INTEGRATED CIRCUITS DATA SHEET TDA7073A; TDA7073AT Dual BTL power driver Product specification Supersedes data of 1994 July 1999 Aug 30 NXP Semiconductors Product specification Dual BTL power driver TDA7073A; TDA7073AT FEATURES GENERAL DESCRIPTION * No external components The TDA7073A/AT are dual power driver circuits in a BTL configuration, intended for use as a power driver for servo systems with a single supply. They are specially designed for compact disc players and are capable of driving focus, tracking, sled functions and spindle motors. * Very high slew rate * Single power supply * Short-circuit proof * High output current (0.6 A) * Wide supply voltage range Missing Current Limiter (MCL) * Low output offset voltage A MCL protection circuit is built-in. The MCL circuit is activated when the difference in current between the output terminal of each amplifier exceeds 100 mA (typical 300 mA). This level of 100 mA allows for headphone applications (single-ended). * Suited for handling PWM signals up to 176 kHz * ESD protected on all pins. QUICK REFERENCE DATA SYMBOL PARAMETER VP positive supply voltage range Gv voltage gain IP total quiescent current SR CONDITIONS MIN. TYP. MAX. UNIT 3.0 5.0 18 V 32.5 33.5 34.5 dB - 8 16 mA slew rate - 12 - V/s IO output current - - 0.6 A Ibias input bias current - 100 300 nA fco cut-off frequency - 1.5 - MHz VP = 5 V; RL = -3 dB ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION TDA7073A DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 TDA7073AT SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 1999 Aug 30 2 NXP Semiconductors Product specification Dual BTL power driver TDA7073A; TDA7073AT BLOCK DIAGRAM VP handbook, full pagewidth 5 I + i positive input 1 negative input 1 16 2 1 I - i 13 I - i negative input 2 negative output 1 SHORT - CIRCUIT AND THERMAL PROTECTION TDA7073A TDA7073AT positive input 2 positive output 1 12 negative output 2 6 7 I + i 9 positive output 2 3, 4, 8, 11, 15 10 14 MCD382 - 1 ground 2 ground 1 Fig.1 Block diagram. 1999 Aug 30 3 n.c. NXP Semiconductors Product specification Dual BTL power driver TDA7073A; TDA7073AT PINNING SYMBOL PIN DESCRIPTION IN1- 1 negative input 1 IN1+ 2 positive input 1 n.c. 3 not connected n.c. 4 not connected VP 5 positive supply voltage IN2+ 6 positive input 2 IN2- 7 negative input 2 n.c. 8 not connected OUT2+ 9 positive output 2 GND2 10 ground 2 n.c. 11 not connected OUT2- 12 negative output 2 OUT1- 13 negative output 1 GND1 14 ground 1 n.c. 15 not connected OUT1+ 16 positive output 1 handbook, halfpage 1 16 OUT1+ IN1+ 2 15 n.c. n.c. 3 14 GND1 n.c. 4 13 OUT1 - IN2 + 6 11 n.c. IN2 - 7 10 GND2 n.c. 8 9 OUT2 + VP TDA7073A TDA7073AT 12 OUT2 - 5 MCD381 Fig.2 Pin configuration. FUNCTIONAL DESCRIPTION feedback at 33.5 dB and the devices operate in a wide supply voltage range (3 to 18 V). The devices can supply a maximum output current of 0.6 A. The outputs can be short-circuited over the load, to the supply and to ground at all input conditions. The differential inputs can handle common mode input voltages from ground level up to (VP - 2.2 V with a maximum of 10 V). The devices have a very high slew rate. Due to the large bandwidth, they can handle PWM signals up to 176 kHz. The TDA7073A/AT are dual power driver circuits in a BTL configuration, intended for use as a power driver for servo systems with a single supply. They are particular designed for compact disc players and are capable of driving focus, tracking, sled functions and spindle motors. Because of the BTL configuration, the devices can supply a bi-directional DC current in the load, with only a single supply voltage. The voltage gain is fixed by internal 1999 Aug 30 IN1- 4 NXP Semiconductors Product specification Dual BTL power driver TDA7073A; TDA7073AT LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VP positive supply voltage range - 18 V IORM repetitive peak output current - 1 A IOSM non repetitive peak output current - 1.5 A Ptot total power dissipation TDA7073A Tamb < 25 C - 2.5 W TDA7073AT Tamb < 25 C - 1.32 W Tstg storage temperature range -55 +150 C Tvj virtual junction temperature - 150 C Tsc short-circuit time - 1 hr see note 1 Note 1. The outputs can be short-circuited over the load, to the supply and to ground at all input conditions. THERMAL CHARACTERISTICS SYMBOL Rth (j-a) PARAMETER CONDITIONS VALUE UNIT from junction to ambient TDA7073A in free air; note 1 50 K/W TDA7073AT in free air; note 2 95 K/W Notes 1. TDA7073A: VP = 5 V; RL = 8 ; The typical voltage swing = 5.8 V and Vloss is 2.1 V therefore IO = 0.36 A and Ptot = 2 x 0.76 W = 1.52 W; Tamb (max) = 150 - 1.52 x 50 = 74 C. 2. TDA7073AT: VP = 5 V; RL = 16 ; typical voltage swing = 5.8 V and Vloss is 2.1 V therefore IO = 0.18 A and Ptot = 2 x 0.38 W = 0.76 W; Tamb (max) = 150 - 0.76 x 95 = 77 C. 1999 Aug 30 5 NXP Semiconductors Product specification Dual BTL power driver TDA7073A; TDA7073AT CHARACTERISTICS VP = 5 V; f = 1 kHz; Tamb = 25 C; unless otherwise specified (see Fig.3). TDA7073A: RL = 8 ; TDA7073AT: RL = 16 . SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VP positive supply voltage range 3.0 5.0 18 V IORM repetitive peak output current - - 0.6 A IP total quiescent current VP = 5 V; RL = ; note 1 - 8 16 mA VOUT output voltage swing note 2 5.2 5.8 - V THD total harmonic distortion TDA7073A VOUT = 1 V (RMS) - 0.3 - % TDA7073AT VOUT = 1 V (RMS) - 0.1 - % 32.5 33.5 34.5 dB note 3 - 75 150 V Gv voltage gain Vno(rms) noise output voltage (RMS value) B bandwidth - - 1.5 MHz SVRR supply voltage ripple rejection note 4 38 55 - dB V16-13,12-9 DC output offset voltage RS = 500 - - 100 mV VI(CM) DC common mode voltage range note 5 0 - 2.8 V CMRR DC common mode rejection ratio note 6 - 100 - dB ZI input impedance - 100 - k Ibias input bias current - 100 300 nA channel separation 40 50 - dB GV channel unbalance - - 1 dB SR slew rate - 12 - V/s Notes 1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being equal to the DC output offset voltage divided by RL. 2. The output voltage swing is typically limited to 2 x (VP - 2.1 V) (see Fig.4). 3. The noise output voltage (RMS value), unweighted (20 Hz to 20 kHz) is measured with RS = 500 . 4. The ripple rejection is measured with RS = 0 and f = 100 Hz to 10 kHz. The ripple voltage of 200 mV (RMS value) is applied to the positive supply rail. 5. The DC common mode voltage range is limited to (VP - 2.2 V with a maximum of 10 V). 6. The common mode rejection ratio is measured at Vref = 1.4 V, VI(CM) = 200 mV and f = 1 kHz. 1999 Aug 30 6 NXP Semiconductors Product specification Dual BTL power driver TDA7073A; TDA7073AT APPLICATION INFORMATION (1) VP = 5 V handbook, full pagewidth 220 F 100 nF 5 I + i 16 2 driver signal 1 Rs (2) RL 500 1 13 I - i 12 TDA7073A TDA7073AT SERVO SYSTEM 6 driver signal 2 Rs Vref I - i (2) RL 500 7 I + i 9 3, 4, 8, 11, 15 14 10 n.c. MCD383 ground (1) This capacitor can be omitted if the 220 F electrolytic capacitor is connected close to pin 5. (2) RL can be: focus, tracking, sled function or spindle motor. Fig.3 Test and application diagram. 1999 Aug 30 7 NXP Semiconductors Product specification Dual BTL power driver TDA7073A; TDA7073AT + (VP - 2.1) V handbook, full pagewidth 0V MCD380 - (VP - 2.1) V Fig.4 Typical output voltage swing over RL. 1999 Aug 30 8 NXP Semiconductors Product specification Dual BTL power driver TDA7073A; TDA7073AT PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 2.2 inches 0.19 0.02 0.15 0.055 0.045 0.021 0.015 0.013 0.009 0.86 0.84 0.26 0.24 0.1 0.3 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT38-1 050G09 MO-001 SC-503-16 1999 Aug 30 9 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-13 NXP Semiconductors Product specification Dual BTL power driver TDA7073A; TDA7073AT SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c HE y v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index Lp L 8 1 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.01 0.019 0.013 0.014 0.009 0.41 0.40 0.30 0.29 0.05 0.419 0.043 0.055 0.394 0.016 inches 0.1 0.012 0.096 0.004 0.089 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 8o o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT162-1 075E03 MS-013 1999 Aug 30 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 10 NXP Semiconductors Product specification Dual BTL power driver TDA7073A; TDA7073AT SOLDERING Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE * For packages with leads on two sides and a pitch (e): The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Surface mount packages REFLOW SOLDERING MANUAL SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. 1999 Aug 30 When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 11 NXP Semiconductors Product specification Dual BTL power driver TDA7073A; TDA7073AT Suitability of IC packages for wave, reflow and dipping soldering methods SOLDERING METHOD MOUNTING PACKAGE WAVE suitable(2) Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount REFLOW(1) DIPPING - suitable BGA, LFBGA, SQFP, TFBGA not suitable suitable - HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable(3) suitable - PLCC(4), SO, SOJ suitable suitable - suitable - suitable - recommended(4)(5) LQFP, QFP, TQFP not SSOP, TSSOP, VSO not recommended(6) Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 1999 Aug 30 12 NXP Semiconductors Product specification Dual BTL power driver TDA7073A; TDA7073AT DATA SHEET STATUS DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe 1999 Aug 30 13 NXP Semiconductors Product specification Dual BTL power driver TDA7073A; TDA7073AT Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. Terms and conditions of commercial sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors' standard warranty and NXP Semiconductors' product specifications. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 1999 Aug 30 14 NXP Semiconductors provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com (c) NXP B.V. 2010 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 545002/03/pp15 Date of release: 1999 Aug 30 Document order number: 9397 750 06375