TABLE OF CONTENTS

PARAGRAPH DESCRIPTION PAGE

7.0 QUALITY ASSURANCE PROVISIONS........................ 10

1.0 SCOPE

This specification is intended to define the mechanical, electrical and environmental requirements for

the SL .100” (2.54) pitch modular, single row wire-to-board and wire-to-wire system.

SL is designed for high density signal applications. The system includes: low profile latching vertical

and right angle headers; low profile housings for male and female crimp terminals; pre-assembled,

single piece pin and receptacle connectors for Insulation Displacement Technology (IDT); panel

mounts for modular wire-to-wire remote interconnections; and SL offers design flexibility and

automated harness-making capabilities when combined with our tooling.

71851, female box, high force crimp terminal

70066 & 70107, single row, crimp housing

70450 & 74130, dual row, crimp housing

70400, female, single row, insulation displacement, connector assembly

70475 & 71178 ,male, single row, insulation displacement, connector assembly

Headers:

70541, single row, .120” pocket, wire-to-board, shrouded header, vertical, split peg

70543, single row, .120” pocket, wire-to-board, shrouded header, vertical

70545, single row, .120” pocket, wire-to-board, shrouded header, vertical, tri-peg

70564, single row, .180” pocket, wire-to-board, shrouded header, vertical

70566, single row, .180” pocket, wire-to-board, shrouded header, vertical, tri-peg

70571, single row, .180” pocket, wire-to-board, shrouded header, right angle, board snaps

70575, single row, .180” pocket, wire-to-board, shrouded header, right angle, tri-peg

70634, single row, .120” pocket, wire-to-board, shrouded header, right angle, tri-peg, SMT

71164, single row, .120” pocket, wire-to-board, shrouded header, voided circuits

74095, single row, .120” pocket, wire-to-board, shrouded header, vertical, compliant pin

74098, single row, .120” pocket, wire-to-board, shrouded header, right angle, split peg, SMT

74099, single row, .120” pocket, wire-to-board, shrouded header, vertical, SMT

74105, single row, .120” pocket, wire-to-board, shrouded header, right angle, SMT

2.2.1.1 Maximum mating pin height: .320” (8.13 mm)

2.2.1.2 Minimum mating pin height: .200” (5.08 mm)

2.2.2 Centerline spacing (pitch): .100” (2.54 mm)

2.2.3 Wire Sizes:

For IDT: #22 - #28 AWG stranded wire, with an insulation diameter of .053”

(1.35 mm) max.

For Crimp: #22-#36 AWG wire. See Termination Application Specs for insulation

2.2.5.1 Crimp (70021, 70058, 71851)

2.2.5.2 IDT (70400, 70475)

2.2.5.3 Header

2.2.5.3.1 Thru Hole: Wave Solder

2.2.5.3.2 SMT: Reflow

2.2.5.3.3 Compliant: N/A

2.2.6 Housings:

(70066, 70450, 70107, 74130): Black Glass Filled Polyester, UL 94V-0

Header: Black Glass Filled Polyester, UL 94V-0

2.2.9.1 Gold: 30 microinches minimum Gold in select area over Nickel overall

or

Gold: 15 microinches minimum Gold in select area over Nickel overall

2.2.9.2 Tin: 150 microinches minimum Tin over Nickel overall.

See the appropriate Sales Drawing(s) for additional information on dimensions, materials, platings,

and markings.

2.3 SAFETY AGENCY APPROVALS:

UL File Number . . . . . . . . . . . E29179

CSA File Number . . . . . . . . . . LR19980

All documents referenced shall be of the latest revision. The order of precedence shall be as follows.

4.0 RATINGS:

4.1 VOLTAGE:

3.0 A - 24 AWG

3.0 A - 22 AWG

4.2 TEMPERATURE:

Processing Temperature for Headers: 260°C Maximum for Thru Hole Wave solder only

245°C Maximum for IR reflow SMT and Thru Hole Paste

PS-70021 – Male, crimp terminal

Place mated connectors 150mm from

1000 mm in length, width, and height.

30 millivolt Maximum

Initial

&

measure the initial leakage current.

Place mated pair in a thermostatic

chamber at a temperature of 60±5° C

and a humidity level of 90-

hour

10 microamps Maximum

Initial

1 milliamp Maximum Post

5.2 MECHANICAL PERFORMANCE:

0.56 N (0.125 lb) minimum

maximum and withdrawal

1.67 N (0.375 lb) minimum

min.

per minute prior to defined

Contact Resistance :

Change from Initial

and then unmated at a rate of 500

replaced every 50 cycles. The male

plug was subjected to 500

Contact Resistance :

10 milliohms Maximum

Change from Initial

Sweep: 10-55-10 Hz in one minute

Duration: 2 hours in each X-Y-Z axis.

(Test module shall be per Section 7.0)

Contact Resistance:

10 milliohms Maximum

Change from Initial

50 g's with three 1/2 sine wave form

shocks in each X-Y-Z axis.

(Test module shall be per Section 8.2)

10 milliohms Maximum

Change from Initial

Wire Pullout Force

Pullout force - 75% tensile

strength of wire, minimum.

Wire Pullout Force

wire at a rate of 25 ± 6mm (1 ± 1/4

electrical discontinuity

Newton’s - slight non-

functional plastic

deformation / no electrical

discontinuity.

Insertion Force (into

Housing) for Female

10000 Megohms Minimum

Humidity

transition time of 2.5 hours between

air dry for one hour prior to

measurements.

Appearance: No Damage

Contact Resistance: 10

milliohms maximum

change from initial.

Dielectric Withstanding

Voltage: No Breakdown

Insulation Resistance:

10000 Megohms Minimum

connectors; and measure the

temperature rise at the rated current

after 96 hours.

Current Cycling: Mate connectors;

measure the temperature rise at the

rated current after 500 hours (45

minutes ON and 15 minutes OFF per

Temperature Rise: 30°C

above ambient maximum

Temperature Rise: 30°C

above ambient maximum

Temperature Rise

connectors; and measure the

temperature rise at the rated current

harmonic motions. (Apply 4 hours in

the Z axis and 2 hours in each of the

uniformly from 10 Hz to 50 Hz

traversed continuously in 8 minutes.

Measure temperature rise.

Temperature Rise: 30°C

above ambient maximum

Temperature Rise: 30°C

above ambient maximum

after 45 minutes.

Heat Resistance: Place mated

connectors in an air circulating

chamber oven exposed to a

temperature of 100 degrees for 120

hours. Measure temperature rise.

above ambient maximum

Temperature Rise: 30°C

above ambient maximum