PACKAGE OPTION ADDENDUM
www.ti.com 5-Dec-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-89905012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI
5962-8990501EA ACTIVE CDIP J 16 1 TBD Call TI Call TI
UC1823J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
UC1823J883B ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
UC1823L ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
UC1823L883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
UC2823DW ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2823DWG4 ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2823DWTR ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2823DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2823N ACTIVE PDIP N 16 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2823NG4 ACTIVE PDIP N 16 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2823QTR ACTIVE PLCC FN 20 1000 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR
UC2823QTRG3 ACTIVE PLCC FN 20 1000 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR
UC3823DW ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3823DWG4 ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3823DWTR ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3823DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3823N ACTIVE PDIP N 16 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 5-Dec-2011
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
UC3823NG4 ACTIVE PDIP N 16 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3823Q ACTIVE PLCC FN 20 46 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR
UC3823QG3 ACTIVE PLCC FN 20 46 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR
UC3823QTR ACTIVE PLCC FN 20 1000 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR
UC3823QTRG3 ACTIVE PLCC FN 20 1000 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UC1823, UC3823 :
PACKAGE OPTION ADDENDUM
www.ti.com 5-Dec-2011
Addendum-Page 3
Catalog: UC3823
Military: UC1823
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
UC2823DWTR SOIC DW 16 2000 330.0 16.4 10.85 10.8 2.7 12.0 16.0 Q1
UC2823QTR PLCC FN 20 1000 330.0 16.4 10.3 10.3 4.9 12.0 16.0 Q1
UC3823DWTR SOIC DW 16 2000 330.0 16.4 10.85 10.8 2.7 12.0 16.0 Q1
UC3823QTR PLCC FN 20 1000 330.0 16.4 10.3 10.3 4.9 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Aug-2009
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
UC2823DWTR SOIC DW 16 2000 346.0 346.0 33.0
UC2823QTR PLCC FN 20 1000 346.0 346.0 33.0
UC3823DWTR SOIC DW 16 2000 346.0 346.0 33.0
UC3823QTR PLCC FN 20 1000 346.0 346.0 33.0
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Aug-2009
Pack Materials-Page 2
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