DSPIC30F4011-20E/PRA1 - Microchip Technology

dsPIC30F4011/4012

Data Sheet

High-Performance, 16-Bit

Digital Signal Controllers

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Trademarks

The Microchip name and logo, the Microchip logo, Accur on,

dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICST ART,

PRO MATE, PowerSmart, rfPIC and SmartShunt are

registered trademarks of Microchip Technology Incorporated

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In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active

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Note the following details of the code protection feature on Microchip devices:

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intended manner and under normal conditions.

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mean that we are guaranteeing the product as “unbreakable.”

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manufacture of development systems is ISO 9001:2000 certified.

dsPIC30F4011/4012

High-Performanc e, Modified RISC CPU:

• Modified Harvard architecture

• C compiler optimized in struction set architecture

with flexible addressing modes

• 83 base instructions

• 24-bit wide instructions, 16-bit wide data path

• 48 Kbytes on -chip Flash p rogr am spac e

(16K instruction words)

• 2 Kbytes of on-chip data RAM

• 1 Kbyte of nonvolatile data EEPROM

• Up to 30 MIPS operation:

- DC to 40 MHz external clock input

- 4 MHz-10 MHz oscillator input with

PLL active (4x, 8x, 16x)

• 30 interrupt sources:

- 3 external interrupt sources

- 8 user-selectable priority levels for each

inter rupt so urc e

- 4 processo r trap sources

• 16 x 16-bit working register array

DSP Engine Features:

• Dual data fetch

• Accumulator write-back for DSP operations

• Modulo and Bit-Reversed Addressing modes

• Two, 40-bit wide accumulators with optional

saturati on log ic

• 17-bit x 17-bit single-cycle hardware

fractional/integer multiplier

• All DSP instructions are single cycle

• ±16-bit, single-cycle shift

Peripheral Feat ures:

• High-current sink/source I/O pins: 25 mA/25 mA

•Timer module with programmable prescaler:

- Five 16-bit timers/counters; optionally pair

16-bit timers into 32-bit timer modules

• 16-bit Capture input functions

• 16-bit Compare/PWM output functions

• 3-wire SPI modules (supports 4 Frame modes)

•I

2C™ module supports Multi-Master/Slave mode

and 7-bit/10-bit addressing

• 2 UART modules with FIFO Buffers

• 1 CAN modul e, 2.0B co mpl ia nt

Motor Control PWM Module Features:

• 6 PWM output channels:

- Complement ary or Indepe ndent Outpu t

modes

- Edge and Center-Aligned modes

• 3 duty cycle generators

• Dedicated time base

• Programmable output polarity

• Dead-time control for Complementary mode

• Manual output control

• Trigger for A/D conversions

Quadrature Encoder Interface Module

Features:

• Phase A, Phase B and Index Puls e input

• 16-bit up/down position counter

• Count direction status

• Position Measurement (x2 and x4) mode

• Programmable digital noise filters on inputs

• Alternate 16-Bit Timer/Counter mode

• Interrupt on position counter roll over/underflow

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the “dsPIC30F Family Reference

Manual” (DS70046). For more information on the device

instruction set and programming, refer to the “dsPIC30F/

33F Programmer’s Reference Manual” (DS70157).

dsPIC30F4011/4012 Enhanced Flash

16-Bit Digital Signal Controller

dsPIC30F4011/4012

Analog Features:

• 10-Bit Analog-to-Digital Converter (A/D) with

4 S/H inputs:

- 1 Msps conversion rate

- 9 in put channels

- Conversion available during Sleep and Idle

• Programmable Brown-out Reset

Special Digital Signal Controller

Features:

• Enhanced Flash program memory:

- 10,000 erase/write cycle (min.) for

industrial temperature range, 100K (typical)

• Data EEPROM memory:

- 100,000 erase/write cycle (min.) for

industrial temperature range, 1M (typical)

• Self-reprogrammable under software control

• Power-on Reset (POR), Power-up Timer (PWR T )

and Oscillator Start-up Timer (OST)

Special Digital Signal Controller

Features (Cont.):

• Flexible Watchdog Timer (WDT) with on-chip,

low-power RC oscillator for reliable operation

• Fail-Safe Clock Monitor operation detects clock

failure and switches to on-chip, low-power

RC os cillator

• Programmable code protection

• In-Circuit Serial Programming™ (ICSP™)

• Selectable Power Ma nag em ent mo des :

- Sleep, Idle and Alternate Clock modes

CMOS Technology:

• Low-power, high-speed Flash technology

• Wide operating voltage range (2.5V to 5.5V)

• Industrial and Extended temperature ranges

• Low-power consumption

dsPIC30F Motor Control and Powe r Conversion Family*

Device Pins Program

Mem. B ytes/

Instructions

SRAM

Bytes EEPROM

Bytes Timer

16-bit Input

Cap

Output

Comp/Std

PWM

Motor

Control

PWM

10-Bit A/D

1 Msps Quad

Enc

UART

SPI

I2C™

CAN

dsPIC30F2010 28 12K/4K 512 1024 3 4 2 6 ch 6 ch Yes 1 1 1 -

dsPIC30F3010 28 24K/8K 1024 1024 5 4 2 6 ch 6 ch Yes 1 1 1 -

dsPIC30F4012 28 48K/16K 2048 1024 5 4 2 6 ch 6 ch Yes 1 1 1 1

dsPIC30F3011 40/44 24K/8K 1024 1024 5 4 4 6 ch 9 ch Yes 2 1 1 -

dsPIC30F4011 40/44 48K/16K 2048 1024 5 4 4 6 ch 9 ch Yes 2 1 1 1

dsPIC30F5015 64 66K/22K 2048 1024 5 4 4 8 ch 16 ch Yes 1 2 1 1

dsPIC30F6010 80 144K/48K 8192 4096 5 8 8 8 ch 16 ch Yes 2 2 1 2

* This table provides a summary of the dsPIC30F6010 peripheral features. Other available devices in the dsPIC30F Motor Control

and Power Conversion Family are shown for feature comparison.

dsPIC30F4011/4012

Pin Diagrams

AN7/RB7

AN6/OCFA/RB6

C1RX/RF0

C1TX/RF1

OC3/RD2

EMUC2/OC1/IC1/INT1/RD0

AN8/RB8

dsPIC30F4011

MCLR

VDD

VSS

EMUD2/OC2/IC2/INT2/RD1

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14

EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13

OSC2/CLKO/RC15

OSC1/CLKI

PWM1L/RE0

PWM1H/RE1

PWM2L/RE2

PWM2H/RE3

PWM3H/RE5

AVDD

AVSS

OC4/RD3

VSS

VDD

SCK1/RF6

PGC/EMUC/U1RX/SDI1/SDA/RF2

PGD/EMUD/U1TX/SDO1/SCL/RF3

PWM3L/RE4

VDD

U2RX/CN17/RF4

U2TX/CN18/RF5

AN4/QEA/IC7/CN6/RB4

AN2/SS1/CN4/RB2

EMUC3/AN1/VREF-/CN3/RB1

EMUD3/AN0/VREF+/CN2/RB0

AN5/QEB/IC8/CN7/RB5

FLTA/INT0/RE8

VSS

AN3/INDX/CN5/RB3

40-Pin PDIP

PGD/EMUD/U1TX/SDO1/SCL/RF3

SCK1/RF6

EMUC2/OC1/IC1/INT1/RD0

OC3/RD2

VDD

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14

VSS

OC4/RD3

EMUD2/OC2/IC2/INT2/RD1

FLTA/INT0/RE8

AN3/INDX/CN5/RB3

AN2/SS1/CN4/RB2

EMUC3/AN1/VREF-/CN3/RB1

EMUD3/AN0/VREF+/CN2/RB0

MCLR

AVDD

AVSS

PWM1L/RE0

PWM1H/RE1

PWM2H/RE3

PWM3L/RE4

PWM3H/RE5

VDD

VSS

C1RX/RF0

C1TX/RF1

U2RX/CN17/RF4

U2TX/CN18/RF5

PGC/EMUC/U1RX/SDI1/SDA/RF2

AN4/QEA/IC7/CN6/RB4

AN5/QEB/IC8/CN7/RB5

AN6/OCFA/RB6

AN7/RB7

AN8/RB8

VDD

VSS

OSC1/CLKI

OSC2/CLKO/RC15

EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13

44-Pin TQFP

dsPIC30F4011

PWM2L/RE2

dsPIC30F4011/4012

Pin Diagrams (Continued)

44-Pin QFN

330

232

dsPIC30F4011

PWM2H/RE3

PWM3L/RE4

PWM3H/RE5

VDD

C1RX/RF0

C1TX/RF1

U2RX/CN17/RF4

U2TX/CN18/RF5

PGC/EMUC/U1RX/SDI1/SDA/RF2

AN3/INDX/CN5/RB3

AN2/SS1/CN4/RB2

EMUC3/AN1/VREF-/CN3/RB1

EMUD3/AN0/VREF+/CN2/RB0

MCLR

AVDD

PWM1L/RE0

PWM1H/RE1

PWM2L/RE2

AN4/QEA/IC7/CN6/RB4

AN5/QEB/IC8/CN7/RB5

AN6/OCFA/RB6

AN7/RB7

AN8/RB8

VDD

VSS

OSC1/CLKI

OSC2/CLKO/RC15

PGD/EMUD/U1TX/SDO1/SCL/RF3

SCK1/RF6

EMUC2/OC1/IC1/INT1/RD0

OC3/RD2

VDD

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14

OC4/RD3

EMUD2/OC2/IC2/INT2/RD1

FLTA/INT0/RE8

VSS

AVSS

VDD

VSS

EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13

VSS

NC 12

dsPIC30F4011/4012

Pin Diagrams (Continued)

dsPIC30F4012

MCLR

PWM1L/RE0

PWM1H/RE1

PWM2L/RE2

PWM2H/RE3

PWM3L/RE4

PWM3H/RE5VSS

VDD

EMUD3/AN0/VREF+/CN2/RB0

EMUC3/AN1/VREF-/CN3/RB1

AVDD

AVSS

AN2/SS1/CN4/RB2

EMUD2/OC2/IC2/INT2/RD1 EMUC2/OC1/IC1/INT1/RD0

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14

EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13 VSSOSC2/CLKO/RC15

OSC1/CLKI VDD

FLTA/INT0/SCK1/OCFA/RE8

PGC/EMUC/U1RX/SDI1/SDA/C1RX/RF2

PGD/EMUD/U1TX/SDO1/SCL/C1TX/RF3

AN5/QEB/IC8/CN7/RB5

AN4/QEA/IC7/CN6/RB4

AN3/INDX/CN5/RB3

28-Pin SPDIP and SOIC

44-Pin QFN

330

232

dsPIC30F4012

PWM2H/RE3

PWM3L/RE4

PWM3H/RE5

VDD

PGC/EMUC/U1RX/SDI1/SDA/C1RX/RF2

AN3/INDX/CN5/RB3

AN2/SS1/CN4/RB2

EMUC3/AN1/VREF-/CN3/RB1

EMUD3/AN0/VREF+/CN2/RB0

MCLR

AVDD

PWM1L/RE0

PWM1H/RE1

PWM2L/RE2

AN4/QEA/IC7/CN6/RB4

AN5/QEB/IC8/CN7/RB5

VDD

VSS

OSC1/CLKI

OSC2/CLKO/RC15

PGD/EMUD/U1TX/SDO1/SCL/C1TX/RF3

FLTA/INT0/SCK1/OCFA/RE8

EMUC2/OC1/IC1/INT1/RD0

VDD

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14

EMUD2/OC2/IC2/INT2/RD1

VDD

VSS

AVSS

VDD

VSS

EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13

VSS

NC 14

13 44

dsPIC30F4011/4012
DS70135E-page 6 © 2007 Microchip Technology Inc.
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 7
2.0 CPU Architecture Overview........................................................................................................................................................ 13
3.0 Memory O rganization................................................................................................................................................................. 21
4.0 Address Generato r Units............................................................................................................................................................ 33
5.0 Interrupts.................................................................................................................................................................................... 39
6.0 Flash Pro g ram Memory....... ..................... ..................... ........................... ............................ ...................................................... 45
7.0 Data EEPR OM Mem o ry.... ............... ........................... ........................... ........................... ......................................................... 51
8.0 I/O Ports . ........................... ........................... ........................... ............................ ....................................................................... 57
9.0 Timer1 Module ........................................................................................................................................................................... 63
10.0 Timer2/3 Module ............... .. .. .... .. .. ..... .... .. .. .. .. .... ..... .. .. .... .. .. .. .. ....... .. .. .. .... .. .. ....... .. .. .. .. ............................................................... 67
11.0 Timer4/5 Module  .................. .. .... .. ..... .. .... .. .. .. .. ....... .. .. .. .... .. .. .. ....... .. .. .. .. .... .. ..... .... .. .. .. .. ............................................................. 73
12.0 Input Capture Module.............. .... .. ....... .. .. .... .. .. ....... .. .... .. .. .... .. ....... .. .. .... .. .. ....... .. .... .. .. .... ........................................................... 77
13.0 Output Compa re Module............. ............................ ..................... ........................... ............. ...................................................... 81
14.0 Quadrature Encoder Interface (QEI ) Module ............................................................................................................................. 85
15.0 Mot or Control PWM Module....................................................................................................................................................... 91
16.0 SP I Module............................................................................................................................................................................... 103
17.0 I2C™ Module ........................................................................................................................................................................... 107
18.0 U nivers al Asynchr onous Receiver  Transmi tter (UART) Module .............................................................................................. 115
19.0 CAN Module............................................................................................................................................................................. 123
20.0 10-bit, High-Speed Analog-to-Digita l Converter (ADC) Module ............................................................................................... 133
21.0 System Inte g r a tion ........ ..................... ..................... ........................... ..................... ................................................................. 145
22.0 Instruction Set Summary.......................................................................................................................................................... 159
23.0 Development Support............................................................................................................................................................... 167
24.0 Electrical Characteristics.......................................................................................................................................................... 171
25.0 Packagin g  In fo r mation................. ............................ ..................... ..................... ....................................................................... 213
Appendix A: Revision History............................................................................................................................................................. 221
Index .................................................................................................................................................................................................. 223
The Micro chip Web Site...................... ............................ ................................. .................................................................................. 229
Customer Change Notification Service ........................ ............... ...... ............. ...... ............... ...... ......................................................... 229
Customer Support.......... ............. ...... .... ............. ...... .... ............. ...... ............. ...... .... ............................................................................ 229
Reader Response.............................................................................................................................................................................. 230
Product Identification System............................................................................................................................................................. 231
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welcome your feedback.
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dsPIC30F4011/4012

1.0 DEVICE OVERVIEW This document contains device-specific information for

the dsPIC30F4011/4012 devices. The dsPIC30F

devices contain extensive Digital Signal Processor

(DSP) functionality within a high-performance, 16-bit

microcontroller (MCU) architecture. Figure 1-1 and

Figure 1-2 show device block diagrams for the

dsPIC30F4011 and dsPIC30F4012 devices.

FIGURE 1-1: dsPIC30F4011 BLOCK DIAGRAM

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the “dsPIC30F Family Reference

Manual” (DS70046). For more information on the device

instruction set and programming, refer to the “dsPIC30F/

33F Programmer’s Reference Manual” (DS70157).

AN8/RB8

Power-up

Timer

Oscillator

Start-up Timer

POR/BOR

Reset

Watchdog

Timer

Instruction

Decode and

Control

OSC1/CLKI

MCLR

, V

AN4/QEA/IC7/CN6/RB4

UAR T1 ,

SPI1 Motor Control

PWM

Timing

Generation

CAN

AN5/QEB/IC8/CN7/RB5

PCH

PCL

Program Coun ter

ALU<16>

Address Latch

Program Mem or y

(48 Kbytes)

Data Latch

X Data Bus

C™

QEI

AN6/OCFA/RB6

AN7/RB7

PCU

PWM1L/RE0

PWM1H/RE1

PWM2L/RE2

PWM2H/RE3

PWM3L/RE4

10-Bit ADC

Timers PWM3H/RE5

FLTA/INT0/RE8

U2TX/CN18/RF5

SCK1/RF6

Input

Capture

Module

Output

Compare

Module

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14

EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13

PORTB

C1RX/RF0

C1TX/RF1

PGC/EMUC/U1RX/SDI1/SDA/RF2

PGD/EMUD/U1TX/SDO1/SCL/RF3

PORTF

PORTD

16 16

16 x 16

W Reg Arr ay

Divide

Unit

Engine

DSP

Decode

ROM Latch

Y Data Bu s

Effe ctive Address

X RAGU

X WAGU

Y AGU EMUD3/AN0/V

REF

+/CN2/RB0

EMUC3/AN1/V

REF

-/CN3/RB1

AN2/SS1/CN4/RB2

AN3/INDX/CN5/RB3

OSC2/CLKO/RC15

U2RX/CN17/RF4

, A V

UART2

PORTC

PORTE

Interrupt

Controller PSV & Table

Data Access

Control Block

Stack

Control

Logic

Loop

Control

Logic

Data Lat chDat a L atch

Y Data

(1 Kbyte)

RAM X Data

(1 Kbyte)

RAM

Address

Latch Address

Latch

Control Signals

to V ar ious Blocks

EMUC2/OC1/IC1/INT1/RD0

EMUD2/OC2/IC2/INT2/RD1

OC3/RD2

OC4/RD3

Data EEPROM

(1 Kbyte)

dsPIC30F4011/4012

FIGURE 1-2: dsP IC30F4012 BLOCK DIAGRAM

Power-up

Timer

Oscillator

Start-up Timer

POR/BOR

Reset

Watchdog

Timer

Instruction

Decode and

Control

OSC1/CLKI

MCLR

, V

AN4/QEA/IC7/CN6/RB4

UAR T1 ,

SPI1, Motor Control

PWM

Timing

Generation

CAN

AN5/QEB/IC8/CN7/RB5

PCH PCL

Program Coun ter

ALU<16>

Address Latch

Program Mem or y

(48 Kbytes)

Data Latch

X Data Bus

C™

QEI

PCU

PWM1L/RE0

PWM1H/RE1

PWM2L/RE2

PWM2H/RE3

PWM3L/RE4

10-Bit ADC

Timers PWM3H/RE5

FLTA/INT0/SCK1/OCFA/RE8

Input

Capture

Module

Output

Compare

Module

EMUC1/SOSCO/T1CK/U1ARX/CN0/RC14

EMUD1/SOSCI/T2CK/U1ATX/CN1/RC13

PORTB

PGC/EMUC/U1RX/SDI1/SDA/C1RX/RF2

PGD/EMUD/U1TX/SDO1/SCL/C1TX/RF3

PORTF

PORTD

16 16

16 x 16

W Reg Arra y

Divide

Unit

Engine

DSP

Decode

ROM Latch

Y Data Bus

Effe ctive Address

X RAGU

X WAGU

Y AGU EMUD3/AN0/V

REF

+/CN2/RB0

EMUC3/AN1/V

REF

-/CN3/RB1

AN2/SS1/CN4/RB2

AN3/INDX/CN5/RB3

OSC2/CLKO/RC15

, A V

UART2

PORTC

PORTE

Interrupt

Controller PSV & Table

Data Access

Control Block

Stack

Contr ol

Logic

Loop

Control

Logic

Data LatchData Latch

Y Dat a

(1 Kbyte)

RAM X Da t a

(1 Kbyte)

RAM

Address

Latch Address

Latch

Control Sign als

to Va rious Blocks

EMUC2/OC1/IC1/INT1RD0

EMUD2/OC2/IC2/INT2/RD1

Dat a EEPROM

(1 Kbyte)

SPI2

dsPIC30F4011/4012

Table 1-1 provides a brief description of the device I/O

pinout and the functions that are multiplexed to a port

pin. Mul tiple fu nction s may exist on one po rt pin. Whe n

multiplexing occurs, the peripheral module’s functional

requirements may force an override of the data

direction of the port pin.

TABLE 1-1: dsPIC30F4011 I/O PIN DESCRIPTIONS

Pin Name Pin

Type Buffer

Type Description

AN0-AN8 I Analog Analog input channels. AN0 and AN1 are also used for device programming

data and clock inputs, respectively.

AVDD P P Positive supply for analog module.

AVSS P P Ground reference for analog module.

CLKI

CLKO I

OST/CMOS

—External clock source input. Always associated with OSC1 pin function.

Oscill ator cry stal output. Conn ec ts to crysta l or resona tor in Crystal

Oscillator mode. Optionally functions as CLKO in RC and EC modes.

Always associated with OSC2 pin function.

CN0-CN7

CN17-CN18 I ST Input change notification inputs. Can be software programmed for internal

weak pull-ups on all inputs.

C1RX

C1TX I

OST

—CAN1 bus receive pin.

CAN1 bus transmit pin.

EMUD

EMUC

EMUD1

EMUC1

EMUD2

EMUC2

EMUD3

EMUC3

I/O

ICD Primary Communication Channel data input/output pin.

ICD Primary Communication Channel clock input/output pin.

ICD Secondary Communication Channel data input/output pin.

ICD Secondary Communication Channel clock input/output pin.

ICD Tertiary Communication Channel data input/output pin.

ICD Tertiary Communication Channel clock input/output pin.

ICD Quaternary Communication Channel data input/output pin.

ICD Quaternary Communication Channel clock input/output pin.

IC1, IC2, IC7,

IC8 I ST Capture inputs 1, 2, 7 and 8.

INDX

QEA

QEB

Quadrature Encoder Index Pulse input.

Quadrature Encoder Phase A input in QEI mode.

Auxiliary Timer External Clock/Gate input in Timer mode.

Quadrature Encoder Phase A input in QEI mode.

Auxiliary Timer External Clock/Gate input in Timer mode.

INT0

INT1

INT2

External interrupt 0.

External interrupt 1.

External interrupt 2.

FLTA

PWM1L

PWM1H

PWM2L

PWM2H

PWM3L

PWM3H

—

PWM Fault A input.

PWM1 low output.

PWM1 high output.

PWM2 low output.

PWM2 high output.

PWM3 low output.

PWM3 high output.

MCLR I/P ST Master Clear (Reset) input or programming voltage input. This pin is an

active-low Reset to the device.

OCFA

OC1-OC4 I

OST

—Compare Fault A input (for Compare channels 1, 2, 3 and 4).

Compare outputs 1 through 4.

Legend: CMOS = CMOS compatible input or output Analog = Analog input

ST = Schmitt Trigger input with CMOS levels O = O utput

I = Input P = Power

dsPIC30F4011/4012

OSC1

OSC2

I/O

ST/CMOS

—

Oscill ator crystal inp ut. ST buffer when conf igu r ed in RC mo de; CMO S

otherwise.

Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator

mode. Optionally functions as CLKO in RC and EC modes.

PGD

PGC I/O

IST

ST In-Circuit Serial Programming™ data input/output pin.

In-Circuit Serial Programming clock input pin.

RB0-RB8 I/O ST PORTB is a bidirectional I/O port.

8RC13-RC15 8I/O 8ST PORTC is a bidirectional I/O port.

RD0-RD3 I/O ST PORTD is a bidirectional I/O port.

RE0-RE5,

RE8 I/O ST PORTE is a bidirectional I/O port.

RF0-RF6 I/O ST PORTF is a bidirectional I/O port.

SCK1

SDI1

SDO1

SS1

I/O

—

Synchronous serial clock input/output for SPI1.

SPI1 data in.

SPI1 data out.

SPI1 slave synchronization.

SCL

SDA I/O

I/O ST

ST Synchronous serial clock input/output for I2C™.

Synchronous serial data input/output for I2C.

SOSCO

SOSCI O

I—

ST/CMOS 32 kHz low-power oscillator crystal ou tput.

32 kHz low-power oscillator crystal input. ST buffer when configured in RC

mode; CMOS otherw i se .

T1CK

T2CK I

IST

ST Timer1 external clock input.

Timer2 external clock input.

U1RX

U1TX

U1ARX

U1ATX

U2RX

U2TX

—

UART1 receive.

UAR T1 tran sm it .

UAR T1 alt erna te receive.

UAR T1 alt erna te tr an s mi t.

UART2 receive.

UAR T2 tran sm it .

VDD P — Positive supply for logic and I/O pins.

VSS P — Ground refere nce for logic and I/O pins.

VREF+ I Analog Analog voltage reference (high) input.

VREF- I Analog Analog voltage reference (low) input.

TABLE 1-1: dsPIC30F4011 I/O PIN DESCRIPTIONS (CONTINUED)

Pin Name Pin

Type Buffer

Type Description

Legend: CMOS = CMOS compatible input or output Analog = Analog input

ST = Schmitt Trigger input with CMOS levels O = O utput

I = Input P = Power

dsPIC30F4011/4012

Table 1-2 provides a brief description of the device I/O

pinout and the functions that are multiplexed to a port

pin. Mul tiple fu nction s may exist on one po rt pin. Whe n

multiplexing occurs, the peripheral module’s functional

requirements may force an override of the data

direction of the port pin.

TABLE 1-2: dsPIC30F4012 I/O PIN DESCRIPTIONS

Pin Name Pin

Type Buffer

Type Description

AN0-AN5 I Analog Analog input channels. AN0 and AN1 are also used for device programming

data and clock inputs, respectively.

AVDD P P Positive supply for analog module.

AVSS P P Ground reference for analog module.

CLKI

CLKO I

OST/CMOS

—External clock source input. Always associated with OSC1 pin function.

Oscill ator cry stal output. Conn ec ts to crysta l or resona tor in Crystal

Oscillator mode. Optionally functions as CLKO in RC and EC modes.

Always associated with OSC2 pin function.

CN0-CN7 I ST Input change notification inputs. Can be software programmed for internal

weak pull-ups on all inputs.

C1RX

C1TX I

OST

—CAN1 bus receive pin.

CAN1 bus transmit pin.

EMUD

EMUC

EMUD1

EMUC1

EMUD2

EMUC2

EMUD3

EMUC3

I/O

ICD Primary Communication Channel data input/output pin.

ICD Primary Communication Channel clock input/output pin.

ICD Secondary Communication Channel data input/output pin.

ICD Secondary Communication Channel clock input/output pin.

ICD Tertiary Communication Channel data input/output pin.

ICD Tertiary Communication Channel clock input/output pin.

ICD Quaternary Communication Channel data input/output pin.

ICD Quaternary Communication Channel clock input/output pin.

IC1, IC2, IC7,

IC8 I ST Capture inputs 1, 2, 7 and 8.

INDX

QEA

QEB

Quadrature Encoder Index Pulse input.

Quadrature Encoder Phase A input in QEI mode.

Auxiliary Timer External Clock/Gate input in Timer mode.

Quadrature Encoder Phase A input in QEI mode.

Auxiliary Timer External Clock/Gate input in Timer mode.

INT0

INT1

INT2

External interrupt 0.

External interrupt 1.

External interrupt 2.

FLTA

PWM1L

PWM1H

PWM2L

PWM2H

PWM3L

PWM3H

—

PWM Fault A input.

PWM1 low output.

PWM1 high output.

PWM2 low output.

PWM2 high output.

PWM3 low output.

PWM3 high output.

MCLR I/P ST Master Clear (Reset) input or programming voltage input. This pin is an

active-low Reset to the device.

OCFA

OC1, OC2 I

OST

—Compare Fault A input (for Compare channels 1, 2, 3 and 4).

Compare outputs 1 and 2.

Legend: CMOS = CMOS compatible input or output Analog = Analog input

ST = Schmitt Trigger input with CMOS levels O = O utput

I = Input P = Power

dsPIC30F4011/4012

OSC1

OSC2

I/O

ST/CMOS

—

Oscill ator crystal inp ut. ST buffer when conf igu r ed in RC mo de; CMO S

otherwise.

Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator

mode. Optionally functions as CLKO in RC and EC modes.

PGD

PGC I/O

IST

ST In-Circuit Serial Programming™ data input/output pin.

In-Circuit Serial Programming clock input pin.

RB0-RB5 I/O ST PORTB is a bidirectional I/O port.

RC13-RC15 8I/O 8ST PORTC is a bidirect ional I/O port.

RD0-RD1 I/O ST PORTD is a bidirectional I/O port.

RE0-RE5,

RE8 I/O ST PORTE is a bidirectional I/O port.

RF2-RF3 I/O ST PORTF is a bidirectional I/O port.

SCK1

SDI1

SDO1

SS1

I/O

—

Synchronous serial clock input/output for SPI1.

SPI1 D a ta In .

SPI1 Data Out.

SPI1 Slave Synchronization

SCL

SDA I/O

I/O ST

ST Synchronous serial clock input/output for I2C™.

Synchronous serial data input/output for I2C.

SOSCO

SOSCI O

I—

ST/CMOS 32 kHz low-power oscillator crystal ou tput.

32 kHz low-power oscillator crystal input. ST buffer when configured in RC

mode; CMOS otherw i se .

T1CK

T2CK I

IST

ST Timer1 external clock input.

Timer2 external clock input.

U1RX

U1TX

U1ARX

U1ATX

—

UART1 receive.

UAR T1 tran sm it .

UAR T1 alt erna te receive.

UAR T1 alt erna te t ransmit.

VDD P — Positive supply for logic and I/O pins.

VSS P — Ground refere nce for logic and I/O pins.

VREF+ I Analog Analog voltage reference (high) input.

VREF- I Analog Analog voltage reference (low) input.

TABLE 1-2: dsPIC30F4012 I/O PIN DESCRIPTIONS (CONTINUED)

Pin Name Pin

Type Buffer

Type Description

Legend: CMOS = CMOS compatible input or output Analog = Analog input

ST = Schmitt Trigger input with CMOS levels O = O utput

I = Input P = Power

dsPIC30F4011/4012

2.0 CPU ARCHITECTURE

OVERVIEW

This document provides a summary of the

dsPIC30F4011/4012 CPU and peripheral functions.

For a complete description of this functionality, please

refer to the “dsPIC30F Family Reference Manual”

(DS70046).

2.1 Core Overview

The core has a 24-bit instruction word. The Program

Counter (PC) is 23 bits wide with the Least Significant

bit (LSb) always clear (see Section 3.1 “Program

Address Space”), and the Most Significant bit (MSb)

is ignored during norm al prog ram ex ecuti on, ex cept for

certain specialized instructions. Thus, the PC can

address up to 4M instruction words of user program

space. An instruction prefetch mechanism is used to

help maintain throughput. Program loop constructs,

free from loop count management overhead, are

supported using the DO and REPEAT inst ru cti on s, b oth

of which are int errup tib le at any point.

The working register array consists of 16x16-bit

set registers. One working register (W15) operates as

a software Stack Pointer for interrupts and calls.

The data space is 64 Kbytes (32K words) and is split into

two blocks, referred to as X and Y data memory. Each

block has its own independe nt Address Ge neration U nit

(AGU). Most instructions operate solely through the X

memory, AGU, which provides the appearance of a sin-

gle, unified data space. The Multiply-Accumulate (MAC)

class of dual source DSP instructions operate through

both the X and Y AGUs, splitting the data a ddress space

into two parts (see Section 3.2 “Data Address

Space”). The X and Y data space boundary is device-

specific and cannot be altered by the user. Each data

word consists of 2 bytes, and most instructions can

address data eithe r as words or bytes.

There are two methods of accessing data stored in

program memory:

• The upper 32 Kbyte s of data sp ace memory can be

mapped into the low er half (user space) of pro gram

space at any 16K program word bound ary, defined

by the 8-bit Program Sp ace V is ibility Page

(PSVP AG) register . This lets any instruction access

program space as if it were da t a sp ace , with a lim i-

tation that the access requires an additional c ycle.

Moreover, only the lower 16 bit s o f each instruction

word can be acces sed usi ng this meth od.

• SWWLinear indirect access of 32K word pages

within program space is also possible, using any

working register via table read and write instruc-

tions. Table read and write instructions can be

used to access all 24 bits of an instruction word.

Overhead-free circular buffers (Modulo Addressing)

are supported in both X and Y address spaces. This is

primarily intended to remove the loop overhead for

DSP algorithms.

The X AGU also supports Bit-Reversed Addressing on

destination ef fective addresses, to greatly simplify input

or output data reordering for radix-2 FFT algorithms.

Refer to Section 4.0 “Address Generator Units” for

details on Modulo and Bit-Reversed Addressing.

The core s up ports Inherent (n o op era nd), Re lat iv e, Lit-

eral, Memory Direct, Register Direct, Register Indirect,

Instruct ion s are associ ated wi th predefi ned addr essin g

modes, depending upon their functional requirements.

For m os t i ns tru c ti o ns , the c or e i s c apa bl e of e xe c ut i ng

a data (or program data) memory read, a working reg-

ister (data) read, a data memory write and a program

(instruction) memory read per instruction cycle. As a

result, 3-operand instructions are supported, allowing

C = A + B operations to be executed in a single cycle.

A DSP engine has been included to significantly

enhance the core arithmetic capab ility and throughput.

It features a high-speed, 17-bit by 17-bit multiplier, a

40-bit ALU, two 40-bit saturating accumulators and a

40-bit b idi rec tio nal b arrel shifter. Dat a in th e a cc umul a-

tor , or any working register , can be shifted up to 16 bits

right or 16 bits left in a single cycle. The DSP instruc-

tions ope rate sea mles sly with all other in struct ions an d

have be en desi gned for o ptimal re al-time p erforma nce.

The MAC class of instructions can concurrently fetch

two data operands from memory, while multiplying two

W registers. To enable this concurrent fetching of data

operands, the data space has been split for these

instructions and is linear for all others. This has been

achieved in a transparent and flexible manner by

dedicating certain working registers to each address

spac e for the MAC class of instructions.

The core does not support a multi-stage instruction

pipeline. However, a single-stage instruction prefetch

mechanism is used, which accesses and partially

decodes instructions a cycle ahead of execution in order

to maximize available execution time. Most instructions

execute in a single cycle with certain exceptions.

The core features a vectored exception processing

structure for traps and interrupts, with 62 independent

vectors. The exceptions consist of up to 8 traps (of

which 4 are res erv ed ) an d 54 interrupts . Eac h in terru pt

is prioritized based on a user-assigned priority between

1 and 7 (1 being the lowest priority and 7 being the

highest) in conjunction with a predetermined ‘natural

order’. T raps hav e fixed prio rities, rangi ng from 8 to 15.

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the “dsPIC30F Family Reference

Manual” (DS70046). For more information on the device

instruction set and programming, refer to the “dsPIC30F/

33F Programmer’s Reference Manual” (DS70157).

dsPIC30F4011/4012

2.2 Programmer’s Model

The programmer’s model is shown in Figure 2-1 and

consists of 16x16-bit working registers (W0 through

W15), 2x40-bit accumulators (ACCA and ACCB),

STATUS register (SR), Data Table Page register

(TBLPAG), Program Space Visibility Page register

(PSVPAG), DO and REPEAT registers (DOSTART,

DOEND, DCOUNT and RCOUNT) and Program

Counter (PC). The working registers can act as data,

address or offset registers. All registers are memory

mapped. W0 acts as the W register for file register

addressing.

Some of these registers have a shadow register asso-

ciated with each of them, as shown in Figure 2-1. The

shadow register is used as a temporary h olding register

and can tr ansfer its con tents to or fro m i t s hos t reg is ter

upon the occurrence of an event. None of the shadow

registers are accessible directly. The following rules

apply for transfer of registers into and out of shadows.

•PUSH.S and POP.S

W0, W1, W2, W3, SR (DC, N, OV, Z and C bits

only) are transferred.

•DO instruction

DOSTART, DOEND, DCOUNT shadows are

pushed on loop start and popped on loop end.

When a byte operation is performed on a working

mapped working registers is that both the Least and

Most Significant Bytes can be manipulated through

byte wide data m emory space accesses.

2.2.1 SOFTWARE STACK POINTER/

FRAM E POIN TE R

The dsPIC® Digital Signal Controllers contain a soft-

ware stack. W15 is the dedicated software Stack

Pointer (SP) and is automatically modified by exception

proce ssing and subrouti ne calls and retu rns. However,

W15 can be referenced by any instruction in the same

manner as all other W registers. This simplifies the

reading, writing and manipulation of the Stack Pointer

(e.g., creating stack frames).

W15 is initialized to 0x0800 during a Reset. The user

may reprogram the SP during initialization to any

location within data space.

W14 has been dedicated as a Stack Frame Pointer as

defined by the LNK and ULNK instructions. However,

W14 can be referenced by any instruction in the same

manner as all other W registers.

2.2.2 STATUS REGISTER

The dsPIC DSC c ore has a 16-bit STA TUS register (SR),

the Least Significant Byte of which is referred to as the

SR Low Byte (SRL) an d the Most Significant Byte as the

SR High Byte (SRH). See Figure 2-1 for SR layout.

SRL contains all the DSP ALU operation Status flags

(includ ing the Z bit ), as well as the CPU Inter rupt Prior-

ity Level Status bits, IPL<2:0>, and the Repeat Active

Status bit, RA. During exception processing, SRL is

concatenated with the MSB of the PC to form a

complete word value which is then stacked.

The upper byte of the SR register contains the DSP

Adder/Subtracter Status bits, the DO Loop Active bit

(DA) and the Digit Carry (DC) Status bit.

2.2.3 PROGRAM COUNTER

The Program Counter is 23 bits wide. Bit 0 is always

clear; therefore, the PC can address up to 4M

instruction words.

Note: In order to protect against misaligned

stack accesses, W15<0> is always clear.

dsPIC30F4011/4012

FIGURE 2-1: dsPIC30F4011/4012 PROGRAMMER’S MODEL

TABPAG

PC22 PC0

7 0

D0D15

Program Counter

Data Table Page Address

STATUS Regist er

Working Registers

DSP Operand

Registers

W10

W11

W12/DSP Offset

W13/DSP Write-Back

W14/Frame Pointer

W15/Stack Pointe r

DSP Address

Registers

AD39 AD0AD31

DSP

Accumulators ACCA

ACCB

PSVPAG

7 0Program Space Visibility Page Address

OA OB SA SB

RCOUNT

15 0

REPEAT Loop Counter

DCOUNT

15 0

DO Loop Counter

DOSTART

22 0

DO Loop Start Address

IPL2 IPL1

SPLIM Stack Pointer Limit Register

AD15

SRL

PUSH.S Shadow

DO Shadow

OAB SAB

15 0 Core Configuration Register

Legend

CORCON

DA DC RA N

TBLPAG

PSVPAG

IPL0 OV

W0/WREG

SRH

DO Loop End Address

DOEND

dsPIC30F4011/4012

2.3 Divide Support

The dsPIC DSCs feature a 16/16-bit signed fractional

divide operation, as well as 32/16-bit and 16/16-bit

signed and unsigned integer divide operations, in the

form of single instruction iterative divides. The following

instructions and data sizes are supported:

1. DIVF – 16/16 signed fractional divide

2. DIV.sd – 32/16 signed divide

3. DIV.ud – 32/16 unsigned divide

4. DIV.s – 16/16 signed divide

5. DIV.u – 16/16 unsigned divide

The divide instructions must be executed within a

REPEAT loop. Any other form of execution (e.g. a series

of discrete divide instructions) will not function correctly

becaus e t h e i ns tru ct io n fl ow dep en ds on RC OUN T. The

divide instruction does not automatically set up the

RCOUN T value and it must , therefore , be explicit ly and

correctly specified in the REPEAT instruction, as shown in

Table 2-1 (REPEAT executes the target instruction

{o perand va lue + 1} tim es). The REPEAT loop count must

be set up for 18 iterations of the DIV/DIVF instruction.

Thus, a complete divide operation requires 19 cycles.

TABLE 2-1: DIVIDE INSTRUCTIONS

2.4 DSP Engine

The DSP engine consists of a high-speed, 17-bit x

17-bit multiplier, a barrel shifter and a 40-bit adder/

subtracter (with two target accumulators, round and

saturati on log ic ).

The dsPIC30F devices have a single instruction flow

which can execute either DSP or MCU instructions.

Many of the hardware resources are shared between

the DSP and MCU instructions. For example, the

instruction set has both DSP and MCU multiply

instructions which use the same hardware multiplier.

The DSP engine also has the capability to perform

inherent accumulator-to-accumulator operations which

require no additional data. These instructions are ADD,

SUB and NEG.

The DS0 engine has various options selected through

various bits in the CPU Core Configuration register

(CORCON), as listed below:

1. Fractional or integer DSP multiply (IF).

2. Signed or unsigned DSP multiply (US).

3. Conventional or convergent rounding (RND).

4. Automatic saturation on/off for ACCA (SATA).

5. Automatic saturation on/off for ACCB (SATB).

6. Automatic saturation on/off for writes to data

memory (SATDW).

7. Accumulator Saturation mode selection

(ACCSAT).

A block diagram of the DSP engine is shown in

Figure 2-2.

Note: The divide flow is interruptible. However,

the user needs to save the context as

appropriate.

Instruction Function

DIVF Signed fractional divide: Wm/Wn → W0; Rem → W1

DIV.sd Signed divide: (Wm + 1:Wm)/Wn → W0; Rem → W1

DIV.s Signed divide: Wm/Wn → W0; Rem → W1

DIV.ud Unsigned divid e: (Wm + 1:Wm )/Wn → W0; Rem → W1

DIV.u Unsigned divide: Wm/Wn → W0; Rem → W1

Note: For CORCON layout, see Table 3-3.

TABLE 2-2: DSP INSTRUCTION

SUMMARY

Instruction Algebraic Operation

CLR A = 0

ED A = (x – y)2

EDAC A = A + (x – y)2

MAC A = A + (x * y)

MOVSAC No change in A

MPY A = x * y

MPY.N A = – x * y

MSC A = A – x * y

dsPIC30F4011/4012

FIGURE 2-2: DSP ENGINE BLOCK DIAGRAM

Zero Backfill

Sign-Extend

Barrel

Shifter

40-bit Accumulator A

40-bit Accumulator B Round

Logic

X Data Bus

To/From W Array

Adder

Saturate

Negate

16 16

40 40

Y Data Bus

Carry/Borrow Out

Carry/Borrow In

Multiplier/Scaler

17-bit

dsPIC30F4011/4012

2.4.1 MULTIPLIER

The 17x17-bit multiplier is capable of signed or

unsign ed op eration an d can m ultiplex its output u sing a

scaler to support either 1.31 fractional (Q31) or 32-bit

integer results. Unsigned operands are zero-extended

into the 17th bit of the multiplier input value. Signed

operands are sign-exten ded into the 17th bit of the mul-

tiplier input value. The output of the 17x17-bit multiplier/

scaler is a 33-bit value, which is sign-extended to

40 bits. Integer data is inherently represented as a

signed two’s complement value, where the MSB is

defined as a sign bit. Generally speaking, the range of

an N-bit two’s complement integer is -2N-1 to 2N-1 – 1.

For a 16-bit integer, the data range is -32768 (0x8000)

to 32767 (0x7FFF), inc luding 0. For a 32 -bit integer, the

data range is -2,147,483,648 (0x8000 0000) to

2,147,48 3,6 45 (0x7 FFF FFFF).

When the multiplier is configured for fractional multipli-

cation, the data is represented as a two’s complement

fraction , where the M SB is define d as a sign b it and the

radix point is implied to lie just after the sign bit

(QX format). The range of an N-bit two’s complement

fraction with this implied radix point is -1.0 to (1-21-N).

For a 16-bit fraction, the Q15 data range is -1.0

(0x8000) to 0.999969482 (0x7FFF), including 0, and

has a precision of 3.01518x10-5. In Fractional mode, a

16x16 multiply operation generates a 1.31 product,

which has a precision of 4.65661x10-10.

The same multiplier is used to support th e DSC multiply

instructions, which include integer 16-bit signed,

unsigned and mixed sign multiplies.

The MUL instruction may be directed to use byte or

word-sized operands. Byte operands direct a 16-bit

result, and word operands direct a 32-bit result to the

specified register(s) in the W array.

2.4.2 DATA ACCUMULATORS AND

ADDER/SUBTRACTER

The data accumulator consists of a 40-bit adder/

subtracter with automatic sign extension logic. It

can select one of two accumulators (A or B) as its

pre-accumu la tion source and po st-accumula tio n d es t i-

nation. F or the ADD and LAC instruc tions, the dat a to be

accum ulated or l oaded ca n be optio nally sca led via th e

barrel shifter, prior to accumulation.

2.4.2.1 Adder/Subtracter, Overflow and

Saturation

The adder/subtracter is a 40-bit adder with an optional

zero input into one side and either true or complement

data into the other input. In the case of addition, the

carry/borrow input is active-high and the other input is

true data (not complemented), whereas in the case of

subtraction, the carry/borrow input is active-low and the

other input is complemented. The adder/subtracter

generates Overflow Status bits, SA/SB and OA/OB,

which are latched an d reflected in t he ST ATUS r egister .

• Overflow from bit 39: this is a catastrophic

overflow in which the sign of the accumulator is

destroyed.

• Overflow into guard bits 32 through 39: this is a

recoverable overflow. This bit is set whenever all

the guard bits are not identical to each other.

The adder has an additional saturation block which

controls accumulator data saturation, if selected. It

uses the result of the adder, the Overflow Status bits

described above, and the SATA/B (CORCON<7:6>)

and ACCSAT (CORCON<4>) mode control bits to

determine when and to what value to saturate.

Six STATUS register bits have been provided to

support saturation and overflow; they are:

1. OA:

ACCA overflowed into guard bits

2. OB:

ACCB overflowed into guard bits

3. SA:

ACCA saturated (bit 31 overflo w and saturatio n)

ACCA overflowed into guard bits and saturated

(bit 39 overflow and saturation)

4. SB:

ACCB saturated (bit 31 overflo w and saturatio n)

ACCB overflowed into guard bits and saturated

(bit 39 overflow and saturation)

5. OAB:

Logical OR of OA and OB

6. SAB:

Logical OR of SA and SB

The OA and OB bits are modified each time data

passes through the adder/subtracter. When set, they

indicate that the most recent operation has overflowed

into the accumulator guard bits (bits 32 through 39).

Also, the OA and OB bits can optionally generate an

arithmetic warning trap when set and the correspond-

ing Overflow Trap Flag Enable bit (OVATE, OVBTE) in

the INTCON1 register (refer to Section 5.0 “Inter-

rupts”) is set. This allows the user to take immediate

action, for example, to correct system gain.

dsPIC30F4011/4012

The SA and SB bit s are modified each ti me data pass es

through the adder/subtracter but can only be cleared by

the user. When set, they indicate that the accumulator

has overflowed its maximum range (bit 31 for 32-bit

saturation or bit 39 for 40-bit saturation) and is saturated

(if saturation is enabled). When saturation is not

enabled, SA and SB default to bit 39 overflow and thus

indicate that a cat astrophic overfl ow has occurred. If the

COVTE bit in the INTCON1 register is set, SA and SB

bits gen erate an arithmetic warning trap when saturation

is disabled.

The overflow and saturation Status bits can optionally

be viewed in the STATUS register (SR) as the logical

OR of OA an d OB (in bit OAB) and the logical OR of SA

and SB (in bit SAB). Th is allows programm ers to check

one bit in the STATUS register to determine if either

accumulator has overflowed, or one bit to determine if

either a ccum ulator has satu rated. T his w ould be usefu l

for complex number arithmetic which typically uses

both the accu mul ators.

The device supports three Saturation and Overflow

modes:

1. Bit 39 Overflow and Saturation:

When bit 39 overflow and saturation occurs, the

saturation logic load s the maximally positive 9.31

(0x7FFFFFFFFF) or maximally negative 9.31

value (0 x8000000 000) into th e target accumul a-

tor. The SA or SB bit is set and remains set until

cleared by the user. This is referred to as ‘super

saturation’ and provides protection against erro-

neous data or unexpected algorithm problems

(e.g., gain calculations).

2. Bit 31 Overflow and Saturation:

When bit 31 overflow and saturation occurs, the

saturation logic then loads the maximally posi-

tive 1.31 value (0x007FFFFFFF) or maximally

negative 1.31 value (0x0080000000) into the

target accumulator. The SA or SB bit is set and

remains set until cleared by the user. When this

Saturation mode is in effect, the guard bits are not

used (so the OA, OB or OAB bits are never set).

3. Bit 39 Catastrophic Overflow

The bit 39 overflow Status bit from the adder is

used to set the SA or SB bit, which remain set

until cleared by the user. No saturation operation

is performed and the accumulator is allowed to

overflow (destroying its sign). If the COVTE bit in

the INTCON1 register is set, a catastrophic

ove rflow can initiate a trap exception.

2.4.2.2 Accumulator ‘Write-Back’

The MAC class of instructions (with the exception of

MPY, MPY.N, ED and EDAC) can optionally write a

rounded version of the high word (bits 31 through 16)

of the acc umulator that is not t argeted by the instruction

into dat a spac e memory. The wri te is performe d across

the X bus into combined X and Y address space. The

following addressing modes are supported:

1. W13, Register Direct:

The rounded contents of the non-target

accumulator are written into W13 as a

1.15 fraction.

2. [W13]+ = 2, Register Indirect with Post-Increment :

The round ed contents of the non-target accumu-

lator are written into the address pointed to by

W13 as a 1.15 fraction. W13 is then

incremented by 2 (fo r a wo rd wr ite).

2.4.2.3 Round Logic

The round logic is a combinational block, which per-

forms a conventional (biased) or convergent (unbiased)

round function during an accumulator write (store). The

Round mode is det ermined by the state of the RND bit

in the CORCON register. It generates a 16-bit, 1.15 data

value which is passed to the data space write saturation

logic. If rounding is not indicated by the instruction, a

truncated 1.15 data value is stored and the least

significant word is simply discarded.

Conventional rounding takes bit 15 of the accumulator,

zero-extends it and ad ds it to the AC CxH word (bi t s 16

through 31 of the accum ulator). I f the AC CxL word ( bits

0 through 15 of the accumulator) is between 0x8000

and 0xFFFF (0x8000 included), ACCxH is incre-

mented. If ACCxL is between 0x0000 and 0x7FFF,

ACCxH is left un ch ang ed. A consequenc e of thi s alg o-

rithm is that over a succession of random rounding

operations, the value tends to be biased slightly

positive.

Convergent (or unbiased) rounding operates in the

same manner as conventional rounding, except when

ACCxL equals 0x8000. If this is the case, the LSb

(bit 16 of the accumulator) of ACCxH is examined. If it

is ‘1’, ACCxH is incremented. If it is ‘0’, ACCxH is not

modif ied . Assu min g th at bit 16 is effec tive ly ra ndom in

nature, this scheme removes any rounding bias that

may accumulate .

The SAC and SAC.R instructions store either a trun-

cated (SAC) or rounded (SAC.R) version of the cont ents

of the t arget accumul ator to data mem ory , via the X bu s

(subject to data saturation, see Section 2.4.2.4 “Data

Space Write Saturation”). Note that for the MAC cl as s

of instructions, the accumulator write-back operation

functions in the same manner, addressing combined

DSC (X and Y) data space though the X bus. For this

class of instructions, the data is always subject to

rounding.

dsPIC30F4011/4012

2.4.2.4 Data Space Write Saturation

In ad dition to add er/subtr acter sat uration , writes to data

space may also be saturated, but without affecting the

contents of the source accumulator. The data space write

saturation logic block accepts a 16-bit, 1.15 fractional

value from the round logic block as its input, together with

overflow status from the original source (accumulator)

and the 16-bit round adder. These are combined and

used to select the appropriate 1.15 fractional value as

output to wri te to d at a spa ce m e mo ry.

If the SATDW bit in the CORCON register is set, data

(after roundi ng or trun ca tio n) is tes te d for ove rflo w and

adjusted accordingly. For input data greater than

0x007FF F, dat a written to me mory is forced to the max-

imum posit ive 1. 15 val ue, 0x7FFF. F or inp ut da ta less

than 0x FF8000, dat a wri tten to memo ry is f orced to the

maximum negative 1.15 value, 0x8000. The MSb of the

source (bit 39) is used to determine the sign of the

operand bei ng tes ted.

If the SATDW bit in the CORCON re gister is not set, the

input data is always passed through unmodified under

all conditions.

2.4.3 BARREL SHIFTER

The barrel shifter is capable of performing up to 16-bit

arithmetic or logic right shifts, or up to 16-bit left shifts

in a single cycle. The source can be either of the two

DSP accumulators or the X bus (to support multi-bit

shifts of register or memory data).

The sh ifter requires a s ign ed bi nary v al ue to de term in e

both the magnitude (number of bits) and direction of the

shift op eration. A positive value shifts the operand right.

A negative value shifts the operand left. A value of ‘0’

does not modify the operand.

The barrel shifter is 40 bits wide, thereby obtaining a

40-bit res ult for DSP shift ope rations an d a 16-bit resu lt

for MCU shift operations. Data from the X bus is pre-

sented to the barrel shifter between bit positions 16 to

31 for right sh ifts, and bit positio ns 0 to 15 for left sh ifts.

dsPIC30F4011/4012

3.0 MEMORY ORGANIZATION

3.1 Program Address Space

The program address space is 4M instruction words. It

is addressable by the 23-bit PC, table instruction

Effective Address (EA) or data space EA, when

program space is mapped into data space as defined

by Table 3-1. Note that the program space address is

incremented by two between successive program

words in order to provide compatibility with data space

addressing.

User program space access is restricted to the lower

4M instruction word address range (0x000000 to

0x7FFFFE) for all accesses other than TBLRD/TBLWT,

which use TBLPAG<7> to dete rmine user or c onfigura-

tion sp ace ac cess. I n Table 3-1, read/ write instru ctions,

bit 23 allows access to the Device ID, the User ID and

the Configur ation bit s; otherwis e, bit 23 is always clear .

FIGURE 3-1:

PROGRAM SP AC E

MEMORY MAP FOR

dsPIC30F4011/4012

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the “dsPIC30F Family Reference

Manual” (DS70046). For more information on the device

instruction set and programming, refer to the “dsPIC30F/

33F Programmer’s Reference Manual” (DS70157).

Reset – Target Address

User Memor y

Space

000000

00007E

000002

000080

Device Configuration

User Flash

Program Memory

008000

007FFE

Configuration Memory

Space

Data EEPROM

(16K instructions)

(1 Kbyte)

800000

F80000

Registers F8000E

F80010

DEVID (2) FEFFFE

FF0000

FFFFFE

Reserved F7FFFE

Reserved

7FFC00

7FFBFE

(Read ‘0’s)

8005FE

800600

UNITID (32 instr.)

8005BE

8005C0

Reset – GOTO Instruction

000004

Reserved

7FFFFE

Reserved

000100

0000FE

000084

Alterna te Vector Table

Reserved

Interrupt Vector Table Vector Tables

dsPIC30F4011/4012

TABLE 3-1: PROGRAM SPACE ADDRESS CONSTRUCTION

FIGURE 3-2: DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION

Access Type Access

Space Program Spac e Address

<23> <22:16> <15> <14:1> <0>

Instruction Access User 0 PC<22:1> 0

TBLRD/TBLWT User

(TBLPAG<7> = 0)TBLPAG<7:0> Data EA<15:0>

TBLRD/TBLWT Configuration

(TBLPAG<7> = 1)TBLPAG<7:0> Data EA<15:0>

Program Space Visibility User 0 PSVPAG<7:0> Data EA<14:0>

0Program Counter

23 bits

PSVPAG Reg

8 bits

15 bits

Program

Using

Select

TBLPAG Reg

8 bits

16 bits

Using

Byte

24-bit EA

1/0

Select

User/

Configuration

Table

Instruction

Program

Space

Counter

Using

Space

Select

Note: Program Space Visibility cannot be used to access bits <23:16> of a word in program memory.

Visibility

© 2007 Microchip Technology Inc. DS70135E-page 23
dsPIC30F4011/4012
3.1.1 DATA ACCESS FROM PROGRAM 
MEMORY USING TABLE 
INSTRUCTIONS
This arc hit ec ture f etc hes  24 -bi t w ide  prog ram  me mo ry.
Consequently, instructions are always aligned. How-
ever, as the architecture is modified Harvard, data can
also be present in prog ram space.
There are two methods by which program space can
be accessed; via special table instructions, or through
the rema ppi ng of a 16K w ord  prog ram  space page into
the u pp e r  half  o f  da ta space (s ee  Section 3.1.2 “Data
Access From Program Memory Using Program
Space Visibility”). The TBLRDL and TBLWTL instruc-
tions of fer a direct method of reading or writing the least
significant word (lsw) of any address within program
space, without going through data space. The TBLRDH
and TBLWTH instructions are the only method whereby
the upper 8 bits of a program space word can be
accessed as data.
The PC is incremented by two for each successive
24-bit program word. This allows program memory
addresses to directly map to data space addresses.
Program memory can thus be regarded as two, 16-bit
word-wid e addres s sp aces,  residin g side by  side, eac h
with the same address range. TBLRDL and TBLWTL
access the space which contains the least significant
data  word,  and TBLRDH and TBLWTH ac cess the sp ac e
which contains the Most Significant Byte of data. 
Figure 3-2 shows  h ow th e EA  is  cre ate d for table  op er-
ations and data space accesses (PSV = 1). Here,
P<23:0> refers to a program space word, whereas
D<15:0> refers to a data space word.
A set of table instructions is provided to move byte or
word-sized data to and from program space (see
Figure 3-3 and Figure 3-4). 
1. TBLRDL: Table Read Low
Word: Read the lsw of the program address;
P<15:0> maps to D<15:0>.
Byte: Read one of the LSBs of the program 
address;
P<7:0> maps to the destination byte when byte
select = 0;
P<15:8> m aps to the d estination byte  when byte
select = 1.
2. TBLWTL: Table Writ e Low (re fer  to Section 6.0
“Flash Program Memory” for details on Flash
programming).
3. TBLRDH: Table Read High
Word: Read the msw of the program address;
P<23:16> m aps to D<7:0>; D<15:8 > will always 
be = 0.
Byte: Read one of the MSBs of the program 
address;
P<23:16> maps to the destination byte when
byte select = 0;
The destination byte will always be ‘0’ when byte
select = 1.
4. TBLWTH: Table Wri te  Hi gh  (ref er  to Section 6.0
“Flash Program Memory” for details on Flash
programming).
FIGURE 3-3: PROGRAM DATA TABLE ACCESS (LEAST SIGNIFICANT WORD)
0
8
16
PC Address
0x000000
0x000002
0x000004
0x000006
23
00000000
00000000
00000000
00000000
Progra m Me mo r y
‘Phantom’ Byte
(read as ‘0’).
TBLRDL.W
TBLRDL.B (Wn<0> = 1)
TBLRDL.B (Wn<0> = 0)

dsPIC30F4011/4012

FIGURE 3-4: PROGRAM DATA TABLE ACCESS (MOST SIGNIFICANT BYTE)

3.1.2 DATA ACCESS FROM PROGRAM

MEMORY USING PROGRAM

SPACE VISIBILITY

The upper 32 Kbytes of data space may optionally be

mapped into any 16K word program space page. This

provides transparent access of stored constant data

from X data space without the need to use special

instruc tio ns (i.e ., TBLRDL/H, TBLWTL/H ins tru cti ons).

Program space access through the data space occurs

if the MSb of the data space EA is set and program

space visibility is enabled by setting the PSV bit in the

Core Control register (CORCON). The functions of

CORCON are discussed in Section 2.4 “DSP

Engine”.

Data accesses to this area add an additional cycle to

the instruction being executed, since two program

memory fetch es are requ ire d.

Note that the upper half of addressable data space is

always part of the X data space. Therefore, when a

DSP ope ration uses p rogram sp ace mapp ing to acces s

this m em ory reg ion , Y d ata sp ac e s ho uld ty pic al ly co n-

tain state (variable) data for DSP operations, whereas

X data space should typically contain coefficient

(constant) da ta.

