LM7321MFE/NOPB - Texas Instruments

0.1 1 10 100

ISOURCE (mA)

0.01

0.1

VOUT from V+ (V)

VS = ±15V

125°C

85°C

25°C

-40°C

25V/DIV

5 Ps/DIV

VS = ±15V, AV = +1

INPUT

10 pF

2,200 pF

8,600 pF

12,200 pF

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LM7321

LM7322

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LM7321x Single and LM7322x Dual Rail-to-Rail Input and Output ±15-V, High-Output

Current and Unlimited Capacitive Load Operational Amplifier

1 Features 3 Description

The LM732xx devices are rail-to-rail input and output

1• (VS= ±15, TA= 25°C, Typical Values Unless amplifiers with wide operating voltages and high-

Specified.) output currents. The LM732xx family is efficient,

• Wide Supply Voltage Range 2.5 V to 32 V achieving 18-V/µs slew rate and 20-MHz unity gain

• Output Current +65 mA/−100 mA bandwidth while requiring only 1 mA of supply current

per op amp. The LM732xx device performance is fully

• Gain Bandwidth Product 20 MHz specified for operation at 2.7 V, ±5 V and ±15 V.

• Slew Rate 18 V/µs The LM732xx devices are designed to drive unlimited

• Capacitive Load Tolerance Unlimited capacitive loads without oscillations. All LM7321x and

• Input Common-Mode Voltage 0.3-V Beyond Rails LM7322x parts are tested at −40°C, 125°C, and

• Input Voltage Noise 15 nV/√Hz 25°C, with modern automatic test equipment. High

performance from −40°C to 125°C, detailed

• Input Current Noise 1.3 pA/√Hz specifications, and extensive testing makes them

• Supply Current/Channel 1.1 mA suitable for industrial, automotive, and

• Distortion THD+Noise −86 dB communications applications.

• Temperature Range −40°C to 125°C Greater than rail-to-rail input common-mode voltage

• Tested at −40°C, 25°C and 125°C at 2.7 V, ±5 V, range with 50 dB of common-mode rejection across

±15 V. this wide voltage range, allows both high-side and

low-side sensing. Most device parameters are

• LM732xx are Automotive Grade Products that are insensitive to power supply voltage, and this makes

AEC-Q100 Grade 1 Qualified. the parts easier to use where supply voltage may

vary, such as automotive electrical systems and

2 Applications battery powered equipment. These amplifiers have

• Driving MOSFETs and Power Transistors true rail-to-rail output and can supply a respectable

amount of current (15 mA) with minimal head- room

• Capacitive Proximity Sensors from either rail (300 mV) at low distortion (0.05%

• Driving Analog Optocouplers THD+Noise).

• High-Side Sensing Device Information(1)

• Below Ground Current Sensing PART NUMBER PACKAGE BODY SIZE (NOM)

• Photodiode Biasing SOIC (8) 4.90 mm × 3.91 mm

LM7321

• Driving Varactor Diodes in PLLs LM7322 SOT (5) 2.90 mm × 1.60 mm

• Wide Voltage Range Power supplies LM7322 VSSOP (8) 3.00 mm × 3.00 mm

• Automotive (1) For all available packages, see the orderable addendum at

• International Power Supplies the end of the data sheet.

Output Swing vs. Sourcing Current Large Signal Step Response

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LM7321

LM7322

SNOSAW8E –MAY 2008–REVISED SEPTEMBER 2015

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Table of Contents

8.2 Functional Block Diagram....................................... 20

1 Features.................................................................. 18.3 Feature Description................................................. 20

2 Applications ........................................................... 18.4 Device Functional Modes........................................ 23

3 Description............................................................. 19 Application and Implementation ........................ 25

4 Revision History..................................................... 29.1 Application Information............................................ 25

5 Description continued........................................... 39.2 Typical Application ................................................. 25

6 Pin Configuration and Functions......................... 310 Power Supply Recommendations ..................... 27

7 Specifications......................................................... 411 Layout................................................................... 27

7.1 Absolute Maximum Ratings ..................................... 411.1 Layout Guidelines ................................................. 27

7.2 ESD Ratings.............................................................. 411.2 Layout Example .................................................... 27

7.3 Recommended Operating Conditions....................... 412 Device and Documentation Support................. 28

7.4 Thermal Information.................................................. 412.1 Related Links ........................................................ 28

7.5 2.7-V Electrical Characteristics ............................... 512.2 Community Resources.......................................... 28

7.6 ±5-V Electrical Characteristics................................. 712.3 Trademarks........................................................... 28

7.7 ±15-V Electrical Characteristics............................... 812.4 Electrostatic Discharge Caution............................ 28

7.8 Typical Characteristics............................................ 10 12.5 Glossary................................................................ 28

8 Detailed Description............................................ 20 13 Mechanical, Packaging, and Orderable

8.1 Overview................................................................. 20 Information........................................................... 28

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision D (March 2013) to Revision E Page

• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional

Modes,Application and Implementation section, Power Supply Recommendations section, Layout section, Device

and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1

Changes from Revision C (May 2008) to Revision D Page

• Changed layout of National Data Sheet to TI format ........................................................................................................... 25

Product Folder Links: LM7321 LM7322

OUT B

OUT A

-IN A

+IN A

V-

V+

-IN B

+IN B

V+

4 5

N/C

-IN

+IN

V-

N/C

OUT

N/C

OUT

V-

+IN

V+

-IN

LM7321

LM7322

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SNOSAW8E –MAY 2008–REVISED SEPTEMBER 2015

5 Description continued

There are several package options for each part. Standard SOIC versions of both parts make upgrading existing

designs easy. LM7322x are offered in a space-saving 8-Pin VSSOP package. The LM7321x are offered in small

SOT-23 package, which makes it easy to place this part close to sensors for better circuit performance.

6 Pin Configuration and Functions

DBV Package D Package

5-Pin SOT-23 8-Pin SOIC

Top View Top View

DGK Package

8-Pin VSSOP or SOIC

Top View

Pin Functions

PIN I/O DESCRIPTION

SOT-23 VSSOP,

NAME SOIC NO.

NO. SOIC NO.

OUT 1 6 — O Output

OUT A — — 1 O Output for Amplifier A

OUT B — — 7 O Output for Amplifier B

V+ 5 7 7 P Positive Supply

V– 2 4 4 P Negative Supply

+IN 3 3 — I Noninverting Input

–IN 4 2 — I Inverting Input

+IN A — — 3 I Noninverting Input for Amplifier A

–IN A — — 2 I Inverting Input for Amplifier A

+IN B — — 5 I Noninverting Input for Amplifier B

–IN B — — 6 I Inverting Input for Amplifier B

N/C — 1, 5, 8 — — No connection

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)

MIN MAX UNIT

VIN Differential ±10 V

Output Short Circuit Current See (3)

Supply Voltage (VS= V+- V−) 35 V

Voltage at Input/Output pins V++ 0.8 V−−0.8 V

Junction Temperature(4) 150 °C

Soldering Infrared or Convection (20 sec.) 235 °C

Information: Wave Soldering (10 sec.) 260 °C

Storage Temperature −65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 150°C. Short circuit test is a momentary test. Output short circuit duration is

infinite for VS≤6V at room temperature and below. For VS> 6V, allowable short circuit duration is 1.5 ms.

