DS15BR401TVS - National Semiconductor

DS15BR400,DS15BR401

DS15BR400/DS15BR401 4-Channel LVDS Buffer/Repeater with Pre-Emphasis

Literature Number: SNLS224F

DS15BR400/DS15BR401

December 1, 2010

4-Channel LVDS Buffer/Repeater with Pre-Emphasis

General Description

The DS15BR400/DS15BR401 are four channel LVDS buffer/

repeaters capable of datarates of up to 2 Gbps. High speed

data paths and flow-through pinout minimize internal device

jitter and simplify board layout, while pre-emphasis over-

comes ISI jitter effects from lossy backplanes and cables. The

differential inputs interface to LVDS, and Bus LVDS signals

such as those on National's 10-, 16-, and 18- bit Bus LVDS

SerDes, as well as CML and LVPECL. The differential inputs

and outputs of the DS15BR400 are internally terminated with

100Ω resistors to improve performance and minimize board

space. The DS15BR401 does not have input termination re-

sistors. The repeater function is especially useful for boosting

signals for longer distance transmission over lossy cables and

backplanes.

The DS15BR400/DS15BR401 are powered from a single

3.3V supply and consume 578 mW (typ). They operate over

the full -40°C to +85°C industrial temperature range and are

available in space saving LLP-32 and TQFP-48 packages.

Features

■DC to 2 Gbps low jitter, high noise immunity, low power

operation

■6 dB of pre-emphasis drives lossy backplanes and cables

■LVDS/CML/LVPECL compatible input, LVDS output

■On-chip 100 Ω output termination, optional 100 Ω input

termination

■15 kV ESD protection on LVDS inputs and outputs

■Single 3.3V supply

■Industrial -40 to +85°C temperature range

■Space saving LLP-32 or TQFP-48 packages

Applications

■Cable extension applications

■Signal repeating and buffering

■Digital routers

Typical Application

20188950

DS15BR400/DS15BR401 4-Channel LVDS Buffer/Repeater with Pre-Emphasis

Block and Connection Diagrams

20188901

DS15BR400 Block Diagram

20188903

DS15BR401 Block Diagram

20188902

TQFP Pinout - Top View

20188912

LLP Pinout - Top View

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DS15BR400/DS15BR401

Pin Descriptions

Name

TQFP Pin

Number

LLP Pin

Number I/O, Type Description

DIFFERENTIAL INPUTS

IN0+

IN0−

I, LVDS Channel 0 inverting and non-inverting differential inputs.

IN1+

IN1−

I, LVDS Channel 1 inverting and non-inverting differential inputs.

IN2+

IN2−

I, LVDS Channel 2 inverting and non-inverting differential inputs.

IN3+

IN3−

I, LVDS Channel 3 inverting and non-inverting differential inputs.

DIFFERENTIAL OUTPUTS

OUT0+

OUT0−

O, LVDS Channel 0 inverting and non-inverting differential outputs. (Note 2)

OUT1+

OUT1−

O, LVDS Channel 1 inverting and non-inverting differential outputs. (Note 2)

OUT2+

OUT2−

O, LVDS Channel 2 inverting and non-inverting differential outputs. (Note 2)

OUT3+

OUT3-

O, LVDS Channel 3 inverting and non-inverting differential outputs. (Note 2)

DIGITAL CONTROL INTERFACE

PWDN 12 8 I, LVTTL A logic low at PWDN activates the hardware power down mode (all channels).

PEM 2 2 I, LVTTL Pre-emphasis Control Input (affects all Channels)

POWER

VDD 3, 4, 5, 7, 10, 11,

28, 29, 32, 33

3, 4, 6, 7, 20,

I, Power VDD = 3.3V, ±10%

GND 8, 9, 17, 18, 23,

24, 37, 38, 43,

5 (Note 1) I, Ground Ground reference for LVDS and CMOS circuitry. For the LLP package, the DAP

is used as the primary GND connection to the device in addition to the pin

numbers listed. The DAP is the exposed metal contact at the bottom of the

LLP-32 package. It should be connected to the ground plane with at least 4

vias for optimal AC and thermal performance.

