PIC16C71X 8-Bit CMOS Microcontrollers with A/D Converter Devices included in this data sheet: PIC16C71X Peripheral Features: * * * * * Timer0: 8-bit timer/counter with 8-bit prescaler * 8-bit multichannel analog-to-digital converter * Brown-out detection circuitry for Brown-out Reset (BOR) * 13 I/O Pins with Individual Direction Control PIC16C710 PIC16C71 PIC16C711 PIC16C715 PIC16C71X Microcontroller Core Features: 710 71 711 715 Program Memory (EPROM) x 14 512 1K 1K 2K Data Memory (Bytes) x 8 36 36 68 128 I/O Pins 13 13 13 13 Timer Modules 1 1 1 1 A/D Channels 4 4 4 4 In-Circuit Serial Programming Yes Yes Yes Yes Brown-out Reset Yes -- Interrupt Sources 4 4 Yes Yes 4 4 Pin Diagrams PDIP, SOIC, Windowed CERDIP *1 18 RA1/AN1 RA3/AN3/VREF RA2/AN2 2 17 RA0/AN0 RA4/T0CKI 3 16 OSC1/CLKIN MCLR/VPP 4 15 OSC2/CLKOUT VSS 5 RB0/INT 6 RB1 RB2 7 8 RB3 14 VDD 13 RB7 12 11 RB6 RB5 9 10 RB4 SSOP *1 20 RA1/AN1 RA3/AN3/VREF RA2/AN2 2 19 RA0/AN0 RA4/T0CKI 3 18 OSC1/CLKIN MCLR/VPP 4 VSS 5 VSS 6 RB0/INT RB1 7 8 RB2 RB3 PIC16C710 PIC16C711 PIC16C715 1997 Microchip Technology Inc. PIC16C7X Features PIC16C710 PIC16C71 PIC16C711 PIC16C715 * High-performance RISC CPU * Only 35 single word instructions to learn * All single cycle instructions except for program branches which are two cycle * Operating speed: DC - 20 MHz clock input DC - 200 ns instruction cycle * Up to 2K x 14 words of Program Memory, up to 128 x 8 bytes of Data Memory (RAM) * Interrupt capability * Eight level deep hardware stack * Direct, indirect, and relative addressing modes * Power-on Reset (POR) * Power-up Timer (PWRT) and Oscillator Start-up Timer (OST) * Watchdog Timer (WDT) with its own on-chip RC oscillator for reliable operation * Programmable code-protection * Power saving SLEEP mode * Selectable oscillator options * Low-power, high-speed CMOS EPROM technology * Fully static design * Wide operating voltage range: 2.5V to 6.0V * High Sink/Source Current 25/25 mA * Commercial, Industrial and Extended temperature ranges * Program Memory Parity Error Checking Circuitry with Parity Error Reset (PER) (PIC16C715) * Low-power consumption: - < 2 mA @ 5V, 4 MHz - 15 A typical @ 3V, 32 kHz - < 1 A typical standby current 17 OSC2/CLKOUT 16 VDD 15 VDD 14 13 RB7 RB6 9 12 RB5 10 11 RB4 DS30272A-page 1 PIC16C71X Table of Contents 1.0 General Description .................................................................................................................................................................... 3 2.0 PIC16C71X Device Varieties...................................................................................................................................................... 5 3.0 Architectural Overview................................................................................................................................................................ 7 4.0 Memory Organization ............................................................................................................................................................... 11 5.0 I/O Ports.................................................................................................................................................................................... 25 6.0 Timer0 Module.......................................................................................................................................................................... 31 7.0 Analog-to-Digital Converter (A/D) Module ................................................................................................................................ 37 8.0 Special Features of the CPU .................................................................................................................................................... 47 9.0 Instruction Set Summary .......................................................................................................................................................... 69 10.0 Development Support ............................................................................................................................................................... 85 11.0 Electrical Characteristics for PIC16C710 and PIC16C711 ....................................................................................................... 89 12.0 DC and AC Characteristics Graphs and Tables for PIC16C710 and PIC16C711.................................................................. 101 13.0 Electrical Characteristics for PIC16C715................................................................................................................................ 111 14.0 DC and AC Characteristics Graphs and Tables for PIC16C715 ............................................................................................ 125 15.0 Electrical Characteristics for PIC16C71.................................................................................................................................. 135 16.0 DC and AC Characteristics Graphs and Tables for PIC16C71 .............................................................................................. 147 17.0 Packaging Information ............................................................................................................................................................ 155 Appendix A: ...................................................................................................................................................................................... 161 Appendix B: Compatibility................................................................................................................................................................. 161 Appendix C: What's New .................................................................................................................................................................. 162 Appendix D: What's Changed .......................................................................................................................................................... 162 Index .................................................................................................................................................................................................. 163 PIC16C71X Product Identification System......................................................................................................................................... 173 To Our Valued Customers We constantly strive to improve the quality of all our products and documentation. We have spent an exceptional amount of time to ensure that these documents are correct. However, we realize that we may have missed a few things. If you find any information that is missing or appears in error, please use the reader response form in the back of this data sheet to inform us. We appreciate your assistance in making this a better document. DS30272A-page 2 1997 Microchip Technology Inc. PIC16C71X 1.0 GENERAL DESCRIPTION The PIC16C71X is a family of low-cost, high-performance, CMOS, fully-static, 8-bit microcontrollers with integrated analog-to-digital (A/D) converters, in the PIC16CXX mid-range family. All PIC16/17 microcontrollers employ an advanced RISC architecture. The PIC16CXX microcontroller family has enhanced core features, eight-level deep stack, and multiple internal and external interrupt sources. The separate instruction and data buses of the Harvard architecture allow a 14-bit wide instruction word with the separate 8-bit wide data. The two stage instruction pipeline allows all instructions to execute in a single cycle, except for program branches which require two cycles. A total of 35 instructions (reduced instruction set) are available. Additionally, a large register set gives some of the architectural innovations used to achieve a very high performance. PIC16CXX microcontrollers typically achieve a 2:1 code compression and a 4:1 speed improvement over other 8-bit microcontrollers in their class. The PIC16C710/71 devices have 36 bytes of RAM, the PIC16C711 has 68 bytes of RAM and the PIC16C715 has 128 bytes of RAM. Each device has 13 I/O pins. In addition a timer/counter is available. Also a 4-channel high-speed 8-bit A/D is provided. The 8-bit resolution is ideally suited for applications requiring low-cost analog interface, e.g. thermostat control, pressure sensing, etc. The PIC16C71X family has special features to reduce external components, thus reducing cost, enhancing system reliability and reducing power consumption. There are four oscillator options, of which the single pin RC oscillator provides a low-cost solution, the LP oscillator minimizes power consumption, XT is a standard crystal, and the HS is for High Speed crystals. The SLEEP (power-down) feature provides a power saving mode. The user can wake up the chip from SLEEP through several external and internal interrupts and resets. 1997 Microchip Technology Inc. A highly reliable Watchdog Timer with its own on-chip RC oscillator provides protection against software lockup. A UV erasable CERDIP packaged version is ideal for code development while the cost-effective One-TimeProgrammable (OTP) version is suitable for production in any volume. The PIC16C71X family fits perfectly in applications ranging from security and remote sensors to appliance control and automotive. The EPROM technology makes customization of application programs (transmitter codes, motor speeds, receiver frequencies, etc.) extremely fast and convenient. The small footprint packages make this microcontroller series perfect for all applications with space limitations. Low cost, low power, high performance, ease of use and I/O flexibility make the PIC16C71X very versatile even in areas where no microcontroller use has been considered before (e.g. timer functions, serial communication, capture and compare, PWM functions and coprocessor applications). 1.1 Family and Upward Compatibility Users familiar with the PIC16C5X microcontroller family will realize that this is an enhanced version of the PIC16C5X architecture. Please refer to Appendix A for a detailed list of enhancements. Code written for the PIC16C5X can be easily ported to the PIC16CXX family of devices (Appendix B). 1.2 Development Support PIC16C71X devices are supported by the complete line of Microchip Development tools. Please refer to Section 10.0 for more details about Microchip's development tools. DS30272A-page 3 PIC16C71X TABLE 1-1: PIC16C71X FAMILY OF DEVICES PIC16C710 Clock Memory Memory PIC16C72 PIC16CR72(1) 20 20 20 20 20 EPROM Program Memory (x14 words) 512 1K 1K 2K 2K -- ROM Program Memory (14K words) -- -- -- -- -- 2K Data Memory (bytes) 36 36 68 128 128 128 Timer Module(s) TMR0 TMR0 TMR0 TMR0 TMR0, TMR1, TMR2 TMR0, TMR1, TMR2 -- -- -- -- 1 1 Serial Port(s) (SPI/I2C, USART) -- -- -- -- SPI/I2C SPI/I2C Parallel Slave Port -- -- -- -- -- -- A/D Converter (8-bit) Channels 4 4 4 4 5 5 Interrupt Sources 4 4 4 4 8 8 I/O Pins 13 13 13 13 22 22 Voltage Range (Volts) 2.5-6.0 3.0-6.0 2.5-6.0 2.5-5.5 2.5-6.0 3.0-5.5 In-Circuit Serial Programming Yes Yes Yes Yes Yes Yes Brown-out Reset Yes -- Yes Yes Yes Yes Packages 18-pin DIP, 18-pin DIP, 18-pin DIP, 18-pin DIP, 28-pin SDIP, 28-pin SDIP, SOIC; SOIC SOIC; SOIC; SOIC, SSOP SOIC, SSOP 20-pin SSOP 20-pin SSOP 20-pin SSOP PIC16C74A PIC16C76 PIC16C77 Maximum Frequency of Operation (MHz) 20 20 20 20 EPROM Program Memory (x14 words) 4K 4K 8K 8K Data Memory (bytes) 192 192 376 376 Timer Module(s) TMR0, TMR1, TMR2 TMR0, TMR1, TMR2 TMR0, TMR1, TMR2 TMR0, TMR1, TMR2 2 2 2 2 Serial Port(s) (SPI/I2C, USART) SPI/I2C, USART SPI/I2C, USART SPI/I2C, USART SPI/I2C, USART Parallel Slave Port -- Capture/Compare/PWM Peripherals Module(s) Features PIC16C715 20 PIC16C73A Clock PIC16C711 Maximum Frequency of Operation (MHz) Capture/Compare/PWM Peripherals Module(s) Features PIC16C71 Yes -- Yes A/D Converter (8-bit) Channels 5 8 5 8 Interrupt Sources 11 12 11 12 I/O Pins 22 33 22 33 Voltage Range (Volts) 2.5-6.0 2.5-6.0 2.5-6.0 2.5-6.0 In-Circuit Serial Programming Yes Yes Yes Yes Brown-out Reset Yes Yes Yes Yes Packages 28-pin SDIP, SOIC 40-pin DIP; 44-pin PLCC, MQFP, TQFP 28-pin SDIP, SOIC 40-pin DIP; 44-pin PLCC, MQFP, TQFP All PIC16/17 Family devices have Power-on Reset, selectable Watchdog Timer, selectable code protect and high I/O current capability. All PIC16C7XX Family devices use serial programming with clock pin RB6 and data pin RB7. Note 1: Please contact your local Microchip sales office for availability of these devices. DS30272A-page 4 1997 Microchip Technology Inc. PIC16C71X 2.0 PIC16C71X DEVICE VARIETIES A variety of frequency ranges and packaging options are available. Depending on application and production requirements, the proper device option can be selected using the information in the PIC16C71X Product Identification System section at the end of this data sheet. When placing orders, please use that page of the data sheet to specify the correct part number. For the PIC16C71X family, there are two device "types" as indicated in the device number: 1. 2. 2.1 C, as in PIC16C71. These devices have EPROM type memory and operate over the standard voltage range. LC, as in PIC16LC71. These devices have EPROM type memory and operate over an extended voltage range. UV Erasable Devices The UV erasable version, offered in CERDIP package is optimal for prototype development and pilot programs. This version can be erased and reprogrammed to any of the oscillator modes. 2.3 Quick-Turnaround-Production (QTP) Devices Microchip offers a QTP Programming Service for factory production orders. This service is made available for users who choose not to program a medium to high quantity of units and whose code patterns have stabilized. The devices are identical to the OTP devices but with all EPROM locations and configuration options already programmed by the factory. Certain code and prototype verification procedures apply before production shipments are available. Please contact your local Microchip Technology sales office for more details. 2.4 Serialized Quick-Turnaround Production (SQTPSM) Devices Microchip offers a unique programming service where a few user-defined locations in each device are programmed with different serial numbers. The serial numbers may be random, pseudo-random, or sequential. Serial programming allows each device to have a unique number which can serve as an entry-code, password, or ID number. Microchip's PICSTART Plus and PRO MATE II programmers both support programming of the PIC16C71X. 2.2 One-Time-Programmable (OTP) Devices The availability of OTP devices is especially useful for customers who need the flexibility for frequent code updates and small volume applications. The OTP devices, packaged in plastic packages, permit the user to program them once. In addition to the program memory, the configuration bits must also be programmed. 1997 Microchip Technology Inc. DS30272A-page 5 PIC16C71X NOTES: DS30272A-page 6 1997 Microchip Technology Inc. PIC16C71X 3.0 ARCHITECTURAL OVERVIEW The high performance of the PIC16CXX family can be attributed to a number of architectural features commonly found in RISC microprocessors. To begin with, the PIC16CXX uses a Harvard architecture, in which, program and data are accessed from separate memories using separate buses. This improves bandwidth over traditional von Neumann architecture in which program and data are fetched from the same memory using the same bus. Separating program and data buses further allows instructions to be sized differently than the 8-bit wide data word. Instruction opcodes are 14-bits wide making it possible to have all single word instructions. A 14-bit wide program memory access bus fetches a 14-bit instruction in a single cycle. A twostage pipeline overlaps fetch and execution of instructions (Example 3-1). Consequently, all instructions (35) execute in a single cycle (200 ns @ 20 MHz) except for program branches. The table below lists program memory (EPROM) and data memory (RAM) for each PIC16C71X device. Device PIC16C710 PIC16C71 PIC16C711 PIC16C715 Program Memory 512 x 14 1K x 14 1K x 14 2K x 14 PIC16CXX devices contain an 8-bit ALU and working register. The ALU is a general purpose arithmetic unit. It performs arithmetic and Boolean functions between the data in the working register and any register file. The ALU is 8-bits wide and capable of addition, subtraction, shift and logical operations. Unless otherwise mentioned, arithmetic operations are two's complement in nature. In two-operand instructions, typically one operand is the working register (W register). The other operand is a file register or an immediate constant. In single operand instructions, the operand is either the W register or a file register. The W register is an 8-bit working register used for ALU operations. It is not an addressable register. Depending on the instruction executed, the ALU may affect the values of the Carry (C), Digit Carry (DC), and Zero (Z) bits in the STATUS register. The C and DC bits operate as a borrow bit and a digit borrow out bit, respectively, in subtraction. See the SUBLW and SUBWF instructions for examples. Data Memory 36 x 8 36 x 8 68 x 8 128 x 8 The PIC16CXX can directly or indirectly address its register files or data memory. All special function registers, including the program counter, are mapped in the data memory. The PIC16CXX has an orthogonal (symmetrical) instruction set that makes it possible to carry out any operation on any register using any addressing mode. This symmetrical nature and lack of `special optimal situations' make programming with the PIC16CXX simple yet efficient. In addition, the learning curve is reduced significantly. 1997 Microchip Technology Inc. DS30272A-page 7 PIC16C71X FIGURE 3-1: Device PIC16C71X BLOCK DIAGRAM Program Memory Data Memory (RAM) PIC16C710 PIC16C71 PIC16C711 PIC16C715 512 x 14 1K x 14 1K x 14 2K x 14 36 x 8 36 x 8 68 x 8 128 x 8 13 8 Data Bus Program Counter PORTA EPROM Program Memory Program Bus RAM File Registers 8 Level Stack (13-bit) 14 RA0/AN0 RA1/AN1 RA2/AN2 RA3/AN3/VREF RA4/T0CKI RAM Addr (1) PORTB 9 Addr MUX Instruction reg Direct Addr 7 8 Indirect Addr FSR reg RB0/INT RB7:RB1 STATUS reg 8 3 MUX Power-up Timer Instruction Decode & Control Timing Generation OSC1/CLKIN OSC2/CLKOUT Oscillator Start-up Timer Power-on Reset ALU 8 W reg Watchdog Timer Brown-out Reset(2) Timer0 MCLR VDD, VSS A/D Note 1: Higher order bits are from the STATUS register. 2: Brown-out Reset is not available on the PIC16C71. DS30272A-page 8 1997 Microchip Technology Inc. PIC16C71X TABLE 3-1: Pin Name PIC16C710/71/711/715 PINOUT DESCRIPTION DIP SSOP Pin# Pin#(4) SOIC Pin# I/O/P Type Buffer Type Description ST/CMOS(3) Oscillator crystal input/external clock source input. -- Oscillator crystal output. Connects to crystal or resonator in crystal oscillator mode. In RC mode, OSC2 pin outputs CLKOUT which has 1/4 the frequency of OSC1, and denotes the instruction cycle rate. 4 4 4 I/P ST Master clear (reset) input or programming voltage input. This pin is MCLR/VPP an active low reset to the device. PORTA is a bi-directional I/O port. RA0/AN0 17 19 17 I/O TTL RA0 can also be analog input0 RA1/AN1 18 20 18 I/O TTL RA1 can also be analog input1 RA2/AN2 1 1 1 I/O TTL RA2 can also be analog input2 RA3/AN3/VREF 2 2 2 I/O TTL RA3 can also be analog input3 or analog reference voltage RA4/T0CKI 3 3 3 I/O ST RA4 can also be the clock input to the Timer0 module. Output is open drain type. PORTB is a bi-directional I/O port. PORTB can be software programmed for internal weak pull-up on all inputs. RB0 can also be the external interrupt pin. RB0/INT 6 7 6 I/O TTL/ST(1) RB1 7 8 7 I/O TTL RB2 8 9 8 I/O TTL RB3 9 10 9 I/O TTL RB4 10 11 10 I/O TTL Interrupt on change pin. RB5 11 12 11 I/O TTL Interrupt on change pin. RB6 12 13 12 I/O TTL/ST(2) Interrupt on change pin. Serial programming clock. RB7 13 14 13 I/O TTL/ST(2) Interrupt on change pin. Serial programming data. VSS 5 4, 6 5 P -- Ground reference for logic and I/O pins. VDD 14 15, 16 14 P -- Positive supply for logic and I/O pins. Legend: I = input O = output I/O = input/output P = power -- = Not used TTL = TTL input ST = Schmitt Trigger input Note 1: This buffer is a Schmitt Trigger input when configured as the external interrupt. 2: This buffer is a Schmitt Trigger input when used in serial programming mode. 3: This buffer is a Schmitt Trigger input when configured in RC oscillator mode and a CMOS input otherwise. 4: The PIC16C71 is not available in SSOP package. OSC1/CLKIN 16 18 16 I OSC2/CLKOUT 15 17 15 O 1997 Microchip Technology Inc. DS30272A-page 9 PIC16C71X 3.1 Clocking Scheme/Instruction Cycle 3.2 The clock input (from OSC1) is internally divided by four to generate four non-overlapping quadrature clocks namely Q1, Q2, Q3 and Q4. Internally, the program counter (PC) is incremented every Q1, the instruction is fetched from the program memory and latched into the instruction register in Q4. The instruction is decoded and executed during the following Q1 through Q4. The clocks and instruction execution flow is shown in Figure 3-2. Instruction Flow/Pipelining An "Instruction Cycle" consists of four Q cycles (Q1, Q2, Q3 and Q4). The instruction fetch and execute are pipelined such that fetch takes one instruction cycle while decode and execute takes another instruction cycle. However, due to the pipelining, each instruction effectively executes in one cycle. If an instruction causes the program counter to change (e.g. GOTO) then two cycles are required to complete the instruction (Example 3-1). A fetch cycle begins with the program counter (PC) incrementing in Q1. In the execution cycle, the fetched instruction is latched into the "Instruction Register" (IR) in cycle Q1. This instruction is then decoded and executed during the Q2, Q3, and Q4 cycles. Data memory is read during Q2 (operand read) and written during Q4 (destination write). FIGURE 3-2: CLOCK/INSTRUCTION CYCLE Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 Q1 Q2 Internal phase clock Q3 Q4 PC OSC2/CLKOUT (RC mode) EXAMPLE 3-1: 1. MOVLW 55h PC PC+1 Fetch INST (PC) Execute INST (PC-1) PC+2 Fetch INST (PC+1) Execute INST (PC) Fetch INST (PC+2) Execute INST (PC+1) INSTRUCTION PIPELINE FLOW Tcy0 Tcy1 Fetch 1 Execute 1 2. MOVWF PORTB 3. CALL SUB_1 4. BSF PORTA, BIT3 (Forced NOP) 5. Instruction @ address SUB_1 Fetch 2 Tcy2 Tcy3 Tcy4 Tcy5 Execute 2 Fetch 3 Execute 3 Fetch 4 Flush Fetch SUB_1 Execute SUB_1 All instructions are single cycle, except for any program branches. These take two cycles since the fetch instruction is "flushed" from the pipeline while the new instruction is being fetched and then executed. DS30272A-page 10 1997 Microchip Technology Inc. PIC16C71X 4.0 MEMORY ORGANIZATION 4.1 Program Memory Organization The PIC16C71X family has a 13-bit program counter capable of addressing an 8K x 14 program memory space. The amount of program memory available to each device is listed below: PIC16C71/711 PROGRAM MEMORY MAP AND STACK PC<12:0> CALL, RETURN RETFIE, RETLW 13 Stack Level 1 Program Memory Address Range PIC16C710 512 x 14 0000h-01FFh PIC16C71 1K x 14 0000h-03FFh PIC16C711 1K x 14 0000h-03FFh PIC16C715 2K x 14 0000h-07FFh For those devices with less than 8K program memory, accessing a location above the physically implemented address will cause a wraparound. The reset vector is at 0000h and the interrupt vector is at 0004h. Stack Level 8 User Memory Space Device FIGURE 4-1: FIGURE 4-2: Reset Vector 0000h Interrupt Vector 0004h 0005h On-chip Program Memory 03FFh PIC16C710 PROGRAM MEMORY MAP AND STACK 0400h PC<12:0> CALL, RETURN RETFIE, RETLW 1FFFh 13 FIGURE 4-3: PIC16C715 PROGRAM MEMORY MAP AND STACK Stack Level 1 PC<12:0> CALL, RETURN RETFIE, RETLW Stack Level 8 User Memory Space Reset Vector 0000h 13 Stack Level 1 Stack Level 8 Interrupt Vector On-chip Program Memory 0004h 0005h Reset Vector 0000h Interrupt Vector 0004h 0005h 01FFh 0200h 1FFFh On-chip Program Memory 07FFh 0800h 1FFFh 1997 Microchip Technology Inc. DS30272A-page 11 PIC16C71X 4.2 Data Memory Organization The data memory is partitioned into two Banks which contain the General Purpose Registers and the Special Function Registers. Bit RP0 is the bank select bit. RP0 (STATUS<5>) = 1 Bank 1 RP0 (STATUS<5>) = 0 Bank 0 Each Bank extends up to 7Fh (128 bytes). The lower locations of each Bank are reserved for the Special Function Registers. Above the Special Function Registers are General Purpose Registers implemented as static RAM. Both Bank 0 and Bank 1 contain special function registers. Some "high use" special function registers from Bank 0 are mirrored in Bank 1 for code reduction and quicker access. 4.2.1 GENERAL PURPOSE REGISTER FILE The register file can be accessed either directly, or indirectly through the File Select Register FSR (Section 4.5). FIGURE 4-4: PIC16C710/71 REGISTER FILE MAP File Address 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 0Bh 0Ch File Address INDF(1) TMR0 PCL STATUS FSR PORTA PORTB ADCON0 ADRES INDF(1) OPTION PCL STATUS FSR TRISA TRISB PCON(2) ADCON1 ADRES PCLATH INTCON PCLATH INTCON General Purpose Register General Purpose Register 80h 81h 82h 83h 84h 85h 86h 87h 88h 89h 8Ah 8Bh 8Ch Mapped in Bank 0(3) 2Fh AFh 30h B0h 7Fh FFh Bank 0 Bank 1 Unimplemented data memory locations, read as '0'. Note 1: Not a physical register. 2: The PCON register is not implemented on the PIC16C71. 3: These locations are unimplemented in Bank 1. Any access to these locations will access the corresponding Bank 0 register. DS30272A-page 12 1997 Microchip Technology Inc. PIC16C71X FIGURE 4-5: PIC16C711 REGISTER FILE MAP File Address 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 0Bh 0Ch File Address INDF(1) TMR0 PCL STATUS FSR PORTA PORTB ADCON0 ADRES INDF(1) OPTION PCL STATUS FSR TRISA TRISB PCON ADCON1 ADRES PCLATH INTCON PCLATH INTCON General Purpose Register General Purpose Register 80h 81h 82h 83h 84h 85h 86h 87h 88h 89h 8Ah 8Bh 8Ch Mapped in Bank 0(2) 4Fh CFh 50h D0h 7Fh FFh Bank 0 Bank 1 Unimplemented data memory locations, read as '0'. Note 1: Not a physical register. 2: These locations are unimplemented in Bank 1. Any access to these locations will access the corresponding Bank 0 register. FIGURE 4-6: PIC16C715 REGISTER FILE MAP File Address File Address 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 0Bh 0Ch 0Dh 0Eh 0Fh 10h 11h 12h 13h 14h 15h 16h 17h 18h 19h 1Ah 1Bh 1Ch 1Dh 1Eh 1Fh 20h INDF(1) TMR0 PCL STATUS FSR PORTA PORTB INDF(1) OPTION PCL STATUS FSR TRISA TRISB PCLATH INTCON PIR1 PCLATH INTCON PIE1 PCON ADRES ADCON0 General Purpose Register ADCON1 General Purpose Register 80h 81h 82h 83h 84h 85h 86h 87h 88h 89h 8Ah 8Bh 8Ch 8Dh 8Eh 8Fh 90h 91h 92h 93h 94h 95h 96h 97h 98h 99h 9Ah 9Bh 9Ch 9Dh 9Eh 9Fh A0h BFh C0h 7Fh FFh Bank 0 Bank 1 Unimplemented data memory locations, read as '0'. Note 1: Not a physical register. 1997 Microchip Technology Inc. DS30272A-page 13 PIC16C71X 4.2.2 The special function registers can be classified into two sets (core and peripheral). Those registers associated with the "core" functions are described in this section, and those related to the operation of the peripheral features are described in the section of that peripheral feature. SPECIAL FUNCTION REGISTERS The Special Function Registers are registers used by the CPU and Peripheral Modules for controlling the desired operation of the device. These registers are implemented as static RAM. TABLE 4-1: Address Name PIC16C710/71/711 SPECIAL FUNCTION REGISTER SUMMARY Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Value on all other resets (1) Bank 0 00h(3) INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 0000 0000 01h TMR0 Timer0 module's register xxxx xxxx uuuu uuuu 02h(3) PCL Program Counter's (PC) Least Significant Byte 0000 0000 0000 0000 03h(3) STATUS 04h(3) FSR RP1(5) RP0 TO PD Z DC C Indirect data memory address pointer 05h PORTA 06h PORTB 07h IRP(5) -- -- -- -- xxxx xxxx uuuu uuuu PORTA Data Latch when written: PORTA pins when read PORTB Data Latch when written: PORTB pins when read ---x 0000 ---u 0000 xxxx xxxx uuuu uuuu Unimplemented ADCS1 0001 1xxx 000q quuu -- 08h ADCON0 ADCS0 (6) 09h(3) ADRES 0Ah(2,3) PCLATH -- -- -- 0Bh(3) INTCON GIE ADIE T0IE CHS1 CHS0 GO/DONE ADIF ADON -- 00-0 0000 00-0 0000 xxxx xxxx uuuu uuuu A/D Result Register Write Buffer for the upper 5 bits of the Program Counter INTE RBIE T0IF INTF ---0 0000 ---0 0000 RBIF 0000 000x 0000 000u Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 0000 0000 Bank 1 80h(3) INDF 81h OPTION 82h (3) PCL (3) STATUS (3) FSR 83h 84h 85h TRISA 86h TRISB RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 Program Counter's (PC) Least Significant Byte IRP(5) (5) RP1 RP0 TO 0000 0000 0000 0000 PD Z DC C Indirect data memory address pointer -- -- -- 1111 1111 1111 1111 0001 1xxx 000q quuu xxxx xxxx uuuu uuuu PORTA Data Direction Register ---1 1111 ---1 1111 PORTB Data Direction Control Register 1111 1111 1111 1111 87h(4) PCON -- -- -- -- -- -- POR BOR ---- --qq ---- --uu 88h ADCON1 -- -- -- -- -- -- PCFG1 PCFG0 ---- --00 ---- --00 89h(3) xxxx xxxx uuuu uuuu A/D Result Register PCLATH -- -- -- (3) INTCON GIE ADIE T0IE 8Ah 8Bh ADRES (2,3) Write Buffer for the upper 5 bits of the Program Counter INTE RBIE T0IF INTF RBIF ---0 0000 ---0 0000 0000 000x 0000 000u Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented read as '0'. Shaded locations are unimplemented, read as `0'. Note 1: Other (non power-up) resets include external reset through MCLR and Watchdog Timer Reset. 2: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<12:8> whose contents are transferred to the upper byte of the program counter. 3: These registers can be addressed from either bank. 4: The PCON register is not physically implemented in the PIC16C71, read as '0'. 5: The IRP and RP1 bits are reserved on the PIC16C710/71/711, always maintain these bits clear. 6: Bit5 of ADCON0 is a General Purpose R/W bit for the PIC16C710/711 only. For the PIC16C71, this bit is unimplemented, read as '0'. DS30272A-page 14 1997 Microchip Technology Inc. PIC16C71X TABLE 4-2: Address Name PIC16C715 SPECIAL FUNCTION REGISTER SUMMARY Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR, PER Value on all other resets (3) Bank 0 00h(1) INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 0000 0000 01h TMR0 Timer0 module's register xxxx xxxx uuuu uuuu 02h(1) PCL Program Counter's (PC) Least Significant Byte 03h(1) STATUS 04h(1) FSR 05h PORTA 06h PORTB IRP(4) RP1(4) RP0 TO 0000 0000 0000 0000 PD Z DC C 0001 1xxx 000q quuu PORTA Data Latch when written: PORTA pins when read ---x 0000 ---u 0000 Indirect data memory address pointer -- -- -- xxxx xxxx uuuu uuuu PORTB Data Latch when written: PORTB pins when read xxxx xxxx uuuu uuuu 07h -- Unimplemented -- -- 08h -- Unimplemented -- -- 09h -- Unimplemented -- -- (1,2) 0Ah PCLATH -- -- -- 0Bh(1) INTCON GIE PEIE T0IE Write Buffer for the upper 5 bits of the Program Counter INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u 0Ch PIR1 -- ADIF -- -- -- -- -- -- -0-- ---- -0-- ---- ---0 0000 ---0 0000 0Dh -- Unimplemented -- -- 0Eh -- Unimplemented -- -- 0Fh -- Unimplemented -- -- 10h -- Unimplemented -- -- 11h -- Unimplemented -- -- 12h -- Unimplemented -- -- 13h -- Unimplemented -- -- 14h -- Unimplemented -- -- 15h -- Unimplemented -- -- 16h -- Unimplemented -- -- 17h -- Unimplemented -- -- 18h -- Unimplemented -- -- 19h -- Unimplemented -- -- 1Ah -- Unimplemented -- -- 1Bh -- Unimplemented -- -- 1Ch -- Unimplemented -- -- 1Dh -- Unimplemented -- -- 1Eh ADRES 1Fh ADCON0 A/D Result Register ADCS1 ADCS0 xxxx xxxx uuuu uuuu CHS2 CHS1 CHS0 GO/DONE -- ADON 0000 00-0 0000 00-0 Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented read as '0'. Shaded locations are unimplemented, read as `0'. Note 1: These registers can be addressed from either bank. 2: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<12:8> whose contents are transferred to the upper byte of the program counter. 3: Other (non power-up) resets include external reset through MCLR and Watchdog Timer Reset. 4: The IRP and RP1 bits are reserved on the PIC16C715, always maintain these bits clear. 1997 Microchip Technology Inc. DS30272A-page 15 PIC16C71X TABLE 4-2: Address Name PIC16C715 SPECIAL FUNCTION REGISTER SUMMARY (Cont.'d) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR, PER Value on all other resets (3) Bank 1 80h(1) INDF 81h OPTION 82h(1) PCL (1) Addressing this location uses contents of FSR to address data memory (not a physical register) RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 Program Counter's (PC) Least Significant Byte 83h STATUS 84h(1) FSR (4) IRP (4) RP1 RP0 TO PD Z DC C 0001 1xxx 000q quuu xxxx xxxx uuuu uuuu 85h TRISA 86h TRISB 87h -- Unimplemented -- -- 88h -- Unimplemented -- -- -- Unimplemented -- -- 89h 8Ah(1,2) -- 1111 1111 1111 1111 0000 0000 0000 0000 Indirect data memory address pointer -- 0000 0000 0000 0000 PORTA Data Direction Register --11 1111 --11 1111 PORTB Data Direction Register PCLATH -- 8Bh(1) INTCON 8Ch PIE1 1111 1111 1111 1111 -- -- Write Buffer for the upper 5 bits of the PC GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u -- ADIE -- -- -- -- -- -- -0-- ---- -0-- ---- -- -- -- PER POR BOR u--- -1qq u--- -1uu ---0 0000 ---0 0000 8Dh -- 8Eh PCON 8Fh -- Unimplemented -- -- 90h -- Unimplemented -- -- 91h -- Unimplemented -- -- 92h -- Unimplemented -- -- 93h -- Unimplemented -- -- 94h -- Unimplemented -- -- 95h -- Unimplemented -- -- 96h -- Unimplemented -- -- 97h -- Unimplemented -- -- 98h -- Unimplemented -- -- 99h -- Unimplemented -- -- 9Ah -- Unimplemented -- -- 9Bh -- Unimplemented -- -- 9Ch -- Unimplemented -- -- 9Dh -- Unimplemented -- -- 9Eh -- Unimplemented -- -- ---- --00 ---- --00 9Fh ADCON1 Unimplemented MPEEN -- -- -- -- -- -- -- -- PCFG1 PCFG0 -- Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented read as '0'. Shaded locations are unimplemented, read as `0'. Note 1: These registers can be addressed from either bank. 2: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<12:8> whose contents are transferred to the upper byte of the program counter. 3: Other (non power-up) resets include external reset through MCLR and Watchdog Timer Reset. 4: The IRP and RP1 bits are reserved on the PIC16C715, always maintain these bits clear. DS30272A-page 16 1997 Microchip Technology Inc. PIC16C71X 4.2.2.1 STATUS REGISTER Applicable Devices 710 71 711 715 The STATUS register, shown in Figure 4-7, contains the arithmetic status of the ALU, the RESET status and the bank select bits for data memory. The STATUS register can be the destination for any instruction, as with any other register. If the STATUS register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO and PD bits are not writable. Therefore, the result of an instruction with the STATUS register as destination may be different than intended. It is recommended, therefore, that only BCF, BSF, SWAPF and MOVWF instructions are used to alter the STATUS register because these instructions do not affect the Z, C or DC bits from the STATUS register. For other instructions, not affecting any status bits, see the "Instruction Set Summary." Note 1: For those devices that do not use bits IRP and RP1 (STATUS<7:6>), maintain these bits clear to ensure upward compatibility with future products. Note 2: The C and DC bits operate as a borrow and digit borrow bit, respectively, in subtraction. See the SUBLW and SUBWF instructions for examples. For example, CLRF STATUS will clear the upper-three bits and set the Z bit. This leaves the STATUS register as 000u u1uu (where u = unchanged). FIGURE 4-7: R/W-0 IRP bit7 bit 7: STATUS REGISTER (ADDRESS 03h, 83h) R/W-0 RP1 R/W-0 RP0 R-1 TO R-1 PD R/W-x Z R/W-x DC R/W-x C bit0 R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR reset IRP: Register Bank Select bit (used for indirect addressing) 1 = Bank 2, 3 (100h - 1FFh) 0 = Bank 0, 1 (00h - FFh) bit 6-5: RP1:RP0: Register Bank Select bits (used for direct addressing) 11 = Bank 3 (180h - 1FFh) 10 = Bank 2 (100h - 17Fh) 01 = Bank 1 (80h - FFh) 00 = Bank 0 (00h - 7Fh) Each bank is 128 bytes bit 4: TO: Time-out bit 1 = After power-up, CLRWDT instruction, or SLEEP instruction 0 = A WDT time-out occurred bit 3: PD: Power-down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction bit 2: Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1: DC: Digit carry/borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions)(for borrow the polarity is reversed) 1 = A carry-out from the 4th low order bit of the result occurred 0 = No carry-out from the 4th low order bit of the result bit 0: C: Carry/borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions) 1 = A carry-out from the most significant bit of the result occurred 0 = No carry-out from the most significant bit of the result occurred Note: For borrow the polarity is reversed. A subtraction is executed by adding the two's complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high or low order bit of the source register. 1997 Microchip Technology Inc. DS30272A-page 17 PIC16C71X 4.2.2.2 OPTION REGISTER Applicable Devices Note: 710 71 711 715 The OPTION register is a readable and writable register which contains various control bits to configure the TMR0/WDT prescaler, the External INT Interrupt, TMR0, and the weak pull-ups on PORTB. FIGURE 4-8: R/W-1 RBPU bit7 To achieve a 1:1 prescaler assignment for the TMR0 register, assign the prescaler to the Watchdog Timer by setting bit PSA (OPTION<3>). OPTION REGISTER (ADDRESS 81h, 181h) R/W-1 INTEDG R/W-1 T0CS R/W-1 T0SE R/W-1 PSA R/W-1 PS2 R/W-1 PS1 bit 7: RBPU: PORTB Pull-up Enable bit 1 = PORTB pull-ups are disabled 0 = PORTB pull-ups are enabled by individual port latch values bit 6: INTEDG: Interrupt Edge Select bit 1 = Interrupt on rising edge of RB0/INT pin 0 = Interrupt on falling edge of RB0/INT pin bit 5: T0CS: TMR0 Clock Source Select bit 1 = Transition on RA4/T0CKI pin 0 = Internal instruction cycle clock (CLKOUT) bit 4: T0SE: TMR0 Source Edge Select bit 1 = Increment on high-to-low transition on RA4/T0CKI pin 0 = Increment on low-to-high transition on RA4/T0CKI pin bit 3: PSA: Prescaler Assignment bit 1 = Prescaler is assigned to the WDT 0 = Prescaler is assigned to the Timer0 module R/W-1 PS0 bit0 R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR reset bit 2-0: PS2:PS0: Prescaler Rate Select bits Bit Value TMR0 Rate WDT Rate 000 001 010 011 100 101 110 111 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 1:1 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 DS30272A-page 18 1997 Microchip Technology Inc. PIC16C71X 4.2.2.3 INTCON REGISTER Applicable Devices Note: 710 71 711 715 The INTCON Register is a readable and writable register which contains various enable and flag bits for the TMR0 register overflow, RB Port change and External RB0/INT pin interrupts. FIGURE 4-9: R/W-0 GIE bit7 Interrupt flag bits get set when an interrupt condition occurs regardless of the state of its corresponding enable bit or the global enable bit, GIE (INTCON<7>). INTCON REGISTER (ADDRESS 0Bh, 8Bh) R/W-0 ADIE R/W-0 T0IE R/W-0 INTE R/W-0 RBIE R/W-0 T0IF R/W-0 INTF R/W-x RBIF bit0 R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR reset bit 7: GIE:(1) Global Interrupt Enable bit 1 = Enables all un-masked interrupts 0 = Disables all interrupts bit 6: ADIE: A/D Converter Interrupt Enable bit 1 = Enables A/D interrupt 0 = Disables A/D interrupt bit 5: T0IE: TMR0 Overflow Interrupt Enable bit 1 = Enables the TMR0 interrupt 0 = Disables the TMR0 interrupt bit 4: INTE: RB0/INT External Interrupt Enable bit 1 = Enables the RB0/INT external interrupt 0 = Disables the RB0/INT external interrupt bit 3: RBIE: RB Port Change Interrupt Enable bit 1 = Enables the RB port change interrupt 0 = Disables the RB port change interrupt bit 2: T0IF: TMR0 Overflow Interrupt Flag bit 1 = TMR0 register has overflowed (must be cleared in software) 0 = TMR0 register did not overflow bit 1: INTF: RB0/INT External Interrupt Flag bit 1 = The RB0/INT external interrupt occurred (must be cleared in software) 0 = The RB0/INT external interrupt did not occur bit 0: RBIF: RB Port Change Interrupt Flag bit 1 = At least one of the RB7:RB4 pins changed state (must be cleared in software) 0 = None of the RB7:RB4 pins have changed state Note 1: For the PIC16C71, if an interrupt occurs while the GIE bit is being cleared, the GIE bit may be unintentionally re-enabled by the RETFIE instruction in the user's Interrupt Service Routine. Refer to Section 8.5 for a detailed description. Interrupt flag bits get set when an interrupt condition occurs regardless of the state of its corresponding enable bit or the global enable bit, GIE (INTCON<7>). User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. 