(4) The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is

PD= (TJ(MAX)) – TA)/ RθJA. All numbers apply for packages soldered directly onto a PCB.

7.2 ESD Ratings VALUE UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(2) ±2000

Charged-device model (CDM), per JEDEC specification JESD22-

V(ESD) Electrostatic discharge(1) ±1000 V

C101(3)

Machine Model 200

(1) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

(2) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(3) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions MIN MAX UNIT

Supply Voltage (VS= V+- V−) 2.5 32 V

Temperature Range(1) −40 125 °C

(1) The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is

PD= (TJ(MAX)) – TA)/ RθJA. All numbers apply for packages soldered directly onto a PCB.

7.4 Thermal Information LM7321

THERMAL METRIC(1) D (SOIC) DBV (SOT) DGK (VSSOP) UNIT

8 PINS 5 PINS 8 PINS

RθJA(2) Junction-to-ambient thermal resistance 165 325 235 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2) The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is

PD= (TJ(MAX)) – TA)/ RθJA. All numbers apply for packages soldered directly onto a PCB.

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SNOSAW8E –MAY 2008–REVISED SEPTEMBER 2015

7.5 2.7-V Electrical Characteristics

Unless otherwise specified, all limits ensured for TA= 25°C, V+= 2.7 V, V−= 0 V, VCM = 0.5 V, VOUT = 1.35 V, and RL> 1 MΩ

to 1.35 V.(1)

PARAMETER TEST CONDITION MIN(2) TYP(3) MAX(2) UNIT

−5 ±0.7 +5

VOS Input Offset Voltage VCM = 0.5 V and VCM = 2.2 V mV

TA= –40°C to +125°C −6 +6

Input Offset Voltage

TC VOS VCM = 0.5 V and VCM = 2.2 V(4) ±2 µV/C

Temperature Drift

−2−1.2

VCM = 0.5 V(5) TA= –40°C to +125°C −2.5

IBInput Bias Current µA

0.45 1

VCM = 2.2 V(5) TA= –40°C to +125°C 1.5

20 200

IOS Input Offset Current VCM = 0.5 V and VCM = 2.2 V nA

TA= –40°C to +125°C 300

70 100

0 V ≤VCM ≤1 V TA= –40°C to +125°C 60

Common-Mode

CMRR dB

Rejection Ratio 55 70

0 V ≤VCM ≤2.7 V TA= –40°C to +125°C 50

78 104

Power Supply Rejection

PSRR 2.7 V ≤VS≤30 V dB

Ratio TA= –40°C to +125°C 74

−0.3 −0.1

Common-Mode Voltage CMRR > 50 dB

Range (Min) TA= –40°C to +125°C 0

CMVR V

2.8 3

Common-Mode Voltage CMRR > 50 dB

Range (Max) TA= –40°C to +125°C 2.7

65 72

0.5 V ≤VO≤2.2 V

RL= 10 kΩto 1.35 V TA= –40°C to +125°C 62

AVOL Open-Loop Voltage Gain dB

59 66

0.5 V ≤VO≤2.2 V

RL= 2 kΩto 1.35V TA= –40°C to +125°C 55 50 150

RL= 10 kΩto 1.35 V

VID = 100 mV TA= –40°C to +125°C 160

Output Voltage Swing

High 100 250

RL= 2 kΩto 1.35 V

VID = 100 mV TA= –40°C to +125°C 280 mV from

VOUT either rail

20 120

RL= 10 kΩto 1.35 V

VID =−100 mV TA= –40°C to +125°C 150

Output Voltage Swing

Low 40 120

RL= 2 kΩto 1.35 V

VID =−100 mV TA= –40°C to +125°C 150

30 48

Sourcing

VID = 200 mV, VOUT = 0 V(6) TA= –40°C to +125°C 20

IOUT Output Current mA

Sinking 40 65

VID =−200 mV, VOUT = 2.7 TA= –40°C to +125°C 30

V(6)

(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very

limited self-heating of the device such that TJ= TA. No ensured specification of parametric performance is indicated in the electrical

tables under conditions of internal self-heating where TJ> TA.

(2) All limits are ensured by testing or statistical analysis.

(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary

over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped

production material.

(4) Offset voltage temperature drift determined by dividing the change in VOS at temperature extremes into the total temperature change.

(5) Positive current corresponds to current flowing into the device.

(6) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 150°C. Short circuit test is a momentary test. Output short circuit duration is

infinite for VS≤6 V at room temperature and below. For VS> 6 V, allowable short circuit duration is 1.5 ms.

Product Folder Links: LM7321 LM7322

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2.7-V Electrical Characteristics (continued)

Unless otherwise specified, all limits ensured for TA= 25°C, V+= 2.7 V, V−= 0 V, VCM = 0.5 V, VOUT = 1.35 V, and RL> 1 MΩ

to 1.35 V.(1)

PARAMETER TEST CONDITION MIN(2) TYP(3) MAX(2) UNIT

0.95 1.3

LM7321 TA= –40°C to +125°C 1.9

ISSupply Current mA

2 2.5

LM7322 TA= –40°C to +125°C 3.8

SR Slew Rate(7) AV= +1, VI= 2-V Step 8.5 V/µs

fuUnity Gain Frequency RL= 2 kΩ, CL= 20 pF 7.5 MHz

GBW Gain Bandwidth f = 50 kHz 16 MHz

Input Referred Voltage

enf = 2 kHz 11.9 nV/√H

Noise Density

Input Referred Current

inf = 2 kHz 0.5 pA/√H

Noise Density V+= 1.9 V, V−=−0.8 V

Total Harmonic

THD+N f = 1 kHz, RL= 100 kΩ, AV= +2 −77 dB

Distortion + Noise VOUT = 210 mVPP

CT Rej. Crosstalk Rejection f = 100 kHz, Driver RL= 10 kΩ60 dB

(7) Slew rate is the slower of the rising and falling slew rates. Connected as a Voltage Follower.

