© 2008 Microchip Technology Inc. DS21073K-page 1
24AA65/24LC65/24C65
Device Selection Table
Features:
Voltage Operating Range: 1.8V to 6.0V
- Peak writ e curr ent 3 mA at 6.0V
- Maximum read current 150 μA at 6.0V
- Standby current 1 μA, typical
Industry Standard Two-Wire Bus Protocol I2C™
Compatible
8-B yte Page, or Byte mo des Availab le
2 ms Typical Write Cycle Time, Byte or Page
64-Byte Input Cache for Fast Write Loads
Up to 8 devices may be connected to the same
bus for up to 512K bits total memory
Including 100 kHz (1.8V Vcc < 4.5V) and 400
kHz (4.5V VCC 6.0V) Comp atibilit y
Programmable Block Security Options
Programmable Endurance Options
Schmitt Trigger, Filtered Inputs for Noise
Suppression
Output Slop e Control t o El im ina te Gro und Bounce
Self-Timed Erase and Write Cycles
Power-on/off Data Protection Circuitry
Endurance:
- 10,000,000 E/W cy cles for a High Endura nce
Block
- 1,000,000 E/W cycles for a Standard
Endurance Block
Electros t atic Discha rge Prote cti on > 4000V
Data Retention > 200 years
8-pin PDIP/SOIJ Packages
Temperature Ranges
Pb-Free and RoHS Compliant
Description:
The Microchip Technology Inc. 24AA65/24LC65/
24C65 (2 4XX6 5)* is a “sm art ” 8K x 8 Seria l Ele ctrica ll y
Erasable PROM. This device has been developed for
advanced, low-power applications such as personal
communications, and provides the systems designer
with flexibility through the use of many new user-pro-
gramm able fea tures. The 24 XX65 offer s a reloca table
4K bit block of ultra-high-endurance memory for data
that chang es fr equ ent ly. Th e rem ain der of the arra y, or
60K bit s, is rated at 1, 000,000 era se/write (E/W) c ycles
ensured. The 24XX65 features an input cache for fast
wri te lo ad s wit h a capa ci ty of eig ht page s , or 64 b yt es.
This device also features programmable security
options for E/W protection of critical data and/or code
of up to fifteen 4K blocks. Functional address lines
allow the connection of up to eight 24XX65’s on the
same bus for up to 512K bits contiguous EEPROM
memory. Advanced CMOS technology makes this
device ideal for low-power nonvolatile code and data
applications. The 24XX65 is available in the standard
8-pin plastic DIP and 8-pin surface mount SOIJ
package.
Package Types
Part Number VCC Range Page Size Temp. Ranges Packages
24AA65 1.8-6.0V 64 Bytes C P, SM
24LC65 2.5-6.0V 64 Bytes C, I P, SM
24C65 4.5 -6.0V 64 Bytes C, I, E P, SM
- Industrial (I) -40°C to +85°C
- Automotive (E) -40°C to +125°C
24XX65
A0
A1
A2
V
SS
1
2
3
4
8
7
6
5
V
CC
NC
SCL
SDA
24XX65
A0
A1
A2
V
SS
1
2
3
4
8
7
6
5
V
CC
NC
SCL
SDA
PDIP
SOIJ
64K I2C Smart Serial EEPROM
*24XX65 is used in this document as a generic part
number for the 24AA65/24LC65/24C65 devices.
24AA65/24LC65/24C65
DS21073K-page 2 © 2008 Microchip Technology Inc.
Block Diagram Pin Function Table
HV Generator
EEPROM
Array
Page Lat ches
YDEC
XDEC
Sense Amp.
R/W Control
Memory
Control
Logic
I/O
Control
Logic
SDA
SCL
VCC
VSS
I/O
A2A1A0
Cache
Name Function
A0, A1, A2 User Configurable Chip Selects
VSS Ground
SDA Serial Address/Data/I/O
SCL Serial Clock
VCC +1.8V to 6.0V Power Supply
NC No Internal Connection
© 2008 Microchip Technology Inc. DS21073K-page 3
24AA65/24LC65/24C65
1.0 ELECTRICAL CHARAC TERISTICS
Absolute Maximum Ratings(†)
VCC.............................................................................................................................................................................7.0V
All inputs and outputs w.r.t. VSS ..........................................................................................................-0.6V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied................................................................................................-40°C to +125°C
ESD protection on all pins......................................................................................................................................................≥ 4 kV
TABLE 1-1: DC CHARACTERISTICS
FIGURE 1-1: BUS TIMING START/STOP
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device . This i s a stres s ratin g only and functio nal operati on of the devic e at thos e or any other co nditio ns abov e thos e
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for an
extended period of time may affect device reliability.