1997 Microchip Technology Inc. DS30272A-page 19 PIC16C71X 4.2.2.4 PIE1 REGISTER Applicable Devices Note: 710 71 711 715 Bit PEIE (INTCON<6>) must be set to enable any peripheral interrupt. This register contains the individual enable bits for the Peripheral interrupts. FIGURE 4-10: PIE1 REGISTER (ADDRESS 8Ch) U-0 -- bit7 R/W-0 ADIE U-0 -- U-0 -- U-0 -- bit 7: Unimplemented: Read as '0' bit 6: ADIE: A/D Converter Interrupt Enable bit 1 = Enables the A/D interrupt 0 = Disables the A/D interrupt U-0 -- U-0 -- U-0 -- bit0 R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR reset bit 5-0: Unimplemented: Read as '0' DS30272A-page 20 1997 Microchip Technology Inc. PIC16C71X 4.2.2.5 PIR1 REGISTER Applicable Devices Note: 710 71 711 715 This register contains the individual flag bits for the Peripheral interrupts. Interrupt flag bits get set when an interrupt condition occurs regardless of the state of its corresponding enable bit or the global enable bit, GIE (INTCON<7>). User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. FIGURE 4-11: PIR1 REGISTER (ADDRESS 0Ch) U-0 -- bit7 R/W-0 ADIF U-0 -- U-0 -- U-0 -- bit 7: Unimplemented: Read as '0' bit 6: ADIF: A/D Converter Interrupt Flag bit 1 = An A/D conversion completed 0 = The A/D conversion is not complete U-0 -- U-0 -- U-0 -- bit0 R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR reset bit 5-0: Unimplemented: Read as '0' 1997 Microchip Technology Inc. DS30272A-page 21 PIC16C71X 4.2.2.6 PCON REGISTER Applicable Devices Note: 710 71 711 715 The Power Control (PCON) register contains a flag bit to allow differentiation between a Power-on Reset (POR) to an external MCLR Reset or WDT Reset. Those devices with brown-out detection circuitry contain an additional bit to differentiate a Brown-out Reset (BOR) condition from a Power-on Reset condition. For the PIC16C715 the PCON register also contains status bits MPEEN and PER. MPEEN reflects the value of the MPEEN bit in the configuration word. PER indicates a parity error reset has occurred. BOR is unknown on Power-on Reset. It must then be set by the user and checked on subsequent resets to see if BOR is clear, indicating a brown-out has occurred. The BOR status bit is a don't care and is not necessarily predictable if the brown-out circuit is disabled (by clearing the BODEN bit in the Configuration word). FIGURE 4-12: PCON REGISTER (ADDRESS 8Eh), PIC16C710/711 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 -- -- -- -- -- -- POR bit7 R/W-q BOR bit0 R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR reset bit 7-2: Unimplemented: Read as '0' bit 1: POR: Power-on Reset Status bit 1 = No Power-on Reset occurred 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs) bit 0: BOR: Brown-out Reset Status bit 1 = No Brown-out Reset occurred 0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs) FIGURE 4-13: PCON REGISTER (ADDRESS 8Eh), PIC16C715 R-U MPEEN bit7 bit 7: U-0 -- U-0 -- U-0 -- U-0 -- R/W-1 PER R/W-0 POR R/W-q BOR(1) bit0 R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR reset MPEEN: Memory Parity Error Circuitry Status bit Reflects the value of configuration word bit, MPEEN bit 6-3: Unimplemented: Read as '0' bit 2: PER: Memory Parity Error Reset Status bit 1 = No Error occurred 0 = Program Memory Fetch Parity Error occurred (must be set in software after a Parity Error Reset) bit 1: POR: Power-on Reset Status bit 1 = No Power-on Reset occurred 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs) bit 0: BOR: Brown-out Reset Status bit 1 = No Brown-out Reset occurred 0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs) DS30272A-page 22 1997 Microchip Technology Inc. PIC16C71X 4.3 PCL and PCLATH 4.3.2 The program counter (PC) is 13-bits wide. The low byte comes from the PCL register, which is a readable and writable register. The upper bits (PC<12:8>) are not readable, but are indirectly writable through the PCLATH register. On any reset, the upper bits of the PC will be cleared. Figure 4-14 shows the two situations for the loading of the PC. The upper example in the figure shows how the PC is loaded on a write to PCL (PCLATH<4:0> PCH). The lower example in the figure shows how the PC is loaded during a CALL or GOTO instruction (PCLATH<4:3> PCH). FIGURE 4-14: LOADING OF PC IN DIFFERENT SITUATIONS PCH 8 7 0 PC 5 8 PCLATH<4:0> Instruction with PCL as Destination ALU PCLATH PCH 12 11 10 PCL 8 GOTO, CALL PCLATH<4:3> 11 Opcode <10:0> PCLATH 4.3.1 The stack operates as a circular buffer. This means that after the stack has been PUSHed eight times, the ninth push overwrites the value that was stored from the first push. The tenth push overwrites the second push (and so on). Note 2: There are no instructions/mnemonics called PUSH or POP. These are actions that occur from the execution of the CALL, RETURN, RETLW, and RETFIE instructions, or the vectoring to an interrupt address. 4.4 0 7 PC 2 The PIC16CXX family has an 8 level deep x 13-bit wide hardware stack. The stack space is not part of either program or data space and the stack pointer is not readable or writable. The PC is PUSHed onto the stack when a CALL instruction is executed or an interrupt causes a branch. The stack is POPed in the event of a RETURN, RETLW or a RETFIE instruction execution. PCLATH is not affected by a PUSH or POP operation. Note 1: There are no status bits to indicate stack overflow or stack underflow conditions. PCL 12 STACK Program Memory Paging The PIC16C71X devices ignore both paging bits (PCLATH<4:3>, which are used to access program memory when more than one page is available. The use of PCLATH<4:3> as general purpose read/write bits for the PIC16C71X is not recommended since this may affect upward compatibility with future products. COMPUTED GOTO A computed GOTO is accomplished by adding an offset to the program counter (ADDWF PCL). When doing a table read using a computed GOTO method, care should be exercised if the table location crosses a PCL memory boundary (each 256 byte block). Refer to the application note "Implementing a Table Read" (AN556). 1997 Microchip Technology Inc. DS30272A-page 23 PIC16C71X 4.5 Example 4-1 shows the calling of a subroutine in page 1 of the program memory. This example assumes that PCLATH is saved and restored by the interrupt service routine (if interrupts are used). EXAMPLE 4-1: ORG 0x500 BSF PCLATH,3 BCF PCLATH,4 CALL SUB1_P1 : : : ORG 0x900 SUB1_P1: : : RETURN Indirect Addressing, INDF and FSR Registers The INDF register is not a physical register. Addressing the INDF register will cause indirect addressing. Indirect addressing is possible by using the INDF register. Any instruction using the INDF register actually accesses the register pointed to by the File Select Register, FSR. Reading the INDF register itself indirectly (FSR = '0') will read 00h. Writing to the INDF register indirectly results in a no-operation (although status bits may be affected). An effective 9-bit address is obtained by concatenating the 8-bit FSR register and the IRP bit (STATUS<7>), as shown in Figure 4-15. However, IRP is not used in the PIC16C71X devices. CALL OF A SUBROUTINE IN PAGE 1 FROM PAGE 0 ;Select page 1 (800h-FFFh) ;Only on >4K devices ;Call subroutine in ;page 1 (800h-FFFh) ;called subroutine ;page 1 (800h-FFFh) A simple program to clear RAM locations 20h-2Fh using indirect addressing is shown in Example 4-2. ;return to Call subroutine ;in page 0 (000h-7FFh) EXAMPLE 4-2: movlw movwf clrf incf btfss goto NEXT INDIRECT ADDRESSING 0x20 FSR INDF FSR,F FSR,4 NEXT ;initialize pointer ;to RAM ;clear INDF register ;inc pointer ;all done? ;no clear next CONTINUE : FIGURE 4-15: ;yes continue DIRECT/INDIRECT ADDRESSING Direct Addressing Indirect Addressing from opcode RP1:RP0 6 bank select location select (1) 0 IRP 7 bank select 00 00h 01 80h 10 FSR register 0 location select 11 100h 180h Not Used Data Memory 7Fh FFh Bank 0 Bank 1 17Fh Bank 2 1FFh Bank 3 For register file map detail see Figure 4-4. Note 1: The RP1 and IRP bits are reserved, always maintain these bits clear. DS30272A-page 24 1997 Microchip Technology Inc. PIC16C71X 5.0 I/O PORTS Applicable Devices FIGURE 5-1: 710 71 711 715 Some pins for these I/O ports are multiplexed with an alternate function for the peripheral features on the device. In general, when a peripheral is enabled, that pin may not be used as a general purpose I/O pin. 5.1 BLOCK DIAGRAM OF RA3:RA0 PINS Data bus D Q VDD WR Port Q CK Data Latch PORTA is a 5-bit latch. The RA4/T0CKI pin is a Schmitt Trigger input and an open drain output. All other RA port pins have TTL input levels and full CMOS output drivers. All pins have data direction bits (TRIS registers) which can configure these pins as output or input. D WR TRIS TRIS Latch Pin RA4 is multiplexed with the Timer0 module clock input to become the RA4/T0CKI pin. To A/D Converter On a Power-on Reset, these pins are configured as analog inputs and read as '0'. The TRISA register controls the direction of the RA pins, even when they are being used as analog inputs. The user must ensure the bits in the TRISA register are maintained set when using them as analog inputs. EXAMPLE 5-1: STATUS, RP0 PORTA BSF MOVLW STATUS, RP0 0xCF MOVWF TRISA Q ; ; ; ; ; ; ; ; ; ; ; ; Initialize PORTA by clearing output data latches Select Bank 1 Value used to initialize data direction Set RA<3:0> as inputs RA<4> as outputs TRISA<7:5> are always read as '0'. D EN Note 1: I/O pins have protection diodes to VDD and VSS. FIGURE 5-2: Data bus WR PORT BLOCK DIAGRAM OF RA4/ T0CKI PIN D Q CK Q N I/O pin(1) Data Latch INITIALIZING PORTA BCF CLRF TTL input buffer RD TRIS RD PORT I/O pin(1) VSS Analog input mode Q CK Reading the PORTA register reads the status of the pins whereas writing to it will write to the port latch. All write operations are read-modify-write operations. Therefore a write to a port implies that the port pins are read, this value is modified, and then written to the port data latch. Other PORTA pins are multiplexed with analog inputs and analog VREF input. The operation of each pin is selected by clearing/setting the control bits in the ADCON1 register (A/D Control Register1). N Q Setting a TRISA register bit puts the corresponding output driver in a hi-impedance mode. Clearing a bit in the TRISA register puts the contents of the output latch on the selected pin(s). Note: P PORTA and TRISA Registers WR TRIS D Q CK Q VSS Schmitt Trigger input buffer TRIS Latch RD TRIS Q D EN EN RD PORT TMR0 clock input Note 1: I/O pin has protection diodes to VSS only. 1997 Microchip Technology Inc. DS30272A-page 25 PIC16C71X TABLE 5-1: PORTA FUNCTIONS Name Bit# Buffer RA0/AN0 RA1/AN1 RA2/AN2 RA3/AN3/VREF RA4/T0CKI bit0 bit1 bit2 bit3 bit4 TTL TTL TTL TTL ST Function Input/output or analog input Input/output or analog input Input/output or analog input Input/output or analog input/VREF Input/output or external clock input for Timer0 Output is open drain type Legend: TTL = TTL input, ST = Schmitt Trigger input TABLE 5-2: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA Address Name 05h Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Value on all other resets RA4 RA3 RA2 RA1 RA0 ---x 0000 ---u 0000 ---1 1111 ---1 1111 PCFG1 PCFG0 ---- --00 ---- --00 PORTA -- -- -- 85h TRISA -- -- -- 9Fh ADCON1 -- -- -- PORTA Data Direction Register -- -- -- Legend: x = unknown, u = unchanged, - = unimplemented locations read as '0'. Shaded cells are not used by PORTA. DS30272A-page 26 1997 Microchip Technology Inc. PIC16C71X 5.2 PORTB and TRISB Registers PORTB is an 8-bit wide bi-directional port. The corresponding data direction register is TRISB. Setting a bit in the TRISB register puts the corresponding output driver in a hi-impedance input mode. Clearing a bit in the TRISB register puts the contents of the output latch on the selected pin(s). EXAMPLE 5-2: INITIALIZING PORTB BCF CLRF STATUS, RP0 PORTB BSF MOVLW STATUS, RP0 0xCF MOVWF TRISB ; ; ; ; ; ; ; ; ; ; ; Initialize PORTB by clearing output data latches Select Bank 1 Value used to initialize data direction Set RB<3:0> as inputs RB<5:4> as outputs RB<7:6> as inputs Each of the PORTB pins has a weak internal pull-up. A single control bit can turn on all the pull-ups. This is performed by clearing bit RBPU (OPTION<7>). The weak pull-up is automatically turned off when the port pin is configured as an output. The pull-ups are disabled on a Power-on Reset. FIGURE 5-3: BLOCK DIAGRAM OF RB3:RB0 PINS Data bus WR Port weak P pull-up Data Latch D Q I/O pin(1) CK TRIS Latch D Q WR TRIS This interrupt can wake the device from SLEEP. The user, in the interrupt service routine, can clear the interrupt in the following manner: a) b) Any read or write of PORTB. This will end the mismatch condition. Clear flag bit RBIF. A mismatch condition will continue to set flag bit RBIF. Reading PORTB will end the mismatch condition, and allow flag bit RBIF to be cleared. This interrupt on mismatch feature, together with software configurable pull-ups on these four pins allow easy interface to a keypad and make it possible for wake-up on key-depression. Refer to the Embedded Control Handbook, "Implementing Wake-Up on Key Stroke" (AN552). Note: VDD RBPU(2) Four of PORTB's pins, RB7:RB4, have an interrupt on change feature. Only pins configured as inputs can cause this interrupt to occur (i.e. any RB7:RB4 pin configured as an output is excluded from the interrupt on change comparison). The input pins (of RB7:RB4) are compared with the old value latched on the last read of PORTB. The "mismatch" outputs of RB7:RB4 are OR'ed together to generate the RB Port Change Interrupt with flag bit RBIF (INTCON<0>). For the PIC16C71 if a change on the I/O pin should occur when the read operation is being executed (start of the Q2 cycle), then interrupt flag bit RBIF may not get set. The interrupt on change feature is recommended for wake-up on key depression operation and operations where PORTB is only used for the interrupt on change feature. Polling of PORTB is not recommended while using the interrupt on change feature. TTL Input Buffer CK RD TRIS Q RD Port D EN RB0/INT Schmitt Trigger Buffer RD Port Note 1: I/O pins have diode protection to VDD and VSS. 2: TRISB = '1' enables weak pull-up if RBPU = '0' (OPTION<7>). 1997 Microchip Technology Inc. DS30272A-page 27 PIC16C71X FIGURE 5-4: BLOCK DIAGRAM OF RB7:RB4 PINS (PIC16C71) FIGURE 5-5: BLOCK DIAGRAM OF RB7:RB4 PINS (PIC16C710/711/715) VDD RBPU(2) VDD weak P pull-up Data Latch D Q Data bus WR Port RBPU(2) Data bus I/O pin(1) CK WR Port TRIS Latch D Q WR TRIS weak P pull-up Data Latch D Q I/O pin(1) CK TRIS Latch D Q TTL Input Buffer CK RD TRIS Q WR TRIS ST Buffer RD TRIS Latch D Q EN RD Port TTL Input Buffer CK Latch D EN RD Port Set RBIF ST Buffer Q1 Set RBIF From other RB7:RB4 pins Q D From other RB7:RB4 pins Q D RD Port EN EN RD Port RB7:RB6 in serial programming mode RB7:RB6 in serial programming mode Note 1: I/O pins have diode protection to VDD and VSS. 2: TRISB = '1' enables weak pull-up if RBPU = '0' (OPTION<7>). Note 1: I/O pins have diode protection to VDD and VSS. 2: TRISB = '1' enables weak pull-up if RBPU = '0' (OPTION<7>). TABLE 5-3: Name Q3 PORTB FUNCTIONS Bit# Buffer Function TTL/ST(1) Input/output pin or external interrupt input. Internal software programmable weak pull-up. RB1 bit1 TTL Input/output pin. Internal software programmable weak pull-up. RB2 bit2 TTL Input/output pin. Internal software programmable weak pull-up. RB3 bit3 TTL Input/output pin. Internal software programmable weak pull-up. RB4 bit4 TTL Input/output pin (with interrupt on change). Internal software programmable weak pull-up. RB5 bit5 TTL Input/output pin (with interrupt on change). Internal software programmable weak pull-up. RB6 bit6 TTL/ST(2) Input/output pin (with interrupt on change). Internal software programmable weak pull-up. Serial programming clock. RB7 bit7 TTL/ST(2) Input/output pin (with interrupt on change). Internal software programmable weak pull-up. Serial programming data. Legend: TTL = TTL input, ST = Schmitt Trigger input Note 1: This buffer is a Schmitt Trigger input when configured as the external interrupt. 2: This buffer is a Schmitt Trigger input when used in serial programming mode. RB0/INT bit0 DS30272A-page 28 1997 Microchip Technology Inc. PIC16C71X TABLE 5-4: SUMMARY OF REGISTERS ASSOCIATED WITH PORTB Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Value on all other resets 06h, 106h PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx xxxx uuuu uuuu 86h, 186h TRISB 1111 1111 1111 1111 81h, 181h OPTION 1111 1111 1111 1111 PORTB Data Direction Register RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 Legend: x = unknown, u = unchanged. Shaded cells are not used by PORTB. 1997 Microchip Technology Inc. DS30272A-page 29 PIC16C71X 5.3 I/O Programming Considerations 5.3.1 BI-DIRECTIONAL I/O PORTS EXAMPLE 5-3: Any instruction which writes, operates internally as a read followed by a write operation. The BCF and BSF instructions, for example, read the register into the CPU, execute the bit operation and write the result back to the register. Caution must be used when these instructions are applied to a port with both inputs and outputs defined. For example, a BSF operation on bit5 of PORTB will cause all eight bits of PORTB to be read into the CPU. Then the BSF operation takes place on bit5 and PORTB is written to the output latches. If another bit of PORTB is used as a bi-directional I/O pin (e.g., bit0) and it is defined as an input at this time, the input signal present on the pin itself would be read into the CPU and rewritten to the data latch of this particular pin, overwriting the previous content. As long as the pin stays in the input mode, no problem occurs. However, if bit0 is switched to an output, the content of the data latch may now be unknown. Reading the port register, reads the values of the port pins. Writing to the port register writes the value to the port latch. When using read-modify-write instructions (ex. BCF, BSF, etc.) on a port, the value of the port pins is read, the desired operation is done to this value, and this value is then written to the port latch. Example 5-3 shows the effect of two sequential readmodify-write instructions on an I/O port. FIGURE 5-6: ;Initial PORT settings: PORTB<7:4> Inputs ; PORTB<3:0> Outputs ;PORTB<7:6> have external pull-ups and are ;not connected to other circuitry ; ; PORT latch PORT pins ; ---------- --------BCF PORTB, 7 ; 01pp pppp 11pp pppp BCF PORTB, 6 ; 10pp pppp 11pp pppp BSF STATUS, RP0 ; BCF TRISB, 7 ; 10pp pppp 11pp pppp BCF TRISB, 6 ; 10pp pppp 10pp pppp ; ;Note that the user may have expected the ;pin values to be 00pp ppp. The 2nd BCF ;caused RB7 to be latched as the pin value ;(high). A pin actively outputting a Low or High should not be driven from external devices at the same time in order to change the level on this pin ("wired-or", "wired-and"). The resulting high output currents may damage the chip. 5.3.2 SUCCESSIVE OPERATIONS ON I/O PORTS The actual write to an I/O port happens at the end of an instruction cycle, whereas for reading, the data must be valid at the beginning of the instruction cycle (Figure 5-6). Therefore, care must be exercised if a write followed by a read operation is carried out on the same I/O port. The sequence of instructions should be such to allow the pin voltage to stabilize (load dependent) before the next instruction which causes that file to be read into the CPU is executed. Otherwise, the previous state of that pin may be read into the CPU rather than the new state. When in doubt, it is better to separate these instructions with a NOP or another instruction not accessing this I/O port. SUCCESSIVE I/O OPERATION Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 PC Instruction fetched READ-MODIFY-WRITE INSTRUCTIONS ON AN I/O PORT PC PC + 1 MOVWF PORTB MOVF PORTB,W write to PORTB PC + 2 PC + 3 NOP NOP This example shows a write to PORTB followed by a read from PORTB. Note that: data setup time = (0.25TCY - TPD) RB7:RB0 where TCY = instruction cycle TPD = propagation delay Port pin sampled here TPD Instruction executed NOP MOVWF PORTB write to PORTB DS30272A-page 30 Note: MOVF PORTB,W Therefore, at higher clock frequencies, a write followed by a read may be problematic. 1997 Microchip Technology Inc. PIC16C71X 6.0 TIMER0 MODULE Applicable Devices bit T0SE selects the rising edge. Restrictions on the external clock input are discussed in detail in Section 6.2. 710 71 711 715 The Timer0 module timer/counter has the following features: * * * * * * The prescaler is mutually exclusively shared between the Timer0 module and the Watchdog Timer. The prescaler assignment is controlled in software by control bit PSA (OPTION<3>). Clearing bit PSA will assign the prescaler to the Timer0 module. The prescaler is not readable or writable. When the prescaler is assigned to the Timer0 module, prescale values of 1:2, 1:4, ..., 1:256 are selectable. Section 6.3 details the operation of the prescaler. 8-bit timer/counter Readable and writable 8-bit software programmable prescaler Internal or external clock select Interrupt on overflow from FFh to 00h Edge select for external clock Figure 6-1 is a simplified block diagram of the Timer0 module. 6.1 Timer mode is selected by clearing bit T0CS (OPTION<5>). In timer mode, the Timer0 module will increment every instruction cycle (without prescaler). If the TMR0 register is written, the increment is inhibited for the following two instruction cycles (Figure 6-2 and Figure 6-3). The user can work around this by writing an adjusted value to the TMR0 register. Counter mode is selected by setting bit T0CS (OPTION<5>). In counter mode, Timer0 will increment either on every rising or falling edge of pin RA4/T0CKI. The incrementing edge is determined by the Timer0 Source Edge Select bit T0SE (OPTION<4>). Clearing FIGURE 6-1: Timer0 Interrupt The TMR0 interrupt is generated when the TMR0 register overflows from FFh to 00h. This overflow sets bit T0IF (INTCON<2>). The interrupt can be masked by clearing bit T0IE (INTCON<5>). Bit T0IF must be cleared in software by the Timer0 module interrupt service routine before re-enabling this interrupt. The TMR0 interrupt cannot awaken the processor from SLEEP since the timer is shut off during SLEEP. See Figure 6-4 for Timer0 interrupt timing. TIMER0 BLOCK DIAGRAM Data bus FOSC/4 0 PSout 1 Sync with Internal clocks 1 Programmable Prescaler RA4/T0CKI pin 8 0 TMR0 PSout (2 cycle delay) T0SE 3 Set interrupt flag bit T0IF on overflow PSA PS2, PS1, PS0 T0CS Note 1: T0CS, T0SE, PSA, PS2:PS0 (OPTION<5:0>). 2: The prescaler is shared with Watchdog Timer (refer to Figure 6-6 for detailed block diagram). FIGURE 6-2: PC (Program Counter) TIMER0 TIMING: INTERNAL CLOCK/NO PRESCALE Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 PC-1 Instruction Fetch TMR0 T0 PC PC+1 MOVWF TMR0 MOVF TMR0,W T0+1 Instruction Executed 1997 Microchip Technology Inc. PC+2 MOVF TMR0,W PC+3 MOVF TMR0,W T0+2 NT0 NT0 Write TMR0 executed Read TMR0 reads NT0 Read TMR0 reads NT0 PC+4 MOVF TMR0,W NT0 Read TMR0 reads NT0 PC+5 PC+6 MOVF TMR0,W NT0+1 Read TMR0 reads NT0 + 1 NT0+2 T0 Read TMR0 reads NT0 + 2 DS30272A-page 31 PIC16C71X FIGURE 6-3: TIMER0 TIMING: INTERNAL CLOCK/PRESCALE 1:2 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 PC (Program Counter) PC-1 Instruction Fetch PC PC+1 MOVWF TMR0 MOVF TMR0,W PC+3 Instruction Execute PC+5 MOVF TMR0,W PC+6 MOVF TMR0,W Read TMR0 reads NT0 Read TMR0 reads NT0 PC+6 NT0+1 NT0 Write TMR0 executed FIGURE 6-4: PC+4 MOVF TMR0,W T0+1 T0 TMR0 PC+2 MOVF TMR0,W Read TMR0 reads NT0 Read TMR0 reads NT0 Read TMR0 reads NT0 + 1 TIMER0 INTERRUPT TIMING Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 CLKOUT(3) Timer0 FEh T0IF bit (INTCON<2>) FFh 00h 01h 02h 1 1 GIE bit (INTCON<7>) INSTRUCTION FLOW PC PC Instruction fetched Inst (PC) Instruction executed Inst (PC-1) PC +1 PC +1 Inst (PC+1) Inst (PC) Dummy cycle 0004h 0005h Inst (0004h) Inst (0005h) Dummy cycle Inst (0004h) Note 1: Interrupt flag bit T0IF is sampled here (every Q1). 2: Interrupt latency = 4Tcy where Tcy = instruction cycle time. 3: CLKOUT is available only in RC oscillator mode. DS30272A-page 32 1997 Microchip Technology Inc. PIC16C71X 6.2 Using Timer0 with an External Clock caler so that the prescaler output is symmetrical. For the external clock to meet the sampling requirement, the ripple-counter must be taken into account. Therefore, it is necessary for T0CKI to have a period of at least 4Tosc (and a small RC delay of 40 ns) divided by the prescaler value. The only requirement on T0CKI high and low time is that they do not violate the minimum pulse width requirement of 10 ns. Refer to parameters 40, 41 and 42 in the electrical specification of the desired device. When an external clock input is used for Timer0, it must meet certain requirements. The requirements ensure the external clock can be synchronized with the internal phase clock (TOSC). Also, there is a delay in the actual incrementing of Timer0 after synchronization. 6.2.1 EXTERNAL CLOCK SYNCHRONIZATION When no prescaler is used, the external clock input is the same as the prescaler output. The synchronization of T0CKI with the internal phase clocks is accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the internal phase clocks (Figure 6-5). Therefore, it is necessary for T0CKI to be high for at least 2Tosc (and a small RC delay of 20 ns) and low for at least 2Tosc (and a small RC delay of 20 ns). Refer to the electrical specification of the desired device. 6.2.2 TMR0 INCREMENT DELAY Since the prescaler output is synchronized with the internal clocks, there is a small delay from the time the external clock edge occurs to the time the Timer0 module is actually incremented. Figure 6-5 shows the delay from the external clock edge to the timer incrementing. When a prescaler is used, the external clock input is divided by the asynchronous ripple-counter type pres- FIGURE 6-5: TIMER0 TIMING WITH EXTERNAL CLOCK Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 External Clock Input or Prescaler output (2) Q1 Q2 Q3 Q4 Small pulse misses sampling (1) (3) External Clock/Prescaler Output after sampling Increment Timer0 (Q4) Timer0 T0 T0 + 1 T0 + 2 Note 1: Delay from clock input change to Timer0 increment is 3Tosc to 7Tosc. (Duration of Q = Tosc). Therefore, the error in measuring the interval between two edges on Timer0 input = 4Tosc max. 2: External clock if no prescaler selected, Prescaler output otherwise. 3: The arrows indicate the points in time where sampling occurs. 1997 Microchip Technology Inc. DS30272A-page 33 PIC16C71X 6.3 Prescaler When assigned to the Timer0 module, all instructions writing to the TMR0 register (e.g. CLRF 1, MOVWF 1, BSF 1,x....etc.) will clear the prescaler. When assigned to WDT, a CLRWDT instruction will clear the prescaler along with the Watchdog Timer. The prescaler is not readable or writable. An 8-bit counter is available as a prescaler for the Timer0 module, or as a postscaler for the Watchdog Timer, respectively (Figure 6-6). For simplicity, this counter is being referred to as "prescaler" throughout this data sheet. Note that there is only one prescaler available which is mutually exclusively shared between the Timer0 module and the Watchdog Timer. Thus, a prescaler assignment for the Timer0 module means that there is no prescaler for the Watchdog Timer, and vice-versa. Note: Writing to TMR0 when the prescaler is assigned to Timer0 will clear the prescaler count, but will not change the prescaler assignment. The PSA and PS2:PS0 bits (OPTION<3:0>) determine the prescaler assignment and prescale ratio. FIGURE 6-6: BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER Data Bus CLKOUT (=Fosc/4) 0 RA4/T0CKI pin 8 M U X 1 M U X 0 1 SYNC 2 Cycles TMR0 reg T0SE T0CS 0 Watchdog Timer 1 M U X Set flag bit T0IF on Overflow PSA 8-bit Prescaler 8 8 - to - 1MUX PS2:PS0 PSA WDT Enable bit 1 0 MUX PSA WDT Time-out Note: T0CS, T0SE, PSA, PS2:PS0 are (OPTION<5:0>). DS30272A-page 34 1997 Microchip Technology Inc. PIC16C71X 6.3.1 SWITCHING PRESCALER ASSIGNMENT Note: The prescaler assignment is fully under software control, i.e., it can be changed "on the fly" during program execution. EXAMPLE 6-1: BCF CLRF BSF CLRWDT MOVLW MOVWF BCF To avoid an unintended device RESET, the following instruction sequence (shown in Example 6-1) must be executed when changing the prescaler assignment from Timer0 to the WDT. This sequence must be followed even if the WDT is disabled. CHANGING PRESCALER (TIMER0WDT) STATUS, RP0 TMR0 STATUS, RP0 b'xxxx1xxx' OPTION_REG STATUS, RP0 ;Bank 0 ;Clear TMR0 & Prescaler ;Bank 1 ;Clears WDT ;Selects new prescale value ;and assigns the prescaler to the WDT ;Bank 0 To change prescaler from the WDT to the Timer0 module use the sequence shown in Example 6-2. EXAMPLE 6-2: CLRWDT BSF MOVLW MOVWF BCF CHANGING PRESCALER (WDTTIMER0) STATUS, RP0 b'xxxx0xxx' OPTION_REG STATUS, RP0 TABLE 6-1: ;Clear WDT and prescaler ;Bank 1 ;Select TMR0, new prescale value and ;clock source ;Bank 0 REGISTERS ASSOCIATED WITH TIMER0 Address Name Bit 7 Bit 6 01h TMR0 0Bh,8Bh, INTCON 81h OPTION RBPU INTEDG 85h TRISA Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Timer0 module's register GIE -- ADIE -- Value on: POR, BOR Value on all other resets xxxx xxxx uuuu uuuu T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 ---1 1111 ---1 1111 -- PORTA Data Direction Register Legend: x = unknown, u = unchanged, - = unimplemented locations read as '0'. Shaded cells are not used by Timer0. 1997 Microchip Technology Inc. DS30272A-page 35 PIC16C71X NOTES: DS30272A-page 36 1997 Microchip Technology Inc. PIC16C71X 7.0 ANALOG-TO-DIGITAL CONVERTER (A/D) MODULE Applicable Devices The A/D converter has a unique feature of being able to operate while the device is in SLEEP mode. To operate in sleep, the A/D conversion clock must be derived from the A/D's internal RC oscillator. 710 71 711 715 The A/D module has three registers. These registers are: The analog-to-digital (A/D) converter module has four analog inputs. * A/D Result Register (ADRES) * A/D Control Register 0 (ADCON0) * A/D Control Register 1 (ADCON1) The A/D allows conversion of an analog input signal to a corresponding 8-bit digital number (refer to Application Note AN546 for use of A/D Converter). The output of the sample and hold is the input into the converter, which generates the result via successive approximation. The analog reference voltage is software selectable to either the device's positive supply voltage (VDD) or the voltage level on the RA3/AN3/VREF pin. FIGURE 7-1: The ADCON0 register, shown in Figure 7-1 and Figure 7-2, controls the operation of the A/D module. The ADCON1 register, shown in Figure 7-3 configures the functions of the port pins. The port pins can be configured as analog inputs (RA3 can also be a voltage reference) or as digital I/O. ADCON0 REGISTER (ADDRESS 08h), PIC16C710/71/711 R/W-0 R/W-0 ADCS1 ADCS0 U-0 -- (1) R/W-0 CHS1 R/W-0 CHS0 R/W-0 GO/DONE bit7 R/W-0 ADIF R/W-0 ADON bit0 R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n =Value at POR reset bit 7-6: ADCS1:ADCS0: A/D Conversion Clock Select bits 00 = FOSC/2 01 = FOSC/8 10 = FOSC/32 11 = FRC (clock derived from an RC oscillation) bit 5: Unimplemented: Read as '0'. bit 4-3: CHS1:CHS0: Analog Channel Select bits 00 = channel 0, (RA0/AN0) 01 = channel 1, (RA1/AN1) 10 = channel 2, (RA2/AN2) 11 = channel 3, (RA3/AN3) bit 2: GO/DONE: A/D Conversion Status bit If ADON = 1: 1 = A/D conversion in progress (setting this bit starts the A/D conversion) 0 = A/D conversion not in progress (This bit is automatically cleared by hardware when the A/D conversion is complete) bit 1: ADIF: A/D Conversion Complete Interrupt Flag bit 1 = conversion is complete (must be cleared in software) 0 = conversion is not complete bit 0: ADON: A/D On bit 1 = A/D converter module is operating 0 = A/D converter module is shutoff and consumes no operating current Note 1: Bit5 of ADCON0 is a General Purpose R/W bit for the PIC16C710/711 only. For the PIC16C71, this bit is unimplemented, read as '0'. 1997 Microchip Technology Inc. DS30272A-page 37 PIC16C71X FIGURE 7-2: ADCON0 REGISTER (ADDRESS 1Fh), PIC16C715 R/W-0 R/W-0 ADCS1 ADCS0 bit7 R/W-0 -- R/W-0 CHS1 R/W-0 CHS0 R/W-0 GO/DONE U-0 -- R/W-0 ADON bit0 R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR reset bit 7-6: ADCS1:ADCS0: A/D Conversion Clock Select bits 00 = FOSC/2 01 = FOSC/8 10 = FOSC/32 11 = FRC (clock derived from an RC oscillation) bit 5: Unused bit 6-3: CHS1:CHS0: Analog Channel Select bits 000 = channel 0, (RA0/AN0) 001 = channel 1, (RA1/AN1) 010 = channel 2, (RA2/AN2) 011 = channel 3, (RA3/AN3) 100 = channel 0, (RA0/AN0) 101 = channel 1, (RA1/AN1) 110 = channel 2, (RA2/AN2) 111 = channel 3, (RA3/AN3) bit 2: GO/DONE: A/D Conversion Status bit If ADON = 1 1 = A/D conversion in progress (setting this bit starts the A/D conversion) 0 = A/D conversion not in progress (This bit is automatically cleared by hardware when the A/D conversion is complete) bit 1: Unimplemented: Read as '0' bit 0: ADON: A/D On bit 1 = A/D converter module is operating 0 = A/D converter module is shutoff and consumes no operating current FIGURE 7-3: U-0 -- bit7 ADCON1 REGISTER, PIC16C710/71/711 (ADDRESS 88h), PIC16C715 (ADDRESS 9Fh) U-0 -- U-0 -- U-0 -- U-0 -- U-0 -- R/W-0 PCFG1 R/W-0 PCFG0 bit0 R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n =Value at POR reset bit 7-2: Unimplemented: Read as '0' bit 1-0: PCFG1:PCFG0: A/D Port Configuration Control bits PCFG1:PCFG0 00 01 10 11 RA1 & RA0 A A A D RA2 A A D D RA3 A VREF D D VREF VDD RA3 VDD VDD A = Analog input D = Digital I/O DS30272A-page 38 1997 Microchip Technology Inc. PIC16C71X 2. The ADRES register contains the result of the A/D conversion. When the A/D conversion is complete, the result is loaded into the ADRES register, the GO/DONE bit (ADCON0<2>) is cleared, and A/D interrupt flag bit ADIF is set. The block diagram of the A/D module is shown in Figure 7-4. 3. 4. After the A/D module has been configured as desired, the selected channel must be acquired before the conversion is started. The analog input channels must have their corresponding TRIS bits selected as an input. To determine acquisition time, see Section 7.1. After this acquisition time has elapsed the A/D conversion can be started. The following steps should be followed for doing an A/D conversion: 1. 5. OR 6. Configure the A/D module: * Configure analog pins / voltage reference / and digital I/O (ADCON1) * Select A/D input channel (ADCON0) * Select A/D conversion clock (ADCON0) * Turn on A/D module (ADCON0) FIGURE 7-4: Configure A/D interrupt (if desired): * Clear ADIF bit * Set ADIE bit * Set GIE bit Wait the required acquisition time. Start conversion: * Set GO/DONE bit (ADCON0) Wait for A/D conversion to complete, by either: * Polling for the GO/DONE bit to be cleared 7. * Waiting for the A/D interrupt Read A/D Result register (ADRES), clear bit ADIF if required. For next conversion, go to step 1 or step 2 as required. The A/D conversion time per bit is defined as TAD. A minimum wait of 2TAD is required before next acquisition starts. A/D BLOCK DIAGRAM CHS1:CHS0 11 VIN RA3/AN3/VREF 10 (Input voltage) RA2/AN2 01 A/D Converter RA1/AN1 00 RA0/AN0 VDD 00 or 10 or 11 VREF (Reference voltage) 01 PCFG1:PCFG0 1997 Microchip Technology Inc. DS30272A-page 39 PIC16C71X 7.1 A/D Acquisition Requirements Note 1: The reference voltage (VREF) has no effect on the equation, since it cancels itself out. For the A/D converter to meet its specified accuracy, the charge holding capacitor (CHOLD) must be allowed to fully charge to the input channel voltage level. The analog input model is shown in Figure 7-5. The source impedance (RS) and the internal sampling switch (RSS) impedance directly affect the time required to charge the capacitor CHOLD. The sampling switch (RSS) impedance varies over the device voltage (VDD), Figure 7-5. The source impedance affects the offset voltage at the analog input (due to pin leakage current). The maximum recommended impedance for analog sources is 10 k. After the analog input channel is selected (changed) this acquisition must be done before the conversion can be started. To calculate the minimum acquisition time, Equation 71 may be used. This equation calculates the acquisition time to within 1/2 LSb error is used (512 steps for the A/D). The 1/2 LSb error is the maximum error allowed for the A/D to meet its specified accuracy. EQUATION 7-1: Note 2: The charge holding capacitor (CHOLD) is not discharged after each conversion. Note 3: The maximum recommended impedance for analog sources is 10 k. This is required to meet the pin leakage specification. Note 4: After a conversion has completed, a 2.0TAD delay must complete before acquisition can begin again. During this time the holding capacitor is not connected to the selected A/D input channel. EXAMPLE 7-1: CALCULATING THE MINIMUM REQUIRED AQUISITION TIME TACQ = Amplifier Settling Time + Holding Capacitor Charging Time + A/D MINIMUM CHARGING TIME Temperature Coefficient VHOLD = (VREF - (VREF/512)) * (1 - e(-TCAP/CHOLD(RIC + RSS + RS))) TACQ = 5 s + TCAP + [(Temp - 25C)(0.05 s/C)] Given: VHOLD = (VREF/512), for 1/2 LSb resolution TCAP = -CHOLD (RIC + RSS + RS) ln(1/511) The above equation reduces to: -51.2 pF (1 k + 7 k + 10 k) ln(0.0020) TCAP = -(51.2 pF)(1 k + RSS + RS) ln(1/511) -51.2 pF (18 k) ln(0.0020) Example 7-1 shows the calculation of the minimum required acquisition time TACQ. This calculation is based on the following system assumptions. -0.921 s (-6.2364) 5.747 s TACQ = 5 s + 5.747 s + [(50C - 25C)(0.05 s/C)] CHOLD = 51.2 pF 10.747 s + 1.25 s Rs = 10 k 11.997 s 1/2 LSb error VDD = 5V Rss = 7 k Temp (application system max.) = 50C VHOLD = 0 @ t = 0 FIGURE 7-5: ANALOG INPUT MODEL VDD Rs ANx CPIN 5 pF VA Sampling Switch VT = 0.6V VT = 0.6V RIC 1k SS RSS CHOLD = DAC capacitance = 51.2 pF I leakage 500 nA VSS Legend CPIN = input capacitance VT = threshold voltage I leakage = leakage current at the pin due to various junctions RIC SS CHOLD DS30272A-page 40 = interconnect resistance = sampling switch = sample/hold capacitance (from DAC) 6V 5V VDD 4V 3V 2V 5 6 7 8 9 10 11 Sampling Switch ( k ) 1997 Microchip Technology Inc. PIC16C71X 7.2 Selecting the A/D Conversion Clock 7.3 The A/D conversion time per bit is defined as TAD. The A/D conversion requires 9.5TAD per 8-bit conversion. The source of the A/D conversion clock is software selectable. The four possible options for TAD are: * * * * The ADCON1 and TRISA registers control the operation of the A/D port pins. The port pins that are desired as analog inputs must have their corresponding TRIS bits set (input). If the TRIS bit is cleared (output), the digital output level (VOH or VOL) will be converted. 