General Description
The MAX15096 family of devices are integrated solu-
tions for hot-swap applications requiring the safe
insertion and removal of circuit line cards from a live
backplane. They can also be used as electronics
circuit breaker for hard drive and solid-state drive and
fans. The devices integrate a hot-swap controller, 12mΩ
(typ) power MOSFET, and an electronic circuit-breaker
protection in a single package.
The devices are designed for protection of 2.7V to 18V
supply voltages. These devices implement a foldback
current limit during startup to control inrush current,
lowering di/dt and keeping the MOSFET operating
under safe operating area (SOA) conditions. After the
startup cycle is complete, on-chip comparators provide
VariableSpeed/BiLevel™ protection against short-circuit
and overcurrent faults, and immunity against system
noise and load transients. The load is disconnected in
the event of a fault condition. The devices are factory
calibrated to deliver accurate overcurrent protection with
±10% accuracy. During a fault condition, PG goes low
and the devices latch off (MAX15096) or automatic retry
(MAX15096A); the output could also be discharged after
a fault event (MAX15096D).
The devices feature an IN-to-OUT short-circuit detection
before startup. The devices provide a power-MOSFET
GATE pin to program the slew rate during startup by
adding an external capacitor. The devices have an under-
voltage/overvoltage input pin (UVOV) that can detect an
undervoltage/overvoltage fault and disconnect the IN from
the OUT. Additional features include internal overtem-
perature protection and a power-good output (PG).
The devices are available in a 16-bump, 2mm x 2mm
wafer-level package (WLP) and are rated over the -40°C
to +105°C extended temperature range.
Benets and Features
Integration Reduces Solution size for Blade Servers
and Other Space-Constrained Designs
Integrated 12mΩ (typ) Internal Power MOSFET
Programmable Overvoltage Protection and
Undervoltage-Lockout Threshold
Drive-Present Signal Input (PRSNT pin)
Thermal Protection
Flexibility Enables Use in Many Unique Designs
2.7V to 18V Operating Voltage Range
Programmable Inrush Current Control Under SOA
Operation
Adjustable Circuit-Breaker Current/Current-Limit
Threshold
Programmable Slew-Rate Control
Variable-Speed Circuit-Breaker Response
Latchoff (MAX15096) or Automatic Retry
(MAX15096A) Options
Safety Features Ensure Accurate, Robust Protection
6A (max) Load Current Capability
±10% Circuit-Breaker Threshold Accuracy
IN-to-OUT Short-Circuit Detection
Open-Drain PG Output
Output Discharge After a Fault Event (MAX15096D Only)
Programmable Additional Delay (2µs max) to
Fast-Comparator Response Time
Enable Input (EN)
Applications
Blade Servers
Server I/O Cards
RAID Systems
Disk Drive Power
Storage Applications
Industrial Applications
Ordering Information appears at end of data sheet.
VariableSpeed/BiLevel is a trademark of Maxim Integrated
Products, Inc.