DC CHARACTERISTICS
VCC = +1.8V to +6.0V
Commercial (C): TA =0°C to +70°C
Industrial (I): TA =-40°C to +85°C
Automotive (E): TA =-40°C to +125°C
Parameter Sym Min Max Units Conditions
A0, A1, A2, SCL and SDA pins:
High-level input voltage
Low-level input voltage
Hyster es is of Sc hm itt Trigger inputs
Low-level output voltage
VIH
VIL
VHYS
VOL
.7 VCC
.05 VCC
.3 VCC
.40
V
V
V
V(Note 1)
IOL = 3.0 mA
Input leakage current ILI ±1μAVIN = .1V to VCC
Output lea ka ge current ILO ±1μAVOUT = .1V to VCC
Pin capacitance
(all inputs/ou tpu t s) CIN, COUT —10pFVCC = 5.0V (Note 1)
TA = 25°C, FCLK = 1 MHz
Operati ng current ICC Write
ICC Read
3
150 mA
μAVCC = 6.0V, SCL = 400 kHz
VCC = 6.0V, SCL = 400 kHz
Standby current ICCS —5μAVCC = 5.0V, SCL = SDA = VCC
A0, A1, A2 = VSS
Note 1: This parameter is periodically sampled and not 100% tested.
TSU:STA THD:STA
VHYS
TSU:STO
Start Stop
SCL
SDA
24AA65/24LC65/24C65
DS21073K-page 4 © 2008 Microchip Technology Inc.
TABLE 1-2: AC CHARACTERISTICS
FIGURE 1-2: BUS TIMING DATA
Parameter Symbol VCC = 1.8V-6.0V
STD. Mode VCC = 4.5-6.0V
FAST Mode Units Remarks
Min Max Min Max
Clock frequency FCLK —100 400kHz
Clock high time THIGH 4000 600 ns
Clock low time TLOW 4700 1300 ns
SDA and SCL rise time TR 1000 300 ns (Note 1)
SDA and SCL fall time TF 300 300 ns (Note 1)
Start condition setup time THD:STA 4000 600 ns After this peri od the firs t
clock pulse is generated
Start condition setup time TSU:STA 4700 600 ns Only relevant for
repeated Start condition
Data input hold time THD:DAT 0— 0 ns
Data input setup time TSU:DAT 250 100 ns
Stop condition setup time TSU:STO 4000 600 ns
Output valid from clock TAA 3500 900 ns (Note 2)
Bus free time TBUF 4700 1300 ns Time the bus must be
free before a new
transmission can start
Output fall time from VIH min to
VIL max TOF 250 20 + 0.1
CB250 ns (Note 1), CB 100 pF
Input filter spike suppression
(SDA and SCL pins) TSP 50 50 ns (Note 3)
Write cycle time TWR 5 5 ms/page (Note 4)
Endurance
High Endurance Block
Rest of Array 10M
1M
10M
1M
cycles 25°C, (Note 5)
Note 1: Not 100 percent tested. CB = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: The combi ne d TSP and VHYS specifications are due to new Schmitt Trigger inputs which provide improved
noise and spike suppression. This eliminates the need for a Ti specification for standard operation.
4: The times shown are for a single page of 8 bytes. Multiply by the number of pages loaded into the write
cache for total time.
5: This parameter is not tes ted but ensured by characterization. For endu rance estimates in a specif ic
applic ation, pleas e cons ult th e Total En duranc e™ Mod el whic h can be down loade d at www.microch ip.co m.
SCL
SDA
IN
SDA
OUT
TSU:STA
TSP
TAA
TF
TLOW
THIGH
THD:STA THD:DAT TSU:DAT TSU:STO
TBUF
TAA
TR
© 2008 Microchip Technology Inc. DS21073K-page 5
24AA65/24LC65/24C65
2.0 FUNCTIONAL DESCRIPTION
The 24XX65 supports a bidirectional two-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as transmitter, and a device
receiving data as receiver. The bus must be controlled
by a master device which generates the serial clock
(SCL), c ontrol s the bus acce ss a nd ge nerates the S tart
and Stop conditions , whil e the 24XX65 works as sl ave.
Both master and slave can operate as transmitter or
receive r, but the master device determines which mode
is activated.
3.0 BUS CHARACTERISTICS
The following bus protocol has been defined:
Data transfer may be initiated only when the bus
is not busy.
During data transfer, the data line must remain
stab le when ever th e clock lin e is high . Change s in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
Accordingly, the following bus conditions have been
defined (Figur e 3-1).
3.1 Bus not Busy (A)
Both data and clock lines remain high.
3.2 Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
3.3 S top Data Transfer (C)
A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must be ended with a Stop condition.
3.4 Data Valid (D)
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
The data on the line must be changed during the low
period of the clock signal. There is one clock pulse per
bit of data.