2TOSC 8TOSC 32TOSC Internal RC oscillator The A/D operation is independent of the state of the CHS2:CHS0 bits and the TRIS bits. Note 1: When reading the port register, all pins configured as analog input channels will read as cleared (a low level). Pins configured as digital inputs, will convert an analog input. Analog levels on a digitally configured input will not affect the conversion accuracy. For correct A/D conversions, the A/D conversion clock (TAD) must be selected to ensure a minimum TAD time of: 2.0 s for the PIC16C71 1.6 s for all other PIC16C71X devices Note 2: Analog levels on any pin that is defined as a digital input (including the AN7:AN0 pins), may cause the input buffer to consume current that is out of the devices specification. Table 7-1 and Table 7-2 and show the resultant TAD times derived from the device operating frequencies and the A/D clock source selected. TABLE 7-1: TAD vs. DEVICE OPERATING FREQUENCIES, PIC16C71 AD Clock Source (TAD) Operation Configuring Analog Port Pins Device Frequency ADCS1:ADCS0 20 MHz 16 MHz 4 MHz 1 MHz 333.33 kHz 00 100 ns(2) 125 ns(2) 6 s 8TOSC 01 400 ns(2) 500 ns(2) 2.0 s 2.0 s ns(2) 8.0 s 24 s(3) 32TOSC 10 1.6 s(2) 8.0 s 32.0 s(3) 96 s(3) 2TOSC RC(5) 5: 2-6 2-6 2-6 2 - 6 s(1) 2 - 6 s Shaded cells are outside of recommended range. The RC source has a typical TAD time of 4 s. These values violate the minimum required TAD time. For faster conversion times, the selection of another clock source is recommended. When device frequency is greater than 1 MHz, the RC A/D conversion clock source is recommended for sleep operation only. For extended voltage devices (LC), please refer to Electrical Specifications section. TABLE 7-2: s(1,4) (1,4) 11 Legend: Note 1: 2: 3: 4: 500 2.0 s ADCS1:ADCS0 Device Frequency 20 MHz 2TOSC 00 100 8TOSC 01 400 ns(2) 1.6 s 32TOSC s(1) TAD vs. DEVICE OPERATING FREQUENCIES, PIC16C710/711, PIC16C715 AD Clock Source (TAD) Operation s(1,4) 10 ns(2) 5 MHz 1.25 MHz 333.33 kHz 400 1.6 s 1.6 s 6 s 6.4 s 24 s(3) 6.4 s 25.6 s 96 s(3) ns(2) (3) 2 - 6 s(1,4) 2 - 6 s(1,4) 2 - 6 s(1) 2 - 6 s(1,4) Shaded cells are outside of recommended range. The RC source has a typical TAD time of 4 s. These values violate the minimum required TAD time. For faster conversion times, the selection of another clock source is recommended. When device frequency is greater than 1 MHz, the RC A/D conversion clock source is recommended for sleep operation only. 5: For extended voltage devices (LC), please refer to Electrical Specifications section. RC(5) Legend: Note 1: 2: 3: 4: 11 1997 Microchip Technology Inc. DS30272A-page 41 PIC16C71X 7.4 A/D Conversions Example 7-2 shows how to perform an A/D conversion. The RA pins are configured as analog inputs. The analog reference (VREF) is the device VDD. The A/D interrupt is enabled, and the A/D conversion clock is FRC. The conversion is performed on the RA0 pin (channel 0). EXAMPLE 7-2: BSF CLRF BCF MOVLW MOVWF BSF BSF ; ; ; ; Note: The GO/DONE bit should NOT be set in the same instruction that turns on the A/D. Clearing the GO/DONE bit during a conversion will abort the current conversion. The ADRES register will NOT be updated with the partially completed A/D conversion sample. That is, the ADRES register will continue to contain the value of the last completed conversion (or the last value written to the ADRES register). After the A/D conversion is aborted, a 2TAD wait is required before the next acquisition is started. After this 2TAD wait, an acquisition is automatically started on the selected channel. A/D CONVERSION STATUS, ADCON1 STATUS, 0xC1 ADCON0 INTCON, INTCON, RP0 RP0 ADIE GIE ; ; ; ; ; ; ; Select Bank 1 Configure A/D inputs Select Bank 0 RC Clock, A/D is on, Channel 0 is selected Enable A/D Interrupt Enable all interrupts Ensure that the required sampling time for the selected input channel has elapsed. Then the conversion may be started. BSF : : ADCON0, GO DS30272A-page 42 ; Start A/D Conversion ; The ADIF bit will be set and the GO/DONE bit ; is cleared upon completion of the A/D Conversion. 1997 Microchip Technology Inc. PIC16C71X 7.4.1 FASTER CONVERSION - LOWER RESOLUTION TRADE-OFF Not all applications require a result with 8-bits of resolution, but may instead require a faster conversion time. The A/D module allows users to make the trade-off of conversion speed to resolution. Regardless of the resolution required, the acquisition time is the same. To speed up the conversion, the clock source of the A/D module may be switched so that the TAD time violates the minimum specified time (see the applicable electrical specification). Once the TAD time violates the minimum specified time, all the following A/D result bits are not valid (see A/D Conversion Timing in the Electrical Specifications section.) The clock sources may only be switched between the three oscillator versions (cannot be switched from/to RC). The equation to determine the time before the oscillator can be switched is as follows: Since the TAD is based from the device oscillator, the user must use some method (a timer, software loop, etc.) to determine when the A/D oscillator may be changed. Example 7-3 shows a comparison of time required for a conversion with 4-bits of resolution, versus the 8-bit resolution conversion. The example is for devices operating at 20 MHz and 16 MHz (The A/D clock is programmed for 32TOSC), and assumes that immediately after 6TAD, the A/D clock is programmed for 2TOSC. The 2TOSC violates the minimum TAD time since the last 4-bits will not be converted to correct values. Conversion time = 2TAD + N * TAD + (8 - N)(2TOSC) Where: N = number of bits of resolution required. EXAMPLE 7-3: 4-BIT vs. 8-BIT CONVERSION TIMES Freq. (MHz)(1) TAD TOSC 2TAD + N * TAD + (8 - N)(2TOSC) 20 16 20 16 20 16 Resolution 4-bit 8-bit 1.6 s 2.0 s 50 ns 62.5 ns 10 s 12.5 s 1.6 s 2.0 s 50 ns 62.5 ns 16 s 20 s Note 1: The PIC16C71 has a minimum TAD time of 2.0 s. All other PIC16C71X devices have a minimum TAD time of 1.6 s. 1997 Microchip Technology Inc. DS30272A-page 43 PIC16C71X 7.5 A/D Operation During Sleep The A/D module can operate during SLEEP mode. This requires that the A/D clock source be set to RC (ADCS1:ADCS0 = 11). When the RC clock source is selected, the A/D module waits one instruction cycle before starting the conversion. This allows the SLEEP instruction to be executed, which eliminates all digital switching noise from the conversion. When the conversion is completed the GO/DONE bit will be cleared, and the result loaded into the ADRES register. If the A/D interrupt is enabled, the device will wake-up from SLEEP. If the A/D interrupt is not enabled, the A/D module will then be turned off, although the ADON bit will remain set. When the A/D clock source is another clock option (not RC), a SLEEP instruction will cause the present conversion to be aborted and the A/D module to be turned off, though the ADON bit will remain set. Turning off the A/D places the A/D module in its lowest current consumption state. Note: 7.6 For the A/D module to operate in SLEEP, the A/D clock source must be set to RC (ADCS1:ADCS0 = 11). To perform an A/D conversion in SLEEP, ensure the SLEEP instruction immediately follows the instruction that sets the GO/DONE bit. A/D Accuracy/Error The absolute accuracy specified for the A/D converter includes the sum of all contributions for quantization error, integral error, differential error, full scale error, offset error, and monotonicity. It is defined as the maximum deviation from an actual transition versus an ideal transition for any code. The absolute error of the A/D converter is specified at < 1 LSb for VDD = VREF (over the device's specified operating range). However, the accuracy of the A/D converter will degrade as VDD diverges from VREF. For a given range of analog inputs, the output digital code will be the same. This is due to the quantization of the analog input to a digital code. Quantization error is typically 1/2 LSb and is inherent in the analog to digital conversion process. The only way to reduce quantization error is to increase the resolution of the A/D converter. Offset error measures the first actual transition of a code versus the first ideal transition of a code. Offset error shifts the entire transfer function. Offset error can be calibrated out of a system or introduced into a system through the interaction of the total leakage current and source impedance at the analog input. full scale error is that full scale does not take offset error into account. Gain error can be calibrated out in software. Linearity error refers to the uniformity of the code changes. Linearity errors cannot be calibrated out of the system. Integral non-linearity error measures the actual code transition versus the ideal code transition adjusted by the gain error for each code. Differential non-linearity measures the maximum actual code width versus the ideal code width. This measure is unadjusted. In systems where the device frequency is low, use of the A/D RC clock is preferred. At moderate to high frequencies, TAD should be derived from the device oscillator. TAD must not violate the minimum and should be 8 s for preferred operation. This is because TAD, when derived from TOSC, is kept away from on-chip phase clock transitions. This reduces, to a large extent, the effects of digital switching noise. This is not possible with the RC derived clock. The loss of accuracy due to digital switching noise can be significant if many I/O pins are active. In systems where the device will enter SLEEP mode after the start of the A/D conversion, the RC clock source selection is required. In this mode, the digital noise from the modules in SLEEP are stopped. This method gives high accuracy. 7.7 Effects of a RESET A device reset forces all registers to their reset state. This forces the A/D module to be turned off, and any conversion is aborted. The value that is in the ADRES register is not modified for a Power-on Reset. The ADRES register will contain unknown data after a Power-on Reset. 7.8 Connection Considerations If the input voltage exceeds the rail values (VSS or VDD) by greater than 0.2V, then the accuracy of the conversion is out of specification. Note: Care must be taken when using the RA0 pin in A/D conversions due to its proximity to the OSC1 pin. An external RC filter is sometimes added for anti-aliasing of the input signal. The R component should be selected to ensure that the total source impedance is kept under the 10 k recommended specification. Any external components connected (via hi-impedance) to an analog input pin (capacitor, zener diode, etc.) should have very little leakage current at the pin. Gain error measures the maximum deviation of the last actual transition and the last ideal transition adjusted for offset error. This error appears as a change in slope of the transfer function. The difference in gain error to DS30272A-page 44 1997 Microchip Technology Inc. PIC16C71X 7.9 Transfer Function FIGURE 7-6: A/D TRANSFER FUNCTION The ideal transfer function of the A/D converter is as follows: the first transition occurs when the analog input voltage (VAIN) is Analog VREF/256 (Figure 7-6). References Digital code output 7.10 A very good reference for understanding A/D converters is the "Analog-Digital Conversion Handbook" third edition, published by Prentice Hall (ISBN 0-13-032848-0). FFh FEh 04h 03h 02h 01h 256 LSb (full scale) 255 LSb 4 LSb 3 LSb 2 LSb 0.5 LSb 1 LSb 00h Analog input voltage FIGURE 7-7: FLOWCHART OF A/D OPERATION ADON = 0 Yes ADON = 0? No Acquire Selected Channel Yes GO = 0? No A/D Clock = RC? Yes Start of A/D Conversion Delayed 1 Instruction Cycle Finish Conversion GO = 0 ADIF = 1 No No Device in SLEEP? SLEEP Yes Instruction? Yes Abort Conversion GO = 0 ADIF = 0 Finish Conversion GO = 0 ADIF = 1 Wait 2 TAD No No Finish Conversion GO = 0 ADIF = 1 Wake-up Yes From Sleep? SLEEP Power-down A/D Wait 2 TAD Stay in Sleep Power-down A/D Wait 2 TAD 1997 Microchip Technology Inc. DS30272A-page 45 PIC16C71X TABLE 7-3: Address REGISTERS/BITS ASSOCIATED WITH A/D, PIC16C710/71/711 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Value on all other Resets GIE ADIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u xxxx xxxx uuuu uuuu 0Bh,8Bh INTCON 89h ADRES A/D Result Register 08h ADCON0 ADCS1 ADCS0 -- CHS1 CHS0 GO/DONE ADIF ADON 00-0 0000 00-0 0000 88h ADCON1 -- -- -- -- -- -- PCFG1 PCFG0 ---- --00 ---- --00 05h PORTA -- -- -- RA4 RA3 RA2 RA1 RA0 ---x 0000 ---u 0000 ---1 1111 ---1 1111 85h TRISA -- -- -- PORTA Data Direction Register Legend: x = unknown, u = unchanged, - = unimplemented read as '0'. Shaded cells are not used for A/D conversion. TABLE 7-4: REGISTERS/BITS ASSOCIATED WITH A/D, PIC16C715 Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Value on all other Resets 0Bh/8Bh INTCON PIR1 0Ch GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u -- ADIF -- -- -- -- -- -- -0-- ---- -0-- ---- -- ADIE -- -- -- -- -- -- -0-- ---- -0-- ---- xxxx xxxx uuuu uuuu 0000 00-0 0000 00-0 PCFG0 ---- --00 ---- --00 8Ch PIE1 1Eh ADRES A/D Result Register 1Fh ADCON 0 ADCON 1 ADCS 1 -- ADCS 0 -- CHS2 CHS1 CHS0 -- -- PORTA -- -- -- RA4 -- -- 9Fh 05h 85h TRISA TRISA4 -- PCFG1 RA3 RA2 RA1 ADON ---x 0000 ---u 0000 TRISA1 TRISA0 ---1 1111 ---1 1111 RA0 TRISA TRISA2 3 Legend: x = unknown, u = unchanged, - = unimplemented read as '0'. Shaded cells are not used for A/D conversion. DS30272A-page 46 -- -- GO/ DONE -- 1997 Microchip Technology Inc. PIC16C71X 8.0 SPECIAL FEATURES OF THE CPU Applicable Devices fixed delay of 72 ms (nominal) on power-up only, designed to keep the part in reset while the power supply stabilizes. With these two timers on-chip, most applications need no external reset circuitry. 710 71 711 715 SLEEP mode is designed to offer a very low current power-down mode. The user can wake-up from SLEEP through external reset, Watchdog Timer Wake-up, or through an interrupt. Several oscillator options are also made available to allow the part to fit the application. The RC oscillator option saves system cost while the LP crystal option saves power. A set of configuration bits are used to select various options. What sets a microcontroller apart from other processors are special circuits to deal with the needs of realtime applications. The PIC16CXX family has a host of such features intended to maximize system reliability, minimize cost through elimination of external components, provide power saving operating modes and offer code protection. These are: * Oscillator selection * Reset - Power-on Reset (POR) - Power-up Timer (PWRT) - Oscillator Start-up Timer (OST) - Brown-out Reset (BOR) (PIC16C710/711/715) - Parity Error Reset (PER) (PIC16C715) * Interrupts * Watchdog Timer (WDT) * SLEEP * Code protection * ID locations * In-circuit serial programming 8.1 Configuration Bits The configuration bits can be programmed (read as '0') or left unprogrammed (read as '1') to select various device configurations. These bits are mapped in program memory location 2007h. The user will note that address 2007h is beyond the user program memory space. In fact, it belongs to the special test/configuration memory space (2000h 3FFFh), which can be accessed only during programming. The PIC16CXX has a Watchdog Timer which can be shut off only through configuration bits. It runs off its own RC oscillator for added reliability. There are two timers that offer necessary delays on power-up. One is the Oscillator Start-up Timer (OST), intended to keep the chip in reset until the crystal oscillator is stable. The other is the Power-up Timer (PWRT), which provides a FIGURE 8-1: -- -- CONFIGURATION WORD FOR PIC16C71 -- -- -- -- -- -- -- CP0 bit13 PWRTE WDTE FOSC1 FOSC0 bit0 Register: Address CONFIG 2007h bit 13-5: Unimplemented: Read as '1' bit 4: CP0: Code protection bit 1 = Code protection off 0 = All memory is code protected, but 00h - 3Fh is writable bit 3: PWRTE: Power-up Timer Enable bit 1 = Power-up Timer enabled 0 = Power-up Timer disabled bit 2: WDTE: Watchdog Timer Enable bit 1 = WDT enabled 0 = WDT disabled bit 1-0: FOSC1:FOSC0: Oscillator Selection bits 11 = RC oscillator 10 = HS oscillator 01 = XT oscillator 00 = LP oscillator 1997 Microchip Technology Inc. DS30272A-page 47 PIC16C71X FIGURE 8-2: CP0 CP0 CONFIGURATION WORD, PIC16C710/711 CP0 CP0 CP0 CP0 CP0 BODEN CP0 CP0 bit13 PWRTE WDTE FOSC1 FOSC0 bit0 Register: Address CONFIG 2007h bit 13-7 CP0: Code protection bits (2) 5-4: 1 = Code protection off 0 = All memory is code protected, but 00h - 3Fh is writable bit 6: BODEN: Brown-out Reset Enable bit (1) 1 = BOR enabled 0 = BOR disabled bit 3: PWRTE: Power-up Timer Enable bit (1) 1 = PWRT disabled 0 = PWRT enabled bit 2: WDTE: Watchdog Timer Enable bit 1 = WDT enabled 0 = WDT disabled bit 1-0: FOSC1:FOSC0: Oscillator Selection bits 11 = RC oscillator 10 = HS oscillator 01 = XT oscillator 00 = LP oscillator Note 1: Enabling Brown-out Reset automatically enables Power-up Timer (PWRT) regardless of the value of bit PWRTE. Ensure the Power-up Timer is enabled anytime Brown-out Reset is enabled. 2: All of the CP0 bits have to be given the same value to enable the code protection scheme listed. FIGURE 8-3: CP1 CP0 CONFIGURATION WORD, PIC16C715 CP1 CP0 CP1 CP0 MPEEN BODEN CP1 CP0 bit13 PWRTE WDTE FOSC1 FOSC0 bit0 bit 13-8 5-4: CP1:CP0: Code Protection bits (2) 11 = Code protection off 10 = Upper half of program memory code protected 01 = Upper 3/4th of program memory code protected 00 = All memory is code protected bit 7: MPEEN: Memory Parity Error Enable 1 = Memory Parity Checking is enabled 0 = Memory Parity Checking is disabled bit 6: BODEN: Brown-out Reset Enable bit (1) 1 = BOR enabled 0 = BOR disabled bit 3: PWRTE: Power-up Timer Enable bit (1) 1 = PWRT disabled 0 = PWRT enabled bit 2: WDTE: Watchdog Timer Enable bit 1 = WDT enabled 0 = WDT disabled bit 1-0: FOSC1:FOSC0: Oscillator Selection bits 11 = RC oscillator 10 = HS oscillator 01 = XT oscillator 00 = LP oscillator Register: Address CONFIG 2007h Note 1: Enabling Brown-out Reset automatically enables Power-up Timer (PWRT) regardless of the value of bit PWRTE. Ensure the Power-up Timer is enabled anytime Brown-out Reset is enabled. 2: All of the CP1:CP0 pairs have to be given the same value to enable the code protection scheme listed. DS30272A-page 48 1997 Microchip Technology Inc. PIC16C71X 8.2 Oscillator Configurations 8.2.1 OSCILLATOR TYPES TABLE 8-1: The PIC16CXX can be operated in four different oscillator modes. The user can program two configuration bits (FOSC1 and FOSC0) to select one of these four modes: * * * * LP XT HS RC 8.2.2 Low Power Crystal Crystal/Resonator High Speed Crystal/Resonator Resistor/Capacitor Ranges Tested: Mode XT CRYSTAL/CERAMIC RESONATOR OPERATION (HS, XT OR LP OSC CONFIGURATION) 455 kHz 2.0 MHz 4.0 MHz 8.0 MHz 16.0 MHz C2 (2) 47 - 100 pF 15 - 68 pF 15 - 68 pF 15 - 68 pF 10 - 47 pF To internal logic See Table 8-1 and Table 8-1 for recommended values of C1 and C2. Panasonic EFO-A455K04B Murata Erie CSA2.00MG Murata Erie CSA4.00MG Murata Erie CSA8.00MT Murata Erie CSA16.00MX TABLE 8-2: 0.3% 0.5% 0.5% 0.5% 0.5% CAPACITOR SELECTION FOR CRYSTAL OSCILLATOR, PIC16C71 Mode Freq OSC1 OSC2 LP 32 kHz 200 kHz 100 kHz 500 kHz 1 MHz 2 MHz 4 MHz 8 MHz 20 MHz 33 - 68 pF 15 - 47 pF 47 - 100 pF 20 - 68 pF 15 - 68 pF 15 - 47 pF 15 - 33 pF 15 - 47 pF 15 - 47 pF 33 - 68 pF 15 - 47 pF 47 - 100 pF 20 - 68 pF 15 - 68 pF 15 - 47 pF 15 - 33 pF 15 - 47 pF 15 - 47 pF SLEEP PIC16CXXX OSC2 47 - 100 pF 15 - 68 pF 15 - 68 pF 15 - 68 pF 10 - 47 pF All resonators used did not have built-in capacitors. C1 RS Note1 OSC2 Resonators Used: XT OSC1 RF OSC1 These values are for design guidance only. See notes at bottom of page. In XT, LP or HS modes a crystal or ceramic resonator is connected to the OSC1/CLKIN and OSC2/CLKOUT pins to establish oscillation (Figure 8-4). The PIC16CXX Oscillator design requires the use of a parallel cut crystal. Use of a series cut crystal may give a frequency out of the crystal manufacturers specifications. When in XT, LP or HS modes, the device can have an external clock source to drive the OSC1/ CLKIN pin (Figure 8-5). XTAL Freq 455 kHz 2.0 MHz 4.0 MHz 8.0 MHz 16.0 MHz HS CRYSTAL OSCILLATOR/CERAMIC RESONATORS FIGURE 8-4: CERAMIC RESONATORS, PIC16C71 HS These values are for design guidance only. See notes at bottom of page. Note 1: A series resistor may be required for AT strip cut crystals. 2: The buffer is on the OSC2 pin. FIGURE 8-5: EXTERNAL CLOCK INPUT OPERATION (HS, XT OR LP OSC CONFIGURATION) OSC1 Clock from ext. system PIC16CXXX Open OSC2 1997 Microchip Technology Inc. DS30272A-page 49 PIC16C71X TABLE 8-3: CERAMIC RESONATORS, PIC16C710/711/715 TABLE 8-4: CAPACITOR SELECTION FOR CRYSTAL OSCILLATOR, PIC16C710/711/715 Ranges Tested: Mode XT Freq 455 kHz 2.0 MHz 4.0 MHz 8.0 MHz 16.0 MHz HS OSC1 68 - 100 pF 15 - 68 pF 15 - 68 pF 10 - 68 pF 10 - 22 pF OSC2 68 - 100 pF 15 - 68 pF 15 - 68 pF 10 - 68 pF 10 - 22 pF These values are for design guidance only. See notes at bottom of page. Osc Type Crystal Freq Cap. Range C1 Cap. Range C2 LP 32 kHz 33 pF 33 pF XT HS Resonators Used: 455 kHz 2.0 MHz 4.0 MHz 8.0 MHz 16.0 MHz Panasonic EFO-A455K04B Murata Erie CSA2.00MG Murata Erie CSA4.00MG Murata Erie CSA8.00MT Murata Erie CSA16.00MX 0.3% 0.5% 0.5% 0.5% 0.5% All resonators used did not have built-in capacitors. 200 kHz 15 pF 15 pF 200 kHz 47-68 pF 47-68 pF 1 MHz 15 pF 15 pF 4 MHz 15 pF 15 pF 4 MHz 15 pF 15 pF 8 MHz 15-33 pF 15-33 pF 20 MHz 15-33 pF 15-33 pF These values are for design guidance only. See notes at bottom of page. Crystals Used 32 kHz Epson C-001R32.768K-A 20 PPM 200 kHz STD XTL 200.000KHz 20 PPM 1 MHz ECS ECS-10-13-1 50 PPM 4 MHz ECS ECS-40-20-1 50 PPM 8 MHz EPSON CA-301 8.000M-C 30 PPM 20 MHz EPSON CA-301 20.000M-C 30 PPM Note 1: Recommended values of C1 and C2 are identical to the ranges tested table. 2: Higher capacitance increases the stability of oscillator but also increases the start-up time. 3: Since each resonator/crystal has its own characteristics, the user should consult the resonator/crystal manufacturer for appropriate values of external components. 4: Rs may be required in HS mode as well as XT mode to avoid overdriving crystals with low drive level specification. DS30272A-page 50 1997 Microchip Technology Inc. PIC16C71X 8.2.3 EXTERNAL CRYSTAL OSCILLATOR CIRCUIT Either a prepackaged oscillator can be used or a simple oscillator circuit with TTL gates can be built. Prepackaged oscillators provide a wide operating range and better stability. A well-designed crystal oscillator will provide good performance with TTL gates. Two types of crystal oscillator circuits can be used; one with series resonance, or one with parallel resonance. Figure 8-6 shows implementation of a parallel resonant oscillator circuit. The circuit is designed to use the fundamental frequency of the crystal. The 74AS04 inverter performs the 180-degree phase shift that a parallel oscillator requires. The 4.7 k resistor provides the negative feedback for stability. The 10 k potentiometer biases the 74AS04 in the linear region. This could be used for external oscillator designs. FIGURE 8-6: EXTERNAL PARALLEL RESONANT CRYSTAL OSCILLATOR CIRCUIT +5V To Other Devices 10k 74AS04 4.7k PIC16CXXX CLKIN 74AS04 10k 10k 20 pF Figure 8-7 shows a series resonant oscillator circuit. This circuit is also designed to use the fundamental frequency of the crystal. The inverter performs a 180degree phase shift in a series resonant oscillator circuit. The 330 k resistors provide the negative feedback to bias the inverters in their linear region. FIGURE 8-7: RC OSCILLATOR For timing insensitive applications the "RC" device option offers additional cost savings. The RC oscillator frequency is a function of the supply voltage, the resistor (Rext) and capacitor (Cext) values, and the operating temperature. In addition to this, the oscillator frequency will vary from unit to unit due to normal process parameter variation. Furthermore, the difference in lead frame capacitance between package types will also affect the oscillation frequency, especially for low Cext values. The user also needs to take into account variation due to tolerance of external R and C components used. Figure 8-8 shows how the R/C combination is connected to the PIC16CXX. For Rext values below 2.2 k, the oscillator operation may become unstable, or stop completely. For very high Rext values (e.g. 1 M), the oscillator becomes sensitive to noise, humidity and leakage. Thus, we recommend to keep Rext between 3 k and 100 k. Although the oscillator will operate with no external capacitor (Cext = 0 pF), we recommend using values above 20 pF for noise and stability reasons. With no or small external capacitance, the oscillation frequency can vary dramatically due to changes in external capacitances, such as PCB trace capacitance or package lead frame capacitance. See characterization data for desired device for RC frequency variation from part to part due to normal process variation. The variation is larger for larger R (since leakage current variation will affect RC frequency more for large R) and for smaller C (since variation of input capacitance will affect RC frequency more). XTAL 20 pF 8.2.4 See characterization data for desired device for variation of oscillator frequency due to VDD for given Rext/ Cext values as well as frequency variation due to operating temperature for given R, C, and VDD values. The oscillator frequency, divided by 4, is available on the OSC2/CLKOUT pin, and can be used for test purposes or to synchronize other logic (see Figure 3-2 for waveform). FIGURE 8-8: EXTERNAL SERIES RESONANT CRYSTAL OSCILLATOR CIRCUIT RC OSCILLATOR MODE V DD Rext 330 k 330 k 74AS04 74AS04 0.1 F 74AS04 Internal clock OSC1 To Other Devices PIC16CXXX CLKIN Cext PIC16CXXX VSS Fosc/4 OSC2/CLKOUT XTAL 1997 Microchip Technology Inc. DS30272A-page 51 PIC16C71X 8.3 Reset Applicable Devices 710 71 711 715 The PIC16CXX differentiates between various kinds of reset: * * * * * * Power-on Reset (POR) MCLR reset during normal operation MCLR reset during SLEEP WDT Reset (normal operation) Brown-out Reset (BOR) (PIC16C710/711/715) Parity Error Reset (PIC16C715) A simplified block diagram of the on-chip reset circuit is shown in Figure 8-9. Some registers are not affected in any reset condition; their status is unknown on POR and unchanged in any other reset. Most other registers are reset to a "reset state" on Power-on Reset (POR), on the MCLR and FIGURE 8-9: WDT Reset, on MCLR reset during SLEEP, and Brownout Reset (BOR). They are not affected by a WDT Wake-up, which is viewed as the resumption of normal operation. The TO and PD bits are set or cleared differently in different reset situations as indicated in Table 87, Table 8-8 and Table 8-9. These bits are used in software to determine the nature of the reset. See Table 810 and Table 8-11 for a full description of reset states of all registers. The PIC16C710/711/715 have a MCLR noise filter in the MCLR reset path. The filter will detect and ignore small pulses. It should be noted that a WDT Reset does not drive MCLR pin low. SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT External Reset MCLR/VPP Pin MPEEN Program Memory Parity(3) WDT SLEEP Module WDT Time-out VDD rise detect Power-on Reset VDD Brown-out Reset(2) S BODEN OST/PWRT OST Chip_Reset 10-bit Ripple-counter OSC1/ CLKIN Pin On-chip(1) RC OSC R Q PWRT 10-bit Ripple-counter Enable PWRT See Table 8-6 for time-out situations. Enable OST Note 1: This is a separate oscillator from the RC oscillator of the CLKIN pin. 2: Brown-out Reset is implemented on the PIC16C710/711/715. 3: Parity Error Reset is implemented on the PIC16C715. DS30272A-page 52 1997 Microchip Technology Inc. PIC16C71X 8.4 8.4.1 Power-on Reset (POR), Power-up Timer (PWRT) and Oscillator Start-up Timer (OST), and Brown-out Reset (BOR) The power-up time delay will vary from chip to chip due to VDD, temperature, and process variation. See DC parameters for details. POWER-ON RESET (POR) Applicable Devices Applicable Devices 710 71 711 715 A Power-on Reset pulse is generated on-chip when VDD rise is detected (in the range of 1.5V - 2.1V). To take advantage of the POR, just tie the MCLR pin directly (or through a resistor) to VDD. This will eliminate external RC components usually needed to create a Power-on Reset. A maximum rise time for VDD is specified. See Electrical Specifications for details. When the device starts normal operation (exits the reset condition), device operating parameters (voltage, frequency, temperature, ...) must be met to ensure operation. If these conditions are not met, the device must be held in reset until the operating conditions are met. Brown-out Reset may be used to meet the startup conditions. For additional information, refer to Application Note AN607, "Power-up Trouble Shooting." 8.4.2 POWER-UP TIMER (PWRT) Applicable Devices 710 71 711 715 The Power-up Timer provides a fixed 72 ms nominal time-out on power-up only, from the POR. The Powerup Timer operates on an internal RC oscillator. The chip is kept in reset as long as the PWRT is active. The PWRT's time delay allows VDD to rise to an acceptable level. A configuration bit is provided to enable/disable the PWRT. 8.4.3 OSCILLATOR START-UP TIMER (OST) 710 71 711 715 The Oscillator Start-up Timer (OST) provides 1024 oscillator cycle (from OSC1 input) delay after the PWRT delay is over. This ensures that the crystal oscillator or resonator has started and stabilized. The OST time-out is invoked only for XT, LP and HS modes and only on Power-on Reset or wake-up from SLEEP. 8.4.4 BROWN-OUT RESET (BOR) Applicable Devices 710 71 711 715 A configuration bit, BODEN, can disable (if clear/programmed) or enable (if set) the Brown-out Reset circuitry. If VDD falls below 4.0V (3.8V - 4.2V range) for greater than parameter #35, the brown-out situation will reset the chip. A reset may not occur if VDD falls below 4.0V for less than parameter #35. The chip will remain in Brown-out Reset until VDD rises above BVDD. The Power-up Timer will now be invoked and will keep the chip in RESET an additional 72 ms. If VDD drops below BVDD while the Power-up Timer is running, the chip will go back into a Brown-out Reset and the Power-up Timer will be initialized. Once VDD rises above BVDD, the Power-up Timer will execute a 72 ms time delay. The Power-up Timer should always be enabled when Brown-out Reset is enabled. Figure 8-10 shows typical brown-out situations. FIGURE 8-10: BROWN-OUT SITUATIONS VDD BVDD Internal Reset 72 ms VDD BVDD Internal Reset <72 ms 72 ms VDD BVDD Internal Reset 1997 Microchip Technology Inc. 72 ms DS30272A-page 53 PIC16C71X 8.4.5 TIME-OUT SEQUENCE Applicable Devices 710 71 711 715 On power-up the time-out sequence is as follows: First PWRT time-out is invoked after the POR time delay has expired. Then OST is activated. The total time-out will vary based on oscillator configuration and the status of the PWRT. For example, in RC mode with the PWRT disabled, there will be no time-out at all. Figure 8-11, Figure 8-12, and Figure 8-13 depict time-out sequences on power-up. Since the time-outs occur from the POR pulse, if MCLR is kept low long enough, the time-outs will expire. Then bringing MCLR high will begin execution immediately (Figure 8-12). This is useful for testing purposes or to synchronize more than one PIC16CXX device operating in parallel. Table 8-10 and Table 8-11 show the reset conditions for some special function registers, while Table 8-12 and Table 8-13 show the reset conditions for all the registers. 8.4.6 POWER CONTROL/STATUS REGISTER (PCON) Applicable Devices 710 71 711 715 The Power Control/Status Register, PCON has up to two bits, depending upon the device. Bit0 is Brown-out Reset Status bit, BOR. Bit BOR is unknown on a Power-on Reset. It must then be set by the user and checked on subsequent resets to see if bit BOR cleared, indicating a BOR occurred. The BOR bit is a "Don't Care" bit and is not necessarily predictable if the Brown-out Reset circuitry is disabled (by clearing bit BODEN in the Configuration Word). TABLE 8-5: XT, HS, LP RC For the PIC16C715, bit7 is MPEEN (Memory Parity Error Enable). This bit reflects the status of the MPEEN bit in configuration word. It is unaffected by any reset of interrupt. 8.4.7 PARITY ERROR RESET (PER) Applicable Devices 710 71 711 715 The PIC16C715 has on-chip parity bits that can be used to verify the contents of program memory. Parity bits may be useful in applications in order to increase overall reliability of a system. There are two parity bits for each word of Program Memory. The parity bits are computed on alternating bits of the program word. One computation is performed using even parity, the other using odd parity. As a program executes, the parity is verified. The even parity bit is XOR'd with the even bits in the program memory word. The odd parity bit is negated and XOR'd with the odd bits in the program memory word. When an error is detected, a reset is generated and the PER flag bit 2 in the PCON register is cleared (logic `0'). This indication can allow software to act on a failure. However, there is no indication of the program memory location of the failure in Program Memory. This flag can only be set (logic `1') by software. The parity array is user selectable during programming. Bit 7 of the configuration word located at address 2007h can be programmed (read as `0') to disable parity. If left unprogrammed (read as `1'), parity is enabled. Power-up PWRTE = 1 PWRTE = 0 72 ms + 1024TOSC 1024TOSC 72 ms -- Wake-up from SLEEP 1024 TOSC -- TIME-OUT IN VARIOUS SITUATIONS, PIC16C710/711/715 Oscillator Configuration XT, HS, LP RC DS30272A-page 54 For the PIC16C715, bit2 is PER (Parity Error Reset). It is cleared on a Parity Error Reset and must be set by user software. It will also be set on a Power-on Reset. TIME-OUT IN VARIOUS SITUATIONS, PIC16C71 Oscillator Configuration TABLE 8-6: Bit1 is POR (Power-on Reset Status bit). It is cleared on a Power-on Reset and unaffected otherwise. The user must set this bit following a Power-on Reset. Power-up PWRTE = 0 PWRTE = 1 72 ms + 1024TOSC 1024TOSC 72 ms -- Wake-up from SLEEP Brown-out 72 ms + 1024TOSC 72 ms 1024TOSC -- 1997 Microchip Technology Inc. PIC16C71X TABLE 8-7: STATUS BITS AND THEIR SIGNIFICANCE, PIC16C71 TO PD 1 0 x 0 0 u 1 1 x 0 1 0 u 0 TABLE 8-8: Power-on Reset Illegal, TO is set on POR Illegal, PD is set on POR WDT Reset WDT Wake-up MCLR Reset during normal operation MCLR Reset during SLEEP or interrupt wake-up from SLEEP STATUS BITS AND THEIR SIGNIFICANCE, PIC16C710/711 POR BOR TO PD 0 0 0 1 1 1 1 1 x x x 0 1 1 1 1 1 0 x x 0 0 u 1 1 x 0 x 1 0 u 0 TABLE 8-9: Power-on Reset Illegal, TO is set on POR Illegal, PD is set on POR Brown-out Reset WDT Reset WDT Wake-up MCLR Reset during normal operation MCLR Reset during SLEEP or interrupt wake-up from SLEEP STATUS BITS AND THEIR SIGNIFICANCE, PIC16C715 PER POR BOR TO PD 1 x x 1 1 1 1 1 0 0 0 0 0 0 1 1 1 1 1 1 0 x x x x 0 1 1 1 1 1 x 0 1 0 x x 0 0 u 1 1 x x 1 x 0 x 1 0 u 0 1 x x 1997 Microchip Technology Inc. Power-on Reset Illegal, TO is set on POR Illegal, PD is set on POR Brown-out Reset WDT Reset WDT Wake-up MCLR Reset during normal operation MCLR Reset during SLEEP or interrupt wake-up from SLEEP Parity Error Reset Illegal, PER is set on POR Illegal, PER is set on BOR DS30272A-page 55 PIC16C71X TABLE 8-10: RESET CONDITION FOR SPECIAL REGISTERS, PIC16C710/71/711 Condition Program Counter STATUS Register PCON Register PIC16C710/711 Power-on Reset 000h 0001 1xxx ---- --0x MCLR Reset during normal operation 000h 000u uuuu ---- --uu MCLR Reset during SLEEP 000h 0001 0uuu ---- --uu WDT Reset 000h 0000 1uuu ---- --uu WDT Wake-up PC + 1 uuu0 0uuu ---- --uu Brown-out Reset (PIC16C710/711) 000h 0001 1uuu ---- --u0 uuu1 0uuu ---- --uu Interrupt wake-up from SLEEP (1) PC + 1 Legend: u = unchanged, x = unknown, - = unimplemented bit read as '0'. Note 1: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h). TABLE 8-11: RESET CONDITION FOR SPECIAL REGISTERS, PIC16C715 Condition Program Counter STATUS Register PCON Register Power-on Reset 000h 0001 1xxx u--- -10x MCLR Reset during normal operation 000h 000u uuuu u--- -uuu MCLR Reset during SLEEP 000h 0001 0uuu u--- -uuu WDT Reset 000h 0000 1uuu u--- -uuu WDT Wake-up PC + 1 uuu0 0uuu u--- -uuu Brown-out Reset 000h 0001 1uuu u--- -uu0 Parity Error Reset 000h uuu1 0uuu u--- -0uu uuu1 0uuu u--- -uuu Interrupt wake-up from SLEEP (1) PC + 1 Legend: u = unchanged, x = unknown, - = unimplemented bit read as '0'. Note 1: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h). DS30272A-page 56 1997 Microchip Technology Inc. PIC16C71X TABLE 8-12: Register INITIALIZATION CONDITIONS FOR ALL REGISTERS, PIC16C710/71/711 Power-on Reset, Brown-out Reset(5) MCLR Resets WDT Reset Wake-up via WDT or Interrupt xxxx xxxx uuuu uuuu uuuu uuuu INDF N/A N/A N/A TMR0 xxxx xxxx uuuu uuuu uuuu uuuu 0000h 0000h PC + 1(2) STATUS 0001 1xxx 000q quuu(3) uuuq quuu(3) FSR xxxx xxxx uuuu uuuu uuuu uuuu PORTA ---x 0000 ---u 0000 ---u uuuu PORTB xxxx xxxx uuuu uuuu uuuu uuuu PCLATH ---0 0000 ---0 0000 ---u uuuu INTCON 0000 000x 0000 000u uuuu uuuu(1) ADRES xxxx xxxx uuuu uuuu uuuu uuuu ADCON0 00-0 0000 00-0 0000 uu-u uuuu OPTION 1111 1111 1111 1111 uuuu uuuu TRISA ---1 1111 ---1 1111 ---u uuuu W PCL TRISB 1111 1111 1111 1111 uuuu uuuu PCON ---- --0u ---- --uu ---- --uu ADCON1 ---- --00 ---- --00 ---- --uu (4) Legend: u = unchanged, x = unknown, - = unimplemented bit, read as '0', q = value depends on condition Note 1: One or more bits in INTCON will be affected (to cause wake-up). 2: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h). 3: See Table 8-10 for reset value for specific condition. 4: The PCON register is not implemented on the PIC16C71. 5: Brown-out reset is not implemented on the PIC16C71. 1997 Microchip Technology Inc. DS30272A-page 57 PIC16C71X TABLE 8-13: Register INITIALIZATION CONDITIONS FOR ALL REGISTERS, PIC16C715 Power-on Reset, Brown-out Reset Parity Error Reset MCLR Resets WDT Reset Wake-up via WDT or Interrupt xxxx xxxx uuuu uuuu uuuu uuuu INDF N/A N/A N/A TMR0 xxxx xxxx uuuu uuuu uuuu uuuu PCL 0000 0000 0000 0000 PC + 1(2) STATUS 0001 1xxx 000q quuu(3) uuuq quuu(3) FSR xxxx xxxx uuuu uuuu uuuu uuuu PORTA ---x 0000 ---u 0000 ---u uuuu W PORTB xxxx xxxx uuuu uuuu uuuu uuuu PCLATH ---0 0000 ---0 0000 ---u uuuu INTCON 0000 000x 0000 000u uuuu uuuu(1) PIR1 -0-- ---- -0-- ---- -u-- ----(1) ADCON0 0000 00-0 0000 00-0 uuuu uu-u OPTION 1111 1111 1111 1111 uuuu uuuu TRISA ---1 1111 ---1 1111 ---u uuuu TRISB 1111 1111 1111 1111 uuuu uuuu PIE1 -0-- ---- -0-- ---- -u-- ---- PCON ---- -qqq ---- -1uu ---- -1uu ADCON1 ---- --00 ---- --00 ---- --uu Legend: u = unchanged, x = unknown, - = unimplemented bit, read as '0', q = value depends on condition Note 1: One or more bits in INTCON and PIR1 will be affected (to cause wake-up). 2: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h). 3: See Table 8-11 for reset value for specific condition. DS30272A-page 58 1997 Microchip Technology Inc. PIC16C71X FIGURE 8-11: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1 VDD MCLR INTERNAL POR TPWRT PWRT TIME-OUT TOST OST TIME-OUT INTERNAL RESET FIGURE 8-12: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2 VDD MCLR INTERNAL POR TPWRT PWRT TIME-OUT TOST OST TIME-OUT INTERNAL RESET FIGURE 8-13: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD) VDD MCLR INTERNAL POR TPWRT PWRT TIME-OUT TOST OST TIME-OUT INTERNAL RESET 1997 Microchip Technology Inc. DS30272A-page 59 PIC16C71X FIGURE 8-14: EXTERNAL POWER-ON RESET CIRCUIT (FOR SLOW VDD POWER-UP) FIGURE 8-15: EXTERNAL BROWN-OUT PROTECTION CIRCUIT 1 VDD D VDD 33k VDD 10k R R1 40k MCLR C MCLR PIC16CXX PIC16CXX Note 1: External Power-on Reset circuit is required only if VDD power-up slope is too slow. The diode D helps discharge the capacitor quickly when VDD powers down. 2: R < 40 k is recommended to make sure that voltage drop across R does not violate the device's electrical specification. 3: R1 = 100 to 1 k will limit any current flowing into MCLR from external capacitor C in the event of MCLR/VPP pin breakdown due to Electrostatic Discharge (ESD) or Electrical Overstress (EOS). Note 1: This circuit will activate reset when VDD goes below (Vz + 0.7V) where Vz = Zener voltage. 2: Internal brown-out detection on the PIC16C710/711/715 should be disabled when using this circuit. 3: Resistors should be adjusted for the characteristics of the transistor. FIGURE 8-16: EXTERNAL BROWN-OUT PROTECTION CIRCUIT 2 VDD VDD R1 Q1 MCLR R2 40k PIC16CXX Note 1: This brown-out circuit is less expensive, albeit less accurate. Transistor Q1 turns off when VDD is below a certain level such that: R1 = 0.7V VDD * R1 + R2 2: Internal brown-out detection on the PIC16C710/711/715 should be disabled when using this circuit. 3: Resistors should be adjusted for the characteristics of the transistor. DS30272A-page 60 1997 Microchip Technology Inc. PIC16C71X 8.5 Interrupts Applicable Devices 710 71 711 715 The PIC16C71X family has 4 sources of interrupt. Interrupt Sources External interrupt RB0/INT TMR0 overflow interrupt PORTB change interrupts (pins RB7:RB4) A/D Interrupt For external interrupt events, such as the INT pin or PORTB change interrupt, the interrupt latency will be three or four instruction cycles. The exact latency depends when the interrupt event occurs (Figure 8-19). The latency is the same for one or two cycle instructions. Individual interrupt flag bits are set regardless of the status of their corresponding mask bit or the GIE bit. Note: The interrupt control register (INTCON) records individual interrupt requests in flag bits. It also has individual and global interrupt enable bits. Note: Individual interrupt flag bits are set regardless of the status of their corresponding mask bit or the GIE bit. A global interrupt enable bit, GIE (INTCON<7>) enables (if set) all un-masked interrupts or disables (if cleared) all interrupts. When bit GIE is enabled, and an interrupt's flag bit and mask bit are set, the interrupt will vector immediately. Individual interrupts can be disabled through their corresponding enable bits in various registers. Individual interrupt bits are set regardless of the status of the GIE bit. The GIE bit is cleared on reset. The "return from interrupt" instruction, RETFIE, exits the interrupt routine as well as sets the GIE bit, which re-enables interrupts. The RB0/INT pin interrupt, the RB port change interrupt and the TMR0 overflow interrupt flags are contained in the INTCON register. The peripheral interrupt flags are contained in the special function registers PIR1 and PIR2. The corresponding interrupt enable bits are contained in special function registers PIE1 and PIE2, and the peripheral interrupt enable bit is contained in special function register INTCON. For the PIC16C71 If an interrupt occurs while the Global Interrupt Enable (GIE) bit is being cleared, the GIE bit may unintentionally be re-enabled by the user's Interrupt Service Routine (the RETFIE instruction). The events that would cause this to occur are: 1. An instruction clears the GIE bit while an interrupt is acknowledged. 