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SNOSAW8E –MAY 2008–REVISED SEPTEMBER 2015

7.6 ±5-V Electrical Characteristics

Unless otherwise specified, all limited ensured for TA= 25°C, V+= 5 V, V−=−5V, VCM = 0 V, VOUT = 0 V, and RL> 1 MΩto 0

V.(1)

PARAMETER TEST CONDITION MIN(2) TYP(3) MAX(2) UNIT

−5 ±0.7 +5

VCM =−4.5 V and VCM =

VOS Input Offset Voltage mV

4.5 V TA= –40°C to +125°C −6 +6

Input Offset Voltage

TC VOS VCM =−4.5 V and VCM = 4.5 V(4) ±2 µV/°C

Temperature Drift VCM =−4.5 V(5) −2.0 −1.2

TA= –40°C to +125°C −2.5

IBInput Bias Current µA

VCM = 4.5 V(5) 0.45 1

TA= –40°C to +125°C 1.5

20 200

VCM =−4.5 V and VCM =

IOS Input Offset Current nA

4.5 V TA= –40°C to +125°C 300

80 100

−5 V ≤VCM ≤3 V TA= –40°C to +125°C 70

Common Mode

CMRR dB

Rejection Ratio 65 80

−5 V ≤VCM ≤5 V TA= –40°C to +125°C 62

78 104

Power Supply Rejection 2.7 V ≤VS≤30 V,

PSRR dB

Ratio VCM =−4.5 V TA= –40°C to +125°C 74

−5.3 −5.1

Common-Mode Voltage CMRR > 50 dB

Range (Min) TA= –40°C to +125°C −5

CMVR V

5.1 5.3

Common-Mode Voltage CMRR > 50 dB

Range (Max) TA= –40°C to +125°C 5

74 80

−4 V ≤VO≤4 V

RL= 10 kΩto 0 V TA= –40°C to +125°C 70

Open-Loop Voltage

AVOL dB

Gain 68 74

−4 V ≤VO≤4 V

RL= 2 kΩto 0 V TA= –40°C to +125°C 65 100 250

RL= 10 kΩto 0 V

VID = 100 mV TA= –40°C to +125°C 280

Output Voltage Swing

High 160 350

RL= 2 kΩto 0 V mV

VID = 100 mV TA= –40°C to +125°C 450 from

VOUT either

35 200

RL= 10 kΩto 0 V rail

VID =−100 mV TA= –40°C to +125°C 250

Output Voltage Swing

Low 80 200

RL= 2 kΩto 0 V

VID =−100 mV TA= –40°C to +125°C 250

Sourcing 35 70

VID = 200 mV, VOUT =−5TA= –40°C to +125°C 20

V(6)

IOUT Output Current mA

Sinking 50 85

VID =−200 mV, VOUT = 5 TA= –40°C to +125°C 30

V(6)

(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very

limited self-heating of the device such that TJ= TA. No ensured specification of parametric performance is indicated in the electrical

tables under conditions of internal self-heating where TJ> TA.

(2) All limits are ensured by testing or statistical analysis.

(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary

over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped

production material.

(4) Offset voltage temperature drift determined by dividing the change in VOS at temperature extremes into the total temperature change.

(5) Positive current corresponds to current flowing into the device.

(6) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 150°C. Short circuit test is a momentary test. Output short circuit duration is

infinite for VS≤6 V at room temperature and below. For VS> 6 V, allowable short circuit duration is 1.5 ms.

Product Folder Links: LM7321 LM7322

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SNOSAW8E –MAY 2008–REVISED SEPTEMBER 2015

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±5-V Electrical Characteristics (continued)

Unless otherwise specified, all limited ensured for TA= 25°C, V+= 5 V, V−=−5V, VCM = 0 V, VOUT = 0 V, and RL> 1 MΩto 0

V.(1)

PARAMETER TEST CONDITION MIN(2) TYP(3) MAX(2) UNIT

1.0 1.3

LM7321 TA= –40°C to 2

+125°C

ISSupply Current VCM =−4.5 V mA

2.3 2.8

LM7322 TA= –40°C to 3.8

+125°C

SR Slew Rate(7) AV= +1, VI= 8-V Step 12.3 V/µs

fuUnity Gain Frequency RL= 2 kΩ, CL= 20 pF 9 MHz

GBW Gain Bandwidth f = 50 kHz 16 MHz

Input Referred Voltage f = 2 kHz

en14.3 nV/√H

Noise Density

Input Referred Current f = 2 kHz

in1.35 pA/√H

Noise Density

Total Harmonic f = 1 kHz, RL= 100 kΩ, AV= +2

THD+N −79 dB

Distortion + Noise VOUT = 8 VPP

CT Rej. Crosstalk Rejection f = 100 kHz, Driver RL= 10 kΩ60 dB

(7) Slew rate is the slower of the rising and falling slew rates. Connected as a Voltage Follower.

7.7 ±15-V Electrical Characteristics

Unless otherwise specified, all limited ensured for TA= 25°C, V+= 15 V, V−=−15 V, VCM = 0 V, VOUT = 0 V, and RL> 1 MΩto

15 V.(1)

PARAMETER TEST CONDITION MIN(2) TYP(3) MAX(2) UNIT

−6 ±0.7 +6

VCM =−14.5 V and

VOS Input Offset Voltage mV

VCM = 14.5 V –40°C to +125°C −8 +8

Input Offset Voltage

TC VOS VCM =−14.5 V and VCM = 14.5 V(4) ±2 µV/°C

Temperature Drift

−2−1.1

VCM =−14.5 V(5) –40°C to +125°C −2.5

IBInput Bias Current µA

0.45 1

VCM = 14.5 V(5) –40°C to +125°C 1.5

30 300

VCM =−14.5 V and

IOS Input Offset Current nA

VCM = 14.5 V –40°C to +125°C 500

80 100

−15 V ≤VCM ≤12 V –40°C to +125°C 75

Common-Mode Rejection

CMRR dB

Ratio 72 80

−15 V ≤VCM ≤15 V –40°C to +125°C 70

78 100

Power Supply Rejection 2.7 V ≤VS≤30 V, VCM

PSRR dB

Ratio = −14.5 V –40°C to +125°C 74

(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very

limited self-heating of the device such that TJ= TA. No ensured specification of parametric performance is indicated in the electrical

tables under conditions of internal self-heating where TJ> TA.

(2) All limits are ensured by testing or statistical analysis.

(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary

over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped

production material.

(4) Offset voltage temperature drift determined by dividing the change in VOS at temperature extremes into the total temperature change.

(5) Positive current corresponds to current flowing into the device.

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SNOSAW8E –MAY 2008–REVISED SEPTEMBER 2015

±15-V Electrical Characteristics (continued)

Unless otherwise specified, all limited ensured for TA= 25°C, V+= 15 V, V−=−15 V, VCM = 0 V, VOUT = 0 V, and RL> 1 MΩto

15 V.(1)

PARAMETER TEST CONDITION MIN(2) TYP(3) MAX(2) UNIT

−15.3 −15.1

Common-Mode Voltage CMRR > 50 dB

Range (Min) –40°C to +125°C −15

CMVR V

15.1 15.3

Common-Mode Voltage CMRR > 50 dB

Range (Max) –40°C to +125°C 15

75 85

−13 V ≤VO≤13 V

RL= 10 kΩto 0 V –40°C to +125°C 70

AVOL Open-Loop Voltage Gain dB

70 78

−13 V ≤VO≤13 V

RL= 2 kΩto 0 V –40°C to +125°C 65 150 300

RL= 10 kΩto 0 V

VID = 100 mV –40°C to +125°C 350

Output Voltage Swing

High 250 550

RL= 2 kΩto 0 V mV

VID = 100 mV –40°C to +125°C 650 from

VOUT either

60 200

RL= 10 kΩto 0 V rail

VID =−100 mV –40°C to +125°C 250

Output Voltage Swing

Low 130 300

RL= 2 kΩto 0 V

VID =−100 mV –40°C to +125°C 400

Sourcing 40 65

VID = 200 mV, VOUT =−15 V(6)