Each dat a transf er is initiated w ith a S tart condition an d
terminated with a Stop condition. The number of the
data bytes transferred between the Start and Stop
conditions is determined by the master device.
3.5 Acknowledge
Each receiving device, when addressed, is obliged to
generate an acknowledge after the reception of each
byte. Th e mast er device mus t ge nera te a n ex tra c lock
pulse which is associated with this Acknowledge bit.
A device that acknowledges must pull down the SDA
line during the Acknowledge clock pulse in such a way
that the SD A line is sta ble low d uring the high pe riod of
the ack nowledge relat ed clock pu lse. Of co urse, setup
and hold times must be taken into account. During
reads, a maste r mus t sign al an e nd of dat a to the sl ave
by NOT gene rating an Acknowl edge bit on the las t byte
that has been cl ocke d out o f the slave . In th is ca se , the
slave (24 XX65) mus t leav e the dat a line high to en able
the master to generate the Stop condition.
FIGURE 3-1: DATA TRANSFER SEQUENCE ON THE SERIAL BUS
Note: The 24XX65 does not generate any
Acknowledge bits if an internal program-
ming cycle is in prog res s.
SCL
SDA
(A) (B) (D) (D) (A)(C)
Start
Condition Address or
Acknowledge
Valid
Data
Allowed
To Change
Stop
Condition
24AA65/24LC65/24C65
DS21073K-page 6 © 2008 Microchip Technology Inc.
3.6 Device Addressing
A control byte is the first byte received following the
S tar t condition from the m aster device . The co ntrol byte
consists of a four-bit control code, for the 24XX65 this
is set as ‘1010’ binary for read and write operations.
The next three bits of the control byte are the device
select bits (A2, A1, A0). They are used by the master
device to select which of the eight devices are to be
accessed. These bits are in effect the three Most
Significant bits of the word address. The last bit of the
control byte defines the operation to be performed.
When set to a one a read operation is selected, when
set to a z ero a wri te operation is sele cted. The n ext two
bytes received define the address of the first data byte
(Figure 4-1). Because only A12..A0 are used, the
upper three address bits must be zeros. The Most
Signific ant bit of the Most Significan t Byte is trans ferred
first. Following the Start condition, the 24XX65
monitors the SDA bus checking the device type
identifier being transmitted. Upon receiving a ‘1010
code and appropriate device select bits, the slave
device (24XX65) output s an Acknowledge si gnal on the
SDA lin e. Dep en din g u pon the st ate of the R/W bi t, th e
24XX65 will select a read or write operation.
FIGURE 3-2: CONTROL BYTE
ALLOCATION
4.0 WRITE OPERATION
4.1 Byte Write
Following the Start condition from the master, the con-
trol code (four bits), the device select (three bits), and
the R/W bit which is a logic low, is placed onto the bus
by the master transmitter. This indicates to the
addressed slave receiver (24XX65) that a byte with a
word address will follow after it has generated an
Acknowledge bit during the ninth clock cycle. There-
fore, the next byte transmitted by the master is the
high-order byte of the word address and will be written
into the Address Pointer of the 24XX65. The next byte
is the Least Significant Address Byte. After receiving
another Acknowledge signal from the 24XX65, the
master device will transmit the data word to be written
into the addressed memory location. The 24XX65
acknowledges again and the master generates a Stop
condition. This initiates the internal write cycle, and
during this time the 24XX65 will not generate
Acknowledge signals (Figure 4-1).
4.2 Page Write
The write cont rol byte , word address and the first data
byte are transmitted to the 24XX65 in the same way as
in a byte write. But instead of generating a Stop
condition, the master transmits up to eight pages of
eight data bytes each (64 bytes total), which are
temporarily stored in the on-chip page cache of the
24XX65. They will be written from the cache into the
EEPROM array after the master has transmitted a S top
condition. After the receipt of each word, the six lower
order Address Pointer bits are internally incremented by
one. The higher order seven bits of the word address
remain constant. If the master should transmit more
than eight bytes prior to generating the Stop condition
(writi ng across a page boundary), t he address counter
(lower three bits) will roll over and the pointer will be
incremente d to poi nt to the n ext line in the ca che. Th is
can continue to occur up to eight times or until the cache
is full, at which time a Stop condition should be
generated by the master. If a Stop condition is not
received, t he cache poi nter w ill roll over to the f irst lin e
(byte 0) of the cache, and any further data received will
overwrite pr eviously captur ed data. The Stop conditio n
can be sent at any t ime dur ing the tran sfe r. As with the
byte write operation, once the Stop condition is received
an internal write cycle will begin. The 64-byte cache will
continue to capture data until a Stop condition occurs or
the operation is aborted (Figure 4-2).