N/C 1,6, 25, 26, 27,

30, 31, 34, 35,

1, 17,

18,19,22, 23,

No Connect

Note 1: Note that for the LLP package the GND is connected thru the DAP on the back side of the LLP package in addition to the actual pin numbers listed.

Note 2: The LVDS outputs do not support a multidrop (BLVDS) environment. The LVDS output characteristics of the DS15BR400 and DS15BR401 are optimized

for point-to-point backplane and cable applications.

3 www.national.com

DS15BR400/DS15BR401

Absolute Maximum Ratings (Note 3)

Supply Voltage (VDD)−0.3V to +4.0V

CMOS Input Voltage −0.3V to (VDD+0.3V)

LVDS Receiver Input Voltage −0.3V to (VDD+0.3V)

LVDS Driver Output Voltage −0.3V to (VDD+0.3V)

LVDS Output Short Circuit Current +40 mA

Junction Temperature +150°C

Storage Temperature −65°C to +150°C

Lead Temperature (Solder, 4sec) 260°C

Max Pkg Power Capacity @ 25°C

TQFP

LLP

1.64W

4.16W

Thermal Resistance (θJA)

TQFP

LLP

76°C/W

30°C/W

Package Derating above +25°C

TQFP

LLP

13.2mW/°C

33.3mW/°C

ESD Last Passing Voltage

HBM, 1.5kΩ, 100pF 8 kV

LVDS pins to GND only 15 kV

EIAJ, 0Ω, 200pF 250V

Charged Device Model 1000V

Recommended Operating

Conditions

Supply Voltage (VDD) 3.0V to 3.6V

Input Voltage (VI) (Note 4) 0V to VDD

Output Voltage (VO) 0V to VDD

Operating Temperature (TA)

Industrial −40°C to +85°C

Note 3: Absolute maximum ratings are those values beyond which damage

to the device may occur. The databook specifications should be met, without

exception, to ensure that the system design is reliable over its power supply,

temperature, and output/input loading variables. National does not

recommend operation of products outside of recommended operation

conditions.

Note 4: VID max < 2.4V

Electrical Characteristics

Over recommended operating supply and temperature ranges unless other specified.

Symbol Parameter Conditions Min

Typ

(Note

Max Units

LVCMOS DC SPECIFICATIONS (PWDN, PEM)

VIH High Level Input Voltage 2.0 VDD V

VIL Low Level Input Voltage GND 0.8 V

IIH High Level Input Current VIN = VDD = 3.6V (PWDN pin) −10 +10 µA

IIHR High Level Input Current VIN = VDD = 3.6V (PEM pin) 40 200 µA

IIL Low Level Input Current VIN = VSS, VDD = 3.6V −10 +10 µA

CIN1 LVCMOS Input Capacitance Any Digital Input Pin to VSS 5.5 pF

VCL Input Clamp Voltage ICL = −18 mA, VDD = 0V −1.5 −0.8 V

LVDS INPUT DC SPECIFICATIONS (INn±)

VTH Differential Input High

Threshold (Note 6)

VCM = 0.8V to 3.55V,

VDD = 3.6V 0 100 mV

VTL Differential Input Low

Threshold (Note 6)

VCM = 0.8V to 3.55V,

VDD = 3.6V −100 0 mV

VID Differential Input Voltage VCM = 0.8V to 3.55V, VDD = 3.6V 100 2400 mV

VCMR Common Mode Voltage

Range

VID = 150 mV, VDD = 3.6V 0.05 3.55 V

CIN2 LVDS Input Capacitance IN+ or IN− to VSS 3.0 pF

IIN Input Current VIN = 3.6V, VDD = 3.6V −10 +10 µA

VIN = 0V, VDD = 3.6V −10 +10 µA

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DS15BR400/DS15BR401

Symbol Parameter Conditions Min

Typ

(Note

Max Units

LVDS OUTPUT DC SPECIFICATIONS (OUTn±)

VOD Differential Output Voltage,

0% Pre-emphasis (Note 6)