Although each dat a sp ace address, 0x8000 and higher ,

maps directly into a corresponding program memory

address (see Figure 3-5), only the lower 16 bits of the

24-bit program word are used to contain the data. The

upper 8 bits shoul d be progra mmed to forc e an illeg al

instruction to maintain machine robustness. Refer

to the “dsPIC30F Programmer’s Reference Manual”

(DS70030) for details on instruction encoding.

Note that by incrementing the PC by 2 for each

program memory word, the Least Significant 15 bits of

data space addresses directly map to the Least Signif-

icant 15 bits in the corresponding program space

addresses. The remaining bits are provided by the

Program Space Visibility Page register,

PSVPAG<7:0>, as shown in Figure 3-5.

For instructions that use PSV which are executed

outside a REPEAT loop:

• The following instructions require one instruction

cycle in addition to the specified execution time:

-MAC class of instructions with data operand

prefetch

-MOV instr ucti ons

-MOV.D instructions

• All ot her instructions require two ins truction cycles

in addition to the specified execution time of the

instruction.

For instructions that use PSV which are executed

inside a REPEAT loop:

• The following instances require two instruction

cycl es in addition to th e specified execution time

of the instruction:

- Execution in the first iteration

- Execution in the last iteration

- Execution prior to exiting the loop due to an

interrupt

- Execution upon re-entering the loop after an

interr upt is servi ced

• Any other iteration of the REPEAT loop allows the

instruc tion, access ing dat a usin g PSV, to execute

in a single cycle.

PC Address

0x000000

0x000002

0x000004

0x000006

00000000

Program Memory

‘Phantom’ Byte

(read as ‘0’)

TBLRDH.W

TBLRDH.B (Wn<0> = 1)

TBLRDH.B (Wn<0> = 0)

Note: PSV acc ess is tempo raril y disabl ed durin g

table reads/wr ites.

dsPIC30F4011/4012

FIGURE 3-5: DATA SPACE WINDOW INTO PROGRAM SPACE OPERATION

3.2 Data Address Space

The core has two data spaces. The data spaces can be

considered either separate (for some DSP instruc-

tions), o r as o ne u nified linear a ddre ss ran ge (fo r MC U

instruc tions). The dat a spaces are acces s ed usi ng two

Address Generation Units (AGUs) and separate data

paths.

3.2.1 DATA SPACE MEMORY MAP

The data space memory is split into two blocks, X and

Y data space. A key ele me nt of th is archi tec tur e is th at

Y space is a subset of X space, and is fully contained

within X space. In order to provide an apparent linear

addressing space, X and Y spaces have contiguous

addresses.

When ex ecuting an y instr uctio n other th an one of the

MAC class of instructions, the X block consists of the

64-Kbyte data address space (including all Y

addresses). When executing one of the MAC class of

instructions, the X block consists of the 64-Kbyte data

address space excluding the Y address block (for data

reads only). In other words, all other instructions regard

the entire data memory as one composite address

space. The MAC class instructions extract the Y address

space from data space and address it using EAs

sourced from W10 and W11. The remaining X data

space is addressed using W8 and W9. Both address

spaces are concurrently accessed only with the MAC

class instruc tions.

A data space memory map is shown in Figure 3-6.

Figur e 3-7 s hows a graphi cal s ummar y of h ow X and Y

data spaces are accessed for MCU and DSP

instructions.

23 15 0

PSVPAG(1)

EA<15> =

EA<15> = 1

Data

Space

Data Space Program Space

15 23

0x0000

0x8000

0xFFFF

0x00

0x000100

0x007FFE

Data Read

Upper Half of Data

Space is Mapped

into Program Space

Note: PSVPAG is an 8-bit register containing bits <22:15> of the program space address

(i.e., it defines the page in program space to which the upper half of data space is being mapped).

0x001200

Address

Concatenation

BSET CORCON,#2 ; PSV bit set

MOV #0x00, W0 ; Set PSVPAG register

MOV W0, PSVPAG

MOV 0x9200, W0 ; Access program memory location

; using a data space access

dsPIC30F4011/4012

FIGURE 3-6: dsPIC30F4011/4012 DATA SPACE MEMORY MAP

0x0000

0x07FE

0x0BFE

0xFFFE

LSB

Address

16 bi ts

LSBMSB

MSB

Address

0x0001

0x07FF

0x0BFF

0xFFFF

0x8001 0x8000

Optionally

Mapped

into Program

Memory

0x0FFF 0x0FFE

0x10000x1001

0x0801 0x0800

0x0C01

0x0C00

Near Data

Space

2-Kbyte

SFR Space

2-Kbyte

SRAM Space

4096 Bytes

Unimplemented (X)

X Data

SFR Space

X Data RAM (X)

Y Data RAM (Y)

dsPIC30F4011/4012

FIGURE 3-7: DATA SPACE FOR MCU AND DSP (MAC CLASS) INSTRUCTIONS EXAMPLE

SFR SPACE

(Y SPACE)

X SPACE

SFR SPACE

UNUSED

X SPACE

Y SPACE

UNUSED

Non-MAC Class Ops (Read/Write) MAC Class Ops Read-Only

Indirect EA using any W Indirect EA using W8, W9 Indirect EA using W10, W11

MAC Class Ops (Write)

dsPIC30F4011/4012

3.2.2 DATA SPACES

The X data space is used by all instructions and sup-

ports all addressing modes. There are separate read

and write data buses. The X read data bus is the return

data path for all instructions that view data space as

combined X and Y address space. It is also the X

address space data path for the dual operand read

instructions (MAC class). The X write data bus is the

only write path to data space for all instructions.

The X dat a sp ace also su pports Modulo Address ing for

all instructions, subject to addressing mode restric-

tions. Bit-Reversed Addressing is only supported for

writes to X data space.

The Y data space is used in concert with the X data

space by the MAC class of instructions (CLR, ED,

EDAC, MAC, MOVSAC, MPY, MPY.N and MSC) to pro-

vide two concurrent data read paths. No writes occur

across the Y bus. This class of instructions dedicates

two W register pointers, W10 and W11, to always

address Y data space, independent of X data space,

whereas W8 and W9 always address X data space.

Note that during accumulator write-back, the data

address space is consi dere d a c om bin ati on of X and Y

data spaces, so the write occurs across the X bus.

Consequently, the write can be to any address in the

entire data space.

The Y data space can only be used for the data

prefetch operation associated with the MAC class of

instructions. It also supports Modulo Addressing for

automat ed c irc ul ar bu f fe r s. Of c ours e, all othe r ins tru c-

tions ca n access the Y dat a address sp ace thro ugh the

X data path, as part of the composite linear space.

The boundary between the X and Y data spaces is

defined as shown in Figure 3-6 and is not user-

pro gramma ble. Shou ld an EA p oint to data outs ide its

own assigned address space, or to a location outside

physical memory , an all-zero word/byte is returned. For

example, although Y address space is visible by all

non-MAC instructions using any addressing mode, an

attempt by a MAC instruction to fetch data from that

space, using W8 or W9 (X Space Pointers), returns

0x0000.

All Effective Ad dre sses (EA) are 16 bits wide a nd poi nt

to bytes within the data space. Therefore, the data

space address range is 64 Kbytes or 32K words.

3.2.3 DATA SPACE WIDTH

The core data width is 16-bits. All internal regis ters are

organ ized as 16-bit wide words. Data space mem ory is

organized in byte addressable, 16-bit wide blocks.

3.2.4 DATA ALIGNMENT

To help maintain backward compatibility with PIC®

devices and improve data space memory usage effi-

ciency, the dsPIC30F instruction set supports both

word and byte operation s. Data is al igned in dat a mem-

ory and registers as words, but all data space EAs

resolve to bytes. Data byte reads read the complete

word, whi ch contain s the byte, using the LSb of any EA

to determine which byte to select. The selected byte is

placed onto the LSB of the X data path (no byte

acces ses are possible fro m the Y data pa th as the MAC

class of instruction s can only f etch words). That is, data

memory and registers are organized as two parallel

byte-wide entitie s, with s hared (wo rd) ad dress dec ode,

but separate write lines. Data byte writes only write to

the corresponding side of the array or register which

matches the byte address.

As a consequence of this byte accessibility , all Ef fective

Address c alculati ons (includin g those gene rated by the

DSP operations, which are restricted to word-sized

data) a re internally scale d to step through word-aligned

memory. For example, the core would recognize that

Post-Modified Register Indirect Addressing mode,

[Ws++], will result in a value of Ws + 1 for byte

operations and Ws + 2 for word operations.

All word accesses must be al igned to an even a ddress.

Misaligned word data fetches are not supported, so

care must be taken when mixing byte and word opera-

tions, or translating from 8-bit MCU code. Should a

misaligned read or write be attempted, an address

error trap is generated. If the error occurred on a read,

the instruction underway is completed, whereas if it

occurred on a write, th e instructi on will be execu ted but

the write does not occur. In either case, a trap is then

executed, allowing the system and/or user to examine

the machine state prior to execution of the address

Fault.

FIGURE 3-8: DATA ALIGNMENT

TABLE 3-2: EFFECT OF INVALID

MEMORY ACCESSES

Attempted Operatio n Data Returned

EA = an unimplemented address 0 x0000

W8 or W9 used to access Y data

spa ce in a MAC instru ction 0x0000

W10 or W11 used to access X

data space in a MAC instruction 0x0000

15 8 7 0

0001

0003

0005

0000

0002

0004

Byte 1 Byte 0

Byte 3 Byte 2

Byte 5 Byte 4

LSBMSB

dsPIC30F4011/4012

All byte loads into any W register are loaded into the

LSB; the MSB is not modified.

A sign-extend (SE) instruction is provided to allow

users to translate 8-bit signed data to 16-bit signed

values. Alternatively, for 16-bit unsigned data, users

can clear the MSB of any W register by executing a

zero-extend (ZE) instruction on the appropriate

address.

Although m os t i ns truc tio ns are capable of op era t ing o n

word or byte data sizes, it should be noted that some

instructions, including the DSP instructions, operate

only on words .

3.2.5 NEAR DATA SPACE

An 8-Kbyte ‘near’ data space is reserved in X address

memory space between 0x0000 and 0x1FFF, which is

directly add res sab le via a 13-bit absolut e address field

within all memory direct instructions. The remaining X

address space and all of the Y address space is

address able indirec tly. Additional ly, the whole of X da ta

space is addressable using MOV instructions, which

support Memory Direct Addressing with a 16-bit

address field.

3.2.6 SOFTWARE STACK

The dsPIC DSC contains a software stack. W15 is used

as the Stack Pointer.

The Stack Pointer always points to the first available

free word and grows from lower addresses towards

higher ad dresses. It pre-dec rements for stack pop s and

post-increments for stack pushes, as shown in

Figure 3-9. Note that for a PC push during any CALL

instruc tio n, the M SB o f t he PC i s ze ro-ex te nde d b efo re

the push, ensuring that the MSB is always clear.

There is a Stack Pointer Limit register (SPLIM) associ-

ated with the Stack Pointer. SPLIM is uninitialized at

Reset. As is t he case f or t h e Stack Pointer, SPLIM <0>

is forced to ‘0’, because all stack operations must be

word-aligned. Whenever an Effective Address (EA) is

generated, using W15 as a source or destination

pointer, the address thus generated is compared with

the valu e i n SPL IM. If the cont ents of the Stack Po int er

(W15) and the SPLIM register are equal, and a push

operatio n is perform ed, a st ack error trap will no t occur.

The stack error trap will occur on a subsequent push

operation. Thus, for example, if it is desirable to cause

a stack error trap when the stack grows beyond

address 0x2000 in RAM, initialize the SPLIM with the

value, 0x1FFE.

Similarl y, a S tack Po inter un derflow ( sta ck erro r) trap i s

generated when the Stack Pointer address is found to

be less than 0x0800, thus preventing the stack from

interfering with the Special Function Register (SFR)

space.

A write to the SPLIM register should no t be immediately

follow ed by an ind irec t read ope rati on usi ng W15.

FIGURE 3-9: CALL STACK FRAME

Note: A PC push during exception processing

concat enates the SRL regis ter to the M SB

of the PC prior to the push.

PC<15:0>

000000000

015

W15 (before CALL)

W15 (after CALL)

Stack Grows Towards

Higher Address

PUSH: [W 1 5+ +]

POP: [--W15 ]

0x0000

PC<22:16>

dsPIC30F4011/4012

TABLE 3-3: CORE REGISTER MAP

SFR Name Address

(Home) Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

W0 0000 W0/WREG 0000 0000 0000 0000

W1 0002 W1 0000 0000 0000 0000

W2 0004 W2 0000 0000 0000 0000

W3 0006 W3 0000 0000 0000 0000

W4 0008 W4 0000 0000 0000 0000

W5 000A W5 0000 0000 0000 0000

W6 000C W6 0000 0000 0000 0000

W7 000E W7 0000 0000 0000 0000

W8 0010 W8 0000 0000 0000 0000

W9 0012 W9 0000 0000 0000 0000

W10 0014 W10 0000 0000 0000 0000

W11 0016 W11 0000 0000 0000 0000

W12 0018 W12 0000 0000 0000 0000

W13 001A W13 0000 0000 0000 0000

W14 001C W14 0000 0000 0000 0000

W15 001E W15 0000 1000 0000 0000

SPLIM 0020 SPLIM 0000 0000 0000 0000

ACCAL 0022 ACCAL 0000 0000 0000 0000

ACCAH 0024 ACCAH 0000 0000 0000 0000

ACCAU 0026 Sign Extension (ACCA<39>) ACCAU 0000 0000 0000 0000

ACCBL 0028 ACCBL 0000 0000 0000 0000

ACCBH 002A ACCBH 0000 0000 0000 0000

ACCBU 002C Sign Extension (ACCB<39>) ACCBU 0000 0000 0000 0000

PCL 002E PCL 0000 0000 0000 0000

PCH 0030 — — — — — — — — —PCH0000 0000 0000 0000

TBLPAG 0032 — — — — — — — —TBLPAG0000 0000 0000 0000

PSVPAG 0034 — — — — — — — —PSVPAG0000 0000 0000 0000

RCOUNT 0036 RCOUNT uuuu uuuu uuuu uuuu

DCOUNT 0038 DCOUNT uuuu uuuu uuuu uuuu

DOSTARTL 003A DOSTARTL 0 uuuu uuuu uuuu uuu0

DOSTARTH 003C — — — — — — — — —DOSTARTH0000 0000 0uuu uuuu

DOENDL 003E DOENDL 0 uuuu uuuu uuuu uuu0

DOENDH 0040 — — — — — — — — — DOENDH 0000 0000 0uuu uuuu

SR 0042 OA OB SA SB OAB SAB DA DC IPL2 IPL1 IPL0 RA N OV Z C 0000 0000 0000 0000

CORCON 0044 — — — US EDT DL2 DL1 DL0 SATA SATB SATDW ACCSAT IPL3 PSV RND IF 0000 0000 0010 0000

MODCON 0046 XMODEN YMODEN — — BWM<3:0> YWM<3:0> XWM<3:0> 0000 0000 0000 0000

XMODSRT 0048 XS<15:1> 0 uuuu uuuu uuuu uuu0

Legend: u = uninitialized bit

Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for descriptions of regist er bit f ields.

dsPIC30F4011/4012

XMODEND 004A XE<15:1> 1 uuuu uuuu uuuu uuu1

YMODSRT 004C YS<15:1> 0 uuuu uuuu uuuu uuu0

YMODEND 004E YE<15:1> 1 uuuu uuuu uuuu uuu1

XBREV 0050 BREN XB<14:0> uuuu uuuu uuuu uuuu

DISICNT 0052 —— DISICNT<13:0> 0000 0000 0000 0000

TABLE 3-3: CORE REGISTER MAP (CONTINUED)

SFR Name Address

(Home) Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

Legend: u = uninitialized bit

Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for descriptions of regist er bit f ields.

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

4.0 ADDRESS GENERATOR UNITS

The dsPIC DSC core contains two independent

address generator un its: the X AGU and Y AGU. The Y

AGU supports word-sized data reads for the DSP MAC

class of instructions only. The dsPIC Digital Signal

Controller AGUs support three types of data

addressing:

• Linear Addressing

• Modulo (Circular) Addressing

• Bit-Revers ed Addre ss in g

Linear and Modulo Data Addressing modes can be

applied to data space or program space. Bit-Reversed

Addressi ng is on ly appli cable to data s pace a ddresses .

4.1 Instruction Addressing Modes

The addressing modes in Table 4-1 form the basis of

the addressing modes optimized to support the specific

features of individual instructions. The addressing

modes provided in the MAC class of instructions are

somewhat different from those in the other instruction

types.

4.1.1 FILE REGISTER INSTRUCTIONS

Most fil e re gis ter i ns truc tio ns use a 13-bit ad dres s f iel d

(f) to directly address data present in the first

8192 bytes of dat a memory (near dat a space). Most file

whic h is den oted as WREG in these i nstruc tions. The

destination is typically either the same file register, or

WREG (with the exception of the MUL instruction),

which w rites the re sult t o a re gister or regi ster p air. The

MOV instruction allows additional flexibility and can

access the entire data space during file register

operation.

4.1.2 MCU INSTRUCTIONS

The three-operand MCU instructions are of the form:

Operand 3 = Operand 1 <function> Operand 2

where O pe rand 1 is alw a ys a work in g reg ister (i.e., the

address ing mode can only be Reg ister Direct), whi ch is

referred to as Wb. Operand 2 can be a W register,

fetched from data memory or a 5-bit literal. The result

location can either be a W register or an address

location. The following addressing modes are

supported by MCU instructions:

• Register Direct

• Register Indirect

• Register Indirect Post-Modified

• Register Indirect Pre-Modified

• 5-bit or 10-bit Literal

TABLE 4-1: FUNDAMENT A L ADDRESSING MODES SUPPORTED

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the “dsPIC30F Family Reference

Manual” (DS70046). For more information on the device

instruction set and programming, refer to the “dsPIC30F/

33F Programmer’s Reference Manual” (DS70157).

Note: Not all instructions sup port all the address-

ing modes given above. Individual

instructions may support different subsets

of these addressing modes.

Addressing Mode Description

File Register Direct The address of the file register is specified explicitly.

decremented) by a constant value.

to form the EA.

dsPIC30F4011/4012

4.1.3 MOVE AND ACCUMULATOR

INSTRUCTIONS

Move instructions and the DSP accumulator class of

instructions provide a greater degree of addressing

flexibility than other instructions. In addition to the

addressing modes supported by most MCU instruc-

tions, move and accumulator instructions also support

mode, also referred to as Register Indexed mode.

In summary, the following addressing modes are

supported by move and accumulator instructions:

• Register Direc t

• Register Indi rec t

• Register Indi rec t Post-Mod ifi ed

• Register Indi rec t Pre- Mo dif ied

• Register Indirect with Register Offset (Indexed)

• Register Indirect with Literal Offset

• 8-bit Literal

• 16-bit Literal

4.1.4 MAC INSTRUCTIONS

The dual source operand DSP instructions (CLR, ED,

EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also

referred to a s MAC instruction s, utilize a si mplified se t of

addressing modes to allow the user to effectively

manipulate the Data Pointers through register indirect

tables.

The two source operand prefetch registers must be

members of the set {W8, W9, W10, W11}. For data

reads, W8 and W9 will always be directed to the X

RAGU, and W10 and W11 will always be directed to the

Y AGU. The Effective Addresses (EA) generated

(befor e and after mo dification) mu st, therefore, be vali d

addresses within X data space for W8 and W9, and Y

data space for W10 and W11.

In summary, the following addressing modes are

supported by the MAC class of instructions:

• Register Indirect

• Register Indirect Post-Modified by 2

• Register Indirect Post-Modified by 4

• Register Indirect Post-Modified by 6

• Register Indirect with Register Offset (Indexed)

4.1.5 OTHER INSTRU CTIONS

Besides the various addressing mo des outlin ed above,

some i nstructio ns use li teral con sta nts of various sizes.

For example, BRA (branch) instructions use 16-bit

signed l iterals to spe cify the branch de stination dire ctly ,

whereas the DISI instruction uses a 14-bit unsigned

literal fiel d. In som e in stru cti ons , suc h as ADD Acc, the

source of an operand or result is implied by the opc ode

it self. Cert ain opera tions, such as NOP, do not have any

operands.

4.2 Modulo Addressing

Modulo Addressing is a method of providing an auto-

mated means to support circular data buffers using

hardwa re. The obj ective is to remo ve the ne ed for so ft-

ware to perform data address boundary checks when

executing tightly looped code, as is typical in many

DSP algorithms.

Modulo Addressing can operate in either data or pro-

gram space (since the Data Pointer mechanism is

essentially the same for both). One circular buffer can be

supported in each of the X (which also provides the

pointers into program space) and Y data spaces. Modulo

Addressing can o perate on any W regis ter pointer . Ho w-

ever, it is not advisable to use W14 or W15 for Modulo

Addressing, since these two registers are used as the

St ack Frame Pointer and Stack Pointer, respectively.

In general, any particular circular buffer can only be

configured to operate in one direction, as there are

certain restrictio ns on the buffer start address (for incre-

menting buffers) or end address (for decrementing

buffers) based upon the direction of the buffer.

The only exception to the usage restrictions is for buff-

ers which have a power-of-2 length. As these buffers

satisfy the start and end address criteria, they may

operate in a Bidirecti onal mode (i.e., addres s boundar y

checks will be performed on both the lower and upper

address boundaries).

Note: For the MOV instructions, the addressing

mode specified in the instruction can differ

for the source and destination EA.

However, the 4-bit Wb (register offset) field

is shared between both source and

destination (but typically only used by one).

Note: Not all instructions su pport all the address-

ing modes given above. Individual

instructions may support different subsets

of these addressing modes.

Note: Register Indirect with Register Offset

Addressing is only available for W9 (in X

data space) and W11 (in Y data space).

dsPIC30F4011/4012

4.2.1 START AND END ADDRESS

The M odulo Addr essing sc heme requ ires that a s tart and

end ad dress be specifi ed and loaded in to the 16- bit Mod-

ulo Buffer Address registers: XMODSRT, XMODEND,

YMODSR T a nd YM ODEND ( see Table 3-3).

The leng th of a ci rcular buffer is not di rectly s pecified. It

is determined by the difference between the

corresp onding st art and end ad dress es. Th e ma ximu m

possible length of the circular buffer is 32K words

(64 Kbytes).

4.2.2 W ADDRESS REGISTER

SELECTION

The Mod ulo an d Bi t-Rev ers ed Add ress in g Co ntro l re g-

ister, MODCON<15:0>, contains enable flags as well

as a W re gister field t o specify the W Addre ss registers .

The XWM and YWM fields se lect whic h registe rs oper-

ate with Modulo Addressing. If XWM = 15, X RAGU and

X WAGU Modulo Addressing are disabled. Similarly, if

YWM = 15, Y AGU Modulo Addressing is disabled.

The X Address Space Pointer W register (XWM), to

which Modulo Addressing is to be applied, is stored in

MODCON <3:0> (see Table 3-3). Modul o Addre ssing is

enabled for X data sp ace when XWM is set to any v alue

other than 15 and the XMODEN bit is set at

MODCON<15>.

The Y Address Space Pointer W register (YWM), to

which Modulo Addressing is to be applied, is stored in

MODCON<7:4>. Modulo Addressing is enabled for Y

data space when YWM is set to any value other than 15

and the YMODEN bit is set at MODCON<14>.

FIGURE 4-1: MODULO ADDRESSING OPERATION EXAMPLE

Note: Y space Modulo Addressing EA calcula-

tions assume word-sized data (LSb of

ever y EA is always clear ).

0x1100

0x1163

St art Addr = 0x1100

End Addr = 0x1163

Length = 0x0032 words

Byte

Address MOV #0x1100,W0

MOV W0, XMODSRT ;set modulo start address

MOV #0x1163,W0

MOV W0,MODEND ;set modulo end address

MOV #0x8001,W0

MOV W0,MODCON ;enable W1, X AGU for modulo

MOV #0x0000,W0 ;W0 holds buffer fill value

MOV #0x1110,W1 ;point W1 to buffer

DO AGAIN,#0x31 ;fill the 50 buffer locations

MOV W0, [W1++] ;fill the next location

AGAIN: INC W0,W0 ;increment the fill value

dsPIC30F4011/4012

4.2.3 MODULO ADDRESSING

APPLICABILITY

Modulo Addressing can be applied to the Effective

Address (EA) calculation associated with any W register .

It is important to realize that the address boundaries

check for addresses less than or greater than the upper

(for incrementing buffers) and lower (for decrementing

buffers) boundary addresses (not just equal to). Address

changes may, therefore, jump beyond boundaries and

still be adjusted correctly.

4.3 Bit-Reversed Addressing

Bit-Reversed Addressing is intended to simplify data

reordering for radix-2 FFT al gorithms. It is supported by

the X AGU for data wr ites only.

The modifier , which may be a constant value or register

contents, is regarded as having its bit order reversed.

The addres s sourc e and dest inat ion are ke pt in norma l

order. Thus, the only operand requiring reversal is the

modifier.

4.3. 1 BIT-REVERSED AD DRESSIN G

IMPLEMENTATION

Bit-Reversed Addressing is enabled when:

1. BWM (W register sel ection) in the MODCON reg-

ister is any value other than 15 (the sta ck can not

be accessed using Bit-Reversed Addressing)

and

2. The BREN bit is set in the XBREV register and

3. The addressing mode used is Register Indirect

with Pre-Increment or Post-Increment.

If the length of a bit-reversed buffer is M = 2N bytes,

then the last ’N’ bits of the data buffer start address

must be zero s.

XB<14:0> is the Bit-Reversed Addressing modifier, or

‘pivot p oint’, which is typica lly a cons tant. In th e case of

an FFT computation, its value is equal to half of the FFT

dat a buffer size.

When enabled, Bit-Reversed Addressing is only

executed for Register Indirect with Pre-Increment or

Post-Incre ment Addressing m od e a nd wo rd-s iz ed data

writes. It will not function for any other addressing

mode o r for by te-si zed d ata, and normal addre sses wil l

be generated instead. When Bit-Reversed Addressing

is active, the W Address Pointer will always be added

to the address modifier (XB) and the offset associated

with the Register Indirect Addressing mode will be

ignored. In addition, as word-sized data is a

requirement, the LSb of the EA is ignored (and always

clear).

If Bit-Reversed Addressing has already been enabled

by setting the BREN (XBREV<15>) bit, then a write to

the XBREV register should not be immediately followed

by an indirect read operation using the W register that

has been designated as the Bit-Reversed Pointer.

FIGURE 4-2: BIT-REVERSED ADDRESS EXAMPLE

Note: The m odulo correcte d Effective Address is

written back to the re giste r only when Pre-

Modify or Post-Modify Addressing mode is

used to compute the Effective Address.

When an address offset (e.g., [W7+W2] ) is

used, Modulo Addressing correction is

perfor me d, but the conten ts of t he register

remain unc han ged.

Note: All bit-reversed EA calculations assume

word-sized data (LSb of every EA is

always clear). The XB value is scaled

accordingly to generate compatible (byte)

addresses.

Note: Modulo Addressing and Bit-Reversed

Addressing should not be enabled

together. In the event that the user

attempt s to do this , Bit-Reversed Address -

ing wil l assume priori ty when activ e for the

X WAGU, and X WAGU Modulo Address-

ing will be disabled. However, Modulo

Addressing will continue to function in the

X RAGU.

b3 b2 b1 0

b2 b3 b4 0

Bit Locations Swapped Left-to-Right

Around Center of Binary Value

Bit-Reversed Address

XB = 0x0008 for a 16-Word Bit-Reversed Buffer

b7 b6 b5 b1

b7 b6 b5 b4

b11 b10 b9 b8

b15 b14 b13 b12

Sequenti al Addre ss

Pivot Point

dsPIC30F4011/4012

TABLE 4-2: BIT-REVERSED ADDRESS SEQUENCE (16-ENTRY)

TABLE 4-3: BIT-REVERSED ADDRESS MODIFIER VALUES FOR XBREV REGISTER

Normal Address Bit-Reversed Address

A3 A2 A1 A0 Decimal A3 A2 A1 A0 Decimal

0000 00000 0

0001 11000 8

0010 20100 4

0011 31100 12

0100 40010 2

0101 51010 10

0110 60110 6

0111 71110 14

1000 80001 1

1001 91001 9

1010 10 0101 5

1011 11 1101 13

1100 12 0011 3

1101 13 1011 11

1110 14 0111 7

1111 15 1111 15

Buffer Size (Words) XB<14:0> Bit-Reversed Address Modifier Value*

32768 0x4000

16384 0x2000

8192 0x1000

4096 0x0800

2048 0x0400

1024 0x0200

512 0x0100

256 0x0080

128 0x0040

64 0x0020

32 0x0010

16 0x0008

80x0004

40x0002

20x0001

*Modifier values for buffer sizes greater than 1024 words will exceed the available data memory on the

dsPIC30F4011/4012 devices.

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

5.0 INTERRUPTS

The dsPIC30F4011/4012 has 30 interrupt sources and

4 processor exceptions (traps), which must be

arbitrated based on a priority scheme.

The CPU is responsible for reading the Interrupt

Vector Table (IVT) and transferring the address con-

tained in the interrupt vector to the program counter.

The interrupt vector is transferred from the program

data bus into the program counter via a 24-bit wide

multiplexer on the input of the program counter.

The Interrupt Vector Table (IVT) and Alternate

Interrupt Vector Table (AIVT) are placed near the

beginning of program memory (0x000004). The IVT

and AIVT are shown in Figure 5-1.

The interrupt controller is responsible for pre-

processing the interrupts and processor exceptions,

prior to their being presented to the processor core.

The peripheral interrupts and traps are enabled,

prioritized and controlled using centralized Special

Function Registers:

• IFS0<15:0>, IFS1<15:0>, IFS2<15:0>

All interrupt request flags are maintained in these

three registers. The flags are set by their respec-

tive peripherals or external signals, and they are

cleared via software.

• IEC0<15:0>, IEC1<15:0>, IEC2<15:0>

All interrupt enable control bits are maintained in

these three registers. These control bits are used

to individually enable interrupts from the

peripherals or external signals.

• IPC0<15:0>... IPC11<7:0>

The user-as s ign abl e prio rity lev el assoc iate d with

eac h of these i nterrupts is held centrally in these

twelve registe rs.

• IPL<3:0>

The current CPU priority level is explicitly stored

in the IPL bi ts. IPL<3> i s p res en t in the C ORCO N

STATUS register (SR) in the processor core.

• INTCON1< 15: 0>, IN TCO N2<15:0>

Global interru pt co ntrol fu nctio ns are deriv ed from

these two registers. INTCON1 contains the con-

trol and status flags for the processor exceptions.

The INTCON2 r egister controls the external

interrupt request signal behavior and the use of

the AIVT.

All interrupt sources can be user-assigned to one of

seven priority levels, 1 through 7, via the IPCx

registers. Each interrupt source is associated with an

interrupt vector, as shown in Table 5-1. Levels 7 and 1

represent the highest and lowest maskable priorities,

respectively.

If the NSTDIS bit (INTCON1<15>) is set, nesting of

interrupts is prev en ted . Th us, i f an interrupt is c urrentl y

being serviced, processing of a new interrupt is pre-

vented, even if the new interrupt is of higher priority

than the one currently being serviced.

Certain interrupts have specialized control bits for fea-

tures like edge or level triggered interrupts, interrupt-

on-change, etc. Control of these features remains

within the peripheral module which generates the

interrupt.

The DISI instruction can be used to disable the

processing of interrupts of priorities 6 and lower for a

certain number of instructions, during which the DISI bit

(INTCON2<14>) remains set.

When an interrupt is serviced, the PC is loaded with the

address stored in the vector locatio n in program memory

that corresponds to the interrupt. There are 63 different

vectors within the IVT (refer to Figure 5-2). These vec-

tors are contained in locations 0x000004 through

0x0000FE of program memory (refer to Figure 5-2).

These locations contain 24-bit addresses, and in order

to preserve robustness, an address error trap will take

place should the PC attempt to fetch any of these w ords

during normal execution. This prevents execution of

random data as a result of accidentally decrementing a

PC into vector space, accidentally mapping a data space

address into vector space or the PC rolling over to

0x000000 after reaching the end of implemented

program memory space. Execution of a GOTO instruction

to this vector space will also generate an address error

trap.

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the “dsPIC30F Family Reference

Manual” (DS70046). For more information on the device

instruction set and programming, refer to the “dsPIC30F/

33F Programmer’s Reference Manual” (DS70157).

Note: Interru pt flag bit s get set when an interru pt

conditi on occ urs, regar dless o f the s tate of

its corresponding enable bit. User

software should ensure the appropriate

interrupt flag bits are clear prior to

enabling an interrupt.

Note: Assigning a priority level of 0 to an

interrupt source is equivalent to disabling

that interrupt.

Note: The IPL bits become read-only whenever

the NSTDIS bit has been set to ‘1’.

dsPIC30F4011/4012

5.1Interrupt Priority

The user-a ssig nable In terrupt Prio rity (IP<2:0>) b its for

each ind ividual interrupt source are located in the Least

Significant 3 bits of each nibble within the IPCx regis-

ter(s). Bit 3 of each nibble is not used and is read as a

‘0’. These bits define the priority level assigned to a

particular interrupt by the user.

Since more than one interrupt request source may be

assigned to a specific user-specified priority level, a

means is provided to assign prio rity within a given level.

This method is called “Natural Order Priority”.

Natur al order pr iority is dete rmined by the posit ion of

an interrupt in the vector table, and only affects

interrupt operation when multiple interrupts with the

same user-assigned priority become pending at the

same time.

Table 5-1 lists the interrupt numbers and interrupt

sources for the dsPIC DSCs and their associated

vector numbers.

The ability for the user to assign every interrupt to one

of sev en priority lev els i mp lie s tha t the user c an as sign

a very high overall priority level to an interrupt with a

low natural order priority. For exa mple, the PLVD (Low-

Voltage Detect) can be given a priority of 7. The INT0

(External Interrupt 0) may be assigned to priority

level 1, thus giving it a very low effective priority.

TABLE 5-1: INTERRUPT VECTOR TABLE

Note: The user-selectable priority levels start at

0 as the lowest priority, and level 7 as the

highest priority.

Note 1: The natural order priority scheme has 0

as the highest priority and 53 as the

lowest priority.

2: The natural order priority number is the

same as the INT number.

INT

Number Vector

Number Interrupt Source

Highest Natural Order Priority

0 8 INT0 – Ex ternal Inte rrupt 0

1 9 IC1 – Inpu t Ca pt ur e 1

2 10 OC1 – Output Compare 1

3 11 T1 – Timer 1

4 12 IC2 – Input Ca pt ur e 2

5 13 OC2 – Output Compare 2

6 14 T2 – Timer 2

7 15 T3 – Timer 3

8 16 SPI1

9 17 U1RX – UART1 Re ceiver

10 18 U1TX – UART1 Transm i tter

11 19 ADC – ADC Convert Done

12 20 NVM – NVM Write Complete

13 21 SI2C – I2C™ Slave In te rrupt

14 22 MI2C – I2C Master Interrupt

15 23 Input Change I nt er ru pt

16 24 INT1 – External Interrupt 1

17 25 IC7 – Input Capt ur e 7

18 26 IC8 – Input Capt ur e 8

19 27 OC3 – Output Compare 3

20 28 OC4 – Output Compare 4

21 29 T4 – T imer4

22 30 T5 – T imer5

23 31 INT2 – External Interrupt 2

24 32 U2RX – UART2 Receiver

25 33 U2TX – UART2 Transmitter

26 34 Reserved

27 35 C1 – Combined IRQ for CAN1

28 36 Reserved

29 37 Reserved

30 38 Reserved

31 39 Reserved

32 40 Reserved

33 41 Reserved

34 42 Reserved

35 43 Reserved

36 44 Reserved

37 45 Reserved

38 46 Reserved

39 47 PWM – PWM Period Match

40 48 QEI – QEI Interrupt

41 49 Reserved

42 50 Reserved

43 51 FLTA – PWM Fault A

44 52 Reserved

45-53 53-61 Reserved

Lowest Natural Order Priority

dsPIC30F4011/4012

5.2 Reset Sequence

A Reset is not a true exception, because the interrupt

controll er is not involv ed in the Reset proce ss. The pro-

cessor initializes its registers in response to a Reset,

which forces the PC to zero. The processor then begins

program execution at location 0x000000. A GOTO

instruction is stored in the first program memory loca-

tion, im media tel y follo wed by th e addres s t arget for th e

GOTO instruction. The processor executes the GOTO to

the speci f ie d add res s and then begi ns op erat ion at the

specified target (start) address.

5.2.1 RES ET SOURCES

There are 5 sources of error which will cause a device

reset.

• Watchdog Time-out:

The watchdog has timed out, indicating that the

process or is no longer ex ecu tin g the corre ct flo w

of code.

• Uninitialized W Register Trap:

An attempt to use an uninitialized W register as

an Address Pointer will cause a Reset.

• Illegal Instruction Trap:

Attempted execution of any unused opcodes will

result in an illegal instruction trap. Note that a

fetch of an illegal instruction does not result in an

illegal instruction trap if that instruction is flushed

prior to execution due to a flow change.

• Brown-out Reset (BOR):

A momentary dip in the power supply to the

device has been detected which may result in

malfunction.

• Trap Lockout:

Occurrence of multiple trap condit ions

simultaneously will cause a Reset.

5.3 Traps

Traps can be considered as non-maskable interrupts,

indica ting a software o r hardware error w hich adhere to

a predefined priority, as shown in Figure 5-1. They are

intended to provide the user a means to correct errone-

ous operation during deb ug and when opera tin g withi n

the application.

Note that many of these trap conditions can only be

detected when th ey occur. Conseque ntly, the ques tion-

able instruction is allowed to complete prior to trap

exception processing. If the user chooses to recover

from the error, the result of the erroneous action that

caused the trap may have to be corrected.

There are 8 fixed priority levels for traps, Level 8

through Le vel 15, which m ea ns that t he IPL 3 is al way s

set during processing of a trap.

If the user is not currently executing a trap and he sets

the IP L<3:0> bit s to a value of ‘0111’ (Level 7), t hen al l

interr upts are disabled, b ut traps c an still b e processed.

5.3.1 TRAP SOURCES

The following traps are provided with increasing

priority. However, since all traps can be nested, priority

has lit tle ef f e ct .

5.3.1.1 Math Error Trap

The math error trap executes under the following four

circumstances:

1. Should an attempt be made to divide by zero,

the divide operation will be aborted on a cycle

boundary and the trap taken.

2. If enabled, a math error trap will be taken when

an arithmetic operation on either accumulator A

or B causes an overflow from bit 31 and the

accumulator guard bits are not utilized.

3. If enabled, a math error trap will be taken when

an arithmetic operation on either accumulator A

or B causes a catastrophic overflow from bit 39

and all saturation is disabled.

4. If the shift amount specified in a shift instruction

is greater than the maximum allowed shift

amount, a trap will occur.

Note: If the user does not intend to take correc-

tive action in the event of a trap error

condition, these vectors must be loaded

with the address of a default handler that

simply contains the RESET instruction. If,

on the other hand, one of the vectors

containing an invalid address is called, an

address error trap is generated.

dsPIC30F4011/4012

5.3.1.2 Address Error Trap

This trap is initiated when any of the following

circumstances occurs:

1. A misaligned data word access is attempted.

2. A data fetch from an unimplemented data

memory location is attempted.

3. A data access of an unimplemented program

memory location is attempted.

4. An instruction fetch from vector space is

attempted.

5. Execution o f a “BRA #literal” instruction, or a

“GOTO #literal” ins truc ti on, w he re literal

is an u nimplem ented pr ogram me mory addr ess.

6. Executing instructions after modifying the PC to

point to unimplemented program memory

addresses. The PC may be modified by loading

a value into the stack and executing a RETURN

instruction.

5.3.1.3 Stack Error Trap

This trap is initiated under the following conditions:

1. The Stack Pointer is loaded with a value which

is greater than the (user-programmable) limit

value written into the SPLIM register (stack

overflow).

2. The Stack Pointer is loaded with a value which

is less than 0x0800 (simple stack underflow).

5.3.1.4 Oscillator Fail Trap

This trap is initiated if the external oscillator fails and

operation becomes reliant on an internal RC backup.

5.3.2 HARD AND SOFT TRAPS

It is possible that multiple traps can become active

within the same cycle (e.g., a misaligned word stack

write to an overflowed address). In such a case, the

fixed priority shown in Figure 5-2 is implemented,

whic h may requir e the user t o check if oth er traps are

pending in order to completely correct the Fault.

‘Soft’ traps incl ude exceptions of priority lev el 8 through

level 11, inclusive. The arithmetic error trap (level 11)

falls into this category of traps.

‘Hard’ traps include exceptions of priority level 12

through level 15, inclusive. The address error (level

12), stack error (level 13) and oscillator error (level 14)

traps fall into this category.

Each hard trap that occurs must be acknowledged

before code execution of any type may continue. If a

lower priority hard trap occurs while a higher priority

trap is pending, acknowledged or is being processed, a

hard trap con fli ct w ill occu r.

The devic e is automatic ally Reset in a hard trap conflict

condition. The TRAPR status bit (RCON<15>) is set

when the Reset occurs, so that the condition may be

detected in software.

FIGURE 5-1: TRAP VECTORS

Note: In the MAC class of instructions, wherein

the data space is split into X and Y data

space, unimplemented X space includes

all of Y space and u nimplemented Y sp ace

includ es all of X sp ac e.

Address Error Trap Vector

Oscillator Fail Trap Vector

Stack Error Trap Vector

Reserv ed Vector

Math Error Trap Vector

Reserved

Oscillator Fail Trap Vector

Address Error Trap Vector

Reserv ed Vector

Interrupt 0 Vector

Interrupt 1 Vector

Interrupt 52 Vector

Interrupt 53 Vector

Math Error Trap Vector

Decreasing

Priority

0x000000

0x000014

Reserved

Stack Error Trap Vector

Reserv ed Vector

Interrupt 1 V e ctor

Interrupt 52 Vector

Interrupt 53 Vector

IVT

AIVT

0x000080

0x00007E

0x0000FE

Reserved

0x000094

Res e t – GOTO Instruction

Reset – GOTO Address 0x000002

Reserved 0x000082

0x000084

0x000004

Reserv ed Vector

—

Interrupt 0 Vector

—

dsPIC30F4011/4012

5.4 Interrupt Sequence

All inte rrupt event flags are sampled in the be ginning of

each instruction cycle by the IFSx registers. A pending

interr upt reque st (IRQ) i s indic ated by the flag bit being

equal t o a ‘1’ in an IFSx register . The IRQ will cause an

interrupt to occur if the corresponding bit in the interrupt

enable (IECx) register is set. For the remainder of the

instruction cycle, the priorities of all pending interrupt

requests are evaluated.

If there is a pending IRQ with a priority level greater

than the current processor priority level in the IPL bits,

the processor will be interrupted.

The pr ocessor then st acks the curren t program counter

and the low byte of the processor STATUS register

(SRL), as shown in Figure 5-2. The low byte of the

ST ATUS register contains the processor priority level at

the time prior to the beginning of the interrupt cycle.

The pr ocessor the n loads t he priority level fo r this int er-

rupt into the STATUS register. This action will disable

all lower priority interrupts until the completion of the

Interr u pt Service R outine.

FIGURE 5-2: INTERRUP T STACK

FRAME

The RETFIE (return from interrupt) instruction will

unstack the program counter and STATUS registers to

return the processor to its state prior to the interrupt

sequence.

5.5 Alternate Interrupt Vector Table

In program memory, the Interrupt Vector Table (IVT) is

follow ed by the Altern ate Interr upt Vector Tab le (AIVT),

as shown in Figure 5-1. Access to the Alternate Inter-

rupt Vector Table is provided by the ALTIVT bit in the

INTCON2 register. If the ALTIVT bit is set, all interrupt

and exception processes will use the alternate vectors

inst ead of the defa ult vector s. The altern ate vectors a re

organized in the same manner as the default vectors.

The AIVT sup port s emul ation an d debug ging ef for t s by

providing a means to switch between an application

and a support environment, without requiring the inter-

rupt vectors to be reprogrammed. This feature also

enables switching between applications for evaluation

of different software algorithms at run time.

If the AIVT is not required, the program memory

allocated to the AIVT may be used for other purposes.

AIVT is not a protected section and may be freely

programmed by the user.

5.6 Fast Context Saving

A context saving option is available using shadow reg-

isters. Shadow registers are provided for the DC, N,

OV, Z an d C bits in SR, and the re gisters W 0 through

W3. The shadows are only one-level deep. The

shadow registers are acc essible usin g the PUSH.S and

POP.S instructi ons only.

When the processor vectors to an interrupt, the

PUSH.S instruction can be used to store the current

value of the aforementioned registers into their

respective shadow registers.

If an ISR of a certain priority uses the PUSH.S and

POP.S instructions for fast context saving, then a

higher priority IS R shou ld no t inc lude the s ame ins truc-

tions. Users must save the key registers in software

during a lo wer priorit y interru pt if the hi gher pri ority ISR

uses fast context saving.

5.7 External Interrupt Requests

The interrupt controller supports three external inter-

rupt request signals, INT0-INT2. These inputs are edge

sensitive; they require a low-to-high, or a high-to-low

transition, to generate an interrupt request. The

INTCON2 re gister has thre e bits, INT0EP-INT2EP, th at

select the polarity of the edge detection circuitry.

5.8 Wake- up from Sleep and Idle

The interrupt controller may be used to wake-up the

processor from either Sleep or Idle modes if Sleep or

Idle modes are active when the interrupt is generated.

If an enabled interrupt request of sufficient priority is

received by the interrupt controller, then the standard

interrupt request is presented to the processor. At the

same time, the processor will wake-up from Sleep or

Idle and begin execution of the Interrupt Service

Routine (ISR) needed to process the interrupt request.

Note 1: The user can always lower the priority level

by writing a new value into SR. The Interrupt

Service Routine must clear the interrupt flag

bits in the IFSx reg ister before low ering the

processor interrupt priority in order to avoid

recursive interrup ts.

2: The IPL3 bit ( C O RCON<3>) is always clear

when interrupts are being processed. It is

set only dur i ng executio n of traps.

015

W15 (before CALL)

W15 (after CALL)

Stack Grows Towards

Higher Address

PUSH: [W15++]

POP : [--W15]

0x0000

PC<15:0>

SRL IPL3 PC<22:16>

dsPIC30F4011/4012

TABLE 5-2: INTERRUPT CONTROLLER REGISTER MAP

SFR

Name ADR Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

INTCON1 0080 NSTDIS ———— OVATE OVBTE COVTE — — — MATHERR ADDRERR STKERR OSCFAIL —0000 0000 0000 0000

INTCON2 0082 ALTIVT DISI — — — — — — — — — — — INT2EP INT1EP INT0EP 0000 0000 0000 0000

IFS0 0084 CNIF MI2CIF SI2CIF NVMIF ADIF U1TXIF U1RXIF SPI1IF T3IF T2IF OC2IF IC2IF T1IF OC1IF IC1IF INT0IF 0000 0000 0000 0000

IFS1 0086 ————C1IF— U2TXIF U2RXIF INT2IF T5IF T4IF OC4IF OC3IF IC8IF IC7IF INT1IF 0000 0000 0000 0000

IFS2 0088 ————FLTAIF—— QEIIF PWMIF — — — — — — — 0000 0000 0000 0000

IEC0 008C CNIE MI2CIE SI2CIE NVMIE ADIE U1TXIE U1RXIE SPI1IE T3IE T2IE OC2IE IC2IE T1IE OC1IE IC1IE INT0IE 0000 0000 0000 0000

IEC1 008E ————C1IE— U2TXIE U2RXIE INT2IE T5IE T4IE OC4IE OC3IE IC8IE IC7IE INT1IE 0000 0000 0000 0000

IEC2 0090 ————FLTAIE—— QEIIE PWMIE — — — — — — — 0000 0000 0000 0000

IPC0 0094 — T1IP<2:0> —OC1IP<2:0>— IC1IP<2:0> — INT0IP<2:0> 0100 0100 0100 0100

IPC1 0096 — T31P<2:0> — T2IP<2:0> — OC2IP<2:0> — IC2IP<2:0> 0100 0100 0100 0100

IPC2 0098 —ADIP<2:0>— U1TXIP<2:0> — U1RXIP<2:0> — SPI1IP<2:0> 0100 0100 0100 0100

IPC3 009A — CNIP<2:0> —MI2CIP<2:0>— SI2CIP<2:0> — NVMIP<2:0> 0100 0100 0100 0100

IPC4 009C —OC3IP<2:0>—IC8IP<2:0>— IC7IP<2:0> — INT1IP<2:0> 0100 0100 0100 0100

IPC5 009E — INT2IP<2:0> — T5IP<2:0> — T4IP<2:0> — OC4IP<2:0> 0100 0100 0100 0100

IPC6 00A0 — C1IP<2:0> — — — — — U2TXIP<2:0> — U2RXIP<2:0> 0100 0000 0100 0100

IPC7 00A2 — — — — — — — — — — — — — — — — 0000 0000 0000 0000

IPC8 00A4 — — — — — — — — — — — — — — — — 0000 0000 0000 0000

IPC9 00A6 —PWMIP<2:0>— — — — — — — — — — — — 0100 0000 0100 0100

IPC10 00A8 — FLTAIP<2:0> — — — — — — — — — QEIIP<2:0> 0100 0000 0000 0100

IPC11 00AA — — — — — — — — — — — — — — — — 0000 0000 0000 0000

Legend: u = uninitialized bit

Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for de scrip tions of register bit fields.

dsPIC30F4011/4012

6.0 FLASH PROGRAM MEMORY

The dsPIC30F family of devices contains internal

program Flash memory for executing user code. There

are two methods by which the user can program this

memory:

1. In-Circuit Serial Programming™ (ICSP™)

2. Run-Time Self-Programming (RTSP)

6.1 In-Circuit Serial Programming

(ICSP)

dsPIC30F devices can be serially programmed while i n

the end ap plica tion ci rcuit. Th is is s imply do ne wit h two

lines for Programming Clock and Programming Data

(which are named PGC and PGD, respectively), and

three other lines for Power (VDD), Ground (VSS) and

Master Cl ear (MCLR ). This allows customers to manu-

facture boards with unprogrammed devices, and then

program the digital signal controller just before shipping

the product. This also allows the most recent firmware

or a custom firmware to be programmed.

6.2 Run-Time Self-Programming

(RTSP)

RTSP is accomplished using TBLRD (table read) and

TBLWT (table wr ite) ins tru cti ons .

With RTSP, the user may erase program memory,

32 instructions (96 bytes) at a time, and can write

program memory data, 32 instructions (96 bytes) at a

time.

6.3 Table Instruction Operation Summary

The TBLRDL and the TBLWTL instructions are used to

read or write to bits <15:0> of program memory.

TBLRDL and TBLWTL can access program memory in

Word or Byte mode.

The TBLRDH and TBLWTH i nstructio ns are used to read

or write to bits<23:16> of program memory. TBLRDH

and TBLWTH can access program memory in Word or

Byte mode.

A 24-bit program memory address is formed using

bits<7:0> of the TBLPAG register and the Effective

Address (EA) from a W register, specified in the table

instruction, as shown in Figure 6-1.

FIGURE 6-1: ADDRESSING FOR TABLE AND NVM REGISTERS

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046). For more information on the device

instruction set and programming, refer to the “dsPIC30F/

33F Programmer’s Reference Manual” (DS70157).

0Program Counter

24 bi ts

NVMADRU Reg

8 bit s 16 bit s

Program

Using

TBLPA G Reg

8 bits

Wor k i ng Re g EA

16 bits

Using

Byte

24-bit EA

1/0

Select

Table

Instruction

NVMADR

Addressing

Counter

Using

NVMADR R eg EA

User/Configuration

Space Select

dsPIC30F4011/4012

6.4 RTSP Operation

The dsPIC30F Flash program memory is organized

into rows and panels. Each row consists of 32 instruc-

tions or 96 bytes. Each panel consists of 128 rows or

4K x 24 instructions. RTSP allows the user to erase one

row (32 instructions) at a time and to program

32 instru ctions at one time.

Each panel of program memory contains write latches

that hold 32 instructions of programming data. Prior to

the actual programming operation, the write data must

be loaded into the panel write latches. The data to be

programmed into the panel is loaded in sequential

order into the write latches: instruction 0, in str uct i on 1,

etc. The addresses loaded must always be from a

32 address boundary.

The basi c sequence for R TSP programming is to set up

a Table Pointer, then do a series of TBLWT instructions

to load th e wri te latc hes. Program ming is perfo rmed by

setting the special bits in the NVMCON register.

32 TBLWTL and 32 TBLWTH instructions are required

to load the 32 instruc tio ns .

All of the table write operations are single-word writes

(2 instru ction cycles) because only the table latches are

written.

After the latches are written, a programming operation

needs to be initiated to program the data.

The Flash program memory is readable, writable and

erasable during normal operation over the entire VDD

range.

6.5 RTSP Control Registers

The four SFRs used to read and write the program

Flash memory are:

•NVMCON

• NVMADR

• NVMADRU

• NVMKEY

6.5.1 NVMCON REGISTER

The NVMCON register controls which blocks are to be

erased, which memory type is to be programmed and

the start of the programming cycle.

6.5.2 NVMADR REGISTER

The NVMADR register is used to hold the lower two

bytes of the Effective Address. The NVMADR register

captures the EA<15 :0> of the last table instru ct ion that

has been executed and selects the row to write.

6.5.3 NVMADRU REGISTER

The NVMADRU register is used to hold the upper byte

of the Effective Address. The NVMADRU register cap-

tures the EA<23:16> of the last table instruction that

has been exec uted.

6.5. 4 NVMKEY R EGISTER

NVMKEY is a write-only register that is used for write

protection. To start a programming or an erase

sequence, the user must consecutively write 0x55 and

0xAA to the NVMKEY register. Refer to Section 6.6

“Programming Operations” for further details.

Note: The user can also directly write to the

NVMADR and NVMADRU registers to

specify a program memory address for

erasing or programming.

dsPIC30F4011/4012

6.6 Programming Operations

A complete programming sequence is necessary for

programming or erasing the internal Flash in RTSP

mode. A progra mming operati on is nominally 2 ms ec in

duration and the processor stalls (waits) until the oper-

ation is finished. Setting the WR bit (NVMCON<15>)

starts the operation, and the WR bit is automatically

cleared when the operation is finished.

6.6.1 PROGRAMMING ALGORITHM FOR

PROGRAM FLASH

The user can erase or program one row of program

Flash memory at a time. The general process is:

1. Read one row of program Flash (32 instruction

words) and store into data RAM as a data

“image”.

2. Update the data image with the desired new

data.

3. Erase program Flash row.

a) Set up NVMCON register for multi-word,

program Flash, erase and set WREN bit.

b) Write address of row to be erased into

NVMADRU/NVMDR.

c) Write ‘55’ to NVMKEY.

d) Wri te ‘AA’ to NVMKEY.

e) Set the WR bit. This will begin erase cycle.

f) CPU will stall for the duration of the erase

cycle.

g) The WR bit is cleared when erase cycle

ends.

4. Write 32 instruction words of data from data

RAM “image” into the program Flash write

latches.

5. Program 32 instruction words into program

Flash.

a) Setup NVMCON register for multi-word,

progra m Flash, program and set WREN bit.

b) Write ‘55’ to NVMKEY.

c) Write ‘AA’ to NVMKEY.

d) Set the WR bit. This will begin program

cycle.

e) CPU will stall for duration of the program

cycle.

f) The WR bit is cleared by the hardware

when program cycle ends.

6. Repeat step s 1 through 5 as needed to program

desired amount of program Flash memory.

6.6.2 ERASING A ROW OF PROGRAM

MEMORY

Example 6-1 show s a code seque nce that can be used

to erase a row (32 instructions) of program memory.

EXAMPLE 6-1: ERASING A ROW OF PROGRAM MEMORY

; Setup NVMCON for erase operation, multi word write

; program memory selected, and writes enabled

MOV #0x4041,W0 ;

MOV W0,NVMCON ; Init NVMCON SFR

; Init pointer to row to be ERASED

MOV #tblpage(PROG_ADDR),W0 ;

MOV W0,NVMADRU ; Initialize PM Page Boundary SFR

MOV #tbloffset(PROG_ADDR),W0 ; Intialize in-page EA[15:0] pointer

MOV W0, NVMADR ; Intialize NVMADR SFR

DISI #5 ; Block all interrupts with priority <7

; for next 5 instructions

MOV #0x55,W0

MOV W0,NVMKEY ; Write the 0x55 key

MOV #0xAA,W1 ;

MOV W1,NVMKEY ; Write the 0xAA key

BSET NVMCON,#WR ; Start the erase sequence

NOP ; Insert two NOPs after the erase

NOP ; command is asserted

dsPIC30F4011/4012

6.6.3 LOADING WRITE LATCHES

Example 6-2 shows a sequence of instructions that

can be used to load the 96 bytes of write latches.

32 TBLWTL and 32 TBLWTH instructions are needed to

load the w rite lat ches selected by the Tabl e Pointer.

EXAMP L E 6-2: LOA DIN G WR ITE LATC HES

6.6.4 INITIATING THE PROGRAMMING

SEQUENCE

For protec tion, the w rite i nitiate sequenc e for N VMKEY

must be used to allow any erase or program operation

to procee d. After the prog ramming comm and has bee n

executed, the user must wait for the programming time

until programming is complete. The two instructions

following the start of the programming sequence

should be NOPs.

EXAMPLE 6-3: INITIATIN G A PROGRAMMING SEQUENCE

; Set up a pointer to the first program memory location to be written

; program memory selected, and writes enabled

MOV #0x0000,W0 ;

MOV W0,TBLPAG ; Initialize PM Page Boundary SFR

MOV #0x6000,W0 ; An example program memory address

; Perform the TBLWT instructions to write the latches

; 0th_program_word

MOV #LOW_WORD_0,W2 ;

MOV #HIGH_BYTE_0,W3 ;

TBLWTL W2,[W0] ; Write PM low word into program latch

TBLWTH W3,[W0++] ; Write PM high byte into program latch

; 1st_program_word

MOV #LOW_WORD_1,W2 ;

MOV #HIGH_BYTE_1,W3 ;

TBLWTL W2,[W0] ; Write PM low word into program latch

TBLWTH W3,[W0++] ; Write PM high byte into program latch

; 2nd_program_word

MOV #LOW_WORD_2,W2 ;

MOV #HIGH_BYTE_2,W3 ;

TBLWTL W2, [W0] ; Write PM low word into program latch

TBLWTH W3, [W0++] ; Write PM high byte into program latch

•

; 31st_program_word

MOV #LOW_WORD_31,W2 ;

MOV #HIGH_BYTE_31,W3 ;

TBLWTL W2, [W0] ; Write PM low word into program latch

TBLWTH W3, [W0++] ; Write PM high byte into program latch

Note: In Example 6-2, the contents of the upper byte of W3 has no effect.

DISI #5 ; Block all interrupts with priority <7

; for next 5 instructions

MOV #0x55,W0

MOV W0,NVMKEY ; Write the 0x55 key

MOV #0xAA,W1 ;

MOV W1,NVMKEY ; Write the 0xAA key

BSET NVMCON,#WR ; Start the erase sequence

NOP ; Insert two NOPs after the erase

NOP ; command is asserted

dsPIC30F4011/4012

TABLE 6-1: NVM REGISTER MAP

File Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All Resets

NVMCON 0760 WR WREN WRERR — — — —TWRI — PROGOP<6:0> 0000 0000 0000 0000

NVMADR 0762 NVMADR<15:0> uuuu uuuu uuuu uuuu

NVMADRU 0764 — — — — — — — — — NVMADR<22:16> 0000 0000 uuuu uuuu

NVMKEY 0766 — — — — — — — — KEY<7:0> 0000 0000 0000 0000

Legend: u = uninitialized bit

Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for de scrip tions of register bit fields.