19-7304; Rev 4; 2/17
MAX15096/MAX15096A 2.7V to 18V, 6A Integrated Hot-Swap/Electronic
Circuit Breaker
EVALUATION KIT AVAILABLE
VCC to GND ............................................................-0.3V to 20V
IN to GND .............................................................. -0.3V to +20V
PG, PRSNT to GND ..............................................-0.3V to +20V
OUT to GND ...............................................-0.3V to (VIN + 0.3V)
GATE to OUT ..........................................................-0.3V to +6V
EN, UVOV to GND ..................................................-0.3V to +6V
TIMER, CB to GND ................................-0.3V to (VREG + 0.3V)
REG to GND ............................-0.3V to min (+6V, (VCC + 0.3V))
Continuous Power Dissipation (TA = +70°C)
16-bump WLP (derate 20.4mW/°C above +70°C) ....1633mW
Operating Temperature Range ......................... -40°C to +105°C
Junction Temperature ..................................................... +150°C
Storage Temperature Range ............................ -60°C to +150°C
Lead Temperature (soldering, 10s) ................................ +300°C
Soldering Temperature (reflow) ...................................... +260°C
Junction-to-Ambient Thermal Resistance JA) ................... 49°C/W
(Note 1)
(VIN = VCC = 2.7V to 18V, TA = TJ = -40°C to +105°C, unless otherwise noted. Typical values are at VIN = 12V, RCB = 10.5kΩ, and
TA = +25°C.) (Note 2)
PARAMETER SYMBOL
CONDITIONS
MIN TYP MAX UNITS
POWER SUPPLIES
VCC Operating Range VCC
2.7
18
V
IN Operating Range VIN 2.7 18
V
VCC Supply Current ICC
VIN = VCC = 2.7V to 18V, enable 0.58 0.9 mA
VIN = VCC = 2.7V to 18V, disable 0.590 μA
IN Supply Current IIN
RCB = 41.67kΩ, no load 3.3 3.8 mA
RCB = 10.42kΩ, no load 1.3 1.8
VCC Default Undervoltage Lockout VUVLO VCC rising 2.35 2.5 2.65
V
VCC Default Undervoltage-Lockout
Hysteresis VUVLO_HYS 0.1
V
REG Regulator Voltage VREG No load, VCC > 4V 3 3.3 3.6
V
UV Turn-On Threshold VUV_TH VUVOV rising 0.536 0.55 0.564 V
UV Turn-On Threshold Hysteresis VUV_HYS VUVOV falling 50
mV
OV Turn-On Threshold VOV_TH VUVOV rising 1.199 1.23 1.261
V
OV Turn-On Threshold Hysteresis VOV_HYS VUVOV falling 50
mV
OVUV Input Leakage Current ILEAK VUVOV = VEN = 0 to 5.5V
-1 +1
µ
A
CURRENT LIMIT
Circuit-Breaker Accuracy (Note 3) ICB_TH VIN = 12V RCB = 41.2kΩ 5.4 6 6.6 A
RCB = 10.5kΩ 1.14 1.27 1.40
Circuit-Breaker Accuracy Deviation
(Note 4)
RCB = 10.5kΩ to 21.5kΩ, compared to
nominal current-limit value, VIN = VCC
= 8V to 15V
-10 +10
%
RCB = 21.5kΩ to 41.2kΩ, compared to
nominal current-limit value -10 +10
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
Electrical Characteristics
MAX15096/MAX15096A 2.7V to 18V, 6A Integrated Hot-Swap/
Electronic Circuit Breaker
www.maximintegrated.com Maxim Integrated
2
(VIN = VCC = 2.7V to 18V, TA = TJ = -40°C to +105°C, unless otherwise noted. Typical values are at VIN = 12V, RCB = 10.5kΩ, and
TA = +25°C.) (Note 2)
PARAMETER SYMBOL
CONDITIONS
MIN TYP MAX UNITS
Slow-Comparator Response Time
(Note 5) tSCD
0.6% overcurrent 2.7 ms
30% overcurrent 200 µs
CB Source Current ITHCB_NORM In power-on mode 12 µA
Maximum Current Limit During
Startup ILIM (see Figure 2) 0.5 x
ICB_TH
A
Fast-Comparator Threshold IFC_TH
1.5 x
ICB_TH
A
Fast-Comparator Response Time tFCD 200 ns
Additional Delay Time by TIMER tAFCD RTIMER = open 2 µs
Minimum CB Voltage Reference
During Foldback (Note 6) VTHCB_MIN VIN - VOUT > 10V, RCB = 41.2kΩ 60 mV
Maximum CB Voltage Reference
During Foldback (Note 6) VTHCB_MAX VIN - VOUT < 2V, RCB = 41.2kΩ 250 mV
TIMING
Startup Maximum Time Duration tSU 43 52 61 ms
Autoretry Delay Time tRESTART MAX15096A/MAX15096D only 3.4 s
Output Short Detection at Startup tSHORT 10.4 13.2 15.6 ms
MOSFET
Total On-Resistance RON
TA = +25°C 12 18 mΩ
TA = -40°C to +105°C 25
GATE Charge Current IGATE 4.8 5.9 7.1 μA
OUTPUTS
PG Output Low Voltage VOL Low-impedance state, IPG = +5mA 0.4 V
PG Output High-Leakage Current IOH High-impedance state, VPG = 16V 1 μA
DISCHARGE
Discharge Current After PG
Deasserted IDISCHARGE
VOUT < 7.1V (MAX15096D only) 50 100 160
mA
VOUT ≥ 7.1V to 18V
(MAX15096D only)
710mW/
VOUT
PG THRESHOLD
PG Threshold VPG VIN = 12V 0.9 x
VIN
V
PG Assertion Delay tPG From VOUT > VPG and
VGATE - VOUT > 3V 12 16 20 ms
OUT-to-IN Short-Circuit Detection
Threshold VIOSHT Measured at VOUT
0.9 x
VIN
V
OUT Preload Threshold VPL Measured at VOUT
0.5 x
VIN
V
Electrical Characteristics (continued)
MAX15096/MAX15096A 2.7V to 18V, 6A Integrated Hot-Swap/
Electronic Circuit Breaker
www.maximintegrated.com Maxim Integrated
3
(VIN = VCC = 2.7V to 18V, TA = TJ = -40°C to +105°C, unless otherwise noted. Typical values are at VIN = 12V, RCB = 10.5kΩ, and
TA = +25°C.) (Note 2)
Note 2: All devices are 100% production tested at TA = +25°C. Limits over temperature are guaranteed by design.
