VS-10CTQ150S-M3, VS-10CTQ150-1-M3
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Revision: 27-Oct-17 1Document Number: 95729
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High Performance Schottky Rectifier, 2 x 5 A
FEATURES
• 175 °C TJ operation
• Center tap configuration
• Low forward voltage drop
• High frequency operation
• High purity, high temperature epoxy
encapsulation for enhanced mechanical strength and
moisture resistance
• Guard ring for enhanced ruggedness and long term
reliability
• Meets MSL level 1, per J-STD-020, LF maximum peak
of 245 °C
• Designed and qualified according to JEDEC®-JESD 47
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
DESCRIPTION
This center tap Schottky rectifier has been optimized for low
reverse leakage at high temperature. The proprietary barrier
technology allows for reliable operation up to 175 °C
junction temperature. Typical applications are in switching
power supplies, converters, freewheeling diodes, and
reverse battery protection.
PRIMARY CHARACTERISTICS
IF(AV) 2 x 5 A
VR150 V
VF at IF0.93 V
IRM 7 mA at 125 °C
TJ max. 175 °C
EAS 5 mJ
Package D2PAK (TO-263AB), TO-262AA
Circuit configuration Common cathode
D
2
PAK (TO-263AB) TO-262AA
1
3
2
1
3
2
Base
common
cathode
Anode Anode
Common
cathode
13
2
2
Base
common
cathode
Anode Anode
Common
cathode
13
2
2
VS-10CTQ150S-M3VS-10CTQ150-1-M3
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL CHARACTERISTICS VALUES UNITS
IF(AV) Rectangular waveform 10 A
VRRM 150 V
IFSM tp = 5 μs sine 620 A
VF5 Apk, TJ = 125 °C (per leg) 0.73 V
TJRange -55 to +175 °C
VOLTAGE RATINGS
PARAMETER SYMBOL VS-10CTQ150S-M3
VS-10CTQ150-1-M3 UNITS
Maximum DC reverse voltage VR150 V
Maximum working peak reverse voltage VRWM
VS-10CTQ150S-M3, VS-10CTQ150-1-M3
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Note
(1) Pulse width < 300 μs, duty cycle < 2 %
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum average
forward current, see fig. 5
per leg IF(AV) 50 % duty cycle at TC = 155 °C, rectangular waveform 5A
per device 10
Maximum peak one cycle non-repetitive
surge current per leg, see fig. 7 IFSM
5 μs sine or 3 μs rect. pulse Following any rated load
condition and with rated
VRRM applied
620
A
10 ms sine or 6 ms rect. pulse 115
Non-repetitive avalanche energy per leg EAS TJ = 25 °C, IAS = 1 A, L = 10 mH 5 mJ
Repetitive avalanche current per leg IAR Current decaying linearly to zero in 1 μs
Frequency limited by TJ maximum VA = 1.5 x VR typical 1A
ELECTRICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum forward voltage drop per leg
See fig. 1 VFM (1)
5 A TJ = 25 °C 0.93
V
10 A 1.10
5 A TJ = 125 °C 0.73
10 A 0.86
Maximum reverse leakage current per
leg See fig. 2 IRM (1) TJ = 25 °C VR = Rated VR
0.05 mA
TJ = 125 °C 7
Threshold voltage VF(TO) TJ = TJ maximum 0.468 V
Forward slope resistance rt28 m
Maximum junction capacitance per leg CTVR = 5 VDC (test signal range 100 kHz to 1 MHz), 25 °C 200 pF
Typical series inductance per leg LSMeasured lead to lead 5 mm from package body 8.0 nH
Maximum voltage rate of change dV/dt Rated VR10 000 V/μs
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum junction and storage
temperature range TJ, TStg -55 to +175 °C
Maximum thermal resistance,
junction to case per leg RthJC DC operation
3.50
°C/W
Maximum thermal resistance,
junction to case per package 1.75
Typical thermal resistance,
case to heatsink (only for TO-220) RthCS Mounting surface, smooth and greased 0.50
Approximate weight 2g
0.07 oz.