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

7.0 DAT A EEPROM MEMORY

The data EEPROM memory is readable and writable

during no rmal operatio n over the enti re VDD range. The

data EEPROM memory is directly mapped in the

program memory address space.

The four SFRs used to read and write the program

Flash memory are used to access data EEPROM

memory, as well. As described in Section 6.0 “Flash

Program Memory”, these registers are:

•NVMCON

• NVMADR

• NVMADRU

• NVMKEY

The EEPROM data memory allows read and write of

single words and 16-word blocks. When interfacing to

data memory, NVMADR, in conjunction with the

NVMADRU register, is used to address the EEPROM

locatio n bei ng ac cess ed. TBLRDL and TBLWTL instruc-

tions are used to read and write data EEPROM. The

dsPIC30F401 1/4012 devices have 1 Kbyte (512 words)

of data EEPROM, with an address range from

0x7FFC00 to 0x7FFFFE.

A word wri te operatio n should be prec eded by an e rase

of the corresponding memory location(s). The write

typically requires 2 ms to complete, but the write time

will vary with voltage and temperature.

A program or erase operation on the data EEPROM

does n ot sto p the ins truc tion fl ow. The us er is r espon -

sible for waiting for the appropriate duration of time

before initiating another data EEPROM write/erase

operation. Attempting to read the data EEPROM while

a programming or erase operation is in progress results

in unspecified data.

Control bit, WR, initiates write operations, similar to

prog ram Fl ash wri tes. This bi t canno t be clea red, only

set, in software. This bit is cleared in hardware at the

completion of the write operation. The inability to clear

the WR bit in software prevents the accidental or

premature termination of a write operation.

The WREN bit, when set, will allow a write operation.

On powe r-up, the WR EN bit is clear. The WRERR bi t is

set when a write operation is interrupted by a MCLR

Reset, or a WDT Time-out Reset, during normal oper-

ation . In these si tuatio ns, foll owing Re set, the us er can

check the WRERR bit and rewrite the location. The

address register, NVMADR, remains unchanged.

7.1 Reading the Data EEPROM

A TBLRD instruction reads a word at the current pro-

gram word address. This example uses W0 as a

pointer to data EEPROM. The result is placed in

EXAMPLE 7-1: DATA EEPROM READ

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046). For more information on the device

instruction set and programming, refer to the “dsPIC30F/

33F Programmer’s Reference Manual” (DS70157).

Note: Interrupt flag bit, NVMIF in the IFS0 regis-

ter, is set when write is complete. It must

be cleared in sof tw are.

MOV #LOW_ADDR_WORD,W0 ; Init Pointer

MOV #HIGH_ADDR_WORD,W1

MOV W1

TBLPAG

TBLRDL [ W0 ], W4 ; read data EEPROM

dsPIC30F4011/4012

7.2 Erasing Data EEPROM

7.2.1 ERASING A BLOCK OF DATA

EEPROM

In order to erase a block of data EEPROM, the

NVMADRU and NVMADR registers must initially

point to th e block of memor y to be erased. Co nfigure

NVMCON for erasing a block of data EEPROM and

set the WR and WREN bits in the NVMCON register.

Setting the WR bit initiates the erase, as shown in

Example 7-2.

EXAMPLE 7-2: DATA EEPROM BLOCK ERASE

7.2.2 ERASING A WORD OF DATA

EEPROM

The TBLPAG and NVMADR registers must point to

the bloc k. Selec t erase a block of data Flash and set

the WR and WREN bits in the NVMCON register.

Setting the WR bit initiates the erase, as shown in

Example 7-3.

EXAMPLE 7-3: DATA EEPROM WORD ERASE

; Select data EEPROM block, WR, WREN bits

MOV #0x4045,W0

MOV W0,NVMCON ; Initialize NVMCON SFR

; Start erase cycle by setting WR after writing key sequence

DISI #5 ; Block all interrupts with priority <7

; for next 5 instructions

MOV #0x55,W0 ;

MOV W0,NVMKEY ; Write the 0x55 key

MOV #0xAA,W1 ;

MOV W1,NVMKEY ; Write the 0xAA key

BSET NVMCON,#WR ; Initiate erase sequence

NOP

; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle

; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete

; Select data EEPROM word, WR, WREN bits

MOV #0x4044,W0

MOV W0,NVMCON

; Start erase cycle by setting WR after writing key sequence

DISI #5 ; Block all interrupts with priority <7

; for next 5 instructions

MOV #0x55,W0 ;

MOV W0,NVMKEY ; Write the 0x55 key

MOV #0xAA,W1 ;

MOV W1,NVMKEY ; Write the 0xAA key

BSET NVMCON,#WR ; Initiate erase sequence

NOP

; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle

; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete

dsPIC30F4011/4012

7.3 Writing to the Data EEPROM

To write an EEPROM data location, the following

sequen ce must be followed :

1. Erase data EEPROM word.

a) Select word, data EEPROM; erase and set

WREN bit in NVMCO N regis ter.

b) Write address of word to be erased into

NVMADRU/NVMADR.

c) Enable NVM interrupt (optional).

d) Wri te ‘55’ to NVMKEY.

e) Wri te ‘AA’ to NVMKEY.

f) Set the WR bit. This will begin erase cycle.

g) Either poll NVMIF bit or wait for NVMIF

interrupt.

h) The WR bit is cle ared w hen th e erase cycl e

ends.

2. Write data word into data EEPROM write

latches.

3. Program 1 data word into data EEPROM.

a) Select word, data EEPROM; program and

set WREN bit in NVMCON register.

b) Enable NVM w rite done i nterrup t (optio nal).

c) Write ‘55’ to NVMKEY.

d) Wri te ‘AA’ to NVMKEY.

e) Set the WR bit. This will begin program

cycle.

f) Either poll NVMIF bit or wait for NVM

interrupt.

g) The WR bit is cleared when the write cycle

ends.

The write will not initiate if the above sequence is not

exactly followed (write 0x55 to NVMKEY, write 0xAA to

NVMCON, then set WR bit) for each word. It is strongly

recommended that interrupts be disabled during this

code segment.

Additionally, the WREN bit in NVMCON must be set to

enable writes. This mechanism prevents accidental

writes to data EEPROM due to unexpected code exe-

cution. The WREN bit should be kept clear at all times

except when updating the EEPROM. The WREN bit is

not cleared by hardware.

After a write sequence has been initiated, clearing the

WREN bit wil l not affect the current write cycle. The WR

bit will be inhibited from being set unless the WREN bit

is set. The WREN bit must be set o n a previous instruc -

tion. Both WR a nd WREN c an not be se t with th e s am e

instruction.

At the completion of the write cycle, the WR bit is

cleared in ha rdware and the No nv ola til e M emory Write

Complete Interrupt Flag bit (NVMIF) is set. The user

may either enable this interrupt or poll this bit. NVMIF

must be cleared by software.

7.3.1 WRITING A WORD OF DATA

EEPROM

Once the user has erased the word to be programme d,

then a table write instruction is used to write one write

latch, as shown in Example 7-4.

EXAMPLE 7-4: DATA EEPROM WORD WRITE

; Point to data memory

MOV #LOW_ADDR_WORD,W0 ; Init pointer

MOV #HIGH_ADDR_WORD,W1

MOV W1,TBLPAG

MOV #LOW(WORD),W2 ; Get data

TBLWTL W2,[ W0] ; Write data

; The NVMADR captures last table access address

; Select data EEPROM for 1 word op

MOV #0x4004,W0

MOV W0,NVMCON

; Operate key to allow write operation

DISI #5 ; Block all interrupts with priority <7

; for next 5 instructions

MOV #0x55,W0

MOV W0,NVMKEY ; Write the 0x55 key

MOV #0xAA,W1

MOV W1,NVMKEY ; Write the 0xAA key

BSET NVMCON,#WR ; Initiate program sequence

NOP

; Write cycle will complete in 2mS. CPU is not stalled for the Data Write Cycle

; User can poll WR bit, use NVMIF or Timer IRQ to determine write complete

dsPIC30F4011/4012

7.3.2 WRITING A BLOCK OF DATA

EEPROM

To write a block of data EEPROM, write to all sixteen

latches first, then set the NVMCON register and

progra m the block .

EXAMPLE 7-5: DATA EEPROM BLOCK WRITE

MOV #LOW_ADDR_WORD,W0 ; Init pointer

MOV #HIGH_ADDR_WORD,W1

MOV W1,TBLPAG

MOV #data1,W2 ; Get 1st data

TBLWTL W2,[ W0]++ ; write data

MOV #data2,W2 ; Get 2nd data

TBLWTL W2,[ W0]++ ; write data

MOV #data3,W2 ; Get 3rd data

TBLWTL W2,[ W0]++ ; write data

MOV #data4,W2 ; Get 4th data

TBLWTL W2,[ W0]++ ; write data

MOV #data5,W2 ; Get 5th data

TBLWTL W2,[ W0]++ ; write data

MOV #data6,W2 ; Get 6th data

TBLWTL W2,[ W0]++ ; write data

MOV #data7,W2 ; Get 7th data

TBLWTL W2,[ W0]++ ; write data

MOV #data8,W2 ; Get 8th data

TBLWTL W2,[ W0]++ ; write data

MOV #data9,W2 ; Get 9th data

TBLWTL W2,[ W0]++ ; write data

MOV #data10,W2 ; Get 10th data

TBLWTL W2,[ W0]++ ; write data

MOV #data11,W2 ; Get 11th data

TBLWTL W2,[ W0]++ ; write data

MOV #data12,W2 ; Get 12th data

TBLWTL W2,[ W0]++ ; write data

MOV #data13,W2 ; Get 13th data

TBLWTL W2,[ W0]++ ; write data

MOV #data14,W2 ; Get 14th data

TBLWTL W2,[ W0]++ ; write data

MOV #data15,W2 ; Get 15th data

TBLWTL W2,[ W0]++ ; write data

MOV #data16,W2 ; Get 16th data

TBLWTL W2,[ W0]++ ; write data. The NVMADR captures last table access address.

MOV #0x400A,W0 ; Select data EEPROM for multi word op

MOV W0,NVMCON ; Operate Key to allow program operation

DISI #5 ; Block all interrupts with priority <7

; for next 5 instructions

MOV #0x55,W0

MOV W0,NVMKEY ; Write the 0x55 key

MOV #0xAA,W1

MOV W1,NVMKEY ; Write the 0xAA key

BSET NVMCON,#WR ; Start write cycle

NOP

dsPIC30F4011/4012

7.4 Write Verify

Depending on the application, good programming

practice may dictate that the value written to the mem-

ory should be verified against the original value. This

should be used in applications where excessive writes

can stress bits near the specification limit.

7.5 Protection Against Spurious Write

There are conditions when the device may not want to

write to the data EEPROM memory. To protect against

spurious EEPROM writes, various mechanisms have

been built-in. On power-up, the WREN bit is cleared;

also, the Power-up Ti mer prevents EEPROM write.

The write initiate sequence, and the WREN bit

together, help prevent an accidental write during

brown-out, power glitch or software malfunction.

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

8.0 I/O PORTS

All of the device pins (except VDD, VSS, MCLR and

OSC1/CLKI) are shared between the peripherals and

the parallel I/O ports.

All I/O input ports feature Schmitt Trigger inputs for

improved noise immunity.

8.1 Pa ra l le l I/O (PIO) Po rts

When a peripheral is enabled and the peripheral is

actively driving an associated pin, the use of the pin as

a general purpose output pin is disabled. The I/O pin

may be read, but the output driver for the Parallel Port

bit will be disabled. If a peripheral is enabled, but the

peripheral is not actively driving a pin, that pin may be

driven by a port.

All port pins have three registers directly associated

with the operation of the port pin. The Data Direction

or an output. If the Data Direction register bit is a ‘1’,

then the pin is an input. All port pins are defined as

input s after a R eset. Read s from the la tch (LATx), read

the latch. Writes to the latch, write the latch (LATx).

Reads from the port (PORTx), read the port pins and

writes to the port pins, write the latch (LATx).

Any bit and its associated data and control registers

that are not valid for a particular device will be

disabled. That means the corresponding LATx and

TRISx registers and the port pin will read as zeros.

When a pin is shared with another peripheral or func-

tion that is defined as an input only, it is nevertheless

regarded as a dedicated port because there is no

other competing source of outputs. An example is the

INT4 pin.

The format of the registers for PORTx are shown in

Table 8-1.

The TRISx (Data Direction) register controls the direc-

tion of the pins. The LATx register supplies data to the

outputs and is readable/writable. Reading the PORTx

to the PORTx register modifies the contents of the

LATx register.

A parallel I/O (PIO) port that shares a pin with a periph-

eral is, in general, subservient to the peripheral. The

peripheral’s output buffer data and control signals are

provided to a pair of multiplexers. The multiplexers

select whether the peripheral or the associated port

has own ership of the outp ut dat a and co ntrol si gnals of

the I/O pad cell. Figure 8-2 shows how ports are shared

with oth er perip herals and the a ssociat ed I/O c ell (p ad)

to which they are connected. Table 8-1 and Table 8-2

show the formats of the registers for the shared ports,

PORTB through PORTG.

FIGURE 8-1: BLOCK DIAGRAM OF A DEDICATED PORT STRUCTURE

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046). For more information on the device

instruction set and programming, refer to the “dsPIC30F/

33F Programmer’s Reference Manual” (DS70157).

WR LAT +

TRIS Latch

I/O Pad

WR PORT

Data Bus

Data Latch

Read LAT

Read PORT

Read TRIS

WR TRIS

I/O Cell

Dedicated Port Module

dsPIC30F4011/4012

FIGURE 8-2: BLOCK DIAGRAM OF A SHARED PORT STRUCTURE

8.2 Configuring Analog Port Pins

The use of the ADPC FG and TRIS registers control the

operation of the A/D port pins. The port pins that are

desired as analog inputs must have their correspond-

ing TRIS bit set (input). If the TRIS bit is cleared

(output), the digital output level (VOH or VOL) will be

converted.

When read ing the POR T register, all pins c onfigured a s

analog input channels will read as cleared (a low level).

Pins configured as digital inp uts will not convert an ana-

log input. Analog levels on any pin that is defined as a

digital input (including the ANx pins), may cause the

input buffer to consume current that exceeds the

device specifications.

8.2.1 I/O PORT WRITE/READ TIMING

One instruction cycle is required between a port

direction change or port write operation and a read

operation of the same port. Typically this instruction

would be a NOP.

EXAMP LE 8- 1: PORT WRITE/R EAD

EXAMPLE

WR LAT +

TRIS Latch

I/O Pad

WR PORT

Data Bus

Data Latch

Read LA T

Read PORT

Read TRIS

WR TRIS

Peripheral Output Data

Peripheral Input Data

I/O Cell

Peripheral Module

Peripheral Output Enable

PIO Module

Out put Mult iplexers

Input Data

Peripheral Module Enable

Output Enable

Output Data

MOV 0xFF00, W0 ; Configure PORTB<15:8>

; as inputs

MOV W0, TRISBB ; and PORTB<7:0> as outputs

NOP ; Delay 1 cycle

BTSS PORTB, #13 ; Next Instruction

dsPIC30F4011/4012

TABLE 8-1: dsPIC30F4011 PORT REGISTER MAP

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TRISB 02C6 — — — — — — — TRISB8 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 0000 0001 1111 1111

PORTB 02C8 — — — — — — — RB8 RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 0000 0000 0000 0000

LATB 02CA — — — — — — — LATB8 LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 0000 0000 0000 0000

TRISC 02CC TRISC15 TRISC14 TRISC13 — — — — — — — — — — — — — 1110 0000 0000 0000

PORTC 02CE RC15 RC14 RC13 — — — — — — — — — — — — — 0000 0000 0000 0000

LATC 02D0 LATC15 LATC14 LATC13 — — — — — — — — — — — — — 0000 0000 0000 0000

TRISD 02D2 — — — — — — — — — — — — TRISD3 TRISD2 TRISD1 TRISD0 0000 0000 0000 1111

PORTD 02D4 — — — — — — — — — — — — RD3 RD2 RD1 RD0 0000 0000 0000 0000

LATD 02D6 — — — — — — — — — — — — LATD3 LATD2 LATD1 LATD0 0000 0000 0000 0000

TRISE 02D8 — — — — — — —TRISE8—— TRISE5 TRISE4 TRISE3 TRISE2 TRISE1 TRISE0 0000 0001 0011 1111

PORTE 02DA — — — — — — —RE8—— RE5 RE4 RE3 RE2 RE1 RE0 0000 0000 0000 0000

LATE 02DC — — — — — — —LATE8—— LATE5 LATE4 LATE3 LATE2 LATE1 LATE0 0000 0000 0000 0000

TRISF 02DE — — — — — — — — — TRISF6 TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 TRISF0 0000 0000 0111 1111

PORTF 02E0 — — — — — — — — — RF6 RF5 RF4 RF3 RF2 RF1 RF0 0000 0000 0000 0000

LATF 02E2 — — — — — — — — — LATF6 LATF5 LATF4 LATF3 LATF2 LATF1 LATF0 0000 0000 0000 0000

Legend: u = uninitialized bit

Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for de scrip tions of register bit fields.

dsPIC30F4011/4012

TABLE 8-2: dsPIC30F4012 PORT REGISTER MAP

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TRISB 02C6 — — — — — — — — — — TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 0000 0000 0011 1111

PORTB 02C8 — — — — — — — — — — RB5 RB4 RB3 RB2 RB1 RB0 0000 0000 0000 0000

LATB 02CB — — — — — — — — — — LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 0000 0000 0000 0000

TRISC 02CC TRISC15 TRISC14 TRISC13 — — — — — — — — — — — — — 1110 0000 0000 0000

PORTC 02CE RC15 RC14 RC13 — — — — — — — — — — — — — 0000 0000 0000 0000

LATC 02D0 LATC15 LATC14 LATC13 — — — — — — — — — — — — — 0000 0000 0000 0000

TRISD 02D2 — — — — — — — — — — — — — — TRISD1 TRISD0 0000 0000 0000 0011

PORTD 02D4 — — — — — — — — — — — — — — RD1 RD0 0000 0000 0000 0000

LATD 02D6 — — — — — — — — — — — — — —LATD1LATD00000 0000 0000 0000

TRISE 02D8 — — — — — — —TRISE8—— TRISE5 TRISE4 TRISE3 TRISE2 TRISE1 TRISE0 0000 0001 0011 1111

PORTE 02DA — — — — — — —RE8—— RE5 RE4 RE3 RE2 RE1 RE0 0000 0000 0000 0000

LATE 02DC — — — — — — —LATE8—— LATE5 LATE4 LATE3 LATE2 LATE1 LATE0 0000 0000 0000 0000

TRISF 02EE — — — — — — — — — — — — TRISF3 TRISF2 — — 0000 0000 0000 1100

PORTF 02E0 — — — — — — — — — — — —RF3RF2— — 0000 0000 0000 0000

LATF 02E2 — — — — — — — — — — — — LATF3 LATF2 — — 0000 0000 0000 0000

Legend: u = uninitialized bit

Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for de scrip tions of register bit fields.

dsPIC30F4011/4012

8.3 Input Change Notification Module

The input change notification module provides the

dsPIC30F devices the ability to generate interrupt

requests to the processor in response to a change of

state on selected input pins. This module is capable of

detecting input change of states, even in Sleep mode,

when the clocks are disabled. There are 10 external

signals (CN0 through CN7, CN17 and CN18) that may

be selected (enabled) for generating an interrupt

request on a chan ge of st ate.

Please refer to the pin diagrams for CN pin locations.

TABLE 8-3: INPUT CHANGE NOTIFICATION REGISTER MAP (BITS 7-0)

SFR Name Addr. Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

CNEN1 00C0 CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE 0000 0000 0000 0000

CNEN2 00C2 ————— CN18IE* CN17IE* —0000 0000 0000 0000

CNPU1 00C4 CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE 0000 0000 0000 0000

CNPU2 00C6 ————— CN18PUE* CN17PUE* —0000 0000 0000 0000

Legend: u = uninitialized bit

* Not availa ble on dsP IC3 0F4 01 2

Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

9.0 TIMER1 MODULE

This section describes the 16-bit general purpose

Timer1 module and associated operational modes.

Figure 9-1 depicts the simplified block diagram of the

16-bit Ti mer1 module.

The following sections provide a detailed description,

including setup and control registers, along with asso-

ciated bl oc k dia gram s for the ope rati ona l mod es of the

timers.

The T imer1 mo dule is a 16-bit timer which can serv e as

the time counter for th e Real-T ime Clo ck, or operat e as

a free-running, interval timer/counter. The 16-bit timer

has the followi ng mo des :

• 16-bit Timer

• 16-bit Synchronous Counter

• 16-bit Asynchronous Counter

Further, the following operational characteristics are

supported:

• Timer gate operation

• Selectable prescaler set tings

• Timer operation during CPU Idle and Sleep

modes

• Interrupt on 16-bit Period register match or falling

edge of external gate signal

These operating modes are determined by setting the

appropriate bit(s) in the 16-bit SFR, T1CON. Figure 9-1

presents a block diagram of the 16-bit timer module.

16-bit T imer Mode: In t he 16-bi t T imer m ode, the timer

increments on every instruction cycle up to a match

value, preloaded into the Period register, PR1, then

resets to 0 and continues to count.

When the CPU goes into the Idle mode, the timer will

stop incrementing unless the TSIDL (T1CON<13>)

bit = 0. If TSIDL = 1, t he timer module log ic will resum e

the incrementing sequence upon termination of the

CPU Idle mode.

16-bit Synchronous Counter Mode: In the 16-bit

Synchronous Counter mode, the timer increments on

the rising edge of the applied external clock signal,

which is synchronized with the internal phase clocks.

The timer counts up to a match value preloaded in PR1,

then resets to 0 and continues.

When the CPU goes into the Idle mode, the timer will

stop incrementing unless the respective TSIDL bit = 0.

If TSIDL = 1, the timer module logic will resume the

incrementing sequence upon termination of the CPU

Idle mode.

16-bit Asynchronous Counter Mode: In the 16-bit

Asynchronous Counter mode, the timer increments on

every rising edge of the applied external clock signal.

The timer counts up to a match value preloaded in PR1,

then resets to 0 and continues.

When the timer is configured for the Asynchronous mode

of operation, and the CPU goes into the Idle mode, the

timer w ill s to p increm en ti ng if TSID L = 1.

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046). For more information on the device

instruction set and programming, refer to the “dsPIC30F/

33F Programmer’s Reference Manual” (DS70157).

Note: Timer1 is a ‘Type A’ timer. Please refer to

the specifications for a Type A timer in

Section 24.0 “Electrical Characteristics”

of t hi s document.

dsPIC30F4011/4012

FIGURE 9-1: 16-BIT TIMER1 MODULE BLOCK DIAGRAM (TYPE A TIMER)

9.1 Timer Gate Operation

The 16-bi t timer can be pl aced in the Ga ted Ti me Accu-

mulation mode. This mode allows the internal TCY to

increment the respective timer when the gate input

signa l ( T 1C K pi n) i s as se rt ed hi g h. C o ntr o l b it, TG ATE

(T1CON<6>), must be set to enable this mode. The

timer must be enabled (TON = 1) and the timer clock

source se t to interna l (TCS = 0).

When the CPU goes into the Idle mode, the timer will

stop incrementing unless TSIDL = 0. If TSIDL = 1, the

timer will resume the incrementing sequence upon

termination of the CPU Idle mode.

9.2 Timer Prescaler

The input clock (FOSC/4 or external clock) to the 16-bit

T i mer has a prescale opti on of 1:1 , 1:8, 1:64 and 1:25 6

selected by control bits, TCKPS<1:0> (T1CON<5:4>).

The prescaler counter is cleared when any of the

following occurs:

• a write to the TMR1 register

• cl earing of the TON bit (T1C ON<1 5>)

• device Reset, su ch as POR and BOR

However, if the timer is disabled (TON = 0), then the

timer prescaler cannot be reset since the prescaler

clock is halted.

TMR1 is not cleared when T1CON is written. It is

cleared by writin g to the TMR1 register.

9.3 Timer Operatio n During Sleep

Mode

During CPU Sleep mode, the timer will operate if:

• The timer module is enabled (TON = 1) and

• The timer clock s ource is selected as extern al

(TCS = 1) and

• The TSYNC bit (T1CON<2>) is asser ted to a logic

‘0’, which defines the external clock source as

asynchronous

When all three conditions are true, the timer will

continu e to count u p to the Period register an d be reset

to 0x0000.

When a ma tch betwe en the tim er and th e Period re gis-

ter occurs, an interrupt can be generated if the

respective timer interrupt enable bit is asserted.

TON

Sync

SOSCI

SOSCO/

PR1

T1IF

Equal Comparator x 16

TMR1

Reset

LPOSCEN

Event Flag

TSYNC

TGATE

TCKPS<1:0>

Prescaler

1, 8, 64, 256

TGATE

T1CK

TCS

TGATE

Gate

Sync

dsPIC30F4011/4012

9.4 Timer Interrupt

The 16-bit tim er ha s the ab ili ty to ge nerate an interrupt

on period match. When the timer count matches the

Period regi ster , the T1IF bit is asserted and an interru pt

will be generated, if enabled. The T1IF bit must be

cleared in software. The Timer Interrupt Flag, T1IF, is

located in the IFS0 control register in the interrupt

controller.

When the Gated Time Accumulation mode is enabled,

an interr upt will also be generated o n the fall ing edge of

the gate signal (at the end of the accumulation cycle).

Enabling an interrupt is accomplished via the respec-

tive T imer Interrupt Enable bi t, T1IE. The ti mer interrupt

enable bit is located in the IEC0 Control register in the

inter rupt co ntro lle r.

9.5 Real-Time Clock

Timer1, when operating in Real-Time Clock (RTC)

mode, provides time-of-day and event time-stamping

capabilities. Key operational features of the RTC are:

• Operation from 32 kHz LP oscillator

• 8-bit prescaler

• Low power

• Real-Time Clock interrupts

These operating modes are determined by setting the

appropriate bit(s) in the T1CON Control register

FIGURE 9-2: RECOMME NDED

COMPONENTS FOR

TI MER1 LP OSCILLATOR

REAL-TIME CLOCK (RTC)

9.5.1 RTC OSCILLATOR OPERATION

When TON = 1, TCS = 1 and TGATE = 0, the timer

increme nt s on the risin g e dge of the 32 kHz LP oscill a-

tor output sig nal, up to the val ue specified in the Period

The TSYNC bit must be asserted to a logic ‘0’

(Asynchronous mode) for correct operation.

Enabling LPOSCEN (OSCCON<1>) will disable the

normal Timer and Counter modes and enable a timer

carry-out wake-up event.

When the CPU enters Sleep mode, the RTC will con-

tinue to operate, provided the 32 kHz external crystal

oscillator is active and the control bits have not been

changed. The TSIDL bit should be cleared to ‘0’ in

order for R TC to contin ue ope rati on in Idle mode .

9.5.2 RTC INTERRUPTS

When an interrupt event occurs, the respective Timer

Interrupt Flag, T1IF, is asserted and an i nte rrupt w ill b e

generated, if enabled. The T1IF bit must be cleared in

software. The respective Timer Interrupt Flag, T1IF, is

located in the IFS0 Status register in the interrupt

controller.

Enabling an interrupt is accomplished via the

respective Timer Interrupt Enable bit, T1IE. The Timer

Interrupt Enable bit is located in the IEC0 control

SOSCI

SOSCO

dsPIC30FXXXX

32.768 kHz

XTAL

C1 = C2 = 18 pF; R = 100K

dsPIC30F4011/4012

TABLE 9-1: TIMER1 REGISTER MAP

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 1 1 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TMR1 0100 Timer1 Register uuuu uuuu uuuu uuuu

PR1 0102 Period Register 1 1111 1111 1111 1111

T1CON 0104 TON —TSIDL— — — — — — TGATE TCKPS1 TCKPS0 —TSYNCTCS —0000 0000 0000 0000

Legend: u = uninitialized bit

Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for de scrip tions of register bit fields.

dsPIC30F4011/4012

10.0 TIMER2/3 MODULE

This sec tion describes the 32 -bit general purpose tim er

module (Timer2/3) and associated operational modes.

Figure 10-1 depicts the simplified block diagram of the

32-bit Timer2/3 module. Figure 10-2 and Figure 10-3

show Timer2/3 configured as two independent 16-bit

timers, Timer2 and Timer3, respectively.

The Timer2/3 module is a 32-bit timer, which can be

configu red as two 16-bit timers , with sele ct able oper at-

ing modes. These timers are utilized by other

periphe ral modul es, such as:

• Input Capture

• Output Compare/Simpl e PWM

The following sections provide a detailed description,

including setup and control registers, along with asso-

ciated block diagrams for the operational modes of the

timers.

The 32-bit timer has the following modes:

• Two independent 16-bit timers (Timer2 and

Tim er3) with all 16 -bit operating mode s (except

Asynchronous Counter mode)

• Single 32-bit timer operation

• Single 32-bit synchronous counter

Further, the following operational characteristics are

supported:

• ADC Event Trigger

• Timer Gate Operation

• Selectable Prescaler Settings

• Timer Operation During Idle and Sleep Modes

• Interrupt on a 32-bit Period Register Match

These operating modes are determined by setting the

appropriate bit(s) in the 16-bit T2CON and T3CON

SFRs.

For 32-bit timer/counter operation, Timer2 is the least

signifi cant word and Tim er3 is the mos t significant wo rd

of the 32-bit timer.

16-bit Mode: In the 16-bit mode, Timer2 and Timer3

can be configured as two independent 16-bit timers.

Each time r can be set up in either 16-b it T imer mod e or

16-bit Synchronous Counter mode. See Section 9.0

“Tim er1 Module” , T ime r1 Mod ule, for det ails o n thes e

two operating modes.

The only functional difference between Timer2 and

Timer3 is that Timer2 provides synchronization of the

clock prescal er output. This is useful for high-frequency

external clock inputs.

32-bit T imer Mode: In t he 32-bi t T imer m ode, the timer

increments on every instruction cycle up to a match

value, preloaded into the combined 32-bit Period

count.

For synchronous 32-bit reads of the Timer2/Timer3

pair, reading the least significant word (TMR2 register)

will cause the msw to be read and latched into a 16-bit

holding register, termed TMR3HLD.

For synchronous 32-bit writes, the holding register

(TMR3HLD) must first be written to. When followed by

a write to the TMR2 re gister, the content s of TM R3HLD

will be transferred and latched into the MSB of the

32-bit timer (TMR3).

32-bit Synchronous Counter Mode: In the 32-bit

Synchronous Counter mode, the timer increments on

the rising edge of the applied external clock signal,

which is synchronized with the internal phase clocks.

The timer counts up to a match value preloaded in the

combi ne d 32 -bi t per i od re gi st er, PR3/PR 2 , th en re se ts

to 0 and continues.

When the timer is configured for the Synchronous

Counter mode of operation and the CPU goes into the

Idle mode, the timer will stop incrementing unless the

TSIDL (T2CON<13>) bit = 0. If TSIDL = 1, the timer

module logic will resume the incrementing sequence

upon termination of the CPU Idle mode.

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046). For more information on the device

instruction set and programming, refer to the “dsPIC30F/

33F Programmer’s Reference Manual” (DS70157).

Note: Timer2 is a ‘ Typ e B ’ ti me r an d Timer 3 is a

‘Type C’ timer. Please refer to the

appropriate timer type in Section 24.0

“Electrical Characteristics” of this

document.

Note: For 32-bit timer operation, T3CON control

bits are ignored. Only T2CON control bits

are used for setup and control. Timer2

clock and gate inputs are utilized for the

32-bit timer module, but an interrupt is

generated with the Timer3 Interrupt Flag

(T3IF) and th e interrupt is en abled with the

Timer3 Interrupt Enable bit (T3IE).

dsPIC30F4011/4012

FIGU RE 10-1: 32-BI T T IM ER2 /3 BLOC K DI AGR AM

TMR3 TMR2

T3IF

Equal Compara tor x 32

PR3 PR2

Reset

LSB

MSB

Event Fl ag

Note: Timer configuration bit, T32 (T2CON<3>), must be set to ‘1’ for a 32-bit timer/counter operation. All control

bits are respective to the T2CON register.

Data Bus<15:0>

TMR3HLD

Read TMR2

Write TMR2 16

TGATE(T2CON<6>)

(T2CON<6>)

TGATE

TON TCKPS<1:0>

Prescaler

1, 8, 64, 256

TCY

TCS

1 x

0 1

TGATE

0 0

Gate

T2CK

Sync

ADC Event Trigger

Sync

dsPIC30F4011/4012

FIGU RE 10- 2: 16- BI T TIMER2 B L OC K D IA GRAM

FIGU RE 10- 3: 16- BI T TIMER3 B L OC K D IA GRAM

TON

Sync

PR2

T2IF

Equal Comparator x 16

TMR2

Reset

Event Flag

TGATE

TCKPS<1:0>

Prescaler

1, 8, 64, 256

TGATE

TCY

TCS

1 x

0 1

TGATE

0 0

Gate

T2CK

Sync

TON

PR3

T3IF

Equal Comparator x 16

TMR3

Reset

Event Flag

TGATE

TCKPS<1:0>

Prescaler

1, 8, 64, 256

TGATE

TCY

TCS

1 x

0 1

TGATE

0 0

ADC Event Trigger

Sync

Note: The dsPIC30F4011/4012 devices do not have external pin inputs to Timer3. In these devices, the following

modes should not be used:

1. TCS = 1.

2. TCS = 0 and TGATE = 1 (gated time accumulation).

dsPIC30F4011/4012

10.1 Timer Gate Operation

The 32-bi t timer can be pl aced in the Ga ted Ti me Accu-

mulation mode. This mode allows the internal TCY to

increm ent the respec tive timer when the gate input si g-

nal (T2CK pin) is asserted high. Control bit, TGATE

(T2CON<6>), must be set to enable this mode. When

in this mode, Timer2 is the originating clock source.

The TGATE setting is ignored for Timer3. The timer

must be e nab led (T O N = 1) and the time r cl oc k so urc e

set to internal (TCS = 0).

The falling edge of the external signal terminates the

count operation but does not reset the timer. The user

must reset the timer in order to start counting from zero.

10.2 ADC Event Trigger

When a matc h occurs betwe en the 32-bit timer (TM R3/

TMR2) and the 32-bit combined Period register (PR3/

PR2), a special ADC trigger event signal is generated

by Timer3.

10.3 Timer Prescaler

The in put cloc k (FOSC/4 or external clock) to the timer

has a prescale option of 1:1, 1:8, 1:64 and 1:256,

selected by control bits, TCKPS<1:0> (T2CON<5:4>

and T3CON<5:4>). For the 32-bit timer operation, the

origina ting clock so urce is Timer2. Th e prescale r oper-

ation for Timer3 is not applicable in this mode. The

prescaler counter is cleared when any of the following

occurs:

• a write to the TMR2/TMR3 register

• clearing either of the TON (T2CON<15> or

T3CON<15>) bits to ‘0’

• device Reset, su ch as POR and BOR

However, if the timer is disabled (TON = 0), then the

Timer 2 prescaler cannot be reset, since the prescaler

clock is halted.

TMR2/TMR3 is not cleared when T2CON/T3CON is

written.

10.4 Timer Operation During Sleep

Mode

During CPU Sleep mode, the timer will not operate

because the internal clocks are disabled.

10.5 Timer Interrupt

The 32-bit timer module can generate an interrupt on

period ma tch, or on the fa lling edge of the externa l gate

signal. When the 32-bit timer count matches the

respective 32-bit Period register, or the falling edge of

the external “gate” signal is detected, the T3IF bit

(IFS0<7>) is asserted and an interrupt will be gener-

ated, if enabled. In this mode, the T3IF interrupt flag is

used as the source of the interrupt. The T3IF bit must

be cleared in sof tw are.

Enabling an interrupt is accomplished via the

respective Timer Interru pt Enable bi t, T3IE (IEC0<7 >).

dsPIC30F4011/4012

TABLE 10-1: TIMER2/3 REGISTER MAP

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TMR2 0106 Timer2 Register uuuu uuuu uuuu uuuu

TMR3HLD 0108 Timer3 Holding Register (For 32-bit timer operations only) uuuu uuuu uuuu uuuu

TMR3 010A Timer3 Register uuuu uuuu uuuu uuuu

PR2 010C Period Register 2 1111 1111 1111 1111

PR3 010E Period Register 3 1111 1111 1111 1111

T2CON 0110 TON —TSIDL— — — — — — TGATE TCKPS1 TCKPS0 T32 —TCS —0000 0000 0000 0000

T3CON 0112 TON —TSIDL— — — — — — TGATE TCKPS1 TCKPS0 ——TCS —0000 0000 0000 0000

Legend: u = uninitialized bit

Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for de scrip tions of register bit fields.

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

11.0 TIMER4/5 MODULE

This section describes the second 32-bit general

purpose timer module (Timer4/5) and associated

operational modes. Figure 11-1 depicts the simplified

block diagram of the 32-bit Timer4/5 module.

Figure 11-2 and Figure 11-3 show Time r4/5 co nfi gure d

as two independent 16-bit timers, Timer4 and Timer5,

respectively.

The Timer4/5 module is similar in operation to the

Timer 2/3 module. However, there are some

diffe rences, which are as follows :

• The Timer4/5 module does not support the ADC

event trigger feature

• Timer4/5 can not be utilized by other peripheral

modules such as input capture and output compare

The operating modes of the Timer4/5 module are

determined by setting the appropriate bit(s) in the 16-b it

T4CON and T5CON SFRs.

For 32-bit timer/counter operation, Timer4 is the least

signifi cant word and Tim er5 is the mos t significant wo rd

of the 32-bit timer.

FIGURE 11-1: 32-BIT TIMER4/5 BLOCK DIAGRAM

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046). For more information on the device

instruction set and programming, refer to the “dsPIC30F/

33F Programmer’s Reference Manual” (DS70157).

Note: Timer4 is a ‘ Typ e B ’ ti me r an d Timer 5 is a

‘Type C’ timer. Please refer to the

appropriate timer type in Section 24.0

“Electrical Characteristics” of this

document.

Note: For 32-bit timer operation, T5CON control

bits are ignored. Only T4CON control bits

are used for setup and control. Timer4

clock and gate inputs are utilized for the

32-bit timer module, but an interrupt is

generated with the Timer5 Interrupt Flag

(T5IF) and th e interrupt is en abled with the

Timer5 Interrupt Enable bit (T5IE).

TMR5 TMR4

T5IF

Equal Comparator x 32

PR5 PR4

Reset

LSB

MSB

Event Flag

Note: Timer configuration bit, T32 (T2CON<3>), must be set to ‘1’ for a 32-bit timer/counter operation. All

control bits are respective to the T4CON register.

Data Bus<15:0>

TMR5HLD

Read TMR4

Write TMR4 16

CK TGATE(T4CON<6>)

(T4CON<6>)

TGATE

TON TCKPS<1:0>

Prescaler

1, 8, 64, 256

TCY

TCS

1 x

0 1

TGATE

0 0

Gate

Sync

T4CK

dsPIC30F4011/4012

FIGURE 11-2: 16-BIT TIMER4 BLOCK DIAGRAM

TON

Sync

PR4

T4IF

Equal Comparator x 16

TMR4

Reset

Event Flag

TGATE

TCKPS<1:0>

Prescaler

1, 8, 64, 256

TGATE

TCY

TCS

1 x

0 1

TGATE

0 0

Gate

Sync

T4CK

dsPIC30F4011/4012

FIGURE 11-3: 16-BIT TIMER5 BLOCK DIAGRAM

TON

PR5

T5IF

Equal Comparator x 16

TMR5

Reset

Event Flag

TGATE

TCKPS<1:0>

Prescaler

1, 8, 64, 256

TGATE

TCY

TCS

1 x

0 1

TGATE

0 0

ADC Event Trigger

Sync

Note: The dsPIC30F4011/4012 devices do not have an external pin input to Timer5. In these devices, the

following modes should not be used:

1. TCS = 1.

2. TCS = 0 and TGATE = 1 (gated time accumulation).

dsPIC30F4011/4012

TABLE 11-1: TIMER4/5 REGISTER MAP

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TMR4 0114 Timer4 Register uuuu uuuu uuuu uuuu

TMR5HLD 0116 Time r5 Holding Register (For 32-bit operations only) uuuu uuuu uuuu uuuu

TMR5 0118 Timer5 Register uuuu uuuu uuuu uuuu

PR4 011A Period Regist er 4 1111 1111 1111 1111

PR5 011C Period Register 5 1111 1111 1111 1111

T4CON 011E TON —TSIDL— — — — — — TGATE TCKPS1 TCKPS0 T45 —TCS—0000 0000 0000 0000

T5CON 0120 TON —TSIDL— — — — — — TGATE TCKPS1 TCKPS0 ——TCS—0000 0000 0000 0000

Legend: u = uninitialized bit

Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for de scrip tions of register bit fields.

dsPIC30F4011/4012

12.0 INPUT CAPTURE MODULE

This section describes the input capture module and

associated operational modes. The features provided by

this module are useful in applications requiring

frequency (period) and pulse m easurement. Figure 12-1

depicts a block diagram of the input capture module.

Input capture is useful for such m odes as:

• Frequency/Period/Pulse Measurements

• Additional Sources of External Interrupts

The key operational features of the input capture

module are:

• Simple Capture Event mode

• Timer2 and Timer3 mode selection

• Interrupt on input capture event

These operating modes are determined by setting the

appropriate bits in the ICxCON register (where x = 1, 2,

..., N). The dsPIC30F4011/401 2 devices have 4 capt ure

channels.

FIGURE 12-1: INPUT CAPTURE MODE BLOCK DIAGRAM

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046). For more information on the device

instruction set and programming, refer to the “dsPIC30F/

33F Programmer’s Reference Manual” (DS70157).

Note: The dsPIC30F4011/4012 devices have

four capt ure inpu ts: IC1, IC2 , IC7 a nd IC8.

The naming of these four capture chan-

nels is intentional and preserves software

compatibility with other dsPIC Digital

Signal Controllers.

ICxBUF

Prescaler

ICx

ICM<2:0>

Mode S elect

Note: Where ‘x’ is shown, reference is made to the registers or bits associated to the respec tive input capture

channels 1 through N.

Set Flag

ICxIF

ICTMR

T2_CNT T3_CNT

Edge

Detection

Logic

Clock

Synchronizer

1, 4, 16

From Timer Module

16 16

FIFO

R/W

Logic

ICI<1:0>

ICBNE, ICOV

ICxCON Interrupt

Logic

Set Flag

ICxIF

Data Bus

dsPIC30F4011/4012

12.1 Simple Capture Event Mode

The simple capture events in the dsPIC30F product

family are:

• Capture every falling edge

• Capture every rising edge

• Capture every 4th rising edge

• Capture every 16th rising edge

• Capture every rising and falling edge

These simple Input Capture modes are configured by

setting the appropriate bits ICM<2:0> (ICxCON<2:0>).

12.1.1 CAPTURE PRESCALER

There are four input capture prescaler settings, speci-

fied by bits, ICM<2:0> (ICxCON<2:0>). Whenever the

capture c hanne l is turn ed of f, the pr escal er coun ter will

be cleared. In addition, any Reset will clear the

prescaler counter.

12.1.2 CAPTURE BUFFER OPERATION

Each capture channel has an associated FIFO buffer

which is four, 16-bit words deep. There are two status

flags which provide status on the FIFO buffer:

• ICBNE – Input Capture Buffer Not Empty

• IC OV – Input Capture Ov erfl ow

The ICBNE bit will be set on the first in put capture event

and remain set until all capture events have been read

from the FIF O. As each word is read fro m the FIFO, th e

remaining words are advanced by one position within

the buffer.

In the event that the FIFO is full with four capture

events, and a fifth capture event occurs prior to a read

of the FIFO, an overflow condition will occur and the

ICOV bit will be s et to a logic ‘1’. The fifth capture event

is lost and is not stored in the FIFO. No additional

events will be captured till all four events have been

read from the buffer.

If a FIFO read is performed after the last read and no

new capture event has been received, the read will

yield indeterminate results.

12.1.3 TIMER2 AND TIMER3 SELECTION

MODE

Each capture channel can select between one of two

timers for the time base, Timer2 or Timer3.

Selection of the timer resource is accomplished

through SFR bit, ICTMR (ICxCON<7>). Timer3 is the

default timer resource available for the input capture

module.

12.1.4 HALL SENSOR MODE

When the input capture module is set for capture on

every ed ge, risi ng and fal ling, ICM <2:0> = 001, the fol-

lowing operations are performed by the input capture

logic:

• The input capture interrupt flag is set on every

edge, rising and falling.

• The interrupt on Capture mode setting bits,

ICI<1:0>, is ignored, since every capture

generates an interrupt.

• A capture overflow condition is not generated in

this mode.

12.2 Input Capture Operation During

Sleep and Idle Modes

An input capture event will generate a device wake-up

or interrupt, if enabled, if the device is in CPU Idle or

Sleep mode.

Independent of the timer being enabled, the input

captu re module w il l wak e-u p from t he C PU Sl ee p o r I dl e

mode when a capture event occurs, if ICM<2:0> = 111

and the interrupt enable bit is asserted. The same wake-

up can generate an interrupt if the conditions for

proces sing the i nte rrupt have been sati sfied. The wak e-

up feature is useful as a method of adding extra external

pin interrupts.

12.2.1 INPUT CAPTURE IN CPU SLEEP

MODE

CPU Sleep mode allows input capture module opera-

tion with reduced functionality. In the CPU Sleep

mode, the ICI<1:0> bits are not applicable, and the

input capture module can only function as an external

interr upt so urce .

The capture module must be configured for interrupt

only on the rising edge (ICM<2:0> = 111) in order for

the input capture module to be used while the device

is in Sleep mode. The prescale settings of 4:1 or 16:1

are not applicable in this mode.

dsPIC30F4011/4012

12.2.2 INPUT CAPTURE IN CPU IDLE

MODE

CPU Idle mode allows input capture module operation

with full fun ctionality. In the CPU Idle mode, the interrupt

mode selected by the ICI<1:0> bits are applicable, as

well as the 4:1 and 16:1 capture prescale settings which

are defined by control bits ICM<2:0>. This mode

requires the selected timer to be enabled. Moreover, the

ICSIDL bit must be asserted to a logic ‘0’.

If the input capture module is defined as

ICM<2:0> = 111 in CPU Idle mode, the input capture

pin will serve only as an external interrupt pin.

12.3 Input Capture Interr upts

The inpu t captur e channe ls have the a bility to generate

an interrupt, based upon the selected number of

capture events. The selection number is set by control

bits, ICI<1:0> (ICxCON<6:5>).

Each chan nel provide s an interrupt flag (ICxI F) bit. The

respective capture channel interrupt flag is located in

the corresponding IFSx register.

Enabling an interrupt is accomplished via the respec-

tive Capture Channel Interrupt Enable (ICxIE) bit. The

capture interrupt enable bit is located in the

corresponding IECx register.

dsPIC30F4011/4012

TABLE 12-1: INPUT CAPTURE REGISTER MAP

SFR Name A ddr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

IC1BUF 0140 Input 1 Capture Register uuuu uuuu uuuu uuuu

IC1CON 0142 ——ICSIDL— — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000

IC2BUF 0144 Input 2 Capture Register uuuu uuuu uuuu uuuu

IC2CON 0146 ——ICSIDL— — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000

IC7BUF 0158 Input 7 Capture Register uuuu uuuu uuuu uuuu

IC7CON 015A ——ICSIDL— — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000

IC8BUF 015C Input 8 Capture Register uuuu uuuu uuuu uuuu

IC8CON 015E ——ICSIDL— — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000

Legend: u = uninitialized bit

Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for de scrip tions of register bit fields.

dsPIC30F4011/4012

13.0 OUTPUT COMPARE MODULE

This sec tion desc ribes the ou tput comp are modu le and

associated operational modes. The features provided

by this module are useful in applications requiring

operational modes, such as:

• Generation of Variable Width Output Pulses

• Pow er Fact or Correction

Figure 13-1 depicts a block diagram of the output

compare module.

The key operational features of the output compare

module include:

• Timer2 and Timer3 Selection mode

• Simple Output Compare Match mode

• Dual Output Compare Match mode

• Simple PWM mode

• Output Compare during Sleep and Idle modes

• Interrupt on Output Compare/PWM Event

These operating modes are determined by setting the

appropriate bits in the 16-bit OCxCON SFR (where x = 1,

2, 3, ..., N). The dsPIC30F4011/4012 devices have

4/ 2 com pare channels, respectivel y.

OCxRS and OCxR in the figure represent the Dual

Compare registers. In the Dual Compare mode, the

OCxR register is used for the f irst comp are and O CxRS

is used for the second compare.

FIGURE 13-1: OUTPUT COMPARE MODE BLOCK DIAGRAM

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046). For more information on the device

instruction set and programming, refer to the “dsPIC30F/

33F Programmer’s Reference Manual” (DS70157).

OCxR

Comparator

Output

Logic QS

OCM<2:0>

Output Enable

OCx

Set Flag bit,

OCxIF

OCxRS

Mode Select

Note: Where ‘x’ is shown, referenc e is made to the regist ers as sociat ed with the res pective output com pare channels 1

through N.

OCFA

OCTSEL 01

T2P2_MATCH

TMR2<15:0 TMR3<15:0> T3P3_MATCH

From Timer Module

(for x = 1, 2, 3 or 4)

dsPIC30F4011/4012

13.1 Timer2 and T imer3 Selection Mode

Each output compare channel can select between one

of two 16-bit timers: Ti mer2 or Timer3.

The selection of the timers is controlled by the OCTSEL

bit (OCxCON<3> ). T im er2 is the de fault ti mer reso urce

for the output compare module.

13.2 Simple Output Compare Match

Mode

When control bit s, OC M <2: 0> (O CxCO N <2 :0>) = 001,

010 or 011, the selected output compare channel is

configured for one of three simple Output Compare

Match modes:

• Compare forces I/O pin low

• Compare forces I/O pin high

• Compare toggles I/O pin

The OCxR reg is ter i s us ed in th es e m ode s. Th e O C xR

selected incrementing timer count. When a compare

occurs, o ne of these C ompare Match modes oc curs. If

the counter resets to zero before reaching the value in

OCxR, the state of the OCx pin remains unchanged.

13.3 Dual Output Compare Match Mode

When control bits, OCM<2:0> (OCxCON<2:0>) = 100

or 101, the selec ted outp ut compare chan nel is co nfig-

ured for one of two Dual Output Compa re modes which

are:

• Single Output Pulse mode

• Conti nuous Output Pulse mode

13.3.1 SIN GL E OUT P UT PULSE MOD E

For the use r to confi gure the modul e for the ge ner ation

of a single output pulse, the following steps are

required (assuming timer is off):

• Determine instruction cycle time TCY.

• Calcu la te d es ired pulse w id t h v al ue bas ed on TCY.

• Calcu late ti me to s tart pulse from ti mer st a rt valu e

of 0x0000.

• Write pulse width start and stop times into OCxR

and OCxRS Compare registers (x denotes

channel 1, 2, ..., N).

• Set Timer Period register to value equal to, or

greater than, value in OCxRS Compare register.

• Set OCM<2:0> = 100.

• Enable timer, TON (TxCON<15>) = 1.

To initiate another single pulse, issue another write to

set OCM<2:0> = 100.

13.3.2 CONTINUOUS OUTPUT PULSE

MODE

For the use r to confi gure the modul e for the ge neratio n

of a continuous stream of output pulses, the following

steps are required:

• Determine instruction cycle time TCY.

• Calculate desired pulse value based on TCY.

• Calcu late timer to st art pulse width from timer sta rt

value of 0x0000.

• Write pulse width start and stop times into OCxR

and OCxRS (x denotes channel 1, 2, ..., N)

Compare registers, respectively.

• Set Timer Period register to value equal to, or

greater than, value in OCxRS Compare register.

• Set OCM<2:0> = 101.

• Enable timer, TON (TxCON<15>) = 1.

13.4 Simple PWM Mode

When control bits, OCM<2:0> (OCxCON<2:0>) = 110

or 111, the selec ted outp ut comp are c hannel is confi g-

ured for th e PWM mode of opera tion. When co nfigured

for the PWM mode of operation, OCxR is the main l atch

(read-only) and OCxRS is the secondary latch. This

enables glitchless PWM transitions.

The user must perform the following steps in order to

configure the output compare module for PWM

operation:

1. Set the PWM pe riod by writing to the appropriate

Period register.

2. Set the PWM duty cy cle by writ ing to the OCxRS

3. Configure the output compare module for PWM

operation.

4. Set the TMRx prescale value and enable the

timer, TON (TxCON<15>) = 1.

13.4.1 INPUT PIN FAULT PROTECTION

FOR PWM

When con trol bits, OCM <2: 0> (O CxCO N<2 :0>) = 111,

the selected output compare channel is again config-

ured fo r the PWM mode of op eration with the add itional

feature of input Fault protection. While in this mode, if

a logic ‘0’ is detec ted on t he OCFA pi n, the res pecti ve

PWM output pin is placed in the high-impedance input

state . The O CFLT bit (OCxCON <4>) in dicate s wheth er

a Fault condition has occurred. This state will be

maintained until both of the following events have

occurred:

• The external Fault condition has been removed.

• The PWM mode has been re-enabled by writing

to the appropriate control bits.

dsPIC30F4011/4012

13.4.2 PWM PE RIO D

The PWM period is specified by writing to the PRx

Equation 13-1.

EQUATION 13-1: PWM PERIOD

PWM frequency is defined as 1/[PWM period].

When the selected TMRx is equal to its respective

Period regi ster, PRx, the followi ng four event s occur o n

the next i ncrement cycle:

• TMRx is clear e d.

• The OCx pin is set.

- Exception 1: If PWM duty cycle is 0x0000,

the OCx pin will r emain low.

- Exception 2: If d uty cycl e is gr eater tha n PRx,

the pin will remain high.

• The PWM duty cycle is latched from OCxRS into

OCxR.

• The corresponding timer interrupt flag is set.

See Figure 13-1 for key PWM period comparisons.

Timer3 is referred to in the figure for clarity.

FIGURE 13-1: PWM OUTPUT TIMING

13.5 Output Compare Operation During

CPU Sleep Mode

When the CPU enters the Sleep mode, all internal

clocks are stopped. Therefore, when the CPU enters

the Sleep state, the output compare channel will drive

the pin to the active state that was observed prior to

entering the CPU Sleep state.

For example, if the pin was high when the CPU

entered the Sleep state, the pin will remain high. Like-

wise, if the pin was low when the CPU entered the

Sleep state, the pin will remain low. In either case, the

output compare module will resume operation when

the device wakes up.

13.6 Output Compare Operation During

CPU Idle Mode

When the CPU enters the Idle mode, the output

compare module can operate with full functionality.

The output compare channel will operate during the

CPU Idle m ode if th e O CSID L bi t (O CxCO N<13 >) is at

logic ‘0’ and t he selected tim e b ase (Timer2 or Timer3)

is enabled and the TSIDL bit of the selected timer is

set to logic ‘0’.

13.7 Output Compare Interrupts

The outpu t comp are channels have the abil ity to gener-

ate an interrupt on a compare match for whichever

Match mode has been selected.

For all m odes exc ept the PWM mode, when a comp are

event occurs, the respective interrupt flag (OCxIF) is

asserted and an interrupt will be generated if enabled.

The OCx IF bit is located in the corresp onding IFSx reg-

ister, and must be cleared in software. The interrupt is

enabled via the respective Compare Interrupt Enable

(OCxIE) b it, locat ed in th e corresp onding IE Cx register.

For the PWM mode, when a n event occurs, the respec-

tive Timer Interrupt Flag (T2IF or T3 IF) i s a sserte d an d

an interru pt will be gen erated if enable d. The TxIF bit is

located in the IFS0 register and must be cleared in

software. The interrupt is enabled via the respective

Timer Interrupt Enable bit (T2IE or T3IE) located in the

IEC0 register. The output compare interrupt flag is

never set during the PWM mode of operati on.

PWM period = [(PRx) + 1] • 4 • TOSC •

(TMRx prescale value)

Period

Duty Cycle

TMR3 = Duty Cycle (OCxR) TMR3 = Duty Cycle (OCxR)

TMR3 = PR3

T3IF = 1

(Inte rru pt Flag )

OCxR = OCxRS

TMR3 = PR3

(Interrupt Flag)

OCxR = OCxRS

T3IF = 1

dsPIC30F4011/4012

TABLE 13-1: OUTPUT COMPARE REGISTER MAP

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

OC1RS 0180 Output Compare 1 Secondary Register 0000 0000 0000 0000

OC1R 0182 Output Compare 1 Main Register 0000 0000 0000 0000

OC1CON 0184 ——OCSIDL— — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000

OC2RS 0186 Output Compare 2 Secondary Register 0000 0000 0000 0000

OC2R 0188 Output Compare 2 Main Register 0000 0000 0000 0000

OC2CON 018A ——OCSIDL— — — — — — — — OCFLT OCTSE OCM<2:0> 0000 0000 0000 0000

OC3RS* 018C Output Compare 3 Secondary Register 0000 0000 0000 0000

OC3R* 018E Output Compare 3 Main Register 0000 0000 0000 0000

OC3CON* 0190 ——OCSIDL— — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000

OC4RS* 0192 Output Compare 4 Secondary Register 0000 0000 0000 0000

OC4R* 0194 Output Compare 4 Main Register 0000 0000 0000 0000

OC4CON* 0196 ——OCSIDL— — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000

Legend: u = uninitialized bit

* Not avail able on dsPIC30F4012.

Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for de scrip tions of register bit fields.

dsPIC30F4011/4012

14.0 QUADRATURE ENCODER

INTERFACE (QEI) MODULE

This section describes the Quadrature Encoder Inter-

face (QEI) module and associated operational modes.

The QEI module provides the interface to incremental

encoders for obtaining mechanical position data.

The operational features of the QEI include:

• Three input channels for two phase signals and

index pulse

• 16-bit up/down position counter

• Count direction status

• Position Measurement (x2 and x4) mode

• Programmable digital noise filters on inputs

• Alternate 16-bit Timer/Counter mode

• Quadrature Encoder Interface interrupts

These operating modes are determined by setting the

appropriate bits QEIM<2:0> (QEICON<10:8>).

Figure 14-1 depicts the Quadrature Encoder Interface

block dia gram .

FIGU RE 14-1: QUAD RATU RE ENCO DER IN TERF ACE BL OCK DIAGRA M

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046). For more information on the device

instruction set and programming, refer to the “dsPIC30F/

33F Programmer’s Reference Manual” (DS70157).

16-bit Up/Down Counter

Comparator/

Max Count Register

Quadrature

Programmable

Digital Filter

QEA

Programmable

Digital Filter

INDX

Up/Down

Encoder

Programmable

Digital Filter

QEB

Interface Logic

QEIM<2:0>

Mode Select

(POSCNT)

(MAXCNT)

QEIIF

Event

Flag

Reset

Equal

TCY

TQCS TQCKPS<1:0>

1, 8, 64, 256

Prescaler

TQGATE

QEIM<2:0>

Synchronize

Det

Sleep Input

UPDN_SRC

QEICON<11> Zero Detect

Note: In dsPIC30F4011/4012, the UPDN pin is not available. Up/Down logic bit can still be polled by software.

dsPIC30F4011/4012

14.1 Quadrature Encoder Interface

Logic

A typica l, increment al (a.k.a. opt ical) encoder has three

outputs: Phase A, Phase B and an index pulse. These

signals are useful and often required in position and

speed control of ACIM and SR motors.