Note 3: 41.2kΩ is the maximum allowed external resistance value to be connected at the CB pin to GND for safe operation. All
devices are tested with 10.5kΩ, the parameter specified at RCB = 41.2kΩ is guaranteed by bench characterization and cor-
relation, with respect to the tested parameter at RCB = 10.5kΩ. The formula that describes the relationship between RCB
and the circuit-breaker current threshold is: ICB = RCB/6510)(Ω/A) - 0.34A.
Note 4: Guaranteed by design and not production tested.
Note 5: The current-limit slow-comparator response time is weighed against the amount of overcurrent so the higher the
overcurrent condition, the faster the response time.
Note 6: Foldback is active during the startup phase so the internal power MOSFET operates within SOA.
Electrical Characteristics (continued)
PARAMETER SYMBOL
CONDITIONS
MIN TYP MAX UNITS
INPUTS
Input Logic Threshold EN VEN_TH Rising 0.95 1 1.05 V
Threshold Hysteresis EN VEN_TH_HYS Falling 50 mV
Input Logic Threshold PRSNT VPRSNT_TH Falling 0.92 0.97 1.02 V
Threshold Hysteresis PRSNT VPRSNT_TH_HYS Rising 50 mV
EN Bias Current IEN_BIAS VEN = 0 or 5.5V 1 μA
PRSNT Input Bias Current IPRSNT_BIAS VPRSNT = 0 or 18V 1 μA
EN Deglitch Time tEN_DEG 100 μs
PRSNT High-to-Low Deglitch Time tPRSNT_DEG 400 μs
THERMAL SHUTDOWN
Thermal Shutdown TSD TJ rising 150 °C
Thermal Shutdown Hysteresis TJ falling 20 °C
MAX15096/MAX15096A 2.7V to 18V, 6A Integrated Hot-Swap/
Electronic Circuit Breaker
www.maximintegrated.com Maxim Integrated
4
(VIN = VCC = 2.7V to 18V, TA = TJ = -40°C to +85°C, unless otherwise noted. Typical values are at VIN = 12V, RCB = 10.5kΩ, and
TA = +25°C.)