IOUT Output Current mA

Sinking 60 100

VID =−200 mV, VOUT = 15 V(6)

1.1 1.7

LM7321 –40°C to +125°C 2.4

ISSupply Current VCM =−14.5 V mA

2.5 4

LM7322 –40°C to +125°C 5.6

SR Slew Rate(7) AV= +1, VI= 20-V Step 18 V/µs

fuUnity Gain Frequency RL= 2 kΩ, CL= 20 pF 11.3 MHz

GBW Gain Bandwidth f = 50 kHz 20 MHz

Input Referred Voltage f = 2 kHz

en15 nV/√H

Noise Density

Input Referred Current

inf = 2 kHz 1.3 pA/√H

Noise Density

Total Harmonic Distortion f = 1 kHz, RL100 kΩ,

THD+N −86 dB

+Noise AV= +2, VOUT = 23 VPP

CT Rej. Crosstalk Rejection f = 100 kHz, Driver RL= 10 kΩ60 dB

(6) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 150°C. Short circuit test is a momentary test. Output short circuit duration is

infinite for VS≤6 V at room temperature and below. For VS> 6 V, allowable short circuit duration is 1.5 ms.

(7) Slew rate is the slower of the rising and falling slew rates. Connected as a Voltage Follower.

Product Folder Links: LM7321 LM7322

0.1 1 10 100

ISOURCE (mA)

0.01

0.1

VOUT from V+ (V)

VS = ±15V

125°C

85°C

25°C

-40°C

0.1 1 10 100

ISINK (mA)

0.01

0.1

VOUT from V- (V)

VS = ±15V

125°C

85°C

25°C

-40°C

0.1 1 10 100

ISOURCE (mA)

0.01

0.1

VOUT from V+ (V)

VS = ±5V

125°C

85°C

25°C

-40°C

0.1 1 10 100

ISINK (mA)

0.01

0.1

VOUT from V- (V)

VS = ±5V

125°C

85°C

25°C

-40°C

0.1 1 10 100

ISOURCE (mA)

0.01

0.1

VOUT from V+ (V)

VS = 2.7V

125°C

85°C

25°C

-40°C

0.1 1 10 100

ISINK (mA)

0.01

0.1

VOUT from V- (V)

VS = 2.7V

125°C

85°C

25°C

-40°C

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SNOSAW8E –MAY 2008–REVISED SEPTEMBER 2015

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7.8 Typical Characteristics

Unless otherwise specified: TA= 25°C.

Figure 1. Output Swing vs. Sourcing Current Figure 2. Output Swing vs. Sinking Current

Figure 3. Output Swing vs. Sourcing Current Figure 4. Output Swing vs. Sinking Current

Figure 5. Output Swing vs. Sourcing Current Figure 6. Output Swing vs. Sinking Current

Product Folder Links: LM7321 LM7322

-6 -4 -2 0 0 4 6

VCM (V)

-0.8

-0.7

-0.6

-0.5

-0.4

-0.3

VOS (mV)

25°C

VS = ±5V

85°C

125°C

-40°C

-6 -4 -2 02 4 6

VCM (V)

-2.5

-2.25

-2

-1.75

-1.5

-1.25

-1

VOS (mV)

VS = ±5V

-40°C

25°C

85°C

125°C

-1 0 1 2 3 4

-2.5

-2.3

-2.1

-1.9

-1.7

-1.5

-1.3

-1.1

-0.9

-0.7

-0.5

VOS (mV)

VCM (V)

-40°C

25°C

85°C

125°C

VS = 2.7V

-1 0 1 2 3 4

-0.8

-0.7

-0.6

-0.5

-0.4

-0.3

-0.2

-0.1

VOS (mV)

VCM (V)

85°C

-40°C

125°C

25°C

125°C

VS = 2.7V

-3 -2 -1 0 1 2 3

VOS (mV)

PERCENTAGE (%)

VS = ±5V

-1 0 1 2 3 4

-2.5

-2.3

-2.1

-1.9

-1.7

-1.5

-1.3

-1.1

-0.9

-0.7

-0.5

VOS (mV)

VCM (V)

-40°C

25°C

85°C

125°C

VS = 2.7V

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Typical Characteristics (continued)

Unless otherwise specified: TA= 25°C.

Figure 7. VOS Distribution Figure 8. VOS vs. VCM (Unit 1)

Figure 9. VOS vs. VCM (Unit 2) Figure 10. VOS vs. VCM (Unit 3)

Figure 11. VOS vs. VCM (Unit 1) Figure 12. VOS vs. VCM (Unit 2)

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0 10 20 30 40

-2.5

-2.3

-2.1

-1.9

-1.7

-1.5

-1.3

-1.1

VOS (mV)

VS (V)

-40°C

25°C

85°C

125°C

VCM = V- +0.5V

05 10 15 20 25 30 35 40

VS (V)

-0.7

-0.6

-0.5

-0.4

-0.3

-0.2

-0.1

VOS (mV)

VCM = V- +0.5V

85°C

125°C

-40°C

25°C

-20 -15 -10 -5 0 5 10 15 20

-1

VOS (mV)

VCM (V)

-0.9

-0.8

-0.7

-0.6

-0.5

-0.4

-0.3

-0.2

-0.1 VS = ±15V

-40°C

25°C

85°C 125°C

-20 -15 -10 -5 0 5 10 15 20

-2.5

-0.5

VOS (mV)

VCM (V)

-2.3

-2.1

-1.9

-1.7

-1.5

-1.3

-1.1

-0.9

-0.7 VS = ±15V

-40°C

25°C

85°C

125°C

-6 -4 -2 02 4 6

VCM (V)

-2.5

-2.25

-2

-1.75

-1.5

-1.25

-1

-0.75

-0.5

VOS (mV)

-40°C

25°C

85°C

125°C

VS = ±5V

-20 -15 -10 -5 0 5 10 15 20

VCM (V)

VOS (mV)

-2.25

-2

-1.75

-1.5

-1.25

-1 VS = ±15V

-40°C

25°C

85°C

125°C

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Typical Characteristics (continued)

Unless otherwise specified: TA= 25°C.

Figure 14. VOS vs. VCM (Unit 1)

Figure 13. VOS vs. VCM (Unit 2)

Figure 15. VOS vs. VCM (Unit 2) Figure 16. VOS vs. VCM (Unit 3)

Figure 18. VOS vs. VS(Unit 2)

Figure 17. VOS vs. VS(Unit 1)

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-5 -3 -1 1 3 5

-1.5

-1

-0.5

0.5

IBAIS (PA)

VCM (V)

VS = ±5V

-40°C

25°C

125°C 85°C

00.5 1 1.5 2 2.5 3

VCM (V)

-1.5

-1

-0.5

0.5

IBIAS (PA)

VS = 2.7V -40°C 25°C

85°C 125°C

05 10 15 20 25 30 35 40

VS (V)

-2.2

-2

-1.8

-1.6

-1.4

-1.2

-1

VOS (mV)

-40°C

25°C

85°C

125°C

VCM = V+ -0.5V

0 5 10 15 20 25 30 35 40

-1

VOS (mV)

VS (V)

-0.9

-0.8

-0.7

-0.6

-0.5

-0.4

-0.3

-0.2

-0.1

85°C

125°C

25°C

-40°C

VCM = V+ -0.5V

05 10 15 20 25 30 35 40

VS (V)

-2.5

-2

-1.5

-1

-0.5

VOS (mV)

-40°C

25°C

85°C

125°C

VCM = V- +0.5V

05 10 15 20 25 30 35 40

VS (V)

-2

-1.8

-1.6

-1.4

-1.2

-1

VOS (mV)

VCM = V+ -0.5V

-40°C

25°C

85°C

125°C

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Typical Characteristics (continued)

Unless otherwise specified: TA= 25°C.

