SFH 485 P
GaAlAs-IR-Lumineszenzdiode (880 nm)
GaAlAs Infrared Emitter (880 nm)
Lead (Pb) Free Product - RoHS Compliant
2007-11-29 1
Wesentliche Merkmale
• GaAlAs-LED mit sehr hohem Wirkungsgrad
• Hohe Zuverlässigkeit
• Gute spektrale Anpassung an
Si-Fotoempfänger
• Gegurtet lieferbar (im Ammo-Pack)
• Gruppiert lieferbar
• Gehäusegleich mit SFH 217
Anwendungen
• IR-Fernsteuerung von Fernseh- und
Rundfunkgeräten, Videorecordern,
Lichtdimmern
• Gerätefernsteuerungen für Gleich- und
Wechsellichtbetrieb
• Rauchmelder (UL-Freigabe)
• Sensorik
• Diskrete Lichtschranken
Typ
Type
Bestellnummer
Ordering Code
Gehäuse
Package
SFH 485 P Q62703Q0516 5-mm-LED-Gehäuse, plan, klares violettes
Epoxy-Gießharz, Lötspieße im 2.54-mm-Raster (1/10’’),
Anodenkennzeichnung: kürzerer Anschluß
5 mm LED package (T 1 3/4), plane violet-colored
transparent epoxy resin, solder tabs lead spacing
2.54 mm (1/10’’), anode marking: short lead.
Features
• Very highly efficient GaAlAs-LED
• High reliability
• Spectral match with silicon photodetectors
• Available on tape and reel (in Ammopack)
• Available in bins
• Same package as SFH 217
Applications
• IR remote control of hi-fi and TV-sets, video
tape recorders, dimmers
• Remote control for steady and varying intensity
• Smoke detectors (UL-approval)
• Sensor technology
• Discrete interrupters
2007-11-29 2
SFH 485 P
Grenzwerte (TA = 25 °C)
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebs- und Lagertemperatur
Operating and storage temperature range
Top; Tstg – 40 … + 100 °C
Sperrspannung
Reverse voltage
VR5 V
Durchlaßstrom
Forward current
IF100 mA
Stoßstrom, τ ≤ 10 µs
Surge current
IFSM 2.5 A
Verlustleistung
Power dissipation
Ptot 200 mW
Wärmewiderstand, freie Beinchenlänge
max. 10 mm
Thermal resistance, lead length between
package bottom and PC-board max. 10 mm
RthJA 375 K/W
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 100 mA
λpeak 880 nm
Spektrale Bandbreite bei 50% von Imax
IF = 100 mA
Spectral bandwidth at 50% of Imax
∆λ 80 nm
Abstrahlwinkel
Half angle
ϕ± 40 Grad
deg.
Aktive Chipfläche
Active chip area
A0.09 mm2
Abmessungen der aktiven Chipfläche
Dimension of the active chip area
L × B
L × W
0.3 × 0.3 mm²
Abstand Chipoberfläche bis Gehäusevorderseite
Distance chip front to case surface
H0.5 … 1 mm
SFH 485 P
2007-11-29 3
Schaltzeiten, Ie von 10% auf 90% und von 90%
auf 10%, bei IF = 50 mA, RL = 50 Ω
Switching times, Ie from 10% to 90% and from
90% to 10%, IF = 100 mA, RL = 50 Ω
tr, tf0.6/0.5 µs
Kapazität, VR = 0 V, f = 1 MHz
Capacitance
Co15 pF
Durchlaßspannung,
Forward voltage
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 µs
VF
1.5 (< 1.8)
3.0 (< 3.8)
V
Sperrstrom,
Reverse current
VR = 5 V
IR0.01 (≤ 1) µA
Gesamtstrahlungsfluß,
Total radiant flux
IF = 100 mA, tp = 20 ms
Φe25 mW
Temperaturkoeffizient von Ie bzw. Φe,
IF = 100 mA
Temperature coefficient of Ie or Φe,
IF = 100 mA
TCI– 0.5 %/K
Temperaturkoeffizient von VF, IF = 100 mA
Temperature coefficient of VF, IF = 100 mA
TCV– 2 mV/K
Temperaturkoeffizient von λ, IF = 100 mA
Temperature coefficient of λ, IF = 100 mA
TCλ+ 0.25 nm/K
Kennwerte (TA = 25 °C)
Characteristics (cont’d)
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
2007-11-29 4
SFH 485 P
Strahlstärke Ie in Achsrichtung1)
gemessen bei einem Raumwinkel Ω = 0.01 sr
Radiant Intensity Ie in Axial Direction
at a solid angle of Ω = 0.01 sr
Bezeichnung
Parameter
Symbol Werte
Values
Einheit
Unit
SFH 485 P-1 SFH 485 P-2
Strahlstärke
Radiant intensity
IF = 100 mA, tp = 20 ms
Ie min
Ie max
3.15
5.5
4.5
-
mW/sr
Strahlstärke
Radiant intensity
IF = 1 A, tp = 100 µs
Ie typ.