Typical Operating Characteristics
8
10
12
14
16
18
-40 -25 -10 520 35 50 65 80 95 110
ON-RESISTANCE(mΩ)
TEMPERATURE (°C)
ON-RESISTANCE
vs. TEMPERATURE toc04
VIN = 12V,
ILOAD = 0.5A
10V/div
500mV/
div
toc06
10ms/div
VUV
VPG
UV TURN-OFF WAVEFORMS
ILOAD
1V/div
VOUT
2A/div
CGATE =
5.6nF
5V/div
500mV/
div
toc05
10ms/div
VUV
VPG
UV TURN-ON WAVEFORMS
ILOAD
1V/div
VOUT
2A/div
CGATE =
5.6nF
5A/div
10V/div
toc07
1ms/div
VOUT
VPG
FAULT-SHUTDOWN WAVEFORMS
OVERLOAD (SLOW TRIP)
ILOAD
10V/div
VGATE 10V/div
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
-40 -25 -10 520 35 50 65 80 95 110
SUPPLY CURRENT(mA)
TEMPERATURE (°C)
SUPPLY CURRENT
vs. TEMPERATURE toc01
ICC
IIN
RCB = 41.2k
VIN = VCC= 12V
0
1
2
3
4
5
6
7
8
-40 -25 -10 520 35 50 65 80 95 110
CIRCUIT BREAKER THRESHOLD(A)
TEMPERATURE (°C)
CIRCUIT BREAKER THRESHOD
vs. TEMPERATURE toc03
RCB = 41.2k
RCB = 30k
RCB = 20k
RCB = 10.5k
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
10 15 20 25 30 35 40
CIRCUIT BREAKER THRESHOLD (A)
CIRCUIT BREAKER RESISTANCE (k)
CIRCUIT BREAKER THRESHOLD
vs. CIRCUIT BREAKER
REISISTANCE toc02
VIN = VCC = 12V
MAX15096/MAX15096A 2.7V to 18V, 6A Integrated Hot-Swap/
Electronic Circuit Breaker
Maxim Integrated
5
www.maximintegrated.com
(VIN = VCC = 2.7V to 18V, TA = TJ = -40°C to +85°C, unless otherwise noted. Typical values are at VIN = 12V, RCB = 10.5kΩ, and
TA = +25°C.)
Typical Operating Characteristics (continued)
5V/div
10V/div
10V/div
toc11
1s/div
VIN
ILOAD
VGATE
AUTORETRY
FUNCTIONALITY
VOUT
5A/div
CLOAD = 620nF
10V/div
2V/div
10V/div
toc14
2ms/div
VIN
VPG
VGATE
OUTPUT DISCHARGE BEHAVIOR
VOUT
5V/div
COUT =
1060µF
MAX15096D ONLY
10A/div
10V/div
toc08
400µs/div
VOUT
VPG
FAULT-SHUTDOWN WAVEFORMS
OVERLOAD (SHORT CIRCUIT)
ILOAD
10V/div
VGATE 20V/div 0.5
0.51
0.52
0.53
0.54
0.55
0.56
-40 -25 -10 520 35 50 65 80 95 110
UV RISING/FALLING THRESHOLD VOLTAGE(V)
TEMPERATURE (°C)
UV RISING\FALLING THRESHOLD
VOLTAGE vs. TEMPERATURE toc09
VIN = 12V,
VUV FALLING
VUV RISING
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
0 5 10 15 20 25 30
CIRCUIT BREAKER THRESHOLD TIME (ms)
OVERCURRENT(%)
CIRCUIT BREAKER THRESHOLD
TIME vs. OVERCURRENT toc12
VIN = VCC = 12V
5V/div
500mV/
div
toc10
10ms/div
VUV
VPG
PG ASSERTION DELAY
VOUT
500mV/
div
CGATE =
5.6nF
0
0.5
1
1.5
2
2.5
3
-40 -25 -10 520 35 50 65 80 95 110
FAST COMPARATOR DELAY(µs)
TEMPERATURE( OC)
FAST COMPARATOR DELAY
vs. TEMPERATURE toc13
RTIMER = OPEN
RTIMER = 44kRTIMER = 22k
RTIMER =0
RTIMER = 10.9k
MAX15096/MAX15096A 2.7V to 18V, 6A Integrated Hot-Swap/
Electronic Circuit Breaker
Maxim Integrated
6
www.maximintegrated.com
BUMP
NAME FUNCTION
A1 VCC
Power-Supply Input. Connect VCC to a voltage between 2.7V and 18V. Connect a Schottky diode (or 10Ω
resistor) from IN to VCC, and a 1µF bypass capacitor to GND to guarantee full operation in the event VIN
collapses during a strong short from OUT to GND.
A2 PG Power-Good Output. PG is an open-drain output. Connect to an external pullup resistor to make it an
active-high output. PG pulls low until the internal power MOSFET is fully enhanced.