The two chann els, Phase A (QEA) and Phase B (QEB),

have a unique relationship. If Phase A leads Phase B,

then the direction (of the motor) is deemed positive or

forward. If Phase A lags Phase B, then the direction (of

the motor) is deemed negative or reverse.

A third channel, termed index pulse, occurs once per

revolution and is used as a reference to establish an

absolute position. The index pulse coincides with

Phase A and Phase B, both low.

14.2 16-bit Up/Down Position Counter

Mode

The 16-bit Up/Down Counter counts up or down on

ever y count pulse, w hich is generat ed by t he dif ference

of the Phase A and Phase B input signals. The counter

acts as an integrato r , wh ose cou nt value is proporti onal

to position. The direction of the count is determined by

the UPDN signal which is gene rated by th e Quadratu re

Encoder Interface Logic.

14.2.1 POSITION COUNTER ERROR

CHECKING

Position counter error checking in the QEI is provided

for and indicated by the CNTERR bit (QEICON<15>).

The error checking only applies when the position

counter is configured for Reset on the Index Pulse

modes (QEIM<2:0> = 110 or 100). In these modes, the

contents of the POSCNT register are compared with

the values (0xFFFF or MAXCNT + 1, depending on

direction). If these values are detected, an error condi-

tion is ge nera t ed by setti ng the CNTERR bi t a nd a Q EI

count error interrupt is generated. The QEI count error

interrupt can be disabled by setting the CEID bit

(DFLTCON<8>). The position counter continues to

count enc oder edg es after an err or has been detected.

The POSCNT register continue s to count up/do wn until

a natural rollover/underflow. No interrupt is generated

for the natural rollover/underflow event. The CNTERR

bit is a read/write bit and reset in software by the user.

14.2.2 POSITION COUNTER RESET

The Position Counter Reset Enable bit, POSRES

(QEICON<2>) controls whether the position counter is

reset when the index pulse is detected. This bit is only

applicable when QEIM<2:0> = 100 or 110.

If the POSRES bit is se t to ‘1’, then the posi tion count er

is reset when the index pulse is detected. If the

POSRES bit is set to ‘0’, then the position counter is not

reset when the index pulse is detected. The position

counter will continue counting up or down and will be

reset on the rollover or underflow condition.

When selecting the INDX signal to reset the position

counter (POSCNT), the user has to specify the states

on the QEA and QEB input pins. These states have to

be match ed in order for a Reset to occ ur. These st ate s

are selected by the IMV<1:0> bits (DFLTCON<10:9>).

The Index Match Value bits (IMV<1:0>) allow the user

to specify the state of the QEA and QEB input pins,

during a n inde x pulse, when t he POSCNT regist er is to

be reset.

In 4x Quadrature Count mode:

IMV1 = Required state of Phase B input signal for

match on index pulse

IMV0 = Required state of Phase A input signal for

match on index pulse

In 2x Quadrature Count mode:

IMV1 = Selects phase input signal for index state

match (0 = Phase A, 1 = Phase B)

IMV0 = Required state of the selected phase input

signal for mat ch on ind ex pulse

The interrupt is still generated on the detection of the

index pulse and not on the position counter overflow/

underflow.

14.2.3 COUNT DIRECTION STATUS

As mentioned in the previous section, the QEI logic

generates an UPDN signal, based upon the relation-

ship between Phase A and Phase B. In addition to the

output pin, the state of this internal UPDN signal is

supplied to an SFR bit, UPDN (QEICON<11>), as a

read-on ly bit.

Note: QEI pins are multiplexed with analog

inputs. The user must insure that all QEI

associated pins are set as digital inputs in

the ADPCFG register.

dsPIC30F4011/4012

14.3 Position Measurement Mode

There are two Measurement modes which are sup-

ported and are termed x2 and x4. These modes are

selected by the QEIM<2:0> (QEICON<10:8>) mode

select bits.

When control bits, QEIM<2:0> = 100 or 101, the x2

Measurement mode is selected and the QEI logic only

looks at the Phase A input for the position counter

increment rate. Every rising and falling edge of the

Phase A s ignal caus es the po sition c ounter to b e incre-

mented or decremented. The Phase B signal is still

utilized for the determination of the counter direction

just as in the x4 mode.

Within the x2 Measurement mode, there are two

variations of how the position counter is reset:

1. Position counter reset by detection of index

pulse, QEI M<2 :0> = 100.

2. Position counter reset by match with MAXCNT,

QEIM<2:0> = 101.

When control bits, QEIM<2:0> = 110 or 111, the x4

Measur ement mode i s selected and the QE I logic looks

at both edges of the Phase A and Phase B input sig-

nals. Every edge of both signals causes the position

counter to increment or decrement.

Within the x4 Measurement mode, there are two

variations of how the position counter is reset:

1. Position counter reset by detection of index

pulse, QEI M<2 :0> = 110.

2. Position counter reset by match with MAXCNT,

QEIM<2:0> = 111.

The x4 Measurement mode provides for finer resolu-

tion data (more position counts) for determining motor

position.

14.4 Programmable Digital Noise

Filters

The digital noise filter section is responsible for reject-

ing noise on the incoming capture or quadrature

signals. Schmitt Trigger inputs and a three-clock cycle

delay filter combine to reject low-level noise and large,

short d uration, n oise s pikes t hat typical ly occ ur in n oise

prone applications, such as a motor system.

The filter ensures that the filtered output signal is not

permitted to change until a stable value has been

registered for three consecutive clock cycles.

For the QEA, QEB and INDX pins, the clock divide

frequency for the digital filter is programmed by bits

QECK<2:0> (DFLTCON<6:4>) and are derived from

the base instruction cycle TCY.

To enable the filter output for channels QEA, QEB and

INDX, the QEOUT bit must be ‘1’ . The f ilt er netwo rk for

all channels is disabled on POR and BOR.

14.5 Alternate 16-bit Timer/Counter

When the QEI module is not configured for the QEI

mode, QEIM<2:0> = 001, the module can be config-

ured as a simple 16-bit timer/counter. The setup and

control of the auxiliary timer is accomplished through

the QEICON SFR register. This timer functions identi-

cally to T ime r1. The QEA pi n is used as the timer cl ock

input.

When configured as a timer, the POSCNT register

serves as the Timer Count register and the MAXCNT

Period re gis ter m atc h occ urs, the Q EI i nte rrup t fl ag wil l

be asserted.

The only exception between the general purpose tim-

ers and this timer is the added feature of external up/

down input select. When the UPDN pin is asserted

high, the timer will increment up. When the UPDN pin

is asserted low, the timer will be decremented .

The UPDN control/status bit (QEICON<11>) can be

used to select the count direction state of the Timer

UPDN = 0, the timer will count down.

In addition, control bit, UPDN_SRC (QEICON<0>),

determines whether the timer count direction state is

based on the logic state written into the UPDN control/

status bit (QEICON<11>) or the QEB pin state. When

UPDN_SRC = 1, the timer coun t dire ct ion is co ntro lle d

from the QEB pin. Likewise, when UPDN_SRC = 0, the

timer count direction is controlled by the UPDN bit.

14.6 QEI Module Operation During CPU

Sleep Mode

14.6.1 QEI OPERATION DURING CPU

SLEE P MOD E

The QEI module will be halted during the CPU Sleep

mode.

14.6.2 TIMER OPERATION DURING CPU

SLEE P MOD E

During CPU Sleep mode, the timer will not operate

because the internal clocks are disabled.

Note: Changing the operational mode (i.e., from

QEI to timer or vice versa) will not af fect the

Timer/Position Count register content s .

Note: This timer does not support the External

Asynchronous Counter mode of operation.

If using an exte rnal cloc k sourc e, the cl ock

will automatically be synchronized to the

internal instruction cycle.

dsPIC30F4011/4012

14.7 QEI Module Operation During CPU

Idle Mode

Since the QEI module can function as a quadrature

encoder interface, or as a 16-bit timer, the following

section describes operation of the module in both

modes.

14.7.1 QEI OPERATION DURING CPU IDLE

MODE

When the CPU is placed i n the Idle m ode, the Q EI mod-

ule will operate if the QEISIDL bit (QEICON<13>) = 0.

This bit defaults to a logic ‘0’ upon executing POR and

BOR. For halting the QEI module during the CPU Idle

mode, QEISIDL should be set to ‘1’.

14.7.2 TIMER OPERATION DURING CPU

IDLE MODE

When the CPU is placed in the Idle mode and the QEI

module is configured in the 16-bit Timer mode, the

16-bit timer will operate if the QEISIDL bit

(QEICON<13>) = 0. This bit defaults to a logic ‘0’ upon

execut ing POR a nd BO R. F or halting the ti me r mo dul e

during the CPU Idle mode, QEISIDL should be set

to ‘1’.

If the QEISIDL bit is cleared, the timer will function

normally as if the CPU Idle mode had not been

entered.

14.8 Quadrature Encoder Interface

Interrupts

The quadrature encoder interface has the ability to

generate an interrupt on occurrence of the following

events:

• Inter rupt on 16-bit up/down position counter

rollover/underflow

• Detection of qualified index pulse or if CNTERR

bit is set

• Timer period match event (overflow/underflow)

• Gate accumulation event

The QEI Interrupt Flag bit, QEIIF, is asserted upon

occurrence of any of the above events. The QEIIF bit

must be cleared in software. QEIIF is located in the

IFS2 register.

Enabling an interrupt is accomplished via the respec-

tive Enable bit, QEIIE. The QEIIE bit is located in the

IEC2 register.

dsPIC30F4011/4012

TABLE 14-1: QEI REGISTER MAP

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

QEICON 0122 CNTERR — QEISIDL INDX UPDN QEIM2 QEIM1 QEIM0 SWPAB — TQGATE TQCKPS1 TQCKPS0 POSRES TQCS UPDN_SRC 0000 0000 0000 0000

DFLTCON 0124 — — — — — IMV1 IMV0 CEID QEOUT QECK2 QECK1 QECK0 — — — — 0000 0000 0000 0000

POSCNT 0126 Position Counter<15:0> 0000 0000 0000 0000

MAXCNT 0128 Maximun Count<15:0> 1111 1111 1111 1111

ADPCFG 02A8 — — — — — — — PCFG8 PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000 0000 0000 0000

Legend: u = uninitialized bit

Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for de scrip tions of register bit fields.

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

15.0 MOTOR CONTROL PWM

MODULE

This module simplifies the task of generating multiple,

synchronized Pulse-Width Modulated (PWM) outputs.

In particular, the following power and motion control

applications are supported by the PWM module:

• Three-Phase AC Induction Motor

• Switched Reluctance (SR) Motor

• Brushless DC (BLDC) Motor

• Uninterruptible Power Supply (UPS)

The PWM module has the following features:

• 6 PWM I/O pins with 3 duty cycle generators

• Up to 16-bit resolution

• ‘On-the-Fly’ PWM frequency changes

• Edge and Center-Aligned Output modes

• Single Pulse Generation mode

• Interrupt support for asymmetrical updates in

Center-Aligned mode

• Output override control for Electrically

Commutative Motor (ECM) operation

• ‘Special Event’ comparator for scheduling other

peripheral events

• Fault pins to optionally drive each of the PWM

output pins to a defined state

This module contains 3 duty cycle generators, num-

bered 1 through 3. The modul e has 6 PW M output p ins,

numbere d PWM1 H/PWM 1L throu gh PWM 3H/PWM3 L.

The six I/O pins are grouped into high/low numbered

pairs, denoted by the suffix H or L, respectively. For

complementary loads, the low PWM pins are always

the complement of the corresponding high I/O pin.

The PWM module allows several modes of operation

which are beneficial for specific power control

applications.

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046). For more information on the device

instruction set and programming, refer to the “dsPIC30F/

33F Programmer’s Reference Manual” (DS70157).

dsPIC30F4011/4012

FIGURE 15-1: PWM MO DULE BLOCK DIAGRAM

PDC3

PDC3 Buffer

PWMCON1

PWMCON2

PTPER

PTMR

Comparator

Channel 3 Dead-Time

Generator and

PTCON

SEVTCMP

Comparator Special Event Trigger

OVDCON

PWM Enable and Mode SFRs

PWM Manual

Control SF R

Channel 2 Dead-Time

Generator and

Channel 1 Dead-Time

Generator and

PWM Generator

PWM Generator #3

SEVTDIR

PTDIR

DTCON1 Dead-Time Control SFRs

Special Event

Postscaler

PWM1L

PWM1H

PWM2L

PWM2H

Note: Details of PWM Generator #1 and #2 not shown for clarity.

16-bit Data Bus

PWM3L

PWM3H

FLTACON Fault Pin Control SFRs

PWM Time Base

Output

Driver

Block

FLTA

Override Logic

PTPER Buffer

dsPIC30F4011/4012

15.1 PWM Time Base

The PWM time base is provided by a 15-bit timer with

a pr escaler and postsc aler . The time base is acce ssible

via the PTMR SFR. PTMR<15> is a read-only status

bit, P TDIR, tha t indic ates th e present c ount dir ection of

the PWM time base. If PTDIR is cleared, PTMR is

counting upwards. If PTDIR is set, PTMR is counting

downwards. The PWM time base is configured via the

PTCON SFR. The time base is enabled/disabled by

setting/clearing the PTEN bit in the PTCON SFR.

PTMR is not cleared when the PTEN bit is cleared in

software.

The PTPER SFR sets the counting period for PTMR.

The user must write a 15-bit value to PTPER<14:0>.

When the value in PTMR<14:0> matches the value in

PTPER<14:0>, the time base will either reset to ‘0’, or

reverse the count direction on the next occurring clock

cycle. The action taken depends on the operating

mode of the time base.

The PWM time base can be configured fo r four different

modes of opera tion:

• Free-Running mode

• Single-Shot mode

• Continuous Up/Down Count mode

• Continuous Up/Down Count mode with interrupts

for double updates

These four modes are selected by the PTMOD<1:0>

bits in the PTCON SFR. The Continuous Up/Down

Count mo des support cente r-aligned PWM generation.

The Single-S hot mode allows the PWM mo dule to sup-

port pul se contro l of cert ain Electroni cally Comm utativ e

Motors (ECMs).

The interrupt sig nal s ge nerated by the PWM t im e bas e

depend on the mode sele ction bit s (P TMOD<1:0>) and

the post sca ler bit s (P T OPS <3:0>) in the PT CON SFR.

15.1.1 FREE-RUNNING MODE

In the Free-Runni ng mo de , the PWM tim e bas e counts

upwards until the value in the Time Base Period regis-

ter (P TPER) is match ed. The P TMR regi ster is reset o n

the following input clock edge and the time base will

continue to count upwards as long as the PTEN bit

remains set.

When the PWM time base i s in the Free-Run ning mode

(PTMOD<1:0> = 00), an interrupt event is generated

each tim e a m atch wi th the P TPER reg ister o ccurs an d

the PTMR register is reset to zero. The postscaler

selectio n bi ts m ay b e us ed i n thi s mode of th e timer t o

reduce the frequency of the interrupt events.

15.1.2 SINGLE-SHOT MODE

In the Single-Shot mode, the PWM time base begins

counting upwards when the PTEN bit is set. When the

value in the PTMR register matches the PTPER regis-

ter, the PTMR register will be reset on the following

input cl ock edge and the P TEN bit will be cleared by the

hardware to halt the time base.

When the PWM time base is in the Single-Shot mode

(PTMOD<1:0> = 01), an interrupt event is generated

when a match with the PTPER register occurs, the

PTMR register is reset to zero on the following input

clock edge and the PT EN bit is cleared. The postsc aler

selection bits have no effect in this mode of the timer.

15.1.3 CONTINUOUS UP/DOWN COUNT

MODES

In the Continuous Up/Down Count modes, the PWM

time bas e count s upwar ds until th e value in the PTPER

downwards on the following input clock edge. The

PTDIR bit in the PTMR SFR is read-only and indicates

the counting direction. The PTDIR bit is set when the

timer counts downwards.

In the Continuous Up/Down Count mode

(PTMOD<1:0> = 10), an interrupt event is generated

each time the value of the PTMR register becomes

zero and the PW M tim e bas e begi ns to count upw ards.

The postscaler selection bits may be used in this mode

of the timer to reduce the frequency of the interrupt

events.

Note: If the Period register is set to 0x0000, the

timer will stop counting, and the interrupt

and sp ecial ev ent trigge r will n ot be gen er-

ated even if the special eve nt value is als o

0x0000. The module will not update the

Period register if it is already at 0x0000;

therefore, the user must disable the

module in order to update the Period

dsPIC30F4011/4012

15.1.4 DOUBLE UPDATE MODE

In the Double Update mode (PTMOD<1:0> = 11), an

inter rupt event is generated each time the PTM R regis-

ter is eq ual to zero, as well as each time a pe riod match

occur s. Th e postsc aler se lecti on bits ha ve no effect in

this mode of the timer.

The Do uble Update mo de provides two addition al func-

tions to the user. First, the control loop bandwidth is

doubled because the PWM duty cycles can be

updated, twice per period. Second, asymmetrical

center-aligned PWM waveforms can be generated

which are useful for minimizing output waveform

distortion in certain motor control applications.

15.1.5 PW M TIME BA SE PRES CA LER

The input clock to PTMR (FOSC/4) has prescaler

options of 1:1, 1:4, 1:16 or 1:64, selected by control

bits , PTCKPS<1 :0>, in the PTCON SFR. The prescal er

counter is cleared when any of the following occurs:

• a write to the PTMR register

• a write to the PTCON register

• any devic e Re se t

The PTMR register is not cleared when PTCON is

written.

15.1.6 PWM TIME BASE POSTSCALER

The match output of PTMR can optionally be post-

scaled through a 4-bit postscaler (which gives a 1:1 to

1:16 sc ali ng ).

The postscaler counter is cleared when any of the

following occurs:

• a write to the PTMR register

• a write to the PTCON register

• any devic e Re se t

The PTMR register is not cleared when PTCON is written.

15.2 PWM Period

PTPER is a 15-bit register and is used to set the

counting period for the PWM time base. PTPER is a

double-buffered register. The PTPER buffer contents

are loaded into the PTPER register at the following

instants:

•Free

-Running and Single-Shot modes: When the

PTMR register is reset to zero after a match with

the PTPER register.

• Continuous Up/Down Count modes: When the

PTMR register is zero.

The value held in the PTPER buffer is automatically

loaded into the PTPER register when the PWM time

base is disabled (PTEN = 0).

The PWM period can be determined using

Equation 15-1:

EQUATION 15-1: PWM PERIOD

If the PWM time base is configured for one of the

Contin uous Up/Down C ount modes , the PWM perio d is

provided by Equation 15-2.

EQUATION 15-2: PWM PERIOD

(CENTER-ALIGNED

MODE)

The maximum resolution (in bits) for a given device

oscillator and PWM frequency can be determined using

Equation 15-3:

EQUATION 15-3: PWM RESOLUTION

Note: Programming a value of 0x0001 in the

Period register could generate a continu-

ous interrupt pulse, and hence, must be

avoided.

TPWM = TCY • (P TPER + 1)

(PTMR Prescale Val ue)

TPWM = 2 TCY • PTPER + 0.75

(PTMR Prescale Value)

Resolution = log (2 • TPWM/TCY)

log (2)

dsPIC30F4011/4012

15.3 Edge-Aligned PWM

Edge-aligned PWM signals are produced by the module

when the PWM time base is in the Free-Running or

Single-Shot mode. For edge-aligned PWM outputs, the

output has a period specified by the value in PTPER

and a duty cycle specified by the appropriate duty cycle

active at the beginning of the period (PTMR = 0) and is

driven inactive when the value in the duty cycle register

matches PTMR.

If the value in a particular duty cycle register is zero,

then the output on the corresponding PWM pin will be

inactiv e for the en tire PWM p erio d. In add iti on, the out-

put on the PWM pin will be active for the entire PWM

period if the value in the duty cycle register is greater

than the value held in the PTPER register.

FIGUR E 15-2: EDG E -A LI GN ED PW M

15.4 Center-Aligned PWM

Center-aligned PWM signals are produced by the

module when the PWM time base is configured in a

Continuous Up/Down Count mode (see Figure 15-3).

The PWM compare output is driven to the active state

when the value of the duty cycle register matches the

value of PTMR and the PWM time base is counting

downwards (PTDIR = 1). The P W M compa r e o utp ut is

drive n to the inacti ve st ate w hen th e PWM ti me bas e is

counting upwards (PTDIR = 0) and the value in the

PTMR register matches the duty cycle value.

If the value in a particular duty cycle register is zero,

then the output on the corresponding PWM pin will be

inactiv e for the entire PWM period. In additi on, the out-

put on the PWM pin will be active for the entire PWM

period if the value in the duty cycle register is equal to

the value held in the PTPER register.

FIGURE 15-3: CENTER-ALIGNED PWM

Period

Duty Cycle

PTPER

PTMR

Value

New Duty Cycle Latched

PTPER PTMR

Value

Period

Period/2

Duty

Cycle

dsPIC30F4011/4012

15.5 PWM Duty Cycle Comparison

Units

There are three 16-bit Special Function Registers

(PDC1, PDC2 and PDC3) used to specify duty cycle

values for the PWM module.

The value in each duty cycle register determines the

amount of time that the PWM output is in the active

state. The duty cycle registers are 16-bits wide. The

LSb of a duty cycle register determines whether the

PWM edge occurs in the beginning. Thus, the PWM

resolution is effectively doubled.

15.5.1 DUTY CYCLE REGISTER BUFFERS

The three PWM duty cycle registers are double-

buffered to allow glitchless updates of the PWM

outputs. For each duty cycle, there is a duty cycle

duty cy cl e register that ho lds the actual compare v alu e

used in the present PWM period.

For edge-aligned PWM output, a new duty cycle value

will b e updated whene ver a match with the PTPER reg-

ister occurs and PTMR is reset. The contents of the

duty cycle buffers are automatically loaded into the

duty cycle registers when the PWM time base is dis-

abled (PTEN = 0) and the UDIS bit is cleared in

PWMCON2.

When the PWM time base is in the Continuous Up/

Down Co unt mode, new duty cycl e values are update d

when the value of the PTMR register is zero and the

PWM time base begins to count upwards. The contents

of the duty cycle buffers are automatically loaded into

the duty cycle registers when the PWM time base is

disabled (PTEN = 0).

When the PWM time base is in the Continuous Up/

Down Count mode with double updates, new duty cycle

values are up dated when the va lue of the PTMR re gi s-

ter is zero, and when the value of the PTMR register

matche s the value in the PTPER register. The content s

of the duty cycle buffers are automatically loaded into

the duty cycle registers when the PWM time base is

disabled (PTEN = 0).

15.6 Complementary PWM Operation

In the Complementary mode of operation, each pair of

PWM outputs is obtained by a complementary PWM

signal. A dead time may be optionally inserted during

device switching when both outputs are inactive for

a short period (refer to Section 15.7 “Dead-Time

Generators”).

In Complementary mode, the duty cycle comparison

units are assigned to the PWM outputs as follows:

• PDC1 register controls PWM1H/PWM1L outputs

• PDC2 register controls PWM2H/PWM2L outputs

• PDC3 register controls PWM3H/PWM3L outputs

The Complementary mode is selected for each PWM

I/O pin pair by cle aring the appropr iate PTMODx bit i n

the PWMCON1 SFR. The PWM I/O pins are set to

Complementary mode by default upon a device Reset.

15.7 Dead-Time Generators

Dead-time generation may be provided when any of

the PWM I/O pin pairs are operating in the

Complementary Output mode. The PWM outputs use

push-pu ll drive circuit s. Due to the inabil ity of the power

outpu t devices t o switch i nstant aneously, so me amount

of time must be provided between the turn-off event

of one PWM output in a complementary pair and the

turn-on event of the other transistor.

The PWM module allows t wo dif ferent dead tim es to be

programmed. These two dead times may be used in

one of two methods described below to increase user

flexibility:

• The PWM output signals can be optimized for

different turn-off times in the high side and low

side transistors in a complementary pair of tran-

sistors. The first dead time is inserted between

the turn-off event of the lower transistor of the

complementary pair and the turn-on event of the

upper tran sistor . Th e second dead time is inserte d

between the turn-off event of the upper transistor

and the turn-on event of the lower transistor.

• The two d ead tim es can be assig ne d to i ndi vi dua l

PWM I/O pin pairs. This operating mode allows

the PWM module to drive different transistor/load

combin ati ons w ith ea ch co mp lem en tary PWM I/O

pin pair.

dsPIC30F4011/4012

15.7.1 DEAD-TIME GENERATORS

Each complementary output pair for the PWM module

has a 6-bit down counter that is used to produce the

dead-time insertion. As shown in Figure 15-4, each

dead-time unit has a rising and falling edge detector

connected to the duty cycle comparison output.

15.7.2 DEAD-TIME RANGES

The amount of dead time provided by the dead-time

unit is selected by specifying the input clock prescaler

value and a 6-bit unsigned value.

Four input clock prescaler selections have been

provided to allow a suitable range of dead time based

on the device operating frequency. The dead-time

clock prescaler values are selected using the

DTAPS<1:0> control bits in the DTCON1 SFR. One of

four clock prescaler options (TCY, 2 TCY, 4 TCY or 8 TCY)

may be select ed.

After the prescaler value is selected, the dead time is

adjusted by loading 6-bit unsigned values into the

DTCON1 SFR.

The dead-ti me unit prescaler is cleared on the following

events:

• On a load of the down timer due to a duty cycle

comparison edge event.

• On a write to the DTCON1 register.

• On any device Reset.

FIGURE 15-4: DEAD-TIME TIMING DIAGRAM

Note: The user should not modify the DTCON1

value while the PWM module is operating

(PTEN = 1). Unexpected results may

occur.

Duty Cycle Generator

PWMxH

PWMxL

Dead-Time A (Active) Dead-Time A (Inactive)

dsPIC30F4011/4012

15.8 Independent PWM Output

An Independent PWM Output mode is required for

driving certain types of loads. A particular PWM output

pair is in the Independent Output mode when the

corr es pon di n g PT M ODx bi t i n th e P WMC O N1 r e gi ste r

is set. No dead-time control is implemented between

adjac ent PWM I /O pins when th e module is ope rat ing

in the Independent Output mode and both I/O pins are

allowed to be active simultaneously.

In the Independent Output mode, each duty cycle

generator is connected to both of the PWM I/O pins in

an output pair. By using the associated duty cycle reg-

ister and the appropriate bits in the OVDCON register,

the user may select the following signal output options

for each PWM I/O pin operating in the Independent

Output mode:

• I/O pin outputs PWM signal

• I/O pi n inactive

• I/O pin active

15.9 Single Pulse PWM Operation

The PWM m odule pr odu ce s si ngle pulse outputs w he n

the PTCON control bits, PTMOD<1:0> = 10. Only

edge-aligned outputs may be produced in the Single

Pulse mo de. In Single Pu lse mode, th e PWM I/O pin( s)

are driven to the active state when the PTEN bit is set.

When a match with a duty cycle register occurs, the

PWM I/O pin is driven to the inactive state. When a

match with the PTPER register occurs, the PTMR reg-

ister is cleared, all active PWM I/O pins are driven to

the inactive state, the PTEN bit is cleared and an

interrupt is generated.

15.10 PWM Output Override

The PWM output override bits allow the user to manu-

ally drive the PWM I/O pins to specified logic states,

independent of the duty cycle comparison units.

All control bits associated with the PWM output over-

ride function are contained in the OVDCON register.

The upper half of the OVDCON register contains six

bits , POVDxH<3:1> and POVDxL<3 :1>, that de termine

which PWM I/O pins will be overridden. The lower half

of the OVDCON register contains six bits,

POUTxH<3:1> and POUTxL<3:1>, that determine the

state of the PWM I/O pins when a particular output is

overridden via the POVD bits.

15.10.1 COMPLEMENTARY OUTPUT MODE

When a PWMxL pin is driven active via the OVDCON

ment of the corresponding PWMxH pin in the pair.

Dead-time insertion is still performed when PWM

channel s are overridden manu all y.

15.10.2 OVERRIDE SYNCHRONIZATION

If the OSYNC bit in the PWMCON2 register is set, all

output overrides performed via the OVDCON register

are sync hro ni zed to the PWM tim e b ase. Sy nc hron ou s

output overrides occur at the following times:

• Edge-Aligned mode when PTMR is zero.

• Center-Aligned modes when PTMR is zero and

when the value of PTMR matches PTPER.

dsPIC30F4011/4012

15.11 PWM Output and Polarity Control

There are three device Configuration bits associated

with the PWM module that provide PWM output pin

control:

• HPOL Configuration bit

• LPOL Configuration bit

• PWMPIN Configuration bit

These th ree b its in the F P ORBO R C on figu r ati on re gi s-

ter (see Section 21.0 “System Integration”) work in

conjunction with the six PWM Enable bits (PENxL and

PENxH). The C onfiguration bits and PWM Enable bits

ensure that the PWM pins are in the correct states after

a device Reset occurs. The PWMPIN Configuration

fuse allows the PWM module outputs to be optionally

enabled on a device Reset. If PWMPIN = 0, the PWM

output s wi ll be dr iven to thei r inactive st ates at Rese t. If

PWMPIN = 1 (default), the PWM outputs will be tri-

stated. The HPOL bit specifies the polarity for the

PWMxH outputs, whereas the LPOL bit specifies the

polarity for the PWMxL outputs.

15.11.1 OUTPUT PIN CONTROL

The PEN<3:1>H and PEN<3:1>L control bits in the

PWMCON1 SFR enable each high PWM output pin

and each low PWM output pin, respectively. If a partic-

ular PWM output pin is not enabled, it is treated as a

general purpose I/O pin.

15.12 PWM Fault Pin

There is one Fau lt pin (FLTA) associated with the PWM

module. When asserted, these pins can optionally drive

each of the PWM I/O pins to a defined state.

15.12.1 FAULT PIN ENABLE BITS

The FLTACON SFR has 3 control bits that determine

whether a particular pair of PWM I/O pins is to be

controlled by the Fault input pin. To enable a

specific PWM I/O pin pair for Fault overrides, the

corresponding bit should be set in the FLTACON

If all enable bits are cleared in the FLTACON register,

then the correspo ndi ng Fau lt i nput pin has no effect o n

the PWM module and the pin may be used as a genera l

purpose interrupt or I/O pin.

15.12.2 FAULT STATES

The FLTACON Special Function Register has 6 bits

that determ ine the s tate of ea ch PWM I/O pin when it i s

overridden by a Fault input. When these bits are

cleared , the PW M I/O pin is dri ven to the inact ive s tat e.

If the bit is set, the PWM I/O pin will be driven to the

active state. The active and inactive states are refer-

enced to the polarity defined for each PWM I/O pin

(HPOL and LPOL polarity control bits).

A special case exists when a PWM module I/O pair is

in the Complementary mode and both pins are

programmed to be active on a Fault condition. The

PWMxH pin always has priority in the Complementary

mode, so that both I/O pins cannot be driven active

simultaneously.

15.12.3 FAULT INPUT MODES

The Fault input pin has two modes of operation:

•Latched Mode: When the Fault pin is driven low,

the PWM outputs will go to the states defined in

the FLTACON register. The PWM outputs will

remain in this state until the Fault pin is driven

high and the corresponding interrupt flag has

been cleared in software. When both of these

actions have occurred, the PWM outputs will

return to normal operation at the beginning of the

next PWM cycle or half-cycle boundary. If the

interrupt flag is cleared before the Fault condition

ends, th e PWM m odule will w ait unti l the F ault pi n

is no longer as sert ed to r estore the out puts.

•Cycle-by-Cycle Mode: When the Fault input pin

is driven low, the PWM outputs remain in the

defined Fault states for as long as the Fault pin is

held low. After the Fault pin is driven high, the

PWM outputs return to normal operation at the

beginning of the following PWM cycle or

half-cycle boundary.

The operating mode for the Fault input pin is selected

using the FLTAM control bit in the FLTACON Special

Function Regi ster.

The Fault pin can be controlled manually in software.

Note: The Fault pin logic can operate indepen-

dent of the PWM logic. If al l the enable bit s

in the FL TACON register are cleared, then

the Fault pin could be used as a general

purpose interrupt pin. The Fault pin has an

interrupt vector, interrupt flag bit and

interrupt priority bits associated with it.

dsPIC30F4011/4012

15.13 PWM Up date Lockout

For a comple x PWM appl ica tion, the user may nee d to

write up to three duty cycl e registers and the T ime Base

Period register, PTPER, at a given ti me . In some appl i-

cations , it is importan t that all buf fer registers be wr itten

befor e the new duty cycle and p eriod values are loaded

for use by the module.

The PWM update lockout feature is enabled by setting

the UDIS c ontro l bi t in the PW MC ON 2 SFR. The UDIS

bit affects all duty cycle buffer registers and the PWM

Time Base Period buffer, PTPER. No duty cycle

change s or period value changes wi ll h av e effect while

UDIS = 1.

15.14 PWM Special Event Tr igger

The PWM module has a special event trigger that

allows A/D conversions to be synchronized to the PWM

time bas e. The A/D sa mplin g an d convers ion ti me ma y

be programmed to occur at any point within the PWM

period. The special event trigger allows the user to min-

imize th e delay betwee n the time whe n A/D conversio n

results are acquired and the time when the duty cycle

value is updated.

The PWM special event trigger has an SFR named

SEVTCMP and fiv e contro l bi t s to control it s o pera tio n.

The PTMR value for which a special event trigger

should occur is loaded into the SEVTCMP register.

When the PWM time b ase is in a Con tinuou s Up/ Down

Count mode, an additional control bit is required to

specif y the counting ph ase for the specia l event trigger .

The count phase is selected using the SEVTDIR con-

trol bit in the SEVTCMP SFR. If the SEVTDIR bit is

cleared, the special event trigger will occur on the

upward counting cycle of the PWM time base. If the

SEVTDIR bit is set, the special event trigger will occur

on the downward count cycle of the PWM time base.

The SEVTDI R control bit has no effect unles s the PWM

time base is configured for a Continuous Up/Down

Count mo de.

15.14.1 SPECIAL EVENT TRIGGER

POSTSCALER

The PWM special event trigger has a postscaler that

allows a 1:1 to 1:16 postscale ratio. The postscaler is

configured by writing the SEVOPS<3:0> control bits in

the PWMCON2 SFR.

The special event output postscaler is cleared on the

following events:

• Any write to the SEVTCMP register

• Any devi ce Reset

15.15 PWM Operation During CPU Sleep

Mode

The Fault A input pin has the ability to wake the CPU

from Sleep mode. The PWM module generates an

interrupt if the Fault pin is driven low while in Sleep.

15.16 PWM Operation During CPU Idle

Mode

The PTCON SFR contains a PTSIDL control bit. This

bit determines if the PWM module will continue to

operate or stop when the device enters Idle mode. If

PTSIDL = 0, the module will continue to operate. If

PT S IDL = 1, the module will stop operation as long as

the CPU remains in Idle mode.

dsPIC30F4011/4012

TABLE 15-1: 6-OUTPUT PWM REGISTER MAP

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

PTCON 01C0 PTEN —PTSIDL — — — — — PTOPS<3:0> PTCKPS<1:0> PTMOD<1:0> 0000 0000 0000 0000

PTMR 01C2 PTDIR PWM Timer Count Value 0000 0000 0000 0000

PTPER 01C4 — PWM Time Base Period Register 0111 1111 1111 1111

SEVTCMP 01C6 SEVTDIR PWM Special Event Compare Register 0000 0000 0000 0000

PWMCON1 01C8 — — — — — PTMOD3 PTMOD2 PTMOD1 — PEN3H PEN2H PEN1H — PEN3L PEN2L PEN1L 0000 0000 1111 1111

PWMCON2 01CA — — — — SEVOPS<3:0> —————— OSYNC UDIS 0000 0000 0000 0000

DTCON1 01CC — — — — — — — — DTAPS<1:0> Dead-Time A Value 0000 0000 0000 0000

FLTACON 01D0 —— FAOV3H FAOV3L FAOV2H FAOV2L FAOV1H FAOV1L FLTAM ———— FAEN3 FAEN2 FAEN1 0000 0000 0000 0000

OVDCON 01D4 —— POVD3H POVD3L POVD2H POVD2L POVD1H POVD1L — — POUT3H POUT3L POUT2H POUT2L POUT1H POUT1L 1111 1111 0000 0000

PDC1 01D6 PWM Duty Cycle #1 Register 0000 0000 0000 0000

PDC2 01D8 PWM Duty Cycle #2 Register 0000 0000 0000 0000

PDC3 01DA PWM Duty Cycle #3 Register 0000 0000 0000 0000

Legend: u = uninitialized bit

Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for de scrip tions of register bit fields.

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

16.0 SPI MODULE

The Serial Peripheral Interface (SPI) module is a

synchronous serial interface. It is useful for communi-

cating with other peripheral devices, such as

EEPROMs, shift registers, display drivers and A/D

converters, or other microcontrollers. It is compatible

with Motorola’s SPI and SIOP interfaces.

16.1 Operating Function Description

The SPI module consists of a 16-bit shift register,

SPI1SR, used for shifting data in and out, and a buffer

configures the module. Additionally, a status register,

SPI1STAT, indicates various status conditions.

The serial interfac e consist s of 4 pins: SDI1 (Serial Dat a

Input), SDO1 (Serial Data Output), SCK1 (Shift Clock

Input or Output), and SS1 (active-low Slave Select).

In Master mode operation, SCK1 is a clock output, but

in Slave mode, it is a clock input.

A series of eight (8) or sixteen (16) clock pulses shift

out bits from the SPI1SR to SDO1 pin, and simulta-

neously, shifts in data from SDI1 pin. An interrupt is

generated when the transfer is complete and the

corresponding interrupt flag bit (SPI1IF) is set. This

interrupt can be disabled through an interrupt enable

bit (SPI1IE).

The receive operation is double-buffered. When a

complete byte is received, it is transferred from

SPI1SR to SPI1BUF.

If the receive buffer is full when new data is being

transferred from SPI1SR to SPI1BUF, the module will

set the SPIROV bit, indicating an overflow condition.

The transfer of the data from SPI1SR to SPI1BUF will

not be completed and the new data will be lost. The

module will not respond to SCL transitions while

SPIROV is ‘1’, effectively disabling the module until

SPI1BUF is read by user software.

Transmit writes are also double-buffered. The user

writes to SPI1BUF. When the master or slave transfer

is completed, the contents of the shift register

(SPI1SR) is moved to the receive buffer. If any trans-

mit data has been written to the buffer register, the

contents of the transmit buffer are moved to SPI1SR.

The received data is thus placed in SPI1BUF and the

transmit data in SPI1SR is ready for the next transfer.

In Master mode, the clock is generated by prescaling

the system clock. Data is transmitted as soon as a

value is writ ten to SPI1 BUF. The interrupt is gene rate d

at the middle of the transfer of the last bit.

In Slave mode, data is transmitted and received as

external clock pulses appear on SCK1. Again, the

interrupt is generated when the last bit is latched. If

SS1 control is enabled, then transmission and recep-

tion are enabled only when SS1 = low. The SDO1

output will be disabled in SS1 mode with SS1 high.

The clock provided to the module is (FOSC/4). This

clock is then prescaled by the primary (PPRE<1:0>)

and secondary (SPRE<2:0>) prescale factors. The

CKE bit determines whether transmit occurs on transi-

tion from active clock state to Idle clock state, or vice

versa. The CKP bit selects the Idle state (high or low)

for the clock.

16.1.1 WORD AND BYTE

COMMUNICATION

A control bit, MODE16 (SPI1CON<10>), allows the

module to communicate in either 16-bit or 8-bit mode.

16-bit operation is identical to 8-bit operation, except

that the number of bits transmitted is 16 instead of 8.

The user software must disable the module prior to

changing the MODE16 bit. The SPI module is reset

when the MODE16 bit is changed by the user.

A basic dif ference betwee n 8-bit and 16-bit operat ion is

that the data is transmitted out of bit 7 of the SPI1SR

for 8-bit operation, and data is transmitted out of bit 15

of the SPI1SR for 16-bi t operation . In both mod es, dat a

is shifted into bit 0 of the SPI1SR.

16.1.2 SDO1 DISABLE

A control bit, DISSDO, is provided to the SPI1CON

will allow the SPI module to be connected in an input

only configuration. SDO1 can also be used for general

purpose I/O.

16.2 Framed SPI Support

The module supports a basic framed SPI protocol in

Master or Slave mode. The control bit, FRMEN,

enables fram ed SPI sup port a nd c auses the SS 1 pin to

perform the frame synchronization pulse (FSYNC)

function. The control bit, SPIFSD, determines whether

the SS1 pin is an input or an output (i.e., whether the

module receives or generates the frame synchroniza-

tion pulse). The frame pulse is an active-high pulse for

a single SPI clock cycle. When frame synchronization

is enabled, the data transmission starts only on the

subsequent transmit edge of the SPI clock.

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046). For more information on the device

instruction set and programming, refer to the “dsPIC30F/

33F Programmer’s Reference Manual” (DS70157).

Note: Both the transmit buffer (SPI1TXB) and

the receive buffer (SPI1RXB) are mapped

to the same register address, SPI1BUF.

dsPIC30F4011/4012

FIGURE 16-1: SPI BLOCK DIAGRAM

FIGURE 16-2: SPI MASTER/SLAVE CONNECTION

Read Write

Internal

Data Bus

SDI1

SDO1

SS1

SCK1

SPI1SR

SPI1BUF

bit 0

Shift

Clock Edge

Select

FCY

Primary

1, 4, 16, 64

Enable Master Clock

Prescaler

Secondary

Prescaler

1, 2, 4, 6, 8

Transmit

SPI1BUF

Receive

SS1 and

Control

Clock

Control

FSYNC

Serial Input Buffer

(SPI1BUF)

Shift Register

(SPI1SR)

MSb LSb

SDO1

SDI1

PROC ESSOR 1

SCK1

SPI Mas t er

Serial Input Buffer

(SPI1BUF)

LSb

MSb

SDI1

SDO1

PROCESSOR 2

SCK1

SPI Slave

Serial Clock

Shift Register

(SPI1SR)

dsPIC30F4011/4012

16.3 Slave Select Synchronizati on

The SS1 pin allows a Synchronous Slave mode. The

SPI must be configured in SPI Slave mode, with SS1

pin control enabled (SSEN = 1). When t he SS1 pi n is

low, transmission and reception are enabled and the

SDO1 pin is driven. When SS1 pin goes high, the

SDO1 pin is no longer driven. Also, the SPI module is

resynchronized and all counters/control circuitry are

reset. Therefore, when the SS1 pin is asserted low

again, transmission/reception will begin at the MSb,

even if SS1 had been deasserted in the middle of a

transmit/receive.

16.4 SPI Operation During CPU Sleep

Mode

During Sleep mode, the SPI module is shut down. If

the CPU enters Sleep mode while an SPI transaction

is in progress, then the transmission and reception is

aborted.

The transmitter and receiver will stop in Sleep mode.

However, register contents are not affected by

entering or exiting Sleep mode.

16.5 SPI Operation During CPU Idle

Mode

When the device enters Idle mode, all clock sources

remain functional. The SPISIDL bit (SPI1STAT<13>)

selects if the SPI module will stop or continue on Idle.

If SPISIDL = 0, the module will continue to operate

when the CPU enters Idle mode. If SPISIDL = 1, the

module will stop when the CPU enters Idle mode.

dsPIC30F4011/4012

TABLE 16-1: SPI1 REGISTER MAP

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset St ate

SPI1STAT 0220 SPIEN — SPISIDL — — — — — — SPIROV — — — — SPITBF SPIRBF 0000 0000 0000 0000

SPI1CON 0222 — FRMEN SPIFSD — DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE2 SPRE1 SPRE0 PPRE1 PPRE0 0000 0000 0000 0000

SPI1BUF 0224 Transmit and Receive Buffer 0000 0000 0000 0000

Legend: u = uninitialized bit

Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for de scrip tions of register bit fields.

dsPIC30F4011/4012

17.0 I2C™ MODULE

The Inter-Integrated Circuit (I2C) module provides

complete hardware support for both Slave and Multi-

Master modes of the I2C serial communication

standard with a 16-bit interface.

This module offers the following key features:

•I

2C Interface supporting both Master and Slave

Operation.

•I

2C Slave mo de s up ports 7 and 10-b it a ddre ss in g.

•I

2C Master m ode support s 7 and 10-bit addressing.

•I

2C Port allows Bidirectional Transfers between

Master and Slaves.

• Serial Clock Synchronization for I2C Port can be

used as a Handshake Mechanism to Suspend

and Resu me Serial Trans fer (SCLR EL con trol ).

•I

2C sup port s Multi-M aster Opera tion; De tect s Bus

Collision and will Arbitrate accordingly.

17.1 Operating Function Description

The hardw are fully imple ments al l the master an d slave

functions of the I2C Standard and Fast mode

specif ications, as well as 7 and 10-bit addressing.

Thus, the I2C module can operate either as a slave or

a master on an I2C bus.

17.1.1 VARIOUS I2C MODES

The following types of I2C operation are supported:

•I

2C slave operation with 7-bit addressing.

•I

2C slave operation with 10-bit addressing.

•I

2C master operation with 7 or 10-bit addressing.

See the I2C programmer’s model in Figure 17-1.

17.1.2 PIN CONFIGURATION IN I2C MODE

I2C has a 2-pi n inter fac e; SCL pi n is clock and SDA pin

is data.

17.1.3 I2C REGISTERS

I2CCON and I2C STAT are control and s ta tus reg isters ,

respect ively . Th e I2CCON register is readable an d writ-

able. The lower 6 bits of I2CSTAT are read-only. The

remaining bits of the I2CSTAT are read/write.

I2CRSR is the shift register used for shifting data,

whereas I2CRCV is the buffer register to which data

bytes are written or from which data bytes are read.

I2CRCV is the receive buffer, as shown in F igu re 17- 1.

I2CTRN is the transmit register to which bytes are

written during a transmit operation, as shown in

Figure 17-2.

The I2CADD regis ter hol ds the s lave a ddress. A status

bit, ADD10, indicates 10-bit Address mode. The

I2CBRG acts as the Baud Rate Generator reload

value.

In receive operations, I2CRSR and I2CRCV together

form a double-buffered receiver. When I2CRSR

receives a complete byte, it is transferred to I2CRCV

and an interrupt pulse is generated. During

transmission, the I2CTRN is not double-buffered.

FIGURE 17-1: PROGRAMMER ’S MODEL

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046). For more information on the device

instruction set and programming, refer to the “dsPIC30F/

33F Programmer’s Reference Manual” (DS70157).

Note: Following a Restart condition in 10-bit

mode, the user only needs to match the

first 7-bit addre ss.

bit 7 bit 0 I2CRCV (8 bits)

bit 7 bit 0 I2CTRN (8 bits)

bit 8 bit 0 I2CBRG (9 bits)

bit 15 bit 0 I2CCON (16-bits)

bit 15 bit 0 I2CSTAT (16-bits)

bit 9 bit 0 I2CADD (1 0- bit s)

dsPIC30F4011/4012

FIGURE 17-2: I2C™ BLOC K DIAGRAM

I2CRSR

I2CRCV

Internal

Data Bus

SCL

SDA

Shift

Match Detect

I2CADD

Start and

Stop bit Detect

Clock

Addr_Match

Clock

Stretching

I2CTRN LSB

Shift

Clock

Write

Read

BRG Down I2CBRG

Reload

Control

FCY

Start, Restart,

Stop bit Generate

Write

Read

Acknowledge

Generation

Collision

Detect

Write

Read

Write

Read

I2CCON

Write

Read

I2CSTAT

Control Logic

Read

LSB

Counter

dsPIC30F4011/4012

17.2 I2C Module Addresses

The I2CADD register contains the Slave mode

addresses. The register is a 10-bit register.

If the A10M bit (I2CCON<10>) is ‘0’, the address is

inter prete d by the mo dul e as a 7 - bit add ress . When an

address is re ceived, i t is c ompa red to the 7 LSbs of the

I2CADD register.

If the A10M bit is ‘1’, the address is assumed to be a

10-bit address. When an address is received, it will be

compared with the binary value, ‘11110 A9 A8’

(where A9 and A8 are two Most Significant bits of

I2CADD). If that value matches, the next address will

be compared with the Least Significant 8 bits of

I2CAD D, as speci fied in the 1 0-bit addres sing proto col.

The 7-bit I2C slave addresses supported by the

dsPIC30F are shown in Table 17-1.

TABLE 17-1: 7-BIT I2C™ SLAVE

ADDRESSES

17.3 I2C 7-bit Slave Mode Operation

Once enabled (I2CEN = 1), the slave module will wait

for a Start bit to occur (i.e., the I2C module is ‘Idle’).

Following the detection of a Start bit, 8 bits are shifted

into I2CRSR and the address is compared against

I2CADD. In 7-bit mode (A10M = 0), I2CADD<6:0> bits

are compared against I2CRSR<7:1>, and I2CRSR<0>

is the R_W bit. All incoming bits are sampled on the

rising edge of SCL.

If an address match occurs, an Acknowledgement will

be sent, and the Slave Event Interrupt Flag (SI2CIF) is

set on the falling edge of the ninth (ACK) bit. The

address match does not affect the contents of the

I2CRCV buffer or the RBF bit.

17.3.1 SLAVE TRANSMISSION

If the R_W bit received is a ‘1’, then the serial port will

go into Transmit mode. It wil l send ACK on the nin th bit

and then hold SCL to ‘0’ un til the CPU responds by writ-

ing to I2C TRN. SCL is rele ased by settin g the SCLREL

bit and 8 bits of data are shifted out. Data bits are

shifted out on the fa lling edge of SCL, s uch that SDA i s

valid during SCL high (see timing diagram). The inter-

rupt pulse is sent on the falling edge of the ninth clock

pulse, regardless of the status of the ACK received

from the master.

17.3.2 SLAV E RECE PTI ON

If the R_W bit received is a ‘0’ during an address

match, then Receive mode is initiated. Incoming bits

are sa mpl ed on the risi ng ed ge of SCL . After 8 bi t s are

received, if I2CRCV is not full or I2COV is not set,

I2CRSR is transferred to I2CRCV. ACK is sent on the

ninth clock.

If the RBF flag is set, indicating that I2CRCV is still

holding data from a pre vious operati on (RBF = 1), the n

ACK is not sent; however, the interrupt pulse is gener-

ated. In the case of an overflow, the contents of the

I2CRSR are not loaded into the I2CRCV.

17.4 I2C 10-bit Slave Mode Operation

In 10-bit mode, the basic receive and transmit

operations are the same as in the 7-bit mode. Howeve r,

the criteria for address match is more complex.

The I2C specification dictates that a slave must be

address ed for a write ope ration, with tw o address byte s

following a Start bit.

The A10M bit is a control bit that signifies that the

address in I2CADD is a 10-bit address rather than a

7-bit address. The address detection protocol for the

first byte of a message address is identical for 7-bit

and 10-bit messages but the bits being compared are

different.

I2CADD holds the entire 10-bit address. Upon receiv-

ing an address following a Start bit, I2CRSR<7:3> is

compared against a literal ‘11110’ (the default 10-bit

address) and I2CRSR<2:1> are compared against

I2CADD<9:8>. If a match occurs and if R_W = 0, the

interrupt pu lse is sent. Th e ADD10 bit will be cleare d to

indicate a partial address match. If a match fails or

R_W = 1, the ADD10 bit is cleared and the module

returns to the Idle state.

The low byte of the address is then received and com-

pared with I2CADD<7:0>. If an address match occurs,

the interrupt pulse is generated and the ADD10 bit is

set, indicating a complete 10-bit address match. If an

address match did not occur, the ADD10 bit is cleared

and the module returns to the Idle state.

0x00 General call address or Start byte

0x01-0x03 Reserved

0x04-0x 07 HS mode master codes

0x08-0x 77 Valid 7-bit addre sses

0x78-0x7B Valid 10-bit addresses (lower 7 bits)

0x7C-0x7F Reserved

Note: The I2CRCV will be loaded if the I2COV

bit = 1 and the RBF flag = 0. In this case,

a read of the I2CRCV was performed but

the user did not clear the state of the

I2COV bit before the next receive

occurred. The Acknowledgement is not

sent (ACK = 1) and the I2CRCV is

updated.

dsPIC30F4011/4012

17.4.1 10-BIT MODE SLAVE

TRANSMISSION

Once a slave is addressed in this fashion, with the full

10-bit address (we will refer to this state as

“PRIOR_ADDR_MATCH”), the master can begin

sending data bytes for a slave reception operation.

17.4.2 10-BIT MODE SLAVE RECEPTION

Once ad dress ed, the ma ster ca n genera te a Rep eated

Start, reset the high byte of the address and set the

R_W bit without generating a Stop bit, thus initiating a

slave tran sm it ope ratio n.

17.5 Automatic Clock Stretch

In the Slave modes, the module can synchronize buffer

reads and write to the master device by clock stretching.

17.5.1 TRANSMI T CLOCK STRETCHING

Both 10-bit and 7-bit Transmit modes implement clock

stretching by asserting the SCLREL bit after the falling

edge of the ninth clock if the TBF bit is cleared,

indicating the buffer is empty.

In Slave Transmit modes, clock stretching is always

performed, irrespective of the STREN bit.

Clock synchronization takes place following the ninth

clock of the transmit sequence. If the device samples

an ACK on the fa lling edge o f the ni nth cl ock, a nd if th e

TBF bit is still clear, then the SCLREL bit is automati-

cally cleared. The SCLREL being cleared to ‘0’ will

assert the SCL line low. The user ’s ISR must set the

SCLREL bit before transmission is allowed to

continue. By holding the SCL line low, the user has

time to service the ISR and load the contents of the

I2CTRN before the master device can initiate another

transmit sequence.

17.5.2 RECEIVE CLOCK STRETCHING

The STREN bit in the I2CCON register can be used to

enable clock stretching in Slave Receive mode. When

the STREN bit is set, the SCL pin will be held low at

the end of each data receive sequence.

17.5.3 CLOCK STRETCHING DURING

7-BIT AD DRES SIN G (S TR EN = 1)

When the STREN bit is set in Slave Receive mode,

the SCL line is held low when the buffer register is full.

The method for stretching the SCL output is the same

for both 7 and 10-bit Addressing modes.

Clock stretching takes place following the ninth clock of

the receive sequence. On the falling edge of the ninth

clock at the end of the ACK sequence, if the RBF bit is

set, the SCLREL bit is automatically cleared, forcing the

SCL output to be held low. The user ’s ISR must set the

SCLREL bit before reception is allowed to continue. By

holding the SCL line low, the user has time to service

the ISR and read the contents of the I2CRCV before the

master device can initiate another receive sequence.

This will prevent buffer ov erruns from occ urring.

17.5.4 CLOCK STRETCHING DURING

10-BIT ADDRESSING (STREN = 1)

Clock stretching takes place automatically during the

addressing sequence. Because this module has a

the protocol to wait for the address to be updated.

After the address phase is complete, clock stretching

will occur on each data receive or transmit sequence

as was described earlier.

17.6 Software Controlled Clock

Stretching (STREN = 1)

When the STREN bit is ‘1’, the SCLREL bit may be

cleared by software to allow software to control the

clock stretching. The logic will synchronize writes to

the SCLREL bit with the SCL clock. Clearing the

SCLREL bit will not assert the SCL output until the

module detects a falling edge on the SCL output and

SCL is sampled low. If the SCLREL bit is cleared by

the user while the SCL line has been sampled low, the

SCL output will be asserted (held low). The SCL out-

put will remain low until the SCLREL bit is set and all

other devices on the I2C bus have deasserted SCL.

This ensures that a write to the SCLREL bit will not

violate the minimum high time requirement for SCL.

If the STREN bit is ‘0’, a software write to the SCLREL

bit will be disregarded and have no effect on the

SCLREL bit.

Note 1: If the user loads the contents of I2CTRN,

setting the TBF bit before the fallin g edge

of the n int h c lo ck , th e SC LREL bit w il l n ot

be cleared and clock stretching will not

occur.

2: The SCLREL bit can be set in software

regardless of the state of the TBF bit.

Note 1: If the user reads the contents of the

I2CRCV, clearing the RBF bit before the

falling edge of the ninth clock, the

SCLREL bit will not be cleared and clock

stretching will not occur.

2: The SCLREL bit can be set in software,

regardles s of the state of the RBF bit. The

user should be careful to clear the RBF bit

in the ISR before the next receive

sequence in order to prevent an overflow

condition.

dsPIC30F4011/4012

17.7 Interrupts

The I2C module generates two interrupt flags, MI2CIF

(I2C Master Inter rupt Flag) and SI2CIF (I2C Slav e Inter-

rupt Flag). The MI2CIF interrupt flag is activated on

completion of a master message event. The SI2CIF

interrupt flag is activated on detection of a message

directed to the slave.

17.8 Slope Control

The I2C standard requires slope control on the SDA

and SCL signals for Fast mode (400 kHz). The control

bit, DISSLW , enables the us er to disable slew rate con-

trol, if desired. It is necessary to disable the slew rate

control for 1 MHz mode.

17.9 IPMI Support

The con trol bit, IPM IEN, enabl es the modul e to supp ort

Intelligent Peripheral Management Interface (IPMI).

When this bit is set, the module ac ce pts and ac t s upo n

all addres ses .

17.10 General Call Address Support

The general call address can address all devices.

When this address is used, all devices should, in

theor y, respond with an Acknow l edg em ent .

The general call address is one of eight addresses

reserved for specific purposes by the I2C protocol. It

consists of all ‘0’s with R_W = 0.

The general call address is recognized when the Gen-

eral Call Enable (GCEN) bit is set (I2CCON<7> = 1).

Following a Start bit detection, 8 bits are shifted into

I2CRSR and the address is compared with I2CADD,

and is also compared with the general call address

which is fixed in hardware.

If a gen eral cal l addre ss matc h occurs, the I2CRS R is

transferred to the I2CRCV after the eighth clock, the

RBF flag is set, and on the falling edge of the ninth bit

(ACK bit), the Master Event Interrupt Flag (MI2CIF) is

set.

When the interrupt is serviced, the source for the interrupt

can be checked by reading the contents of the I2CRCV

to determine if the address was device-specific or a

general call address.

17.11 I2C Master Support

As a master device, six operations are supported.

• Assert a Start condition on SDA and SCL.

• Assert a Restart condition on SDA and SCL.

• Write to the I2CTRN register initiating

transmission of data/address.

• Generate a Stop condition on SDA and SCL.

• Config ure the I2C port to receive data.

• Generate an ACK condition at the end of a

received byte of data.

17.12 I2C Master Operation

The master device generates all of the serial clock

pulses and the Start and Stop conditions. A transfer is

ended with a Stop condition or with a Repeated Start

condition. Since the Repeated Start condition is also

the begi nning of the next seria l transfer, the I2C bus will

not be released.

In Master Transmitter mode, serial data is output

through SDA, while SCL outputs the serial clock. The

first byte transmitted contains the slave address of the

receiving device (7 bits) and the data direction bit. In

this ca se, the da ta direc tion bit (R_ W) is logi c ‘0’. Serial

data is transmitted 8 bits at a time. After each byte is

transmitted, an ACK bit is received. Start and Stop

conditions are output to indicate the beginning and the

end of a serial transfer.

In Master Receive mode, the first byte transmitted

contains the slave address of the transmitting device

(7 bits) and the data direction bit. In this case, the data

direction bit (R_W) is logic ‘1’. Thus, the first byte

transmitted is a 7-bit slave address, followed by a ‘1’ to

indica te the rece ive bit . Seria l dat a is rece ived v ia SDA

while SCL outputs the serial clock. Serial data is

receive d 8 bits at a tim e. After each byte is rece ived, an

ACK bit is transmitted. Start and Stop conditions

indicate the beginning and end of transmission.