Mounting torque minimum 6 (5) kgf · cm
(lbf · in)
maximum 12 (10)
Marking device Case style D2PAK (TO-263AB) 10CTQ150S
Case style TO-262AA 10CTQ150-1
VS-10CTQ150S-M3, VS-10CTQ150-1-M3
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Revision: 27-Oct-17 3Document Number: 95729
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Fig. 1 - Maximum Forward Voltage Drop Characteristics
(Per Leg)
Fig. 2 - Typical Values of Reverse Current vs. Reverse Voltage
(Per Leg)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage (Per Leg)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics (Per Leg)
100
10
1
VFM - Forward Voltage Drop (V)
IF - Instantaneous Forward Current (A)
0 2.50.5 1.0 1.5 2.0 3.0
TJ = 25 °C
TJ = 175 °C
TJ = 125 °C
V
R
- Reverse Voltage (V)
IR - Reverse Current (mA)
0.0001
0.001
0.01
0.1
1
0 25 50 75 100 125 150
10
100
TJ = 175 °C
TJ = 150 °C
TJ = 125 °C
TJ = 100 °C
TJ = 75 °C
TJ = 50 °C
TJ = 25 °C
1000
100
VR - Reverse Voltage (V)
CT - Junction Capacitance (pF)
0
10
40 140
80 120 16020 60 100
TJ = 25 °C
t1 - Rectangular Pulse Duration (s)
ZthJC - Thermal Impedance (°C/W)
0.001
0.01
0.1
1
10
0.00001 0.0001 0.001 0.01 0.1 1 10 100
PDM
t1
t2
Notes:
1. Duty factor D = t1/t2
2. Peak TJ = PDM x ZthJC + TC
Single pulse
(thermal resistance)
D = 0.75
D = 0.50
D = 0.33
D = 0.25
D = 0.20
VS-10CTQ150S-M3, VS-10CTQ150-1-M3
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Revision: 27-Oct-17 4Document Number: 95729
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Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current (Per Leg)
Fig. 6 - Forward Power Loss Characteristics (Per Leg)
Fig. 7 - Maximum Non-Repetitive Surge Current (Per Leg)
Fig. 8 - Unclamped Inductive Test Circuit
Note
(1) Formula used: TC = TJ - (Pd + PdREV) x RthJC;
Pd = forward power loss = IF(AV) x VFM at (IF(AV)/D) (see fig. 6);
PdREV = inverse power loss = VR1 x IR (1 - D); IR at VR1 = 10 V
IF(AV) - Average Forward Current (A)
Allowable Case Temperature (°C)
120
130
140
150
160
170
180
02468
DC
See note (1)
Square wave (D = 0.50)
80 % rated VR applied
IF(AV) - Average Forward Current (A)
Average Power Loss (W)
0123456 8
0
1
2
4
7
3
5
D = 0.20
D = 0.25
D = 0.33
D = 0.50
D = 0.75
RMS limit
DC
tp - Square Wave Pulse Duration (µs)
IFSM - Non-Repetitive Surge Current (A)
10 100 1000 10 000
100
1000
At any rated load condition and
with rated V
RRM
applied
following surge
Current
monitor
High-speed
switch
D.U.T.
Rg = 25 Ω
+
Freewheel
diode Vd = 25 V
L
IRFP460
40HFL40S02
VS-10CTQ150S-M3, VS-10CTQ150-1-M3
www.vishay.com Vishay Semiconductors
Revision: 27-Oct-17 5Document Number: 95729
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ORDERING INFORMATION TABLE
ORDERING INFORMATION (Example)
PREFERRED P/N QUANTITY PER T/R MINIMUM ORDER QUANTITY PACKAGING DESCRIPTION
VS-10CTQ150S-M3 50 1000 Antistatic plastic tubes
VS-10CTQ150STRR-M3 800 800 13" diameter reel
VS-10CTQ150STRL-M3 800 800 13" diameter reel
VS-10CTQ150-1-M3 50 1000 Antistatic plastic tubes
LINKS TO RELATED DOCUMENTS
Dimensions D2PAK (TO-263AB) www.vishay.com/doc?96164
TO-262AA www.vishay.com/doc?96165
Part marking information D2PAK (TO-263AB) www.vishay.com/doc?95444
TO-262AA www.vishay.com/doc?95443
Packaging information www.vishay.com/doc?96424
2- Current rating (10 A)
3- Circuit conguration: C = common cathode
4- T = TO-220
5-Schottky “Q” series
6- Voltage rating (150 = 150 V)
7- S = D
2
PAK (TO-263AB)
-1 = TO-262AA
8- None = tube (50 pieces)
TRL = tape and reel (left oriented - for D
2
PAK (TO-263AB) only)
TRR = tape and reel (right oriented - for D
2
PAK (TO-263AB) only)
- -M3 = halogen-free, RoHS-compliant, and termination lead (Pb)-free
9
1
Device code
51 32 4 6 7 8 9
VS- 10 C T Q 150 S TRL -M3
-Vishay Semiconductors product
Outline Dimensions
www.vishay.com Vishay Semiconductors
Revision: 08-Jul-15 1Document Number: 95046
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D2PAK
DIMENSIONS in millimeters and inches
Notes
(1) Dimensioning and tolerancing per ASME Y14.5 M-1994
(2) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outmost extremes of the plastic body
(3) Thermal pad contour optional within dimension E, L1, D1 and E1
(4) Dimension b1 and c1 apply to base metal only
(5) Datum A and B to be determined at datum plane H
(6) Controlling dimension: inch
(7) Outline conforms to JEDEC® outline TO-263AB
SYMBOL MILLIMETERS INCHES NOTES SYMBOL MILLIMETERS INCHES NOTES
MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX.