A3 TIMER
Timing Input. Connect a resistor from TIMER to GND to program the maximum time the part is allowed
to remain in current limit. See the TIMER section. If TIMER is not connected, the parasitic capacitance
between TIMER and GND must be less than 10pF.
A4
UVOV
Undervoltage and Overvoltage Threshold Pin. UVOV sets the under/overvoltage threshold. See the Setting
the Undervoltage/Overvoltage Threshold section.
B1 CB
Current-Limit Threshold Set. Connect a resistor from CB to GND to set the circuit-breaker threshold. Maximum
value of 41.2kΩ can be accepted for safe operation. Having the CB pin connected to GND sets the circuit-
breaker threshold at 0A.
B2–B4 IN
Supply Voltage Input. IN is connected to the drain of the internal 12mΩ (typ) MOSFET. Bypass IN with a
transient voltage-suppressor diode to GND for clamping inductive kick transients in the case of fast output
short circuit to GND.
C1 GND Ground
C2–C4 OUT Load Output. Source of the internal power MOSFET.
D1 REG Internal Regulator Output. Bypass to ground with a 1µF capacitor. Do not power external circuitry using the
REG output.
D2 GATE
Gate of Internal MOSFET. During startup, a 5.9µA (typ) current is sourced to enhance the internal MOSFET
with a 10V/ms slew rate. Connect an external capacitance from GATE to GND to reduce the output slew
rate during startup.
D3 EN Active-High Enable Comparator Input. Pulling EN high enables the output if PRSNT is held low.
D4 PRSNT Active-Low Present-Detect Logic Input. Pulling PRSNT to GND enables the output if EN is high.
Bump Description
Bump Conguration
WLP
(2mm x 2mm)
TOP VIEW
(BUMP SIDE DOWN)
MAX15096
MAX15096A
MAX15096D
+
1 2 3 4
A
B
C
D
V
CC
PG TIMER UVOV
CB
IN IN IN
GND
OUT OUT OUT
REG
GATE EN PRSNT
MAX15096/MAX15096A 2.7V to 18V, 6A Integrated Hot-Swap/
Electronic Circuit Breaker
www.maximintegrated.com Maxim Integrated
7
Block Diagram
CHARGE PUMP
CONTROL
LOGIC
STARTUP
CONTROL
GATE_OK
GATE
0.9 x V
IN
1.25V
REFERENCE
GENERATOR
VCC
1V
REF2
REF1
CB_SLOW_COMP
EN
M
POW
TEMP
SENSE
I
LOAD
I
REF
I
GATE
100mA
OUT
FAST_COMP
PG
12µA
CB
LDO
REGULATOR
PRSNT
UVOV
GATE
V
CC
IN
TIMER REG GND
2x I
SLEW
I
PD
MAX15096
MAX15096A
MAX15096D
M
S1
(MAX15096D
ONLY)
MAX15096/MAX15096A 2.7V to 18V, 6A Integrated Hot-Swap/
Electronic Circuit Breaker
www.maximintegrated.com Maxim Integrated
8
Table 1. Timing
Timing Diagram
TIMING PARAMETER MIN TYP MAX UNITS
t0 400 μs
t1 100 μs
t212 16 20 ms
t3 100 μs
t4 0.5 μs
PRSNT#
100µs DEBOUNCING TIME
100µs FILTER TIME
GATE-OUT
t
2
V
TH_UV
3V
V
TH_REG
SYSTEM IDLE TIME
V
TH_OV
DISCHARGING
(MAX15096D) I
DISCHARGE
IN
UVOV
REG
EN
OUT
PG
0.9 x V
IN
t
1
t
0
t
3
t
4
MAX15096/MAX15096A 2.7V to 18V, 6A Integrated Hot-Swap/
Electronic Circuit Breaker
www.maximintegrated.com Maxim Integrated
9
Detailed Description
Enable Logic and Undervoltage/
Overvoltage-Lockout Threshold
The supply output can become active only after all the
following events have occurred:
IN is within the UVOV window
VCC is above its UVLO threshold
EN meets its enable threshold for more than 100μs
PRSNT is low for more than 400µs
The MAX15096 family of devices enables the outputs as
shown in Table 1. The devices are ready to drive the out-
put when the VCC supply rises above the VUVLO thresh-
old. The devices turn on the output when VCC > VUVLO,
VUVOV is higher than 0.55V (VUV_TH) and less than 1.23V
(VOV_TH). The devices turn off the output when VUVOV
falls below (0.55V - VUV_HYS) or VUVOV rises above
1.23V. An external resistive divider from IN to UVOV and
ground provide the flexibility to select the undervoltage/
overvoltage-lockout threshold to the desired value. See
Figure 1 and the Setting the Undervoltage/Overvoltage
Threshold section in the Applications Information section.