2. The program branches to the Interrupt vector and executes the Interrupt Service Routine. 3. The Interrupt Service Routine completes with the execution of the RETFIE instruction. This causes the GIE bit to be set (enables interrupts), and the program returns to the instruction after the one which was meant to disable interrupts. Perform the following to ensure that interrupts are globally disabled: LOOP BCF INTCON, GIE BTFSC INTCON, GIE GOTO : LOOP ; Disable global ; interrupt bit ; Global interrupt ; disabled? ; NO, try again ; Yes, continue ; with program ; flow When an interrupt is responded to, the GIE bit is cleared to disable any further interrupt, the return address is pushed onto the stack and the PC is loaded with 0004h. Once in the interrupt service routine the source(s) of the interrupt can be determined by polling the interrupt flag bits. The interrupt flag bit(s) must be cleared in software before re-enabling interrupts to avoid recursive interrupts. 1997 Microchip Technology Inc. DS30272A-page 61 PIC16C71X FIGURE 8-17: INTERRUPT LOGIC, PIC16C710, 71, 711 Wakeup (If in SLEEP mode) T0IF T0IE INTF INTE Interrupt to CPU RBIF RBIE ADIF ADIE GIE FIGURE 8-18: INTERRUPT LOGIC, PIC16C715 T0IF T0IE INTF INTE Wakeup (If in SLEEP mode) Interrupt to CPU RBIF RBIE ADIF ADIE ADIF GIE DS30272A-page 62 1997 Microchip Technology Inc. PIC16C71X 8.5.1 8.5.2 INT INTERRUPT TMR0 INTERRUPT An overflow (FFh 00h) in the TMR0 register will set flag bit T0IF (INTCON<2>). The interrupt can be enabled/disabled by setting/clearing enable bit T0IE (INTCON<5>). (Section 6.0) External interrupt on RB0/INT pin is edge triggered: either rising if bit INTEDG (OPTION<6>) is set, or falling, if the INTEDG bit is clear. When a valid edge appears on the RB0/INT pin, flag bit INTF (INTCON<1>) is set. This interrupt can be disabled by clearing enable bit INTE (INTCON<4>). Flag bit INTF must be cleared in software in the interrupt service routine before re-enabling this interrupt. The INT interrupt can wake-up the processor from SLEEP, if bit INTE was set prior to going into SLEEP. The status of global interrupt enable bit GIE decides whether or not the processor branches to the interrupt vector following wake-up. See Section 8.8 for details on SLEEP mode. 8.5.3 PORTB INTCON CHANGE An input change on PORTB<7:4> sets flag bit RBIF (INTCON<0>). The interrupt can be enabled/disabled by setting/clearing enable bit RBIE (INTCON<4>). (Section 5.2) Note: For the PIC16C71 if a change on the I/O pin should occur when the read operation is being executed (start of the Q2 cycle), then the RBIF interrupt flag may not get set. FIGURE 8-19: INT PIN INTERRUPT TIMING Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 CLKOUT 3 4 INT pin 1 1 INTF flag (INTCON<1>) Interrupt Latency 2 5 GIE bit (INTCON<7>) INSTRUCTION FLOW PC PC Instruction fetched Inst (PC) Instruction executed Inst (PC-1) PC+1 Inst (PC+1) Inst (PC) 0004h PC+1 -- Dummy Cycle 0005h Inst (0004h) Inst (0005h) Dummy Cycle Inst (0004h) Note 1: INTF flag is sampled here (every Q1). 2: Interrupt latency = 3-4 Tcy where Tcy = instruction cycle time. Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction. 3: CLKOUT is available only in RC oscillator mode. 4: For minimum width of INT pulse, refer to AC specs. 5: INTF is enabled to be set anytime during the Q4-Q1 cycles. 1997 Microchip Technology Inc. DS30272A-page 63 PIC16C71X 8.6 Context Saving During Interrupts During an interrupt, only the return PC value is saved on the stack. Typically, users may wish to save key registers during an interrupt i.e., W register and STATUS register. This will have to be implemented in software. Example 8-1 stores and restores the STATUS and W registers. The user register, STATUS_TEMP, must be defined in bank 0. The example: a) b) c) d) e) Stores the W register. Stores the STATUS register in bank 0. Executes the ISR code. Restores the STATUS register (and bank select bit). Restores the W register. EXAMPLE 8-1: SAVING STATUS AND W REGISTERS IN RAM MOVWF SWAPF MOVWF : :(ISR) : SWAPF W_TEMP STATUS,W STATUS_TEMP ;Copy W to TEMP register, could be bank one or zero ;Swap status to be saved into W ;Save status to bank zero STATUS_TEMP register STATUS_TEMP,W MOVWF SWAPF SWAPF STATUS W_TEMP,F W_TEMP,W ;Swap STATUS_TEMP register into W ;(sets bank to original state) ;Move W into STATUS register ;Swap W_TEMP ;Swap W_TEMP into W DS30272A-page 64 1997 Microchip Technology Inc. PIC16C71X 8.7 Watchdog Timer (WDT) Applicable Devices assigned to the WDT under software control by writing to the OPTION register. Thus, time-out periods up to 2.3 seconds can be realized. 710 71 711 715 The CLRWDT and SLEEP instructions clear the WDT and the postscaler, if assigned to the WDT, and prevent it from timing out and generating a device RESET condition. The Watchdog Timer is as a free running on-chip RC oscillator which does not require any external components. This RC oscillator is separate from the RC oscillator of the OSC1/CLKIN pin. That means that the WDT will run, even if the clock on the OSC1/CLKIN and OSC2/CLKOUT pins of the device has been stopped, for example, by execution of a SLEEP instruction. During normal operation, a WDT time-out generates a device RESET (Watchdog Timer Reset). If the device is in SLEEP mode, a WDT time-out causes the device to wake-up and continue with normal operation (Watchdog Timer Wake-up). The WDT can be permanently disabled by clearing configuration bit WDTE (Section 8.1). 8.7.1 The TO bit in the STATUS register will be cleared upon a Watchdog Timer time-out. 8.7.2 WDT PROGRAMMING CONSIDERATIONS It should also be taken into account that under worst case conditions (VDD = Min., Temperature = Max., and max. WDT prescaler) it may take several seconds before a WDT time-out occurs. Note: When a CLRWDT instruction is executed and the prescaler is assigned to the WDT, the prescaler count will be cleared, but the prescaler assignment is not changed. WDT PERIOD The WDT has a nominal time-out period of 18 ms, (with no prescaler). The time-out periods vary with temperature, VDD and process variations from part to part (see DC specs). If longer time-out periods are desired, a prescaler with a division ratio of up to 1:128 can be FIGURE 8-20: WATCHDOG TIMER BLOCK DIAGRAM From TMR0 Clock Source (Figure 6-6) 0 WDT Timer Postscaler M U X 1 8 8 - to - 1 MUX PS2:PS0 PSA WDT Enable Bit To TMR0 (Figure 6-6) 0 1 MUX PSA WDT Time-out Note: PSA and PS2:PS0 are bits in the OPTION register. FIGURE 8-21: SUMMARY OF WATCHDOG TIMER REGISTERS Address Name 2007h Config. bits 81h,181h OPTION Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 (1) BODEN(1) CP1 CP0 PWRTE(1) WDTE FOSC1 FOSC0 RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 Legend: Shaded cells are not used by the Watchdog Timer. Note 1: See Figure 8-1, Figure 8-2 and Figure 8-3 for operation of these bits. 1997 Microchip Technology Inc. DS30272A-page 65 PIC16C71X 8.8 Power-down Mode (SLEEP) Power-down mode is entered by executing a SLEEP instruction. If enabled, the Watchdog Timer will be cleared but keeps running, the PD bit (STATUS<3>) is cleared, the TO (STATUS<4>) bit is set, and the oscillator driver is turned off. The I/O ports maintain the status they had, before the SLEEP instruction was executed (driving high, low, or hi-impedance). For lowest current consumption in this mode, place all I/O pins at either VDD, or VSS, ensure no external circuitry is drawing current from the I/O pin, power-down the A/D, disable external clocks. Pull all I/O pins, that are hi-impedance inputs, high or low externally to avoid switching currents caused by floating inputs. The T0CKI input should also be at VDD or VSS for lowest current consumption. The contribution from on-chip pull-ups on PORTB should be considered. The MCLR pin must be at a logic high level (VIHMC). 8.8.1 WAKE-UP FROM SLEEP The device can wake up from SLEEP through one of the following events: 1. 2. 3. External reset input on MCLR pin. Watchdog Timer Wake-up (if WDT was enabled). Interrupt from INT pin, RB port change, or some Peripheral Interrupts. Other peripherals cannot generate interrupts since during SLEEP, no on-chip Q clocks are present. When the SLEEP instruction is being executed, the next instruction (PC + 1) is pre-fetched. For the device to wake-up through an interrupt event, the corresponding interrupt enable bit must be set (enabled). Wake-up is regardless of the state of the GIE bit. If the GIE bit is clear (disabled), the device continues execution at the instruction after the SLEEP instruction. If the GIE bit is set (enabled), the device executes the instruction after the SLEEP instruction and then branches to the interrupt address (0004h). In cases where the execution of the instruction following SLEEP is not desirable, the user should have a NOP after the SLEEP instruction. 8.8.2 WAKE-UP USING INTERRUPTS When global interrupts are disabled (GIE cleared) and any interrupt source has both its interrupt enable bit and interrupt flag bit set, one of the following will occur: * If the interrupt occurs before the the execution of a SLEEP instruction, the SLEEP instruction will complete as a NOP. Therefore, the WDT and WDT postscaler will not be cleared, the TO bit will not be set and PD bits will not be cleared. * If the interrupt occurs during or after the execution of a SLEEP instruction, the device will immediately wake up from sleep . The SLEEP instruction will be completely executed before the wake-up. Therefore, the WDT and WDT postscaler will be cleared, the TO bit will be set and the PD bit will be cleared. External MCLR Reset will cause a device reset. All other events are considered a continuation of program execution and cause a "wake-up". The TO and PD bits in the STATUS register can be used to determine the cause of device reset. The PD bit, which is set on power-up, is cleared when SLEEP is invoked. The TO bit is cleared if a WDT time-out occurred (and caused wake-up). Even if the flag bits were checked before executing a SLEEP instruction, it may be possible for flag bits to become set before the SLEEP instruction completes. To determine whether a SLEEP instruction executed, test the PD bit. If the PD bit is set, the SLEEP instruction was executed as a NOP. The following peripheral interrupts can wake the device from SLEEP: To ensure that the WDT is cleared, a CLRWDT instruction should be executed before a SLEEP instruction. 1. 2. TMR1 interrupt. Timer1 must be operating as an asynchronous counter. A/D conversion (when A/D clock source is RC). DS30272A-page 66 1997 Microchip Technology Inc. PIC16C71X FIGURE 8-22: WAKE-UP FROM SLEEP THROUGH INTERRUPT Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 TOST(2) CLKOUT(4) INT pin INTF flag (INTCON<1>) Interrupt Latency (Note 2) GIE bit (INTCON<7>) Processor in SLEEP INSTRUCTION FLOW PC PC Instruction fetched Inst(PC) = SLEEP Instruction executed Inst(PC - 1) Note 1: 2: 3: 4: 8.9 PC+1 PC+2 Inst(PC + 2) SLEEP Inst(PC + 1) 8.10 Program Verification/Code Protection Microchip does not recommend code protecting windowed devices. ID Locations Four memory locations (2000h - 2003h) are designated as ID locations where the user can store checksum or other code-identification numbers. These locations are not accessible during normal execution but are readable and writable during program/verify. It is recommended that only the 4 least significant bits of the ID location are used. 8.11 PC + 2 Dummy cycle 0004h 0005h Inst(0004h) Inst(0005h) Dummy cycle Inst(0004h) XT, HS or LP oscillator mode assumed. TOST = 1024TOSC (drawing not to scale) This delay will not be there for RC osc mode. GIE = '1' assumed. In this case after wake- up, the processor jumps to the interrupt routine. If GIE = '0', execution will continue in-line. CLKOUT is not available in these osc modes, but shown here for timing reference. If the code protection bit(s) have not been programmed, the on-chip program memory can be read out for verification purposes. Note: PC+2 Inst(PC + 1) In-Circuit Serial Programming PIC16CXX microcontrollers can be serially programmed while in the end application circuit. This is simply done with two lines for clock and data, and three other lines for power, ground, and the programming voltage. This allows customers to manufacture boards with unprogrammed devices, and then program the microcontroller just before shipping the product. This also allows the most recent firmware or a custom firmware to be programmed. The device is placed into a program/verify mode by holding the RB6 and RB7 pins low while raising the MCLR (VPP) pin from VIL to VIHH (see programming specification). RB6 becomes the programming clock and RB7 becomes the programming data. Both RB6 and RB7 are Schmitt Trigger inputs in this mode. After reset, to place the device into programming/verify mode, the program counter (PC) is at location 00h. A 6bit command is then supplied to the device. Depending on the command, 14-bits of program data are then supplied to or from the device, depending if the command was a load or a read. For complete details of serial programming, please refer to the PIC16C6X/7X Programming Specifications (Literature #DS30228). FIGURE 8-23: TYPICAL IN-CIRCUIT SERIAL PROGRAMMING CONNECTION External Connector Signals To Normal Connections PIC16CXX +5V VDD 0V VSS VPP MCLR/VPP CLK RB6 Data I/O RB7 VDD To Normal Connections 1997 Microchip Technology Inc. DS30272A-page 67 PIC16C71X NOTES: DS30272A-page 68 1997 Microchip Technology Inc. PIC16C71X 9.0 INSTRUCTION SET SUMMARY Each PIC16CXX instruction is a 14-bit word divided into an OPCODE which specifies the instruction type and one or more operands which further specify the operation of the instruction. The PIC16CXX instruction set summary in Table 9-2 lists byte-oriented, bit-oriented, and literal and control operations. Table 9-1 shows the opcode field descriptions. For byte-oriented instructions, 'f' represents a file register designator and 'd' represents a destination designator. The file register designator specifies which file register is to be used by the instruction. The destination designator specifies where the result of the operation is to be placed. If 'd' is zero, the result is placed in the W register. If 'd' is one, the result is placed in the file register specified in the instruction. For bit-oriented instructions, 'b' represents a bit field designator which selects the number of the bit affected by the operation, while 'f' represents the number of the file in which the bit is located. For literal and control operations, 'k' represents an eight or eleven bit constant or literal value. TABLE 9-1: OPCODE FIELD DESCRIPTIONS Field Description Register file address (0x00 to 0x7F) Working register (accumulator) Bit address within an 8-bit file register Literal field, constant data or label Don't care location (= 0 or 1) The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. d Destination select; d = 0: store result in W, d = 1: store result in file register f. Default is d = 1 label Label name TOS Top of Stack PC Program Counter f W b k x * Byte-oriented operations * Bit-oriented operations * Literal and control operations All instructions are executed within one single instruction cycle, unless a conditional test is true or the program counter is changed as a result of an instruction. In this case, the execution takes two instruction cycles with the second cycle executed as a NOP. One instruction cycle consists of four oscillator periods. Thus, for an oscillator frequency of 4 MHz, the normal instruction execution time is 1 s. If a conditional test is true or the program counter is changed as a result of an instruction, the instruction execution time is 2 s. Table 9-2 lists the instructions recognized by the MPASM assembler. Figure 9-1 shows the general formats that the instructions can have. Note: To maintain upward compatibility with future PIC16CXX products, do not use the OPTION and TRIS instructions. All examples use the following format to represent a hexadecimal number: 0xhh where h signifies a hexadecimal digit. FIGURE 9-1: GENERAL FORMAT FOR INSTRUCTIONS Byte-oriented file register operations 13 8 7 6 OPCODE d f (FILE #) 0 d = 0 for destination W d = 1 for destination f f = 7-bit file register address Bit-oriented file register operations 13 10 9 7 6 OPCODE b (BIT #) f (FILE #) 0 b = 3-bit bit address f = 7-bit file register address PCLATH Program Counter High Latch GIE WDT TO PD dest [ ] ( ) <> Global Interrupt Enable bit Watchdog Timer/Counter Time-out bit Power-down bit Destination either the W register or the specified register file location Options Contents Assigned to Literal and control operations General 13 8 7 OPCODE 0 k (literal) k = 8-bit immediate value CALL and GOTO instructions only 13 11 10 0 Register bit field OPCODE In the set of k = 11-bit immediate value k (literal) italics User defined term (font is courier) The instruction set is highly orthogonal and is grouped into three basic categories: 1997 Microchip Technology Inc. DS30272A-page 69 PIC16C71X TABLE 9-2: PIC16CXX INSTRUCTION SET Mnemonic, Operands Description Cycles 14-Bit Opcode MSb LSb Status Affected Notes BYTE-ORIENTED FILE REGISTER OPERATIONS ADDWF ANDWF CLRF CLRW COMF DECF DECFSZ INCF INCFSZ IORWF MOVF MOVWF NOP RLF RRF SUBWF SWAPF XORWF f, d f, d f f, d f, d f, d f, d f, d f, d f, d f f, d f, d f, d f, d f, d Add W and f AND W with f Clear f Clear W Complement f Decrement f Decrement f, Skip if 0 Increment f Increment f, Skip if 0 Inclusive OR W with f Move f Move W to f No Operation Rotate Left f through Carry Rotate Right f through Carry Subtract W from f Swap nibbles in f Exclusive OR W with f 1 1 1 1 1 1 1(2) 1 1(2) 1 1 1 1 1 1 1 1 1 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 0111 0101 0001 0001 1001 0011 1011 1010 1111 0100 1000 0000 0000 1101 1100 0010 1110 0110 dfff dfff lfff 0xxx dfff dfff dfff dfff dfff dfff dfff lfff 0xx0 dfff dfff dfff dfff dfff ffff ffff ffff xxxx ffff ffff ffff ffff ffff ffff ffff ffff 0000 ffff ffff ffff ffff ffff 1 1 1 (2) 1 (2) 01 01 01 01 00bb 01bb 10bb 11bb bfff bfff bfff bfff ffff ffff ffff ffff 1 1 2 1 2 1 1 2 2 2 1 1 1 11 11 10 00 10 11 11 00 11 00 00 11 11 111x 1001 0kkk 0000 1kkk 1000 00xx 0000 01xx 0000 0000 110x 1010 kkkk kkkk kkkk 0110 kkkk kkkk kkkk 0000 kkkk 0000 0110 kkkk kkkk kkkk kkkk kkkk 0100 kkkk kkkk kkkk 1001 kkkk 1000 0011 kkkk kkkk C,DC,Z Z Z Z Z Z Z Z Z C C C,DC,Z Z 1,2 1,2 2 1,2 1,2 1,2,3 1,2 1,2,3 1,2 1,2 1,2 1,2 1,2 1,2 1,2 BIT-ORIENTED FILE REGISTER OPERATIONS BCF BSF BTFSC BTFSS f, b f, b f, b f, b Bit Clear f Bit Set f Bit Test f, Skip if Clear Bit Test f, Skip if Set 1,2 1,2 3 3 LITERAL AND CONTROL OPERATIONS ADDLW ANDLW CALL CLRWDT GOTO IORLW MOVLW RETFIE RETLW RETURN SLEEP SUBLW XORLW k k k k k k k k k Add literal and W AND literal with W Call subroutine Clear Watchdog Timer Go to address Inclusive OR literal with W Move literal to W Return from interrupt Return with literal in W Return from Subroutine Go into standby mode Subtract W from literal Exclusive OR literal with W C,DC,Z Z TO,PD Z TO,PD C,DC,Z Z Note 1: When an I/O register is modified as a function of itself ( e.g., MOVF PORTB, 1), the value used will be that value present on the pins themselves. For example, if the data latch is '1' for a pin configured as input and is driven low by an external device, the data will be written back with a '0'. 2: If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared if assigned to the Timer0 Module. 3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. DS30272A-page 70 1997 Microchip Technology Inc. PIC16C71X 9.1 Instruction Descriptions ADDLW Add Literal and W ANDLW AND Literal with W Syntax: [label] ADDLW Syntax: [label] ANDLW Operands: 0 k 255 Operands: 0 k 255 Operation: (W) + k (W) Operation: (W) .AND. (k) (W) C, DC, Z Status Affected: Z Status Affected: Encoding: 11 k 111x kkkk kkkk Encoding: 11 k 1001 kkkk kkkk Description: The contents of the W register are added to the eight bit literal 'k' and the result is placed in the W register. Description: The contents of W register are AND'ed with the eight bit literal 'k'. The result is placed in the W register. Words: 1 Words: 1 1 Cycles: 1 Cycles: Q Cycle Activity: Example: Q1 Q2 Q3 Q4 Decode Read literal 'k' Process data Write to W ADDLW 0x15 Q Cycle Activity: Example = = ADDWF Add W and f Syntax: [label] ADDWF Operands: Q3 Q4 Decode Read literal "k" Process data Write to W ANDLW 0x5F W 0x10 = 0xA3 After Instruction After Instruction W Q2 Before Instruction Before Instruction W Q1 W 0x25 = 0x03 ANDWF AND W with f Syntax: [label] ANDWF 0 f 127 d [0,1] Operands: 0 f 127 d [0,1] Operation: (W) + (f) (dest) Operation: (W) .AND. (f) (dest) Status Affected: C, DC, Z Status Affected: Z Encoding: Description: 00 f,d 0111 dfff ffff Encoding: 00 f,d 0101 dfff ffff Add the contents of the W register with register 'f'. If 'd' is 0 the result is stored in the W register. If 'd' is 1 the result is stored back in register 'f'. Description: AND the W register with register 'f'. If 'd' is 0 the result is stored in the W register. If 'd' is 1 the result is stored back in register 'f'. Words: 1 Words: 1 Cycles: 1 Cycles: 1 Q Cycle Activity: Example Q1 Q2 Q3 Q4 Decode Read register 'f' Process data Write to Dest ADDWF FSR, 0 Before Instruction W = FSR = 1997 Microchip Technology Inc. Example Q1 Q2 Q3 Q4 Decode Read register 'f' Process data Write to Dest ANDWF FSR, 1 Before Instruction 0x17 0xC2 After Instruction W = FSR = Q Cycle Activity: W = FSR = 0x17 0xC2 After Instruction 0xD9 0xC2 W = FSR = 0x17 0x02 DS30272A-page 71 PIC16C71X BCF Bit Clear f BTFSC Bit Test, Skip if Clear Syntax: [label] BCF Syntax: [label] BTFSC f,b Operands: 0 f 127 0b7 Operands: 0 f 127 0b7 Operation: 0 (f<b>) Operation: skip if (f<b>) = 0 Status Affected: None Status Affected: None Encoding: 01 f,b 00bb bfff ffff Description: Bit 'b' in register 'f' is cleared. Words: 1 Cycles: 1 Q Cycle Activity: Example Q1 Q2 Q3 Q4 Decode Read register 'f' Process data Write register 'f' BCF Encoding: 10bb bfff ffff Description: Words: 1 Cycles: 1(2) Q Cycle Activity: FLAG_REG, 7 01 If bit 'b' in register 'f' is '1' then the next instruction is executed. If bit 'b', in register 'f', is '0' then the next instruction is discarded, and a NOP is executed instead, making this a 2TCY instruction. Before Instruction Q1 Q2 Q3 Q4 Decode Read register 'f' Process data NOP Q3 Q4 NOP NOP FLAG_REG = 0xC7 If Skip: After Instruction FLAG_REG = 0x47 Example (2nd Cycle) Q1 Q2 NOP NOP HERE FALSE TRUE BTFSC GOTO * * * FLAG,1 PROCESS_CODE Before Instruction PC = address HERE After Instruction BSF if FLAG<1> = 0, PC = address TRUE if FLAG<1>=1, PC = address FALSE Bit Set f Syntax: [label] BSF Operands: 0 f 127 0b7 Operation: 1 (f<b>) Status Affected: None Encoding: 01 f,b 01bb bfff Description: Bit 'b' in register 'f' is set. Words: 1 Cycles: 1 Q Cycle Activity: Example ffff Q1 Q2 Q3 Q4 Decode Read register 'f' Process data Write register 'f' BSF FLAG_REG, 7 Before Instruction FLAG_REG = 0x0A After Instruction FLAG_REG = 0x8A DS30272A-page 72 1997 Microchip Technology Inc. PIC16C71X BTFSS Bit Test f, Skip if Set CALL Call Subroutine Syntax: [label] BTFSS f,b Syntax: [ label ] CALL k Operands: 0 f 127 0b<7 Operands: 0 k 2047 Operation: Operation: skip if (f<b>) = 1 Status Affected: None (PC)+ 1 TOS, k PC<10:0>, (PCLATH<4:3>) PC<12:11> Status Affected: None Encoding: Description: 01 1 Cycles: 1(2) If Skip: Example bfff ffff If bit 'b' in register 'f' is '0' then the next instruction is executed. If bit 'b' is '1', then the next instruction is discarded and a NOP is executed instead, making this a 2TCY instruction. Words: Q Cycle Activity: 11bb Q1 Q2 Q3 Q4 Decode Read register 'f' Process data NOP (2nd Cycle) Q1 Q2 NOP NOP HERE FALSE TRUE BTFSC GOTO * * * Q3 Q4 NOP NOP FLAG,1 PROCESS_CODE 10 0kkk kkkk kkkk Description: Call Subroutine. First, return address (PC+1) is pushed onto the stack. The eleven bit immediate address is loaded into PC bits <10:0>. The upper bits of the PC are loaded from PCLATH. CALL is a two cycle instruction. Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 1st Cycle Decode Read literal 'k', Push PC to Stack Process data Write to PC 2nd Cycle NOP NOP NOP NOP HERE CALL THERE Example Before Instruction PC = Address HERE After Instruction Before Instruction PC = Encoding: address HERE PC = Address THERE TOS = Address HERE+1 After Instruction if FLAG<1> = 0, PC = address FALSE if FLAG<1> = 1, PC = address TRUE 1997 Microchip Technology Inc. DS30272A-page 73 PIC16C71X CLRF Clear f Syntax: [label] CLRF Operands: 0 f 127 Operation: 00h (f) 1Z Status Affected: Z Encoding: 00 f 0001 1fff ffff CLRW Clear W Syntax: [ label ] CLRW Operands: None Operation: 00h (W) 1Z Status Affected: Z Encoding: 00 0001 0xxx xxxx Description: The contents of register 'f' are cleared and the Z bit is set. Description: W register is cleared. Zero bit (Z) is set. Words: 1 Words: 1 Cycles: 1 Cycles: 1 Q Cycle Activity: Example Q1 Q2 Q3 Q4 Decode Read register 'f' Process data Write register 'f' CLRF Q Cycle Activity: Example FLAG_REG = 0x5A Q3 Q4 Process data Write to W CLRW = = 0x00 1 W = 0x5A After Instruction After Instruction FLAG_REG Z Q2 NOP Before Instruction Before Instruction FLAG_REG Q1 Decode W Z = = 0x00 1 CLRWDT Clear Watchdog Timer Syntax: [ label ] CLRWDT Operands: None Operation: 00h WDT 0 WDT prescaler, 1 TO 1 PD Status Affected: TO, PD Encoding: 00 0000 0110 0100 Description: CLRWDT instruction resets the Watchdog Timer. It also resets the prescaler of the WDT. Status bits TO and PD are set. Words: 1 Cycles: 1 Q Cycle Activity: Example Q1 Q2 Q3 Q4 Decode NOP Process data Clear WDT Counter CLRWDT Before Instruction WDT counter = ? After Instruction WDT counter = WDT prescaler= TO = PD = DS30272A-page 74 0x00 0 1 1 1997 Microchip Technology Inc. PIC16C71X COMF Complement f Syntax: [ label ] COMF Operands: 0 f 127 d [0,1] Operation: (f) (dest) Status Affected: Z Encoding: 00 f,d 1001 dfff ffff Description: The contents of register 'f' are complemented. If 'd' is 0 the result is stored in W. If 'd' is 1 the result is stored back in register 'f'. Words: 1 Cycles: 1 Q Cycle Activity: Example DECFSZ Decrement f, Skip if 0 Syntax: [ label ] DECFSZ f,d Operands: 0 f 127 d [0,1] Operation: (f) - 1 (dest); Status Affected: None Encoding: 00 Q2 Q3 Q4 Words: 1 Read register 'f' Process data Write to dest Cycles: 1(2) Q Cycle Activity: Q2 Q3 Q4 Decode Read register 'f' Process data Write to dest Before Instruction 0x13 = = 0x13 0xEC If Skip: After Instruction REG1 W (2nd Cycle) Q1 Q2 NOP NOP DECF Decrement f Syntax: [label] DECF f,d Operands: 0 f 127 d [0,1] Operation: (f) - 1 (dest) Before Instruction Status Affected: Z After Instruction Encoding: 00 Example dfff ffff Description: Decrement register 'f'. If 'd' is 0 the result is stored in the W register. If 'd' is 1 the result is stored back in register 'f'. Words: 1 Cycles: 1 Q Cycle Activity: Example Q1 Q2 Q3 Q4 Decode Read register 'f' Process data Write to dest DECF HERE DECFSZ GOTO CONTINUE * * * PC 0011 ffff Q1 REG1,0 = dfff Description: Q1 REG1 1011 The contents of register 'f' are decremented. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is placed back in register 'f'. If the result is 1, the next instruction, is executed. If the result is 0, then a NOP is executed instead making it a 2TCY instruction. Decode COMF skip if result = 0 CNT if CNT PC if CNT PC = = = = = Q3 Q4 NOP NOP CNT, 1 LOOP address HERE CNT - 1 0, address CONTINUE 0, address HERE+1 CNT, 1 Before Instruction CNT Z = = 0x01 0 = = 0x00 1 After Instruction CNT Z 1997 Microchip Technology Inc. DS30272A-page 75 PIC16C71X GOTO Unconditional Branch INCF Increment f Syntax: [ label ] Syntax: [ label ] Operands: 0 k 2047 Operands: Operation: k PC<10:0> PCLATH<4:3> PC<12:11> 0 f 127 d [0,1] Operation: (f) + 1 (dest) None Status Affected: Z Status Affected: Encoding: 10 GOTO k 1kkk kkkk kkkk Encoding: 00 INCF f,d 1010 dfff ffff Description: GOTO is an unconditional branch. The eleven bit immediate value is loaded into PC bits <10:0>. The upper bits of PC are loaded from PCLATH<4:3>. GOTO is a two cycle instruction. Description: The contents of register 'f' are incremented. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is placed back in register 'f'. Words: 1 Words: 1 Cycles: 2 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 1st Cycle Decode Read literal 'k' Process data Write to PC 2nd Cycle NOP NOP NOP NOP Q Cycle Activity: Example Example GOTO THERE Q2 Q3 Q4 Read register 'f' Process data Write to dest INCF CNT, 1 Before Instruction After Instruction PC = Q1 Decode Address THERE CNT Z = = 0xFF 0 = = 0x00 1 After Instruction CNT Z DS30272A-page 76 1997 Microchip Technology Inc. PIC16C71X INCFSZ Increment f, Skip if 0 IORLW Inclusive OR Literal with W Syntax: [ label ] Syntax: [ label ] Operands: 0 f 127 d [0,1] Operands: 0 k 255 Operation: (f) + 1 (dest), skip if result = 0 (W) .OR. k (W) Operation: Status Affected: Z Status Affected: None Encoding: Encoding: Description: 00 1111 dfff ffff The contents of register 'f' are incremented. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is placed back in register 'f'. If the result is 1, the next instruction is executed. If the result is 0, a NOP is executed instead making it a 2TCY instruction. Words: 1 Cycles: 1(2) Q Cycle Activity: INCFSZ f,d Q1 Q2 Q3 Q4 Decode Read register 'f' Process data Write to dest 11 IORLW k 1000 kkkk kkkk Description: The contents of the W register is OR'ed with the eight bit literal 'k'. The result is placed in the W register. Words: 1 Cycles: 1 Q Cycle Activity: Example Q1 Q2 Q3 Q4 Decode Read literal 'k' Process data Write to W IORLW 0x35 Before Instruction W = 0x9A After Instruction If Skip: (2nd Cycle) Q1 Q2 NOP Example NOP HERE INCFSZ GOTO CONTINUE * * * Q3 Q4 NOP NOP W Z = = 0xBF 1 CNT, 1 LOOP Before Instruction PC = address HERE After Instruction CNT = if CNT= PC = if CNT PC = 1997 Microchip Technology Inc. CNT + 1 0, address CONTINUE 0, address HERE +1 DS30272A-page 77 PIC16C71X IORWF Inclusive OR W with f MOVLW Move Literal to W Syntax: [ label ] Syntax: [ label ] Operands: 0 f 127 d [0,1] Operands: 0 k 255 Operation: (W) .OR. (f) (dest) Operation: k (W) Status Affected: Z Status Affected: None Encoding: IORWF 00 f,d 0100 dfff ffff Description: Inclusive OR the W register with register 'f'. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is placed back in register 'f'. Words: 1 Cycles: 1 Q Cycle Activity: Example Encoding: 11 Q2 Q3 Q4 Decode Read register 'f' Process data Write to dest IORWF 00xx kkkk kkkk Description: The eight bit literal 'k' is loaded into W register. The don't cares will assemble as 0's. Words: 1 Cycles: 1 Q Cycle Activity: Q1 MOVLW k Example Q1 Q2 Q3 Q4 Decode Read literal 'k' Process data Write to W MOVLW 0x5A After Instruction RESULT, 0 W = 0x5A Before Instruction RESULT = W = 0x13 0x91 After Instruction RESULT = W = Z = MOVF 0x13 0x93 1 Move f MOVWF Move W to f Syntax: [ label ] MOVWF Syntax: [ label ] Operands: 0 f 127 d [0,1] Operands: 0 f 127 Operation: (W) (f) (f) (dest) Status Affected: None Z Encoding: Operation: Status Affected: Encoding: Description: 00 1 Cycles: 1 Example 1000 dfff ffff The contents of register f is moved to a destination dependant upon the status of d. If d = 0, destination is W register. If d = 1, the destination is file register f itself. d = 1 is useful to test a file register since status flag Z is affected. Words: Q Cycle Activity: MOVF f,d Q2 Q3 Q4 Decode Read register 'f' Process data Write to dest MOVF FSR, 0 0000 1fff ffff Description: Move data from W register to register 'f'. Words: 1 Cycles: 1 Q Cycle Activity: Example Q1 00 f Q1 Q2 Q3 Q4 Decode Read register 'f' Process data Write register 'f' MOVWF OPTION_REG Before Instruction OPTION = W = 0xFF 0x4F After Instruction OPTION = W = 0x4F 0x4F After Instruction W = value in FSR register Z =1 DS30272A-page 78 1997 Microchip Technology Inc. PIC16C71X NOP No Operation RETFIE Return from Interrupt Syntax: [ label ] Syntax: [ label ] Operands: None Operands: None Operation: No operation Operation: Status Affected: None TOS PC, 1 GIE Status Affected: None Encoding: 00 NOP 0000 0xx0 0000 RETFIE Description: No operation. Encoding: Words: 1 Description: Cycles: 1 Return from Interrupt. Stack is POPed and Top of Stack (TOS) is loaded in the PC. Interrupts are enabled by setting Global Interrupt Enable bit, GIE (INTCON<7>). This is a two cycle instruction. Words: 1 Cycles: 2 Q Cycle Activity: Example Q1 Q2 Q3 Q4 Decode NOP NOP NOP NOP Q Cycle Activity: 00 0000 0000 1001 Q1 Q2 Q3 Q4 1st Cycle Decode NOP Set the GIE bit Pop from the Stack 2nd Cycle NOP NOP NOP NOP Example RETFIE After Interrupt PC = GIE = OPTION Load Option Register Syntax: [ label ] Operands: None Operation: (W) OPTION TOS 1 OPTION Status Affected: None Encoding: 00 0000 0110 0010 Description: The contents of the W register are loaded in the OPTION register. This instruction is supported for code compatibility with PIC16C5X products. Since OPTION is a readable/writable register, the user can directly address it. Words: 1 Cycles: 1 Example To maintain upward compatibility with future PIC16CXX products, do not use this instruction. 1997 Microchip Technology Inc. DS30272A-page 79 PIC16C71X RETLW Return with Literal in W Syntax: [ label ] Syntax: [ label ] Operands: 0 k 255 Operands: None Operation: k (W); TOS PC Operation: TOS PC Status Affected: None Status Affected: None Encoding: RETLW k 01xx kkkk kkkk The W register is loaded with the eight bit literal 'k'. The program counter is loaded from the top of the stack (the return address). This is a two cycle instruction. Words: 1 Cycles: 2 Q Cycle Activity: Return from Subroutine Encoding: 11 Description: RETURN Q2 Q3 Q4 1st Cycle Decode Read literal 'k' NOP Write to W, Pop from the Stack 2nd Cycle NOP NOP NOP NOP 0000 CALL TABLE Words: 1 Cycles: 2 Q1 Q2 Q3 Q4 1st Cycle Decode NOP NOP Pop from the Stack 2nd Cycle NOP NOP NOP NOP Example RETURN After Interrupt TOS ;W contains table ;offset value ;W now has table value * * * TABLE ADDWF PC RETLW k1 RETLW k2 1000 Return from subroutine. The stack is POPed and the top of the stack (TOS) is loaded into the program counter. This is a two cycle instruction. PC = Example 0000 Description: Q Cycle Activity: Q1 00 RETURN ;W = offset ;Begin table ; * * * RETLW kn ; End of table Before Instruction W = 0x07 After Instruction W DS30272A-page 80 = value of k8 1997 Microchip Technology Inc. PIC16C71X RLF Rotate Left f through Carry Syntax: [ label ] Syntax: [ label ] Operands: 0 f 127 d [0,1] Operands: 0 f 127 d [0,1] Operation: See description below Operation: See description below Status Affected: C Status Affected: C Encoding: Description: RLF 00 RRF f,d 1101 dfff ffff The contents of register 'f' are rotated one bit to the left through the Carry Flag. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is stored back in register 'f'. C Rotate Right f through Carry Encoding: Description: 00 Register f C 1 Words: 1 Cycles: 1 Cycles: 1 Example Q1 Q2 Q3 Q4 Decode Read register 'f' Process data Write to dest RLF REG1,0 1997 Microchip Technology Inc. dfff ffff Register f Q1 Q2 Q3 Q4 Decode Read register 'f' Process data Write to dest RRF REG1,0 Before Instruction = = 1110 0110 0 = = = 1110 0110 1100 1100 1 After Instruction REG1 W C Q Cycle Activity: Example Before Instruction REG1 C 1100 The contents of register 'f' are rotated one bit to the right through the Carry Flag. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is placed back in register 'f'. Words: Q Cycle Activity: RRF f,d REG1 C = = 1110 0110 0 = = = 1110 0110 0111 0011 0 After Instruction REG1 W C DS30272A-page 81 PIC16C71X SLEEP SUBLW Subtract W from Literal Syntax: [ label ] SUBLW k Syntax: [ label ] Operands: None Operands: 0 k 255 Operation: 00h WDT, 0 WDT prescaler, 1 TO, 0 PD Operation: k - (W) (W) Status Affected: C, DC, Z Status Affected: SLEEP Encoding: Description: TO, PD Encoding: 00 0000 0110 0011 11 Words: 1 Cycles: 1 Words: 1 Example 1: Cycles: 1 Q Cycle Activity: Q Cycle Activity: kkkk kkkk The W register is subtracted (2's complement method) from the eight bit literal 'k'. The result is placed in the W register. The power-down status bit, PD is cleared. Time-out status bit, TO is set. Watchdog Timer and its prescaler are cleared. The processor is put into SLEEP mode with the oscillator stopped. See Section 8.8 for more details. Description: 110x Q1 Q2 Q3 Q4 Decode Read literal 'k' Process data Write to W SUBLW 0x02 Before Instruction Q1 Q2 Q3 Q4 Decode NOP NOP Go to Sleep W C Z = = = 1 ? ? After Instruction Example: SLEEP W C Z Example 2: = = = 1 1; result is positive 0 Before Instruction W C Z = = = 2 ? ? After Instruction W C Z Example 3: = = = 0 1; result is zero 1 Before Instruction W C Z = = = 3 ? ? After Instruction W = C = tive Z = DS30272A-page 82 0xFF 0; result is nega0 1997 Microchip Technology Inc. PIC16C71X SUBWF Subtract W from f SWAPF Swap Nibbles in f Syntax: [ label ] Syntax: [ label ] SWAPF f,d Operands: 0 f 127 d [0,1] Operands: 0 f 127 d [0,1] Operation: (f) - (W) (dest) Operation: (f<3:0>) (dest<7:4>), (f<7:4>) (dest<3:0>) Status Affected: None SUBWF f,d Status Affected: C, DC, Z Encoding: Description: 00 1 Cycles: 1 Example 1: dfff ffff Subtract (2's complement method) W register from register 'f'. If 'd' is 0 the result is stored in the W register. If 'd' is 1 the result is stored back in register 'f'. Words: Q Cycle Activity: 0010 Q1 Q2 Q3 Q4 Decode Read register 'f' Process data Write to dest SUBWF Encoding: 00 REG1 W C Z ffff Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register 'f' Process data Write to dest Example = = = = SWAPF REG, REG1 W C Z = = = = REG1 = = = = = = = = 2 2 ? ? = = = = 1997 Microchip Technology Inc. = = = = 0xA5 0x5A Load TRIS Register Syntax: [label] Operands: 5f7 Operation: (W) TRIS register f; TRIS f Status Affected: None 0 2 1; result is zero 1 1 2 ? ? After Instruction REG1 W C Z = = TRIS Encoding: 0xFF 2 0; result is negative 0 00 0000 0110 0fff Description: The instruction is supported for code compatibility with the PIC16C5X products. Since TRIS registers are readable and writable, the user can directly address them. Words: 1 Cycles: 1 Before Instruction REG1 W C Z 0xA5 1 2 1; result is positive 0 After Instruction REG1 W C Z = After Instruction REG1 W Before Instruction REG1 W C Z 0 Before Instruction 3 2 ? ? After Instruction Example 3: dfff The upper and lower nibbles of register 'f' are exchanged. If 'd' is 0 the result is placed in W register. If 'd' is 1 the result is placed in register 'f'. REG1,1 Before Instruction Example 2: 1110 Description: Example To maintain upward compatibility with future PIC16CXX products, do not use this instruction. DS30272A-page 83 PIC16C71X XORLW Exclusive OR Literal with W XORWF Exclusive OR W with f Syntax: [label] Syntax: [label] Operands: 0 k 255 Operands: Operation: (W) .XOR. k (W) 0 f 127 d [0,1] Status Affected: Z Operation: (W) .XOR. (f) (dest) Status Affected: Z Encoding: Description: 11 1 Cycles: 1 Example: 1010 kkkk kkkk The contents of the W register are XOR'ed with the eight bit literal 'k'. The result is placed in the W register. Words: Q Cycle Activity: XORLW k Q1 Q2 Q3 Q4 Decode Read literal 'k' Process data Write to W XORLW Encoding: 00 XORWF 0110 f,d dfff ffff Description: Exclusive OR the contents of the W register with register 'f'. If 'd' is 0 the result is stored in the W register. If 'd' is 1 the result is stored back in register 'f'. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register 'f' Process data Write to dest 0xAF Before Instruction W = 0xB5 = XORWF REG 1 Before Instruction After Instruction W Example 0x1A REG W = = 0xAF 0xB5 = = 0x1A 0xB5 After Instruction REG W DS30272A-page 84 1997 Microchip Technology Inc. PIC16C71X 10.0 DEVELOPMENT SUPPORT 10.1 Development Tools The PICmicr microcontrollers are supported with a full range of hardware and software development tools: * PICMASTER/PICMASTER CE Real-Time In-Circuit Emulator * ICEPIC Low-Cost PIC16C5X and PIC16CXXX In-Circuit Emulator * PRO MATE II Universal Programmer * PICSTART Plus Entry-Level Prototype Programmer * PICDEM-1 Low-Cost Demonstration Board * PICDEM-2 Low-Cost Demonstration Board * PICDEM-3 Low-Cost Demonstration Board * MPASM Assembler * MPLAB SIM Software Simulator * MPLAB-C (C Compiler) * Fuzzy Logic Development System (fuzzyTECH-MP) 10.2 PICMASTER: High Performance Universal In-Circuit Emulator with MPLAB IDE The PICMASTER Universal In-Circuit Emulator is intended to provide the product development engineer with a complete microcontroller design tool set for all microcontrollers in the PIC12CXXX, PIC14C000, PIC16C5X, PIC16CXXX and PIC17CXX families. PICMASTER is supplied with the MPLAB Integrated Development Environment (IDE), which allows editing, "make" and download, and source debugging from a single environment. Interchangeable target probes allow the system to be easily reconfigured for emulation of different processors. The universal architecture of the PICMASTER allows expansion to support all new Microchip microcontrollers. 10.3 ICEPIC: Low-Cost PIC16CXXX In-Circuit Emulator ICEPIC is a low-cost in-circuit emulator solution for the Microchip PIC16C5X and PIC16CXXX families of 8-bit OTP microcontrollers. ICEPIC is designed to operate on PC-compatible machines ranging from 286-AT through Pentium based machines under Windows 3.x environment. ICEPIC features real time, non-intrusive emulation. 10.4 PRO MATE II: Universal Programmer The PRO MATE II Universal Programmer is a full-featured programmer capable of operating in stand-alone mode as well as PC-hosted mode. The PRO MATE II has programmable VDD and VPP supplies which allows it to verify programmed memory at VDD min and VDD max for maximum reliability. It has an LCD display for displaying error messages, keys to enter commands and a modular detachable socket assembly to support various package types. In standalone mode the PRO MATE II can read, verify or program PIC12CXXX, PIC14C000, PIC16C5X, PIC16CXXX and PIC17CXX devices. It can also set configuration and code-protect bits in this mode. 10.5 PICSTART Plus Entry Level Development System The PICSTART programmer is an easy-to-use, lowcost prototype programmer. It connects to the PC via one of the COM (RS-232) ports. MPLAB Integrated Development Environment software makes using the programmer simple and efficient. PICSTART Plus is not recommended for production programming. PICSTART Plus supports all PIC12CXXX, PIC14C000, PIC16C5X, PIC16CXXX and PIC17CXX devices with up to 40 pins. Larger pin count devices such as the PIC16C923 and PIC16C924 may be supported with an adapter socket. The PICMASTER Emulator System has been designed as a real-time emulation system with advanced features that are generally found on more expensive development tools. The PC compatible 386 (and higher) machine platform and Microsoft Windows 3.x environment were chosen to best make these features available to you, the end user. A CE compliant version of PICMASTER is available for European Union (EU) countries. 1997 Microchip Technology Inc. DS30272A-page 85 PIC16C71X 10.6 PICDEM-1 Low-Cost PIC16/17 Demonstration Board The PICDEM-1 is a simple board which demonstrates the capabilities of several of Microchip's microcontrollers. The microcontrollers supported are: PIC16C5X (PIC16C54 to PIC16C58A), PIC16C61, PIC16C62X, PIC16C71, PIC16C8X, PIC17C42, PIC17C43 and PIC17C44. All necessary hardware and software is included to run basic demo programs. The users can program the sample microcontrollers provided with the PICDEM-1 board, on a PRO MATE II or PICSTART-Plus programmer, and easily test firmware. The user can also connect the PICDEM-1 board to the PICMASTER emulator and download the firmware to the emulator for testing. Additional prototype area is available for the user to build some additional hardware and connect it to the microcontroller socket(s). Some of the features include an RS-232 interface, a potentiometer for simulated analog input, push-button switches and eight LEDs connected to PORTB. 10.7 PICDEM-2 Low-Cost PIC16CXX Demonstration Board The PICDEM-2 is a simple demonstration board that supports the PIC16C62, PIC16C64, PIC16C65, PIC16C73 and PIC16C74 microcontrollers. All the necessary hardware and software is included to run the basic demonstration programs. The user can program the sample microcontrollers provided with the PICDEM-2 board, on a PRO MATE II programmer or PICSTART-Plus, and easily test firmware. The PICMASTER emulator may also be used with the PICDEM-2 board to test firmware. Additional prototype area has been provided to the user for adding additional hardware and connecting it to the microcontroller socket(s). Some of the features include a RS-232 interface, push-button switches, a potentiometer for simulated analog input, a Serial EEPROM to demonstrate usage of the I2C bus and separate headers for connection to an LCD module and a keypad. 10.8 PICDEM-3 Low-Cost PIC16CXXX Demonstration Board The PICDEM-3 is a simple demonstration board that supports the PIC16C923 and PIC16C924 in the PLCC package. It will also support future 44-pin PLCC microcontrollers with a LCD Module. All the necessary hardware and software is included to run the basic demonstration programs. The user can program the sample microcontrollers provided with the PICDEM-3 board, on a PRO MATE II programmer or PICSTART Plus with an adapter socket, and easily test firmware. The PICMASTER emulator may also be used with the PICDEM-3 board to test firmware. Additional prototype area has been provided to the user for adding hardware and connecting it to the microcontroller socket(s). Some of the features include DS30272A-page 86 an RS-232 interface, push-button switches, a potentiometer for simulated analog input, a thermistor and separate headers for connection to an external LCD module and a keypad. Also provided on the PICDEM-3 board is an LCD panel, with 4 commons and 12 segments, that is capable of displaying time, temperature and day of the week. The PICDEM-3 provides an additional RS-232 interface and Windows 3.1 software for showing the demultiplexed LCD signals on a PC. A simple serial interface allows the user to construct a hardware demultiplexer for the LCD signals. 10.9 MPLAB Integrated Development Environment Software The MPLAB IDE Software brings an ease of software development previously unseen in the 8-bit microcontroller market. MPLAB is a windows based application which contains: * A full featured editor * Three operating modes - editor - emulator - simulator * A project manager * Customizable tool bar and key mapping * A status bar with project information * Extensive on-line help MPLAB allows you to: * Edit your source files (either assembly or `C') * One touch assemble (or compile) and download to PIC16/17 tools (automatically updates all project information) * Debug using: - source files - absolute listing file * Transfer data dynamically via DDE (soon to be replaced by OLE) * Run up to four emulators on the same PC The ability to use MPLAB with Microchip's simulator allows a consistent platform and the ability to easily switch from the low cost simulator to the full featured emulator with minimal retraining due to development tools. 10.10 Assembler (MPASM) The MPASM Universal Macro Assembler is a PChosted symbolic assembler. It supports all microcontroller series including the PIC12C5XX, PIC14000, PIC16C5X, PIC16CXXX, and PIC17CXX families. MPASM offers full featured Macro capabilities, conditional assembly, and several source and listing formats. It generates various object code formats to support Microchip's development tools as well as third party programmers. MPASM allows full symbolic debugging from PICMASTER, Microchip's Universal Emulator System. 1997 Microchip Technology Inc. PIC16C71X MPASM has the following features to assist in developing software for specific use applications. * Provides translation of Assembler source code to object code for all Microchip microcontrollers. * Macro assembly capability. * Produces all the files (Object, Listing, Symbol, and special) required for symbolic debug with Microchip's emulator systems. * Supports Hex (default), Decimal and Octal source and listing formats. MPASM provides a rich directive language to support programming of the PIC16/17. Directives are helpful in making the development of your assemble source code shorter and more maintainable. 10.11 Software Simulator (MPLAB-SIM) The MPLAB-SIM Software Simulator allows code development in a PC host environment. It allows the user to simulate the PIC16/17 series microcontrollers on an instruction level. On any given instruction, the user may examine or modify any of the data areas or provide external stimulus to any of the pins. The input/ output radix can be set by the user and the execution can be performed in; single step, execute until break, or in a trace mode. MPLAB-SIM fully supports symbolic debugging using MPLAB-C and MPASM. The Software Simulator offers the low cost flexibility to develop and debug code outside of the laboratory environment making it an excellent multi-project software development tool. 10.12 C Compiler (MPLAB-C) 10.14 MP-DriveWay - Application Code Generator MP-DriveWay is an easy-to-use Windows-based Application Code Generator. With MP-DriveWay you can visually configure all the peripherals in a PIC16/17 device and, with a click of the mouse, generate all the initialization and many functional code modules in C language. The output is fully compatible with Microchip's MPLAB-C C compiler. The code produced is highly modular and allows easy integration of your own code. MP-DriveWay is intelligent enough to maintain your code through subsequent code generation. 10.15 SEEVAL Evaluation and Programming System The SEEVAL SEEPROM Designer's Kit supports all Microchip 2-wire and 3-wire Serial EEPROMs. The kit includes everything necessary to read, write, erase or program special features of any Microchip SEEPROM product including Smart Serials and secure serials. The Total Endurance Disk is included to aid in tradeoff analysis and reliability calculations. The total kit can significantly reduce time-to-market and result in an optimized system. 10.16 KEELOQ Evaluation and Programming Tools KEELOQ evaluation and programming tools support Microchips HCS Secure Data Products. The HCS evaluation kit includes an LCD display to show changing codes, a decoder to decode transmissions, and a programming interface to program test transmitters. The MPLAB-C Code Development System is a complete `C' compiler and integrated development environment for Microchip's PIC16/17 family of microcontrollers. The compiler provides powerful integration capabilities and ease of use not found with other compilers. For easier source level debugging, the compiler provides symbol information that is compatible with the MPLAB IDE memory display. 10.13 Fuzzy Logic Development System (fuzzyTECH-MP) fuzzyTECH-MP fuzzy logic development tool is available in two versions - a low cost introductory version, MP Explorer, for designers to gain a comprehensive working knowledge of fuzzy logic system design; and a full-featured version, fuzzyTECH-MP, edition for implementing more complex systems. Both versions include Microchip's fuzzyLAB demonstration board for hands-on experience with fuzzy logic systems implementation. 1997 Microchip Technology Inc. DS30272A-page 87 Emulator Products Software Tools DS30272A-page 88 Programmers KEELOQ Evaluation Kit PICDEM-3 PICDEM-2 PICDEM-1 SEEVAL Designers Kit KEELOQ Programmer PRO MATE II Universal Programmer PICSTART Plus Low-Cost Universal Dev. Kit PICSTART Lite Ultra Low-Cost Dev. Kit Total Endurance Software Model fuzzyTECH-MP Explorer/Edition Fuzzy Logic Dev. Tool MP-DriveWay Applications Code Generator MPLAB C Compiler MPLAB Integrated Development Environment ICEPIC Low-Cost In-Circuit Emulator PICMASTER/ PICMASTER-CE In-Circuit Emulator PIC14000 PIC16C5X PIC16CXXX PIC16C6X PIC16C7XX PIC16C8X PIC16C9XX PIC17C4X Available 3Q97 PIC17C75X 24CXX 25CXX 93CXX HCS200 HCS300 HCS301 TABLE 10-1: Demo Boards PIC12C5XX PIC16C71X DEVELOPMENT TOOLS FROM MICROCHIP 1997 Microchip Technology Inc. PIC16C71X Applicable Devices 11.0 710 71 711 715 ELECTRICAL CHARACTERISTICS FOR PIC16C710 AND PIC16C711 Absolute Maximum Ratings Ambient temperature under bias................................................................................................................. -55 to +125C Storage temperature .............................................................................................................................. -65C to +150C Voltage on any pin with respect to VSS (except VDD, MCLR, and RA4).......................................... -0.3V to (VDD + 0.3V) Voltage on VDD with respect to VSS ........................................................................................................... -0.3 to +7.5V Voltage on MCLR with respect to VSS................................................................................................................0 to +14V Voltage on RA4 with respect to Vss ...................................................................................................................0 to +14V Total power dissipation (Note 1)................................................................................................................................1.0W Maximum current out of VSS pin ...........................................................................................................................300 mA Maximum current into VDD pin ..............................................................................................................................250 mA Input clamp current, IIK (VI < 0 or VI > VDD)..................................................................................................................... 20 mA Output clamp current, IOK (VO < 0 or VO > VDD) ............................................................................................................. 20 mA Maximum output current sunk by any I/O pin..........................................................................................................25 mA Maximum output current sourced by any I/O pin ....................................................................................................25 mA Maximum current sunk by PORTA ........................................................................................................................200 mA Maximum current sourced by PORTA ...................................................................................................................200 mA Maximum current sunk by PORTB........................................................................................................................200 mA Maximum current sourced by PORTB...................................................................................................................200 mA Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD - IOH} + {(VDD - VOH) x IOH} + (VOl x IOL) NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 11-1: OSC RC XT HS LP CROSS REFERENCE OF DEVICE SPECS FOR OSCILLATOR CONFIGURATIONS AND FREQUENCIES OF OPERATION (COMMERCIAL DEVICES) PIC16C710-04 PIC16C711-04 VDD: 4.0V to 6.0V IDD: 5 mA max. at 5.5V IPD: 21 A max. at 4V Freq:4 MHz max. VDD: 4.0V to 6.0V IDD: 5 mA max. at 5.5V IPD: 21 A max. at 4V Freq: 4 MHz max. VDD: 4.5V to 5.5V IDD: 13.5 mA typ. at 5.5V IPD: 1.5 A typ. at 4.5V Freq: 4 MHz max. VDD: 4.0V to 6.0V IDD: 52.5 A typ. at 32 kHz, 4.0V IPD: 0.9 A typ. at 4.0V Freq: 200 kHz max. PIC16C710-10 PIC16C711-10 VDD: 4.5V to 5.5V IDD: 2.7 mA typ. at 5.5V IPD: 1.5 A typ. at 4V Freq: 4 MHz max. VDD: 4.5V to 5.5V IDD: 2.7 mA typ. at 5.5V IPD: 1.5 A typ. at 4V Freq: 4 MHz max. VDD: 4.5V to 5.5V IDD: 30 mA max. at 5.5V IPD: 1.5 A typ. at 4.5V Freq: 10 MHz max. PIC16C710-20 PIC16C711-20 VDD: 4.5V to 5.5V IDD: 2.7 mA typ. at 5.5V IPD: 1.5 A typ. at 4V Freq: 4 MHz max. VDD: 4.5V to 5.5V IDD: 2.7 mA typ. at 5.5V IPD: 1.5 A typ. at 4V Freq: 4 MHz max. VDD: 4.5V to 5.5V IDD: 30 mA max. at 5.5V IPD: 1.5 A typ. at 4.5V Freq:20 MHz max. Not recommended for use in LP mode Not recommended for use in LP mode 1997 Microchip Technology Inc. PIC16LC710-04 PIC16LC711-04 VDD: 2.5V to 6.0V IDD: 3.8 mA typ. at 3.0V IPD: 5.0 A typ. at 3V Freq: 4 MHz max. VDD: 2.5V to 6.0V IDD: 3.8 mA typ. at 3.0V IPD: 5.0 A typ. at 3V Freq: 4 MHz max. PIC16C710/JW PIC16C711/JW VDD: 4.0V to 6.0V IDD: 5 mA max. at 5.5V IPD: 21 A max. at 4V Freq:4 MHz max. VDD: 4.0V to 6.0V IDD: 5 mA max. at 5.5V IPD: 21 A max. at 4V Freq: 4 MHz max. VDD: 4.5V to 5.5V IDD: 30 mA max. at Not recommended for 5.5V use in HS mode IPD: 1.5 A typ. at 4.5V Freq: 10 MHz max. VDD: 2.5V to 6.0V VDD: 2.5V to 6.0V IDD: 48 A max. at IDD: 48 A max. at 32 kHz, 3.0V 32 kHz, 3.0V IPD: 5.0 A max. at 3.0V IPD: 5.0 A max. at Freq: 200 kHz max. 3.0V Freq: 200 kHz max. DS30272A-page 89 PIC16C71X Applicable Devices 11.1 710 71 711 715 DC Characteristics: PIC16C710-04 (Commercial, Industrial, Extended) PIC16C711-04 (Commercial, Industrial, Extended) PIC16C710-10 (Commercial, Industrial, Extended) PIC16C711-10 (Commercial, Industrial, Extended) PIC16C710-20 (Commercial, Industrial, Extended) PIC16C711-20 (Commercial, Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) DC CHARACTERISTICS Param. No. Characteristic Sym Min Typ Max Units Conditions D001 D001A Supply Voltage VDD 4.0 4.5 - 6.0 5.5 V V D002* RAM Data Retention Voltage (Note 1) VDR - 1.5 - V D003 VDD start voltage to ensure internal Poweron Reset signal VPOR - VSS - V D004* VDD rise rate to ensure internal Power-on Reset signal SVDD 0.05 - - D005 Brown-out Reset Voltage BVDD 3.7 4.0 4.3 3.7 4.0 4.4 V D010 Supply Current (Note 2) IDD - 2.7 5 mA XT, RC osc configuration FOSC = 4 MHz, VDD = 5.5V (Note 4) - 13.5 30 mA HS osc configuration FOSC = 20 MHz, VDD = 5.5V D013 XT, RC and LP osc configuration HS osc configuration See section on Power-on Reset for details V/ms See section on Power-on Reset for details V BODEN configuration bit is enabled Extended Range Only D015 Brown-out Reset Current IBOR (Note 5) - 300* 500 A BOR enabled VDD = 5.0V D020 D021 D021A D021B Power-down Current (Note 3) - 10.5 1.5 1.5 1.5 42 21 24 30 A A A A VDD = 4.0V, WDT enabled, -40C to +85C VDD = 4.0V, WDT disabled, -0C to +70C VDD = 4.0V, WDT disabled, -40C to +85C VDD = 4.0V, WDT disabled, -40C to +125C D023 Brown-out Reset Current IBOR (Note 5) - 300* 500 A BOR enabled VDD = 5.0V * Note 1: 2: 3: 4: 5: IPD These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. This is the limit to which VDD can be lowered without losing RAM data. The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD MCLR = VDD; WDT enabled/disabled as specified. The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS. For RC osc configuration, current through Rext is not included. The current through the resistor can be estimated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm. The current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD or IPD measurement. DS30272A-page 90 1997 Microchip Technology Inc. PIC16C71X Applicable Devices 11.2 DC Characteristics: PIC16LC710-04 (Commercial, Industrial, Extended) PIC16LC711-04 (Commercial, Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) DC CHARACTERISTICS Param No. D001 710 71 711 715 Characteristic Sym Min Typ Max Units Supply Voltage Commercial/Industrial Extended VDD VDD 2.5 3.0 - 6.0 6.0 V V Conditions LP, XT, RC osc configuration (DC - 4 MHz) LP, XT, RC osc configuration (DC - 4 MHz) D002* RAM Data Retention Voltage (Note 1) VDR - 1.5 - V D003 VDD start voltage to ensure internal Poweron Reset signal VPOR - VSS - V D004* VDD rise rate to ensure internal Power-on Reset signal SVDD 0.05 - - D005 Brown-out Reset Voltage BVDD 3.7 4.0 4.3 V BODEN configuration bit is enabled D010 Supply Current (Note 2) IDD - 2.0 3.8 mA XT, RC osc configuration FOSC = 4 MHz, VDD = 3.0V (Note 4) - 22.5 48 A IBOR - 300* 500 A LP osc configuration FOSC = 32 kHz, VDD = 3.0V, WDT disabled BOR enabled VDD = 5.0V IPD - 7.5 0.9 0.9 0.9 300* 30 5 5 10 500 A A A A A VDD = 3.0V, WDT enabled, -40C to +85C VDD = 3.0V, WDT disabled, 0C to +70C VDD = 3.0V, WDT disabled, -40C to +85C VDD = 3.0V, WDT disabled, -40C to +125C BOR enabled VDD = 5.0V D010A D015 Brown-out Reset Current (Note 5) D020 D021 D021A D021B D023 Power-down Current (Note 3) * Note 1: 2: 3: 4: 5: Brown-out Reset Current (Note 5) IBOR See section on Power-on Reset for details V/ms See section on Power-on Reset for details These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. This is the limit to which VDD can be lowered without losing RAM data. The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD MCLR = VDD; WDT enabled/disabled as specified. The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS. For RC osc configuration, current through Rext is not included. The current through the resistor can be estimated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm. The current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD or IPD measurement. 1997 Microchip Technology Inc. DS30272A-page 91 PIC16C71X Applicable Devices 11.3 710 71 711 715 DC Characteristics: PIC16C710-04 (Commercial, Industrial, Extended) PIC16C711-04 (Commercial, Industrial, Extended) PIC16C710-10 (Commercial, Industrial, Extended) PIC16C711-10 (Commercial, Industrial, Extended) PIC16C710-20 (Commercial, Industrial, Extended) PIC16C711-20 (Commercial, Industrial, Extended) PIC16LC710-04 (Commercial, Industrial, Extended) PIC16LC711-04 (Commercial, Industrial, Extended) DC CHARACTERISTICS Param No. D030 D030A D031 D032 D033 D040 D040A D041 D042 D042A D043 D070 Characteristic Input Low Voltage I/O ports with TTL buffer with Schmitt Trigger buffer MCLR, OSC1 (in RC mode) OSC1 (in XT, HS and LP) Input High Voltage I/O ports with TTL buffer D060 with Schmitt Trigger buffer MCLR, RB0/INT OSC1 (XT, HS and LP) OSC1 (in RC mode) PORTB weak pull-up current Input Leakage Current (Notes 2, 3) I/O ports D061 D063 MCLR, RA4/T0CKI OSC1 Standard Operating Conditions (unless otherwise stated) Operating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating voltage VDD range as described in DC spec Section 11.1 and Section 11.2. Sym Min Typ Max Units Conditions VIL VSS VSS VSS VSS - 0.15VDD 0.8V - 0.2VDD - 0.2VDD V V V V For entire VDD range 4.5 VDD 5.5V VSS - 0.3VDD V Note1 VDD VDD V V 4.5 VDD 5.5V For entire VDD range VDD VDD VDD VDD 400 V For entire VDD range V V Note1 V A VDD = 5V, VPIN = VSS VIH 2.0 0.25VDD + 0.8V 0.8VDD 0.8VDD 0.7VDD 0.9VDD IPURB 50 250 IIL - - 1 - - 5 5 A Vss VPIN VDD, Pin at hiimpedance A Vss VPIN VDD A Vss VPIN VDD, XT, HS and LP osc configuration * These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC16C7X be driven with external clock in RC mode. 2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Negative current is defined as current sourced by the pin. DS30272A-page 92 1997 Microchip Technology Inc. PIC16C71X Applicable Devices DC CHARACTERISTICS Param No. Characteristic Output Low Voltage I/O ports D080 Standard Operating Conditions (unless otherwise stated) Operating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating voltage VDD range as described in DC spec Section 11.1 and Section 11.2. Sym Min Typ Max Units Conditions VOL - - 0.6 V - - 0.6 V - - 0.6 V - - 0.6 V VOH VDD - 0.7 - - V VDD - 0.7 - - V VDD - 0.7 - - V VDD - 0.7 - - V D080A D083 OSC2/CLKOUT (RC osc config) D083A Output High Voltage I/O ports (Note 3) D090 D090A D092 OSC2/CLKOUT (RC osc config) D092A D130* D100 Open-Drain High Voltage Capacitive Loading Specs on Output Pins OSC2 pin 710 71 711 715 VOD - - 14 V COSC2 - - 15 pF IOL = 8.5 mA, VDD = 4.5V, -40C to +85C IOL = 7.0 mA, VDD = 4.5V, -40C to +125C IOL = 1.6 mA, VDD = 4.5V, -40C to +85C IOL = 1.2 mA, VDD = 4.5V, -40C to +125C IOH = -3.0 mA, VDD = 4.5V, -40C to +85C IOH = -2.5 mA, VDD = 4.5V, -40C to +125C IOH = -1.3 mA, VDD = 4.5V, -40C to +85C IOH = -1.0 mA, VDD = 4.5V, -40C to +125C RA4 pin In XT, HS and LP modes when external clock is used to drive OSC1. D101 All I/O pins and OSC2 (in RC mode) CIO 50 pF These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC16C7X be driven with external clock in RC mode. 2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Negative current is defined as current sourced by the pin. * 1997 Microchip Technology Inc. DS30272A-page 93 PIC16C71X Applicable Devices 11.4 710 71 711 715 Timing Parameter Symbology The timing parameter symbols have been created following one of the following formats: 1. TppS2ppS 2. TppS T F Frequency Lowercase letters (pp) and their meanings: pp cc CCP1 ck CLKOUT cs CS di SDI do SDO dt Data in io I/O port mc MCLR Uppercase letters and their meanings: S F Fall H High I Invalid (Hi-impedance) L Low T Time osc rd rw sc ss t0 t1 wr OSC1 RD RD or WR SCK SS T0CKI T1CKI WR P R V Z Period Rise Valid Hi-impedance FIGURE 11-1: LOAD CONDITIONS Load condition 2 Load condition 1 VDD/2 RL CL Pin VSS CL Pin VSS RL = 464 CL = 50 pF 15 pF DS30272A-page 94 for all pins except OSC2 for OSC2 output 1997 Microchip Technology Inc. PIC16C71X Applicable Devices 11.5 710 71 711 715 Timing Diagrams and Specifications FIGURE 11-2: EXTERNAL CLOCK TIMING Q4 Q1 Q2 Q3 Q4 Q1 OSC1 1 3 3 4 4 2 CLKOUT TABLE 11-2: Parameter No. EXTERNAL CLOCK TIMING REQUIREMENTS Sym Characteristic Fosc External CLKIN Frequency (Note 1) Min Typ Max Units Conditions DC -- 4 MHz XT osc mode DC -- 4 MHz HS osc mode (-04) DC -- 10 MHz HS osc mode (-10) DC -- 20 MHz HS osc mode (-20) DC -- 200 kHz LP osc mode Oscillator Frequency DC -- 4 MHz RC osc mode (Note 1) 0.1 -- 4 MHz XT osc mode 4 -- 20 MHz HS osc mode 5 -- 200 kHz LP osc mode 1 Tosc External CLKIN Period 250 -- -- ns XT osc mode (Note 1) 250 -- -- ns HS osc mode (-04) 100 -- -- ns HS osc mode (-10) 50 -- -- ns HS osc mode (-20) 5 -- -- s LP osc mode Oscillator Period 250 -- -- ns RC osc mode (Note 1) 250 -- 10,000 ns XT osc mode 250 -- 250 ns HS osc mode (-04) 100 -- 250 ns HS osc mode (-10) 50 -- 250 ns HS osc mode (-20) 5 -- -- s LP osc mode -- DC ns TCY = 4/FOSC 2 TCY Instruction Cycle Time (Note 1) 200 3 TosL, External Clock in (OSC1) High 50 -- -- ns XT oscillator TosH or Low Time 2.5 -- -- s LP oscillator 10 -- -- ns HS oscillator 4 TosR, External Clock in (OSC1) Rise -- -- 25 ns XT oscillator TosF or Fall Time -- -- 50 ns LP oscillator -- -- 15 ns HS oscillator Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Instruction cycle period (TCY) equals four times the input oscillator time-base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at "min." values with an external clock applied to the OSC1/CLKIN pin. When an external clock input is used, the "Max." cycle time limit is "DC" (no clock) for all devices. OSC2 is disconnected (has no loading) for the PIC16C710/711. 1997 Microchip Technology Inc. DS30272A-page 95 PIC16C71X Applicable Devices 710 71 711 715 FIGURE 11-3: CLKOUT AND I/O TIMING Q1 Q4 Q2 Q3 OSC1 11 10 CLKOUT 13 19 14 12 18 16 I/O Pin (input) 15 17 I/O Pin (output) new value old value 20, 21 Note: Refer to Figure 11-1 for load conditions. TABLE 11-3: CLKOUT AND I/O TIMING REQUIREMENTS Parameter Sym No. Characteristic Min Typ Max Units Conditions 10* TosH2ckL OSC1 to CLKOUT -- 15 30 ns Note 1 11* TosH2ckH OSC1 to CLKOUT -- 15 30 ns Note 1 12* TckR CLKOUT rise time -- 5 15 ns Note 1 13* TckF CLKOUT fall time -- 5 15 ns Note 1 14* TckL2ioV CLKOUT to Port out valid 15* TioV2ckH Port in valid before CLKOUT 16* TckH2ioI 17* TosH2ioV 18* TosH2ioI 19* 20* 21* -- -- 0.5TCY + 20 ns Note 1 0.25TCY + 25 -- -- ns Note 1 Port in hold after CLKOUT 0 -- -- ns Note 1 OSC1 (Q1 cycle) to Port out valid -- -- 80 - 100 ns OSC1 (Q2 cycle) to Port input invalid (I/O in hold time) TBD -- -- ns TioV2osH Port input valid to OSC1 (I/O in setup time) TBD -- -- ns TioR Port output rise time PIC16C710/711 -- 10 25 ns PIC16LC710/711 -- -- 60 ns PIC16C710/711 -- 10 25 ns PIC16LC710/711 -- -- 60 ns TioF Port output fall time 22* Tinp INT pin high or low time 20 -- -- ns 23* Trbp RB7:RB4 change INT high or low time 20 -- -- ns * These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. These parameters are asynchronous events not related to any internal clock edges. Note 1: Measurements are taken in RC Mode where CLKOUT output is 4 x TOSC. DS30272A-page 96 1997 Microchip Technology Inc. PIC16C71X Applicable Devices 710 71 711 715 FIGURE 11-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING VDD MCLR 30 Internal POR 33 PWRT Time-out 32 OSC Time-out Internal RESET Watchdog Timer RESET 31 34 34 I/O Pins Note: Refer to Figure 11-1 for load conditions. FIGURE 11-5: BROWN-OUT RESET TIMING BVDD VDD 35 TABLE 11-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER, AND BROWN-OUT RESET REQUIREMENTS Parameter No. Sym Characteristic 30 TmcL MCLR Pulse Width (low) 1 -- -- s VDD = 5V, -40C to +125C 31 Twdt Watchdog Timer Time-out Period (No Prescaler) 7* 18 33* ms VDD = 5V, -40C to +125C Oscillation Start-up Timer Period -- 1024TOSC -- -- TOSC = OSC1 period Power up Timer Period 28* 72 132* ms VDD = 5V, -40C to +125C -- -- 1.1 s 100 -- -- s 32 Tost 33 Tpwrt 34 TIOZ I/O Hi-impedance from MCLR Low or Watchdog Timer Reset 35 TBOR Brown-out Reset pulse width * Min Typ Max Units Conditions 3.8V VDD 4.2V These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 1997 Microchip Technology Inc. DS30272A-page 97 PIC16C71X Applicable Devices 710 71 711 715 FIGURE 11-6: TIMER0 EXTERNAL CLOCK TIMINGS RA4/T0CKI 41 40 42 TMR0 Note: Refer to Figure 11-1 for load conditions. TABLE 11-5: TIMER0 EXTERNAL CLOCK REQUIREMENTS Param No. Sym Characteristic 40 Tt0H T0CKI High Pulse Width 41 Tt0L T0CKI Low Pulse Width Min No Prescaler With Prescaler No Prescaler With Prescaler 42 Tt0P 48 T0CKI Period Tcke2tmrI Delay from external clock edge to timer increment * 0.5TCY + 20* Typ Max Units Conditions -- -- ns 10* -- -- ns 0.5TCY + 20* -- -- ns 10* -- -- ns Greater of: 20 ns or TCY + 40* N -- -- ns 2Tosc -- 7Tosc -- Must also meet parameter 42 Must also meet parameter 42 N = prescale value (2, 4,..., 256) These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. DS30272A-page 98 1997 Microchip Technology Inc. PIC16C71X Applicable Devices TABLE 11-6: A/D CONVERTER CHARACTERISTICS: PIC16C710/711-04 (COMMERCIAL, INDUSTRIAL, EXTENDED) PIC16C710/711-10 (COMMERCIAL, INDUSTRIAL, EXTENDED) PIC16C710/711-20 (COMMERCIAL, INDUSTRIAL, EXTENDED) PIC16LC710/711-04 (COMMERCIAL, INDUSTRIAL, EXTENDED) Param Sym Characteristic No. A01 NR A02 710 71 711 715 Resolution EABS Absolute error Min Typ Max Units bit Conditions VREF = VDD, VSS AIN VREF -- -- 8-bits -- -- <1 LSb VREF = VDD, VSS AIN VREF A03 EIL -- -- <1 LSb VREF = VDD, VSS AIN VREF A04 EDL Differential linearity error -- -- <1 LSb VREF = VDD, VSS AIN VREF A05 EFS Full scale error -- -- <1 LSb VREF = VDD, VSS AIN VREF A06 EOFF Offset error -- -- <1 LSb VREF = VDD, VSS AIN VREF A10 -- Integral linearity error VSS VAIN VREF Monotonicity -- guaranteed -- -- A20 VREF Reference voltage 2.5V -- VDD + 0.3 V A25 VAIN Analog input voltage VSS - 0.3 -- VREF + 0.3 V A30 ZAIN Recommended impedance of analog voltage source -- -- 10.0 k A40 IAD -- 180 -- A Average current consumption when A/D is on. (Note 1) A50 IREF VREF input current (Note 2) 10 -- 1000 A -- -- 10 A During VAIN acquisition. Based on differential of VHOLD to VAIN. To charge CHOLD see Section 7.1. During A/D Conversion cycle A/D conversion current (VDD) * These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: When A/D is off, it will not consume any current other than minor leakage current. The power-down current spec includes any such leakage from the A/D module. 2: VREF current is from RA3 pin or VDD pin, whichever is selected as reference input. 1997 Microchip Technology Inc. DS30272A-page 99 PIC16C71X Applicable Devices 710 71 711 715 FIGURE 11-7: A/D CONVERSION TIMING BSF ADCON0, GO 1 Tcy (TOSC/2) (1) 131 Q4 130 132 A/D CLK 7 A/D DATA 6 5 4 3 2 1 NEW_DATA OLD_DATA ADRES 0 ADIF GO DONE SAMPLING STOPPED SAMPLE Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. TABLE 11-7: Param No. 130 A/D CONVERSION REQUIREMENTS Sym Characteristic TAD A/D clock period Units Conditions 1.6 -- -- s TOSC based, VREF 3.0V 2.0 -- -- s TOSC based, VREF full range PIC16C710/711 2.0* 4.0 6.0 s A/D RC mode PIC16LC710/711 3.0* 6.0 9.0 s A/D RC mode -- 9.5 -- TAD Note 2 20 -- s 5* -- -- s The minimum time is the amplifier settling time. This may be used if the "new" input voltage has not changed by more than 1 LSb (i.e., 19.5 mV @ 5.12V) from the last sampled voltage (as stated on CHOLD). -- TOSC/2 -- -- If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. 1.5 -- -- TAD 132 TACQ Acquisition time Q4 to AD clock start TSWC Switching from convert sample time 135 Max PIC16C710/711 TCNV Conversion time (not including S/H time). (Note 1) TGO Typ PIC16LC710/711 131 134 Min * These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. This specification ensured by design. Note 1: ADRES register may be read on the following TCY cycle. 2: See Section 7.1 for min conditions. DS30272A-page 100 1997 Microchip Technology Inc. PIC16C71X Applicable Devices 12.0 710 71 711 715 DC AND AC CHARACTERISTICS GRAPHS AND TABLES FOR PIC16C710 AND PIC16C711 The graphs and tables provided in this section are for design guidance and are not tested or guaranteed. In some graphs or tables the data presented are outside specified operating range (i.e., outside specified VDD range). This is for information only and devices are guaranteed to operate properly only within the specified range. Note: The data presented in this section is a statistical summary of data collected on units from different lots over a period of time and matrix samples. 'Typical' represents the mean of the distribution at, 25C, while 'max' or 'min' represents (mean +3) and (mean -3) respectively where is standard deviation. FIGURE 12-1: TYPICAL IPD vs. VDD (WDT DISABLED, RC MODE) 35 30 IPD(nA) 25 20 15 10 5 0 2.5 3.0 3.5 4.0 4.5 VDD(Volts) 5.0 5.5 6.0 FIGURE 12-2: MAXIMUM IPD vs. VDD (WDT DISABLED, RC MODE) 10.000 85C 70C IPD(A) 1.000 25C 0.100 0C -40C 0.010 0.001 2.5 1997 Microchip Technology Inc. 3.0 3.5 4.0 4.5 VDD(Volts) 5.0 5.5 6.0 DS30272A-page 101 PIC16C71X Applicable Devices 710 71 711 715 FIGURE 12-3: TYPICAL IPD vs. VDD @ 25C (WDT ENABLED, RC MODE) FIGURE 12-5: TYPICAL RC OSCILLATOR FREQUENCY vs. VDD Cext = 22 pF, T = 25C 6.0 25 5.5 5.0 4.5 Fosc(MHz) IPD(A) 20 15 10 R = 5k 4.0 3.5 3.0 R = 10k 2.5 2.0 5 1.5 1.0 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0.0 2.5 VDD(Volts) FIGURE 12-4: MAXIMUM IPD vs. VDD (WDT ENABLED, RC MODE) 35 3.0 3.5 4.0 4.5 VDD(Volts) 5.0 6.0 Shaded area is beyond recommended range. 0C Cext = 100 pF, T = 25C 2.4 2.2 25 R = 3.3k 2.0 20 1.8 70C Fosc(MHz) IPD(A) 5.5 FIGURE 12-6: TYPICAL RC OSCILLATOR FREQUENCY vs. VDD -40C 30 R = 100k 0.5 6.0 15 85C 10 5 1.6 R = 5k 1.4 1.2 1.0 R = 10k 0.8 0.6 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0.4 6.0 R = 100k 0.2 VDD(Volts) 0.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(Volts) FIGURE 12-7: TYPICAL RC OSCILLATOR FREQUENCY vs. VDD Cext = 300 pF, T = 25C 1000 900 Fosc(kHz) 800 R = 3.3k 700 600 R = 5k 500 400 R = 10k 300 200 R = 100k 100 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(Volts) DS30272A-page 102 1997 Microchip Technology Inc. PIC16C71X Applicable Devices FIGURE 12-8: TYPICAL IPD vs. VDD BROWNOUT DETECT ENABLED (RC MODE) 710 71 711 715 FIGURE 12-10: TYPICAL IPD vs. TIMER1 ENABLED (32 kHz, RC0/RC1 = 33 pF/33 pF, RC MODE) 1400 1200 30 25 Device NOT in Brown-out Reset 800 20 600 400 200 0 2.5 IPD(A) IPD(A) 1000 Device in Brown-out Reset 15 10 3.0 3.5 4.0 4.5 VDD(Volts) 5.0 5.5 5 6.0 0 2.5 The shaded region represents the built-in hysteresis of the brown-out reset circuitry. FIGURE 12-9: MAXIMUM IPD vs. VDD BROWN-OUT DETECT ENABLED (85C TO -40C, RC MODE) 3.0 3.5 4.0 4.5 VDD(Volts) 5.0 5.5 6.0 FIGURE 12-11: MAXIMUM IPD vs. TIMER1 ENABLED (32 kHz, RC0/RC1 = 33 pF/33 pF, 85C TO -40C, RC MODE) 1600 1400 1200 45 40 Device NOT in Brown-out Reset 800 35 30 600 400 Device in Brown-out Reset IPD(A) IPD(A) 1000 20 15 200 4.3 0 2.5 25 3.0 3.5 4.0 4.5 VDD(Volts) 10 5.0 5.5 6.0 The shaded region represents the built-in hysteresis of the brown-out reset circuitry. 1997 Microchip Technology Inc. 5 0 2.5 3.0 3.5 4.0 4.5 VDD(Volts) 5.0 5.5 6.0 DS30272A-page 103 PIC16C71X Applicable Devices 710 71 711 715 FIGURE 12-12: TYPICAL IDD vs. FREQUENCY (RC MODE @ 22 pF, 25C) 2000 6.0V 1800 5.5V 5.0V 1600 4.5V IDD(A) 1400 4.0V 1200 3.5V 1000 3.0V 800 2.5V 600 400 200 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Frequency(MHz) 3.5 4.0 4.5 Shaded area is beyond recommended range FIGURE 12-13: MAXIMUM IDD vs. FREQUENCY (RC MODE @ 22 pF, -40C TO 85C) 2000 6.0V 1800 5.5V 5.0V 1600 4.5V IDD(A) 1400 4.0V 1200 3.5V 1000 3.0V 800 2.5V 600 400 200 0 0.0 0.5 1.0 1.5 2.0 2.5 Frequency(MHz) DS30272A-page 104 3.0 3.5 4.0 4.5 Shaded area is beyond recommended range 1997 Microchip Technology Inc. PIC16C71X Applicable Devices 710 71 711 715 FIGURE 12-14: TYPICAL IDD vs. FREQUENCY (RC MODE @ 100 pF, 25C) 1600 6.0V 1400 5.5V 5.0V 1200 4.5V 4.0V 1000 IDD(A) 3.5V 3.0V 800 2.5V 600 400 200 0 0 200 400 Shaded area is beyond recommended range 600 800 1000 1200 1400 1600 1800 Frequency(kHz) FIGURE 12-15: MAXIMUM IDD vs. FREQUENCY (RC MODE @ 100 pF, -40C TO 85C) 1600 6.0V 1400 5.5V 5.0V 1200 4.5V 4.0V 1000 IDD(A) 3.5V 3.0V 800 2.5V 600 400 200 0 0 200 400 Shaded area is beyond recommended range 1997 Microchip Technology Inc. 600 800 1000 1200 1400 1600 1800 Frequency(kHz) DS30272A-page 105 PIC16C71X Applicable Devices 710 71 711 715 FIGURE 12-16: TYPICAL IDD vs. FREQUENCY (RC MODE @ 300 pF, 25C) 1200 6.0V 5.5V 1000 5.0V 4.5V 4.0V 800 3.5V IDD(A) 3.0V 600 2.5V 400 200 0 0 100 200 300 400 500 600 700 Frequency(kHz) FIGURE 12-17: MAXIMUM IDD vs. FREQUENCY (RC MODE @ 300 pF, -40C TO 85C) 1200 6.0V 5.5V 1000 5.0V 4.5V 4.0V 800 IDD(A) 3.5V 3.0V 600 2.5V 400 200 0 0 100 200 300 400 500 600 700 Frequency(kHz) DS30272A-page 106 1997 Microchip Technology Inc. PIC16C71X Applicable Devices FIGURE 12-18: TYPICAL IDD vs. CAPACITANCE @ 500 kHz (RC MODE) FIGURE 12-19: TRANSCONDUCTANCE(gm) OF HS OSCILLATOR vs. VDD 600 4.0 Max -40C 5.0V 500 3.5 3.0 gm(mA/V) 4.0V 400 IDD(A) 710 71 711 715 3.0V 300 200 2.5 Typ 25C 2.0 Min 85C 1.5 1.0 100 0.5 0 20 pF 100 pF RC OSCILLATOR FREQUENCIES 100 300 pF 5k 4.12 MHz 1.4% 10k 2.35 MHz 1.4% 100k 268 kHz 1.1% 5.5 6.0 6.5 7.0 70 60 1.80 MHz 1.0% 1.27 MHz 1.0% 10k 688 kHz 1.2% 20 100k 77.2 kHz 1.0% 10 3.3k 707 kHz 1.4% 1.2% 10k 269 kHz 1.6% 100k 28.3 kHz 1.1% The percentage variation indicated here is part to part variation due to normal process distribution. The variation indicated is 3 standard deviation from average value for VDD = 5V. Typ 25C 50 5k 501 kHz Max -40C 80 3.3k 5k 5.0 90 gm(A/V) 100 pF 4.5 110 Rext Fosc @ 5V, 25C 22 pF 4.0 FIGURE 12-20: TRANSCONDUCTANCE(gm) OF LP OSCILLATOR vs. VDD Average Cext 3.5 VDD(Volts) Shaded area is beyond recommended range Capacitance(pF) TABLE 12-1: 0.0 3.0 300 pF 40 30 0 2.0 Min 85C 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 VDD(Volts) Shaded areas are beyond recommended range FIGURE 12-21: TRANSCONDUCTANCE(gm) OF XT OSCILLATOR vs. VDD 1000 900 Max -40C 800 gm(A/V) 700 600 Typ 25C 500 400 300 Min 85C 200 100 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 VDD(Volts) Shaded areas are beyond recommended range 1997 Microchip Technology Inc. DS30272A-page 107 PIC16C71X Applicable Devices 710 71 711 715 FIGURE 12-22: TYPICAL XTAL STARTUP TIME vs. VDD (LP MODE, 25C) FIGURE 12-24: TYPICAL XTAL STARTUP TIME vs. VDD (XT MODE, 25C) 3.5 70 3.0 60 50 Startup Time(ms) Startup Time(Seconds) 2.5 2.0 32 kHz, 33 pF/33 pF 1.5 1.0 40 200 kHz, 68 pF/68 pF 30 200 kHz, 47 pF/47 pF 20 1 MHz, 15 pF/15 pF 10 0.5 4 MHz, 15 pF/15 pF 200 kHz, 15 pF/15 pF 0.0 2.5 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 3.0 3.5 6.0 4.0 4.5 VDD(Volts) 5.0 5.5 6.0 VDD(Volts) FIGURE 12-23: TYPICAL XTAL STARTUP TIME vs. VDD (HS MODE, 25C) TABLE 12-2: 7 Osc Type Startup Time(ms) 6 LP 20 MHz, 33 pF/33 pF 5 XT 4 8 MHz, 33 pF/33 pF 3 20 MHz, 15 pF/15 pF 8 MHz, 15 pF/15 pF 2 1 4.0 4.5 DS30272A-page 108 5.0 VDD(Volts) 5.5 HS CAPACITOR SELECTION FOR CRYSTAL OSCILLATORS Crystal Freq Cap. Range C1 Cap. Range C2 33 pF 32 kHz 33 pF 200 kHz 15 pF 15 pF 200 kHz 47-68 pF 47-68 pF 1 MHz 15 pF 15 pF 4 MHz 15 pF 15 pF 4 MHz 15 pF 15 pF 8 MHz 15-33 pF 15-33 pF 20 MHz 15-33 pF 15-33 pF 6.0 Crystals Used 32 kHz Epson C-001R32.768K-A 20 PPM 200 kHz STD XTL 200.000KHz 20 PPM 1 MHz ECS ECS-10-13-1 50 PPM 4 MHz ECS ECS-40-20-1 50 PPM 8 MHz EPSON CA-301 8.000M-C 30 PPM 20 MHz EPSON CA-301 20.000M-C 30 PPM 1997 Microchip Technology Inc. PIC16C71X Applicable Devices FIGURE 12-25: TYPICAL IDD vs. FREQUENCY (LP MODE, 25C) 710 71 711 715 FIGURE 12-27: TYPICAL IDD vs. FREQUENCY (XT MODE, 25C) 1800 1600 6.0V 1400 5.5V 120 100 5.0V 1200 4.5V 1000 4.0V 60 40 20 0 0 6.0V 5.5V 5.0V 4.5V 4.0V 3.5V 3.0V 2.5V IDD(A) IDD(A) 80 3.5V 800 3.0V 600 2.5V 400 50 100 150 200 200 Frequency(kHz) 0 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 Frequency(MHz) FIGURE 12-26: MAXIMUM IDD vs. FREQUENCY (LP MODE, 85C TO -40C) FIGURE 12-28: MAXIMUM IDD vs. FREQUENCY (XT MODE, -40C TO 85C) 1800 140 6.0V 1600 5.5V 1400 100 1200 80 1000 4.0V 800 3.5V 60 40 20 0 0 6.0V 5.5V 5.0V 4.5V 4.0V 3.5V 3.0V 2.5V IDD(A) IDD(A) 120 5.0V 4.5V 3.0V 600 2.5V 400 200 50 100 Frequency(kHz) 150 200 0 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 Frequency(MHz) 1997 Microchip Technology Inc. DS30272A-page 109 PIC16C71X Applicable Devices 710 71 711 715 FIGURE 12-29: TYPICAL IDD vs. FREQUENCY (HS MODE, 25C) 7.0 FIGURE 12-30: MAXIMUM IDD vs. FREQUENCY (HS MODE, -40C TO 85C) 7.0 6.0 6.0 5.0 IDD(mA) IDD(mA) 5.0 4.0 3.0 2.0 1.0 0.0 1 2 6.0V 5.5V 5.0V 4.5V 4.0V 4.0 3.0 2.0 1.0 4 6 8 10 12 Frequency(MHz) 14 16 18 20 0.0 1 2 6.0V 5.5V 5.0V 4.5V 4.0V 4 6 8 10 12 14 16 18 20 Frequency(MHz) DS30272A-page 110 1997 Microchip Technology Inc. PIC16C71X Applicable Devices 13.0 710 71 711 715 ELECTRICAL CHARACTERISTICS FOR PIC16C715 Absolute Maximum Ratings Ambient temperature under bias................................................................................................................ .