RL = 100Ω external resistor between OUT+ and OUT−

Figure 1 250 360 500 mV

ΔVOD Change in VOD between

Complementary States −35 35 mV

VOS Offset Voltage (Note 7)1.05 1.18 1.475 V

ΔVOS Change in VOS between

Complementary States −35 35 mV

COUT LVDS Output Capacitance OUT+ or OUT− to VSS 2.5 pF

IOS Output Short Circuit Current OUT+ or OUT− Short to GND −21 −40 mA

OUT+ or OUT− Short to VDD 6 40 mA

SUPPLY CURRENT (Static)

ICC Supply Current All inputs and outputs enabled and active, terminated with

differential load of 100Ω between OUT+ and OUT-. PEM =

175 215 mA

ICCZ Supply Current - Power Down

Mode

PWDN = L, PEM = L 20 200 µA

SWITCHING CHARACTERISTICS—LVDS OUTPUTS

tLHT Differential Low to High

Transition Time (Note 12)

Use an alternating 1 and 0 pattern at 200 Mbps, measure

between 20% and 80% of VOD.

Figures 2, 4

170 250 ps

tHLT Differential High to Low

Transition Time (Note 12) 170 250 ps

tPLHD Differential Low to High

Propagation Delay

Use an alternating 1 and 0 pattern at 200 Mbps, measure

at 50% VOD between input to output.

Figures 2, 3

1.0 2.0 ns

tPHLD Differential High to Low

Propagation Delay 1.0 2.0 ns

tSKD1 Pulse Skew (Note 12) |tPLHD–tPHLD| 10 60 ps

tSKCC Output Channel to Channel

Skew (Note 12)

Difference in propagation delay (tPLHD or tPHLD) among all

output channels. 25 75 ps

tSKP Part to Part Skew (Note 12) Common edge, parts at same temp and VCC 550 ps

tJIT Jitter (0% Pre-emphasis)

(Note 8)

RJ - Alternating 1 and 0 at 750 MHz (Note 9) 0.5 1.5 ps

DJ - K28.5 Pattern, 1.5 Gbps (Note 10) 14 30 ps

TJ - PRBS 223-1 Pattern, 1.5 Gbps (Note 11) 14 31 ps

tON LVDS Output Enable Time Time from PWDN to OUT± change from TRI-STATE to

active. Figures 5, 6 20 µs

tOFF LVDS Output Disable Time Time from PWDN to OUT± change from active to TRI-

STATE. Figures 5, 6

12 ns

Note 5: Typical parameters are measured at VDD = 3.3V, TA = 25°C. They are for reference purposes, and are not production-tested.

Note 6: Differential output voltage VOD is defined as ABS(OUT+–OUT−). Differential input voltage VID is defined as ABS(IN+–IN−).

Note 7: Output offset voltage VOS is defined as the average of the LVDS single-ended output voltages at logic high and logic low states.

Note 8: Jitter is not production tested, but guaranteed through characterization on a sample basis.

Note 9: Random Jitter, or RJ, is measured RMS with a histogram including 1500 histogram window hits. Stimulus and fixture Jitter has been subtracted. The

input voltage = VID = 500 mV, input common mode voltage = VICM = 1.2V, 50% duty cycle at 750 MHz, tr = tf = 50 ps (20% to 80%).

Note 10: Deterministic Jitter, or DJ, is a peak to peak value. Stimulus and fixture jitter has been subtracted. The input voltage = VID = 500 mV, input common

mode voltage = VICM = 1.2V, K28.5 pattern at 1.5 Gbps, tr = tf = 50 ps (20% to 80%). The K28.5 pattern is repeating bit streams of (0011111010 1100000101).

Note 11: Total Jitter, or TJ, is measured peak to peak with a histogram including 3500 window hits. Stimulus and fixture Jitter has been subtracted. The input

voltage = VID = 500 mV, input common mode voltage = VICM = 1.2V, 223-1 PRBS pattern at 1.5 Gbps, tr = tf = 50 ps (20% to 80%).