17.12.1 I2C MASTER TRANSMI S SION

Transmission of a data byte, a 7-bit address or the

second half of a 10-bit address, is accomplished by

simply writing a value to the I2CTR N registe r. The user

should only write to I2CTRN when the module is in a

Wait state. This action will set the buffer full flag (TBF)

and allow the Baud Rate Generator to begin counting

and start the next transmission. Each bit of address/

data wil l be shifted out onto th e SDA pin after th e falling

edge of SCL is asserted. The Transmit Status Flag,

TRSTAT (I2CSTAT<14>), indicates that a master

transmit is in progress.

dsPIC30F4011/4012

17.12.2 I2C MASTER RECEPTION

Master mode recepti on is enab led by progra mmin g the

receive enable (RCEN) bit (I2CCON<3>). The I2C

module must be Idle before the RCEN bit is set, other-

wise the RCEN bit will be disregarded. The Baud Rate

Generator begins counting and on each rollover, the

stat e of the SCL pin toggle s and dat a is sh ifted in to the

I2CRSR on the rising edge of each clock.

17.12.3 BAUD RATE GENERATOR (BRG)

In I2C Master mode, the reload value for the BRG is

located in the I2CBRG register. When the BRG is

loaded w ith th is v alu e, the BRG c ou nt s d own to ‘0’ and

stops until another reload has taken place. If clock

arbitration is taking place, for instance, the BRG is

reloaded when the SCL pin is sampled high.

As per the I2C standard, FSCK may be 100 kHz or

400 kHz. However, the user can specify any baud rate

up to 1 MHz. I2CBRG values of ‘0’ or ‘1’ are illegal.

EQUATION 17-1: I2CBRG VALUE

17.12.4 CLOCK ARBITRATION

Clock arbitration oc curs when the m aster deasse rts the

SCL pi n (SCL al lowe d to fl oat hi gh) duri ng an y rece ive,

transmi t or Restar t/S top conditio n. When the SCL pi n is

allowed to float high, the Baud Rate Generator (BRG)

is suspen ded from cou nting until the SC L pin is actu ally

sampled high. When the SCL pin is sampled high, the

Baud Rate Generator is reloaded with the contents of

I2CBRG and begins counting. This ensures that the

SCL high time w il l al ways be a t lea st o ne BR G roll over

count in the event that the clock is held low by an

external device.

17.12.5 MULTI-MASTER COMMUNICATION,

BUS COLLISION AND BUS

ARBITRATION

Multi-master operation support is achieved by bus

arbitration. When the master outputs address/data bits

onto the SDA pin, arbitration takes place when the

master outputs a ‘1’ on SDA, by letting SDA float high,

whil e another mas ter asser ts a ‘0’. When the SCL pin

floats high, data should be stable. If the expected data

on SDA is a ‘1’ and the data sampled on the SDA

pin = 0, then a bus collision has taken place. The

master will set the MI2CIF pulse and reset the master

portion of the I2C port to its Idle state.

If a transmit was in progress when the bus collision

occurred, the transmission is halted, the TBF flag is

cleared, the SDA and SCL lines are deasserted and a

value can now be written to I2CTRN. When the user

services the I2C master event Inte rrupt Service R outine

and if the I2C bus is free (i.e., the P bit is set), the user

can resume communication by asserting a Start

condition.

If a Start, Restart, Stop or Acknowledge condition was

in progres s when the bus co lli si on o cc urre d, th e c ond i-

tion is aborted, the SDA and SCL lines are deasserted

and the respective control bits in the I2CCON register

are cleared to ‘0’. When the user services the bus

collis ion In terru pt Serv ic e Routine, and i f th e I 2C bus is

free, the user can resume co mm uni ca tio n by as se rting

a St art conditi on .

The Master will continue to monitor the SDA and SCL

pins, and if a Stop condition occurs, the MI2CIF bit will

be set.

A write to the I2CTR N will start the trans mission of dat a

at the first data bit, regardless of where the transmitter

left off when bus collision occurred.

In a Multi-Maste r en vi ronm en t, th e i nte rrup t ge nera tio n

on the d etecti on of St art a nd Stop conditio ns al lows the

determination of when the bus is free. Control of t he I2C

bus can be taken when the P bit is set in the I2CSTAT

cleared.

17.13 I2C Module Operation During CPU

Sleep and Idle Modes

17.13.1 I2C OPERATION DURING CPU

SLEE P MOD E

When the device enters Sleep mode, all clock sources

to the module are shut down and stay at logic ‘0’. If

Sleep occurs in the middle of a transmission, and the

state machine is partially into a transmission as the

clocks s top, the n the tra nsmiss ion is ab orted. Si milarl y,

if Sleep occurs in the middle of a reception, then the

reception is aborted.

17.13.2 I2C OPERATION DURING CPU IDLE

MODE

For the I2C, the I2CSIDL bit selects if the module will

stop on Idle or continue on Idle. If I2CSIDL = 0, the

module will continue operation on assertion of the Idle

mode. If I2CSIDL = 1, the module will stop on Idle.

I2CBRG = FCY FCY

FSCL 1,111,111 – 1

–

()

dsPIC30F4011/4012

TABLE 17-2: I2C™ REGIST ER MAP

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 1 1 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

I2CRCV 0200 — — — — — — — — Receive Register 0000 0000 0000 0000

I2CTRN 0202 — — — — — — — — Tra nsmit Register 0000 0000 1111 1111

I2CBRG 0204 — — — — — — — Baud Rate Generator 0000 0000 0000 0000

I2CCON 0206 I2CEN —I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN 0001 0000 0000 0000

I2CSTAT 0208 ACKSTAT TRSTAT — — — BCL GCSTAT ADD10 IWCOL I2COV D_A P S R_W RBF TBF 0000 0000 0000 0000

I2CADD 020A — — — — — — Address Regist er 0000 0000 0000 0000

Legend: u = uninitialized bit

Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for de scrip tions of register bit fields.

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

18.0 UNIVERSAL ASYNCHRONOUS

RECEIVER TRANSMITTER

(UART) MODULE

This section describes the Universal Asynchronous

Receiver/Transmitter commun ications module.

18.1 UART Module Overview

The key features of the UART module are:

• Full-Duplex, 8 or 9-bit Data Communication

• Even, Odd or No Parity Options (for 8-bit data)

• One or Two Stop bits

• Fully Integrated Baud Rate Generator with

16-bit Prescaler

• Baud Rate s ranging fro m 38 bps to 1.8 75 Mbps at

a 30 MHz Instruction Rate

• 4-Word Deep Transmit Data Bu ffer

• 4-Word Deep Receive Data Buffer

• Parity, Framing and Buffer Overrun Error Detection

• Support for Interrupt Only on Address Detect

(9th bit = 1)

• Separate Transmit and Receive Interrupts

• Loopback mode for Diagnostic Support

FIGURE 18-1: UART TRANSMITTER BLOCK DIAGRAM

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046). For more information on the device

instruction set and programming, refer to the “dsPIC30F/

33F Programmer’s Reference Manual” (DS70157).

Write Write

UTX8 UxTXREG Low Byte

Load TSR

Transmit Control

– Control TSR

– Control Buffer

– Generate Flags

– Generate Interrupt

Control and Status bits

UxTXIF

Data

‘0’ (Start)

‘1’ (Stop)

Parity Parity

Generator

Transmit Shift Register (UxTSR)

16 Divider

Control

Signals

16x Baud Clock

from Baud Rate

Generator

Internal Data Bus

UTXBRK

Note: x = 1 or 2. dsPIC30F4012 only has UART1.

UxTX

dsPIC30F4011/4012

FIGURE 18-2: UART RECE IVER BLOCK DIAGRAM

Read

URX8 UxRXREG Low Byte

Load RSR

UxMODE

Receive Buffer Control

– Generate Flags

– Generate Interrupt

UxRXIF

UxRX

· Start bit Detect

Receive Shift Register Control

Signals

UxSTA

– Shift Data Characters

Read Read

Write Write

to Buffer

8-9

(UxRSR)

PERR

FERR

· Parity Check

· Stop bit Detect

· Shift Clock Generation

· W a k e Logi c

Internal Data Bus

LPBACK

From UxTX

16x Baud Clock from

Baud Rate Generator

÷ 16 Divider

dsPIC30F4011/4012

18.2 Enabling and Setting Up UART

18.2.1 ENABLING THE UART

The UART module is enabled by setting the UARTEN

bit in the UxMODE register (where x = 1 or 2). Once

enabled , the UxTX and UxRX pins are configured as an

output and an input, respectively, overriding the TRIS

and LATCH register bit settings for the corresponding

I/O port pins. The UxTX pin is at logic ‘1’ when no

transmission is taking place.

18.2.2 DISABLING THE UART

The UART module is disabled by clearing the UARTEN

bit in the UxMODE register. This is the default state

after any Reset. If the UART is disabled, all I/O pins

operate as p ort pins under th e control of the LATCH and

TRIS bits of the corresp onding port pins .

Disabling the UART module resets the buffers to

empty states. Any data characters in the buffers are

lost and the baud rate counter is reset.

All error and status flags associated with the UART

module are reset when the module is disabled. The

URXDA, OERR, FERR, PERR, UTXEN, UTXBRK and

UTXBF bits are cleared, whereas RIDLE and TRMT

are set. Other control bits, including ADDEN,

URXISEL<1:0>, UTXISEL, as well as the UxMODE

and UxBRG registers, are not affected.

Clearing the UARTEN bit while the UART is active will

abort all pending transmissions and receptions and

reset the module as defined above. Re-enabling the

UART will restart the UART in the same configuration.

18.2.3 ALT ERNA TE I/O

The alternate I/O function is enabled by setting the

ALTIO bit (UxMODE<10>). If ALTIO = 1, the UxATX

and UxARX pins (alternate transmit and alternate

receive pins, respectively) are used by the UART mod-

ule instead of the UxTX and UxRX pins. If ALTIO = 0,

the UxTX and UxRX pins are used by the UART

module.

18.2.4 SETTING UP DATA, PARITY AND

STOP BIT SELECTIONS

Control bit s, PDSEL<1 :0> in the UxM ODE regi ster, are

used to select the data length and parity used in the

transmission. The data length may either be 8 bits with

even, odd or no parity, or 9-bits with no parity.

The STSEL bit determines whether one or two S top bits

will be used during data transmissi on.

The defa ult (power-on) setting of the UAR T is 8 bit s, no

parity and 1 Stop bit (typically represented as 8, N, 1).

18.3 Transmitting Data

18.3.1 TRANSMITTING IN 8-BIT DATA

MODE

The following steps must be performed in order to

transmit 8-bit data:

1. Set up the UART:

First, the data length, parity and number of Stop

bits must be selected. Then, the transmit and

receive interrupt enable and priority bits are set

up in the UxMODE and UxSTA registers. Also,

the appropriate baud rate value must be written

to the UxBRG register.

2. Enable the UART by setting the UARTEN bit

(UxMODE<15>).

3. Set the UTXEN bit (UxSTA<10>), thereby

enabling a transmission.

4. Write the byte to be t ransmitted to the lower byte

of UxTXREG. The value will be transferred to the

Transmit Shift register (UxTSR) immediately

and the serial bit stream will start shifting out

during the next rising edge of the baud clock.

Alternatively, the data byte may be written while

UTXEN = 0, following which, the user may set

UTXEN. This will cause the serial bit stream to

begin immediately because the baud clock will

start from a cleared state.

5. A transmit i nterrupt wi ll be gene rated depen ding

on the va lue of the interrup t contro l bit UTXI SEL

(UxSTA<15>).

18.3.2 TRANSMITTING IN 9-BIT DATA

MODE

The sequence of steps involved in the transmission of

9-bit data is similar to 8-bit transmission, except that a

16-bit data word (of which the upper 7 bits are always

clear) must be written to the UxTXREG register.

18.3.3 TRANSMIT BUFFER (UXTXB)

The transmit buffer is 9 bits wide and 4 characters

deep. Including the Transmit Shift register (UxTSR),

the user effectively has a 5-deep FIFO (First In First

Out) buffer. The UTXBF Status bit (UxSTA<9>)

indicates whether the transmit buffer is full.

If a user attempts to write to a full buffer, the new data

will not be accepted into the FIFO, and no data shift

will occur within the buffer. This enables recovery from

a buffer overrun condition.

The FIFO is reset during any device Reset, but is not

affected when the device enters or wakes up from a

power-saving mode.

dsPIC30F4011/4012

18.3.4 TRANSMIT INTERRUPT

The Transmit Interrupt Flag (U1TXIF or U2TXIF) is

located in the corresponding interrupt flag register.

The transmitter generates an edge to set the UxTXIF

bit. The cond itio n for gene ratin g the in terru pt depe nds

on UTXISEL control bit:

a) If UTXISEL = 0, an interrupt is generated when a

word is transferred from the transmit buffer to the

Transmit Shift register (UxTSR). This implies that

the trans mit bu ff er has at le ast one empty word.

b) If UTXISEL = 1, an interrupt is generated when

a word is transferred from the transmit buffer to

the Transmit Shift register (UxTSR) and the

transmit buffer is empty.

Switching between the two interrupt modes during

operation is possible and sometimes offers more

flexibility.

18.3.5 TRANSMIT BREAK

Setting the UTXBRK bit (UxSTA<11>) will cause the

UxTX line to be driven to logic ‘0’. The UTXBRK bit

overrides all transmission activity. Therefore, the user

should generally wait for the transmitter to be Idle

before setting UTXBRK.

To send a Break character, the UTXBRK bit must be

set by software and must remain set for a minimum of

13 baud cl oc k cy cl es . The UTX BR K b it is then cle a red

by software to generate Stop bits. The user must wait

for a duration of at least one or two baud clock cycles

in order to ensure a valid Stop bit(s) before reloading

the UxTXB or starting other transmitter activity.

Transmission of a Break character does not generate

a transmit interrupt.

18.4 Receiving Data

18.4.1 RECEIVING IN 8-BIT OR 9-BIT DATA

MODE

The following steps must be performed while receiving

8-bit or 9-bit data:

1. Set up the UART (see Section 18.3.1

“Transmitting in 8-bit Data Mode”).

2. Enable the UART (see Section 18.3.1

“Transmitting in 8 -bit D ata Mode”).

3. A receive interrupt will be generated when one

or more data words have been received,

depending on the receive interrupt settings

specified by the URXISEL bits (UxSTA<7:6>).

4. Read the OERR bit to determine if an overrun

error has occ urred. The OERR bit must be reset

in software.

5. Read the received data from UxRXREG. The act

of reading UxRXREG will move the next word to

the top of the receive FIFO and the PERR and

FER R values will be update d.

18.4.2 RECEIVE BUFFER (UXRXB)

The receive buffer is 4 words deep. Including the

Receive Shift register (UxRSR), the user effectively

has a 5-word deep FIFO buffer.

URXDA (UxSTA<0>) = 1 indicates that the receive

buffer has data available. URXDA = 0 implies that the

buffer is empty. If a user attempts to read an empty

buffer, the old values in the buffer will be read and no

data shift will occur within the FIFO.

The FIFO is reset during any device Reset. It is not

affected when the device enters or wakes up from a

power-saving mode.

18.4.3 RECEIVE INTERRUPT

The Receive Interrupt Flag (U1RXIF or U2RXIF) can

be read from the corresponding interrupt flag register.

The interrupt flag is set by an edge generated by the

rece iver. The cond iti on f or se tti ng t he re ceiv e int err upt

flag depends on the settings specified by the

URXISEL<1:0> (UxSTA<7:6>) control bits.

a) If URXISEL<1:0> = 00 or 01, an interrupt is

generated every time a data word is transferred

from the Receive Shift register (UxRSR) to the

receive buffer. There may be one or more

charact ers in the receive buffer.

b) If URXISEL<1:0> = 10, an int errupt is generate d

when a word is transferred from the Receive

Shift register (UxRSR) to the receive buffer

which, as a result of the transfer, contains

3 characters.

c) If URXISEL<1:0> = 11, an interrupt is set when

a word is transferred from the Receive Shift

a result of the transfer, contains 4 characters

(i.e., becom es full).

Switching between the interrupt modes during opera-

tion is possible, though generally not advisable during

normal operation.

18.5 Reception Error Handling

18.5.1 RECEIVE BUFFER OVERRUN

ERROR (OERR BIT)

The OERR bit (UxSTA<1>) is set if all of the following

conditions occur:

a) The receive buffer is full.

b) The Receive Shift register is full, but unable to

transfer the character to the receive buffer.

c) The Stop bit of the character in the UxRSR is

detected, indicating that the UxRSR needs to

transfer the character to the buffer.

Once OERR is se t, no furthe r dat a is s hif ted in UxRSR

(until the OERR bit is cleared in software or a Reset

occurs). The data held in UxRSR and UxRXREG

remains val id.

dsPIC30F4011/4012

18.5.2 FRAMING ERROR (FERR)

The FERR bit (UxSTA<2>) is set if a ‘0’ is detected

instead of a Stop bit. If two Stop bits are selected, both

Stop bits must be ‘1’, otherwise FERR will be set. The

read-only FERR bit is buffered along with the received

data; it is cleared on any Reset.

18.5.3 PARITY ERROR (PERR)

The PERR bit (UxSTA<3>) is set if the parity of the

received word is incorrect. This error bit is applicable

only if a Parity mode (odd or even) is selected. The

read-only PERR bit is buffered along with the received

data bytes; it is cleared on any Reset.

18.5.4 IDLE STATUS

When the receiver is active (i.e., between the initial

detecti on of the Start bit and the co mple tion of the Stop

bit), the RIDLE bit (UxSTA<4>) is ‘0’. Between the

completion of the Stop bit and detection of the next

Start bit, the RIDLE bit is ‘1’, indicating that the UART

is Idle.

18.5.5 RECEIVE BRE AK

The receiver will count and expect a certain number

of bit times based on the values programmed in

the PDSEL<1:0> (UxMODE<2:1>) and STSEL

(UxM ODE < 0>) bi ts.

If the Bre ak i s lo nge r than 13 bi t tim es , the rece pti on i s

considered complete after the number of bit times

specified by PDSEL and STSEL. The URXDA bit is

set, FERR is set, zeros are loaded into the receive

FIFO, interrupts are generated, if appropriate and the

RIDLE bit is set.

When the modu le rece ives a lon g Break s ignal a nd the

receiver has detected the Start bit, the data bits and

the inv ali d Stop bit (wh ic h sets the FER R), the receiv er

must wait for a valid Stop bit before looking for the next

Start bit. It cannot assume that the Break condition on

the line is the next Start bit.

Break is regarded as a character containing all ‘0’s,

with the FERR bit set. The Break character is loaded

into the buffer. No further reception can occur until a

Stop bit is received. Note that RIDLE goes high when

the Stop bit has not been received yet.

18.6 Address Detect Mode

Setting the ADDEN bit (UxSTA<5>) enables this

special mode in which a 9th bit (URX8) value of ‘1’

identifies the received word as an address, rather than

data. This mode is only applicable for 9-bit data

communication. The URXISELx control bit does not

have any impact on interrupt generation in this mode,

since an interrupt (if enabled) will be generated every

time the received word has the 9th bit set.

18.7 Loopback Mode

Setting the LPBACK bit enables this special mode in

which the UxTX pin is int ernally conne cted to the UxRX

pin. When configured for the Loopback mode, the

UxRX pin is disconnected from the internal UART

receive logic. However, the UxTX pin still functions as

in a normal operation.

To select this mode:

a) Configure UART for desired mode of operation.

b) Set LPBACK = 1 to enable Loopback mode.

c) Enable tran sm is si on as def ine d in Section 18.3

“Transmitting Data”.

18.8 Baud Rate Generator

The UART has a 16-bit Baud Rate Generator to allow

maximu m fl exib ilit y in b aud r ate ge nera tio n. Th e Baud

Rate Generator register (UxBRG) is readable and

writable. The baud rate is computed as follows:

BRG = 16-bit value held in UxBRG register

(0 through 65535)

FCY = Instruction Clock Rate (1/TCY)

The baud rate is given by Equation 18-1.

EQUATION 18-1: BAUD RATE

Therefore , max i mum baud rate possible is:

FCY/16 (if BRG = 0),

and the minimum baud rate possible is:

FCY/(16 * 65536).

With a full, 16-bit Baud Rate Generator, at 30 MIPS

operation, the minimum baud rate achievable is

28.5 bps.

Baud Rate = FCY/(16 * (BRG + 1))

dsPIC30F4011/4012

18.9 Auto-Baud Support

To allow the system to determine baud rates of

received characters, the input can be optionally linked

to a selected capture input (IC1 for UART1, IC2 for

UART2). To enable this mode, the user must program

the inp ut cap ture m odule to dete ct the falli ng and risin g

edges of the Start bit.

18.10 UART Operation During CPU

Sleep and Idle Modes

18.10.1 UART OPERATION DURING CPU

SLEEP MODE

When the device enters Sleep mode, all clock sources

to the module are shut down and stay at logic ‘0’. If

entry into Sleep mode occurs while a transmission is

in progress, then the transmission is aborted. The

UxTX pin is driven to logic ‘1’. Similarly, if entry into

Sleep mode occurs while a reception is in progress,

then the reception is aborted. The UxSTA, UxMODE,

UxBRG, transmit and rec eive registe rs and buf fer s, are

not affected by Sleep mode.

If the WAKE bit (UxMO DE<7>) is set be fore th e dev ic e

enters Sleep mode, then a falling edge on the UxRX

pin will generate a receive interrupt. The Receive

Interrupt Select Mode bit (URXISEL) has no effect for

this function. If the receive interrupt is enabled, then

this will wake-up the device from Sleep. The UARTEN

bit must be set in order to generate a wake-up

interrupt.

18.10.2 UART OPERATION DURING CPU

IDLE MODE

For the UART, the USIDL bit selects if the module will

stop operation when the device enters Idle mode, or

whethe r the m odu le wi ll co nti nue on Idl e. If U SID L = 0,

the module will continue operation during Idle mode. If

USIDL = 1, the module will stop on Idle.

dsPIC30F4011/4012

TABLE 18-1: UART1 REGISTER MAP

TABLE 18-2: UART2 REGISTER MAP (NOT AVAILABLE ON dsPIC30F4012)

SFR Name Addr . Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

U1MODE 020C UARTEN —USIDL——ALTIO—— WAKE LPBACK ABAUD —— PDSEL1 PDSEL0 STSEL 0000 0000 0000 0000

U1STA 020E UTXISEL — — — UTXBRK UTXEN UTXBF TRMT URXISEL1 URXISEL0 ADDEN RIDLE PERR FERR OERR URXDA 0000 0001 0001 0000

U1TXREG 0210 — — — — — — — UTX8 T ransmit Register 0000 000u uuuu uuuu

U1RXREG 0212 — — — — — — — URX8 Receive Register 0000 0000 0000 0000

U1BRG 0214 Baud Rate Generator Prescaler 0000 0000 0000 0000

Legend: u = uninitialized bit

Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for de scrip tions of register bit fields.

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

U2MODE 0216 UARTEN —USIDL— — — — — WAKE LPBACK ABAUD —— PDSEL1 PDSEL0 STSEL 0000 0000 0000 0000

U2STA 0218 UTXISEL — — — UTXBRK UTXEN UTXBF TRMT URXISEL1 URXISEL0 ADDEN RIDLE PERR FERR OERR URXDA 0000 0001 0001 0000

U2TXREG 021A — — — — — — — UTX8 Transmit Register 0000 000u uuuu uuuu

U2RXREG 021C — — — — — — — URX8 Receive Register 0000 0000 0000 0000

U2BRG 021E Baud Rate Generator Prescaler 0000 0000 0000 0000

Legend: u = uninitialized bit

Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for de scrip tions of register bit fields.

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

19.0 CAN MODULE

19.1 Overview

The Controller Area Network (CAN) module is a serial

interface, useful for communicating with other CAN

modules or digital signal controller devices. This inter-

face/protocol was designed to allow communications

within noisy environments. The dsPIC30F4011/4012

devices have 1 CAN module.

The CAN module is a communication controller imple-

menting the CAN 2.0 A/B protocol, as defined in the

BOSCH specification. The module will suppo rt CAN 1.2,

CAN 2.0A, CAN2.0B Passive and CAN 2.0B Active

versions of the protocol. The module implementation is

a full CAN system. The CAN specification is not covered

within this data sheet. The reader may refer to the

BOSCH CAN specification for further det ails .

The module features are as follows:

• Implementation of the CAN protocol CAN 1.2,

CAN 2.0A and CAN 2.0B

• Standard and extended data frames

• 0-8 bytes data length

• Programmable bit rate up to 1 Mbit/sec

• Support for remote frames

• Doubl e-bu f fe red receiver with two prioritiz ed

received message storage buffers (each buffer

may contain up to 8 bytes of data)

• 6 full (standard/extended identifier), acceptance

filters, 2 associated with the high priority receive

buffer and 4 associated with the low priority

rece ive buffer

• 2 full, accept ance filte r masks, one each ass ociated

with the high and low priority receive buffers

• Three transmit buffers with application specified

priori tization and abort c apabilit y (each buf fer may

contain up to 8 bytes of data)

• Programmable wake-up functionality with

integra ted low-pass filter

• Programm abl e Loopback m ode su pp orts self -tes t

operation

• Signaling via interrupt capabilities for all CAN

receiver and transmitter error states

• Programmable clock source

• Programmable link to input capture module (IC2,

for both CAN1 and CAN2) for time-stamping and

netw ork synchronizati on

• Low-power Sleep and Idle mode

The CAN bus modu le consist s of a protocol engi ne and

message buffering/control. The CAN protocol engine

handles all functions for receiving and transmitting

messages on the CAN bus. Messages are transmitted

by first loading the appropriate data registers. Status

and errors can be checked by reading the appropriate

registers. Any message detected on the CAN bus is

checked for errors and then matched against filters to

see if it should be received and stored in one of the

receive registers.

19.2 Frame Types

The CAN module transmits various types of frames

which include data messages or remote transmission

requests, ini tiated by the us er, as other frames that are

automatically generated for control purposes. The

following frame types are supported:

19.2.1 STANDARD DATA FRAME

A stand ard data frame is generated by a node when the

node wishes to transmit data. It includes an 11-bit

Standard Identifier (SID) but not an 18-bit Extended

Identifier (EID).

19.2.2 EXTEN DED DATA FRAME

An extended data frame is similar to a standard data

frame but includes an extended identifier as well.

19.2.3 REMOTE FRAME

It is possible for a destination node to request the data

from the source. For this purpose, the destination node

sends a remote frame with an identifier that matches

the identifier of the required data frame. The appropri-

ate data source node will then send a data frame as a

response to this remote request.

19.2.4 ERROR FRAME

An error frame is generate d by any no de that dete ct s a

bus error. An error frame consists of 2 fields: an error

flag field and an error del im ite r field.

19.2.5 OVERLOAD FRAME

An overload frame can be generated by a node as a

result of 2 conditions. First, the node detects a domi-

nant bit during interframe space which is an illegal

conditi on. Second, due to int erna l conditions, the nod e

is not yet ab le to start rec eption of the ne xt message. A

node may generate a maximum of 2 sequential

overloa d frames to delay the s tart of th e next messag e.

19.2.6 INTERFRAME SP ACE

Interframe space separates a proceeding frame (of

whatever ty pe) from a following da ta or r emote frame.

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046). For more information on the device

instruction set and programming, refer to the “dsPIC30F/

33F Programmer’s Reference Manual” (DS70157).

dsPIC30F4011/4012

FIGURE 19-1: CAN BUFFERS AND PROTOCOL ENGINE BLOCK DIAGRAM

Acceptance Filter

RXF2(1)

Identifier

Data Field Data Field

Identifier

Acceptance Mask

RXM1(1)

Acceptance Filter

RXF3(1)

Acceptance Filter

RXF4(1)

Acceptance Filter

RXF5(1)

Acceptance Mask

RXM0(1)

Acceptance Filter

RXF0(1)

Acceptance Filter

RXF1(1)

RXB0

(1)

TXREQ

TXB2(1)

TXABT

TXLARB

TXERR

MESSAGE

Message

Queue

Control Transmit Byte Sequencer

TXREQ

TXB1(1)

TXABT

TXLARB

TXERR

MESSAGE

TXREQ

TXB0(1)

TXABT

TXLARB

TXERR

MESSAGE

Receive ShiftTransmit Shift

Receive

Error

Transmit

Error

Protocol

RERRCNT

TERRCNT

ErrPas

BusOff

Finite

State

Machine

Counter

Transmit

Logic

Bit

Timing

Logic

C1TX C1RX

Bit Ti ming

Generator

PROTOCOL

ENGINE

BUFFERS

CRC Check

CRC Generator

RXB1

(1)

Note 1: T hese are concept ual groups of registers, not SFR names by themselves.

dsPIC30F4011/4012

19.3 Modes of Operation

The CAN module can operate in one of several

operation modes selected by the user. These modes

include:

• Initialization Mode

• Disable Mode

• Normal Operation Mode

• List en On ly Mode

• Loop bac k Mo de

• Error Recognition Mode

Modes are requested by setting the REQOP<2:0> bits

(C1CTRL <10:8>). En try into a mod e is acknowl edged by

monitoring the OPMODE<2:0> bits (C1CTRL<7:5>). The

module will not change the mode and the OPMODE bits

until a change in mode is acceptable, generally during

bus Idle time which is defined as at least 11 consecutive

recessive bits.

19.3.1 INITIALIZATION MODE

In the Ini tialization mode, the module will not tra nsmit or

receive. The error counters are cleared and the inter-

rupt flags remain unchanged. The programmer will

have access to Configuration registers that are access

restricted in other modes. The module will protect the

user from accidentally violating the CAN protocol

through p rogramming er rors. All registe rs which contro l

the configuration of the module can not be modified

while the module is online. The CAN modu le will not be

allowed to enter the Configuration mode while a

transmission is taking place. The Configuration mode

serves as a lock to protect the following registers.

• All Module Control Registers

• Baud Rate and Interrupt Configuration Registers

• Bus Timing Registers

• Identifier Acceptance Filter Registers

• Identifier Acceptance Mask Registers

19.3.2 DISABLE MODE

In Disable mode, the module will not transmit or

receive . The mo dule has the ability to set the W AKIF b it

due to bus activity, howev er , an y pending interrupt s will

remain and the error counters will retain their value.

If the REQOP<2:0> bits (C1CTRL<10:8>) = 001, the

module will enter the Disable mode. If the module is

active, the module will wait for 11 recessive bits on the

CAN bus, detect that condition as an Idle bus, then

accept the disable command. When the

OPMODE<2:0> bits (C1CTRL<7:5>) = 001, that

indicates whether the module successfully went into

Disable mode. The I/O pins will revert to normal I/O

function when the module is in the Disable mode.

The module can be programmed to apply a low-pass

filter function to the C1RX input line while the module

or the CPU is in Sleep mode. The WAKFIL bit

(C1CFG2<14>) enables or disables the filter.

19.3.3 NORMAL OPERATION MODE

Normal Operation mode is selected when

REQOP<2:0> = 000. In this mode, the module is

activated and the I/O pins will assume the CAN bus

functions. The module will transmit and receive CAN

bus messages via the C1TX and C1RX pins.

19.3.4 LIST EN ONLY MO DE

If the Li st en O nl y mode is activa ted , the m od ule on the

CAN bus is passive. The transmitter buffers revert to

the port I/O function. The receive pins remain inputs.

For the rec eiv er, no error flags or Ac kn ow le dge s ignals

are sent. The error counters are deactivated in this

state. The Listen Only mode can be used for detecting

the baud rate on the CAN bus. To use this, it is neces-

sary that there are at least two further nodes that

communicate with each other.

19.3.5 ERROR RECOGNITION MODE

The module can be set to ignore all errors and receive

any message. In this mode, the data which is in the

message assembly buffer until the time an error

occurred, is copied in the receive buffer and can be

read via the CPU interface.

19.3.6 LOOPBACK MODE

If the Loopback mode is activated, the module will

connect the internal transmit signal to the internal

receive signal at the module boundary. The transmit

and receive pins revert to their port I/O function.

Note: Typically, if the CAN module is allowed to

transmit in a particular mode of operation

and a transmission is requested immedi-

ately after the CAN module has been

placed in that mode of operation, the

module waits for 11 consecutive recessive

bits on the bus before starting trans mission.

If the user switches to Disable mode within

this 11-bit period, then this transmission is

aborted and the corresponding TXABT bit is

set and TXREQ bi t is cleared.

dsPIC30F4011/4012

19.4 Message Reception

19.4.1 R EC EIV E BUFF ER S

The CAN bus module has 3 receive buffers. However,

one of the receiv e b uf fers is al ways c om mi tted to mo n-

itoring the bus for incoming messages. This buffer is

called the message assembly buffer (MAB). There are

two receive buffers, visibly denoted as RXB0 and

RXB1, that can essentially instantaneously receive a

complete message from the protocol engine.

All messages are assembled by the MAB, and are

transferred to the RXBn buffers only if the acceptance

filter criterion is met. When a message is received, the

RXxIF flag (C1INTF< 0> or C1INIF<1>) will be set. Thi s

bit can only be set by the module when a message is

received. The bit is cleared by the CPU when it has

completed processing the message in the buffer. If the

RXxIE bit (C1INTE<0> or C1INTE<1>) is set, an

interrupt will be generated when a message is

received.

RXF0 and RXF1 filters with the RXM0 mask are

associated with RXB0. The filters, RXF2, RXF3, RXF4

and RXF5, and the mask, RXM1, are associated with

RXB1.

19.4.2 MESSA GE ACCEPTANCE FILTERS

The me ssage acc eptance filters and masks ar e used to

determine if a message in the message assembly

buffer should be loaded into either of the receive buff-

ers. Once a valid message has been received into the

Message Assembly Buffer (MAB), the identifier fields of

the message are compared to the filter values. If there

is a match, that message will be loaded into the

appropri ate rec eiv e buffer.

The acceptance filter looks at incoming messages for

the RXIDE bit (CiRXnSID<0>) to determine how to

compare the identifiers. If the RXIDE bit is clear, the

message is a standard frame and only filters with the

EXIDE bit (C1RXFxSI D <0>) c lear are co mpared. If th e

RXIDE bit is set, the message is an extended frame

and only filters with the EXIDE bit set are compared.

19.4.3 MESSA GE ACCEPTANCE FILTER

MASKS

The mask bits e ssential ly determi ne which bit s to appl y

the filter to. If any m as k bit is se t to a ze ro, then that b it

will automatically be accepted regardless of the filter

bit. There are 2 prog rammab le ac cept ance filter ma sks

assoc iated with the receive bu ffers, one for each bu ffer .

19.4.4 RECEIVE OVERRUN

An overrun condition occurs when the Message

Assembly Buffer (MAB) has assembled a valid

received message, the message is accepted through

the acceptance filters, and when the receive buffer

associated with the filter has not been designated as

clear of the previous message.

The overrun error flag, RXxOVR (C1INTF<15> or

C1INTF<14>) and the ERRIF bit (C1INTF<5>) will be

set and the message in the MAB will be discarded.

If the D BEN bi t i s cle ar, RXB1 and RXB0 o pera te inde-

pendently. When this is the case, a message intended

for RXB0 will not be diverted into RXB1 if RXB0

contains an unread message and the RX0OVR bit will

be set.

If the DBEN bit is set, the overrun for RXB0 is handled

differently. If a va lid m es sa ge is r ece iv ed fo r R XB0 an d

RXFUL = 1, it indicates that RXB0 is full and

RXFUL = 0 indicates that RXB1 is empty, the mess age

for RXB0 will be loaded into RXB1. An overrun error will

not be generated for RXB0. If a valid message is

received for RXB0 and RXFUL = 1, and RXFUL = 1

indicates that both RXB0 and RXB1 are full, the

message will be lost and an overrun will be indicated

for RXB1.

19.4.5 RECEIVE ERRORS

The CAN module will detect the following receive

errors:

• Cyclic Redundancy Check (CRC) Error

• Bit Stuffing Error

• Invalid Message Receive Error

These receive errors do not generate an interrupt.

However, the receive error counter is incremented by

one in case one of these errors occur. The RXWAR bit

(C1INTF<9>) indicates that the receive error counter

has reached the CPU warning limit of 96 and an

interrupt is genera ted.

19.4.6 RECEIVE INTERRUPTS

Receive interrupts can be divided into 3 major groups,

each including various conditions that generate

interrupts:

19.4.6.1 Receive Interrupt

A mess age has been s uccessf ully recei ved and loaded

into one of the receive buffers. This interrupt is acti-

vated immediately after receiving the End-of-Frame

(EOF) field. Reading the RXxIF flag will indicate which

receive buffer caused the interrupt.

19.4.6.2 Wake-up Interrupt

The CAN module has woken up from Disable mode or

the device has woken up from Sleep mode.

dsPIC30F4011/4012

19.4.6.3 Receive Error Interrupts

A receive error inte rrup t w ill be in di cat ed b y th e ER RIF

bit. This bit shows that an error condition occurred. The

source of the error can be determined by checking the

bits in the CAN Interrupt Status register, C1INTF.

• Invalid message received.

• If any type of error occurred during reception of

the last m essag e, an error wil l be indic ated by the

IVRIF bit.

• Receiver overrun.

• The RXxOVR bit indicates that an overrun

conditi on oc curred.

• Receiver warning.

• The RXWAR bit indicates that the Receive Error

Counter (RERRCNT<7:0>) has reached the

warning limit of 96.

• Receiver error passive.

• The RXEP bit indicates that the Receive Error

Counter has ex ceeded the error passive limit

of 127 and th e module has gone into error passiv e

state.

19.5 Message Transmissi on

19.5.1 TRANSMIT BUFFERS

The CAN module has three transmit buffers. Each of

the thre e buf fers occ upies 14 bytes of d ata. Ei ght of th e

bytes a re the maximum 8 bytes of the transm itted me s-

sage. Five bytes hold the standard and extended

identifiers and other message arbitration information.

19.5.2 TRANSMIT MESSAGE PRIORITY

Transmit priority is a prioritization within each node of the

pending transmittable messages. There are 4 levels of

transmit priority . If TXPRI<1:0> (C1 TXxCON<1:0>, where

x = 0, 1 or 2, represents a particular transmit buffer) for a

particular message buffer is set to ‘11’, that buffer has the

highest priority. If TXPRI<1:0> for a particular message

buf fer is set to ‘10’ or ‘01’, that buffer has an intermediate

priority. If TXPRI<1:0> for a particular message buffer is

‘00’, that buffer has the lowest priority.

19.5.3 TRANSMISSION SEQUENCE

To initiate tran smis sion o f the m essag e, the TX REQ b it

(C1TXxCON<3>) must be set. The CAN bus module

resolves any timing conflicts between setting of the

TXREQ bit and the Start-of-Frame (SOF), ensuring

that if the priority was changed, it is resolved correctly

before the SOF occurs. When TXREQ is set, the

TXABT (C1TXxCON<6>), TXLARB (C1TXxCON<5>)

and TXERR (C1TXxCON<4>) flag bits are

automatically cleared.

Setting TXREQ bit simply flags a message buffer as

enqueued for transmission. When the module detects

an available bus, it begins transmitting the message

which has been determi ned to have the highest priori ty .

If the transmission completes successfully on the first

attempt, the TXREQ bit is cl eared autom aticall y and an

interrupt is genera t ed if TXxIE was set .

If the message transmission fails, one of the error

condition flags will be set and the TXREQ bit will

remain set, indicating that the message is still pending

for transmission. If the message encountered an error

condition during the transmission attempt, the TXERR

bit will be set and the error condition may cause an

interrupt. If the message loses arbitration during the

transmission attempt, the TXLARB bit is set. No

interrupt is generated to signal the loss of arbitration.

19.5.4 ABORTI NG MESSAGE

TRANSMISSION

The system can also abort a message by clearing the

TXREQ bit associated with each message buffer. Set-

ting the ABAT bit (C1CTRL<12>) will request an abort

of all pending messages. If the message has not yet

started transmission, or if the message started but is

interrupted by loss of arbitration or an error, the abort

will be processed. The abort is indicated when the

module sets the TXABT bit, and the TXxIF flag is not

automatically set.

19.5.5 TRANSMISSION ERRORS

The CAN module will detect the followin g trans m iss io n

errors:

• Acknowledge Error

• Form Error

• Bit Error

These transmission err ors will not necessarily generate

an interrupt but are indicated by the transmission error

counter. However, each of these errors will cause the

transmission error counter to be incremented by one.

Once the value of the error counter exceeds the value

of 96, the ERRIF (C1INTF<5>) and the TXWAR bit

(C1INTF<10>) are set. Once the value of the error

counter exceeds the value of 96, an interrupt is

generated and the TXWAR bit in the error flag register

is set.

dsPIC30F4011/4012

19.5.6 TRANSMIT INTERRUPTS

T ransmit interrupts can be divided into 2 major groups,

each including various conditions that generate

interrupts:

• Transmit Interrupt

At least one of the three transmit buffers is empty (not

scheduled) and can be loaded to schedule a message

for transmission. Reading the TXxIF flags will indicate

which transmit buffer is available and caused the

interrupt.

• Transmit Error Interrupts

A transmission error interrupt will be indicated by the

ERRIF flag. This flag shows that an error condition

occurre d. The source of t he error can be determined b y

checking the error flags in the CAN Int errupt S tatus reg-

ister, C1INTF. The flags in this register are related to

receive and transmit errors.

• Transmitter warning interrupt.

• The TXWAR bit indicates that the Transmit Error

Counte r has reache d the CPU warning limi t of 96.

• Transmitter error passive.

• The TXEP bit (C1INTF<12>) indicates that the

Transmit Error Counter has exceeded the error

passive limit of 127 and the module has gone to

error passive state.

• Bus off.

• The TXBO bit (C1INTF<13>) indicates that the

T r ans mit Error Counter (TERRCNT<7:0 >) has

exceed ed 255 and the module has g one to b us of f

state.

19.6 Baud Rate Setting

All nodes on any particular CAN bus must have the

same nomin al bit rate. In ord er to set the baud rate, the

following parameters have to be initialized:

• Syn chronization Jump Width

• Baud Rate Prescaler

• Phase Segments

• Length Determination of Phase2 Seg

• Sample Poi nt

• Propagation Segment Bits

19.6.1 BIT TIMING

All controllers on the CAN bus must have the same

baud rate and bit length. However, different controllers

are not required to have the same master oscillator

clock. At different clock frequencies of the individual

controllers, the baud rate has to be adjusted by

adjusti ng the num be r of time quan t a in eac h segm en t.

The nomi nal bit time can be though t of as being div ided

into separate non-overlapping time segments. These

segments are shown in Figure 19-2.

• Synchroniz ati on se gm ent (Syn c Seg)

• Pr opagation time segment (P rop Seg)

• Phase segment 1 (Phase1 Seg)

• Phase segment 2 (Phase2 Seg)

The time segments and also the nominal bit time are

made up of integer units of time called time quanta or

TQ. By definition, the nominal bit time has a minimum

of 8 TQ and a maximum of 25 TQ. Also, by definition,

the min im um no mi nal bit time is 1 μsec, co rres pondin g

to a maximum bit rate of 1 MHz.

FIGURE 19-2: CAN BIT TIMING

Input Signal

Sync Prop

Segment Phase

Segment 1 Phase

Segment 2 Sync

Sample Poin t

dsPIC30F4011/4012

19.6.2 PRESCALER SETTING

There is a programmable prescaler with integral values

ranging f rom 1 to 64 in additi on to a fixed divi de-by-2 for

clock generation. The Time Quantum (TQ) is a fixed

unit of time deri ve d f rom th e o sc ill ato r period, sho w n i n

Equation 19-1, where FCAN is FCY (if the CANCKS bit

is set) or 4 FCY (if CANCKS is cleared).

EQUATION 19-1: TIME QUANTUM FOR

CLOCK GENERATION

19.6.3 PROPAGATION SEGMENT

This p art of t he bit time is u sed to com pensa te phy sica l

delay ti me s withi n the ne twork . These delay times co n-

sist of the signal propagation time on the bus line and

the internal delay time of the nodes. The propagation

segment can be programmed from 1 TQ to 8 TQ by

setting the PRSEG<2:0> bits (C1CFG2<2:0>).

19.6.4 PHASE SEGMENTS

The phase segments are used to optimally locate the

sampling of the received bit within the transmitted bit

time. The sampling point is between Phase1 Seg and

Phase2 Seg. These segmen ts are lengthen ed or sho rt-

ened by res ynchronizatio n. The end of the Phase1 Seg

determines the sampling point within a bit period. The

segment is programmable from 1TQ to 8 TQ. Phase2

Seg provides delay to the next transmitted data transi-

tion. Th e segment is programmable from 1 TQ to 8 TQ,

or it may be defined to be equal to the greater of

Phase1 Seg or the in form ati on pro ce ssin g tim e (2 TQ).

The Phase1 Seg is initialized by setting bits

SEG1PH<2:0> (C1CFG2<5:3>), and Phase2 Seg is

initialized by setting SEG2PH<2:0> (C1CFG2<10:8>).

The following requirement must be fulfilled while setting

the lengths of the phase segments:

Prop aga ti on Se gm en t + Ph as e1 Se g > = Phase2 Se g

19.6.5 SAMPLE POINT

The sample point is the point of time at which the bus

level is r ea d an d inte r pret e d as th e value of tha t res pe c-

tive bit. The location is at the end of Phase1 Seg. If th e bit

timing is slow and contains many TQ, it is possible to

specify multiple sampling of the bus line at the sample

point. The level determined by the CAN bus then cor-

respo nds to the result from the majo rity de cis ion of thre e

values. The majority samples are taken at the sample

point and twice bef ore with a di stance of TQ/2. Th e CAN

module allows the user to choose between sampling

three t imes at th e sa me po int, or o nce at the same point ,

by se tti ng o r c le ari ng th e SAM b it (C1C F G 2< 6>) .

Typically, the sampling of the bit should take place at

about 60-70% through the bit time depending on the

system parameters.

19.6.6 SYNCHRONIZATION

To compensate for phase shifts between the oscillator

frequencies of the different bus stations, each CAN

controller must be able to synchronize to the relevant

signal edge of the incoming signal. When an edge in

the transmitted data is detected, the logic will compare

the location of the edge to the expected time

(synch rono us segm ent). The ci rcu it wi ll then adjust th e

values of Phase1 Seg and Phase2 Seg. There are

2 mechanisms used to synchronize.

19.6.6. 1 Har d Sy nchr oni za tio n

Hard synchronization is only done whenever there is a

‘recessive’ to ‘do minant’ edge durin g bus Idle, indic ating

the start of a message. After hard synchronization, the

bit time counters are restarted with the synchronous

segment. Hard synchronization forces the edge which

has caused the hard synchronization to lie within the

synchronization segment of the restarted bit time. If a

hard synchronization is done, there will not be a

resynchronization withi n that bit time.

19.6.6.2 Resynchronization

As a result of resynchronization, Phase1 Seg may be

lengthened or Phase2 Seg may be shortened. The

amount of lengthening or s hortening of the phase buffer

segment has an upper bound known as the

synchronization jump width, and is specified by the

SJW<1:0> bits (C1CFG1<7:6>). The value of the

synchronizati on jump width will be added to Phase1 Seg

or subtracted from Phase2 Seg. The resynchronization

jump wid th is programm able between 1TQ and 4 TQ.

The following requirement must be fulfilled whi le setting

the SJW<1:0> bits:

Phase2 Seg > Synchronization Jump Width

Note: FCAN must not exceed 30 MHz. If

CANCKS = 0, then FCY must not exceed

7.5 MHz.

TQ = 2 (BRP<5:0> + 1)/FCAN

dsPIC30F4011/4012

TABLE 19-1: CAN1 REGISTER MAP

SFR Na me Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

C1RXF0SID 0300 — — — Receive Acceptance F ilter 0 Standard Identifier<10:0> —EXIDE000u uuuu uuuu uu0u

C1RXF0EIDH 0302 ———— Receive Acceptance Filter 0 Extended Identifier<17:6> 0000 uuuu uuuu uuuu

C1RXF0EIDL 0304 Receive Acceptance Filter 0 Extended Identifier<5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXF1SID 0308 — — — Receive Acceptance F ilter 1 Standard Identifier<10:0> —EXIDE000u uuuu uuuu uu0u

C1RXF1EIDH 030A ———— Receive Acceptance Filter 1 Extended Identifier<17:6> 0000 uuuu uuuu uuuu

C1RXF1EIDL 030C Receive Acceptance Filter 1 Extended Identifier<5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXF2SID 0310 — — — Receive Acceptance F ilter 2 Standard Identifier<10:0> —EXIDE000u uuuu uuuu uu0u

C1RXF2EIDH 0312 ———— Receive Acceptance Filter 2 Extended Identifier<17:6> 0000 uuuu uuuu uuuu

C1RXF2EIDL 0314 Receive Acceptance Filter 2 Extended Identifier<5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXF3SID 0318 — — — Receive Acceptance F ilter 3 Standard Identifier<10:0> —EXIDE000u uuuu uuuu uu0u

C1RXF3EIDH 031A ———— Receive Acceptance Filter 3 Extended Identifier<17:6> 0000 uuuu uuuu uuuu

C1RXF3EIDL 031C Receive Acceptance Filter 3 Extended Identifier<5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXF4SID 0320 — — — Receive Acceptance F ilter 4 Standard Identifier<10:0> —EXIDE000u uuuu uuuu uu0u

C1RXF4EIDH 0322 ———— Receive Acceptance Filter 4 Extended Identifier<17:6> 0000 uuuu uuuu uuuu

C1RXF4EIDL 0324 Receive Acceptance Filter 4 Extended Identifier<5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXF5SID 0328 — — — Receive Acceptance F ilter 5 Standard Identifier<10:0> —EXIDE000u uuuu uuuu uu0u

C1RXF5EIDH 032A ———— Receive Acceptance Filter 5 Extended Identifier<17:6> 0000 uuuu uuuu uuuu

C1RXF5EIDL 032C Receive Acceptance Filter 5 Extended Identifier<5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXM0SID 0330 — — — Receive Acceptance Mask 0 St andard Identifier<10:0> —MIDE000u uuuu uuuu uu0u

C1RXM0EIDH 0332 ———— Receive Acceptance Mask 0 Extended Identifier<17:6> 0000 uuuu uuuu uuuu

C1RXM0EIDL 0334 Receive Acceptance Mask 0 Extended Identifier<5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXM1SID 0338 — — — Receive Acceptance Mask 1 St andard Identifier<10:0> —MIDE000u uuuu uuuu uu0u

C1RXM1EIDH 033A ———— Receive Acceptance Mask 1 Extended Identifier<17:6> 0000 uuuu uuuu uuuu

C1RXM1EIDL 033C Receive Acceptance Mask 1 Extended Identifier<5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1TX2SID 0340 Transmit Buffer 2 Standard Identifier<10:6> — — — Transmit Buffer 2 Standard Identifier<5:0> SRR TXIDE uuuu u000 uuuu uuuu

C1TX2EID 0342 Transmit Buffer 2 Extended Identifier<17:14> — — — — Transmit Buffer 2 Extended Identifier<13:6> uuuu 0000 uuuu uuuu

C1TX2DLC 0344 Tran smi t Buffer 2 Exten ded Identi f ie r<5 :0> TXRTR T XRB1 TXRB0 DLC<3:0> — — — uuuu uuuu uuuu u000

C1TX2B1 0346 Transmit Buffer 2 Byte 1 Transmit Buffer 2 Byte 0 uuuu uuuu uuuu uuuu

C1TX2B2 0348 Transmit Buffer 2 Byte 3 Transmit Buffer 2 Byte 2 uuuu uuuu uuuu uuuu

C1TX2B3 034A Transmit Buffer 2 Byte 5 Transmit Buffer 2 Byte 4 uuuu uuuu uuuu uuuu

C1TX2B4 034C Transmit Buffer 2 Byte 7 Transmit Buffer 2 Byte 6 uuuu uuuu uuuu uuuu

C1TX2CON 034E — — — — — — — — — TXABT TXLARB TXERR TXREQ — TXPRI<1:0> 0000 0000 0000 0000

C1TX1SID 0350 Transmit Buffer 1 Standard Identifier<10:6> — — — Transmit Buffer 1 Standard Identifier<5:0> SRR TXIDE uuuu u000 uuuu uuuu

C1TX1EID 0352 Transmit Buffer 1 Extended Identifier<17:14> — — — — Transmit Buffer 1 Extended Identifier<13:6> uuuu 0000 uuuu uuuu

C1TX1DLC 0354 Tran smi t Buffer 1 Exten ded Identi f ie r<5 :0> TXRTR T XRB1 TXRB0 DLC<3:0> — — — uuuu uuuu uuuu u000

Legend: u = uninitialized bit

Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for de scrip tions of register bit fields.

dsPIC30F4011/4012

C1TX1B1 0356 Transmit Buffer 1 Byte 1 Transmit Buffer 1 Byte 0 uuuu uuuu uuuu uuuu

C1TX1B2 0358 Transmit Buffer 1 Byte 3 Transmit Buffer 1 Byte 2 uuuu uuuu uuuu uuuu

C1TX1B3 035A Transmit Buffer 1 Byte 5 Transmit Buffer 1 Byte 4 uuuu uuuu uuuu uuuu

C1TX1B4 035C Transmit Buffer 1 Byte 7 Transmit Buffer 1 Byte 6 uuuu uuuu uuuu uuuu

C1TX1CON 035E — — — — — — — — — TXABT TXLARB TXERR TXREQ — TXPRI<1:0> 0000 0000 0000 0000

C1TX0SID 0360 Transmit Buffer 0 Standard Identifier<10:6> — — — Transmit Buffer 0 Standard Identifier<5:0> SRR TXIDE uuuu u000 uuuu uuuu

C1TX0EID 0362 Transmit Buffer 0 Extended Identifier<17:14> — — — — Transmit Buffer 0 Extended Identifier<13:6> uuuu 0000 uuuu uuuu

C1TX0DLC 0364 Tran smi t Buffer 0 Exten ded Identi f ie r<5 :0> TXRTR T XRB1 TXRB0 DLC<3:0> — — — uuuu uuuu uuuu u000

C1TX0B1 0366 Transmit Buffer 0 Byte 1 Transmit Buffer 0 Byte 0 uuuu uuuu uuuu uuuu

C1TX0B2 0368 Transmit Buffer 0 Byte 3 Transmit Buffer 0 Byte 2 uuuu uuuu uuuu uuuu

C1TX0B3 036A Transmit Buffer 0 Byte 5 Transmit Buffer 0 Byte 4 uuuu uuuu uuuu uuuu

C1TX0B4 036C Transmit Buffer 0 Byte 7 Transmit Buffer 0 Byte 6 uuuu uuuu uuuu uuuu

C1TX0CON 036E — — — — — — — — — TXABT TXLARB TXERR TXREQ — TXPRI<1:0> 0000 0000 0000 0000

C1RX1SID 0370 — — — Receive Buffer 1 Standard Identifier<10:0> SRR RXIDE 000u uuuu uuuu uuuu

C1RX1EID 0372 ———— Receive Buffer 1 Extended Identifier<17:6> 0000 uuuu uuuu uuuu

C1RX1DLC 0374 Receive Buffer 1 Extended Identifier<5 :0> RXRTR RXR B1 — — — RXRB0 DLC<3:0> uuuu uuuu 000u uuuu

C1RX1B1 0376 Receive Buffer 1 Byte 1 Receive Buffer 1 Byte 0 uuuu uuuu uuuu uuuu

C1RX1B2 0378 Receive Buffer 1 Byte 3 Receive Buffer 1 Byte 2 uuuu uuuu uuuu uuuu

C1RX1B3 037A Receive Buffer 1 Byte 5 Receive Buffer 1 Byte 4 uuuu uuuu uuuu uuuu

C1RX1B4 037C Receive Buffer 1 Byte 7 Receive Buffer 1 Byte 6 uuuu uuuu uuuu uuuu

C1RX1CON 037E — — — — — — — —RXFUL— — — RXRTRRO FILHIT<2:0> 0000 0000 0000 0000

C1RX0SID 0380 — — — Receive Buffer 0 Standard Identifier<10:0> SRR RXIDE 000u uuuu uuuu uuuu

C1RX0EID 0382 ———— Receive Buffer 0 Extended Identifier<17:6> 0000 uuuu uuuu uuuu

C1RX0DLC 0384 Receive Buffer 0 Extended Identifier<5 :0> RXRTR RXR B1 — — — RXRB0 DLC<3:0> uuuu uuuu 000u uuuu

C1RX0B1 0386 Receive Buffer 0 Byte 1 Receive Buffer 0 Byte 0 uuuu uuuu uuuu uuuu

C1RX0B2 0388 Receive Buffer 0 Byte 3 Receive Buffer 0 Byte 2 uuuu uuuu uuuu uuuu

C1RX0B3 038A Receive Buffer 0 Byte 5 Receive Buffer 0 Byte 4 uuuu uuuu uuuu uuuu

C1RX0B4 038C Receive Buffer 0 Byte 7 Receive Buffer 0 Byte 6 uuuu uuuu uuuu uuuu

C1RX0CON 038E — — — — — — — —RXFUL— — — RXRTRRO DBEN JTOFF FILHIT0 0000 0000 0000 0000

C1CTRL 0390 CANCAP — CSIDL ABAT CANCKS REQOP<2:0> OPMODE<2:0> — ICODE<2:0> —0000 0100 1000 0000

C1CFG1 0392 — — — — — — — — SJW<1:0> BRP<5:0> 0000 0000 0000 0000

C1CFG2 0394 —WAKFIL— — — SEG2PH<2:0> SEG2PHTS SAM SEG1PH<2:0> PRSEG<2:0> 0u00 0uuu uuuu uuuu

C1INTF 0396 RX0OVR RX1OVR TXBO TXEP RXEP TXWAR RXWAR EWARN IVRIF WAKIF ERRIF TX2IF TX1IF TX0IF RX1IF RX0IF 0000 0000 0000 0000

C1INTE 0398 — — — — — — — — IVRIE WAKIE ERRIE TX2IE TX1IE TX0IE RX1IE RX0IE 0000 0000 0000 0000

C1EC 039A TERRCNT<7:0> RERRCNT<7:0> 0000 0000 0000 0000

TABLE 19-1: CAN1 REGISTER MAP (CONTINUED)

SFR Na me Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

Legend: u = uninitialized bit

Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for de scrip tions of register bit fields.

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

20.0 10-BIT, HIGH-SPEED

ANALOG-TO-DIGITAL

CONVERTER (ADC) MODULE

The 10-bit, high-speed Analog-to-Digital Converter

(ADC) allows conversion of an analog input signal to a

10-bit digital number. This module is based on a

Succes sive Ap proximation Regis ter (SAR ) archite cture

and provides a maximum sam pling rate of 1 Msps. The

ADC module has 16 analog inputs which are multi-

plexed into four s ample and hold ampli fiers. The o utput

of the sample and hold is the input into the converter

which generates the result. The analog reference

voltages are software selectable to either the device

supply voltage (AVDD/AVSS) or the volt a ge lev el on the

(VREF+/VREF-) pins. The ADC module has a unique

feature of being able to operate while the device is in

Sleep mode.

The ADC module has si x, 16-bit registers:

• A/D Control Register 1 (ADCON1)

• A/D Control Register 2 (ADCON2)

• A/D Control Register 3 (ADCON3)

• A/D Input Select Register (ADCHS)

• A/D Port Configuration Register (ADPCFG)

• A/D Input Scan Selection Register (ADCSSL)

The ADCON1, ADCON2 and ADCON3 registers

control the operation of the ADC module. The ADCHS

ADPCFG register configures the port pins as analog

inputs or as digital I/O. The ADCSSL register selects

input s for sca nni ng .