-55 to +125C Storage temperature .............................................................................................................................. -65C to +150C Voltage on any pin with respect to VSS (except VDD and MCLR).................................................... -0.3V to (VDD + 0.3V) Voltage on VDD with respect to VSS ................................................................................................................ 0 to +7.5V Voltage on MCLR with respect to VSS................................................................................................................0 to +14V Voltage on RA4 with respect to Vss ...................................................................................................................0 to +14V Total power dissipation (Note 1)................................................................................................................................1.0W Maximum current out of VSS pin ...........................................................................................................................300 mA Maximum current into VDD pin ..............................................................................................................................250 mA Input clamp current, IIK (VI < 0 or VI > VDD)..................................................................................................................... 20 mA Output clamp current, IOK (VO < 0 or VO > VDD) ............................................................................................................. 20 mA Maximum output current sunk by any I/O pin..........................................................................................................25 mA Maximum output current sourced by any I/O pin ....................................................................................................25 mA Maximum current sunk by PORTA ........................................................................................................................200 mA Maximum current sourced by PORTA ...................................................................................................................200 mA Maximum current sunk by PORTB........................................................................................................................200 mA Maximum current sourced by PORTB...................................................................................................................200 mA Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD - IOH} + {(VDD - VOH) x IOH} + (VOl x IOL). NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 1997 Microchip Technology Inc. DS30272A-page 111 PIC16C71X 710 71 711 715 1997 Microchip Technology Inc. CROSS REFERENCE OF DEVICE SPECS FOR OSCILLATOR CONFIGURATIONS AND FREQUENCIES OF OPERATION (COMMERCIAL DEVICES) PIC16C715-04 PIC16C715-10 PIC16C715-20 PIC16LC715-04 PIC16C715/JW VDD: 4.0V to 5.5V VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V VDD: 2.5V to 5.5V VDD: 4.0V to 5.5V IDD: 5 mA max. at 5.5V IDD: 2.7 mA typ. at 5.5V IDD: 2.7 mA typ. at 5.5V IDD: 2.0 mA typ. at 3.0V IDD: 5 mA max. at 5.5V RC IPD: 21 A max. at 4V IPD: 1.5 A typ. at 4V IPD: 1.5 A typ. at 4V IPD: 0.9 A typ. at 3V IPD: 21 A max. at 4V Freq: 4 MHz max. Freq: 4 MHz max. Freq: 4 MHz max. Freq: 4 MHz max. Freq: 4 MHz max. VDD: 4.0V to 5.5V VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V VDD: 2.5V to 5.5V VDD: 4.0V to 5.5V IDD: 5 mA max. at 5.5V IDD: 2.7 mA typ. at 5.5V IDD: 2.7 mA typ. at 5.5V IDD: 2.0 mA typ. at 3.0V IDD: 5 mA max. at 5.5V XT IPD: 21 A max. at 4V IPD: 1.5 A typ. at 4V IPD: 1.5 A typ. at 4V IPD: 0.9 A typ. at 3V IPD: 21 A max. at 4V Freq: 4 MHz max. Freq: 4 MHz max. Freq: 4 MHz max. Freq: 4 MHz max. Freq: 4 MHz max. VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V IDD: 13.5 mA typ. at 5.5V IDD: 30 mA max. at 5.5V IDD: 30 mA max. at 5.5V IDD: 30 mA max. at 5.5V HS Do not use in HS mode IPD: 1.5 A typ. at 4.5V IPD: 1.5 A typ. at 4.5V IPD: 1.5 A typ. at 4.5V IPD: 1.5 A typ. at 4.5V Freq: 4 MHz max. Freq: 10 MHz max. Freq: 20 MHz max. Freq: 10 MHz max. VDD: 4.0V to 5.5V VDD: 2.5V to 5.5V VDD: 2.5V to 5.5V IDD: 52.5 A typ. at 32 kHz, 4.0V IDD: 48 A max. at 32 kHz, 3.0V IDD: 48 A max. at 32 kHz, 3.0V LP Do not use in LP mode Do not use in LP mode IPD: 0.9 A typ. at 4.0V IPD: 5.0 A max. at 3.0V IPD: 5.0 A max. at 3.0V Freq: 200 kHz max. Freq: 200 kHz max. Freq: 200 kHz max. The shaded sections indicate oscillator selections which are tested for functionality, but not for MIN/MAX specifications. It is recommended that the user select the device type that ensures the specifications required. Applicable Devices TABLE 13-1: DS30272A-page 112 OSC PIC16C71X Applicable Devices 13.1 DC Characteristics: PIC16C715-04 (Commercial, Industrial, Extended) PIC16C715-10 (Commercial, Industrial, Extended) PIC16C715-20 (Commercial, Industrial, Extended)) Standard Operating Conditions (unless otherwise stated) Operating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) DC CHARACTERISTICS Param. No. Characteristic 710 71 711 715 Sym Min Typ Max Units Conditions D001 D001A Supply Voltage VDD 4.0 4.5 - 5.5 5.5 V V XT, RC and LP osc configuration HS osc configuration D002* RAM Data Retention Voltage (Note 1) VDR - 1.5 - V Device in SLEEP mode D003 VDD start voltage to ensure internal Poweron Reset signal VPOR - VSS - V See section on Power-on Reset for details D004* VDD rise rate to ensure internal Power-on Reset signal SVDD 0.05 - - D005 Brown-out Reset Voltage BVDD 3.7 4.0 4.3 V D010 Supply Current (Note 2) IDD - 2.7 5 mA XT, RC osc configuration (PIC16C715-04) FOSC = 4 MHz, VDD = 5.5V (Note 4) - 13.5 30 mA HS osc configuration (PIC16C715-20) FOSC = 20 MHz, VDD = 5.5V D013 V/ms See section on Power-on Reset for details BODEN configuration bit is enabled D015 Brown-out Reset Current IBOR (Note 5) - 300* 500 A BOR enabled VDD = 5.0V D020 D021 D021A D021B Power-down Current (Note 3) - 10.5 1.5 1.5 1.5 42 21 24 30 A A A A VDD = 4.0V, WDT enabled, -40C to +85C VDD = 4.0V, WDT disabled, -0C to +70C VDD = 4.0V, WDT disabled, -40C to +85C VDD = 4.0V, WDT disabled, -40C to +125C D023 Brown-out Reset Current IBOR (Note 5) - 300* 500 A BOR enabled VDD = 5.0V * Note 1: 2: 3: 4: 5: IPD These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD MCLR = VDD; WDT enabled/disabled as specified. The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS. For RC osc configuration, current through Rext is not included. The current through the resistor can be estimated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm. The current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD or IPD measurement. 1997 Microchip Technology Inc. DS30272A-page 113 PIC16C71X Applicable Devices 13.2 710 71 711 715 DC Characteristics: PIC16LC715-04 (Commercial, Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) DC CHARACTERISTICS Param No. Characteristic Sym Min Typ Max Units Conditions D001 Supply Voltage VDD 2.5 - 5.5 V LP, XT, RC osc configuration (DC - 4 MHz) D002* RAM Data Retention Voltage (Note 1) VDR - 1.5 - V Device in SLEEP mode D003 VDD start voltage to ensure internal Power-on Reset signal VPOR - VSS - V See section on Power-on Reset for details D004* VDD rise rate to ensure internal Power-on Reset signal SVDD 0.05 - - D005 Brown-out Reset Voltage BVDD 3.7 4.0 4.3 V BODEN configuration bit is enabled D010 Supply Current (Note 2) IDD - 2.0 3.8 mA XT, RC osc configuration FOSC = 4 MHz, VDD = 3.0V (Note 4) - 22.5 48 A LP osc configuration FOSC = 32 kHz, VDD = 3.0V, WDT disabled D010A V/ms See section on Power-on Reset for details D015 Brown-out Reset Current (Note 5) IBOR - 300* 500 A BOR enabled VDD = 5.0V D020 D021 D021A Power-down Current (Note 3) IPD - 7.5 0.9 0.9 30 5 5 A A A VDD = 3.0V, WDT enabled, -40C to +85C VDD = 3.0V, WDT disabled, 0C to +70C VDD = 3.0V, WDT disabled, -40C to +85C D023 Brown-out Reset Current (Note 5) IBOR - 300* 500 A BOR enabled VDD = 5.0V * Note 1: 2: 3: 4: 5: These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD MCLR = VDD; WDT enabled/disabled as specified. The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS. For RC osc configuration, current through Rext is not included. The current through the resistor can be estimated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm. The current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD or IPD measurement. DS30272A-page 114 1997 Microchip Technology Inc. PIC16C71X Applicable Devices 13.3 DC Characteristics: PIC16C715-04 (Commercial, Industrial, Extended) PIC16C715-10 (Commercial, Industrial, Extended) PIC16C715-20 (Commercial, Industrial, Extended) PIC16LC715-04 (Commercial, Industrial)) DC CHARACTERISTICS Param No. D030 D031 D032 D033 D040 D040A D041 D042 D042A D043 D070 Characteristic Input Low Voltage I/O ports with TTL buffer with Schmitt Trigger buffer MCLR, RA4/T0CKI,OSC1 (in RC mode) OSC1 (in XT, HS and LP) Input High Voltage I/O ports with TTL buffer D060 with Schmitt Trigger buffer MCLR, RA4/T0CKI RB0/INT OSC1 (XT, HS and LP) OSC1 (in RC mode) PORTB weak pull-up current Input Leakage Current (Notes 2, 3) I/O ports D061 D063 MCLR, RA4/T0CKI OSC1 D080 Output Low Voltage I/O ports D080A D083 D083A Note 1: 2: 3: 710 71 711 715 Standard Operating Conditions (unless otherwise stated) Operating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating voltage VDD range as described in DC spec Section 13.1 and Section 13.2. Sym Min Typ Max Units Conditions VIL VSS VSS VSS - 0.5V 0.2VDD 0.2VDD V V V VSS - 0.3VDD V Note1 VDD VDD VDD VDD VDD VDD 400 V V V V V V A 4.5 VDD 5.5V For VDD > 5.5V or VDD < 4.5V For entire VDD range VIH 2.0 0.8VDD 0.8VDD 0.8VDD 0.7VDD 0.9VDD IPURB 50 250 IIL VOL - - 1 - - 5 5 - - 0.6 Note1 VDD = 5V, VPIN = VSS A Vss VPIN VDD, Pin at hiimpedance A Vss VPIN VDD A Vss VPIN VDD, XT, HS and LP osc configuration IOL = 8.5 mA, VDD = 4.5V, -40C to +85C 0.6 V IOL = 7.0 mA, VDD = 4.5V, -40C to +125C OSC2/CLKOUT (RC osc config) 0.6 V IOL = 1.6 mA, VDD = 4.5V, -40C to +85C 0.6 V IOL = 1.2 mA, VDD = 4.5V, -40C to +125C Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC16C7X be driven with external clock in RC mode. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as coming out of the pin. 1997 Microchip Technology Inc. V DS30272A-page 115 PIC16C71X Applicable Devices 710 71 711 715 DC CHARACTERISTICS Param No. Characteristic Output High Voltage I/O ports (Note 3) D090 Standard Operating Conditions (unless otherwise stated) Operating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating voltage VDD range as described in DC spec Section 13.1 and Section 13.2. Sym Min Typ Max Units Conditions VOH VDD - 0.7 - - V VDD - 0.7 - - V VDD - 0.7 - - V VDD - 0.7 - - V 15 pF D090A D092 OSC2/CLKOUT (RC osc config) D092A Capacitive Loading Specs on Output Pins OSC2 pin D100 COSC2 - - IOH = -3.0 mA, VDD = 4.5V, -40C to +85C IOH = -2.5 mA, VDD = 4.5V, -40C to +125C IOH = -1.3 mA, VDD = 4.5V, -40C to +85C IOH = -1.0 mA, VDD = 4.5V, -40C to +125C In XT, HS and LP modes when external clock is used to drive OSC1. D101 All I/O pins and OSC2 (in RC mode) CIO 50 pF Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC16C7X be driven with external clock in RC mode. 2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Negative current is defined as coming out of the pin. DS30272A-page 116 1997 Microchip Technology Inc. PIC16C71X Applicable Devices 13.4 710 71 711 715 Timing Parameter Symbology The timing parameter symbols have been created following one of the following formats: 1. TppS2ppS 2. TppS T F Frequency Lowercase letters (pp) and their meanings: pp cc CCP1 ck CLKOUT cs CS di SDI do SDO dt Data in io I/O port mc MCLR Uppercase letters and their meanings: S F Fall H High I Invalid (Hi-impedance) L Low T Time osc rd rw sc ss t0 t1 wr OSC1 RD RD or WR SCK SS T0CKI T1CKI WR P R V Z Period Rise Valid Hi-impedance FIGURE 13-1: LOAD CONDITIONS Load condition 2 Load condition 1 VDD/2 RL CL Pin VSS CL Pin VSS RL = 464 CL = 50 pF 15 pF 1997 Microchip Technology Inc. for all pins except OSC2 for OSC2 output DS30272A-page 117 PIC16C71X Applicable Devices 13.5 710 71 711 715 Timing Diagrams and Specifications FIGURE 13-2: EXTERNAL CLOCK TIMING Q4 Q1 Q2 Q3 Q4 Q1 OSC1 1 3 4 3 4 2 CLKOUT TABLE 13-2: Parameter No. CLOCK TIMING REQUIREMENTS Sym Characteristic Min Typ Max Units Conditions Fos External CLKIN Frequency (Note 1) DC DC DC DC DC 0.1 4 4 -- -- -- -- -- -- -- -- 4 4 20 200 4 4 4 10 MHz MHz MHz kHz MHz MHz MHz MHz XT osc mode HS osc mode (PIC16C715-04) HS osc mode (PIC16C715-20) LP osc mode RC osc mode XT osc mode HS osc mode (PIC16C715-04) HS osc mode (PIC16C715-10) 4 -- 20 MHz HS osc mode (PIC16C715-20) 5 250 250 100 50 5 250 250 250 100 -- -- -- -- -- -- -- -- -- -- 200 -- -- -- -- -- -- 10,000 250 250 kHz ns ns ns ns s ns ns ns ns LP osc mode XT osc mode HS osc mode (PIC16C715-04) HS osc mode (PIC16C715-10) HS osc mode (PIC16C715-20) LP osc mode RC osc mode XT osc mode HS osc mode (PIC16C715-04) HS osc mode (PIC16C715-10) Oscillator Frequency (Note 1) 1 Tosc External CLKIN Period (Note 1) Oscillator Period (Note 1) 50 -- 250 ns HS osc mode (PIC16C715-20) 5 -- -- s LP osc mode -- DC ns TCY = 4/FOSC 2 TCY Instruction Cycle Time (Note 1) 200 3 TosL, External Clock in (OSC1) High 50 -- -- ns XT oscillator TosH or Low Time 2.5 -- -- s LP oscillator 10 -- -- ns HS oscillator 4 TosR, External Clock in (OSC1) Rise -- -- 25 ns XT oscillator TosF or Fall Time -- -- 50 ns LP oscillator -- -- 15 ns HS oscillator Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Instruction cycle period (TCY) equals four times the input oscillator time-base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at "min." values with an external clock applied to the OSC1/CLKIN pin. When an external clock input is used, the "Max." cycle time limit is "DC" (no clock) for all devices. OSC2 is disconnected (has no loading) for the PIC16C715. DS30272A-page 118 1997 Microchip Technology Inc. PIC16C71X Applicable Devices 710 71 711 715 Q2 Q3 FIGURE 13-3: CLKOUT AND I/O TIMING Q1 Q4 OSC1 11 10 CLKOUT 13 19 14 12 18 16 I/O Pin (input) 15 17 I/O Pin (output) new value old value 20, 21 Note: Refer to Figure 13-1 for load conditions. TABLE 13-3: CLKOUT AND I/O TIMING REQUIREMENTS Parameter Sym No. Characteristic Min Typ Max Units Conditions 10* TosH2ckL OSC1 to CLKOUT -- 15 30 ns Note 1 11* TosH2ckH OSC1 to CLKOUT -- 15 30 ns Note 1 12* TckR CLKOUT rise time -- 5 15 ns Note 1 13* TckF CLKOUT fall time -- 5 15 ns Note 1 14* TckL2ioV CLKOUT to Port out valid -- -- 0.5TCY + 20 ns Note 1 15* TioV2ckH Port in valid before CLKOUT 0.25TCY + 25 -- -- ns Note 1 16* TckH2ioI Port in hold after CLKOUT 0 -- -- ns Note 1 17* TosH2ioV OSC1 (Q1 cycle) to Port out valid -- -- 80 - 100 ns 18* TosH2ioI OSC1 (Q2 cycle) to Port input invalid (I/O in hold time) TBD -- -- ns 19* TioV2osH Port input valid to OSC1 (I/O in setup time) 20* TioR Port output rise time 21* TioF Port output fall time TBD -- -- ns PIC16C715 -- 10 25 ns PIC16LC715 -- -- 60 ns PIC16C715 -- 10 25 ns PIC16LC715 -- -- 60 ns 22* Tinp INT pin high or low time 20 -- -- ns 23* Trbp RB7:RB4 change INT high or low time 20 -- -- ns * These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. These parameters are asynchronous events not related to any internal clock edges. Note 1: Measurements are taken in RC Mode where CLKOUT output is 4 x TOSC. 1997 Microchip Technology Inc. DS30272A-page 119 PIC16C71X Applicable Devices 710 71 711 715 FIGURE 13-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, AND POWER-UP TIMER TIMING VDD MCLR 30 Internal POR 33 PWRT Timeout 32 OSC Timeout Internal RESET Parity Error Reset 36 Watchdog Timer RESET 34 31 34 I/O Pins FIGURE 13-5: BROWN-OUT RESET TIMING BVDD VDD 35 TABLE 13-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER, AND BROWN-OUT RESET REQUIREMENTS Parameter No. Sym 30 TmcL MCLR Pulse Width (low) 2 -- -- s VDD = 5V, -40C to +125C 31* Twdt Watchdog Timer Time-out Period (No Prescaler) 7 18 33 ms VDD = 5V, -40C to +125C Oscillation Start-up Timer Period -- 1024TOSC -- -- TOSC = OSC1 period Power up Timer Period 28 72 132 ms VDD = 5V, -40C to +125C -- -- 2.1 s 100 -- -- s -- TBD -- s 32 Tost 33* Tpwrt 34 TIOZ I/O Hi-impedance from MCLR Low or Watchdog Timer Reset 35 TBOR Brown-out Reset pulse width TPER Parity Error Reset 36 * Characteristic Min Typ Max Units Conditions VDD BVDD (D005) These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. DS30272A-page 120 1997 Microchip Technology Inc. PIC16C71X Applicable Devices 710 71 711 715 FIGURE 13-6: TIMER0 CLOCK TIMINGS RA4/T0CKI 41 40 42 TMR0 Note: Refer to Figure 13-1 for load conditions. TABLE 13-5: TIMER0 CLOCK REQUIREMENTS Param No. Sym Characteristic 40 Tt0H T0CKI High Pulse Width 41 Tt0L T0CKI Low Pulse Width 42 Tt0P T0CKI Period Min No Prescaler With Prescaler No Prescaler With Prescaler 48 Tcke2tmrI Delay from external clock edge to timer increment * 0.5TCY + 20* Typ Max Units Conditions -- -- ns 10* -- -- ns 0.5TCY + 20* -- -- ns 10* -- -- ns Greater of: 20s or TCY + 40* N -- -- ns 2Tosc -- 7Tosc -- N = prescale value (1, 2, 4,..., 256) These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 1997 Microchip Technology Inc. DS30272A-page 121 PIC16C71X Applicable Devices TABLE 13-6: Parameter No. 710 71 711 715 A/D CONVERTER CHARACTERISTICS: PIC16C715-04 (COMMERCIAL, INDUSTRIAL, EXTENDED) PIC16C715-10 (COMMERCIAL, INDUSTRIAL, EXTENDED) PIC16C715-20 (COMMERCIAL, INDUSTRIAL, EXTENDED) Sym Characteristic Min Typ Max Units Conditions Resolution -- -- 8-bits -- VREF = VDD, VSS AIN VREF NINT Integral error -- -- less than 1 LSb -- VREF = VDD, VSS AIN VREF NDIF Differential error -- -- less than 1 LSb -- VREF = VDD, VSS AIN VREF NFS Full scale error -- -- less than 1 LSb -- VREF = VDD, VSS AIN VREF NOFF Offset error -- -- less than 1 LSb -- VREF = VDD, VSS AIN VREF -- Monotonicity -- guaranteed -- -- VSS AIN VREF 2.5V -- VDD + 0.3 V NR VREF Reference voltage VAIN Analog input voltage VSS - 0.3 -- VREF + 0.3 V ZAIN Recommended impedance of analog voltage source -- -- 10.0 k IAD A/D conversion current (VDD) -- 180 -- A Average current consumption when A/D is on. (Note 1) IREF VREF input current (Note 2) -- -- 1 10 mA A During sampling All other times * These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: When A/D is off, it will not consume any current other than minor leakage current. The power-down current spec includes any such leakage from the A/D module. 2: VREF current is from RA3 pin or VDD pin, whichever is selected as reference input. DS30272A-page 122 1997 Microchip Technology Inc. PIC16C71X Applicable Devices TABLE 13-7: Parameter No. 710 71 711 715 A/D CONVERTER CHARACTERISTICS: PIC16LC715-04 (COMMERCIAL, INDUSTRIAL) Sym Characteristic Min Typ Max Units Conditions Resolution -- -- 8-bits -- VREF = VDD, VSS AIN VREF NINT Integral error -- -- less than 1 LSb -- VREF = VDD, VSS AIN VREF NDIF Differential error -- -- less than 1 LSb -- VREF = VDD, VSS AIN VREF NFS Full scale error -- -- less than 1 LSb -- VREF = VDD, VSS AIN VREF NOFF Offset error -- -- less than 1 LSb -- VREF = VDD, VSS AIN VREF -- Monotonicity -- guaranteed -- -- VSS AIN VREF V NR VREF Reference voltage VAIN Analog input voltage 2.5V -- VDD + 0.3 VSS - 0.3 -- VREF + 0.3 ZAIN V Recommended impedance of analog voltage source -- -- 10.0 k IAD A/D conversion current (VDD) -- 90 -- A Average current consumption when A/D is on. (Note 1) IREF VREF input current (Note 2) -- -- 1 10 mA A During sampling All other times * These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: When A/D is off, it will not consume any current other than minor leakage current. The power-down current spec includes any such leakage from the A/D module. 2: VREF current is from RA3 pin or VDD pin, whichever is selected as reference input. 1997 Microchip Technology Inc. DS30272A-page 123 PIC16C71X Applicable Devices 710 71 711 715 FIGURE 13-7: A/D CONVERSION TIMING BSF ADCON0, GO 1 Tcy (TOSC/2) (1) 131 Q4 130 132 A/D CLK 7 A/D DATA 6 5 4 3 2 1 NEW_DATA OLD_DATA ADRES 0 ADIF GO DONE SAMPLING STOPPED SAMPLE Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. TABLE 13-8: A/D CONVERSION REQUIREMENTS Parameter No. Sym Characteristic Min 130 TAD A/D clock period 1.6 2.0 130 TAD A/D Internal RC Oscillator source 131 TCNV Conversion time (not including S/H time). Note 1 132 TACQ Acquisition time Typ Max Units -- -- s s Conditions VREF 3.0V VREF full range ADCS1:ADCS0 = 11 (RC oscillator source) 3.0 6.0 9.0 s PIC16LC715, VDD = 3.0V 2.0 4.0 6.0 s PIC16C715 -- 9.5TAD -- -- Note 2 20 -- s * These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: ADRES register may be read on the following TCY cycle. DS30272A-page 124 1997 Microchip Technology Inc. PIC16C71X Applicable Devices 14.0 710 71 711 715 DC AND AC CHARACTERISTICS GRAPHS AND TABLES FOR PIC16C715 The graphs and tables provided in this section are for design guidance and are not tested or guaranteed. In some graphs or tables the data presented are outside specified operating range (i.e., outside specified VDD range). This is for information only and devices are guaranteed to operate properly only within the specified range. Note: The data presented in this section is a statistical summary of data collected on units from different lots over a period of time and matrix samples. 'Typical' represents the mean of the distribution at, 25C, while 'max' or 'min' represents (mean +3) and (mean -3) respectively where is standard deviation. FIGURE 14-1: TYPICAL IPD vs. VDD (WDT DISABLED, RC MODE) 35 30 IPD(nA) 25 20 15 10 Shaded area is beyond recommended range. 5 0 2.5 3.0 3.5 4.0 4.5 VDD(Volts) 5.0 5.5 6.0 FIGURE 14-2: MAXIMUM IPD vs. VDD (WDT DISABLED, RC MODE) 10.000 85C 70C IPD(A) 1.000 25C 0.100 0C -40C 0.010 Shaded area is beyond recommended range. 0.001 2.5 3.0 1997 Microchip Technology Inc. 3.5 4.0 4.5 VDD(Volts) 5.0 5.5 6.0 DS30272A-page 125 PIC16C71X Applicable Devices 710 71 711 715 FIGURE 14-3: TYPICAL IPD vs. VDD @ 25C (WDT ENABLED, RC MODE) FIGURE 14-5: TYPICAL RC OSCILLATOR FREQUENCY vs. VDD Cext = 22 pF, T = 25C 6.0 25 5.5 5.0 20 Fosc(MHz) IPD(A) 4.5 15 10 R = 5k 4.0 3.5 3.0 R = 10k 2.5 2.0 5 1.5 0 2.5 1.0 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(Volts) 0.0 2.5 Shaded area is beyond recommended range. FIGURE 14-4: MAXIMUM IPD vs. VDD (WDT ENABLED, RC MODE) 35 3.0 3.5 4.0 4.5 VDD(Volts) 5.0 6.0 FIGURE 14-6: TYPICAL RC OSCILLATOR FREQUENCY vs. VDD Cext = 100 pF, T = 25C 2.4 0C 2.2 25 R = 3.3k 2.0 1.8 Fosc(MHz) 20 70C 15 85C 10 1.6 R = 5k 1.4 1.2 1.0 R = 10k 0.8 5 0 2.5 5.5 Shaded area is beyond recommended range. -40C 30 IPD(A) R = 100k 0.5 0.6 0.4 3.0 3.5 4.0 4.5 5.0 5.5 6.0 R = 100k 0.2 VDD(Volts) 0.0 2.5 3.0 3.5 Shaded area is beyond recommended range. 4.0 4.5 5.0 5.5 6.0 VDD(Volts) Shaded area is beyond recommended range. FIGURE 14-7: TYPICAL RC OSCILLATOR FREQUENCY vs. VDD Cext = 300 pF, T = 25C 1000 900 Fosc(kHz) 800 R = 3.3k 700 600 R = 5k 500 400 R = 10k 300 200 R = 100k 100 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD(Volts) Shaded area is beyond recommended range. DS30272A-page 126 1997 Microchip Technology Inc. PIC16C71X Applicable Devices FIGURE 14-8: TYPICAL IPD vs. VDD BROWNOUT DETECT ENABLED (RC MODE) 710 71 711 715 FIGURE 14-10: TYPICAL IPD vs. TIMER1 ENABLED (32 kHz, RC0/RC1 = 33 pF/33 pF, RC MODE) 1400 30 1200 25 Device NOT in Brown-out Reset 800 20 600 400 200 0 2.5 IPD(A) IPD(A) 1000 Device in Brown-out Reset 15 10 3.0 3.5 4.0 4.5 VDD(Volts) 5.0 5.5 5 6.0 0 2.5 This shaded region represents the built-in hysteresis of the brown-out reset circuitry. 3.0 3.5 4.0 4.5 VDD(Volts) 5.0 5.5 6.0 Shaded area is beyond recommended range. Shaded area is beyond recommended range. FIGURE 14-11: MAXIMUM IPD vs. TIMER1 ENABLED (32 kHz, RC0/RC1 = 33 pF/33 pF, 85C TO -40C, RC MODE) FIGURE 14-9: MAXIMUM IPD vs. VDD BROWN-OUT DETECT ENABLED (85C TO -40C, RC MODE) 1600 45 1400 40 1200 35 800 600 400 30 Device NOT in Brown-out Reset IPD(A) IPD(A) 1000 Device in Brown-out Reset 10 5 4.3 3.0 3.5 20 15 200 0 2.5 25 4.0 4.5 VDD(Volts) 5.0 5.5 6.0 This shaded region represents the built-in hysteresis of the brown-out reset circuitry. 0 2.5 3.0 3.5 4.0 4.5 VDD(Volts) 5.0 5.5 6.0 Shaded area is beyond recommended range. Shaded area is beyond recommended range. 1997 Microchip Technology Inc. DS30272A-page 127 PIC16C71X Applicable Devices 710 71 711 715 FIGURE 14-12: TYPICAL IDD vs. FREQUENCY (RC MODE @ 22 pF, 25C) 2000 1800 5.5V 5.0V 1600 4.5V IDD(A) 1400 4.0V 1200 3.5V 1000 3.0V 800 2.5V 600 400 200 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Frequency(MHz) 3.5 4.0 4.5 Shaded area is beyond recommended range FIGURE 14-13: MAXIMUM IDD vs. FREQUENCY (RC MODE @ 22 pF, -40C TO 85C) 2000 1800 5.5V 5.0V 1600 4.5V IDD(A) 1400 4.0V 1200 3.5V 1000 3.0V 800 2.5V 600 400 200 0 0.0 0.5 1.0 1.5 2.0 2.5 Frequency(MHz) DS30272A-page 128 3.0 3.5 4.0 4.5 Shaded area is beyond recommended range 1997 Microchip Technology Inc. PIC16C71X Applicable Devices 710 71 711 715 FIGURE 14-14: TYPICAL IDD vs. FREQUENCY (RC MODE @ 100 pF, 25C) 1600 1400 5.5V 5.0V 1200 4.5V 4.0V 1000 IDD(A) 3.5V 3.0V 800 2.5V 600 400 200 0 0 200 400 Shaded area is beyond recommended range 600 800 1000 1200 1400 1600 1800 Frequency(kHz) FIGURE 14-15: MAXIMUM IDD vs. FREQUENCY (RC MODE @ 100 pF, -40C TO 85C) 1600 1400 5.5V 5.0V 1200 4.5V 4.0V 1000 IDD(A) 3.5V 3.0V 800 2.5V 600 400 200 0 0 200 400 Shaded area is beyond recommended range 1997 Microchip Technology Inc. 600 800 1000 1200 1400 1600 1800 Frequency(kHz) DS30272A-page 129 PIC16C71X Applicable Devices 710 71 711 715 FIGURE 14-16: TYPICAL IDD vs. FREQUENCY (RC MODE @ 300 pF, 25C) 1200 5.5V 1000 5.0V 4.5V 4.0V 800 3.5V IDD(A) 3.0V 600 2.5V 400 200 0 0 100 200 300 400 500 600 700 Frequency(kHz) FIGURE 14-17: MAXIMUM IDD vs. FREQUENCY (RC MODE @ 300 pF, -40C TO 85C) 1200 5.5V 1000 5.0V 4.5V 4.0V 800 IDD(A) 3.5V 3.0V 600 2.5V 400 200 0 0 100 200 300 400 500 600 700 Frequency(kHz) DS30272A-page 130 1997 Microchip Technology Inc. PIC16C71X Applicable Devices FIGURE 14-18: TYPICAL IDD vs. CAPACITANCE @ 500 kHz (RC MODE) FIGURE 14-19: TRANSCONDUCTANCE(gm) OF HS OSCILLATOR vs. VDD 600 4.0 Max -40C 5.0V 500 3.5 3.0 gm(mA/V) 4.0V 400 IDD(A) 710 71 711 715 3.0V 300 200 2.5 Typ 25C 2.0 Min 85C 1.5 1.0 100 0.5 0 20 pF 100 pF 0.0 3.0 300 pF Capacitance(pF) TABLE 14-1: Rext 300 pF 5.0 5.5 VDD(Volts) 6.0 6.5 7.0 110 100 5k 4.12 MHz 1.4% 90 10k 2.35 MHz 1.4% 80 100k 268 kHz 1.1% 3.3k 1.80 MHz 1.0% 5k 1.27 MHz 1.0% 10k 688 kHz 1.2% 100k 77.2 kHz 1.0% 3.3k 707 kHz 1.4% 5k 501 kHz 1.2% 10k 269 kHz 1.6% 100k 28.3 kHz 1.1% The percentage variation indicated here is part to part variation due to normal process distribution. The variation indicated is 3 standard deviation from average value for VDD = 5V. gm(A/V) 100 pF 4.5 FIGURE 14-20: TRANSCONDUCTANCE(gm) OF LP OSCILLATOR vs. VDD Fosc @ 5V, 25C 22 pF 4.0 Shaded area is beyond recommended range. RC OSCILLATOR FREQUENCIES Average Cext 3.5 Max -40C 70 60 Typ 25C 50 40 30 20 Min 85C 10 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 VDD(Volts) Shaded area is beyond recommended range. FIGURE 14-21: TRANSCONDUCTANCE(gm) OF XT OSCILLATOR vs. VDD 1000 900 Max -40C 800 gm(A/V) 700 600 Typ 25C 500 400 300 Min 85C 200 100 0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 VDD(Volts) Shaded area is beyond recommended range. 1997 Microchip Technology Inc. DS30272A-page 131 PIC16C71X Applicable Devices 710 71 711 715 FIGURE 14-22: TYPICAL XTAL STARTUP TIME vs. VDD (LP MODE, 25C) FIGURE 14-24: TYPICAL XTAL STARTUP TIME vs. VDD (XT MODE, 25C) 3.5 70 3.0 60 50 Startup Time(ms) Startup Time(Seconds) 2.5 2.0 32 kHz, 33 pF/33 pF 1.5 1.0 40 200 kHz, 68 pF/68 pF 30 200 kHz, 47 pF/47 pF 20 1 MHz, 15 pF/15 pF 10 0.5 0.0 2.5 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 TABLE 14-2: FIGURE 14-23: TYPICAL XTAL STARTUP TIME vs. VDD (HS MODE, 25C) Osc Type 7 LP 6 XT 20 MHz, 33 pF/33 pF 4 HS 8 MHz, 33 pF/33 pF 3 20 MHz, 15 pF/15 pF 8 MHz, 15 pF/15 pF 2 1 4.0 4.5 5.0 VDD(Volts) 5.5 Shaded area is beyond recommended range. DS30272A-page 132 3.5 4.0 4.5 VDD(Volts) 5.0 5.5 6.0 Shaded area is beyond recommended range. Shaded area is beyond recommended range. 5 3.0 6.0 VDD(Volts) Startup Time(ms) 4 MHz, 15 pF/15 pF 200 kHz, 15 pF/15 pF 6.0 CAPACITOR SELECTION FOR CRYSTAL OSCILLATORS Crystal Freq Cap. Range C1 Cap. Range C2 33 pF 32 kHz 33 pF 200 kHz 15 pF 15 pF 200 kHz 47-68 pF 47-68 pF 1 MHz 15 pF 15 pF 4 MHz 15 pF 15 pF 4 MHz 15 pF 15 pF 8 MHz 15-33 pF 15-33 pF 20 MHz 15-33 pF 15-33 pF Crystals Used 32 kHz Epson C-001R32.768K-A 20 PPM 200 kHz STD XTL 200.000KHz 20 PPM 1 MHz ECS ECS-10-13-1 50 PPM 4 MHz ECS ECS-40-20-1 50 PPM 8 MHz EPSON CA-301 8.000M-C 30 PPM 20 MHz EPSON CA-301 20.000M-C 30 PPM 1997 Microchip Technology Inc. PIC16C71X Applicable Devices FIGURE 14-25: TYPICAL IDD vs. FREQUENCY (LP MODE, 25C) 710 71 711 715 FIGURE 14-27: TYPICAL IDD vs. FREQUENCY (XT MODE, 25C) 1800 1600 120 5.5V 1400 100 5.0V 1200 4.5V 1000 4.0V 60 40 20 0 0 5.5V 5.0V 4.5V 4.0V 3.5V 3.0V 2.5V IDD(A) IDD(A) 80 3.5V 800 3.0V 600 2.5V 400 50 100 150 200 200 Frequency(kHz) 0 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 Frequency(MHz) FIGURE 14-26: MAXIMUM IDD vs. FREQUENCY (LP MODE, 85C TO -40C) FIGURE 14-28: MAXIMUM IDD vs. FREQUENCY (XT MODE, -40C TO 85C) 1800 140 1600 5.5V 100 1200 80 1000 4.0V 800 3.5V 60 40 20 0 0 IDD(A) 1400 IDD(A) 120 5.5V 5.0V 4.5V 4.0V 3.5V 3.0V 2.5V 5.0V 4.5V 3.0V 600 2.5V 400 200 50 100 Frequency(kHz) 150 200 0 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 Frequency(MHz) 1997 Microchip Technology Inc. DS30272A-page 133 PIC16C71X Applicable Devices 710 71 711 715 FIGURE 14-29: TYPICAL IDD vs. FREQUENCY (HS MODE, 25C) 7.0 FIGURE 14-30: MAXIMUM IDD vs. FREQUENCY (HS MODE, -40C TO 85C) 7.0 6.0 6.0 5.0 IDD(mA) IDD(mA) 5.0 4.0 3.0 2.0 1.0 0.0 1 2 5.5V 5.0V 4.5V 4.0V 4.0 3.0 2.0 1.0 4 6 8 10 12 Frequency(MHz) 14 16 18 20 0.0 1 2 5.5V 5.0V 4.5V 4.0V 4 6 8 10 12 14 16 18 20 Frequency(MHz) DS30272A-page 134 1997 Microchip Technology Inc. PIC16C71X Applicable Devices 15.0 710 71 711 715 ELECTRICAL CHARACTERISTICS FOR PIC16C71 Absolute Maximum Ratings Ambient temperature under bias................................................................................................................ .-55 to +125C Storage temperature .............................................................................................................................. -65C to +150C Voltage on any pin with respect to VSS (except VDD, MCLR, and RA4).......................................... -0.3V to (VDD + 0.3V) Voltage on VDD with respect to VSS .......................................................................................................... -0.3 to +7.5V Voltage on MCLR with respect to VSS (Note 2)..................................................................................................0 to +14V Voltage on RA4 with respect to Vss ...................................................................................................................0 to +14V Total power dissipation (Note 1)...........................................................................................................................800 mW Maximum current out of VSS pin ...........................................................................................................................150 mA Maximum current into VDD pin ..............................................................................................................................100 mA Input clamp current, IIK (VI < 0 or VI > VDD)..................................................................................................................... 20 mA Output clamp current, IOK (VO < 0 or VO > VDD) ............................................................................................................. 20 mA Maximum output current sunk by any I/O pin..........................................................................................................25 mA Maximum output current sourced by any I/O pin ....................................................................................................20 mA Maximum current sunk by PORTA ..........................................................................................................................80 mA Maximum current sourced by PORTA .....................................................................................................................50 mA Maximum current sunk by PORTB........................................................................................................................150 mA Maximum current sourced by PORTB...................................................................................................................100 mA Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD - IOH} + {(VDD-VOH) x IOH} + (VOl x IOL) Note 2: Voltage spikes below VSS at the MCLR pin, inducing currents greater than 80 mA, may cause latch-up. Thus, a series resistor of 50-100 should be used when applying a "low" level to the MCLR pin rather than pulling this pin directly to VSS. NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 15-1: OSC CROSS REFERENCE OF DEVICE SPECS FOR OSCILLATOR CONFIGURATIONS AND FREQUENCIES OF OPERATION (COMMERCIAL DEVICES) PIC16C71-04 PIC16C71-20 PIC16LC71-04 JW Devices RC VDD: 4.0V to 6.0V IDD: 3.3 mA max. at 5.5V IPD: 14 A max. at 4V Freq:4 MHz max. VDD: 4.5V to 5.5V IDD: 1.8 mA typ. at 5.5V IPD: 1.0 A typ. at 4V Freq: 4 MHz max. VDD: 3.0V to 6.0V IDD: 1.4 mA typ. at 3.0V IPD: 0.6 A typ. at 3V Freq: 4 MHz max. VDD: 4.0V to 6.0V IDD: 3.3 mA max. at 5.5V IPD: 14 A max. at 4V Freq:4 MHz max. XT VDD: 4.0V to 6.0V IDD: 3.3 mA max. at 5.5V IPD: 14 A max. at 4V Freq: 4 MHz max. VDD: 4.5V to 5.5V IDD: 1.8 mA typ. at 5.5V IPD: 1.0 A typ. at 4V Freq: 4 MHz max. VDD: 3.0V to 6.0V IDD: 1.4 mA typ. at 3.0V IPD: 0.6 A typ. at 3V Freq: 4 MHz max. VDD: 4.0V to 6.0V IDD: 3.3 mA max. at 5.5V IPD: 14 A max. at 4V Freq: 4 MHz max. VDD: 4.5V to 5.5V VDD: 4.5V to 5.5V IDD: 13.5 mA typ. at 5.5V IDD: 30 mA max. at 5.5V IPD: 1.0 A typ. at 4.5V IPD: 1.0 A typ. at 4.5V Freq: 4 MHz max. Freq: 20 MHz max. HS LP VDD: 4.0V to 6.0V IDD: 15 A typ. at 32 kHz, 4.0V IPD: 0.6 A typ. at 4.0V Freq: 200 kHz max. Not recommended for use in LP mode VDD: 4.5V to 5.5V Not recommended for use in HS mode IDD: 30 mA max. at 5.5V IPD: 1.0 A typ. at 4.5V Freq: 20 MHz max. VDD: 3.0V to 6.0V IDD: 32 A max. at 32 kHz, 3.0V IPD: 9 A max. at 3.0V Freq: 200 kHz max. VDD: 3.0V to 6.0V IDD: 32 A max. at 32 kHz, 3.0V IPD: 9 A max. at 3.0V Freq: 200 kHz max. The shaded sections indicate oscillator selections which are tested for functionality, but not for MIN/MAX specifications. It is recommended that the user select the device type that ensures the specifications required. 1997 Microchip Technology Inc. DS30272A-page 135 PIC16C71X Applicable Devices 15.1 710 71 711 715 DC Characteristics: PIC16C71-04 (Commercial, Industrial) PIC16C71-20 (Commercial, Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) DC CHARACTERISTICS Param No. Characteristic Sym Min D001 Supply Voltage D001A VDD 4.0 4.5 - 6.0 5.5 V V D002* RAM Data Retention Voltage (Note 1) VDR - 1.5 - V D003 VDD start voltage to ensure internal Power-on Reset signal VPOR - VSS - V D004* VDD rise rate to ensure internal Power-on Reset signal SVDD 0.05 - - D010 Supply Current (Note 2) IDD - 1.8 3.3 mA XT, RC osc configuration FOSC = 4 MHz, VDD = 5.5V (Note 4) - 13.5 30 mA HS osc configuration FOSC = 20 MHz, VDD = 5.5V - 7 1.0 1.0 28 14 16 A A A VDD = 4.0V, WDT enabled, -40C to +85C VDD = 4.0V, WDT disabled, -0C to +70C VDD = 4.0V, WDT disabled, -40C to +85C D013 D020 Power-down Current D021 (Note 3) D021A * Note 1: 2: 3: 4: IPD Typ Max Units Conditions XT, RC and LP osc configuration HS osc configuration See section on Power-on Reset for details V/ms See section on Power-on Reset for details These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. This is the limit to which VDD can be lowered without losing RAM data. The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD MCLR = VDD; WDT enabled/disabled as specified. The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS. For RC osc configuration, current through Rext is not included. The current through the resistor can be estimated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm. DS30272A-page 136 1997 Microchip Technology Inc. PIC16C71X Applicable Devices 15.2 DC Characteristics: PIC16LC71-04 (Commercial, Industrial) Standard Operating Conditions (unless otherwise stated) OOperating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) DC CHARACTERISTICS Param No. Characteristic 710 71 711 715 Sym Min Typ Max Units Conditions D001 Supply Voltage VDD 3.0 - 6.0 V D002* RAM Data Retention Voltage (Note 1) VDR - 1.5 - V D003 VDD start voltage to ensure internal Power-on Reset signal VPOR - VSS - V D004* VDD rise rate to ensure internal Power-on Reset signal SVDD 0.05 - - D010 Supply Current (Note 2) IDD - 1.4 2.5 mA XT, RC osc configuration FOSC = 4 MHz, VDD = 3.0V (Note 4) - 15 32 A LP osc configuration FOSC = 32 kHz, VDD = 3.0V, WDT disabled - 5 0.6 0.6 20 9 12 A A A VDD = 3.0V, WDT enabled, -40C to +85C VDD = 3.0V, WDT disabled, 0C to +70C VDD = 3.0V, WDT disabled, -40C to +85C D010A D020 D021 D021A * Note 1: 2: 3: 4: Power-down Current (Note 3) IPD XT, RC, and LP osc configuration See section on Power-on Reset for details V/ms See section on Power-on Reset for details These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. This is the limit to which VDD can be lowered without losing RAM data. The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD MCLR = VDD; WDT enabled/disabled as specified. The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS. For RC osc configuration, current through Rext is not included. The current through the resistor can be estimated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm. 1997 Microchip Technology Inc. DS30272A-page 137 PIC16C71X Applicable Devices 15.3 710 71 711 715 DC Characteristics: PIC16C71-04 (Commercial, Industrial) PIC16C71-20 (Commercial, Industrial) PIC16LC71-04 (Commercial, Industrial) DC CHARACTERISTICS Param No. D030 D031 D032 D033 D040 D040A D041 D042 D042A D043 D070 Characteristic Input Low Voltage I/O ports with TTL buffer with Schmitt Trigger buffer MCLR, OSC1 (in RC mode) OSC1 (in XT, HS and LP) Input High Voltage I/O ports (Note 4) with TTL buffer D060 with Schmitt Trigger buffer MCLR, RB0/INT OSC1 (XT, HS and LP) OSC1 (in RC mode) PORTB weak pull-up current Input Leakage Current (Notes 2, 3) I/O ports D061 D063 MCLR, RA4/T0CKI OSC1 D080 Output Low Voltage I/O ports D083 OSC2/CLKOUT (RC osc config) D090 Output High Voltage I/O ports (Note 3) D092 D130* Note 1: 2: 3: 4: Standard Operating Conditions (unless otherwise stated) OOperating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Operating voltage VDD range as described in DC spec Section 15.1 and Section 15.2. Sym Min Typ Max Units Conditions VIL VSS VSS VSS VSS - 0.15V 0.8V 0.2VDD 0.3VDD V V V V For entire VDD range 4.5 VDD 5.5V Note1 VIH 2.0 VDD 0.25VDD VDD + 0.8V VDD 0.85VDD 0.85VDD VDD 0.7VDD VDD 0.9VDD VDD IPURB 50 250 400 IIL VOL V For entire VDD range V V Note1 V A VDD = 5V, VPIN = VSS - - 1 - - 5 5 - - 0.6 V - - 0.6 V - V VOH VDD - 0.7 - 4.5 VDD 5.5V For entire VDD range A Vss VPIN VDD, Pin at hiimpedance A Vss VPIN VDD A Vss VPIN VDD, XT, HS and LP osc configuration IOL = 8.5mA, VDD = 4.5V, -40C to +85C IOL = 1.6mA, VDD = 4.5V, -40C to +85C IOH = -3.0mA, VDD = 4.5V, -40C to +85C OSC2/CLKOUT (RC osc config) VDD - 0.7 V IOH = -1.3mA, VDD = 4.5V, -40C to +85C Open-Drain High Voltage VOD 14 V RA4 pin Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. In RC oscillator configuration, the OSC1 pin is a Schmitt trigger input. It is not recommended that the PIC16C71 be driven with external clock in RC mode. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as current sourced by the pin. PIC16C71 Rev. "Ax" INT pin has a TTL input buffer. PIC16C71 Rev. "Bx" INT pin has a Schmitt Trigger input buffer. DS30272A-page 138 1997 Microchip Technology Inc. PIC16C71X Applicable Devices DC CHARACTERISTICS Param No. Characteristic Capacitive Loading Specs on Output Pins OSC2 pin D100 D101 Note 1: 2: 3: 4: 710 71 711 715 Standard Operating Conditions (unless otherwise stated) OOperating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Operating voltage VDD range as described in DC spec Section 15.1 and Section 15.2. Sym Min Typ Max Units Conditions COSC2 15 pF In XT, HS and LP modes when external clock is used to drive OSC1. All I/O pins and OSC2 (in RC mode) CIO 50 pF Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. In RC oscillator configuration, the OSC1 pin is a Schmitt trigger input. It is not recommended that the PIC16C71 be driven with external clock in RC mode. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as current sourced by the pin. PIC16C71 Rev. "Ax" INT pin has a TTL input buffer. PIC16C71 Rev. "Bx" INT pin has a Schmitt Trigger input buffer. 1997 Microchip Technology Inc. DS30272A-page 139 PIC16C71X Applicable Devices 15.4 710 71 711 715 Timing Parameter Symbology The timing parameter symbols have been created following one of the following formats: 1. TppS2ppS 2. TppS T F Frequency Lowercase letters (pp) and their meanings: pp cc CCP1 ck CLKOUT cs CS di SDI do SDO dt Data in io I/O port mc MCLR Uppercase letters and their meanings: S F Fall H High I Invalid (Hi-impedance) L Low T Time osc rd rw sc ss t0 t1 wr OSC1 RD RD or WR SCK SS T0CKI T1CKI WR P R V Z Period Rise Valid Hi-impedance FIGURE 15-1: LOAD CONDITIONS Load condition 1 Load condition 2 VDD/2 RL CL Pin CL Pin VSS VSS RL = 464 CL = 50 pF 15 pF DS30272A-page 140 for all pins except OSC2/CLKOUT for OSC2 output 1997 Microchip Technology Inc. PIC16C71X Applicable Devices 15.5 710 71 711 715 Timing Diagrams and Specifications FIGURE 15-2: EXTERNAL CLOCK TIMING Q4 Q1 Q2 Q3 Q4 Q1 OSC1 3 1 3 4 4 2 CLKOUT TABLE 15-2: Parameter No. EXTERNAL CLOCK TIMING REQUIREMENTS Sym Characteristic Fosc External CLKIN Frequency (Note 1) Min Typ Max Units Conditions DC -- 4 MHz XT osc mode DC -- 4 MHz HS osc mode (-04) DC -- 20 MHz HS osc mode (-20) DC -- 200 kHz LP osc mode Oscillator Frequency DC -- 4 MHz RC osc mode (Note 1) 0.1 -- 4 MHz XT osc mode 1 -- 4 MHz HS osc mode 1 -- 20 MHz HS osc mode 1 Tosc External CLKIN Period 250 -- -- ns XT osc mode (Note 1) 250 -- -- ns HS osc mode (-04) 50 -- -- ns HS osc mode (-20) 5 -- -- s LP osc mode Oscillator Period 250 -- -- ns RC osc mode (Note 1) 250 -- 10,000 ns XT osc mode 250 -- 1,000 ns HS osc mode (-04) 50 -- 1,000 ns HS osc mode (-20) 5 -- -- s LP osc mode 1.0 TCY DC s TCY = 4/Fosc 2 TCY Instruction Cycle Time (Note 1) 3 TosL, External Clock in (OSC1) High or 50 -- -- ns XT oscillator TosH Low Time 2.5 -- -- s LP oscillator 10 -- -- ns HS oscillator 4 TosR, External Clock in (OSC1) Rise or 25 -- -- ns XT oscillator TosF Fall Time 50 -- -- ns LP oscillator 15 -- -- ns HS oscillator Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Instruction cycle period (TCY) equals four times the input oscillator time-base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at "min." values with an external clock applied to the OSC1/CLKIN pin. When an external clock input is used, the "Max." cycle time limit is "DC" (no clock) for all devices. OSC2 is disconnected (has no loading) for the PIC16C71. 1997 Microchip Technology Inc. DS30272A-page 141 PIC16C71X Applicable Devices 710 71 711 715 FIGURE 15-3: CLKOUT AND I/O TIMING Q1 Q4 Q2 Q3 OSC1 11 10 CLKOUT 13 19 14 12 18 16 I/O Pin (input) 15 17 I/O Pin (output) new value old value 20, 21 Note: Refer to Figure 15-1 for load conditions. TABLE 15-3: CLKOUT AND I/O TIMING REQUIREMENTS Parameter Sym No. Characteristic Min Typ Max Units Conditions 10* TosH2ckL OSC1 to CLKOUT -- 15 30 ns Note 1 11* TosH2ckH OSC1 to CLKOUT -- 15 30 ns Note 1 12* TckR CLKOUT rise time -- 5 15 ns Note 1 13* TckF CLKOUT fall time -- 5 15 ns Note 1 14* TckL2ioV CLKOUT to Port out valid 15* TioV2ckH Port in valid before CLKOUT 16* TckH2ioI 17* TosH2ioV 18* TosH2ioI OSC1 (Q2 cycle) to Port input invalid (I/O in hold time) -- -- 0.5TCY + 20 ns Note 1 0.25TCY + 25 -- -- ns Note 1 Port in hold after CLKOUT 0 -- -- ns Note 1 OSC1 (Q1 cycle) to Port out valid -- -- 80 - 100 ns PIC16C71 100 -- -- ns PIC16LC71 200 -- -- ns 19* TioV2osH Port input valid to OSC1 (I/O in setup time) 0 -- -- ns 20* TioR Port output rise time PIC16C71 -- 10 25 ns PIC16LC71 -- -- 60 ns PIC16C71 -- 10 25 ns PIC16LC71 -- -- 60 ns 21* TioF Port output fall time 22* Tinp INT pin high or low time 20 -- -- ns 23* Trbp RB7:RB4 change INT high or low time 20 -- -- ns * These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. These parameters are asynchronous events not related to any internal clock edges. Note 1: Measurements are taken in RC Mode where CLKOUT output is 4 x TOSC. DS30272A-page 142 1997 Microchip Technology Inc. PIC16C71X Applicable Devices 710 71 711 715 FIGURE 15-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING VDD MCLR 30 Internal POR 33 PWRT Time-out 32 OSC Time-out Internal RESET Watchdog Timer RESET 31 34 34 I/O Pins Note: Refer to Figure 15-1 for load conditions. TABLE 15-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER REQUIREMENTS Parameter No. Sym Characteristic Min 200 -- -- ns VDD = 5V, -40C to +85C 7* 18 33* ms VDD = 5V, -40C to +85C Oscillation Start-up Timer Period -- 1024 TOSC -- -- TOSC = OSC1 period Power-up Timer Period 28* 72 132* ms VDD = 5V, -40C to +85C I/O High Impedance from MCLR Low -- -- 100 ns 30 TmcL MCLR Pulse Width (low) 31 Twdt Watchdog Timer Time-out Period 32 Tost 33 Tpwrt 34 TIOZ Typ Max Units Conditions (No Prescaler) * These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 1997 Microchip Technology Inc. DS30272A-page 143 PIC16C71X Applicable Devices 710 71 711 715 FIGURE 15-5: TIMER0 EXTERNAL CLOCK TIMINGS RA4/T0CKI 41 40 42 TMR0 Note: Refer to Figure 15-1 for load conditions. TABLE 15-5: Param No. 40* TIMER0 EXTERNAL CLOCK REQUIREMENTS Sym Characteristic Tt0H T0CKI High Pulse Width Min No Prescaler With Prescaler 41* Tt0L T0CKI Low Pulse Width No Prescaler With Prescaler 42* Tt0P T0CKI Period No Prescaler With Prescaler * Typ Max Units Conditions 0.5TCY + 20 -- -- ns 10 -- -- ns 0.5TCY + 20 -- -- ns 10 -- -- ns TCY + 40 -- -- ns Greater of: 20 ns or TCY + 40 N Must also meet parameter 42 Must also meet parameter 42 N = prescale value (2, 4,..., 256) These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. DS30272A-page 144 1997 Microchip Technology Inc. PIC16C71X Applicable Devices TABLE 15-6: Param No. A01 A02 A/D CONVERTER CHARACTERISTICS Sym Characteristic NR Resolution EABS Absolute error PIC16C71 PIC16LC71 A03 EIL Integral linearity error A04 EDL Differential linearity error A05 EFS Full scale error A06 EOFF Offset error PIC16C71 PIC16LC71 PIC16C71 PIC16LC71 PIC16C71 PIC16LC71 PIC16C71 PIC16LC71 A10 -- 710 71 711 715 Monotonicity Min Typ Max Units Conditions -- -- 8 bits bits VREF = VDD = 5.12V, VSS VAIN VREF -- -- < 1 LSb VREF = VDD = 5.12V, VSS VAIN VREF -- -- < 2 LSb VREF = VDD = 3.0V (Note 3) -- -- < 1 LSb VREF = VDD = 5.12V, VSS VAIN VREF -- -- < 2 LSb VREF = VDD = 3.0V (Note 3) -- -- < 1 LSb VREF = VDD = 5.12V, VSS VAIN VREF -- -- < 2 LSb VREF = VDD = 3.0V (Note 3) -- -- < 1 LSb VREF = VDD = 5.12V, VSS VAIN VREF -- -- < 2 LSb VREF = VDD = 3.0V (Note 3) -- -- < 1 LSb VREF = VDD = 5.12V, VSS VAIN VREF -- -- < 2 LSb VREF = VDD = 3.0V (Note 3) -- guaranteed -- -- 3.0V -- VDD + 0.3 V VSS - 0.3 -- VREF V VSS VAIN VREF A20 VREF Reference voltage A25 VAIN Analog input voltage A30 ZAIN Recommended impedance of analog voltage source -- -- 10.0 k A40 IAD -- 180 -- A Average current consumption when A/D is on. (Note 1) A50 IREF VREF input current (Note 2) 10 -- 1000 A -- -- 40 A During VAIN acquisition. Based on differential of VHOLD to VAIN. To charge CHOLD see Section 7.1. During A/D Conversion cycle -- -- 1 mA -- -- 10 A A/D conversion current (VDD) PIC16C71 PIC16LC71 During VAIN acquisition. Based on differential of VHOLD to VAIN. To charge CHOLD see Section 7.1. During A/D Conversion cycle * These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: When A/D is off, it will not consume any current other than minor leakage current. The power-down current spec includes any such leakage from the A/D module. 2: VREF current is from RA3 pin or VDD pin, whichever is selected as reference input. 3: These specifications apply if VREF = 3.0V and if VDD 3.0V. VAIN must be between VSS and VREF. 1997 Microchip Technology Inc. DS30272A-page 145 PIC16C71X Applicable Devices 710 71 711 715 FIGURE 15-6: A/D CONVERSION TIMING BSF ADCON0, GO 1 Tcy (TOSC/2) (1) 131 Q4 130 132 A/D CLK 7 A/D DATA 6 5 4 3 2 1 0 NEW_DATA OLD_DATA ADRES ADIF GO DONE SAMPLING STOPPED SAMPLE Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. TABLE 15-7: A/D CONVERSION REQUIREMENTS Param No. Sym Characteristic 130 TAD A/D clock period Min Typ Max Units PIC16C71 2.0 -- -- s TOSC based, VREF 3.0V PIC16LC71 2.0 -- -- s TOSC based, VREF full range PIC16C71 2.0 4.0 6.0 s A/D RC Mode PIC16LC71 3.0 6.0 9.0 s A/D RC Mode -- 9.5 -- TAD Note 2 20 -- s 5* -- -- s The minimum time is the amplifier settling time. This may be used if the "new" input voltage has not changed by more than 1 LSb (i.e., 19.5 mV @ 5.12V) from the last sampled voltage (as stated on CHOLD). -- Tosc/2 -- -- If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. 1.5 -- -- TAD 131 TCNV Conversion time (not including S/H time) (Note 1) 132 TACQ Acquisition time 134 TGO 135 TSWC Conditions Q4 to A/D clock start Switching from convert sample time * These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. These specifications ensured by design. Note 1: ADRES register may be read on the following TCY cycle. 2: See Section 7.1 for min conditions. DS30272A-page 146 1997 Microchip Technology Inc. PIC16C71X Applicable Devices 16.0 DC AND AC CHARACTERISTICS GRAPHS AND TABLES FOR PIC16C71 FIGURE 16-2: TYPICAL RC OSCILLATOR FREQUENCY VS. VDD 5.0 R = 4.7k The graphs and tables provided in this section are for design guidance and are not tested or guaranteed. In some graphs or tables the data presented are outside specified operating range (e.g. outside specified VDD range). This is for information only and devices are guaranteed to operate properly only within the specified range. The data presented in this section is a statistical summary of data collected on units from different lots over a period of time and matrix samples. 'Typical' represents the mean of the distribution while 'max' or 'min' represents (mean + 3) and (mean - 3) respectively where is standard deviation. 4.5 4.0 3.5 3.0 R = 10k 2.5 Fosc (MHz) Note: 2.0 1.5 Cext = 20 pF, T = 25C FIGURE 16-1: TYPICAL RC OSCILLATOR FREQUENCY VS. TEMPERATURE 1.0 R = 100k 0.5 Fosc Fosc (25C) Frequency Normalized to 25C 0.0 3.0 1.050 1.025 3.5 4.0 4.5 5.0 5.5 6.0 VDD (Volts) Rext = 10k Cext = 100 pF FIGURE 16-3: TYPICAL RC OSCILLATOR FREQUENCY VS. VDD 1.000 VDD = 5.5V 0.975 710 71 711 715 2.0 0.950 R = 3.3k 1.8 VDD = 3.5V 0.925 0.900 1.6 0.875 1.4 R = 4.7k 0.850 0 10 20 30 40 50 60 70 1.2 T(C) Fosc (MHz) 1.0 0.8 R = 10k 0.6 Cext = 100 pF, T = 25C 0.4 0.2 0.0 3.0 R = 100k 3.5 4.0 4.5 5.0 5.5 6.0 VDD (Volts) 1997 Microchip Technology Inc. DS30272A-page 147 PIC16C71X Applicable Devices 710 71 711 715 FIGURE 16-4: TYPICAL RC OSCILLATOR FREQUENCY VS. VDD TABLE 16-1: RC OSCILLATOR FREQUENCIES .8 Average R = 3.3k Cext Rext FOSC @ 5V, 25C .7 20 pF 4.7k 10k 100k 3.3k 4.7k 10k 100k 3.3k 4.7k 10k 100k R = 4.7k .6 Fosc (MHz) 100 pF .5 300 pF .4 R = 10k .3 Cext = 300 pF, T = 25C R = 100k 0 3.0 3.5 4.0 17.35% 10.10% 11.90% 9.43% 9.83% 10.92% 16.03% 10.97% 10.14% 10.43% 11.24% The percentage variation indicated here is part to part variation due to normal process distribution. The variation indicated is 3 standard deviation from average value for VDD = 5V. .1 4.5 5.0 5.5 6.0 FIGURE 16-6: TYPICAL IPD VS. VDD WATCHDOG TIMER ENABLED 25C VDD (Volts) 14 FIGURE 16-5: TYPICAL IPD VS. VDD WATCHDOG TIMER DISABLED 25C 12 0.6 10 IPD (A) 0.5 0.4 8 6 IPD (A) Data based on matrix samples. See first page of this section for details. .2 4.52 MHz 2.47 MHz 290.86 kHz 1.92 MHz 1.49 MHz 788.77 kHz 88.11 kHz 726.89 kHz 573.95 kHz 307.31 kHz 33.82 kHz 0.3 4 0.2 2 0 0.1 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (Volts) 0.0 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (Volts) DS30272A-page 148 1997 Microchip Technology Inc. PIC16C71X Applicable Devices FIGURE 16-7: MAXIMUM IPD VS. VDD WATCHDOG DISABLED 710 71 711 715 FIGURE 16-8: MAXIMUM IPD VS. VDD WATCHDOG ENABLED 45 25 -55C -40C 40 125C 35 20 30 125C 25 20 0C 70C 85C 15 10 85C 70C 10 5 5 0 3.0 3.5 4.0 4.5 5.0 VDD (Volts) 5.5 0C -40C -55C 6.0 0 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VDD (Volts) IPD, with Watchdog Timer enabled, has two components: The leakage current which increases with higher temperature and the operating current of the Watchdog Timer logic which increases with lower temperature. At -40C, the latter dominates explaining the apparently anomalous behavior. FIGURE 16-9: VTH (INPUT THRESHOLD VOLTAGE) OF I/O PINS VS. VDD 2.00 1.80 Max (-40C to 85C) VTH (Volts) 1.60 25C, TYP 1.40 1.20 Min (-40C to 85C) 1.00 0.80 0.60 2.5 1997 Microchip Technology Inc. 3.0 3.5 4.0 4.5 VDD (Volts) 5.0 5.5 6.0 DS30272A-page 149 Data based on matrix samples. See first page of this section for details. IPD (A) IPD (A) 15 PIC16C71X Applicable Devices 710 71 711 715 FIGURE 16-10: VIH, VIL OF MCLR, T0CKI AND OSC1 (IN RC MODE) VS. VDD 4.50 VIH, Max (-40C to 85C) VIH, Typ (25C) 4.00 VIH, Min (-40C to 85C) VIH, VIL (Volts) 3.50 3.00 2.50 2.00 1.50 VIL, Max (-40C to 85C) 1.00 VIL, Typ (25C) VIL, Min (-40C to 85C) 0.50 0.00 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Note: These input pins have a Schmitt Trigger input buffer. FIGURE 16-11: VTH (INPUT THRESHOLD VOLTAGE) OF OSC1 INPUT (IN XT, HS, AND LP MODES) VS. VDD Min (-40C to 85C) 3.60 3.40 TYP (25C) Max (-40C to 85C) 3.20 3.00 2.80 2.60 VTH (Volts) Data based on matrix samples. See first page of this section for details. VDD (Volts) Min (-40C to 85C) 2.40 2.20 2.00 1.80 1.60 1.40 1.20 1.00 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 VDD (Volts) DS30272A-page 150 1997 Microchip Technology Inc. PIC16C71X Applicable Devices 710 71 711 715 FIGURE 16-12: TYPICAL IDD VS. FREQ (EXT CLOCK, 25C) 10,000 6.0 5.5 5.0 4.5 4.0 3.5 3.0 100 10 1 10,000 100,000 1,000,000 100,000,000 10,000,000 Frequency (Hz) FIGURE 16-13: MAXIMUM, IDD VS. FREQ (EXT CLOCK, -40 TO +85C) 10,000 6.0 5.5 5.0 4.5 4.0 3.5 3.0 IDD (A) 1,000 100 10 10,000 100,000 1,000,000 10,000,000 100,000,000 Frequency (Hz) 1997 Microchip Technology Inc. DS30272A-page 151 Data based on matrix samples. See first page of this section for details. IDD (A) 1,000 PIC16C71X Applicable Devices 710 71 711 715 FIGURE 16-14: MAXIMUM IDD VS. FREQ WITH A/D OFF (EXT CLOCK, -55 TO +125C) 10,000 6.0 5.5 5.0 4.5 4.0 3.5 3.0 IDD (A) 1,000 10 10,000 100,000 1,000,000 100,000,000 10,000,000 Frequency (Hz) FIGURE 16-15: WDT TIMER TIME-OUT PERIOD VS. VDD FIGURE 16-16: TRANSCONDUCTANCE (gm) OF HS OSCILLATOR VS. VDD 9000 50 8000 45 7000 40 Max, -40C 35 gm (A/V) 6000 WDT Period (ms) Data based on matrix samples. See first page of this section for details. 100 Max, 85C Max, 70C 30 25 5000 4000 Typ, 25C 3000 20 Min, 85C 2000 Typ, 25C Min, 0C 1000 15 0 10 2 Min, -40C 3 4 5 6 7 VDD (Volts) 5 2 3 4 5 6 7 VDD (Volts) DS30272A-page 152 1997 Microchip Technology Inc. PIC16C71X Applicable Devices FIGURE 16-17: TRANSCONDUCTANCE (gm) OF LP OSCILLATOR VS. VDD 710 71 711 715 FIGURE 16-19: IOH VS. VOH, VDD = 3V 0 225 200 -5 Max, -40C Min, 85C 175 -10 Typ, 25C IOH (mA) gm (A/V) 150 125 100 Min, 85C Typ, 25C -15 Max, -40C 50 -20 25 0 3.0 3.5 4.0 4.5 VDD (Volts) 5.0 5.5 6.0 FIGURE 16-18: TRANSCONDUCTANCE (gm) OF XT OSCILLATOR VS. VDD -25 0.0 0.5 1.0 1.5 2.0 VOH (Volts) 2.5 3.0 FIGURE 16-20: IOH VS. VOH, VDD = 5V 0 2500 -5 Max, -40C -10 2000 IOH (mA) -15 gm (A/V) Typ, 25C 1500 -20 Min @ 85C -25 Typ @ 25C -30 1000 -35 -40 Max @ -40C Min, 85C 500 -45 -50 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 2 3 4 5 VDD (Volts) 1997 Microchip Technology Inc. 6 7 VOH (Volts) DS30272A-page 153 Data based on matrix samples. See first page of this section for details. 75 PIC16C71X Applicable Devices 710 71 711 715 FIGURE 16-22: IOL VS. VOL, VDD = 5V FIGURE 16-21: IOL VS. VOL, VDD = 3V 35 90 Max @ -40C 30 80 Max @ -40C 70 25 60 Typ @ 25C Typ @ 25C 15 Min @ +85C IOL (mA) IOL (mA) 20 50 Min @ +85C 40 30 10 20 Data based on matrix samples. See first page of this section for details. 5 10 0 0.0 0.5 1.0 1.5 VOL (Volts) 2.0 2.5 3.0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VOL (Volts) DS30272A-page 154 1997 Microchip Technology Inc. PIC16C71X 17.0 PACKAGING INFORMATION 17.1 18-Lead Ceramic CERDIP Dual In-line with Window (300 mil) (JW) N C E1 E eA eB Pin No. 1 Indicator Area D S S1 Base Plane Seating Plane L B1 A1 A3 A e1 B A2 D1 Package Group: Ceramic CERDIP Dual In-Line (CDP) Millimeters Symbol Min Max Inches Notes Min Max 0 10 0 10 A A1 A2 A3 B B1 C D D1 E E1 e1 eA eB L N S S1 -- 0.381 3.810 3.810 0.355 1.270 0.203 22.352 20.320 7.620 5.588 2.540 7.366 7.620 3.175 18 0.508 0.381 5.080 1.7780 4.699 4.445 0.585 1.651 0.381 23.622 20.320 8.382 7.874 2.540 8.128 10.160 3.810 18 1.397 1.270 -- 0.015 0.150 0.150 0.014 0.050 0.008 0.880 0.800 0.300 0.220 0.100 0.290 0.300 0.125 18 0.020 0.015 0.200 0.070 0.185 0.175 0.023 0.065 0.015 0.930 0.800 0.330 0.310 0.100 0.320 0.400 0.150 18 0.055 0.050 1997 Microchip Technology Inc. Typical Typical Reference Reference Typical Notes Typical Typical Reference Reference Typical DS30272A-page 155 PIC16C71X 17.2 18-Lead Plastic Dual In-line (300 mil) (P) N C E1 E eA eB Pin No. 1 Indicator Area D S S1 Base Plane Seating Plane L B1 A1 A2 A e1 B D1 Package Group: Plastic Dual In-Line (PLA) Millimeters Symbol Min Max 0 A A1 A2 B B1 C D D1 E E1 e1 eA eB L N S S1 - 0.381 3.048 0.355 1.524 0.203 22.479 20.320 7.620 6.096 2.489 7.620 7.874 3.048 18 0.889 0.127 DS30272A-page 156 Inches Notes Min Max 10 0 10 4.064 - 3.810 0.559 1.524 0.381 23.495 20.320 8.255 7.112 2.591 7.620 9.906 3.556 18 - - - 0.015 0.120 0.014 0.060 0.008 0.885 0.800 0.300 0.240 0.098 0.300 0.310 0.120 18 0.035 0.005 0.160 - 0.150 0.022 0.060 0.015 0.925 0.800 0.325 0.280 0.102 0.300 0.390 0.140 18 - - Reference Typical Reference Typical Reference Notes Reference Typical Reference Typical Reference 1997 Microchip Technology Inc. PIC16C71X 17.3 18-Lead Plastic Surface Mount (SOIC - Wide, 300 mil Body)(SO) e B h x 45 N Index Area E H C Chamfer h x 45 L 1 2 3 D Seating Plane Base Plane CP A1 A Package Group: Plastic SOIC (SO) Millimeters Symbol Min Max Inches Notes Min Max 0 8 0 8 A A1 B C D E e H h L N CP 2.362 0.101 0.355 0.241 11.353 7.416 1.270 10.007 0.381 0.406 18 - 2.642 0.300 0.483 0.318 11.735 7.595 1.270 10.643 0.762 1.143 18 0.102 0.093 0.004 0.014 0.009 0.447 0.292 0.050 0.394 0.015 0.016 18 - 0.104 0.012 0.019 0.013 0.462 0.299 0.050 0.419 0.030 0.045 18 0.004 1997 Microchip Technology Inc. Reference Notes Reference DS30272A-page 157 PIC16C71X 17.4 20-Lead Plastic Surface Mount (SSOP - 209 mil Body 5.30 mm) (SS) N Index area E H C L 1 2 3 B e A Base plane CP Seating plane D A1 Package Group: Plastic SSOP Millimeters Symbol Min Max 0 A A1 B C D E e H L N CP 1.730 0.050 0.250 0.130 7.070 5.200 0.650 7.650 0.550 20 - Inches Notes Min Max 8 0 8 1.990 0.210 0.380 0.220 7.330 5.380 0.650 7.900 0.950 20 0.102 0.068 0.002 0.010 0.005 0.278 0.205 0.026 0.301 0.022 20 - 0.078 0.008 0.015 0.009 0.289 0.212 0.026 0.311 0.037 20 0.004 Reference Notes Reference Note 1: Dimensions D1 and E1 do not include mold protrusion. Allowable mold protrusion is 0.25m/m (0.010") per side. D1 and E1 dimensions including mold mismatch. 2: Dimension "b" does not include Dambar protrusion, allowable Dambar protrusion shall be 0.08m/m (0.003")max. 3: This outline conforms to JEDEC MS-026. DS30272A-page 158 1997 Microchip Technology Inc. PIC16C71X 17.5 Package Marking Information 18-Lead PDIP Example MMMMMMMMMMMMM XXXXXXXXXXXXXXXX AABBCDE 18-Lead SOIC PIC16C711-04/P 9452CBA Example MMMMMMMMMM XXXXXXXXXXXX XXXXXXXXXXXX AABBCDE PIC16C715 -20/50 9447CBA 18-Lead CERDIP Windowed Example MMMMMM XXXXXXXX AABBCDE 20-Lead SSOP Example XXXXXXXX XXXXXXXX PIC16C710 20I/SS025 AABBCAE Legend: 9517SBP MM...M XX...X AA BB C D1 E Note: PIC16C71 /JW 945/CBT Microchip part number information Customer specific information* Year code (last 2 digits of calender year) Week code (week of January 1 is week '01') Facility code of the plant at which wafer is manufactured. C = Chandler, Arizona, U.S.A. S = Tempe, Arizona, U.S.A. Mask revision number for microcontroller Assembly code of the plant or country of origin in which part was assembled. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask revision number, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. 1997 Microchip Technology Inc. DS30272A-page 159 PIC16C71X NOTES: DS30272A-page 160 1997 Microchip Technology Inc. PIC16C71X APPENDIX A: APPENDIX B: COMPATIBILITY The following are the list of modifications over the PIC16C5X microcontroller family: To convert code written for PIC16C5X to PIC16CXX, the user should take the following steps: 1. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. Instruction word length is increased to 14-bits. This allows larger page sizes both in program memory (1K now as opposed to 512 before) and register file (68 bytes now versus 32 bytes before). A PC high latch register (PCLATH) is added to handle program memory paging. Bits PA2, PA1, PA0 are removed from STATUS register. Data memory paging is redefined slightly. STATUS register is modified. Four new instructions have been added: RETURN, RETFIE, ADDLW, and SUBLW. Two instructions TRIS and OPTION are being phased out although they are kept for compatibility with PIC16C5X. OPTION and TRIS registers are made addressable. Interrupt capability is added. Interrupt vector is at 0004h. Stack size is increased to 8 deep. Reset vector is changed to 0000h. Reset of all registers is revisited. Five different reset (and wake-up) types are recognized. Registers are reset differently. Wake up from SLEEP through interrupt is added. Two separate timers, Oscillator Start-up Timer (OST) and Power-up Timer (PWRT) are included for more reliable power-up. These timers are invoked selectively to avoid unnecessary delays on power-up and wake-up. PORTB has weak pull-ups and interrupt on change feature. T0CKI pin is also a port pin (RA4) now. FSR is made a full eight bit register. "In-circuit serial programming" is made possible. The user can program PIC16CXX devices using only five pins: VDD, VSS, MCLR/VPP, RB6 (clock) and RB7 (data in/out). PCON status register is added with a Power-on Reset status bit (POR). Code protection scheme is enhanced such that portions of the program memory can be protected, while the remainder is unprotected. Brown-out protection circuitry has been added. Controlled by configuration word bit BODEN. Brown-out reset ensures the device is placed in a reset condition if VDD dips below a fixed setpoint. 1997 Microchip Technology Inc. 2. 3. 4. 5. Remove any program memory page select operations (PA2, PA1, PA0 bits) for CALL, GOTO. Revisit any computed jump operations (write to PC or add to PC, etc.) to make sure page bits are set properly under the new scheme. Eliminate any data memory page switching. Redefine data variables to reallocate them. Verify all writes to STATUS, OPTION, and FSR registers since these have changed. Change reset vector to 0000h. DS30272A-page 161 PIC16C71X APPENDIX C: WHAT'S NEW APPENDIX D: WHAT'S CHANGED 1. 1. Consolidated all pin compatible 18-pin A/D based devices into one data sheet. 2. 3. DS30272A-page 162 Minor changes, spelling and grammatical changes. Low voltage operation on the PIC16LC710/711/ 715 has been reduced from 3.0V to 2.5V. Part numbers of the PIC16C70 and PIC16C71A have changed to PIC16C710 and PIC16C711, respectively. 1997 Microchip Technology Inc. PIC16C71X INDEX A A/D Accuracy/Error ........................................................... 44 ADIF bit ...................................................................... 39 Analog Input Model Block Diagram ............................ 40 Analog-to-Digital Converter ........................................ 37 Configuring Analog Port Pins ..................................... 41 Configuring the Interrupt ............................................ 39 Configuring the Module .............................................. 39 Connection Considerations ........................................ 44 Conversion Clock ....................................................... 41 Conversion Time ........................................................ 43 Conversions ............................................................... 42 Converter Characteristics .......................... 99, 122, 145 Delays ........................................................................ 40 Effects of a Reset ....................................................... 44 Equations ................................................................... 40 Faster Conversion - Lower Resolution Trade-off ....... 43 Flowchart of A/D Operation ........................................ 45 GO/DONE bit ............................................................. 39 Internal Sampling Switch (Rss) Impedence ............... 40 Minimum Charging Time ............................................ 40 Operation During Sleep ............................................. 44 Sampling Requirements ............................................. 40 Source Impedence ..................................................... 40 Time Delays ............................................................... 40 Transfer Function ....................................................... 45 Absolute Maximum Ratings ............................... 89, 111, 135 AC Characteristics PIC16C710 .............................................................. 101 PIC16C711 .............................................................. 101 PIC16C715 .............................................................. 125 ADCON0 Register .............................................................. 37 ADCON1 ............................................................................ 37 ADCON1 Register ........................................................ 14, 37 ADCS0 bit .......................................................................... 37 ADCS1 bit .......................................................................... 37 ADIE bit ........................................................................ 19, 20 ADIF bit ........................................................................ 21, 37 ADON bit ............................................................................ 37 ADRES Register .................................................... 15, 37, 39 ALU ...................................................................................... 7 Application Notes AN546 ........................................................................ 37 AN552 ........................................................................ 27 AN556 ........................................................................ 23 AN607, Power-up Trouble Shooting .......................... 53 Architecture Harvard ........................................................................ 7 Overview ...................................................................... 7 von Neumann ............................................................... 7 Assembler MPASM Assembler .................................................... 86 B Block Diagrams Analog Input Model .................................................... 40 On-Chip Reset Circuit ................................................ 52 PIC16C71X .................................................................. 8 RA3/RA0 Port Pins .................................................... 25 RA4/T0CKI Pin ........................................................... 25 RB3:RB0 Port Pins .................................................... 27 RB7:RB4 Pins ............................................................ 28 1997 Microchip Technology Inc. RB7:RB4 Port Pins .....................................................28 Timer0 ........................................................................31 Timer0/WDT Prescaler ...............................................34 Watchdog Timer .........................................................65 BODEN bit ..........................................................................48 BOR bit ........................................................................ 22, 54 Brown-out Reset (BOR) ......................................................53 C C bit ....................................................................................17 C16C71 ..............................................................................47 Carry bit ................................................................................7 CHS0 bit .............................................................................37 CHS1 bit .............................................................................37 Clocking Scheme ................................................................10 Code Examples Call of a Subroutine in Page 1 from Page 0 ...............24 Changing Prescaler (Timer0 to WDT) ........................35 Changing Prescaler (WDT to Timer0) ........................35 Doing an A/D Conversion ...........................................42 I/O Programming ........................................................30 Indirect Addressing .....................................................24 Initializing PORTA ......................................................25 Initializing PORTB ......................................................27 Saving STATUS and W Registers in RAM .................64 Code Protection ........................................................... 47, 67 Computed GOTO ...............................................................23 Configuration Bits ...............................................................47 CP0 bit ......................................................................... 47, 48 CP1 bit ................................................................................48 D DC bit ..................................................................................17 DC Characteristics ........................................................... 147 PIC16C71 ................................................................ 136 PIC16C710 ........................................................ 90, 101 PIC16C711 ........................................................ 90, 101 PIC16C715 ...................................................... 113, 125 Development Support .................................................... 3, 85 Development Tools .............................................................85 Diagrams - See Block Diagrams Digit Carry bit ........................................................................7 Direct Addressing ...............................................................24 E Electrical Characteristics PIC16C71 ................................................................ 135 PIC16C710 .................................................................89 PIC16C711 .................................................................89 PIC16C715 .............................................................. 111 External Brown-out Protection Circuit .................................60 External Power-on Reset Circuit ........................................60 F Family of Devices PIC16C71X ...................................................................4 FOSC0 bit .................................................................... 47, 48 FOSC1 bit .................................................................... 47, 48 FSR Register ......................................................... 15, 16, 24 Fuzzy Logic Dev. System (fuzzyTECH-MP) .....................87 G General Description ..............................................................3 GIE bit .......................................................................... 19, 61 GO/DONE bit ......................................................................37 DS30390D-page 163 PIC16C71X I I/O Ports PORTA ....................................................................... 25 PORTB ....................................................................... 27 Section ....................................................................... 25 I/O Programming Considerations ....................................... 30 ICEPIC Low-Cost PIC16CXXX In-Circuit Emulator ........... 85 In-Circuit Serial Programming ...................................... 47, 67 INDF Register ........................................................ 14, 16, 24 Indirect Addressing ............................................................ 24 Instruction Cycle ................................................................. 10 Instruction Flow/Pipelining ................................................. 10 Instruction Format .............................................................. 69 Instruction Set ADDLW ...................................................................... 71 ADDWF ...................................................................... 71 ANDLW ...................................................................... 71 ANDWF ...................................................................... 71 BCF ............................................................................ 72 BSF ............................................................................ 72 BTFSC ....................................................................... 72 BTFSS ....................................................................... 73 CALL .......................................................................... 73 CLRF .......................................................................... 74 CLRW ........................................................................ 74 CLRWDT .................................................................... 74 COMF ........................................................................ 75 DECF ......................................................................... 75 DECFSZ ..................................................................... 75 GOTO ........................................................................ 76 INCF ........................................................................... 76 INCFSZ ...................................................................... 77 IORLW ....................................................................... 77 IORWF ....................................................................... 78 MOVF ......................................................................... 78 MOVLW ..................................................................... 78 MOVWF ..................................................................... 78 NOP ........................................................................... 79 OPTION ..................................................................... 79 RETFIE ...................................................................... 79 RETLW ...................................................................... 80 RETURN .................................................................... 80 RLF ............................................................................ 81 RRF ............................................................................ 81 SLEEP ....................................................................... 82 SUBLW ...................................................................... 82 SUBWF ...................................................................... 83 SWAPF ...................................................................... 83 TRIS ........................................................................... 83 XORLW ...................................................................... 84 XORWF ...................................................................... 84 Section ....................................................................... 69 Summary Table .......................................................... 70 INT Interrupt ....................................................................... 63 INTCON Register ............................................................... 19 INTE bit .............................................................................. 19 INTEDG bit ................................................................... 18, 63 Internal Sampling Switch (Rss) Impedence ....................... 40 Interrupts ............................................................................ 47 A/D ............................................................................. 61 External ...................................................................... 61 PORTB Change ......................................................... 61 PortB Change ............................................................ 63 RB7:RB4 Port Change ............................................... 27 Section ....................................................................... 61 TMR0 ......................................................................... 63 DS30390D-page 164 TMR0 Overflow .......................................................... 61 INTF bit .............................................................................. 19 IRP bit ................................................................................ 17 K KeeLoq Evaluation and Programming Tools ................... 87 L Loading of PC .................................................................... 23 LP ...................................................................................... 54 M MCLR ........................................................................... 52, 56 Memory Data Memory ............................................................. 12 Program Memory ....................................................... 11 Register File Maps PIC16C71 .......................................................... 12 PIC16C710 ........................................................ 12 PIC16C711 ........................................................ 13 PIC16C715 ........................................................ 13 MP-DriveWay - Application Code Generator .................. 