Note 12: Not production tested. Guaranteed by a statistical analysis on a sample basis at the time of characterization.

5 www.national.com

DS15BR400/DS15BR401

DC Test Circuits

20188925

FIGURE 1. Differential Driver DC Test Circuit

AC Test Circuits and Timing Diagrams

20188926

FIGURE 2. Differential Driver AC Test Circuit

20188927

FIGURE 3. Propagation Delay Timing Diagram

20188928

FIGURE 4. LVDS Output Transition Times

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DS15BR400/DS15BR401

20188929

FIGURE 5. Enable/Disable Time Test Circuit

20188930

FIGURE 6. Enable/Disable Time Diagram

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DS15BR400/DS15BR401

Application Information

INTERNAL TERMINATIONS

The DS15BR400 has integrated termination resistors on both

the input and outputs. The inputs have a 100Ω resistor across

the differential pair, placing the receiver termination as close

as possible to the input stage of the device. The LVDS outputs

also contain an integrated 100Ω ohm termination resistor, this

resistor is used to minimize the output return loss and does

not take the place of the 100 ohm termination at the inputs to

the receiving device. The integrated terminations improve

signal integrity and decrease the external component count

resulting in space savings. The DS15BR401 has 100Ω output

terminations only.

OUTPUT CHARACTERISTICS

The output characteristics of the DS15BRB400/DS15BR401

have been optimized for point-to-point backplane and cable

applications, and are not intended for multipoint or multidrop

signaling.

POWERDOWN MODE

The PWDN input activates a hardware powerdown mode.

When the powerdown mode is active (PWDN=L), all input and

output buffers and internal bias circuitry are powered off.

When exiting powerdown mode, there is a delay associated

with turning on bandgap references and input/output buffer

circuits as indicated in the LVDS Output Switching Charac-

teristics

Upon asserting the power down function (PWDN = Low), and

if the Pre-emphasis feature is enable, it is possible for the

driver output to source current for a short amount of time lifting

the output common mode to VDD. To prevent this occurrence,

a load discharge pull down path can be used on either output

(1 kΩ to ground recommended). Alternately, a commonly de-

ployed external failsafe network will also provide this path

(see INPUT FAILSAFE BIASING). The occurrence of this is

application dependant, and parameters that will effect if this

is of concern include: AC coupling, use of the powerdown

feature, presence of the discharge path, presence of the fail-

safe biasing, the usage of the pre-emphasis feature, and input

characteristics of the downstream LVDS Receiver.

PRE-EMPHASIS

Pre-emphasis dramatically reduces ISI jitter from long or

lossy transmission media. One pin is used to select the pre-

emphasis level for all outputs, off or on. The pre-emphasis

boost is approximately 6 dB at 750 MHz.

Pre-emphasis Control Selection Table

PEM Pre-Emphasis

0 Off

1 On

INPUT FAILSAFE BIASING

Failsafe biasing of the LVDS link should be considered if the

downstream Receiver is ON and enabled when the source is

in TRI-STATE, powered off, or removed. This will set a valid

known input state to the active receiver. This is accomplished

by using a pull up resistor to VDD on the ‘plus’ line, and a pull

down resistor to GND on the ‘minus’ line. Resistor values are

in the 750 Ohm to several kΩ range. The exact value depends

upon the desired common mode bias point, termination re-

sistor(s) and desired input differential voltage setting. Please

refer to application note AN-1194 “Failsafe Biasing of LVDS

interfaces” for more information and a general discussion.

DECOUPLING

Each power or ground lead of the DS15BR400 should be

connected to the PCB through a low inductance path. For best

results, one or more vias are used to connect a power or

ground pin to the nearby plane. Ideally, via placement is im-

mediately adjacent to the pin to avoid adding trace induc-

tance. Placing power plane closer to the top of the board

reduces effective via length and its associated inductance.