Figure 20. VOS vs. VS(Unit 1)

Figure 19. VOS vs. VS(Unit 3)

Figure 21. VOS vs. VS(Unit 2) Figure 22. VOS vs. VS(Unit 3)

Figure 23. IBIAS vs. VCM Figure 24. IBIAS vs. VCM

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-6 -4 -2 0 2 4 6

0.2

0.4

0.6

0.8

1.2

1.4

1.6

1.8

IS (mA)

VCM (V)

VS = ±5V

125°C

85°C

25°C

-40°C

-1 0 1 2 3 4

0.5

1.5

2.5

3.5

IS (mA)

VCM (V)

125°C

85°C

25°C

-40°C

VS = 2.7V

-1 0 1 2 3 4

0.2

0.4

0.6

0.8

1.2

1.4

1.6

1.8

IS (mA)

VCM (V)

VS = 2.7V 125°C

85°C

25°C

-40°C

0 10 20 30 40

0.3

0.35

0.4

0.45

0.5

0.55

0.6

0.65

0.7

IBIAS (PA)

VS (V)

VCM = V+ -0.5V

-40°C

25°C

85°C

125°C

-15 -10 -5 0 5 10 15

VCM (V)

-1.5

-1

-0.5

0.5

IBIAS (PA)

VS = ±15V

125°C 85°C

25°C -40°C

05 10 15 20 25 30 35 40

VS (V)

-1.6

-1.5

-1.4

-1.3

-1.2

-1.1

-1

IBIAS (PA)

VCM = V- +0.5V

-40°C

25°C

85°C 125°C

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Typical Characteristics (continued)

Unless otherwise specified: TA= 25°C.

Figure 26. IBIAS vs. VS

Figure 25. IBIAS vs. VCM

Figure 27. IBIAS vs. VSFigure 28. ISvs. VCM (LM7321)

Figure 29. ISvs. VCM (LM7322) Figure 30. ISvs. VCM (LM7321)

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0 5 10 15 20 25 30 35 40

4.5

IS (mA)

VS (V)

0.5

1.5

2.5

3.5

4125°C 85°C

25°C

-40°C

VCM = V+ -0.5V

0 10 20 30 40

0.5

1.5

2.5

IS (mA)

VS (V)

VCM = V+ -0.5V

125°C 85°C

25°C

-40°C

5 15 25 35

0 10 20 30 40

0.2

0.4

0.6

0.8

1.2

1.4

1.6

IS (mA)

VS (V)

125°C

85°C

25°C

-40°C

VCM = V- +0.5V

515 25 30

-20 -15 -10 -5 0 5 10 15 20

4.5

IS (mA)

VCM (V)

0.5

1.5

2.5

3.5

25°C 85°C

25°C

-40°C

VS = ±15V

85°C

-6 -4 -2 02 4 6

VCM (V)

0.5

1.5

2.5

3.5

IS (mA)

125°C

25°C

-40°C

VS = ±5V

-20 -15 -10 -5 0 5 10 15 20

VCM (V)

0.5

1.5

2.5

IS (mA)

VS = ±15V

125°C 85°C

25°C

-40°C

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Typical Characteristics (continued)

Unless otherwise specified: TA= 25°C.

Figure 31. ISvs. VCM (LM7322) Figure 32. ISvs. VCM (LM7321)

Figure 33. ISvs. VCM (LM7322) Figure 34. ISvs. VS(LM7321)

Figure 36. ISvs. VS(LM7321)

Figure 35. ISvs. VS(LM7322)

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-20

140

GAIN (dB)

1k 10k 100k 1M 10M

FREQUENCY (Hz)

100

120

100M

VS = r15V

RL = 10 M:

PHASE

GAIN

113

135

PHASE (q)

-23

158

20 pF

50 pF

200 pF

100 pF

50 pF

200 pF

100 pF

1000 pF

500 pF

1000 pF

500 pF

0 10 20 30 40

0.01

0.02

0.03

0.04

0.05

0.06

0.07

VOUT from RAIL (V)

VS (V)

RL = 10 k:

-40°C

25°C

85°C

125°C

0 10 20 30 40

0.02

0.04

0.06

0.08

0.1

0.12

0.14

0.16

VOUT from RAIL (V)

VS (V)

RL = 2 k:125°C

85°C

25°C

-40°C

05 10 15 20 25 30 35 40

VS (V)

0.02

0.04

0.06

0.08

0.1

0.12

0.14

0.16

VOUT from RAIL (V)

RL = 10 k:

-40°C

125°C

85°C

25°C

0 10 20 30 40

0.05

0.1

0.15

0.2

0.25

0.3

VOUT from RAIL (V)

VS (V)

-40°C

125°C

85°C

25°C

RL = 2 k:

05 10 15 20 25 30 35 40

VS (V)

0.5

1.5

2.5

IS (mA)

125°C 85°C

25°C

-40°C

VCM = V- +0.5V

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Typical Characteristics (continued)

Unless otherwise specified: TA= 25°C.

Figure 37. ISvs. VS(LM7322) Figure 38. Positive Output Swing vs. Supply Voltage

Figure 39. Positive Output Swing vs. Supply Voltage Figure 40. Negative Output Swing vs. Supply Voltage

Figure 42. Open-Loop Frequency Response with Various

Figure 41. Negative Output Swing vs. Supply Voltage Capacitive Load

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10 1k 1M

FREQUENCY (Hz)

100

-PSRR (dB)

100k

10k

100

90 VS = 30V

VCM = 2V

VS = 10V

VCM = 2V VS = 2.7V

VCM = 2V

10 1k 1M

FREQUENCY (Hz)

120

+PSRR (dB)

100k

10k

100

VS = 2.7V

VCM = 0.7V

VS = 10V

VCM = 8V

VS = 30V

VCM = 28V

10 100 1000

PHASE MARGIN (°)

CAPACITIVE LOAD (pF)

RL = 600:

RL = 2 k:

RL = 10 M:, 10 k:, 100 k:

VS = ±15V

10 1k 1M

FREQUENCY (Hz)

100

CMRR (dB)

100k

10k

100

90 VS = ±15V

-20

140

GAIN (dB)

1k 10k 100k 1M 10M

FREQUENCY (Hz)

100

120

100M

VS = r15V

CL = 20 pF

PHASE

GAIN

113

135

PHASE (q)

-23

158

10 M:

2 k:

600:

100 k:

10 k:

2 k:

600:

-20

140

GAIN (dB)

1k 10k 100k 1M 10M

FREQUENCY (Hz)

100

120

100M

RL = 2 k:

CL = 20 pF

113

135

PHASE (q)

-23

158

VS = 10V

VS = 30V

VS = 2.7V

VS = 30V

VS = 2.7V

VS = 10V

PHASE

GAIN

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Typical Characteristics (continued)

Unless otherwise specified: TA= 25°C.