87 MPEEN bit ................................................................... 22, 48 MPLAB C ........................................................................ 87 MPLAB Integrated Development Environment Software ............................................................................. 86 O OPCODE ........................................................................... 69 OPTION Register ............................................................... 18 Orthogonal ........................................................................... 7 OSC selection .................................................................... 47 Oscillator HS ........................................................................ 49, 54 LP ........................................................................ 49, 54 RC ............................................................................. 49 XT ........................................................................ 49, 54 Oscillator Configurations .................................................... 49 Oscillator Start-up Timer (OST) ......................................... 53 P Packaging 18-Lead CERDIP w/Window ................................... 155 18-Lead PDIP .......................................................... 156 18-Lead SOIC .......................................................... 157 20-Lead SSOP ........................................................ 158 Paging, Program Memory .................................................. 23 PCL Register ................................................... 14, 15, 16, 23 PCLATH ....................................................................... 57, 58 PCLATH Register ............................................ 14, 15, 16, 23 PCON Register ............................................................ 22, 54 PD bit ..................................................................... 17, 52, 55 PER bit ............................................................................... 22 PIC16C71 ........................................................................ 147 AC Characteristics ................................................... 147 PICDEM-1 Low-Cost PIC16/17 Demo Board .................... 86 PICDEM-2 Low-Cost PIC16CXX Demo Board .................. 86 PICDEM-3 Low-Cost PIC16CXXX Demo Board ............... 86 PICMASTER In-Circuit Emulator ..................................... 85 PICSTART Plus Entry Level Development System ......... 85 PIE1 Register ..................................................................... 20 Pin Functions MCLR/VPP ................................................................... 9 OSC1/CLKIN ............................................................... 9 OSC2/CLKOUT ........................................................... 9 RA0/AN0 ...................................................................... 9 RA1/AN1 ...................................................................... 9 1997 Microchip Technology Inc. PIC16C71X RA2/AN2 ...................................................................... 9 RA3/AN3/VREF ............................................................. 9 RA4/T0CKI ................................................................... 9 RB0/INT ....................................................................... 9 RB1 .............................................................................. 9 RB2 .............................................................................. 9 RB3 .............................................................................. 9 RB4 .............................................................................. 9 RB5 .............................................................................. 9 RB6 .............................................................................. 9 RB7 .............................................................................. 9 VDD .............................................................................. 9 VSS ............................................................................... 9 Pinout Descriptions PIC16C71 .................................................................... 9 PIC16C710 .................................................................. 9 PIC16C711 .................................................................. 9 PIC16C715 .................................................................. 9 PIR1 Register ..................................................................... 21 POP ................................................................................... 23 POR ............................................................................. 53, 54 Oscillator Start-up Timer (OST) ........................... 47, 53 Power Control Register (PCON) ................................ 54 Power-on Reset (POR) ............................ 47, 53, 57, 58 Power-up Timer (PWRT) ..................................... 47, 53 Time-out Sequence .................................................... 54 Time-out Sequence on Power-up .............................. 59 TO ........................................................................ 52, 55 POR bit ........................................................................ 22, 54 Port RB Interrupt ................................................................ 63 PORTA ......................................................................... 57, 58 PORTA Register .................................................... 14, 15, 25 PORTB ......................................................................... 57, 58 PORTB Register .................................................... 14, 15, 27 Power-down Mode (SLEEP) .............................................. 66 Prescaler, Switching Between Timer0 and WDT ............... 35 PRO MATE II Universal Programmer .............................. 85 Program Branches ............................................................... 7 Program Memory Paging ........................................................................ 23 Program Memory Maps PIC16C71 .................................................................. 11 PIC16C710 ................................................................ 11 PIC16C711 ................................................................ 11 PIC16C715 ................................................................ 11 Program Verification .......................................................... 67 PS0 bit ............................................................................... 18 PS1 bit ............................................................................... 18 PS2 bit ............................................................................... 18 PSA bit ............................................................................... 18 PUSH ................................................................................. 23 PWRT Power-up Timer (PWRT) ........................................... 53 PWRTE bit ................................................................... 47, 48 R RBIE bit .............................................................................. 19 RBIF bit .................................................................. 19, 27, 63 RBPU bit ............................................................................ 18 RC ...................................................................................... 54 RC Oscillator ................................................................ 51, 54 Read-Modify-Write ............................................................. 30 Register File ....................................................................... 12 Registers Maps PIC16C71 .......................................................... 12 PIC16C710 ........................................................ 12 1997 Microchip Technology Inc. PIC16C711 .........................................................13 PIC16C715 .........................................................13 Reset Conditions ........................................................56 Summary ............................................................. 14-?? Reset ........................................................................... 47, 52 Reset Conditions for Special Registers ..............................56 RP0 bit ......................................................................... 12, 17 RP1 bit ................................................................................17 S SEEVAL Evaluation and Programming System ...............87 Services One-Time-Programmable (OTP) Devices ....................5 Quick-Turnaround-Production (QTP) Devices ..............5 Serialized Quick-Turnaround Production (SQTP) Devices .........................................................................5 SLEEP ......................................................................... 47, 52 Software Simulator (MPLAB SIM) ...................................87 Special Features of the CPU ..............................................47 Special Function Registers PIC16C71 ...................................................................14 PIC16C710 .................................................................14 PIC16C711 .................................................................14 Special Function Registers, Section ...................................14 Stack ...................................................................................23 Overflows ....................................................................23 Underflow ...................................................................23 STATUS Register ...............................................................17 T T0CS bit ..............................................................................18 T0IE bit ...............................................................................19 T0IF bit ...............................................................................19 TAD .....................................................................................41 Timer0 RTCC ................................................................... 57, 58 Timers Timer0 Block Diagram ....................................................31 External Clock ....................................................33 External Clock Timing ........................................33 Increment Delay .................................................33 Interrupt ..............................................................31 Interrupt Timing ..................................................32 Prescaler ............................................................34 Prescaler Block Diagram ....................................34 Section ...............................................................31 Switching Prescaler Assignment ........................35 Synchronization ..................................................33 T0CKI .................................................................33 T0IF ....................................................................63 Timing .................................................................31 TMR0 Interrupt ...................................................63 Timing Diagrams A/D Conversion ....................................... 100, 124, 146 Brown-out Reset .................................................. 53, 97 CLKOUT and I/O ....................................... 96, 119, 142 External Clock Timing ................................ 95, 118, 141 Power-up Timer ................................................. 97, 143 Reset ................................................................. 97, 143 Start-up Timer .................................................... 97, 143 Time-out Sequence ....................................................59 Timer0 ................................................. 31, 98, 121, 144 Timer0 Interrupt Timing ..............................................32 Timer0 with External Clock .........................................33 Wake-up from SLEEP through Interrupt .....................67 Watchdog Timer ................................................ 97, 143 DS30390D-page 165 PIC16C71X TO bit ................................................................................. 17 TOSE bit ............................................................................. 18 TRISA Register ...................................................... 14, 16, 25 TRISB Register ...................................................... 14, 16, 27 Two's Complement .............................................................. 7 LIST OF EXAMPLES U Example 4-2: Example 5-1: Example 5-2: Example 5-3: Upward Compatibility ........................................................... 3 UV Erasable Devices ........................................................... 5 W W Register ALU .............................................................................. 7 Wake-up from SLEEP ........................................................ 66 Watchdog Timer (WDT) ................................... 47, 52, 56, 65 WDT ................................................................................... 56 Block Diagram ............................................................ 65 Programming Considerations .................................... 65 Timeout ................................................................ 57, 58 WDT Period ........................................................................ 65 WDTE bit ...................................................................... 47, 48 Z Z bit .................................................................................... 17 Zero bit ................................................................................. 7 Example 3-1: Example 4-1: Example 6-1: Example 6-2: Equation 7-1: Example 7-1: Example 7-2: Example 7-3: Example 8-1: LIST OF FIGURES Figure 3-1: Figure 3-2: Figure 4-1: Figure 4-2: Figure 4-3: Figure 4-4: Figure 4-5: Figure 4-6: Figure 4-7: Figure 4-8: Figure 4-9: Figure 4-10: Figure 4-11: Figure 4-12: Figure 4-13: Figure 4-14: Figure 4-15: Figure 5-1: Figure 5-2: Figure 5-3: Figure 5-4: Figure 5-5: Figure 5-6: Figure 6-1: Figure 6-2: Figure 6-3: Figure 6-4: Figure 6-5: Figure 6-6: Figure 7-1: Figure 7-2: DS30390D-page 166 Instruction Pipeline Flow ........................... 10 Call of a Subroutine in Page 1 from Page 0 ...................................................... 24 Indirect Addressing ................................... 24 Initializing PORTA..................................... 25 Initializing PORTB..................................... 27 Read-Modify-Write Instructions on an I/O Port ........................................... 30 Changing Prescaler (Timer0WDT) ........ 35 Changing Prescaler (WDTTimer0) ........ 35 A/D Minimum Charging Time.................... 40 Calculating the Minimum Required Aquisition Time ......................................... 40 A/D Conversion......................................... 42 4-bit vs. 8-bit Conversion Times ............... 43 Saving STATUS and W Registers in RAM ...................................................... 64 PIC16C71X Block Diagram ........................ 8 Clock/Instruction Cycle ............................. 10 PIC16C710 Program Memory Map and Stack .................................................. 11 PIC16C71/711 Program Memory Map and Stack .................................................. 11 PIC16C715 Program Memory Map and Stack .................................................. 11 PIC16C710/71 Register File Map ............. 12 PIC16C711 Register File Map .................. 13 PIC16C715 Register File Map .................. 13 Status Register (Address 03h, 83h).......... 17 OPTION Register (Address 81h, 181h) .... 18 INTCON Register (Address 0Bh, 8Bh) ..... 19 PIE1 Register (Address 8Ch) ................... 20 PIR1 Register (Address 0Ch) ................... 21 PCON Register (Address 8Eh), PIC16C710/711 ........................................ 22 PCON Register (Address 8Eh), PIC16C715 ............................................... 22 Loading of PC In Different Situations........ 23 Direct/Indirect Addressing......................... 24 Block Diagram of RA3:RA0 Pins .............. 25 Block Diagram of RA4/T0CKI Pin ............. 25 Block Diagram of RB3:RB0 Pins .............. 27 Block Diagram of RB7:RB4 Pins (PIC16C71) ............................................... 28 Block Diagram of RB7:RB4 Pins (PIC16C710/711/715) ............................... 28 Successive I/O Operation ......................... 30 Timer0 Block Diagram .............................. 31 Timer0 Timing: Internal Clock/ No Prescale .............................................. 31 Timer0 Timing: Internal Clock/ Prescale 1:2 .............................................. 32 Timer0 Interrupt Timing ............................ 32 Timer0 Timing with External Clock ........... 33 Block Diagram of the Timer0/ WDT Prescaler ......................................... 34 ADCON0 Register (Address 08h), PIC16C710/71/711 ................................... 37 ADCON0 Register (Address 1Fh), PIC16C715 ............................................... 38 1997 Microchip Technology Inc. PIC16C71X Figure 7-3: Figure 7-4: Figure 7-5: Figure 7-6: Figure 7-7: Figure 8-1: Figure 8-2: Figure 8-3: Figure 8-4: Figure 8-5: Figure 8-6: Figure 8-7: Figure 8-8: Figure 8-9: Figure 8-10: Figure 8-11: Figure 8-12: Figure 8-13: Figure 8-14: Figure 8-15: Figure 8-16: Figure 8-17: Figure 8-18: Figure 8-19: Figure 8-20: Figure 8-21: Figure 8-22: Figure 8-23: Figure 9-1: Figure 11-1: Figure 11-2: Figure 11-3: Figure 11-4: Figure 11-5: Figure 11-6: Figure 11-7: Figure 12-1: Figure 12-2: Figure 12-3: Figure 12-4: Figure 12-5: Figure 12-6: Figure 12-7: Figure 12-8: ADCON1 Register, PIC16C710/71/711 (Address 88h), PIC16C715 (Address 9Fh)........................ 38 A/D Block Diagram.................................... 39 Analog Input Model ................................... 40 A/D Transfer Function ............................... 45 Flowchart of A/D Operation....................... 45 Configuration Word for PIC16C71 ............ 47 Configuration Word, PIC16C710/711........ 48 Configuration Word, PIC16C715............... 48 Crystal/Ceramic Resonator Operation (HS, XT or LP OSC Configuration) ........... 49 External Clock Input Operation (HS, XT or LP OSC Configuration) ........... 49 External Parallel Resonant Crystal Oscillator Circuit ........................................ 51 External Series Resonant Crystal Oscillator Circuit ........................................ 51 RC Oscillator Mode ................................... 51 Simplified Block Diagram of On-chip Reset Circuit.............................................. 52 Brown-out Situations ................................. 53 Time-out Sequence on Power-up (MCLR not Tied to VDD): Case 1............... 59 Time-out Sequence on Power-up (MCLR Not Tied To VDD): Case 2............. 59 Time-out Sequence on Power-up (MCLR Tied to VDD) .................................. 59 External Power-on Reset Circuit (for Slow VDD Power-up)........................... 60 External Brown-out Protection Circuit 1 .... 60 External Brown-out Protection Circuit 2 .... 60 Interrupt Logic, PIC16C710, 71, 711......... 62 Interrupt Logic, PIC16C715....................... 62 INT Pin Interrupt Timing ............................ 63 Watchdog Timer Block Diagram ............... 65 Summary of Watchdog Timer Registers ... 65 Wake-up from Sleep Through Interrupt..... 67 Typical In-Circuit Serial Programming Connection ................................................ 67 General Format for Instructions ................ 69 Load Conditions ........................................ 94 External Clock Timing ............................... 95 CLKOUT and I/O Timing ........................... 96 Reset, Watchdog Timer, Oscillator Start-up Timer and Power-up Timer Timing ....................................................... 97 Brown-out Reset Timing............................ 97 Timer0 External Clock Timings ................. 98 A/D Conversion Timing ........................... 100 Typical IPD vs. VDD (WDT Disabled, RC Mode) ..................... 101 Maximum IPD vs. VDD (WDT Disabled, RC Mode) ..................... 101 Typical IPD vs. VDD @ 25C (WDT Enabled, RC Mode) ...................... 102 Maximum IPD vs. VDD (WDT Enabled, RC Mode) ...................... 102 Typical RC Oscillator Frequency vs. VDD .................................................... 102 Typical RC Oscillator Frequency vs. VDD .................................................... 102 Typical RC Oscillator Frequency vs. VDD .................................................... 102 Typical IPD vs. VDD Brown-out Detect Enabled (RC Mode) ................................ 103 1997 Microchip Technology Inc. Figure 12-9: Figure 12-10: Figure 12-11: Figure 12-12: Figure 12-13: Figure 12-14: Figure 12-15: Figure 12-16: Figure 12-17: Figure 12-18: Figure 12-19: Figure 12-20: Figure 12-21: Figure 12-22: Figure 12-23: Figure 12-24: Figure 12-25: Figure 12-26: Figure 12-27: Figure 12-28: Figure 12-29: Figure 12-30: Figure 13-1: Figure 13-2: Figure 13-3: Figure 13-4: Figure 13-5: Figure 13-6: Figure 13-7: Figure 14-1: Figure 14-2: Figure 14-3: Figure 14-4: Figure 14-5: Maximum IPD vs. VDD Brown-out Detect Enabled (85C to -40C, RC Mode)........ 103 Typical IPD vs. Timer1 Enabled (32 kHz, RC0/RC1 = 33 pF/33 pF, RC Mode) ............................................... 103 Maximum IPD vs. Timer1 Enabled (32 kHz, RC0/RC1 = 33 pF/33 pF, 85C to -40C, RC Mode) ....................... 103 Typical IDD vs. Frequency (RC Mode @ 22 pF, 25C) ..................... 104 Maximum IDD vs. Frequency (RC Mode @ 22 pF, -40C to 85C) ....... 104 Typical IDD vs. Frequency (RC Mode @ 100 pF, 25C) ................... 105 Maximum IDD vs. Frequency (RC Mode @ 100 pF, -40C to 85C) ..... 105 Typical IDD vs. Frequency (RC Mode @ 300 pF, 25C) ................... 106 Maximum IDD vs. Frequency (RC Mode @ 300 pF, -40C to 85C) ..... 106 Typical IDD vs. Capacitance @ 500 kHz (RC Mode) ........................... 107 Transconductance(gm) of HS Oscillator vs. VDD .............................. 107 Transconductance(gm) of LP Oscillator vs. VDD .............................. 107 Transconductance(gm) of XT Oscillator vs. VDD .............................. 107 Typical XTAL Startup Time vs. VDD (LP Mode, 25C) ............................. 108 Typical XTAL Startup Time vs. VDD (HS Mode, 25C)............................. 108 Typical XTAL Startup Time vs. VDD (XT Mode, 25C) ............................. 108 Typical IDD vs. Frequency (LP Mode, 25C) ..................................... 109 Maximum IDD vs. Frequency (LP Mode, 85C to -40C)....................... 109 Typical IDD vs. Frequency (XT Mode, 25C)..................................... 109 Maximum IDD vs. Frequency (XT Mode, -40C to 85C) ...................... 109 Typical IDD vs. Frequency (HS Mode, 25C) .................................... 110 Maximum IDD vs. Frequency (HS Mode, -40C to 85C) ...................... 110 Load Conditions...................................... 117 External Clock Timing............................. 118 CLKOUT and I/O Timing......................... 119 Reset, Watchdog Timer, Oscillator Start-Up Timer, and Power-Up Timer Timing ..................................................... 120 Brown-out Reset Timing ......................... 120 Timer0 Clock Timings ............................. 121 A/D Conversion Timing........................... 124 Typical IPD vs. VDD (WDT Disabled, RC Mode) ..................... 125 Maximum IPD vs. VDD (WDT Disabled, RC Mode) ..................... 125 Typical IPD vs. VDD @ 25C (WDT Enabled, RC Mode)...................... 126 Maximum IPD vs. VDD (WDT Enabled, RC Mode)...................... 126 Typical RC Oscillator Frequency vs. VDD ......................................................... 126 DS30390D-page 167 PIC16C71X Figure 14-6: Figure 14-7: Figure 14-8: Figure 14-9: Figure 14-10: Figure 14-11: Figure 14-12: Figure 14-13: Figure 14-14: Figure 14-15: Figure 14-16: Figure 14-17: Figure 14-18: Figure 14-19: Figure 14-20: Figure 14-21: Figure 14-22: Figure 14-23: Figure 14-24: Figure 14-25: Figure 14-26: Figure 14-27: Figure 14-28: Figure 14-29: Figure 14-30: Figure 15-1: Figure 15-2: Figure 15-3: Figure 15-4: Figure 15-5: Figure 15-6: Figure 16-1: Figure 16-2: Figure 16-3: Typical RC Oscillator Frequency vs. VDD .......................................................... 126 Typical RC Oscillator Frequency vs. VDD .......................................................... 126 Typical IPD vs. VDD Brown-out Detect Enabled (RC Mode) ................................ 127 Maximum IPD vs. VDD Brown-out Detect Enabled (85C to -40C, RC Mode) ...................... 127 Typical IPD vs. Timer1 Enabled (32 kHz, RC0/RC1 = 33 pF/33 pF, RC Mode) ....... 127 Maximum IPD vs. Timer1 Enabled (32 kHz, RC0/RC1 = 33 pF/33 pF, 85C to -40C, RC Mode)........................ 127 Typical IDD vs. Frequency (RC Mode @ 22 pF, 25C)...................... 128 Maximum IDD vs. Frequency (RC Mode @ 22 pF, -40C to 85C)........ 128 Typical IDD vs. Frequency (RC Mode @ 100 pF, 25C).................... 129 Maximum IDD vs. Frequency (RC Mode @ 100 pF, -40C to 85C)...... 129 Typical IDD vs. Frequency (RC Mode @ 300 pF, 25C).................... 130 Maximum IDD vs. Frequency (RC Mode @ 300 pF, -40C to 85C)...... 130 Typical IDD vs. Capacitance @ 500 kHz (RC Mode)............................................... 131 Transconductance(gm) of HS Oscillator vs. VDD .............................. 131 Transconductance(gm) of LP Oscillator vs. VDD ............................... 131 Transconductance(gm) of XT Oscillator vs. VDD .............................. 131 Typical XTAL Startup Time vs. VDD (LP Mode, 25C).............................. 132 Typical XTAL Startup Time vs. VDD (HS Mode, 25C) ............................. 132 Typical XTAL Startup Time vs. VDD (XT Mode, 25C).............................. 132 Typical IDD vs. Frequency (LP Mode, 25C) ..................................... 133 Maximum IDD vs. Frequency (LP Mode, 85C to -40C) ....................... 133 Typical IDD vs. Frequency (XT Mode, 25C) ..................................... 133 Maximum IDD vs. Frequency (XT Mode, -40C to 85C) ....................... 133 Typical IDD vs. Frequency (HS Mode, 25C)..................................... 134 Maximum IDD vs. Frequency (HS Mode, -40C to 85C)....................... 134 Load Conditions ...................................... 140 External Clock Timing ............................. 141 CLKOUT and I/O Timing ......................... 142 Reset, Watchdog Timer, Oscillator Start-up Timer and Power-up Timer Timing ..................................................... 143 Timer0 External Clock Timings ............... 144 A/D Conversion Timing ........................... 146 Typical RC Oscillator Frequency vs. Temperature............................................ 147 Typical RC Oscillator Frequency vs. VDD .......................................................... 147 Typical RC Oscillator Frequency vs. VDD .......................................................... 147 DS30390D-page 168 Figure 16-4: Figure 16-5: Figure 16-6: Figure 16-7: Figure 16-8: Figure 16-9: Figure 16-10: Figure 16-11: Figure 16-12: Figure 16-13: Figure 16-14: Figure 16-15: Figure 16-16: Figure 16-17: Figure 16-18: Figure 16-19: Figure 16-20: Figure 16-21: Figure 16-22: Typical RC Oscillator Frequency vs. VDD ......................................................... 148 Typical Ipd vs. VDD Watchdog Timer Disabled 25C......................................... 148 Typical Ipd vs. VDD Watchdog Timer Enabled 25C.......................................... 148 Maximum Ipd vs. VDD Watchdog Disabled .................................................. 149 Maximum Ipd vs. VDD Watchdog Enabled................................................... 149 Vth (Input Threshold Voltage) of I/O Pins vs. VDD ...................................... 149 VIH, VIL of MCLR, T0CKI and OSC1 (in RC Mode) vs. VDD ............................. 150 VTH (Input Threshold Voltage) of OSC1 Input (in XT, HS, and LP Modes) vs. VDD ................................. 150 Typical IDD vs. Freq (Ext Clock, 25C).... 151 Maximum, IDD vs. Freq (Ext Clock, -40 to +85C) ......................................... 151 Maximum IDD vs. Freq with A/D Off (Ext Clock, -55 to +125C) .................... 152 WDT Timer Time-out Period vs. VDD ...... 152 Transconductance (gm) of HS Oscillator vs. VDD .............................. 152 Transconductance (gm) of LP Oscillator vs. VDD .............................. 153 Transconductance (gm) of XT Oscillator vs. VDD .............................. 153 IOH vs. VOH, VDD = 3V .......................... 153 IOH vs. VOH, VDD = 5V .......................... 153 IOL vs. VOL, VDD = 3V ........................... 154 IOL vs. VOL, VDD = 5V ........................... 154 1997 Microchip Technology Inc. PIC16C71X LIST OF TABLES Table 1-1: Table 3-1: Table 4-1: Table 4-2: Table 5-1: Table 5-2: Table 5-3: Table 5-4: Table 6-1: Table 7-1: Table 7-2: Table 7-3: Table 7-4: Table 8-1: Table 8-2: Table 8-3: Table 8-4: Table 8-5: Table 8-6: Table 8-7: Table 8-8: Table 8-9: Table 8-10: Table 8-11: Table 8-12: Table 8-13: Table 9-1: Table 9-2: Table 10-1: Table 11-1: Table 11-2: Table 11-3: Table 11-4: Table 11-5: PIC16C71X Family of Devices.................... 4 PIC16C710/71/711/715 Pinout Description .................................................. 9 PIC16C710/71/711 Special Function Register Summary .................................... 14 PIC16C715 Special Function Register Summary................................................... 15 PORTA Functions ..................................... 26 Summary of Registers Associated with PORTA...................................................... 26 PORTB Functions ..................................... 28 Summary of Registers Associated with PORTB...................................................... 29 Registers Associated with Timer0............. 35 TAD vs. Device Operating Frequencies, PIC16C71.................................................. 41 TAD vs. Device Operating Frequencies, PIC16C710/711, PIC16C715 .................... 41 Registers/Bits Associated with A/D, PIC16C710/71/711.................................... 46 Registers/Bits Associated with A/D, PIC16C715................................................ 46 Ceramic Resonators, PIC16C71............... 49 Capacitor Selection For Crystal Oscillator, PIC16C71................................. 49 Ceramic Resonators, PIC16C710/711/715.................................. 50 Capacitor Selection for Crystal Oscillator, PIC16C710/711/715................. 50 Time-out in Various Situations, PIC16C71.................................................. 54 Time-out in Various Situations, PIC16C710/711/715.................................. 54 Status Bits and Their Significance, PIC16C71.................................................. 55 Status Bits and Their Significance, PIC16C710/711......................................... 55 Status Bits and Their Significance, PIC16C715................................................ 55 Reset Condition for Special Registers, PIC16C710/71/711.................................... 56 Reset Condition for Special Registers, PIC16C715................................................ 56 Initialization Conditions For All Registers, PIC16C710/71/711.................................... 57 Initialization Conditions for All Registers, PIC16C715................................................ 58 Opcode Field Descriptions ........................ 69 PIC16CXX Instruction Set......................... 70 Development Tools From Microchip ......... 88 Cross Reference of Device Specs for Oscillator Configurations and Frequencies of Operation (Commercial Devices)............................... 89 External Clock Timing Requirements........ 95 CLKOUT and I/O Timing Requirements.... 96 Reset, Watchdog Timer, Oscillator Start-up Timer, Power-up Timer, and Brown-out Reset Requirements ......... 97 Timer0 External Clock Requirements ....... 98 1997 Microchip Technology Inc. Table 11-6: Table 11-7: Table 12-1: Table 12-2: Table 13-1: Table 13-2: Table 13-3: Table 13-4: Table 13-5: Table 13-6: Table 13-7: Table 13-8: Table 14-1: Table 14-2: Table 15-1: Table 15-2: Table 15-3: Table 15-4: Table 15-5: Table 15-6: Table 15-7: Table 16-1: A/D Converter Characteristics: PIC16C710/711-04 (Commercial, Industrial, Extended) PIC16C710/711-10 (Commercial, Industrial, Extended) PIC16C710/711-20 (Commercial, Industrial, Extended) PIC16LC710/711-04 (Commercial, Industrial, Extended) ...........99 A/D Conversion Requirements ............... 100 RC Oscillator Frequencies...................... 107 Capacitor Selection for Crystal Oscillators ............................................... 108 Cross Reference of Device Specs for Oscillator Configurations and Frequencies of Operation (Commercial Devices) ............................ 112 Clock Timing Requirements.................... 118 CLKOUT and I/O Timing Requirements . 119 Reset, Watchdog Timer, Oscillator Start-up Timer, Power-up Timer, and Brown-out Reset Requirements....... 120 Timer0 Clock Requirements ................... 121 A/D Converter Characteristics: PIC16C715-04 (Commercial, Industrial, Extended) PIC16C715-10 (Commercial, Industrial, Extended) PIC16C715-20 (Commercial, Industrial, Extended) ........ 122 A/D Converter Characteristics: PIC16LC715-04 (Commercial, Industrial) ................................................ 123 A/D Conversion Requirements ............... 124 RC Oscillator Frequencies...................... 131 Capacitor Selection for Crystal Oscillators ............................................... 132 Cross Reference of Device Specs for Oscillator Configurations and Frequencies of Operation (Commercial Devices) ............................ 135 External Clock Timing Requirements ..... 141 CLKOUT and I/O Timing Requirements . 142 Reset, Watchdog Timer, Oscillator Start-up Timer and Power-up Timer Requirements ......................................... 143 Timer0 External Clock Requirements ..... 144 A/D Converter Characteristics ................ 145 A/D Conversion Requirements ............... 146 RC Oscillator Frequencies...................... 148 DS30390D-page 169 PIC16C71X NOTES: DS30390D-page 170 1997 Microchip Technology Inc. PIC16C71X ON-LINE SUPPORT Microchip provides two methods of on-line support. These are the Microchip BBS and the Microchip World Wide Web (WWW) site. Use Microchip's Bulletin Board Service (BBS) to get current information and help about Microchip products. Microchip provides the BBS communication channel for you to use in extending your technical staff with microcontroller and memory experts. To provide you with the most responsive service possible, the Microchip systems team monitors the BBS, posts the latest component data and software tool updates, provides technical help and embedded systems insights, and discusses how Microchip products provide project solutions. The web site, like the BBS, is used by Microchip as a means to make files and information easily available to customers. To view the site, the user must have access to the Internet and a web browser, such as Netscape or Microsoft Explorer. Files are also available for FTP download from our FTP site. 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Plus, this line provides information on how customers can receive any currently available upgrade kits.The Hot Line Numbers are: 1-800-755-2345 for U.S. and most of Canada, and 1-602-786-7302 for the rest of the world. 970301 Trademarks: The Microchip name, logo, PIC, PICSTART, PICMASTER and PRO MATE are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FlexROM, MPLAB and fuzzyLAB, are trademarks and SQTP is a service mark of Microchip in the U.S.A. fuzzyTECH is a registered trademark of Inform Software Corporation. IBM, IBM PC-AT are registered trademarks of International Business Machines Corp. Pentium is a trademark of Intel Corporation. Windows is a trademark and MS-DOS, Microsoft Windows are registered trademarks of Microsoft Corporation. CompuServe is a registered trademark of CompuServe Incorporated. All other trademarks mentioned herein are the property of their respective companies. DS30272A-page 171 PIC16C71X READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (602) 786-7578. Please list the following information, and use this outline to provide us with your comments about this Data Sheet. To: Technical Publications Manager RE: Reader Response Total Pages Sent From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Device: PIC16C71X Y N Literature Number: DS30272A Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this data sheet easy to follow? If not, why? 4. What additions to the data sheet do you think would enhance the structure and subject? 5. What deletions from the data sheet could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? 8. How would you improve our software, systems, and silicon products? DS30272A-page 172 1997 Microchip Technology Inc. PIC16C71X PIC16C71X PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery refer to the factory or the listed sales office. Examples PART NO. -XX X /XX XXX Pattern: Package: Temperature Range: Frequency Range: Device QTP, SQTP, Code or Special Requirements a) JW = Windowed CERDIP SO = SOIC SP = Skinny plastic dip P = PDIP SS = SSOP b) = 0C to +70C I = -40C to +85C E = -40C to +125C 04 = 200 kHz (PIC16C7X-04) 04 = 4 MHz 10 = 10 MHz 20 = 20 MHz PIC16C7X :VDD range 4.0V to 6.0V PIC16C7XT :VDD range 4.0V to 6.0V (Tape/Reel) PIC16LC7X :VDD range 2.5V to 6.0V PIC16LC7XT :VDD range 2.5V to 6.0V (Tape/Reel) PIC16C71 - 04/P 301 Commercial Temp., PDIP Package, 4 MHz, normal VDD limits, QTP pattern #301 * JW Devices are UV erasable and can be programmed to any device configuration. JW Devices meet the electrical requirement of each oscillator type (including LC devices). Sales and Support Products supported by a preliminary Data Sheet may possibly have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office (see below) 2. The Microchip Corporate Literature Center U.S. FAX: (602) 786-7277 3. The Microchip's Bulletin Board, via your local CompuServe number (CompuServe membership NOT required). Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. For latest version information and upgrade kits for Microchip Development Tools, please call 1-800-755-2345 or 1-602-786-7302. 1997 Microchip Technology Inc. DS30272A-page 173 PIC16C71X NOTES: DS30272A-page 174 1997 Microchip Technology Inc. PIC16C71X NOTES: 1997 Microchip Technology Inc. DS30272A-page 175 WORLDWIDE SALES & SERVICE AMERICAS ASIA/PACIFIC EUROPE Corporate Office Hong Kong United Kingdom Microchip Technology Inc. 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 602-786-7200 Fax: 602-786-7277 Technical Support: 602 786-7627 Web: http://www.microchip.com Microchip Asia Pacific RM 3801B, Tower Two Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2-401-1200 Fax: 852-2-401-3431 Arizona Microchip Technology Ltd. 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Benex S-1 6F 3-18-20, Shin Yokohama Kohoku-Ku, Yokohama Kanagawa 222 Japan Tel: 81-4-5471- 6166 Fax: 81-4-5471-6122 Taiwan, R.O.C 05/08/97 Microchip Technology Taiwan 10F-1C 207 Tung Hua North Road Taipei, Taiwan, ROC Tel: 886 2-717-7175 Fax: 886-2-545-0139 Microchip Technology Inc. 150 Motor Parkway, Suite 416 Hauppauge, NY 11788 Tel: 516-273-5305 Fax: 516-273-5335 San Jose Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955 Toronto Microchip Technology Inc. 5925 Airport Road, Suite 200 Mississauga, Ontario L4V 1W1, Canada Tel: 905-405-6279 Fax: 905-405-6253 All rights reserved. 1997, Microchip Technology Incorporated, USA. Information contained in this publication regarding device applications and the like is intended for suggestion only and may be superseded by updates. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use, or otherwise. Use of Microchip's products as critical components in medical devices is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. The Microchip logo and name are registered trademarks of Microchip Technology Inc. All rights reserved. All other trademarks mentioned herein are the property of their respective companies. DS30272A-page 176 1997 Microchip Technology Inc.