Operatio n Control Code Device Select R/W
Read 1010 Device Address 1
Write 1010 Device Address 0
SLAVE ADDRESS
1010A2 A1 A0
R/W A
START READ/WRITE
© 2008 Microchip Technology Inc. DS21073K-page 7
24AA65/24LC65/24C65
FIGURE 4-1: BYTE WRITE
FIGURE 4-2: PAGE WRITE (FOR CACHE WRITE, SEE FIGURE 8-2)
FIGURE 4-3: CURRENT ADDRESS READ
000
Bus Activity
Master
SDA Line
Bus Activity
S
T
A
R
T
Control
Byte Word
Address (1) Word
Address (0) Data
A
C
K
A
C
K
A
C
K
A
C
K
S
T
O
P
SP
Bus
Master
SDA Line
Bus
Control
Byte Word
Address (1) S
T
O
P
S
T
A
R
T
A
C
K
0
A
C
K
A
C
K
Activity
Activity:
A
C
K
A
C
K
Data n Data n + 7
00
Word
Address (0)
P
S
SP
Bus Activity
Master
SDA Line
Bus Activity
S
T
A
R
T
S
T
O
P
Control
Byte Data n
A
C
KN
O
A
C
K
24AA65/24LC65/24C65
DS21073K-page 8 © 2008 Microchip Technology Inc.
FIGURE 4-4: RANDOM READ
FIGURE 4-5: SEQUENTIAL READ
SDA Line
Bus
Control
Byte Word
Address (1) S
T
O
P
S
T
A
R
T
A
C
K
A
C
K
A
C
K
Activity A
C
K
N
O
Data n
000
Word
Address (0)
S
T
A
R
TControl
Byte
A
C
K
P
SS
P
Bus Activity
Master
SDA Line
Bus Activity
S
T
O
P
Control
Byte
A
C
KN
O
A
C
K
Data n Data n + 1 Data n + 2 Data n + X
A
C
KA
C
KA
C
K
© 2008 Microchip Technology Inc. DS21073K-page 9
24AA65/24LC65/24C65
5.0 READ OPERATION
Read operations are initiated in the same way as write
operations with the exception that the R/W bit of the
slave address is set to one. There a re three ba sic types
of read operat ions: current address read , rand om rea d
and sequential read.
5.1 Current Address Read
The 24XX65 contains an address counter that main-
tains the address of the last word accessed, internally
incremented by one. Therefore, if the previous access
(either a re ad or wri te opera tion) was to addre ss n (n is
any legal address), the next current address read
operatio n wou ld acc ess dat a f rom add ress n + 1. U pon
receipt of the slav e address w ith R/W bit s et to one, the
24XX65 issues an acknowledge and transmits the
eight-bit data word. The master will not acknowledge
the tr ansfer bu t does ge nerate a Stop con dition an d the
24XX65 discontinues transmission (Figure 4-3).
5.2 Random Read
Random read operations allow the master to access
any memory location in a random manner. To perform
this typ e of re ad ope r atio n, fi rst the w o rd ad dres s must
be set. This is done b y sendi ng the word address to the
24XX65 as p art of a write operati on (R/W bit se t to ‘0’).
Aft er the word add res s is sent, the master generates a
Start condition following the acknowledge. This
terminates the write operation, but not before the
internal Address Pointe r is se t. Then t he master i ssue s
the control byte again, but with the R /W bit set to a one.
The 24XX65 will then issue an acknowledge and
transmit the eight-bit data word. The master will not
acknowledge the transfer, but does generate a Stop
condition which causes the 24XX65 to discontinue
transmission (Figure 4-4).
5.3 Sequential Read
Sequential reads are initiated in the same way as a
random read except that after the 24XX65 transmits the
first data byte, the master issues an acknowledge as
opposed to t he Stop co ndition used in a r andom read.
This acknowledge directs the 24XX65 to transmit the
next sequentially addressed 8-bit word (Figure 4-5).
Following the final byte transmitted to the master, the
master will NOT generate an acknowledge, but will
generate a S top condition.
To provide sequential reads the 24XX65 contains an
internal Address Pointer which is incremented by one
at the completion of each operation. This Address
Pointer allows the entire memory contents to be serially
read during one operati on .
5.4 Contiguous Addressing Across
Multiple Devices
The device select bits A2, A1, A0 can be used to
expand the contiguous address space for up to 512K
bits by adding up to eight 24XX65's on the same bus.
In this c ase , s oftware c an us e A0 o f th e con trol b yte as
address bit A13, A1 as address bit A14 and A2 as
address bit A15.
5.5 Noise Protection
The SCL and SDA inputs have filter circuits which
suppress noise spikes to assure proper device
operatio n even o n a nois y bus. Al l I/O li nes inc orpora te
Schmitt T ri ggers for 400 kHz (Fast mo de) compa tibility.
