MMBD101LT1G - ON SEMICONDUCTOR

March, 2007 − Rev. 3 1Publication Order Number:

MBD101/D

MBD101, MMBD101LT1

Preferred Device

Schottky Barrier Diodes

Designed primarily for UHF mixer applications but suitable also for

use in detector and ultra−fast switching circuits. Supplied in an

inexpensive plastic package for low−cost, high−volume consumer

requirements. Also available in Surface Mount package.

Features

•Low Noise Figure − 6.0 dB Typ @ 1.0 GHz

•Very Low Capacitance − Less Than 1.0 pF

•High Forward Conductance − 0.5 V (Typ) @ IF = 10 mA

•Pb−Free Packages are Available

MAXIMUM RATINGS

Rating Symbol Value Unit

Reverse Voltage VR7.0 V

Forward Power Dissipation

TA = 25°C MBD101

MMBD101LT1

Derate above 25°C MBD101

MMBD101LT1

PF280

225

2.2

1.8

mW/°C

Junction Temperature TJ+150 °C

Storage Temperature Range Tstg −55 to +150 °C

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

ELECTRICAL CHARACTERISTICS (TA = 25°C unless ot herwise noted)

Characteristic Symbol Min Typ Max Unit

Reverse Breakdown Voltage

(IR = 10 mA) V(BR)R 7.0 10 − V

Diode Capacitance

(VR = 0, f = 1.0 MHz,

Note 1, page 2)

CD− 0.88 1.0 pF

Forward Voltage

(IF = 10 mA) VF− 0.5 0.6 V

Reverse Leakage

(VR = 3.0 V) IR− 0.02 0.25 mA

http://onsemi.com

SOT−23 (TO−236)

CASE 318

STYLE 8

Preferred devices are recommended choices for future use

and best overall value.

Device Package Shipping†

ORDERING INFORMATION

MBD101 TO−92 5000 Units / Box

† For information on tape and reel specifications,

including part orientation and tape sizes, please

refer t o our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

MBD101G TO−92

(Pb−Free) 5000 Units / Box

MMBD101LT1 SOT−23 3000 / Tape & Ree

MMBD101LT1G SOT−23

(Pb−Free) 3000 / Tape & Ree

*Date Code orientation and/or overbar may

vary depending upon manufacturing location.

4M M G

A = Assembly Location

Y = Year

WW = Work Week

4M = Device Code (SOT−23)

M = Date Code*

G= Pb−Free Package

(Note: Microdot may be in either location)

MARKING

DIAGRAMS

CATHODE

ANODE

CATHODE

ANODE

(Pin 2 Not Connected)

TO−92 2−Lead

CASE 182

STYLE 1

SILICON SCHOTTKY

BARRIER DIODES

MBD

101

AYWW G

MBD101, MMBD101LT1

http://onsemi.com

TYPICAL CHARACTERISTICS

(TA = 25°C unless noted)

Figure 1. Reverse Leakage

TA, AMBIENT TEMPERATURE (°C)

Figure 2. Forward Voltage

VF, FORWARD VOLTAGE (VOLTS)

Figure 3. Capacitance

VR, REVERSE VOLTAGE (VOLTS)

Figure 4. Noise Figure

PLO, LOCAL OSCILLATOR POWER (mW)

, FORWARD CURRENT (mA)IF

, REVERSE LEAKAGE ( A)IRm

0.1 0.2 0.5 2.01.0 10

3.0

0 1.0 2.0 3.0 4.0

1.0

0.9

0.8

0.7

0.6

0.3 0.4

100

0.1

30 40 50 60 70 80 100

0.1

130110 12090

0.07

0.05

0.02

1.0

2.0

0.5 0.6 0.7

0.01

1.0

0.7

0.5

1.0

Figure 5. Noise Figure Test Circuit

UHF

NOISE SOURCE

H.P. 349A

DIODE IN

TUNED

MOUNT

LOCAL

OSCILLATOR

IF AMPLIFIER

NF = 1.5 dB

f = 30 MHz

NOISE

FIGURE METER

H.P. 342A

NOTES ON TESTING AND SPECIFICATIONS

Note 1 — CD is measured using a capacitance bridge (Boonton

Electronics Model 75A or equivalent).