Startup
Once the devices’ output is enabled, the device pro-
vides controlled application of power to the load. The
voltage at OUT begins to rise at approximately 10V/ms
default until the programmed circuit-breaker current level
is reached, while the devices actively limit the inrush
current at the circuit-breaker setting. An external capacitance
connected to the GATE pin allows the user to program
the slew rate to a value lower than the default. The inrush
current can be programmed by appropriate selection of
RCB. During startup, a foldback current limit is active
to protect the internal MOSFET to operate within safe
operating area. (Figure 2).
Table 2. Output Enable Truth Table
Figure 1. Undervoltage/Overvoltage Threshold Setting Figure 2. Startup Inrush Current Foldback Characteristics
X = Don’t care.
VUV_TH = 0.55V (typ).
VOV_TH = 1.23V (typ).
POWER SUPPLY PRECISION ANALOG INPUT OUT
VCC UVLO UVP OVP
VCC > VUVLO VUVOV > VUV_TH VUVOV < VOV_TH On
VCC < VUVLO X X Off
X VUVOV < (VUV_TH - VUV_HYS) X Off
X X VUVOV > VOV_TH Off
CONTROL
LOGIC
REF1
REF2
R1
R2
IN
UVOV
MAX15096
MAX15096A
MAX15096D
GND
R
CB
= 41.2k
2V
V
IN
- V
OUT
0.64A
3A
10V
I
INRUSH
0.5A
0.1A
R
CB
= 10.5k
MAX15096/MAX15096A 2.7V to 18V, 6A Integrated Hot-Swap/
Electronic Circuit Breaker
www.maximintegrated.com Maxim Integrated
10
An internal 52ms (typ) timer starts counting when the
device enters startup phase. The devices complete
startup phase and enter normal operation mode if the volt-
age at OUT rises above the preload threshold (0.9 x VIN)
and (VGATE - VOUT) > 3V. An open-drain power-good
output (PG) goes high impedance 16ms after the startup
successfully completes. The thermal-protection circuit is
always active and the internal MOSFET is immediately
turned off so thermal-shutdown threshold condition can
be reached.
If the startup is not successful because the output is
shorted or the load is too high (OUT voltage < 1V), the
devices turn off the hot-swap switch after the output short
detection at startup tSHORT (13.2ms) elapses.
VariableSpeed/BiLevel-Fault Protection
VariableSpeed/BiLevel-fault protection incorporates com-
parators with different thresholds and response times to
monitor the load current (Figure 3). Protection is provided
in normal operation (after the startup period has expired)
by discharging the MOSFET gate in response to a fault
condition. During a fault condition, the MAX15096A enters
an autoretry mode while the MAX15096 latches off (see
the Autoretry and Latchoff Fault Management section).
Enable Input (EN)
The devices allow for enabling the MOSFET in an active-
high configuration. When all other enabling conditions
are verified and the EN pin is at a logic-high level, the
MOSFET is enabled. Similarly, when the EN pin is at a
logic-low level, the MOSFET is disabled.
Charge Pump
An integrated charge pump provides the gate-drive volt-
age for the internal power MOSFET. The charge pump
generates the proper gate-drive voltage above VIN to fully
enhance the internal power MOSFET and guarantee low
RON operation during normal state condition.
During startup, the internal charge pump drives the GATE
of the MOSFET with a 5.9μA current to enhance the
internal MOSFET with 10V/ms slew rate. Connect an
external capacitor (CGATE) from GATE to GND to reduce
the output slew rate during startup. CGATE can be
calculated according to the formula below:
CGATE = (IGATE x Δt)/ΔVGATE
where IGATE is 5.9μA (typ), Δt is the desired slew rate
time, and the 5V of ΔVGATE is the voltage at the gate of
the internal MOSFET at turn-on.