5.6 High Endurance Block
The location of the high endurance block within the
memory map is programmed by setting the leading bit
7 (S/HE) of the con figuration by te to 0 . Th e up per bits
of the address loaded in this command will determine
which 4K block within the memory map will be set to
high endurance. This block will be capable of
10,000,0 00 eras e/w ri te cy cle s typ ic al (Fig ure 8-1).
The high endurance block will retain its value as the
high endurance block even if it resides within the
security block range. The high endurance setting
always takes precedence to the security setting.
Note: The high endurance block cannot be
changed after the security option has been
set with a length greater than zero. If the
H.E. bloc k is not program med by th e user,
the default location is the highest block of
memory which starts at location 0x1E00
and ends at 0x1FFF.
24AA65/24LC65/24C65
DS21073K-page 10 © 2008 Microchip Technology Inc.
5.7 Security Options
The 24XX65 has a sophisticated mechanism for write
protecting portions of the array. This write-protect
function is programmable and allows the user to pr otect
0-15 contiguous 4K blocks. The user sets the security
option by sending to the device the starting block
number for the protected region and the number of
blocks to be protected. All parts will come from the
factory in the default configuration with the starting
block number set to 15 and the number of protected
blocks set to zero. THE SECURITY OPTION CAN BE
SET ONLY ONCE WITH A LENGTH GREATER THAN
ZERO.
To invoke th e s ec urit y o pti on, a W r it e c om ma nd is se nt
to the device with the leading bit (bit 7) of the first
address byte set to a ‘1’ (Figure 8-1). Bits 1-4 of the first
address byte define the starting block number for the
protected region.
For exam ple, i f the s tart ing bl ock n umber is to b e set to
5, the first address byte would be 1XX0101X. Bits 0, 5
and 6 of the f irst ad dress by te are disregar ded by the
device and can be either high or low. The device will
acknowledge after the first address byte. A byte of
“don’t care” bits is then sent by the master, with the
device acknowledging afterwards. The third byte sent
to the dev ic e h as bit 7 (S/H E) s et h igh and bit 6 (R) s et
low. Bits 4 and 5 are “don’t cares” and bits 0-3 define
the number of blocks to be write-protected. For exam-
ple, if three blocks are to be protected, the third byte
would be 10XX0011. After the third byte is sent to the
device, it will acknowledge and a Stop bit is then sent
by the master to complete the command.
If one of the security blocks coincides with the high
endurance block, the high endurance setting will take
precedence. Also, if the range of the security blocks
enc ompass the hi gh endur ance bl ock wh en the se cu-
rity option is set, the security block range will be set
accordi ng ly, bu t the hig h enduranc e b loc k will con tinu e
to retain the high endurance setting. As a result, the
memory blocks preceding the high endu rance block will
be set as secure sections.
During a normal write sequence, if an attempt is made
to write to a protected address, no data will be written
and the device will not report an error or abort the
command. If a Write command is attempted across a
secure boundary , un protected addresses will be writte n
and protected addresses will not.
5.8 Security Configuration Read
The st atus o f the secu re portion of memory can be read
by using the same technique as programming this
option except the read bit (bit 6) of the configuration
byte is set t o a one . Aft er the c onfigu ration byte i s sen t,
the device will acknowledge and then se nd two bytes of
data to the master just as in a normal read sequence.
The master must acknowledge the first byte and not
acknowledge the second, and then send a Stop bit to
end the sequence. The upper fou r bit s of both of thes e
bytes w ill alway s be rea d as ‘1s. The lowe r four bits of
the first byte contains the starting secure block. The
lower four bits of the second byte contains the number
of secure blocks. The default starting secure block is
fifteen and the default number of secure blocks is zero
(Figure 8-1).
6.0 ACKNOWLED GE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a Write
comma nd has been is sued from the master , th e device
initiates the internally timed write cycle. ACK polling
can be initiated immediately. This involves the master
sending a Start condition followed by the control byte
for a Write command (R/W = 0). If the device is still
busy with the write cycl e, then no ACK will be returne d.
If the cycle is complete, then the device will return the
ACK and the master can then proceed with the next
Read or Write command. See Figure 6-1 for flow
diagram.
FIGURE 6-1: ACKNOWLEDGE
POLLING FLOW
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
Next
Operation
NO
YES
© 2008 Microchip Technology Inc. DS21073K-page 11
24AA65/24LC65/24C65
7.0 PAGE CACHE AND ARRAY
MAPPING
The cache is a 64-byte (8 pages x 8 bytes) FIFO buffer .
