S-80936CNPF-G86TFU - SEIKO INSTRUMENTS

DTB123YU

-500mA/-50V Digital transistor (with built-in resistors) Datasheet

llOutline

Parameter Value SOT-323 　

VCC -50V SC-70

IC-500mA 　　

R12.2kΩ 　　

R210kΩ (UMT3) 　

llFeatures ll Inner circuit

1)Built-in bias resistors enable the configuration

　 of an inverter circuit without connecting

　 external input resistors.(see equivalent circuit)

2)The bias resistors consist of thin-film resistors

　 with complete isolation to allow positive

　 biasing of the input. They also have the advantage

　 of almost completely eliminating parasitic effects.

3)Only the on/off conditions need to be set for

　 operation, making the device desigh easy.

llApplication

INVERTER, INTERFACE, DRIVER

llPackaging specifications 　　　　　　　　　　　　　　　　　　　　　　

Part No. Package Package

size

Taping

code

Reel size

(mm)

Tape width

(mm)

Basic

ordering

unit.(pcs)

Marking

DTB123YU SOT-323

(UMT3) 2021 T106 180 8 3000 F52

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DTB123YU 　　　　　　　　　 Datasheet

llAbsolute maximum ratings (Ta = 25°C)

Parameter Symbol Values Unit

Supply voltage VCC -50 V

Input voltage VIN -12 to 5 V

Collector current IC*1 -500 mA

Power dissipation PD*2 200 mW/Total

Junction temperature Tj150 ℃

Range of storage temperature Tstg -55 to +150 ℃

llElectrical characteristics (Ta = 25°C)

Parameter Symbol Conditions

Values

Unit

Min. Typ. Max.

Input voltage

VI(off) VCC = -5V, IO = -100μA - - -0.3

V

VI(on) VO = -0.3V, IO = -20mA -2.0 - -

Output voltage VO(on) IO = -50mA, II = -2.5mA - -100 -300 mV

Input current II VI = -5V - - -3.0 mA

Output current IO(off) VCC = -50V, VI = 0V - - -500 nA

DC current gain GI*3 VO = -5V, IO = -50mA 56 - - -

Input resistance R1- 1.54 2.2 2.86 kΩ

Resistance ratio R2/R1- 3.6 4.5 5.5 -

Transition frequency fT*1 VCE = -10V, IE = 50mA,

f = 100MHz - 250 - MHz

*1 Characteristics of built-in transistor

*2 Each terminal mounted on a reference land

*3 Pulsed

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DTB123YU 　　　　　　　　　　 Datasheet

llElectrical characteristic curves (Ta =25°C)

Fig.1 Input Voltage vs. Output Current

　　　　(ON Characteristics)

Fig.2 Output Current vs. Input Voltage

　　　　(OFF Characteristics)

Fig.3 Output Current vs. Output Voltage Fig.4 DC Current Gain vs. Output Current

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DTB123YU 　　　　　　　　　　 Datasheet

llElectrical characteristic curves (Ta =25°C)

Fig.5 Output Voltage vs. Output Current

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DTB123YU 　　　　　　　　　 Datasheet

llDimensions

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Datasheet

Notice-PGA-E Rev.001

Notice

Precaution on using ROHM Products

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OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

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Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred b y you or third parties arisin g from the use of an y ROHM’s Prod ucts for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

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CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ

CLASSⅣ CLASSⅢ

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H2S, NH3, SO2, and NO2

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[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radi ation-proof design.

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confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) dependi ng on Ambient temp erature (T a). When used i n sealed area, co nfirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specificati on.

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this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogen ous (chlori ne, bromine, etc.) flu x is used, the residue of flux may negativel y affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM represe ntative in advance.

For details, please refer to ROHM Mounting specification

Datasheet

Notice-PGA-E Rev.001

Precautions Regarding Application Examples and External Circuits

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characteristics of the Products and external components, including transient characteristics, as well as static

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This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

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1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humi dity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderabilit y of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommen de d storage time period.

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may occur due to excessive s t ress applied when dropping of a carton.

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DatasheetDatasheet

Notice – WE Rev.001

General Precaution

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concerning such information.

Datasheet

Part Number DTB123YU

Package UMT3

Unit Quantity 3000

Minimum Package Quantity 3000

Packing Type Taping

Constitution Materials List inquiry

RoHS Yes

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