The block diagram of the ADC module is shown in

Figure 20-1.

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046). For more information on the device

instruction set and programming, refer to the “dsPIC30F/

33F Programmer’s Reference Manual” (DS70157).

Note: The SSRC<2:0>, ASAM, SIMSAM,

SMPI<3:0>, BUFM and ALTS bits, as well

as the ADCON3 and ADCSSL registers,

must not be written to while ADON = 1.

This would lead to indeterminate results.

dsPIC30F4011/4012

FIGURE 20-1: 10-BIT, HIGH-SPEED ADC FUNCTIONAL BLOCK DIAGRAM

S/H

10-bit Result Conversion Logic

VREF+

AVSS

AVDD

ADC

Data

16-word, 10-bit

Dual Port

Buffer

Bus Interface

AN0

AN5

AN7

AN1

AN2

AN3

AN4

AN6

AN8

*AN8

AN4

AN5

*AN6

*AN7

AN0

AN1

AN2

AN3

CH1

CH2

CH3

CH0

AN5

AN2

AN8

AN4

AN1

AN7

AN3

AN0

AN6

AN1

VREF-

Sample/Sequence

Control

Sample

CH1,CH2,

CH3,CH0

Input MUX

Control

Input

Switches

S/H

Format

* Not available on dsP IC 30 F401 2.

dsPIC30F4011/4012

20.1 A/D Result Buffer

The module contains a 16-word, dual port, read-only

buffer, called ADCBUF0...ADCBUFF, to buffer the A/D

result s. The RAM i s 10 bits wi de, but is read into differe nt

format 16-bit words. The contents of the sixteen A/D

Conve rsi on R esu lt Buffer regis ters, ADCBUF0 through

ADCBUFF, cannot be written by user software.

20.2 Conversion Operation

After the ADC mo dule has been configured, the sample

acquisition is started by setting the SAMP bit. Various

sources, such as a programmable bit, timer time-outs

and external events, terminate acquisition and start a

conversion. When the A/D conversion is complete, the

result is loaded into ADCBUF0...ADCBUFF, and the A/D

Interrupt Flag, ADIF, and the DONE bit are set after the

number of samples spec ified by the SMPI<3:0> bits.

The following steps should be followed for doing an

A/D conversion:

1. Configu re th e ADC module:

- Configure analog pins, voltage reference

and digital I/O

- Sele c t A/D input channels

- Select A/D conve r si on cl ock

- Select A/D conve rsi on trig ger

- Turn on ADC module

2. Configu re the A/D interrupt (if required):

- Clear ADIF bit

- Select A/D interrupt priority

3. Start sampling.

4. Wait the required acquisition time.

5. Trigger acquisition end, start conversion.

6. Wait for A/D conversion to complete by either:

- Waiting for the A/D interrupt

- Waiting for the DONE bit to get set

7. Read A/D result buffer, clear ADIF if required.

20.3 Selecting the Conversion

Sequence

Several groups of control bits select the sequence in

which the A/D connects inputs to the sample/hold

channe ls, convert s chann els, w rites the buff er memo ry

and generates interrupts. The sequence is controlled

by the sampling clocks.

The SIMSAM bit controls the acquire/convert

sequence for multiple channels. If the SIMSAM bit is

‘0’, the two or four se lec ted chan ne ls are acqu ired and

converted sequentially with two or four sample clocks.

If the SIMSAM bit is ‘1’, two or four selected channels

are acquired simultaneously with one sample clock.

The channels are then converted sequentially.

Obviously, if there is only 1 channel selected, the

SIMSAM bit is not applicable.

The CHPS<1:0> bits select how many channels are

sampled. This selection ca n vary from 1, 2 or 4 channels.

If the CHPS bits select 1 channel, the CH0 channel is

sampled at the sample clock and converted. The result is

store d in the bu ffer. If the CHPS bi ts sel ect 2 cha nnels,

the CH0 and CH1 channels are sampled and converted.

If the CHPS bits select 4 channels, the CH0, CH1, CH2

and CH3 channels are sampled and converted.

The SMPI<3:0> bits select the number of acquisition/

convers io n s eq uen ce s that woul d b e p erfo rmed before

an interrupt occurs. This can vary from 1 sample per

interrupt to 16 samples per interrupt.

The user cannot program a combination of CHPS and

SMPI bits that specifies more than 16 conversions per

interrupt, or 8 conversions per interrupt, depending

on the BUFM bit. The BUFM bit, whe n set, splits the

16-word results buffer (ADCBUF0...ADCBUFF) into

two, 8-word groups. Writing to the 8-word buffers is

alternate d on each in terrupt event. Use o f the BUFM bit

depends on how much time is available for moving data

out of the buffers after the interrupt, as determined by

the application.

If the processor can quickly unload a full buffer within

the time it takes to acquire and convert one channel,

the BUFM bit can be ‘0’ and up to 16 conversions

may be done per interrupt. The processor has one

sample-and-conversion time to move the sixteen

conversions.

If the processor cannot unload the buffer within the

acquisition and conversion time, the BUFM bit should be

‘1’. For example, if SMPI<3:0> (ADCON2<5:2>) = 0111,

then eight conversions are loaded into half of the buf fer,

following which an interrupt occurs. The next eight

conversions are loaded into the other half of the buffer.

The processor has the entire time between interrupts to

move the eight conversio n s.

The ALTS bit can be used to alternate the inputs

selected during the sampling sequence. The input

multiplexer has two sets of sample inputs: MUX A and

MUX B. If the ALTS bit i s ‘0’, onl y the MUX A input s are

selected for sampling. If the ALTS bit is ‘1’ and

SMPI<3:0> = 0000, on the first sample/convert

sequence, the MUX A inputs are selected, and on the

next acquire/convert sequence, the MUX B inputs are

selected.

The CSCNA bit (ADCON2<10>) allows the CH0

channel inputs to be alternately scanned across a

select ed number of analog i nputs for the MUX A g roup.

The inputs are selected by the ADCSSL register. If a

particular bit in the ADCSSL register is ‘1’, the corre-

sponding input is selected. The inputs are always

scanne d from low er to higher numbered in puts, st arting

after each interrupt. If the number of inputs selected is

greate r than the number of s amples ta ken per int errupt,

the higher numbered inputs are unused.

dsPIC30F4011/4012

20.4 Programming the Start of the

Conversion Trigger

The conv ersion trigger ter minates a cq ui sit io n and st arts

the requested conversions.

The SSRC<2:0> bits select the source of the

conversion trigger.

The SSRC bits provide for up to 5 alternate sources of

conversion trigger.

When SSRC<2:0> = 000, the conversion trigger is

under soft ware c ontro l. Clea ring the SA MP bit cause s

the conversion trigger.

When SSRC<2:0> = 111 (Auto-Start mode), the con-

version trigger is under A/D clock control. The SAMC

bits select the number of A/D clocks between the start

of acqu isitio n and the s t art of conv ers ion . T his p r ov ide s

the fastest conversion rates on multiple channels.

SAMC must always be at least 1 clock cycle.

Other trigger sources can come from timer modules,

motor control PWM module or external interrupts.

20.5 Aborting a Conversion

Clearing the ADON bit during a conversion aborts the

current conversion and stops the sampling sequencing.

The ADCBUFx is not updated with the partially com-

pleted A/D conversion sample. That is, the ADCBUFx

will continue to contain the value of the last completed

conversion (or the last value written to the ADCBUFx

If the clearing of the ADON bit coincides with an

auto-start, the clearing has a higher priority.

After the A/D conversion is aborted, a 2 TAD wait is

required before the next sampling may be started by

setting the SAMP bit.

If se quential sampl ing is specifi ed, the A/D conti nues at

the next sample pulse, which correspo nds with the next

channel converted. If simultaneous sampling is speci-

fied, the A/D continues with the next multichannel

group conversion sequence.

20.6 Selecting the A/D Conversion

Clock

The A/ D conv ersion requir es 12 TAD. The source of the

A/D conversion clock is software selected using a 6-bit

counter. There are 64 possible options for TAD.

EQUATION 20-1: A/D CONVERSION CLOCK

The internal RC oscillator is selected by setting the

ADRC bit.

For correct A/D conversions, the A/D conversion clock

(TAD) must be selected to ensure a minimum TAD time

of 83.33 nsec (for VDD = 5V). Refer to Section 24.0

“Electrical Characteristics” for minimum TAD under

other ope rati ng con di tion s.

Example 20-1 shows a sample calculation for the

ADCS<5:0> bits, assuming a device operating speed

of 30 MIPS.

EXAMPLE 20-1: A/D CONVERSION CLOCK

CALCULATION

Note: To operate the ADC at the maximum

specified conversion speed, the auto-

convert trigger option should be selected

(SSRC = 111) and the auto-sample

time bits should be set to ‘1’ TAD

(SAMC = 00001). This configuration gives

a total conversion period (sample + convert)

of 13 TAD.

The use of any other conversion trigger

results in additional TAD cycles to

synchronize the external event to the

ADC.

TAD = TCY * (0.5 * (ADCS < 5:0> + 1) )

ADCS<5:0> = 2 – 1

TAD

TCY

TAD = 154 nsec

ADCS<5:0> = 2 – 1

TAD

TCY

TCY = 33 nsec (30 MIPS)

= 2 • – 1

154 ns ec

33 nsec

= 8.33

Therefore,

Set ADCS<5 :0> = 9

Actual TAD = (ADCS<5:0> + 1)

TCY

= (9 + 1)

33 nse c

= 165 ns ec

dsPIC30F4011/4012

20.7 A/D Conversion Speeds

The dsPIC30F 10-bit ADC specifications permit

a maximum 1 Msps sampling rate. Table 20-1

summarizes the conversion speeds for the dsPIC30F

10-bit ADC and the required operating conditions.

TABLE 20-1: 10-BIT A/D CONVERSION RATE PARAMETERS

dsPIC30F 10-bit A/D Converter Conversion Rates

A/D Speed TAD

Minimum Sampling

Time Min. RS Max. VDD Temperature A/D Channels Configuration

Up to

1 Msps(1) 83.33 ns 12 TAD 500Ω4.5V to 5.5V -40°C to +85°C

Up to

750 ksps(1) 95.24 ns 2 TAD 500Ω4.5V to 5.5V -40°C to +85°C

Up to

600 ksps(1) 138.89 ns 12 TAD 500Ω3.0V to 5.5V -40°C to +125°C

Up to

500 ksps 153.85 ns 1 TAD 5.0 kΩ4.5V to 5.5V -40°C to +125°C

Up to

300 ksps 256.41 ns 1 TAD 5.0 kΩ3.0V to 5.5V -40°C to +125°C

Note 1:

External V

REF

- and V

REF

+ pins must be used for correct operation. See Figure 20-2 for recommended circuit.

REF

-V

REF

ADC

ANx S/H

S/H

CH1, CH2 or CH3

CH0

REF

-V

REF

ADC

ANx S/H CH

REF

-V

REF

ADC

ANx S/H

S/H

CH1, CH2 or CH3

CH0

REF

-V

REF

ADC

ANx S/H CH

ANx or V

REF

-V

REF

ADC

ANx S/H CH

ANx or V

REF

dsPIC30F4011/4012

The configuration guidelines give the required setup

values for the conversion speeds above 500 ksps , since

they require external V

REF

pins usage and there are

some differences in the configuration procedure. Config-

uration details that are not critical to the conversion

speed have been omitted.

Figure 20-2 depicts the recommended circuit for the

conversion rates above 500 ksps.

FIGURE 20-2: A/D CONVERTER VOLTAGE REFERENCE SCHEMATIC

20.7.1 1 Msps CONFIGURATION

GUIDELINE

The co nfiguration f or 1 Msp s operatio n is depen dent on

whether a single input pin is to be sampled or whether

multiple pins are to be sampled.

20.7.1.1 Single Analog Input

For conversions at 1 Msps for a single analog input, at

least two sample and hold channels must be enabled.

The analog input multiplexer must be configured so

that the same input pin is connected to both sample

and hol d chan nels. The A/D con vert s the va lue he ld on

one S/H channel while the second S/H channel

acq uires a new input sample.

20.7.1.2 Multiple Analog Inputs

The ADC can also be used to sample multiple analog

input s using mult iple sampl e and hold chann els. In thi s

case, the total 1 Msp s conversion rat e is divided among

the dif ferent input signa ls. For exampl e, four input s can

be sampl ed at a rate of 250 ksp s for each signal, or two

inputs could be sampled at a rate of 500 ksps for each

signal. Sequential sampling must be used in this

configu r ati on t o a llow adequa te s am pl ing ti me on e ac h

input.

REF

VDD

VDD VDD

12 44

VDD

VSS

AVDD

AVSS

VDD

VSS VDD

VSS

dsPIC30F4011

0.01 μF

0.1 μF

1 μFC7

0.1 μFC6

0.01 μF

VDD VDD VDD

1 μFC4

0.1 μFC3

0.01 μF

dsPIC30F4011/4012

20.7.1.3 1 Msps Configuration Items

The following configuration items are required to

achieve a 1 Msps conversion rate.

• Compl y with con di t ion s provided in Tab le 20-2

• Connect external VREF+ and VREF- pins following

the recommended circuit shown in Figure 20-2

• Set SSRC<2:0> = 111 in the ADCO N1 regist er to

enable the auto-convert opti on

• Enable automatic sampling by setting the ASAM

control bit in the ADCON1 register

• Enabl e seq uen tial sam pli ng by cl eari ng the

SIMSAM bit in the ADCON1 register

• Enable at least two sample and hold channels by

writing the CHPS<1:0> control bits in the

ADCON2 register

• Write the SMPI<3 :0> con trol bit s in the ADCON2

between interrupts. At a minimum, set SMPI<3:0>

= 0001 since at least two sample and hold chan-

nels should be enabled

• Configure the A/D clock period to be:

by writing to the ADCS<5:0> control bits in the

ADCON3 register

• Configure the sampling time to be 2 TAD by

writing: SAMC<4:0> = 00010

• Select at least two channels per analog input pin

by writing to the ADCHS register

20.7.2 750 ksps CONFIGURATION

GUIDELINE

The following configuration items are required to

achiev e a 7 50 k s p s con ve r si on ra te. T his co nfiguration

assumes that a single analog input is to be sampled.

• Compl y with con di t ion s provided in Tab le 20-2

• Connect external VREF+ and VREF- pins following

the recommended circuit shown in Figure 20-2

• Set SSRC<2:0> = 111 in the ADCO N1 regist er to

enable the auto-convert opti on

• Enable automatic sampling by setting the ASAM

control bit in the ADCON1 register

• Enable one sample and hold channel by setting

CHPS<1:0> = 00 in the ADCON2 register

• Write the SMPI<3 :0> con trol bit s in the ADCON2

between interrupts

• Configure the A/D clock period to be:

by writing to the ADCS<5:0> control bits in the

ADCON3 register

• Configure the sampling time to be 2 TAD by

writing: SAMC<4:0> = 00010

20.7.3 600 ksps CONFIGURATION

GUIDELINE

The configuration for 600 ksps operation is dependent

on whether a single input pin is to be sampled or

whether multiple pins are to be sampled.

20.7.3. 1 Single Analog Input

When performing conversions at 600 ksps for a single

analog input, at least two sample and hold channels

must be enabl ed. The analog input multip lexer must be

configured so that the same input pin is connected to

both sam ple an d hold c hanne ls. The ADC con vert s the

value held on one S/H channel, while the second S/H

channel acquires a new input sample.

20.7.3.2 Multiple Analog Input

The ADC can also be used to sample multiple analog

input s using mult iple sampl e and hold chann els. In thi s

case, the total 600 ksps conversion rate is divided

among the different input signals. For example, four

inputs can be sampled at a rate of 150 ksps for each

signal or two inputs can be sampled at a rate of

300 ksps fo r e ach s ig nal . Sequent ial s am pli ng m us t b e

used in this configuration to allow adequate sampling

time on each input.

20.7.3.3 600 ksps Configuration Items

The following configuration items are required to

achieve a 600 ksps conversion rate.

• Comply with conditions provided in Table 20-2

• Connect external VREF+ and V REF- pins following

the recommended circuit shown in Figure 20-2

• Set SSRC<2:0> = 111 in the ADCON1 regist er to

enable the auto-convert option

• Enable automatic sampling by setting the ASAM

control bit in the AD CON1 register

• Enable sequential sampling by clearing the

SIMSAM bit in the ADCON1 register

• Enable at least two sample and hold channels by

writin g the CHPS <1:0> control bits in the

ADCON2 register

• Write the SMPI<3:0> control bits in the ADCON2

between interrupts. At a minimum, set

SMPI<3:0> = 0001 s ince at least two s ample and

hold channels should be enabled

• Config ure the A/D clock period to be:

by writing to the ADCS<5:0> control bits in the

ADCON3 register

• Configure the sampling time to be 2 TAD by

writing: SAMC<4:0> = 00010

Select at least two channels per analog input pin by

writing to the ADCHS register.

12 x 1,000,000 = 83.33 ns

(12 + 2) x 750,000 = 95.24 ns

12 x 600,000 = 138.89 ns

dsPIC30F4011/4012

20.8 A/D Acquisition Requirements

The analog input model of the 10-bit ADC is shown in

Figure 20-3. The total sampling time for the ADC is a

function of the internal amplifier settling time, device

VDD and the holding capacitor charge time.

For the ADC to meet its specified accuracy, the charge

holding capacitor (CHOLD) must be allowed to fully

charge to the voltage level on the analog input pin. The

source impedance (RS), the interconnect impedance

(RIC) and the internal sampl ing sw itch (RSS) impedance

combine to directly affect the ti me required to charge the

capac i t o r CHOLD. The combined impedance of the ana-

log sources must therefore be small enough to fully

charge the holding capacitor within the chosen sample

time. To minimize the effects of pin leakage currents on

the accuracy of the ADC, the maximum recommended

source impedance, RS, is 5 kΩ. After the analog input

channel is selected (changed), this sampling function

must be completed prior to starting the conversion. The

internal holding capacitor will be in a discharged state

prior to each sample operation.

The us er mus t all ow at le ast 1 TAD pe riod o f sampl ing

time, TSAMP, between conversions to allow each sam-

ple to be ac quired . This s ample time ma y be co ntrolle d

manually in software by setting/clearing the SAMP bit,

or it ma y be aut om atic al ly con trol led by the AD C. In an

automatic configuration, the user must allow enough

time between conversion triggers so that the minimum

sample time can be satisfied. Refer to Section 24.0

“Electrical Characteristics” for TAD and sample time

requirements.

FIGU RE 20-3 : A/D CO NVE R TE R AN ALO G I N PUT M ODE L

CPIN

Rs ANx VT = 0.6V

VT = 0.6V ILEAKAGE

RIC ≤ 250ΩSampling

Switch

RSS

CHOLD

= DAC Capacitance

VSS

VDD

= 4.4 pF

±500 nA

Legend: CPIN

I leakage

RIC

RSS

CHOLD

= Input Capacitance

= Threshold Voltage

= Leakage Current at the pin due to

= Interconnect Resistance

= Sampling Switch Resistance

= Sample/Hold Capacitance (from DAC)

various junctions

Note: CPIN value depends on device package and is not tested. Effect of CPIN negligible if Rs ≤ 5 kΩ.

RSS ≤ 3 kΩ

dsPIC30F4011/4012

20.9 Module Power-Down Modes

The module has 3 internal power modes. When the

ADON bit is ‘1’, the module is in Active mode; it is fully

powered and function al. When ADO N is ‘0’, th e module

is in Off mode. The digital and analog portions of the

circuit are disabled for maximum current savings. In

order to return to the Active mode from Off mode, the

user must wait for the ADC circuitry to stabilize.

20.10 A/D Operation During CPU Sleep

and Idle Modes

20.10.1 A/D OPERATION DURING CPU

SLEEP MODE

When the device enters Sleep mode, all clock sources

to the module are shut down and stay at logic ‘0’.

If Sleep occurs in the middle of a conversion, the

conversion is aborted. The converter will not continue

with a partially completed conversion on exit from

Sleep mode.

entering or leaving Sleep mode.

The ADC mo dule can op erate during Sl eep mode if th e

A/D clock source is set to RC (ADRC = 1). When the

RC clock source is selected, the ADC module waits

one instruction cycle before starting the conversion.

This allows the SLEEP instruction to be executed,

which eliminates all digital switching noise from the

conversion. When the conversion is complete, the

DONE bit is set and the result is loaded into the

ADCBUFx register.

If the A/D interrupt is enabled, the device wakes up

from Sleep. If the A/D interrupt is not enable d, the ADC

module is then turned off, although the ADON bit

remains set.

20.10.2 A/D OPERATION DURING CPU IDLE

MODE

The ADSIDL bit selects if the module stops on Idle or

continues on Idle. If ADSIDL = 0, t he m odule co ntinues

operatio n on assertio n of Idle mode. If ADSIDL = 1, the

module stops on Idle.

20.11 Effects of a Reset

A device Reset forces all registers to their Reset state.

This forces the ADC module to be turned off, and any

conversion and acquisition sequence is aborted. The

values that are in the ADCBUFx registers are not

modified. The A/D Result register contains unknown

data after a Power-on Reset.

20.12 Output Formats

The A/D result is 10 bits wide. The data buffer RAM is

also 10 b it s wid e. The 10 -bit data can be read in one of

four different formats. The FORM<1:0> bits select the

format. Each of the outpu t format s trans lates t o a 16-bit

result on the data bus.

Write data will always be in right justified (integer)

format.

FIGURE 20-4: A/D OUTPUT DATA FORMATS

RAM Contents: d09 d08 d07 d06 d05 d04 d03 d02 d01 d00

Read to Bus:

Signed Fractional (1.15) d09 d08d07d06d05d04d03d02d01d00000000

Fractional (1.15)d09d08d07d06d05d04d03d02d01d00000000

Signed Integer d09 d09 d09 d09 d09 d09 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00

Integer 0 0 0 0 0 0 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00

dsPIC30F4011/4012

20.13 Configuring Anal og Port Pins

The use of the ADPCFG and TRIS registers control the

operation of the ADC port pins. The port pins that are

desired as analog inputs must have their corresp onding

TRIS bit set (input). If the TRIS bit is cleared (output), the

digital output lev el (VOH or VOL) is converted.

The A/D operation is independent of the state of the

CH0SA<3:0>/CH0SB<3:0> bits and the TRIS bits.

When read ing the POR T register, all pins c onfigured a s

analog input channels are read as cleared.

Pins configured as digital inp uts will not convert an ana-

log input. Analog levels on any pin that is defined as a

digital input (including the ANx pins), may cause the

input buffer to consume current that exceeds the

device specifications.

20.14 Connection Considerations

The anal og inp uts h ave diod es to VDD and V SS as ESD

protection. This requires that the analog input be

betwee n VDD and VSS. If the input voltage exceeds this

range by greater th an 0.3V (eit her direct ion), one o f the

diodes becomes forward b iased and it may damage the

device if the input curre nt specificati on is exce ede d.

An external RC filter is sometimes added for anti-

aliasi ng of the input signal. The R component should be

select ed to ens ure that the sampl ing time requir ement s

are satisfied. Any external components connected (via

high-impedance) to an analog input pin (capacitor,

zener diode, etc.) should have very little leakage

current at the pin.

dsPIC30F4011/4012

TABLE 20-2: ADC REGISTER MAP

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

ADCBUF0 0280 — — — — — — ADC Data Buffer 0 0000 00uu uuuu uuuu

ADCBUF1 0282 — — — — — — ADC Data Buffer 1 0000 00uu uuuu uuuu

ADCBUF2 0284 — — — — — — ADC Data Buffer 2 0000 00uu uuuu uuuu

ADCBUF3 0286 — — — — — — ADC Data Buffer 3 0000 00uu uuuu uuuu

ADCBUF4 0288 — — — — — — ADC Data Buffer 4 0000 00uu uuuu uuuu

ADCBUF5 028A — — — — — — ADC Data Buffer 5 0000 00uu uuuu uuuu

ADCBUF6 028C — — — — — — ADC Data Buffer 6 0000 00uu uuuu uuuu

ADCBUF7 028E — — — — — — ADC Data Buffer 7 0000 00uu uuuu uuuu

ADCBUF8 0290 — — — — — — ADC Data Buffer 8 0000 00uu uuuu uuuu

ADCBUF9 0292 — — — — — — ADC Data Buffer 9 0000 00uu uuuu uuuu

ADCBUFA 0294 — — — — — — ADC Data Buffer 10 0000 00uu uuuu uuuu

ADCBUFB 0296 — — — — — — ADC Data Buffer 11 0000 00uu uuuu uuuu

ADCBUFC 0298 — — — — — — ADC Data Buffer 12 0000 00uu uuuu uuuu

ADCBUFD 029A — — — — — — ADC Data Buffer 13 0000 00uu uuuu uuuu

ADCBUFE 029C — — — — — — ADC Data Buffer 14 0000 00uu uuuu uuuu

ADCBUFF 029E — — — — — — ADC Data Buffer 15 0000 00uu uuuu uuuu

ADCON1 02A0 ADON —ADSIDL— — — FORM<1:0> SSRC<2:0> — SIMSAM ASAM SAMP DONE 0000 0000 0000 0000

ADCON2 02A2 VCFG<2:0> —— CSCNA CHPS<1:0> BUFS — SMPI<3:0> BUFM ALTS 0000 0000 0000 0000

ADCON3 02A4 — — — SAMC<4:0> ADRC — ADCS<5:0> 0000 0000 0000 0000

ADCHS 02A6 CH123NB<1:0> CH123SB CH0NB CH0SB<3:0> CH123NA<1:0> CH123SA CH0NA CH0SA<3:0> 0000 0000 0000 0000

ADPCFG 02A8 — — — — — — — PCFG8* PCFG7* PCFG6* PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000 0000 0000 0000

ADCSSL 02AA — — — — — — — CSSL8* CSSL7* CSSL6* CSSL5 CSSL4 CSSL3 CSSL2 CSSL1 CSSL0 0000 0000 0000 0000

Legend: u = uninitialized bit

* Not available on dsPIC30F4012.

Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for de scrip tions of register bit fields.

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

21.0 SYSTEM INTEGRATION

There are several features intended to maximize

system reliability, minimize cost through elimination of

external components, provide power-saving operating

modes and of fer code protection:

• Oscillator Selection

• Reset

- Power-on Reset (POR)

- Power-up Timer (PWRT)

- Oscillator Start-up Timer (OST)

- Programmable Brown-out Reset (BOR)

• Watchdog Timer (WDT)

• Power-Saving Modes (Sleep and Idle)

• Code Protection

• Unit ID Locations

• In-Circuit Serial Programming (ICSP)

dsPIC30F devices have a Watchdog Timer which is

permanently enabled via the Configuration bits, or can

be software controlled. It runs off its own RC oscillator for

added reliability. There are two timers that offer neces-

sary delays on power-up. One is the Oscillator Start-up

T imer (OST), intended to keep the chip in Reset until the

crystal oscillator is stable. The other is the Power-up

Timer (PWRT), which provides a delay on power-up

only, designed to keep the p art in Res et while the power

supply stabilizes. With these two timers on-chip, most

applications need no ex ternal Res et circuitry.

Sleep mode is designed to offer a very low-current

Power-Down mode . The us er ca n wa ke -up fro m Slee p

through external Reset, Watchdog Timer wake-up or

through an inte rrupt. Several os cillator opti ons are also

made available to allow the part to fit a wide variety of

applications. In the Idle mode, the clock sources are

still active, but the CPU is shut off. The RC oscillator

option saves system cost, while the LP crystal option

saves power.

21.1 Oscillator System Overview

The dsPIC30F oscillator system has the following

modules and features:

• Various external and internal oscillator options as

clock sources

• An on-chip PLL to boost internal operating

frequency

• A clock switching mechanism between various

clock sources

• Programm abl e c loc k pos t s ca ler for system po w er

savings

• A Fail-Safe Clock Monitor (FSCM) that detects

clock failure and takes fail-safe measures

• Clock Control register (OSCCON)

• Configuration bits for main oscillator selection

Table 21-1 provides a summary of the dsPIC30F

oscillator operating modes. A simplified diagram of the

oscillator system is shown in Figure 21-1.

Configuration bits determine the clock source upon

Power-on Reset (POR) and Brown-out Reset (BOR).

Thereafter, the clock source can be changed between

permissible clock sources. The OSCCON register

controls the clock switching and reflects system clock

related status bits.

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046). For more information on the device

instruction set and programming, refer to the “dsPIC30F/

33F Programmer’s Reference Manual” (DS70157).

dsPIC30F4011/4012

TABLE 21-1: OSCILLATOR OPERATING MODES

Oscillator Mode Description

XTL 200 kHz-4 MHz crystal on OSC1:OSC2

XT 4 MH z-10 M Hz crystal on OSC1:OSC2

XT w/PLL 4x 4 MHz-10 MHz crystal on OSC1:OSC2, 4x PLL enabled

XT w/PLL 8x 4 MHz-10 MHz crystal on OSC1:OSC2, 8x PLL enabled

XT w/PLL 16x 4 MHz-10 MHz crystal on OSC1:OSC2, 16x PLL enabled(1)

LP 32 kHz cry s tal on SOSCO:SOSCI(2)

HS 10 MHz-25 MHz crystal

EC External clock input (0-40 MHz)

ECIO External clock input (0-40 MHz), OSC2 pin is I/O

EC w/PLL 4x External clock input (0-40 MHz), OSC2 pin is I/O, 4x PLL enabled(1)

EC w/PLL 8x External clock input (0-40 MHz), OSC2 pin is I/O, 8x PLL enabled(1)

EC w/PLL 16x External clock input (0-40 MHz), OSC2 pin is I/O, 16x PLL enabled(1)

ERC External RC oscillator, OSC2 pin is FOSC/4 output(3)

ERCIO External RC oscillator, OSC2 pin is I/O(3)

FRC 8 MHz internal RC oscillator

FRC w/PLL 4x 7.37 MHz Internal RC oscillator, 4x PLL enabled

FRC w/PLL 8x 7.37 MHz Internal RC oscillator, 8x PLL enabled

FRC w/PLL 16x 7.37 MHz Internal RC oscillator, 16x PLL enabled

LPRC 512 kHz internal RC oscillator

Note 1: The dsPIC30F maximum operating frequency of 120 MHz must be met.

2: LP oscillator can be conveniently shared as a system clock, as well as a Real-Time Clock for Timer1.

3: Requires external R and C. Frequency operation up to 4 MHz.

dsPIC30F4011/4012

FIGURE 21-1: OSCILLAT OR SYSTEM BLOCK DIAGRAM

Primary

OSC1

OSC2

SOSCO

SOSCI

Oscillator

32 kHz LP

Clock

and Control

Block

Switching

Oscillator

x4, x8, x16

PLL

Primary

Oscillator

Stability Detector

Secondary

Oscillator

Programmable

Clock Divider

Oscillator

Start-up

Timer

Fail-Safe Clock

Monitor (FSCM)

Internal Fast RC

Oscillator (FRC)

Internal

Low-Power RC

Oscillator (LPRC)

PWRSAV Instruction

Wake-up Request

Oscillator Configuration bits

System

Clock

Oscillator Trap

to Timer1

LPRC

FRC

Secondary Osc

POR Done

Pri mary Osc

FPLL

POST<1:0>

FCKSM<1:0> 2

PLL

Lock COSC<1:0>

NOSC<1:0>

OSWEN

dsPIC30F4011/4012

21.2 Oscillator Configurations

21.2.1 INITIAL CLOCK SOURCE

SELECTION

While coming out of Power-on Reset or Brown-out

Reset, th e device sel ects its clock source based on:

a) The FOS<1:0> Configuration bits that select one

of four oscillator grou ps.

b) The FPR<3:0> Con figuration bits that s elect one

of 13 o scillat or choic es within the prim ary grou p.

The selection is as shown in Table 21-2.

21.2.2 OSCILLATOR START-UP TIMER

(OST)

In order to ensure that a crystal oscillator (or ceramic

resonator) has started and stabilized, an Oscillator

Start-up Timer (OST) is included. It is a simple, 10-bit

counter that counts 1024 TOSC cycles before releasing

the oscillator clock to the rest of the system. The time-

out period is designated as TOST. The TOST time is

involv ed ev ery tim e the os ci lla tor h as to res tart (i.e., o n

POR, BOR and wake-up from Sleep). The Oscillator

Start-up Timer is applied to the LP, XT, XTL and HS

modes (upon wake-up from Sleep, POR and BOR) for

the primary oscillator.

TABLE 21-2: CONFIGURATION BIT VALUES FOR CLOCK SELECTION

Oscillator Mode Oscillator

Source FOS1 FOS0 FPR3 FPR2 FPR1 FPR0 OSC2

Function

EC Primary 111011 CLKO

ECIO Primary 111100 I/O

EC w/PLL 4x Primary 111101 I/O

EC w/PLL 8x Primary 111110 I/O

EC w/PLL 16x Primary 111111 I/O

ERC Primary 111001 CLKO

ERCIO Primary 111000 I/O

XT Primary 110100 OSC2

XT w/PLL 4x Primary 110101 OSC2

XT w/PLL 8x Primary 110110 OSC2

XT w/PLL 16x Primary 110111 OSC2

XTL Primary 110000 OSC2

HS Primary 110010 OSC2

FRC w/PLL 4x Primary 110001 I/O

FRC w/PLL 8x Primary 111010 I/O

FRC w/PLL 16x Primary 110011 I/O

LP Secondary 0 0 ————(Notes 1, 2)

FRC Internal FRC 0 1 ————(Notes 1, 2)

LPRC In tern al LPRC 1 0 ————(Notes 1, 2)

Note 1: OSC2 pin function is determined by the Primary Oscillator mode selection (FPR<3:0>).

2: Note tha t the OSC1 pi n cannot be us ed as an I/O pin, ev en if the s econdary o scillator or an internal c lock

source is selected at all times.

dsPIC30F4011/4012

21.2.3 LP OSCILLATOR CONTROL

Enabling the LP oscillator is controlled with two

elements:

1. The current oscillator group bits, COSC<1:0>.

2. The LPOSCEN bit (OSC CO N regis ter).

The LP oscillator is on (even during Sleep mode) if

LPOSCEN = 1. The LP oscillator is the device clock if:

• COSC<1: 0> = 00 (LP selec ted as main o scillat or)

and

• LPOSCEN = 1

Keeping the LP oscillator on at all times allows for a

fast swit ch to the 3 2 kHz syst em cl oc k f or lowe r powe r

operation. Returning to the faster main oscillator still

requires a start-up time.

21.2.4 PHASE LOCKED LOOP (PLL)

The PLL multi plies the clock wh ic h is gen era ted by the

primary oscillator. The PLL is selectable to have either

gains of x4, x8 or x16. Input and output frequency

ranges are summarized in Table 21-3.

TABLE 21-3: PLL FREQUENCY RANGE

The PLL fea tures a lo ck out put wh ich is assert ed when

the PLL enters a phase locked state. Should the loop

fall out of lock (e.g., due to noise), the lock signal is

rescinded. The state of this signal is reflected in the

read-only LOCK bi t in the OSCCON register.

21.2.5 FAST RC OSCILLATOR (FRC)

The FRC os cillator is a fast (7.37 MHz, +/-2% no minal),

internal RC oscillator. This oscillator is intended to

provide reasonable device operating speeds without

the use of an externa l cryst al, cerami c resonator o r RC

network. Using the x4, x8 and x16 PLL options, higher

operational frequencies can be generated.

The dsPIC3 0F o pera t es fro m th e F RC o sc illator when-

ever the Current Oscillator Selection (COSC<1:0>)

control bits in the OSCCON register

(OSCCON<13:12>) are set to ‘01’.

There are four tuning bits (TUN<3:0>) for the FRC

oscillator in the OSCCON register. These tuning bits

allow the FRC oscillator frequency to be adjusted as

close to 7.37 MHz as possible, depending on the

device operating conditions. The FRC oscillator

frequency has been calibrated during factory testing.

Table 21-4 describes the adjustment range of the

TUN<3:0> bits.

TABLE 21-4: FRC TUNING

21.2.6 LOW-POWER RC OSCILLATOR

(LPRC)

The LPRC oscillator is a component of the Watchdog

Timer (WDT) and oscillates at a nominal frequency of

512 kHz. The LPRC oscillator is the clock source for

the Power-up Timer (PWRT) circuit, WDT and clock

monitor circuits. It may also be used to provide a low-

frequency clock source option for applications where

power consumption is critical and timing accuracy is

not required.

The LPRC oscillator is always enabled at a Power-on

Reset because it is the clock source for the PWRT.

After the PWRT expires, the LPRC oscillator remains

on if one of the following is true:

• The Fail-Safe Clock Monitor is enabled

• The WDT is enabled

• The LPRC oscillator is selected as the system

clock via the COSC<1:0> control bits in the

OSCCON register

If one of the above conditions is not true, the LPRC

shuts off after the PWRT expires.

FIN PLL

Multiplier FOUT

4 MHz-10 MHz x4 16 MHz-40 MHz

4 MHz-10 MHz x8 32 MHz-80 MHz

4 MHz-7.5 MH z x16 64 MH z-120 MHz

TUN<3:0>

Bits FRC Frequency

0111 +10.5%

0110 +9.0%

0101 +7.5%

0100 +6.0%

0011 +4.5%

0010 +3.0%

0001 +1.5%

0000 Center Frequency (oscillator is

running at calibrated frequency)

1111 -1.5%

1110 -3.0%

1101 -4.5%

1100 -6.0%

1011 -7.5%

1010 -9.0%

1001 -10.5%

1000 -12.0%

Note 1: OSC2 pin function is determined by the

Primary Oscillator mode selection

(FPR<3:0>).

2: Note that O SC1 pin c annot be u sed as an

I/O pin, ev en if the s econda ry osc illato r or

an internal clock source is selected at all

times.

dsPIC30F4011/4012

21.2.7 FAIL-SAFE CLOCK MONITOR

The Fail-Saf e Cl oc k Mo nit or (F SCM) al low s the dev ic e

to conti nue to operate even i n the e vent o f an os cilla tor

failure. The FSCM functi on i s e nab le d by ap pro pria tel y

programming the FCKSM<1:0> Configuration bits

(Clock Switch and Monitor Selec tion bits) in the FOSC

device Configuration register. If the FSCM function is

enabled, the LPRC internal oscillator runs at all times

(except during Sleep mode) and is not subject to

control by the SWDTEN bit.

In the event of an oscillator failure, the FSCM

generates a clock failure trap event and switches the

syste m cl oc k ov er to t he FRC os cil la t or. Th e u se r th en

has the option to either attempt to restart the oscillator

or exec ute a controlled shutdown . The user may decide

to treat th e tra p a s a warm Res et by si mp ly loading the

Reset address into the oscillator fail trap vector. In this

event, the CF (Clock Fail) status bit (OSCCON<3>) is

also set whenever a clock failure is recognized.

In the event of a clock failure, the WDT is unaffected

and continues to run on the LPRC clock.

If the oscillator has a very slow start-up time coming

out of POR, BOR or Sleep, it is possible that the

PWRT timer will expire before the oscillator has

started. In such cases, the FSCM is activated. The

FSCM initiates a clock failure trap, and the

COSC<1:0> bits are loaded with the Fast RC (FRC)

oscillator selection. This effectively shuts off the

original oscillator that was trying to start.

The user may detect this situation and restart the

oscill ato r in t he c lo ck fai l trap Int errup t Serv ic e Routine

(ISR).

Upon a clock failure detection, the FSCM module

initiates a clock swi t ch to the FRC os ci lla tor as fol lo ws:

1. The COSC<1:0> bits (OSCCON<13:12>) are

loaded wi th the FRC osci lla tor se lec tio n val ue.

2. CF bit is set (OSCCON<3>).

3. OSWEN control bit (OSCCON<0>) is cleared.

For the purpose of clock switching, the clock sources

are sectioned into four groups:

1. Primary

2. Secondary

3. Internal FRC

4. Internal LPRC

The user can switch between these functional groups

but cannot switch between options with in a group. If the

primary group is selected, then the choice within the

group is always determined by the FPR<3:0>

Configuration bits.

The OSC CON register ho lds the control and status bits

related to clock switching.

• COSC<1:0>: Read-only status bits always reflect

the current oscillator group in effect.

• NOSC<1:0>: Control bits which are written to

indicate the new oscillator group of choice.

- On POR and BOR, COSC<1:0> and

NOSC<1:0> are both l oaded with the

Configuration bit values, FOS<1:0>.

• LOCK: The LOCK status bit indicates a PLL lock.

• CF: Read-only status bit indicating if a clock fail

detect has occurred.

• OSWEN: Control bit changes from a ‘0’ to a ‘1’

when a clock transition sequence is initiated.

Clearing the OSWEN control bit aborts a clock

transition in progress (used for hang-up

situations).

If Configuration bits, FCKSM<1:0> = 1x, then the clock

switching and Fail-Safe Clock Monitor functions are

disabled. This is the default C onfiguration bit s etting.

If clock switching is disabled, then the FOS<1:0> and

FPR<3:0> bits directly control the oscillator selection,

and the COSC<1:0> bits do not control the clock

selection. However, these bits do reflect the clock

source selection.

21.2.8 PROTECTION AGAINST

ACCIDENTAL WRITES TO OSCCON

A write to the OSCCON regis ter is intentionally made

difficult because it controls clock switching and clock

scaling.

To write to the OSCCON low byte, the following code

sequence must be executed without any other

instructions in between:

•Byte Write “0x46” to OSCCON low

•Byte Write “0x57” to OSCCON low

Byte Write i s allowed for one instruction cycle. Write the

desired value or use bit manipulation instruction.

To write to the OSCCON high byte, the following

instructions must be executed without any other

instructions in between:

•Byte Write “0x78” to OSCCON high

•Byte Write “0x9A” to OSCCON high

Byte Write i s allowed for one instruction cycle. Write the

desired value or use bit manipulation instruction.

Note: The application should not attempt to

switch to a clock of frequency lower than

100 kHz when the Fail-Safe Clock Monitor

is enabled. If such clock switching is

performed, the device may generate an

oscillator fail trap and switch to the Fast RC

(FRC) oscil lator.

dsPIC30F4011/4012

21.3 Reset

The dsPI C30F401 1/4012 devices differentiate between

various kinds of Reset:

a) Power-on Reset (POR)

b) MCLR Reset during normal operation

c) MCLR Reset during Sleep

d) Watchdog Timer (WDT) Reset (during normal

operation)

e) Programmable Brown-out Reset (BOR)

f) RESET Inst ruction

g) Reset caused by trap lock-up (TRAPR)

h) Reset caused by illegal opcode, or by using an

uninitialized W register as an Address Pointer

(IOPUWR)

Different registers are affected in different ways by

various Reset conditions. Most registers are not

af fected b y a WDT wake -up, si nce this is viewed as the

resumption of normal operation. Status bits from the

RCON reg ister are set o r c lea red differentl y in dif fere nt

Reset s itu atio ns , a s in dic ate d in Table 21-5. Thes e bits

are used in software to determine the nature of the

Reset.

A block di agram of the on-ch ip Reset circuit is shown in

Figure 21-2.

A MCLR noise filter is provided in the MCLR Reset

path. The filter detects and ignores small pulses.

Internall y generated Res ets do not drive MCLR pi n low .

FIGURE 21-2: RESET SYSTEM BLOCK DIAGRAM

21.3.1 POR: PO W ER-O N RESET

A power-on event generates an internal POR pulse

when a VDD rise is detected. The R eset pulse occurs at

the POR ci rcuit thres hold volt age (VPOR) wh ich is nom -

inally 1.85V. The device supply voltage characteristics

must meet specified starting voltage and rise rate

requirements. The POR pulse resets a POR timer and

places the device in the Reset state. The POR also

selects the device clock source identified by the

osci llator Co nfiguration fuses.

The POR circuit inserts a small delay, TPOR, which is

nominally 10 μs and ensures that the device bias

circuits are stable. Furthermore, a user-selected

power-up time-out (TPWRT) is applied. The TPWRT

parameter is based on device Configuration bits and

can be 0 ms (no dela y), 4 ms, 16 ms or 64 ms. The total

delay is at device power-up, TPOR + TPWRT. When

these delays have expired, SYSRST wi ll be nega ted on

the next l eading edge of the Q1 clock and the PC jumps

to the Reset vector.

The timing for the SYSRST signal is shown in

Figure 21-3 through Figure 21-5.

MCLR

VDD

VDD Rise

Detect POR

SYSRST

Sleep or Idle

Brown-out

Reset BOREN

RESET

Instruction

WDT

Module

Digital

Glitch Filter

BOR

Trap Conflict

Illegal Opcode/

Uninitialized W Register

dsPIC30F4011/4012

FIGURE 21-3: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD)

FIGURE 21-4: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1

FIGURE 21-5: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2

TPWRT

OST

VDD

INTERNAL POR

PWRT TIME-OUT

OST TIME-OUT

INTERNAL RESET

MCLR

TPWRT

TOST

VDD

INTERNAL POR

PWRT TIME-OUT

OST TIME-OUT

INTERNAL RESET

MCLR

VDD

MCLR

INTERNAL POR

PWRT TIME-OUT

OST TIME-OUT

INTERNAL RESET

TPWRT

OST

dsPIC30F4011/4012

21.3.1.1 POR with Long Crystal Start-up Time

(with FSCM Enabled)

The osci ll ator s t art-up circuit r y is not linked to the POR

circuitry. Some crystal circuits (especially low-

frequency crystals) have a relatively long start-up time.

Therefore, one or more of the following conditions is

possible after the POR timer and the PWRT have

expired:

• The oscillator circuit has not begun to oscillate.

• The Osc ill ato r Start-up Timer ha s not expired (if a

crystal oscillator is used).

• The PLL has not achieved a lock (if PLL is used).

If th e FSCM is enabled and one of th e above c onditions

is true, then a clock failure trap occurs. The device

automatically switches to the FRC oscillator and the

user can switch to the desired crystal oscillator in the

trap ISR.

21.3.1.2 Operating without FSCM and PWRT

If the FSCM is disabled and the Power-up Timer

(PWRT) is also disabled, then the device exits rapidly

from Reset on power-up. If the clock source is FRC,

LPRC, ERC or EC, it will be active immediately.

If the FSCM is disabled and the system clock has not

start ed, the de vice w ill be in a frozen st ate at th e Res et

vector until the system clock starts. From the user’s

perspective, the device will appear to be in Reset until

a system clock is available.

21.3.2 BOR : PROG RA MMA BL E

BROWN-OUT RESET

The BOR (Brown-out Reset) module is based on an

internal voltage reference circuit. The main purpose of

the BOR mod ul e is to ge nera t e a d evic e R eset w he n a

brown-out condition occurs. Brown-out conditions are

generally caused by glitches on the AC mains (i.e.,

missing portions of the AC cycle waveform due to bad

power tr ansmission lines, or voltage sags du e to exces-

sive current draw when a larg e in duc tiv e l oad is turne d

on).

The BOR module allows selection of one of the

following voltage trip points (see Table 24-10 ):

•2.6V-2.71V

•4.1V-4.4V

• 4.58V-4.73V

A BOR generates a Reset pulse, which resets the

device. The BOR selects the clock source, based on

the device Configuration bit values (FOS<1:0> and

FPR<3:0>). Furthermore, if an oscillator mode is

selected, the BOR activates the Oscillator Start-up

Timer (OST). The system clock is held until OST

expires. If the PLL is used, then the clock is held until

the LOCK bit (OSCCON<5>) is ‘1’.

Concurrently, the POR time-out (TPOR) and the PWRT

time-out (TPWRT) are applied before the internal Reset

is released. If TPWRT = 0 and a crystal oscillator is

being us ed, then a nominal del ay of TFSCM = 100 μs is

applied . The tot al delay in this c ase is (TPOR + TFSCM).

The BOR st atus bit (R CON<1>) i s set to in dicate that a

BOR has occurred. The BOR circuit, if enabled, contin-

ues to operate while in Sle ep or Id le m od es a nd res et s

the device if VDD falls below the BOR threshold voltage.

FIGURE 21-6: EXTERNAL POWER-ON

RESET CIRCUIT (FOR

SLOW VDD POWER-UP)

Note: The BOR voltage trip points indicated here

are nominal values provided for design

guidance only.

Note: Dedicated supervisory devices, such as

the MCP1XX and MCP8XX, may also be

used as an external Power-on Reset

circuit.

Note 1: External Power-on Reset circuit is required

only if the VDD power-up slope is too slow.

The diode D helps discharge the capacitor

quickly when VDD powers down.

2: R should be suitably chosen so as to make

sure that the voltage drop across R does not

violate the device’s electrical specification.

3: R1 should be suitably chosen so as to limit

any current flowing into MCLR from external

capacitor C, in the event of MCLR pin break-

down, due to Elect rostatic Discharge (ESD)

or Electrical Overstress (EOS).

VDD

dsPIC30F

MCLR

dsPIC30F4011/4012

Table 21-5 shows the Reset conditions for the RCON

ter are R/W, the information in the table implies that all

the bits are negated prior to the action specified in the

conditi on column.

TABLE 21-5: INITIALIZATION CONDITION FOR RCON REGISTER, CASE 1

Table 21-6 shows a second example of the bit

conditions for the RCON register. In this case, it is not

assumed that the user has set/cleared specific bits

prior to action specified in the condition column.

TABLE 21-6: INITIALIZATION CONDITION FOR RCON REGISTER, CASE 2

Condition Program

Counter TRAPR IOPUWR EXTR SWR WDTO IDLE SLEEP POR BOR

Power-on Reset 0x000000 000000011

Brown-out Reset 0x000000 000000001

MCLR Reset during normal

operation 0x000000 001000000

Software Reset during

normal ope rati on 0x000000 000100000

MCLR Reset during Sleep 0x000000 001000100

MCLR Reset during Idle 0x000000 001001000

WDT Time-out Reset 0x000000 000010000

WDT Wake-up PC + 2 000010100

Interrupt Wake-up from

Sleep PC + 2(1) 000000100

Clock Failure Trap 0x000004 000000000

Trap Reset 0x000000 100000000

Illegal Operation Trap 0x000000 010000000

Note 1: When the wake-up is du e to an enable d inte rrupt, the PC is lo aded wi th the c orresp onding interru pt vec tor.

Condition Program

Counter TRAPR IOPUWR EXTR SWR WDTO IDLE SLEEP POR BOR

Power-on Reset 0x000000 000000011

Brown-out Reset 0x000000 uuuuuuu01

MCLR Reset during normal

operation 0x000000 uu10000uu

Software Reset during

normal ope rati on 0x000000 uu01000uu

MCLR Reset during Sleep 0x000000 uu1u001uu

MCLR Reset during Idle 0x000000 uu1u010uu

WDT Time-out Reset 0x000000 uu00100uu

WDT Wake-up PC + 2 uuuu1u1uu

Interrupt Wake-up from

Sleep PC + 2(1) uuuuuu1uu

Clock Failure Trap 0x000004 uuuuuuuuu

Trap Reset 0x000000 1uuuuuuuu

Illegal Operation Reset 0x000000 u1uuuuuuu

Legend: u = unchanged

Note 1: When the wake -up is d ue to an enabl ed inte rrupt, the PC is loa ded w ith the corres pondin g interru pt vector.

dsPIC30F4011/4012

21.4 Watchdog Timer (WDT)

21.4.1 WATCHDOG TIMER OPERATION

The primary function of the Watchdog Timer (WDT) is

to reset the processor in the event of a software

malfunc ti on. T he W D T is a fre e-run ni ng ti me r tha t run s

off an on-chip RC oscillator, requiring no external

component. Therefore, the WDT timer continues to

operate even if the main processor clock (e.g., the

crystal oscillator) fails.

21.4.2 ENABLING AND DISABLING

THE WDT

The Watchdog Timer can be “Enabled” or “Disabled”

only through a Configuration bit (FWDTEN) in the

Conf iguration re gister, FWDT.

Setting FWDTEN = 1 enables the Watchdog Timer.

The enabling is done when programming the device.

By default, after chip erase, FWDTEN bit = 1. Any

device programmer capable of programming

dsPIC30F devices allows programming of this and

other Configuration bits.

If enabled, the WDT increments until it overflows or

“times out”. A WDT time-out forces a device Reset

(except during Sleep). To prevent a WDT time-out, the

user must clear the Watchdog Timer using a CLRWDT

instruction.

If a WDT ti me s ou t du ring Sleep, the de vi ce wakes-u p.

The WDTO bit in the RCON register is cleared to

indicate a wake-up r esulting from a WDT time-out.

Setting FWDTEN = 0 allows user software to enable/

disable the Watchdog Timer via the SWDTEN

(RCON<5>) control bit.

21.5 Power-Saving Modes

There are tw o powe r-saving s tate s that c an be entere d

through the execu tion of a spe ci al ins t ru cti on, PWRSAV.

These are: Sleep and Idle.

The format of the PWRSAV instruc tion is as follows:

PWRSAV <parameter>, where ‘parameter’ defines

Idle or Sleep mode.

21.5.1 SL EEP MO DE

In Sleep m ode, th e clo ck to the C PU and p eriphe rals i s

shut down. If an on-chip oscillator is being used, it is

shut down .

The Fail-Safe Clock Monitor is not functional during

Sleep, since there is no clock to monitor. However, the

LPRC clock remains active if WDT is operational during

Sleep.

The Brown-out Reset protection circuit and the Low-

Voltage Detect (LVD) circuit, if enabled, remain

functional during Sleep.

The processor wakes up from Sleep if at least one of

the following conditions has occurred:

• any interrupt that is individually enabled and

meets the required priority level

• any Reset (POR, BOR and MCLR)

• WDT time-out

On wakin g up from Sleep mode, th e processo r rest arts

the sam e clo ck th at wa s a ct ive pri or to e ntry in to Slee p

mode. When clock switching is enabled, bits

COSC<1:0> determine the oscillator source to be

used on wake-up. If clock switch is disabled, then

there is only one system clock.

If the clock source is an oscillator, the clock to the

device is held off until OST times out (indicating a

stable oscillator). If PLL is used, the system clock is

held off until LOCK = 1 (indicating that the PLL is

stab le). I n eit her c ase, TPOR, T LOCK and TPWRT delay s

are applied.

If EC, FRC, LPRC or ERC oscillators are used, then a

delay of TPOR (~10 μs) is applied. This is the smallest

delay possible on wake-up from Sleep.

Moreover, if the LP oscillator was active during Sleep,

and LP is the oscillator used on wake-up, then the start-

up delay is equal to TPOR. PWRT and OST delays are

not applie d. In order to have the smallest possible st art-

up delay when waking up from Sleep, one of these

faster wake-up options should be selected before

entering Sleep.

Note: If a POR or BOR occurred, the selection of

the oscillator is based on the FOS<1:0>

and FPR<3:0> Configuration bits.

dsPIC30F4011/4012

Any interrupt that is individually enabled (using the

corresponding IE bit) and meets the prevailing priority

level can wake-up the processor. The processor

processes the interrupt and branches to the ISR. The

SLEEP status bit in the RCON register is set upon

wake-up.

All Resets wake-up the processor from Sleep mode.

Any Reset, ot her than PO R, sets the SLEE P status bi t.

In a POR, the SLEEP bit is cleared.

If Watchdo g Timer is enabled , the proc es so r wake s-u p

from Sle ep m ode u pon W DT time -out. T he SLEEP an d

WDTO status bits are both set.

21.5.2 IDLE MODE

In Idle mode, the clock to the CPU is shut down while

peripher als keep running. Unlike Sleep mode, the clock

sour ce rem ains active .

Several peripherals have a control bit in each module,

that allows them to operate during Idle.

LPRC Fail-Safe Clock Monitor remains active if clock

failure detect is enabled.

The processor wakes up from Idle if at least one of the

following conditions is true:

• on any interrupt that is individually enabled (IE bit

is ‘1’) and meets the required priority level

• on any Reset (POR, BOR, MCLR)

• on WDT time-out

Upon wake-up from Idle mode, the clock is re-applied

to the CPU and instruction execution begins immedi-

ately, st arting with the instructi on fol low i ng the PWRSAV

instruction.

Any interrupt that is individually enabled (using IE bit)

and meets the pre vai li ng p r iori ty l ev el c an wa ke -up the

processor. The processor processes the interrupt and

branches to the ISR. The IDLE status bit in RCON

Any Reset, other than POR, sets the IDLE status bit.

On a POR, the IDLE bit is cleared.

If Watchdog Timer is enabled, then the processor

wakes-up from Idle mode upon WDT time-out. The

IDLE and WDTO status bits are both set.

Unlike wake-up from Sleep, there are no time delays

involv ed in wa ke -up from Idle.

21.6 Device Configuration Registers

The Configuration bits in each device Configuration

programmed by a device programmer, or by using the

In-Circuit Serial Programming™ (ICSP™) feature of the

device. Each device Configuration register is a 24-bit

used to hold configuration data. There are four device

Configuration registers avai lable to the use r:

1. FOSC (0xF80000): Oscillator Configuration

2. FWDT (0xF80002): Watchdog Timer

Configu ration Register

3. FBORPOR (0xF80004): BOR and POR

Configu ration Register

4. FGS (0xF8000A): General Code Segment

Configu ration Register

The placement of the Configuration bits is automatically

handled when you select the device in your device

programmer. The desired state of the Configuration bits

may be specified in the source code (dependent on the

language tool used), or through the programming

interface. After the device has been programmed, the

application software may read the Configuration bit

values through the t able read instructions. For additional

information, please refer to the programming

specifications of the devic e.

Note: In spite of various delays applied (TPOR,

TLOCK and TPWRT), the crystal oscillator

(and PLL) may not be active at the end of

the time-out (e.g., for low-frequency crys-

tals). In such cases, if FSCM is enabled,

the dev ice detect s this c ondition as a clock

failure and processes the clock failure

trap. The FRC oscillator is enabled, and

the user mu st re-enable the crys tal oscill a-

tor. If FSCM is not enabled, then the

devi ce simp ly suspe nds exec ution of cod e

until the clock is stable and remains in

Sleep unti l the osci llator clock ha s st arte d.

Note: If the code protection Configuration fuse

bits (FGS<GCP> and FGS<GWRP>)

have been programmed, an erase of the

entire code-protected device is only

possib le at vol tages VDD ≥ 4.5V.

dsPIC30F4011/4012

21.7 In-Circuit Debugger

When MPLAB® ICD 2 is selected as a debugger, the

in-circuit debugging functionality is enabled. This func-

tion al lows simple debug ging functi ons whe n use d wi th

MPLAB IDE. When the device has this feature enabled,

some of the resources are not available for general

use. These resources include the first 80 bytes of data

RAM and two I/O pins.

one of four pairs of debug I/O pins may be selected by

the user using configuration options in MPLAB IDE.

These pin pairs are named EMUD/EMUC, EMUD1/

EMUC1, EMUD2/EMUC2 and EMUD3/EMUC3.

In each case, the selected EMUD pin is the emulation/

debug data line and the EMUC pin is the emulation/

debug clock line. These pins interface to the MPLAB

ICD 2 module available from Microchip. The selected

pair of de bug I/O pi ns is used by MPL AB ICD 2 to send

commands and receive responses, as well as to send

and receive data. To use the in-circuit debugger func-

tion of the device, the design must implement ICSP

connections to MCLR, VDD, VSS, PGC, PGD and the

selected EMUDx/EMUCx pin pair.

This gives rise to two possibilities:

1. If EMUD/EMUC is selected as the debug I/O pi n

pair , then only a 5-pin interface is required as th e

EMUD and EMUC pi n fun cti ons ar e mu lti ple xe d

with the PGD and PGC pin functions in all

dsPIC30F devices.