The cache allows the loading of up to 64 bytes of data
before the write cycle is actually begun, effectively
providing a 64-byte burst write at the maximum bus
rate. When ever a Write command is initi ated, the cache
start s load ing and wi ll contin ue to load un til a Stop bit is
received to start the internal write cycle. The total
length of the write cycle will depend on how many
pages are loaded into the cache before the Stop bit is
given. Maximum cycle time for each p age is 5 ms. Even
if a page is only partially loaded, it will still require the
same cy cle time a s a full page. If more than 64 bytes of
data are loaded before the Stop bit is given, the
Address Pointer will ‘wrap around’ to the beginning of
cache page 0 and existing bytes in the cache will be
overwritten. The device will not respond to any
comm ands w hile the wr ite cycle is in progr ess.
7.1 Cache Write Starting at a Page
Boundary
If a Write command begins at a page boundary
(address bits A2, A1 and A0 are zero), then all data
loaded into the cache will be written to the array in
sequential addresses. This includes writing across a
4K block boundary. In the example shown below,
(Figure 8-2) a Write command is initiated starting at
byte 0 of page 3 with a fully loaded cache (64 bytes).
The firs t by te in the cach e i s wri tte n to by te 0 o f page 3
(of the array), with the remaining pages in the cache
written to seque ntial p age s in the array. A wri te cyc le is
executed after each page is written. Since the write
begins at page 3 and 8 pages are loaded into the
cache, the last 3 pages of the cache are written to the
next row in the array.
7.2 Cache Write Starting at a
Non-Page Boundary
When a Writ e comm and is in iti ated tha t does not begin
at a page boundary (i.e., address bits A2, A1 and A0
are not all zero), it is important to note how the data is
loaded in to the cache , and how the dat a in the cache is
written to the arra y . When a W rite command begins, th e
first byte loaded into the cache is always loaded into
page 0. The byte within page 0 of the cache where the
load be gins is determined by the three Lea st Significant
Address bits (A2, A1, A0) that were sent as part of the
W rite command . If the Write co mmand does no t start at
byte 0 of a p age a nd the ca ch e i s ful ly lo aded, the n th e
last byte(s) loaded into the cache will roll around to
page 0 o f the ca ch e and fi ll th e remain ing e mp t y by tes .
If more than 6 4 bytes of dat a are load ed into the ca che,
data already loa ded will be overwr itte n. In the e xam pl e
shown in Figure 8-3, a Write command has been
initiated starting at byte 2 of page 3 in the array with a
fully l oad ed cache of 64 bytes . Si nc e t he cac he s tarted
loading at byte 2, the last two bytes loaded into the
cache will ‘roll over' and be loaded into the first two
bytes of page 0 (of the cache). When the Stop bit is
sent, page 0 of the cache is written to page 3 of the
array. The remaining pages in the cache are then
loaded sequentially to the array. A write cycle is
execute d afte r each p age is written . If a p artially loaded
page in the cache remains when the Stop bit is sent,
only the bytes that have been loaded will be written to
the array.
7.3 Power Management
The design incorporates a power Standby mode when
not in u se and auto matically powers of f after the normal
terminat ion of any operation when a S top bit is received
and all internal functions are complete. This includes
any error conditions (i.e., not receiving an Acknowl-
edge or Stop condition per the two-wire bus specifica-
tion). The device also incorporates VDD monitor
circuitry to prevent inadvertent writes (data corruption)
during l ow voltage conditio ns. The VDD monitor circuitry
is po wered o ff when the dev ice is in Standby mode in
order to further reduce power consumption.
8.0 PIN DESCRIPTIONS
8.1 A0, A1, A2 Chip Address Inputs
The A0..A2 input s are use d by the 24XX6 5 for m ult ipl e
device operation and conform to the two-wire bus
standard. The levels applied to these pins define the
address block occupied by the device in the address
map. A parti cu lar de vice is s ele cte d by transmit ting th e
corresponding bits (A2, A1, A0) in the control byte
(Figure 3-2 and Figure 8-1).
8.2 SDA Serial Address/Data Input/
Output
This is a bidirectional pin used to transfer addresses
and data into and data out of the device. It is an open
drain terminal, therefore the SDA bus requires a pull-up
resistor to VCC (typic al 10 KΩ for 100 kHz, 2 KΩ for 400
kHz).
For norma l data trans fer SDA is allowed to change onl y
during SCL low. Changes during SCL high are
reserved for indicating the Start and Stop conditions.
8.3 SCL Serial Clock
This inpu t is used to sy nchronize the data tra nsfer from
and to the device.
24AA65/24LC65/24C65
DS21073K-page 12 © 2008 Microchip Technology Inc.