Figure 3. VariableSpeed/BiLevel Response
0.6%
OVERCURRENT
OUT CURRENT
2.7ms
TURN-OFF TIME
SLOW
COMPARATOR
FAST
COMPARATOR
30%
OVERCURRENT
200ns
50%
OVERCURRENT
MAX15096/MAX15096A 2.7V to 18V, 6A Integrated Hot-Swap/
Electronic Circuit Breaker
www.maximintegrated.com Maxim Integrated
11
Circuit-Breaker Comparator and Current Limit
The current through the internal power MOSFET is com-
pared to a circuit-breaker threshold. An external resistor
between CB and ground sets this threshold according to
the following formula:
ICB = (RCB/6501)(A/Ω) - 0.34A
where ICB is in amps and RCB (the resistor between CB
and ground) is in ohms.
The circuit-breaker comparator is designed so that the
load current can exceed the threshold for some amount
of time before tripping. The time delay varies inversely
with the overdrive above the threshold. The greater the
overcurrent condition, the faster the response time,
allowing the devices to tolerate load transients and noise
near the circuit-breaker threshold. The maximum allowed
external resistor value is 41.2kΩ, which corresponds to a
6A CB threshold setting. Programming the CB threshold
to a value higher than 6A could cause unsafe operating
conditions, resulting in damage to the device.
The devices also feature catastrophic short-circuit
protection. During normal operation, if OUT is shorted
directly to ground, a fast protection circuit forces the
gate of the internal MOSFET to discharge quickly and
disconnect the output from the input.
Autoretry and Latchoff Fault Management
During a fault condition, the devices turn off the internal
MOSFET, disconnecting the output from the input. The
MAX15096A enters an autoretry mode and restarts after
tRESTART (3.4s typ.) time delay elapses.
The MAX15096 latches off and remains off until the
enable logic is cycled off and on after a certain delay. The
delay prevents the latchoff device to restart and operate
with unsafe power-dissipation duty cycle. See the Timing
diagram and Table 1 for delay values.
Latchoff Reset
The latchoff could be reset if any one of the following
happens:
VCC is below its UVLO threshold
EN is disabled for longer than 100μs
UV is triggered
PRSNT goes above its threshold
OV is triggered
Power-Good (PG) Delay
The devices feature an open-drain, power-good output
that asserts after tPG delay, indicating that OUT voltage
has reached (0.9 x VIN) voltage and (VGATE - VOUT) > 3V.
REG
The devices include a linear regulator that outputs 3.3V
at REG. REG provides power to the internal circuit blocks
of the devices and must not be loaded externally (except
a resistor > 50kΩ connected from REG to EN). REG
requires a 1µF capacitor to ground for proper operation.
Output Discharging
The discharge FET is active when the output is disabled
or under fault event. In this event, the hot-swap is off
and the output is on the way down. The discharging is
triggered after the main FET has completely turned off.
The maximum output capacitance is approximately
1000µF. The voltage could be up to 18V. Ideally, it
discharges the output capacitor in constant power mode
(710mW typ) to ensure the voltage rail is below 0.3V
within 2s or less time.
TIMER
Connect a resistor from the TIMER pin to the GND pin
to program the fast-trip response time. This time is the
sum of the internal fast-comparator propagation delay
(less than 200ns typ) plus an additional delay set by the
external resistor connected from TIMER to ground.
Choosing different resistance values, it is possible to
change the value of additional delay. If the TIMER pin is
connected to REG, the total response time is less than
200ns (typ).
Additional delay is disabled also during the startup phase
or after a short-circuit event (VOUT < 90% VIN). Be careful
about additional delay settings related to a short event.
Additional delay can be calculated using the following
formula:
Additional_Delay (µs) = RTIMER (kΩ) x 22.9E-03
Maximum additional delay time is set to 2µs. Table 3
provides additional delay settings.