Figure 43. Open-Loop Frequency Response with Various Figure 44. Open-Loop Frequency Response with Various

Resistive Load Supply Voltage

Figure 46. CMRR vs. Frequency

Figure 45. Phase Margin vs. Capacitive Load

Figure 47. +PSRR vs. Frequency Figure 48. −PSRR vs. Frequency

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110 100 1k 100k

FREQUENCY (Hz)

100

1000

10k

CURRENT NOISE (pA/

Hz)

VOLTAGE NOISE (nV

Hz)

0.1

100

VOLTAGE

CURRENT

VS = ±15V

10 1k 1M

FREQUENCY (Hz)

-80

-50

THD+N (dB)

100k

10k

100

-20

-30

-60

-70

-40

-10

VS = 2.7V, VCM = 0.8V

VS = ±5V

VS = ±15V

AV = +2

VIN = 520 mVPP

RL = 100 k:

110 100 1k 100k

FREQUENCY (Hz)

100

1000

10k

CURRENT NOISE (pA/

Hz)

VOLTAGE NOISE (nV

Hz)

0.1

100

VOLTAGE

CURRENT

VS = 2.7V

110 100 1k 100k

FREQUENCY (Hz)

100

1000

10k

CURRENT NOISE (pA/

Hz)

VOLTAGE NOISE (nV

Hz)

0.1

100

VOLTAGE

CURRENT

VS = ±5V

25V/DIV

5 Ps/DIV

VS = ±15V, AV = +1

INPUT

10 pF

2,200 pF

8,600 pF

12,200 pF

1000 pF

750 pF

500 pF

330 pF

100 pF

10 pF

INPUT

100 mV/DIV

200 ns/DIV

VS = ±5V

AV = +1

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Typical Characteristics (continued)

Unless otherwise specified: TA= 25°C.

Figure 49. Small Signal Step Response Figure 50. Large Signal Step Response

Figure 51. Input Referred Noise Density vs. Frequency Figure 52. Input Referred Noise Density vs. Frequency

Figure 53. Input Referred Noise Density vs. Frequency Figure 54. THD+N vs. Frequency

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0.001 0.1 100

OUTPUT AMPLITUDE (VPP)

-90

-70

THD+N (dB)

0.01

-20

-30

-80

-10

-40

-50

-60

VS = ±15V

f = 1 kHz

RL = 100 k:

AV = +2

0.001 0.01 0.1 1 10

OUTPUT AMPLITUDE (VPP)

-90

-80

-70

-60

-50

-40

-30

-20

-10

THD+N (dB)

VS = 2.7V

VCM = 0.8V

f = 1 kHz

RL = 100 k:

AV = +2

0.001 0.1 100

OUTPUT AMPLITUDE (VPP)

-90

-70

THD+N (dB)

0.01

-20

-30

-80

-10

-40

-50

-60

VS = ±5V

f = 1 kHz

RL = 100 k:

AV = +2

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Typical Characteristics (continued)

Unless otherwise specified: TA= 25°C.

Figure 56. THD+N vs. Output Amplitude

Figure 55. THD+N vs. Output Amplitude

Figure 57. THD+N vs. Output Amplitude

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-IN

+IN

OUT

V+

V-

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8 Detailed Description

8.1 Overview

The LM732xx devices are rail-to-rail input and output amplifiers with wide operating voltages and high-output

currents. The LM732xx family is efficient, achieving 18-V/µs slew rate and 20-MHz unity gain bandwidth while

requiring only 1 mA of supply current per op amp. The LM732xx device performance is fully specified for

operation at 2.7 V, ±5 V and ±15 V.

The LM732xx devices are designed to drive unlimited capacitive loads without oscillations. All LM7321x and

LM7322x parts are tested at −40°C, 125°C, and 25°C, with modern automatic test equipment. High performance

from −40°C to 125°C, detailed specifications, and extensive testing makes them suitable for industrial,

automotive, and communications applications.

Greater than rail-to-rail input common-mode voltage range with 50 dB of common-mode rejection across this

wide voltage range, allows both high-side and low-side sensing. Most device parameters are insensitive to power

supply voltage, and this makes the parts easier to use where supply voltage may vary, such as automotive

electrical systems and battery-powered equipment. These amplifiers have true rail-to-rail output and can supply a

respectable amount of current (15 mA) with minimal head room from either rail (300 mV) at low distortion (0.05%

THD+Noise).

8.2 Functional Block Diagram

8.3 Feature Description

8.3.1 Output Short Circuit Current and Dissipation Issues

The LM732xx output stage is designed for maximum output current capability. Even though momentary output

shorts to ground and either supply can be tolerated at all operating voltages, longer lasting short conditions can

cause the junction temperature to rise beyond the absolute maximum rating of the device, especially at higher

supply voltage conditions. Below supply voltage of 6 V, the output short circuit condition can be tolerated

indefinitely.

With the op amp tied to a load, the device power dissipation consists of the quiescent power due to the supply

current flow into the device, in addition to power dissipation due to the load current. The load portion of the

power itself could include an average value (due to a DC load current) and an AC component. DC load current

would flow if there is an output voltage offset, or the output AC average current is non-zero, or if the op amp

operates in a single supply application where the output is maintained somewhere in the range of linear

operation.

Therefore,

PTOTAL = PQ+ PDC + PAC (1)

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PD(MAX) = 150°C ± 125°C

165°C/W = 0.15 W

PD(MAX) = 150°C ± 125°C

235°C/W = 0.11 W

PD(MAX) = 150°C ± 25°C

165°C/W = 0.76 W

PD(MAX) = 150°C ± 25°C

235°C/W = 0.53 W

PD(MAX) = TJ(MAX) - TA

TJA

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Feature Description (continued)

The Op Amp Quiescent Power Dissipation is calculated as:

PQ= IS× VS

where

• IS: Supply Current

• VS: Total Supply Voltage (V+−V−) (2)

The DC Load Power is calculated as:

PDC = IO× (Vr- Vo)

where

• VO: Average Output Voltage

• Vr: V+for sourcing and V−for sinking current (3)

The AC Load Power is calculated as PAC = See Table 1.

Table 1 shows the maximum AC component of the load power dissipated by the op amp for standard Sinusoidal,

Triangular, and Square Waveforms:

Table 1. Normalized AC Power Dissipated in the Output Stage for Standard Waveforms

PAC (W.Ω/V2)

Sinusoidal Triangular Square

50.7 × 10−346.9 × 10−362.5 × 10−3

The table entries are normalized to VS2/RL. To figure out the AC load current component of power dissipation,

simply multiply the table entry corresponding to the output waveform by the factor VS2/RL. For example, with ±12-

V supplies, a 600-Ωload, and triangular waveform power dissipation in the output stage is calculated as:

PAC = (46.9 × 10−3) × (242/600) = 45.0 mW (4)

The maximum power dissipation allowed at a certain temperature is a function of maximum die junction

temperature (TJ(MAX)) allowed, ambient temperature TA, and package thermal resistance from junction to ambient,

θJA.