FIGURE 8-1: CONTROL SEQUENCE BIT ASSIGNMENTS
A
1
Control Byte
A
2
A
0R/W
0101 A
10
Address Byte 1
A
11
A
9
A
8
00S A
7
A
0
Address Byte 0
Slave
Address
Device
Select
Bits
A
12
B
2
Configuration Byte
B
3
B
1
B
0
XR X
Block
Count
S/HE
A
1
A
2
A
0
0101 X
XXX
XX1 X
Starting Block
Number
S
t
a
r
t
0X
XXX
XX
XX
A
C
K
X
XXX
X11 X
A
C
K
B
2
B
3
B
1
B
0
111 1N
2
N
3
N
1
N
0
111 1
Number of
Blocks to
Protect
S
t
o
p
A
C
K
No
ACK
Data from Device
Acknowledge
from
Master
Data from Device
Acknowledges from Device
A
1
A
2
A
0
0101 B
1
B
2
B
0X
XX1 B
3
S
t
a
r
t
0X
XXX
XX
XXN
2
N
3
N
1
N
0
X01 X
A
C
K
S
t
o
p
Acknowledges from Device
A
1
A
2
A
0
A
C
K
0101 X
XXX
XX1 X
High Endurance
Block Number
S
t
a
r
t
0X
XXX
XX
XX
A
C
K
X
XXX
X10 X
A
C
K
B
2
B
3
B
1
B
0
111 1
S
t
o
p
A
C
K
No
ACK
Data from Device
Acknowledges from Device
A
1
A
2
A
0
A
C
K
0101 B
1
B
2
B
0X
XX1 B
3
S
t
a
r
t
0X
XXX
XX
XX
A
C
K
0
000
X00 X
A
C
K
S
t
o
p
A
C
K
Acknowledges from Device
Starting Block
Number
Number of
Blocks to
Protect
R
S/HE
R
S/HE
R
S/HE
R
S/HE
Security Read
Security Write
High Endurance Block Read
High Endurance Block Write
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
High Endurance
Block Number
© 2008 Microchip Technology Inc. DS21073K-page 13
24AA65/24LC65/24C65
FIGURE 8-2: CACHE WRITE TO THE ARRAY ST ARTING AT A PAGE BOUNDARY
FIGURE 8-3: CACHE WRITE TO THE ARRAY STARTING AT A NON-PAGE BOUNDARY
1 Write command initiated; 64 bytes of data
loaded into cache starting at byte 2 of page 0.
2 Last 2 bytes loaded 'roll over'
to beginning.
3
Last 2 bytes
loaded into
page 0 of cache.
4 Write from cache into array initiated by STOP bit.
Page 0 of cache written to page 3 of array.
Write cycle is executed after every page is written.
cache
byte 1
cache
byte 2 • • • cache
byte 7
cache page 1
bytes 8-15 • • •
page 0
cache page 2
bytes 16-23
cache page 7
bytes 56-63
page 1 page 2 • • • • • •
page 4 • • • page 7page 3
Remaining bytes in cache are
written sequentially to array.
5
array
row n
array
row
n + 1
cache
byte 0
Last 3 pages in cache written to next row in array.
6
page 1 page 2
byte 0 byte 2byte 1 page 4 page 7
byte 7byte 3 byte 4
page 0
24AA65/24LC65/24C65
DS21073K-page 14 © 2008 Microchip Technology Inc.
9.0 PACKAGING INFORMATION
9.1 Package Marking Information
XXXXXXXX
T/XXXNNN
YYWW
8-Lead PDIP (300 mil) Example:
8-Lead SOIJ (5.28 mm) Example:
24LC65
0110017
I/SM
24LC65
I/P017
0310
XXXXXXXX
YYWWNNN
T/XXXXXX
*Standard PICmicro device marking consists of Microchip part number, year code, week code, and
traceability code. For PICmicro device marking beyond this, certain price adders apply. Please check
with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP
price.
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric trac eab ili ty code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the fu ll Micr ochip part nu mber ca nnot be m arked on one line , it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
© 2008 Microchip Technology Inc. DS21073K-page 15
24AA65/24LC65/24C65


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1,21!'!&$& "!**&"&&!
 3&'!&"&4#*!(!!&4%&&#&
&&255***''54
6&! 7,8.
'!9'&! 7 7: ;
7"')%! 7 <
& 1,
&& = = 
##44!!   - 
1!&&   = =
"#&"#>#& .  - -
##4>#& .   <
: 9& -< -? 
&& 9  - 
9#4!! <  
69#>#& )  ? 
9*9#>#& )  < 
: *+ 1 = = -
N
E1
NOTE 1
D
123
A
A1
A2
L
b1
b
e
E
eB
c
  * ,<1
24AA65/24LC65/24C65
DS21073K-page 16 © 2008 Microchip Technology Inc.
 ! ""#$%& !'

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 +%&,&!&
- '!!#.#&"#'#%!&"!!#%!&"!!!&$#''!#
 3&'!&"&4#*!(!!&4%&&#&
&&255***''54
6&! 99..
'!9'&! 7 7: ;
7"')%! 7 <
& 1,
: 8&  = -
##44!!   = <
&#%%+   = 
: >#& . ? = <?
##4>#& .  = -<
: 9& - = --
3&9& 9  = ?