2. If EMUD1/EMUC1, EMUD2/EMUC2 or EMUD3/

EMUC3 is selected as the debug I/O pin pair,

then a 7-p in interfac e is requ ired as the EMUDx/

EMUCx pin functions (x = 1, 2 or 3) are not

multiplexed with the PGD and PGC pin

functions.

dsPIC30F4011/4012

TABLE 21-7: SYSTEM INTEGRATION REGISTER MAP

TABLE 21-8: DEVICE CONFIGURATION REGISTER MAP

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

RCON 0740 TRAPR IOPUWR BGST —EXTR SWR SWDT EN WDTO SLEEP IDLE BOR POR Depe nds on type of Reset.

OSCCON 0742 TUN3 TUN2 COSC<1:0> TUN1 TUN0 NOSC<1:0> POST<1:0> LOCK —CF— LPOSCEN OSWEN Depends on Configuration bits.

Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.

File Name Addr. Bits 23-16 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

FOSC F80000 —FCKSM<1:0>— — — — FOS<1:0> — — — —FPR<3:0>

FWDT F80002 —FWDTEN— — — — — — — — — FWPSA<1:0> FWPSB<3:0>

FBORPOR F80004 — MCLREN — — — — PWMPIN HPOL LPOL BOREN — BORV<1:0> ——FPWRT<1:0>

FGS F8000A — — — — — — — — — — — — — — — GCP GWRP

Note: Refer to the “dsPIC30F Family Reference Manual” (DS70046) for descriptions of register bit fields.

dsPIC30F4011/4012

22.0 INSTRUCTION SET SUMMARY

The dsPIC30F instruction set adds many

enhancements to the previous PIC® MCU instruction

sets, while maintaining an easy migration from PIC

MCU instruction sets.

Most instructions are a single program memory word

(24 bits). Only three instructions require two program

memory locations.

Each single-word instruction is a 24-bit word divided

into an 8-bit opcode, which specifies the instruction

type, and one or more operands which further specify

the operation of the instruction.

The instruction set is highly orthogonal and is grouped

into five bas ic ca tego ries:

• Word or byte-oriented operations

• Bit-oriented operations

• Literal operations

• DSP operations

• Control operations

Table 22-1 shows the general symbols used in

des c ribing t he instructions.

The dsPIC30F instruction set summary in Table 22-2

lists all the instructions along with the status flags

affected by each instruction.

Most word or byte-oriented W register instructions

(including barrel shift instructions) have three

operands:

• The first source operand, which is typically a

• The second source operand, which is t ypically a

• The destination of the result, which is typically a

However , word or byte-ori ented file register instructions

have two operands:

• The file register specified by the value ‘f ’

• The destination, which could either be the file

‘WREG’

Most bit-oriented instructions (including simple rotate/

shift instructions) have two operands:

• The W register (with or without an address modi-

fier) or file register (specified by the value of ‘Ws’

or ‘f’)

• The bit in the W register or file register

(specified by a literal value or indirectly by the

contents of register ‘Wb’)

The litera l instruct ions that invo lve data m ovement ma y

use some of the following operands:

• A lite ral value to be lo aded i nto a W regi ster or file

• The W register or file register where the literal

value is to be loaded (specified by ‘Wb’ or ‘f’)

However, literal instructions that involve arithmetic or

logical operations use some of the following operands:

• The first source operand which is a register ‘Wb’

without any addre s s modifier

• The second source operand which is a literal

value

• The dest ination of the result (only if not the same

as the first source operand) which is typically a

The MAC class of DSP instructions may use some of the

following operands:

• The accumulator (A or B) to be used (required

operand)

• The W regis ters t o be used as the two operands

• The X and Y address space prefetch operations

• The X and Y address space prefetch destinations

• The accumulator w rite-back destination

The other DSP instructions do not involve any

multiplication and may include:

• The accumul ator to be used (requ ired )

• The source o r destin ation ope rand (des ignated as

Wso or Wdo, respectively) with or without an

address modifier

• The amount of shift, specified by a W register

‘Wn’ or a literal value

The control instructions may use some of the following

operands:

• A program memory address

• The mode of the table read and table write

instructions

All instructions are a single word, except for certain

double-word instructions, which were made double-

word instructions so that all the required information is

available in these 48 bits. In the second word, the

8MSbs are ‘0’s. If t his se co nd wo r d i s ex ec ute d as an

instruction (by itself), it will execute as a NOP.

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046). For more information on the device

instruction set and programming, refer to the “dsPIC30F/

33F Programmer’s Reference Manual” (DS70157).

dsPIC30F4011/4012

Most single-word instructions are executed in a single

instruc tion cycle , u nle ss a co ndi tional test is tru e or the

program counter is changed as a result of the instruc-

tion. In these cases, the executio n takes tw o instructio n

cycles with the additional instruction cycle(s) executed

as a NOP. Notable exceptions are the BRA (uncondi-

tional/c ompu ted bra nch), i ndirec t CALL/GOTO, al l t abl e

reads and writes and RETURN/RETFIE instructions,

which are single-word instructions but take two or three

cycles. Certain instructions that involve skipping over

the su bsequen t instruc tion, requir e either t wo or three

cycles if the skip is performed, depending on whether

the instruction being skipped is a single-word or two-

word instruction. Moreover, double-word moves

require two cycles. The double-word instructions

execute in two instruction cycles.

Note: For more details on the instruction set,

refer to the “dsPIC30F/33F Programmer’s

Reference Manual” (DS70157).

TABLE 22-1: SYMBOLS USED IN OPCODE DESCRIPTIONS

Field Description

#text Me ans literal defined by “text“

(text) Mean s “content of text“

[text] Means “the location addressed by text”

{ } Optional field or operation

<n:m> Register bit field

.b Byte mode selection

.d Double-Word mode selection

.S Shadow register select

.w Word mode selection (default)

Acc One of two accumulators {A, B}

AWB Accumulator Write-Back Destination Address register ∈ {W13, [W13]+=2}

bit4 4-bit bit selection field (used in word addressed instructions) ∈ {0...15}

C, DC, N, OV, Z MCU Status bits: Carry, Digit Carry, Negative, Overflow, Zero

Expr Absolute address, label or expression (resolved by the linker)

fFile register address ∈ {0x0000...0x1FFF}

lit1 1-bit unsigned literal ∈ {0,1}

lit4 4-bit unsigned literal ∈ {0...15}

lit5 5-bit unsigned literal ∈ {0...31}

lit8 8-bit unsigned literal ∈ {0...255}

lit10 10-bit unsigned literal ∈ {0...255} for Byte mode, {0:1023} for Word mode

lit14 14-bit unsigned literal ∈ {0...16384}

lit16 16-bit unsigned literal ∈ {0...65535}

lit23 23-bit unsigned literal ∈ {0...8388608}; LSB must be 0

None Field does not require an entry, may be blank

OA, OB, SA, SB DSP Status bits: ACCA Overflow, ACCB Overflow, ACCA Saturate, ACCB Saturate

PC Program Counter

Slit10 10-bit signed literal ∈ {-512...511}

Slit16 16-bit signed literal ∈ {-32768...32767}

Slit6 6-bit signed literal ∈ {-16...16}

dsPIC30F4011/4012

Wb Base W register ∈ {W0..W15}

Wd Destination W register ∈ { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] }

Wdo Destination W register ∈

{ Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] }

Wm,Wn Dividend, Divisor working register pair (Direct Addressing)

Wm*Wm Multiplicand and Multiplier working register pair for Square instructions ∈

{W4*W4, W5*W5, W6*W6, W7*W7}

Wm*Wn Multiplicand and Multiplier working register pair for DSP instructions ∈

{W4*W5, W4*W6, W4*W7, W5*W6, W5*W7, W6*W7}

Wn One of 16 working registers ∈ {W0..W15}

Wnd One of 16 destination working registers ∈ {W0..W15}

Wns One of 16 source working registers ∈ {W0..W15}

WREG W0 (working register used in file register instructions)

Ws Source W register ∈ { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] }

Wso Source W register ∈

{ Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] }

Wx X Data Space Prefetch Address register for DSP instructions

∈ {[W8]+=6, [W8]+=4, [W8]+=2, [W8], [W8]-=6, [W8]-=4, [W8]-=2,

[W9]+=6, [W9]+=4, [W9]+=2, [W9], [W9]-=6, [W9]-=4, [W9]-=2,

[W9+W12],none}

Wxd X Data Space Prefetch Destination register for DSP instructions ∈ {W4..W7}

Wy Y Data Space Prefetch Address register for DSP instructions

∈ {[W10]+=6, [W10]+=4, [W10]+=2, [W10], [W10]-=6, [W10]-=4, [W10]-=2,

[W11]+=6, [W11]+=4, [W11]+=2, [W11], [W11]-=6, [W11]-=4, [W11]-=2,

[W11+W12], none}

Wyd Y Data Space Prefetch Destination register for DSP instructions ∈ {W4..W7}

TABLE 22-1: SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED)

Field Description

dsPIC30F4011/4012

TABLE 22-2: INSTRUCTION SET OVERVIEW

Base

Instr

Assembly

Mnemonic A s sem b ly Sy ntax Descr ip ti on # of

words # of

cycles Status Flags

Affected

1ADD ADD Acc Add Accumulators 1 1 OA, OB, SA, SB

ADD f f = f + WREG 1 1 C, DC, N, OV, Z

ADD f,WREG WREG = f + WREG 1 1 C, DC, N, OV, Z

ADD #lit10,Wn Wd = lit10 + Wd 1 1 C, DC, N, OV, Z

ADD Wb,Ws,Wd Wd = Wb + Ws 1 1 C, DC, N, OV, Z

ADD Wb,#lit5,Wd Wd = Wb + lit5 1 1 C, DC, N, OV, Z

ADD Wso,#Slit4,Acc 16-bit Signed Add to Accumulator 1 1 OA, OB, SA, SB

2ADDC ADDC f f = f + WREG + (C) 1 1 C, DC, N, OV, Z

ADDC f,WREG WREG = f + WREG + (C) 1 1 C, DC, N, OV, Z

ADDC #lit10,Wn Wd = lit10 + Wd + (C) 1 1 C, DC, N, OV, Z

ADDC Wb,Ws,Wd Wd = Wb + Ws + (C) 1 1 C, DC, N, OV, Z

ADDC Wb,#lit5,Wd Wd = Wb + lit5 + (C) 1 1 C, DC, N, OV, Z

3AND AND f f = f .AND. WREG 1 1 N, Z

AND f,WREG WREG = f .AND. WREG 1 1 N, Z

AND #lit10,Wn Wd = lit10 .AND. Wd 1 1 N, Z

AND Wb,Ws,Wd Wd = Wb .AND. Ws 1 1 N, Z

AND Wb,#lit5,Wd Wd = Wb .AND. lit5 1 1 N, Z

4ASR ASR f f = Arithmetic Right Shift f 1 1 C, N, OV, Z

ASR f,WREG WREG = Arithmetic Right Shift f 1 1 C, N, OV, Z

ASR Ws,Wd Wd = Arithmetic Right Shift Ws 1 1 C, N, OV, Z

ASR Wb,Wns,Wnd Wnd = Arithmetic Right Shift Wb by Wns 1 1 N, Z

ASR Wb,#lit5,Wnd Wnd = Arithmetic Right Shift Wb by lit5 1 1 N, Z

5BCLR BCLR f,#bit4 Bit Cl ear f 1 1 None

BCLR Ws,#bit4 Bit Clear Ws 1 1 None

6BRA BRA C,Expr Branch if Carry 1 1 (2) None

BRA GE,Expr Branch if greater than or equal 1 1 (2) None

BRA GEU,Expr Branch if unsigned greater than or equal 1 1 (2) None

BRA GT,Expr Branch if greater than 1 1 (2) None

BRA GTU,Expr Branch if unsigned greater than 1 1 (2) None

BRA LE,Expr Branch if less than or equal 1 1 (2) None

BRA LEU,Expr Branch if unsigned less than or equal 1 1 (2) None

BRA LT,Expr Branch if less than 1 1 (2) None

BRA LTU,Expr Branch if unsigned less than 1 1 (2) None

BRA N,Expr Branch if Negative 1 1 (2) None

BRA NC,Expr Branch if Not Carry 1 1 (2) None

BRA NN,Expr Branch if Not Negative 1 1 (2) None

BRA NOV,Expr Branch if Not Overflow 1 1 (2) None

BRA NZ,Expr Branch if Not Zero 1 1 (2) None

BRA OA,Expr Branch if Accumulator A overflow 1 1 (2) None

BRA OB,Expr Branch if Accumulator B overflow 1 1 (2) None

BRA OV,Expr Branch if Overflow 1 1 (2) None

BRA SA,Expr Branch if Accumulator A saturated 1 1 (2) None

BRA SB,Expr Branch if Accumulator B saturated 1 1 (2) None

BRA Expr Branch Unconditionally 1 2 None

BRA Z,Expr Branch if Zero 1 1 (2) None

BRA Wn Computed Branch 1 2 None

7BSET BSET f,#bit4 Bit Set f 1 1 None

BSET Ws,#bit4 Bit Set Ws 1 1 No ne

8BSW BSW.C Ws,Wb Write C bit to Ws<Wb> 1 1 None

BSW.Z Ws,Wb Write Z bit to Ws<Wb> 1 1 None

9BTG BTG f,#bit4 Bit Toggle f 1 1 None

BTG Ws,#bit4 Bit Toggle Ws 1 1 No ne

10 BTSC BTSC f,#bit4 Bit Test f, Skip if Clear 1 1

(2 or 3) None

BTSC Ws,#bit4 Bit Test Ws, Skip if Clear 1 1

(2 or 3) None

dsPIC30F4011/4012

11 BTSS BTSS f,#bit4 Bit Test f, Skip if Set 1 1

(2 or 3) None

BTSS Ws,#bit4 Bit Test Ws, Skip if Set 1 1

(2 or 3) None

12 BTST BTST f,#bit4 Bit Test f 1 1 Z

BTST.C Ws,#bit4 Bit Test Ws to C 1 1 C

BTST.Z Ws,#bit4 Bit Test Ws to Z 1 1 Z

BTST.C Ws,Wb Bit Test Ws<Wb> to C 1 1 C

BTST.Z Ws,Wb Bit Test Ws<Wb> to Z 1 1 Z

13 BTSTS BTSTS f,#bit4 B it Test then Set f 1 1 Z

BTSTS.C Ws,#bit4 Bit Test Ws to C, then Set 1 1 C

BTSTS.Z Ws,#bit4 Bit Test Ws to Z, then Set 1 1 Z

14 CALL CALL lit23 Call subroutine 2 2 None

CALL Wn Call indirect subroutine 1 2 None

15 CLR CLR f f = 0x0000 1 1 None

CLR WREG WREG = 0x0000 1 1 None

CLR Ws Ws = 0x0000 1 1 None

CLR Acc,Wx,Wxd,Wy,Wyd,AWB Clear Accumu lator 1 1 OA, OB, SA, SB

16 CLRWDT CLRWDT Clear Watchdog Timer 1 1 WDTO, Sleep

17 COM COM f f = f 11N, Z

COM f,WREG WREG = f 11N, Z

COM Ws,Wd Wd = Ws 11N, Z

18 CP CP f Compare f with WREG 1 1 C, DC, N, OV, Z

CP Wb,#lit5 Compare Wb with lit5 1 1 C, DC, N, OV, Z

CP Wb,Ws Compare Wb with Ws (Wb – Ws) 1 1 C, DC, N, OV, Z

19 CP0 CP0 f Compare f with 0x0000 1 1 C, DC, N, OV, Z

CP0 Ws Compare Ws with 0x0000 1 1 C, DC, N, OV, Z

20 CPB CPB f Compare f with WREG, with Borrow 1 1 C, DC, N, OV, Z

CPB Wb,#lit5 Compare Wb with lit5, with Borrow 1 1 C, DC, N, OV, Z

CPB Wb,Ws Compare Wb with Ws, with Borrow

(Wb – Ws – C)1 1 C, DC, N, OV, Z

21 CPSEQ CPSEQ Wb, Wn Compare Wb with Wn, skip if = 1 1

(2 or 3) None

22 CPSGT CPSGT Wb, Wn Compare Wb with Wn, skip if > 1 1

(2 or 3) None

23 CPSLT CPSLT Wb, Wn Compare Wb with Wn, skip if < 1 1

(2 or 3) None

24 CPSNE CPSNE Wb, Wn Compare Wb with Wn, skip if ≠11

(2 or 3) None

25 DAW DAW Wn Wn = decimal adjust Wn 1 1 C

26 DEC DEC f f = f –1 1 1 C, DC, N, OV, Z

DEC f,WREG WREG = f –1 1 1 C, DC, N, OV, Z

DEC Ws,Wd Wd = Ws – 1 1 1 C, DC, N, OV, Z

27 DEC2 DEC2 f f = f – 2 1 1 C, DC, N, OV, Z

DEC2 f,WREG WREG = f – 2 1 1 C, DC, N, OV, Z

DEC2 Ws,Wd Wd = Ws – 2 1 1 C, DC, N, OV, Z

28 DISI DISI #lit14 Disable Interrupts for k instruction cycles 1 1 None

29 DIV DIV.S Wm,Wn Signed 16/16-bit Integer Divide 1 18 N, Z, C, OV

DIV.SD Wm,Wn Signed 32/16-bit Integer Divide 1 18 N, Z, C, OV

DIV.U Wm,Wn Unsigned 16/16-bit Integer Divide 1 18 N, Z, C, OV

DIV.UD Wm,Wn Unsigned 32/16-bit Integer Divide 1 18 N, Z, C, OV

30 DIVF DIVF Wm,Wn Signed 16/16-bit Fractional Divide 1 18 N, Z, C, OV

31 DO DO #lit14,Expr Do code to PC + Expr, lit14 + 1 time 2 2 None

DO Wn,Expr Do code to PC + Expr, (Wn) +1 time 2 2 None

32 ED ED Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance ( no accumulate) 1 1 OA, OB, OAB,

SA, SB, SAB

TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

Assembly

Mnemonic A s sem b ly Sy ntax Desc rip ti on # of

words # of

cycles Status Flags

Affected

dsPIC30F4011/4012

33 EDAC EDAC Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance 1 1 OA, OB, OAB,

SA, SB, SAB

34 EXCH EXCH Wns,Wnd Swap Wns with Wnd 1 1 None

35 FBCL FBCL Ws,Wnd Find Bit Change from Left (MSb) Side 1 1 C

36 FF1L FF1L Ws,Wnd Find First One from Left (MSb) Side 1 1 C

37 FF1R FF1R Ws,Wnd Find First One from Right (LSb) Side 1 1 C

38 GOTO GOTO Expr Go to address 2 2 None

GOTO Wn Go to in direct 1 2 None

39 INC INC f f = f + 1 1 1 C, DC, N, OV, Z

INC f,WREG WREG = f + 1 1 1 C, DC, N, OV, Z

INC Ws,Wd Wd = W s + 1 1 1 C, DC, N, OV, Z

40 INC2 INC2 f f = f + 2 1 1 C, DC, N, OV, Z

INC2 f,WREG WREG = f + 2 1 1 C, DC, N, OV, Z

INC2 Ws,Wd Wd = Ws + 2 1 1 C, DC, N, OV, Z

41 IOR IOR f f = f .IOR. WREG 1 1 N, Z

IOR f,WREG WREG = f .IOR. WREG 1 1 N, Z

IOR #lit10,Wn Wd = lit10 .IOR. Wd 1 1 N, Z

IOR Wb,Ws,Wd Wd = Wb .IOR. Ws 1 1 N, Z

IOR Wb,#lit5,Wd Wd = Wb .IOR. lit5 1 1 N, Z

42 LAC LAC Wso,#Slit4,Acc Load Accumulator 1 1 OA, OB, OAB,

SA, SB, SAB

43 LNK LNK #lit14 Link Frame Pointer 1 1 None

44 LSR LSR f f = Logical Right Shift f 1 1 C, N, OV, Z

LSR f,WREG WREG = Logical Right Shift f 1 1 C, N, OV, Z

LSR Ws,Wd Wd = Logical Right Shift Ws 1 1 C, N, OV, Z

LSR Wb,Wns,Wnd Wnd = Logical Right Shift Wb by Wns 1 1 N, Z

LSR Wb,#lit5,Wnd Wnd = Logical Right Shift Wb by lit5 1 1 N, Z

45 MAC MAC Wm*Wn,Acc,Wx,Wxd,Wy,Wyd,

AWB

Multiply and Accumulate 1 1 OA, OB, OAB,

SA, SB, SAB

MAC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square and Accumulate 1 1 OA, OB, OAB,

SA, SB, SAB

46 MOV MOV f,Wn Move f to Wn 1 1 None

MOV f Move f to f 1 1 N, Z

MOV f,WREG Move f to WREG 1 1 N, Z

MOV #lit16,Wn Move 16-bit literal to Wn 1 1 None

MOV.b #lit8,Wn Move 8-bit literal to Wn 1 1 None

MOV Wn,f Move Wn to f 1 1 None

MOV Wso,Wdo Move Ws to Wd 1 1 None

MOV WREG,f Move WREG to f 1 1 N, Z

MOV.D Wns,Wd Move Double from W(ns):W(ns + 1) to Wd 1 2 None

MOV.D Ws,Wnd Move Double from Ws to W(nd + 1):W(nd) 1 2 None

47 MOVSAC MOVSAC Acc,Wx,Wxd,Wy,Wyd,AWB Pr efetch and store accu mula tor 1 1 N o ne

48 MPY MPY

Wm*Wn,Acc,Wx,Wxd,Wy,Wyd Multiply Wm by Wn to Accumulator 1 1 OA, OB, OAB,

SA, SB, SAB

MPY Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square Wm to Accumulator 1 1 OA, OB, OAB,

SA, SB, SAB

49 MPY.N MPY.N Wm*Wn,Acc,Wx,Wxd,Wy,Wyd -(Multiply Wm by Wn) to Accumulator 1 1 None

50 MSC MSC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd,

AWB

Multiply and Subtract from Accumulator 1 1 OA, OB, OAB,

SA, SB, SAB

51 MUL MUL.SS Wb,Ws,Wnd {Wnd+1, Wnd} = signed(Wb) * signed(Ws) 1 1 None

MUL.SU Wb,Ws,Wnd {Wnd +1, Wn d} = sign ed (W b ) * un sig ne d( W s) 1 1 None

MUL.US Wb,Ws,Wnd {Wnd +1, Wn d} = uns ign ed (W b ) * sig ne d( W s) 1 1 None

MUL.UU Wb,Ws,Wnd {Wnd +1, Wn d} = uns i gn ed(W b ) * un si g ne d( Ws) 1 1 None

MUL.SU Wb,#lit5,Wnd {Wnd+1, Wnd} = s ign ed (W b) * un sig ne d( l it5 ) 1 1 None

MUL.UU Wb,#lit5,Wnd {Wnd+1, Wnd} = u ns ign ed (Wb ) * un sig ne d( li t5 ) 1 1 None

MUL f W3:W2 = f * WREG 1 1 None

TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

Assembly

Mnemonic A s sem b ly Sy ntax Descr ip ti on # of

words # of

cycles Status Flags

Affected

dsPIC30F4011/4012

52 NEG NEG Acc Negate Accumulator 1 1 OA, OB, OAB,

SA, SB, SAB

NEG f f = f + 1 1 1 C, DC, N, OV, Z

NEG f,WREG WREG = f + 1 1 1 C, DC, N, OV, Z

NEG Ws,Wd Wd = Ws + 1 1 1 C, DC , N, OV, Z

53 NOP NOP No Operation 1 1 None

NOPR No Operation 1 1 None

54 POP POP f Pop f from Top-of-Stack (TOS) 1 1 None

POP Wdo Pop from Top-of-Stack (TOS) to Wdo 1 1 None

POP.D Wnd Pop from Top-of-Stack (TOS) to W(nd):W(nd +1 ) 1 2 None

POP.S Pop Shadow Registers 1 1 All

55 PUSH PUSH f Push f to Top-of-Stack (TOS) 1 1 None

PUSH Wso Push Wso to Top-of-Stack (TOS ) 1 1 None

PUSH.D Wns Push W(ns):W(ns + 1) to Top- of-Stack (TOS) 1 2 None

PUSH.S Push Shadow Registers 1 1 None

56 PWRSAV PWRSAV #lit1 Go into Sleep or Idle mod e 1 1 WDTO, Sleep

57 RCALL RCALL Expr Relative Call 1 2 None

RCALL Wn Computed Call 1 2 None

58 REPEAT REPEAT #lit14 Repeat Next Instruction lit14 + 1 time 1 1 None

REPEAT Wn Repeat Next Instruction (Wn) + 1 time 1 1 None

59 RESET RESET Software device Reset 1 1 None

60 RETFIE RETFIE Return from interrupt 1 3 (2) None

61 RETLW RETLW #lit10,Wn Return with literal in Wn 1 3 (2) None

62 RETURN RETURN Return from Subroutine 1 3 (2) None

63 RLC RLC f f = Rotate Left through Carry f 1 1 C, N, Z

RLC f,WREG WREG = Rotate Left through Carry f 1 1 C, N, Z

RLC Ws,Wd Wd = Rotate Left through Carry Ws 1 1 C, N, Z

64 RLNC RLNC f f = Rotate Left (No Carry) f 1 1 N, Z

RLNC f,WREG WREG = Rotate Left (No Carry) f 1 1 N, Z

RLNC Ws,Wd Wd = Rotate Left (No Carry) Ws 1 1 N, Z

65 RRC RRC f f = Rotate Right through Carry f 1 1 C, N, Z

RRC f,WREG WREG = Rotate Right through Carry f 1 1 C, N, Z

RRC Ws,Wd Wd = Rotate Right through Carry Ws 1 1 C, N, Z

66 RRNC RRNC f f = Rotate Right (No Carry) f 1 1 N, Z

RRNC f,WREG WREG = Rotate Right (No Carry) f 1 1 N, Z

RRNC Ws,Wd Wd = Rotate Right (No Carry) Ws 1 1 N, Z

67 SAC SAC Acc,#Slit4,Wdo St or e A cc um u lat o r 1 1 None

SAC.R Acc,#Slit4,Wdo Store Rounded Accumu lator 1 1 None

68 SE SE Ws,Wnd Wnd = sign-extended Ws 1 1 C, N, Z

69 SETM SETM f f = 0xFFFF 1 1 None

SETM WREG WREG = 0xFFFF 1 1 None

SETM Ws Ws = 0xFFFF 1 1 None

70 SFTAC SFTAC Acc,Wn Arithmetic Shift Accumulator by (Wn) 1 1 OA, OB, OAB,

SA, SB, SAB

SFTAC Acc,#Slit6 Arithmetic Shift Accumulator by Slit6 1 1 OA, OB, OAB,

SA, SB, SAB

71 SL SL f f = Left Shift f 1 1 C,N,OV,Z

SL f,WREG WREG = Left Shift f 1 1 C,N,OV,Z

SL Ws,Wd Wd = Left Shift Ws 1 1 C,N,OV,Z

SL Wb,Wns,Wnd Wnd = Left Shift Wb by Wns 1 1 N, Z

SL Wb,#lit5,Wnd Wnd = Left Shift Wb by lit5 1 1 N, Z

TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

Assembly

Mnemonic A s sem b ly Sy ntax Desc rip ti on # of

words # of

cycles Status Flags

Affected

dsPIC30F4011/4012

72 SUB SUB Acc Subtract Accumulators 1 1 OA, OB, OAB,

SA, SB, SAB

SUB f f = f – WREG 1 1 C, DC, N, OV, Z

SUB f,WREG WREG = f – WREG 1 1 C, DC, N, OV, Z

SUB #lit10,Wn Wn = Wn – lit10 1 1 C, DC, N, OV, Z

SUB Wb,Ws,Wd Wd = Wb – Ws 1 1 C, DC, N, OV, Z

SUB Wb,#lit5,Wd Wd = Wb – lit5 1 1 C, DC, N, OV, Z

73 SUBB SUBB f f = f – WREG – (C) 1 1 C, DC, N, OV, Z

SUBB f,WREG WREG = f – WREG – (C) 1 1 C, DC, N, OV, Z

SUBB #lit10,Wn Wn = Wn – lit10 – (C) 1 1 C, DC, N, OV, Z

SUBB Wb,Ws,Wd Wd = Wb – Ws – (C) 1 1 C, DC, N, OV, Z

SUBB Wb,#lit5,Wd Wd = Wb – lit5 – (C) 1 1 C, DC, N, OV, Z

74 SUBR SUBR f f = WREG – f 1 1 C, DC, N, OV, Z

SUBR f,WREG WREG = WREG – f 1 1 C, DC, N, OV, Z

SUBR Wb,Ws,Wd Wd = Ws – Wb 1 1 C, DC, N, OV, Z

SUBR Wb,#lit5,Wd Wd = lit5 – Wb 1 1 C, DC, N, OV, Z

75 SUBBR SUBBR f f = WREG – f – (C) 1 1 C, DC, N, OV, Z

SUBBR f,WREG WREG = WREG – f – (C) 1 1 C, DC, N, OV, Z

SUBBR Wb,Ws,Wd Wd = Ws – Wb – (C) 1 1 C, DC, N, OV, Z

SUBBR Wb,#lit5,Wd Wd = lit5 – Wb – (C) 1 1 C, DC, N, OV, Z

76 SWAP SWAP.b Wn W n = nibb le swap Wn 1 1 None

SWAP Wn Wn = byte swap Wn 1 1 None

77 TBLRDH TBLRDH Ws,Wd Read Prog<23:16> to Wd<7:0> 1 2 None

78 TBLRDL TBLRDL Ws,Wd Read Prog<15:0> to Wd 1 2 None

79 TBLWTH TBLWTH Ws,Wd Write Ws<7:0> to Prog<23:16> 1 2 None

80 TBLWTL TBLWTL Ws,Wd Write Ws to Prog<15:0> 1 2 None

81 ULNK ULNK Unlink Frame Pointer 1 1 None

82 XOR XOR f f = f .XOR. WREG 1 1 N, Z

XOR f,WREG WREG = f .XOR. WREG 1 1 N, Z

XOR #lit10,Wn Wd = lit10 .XOR. Wd 1 1 N, Z

XOR Wb,Ws,Wd Wd = Wb .XOR. Ws 1 1 N, Z

XOR Wb,#lit5,Wd Wd = Wb .XOR. lit5 1 1 N, Z

83 ZE ZE Ws,Wnd Wnd = Zero-Extend Ws 1 1 C, N, Z

TABLE 22-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr

Assembly

Mnemonic A s sem b ly Sy ntax Descr ip ti on # of

words # of

cycles Status Flags

Affected

dsPIC30F4011/4012

23.0 DEVELOPMENT SUPPORT

The PIC® microcontrollers are supported with a full

range of hardware and software development tools:

• Integrated Development Environment

- MPLAB® IDE Software

• Assemblers/Compilers/Linkers

- MPASMTM Assembler

- MPLAB C18 and MPLAB C30 C Compilers

-MPLINK

TM Object Linker/

MPLIBTM Object Librarian

- MPLAB ASM30 Assembler/Linker/Library

• Simulators

- MPLAB SIM Software Simulator

•Emulators

- MPLAB ICE 2000 In-Circuit Emulator

- MPLAB ICE 4000 In-Circuit Emulator

• In-Circuit Debugger

- MPLAB ICD 2

• Device Progra mmers

- PICSTART® Plus Development Programmer

- MPLAB PM3 Device Programmer

- PICkit™ 2 Development Programmer

• Low-Cost Demonstration and Development

Boards and Evaluation Kits

23.1 MPLAB Integrated Development

Environment Software

The MPLAB IDE software brings an ease of software

development previously unseen in the 8/16-bit micro-

controller market. The MPLAB IDE is a Windows®

operating system-based application that contains:

• A single graphical interface to all debugging tools

- Simulator

- Programmer (sold separately)

- Emulator (sold separatel y)

- In-Circuit Deb u gger (so ld separately)

• A full-featured editor with color-coded context

• A multiple project manager

• Customizable data windows with direct edit of

contents

• High-level source code debugging

• Visual device initializer for easy register

initialization

• Mouse over variable inspection

• Drag and drop variables from source to watch

windows

• Exten si ve on-l in e help

• Integration of select third party tools, such as

HI-TECH Software C Compilers and IAR

C Compilers

The MPLAB IDE allows you to:

• Edit your source files (eithe r assembly or C)

• One touch assemble (or compile) and download

to PIC MCU emulator and simulator tools

(automatically updates all project information)

• Debug us ing :

- Source files (assemb ly or C)

- Mixed assembly and C

- Machine code

MPLAB IDE supports multiple debugging tools in a

single development paradigm, from the cost-effective

simulators, through low-cost in-circuit debuggers, to

full-featured emulators. This eliminates the learning

curve when upgrading to tools with increased flexibility

and power.

dsPIC30F4011/4012

23.2 MPASM Assembler

The MPASM Assembler is a full-featured, universal

macro assemb ler for all PIC MCUs.

The MPASM Assembler generates relocatable object

files fo r the MPLINK Ob ject Linker , Int el® standa rd HEX

files, MAP files to detail memory usage and symbol

reference, absolute LST files that contain source lines

and generated machine code and COFF files for

debugging.

The MPASM Assembler features include:

• Integration into MPLAB IDE projects

• User-defined macros to streamline

assembly code

• Conditional assembly for multi-purpose

sour ce fil es

• Directives that allow complete control over the

assembly process

23.3 MPLAB C18 and MPLAB C30

C Compilers

The MPLAB C18 and MPLAB C30 Code Development

Systems are complete ANSI C compilers for

Microchip’s PIC18 family of microcontrollers and the

dsPIC30, dsPIC33 and PIC24 family of digital signal

controllers. These compilers provide powerful integra-

tion capabilities, superior code optimization and ease

of use not found with other compilers.

For easy source level debugging, the compilers provide

symbol info rmation tha t is optimized to the MPLAB IDE

debugger.

23.4 MPLINK Object Linker/

MPLIB Object Librari an

The MPLINK Object Linker combines relocatable

objects created by the MPASM Assembler and the

MPLAB C18 C Compiler. It can link relocatable objects

from precompiled libraries, using directives from a

linker script.

The MPLIB O bject Li brarian manag es the cre ation an d

modification of library files of precompiled code. When

a routine from a library is called from a source file , only

the modules that contain that routine will be linked in

with the application. This allows large libraries to be

used efficiently in many different applications.

The object linker/library features include:

• Efficient linking of single libraries instead of many

smaller files

• Enhanced code maintainability by grouping

related modules together

• Flexible creation of libraries with easy module

listing, replacement, de letion and extraction

23.5 MPLAB ASM30 Assembler, Linker

and Librarian

MPLAB ASM30 Assembler produces relocatable

machine code from symbolic assembly language for

dsPIC30F devices. MPLAB C30 C Compiler uses the

assembler to produce its object file. The assembler

generates relocatable object files that can then be

archived or linke d with other relocatable ob ject files and

arch ives to c rea te an e xecu tabl e fil e. N otabl e fe atu res

of the assembler include:

• Support for the entire dsPIC30F instruction set

• Support for fixed-point and floating-point data

• Command line interface

• Rich dire cti ve set

• Flexible macro language

• MPLAB IDE compatibility

23.6 MPLAB SIM Software Simulator

The MPLAB SIM Software Simulator allows code

development in a PC-hosted environment by simulat-

ing the PIC MCUs and dsPIC® DSCs on an instruction

level. On any given instruction, the data areas can be

examined or modified and stimuli can be applied from

a comprehensive stimulus controller. Registers can be

logged to files for further run-time analysis. The trace

buffer and logic analyzer display extend the power of

the simulator to record and track program execution,

actions on I/O, most periph erals and inte rnal regi sters.

The MPLAB SIM Software Simulator fully supports

symbolic debugging using the MPLAB C18 and

MPLAB C30 C Compilers, and the MPASM and

MPLAB ASM30 Assemblers. The software simulator

offers the flexibility to develop and debug code outside

of the hardware laboratory environment, making it an

excellent, economical software development tool.

dsPIC30F4011/4012

23.7 MPLAB ICE 2000

High-Performance

In-Circui t Emu lator

The MPLAB ICE 2000 In-Circuit Emulator is intended

to provide the product development engineer with a

complete microcontroller design tool set for PIC micro-

controllers. Software control of the MPLAB ICE 2000

In-Circuit Emulator is advanced by the MPLAB Inte-

grated Development Environment, which allows edit-

ing, building, downloading and source debugging from

a sin gle environment.

The MPLAB ICE 2000 is a full-featured emulator

system with enhanced trace, trigger and data monitor-

ing feat ures. Interc hangeabl e proces sor modul es allow

the system to be easily reconfigured for emulation of

different processors. The architecture of the MPLAB

ICE 2000 In-Circuit Emulator allows expansion to

support new PIC microcontrollers.

The MPLAB ICE 2000 In-Circuit Emulator system has

been designed as a real-time emulation system with

advanced features that are typically found on more

expensive development tools. The PC platform and

Microsoft® Windows® 32-bit operating system were

chosen to best make these features available in a

simple, unified application.

23.8 MPLAB ICE 4000

High-Performance

In-Circui t Emu lator

The MPLAB ICE 4000 In-Circuit Emu lator is intende d to

provide the product development engineer with a

complete microcontroller design tool set for high-end

PIC MCUs and dsPIC DSCs. Software control of the

MPLAB ICE 4000 In-Circuit Emulator is provided by the

MPLAB Integrated Development Environment, which

allows editing, building, downloading and source

debugging from a single environm ent.

The MPLAB ICE 4000 is a premium emulator system,

providing the features of MPLAB ICE 2000, but with

increased emulation memory and high-speed perfor-

mance for dsPIC30F and PIC18XXXX devices. Its

advanc ed emulator fe atures inc lude complex t riggering

and timing, and up to 2 Mb of emulation memory.

The MPLAB ICE 4000 In-Circuit Emulator system has

been designed as a real-time emulation system with

advanced features that are typically found on more

expensive development tools. The PC platform and

Microsoft Windows 32-bit operating system were

chosen to best make these features available in a

simple, unified application.

23.9 MPLAB ICD 2 In-Circuit Debugger

Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a

powerful, low-cost, run-time development tool,

connecting to the host PC via an RS-232 or high-speed

USB interface. This tool is based on the Flash PIC

MCUs and can be used to develop for these and other

PIC MCUs and dsPIC DSCs. The MPLAB ICD 2 utilizes

the in-circuit debugging capability built into the Flash

devices. This feature, along with Microchip’s In-Circuit

Serial ProgrammingTM (ICSPTM) protocol, offers cost-

effective, in-circuit Flash debugging from the graphical

user interface of the MPLAB Integrated Development

Environment. This enables a designer to develop and

debug sou rce code by s etting bre akpoi nts , singl e step-

ping and watching variables, and CPU status and

peripheral registers. Running at full speed enables

testing hardware and applications in real time. MPLAB

ICD 2 also serves as a development programmer for

selected PIC devices.

23.10 MPLAB PM3 Device Programmer

The MPLAB PM3 Device Programmer is a universal,

CE compliant device programmer with programmable

voltage verification at VDDMIN and VDDMAX for

maximum reliability. It features a large LCD display

(128 x 64 ) for men us an d error m essages and a m odu-

lar, detachable socket assembly to support various

pack age types. The ICSP™ cable assembly is incl uded

as a standard item. In Stand-Alone mode, the MPLAB

PM3 Devic e Programmer ca n read, verif y and program

PIC devices without a PC connection. It can also set

code protection in this mode. The MPLAB PM3

connects to the host PC via an RS-232 or USB cable.

The MPLAB PM3 h as high-spe ed co mmunicat ions and

optimized algorithms for quick programming of large

memory devices and in corporates an SD/MMC card for

file storage and secure data applications.

dsPIC30F4011/4012

23.11 PICSTART Plus Development

Programmer

The PICSTART Plus Development Programmer is an

easy-to-use, low-cost, prototype programmer. It

connects to the PC via a COM (RS-232) port. MPLAB

Inte grated Dev elopmen t En vironme nt so ftware makes

using the programmer simple and efficient. The

PICSTART Plus Development Programmer supports

most PIC devices in DIP packages up to 40 pins.

Larger pin count devices, such as the PIC16C92X and

PIC17C76 X, may be sup ported with an a dapter socket.

The PICSTART Plus Development Programmer is CE

compliant.

23.12 PICkit 2 Development Programmer

The PICkit™ 2 Development Programmer is a low-cost

programmer with an easy-to-use interface for pro-

gramming many of Microchip’s baseline, mid-range

and PIC1 8F families of Fl ash memory mic rocontrollers.

The PICkit 2 S tar ter Kit includes a pr ototypin g develop-

ment board, twelve sequential lessons, software and

HI-TECH’s PICC™ Lite C compiler, and is designed to

help get up to speed quickly using PIC® micro-

controllers. The kit provides everything needed to

program, evaluate and develop applications using

Microchip’s powerful, mid-range Flash memory family

of microcontroll ers.

23.13 Demonstration, Development and

Evaluation Boards

A wide variety of demonstration, development and

evaluation boards for various PIC MCUs and dsPIC

DSCs allows quick application development on fully func-

tional systems. Most boards includ e prototyping areas for

adding custom circuitry and provide application firmware

and source code for examination and modification.

The board s suppo rt a variety of features, including LEDs,

temperature sensors, switches, speakers, RS-232

interfaces, LCD displays, potentiometers and additional

EEPROM memory .

The demonstration and development boards can be

used in teaching environments, for prototyping custom

circuits and for learning about various microcontroller

applications.

In addition to the PICDEM™ and dsPICDEM™ demon-

stration/development board series of circuits, Microchip

has a line of evaluation kits and demonstration software

for analog filter design, KEELOQ® security ICs, CAN,

IrDA®, PowerSmart® battery management, SEEVAL®

evaluation system, Sigma-Delta ADC, flow rate

sensing, plus many more.

Check the Microchip web page (www.microchip.com)

and the latest “Product Selector Guide” (DS00148) for

the complete list of demonstration, development and

evaluation kits.

dsPIC30F4011/4012

24.0 ELECTRIC AL CHARACTERISTICS

This section provides an overview of dsPIC30F electrical character istics. Additional information will be provided in future

revisions of this document as it becomes available.

For detailed information about the dsPIC30F architecture and core, refer to the “dsPIC30F Family Reference Manual”

(DS70046).

Absolute maximum ratings for the dsPIC30F family are listed below. Exposure to these maximum rating conditions for

extende d peri ods may aff ec t devi ce re liabil ity. Func tional opera tio n of t he de vice at th ese o r a ny ot her co nditio ns ab ove

the parameters indicated in the operation listings of this specification is not implied.

Absolute Maximum Ratings(†)

Ambient temperature under bias.............................................................................................................-40°C to +125°C

Storage temperature.............................................................................................................................. -65°C to +150°C

Voltage on any pin with respect to VSS (except VDD and MCLR) (Note 1).....................................-0.3V to (VDD + 0.3V)

Vo lt a ge on VDD with respect to VSS ......................................................................................................... -0.3V to +5.5V

Vo lt a ge on MCLR with respect to VSS .......................................................................................................0V to +13.25V

Maximum curr ent o ut of VSS pin ...........................................................................................................................300 mA

Maximum curr ent i nto VDD pin (Note 2)................................................................................................................250 mA

Input clamp current, IIK (VI < 0 or VI > VDD)..........................................................................................................±20 mA

Output clamp current, IOK (VO < 0 or VO > VDD)...................................................................................................±20 mA

Maximum output current sunk by any I/O pin..........................................................................................................25 mA

Maximum output current sourced by any I/O pin....................................................................................................25 mA

Maximum current sunk by all ports.......................................................................................................................200 mA

Maximum current sourced by all ports (Note 2)....................................................................................................200 mA

Note 1: Voltage spikes below VSS at the MCLR pin, inducing currents greater than 80 mA, may cause latch-up.

Thus, a series res istor of 5 0-100Ω should be used when applying a “low” level to the MCLR/ pin, rathe r than

pulling this pin d irect ly to VSS.

2: Maximum allowable current is a function of device maximum power dissipation (see Table 24-2).

24.1 DC Characteristics

†NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device . This is a stres s rating onl y and funct ional ope ration of the device at tho se or any other co nditio ns above those

indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for

extended periods may affect device reliability.

TABLE 24-1: OPERATING MIPS VS. VOLTAGE

VDD Range Temp Range Max MIPS

dsPIC30F401X-30I dsPIC30F401X-20E

4.5-5.5V -40°C to +85°C 30 —

4.5-5.5V -40°C to +125°C — 20

3.0-3.6V -40°C to +85°C 20 —

3.0-3.6V -40°C to +125°C — 15

2.5-3.0V -40°C to +85°C 10 —

dsPIC30F4011/4012

TABLE 24-2: THERMAL OPERATING CONDITIONS

Rating Symbol Min Typ Max Unit

dsPIC30F401X-30I

Operating Junction Temperature Range TJ-40 +125 °C

Operating Ambient Temperature Range TA-40 +85 °C

dsPIC30F401X-20E

Operati ng Junction Temperature Rang e TJ-40 +150 °C

Operating Ambient Temperature Range TA-40 +125 °C

Power Dissi pation:

Internal Chip Power Dissipation:

PINT = VDD X (IDD – ∑ IOH) PDPINT + PI/OW

I/O Pin power dissipation:

PI/O = ∑ ({VDD – VOH} X IOH) + ∑ (VOL X IOL)

Maximum Allowed Power Dissipation PDMAX (TJ – TA)/θJA W

TABLE 24-3: THERMAL PACKAGING CHARACTERISTICS

Characteristic Symbol Typ Max Unit Notes

Package Thermal Resistance, 28-pin SPDIP (SP) θJA 41 °C/W 1

Package Thermal Resistance, 28-pin SOIC (SO) θJA 45 °C/W 1

Package Thermal Resistance, 40-pin PDIP (P) θJA 37 °C/W 1

Package Thermal Resistance, 44-pin TQFP, 10x10x1 mm (PT) θJA 40 °C/W 1

Package Thermal Resistance, 44-pin QFN (ML) θJA 28 °C/W 1

Note 1: Junction to ambient thermal resistance, Theta-ja (θJA) numbers are achieved by package simulations.

TABLE 24-4: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS

DC CHARACTERISTICS

St andard Operating C onditions: 2.5V to 5.5V (unless otherwise st ated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

Operating Voltage(2)

DC10 VDD Supply Voltage 2.5 — 5.5 V Industrial temperature

DC11 VDD Supply Voltage 3.0 — 5.5 V Extend ed tem pera t ure

DC12 VDR RAM Data Retention

Voltage(3) —1.5—V

DC16 VPOR VDD Start Voltage

to ensure internal

Power-on Reset signal

—V

SS —V

DC17 SVDD VDD Rise Rate

to ensure internal

Power-on Reset signal

0.05 — — V/ms 0-5V in 0.1 sec,

0-3V in 60 ms

Note 1: Data in “Typ” column i s at 5V, 25°C unless oth erw ise s tated. Param eters are for de si gn g uid anc e on ly and

are not t ested.

2: These parameters are characterized but not tested in manufacturing.

3: This is the limit to which VDD can be lowered without losing RAM data.

dsPIC30F4011/4012

TABLE 24-5: DC CHARACTERISTICS: OPERATING CURRENT (IDD)

DC CHARACTERISTICS

S tandard O p erating C ond itions: 2 .5V to 5 .5V (unless o th erw ise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Parameter

No. Typical(1) Max Units Conditions

Operating Current (IDD)(2)

DC31a 2 4 mA +25°C 3.3V

0.128 MIPS

LPRC (512 kHz)

DC31b 2 4 mA +85°C

DC31c 2 4 mA +125°C

DC31e 3 5 mA +25°C 5VDC31f 3 5 mA +85°C

DC31g 3 5 mA +125°C

DC30a 4 6 mA +25°C 3.3V

(1.8 MIPS)

FRC (7.37 MHz)

DC30b 4 6 mA +85°C

DC30c 4 6 mA +125°C

DC30e 7 10 mA +25°C 5VDC30f 7 10 mA +85°C

DC30g 7 10 mA +125°C

DC23a 12 19 mA +25°C 3.3V

4 MIPS

DC23b 12 19 mA +85°C

DC23c 13 19 mA +125°C

DC23e 19 31 mA +25°C 5VDC23f 20 31 mA +85°C

DC23g 20 31 mA +125°C

DC24a 28 39 mA +25°C 3.3V

10 MIPS

DC24b 28 39 mA +85°C

DC24c 29 39 mA +125°C

DC24e 46 64 mA +25°C 5VDC24f 46 64 mA +85°C

DC24g 47 64 mA +125°C

DC27a 53 72 mA +25°C 3.3V

20 MIPS

DC27b 53 72 mA +85°C

DC27d 87 120 mA +25°C 5VDC27e 87 120 mA +85°C

DC27f 87 120 mA +125°C

DC29a 124 170 mA +25°C 5V 30 MIPS

DC29b 125 170 mA +85°C

Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only

and are not tested.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O

pin load in g an d s w itc hi ng ra te, os cil la tor ty pe , in ternal code e xe cut ion p a ttern and temp erat ure, also hav e

an imp act on the current c onsumpti on. The tes t condi tions fo r all IDD measureme nt s are as foll ows : OSC1

driven with external square wave from rail to rail. All I/O pins are configured as inputs and pulled to VDD.

MCLR = VDD, WDT, FSCM, LVD and BOR are di sable d. CPU, SRAM, program memo ry and dat a m emory

are operational. No peripheral modules are operating.

dsPIC30F4011/4012

TABLE 24-6: DC CHARACTERISTICS: IDLE CURRENT (IIDLE)

DC CHARACTERISTICS

S t andard Op erating Cond itions: 2.5V to 5.5V (unless otherwise st ated)

Operating temp erature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Parameter

No. Typical(1,2) Max Units Conditions

Operating Current (IDD)(3)

DC51a 1.3 3 mA +25°C 3.3V

0.128 MIPS

LPRC (512 kHz)

DC51b 1.3 3 mA +85°C

DC51c 1.3 3 mA +125°C

DC51e 2.7 5 mA +25°C 5VDC51f 2.7 5 mA +85°C

DC51g 2.7 5 mA +125°C

DC50a 4 6 mA +25°C 3.3V

(1.8 MIPS)

FRC (7.37 MHz)

DC50b 4 6 mA +85°C

DC50c 4 6 mA +125°C

DC50e 7 11 mA +25°C 5VDC50f 7 11 mA +85°C

DC50g 7 11 mA +125°C

DC43a 7 11 mA +25°C 3.3V

4 MIPS

DC43b 7 11 mA +85°C

DC43c 7 11 mA +125°C

DC43e 12 17 mA +25°C 5VDC43f 12 17 mA +85°C

DC43g 12 17 mA +125°C

DC44a 15 22 mA +25°C 3.3V

10 MIPS

DC44b 15 22 mA +85°C

DC44c 16 22 mA +125°C

DC44e 26 36 mA +25°C 5VDC44f 27 36 mA +85°C

DC44g 27 36 mA +125°C

DC47a 30 40 mA +25°C 3.3V

20 MIPS

DC47b 30 40 mA +85°C

DC47d 50 65 mA +25°C 5VDC47e 50 65 mA +85°C

DC47f 51 65 mA +125°C

DC49a 72 95 mA +25°C 5V 30 MIPS

DC49b 73 95 mA +85°C

Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only

and are not tested.

2: Base IIDLE current is measured with core off, clock on and all modules turned off.

dsPIC30F4011/4012

TABLE 24-7: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated)

Operati ng tem pera ture -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Parameter

No. Typical(1) Max Units Conditions

Power-Down Current (IPD)(2)

DC60a 0.3 — μA 25°C 3.3V

Base power-down current(3)

DC60b 1 30 μA 85°C

DC60c 12 60 μA 125°C

DC60e 0.5 — μA 25°C 5VDC60f 2 45 μA 85°C

DC60g 17 90 μA 125°C

DC61a 5 8 μA 25°C 3.3V

Watchdog Timer current: ΔIWDT(3)

DC61b 5 8 μA 85°C

DC61c 6 9 μA 125°C

DC61e 10 15 μA 25°C 5VDC61f 10 15 μA 85°C

DC61g 11 17 μA 125°C

DC62a 4 10 μA 25°C 3.3V

Timer1 w/3 2 kHz crystal: ΔITI32(3)

DC62b 5 10 μA 85°C

DC62c 4 10 μA 125°C

DC62e 4 15 μA 25°C 5VDC62f 6 15 μA 85°C

DC62g 5 15 μA 125°C

DC63a 32 48 μA 25°C 3.3V

BOR on: ΔIBOR(3)

DC63b 35 53 μA 85°C

DC63c 37 56 μA 125°C

DC63e 37 56 μA 25°C 5VDC63f 41 62 μA 85°C

DC63g 57 86 μA 125°C

Note 1: Data in “Typ” column is at 5V, 25°C unless o therw ise st ate d. Parame ters are for desi gn gui dance only and

are not t ested.

2: These parameters are characterized but not tested in manufacturing.

dsPIC30F4011/4012

TABLE 24-8: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS

DC CHARACTERISTICS

S ta ndard Ope rating Conditions: 2.5V to 5.5V

(unless otherwise s ta ted)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

VIL Input Low Voltage(2)

DI10 I/O pins:

with Schmitt Trigger buffer VSS —0.2VDD V

DI15 MCLR VSS —0.2VDD V

DI16 OSC1 (in XT, HS and LP modes) VSS —0.2VDD V

DI17 OSC1 (in RC mode)(3) VSS —0.3VDD V

DI18 SDA, SCL VSS —0.3VDD V SMBus disabled

DI19 SDA, SCL VSS —0.2VDD V SMBus enabled

VIH Input High Voltage(2)

DI20 I/O pins:

with Schmitt Trigger buffer 0.8 VDD —VDD V

DI25 MCLR 0.8 VDD —VDD V

DI26 OSC1 (in XT, HS and LP modes) 0.7 VDD —VDD V

DI27 OSC1 (in RC mode)(3) 0.9 VDD —VDD V

DI28 SDA, SCL 0.7 VDD —VDD V SMBus disabled

DI29 SDA, SCL 0.8 VDD —VDD V SMBus enabled

DI30 ICNPU CNXX Pull-up Current(2) 50 250 400 μAVDD = 5V, VPIN = VSS

IIL Input Leakage Current(2,4,5)

DI50 I/O ports — 0.01 ±1 μAVSS ≤ VPIN ≤ VDD,

Pin at hi gh-impedance

DI51 Analog input pins — 0.50 — μAV

SS ≤ VPIN ≤ VDD,

Pin at hi gh-impedance

DI55 MCLR —0.05±5μAVSS ≤ VPIN ≤ VDD

DI56 OSC1 — 0.05 ±5 μAVSS ≤ VPIN ≤ VDD,

XT, HS and LP Osc mode

Note 1: Data in “Typ” column is at 5V, 25°C unl es s othe rwis e st a ted. Parameters are for des ign guid anc e onl y and

are not tested.

2: These parameters are characterized but not tested in manufacturing.

3: In RC osci llator config ura tion, th e OSC1/C LKl pi n is a S chmit t Trig ger inp ut. It is not rec ommende d that th e

dsPIC30F device be driven with an external clock while in RC mode.

4: The leakage cu rren t on the MCLR pin is st rong ly dependent o n the applied volt age level. The specifi ed lev -

els represent normal operating conditions. Higher leakage current may be measured at different input volt-

ages.

5: Negative current is defined as current sourced by the pin.

dsPIC30F4011/4012

FIGURE 24-1: BROWN-OUT RESET CHARACTERISTICS

TABLE 24-9: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise st ated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

VOL Output Low Voltage(2)

DO10 I/O ports — — 0.6 V IOL = 8.5 mA, VDD = 5V

——TBDVI

OL = 2.0 mA, VDD = 3V

DO16 OSC2/CLKO — — 0.6 V IOL = 1.6 mA, VDD = 5V

(RC or EC Osc mode) — — TBD V IOL = 2.0 mA, VDD = 3V

VOH Output High Voltage(2)

DO20 I/O ports VDD – 0.7 — — V IOH = -3.0 mA, VDD = 5V

TBD — — V IOH = -2.0 mA, VDD = 3V

DO26 OSC2/CLKO VDD – 0.7 — — V IOH = -1.3 mA, VDD = 5V

(RC or EC Osc mode) TBD — — V IOH = -2.0 mA, VDD = 3V

Capacitive Loading Specs

on Output Pins(2)

DO50 COSC2 OSC2/SOSC2 pin — — 15 pF In XTL, XT, HS and LP mo des

when e xternal cloc k is used to

drive OSC1

DO56 CIO All I/O pins and OSC2 — — 50 pF RC or EC Osc mode

DO58 CBSCL, SDA — — 400 pF In I2C™ mode

Note 1: Data in “Typ” col umn i s at 5V, 25°C unless o the rw is e stated. Param ete rs ar e for design gu ida nc e on ly and

are not tested.

2: These parameters are characterized but not tested in manufacturing.

BO10

Reset (due to BOR)

VDD

(Device in Brown-out Reset)

(Device not in Brown-out Reset)

Power-up Time-out

BO15

dsPIC30F4011/4012

TABLE 24-10: ELECTRICAL CHARACTERISTICS: BOR

DC CHARACTERISTICS

St an dard Operating C onditions: 2.5V to 5.5V (unless other wise st ated )

Operating tempe rature -40 °C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

BO10 VBOR BOR Voltage on

VDD Transition

High-to-Low(2)

BORV = 11(3) — — — V Not in operating range

BORV = 10 2.6 — 2.71 V

BORV = 01 4.1 — 4.4 V

BORV = 00 4.58 — 4.73 V

BO15 VBHYS —5—mV

Note 1: Data in “Typ” column is a t 5V, 25°C unl es s othe rw ise s tated. Para me ters ar e fo r design gui da nce only an d

are not t ested.

2: These parameters are characterized but not tested in manufacturing.

3: ‘11’ values not in usable operating range.

TABLE 24-11: DC CHARACTERISTICS: PROGRAM AND EEPROM

DC CHARACTERISTICS

S ta ndard O perating Co nditions: 2.5V to 5.5V (unless o therwise st ated )

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

Dat a EE PROM Memory(2)

D120 EDByte Endurance 100K 1M — E/W -40°C ≤ TA ≤ +85°C

D121 VDRW VDD for Read/Write VMIN — 5.5 V Using EECON to read/write,

VMIN = Minimum operatin g voltage

D122 TDEW Erase/Write Cycle Time — 2 — ms

D123 TRETD Characteristic Retention 40 100 — Year Provided no other specifications are

violated

D124 IDEW IDD During Programming — 10 30 mA Row Erase

Program Fl as h M e mory (2)

D130 EPCell Endurance 10K 100K — E/W -4 0°C ≤ TA ≤ +85°C

D131 VPR VDD for Read VMIN —5.5VVMIN = Minimum operati ng voltage

D132 VEB VDD for Bulk Erase 4.5 — 5.5 V

D133 VPEW VDD for Erase/Write 3.0 — 5.5 V

D134 TPEW Erase/Write Cycle Time — 2 — ms

D135 TRETD Characteristic Retention 40 100 — Year Provided no other specifications are

violated

D136 TEB ICSP™ Block Erase Time — 4 — ms

D137 IPEW IDD During Programming — 10 30 mA Row Erase

D138 IEB IDD During Prog ramming — 10 30 mA Bulk Erase

Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated.

2: These parameters are characterized but not tested in manufacturing.

dsPIC30F4011/4012

24.2 AC Characteristics and Timing Parameters

The information contained in this section defines dsPIC30F AC characteristics and timing parameters.

TABLE 24-12: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC

FIGURE 24-2: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS

FIGURE 24-3: EXTERNAL CLOCK TIMING

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise st ated)

Operati ng tem pera ture -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Operati ng voltage VDD range as described in Section 24.0 “Electrical

Characteristics”.