(5)

For the LM732xx, the maximum junction temperature allowed is 150°C at which no power dissipation is allowed.

The power capability at 25°C is given by the following calculations:

For VSSOP package:

(6)

For SOIC package:

(7)

Similarly, the power capability at 125°C is given by:

For VSSOP package:

(8)

For SOIC package:

(9)

Product Folder Links: LM7321 LM7322

-40 -20 0 20 40 60 80 100 120 140 160

0.2

0.4

0.6

0.8

1.2

1.4

POWER CAPABILITY (W)

TEMPERATURE (°C)

Operating area

Maximum thermal capability line (SOIC)

Maximum thermal capability line (MSOP)

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Figure 58 shows the power capability vs. temperature for VSSOP and SOIC packages. The area under the

maximum thermal capability line is the operating area for the device. When the device works in the operating

area where PTOTAL is less than PD(MAX), the device junction temperature will remain below 150°C. If the

intersection of ambient temperature and package power is above the maximum thermal capability line, the

junction temperature will exceed 150°C and this should be strictly prohibited.

Figure 58. Power Capability vs. Temperature

When high power is required and ambient temperature can't be reduced, providing air flow is an effective

approach to reduce thermal resistance therefore to improve power capability.

8.3.2 Estimating the Output Voltage Swing

It is important to keep in mind that the steady-state output current will be less than the current available when

there is an input overdrive present. For steady-state conditions, the Output Voltage vs. Output Current plot

(Typical Characteristics section) can be used to predict the output swing. Figure 59 and Figure 60 show this

performance along with several load lines corresponding to loads tied between the output and ground. In each

cases, the intersection of the device plot at the appropriate temperature with the load line would be the typical

output swing possible for that load. For example, a 1-kΩload can accommodate an output swing to within 250

mV of V−and to 330 mV of V+(VS= ±15 V) corresponding to a typical 29.3 VPP unclipped swing.

Figure 59. Output Sourcing Characteristics With Load Figure 60. Output Sinking Characteristics With Load Lines

Lines

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8.4 Device Functional Modes

8.4.1 Driving Capacitive Loads

The LM732xx are specifically designed to drive unlimited capacitive loads without oscillations as shown in

Figure 61.

Figure 61. ±5% Settling Time vs. Capacitive Load

In addition, the output current handling capability of the device allows for good slewing characteristics even with

large capacitive loads as shown in Figure 62 and Figure 63.

Figure 62. +SR vs. Capacitive Load Figure 63. −SR vs. Capacitive Load

The combination of these features is ideal for applications such as TFT flat panel buffers, A/D converter input

amplifiers, and so forth.

However, as in most op amps, addition of a series isolation resistor between the op amp and the capacitive load

improves the settling and overshoot performance.

Output current drive is an important parameter when driving capacitive loads. This parameter will determine how

fast the output voltage can change. Referring to the Slew Rate vs. Capacitive Load Plots (Typical Characteristics

section), two distinct regions can be identified. Below about 10,000 pF, the output Slew Rate is solely determined

by the compensation capacitor value of the op amp and available current into that capacitor. Beyond 10 nF, the

Slew Rate is determined by the available output current of the op amp.

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Device Functional Modes (continued)

NOTE

Because of the lower output sourcing current compared to the sinking one, the Slew Rate

limit under heavy capacitive loading is determined by the positive transitions.

An estimate of positive and negative slew rates for loads larger than 100 nF can be made by dividing the short

circuit current value by the capacitor.

For the LM732xx, the available output current increases with the input overdrive. Referring to Figure 64 and

Figure 65, it can be seen that both sourcing and sinking short circuit current increase as input overdrive

increases. In a closed-loop amplifier configuration, during transient conditions while the fed back output has not

quite caught up with the input, there will be an overdrive imposed on the input allowing more output current than

would normally be available under steady-state condition. Because of this feature, the output stage quiescent

current of the op amp can be kept to a minimum, thereby reducing power consumption, while enabling the device

to deliver large output current when the need arises (such as during transients).

Figure 64. Output Short Circuit Sourcing Current vs. Input Figure 65. Output Short Circuit Sinking Current vs. Input

Overdrive Overdrive

Figure 66 shows the output voltage, output current, and the resulting input overdrive with the device set for AV=

+1 and the input tied to a 1-VPP step function driving a 47-nF capacitor. As can be seen, during the output

transition, the input overdrive reaches 1-V peak and is more than enough to cause the output current to increase

to its maximum value (see Figure 64 and Figure 65 plots).

NOTE

Because of the larger output sinking current compared to the sourcing one, the output

negative transition is faster than the positive one.

Figure 66. Buffer Amplifier Scope Photo

Product Folder Links: LM7321 LM7322

LM7321

LM7322

www.ti.com

SNOSAW8E –MAY 2008–REVISED SEPTEMBER 2015

9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

9.1 Application Information

9.1.1 Similar High-Output Devices

The LM7332 is a dual rail-to-rail amplifier with a slightly lower GBW capable of sinking and sourcing 100 mA. It is

available in SOIC and VSSOP packages.

The LM4562 is dual op amp with very low noise and 0.7-mV voltage offset.

The LME49870 and LME49860 are single and dual low-noise amplifiers that can work from ±22-V supplies.

9.1.2 Other High Performance SOT-23 Ampliers

The LM7341 is a 4-MHz rail-to-rail input and output part that requires only 0.6 mA to operate, and can drive

unlimited capacitive load. It has a voltage gain of 97 dB, a CMRR of 93 dB, and a PSRR of 104 dB.

The LM6211 is a 20-MHz part with CMOS input, which runs on ±12-V or 24-V single supplies. It has rail-to-rail

output and low noise.

The LM7121 has a gain bandwidth of 235 MHz.

Detailed information on these parts can be found at www.ti.com.

9.2 Typical Application

Figure 67 shows a typical application where the LM732xx is used as a buffer amplifier for the VCOM signal

employed in a TFT LCD flat panel:

Figure 67. VCOM Driver Application Schematic

9.2.1 Design Requirements

For this example application, the supply voltage is +5 V, and noninverting gain is necessary.

Product Folder Links: LM7321 LM7322

1k 100k 10M

FREQUENCY (Hz)

CROSSTALK REJECTION (dB)

100M

10k

VS = ±15V

VS = ±5V

V+ = 1.8V

VCM = 0.9V

LM7321

LM7322

SNOSAW8E –MAY 2008–REVISED SEPTEMBER 2015

www.ti.com

Typical Application (continued)

9.2.2 Detailed Design Procedure

Figure 68 shows the time domain response of the amplifier when used as a VCOM buffer/driver with VREF at

ground. In this application, the op amp loop will try and maintain its output voltage based on the voltage on its

noninverting input (VREF) despite the current injected into the TFT simulated load. As long as this load current is

within the range tolerable by the LM732xx (45-mA sourcing and 65-mA sinking for ±5-V supplies), the output will

settle to its final value within less than 2 μs.