A 4.06 4.83 0.160 0.190 D1 6.86 8.00 0.270 0.315 3
A1 0.00 0.254 0.000 0.010 E 9.65 10.67 0.380 0.420 2, 3
b 0.51 0.99 0.020 0.039 E1 7.90 8.80 0.311 0.346 3
b1 0.51 0.89 0.020 0.035 4 e 2.54 BSC 0.100 BSC
b2 1.14 1.78 0.045 0.070 H 14.61 15.88 0.575 0.625
b3 1.14 1.73 0.045 0.068 4 L 1.78 2.79 0.070 0.110
c 0.38 0.74 0.015 0.029 L1 - 1.65 - 0.066 3
c1 0.38 0.58 0.015 0.023 4 L2 1.27 1.78 0.050 0.070
c2 1.14 1.65 0.045 0.065 L3 0.25 BSC 0.010 BSC
D 8.51 9.65 0.335 0.380 2 L4 4.78 5.28 0.188 0.208
c
B
Detail A
c2
AA
A
± 0.004 B
M
A
Lead tip
(3)
(3)
View A - A
(E)
(D1)
E1
B
H
A1
Detail “A”
Rotated 90 °CW
Scale: 8:1
L
Gauge
plane
0° to 8°
L3
L4
Seating
plane
Section B - B and C - C
Scale: None
(4)
(4)
(b, b2)
b1, b3
(c) c1
Base
Metal
Plating
Conforms to JEDEC
®
outline D
2
PAK (SMD-220)
132
D
C
A
L2
E
(2)(3)
(2)
4
H
BB
2 x b
2 x b2
L1
0.010 AB
MM
(3)
e
2 x
Pad layout
MIN.
11.00
(0.43)
MIN.
9.65
(0.38)
MIN.
3.81
(0.15)
MIN.
2.32
(0.08)
17.90 (0.70)
15.00 (0.625)
2.64 (0.103)
2.41 (0.096)
Outline Dimensions
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TO-262
DIMENSIONS in millimeters and inches
Notes
(1) Dimensioning and tolerancing as per ASME Y14.5M-1994
(2) Dimension D and E do not include mold flash. Mold flash shall
not exceed 0.127 mm (0.005") per side. These dimensions are
measured at the outmost extremes of the plastic body
(3) Thermal pad contour optional within dimension E, L1, D1 and E1
(4) Dimension b1 and c1 apply to base metal only
(5) Controlling dimension: inches
(6) Outline conform to JEDEC TO-262 except A1 (maximum),
b (minimum) , D1 (minimum) and L2 where dimensions derived
the actual package outline
SYMBOL
MILLIMETERS INCHES
NOTES
MIN. MAX. MIN. MAX.
A 4.06 4.83 0.160 0.190
A1 2.03 3.02 0.080 0.119
b 0.51 0.99 0.020 0.039
b1 0.51 0.89 0.020 0.035 4
b2 1.14 1.78 0.045 0.070
b3 1.14 1.73 0.045 0.068 4
c 0.38 0.74 0.015 0.029
c1 0.38 0.58 0.015 0.023 4
c2 1.14 1.65 0.045 0.065
D 8.51 9.65 0.335 0.380 2
D1 6.86 8.00 0.270 0.315 3
E 9.65 10.67 0.380 0.420 2, 3
E1 7.90 8.80 0.311 0.346 3
e 2.54 BSC 0.100 BSC
L 13.46 14.10 0.530 0.555
L1 - 1.65 - 0.065 3
L2 3.36 3.71 0.132 0.146
(4)
(4) Base
metal
Plating b1, b3
(b, b2)
c1
c
Section B - B and C - C
Scale: None
Section A - A
(3)
E1
(3)D1
E
B
A
A
A
c2
c
A1
Seating
plane
Lead tip
(3)
(2) (3)
(2)
A
E
(Datum A)
L1
L2
BB
CC
3
2
1
L
D
2 x e
3 x b2
3 x b
0.010 A B
M M
Modified JEDEC® outline TO-262
Lead assignments
Diodes
1. - Anode (two die)/open (one die)
2., 4. - Cathode
3. - Anode
Legal Disclaimer Notice
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Revision: 01-Jan-2021 1Document Number: 91000
Disclaimer
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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
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including but not limited to the warranty expressed therein.
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