Bypass capacitors should be placed close to VDD pins. Small

physical size capacitors, such as 0402, X7R, surface mount

capacitors should be used to minimize body inductance of

capacitors. Each bypass capacitor is connected to the power

and ground plane through vias tangent to the pads of the ca-

pacitor. An X7R surface mount capacitor of size 0402 has

about 0.5 nH of body inductance. At frequencies above 30

MHz or so, X7R capacitors behave as low impedance induc-

tors. To extend the operating frequency range to a few hun-

dred MHz, an array of different capacitor values like 100 pF,

1 nF, 0.03 µF, and 0.1 µF are commonly used in parallel. The

most effective bypass capacitor can be built using sand-

wiched layers of power and ground at a separation of 2–3

mils. With a 2 mil FR4 dielectric, there is approximately 500

pF per square inch of PCB.

The center dap of the LLP package housing the DS15BR400

should be connected to a ground plane through an array of

vias. The via array reduces the effective inductance to ground

and enhances the thermal performance of the LLP package.

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DS15BR400/DS15BR401

INPUT INTERFACING

The DS15BR400 and DS15BR401 accept differential signals and allow simple AC or DC coupling. With a wide common mode

range, the DS15BR400 and DS15BR401 can be DC-coupled with all common differential drivers (i.e. LVPECL, LVDS, CML). The

following three figures illustrate typical DC-coupled interface to common differential drivers. Note that the DS15BR400 inputs are

internally terminated with a 100Ω resistor while the DS15BR401 inputs are not, therefore the latter requires external input termi-

nation.

20188941

Typical LVDS Driver DC-Coupled Interface to DS15BR400 Input

20188942

Typical CML Driver DC-Coupled Interface to DS15BR400 Input

20188943

Typical LVPECL Driver DC-Coupled Interface to DS15BR400 Input

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DS15BR400/DS15BR401

OUTPUT INTERFACING

The DS15BR400 and DS15BR401 output signals that are compliant to the LVDS standard. Their outputs can be DC-coupled to

most common differential receivers. The following figure illustrates typical DC-coupled interface to common differential receivers

and assumes that the receivers have high impedance inputs. While most differential receivers have a common mode input range

that can accomodate LVDS compliant signals, it is recommended to check respective receiver's data sheet prior to implementing

the suggested interface implementation.

20188944

Typical DS15BR400 Output DC-Coupled Interface to an LVDS, CML or LVPECL Receiver

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DS15BR400/DS15BR401

Typical Performance Characteristics

Power Supply Current vs. Data Rate

20188920

Total Jitter vs. Ambient Temperature

20188921

Total Jitter vs. Data Rate

20188922

Data Rate vs. Cable Length (0.25 UI Criteria)

20188923

Data presented in this graph was collected using the DS15BR400EVK, a

pair of RJ-45 to SMA adapter boards and various length Belden 1700a

cables. The maximum data rate was determined based on total jitter (0.25

UI criteria) measured after the cable. The total jitter was a peak to peak value

measured with a histogram including 3000 window hits.

Data Rate vs. Cable Length (0.5 UI Criteria)

20188924

Data presented in this graph was collected using the DS15BR400EVK, a

pair of RJ-45 to SMA adapter boards and various length Belden 1700a

cables. The maximum data rate was determined based on total jitter (0.5 UI

criteria) measured after the cable. The total jitter was a peak to peak value

measured with a histogram including 3000 window hits.

11 www.national.com

DS15BR400/DS15BR401

Physical Dimensions inches (millimeters) unless otherwise noted

48-TQFP

NS Package Number VBC48a

Order Number DS15BR400TVS, DS15BR401TVS (250 piece Tray)

Order Number DS15BR400TVSX, DS15BR401TVSX (1000 piece Tape and Reel)

32-LLP

(See AN-1187 for PCB Design and Assembly Recommendations)

NS Package Number SQA32A

Order Number DS15BR400TSQ, DS15BR401TSQ (1000 piece Tape and Reel)

DS15BR400TSQX, DS15BR401TSQX (4500 piece Tape and Reel)

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DS15BR400/DS15BR401

13 www.national.com

DS15BR400/DS15BR401

Notes

DS15BR400/DS15BR401 4-Channel LVDS Buffer/Repeater with Pre-Emphasis

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