3& IA = <A
9#4!!  = 
9#>#& ) -? = 
#%& D= = A
#%&1&&' E= = A
φ
β
α
L
c
A2
A1
A
b
12
e
E
E1
N
D
  * ,?1
© 2008 Microchip Technology Inc. DS21073K-page 17
24AA65/24LC65/24C65
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
24AA65/24LC65/24C65
DS21073K-page 18 © 2008 Microchip Technology Inc.
APPENDIX A: REVISION HISTORY
Revision J
Corrections to Section 1.0, Electrical Characteristics.
Revision K (07/2008)
Revised Temperature ranges; Ambient temperature;
Revised Package Drawings; Replaced On-line
Support; Revised Product ID System.
© 2008 Microchip Technology Inc. DS21073K-page 19
24AA65/24LC65/24C65
THE MICROCHIP WEB SITE
Microc hip pro vides onl ine s upport v ia our W WW site at
www.microchi p.c om . Thi s web si te i s us ed as a m ean s
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
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Questions (FAQ), technical support requests,
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Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
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Microchip sales offices, distributors and factory
representatives
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SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specif ied produ ct family or develo pment tool of interes t.
To register, access the Microchip web site at
www.microchip.com, click on Customer Change
Notification and follow the registration instructions.
CUSTOMER SUPP ORT
Users of Microchip products can receive assistance
through several channels:
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Customers should contact their distributor,
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customers. A listing of sales offices and locations is
included in the back of this document.
Technical s upport is a vailable through the web si te
at: http://support.microchip.com
24AA65/24LC65/24C65
DS21073K-page 20 © 2008 Microchip Technology Inc.
READER RESP ONSE
It is ou r intentio n to provide you w it h th e b es t do cument ation po ss ib le to ensure suc c es sfu l u se of y ou r M ic roc hip prod-
uct. If you wi sh to prov ide you r comment s on org aniza tion, clar ity, subj ect matte r , and ways i n which o ur docum entatio n
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
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DS21073K24AA65/24LC65/24C65
1. What are the best features of this document ?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
© 2008 Microchip Technology Inc. DS21073K-page 21
24AA65/24LC65/24C65
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X/XX XXX
PatternPackageTemperature
Range
Device
Device: 24AA65 - 64K I2C 1.8V Serial EEPROM (100 kHz)
24AA65T - 64K I2C 1.8V Serial EEPROM (100 kHz)
24LC65 - 64K I2C Serial EEPROM (100 kHz/400 kHz)
24LC65T - 64K I2C Serial EEPROM (Tape and Reel)
24C65 - 64K I2C 4.5V Serial EEPROM (400 kHz)
24C65T - 64K I2C 4.5V Serial EEPROM (Tape and Reel)
Temperature
Range: I= -40°C to +85°C
E= -40°C to +125°C
Package: P = Plastic DIP (300 mil Body)
SM = Plastic SOIJ (5.28 mm Body, EIAJ standard)
Examples:
a) 24LC65T-I/SM: 64 Kbit Smart Serial,
Tape and Reel, 5.28 mm SOIJ package,
Industrial temperature, 2.5V
b) 24LC65-I/P: 64 Kbit Smart Serial,
Industrial temperature, PDIP package,
2.5V
c) 24AA65T-/SM: 64 Kbit Smart Serial,
Tape and Reel, 5.28 mm SOIJ package,
Commercial temperature, 1.8V
d) 24C65-E/P: 64 Kbit Smart Serial,
Automotive temperature, PDIP, 5V
24AA65/24LC65/24C65
DS21073K-page 22 © 2008 Microchip Technology Inc.
NOTES:
© 2008 Microchip Technology Inc. DS21073K-page 23
Information contained in this publication regarding device
applications a nd the lik e is p ro vided on ly for yo ur con ve nien ce
and may be supers eded by updates . I t is you r r es ponsibil it y to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, rfPIC and SmartShunt are registered trademarks
of Microchip Technology Incorporated in the U.S.A. and ot her
countries.
FilterLab, Linear Active Thermistor, MXDEV, MXLAB,
SEEV AL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, In-Circuit Serial
Prog ra m ming , IC SP, ICEPIC , Mi n d i , M iW i , M PASM, M P L A B
Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,
PICDEM.net, PICtail , PIC32 logo, PowerCal, PowerInfo,
PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Tot al
Endurance, UNI/O, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2008, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that it s family of products is one of the most secure families of its kind on the market today, when used in t he
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.
Code protection is c onstantly evolving. We a t Microc hip are co m mitted to continuously improving the code prot ect ion featur es of our
products. Attempts to break Microchip’ s code protection feature may be a violation of the Digital Millennium Copyright Act. If such act s
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperiph erals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS21073K-page 24 © 2008 Microchip Technology Inc.
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