Figure 68. VCOM Driver Performance Scope Photo

9.2.3 Application Curve

Figure 69. Crosstalk Rejection vs. Frequency

Product Folder Links: LM7321 LM7322

LM7321

LM7322

www.ti.com

SNOSAW8E –MAY 2008–REVISED SEPTEMBER 2015

10 Power Supply Recommendations

The use of supply decoupling is mandatory in most applications. As with most relatively high-speed or high-

output current op amps, best results are achieved when each supply line is decoupled with two capacitors; a

small value ceramic capacitor ( about 0.01 μF) placed very close to the supply lead in addition to a large value

Tantalum or Aluminum (> 4.7 μF). The large capacitor can be shared by more than one device if necessary. The

small ceramic capacitor maintains low supply impedance at high frequencies while the large capacitor will act as

the charge bucket for fast load current spikes at the op amp output. The combination of these capacitors will

provide supply decoupling and will help keep the op amp oscillation free under any load.

11 Layout

11.1 Layout Guidelines

Take care to minimize the loop area formed by the bypass capacitor connection between supply pins and

ground. A ground plane underneath the device is recommended; any bypass components to ground should have

a nearby via to the ground plane. The optimum bypass capacitor placement is closest to the corresponding

supply pin. Use of thicker traces from the bypass capacitors to the corresponding supply pins will lower the

power supply inductance and provide a more stable power supply.

The feedback components should be placed as close to the device as possible to minimize stray parasitics.

11.2 Layout Example

Figure 70. LM732xx Layout Example

Product Folder Links: LM7321 LM7322

LM7321

LM7322

SNOSAW8E –MAY 2008–REVISED SEPTEMBER 2015

www.ti.com

12 Device and Documentation Support

12.1 Related Links

The table below lists quick access links. Categories include technical documents, support and community

resources, tools and software, and quick access to sample or buy.

Table 2. Related Links

TECHNICAL TOOLS & SUPPORT &

PARTS PRODUCT FOLDER SAMPLE & BUY DOCUMENTS SOFTWARE COMMUNITY

LM7321 Click here Click here Click here Click here Click here

LM7322 Click here Click here Click here Click here Click here

12.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

12.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Product Folder Links: LM7321 LM7322

PACKAGE OPTION ADDENDUM

www.ti.com 8-Oct-2015

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM7321MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM732

1MA

LM7321MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM732

1MA

LM7321MF/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 AU4A

LM7321MFE/NOPB ACTIVE SOT-23 DBV 5 250 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 AU4A

LM7321MFX/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 AU4A

LM7321QMF/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 AR8A

LM7321QMFE/NOPB ACTIVE SOT-23 DBV 5 250 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 AR8A

LM7321QMFX/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 AR8A

LM7322MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM732

2MA

LM7322MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM732

2MA

LM7322MM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 AZ4A

LM7322MME/NOPB ACTIVE VSSOP DGK 8 250 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 AZ4A

LM7322QMA/NOPB ACTIVE SOIC D 8 95 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM732

2QMA

LM7322QMAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM732

2QMA

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

PACKAGE OPTION ADDENDUM

www.ti.com 8-Oct-2015

Addendum-Page 2

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF LM7321, LM7321-Q1, LM7322, LM7322-Q1 :

•Catalog: LM7321, LM7322

•Automotive: LM7321-Q1, LM7322-Q1

NOTE: Qualified Version Definitions:

•Catalog - TI's standard catalog product

PACKAGE OPTION ADDENDUM

www.ti.com 8-Oct-2015

Addendum-Page 3

•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM7321MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM7321MF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM7321MFE/NOPB SOT-23 DBV 5 250 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM7321MFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM7321QMF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM7321QMFE/NOPB SOT-23 DBV 5 250 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM7321QMFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

LM7322MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM7322MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LM7322MME/NOPB VSSOP DGK 8 250 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LM7322QMAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 20-Dec-2016

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM7321MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM7321MF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM7321MFE/NOPB SOT-23 DBV 5 250 210.0 185.0 35.0

LM7321MFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM7321QMF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0

LM7321QMFE/NOPB SOT-23 DBV 5 250 210.0 185.0 35.0

LM7321QMFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0

LM7322MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM7322MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0

LM7322MME/NOPB VSSOP DGK 8 250 210.0 185.0 35.0

LM7322QMAX/NOPB SOIC D 8 2500 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 20-Dec-2016

Pack Materials-Page 2

www.ti.com

PACKAGE OUTLINE

TYP

0.22

0.08

0.25

3.0

2.6

2X 0.95

1.9

1.45 MAX

TYP

0.15

0.00

5X 0.5

0.3

TYP

0.6

0.3

TYP

1.9

3.05

2.75

1.75

1.45

(1.1)

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

4214839/C 04/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Refernce JEDEC MO-178.

0.2 C A B

INDEX AREA

PIN 1

GAGE PLANE

SEATING PLANE

0.1 C

SCALE 4.000

www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MAX

ARROUND 0.07 MIN

ARROUND

5X (1.1)

5X (0.6)

(2.6)

(1.9)

2X (0.95)

(R0.05) TYP

4214839/C 04/2017

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

NOTES: (continued)

4. Publication IPC-7351 may have alternate designs.

5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:15X

PKG

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

DEFINED

EXPOSED METAL

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

EXPOSED METAL

www.ti.com

EXAMPLE STENCIL DESIGN

(2.6)

(1.9)

2X(0.95)

5X (1.1)

5X (0.6)

(R0.05) TYP

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

4214839/C 04/2017

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

7. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:15X

SYMM

PKG

www.ti.com

PACKAGE OUTLINE

TYP

0.22

0.08

0.25

3.0

2.6

2X 0.95

1.9

1.45 MAX

TYP

0.15

0.00

5X 0.5

0.3

TYP

0.6

0.3

TYP

1.9

3.05

2.75

1.75

1.45

(1.1)

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

4214839/C 04/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Refernce JEDEC MO-178.

0.2 C A B

INDEX AREA

PIN 1

GAGE PLANE

SEATING PLANE

0.1 C

SCALE 4.000

www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MAX

ARROUND 0.07 MIN

ARROUND

5X (1.1)

5X (0.6)

(2.6)

(1.9)

2X (0.95)

(R0.05) TYP

4214839/C 04/2017

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

NOTES: (continued)

4. Publication IPC-7351 may have alternate designs.

5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:15X

PKG

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

DEFINED

EXPOSED METAL

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

EXPOSED METAL

www.ti.com

EXAMPLE STENCIL DESIGN

(2.6)

(1.9)

2X(0.95)

5X (1.1)

5X (0.6)

(R0.05) TYP

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

4214839/C 04/2017

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

7. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:15X

SYMM

PKG

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Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

Texas Instruments:

LM7321MA/NOPB LM7321MAX/NOPB LM7321MF/NOPB LM7321MFE/NOPB LM7321MFX/NOPB