
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841 Gort Road Business Park, Ennis, Co. Clare, Ireland
1-800-446-1158 / (978) 620-2600 / Fax: ( 978) 689-0803 Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298
Website: http://www.microsemi.com
T4-LDS-0 09 5 Rev . 2 (1 0 15 7 2) Page 2 of 5
APPLICATIONS / BENEFITS
¾ Protection from switching transients and induced RF
¾ Protects TTL, ECL, DTL, MOS, MSI, and other integrated circuits requiring 5.0 V or lower power supplies
¾ Protection from ESD and EFT per IEC 61000-4-2 and IEC 61000-4-4
¾ Secondary lightning protection per IEC61000-4-5 with 42 Ohms source impedance: Class 1 thru 4
¾ Secondary lightning protection per IEC61000-4-5 with 12 Ohms source impedance: Class 1 thru 4
¾ Secondary lightning protection per IEC61000-4-5 with 2 Ohms source impedance: Class 2 & 3
¾ 1N5907 Inherently radiation hard as described in Microsemi MicroNote 050
MAXIMUM RATINGS
¾ 1500 Watts for 10/1000 μs at lead temperature (TL) 25oC (See Figs. 1, 2, and 4) with repetition rate of 0.01% or
less*
¾ Operating & Storage Temperatures: -65o to +175oC for 1N5907
¾ THERMAL RESISTANCE (junction to lead): 50oC/W for 1N5907
¾ THERMAL RESISTANCE (junction to ambient): 110 oC/W for 1N5907
¾ DC Power Dissipation* (1N5907): 1 Watt at TL <125oC 3/8” (10 mm) from body, or 1 Watt at TA ≤+65oC
when mounted on FR4 PC board as described for thermal resistance junction to ambient
¾ Forward surge current: 200 A for 8.3ms half-sine wave at TA = +25oC
¾ Solder Temperatures: 260 o C for 10 s (maximum)
MECHANICAL AND PACKAGING
¾ CASE (1N5907): DO-13 (DO-202AA) welded hermetically sealed metal and glass
¾ FINISH: External metal surfaces are Tin-Lead (Sn-Pb) plated and solderable per MIL-STD-750 method 2026
¾ POLARITY: Polarity indicated by diode symbol or cathode band (cathode connected to case for 1N5907)
¾ MARKING: Part number and polarity symbol
¾ WEIGHT: 1.4 grams. (Approx)
¾ TAPE & REEL option: Standard per EIA-296 (add “TR” suffix to part number)
¾ See package dimension on last page
* TVS devices are not typically used for dc power dissipation and are instead operated at or less than their rated standoff voltage
(VWM) except for transients that briefly drive the device into avalanche breakdown (VBR to VC region).