Note 2 — Noise figure measured with diode under test in tuned

diode mount using UHF noise source and local oscillator

(LO) frequency of 1.0 GHz. The LO power is adjusted

for 1.0 mW. IF amplifier NF = 1.5 dB, f = 30 MHz, see

Figure 5.

Note 3 — LS is measured on a package having a short instead of a

die, using an impedance bridge (Boonton Radio Model

250A RX Meter).

0.2

VR = 3.0 V

5.0

4.0

7.0

6.0

9.0

8.0

10 LOCAL OSCILLATOR FREQUENCY = 1.0 GHz

(TEST CIRCUIT IN FIGURE 5)

5.0

TA = 25°C

TA = −40°C

TA = 85°C

NF, NOISE FIGURE (dB)

CD,CAPACITANCE (pF)

MBD101, MMBD101LT1

http://onsemi.com

PACKAGE DIMENSIONS

ÉÉ

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. CONTOUR OF PACKAGE BEYOND ZONE R IS

UNCONTROLLED.

4. LEAD DIMENSION IS UNCONTROLLED IN P AND

BEYOND DIMENSION K MINIMUM.

SEATING

PLANE

SECTION X−X

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.175 0.205 4.45 5.21

B0.170 0.210 4.32 5.33

C0.125 0.165 3.18 4.19

D0.016 0.021 0.407 0.533

G0.050 BSC 1.27 BSC

H0.100 BSC 2.54 BSC

J0.014 0.016 0.36 0.41

K0.500 −−− 12.70 −−−

L0.250 −−− 6.35 −−−

N0.080 0.105 2.03 2.66

P−−− 0.050 −−− 1.27

R0.115 −−− 2.93 −−−

V0.135 −−− 3.43 −−−

STYLE 1:

PIN 1. ANODE

2. CATHODE

TO−92 TWO LEAD

TO−226AC

CASE 182−06

ISSUE L

MBD101, MMBD101LT1

http://onsemi.com

PACKAGE DIMENSIONS

SOT−23 (TO−236)

CASE 318−08

ISSUE AN

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH THICKNESS. MINIMUM LEAD

THICKNESS IS THE MINIMUM THICKNESS OF

BASE MATERIAL.

4. 318−01 THRU −07 AND −09 OBSOLETE, NEW

STANDARD 318−08.

ǒmm

inchesǓ

SCALE 10:1

0.8

0.031

0.9

0.035

0.95

0.037

0.95

0.037

2.0

0.079

VIEW C

0.25

SEE VIEW C

DIM

AMIN NOM MAX MIN

MILLIMETERS

0.89 1.00 1.11 0.035

INCHES

A1 0.01 0.06 0.10 0.001

b0.37 0.44 0.50 0.015

c0.09 0.13 0.18 0.003

D2.80 2.90 3.04 0.110

E1.20 1.30 1.40 0.047

e1.78 1.90 2.04 0.070

L0.10 0.20 0.30 0.004

0.040 0.044

0.002 0.004

0.018 0.020

0.005 0.007

0.114 0.120

0.051 0.055

0.075 0.081

0.008 0.012

NOM MAX

2.10 2.40 2.64 0.083 0.094 0.104

HE0.35 0.54 0.69 0.014 0.021 0.029

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

STYLE 8:

PIN 1. ANODE

2. NO CONNECTION

3. CATHODE

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its of ficers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

MBD101/D

PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5773−3850

LITERATURE FULFILLMENT:

Literature Distribution Center for ON Semiconductor

P.O. Box 5163, Denver, Colorado 80217 USA

Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your local

Sales Representative