48 52
mW/sr
1) Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner als der oben angegebene Bereich /
Only one group in one packing unit (variation lower than the above group)
SFH 485 P
2007-11-29 5
Relative Spectral Emission
Irel = f (λ)
Forward Current
IF = f (VF), Single pulse, tp = 20 µs
Radiation Characteristics Ιrel = f (ϕ)
0
750
Ιrel
OHR00877
800 850 900 950 nm 1000
20
40
60
80
%
100
λ
10
OHR00881
F
V
-3
-2
10
-1
10
0
10
1
10
0123456V8
A
Ι
F
OHR01893
02040 60 80 100 1200.40.60.81.0
100
90
80
70
60
50
0
10203040
0
0.2
0.4
0.6
0.8
1.0
ϕ
Radiant Intensity
Single pulse, tp = 20 µs
Permissible Pulse Handling
Capability IF = f (τ), TA = 25 °C,duty
cycle D = parameter
Ie
Ie 100 mA = f (IF)
10
OHR00878
Ιe
F
Ι
-3
-2
10
-1
10
0
10
1
10
2
10
0
10 10 110 210 4
mA
e
Ι
(100mA)
3
10
10
Ι
F
OHR00886
1
2
10
3
10
4
10
mA
-5
10 s
=D
F
Ι
T
DC
0.005=
D
p
t
T
t
p
p
t
0.5
0.2
0.1
0.01
0.02
0.05
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
Max. Permissible Forward Current
IF = f (TA)
Forward Current vs. Lead Length
Between the Package Bottom and
the PC-Board IF = f (I), TA = 25 °C
T
OHR00880
0
F
Ι
0 20 40 60 80 100˚C
mA
25
50
75
100
125
OHR00949
F
Ι
00 5 10 15 20 25 mm 30
20
40
60
80
100
mA
120
2007-11-29 6
SFH 485 P
Maßzeichnung
Package Outlines
Maße in mm (inch) / Dimensions in mm (inch).
Empfohlenes Lötpaddesign Wellenlöten (TTW)
Recommended Solder Pad TTW Soldering
Maße in mm (inch) / Dimensions in mm (inch).
5.9 (0.232)
5.5 (0.217)
ø5.1 (0.201)
ø4.8 (0.189)
2.54 (0.100)
spacing
3.85 (0.152)
3.35 (0.132)
5.0 (0.197)
4.2 (0.165)
1.0 (0.039)
0.5 (0.020)
Chip position GEXY6306
Cathode
0.6 (0.024)
0.4 (0.016)
0.8 (0.031)
0.4 (0.016)
29 (1.142)
27 (1.063)
1.8 (0.071)
1.2 (0.047)
Area not flat
0.6 (0.024)
0.4 (0.016)
4 (0.157)
OHLPY985
4.8 (0.189)
SFH 485 P
2007-11-29 7
Lötbedingungen
Soldering Conditions
Wellenlöten (TTW) (nach CECC 00802)
TTW Soldering (acc. to CECC 00802)
Published by
OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
OHLY0598
0
0
50 100 150 200 250
50
100
150
200
250
300
T
t
C
s
235 C
10 s
C... 260
1. Welle
1. wave
2. Welle
2. wave
5 K/s 2 K/s
ca 200 K/s
CC... 130100
2 K/s Zwangskühlung
forced cooling
Normalkurve
standard curve
Grenzkurven
limit curves