MAX15096/MAX15096A 2.7V to 18V, 6A Integrated Hot-Swap/
Electronic Circuit Breaker
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Thermal Protection
The devices enter a thermal shutdown mode in the event
of overheating caused by excessive power dissipation or
high ambient temperature. When the junction temperature
exceeds TJ = +150°C (typ), the internal thermal protec-
tion circuitry turns off the internal power MOSFET. The
devices recover from thermal shutdown mode once the
junction temperature drops by 20ºC (typ).
IN-to-OUT Short-Circuit Protection
At startup, after all the input conditions are satisfied (UV,
OV, VUVLO), the devices immediately check for IN-to-
OUT short-circuit faults. If VOUT is greater than 90% of
VIN, the internal MOSFET cannot be turned on, then the
MAX15096A autoretries in tRESTART (3.4s typ), while the
MAX15096 latches off.
If VOUT is in the range from 50% to 90% of VIN, then the
internal MOSFET still cannot be turned on after tSU time
elapses. The MAX15096A autoretries in tRESTART, while
the MAX15096 latches off.
Applications Information
Setting the Undervoltage/Overvoltage
Threshold
See Table 4 for options.
Table 3. Additional Delay Settings
Table 4. Setting the Undervoltage/Overvoltage Thresholds
OPTION RTIMER (kΩ) RESPONSE TIME (μs)
1 Open 2
2 86.6 2
3 43.2 1
4 21.5 0.5
511 0.25
6 0 0.050
OPTION R1 TABLE (kΩ)
R2 = 10kΩ OVP UVP
1 133 17.6 7.9
2 127 16.9 7.5
3118 15.7 7.0
4115 15.4 6.9
5113 15.1 6.8
6 107 14.4 6.4
7 102 13.8 6.2
8 49.9 7.4 3.3
9 46.4 6.9 3.1
10 43.2 6.5 2.9
11 39.2 6.1 2.7
12 33.2 5.3 2.4
MAX15096/MAX15096A 2.7V to 18V, 6A Integrated Hot-Swap/
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+Denotes a lead (Pb)-free/RoHS-compliant package.
Typical Application Circuit
Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns (foot-
prints), go to www.maximintegrated.com/packages. Note that
a “+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but the
drawing pertains to the package regardless of RoHS status.
Wafer-Level Packaging (WLP) Applications Information
For the latest application details on WLP construction, dimensions, tape carrier information, printed-circuit board techniques, bump-pad
layout, and recommended reflow temperature profile, as well as the latest information on reliability testing results, refer to Application
Note 1891: Wafer-Level Packaging (WLP) and Its Applications—available on Maxim’s website at www.maximintegrated.com/wlp.
Ordering Information
PART TEMP RANGE (°C) PIN-PACKAGE FAULT MANAGEMENT
MAX15096GWE+ -40 to +105 16 WLP Latchoff
MAX15096AGWE+ -40 to +105 16 WLP Autoretry
MAX15096DGWE+ -40 to +105 16 WLP Autoretry
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND PATTERN
NO.
16 WLP W162J2Z+1 21-0200 Refer to Application
Note 1891
UVOV
CB
MAX15096
MAX15096A
MAX15096D
GND
EN
REG
R1
IN OUT
12V
V
CC
R2
C
IN
C
REG
R
CB
GATE
C
SR
PRSNT
SYSTEM ENABLE
INPUT
*HIGHLY RECOMMENDED
C
OUT
22μF
R
TIMER
TIMER
V
PRSNT
*TVS
RIN
REMOVABLE CARD
PG
RPG
12V
12V
MAX15096/MAX15096A 2.7V to 18V, 6A Integrated Hot-Swap/
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14
Revision History
REVISION
NUMBER
REVISION
DATE DESCRIPTION PAGES
CHANGED
0 3/14 Initial release
1 8/14 Replaced TOCs 1, 3, 4, 9, and 13 5, 6
2 1/15 Updated Benets and Features section 1
3 5/16 Removed future part information; updated Header, General Description and
Benets and Features sections, and Pin Description table 1–15
4 2/17 Updated Typical Application Circuit diagram 14
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specications without notice at any time. The parametric values (min and max limits)
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
MAX15096/MAX15096A 2.7V to 18V, 6Am Integrated Hot-Swap/
Electronic Circuit Breaker
© 2017 Maxim Integrated Products, Inc.
15
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