VDD/2

VSS

RL= 464Ω

CL= 50 pF for all pins except OSC2

5 pF for OSC2 output

Load Cond itio n 1 – for all pins except OSC2 Load Condition 2 – for OSC2

OSC1

CLKO

Q4 Q1 Q2 Q3 Q4 Q1

OS20 OS30 OS30

OS40 OS41

OS31 OS31

OS25

dsPIC30F4011/4012

TABLE 24-13: EXTERNAL CLOCK TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise st ated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

OS10 FOSC External C LKI Frequ enc y

(external clocks allowed only

in EC mode)(2)

—

7.5

MHz

EC with 4x PLL

EC with 8x PLL

EC with 16x PLL

Oscillator Frequency(2) DC

0.4

—

7.37

512

7.5

—

MHz

kHz

MHz

kHz

XTL

XT with 4x PLL

XT with 8x PLL

XT with 16x PLL

FRC internal

LPRC internal

OS20 TOSC TOSC = 1/FOSC — — — — See parame ter OS10

for FOSC value

OS25 TCY Instruction Cycle Time(2,3) 33 — DC ns See Table 24-16

OS30 TosL,

TosH External C lock in (OSC1)

High or Low Time(2) .45 x TOSC ——nsEC

OS31 TosR,

TosF External C lock in (OSC1)

Rise or Fall Time(2) — — 20 ns EC

OS40 TckR CLKO Ris e Time(2,4) — — — ns See parameter D031

OS41 TckF CLKO Fall Time(2,4) — — — ns See parameter D032

Note 1: Data in “Typ” column i s at 5V, 25°C unless oth erw ise s tated. Param eters are for de si gn g uid anc e on ly and

are not t ested.

2: These parameters are characterized but not tested in manufacturing.

3: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values

are based on characterization data for that particular oscillator type under standard operating conditions

with the device executing code. Exceeding these specified limits may result in an unstable oscillator

operation and/or higher than expected current consumption. All devices are tested to operate at “min.”

values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the

“Max.” cycle time limit is “DC” (no clock) for all devices.

4: Measurements are taken in EC or ERC modes. The CLKO signal is measured on the OSC2 pin. CLKO is

low for the Q1-Q2 period (1/2 TCY) and high for the Q3-Q4 period (1/2 TCY).

dsPIC30F4011/4012

TABLE 24-14: PLL CLOCK TIMING SPECIFICATIONS (VDD = 2.5 TO 5.5V)

AC CHARACTERISTICS

Standard Operating Cond itions: 2.5V to 5.5V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

OS50 FPLLI PLL Input Frequency Range(2) 4

—

7.5(3)

MHz

EC with 4x PLL

EC with 8x PLL

EC with 16x PLL

XT with 4x PLL

XT with 8x PLL

XT with 16x PLL

OS51 FSYS On-Chip PLL Output(2) 16 — 120 MHz EC, XT with PLL

OS52 TLOC PLL Start-up Time (Lock Time) — 20 50 μs

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data i n “Typ” colum n i s at 5V, 25°C unless o the rwis e s t ate d. Pa ram ete rs are for design guidanc e on ly and

are not tested.

3: Limited by device operating frequency range.

TABLE 24-15: PLL JITTER

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Characteristic Min Typ(1) Max Units Conditions

OS61 x4 PLL — 0.251 0. 413 % -40°C ≤ TA ≤ +85°C VDD = 3.0 to 3.6V

— 0.251 0.413 % -40°C ≤ TA ≤ +125°C VDD = 3.0 to 3.6V

— 0.256 0.47 % -40°C ≤ TA ≤ +85°C VDD = 4.5 to 5.5V

— 0.256 0.47 % -40°C ≤ TA ≤ +125°C VDD = 4.5 to 5.5V

x8 PLL — 0.355 0.584 % -40°C ≤ TA ≤ +85°C VDD = 3.0 to 3.6V

— 0.355 0.584 % -40°C ≤ TA ≤ +125°C VDD = 3.0 to 3.6V

— 0.362 0.664 % -40°C ≤ TA ≤ +85°C VDD = 4.5 to 5.5V

— 0.362 0.664 % -40°C ≤ TA ≤ +125°C VDD = 4.5 to 5.5V

x16 PLL — 0.67 0.92 % -40°C ≤ TA ≤ +85°C VDD = 3.0 to 3.6V

— 0.632 0.956 % -40°C ≤ TA ≤ +85°C VDD = 4.5 to 5.5V

— 0.632 0.956 % -40°C ≤ TA ≤ +125°C VDD = 4.5 to 5.5V

Note 1: These parameters are characterized but not tested in manufacturing.

dsPIC30F4011/4012

TABLE 24-16: INTERNAL CLOCK TIMING EXAMPLES

Clock

Oscillator

Mode

FOSC

(MHz)(1) TCY (μsec)(2) MIPS

w/o PLL(3) MIPS

w/PLL x4(3) MIPS

w/PLL x8(3) MIPS

w/PLL x16(3)

EC 0.200 20.0 0.05 — — —

4 1.0 1.0 4.0 8.0 16.0

10 0.4 2.5 10.0 20.0 —

25 0.16 6.25 — — —

XT 4 1.0 1.0 4.0 8.0 16.0

10 0.4 2.5 10.0 20.0 —

Note 1: Assumption: Oscillator postscaler is divide by 1.

2: Ins truction Execut ion Cycle Time: TCY = 1/MIPS.

3: Instruction Execution Frequency: MIPS = (FOSC * PLLx)/4, s ince t here are 4 Q cl ocks pe r instru cti on cycl e.

dsPIC30F4011/4012

TABLE 24-17: AC CHARACTERISTICS: INTERNAL RC JITTER

AC CHARACTERISTICS Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Characteristic Min Typ Max Units Conditions

Internal FRC Jitter @ FRC Freq. = 7.37 MHz(1)

OS62 FRC — +0.04 +0.16 % -40°C ≤ TA ≤ +85°C VDD = 3.0-3.6V

—+0.07 +0.23 % -40°C ≤ TA ≤ +125°C VDD = 4.5-5.5V

Internal FRC Accuracy @ FRC Freq. = 7.37 MHz(1)

OS63 FRC — — +1.50 % -40°C ≤ TA ≤ +125°C VDD = 3.0-5.5V

Internal FRC Drift @ FRC Freq. = 7.37 MHz(1)

OS64 -0.7 — 0.5 % -40°C ≤ TA ≤ +85°C VDD = 3.0-3.6V

-0.7 — 0.7 % -40°C ≤ TA ≤ +125°C VDD = 3.0-3.6V

-0.7 — 0.5 % -40°C ≤ TA ≤ +85°C VDD = 4.5-5.5V

-0.7 — 0.7 % -40°C ≤ TA ≤ +125°C VDD = 4.5-5.5V

Note 1: Frequency calibrated at 7.372 MHz ±2%, 25°C and 5V. TUN<3:0> bits can be used to compensate for

temperature drift.

2: Overall FRC variation can be calculated by adding the absolute values of jitter, accuracy and drift

percentages.

TABLE 24-18: INTERNAL RC ACCURACY

AC CHARACTERISTICS

Standard Operating Cond itions: 2.5V to 5.5V (unless otherwise st a ted)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Characteristic Min Typ Max Units Conditions

LPRC @ Freq. = 512 kHz(1)

OS65 -35 — +35 %

Note 1: Change of LPRC frequency as VDD changes.

dsPIC30F4011/4012

FIGURE 24-4: CLKO AND I/O TIMING CHARACTERISTICS

Note: Refer to Figure 24-2 for load conditions.

I/O Pin

(Input)

I/O Pin

(Output)

DI35

Old Value New Value

DI40

DO31

DO32

TABLE 24-19: CLKO AND I/O TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Op erating Cond itions: 2.5V to 5.5V (u nless otherw ise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1,2,3) Min Typ(4) Max Units Conditions

DO31 TIOR Port Output Rise Time — 7 20 ns

DO32 TIOF Port O utput Fall Time — 7 20 ns

DI35 TINP INTx Pin High or Low Time (output) 20 — — ns

DI40 TRBP CNx High or Low Ti me (input) 2 TCY ——ns

Note 1: These parameters are asynchronous events not related to any internal clock edges

2: Measurements are taken in RC mode and EC mode where CLKO output is 4 x TOSC.

3: These parameters are characterized but not tested in manufacturing.

4: Data in “Typ” column is at 5V, 25°C unless otherwise stated.

dsPIC30F4011/4012

FIGURE 24-5: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP

TIMER TIMING CHARACTERISTICS

VDD

MCLR

Internal

POR

PWRT

Time-out

Oscillator

Time-out

Internal

Reset

Watchdog

Timer

Reset

SY11

SY10

SY20

SY13

I/O Pins

SY13

Note: Refer to Figure 24-2 for load conditions.

FSCM

Delay

SY35

SY30

SY12

dsPIC30F4011/4012

FIGURE 24-6: BAND GAP START-UP TIME CHARACTERISTICS

TABLE 24-20: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER

AND BROWN-OUT RESET TIMING REQUIREMENTS

AC CHARACTERISTICS

St an dard Ope rating Conditions: 2.5V to 5.5V

(unless otherw ise st ated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SY10 TmcL MCLR Pulse Width (low) 2 — — μs -40°C to +85°C

SY11 TPWRT Power-up Timer Period 3

ms -40°C to +85°C

User-programmable

SY12 TPOR Power-on Reset Delay 3 10 30 μs -40°C to +85°C

SY13 TIOZ I/O High-Impedance from MCLR

Low or Watchdog Timer Reset —0.81.0μs

SY20 TWDT1 Watchdog Timer Time-out

Period (no prescaler) 1.4 2.1 2.8 ms VDD = 5V, -40°C to +85°C

TWDT21.42.12.8msVDD = 3V, -40°C to +85°C

SY25 TBOR Brown-out Reset Pulse Width(3) 100 — — μsVDD ≤ VBOR (D034)

SY30 TOST Oscillation Start-up Timer Period — 1024 TOSC ——TOSC = OSC1 period

SY35 TFSCM Fail-Safe Clock Monitor Delay — 500 900 μs -40°C to +85°C

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated.

3: Refer to Figure 24-1 and Table 24-10 for BOR.

VBGAP

Enable

Band Gap

Stable

Note 1: Note: Band gap is enabled when FBORPOR<7> is set.

SY40

Band Gap(1)

TABLE 24-21: BAND GAP START-UP TIME REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated)

Operating temperature -40° C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SY40 TBGAP Band Gap

St art -up Time —4065μs Defined as the time between the instant

that the band gap is enabled and the

moment that the band gap reference

voltage is stable (RCON<13> status bit)

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated.

dsPIC30F4011/4012

FIGURE 24-7: TIMERx EXTERNAL CLOCK TIMING CHARACTERISTICS

Note: Refer to Figure 24- 2 for l oad conditions.

Tx11

Tx15

Tx10

Tx20

TMRx OS60

TxCK

TABLE 24-22: TIMER1 EXTERNAL CLOCK TIMING REQUIREMENTS

AC CHARACTERISTICS

St andard Operating Conditions: 2.5V to 5.5V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ Max Units Conditions

TA10 TTXHT1CK High

Time Synchronous,

no prescale r 0.5 TCY + 20 — — ns Must also meet

parameter TA15

Synchronous,

with prescaler 10 — — ns

Asynchronous 10 — — ns

TA11 TTXL T1CK Low

Time Synchronous,

no prescale r 0.5 TCY + 20 — — ns Must also meet

parameter TA15

Synchronous,

with prescaler 10 — — ns

Asynchronous 10 — — ns

TA15 TTXP T1CK Input

Period Synchronous,

no prescale r TCY + 10 — — ns

Synchronous,

with prescaler Greater of:

20 ns or

(TCY + 40)/N

— — — N = prescale val ue

(1, 8, 64, 256)

Asynchronous 20 — — ns

OS60 Ft1 SOSCO/T1CK Oscillator

Input frequen cy Range

(oscillator enabled by setting

bit, TCS (T1CON<1>)

DC — 50 kHz

TA20 TCKEXTMRL Delay from External T1CK

Clock Edge to Timer

Increment

0.5 TCY —1.5 TCY —

dsPIC30F4011/4012

TABLE 24-23: TIMER2 AND TIMER4 EXTERNAL CLOCK TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise sta ted)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ Max Units Conditions

TB10 TTXH TxCK High Time Sync hronous,

no prescale r 0.5 TCY + 20 — — ns Must also meet

parameter TB15

Synchronous,

with prescaler 10 — — ns

TB11 TTXL TxCK Low Time Synchronous,

no prescale r 0.5 TCY + 20 — — ns Must also meet

parameter TB15

Synchronous,

with prescaler 10 — — ns

TB15 TTXP TxCK Input

Period Synchronous,

no prescale r TCY + 10 — — ns N = prescale

value

(1, 8, 64, 256)

Synchronous,

with prescaler Greater of :

20 ns or

(TCY + 40)/N

TB20 TCKEXTMRL Delay from External TxCK Clock

Edge to Timer Increment 0.5 TCY 1.5 TCY —

TABLE 24-24: TIMER3 AND TIMER5 EXTERNAL CLOCK TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise sta ted)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ Max Units Conditions

TC10 TtxH TxCK High Time Synchronous 0.5 TCY + 20 — — ns Must also meet

parameter TC15

TC11 TtxL TxCK Low Time Synchronous 0.5 TCY + 20 — — ns Must also meet

parameter TC15

TC15 TtxP TxCK Input Period Synchronous,

no prescale r TCY + 10 — — ns N = prescale

value

(1, 8, 64, 256)

Synchronous,

with prescaler Greater of:

20 ns or

(TCY + 40)/N

TC20 TCKEXTMRL Delay from External TxCK Clock

Edge to Ti mer Increment 0.5 TCY —1.5 TCY —

dsPIC30F4011/4012

FIGURE 24-8: QEI MODULE EXTERNAL CLOCK TIMING CHARACTERISTICS

TQ11

TQ15

TQ10

TQ20

QEB

POSCNT

TABLE 24-25: QEI MODULE EXTERNAL CLOCK TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Cond itions: 2.5V to 5.5V

(unless otherwise st ated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ Max Units Conditions

TQ10 TtQH TxCK High Time Synchronous,

with prescaler TCY + 20 — — ns Must also meet

parameter TQ15

TQ11 TtQL TxCK Low Time Synchronous,

with prescaler TCY + 20 — — ns Must also meet

parameter TQ15

TQ15 TtQP TxCK Input Period Synchron ous,

with prescaler 2 * TCY + 40 — — ns

TQ20 TCKEXTMRL Delay from External TxCK Clock

Edge to Timer Increment 0.5 TCY —1.5 TCY ns

Note 1: These parameters are characterized but not tested in manufacturing.

dsPIC30F4011/4012

FIGURE 24-9: INPUT CAPTURE TIMING CHARACTERISTICS

ICX

IC10 IC11

IC15

Note: Refer to Figure 24-2 for load conditions.

TABLE 24-26: INPUT CAPTURE TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Co nditions: 2.5V to 5.5V (unless otherwise sta ted)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Max Units Conditions

IC10 TccL ICx Input Low Ti me No prescaler 0 .5 TCY + 20 — ns

With prescaler 10 — ns

IC11 TccH ICx Input High Time No prescaler 0.5 TCY + 20 — ns

With prescaler 10 — ns

IC15 TccP ICx Input Period (2 TCY + 40)/N — ns N = prescale

value (1, 4, 16)

Note 1: These parameters are characterized but not tested in manufacturing.

dsPIC30F4011/4012

FIGURE 24-10: OUTPUT COMPARE MODULE T IMING CHARACTERISTICS

OCx

OC11 OC10

(Output Compare

Note: Refer to Figure 24-2 for load conditions.

or PWM Mode)

TABLE 24-27: OUTPUT COMPARE MODULE TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

OC10 TccF OCx Output Fall Time — — — ns See parameter DO32

OC11 TccR OCx Output Rise Time — — — ns See parameter DO31

Note 1: These parameters are characterized but not tested in manufacturing.

2: Dat a in “Typ” column is at 5V, 25°C unless ot herwi se st ated. Paramete rs are for de sign gu idanc e only and

are not t ested.

dsPIC30F4011/4012

FIGURE 24-11: OUTPUT COMPARE/PWM MODULE TIMING CHARACTERISTICS

OCFA

OCx

OC20

OC15

TABLE 24-28: SIMPLE OUTPUT COMPARE/PWM MODE TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Ope rati ng temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

OC15 TFD Fault Input to PWM I/O

Change ——50ns

OC20 TFLT Fault Input Pulse Width 50 — — ns

Note 1: These parameters are characterized but not tested in manufacturing.

2: Dat a in “Typ” column is at 5V, 25°C unless o therwis e st ated. Par ame ters are for d esign guidan ce onl y and

are not t ested.

dsPIC30F4011/4012

FIGURE 24-12: MOTOR CONTROL PWM MODULE FAULT TIMING CHARACTERISTICS

FIGURE 24-13: MOTOR CONTROL PWM MODULE TIMING CHARACTERISTICS

FLTA

PWMx

MP30

MP20

PWMx

MP11 MP10

Note: Refer to Figure 24-2 for load cond iti ons .

TABLE 24-29: MOTOR CONTROL PWM MODULE TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise st ated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

MP10 TFPWM PWM Output Fall Time — — — ns See parameter DO32

MP11 TRPWM PWM Output Rise

Time — — — ns See parameter DO31

MP20 TFD Fault Input ↓ to PWM

I/O Chan ge — — 50 ns

MP30 TFH Minimum Pulse Width 50 — — ns

Note 1: These parameters are characterized but not tested in manufacturing.

2: Dat a in “Typ” column is at 5V, 25°C unless o therwis e st ated. Par ame ters are for d esign guidan ce onl y and

are not t ested.

dsPIC30F4011/4012

FIGURE 24-14: QEA/QEB INPUT CHARACTERISTICS

TQ30

TQ35

TQ31

QEA

(input)

TQ35

QEB

(input)

TQ36

QEB

Internal

TQ40TQ41

TQ30

TQ31

TABLE 24-30: QUADRATURE DECODER TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise sta ted)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Typ(2) Max Units Conditions

TQ30 TQUL Quadrature Input Low Ti me 6 TCY —ns

TQ31 TQUH Quadrature Input High Time 6 TCY —ns

TQ35 TQUIN Quadrature Input Period 12 TCY —ns

TQ36 TQUP Quadrature Phase Period 3 TCY —ns

TQ40 TQUFL Filter Time to Recognize Low,

with Digital Filter 3 * N * TCY — ns N = 1, 2, 4, 16, 32, 64, 128

and 256 (Note 2)

TQ41 TQUFH Filter Time to Recognize High,

with Digital Filter 3 * N * TCY — ns N = 1, 2, 4, 16, 32, 64, 128

and 256 (Note 2)

Note 1: These parameters are characterized but not tested in manufacturing.

2: N = Index Channel Digital Filter Clock Divide Select bits. Refer to Section 16. “Quadrature Encoder

Interface (QEI)” in the “dsPIC30F Family Reference Manual” (DS70046).

dsPIC30F4011/4012

FIGURE 24-15: QEI MODULE INDEX PULSE TIMING CHARACTERISTICS

QEA

(input)

Ungated

Index

QEB

(input)

TQ55

Index Internal

Position Counter

Reset

TQ50

TQ51

TABLE 24-31: QEI INDEX PULSE TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Cond itions: 2.5V to 5.5V

(unless otherwise st ated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Max Units Conditions

TQ50 TqIL Filter Time to Recognize Low,

with Digital Filter 3 * N * TCY — ns N = 1, 2, 4, 16, 32, 64,

128 and 256 (Note 2)

TQ51 TqiH Filter Time to Recognize High,

with Digital Filter 3 * N * TCY — ns N = 1, 2, 4, 16, 32, 64,

128 and 256 (Note 2)

TQ55 Tqidxr Index Pulse Recognized to Position

Counter Reset (ungated index) 3 TCY —ns

Note 1: These parameters are characterized but not tested in manufacturing.

2: Alignment of index pulses to QEA and QEB is shown for position counter Reset timing only. Shown for

forward direction only (QEA leads QEB). Same timing applies for reverse direction (QEA lags QEB) but

index pulse recognition occurs on falling edge.

dsPIC30F4011/4012

FIGURE 24-16: SPI MODULE MASTER MODE (CKE = 0) TIMING CHARACTERISTICS

SCK1

(CKP = 0)

SCK1

(CKP = 1)

SDO1

SDI1

SP11 SP10

SP40 SP41

SP21

SP20

SP35

SP20

SP21

MSb LSb

Bit 14 - - - - - -1

LSb In

Bit 14 - - - -1

SP30

SP31

Note: Refer to Figure 24-2 for load conditions.

MSb In

TABLE 24-32: SPI MASTER MODE (CKE = 0) TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operati ng Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operati ng tem per ature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SP10 TscL SCK1 Output Low Time(3) TCY/2 — — ns

SP11 TscH SCK1 Output High Time(3) TCY/2 — — ns

SP20 TscF SCK1 Output Fall Time(4 — — — ns See p ara mete r DO3 2

SP21 TscR SCK1 Output Rise Time(4) — — — ns See p aram ete r DO3 1

SP30 TdoF SDO1 Data Output Fall Time(4) — — — ns See para mete r DO3 2

SP31 TdoR SDO1 Data Output Rise

Time(4) — — — ns See para m eter DO3 1

SP35 TscH2doV,

TscL2doV SDO1 Data Output Valid after

SCK1 Edge ——30ns

SP40 TdiV2scH,

TdiV2scL Setup Time of SDI1 Data Input

to SCK1 Edge 20 — — ns

SP41 TscH2diL,

TscL2diL Hold Time of SDI1 Data Input

to SCK1 Edge 20 — — ns

Note 1: These parameters are characterized but not tested in manufacturing.

2: Dat a in “Typ” colum n is at 5V, 25°C unless o therwis e st ated. Pa ramete rs are f or desi gn gui dance only and

are not t ested.

3: The minimum clock period for SCK1 is 100 ns. Therefore, the clock generated in Master mode must not

violate this specification.

4: Assumes 50 pF load on all SPI pins.

dsPIC30F4011/4012

FIGURE 24-17: SPI MODULE MASTER MODE (CKE =1) TIMING CHARACTERISTICS

SCK1

(CKP = 0)

SCK1

(CKP = 1)

SDO1

SDI1

SP36

SP30,SP31

SP35

MSb Bit 14 - - - - - -1

LSb In

Bit 14 - - - -1

LSb

Note: Refer to Figure 24-2 for load conditions.

SP11 SP10

SP21

SP20

SP41

SP20

SP21

MSb In

SP40

TABLE 24-33: SPI MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industri al

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SP10 TscL SCK1 Output Low Time(3) TCY/2 — — ns

SP11 TscH SCK1 Output High Time(3) TCY/2 — — ns

SP20 TscF SCK1 Output Fall Time(4) — — — ns See para mete r DO32

SP21 TscR SCK1 Output Rise Time(4) — — — ns See parameter DO31

SP30 TdoF SDO1 Data Output Fall

Time(4) — — — ns See p ara mete r DO32

SP31 TdoR SDO1 Data Output Rise

Time(4) — — — ns See p ara mete r DO31

SP35 TscH2doV,

TscL2doV SDO1 Data Output V alid after

SCK1 Edge — — 30 ns

SP36 TdoV2sc,

TdoV2scL SDO1 Data Output Setup to

First SCK1 Edge 30 — — ns

SP40 TdiV2scH,

TdiV2scL Setup Time of SDI1 Data

Input to SCK1 Edge 20 — — ns

SP41 TscH2diL,

TscL2diL Hold Time of SDI1 Data Input

to SCK1 Edge 20 — — ns

Note 1: These parameters are characterized but not tested in manufacturing.

2: Dat a i n “Typ” column is at 5V, 25°C unless oth erw is e s t at ed. Parameters a re f or design gui dan ce onl y a nd

are not t ested.

3: The minimum clock period for SCK1 is 100 ns. Therefore, the clock generated in Master mode must not

violate this specification.

4: Assumes 50 pF load on all SPI pins.

dsPIC30F4011/4012

FIGURE 24-18: SPI MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS

SS1

SCK1

(CKP =

)

SCK1

(CKP =

)

SDO1

SDI

SP50

SP40

SP41

SP30,SP31 SP51

SP35

SDI1

MSb LSb

Bit 14 - - - - - -1

Bit 14 - - - -1 LSb In

SP52

SP73

SP72

SP73

SP71 SP70

Note: Refer to Figure 24-2 for load conditions.

MSb In

dsPIC30F4011/4012

TABLE 24-34: SPI MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SP70 TscL SCK1 Input Low Time 30 — — ns

SP71 TscH SCK1 Input High Time 30 — — ns

SP72 TscF SCK1 Input Fall Time(3) —1025ns

SP73 TscR SCK1 Input Rise Time(3) —1025ns

SP30 TdoF SDO1 Data Output Fall Time(3) — — — ns See DO32

SP31 T doR SDO1 Data Output Rise Time(3) — — — ns See DO31

SP35 TscH2doV,

TscL2doV SDO1 Data Output Valid after

SCK1 Edge ——30ns

SP40 TdiV2scH,

TdiV2scL Setup Time of SDI1 Data Input

to SCK1 Edge 20 — — ns

SP41 TscH2diL,

TscL2diL Hold Time of SDI1 Data Input

to SCK1 Edge 20 — — ns

SP50 TssL2scH,

TssL2scL SS1↓ to SCK1↑ or SCK1↓ Input 120 — — ns

SP51 TssH2doZ SS1↑ to SDO1 Ou tput

High-Impedance(3) 10 — 50 ns

SP52 TscH2ssH

TscL2ssH SS1 after SCK1 Edge 1.5 TCY + 40 — — ns

Note 1: These parameters are characterized but not tested in manufacturing.

2: Dat a i n “Typ” colu mn is a t 5V, 25°C unles s otherwise st ated. Parameters are fo r design gui dan ce only and

are not t ested.

3: Assumes 50 pF load on all SPI pins.

dsPIC30F4011/4012

FIGURE 24-19: SPI MODULE SLAVE MODE (CKE = 1) TIMING CHARACTERISTICS

SS1

SCK1

(CKP = 0)

SCK1

(CKP = 1)

SDO1

SDI

SP60

SDI1

SP30,SP31

MSb Bit 14 - - - - - -1 LSb

SP51

Bit 14 - - - -1 LSb In

SP35

SP52

SP73

SP72

SP73

SP71 SP70

SP40

SP41

Note: Refer to Figure 24-2 for load conditions.

SP50

MSb In

dsPIC30F4011/4012

TABLE 24-35: SPI MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Ope rati ng temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SP70 TscL SCK1 Input Low Time 30 — — ns

SP71 TscH SCK1 Input High Time 30 — — ns

SP72 TscF SCK1 Input Fall Time(3) —1025ns

SP73 TscR SCK1 Input Rise Time(3) —1025ns

SP30 TdoF SDO1 Data Output Fall Time(3) — — — ns See parameter DO32

SP31 TdoR SDO 1 Data Output Rise Time(3) — — — ns See parameter DO31

SP35 TscH2doV,

TscL2doV SDO1 Data Output Valid after

SCK1 Edge ——30ns

SP40 TdiV2scH,

TdiV2scL Setup Time of SDI1 Data Input

to SCK1 Edge 20 — — ns

SP41 TscH2diL,

TscL2diL Hold Time of SDI1 Data Input

to SCK1 Edge 20 — — ns

SP50 TssL2scH,

TssL2scL SS1↓ to SCK1↓ or SCK1↑ Input 120 — — ns

SP51 TssH2doZ SS1↑ to SDO1 Output

High-Impedance(4) 10 — 50 ns

SP52 TscH2ssH

TscL2ssH SS1↑ after SCK1 Edge 1.5 TCY + 40 — — ns

SP60 TssL2doV SDO1 Data Output Valid after

SS1 Edge ——50ns

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and

are not tested.

3: The minimum clock period for SCK1 is 100 ns. Therefore, the clock generated in Master mode must not

violate this specificat ion.

4: Assumes 50 pF load on all SPI pins.

dsPIC30F4011/4012

FIGURE 24-20 : I2C™ BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE)

FIGURE 24-21 : I2C™ BUS DATA TIMING CHARACTERISTICS (MASTER MODE)

IM34

SCL

SDA

Start

Condition Stop

Condition

IM33

Note: Refer to Figure 24-2 for load conditions.

IM31

IM30

IM11 IM10 IM33

IM11 IM10

IM20

IM26 IM25

IM40 IM40 IM45

IM21

SCL

SDA

Out

Note: Re fer to Figure 24-2 for load conditions.

dsPIC30F4011/4012

TABLE 24-36: I2C™ BUS DATA TIMING REQUIREMENTS (MASTER MODE)

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise st ated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min(1) Max Units Conditions

IM10 TLO:SCL Clo ck Lo w Time 100 kHz mode TCY/2 (BRG + 1) — μs

400 kHz mode TCY/2 (BRG + 1) — μs

1 MHz mode(2) TCY/2 (BRG + 1) — μs

IM11 THI:SCL Clock High Time 100 kHz mode TCY/2 (BRG + 1) — μs

400 kHz mode TCY/2 (BRG + 1) — μs

1 MHz mode(2) TCY/2 (BRG + 1) — μs

IM20 TF:SCL SDA and SCL

Fall Time 100 kHz mode — 300 ns CB is spec ified to b e

from 10 to 400 pF

400 kHz mode 20 + 0.1 CB300 ns

1 MHz mode(2) — 100 ns

IM21 TR:SCL SDA and SCL

Rise Time 100 kHz mode — 1000 ns CB is specif ied to be

from 10 to 400 pF

400 kHz mode 20 + 0.1 CB300 ns

1 MHz mode(2) — 300 ns

IM25 TSU:DAT Data Input

Setup Time 100 kHz mode 250 — ns

400 kHz mode 100 — ns

1 MHz mode(2) TBD — ns

IM26 THD:DAT Data Input

Hold Time 100 kHz mode 0 — ns

400 kHz mode 0 0.9 μs

1 MHz mode(2) TBD — ns

IM30 TSU:STA Start Condition

Setup Time 100 kHz mode TCY/2 (BRG + 1) — μs Only relevant for

Repeated Start

condition

400 kHz mode TCY/2 (BRG + 1) — μs

1 MHz mode(2) TCY/2 (BRG + 1) — μs

IM31 THD:STA Start Co nd itio n

Hold Time 100 kHz mode TCY/2 (BRG + 1) — μs After this period, the

first clock pulse is

generated

400 kHz mode TCY/2 (BRG + 1) — μs

1 MHz mode(2) TCY/2 (BRG + 1) — μs

IM33 TSU:STO Stop Cond iti on

Setup Time 100 kHz mode TCY/2 (BRG + 1) — μs

400 kHz mode TCY/2 (BRG + 1) — μs

1 MHz mode(2) TCY/2 (BRG + 1) — μs

IM34 THD:STO Stop Conditi on 100 kHz mode TCY/2 (BRG + 1) — ns

Hold Time 400 kHz mode TCY/2 (BRG + 1) — ns

1 MHz mode(2) TCY/2 (BRG + 1) — ns

IM40 TAA:SCL Output Valid

From Clock 100 kHz mode — 3500 ns

400 kHz mode — 1000 ns

1 MHz mode(2) ——ns

IM45 TBF:SDA Bus Free Time 100 kHz mode 4.7 — μs Time the bus must be

free before a new

transmission can start

400 kHz mode 1.3 — μs

1 MHz mode(2) TBD — μs

IM50 CBBus Capacitive Loading — 400 pF

Legend: TBD = To Be Determined

Note 1: BRG is th e value of the I2C Bau d Rate Generato r. Refer to Section 21 . “Int er-Inte grate d Circ uit (I2C™)”

in the “dsPIC30F Family Reference Manual” (DS70046).

2: Maximum pin capacitance = 10 pF for all I2C pins (for 1 MHz mode only).

dsPIC30F4011/4012

FIGURE 24-22 : I2C™ BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE)

FIGURE 24-23 : I2C™ BUS DATA TIMING CHARACTERISTICS (SLAVE MODE)

SCL

SDA

Start

Condition Stop

Condition

IS31

IS30

IS34

IS33

IS30 IS31 IS33

IS11

IS10

IS20

IS26 IS25

IS40 IS40 IS45

IS21

SCL

SDA

Out

dsPIC30F4011/4012

TABLE 24-37: I2C™ BUS DATA TIMING REQUIREMENTS (SLAVE MODE)

AC CHARACTERISTICS

Standard Operating Cond itions: 2.5V to 5.5V (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Max Units Conditions

IS10 TLO:SCL Clock Low Time 100 kHz mode 4.7 — μs Device must operate at a

minimum of 1.5 MHz

400 kHz mode 1.3 — μs Device must operate at a

minimum of 10 MHz.

1 MHz mode(1) 0.5 — μs

IS11 THI:SCL Clock High Time 100 kHz mode 4.0 — μs Device must operate at a

minimum of 1.5 MHz

400 kHz mode 0.6 — μs Device must operate at a

minimum of 10 MHz

1 MHz mode(1) 0.5 — μs

IS20 TF:SCL SDA and SCL

Fall Time 100 kHz mode — 300 ns CB is specified to be from

10 to 400 pF

400 kHz mode 20 + 0.1 CB300 ns

1 MHz mode(1) — 100 ns

IS21 TR:SCL SDA and SCL

Rise Time 100 kHz mode — 1000 ns CB is specified to be from

10 to 400 pF

400 kHz mode 20 + 0.1 CB300 ns

1 MHz mode(1) — 300 ns

IS25 TSU:DAT Data Input

Setup Time 100 kHz mode 250 — ns

400 kHz mode 100 — ns

1 MHz mode(1) 100 — ns

IS26 THD:DAT Data Input

Hold Time 100 kHz mode 0 — ns

400 kHz mode 0 0.9 μs

1 MHz mode(1) 00.3μs

IS30 TSU:STA Start Condition

Setup Time 100 kHz mode 4.7 — μs Only releva nt for Re peated

Start condition

400 kHz mode 0.6 — μs

1 MHz mode(1) 0.25 — μs

IS31 THD:STA Start Condition

Hold Time 100 kHz mode 4.0 — μs After this period, the first

clock pulse is generated

400 kHz mode 0.6 — μs

1 MHz mode(1) 0.25 — μs

IS33 TSU:STO Stop Condition

Setup Time 100 kHz mode 4.7 — μs

400 kHz mode 0.6 — μs

1 MHz mode(1) 0.6 — μs

IS34 THD:STO Stop Condition 100 kHz mode 4000 — ns

Hold Time 400 kHz mode 600 — ns

1 MHz mode(1) 250 ns

IS40 TAA:SCL Output Valid

From Clock 100 kHz mode 0 3500 ns

400 kHz mode 0 1000 ns

1 MHz mode(1) 0 350 ns

IS45 TBF:SDA Bus Free Time 100 kHz mode 4.7 — μs Time the bus must be free

before a new transmission

can start

400 kHz mode 1.3 — μs

1 MHz mode(1) 0.5 — μs

IS50 CBBus Capacitive Loadi ng — 400 pF

Note 1: Maximum pin capacitance = 10 pF for all I2C pins (for 1 MHz mode only).

dsPIC30F4011/4012

FIGURE 24-24: CAN MODULE I/O TIMING CHARACTERISTICS

C1TX Pin

(output)

CA10 CA11

Old V alue New Value

CA20

C1RX Pin

(input)

TABLE 24-38: CAN MODULE I/O TIMING REQUIREMENT S

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise sta ted)

Operating temperature -40°C

≤

+85°C for Industrial

-40

≤

+125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

CA10 TioF Port Output Fall Time — — — ns See parameter DO32

CA11 TioR Port Output Rise Time — — — ns See parameter DO31

CA20 Tcwf Pulse Width to Trigger

CAN Wake-up Filter 500 ns

Note 1: These parameters are characterized but not tested in manufacturing.

2: Dat a in “Ty p” column is at 5V, 25°C unl ess othe rwise st ated . Paramete rs are for desi gn guida nce onl y and

are not t ested.

dsPIC30F4011/4012

TABLE 24-39: 10-BIT HIGH-SPEED A/D MODULE SPECIFICATIONS

AC CHARACTERISTICS

Standard Operati ng Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operati ng tem pe rature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min. Typ Max. Units Conditions

Device Supply

AD01 AVDD Module VDD Supply Greater of

VDD – 0.3

or 2.7

— Lesser of

VDD + 0.3

or 5.5

AD02 AVSS Module VSS Supply VSS – 0.3 — VSS + 0.3 V

Reference Inputs

AD05 VREFH Refer ence Voltage High AVSS + 2.7 — AVDD V

AD06 VREFL Refer ence Voltage Low AVSS —AVDD – 2 .7 V

AD07 VREF Absol ute Referenc e Voltage AVSS – 0.3 — AVDD + 0.3 V

AD08 IREF Current Dr ain — 200

.001 300

3μA

μAA/D operating

A/D off

Analog Input

AD10 VINH-VINL Full-Scale Input Span VREFL —VREFH V

AD11 VIN Absolute Input Vo ltage AVSS – 0.3 — AVDD + 0.3 V

AD12 — Leakage Current — ±0.001 ±0.244 μAVINL = AVSS = VREFL = 0V,

AVDD = VREFH = 5V,

Source Impedance = 5 kΩ

AD13 — Leakage Current — ±0.001 ±0.244 μAV

INL = AVSS = VREFL = 0V,

AVDD = VREFH = 3V,

Source Impedance = 5 kΩ

AD17 RIN Recom m end ed Imp eda nc e

of Analog Voltage Source ——5KΩ

DC Accuracy

AD20 Nr Resolution 10 data bits bits

AD21 INL Integral Nonlinearity(3) —±1±1LSbVINL = AVSS = VREFL = 0V,

AVDD = VREFH = 5V

AD21A INL Integral Nonlinearity(3) —±1±1LSbVINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3V

AD22 DNL Differential Nonlinearity(3) —±1±1LSbVINL = AVSS = VREFL = 0V,

AVDD = VREFH = 5V

AD22A DNL Differential Nonlinearity(3) —±1±1LSbVINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3V

AD23 GERR Gain Error(3) ±1 ±5 ±6 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 5V

AD23A GERR Gain Error(3) ±1 ±5 ±6 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3V

AD24 EOFF Offset Error ±1 ±2 ±3 LS b VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 5V

AD24A EOFF Offset Error ±1 ±2 ±3 LSb VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3V

AD25 — Monotonicity(2) — — — — Guaranteed

Note 1: Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity

performance, especially at elevated temperatures.

2: The A/D conversion result never decreas es w ith an increa se in the inpu t volt age and has no missing codes.

3: Measurements taken with external VREF+ and VREF- used as the ADC voltage references.

dsPIC30F4011/4012

Dynamic Performance

AD30 THD Total Harmonic Distortion — -64 -67 dB

AD31 SINAD Signal to Noise and

Distortion —5758dB

AD32 SFDR Spurious Free Dynamic

Range —6771dB

AD33 FNYQ Input Signal Bandwidth — — 500 kHz

AD34 ENOB Effective Number of Bits 9.29 9.41 — b its

TABLE 24-39: 10-BIT HIGH-SPEED A/D MODULE SPECIFICATIONS (CONTINUED)

AC CHARACTERISTICS

Standard Operati ng Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operati ng tem pe rature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min. Typ Max. Units Conditions

Note 1: Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity

performance, especially at elevated temperatures.

2: The A/D conversion result never decreas es with an inc rease in the input voltage and has no missing codes.

3: Measurements taken with external VREF+ and VREF- used as the ADC voltage references.

dsPIC30F4011/4012

FIGURE 24-25: 10-BIT HIGH-SPEED A/D CONVERSION TIMING CHARACTERISTICS

(CHPS<1:0> = 01, SIMSAM = 0, ASAM = 0, SSRC<2:0> = 000)

TSAMP

Set SAMP

AD61

ADCLK

Instruction

SAMP

ch0_dischrg

ch1_samp

AD60

DONE

ADIF

ADRES(0)

ADRES(1)

1 2 3 4 5 6 9 5 6 8

1- Software sets ADCONx. SAMP to start sampling.

2- Sampling starts after discharge period.

3- Software clears ADCONx. SAMP to start conversion.

4- Sampling ends, conversion sequence starts.

5- Convert bit 9.

9- One TAD for end of conversion.

AD50

ch0_samp

ch1_dischrg

eoc

8 9

6- Convert bit 8.

8- Convert bit 0.

Execution

TSAMP is described in Secti on 17. 10-Bit A/D Converter” in the “dsPIC30F Family Reference Manual” (DS70046).

Clear SAMP

AD55 AD55

dsPIC30F4011/4012

FIGURE 24-26: 10-BIT HIGH-SPEED A/D CONVERSION TIMING CHARACTERISTICS

(CHPS<1:0> = 01, SIMSAM = 0, ASAM = 1, SSRC<2:0> = 111, SAMC<4:0> = 00001)

AD55

TSAMP

Set ADON

ADCLK

Instruction

SAMP

ch0_dischrg

ch1_samp

DONE

ADIF

ADRES(0)

ADRES(1)

1 2 3 4 5 6 4 5 6 8

1- Software sets ADCONx. ADON to start AD operation.

2- Sampling starts after discharge period.

3- Convert bit 9.

4- Convert bit 8.

5- Convert bit 0.

AD50

ch0_samp

ch1_dischrg

eoc

7 3

AD55

6- One TAD for end of conversion.

7- Begin conversion of next channel

8- Sample for time specified by SAMC<4:0>.

TSAMP

3 4

Execution

TSAMP is described in Section 17. 10-Bit A/D Converter”

in the “dsPIC30F Family Reference Manual” (DS70046).

TCONV

dsPIC30F4011/4012

TABLE 24-40: 10-BIT HIGH-SPEED A/D CONVERSION TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Cond itions: 2.5V to 5.5V

(unless otherwise st ated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min. Typ Max. Units Conditions

Clock Parameters

AD50 TAD A/D Clock Period — 84 — ns See Table 20-2(1)

AD51 tRC A/D Internal RC Oscillator Period 700 900 1100 ns

Conversion Rate

AD55 tCONV Conversion Time — 12 TAD —— —

AD56 FCNV Throughput Rate — 1.0 — Msps See Table 20-2(1)

AD57 TSAMP Sample Time — 1 TAD — — See Table 20-2(1)

Timing Parameters

AD60 tPCS Conversion Start from Sample

Trigger —1.0 TAD ——

AD61 tPSS Sample Start from Setting

Sample (SAMP) Bit 0.5 TAD — 1.5 TAD —

AD62 tCSS Conversion Completion to

Sample Start (ASAM = 1)—0.5 TAD ——

AD63 tDPU Time to Stabilize Analog Stage

from A/D Off to A/D On —20—μs

Note 1: Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity

performance, especially at elevated temperatures.

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

25.0 PACKAGING INFORMATION

25.1 Package Marking Information

28-Lead PDIP (Skinny DIP)

XXXXXXXXXXXXXXXXX

YYWWNNN

Example

dsPIC30F4012-

0710017

28-Lead SOIC

XXXXXXXXXXXXXXXXXXXX

YYWWNNN

Example

dsPIC30F4012-

0710017

30I/SP

30I/SO

Example

dsPIC30F4011-

0710017

40-Lead PDIP

XXXXXXXXXXXXXXXXXX

YYWWNNN

30I/P

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week co de (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Pb-free JEDEC designator for Matte Ti n (Sn)

*This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the fu ll Mic rochip part n umber cann ot be mark ed on one line, it wil l

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

dsPIC30F4011/4012

Package Marking Information (Continued)

44-Lead TQFP

XXXXXXXXXX

YYWWNNN

Example

dsPIC30F

0710017

4011-30I/

XXXXXXXXXX

44-Lead QFN

XXXXXXXXXX

YYWWNNN

dsPIC30F

Example

0710017

4012-30I/

dsPIC30F4011/4012

25.2 Package Details

28-Lead Skinny Plastic Dual In-Li ne (SP) – 300 mil Body [SPDIP]

otes:

. Pin 1 visual index feature may vary, but must be located within the hatched area.

. § Significant Characteristic.

. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.

. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units INCHES

Dimension Limits MIN NOM MAX

Number of Pins N 28

Pitch e .100 BSC

Top to Seating Plane A – – .200

Molded Package Thickness A2 .120 .135 .150

Base to Seating Plane A1 .015 – –

Shoulder to Shoulder Width E .290 .310 .335

Molded Package Width E1 .240 .285 .295

Overall Length D 1.345 1.365 1.400

Tip to Seating Plane L .110 .130 .150

Lead Thickness c .008 .010 .015

Upper Lead Width b1 .040 .050 .070

Lower Lead Width b .014 .018 .022

Overall Row Spacing § eB – – . 430

NOTE 1

Microchip Technology Drawing C04-070

dsPIC30F4011/4012

28-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]

otes:

. Pin 1 visual index feature may vary, but must be located within the hatched area.

. § Significant Characteristic.

. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units MILLMETERS

Dimension Limits MIN NOM MAX

Number of Pins N 28

Pitch e 1.27 BSC

Overall Height A – – 2.65

Molded Package Thickness A2 2.05 – –

Standoff § A1 0.10 – 0.30

Overall Width E 10.30 BSC

Molded Package Width E1 7.50 BSC

Overall Length D 17.90 BSC

Chamfer (optional) h 0.25 – 0.75

Foot Length L 0.40 – 1.27

Footprint L1 1.40 REF

Foot Angle Top φ0° – 8°

Lead Thickness c 0.18 – 0.33

Lead Width b 0.31 – 0.51

Mold Draft Angle Top α5° – 15°

Mold Draft Angle Bottom β5° – 15°

NOTE 1

123

Microchip Technology Drawing C04-052

dsPIC30F4011/4012

40-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP]

otes:

. Pin 1 visual index feature may vary, but must be located within the hatched area.

. § Significant Characteristic.

. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.

. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units INCHES

Dimension Limits MIN NOM MAX

Number of Pins N 40

Pitch e .100 BSC

Top to Seating Plane A – – .250

Molded Package Thickness A2 .125 – .195

Base to Seating Plane A1 .015 – –

Shoulder to Shoulder Width E .590 – .625

Molded Package Width E1 .485 – .580

Overall Length D 1.980 – 2.095

Tip to Seating Plane L .115 – .200

Lead Thickness c .008 – . 015

Upper Lead Width b1 .030 – .070

Lower Lead Width b .014 – .023

Overall Row Spacing § eB – – .700

NOTE 1

123

A1 b1

Microchip Technology Drawing C04-016

dsPIC30F4011/4012

44-Lead Plastic Quad Flat, No Lead Package (ML) – 8x8 mm Body [QFN]

otes:

. Pin 1 visual index feature may vary, but must be located within the hatched area.

. Package is saw singulated.

. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units MILLIMETERS

Dimension Limits MIN NOM MAX

Number of Pins N 44

Pitch e 0.65 BSC

Overall Height A 0.80 0.90 1.00

Standoff A1 0.00 0.02 0.05

Contact Thickness A3 0.20 REF

Overall Width E 8.00 BSC

Exposed Pad Width E2 6.30 6.45 6. 80

Overall Length D 8.00 BSC

Exposed Pad Length D2 6.30 6 .45 6.80

Contact Width b 0.25 0.30 0.38

Contact Length L 0.30 0.40 0.50

Contact-to-Exposed Pad K 0.20 – –

DEXPOSED

PAD

NOTE 1

BOTTOM VIEW

TOP VIEW

A3A1

Microchip Technology Drawing C04-103

dsPIC30F4011/4012

44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]

otes:

. Pin 1 visual index feature may vary, but must be located within the hatched area.

. Chamfers at corners are optional; size may vary.

. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.

. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for inform ation purposes only.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units MILLIMETERS

Dimension Limits MIN NOM MAX

Number of Leads N 44

Lead Pitch e 0.80 BSC

Overall Height A – – 1.20

Molded Package Thickness A2 0.95 1.00 1.05

Standoff A1 0.05 – 0.15

Foot Length L 0.45 0.60 0.75

Footprint L1 1.00 REF

Foot Angle φ0° 3.5° 7°

Overall Width E 12.00 BSC

Overall Length D 12.00 BSC

Molded Package Width E1 10.00 BSC

Molded Package Length D1 10.00 BSC

Lead Thickness c 0.09 – 0.20

Lead Width b 0.30 0.37 0.45

Mold Draft Angle Top α11° 12° 13°

Mold Draft Angle Bottom β11° 12° 13°

NOTE 1 NOTE 2

123

Microchip Technology Drawing C04-076

dsPIC30F4011/4012

NOTES:

© 2007 Microchip Technology Inc. DS70135E-page 221
dsPIC30F4011/4012
APPENDIX A: REVISION HISTORY
Revision D (August 2006)
Previous versions of this data sheet contained
Advance or Preliminary Information. They were
distributed with incomplete characterization data.
This revision reflects these changes:
• Revised I2C Slave Addresses 
(see Table 17-1)
• Updated Section 20.0 “10- bit, High-Spe ed 
Analog -to-Digi tal Con verter (ADC) Modu le” to 
more fully describe configuration guidelines
• Base Instruction  CP1 removed from instruction 
set (see Table 22-2)
• Revised Electrical Characteristics:
- Operating Current (IDD) Specifications 
(seeTable 24-5 )
- Idle Current (IIDLE) Specifications
(see Table 24-6)
- Power-Down Current (IPD) Specifications
(see Table 24-7)
- I/O Pin Input Specifications 
(see Table 24-8)
- BOR Voltage Limits 
(see Table 24-11)
- Watchdog Timer Time-out Limits 
(see Table 24-21)
Revision E (January 2007)
- This revision includes updates to the 
packaging diagrams.

dsPIC30F4011/4012

NOTES:

© 2007 Microchip Technology Inc. DS70135E-page 223
dsPIC30F4011/4012
INDEX
A
AC Characteristics ............................................................179
Load Conditions...................... ....... .. .. .. .. .. .. ....... .. .. .. ..179
Temperature and Voltage Specifications..................179
ADC1 Msps Con fig uration Guideline....... ............... ..........138
600 ksps Configuration Guideline.............................139
750 ksps Configuration Guideline.............................139
Aborti n g  a  Conver sion ......................... .....................136
Acquisition Requirements ..... .. ......... .... .... .... ....... .... ..140
ADCHS .....................................................................133
ADCON1...................................................................133
ADCON2...................................................................133
ADCON3...................................................................133
ADCSSL....................................................................133
ADPCFG...................................................................133
Configuring Analog Port Pins....................................142
Connection Considerations................................... .. ..142
Conversi o n  Op eration..... ..................... .....................135
Conversi o n  Ra te Parameters....... ..................... ........137
Conversion Speeds........................ .... .. .... .. .. ....... .... ..137
Effects of a Reset......................................................141
Operation During CPU Idle Mode.............................141
Operation During CPU Sleep Mode..........................141
Output Fo rmats....... .............. ............................ ........141
Power-Down Modes ..................................................141
Programming the Start of Conversion Trigger..........136
Register Map..................... ..................... ...................143
Result Buffer.... ............................ ..................... ........135
Selec t i n g  th e  C o n ve r sion C l o ck.... .. ...... ...... ..... ...... .. .1 3 6
Selecting the Conversion Sequence.........................135
Voltage Reference Schematic ............................ .. ....138
Address Generator Units ....................................................33
Alternate 16-bit Timer/Counter............................................87
Alternate Interrupt Vector Table..........................................43
Assembler
MPASM Assembler...................................................168
B
Barrel Shifter.......................................................................20
Bit-Reversed Addre ssing................................... .................36
Example......................................................................36
Implementation ...........................................................36
Modifier Values (t a b l e ).. .................................. ............37
Sequence Table (16-Entry)....................................... ..37
Block Diagrams
10-Bit, High-Speed ADC...........................................134
16-bit Timer1 Module..................................................64
16-bit Timer4...............................................................74
16-bit Timer5...............................................................75
32-bit Timer4/5 ............................................................73
ADC Analog Input Model ..........................................140
CAN Buffers and Protocol Engine.............................124
Dedicate d  Po rt Structu re.............................. ...............57
DSP Engine....... .................................. .......................17
dsPIC30F4011..............................................................7
dsPIC30F4012..............................................................8
External Power-on Reset Circuit...............................153
I2C.............................................................................108
Input Capture Mode.............. ....... .. .... .. .. .... .. ....... .. .. ....77
Oscillator System......................................................147
Output Co mpa re Mode .......................... .....................81
PWM Module ........................ ........... .... .... .... ........... ....92
Quadrature Encoder Interface......... .... ............. ...... .... 85
Reset System....... ........................... ......................... 151
Shared Po rt Structure........ ................................. ........ 58
SPI............................................................................ 104
SPI Master/Slave Connection . .................................. 104
UART Receiver ......................................................... 116
UART Transmitter..................................................... 115
BOR. See Brown-out Reset.
Brown-out Reset
Characteristics.......................................................... 177
C
C Compilers
MPLAB C18........ ........................... ..................... ...... 168
MPLAB C30........ ........................... ..................... ...... 168
CAN Module ......................... .. ....... .... .. .... .. ....... .... .. .... .. .... 123
Baud Rate Setting .................................................... 128
CAN1 Registe r  Map.... ............... ..................... .......... 130
Frame Types ............................................................ 123
Message Reception.................................................. 126
Message Transmission............................................. 127
Modes of Ope ration...... ..................... ..................... .. 125
Overview................................................................... 123
Center-Aligned PWM.......................................................... 95
Code Examples
Data EEPRO M Block Erase............ ..................... ...... 52
Data EEPRO M Block Write.................... .................... 54
Data EEPRO M Read...... ..................... ..................... .. 51
Data EEP RO M Word Er a se ........................... ............ 52
Data EEPRO M Word Write ....... ........................... ...... 53
Erasing a Row of Program Memory ........................... 47
Initiating a Programming Sequence ................. .... .. .. .. 48
Loading Write Latches............. .. .. .... .. .. ..... .. .... .. .. .. .. .. .. 48
Port Write/Read.......................................................... 58
Code Protection................................................................ 145
Complementary PWM Operation........................................ 96
Config u ring Analog Port Pins................... ..................... ...... 58
Core Overview.................................................................... 13
Core Register Map.............................................................. 30
Customer Change Notification Service............................. 228
Custome r Notification Ser vice ................... ............... ........ 228
Customer Support............................ ...... .... ........... .... .... .... 228
D
Data Access from Program Memory 
Using Program Space Visibility .................................. 24
Data Accumulators and Adder/Subtracter.......................... 18
Data Space Write Saturation...................................... 20
Overflow and Saturation......................................... .... 18
Round Logic ............................................................... 19
Write-Back.................................................................. 19
Data Addre ss Space.................... ..................... .................. 25
Alignment.................................................................... 28
Alignment (Figure)...................................................... 28
Data Space s......... ..................... ........................... ...... 28
Effect of Invalid Memory Accesses............................. 28
MCU and DSP (MAC Class) 
Instructions Exampl e..... ..................... ................ 27
Memory Map ............................................................... 26
Near Data Space........................................................ 29
Softwar e  Stack ..... .................................. .................... 29
Width .......................................................................... 28

dsPIC30F4011/4012
DS70135E-page 224 © 2007 Microchip Technology Inc.
Data EEPROM Memory......................................................51
Erasing........................................................................52
Erasing, Block.............................................................52
Erasing, Word.............................................................52
Protection Agains t S pur io u s Write .. ............................55
Reading.......................................................................51
Write Verify .................................................................55
Writing.........................................................................53
Writing , Block............. ............................ .....................54
Writing , Wo rd ... ..................... ..................... .................53
DC Characteristics............................................................171
BOR..........................................................................178
I/O Pin Input Specifications.......................................176
I/O Pin Output Specifications....................................177
Idle Current (IIDLE) ....................................................174
Operating Current (IDD).............................................173
Power-Down Current (IPD)........................................175
Program and EEPROM.............................................178
DC Temperature and Voltage Specifications....................172
Dead-Time Generators .......................................................96
Ranges........................................................................97
Development Support .......................................................167
Device Configuration
Register Map........................... ..................... .............158
Device Configuration Registers .........................................156
FBORPOR ................................................................156
FGS...........................................................................156
FOSC........................................................................156
FWDT........................................................................156
Divide Support................ .... ....... .... .. .. .... .. ....... .... .. .... .. ....... ..16
DSP Engine. .................................. ........................... ...........16
Multiplier......................................................................18
dsPIC30F4011 Port Register Map..................... .... .... .........59
dsPIC30F4012 Port Register Map..................... .... .... .........60
Dual Output Compare Match Mode ........ ............... .............82
Continuous Output Pulse Mode............. .. .... .. .... .. .......82
Single  Ou tp u t Pulse Mode..................... .....................82
E
Edge-Aligned PWM........ .... ....... .. .... .... .. ....... .... .... .. .... .. .......95
Electrical Characteristics...................................................171
Equations
A/D Convers i o n  Clock............... ............... .................136
Baud Rate.................................................................119
I2CBRG Value .............................. ..................... .......112
PWM Period.............................. ..................................94
PWM Period (Center-Aligned Mode) ..........................94
PWM Resolut i on.... ..................... ..................... ...........94
Time Quantum for Clock Generation ..... .. .... .... .... .....129
Errata ....................................................................................6
External Interrupt Requests ................................................43
F
Fast Context Saving............................................................43
Flash Pr o g ram Memory................................ .......................45
In-Circuit Serial Programming (ICSP).........................45
Run-Time Self-Programming (RTSP) .........................45
Table Instruction Operation Summary........................45
I
I/O Por ts
Paral l e l  I/O (PIO)......................... ............................ ....57
I2C Module
10-bit Slave Mode Operation ........ .. ....... .... .. .... .. .......109
Reception..........................................................110
Transmission.....................................................110
7-bit Slave Mode Operation.............................. .... .. .. 109
Reception ......................................................... 109
Transmission.................................................... 109
Addresses................................................................. 109
Automatic Clock Stretch ........................................... 110
During 10-bit Addressing (STREN = 1) ............ 110
During 7-bit Addressing (STREN  = 1) .............. 110
Reception ......................................................... 110
Transmission.................................................... 110
General Call Address Support.. ................................ 111
Interrupts .................................................................. 111
IPMI Support............................................................. 111
Master Operation...................................................... 111
Baud Rate Generator (BRG) ............................ 112
Clock Operation................................................ 112
Multi-Master Communication, Bus 
Collision and Arbitration............................ 112
Reception ......................................................... 112
Transmission.................................................... 111
Master Support......................................................... 111
Operating Function Description................................ 107
Operation During CPU Sleep and 
Idle Modes........................................................ 112
Pin Configuration...................................................... 107
Programm er’s Model ................................................ 107
Register Map ... ............................ ..................... ........ 11 3
Registers .................................................................. 107
Slope Control............................................................ 111
Software Controlled Clock Stretching 
(STREN = 1)............................ ..................... .... 110
Various Modes...................... .. ....... .... .. .. .... .. ....... .... .. 107
In-Circuit Serial Programming (ICSP)............................... 145
Independent PWM Output.................................................. 98
Initialization Condition for RCON Register, Case 2.......... 154
Initialization Condition for RCON Register, Case 1.......... 154
Input Capture Module......................................................... 77
In CPU Idle Mode....... ............... .............. ................... 79
In CPU Slee p Mode............ ............................ ............ 78
Interrupts .................................................................... 79
Register Map ... ............................ ..................... .......... 80
Simple Capture Event Mode ....................................... 78
Input Change Notification Module....................................... 61
Register Map (bits 7-0)............................................... 61
Input Diagrams
QEA/QEB Input ...................... ..... .. .. .... .. .. .. .. ....... .. .. .. 194
Instruction Addressing Modes ............................................ 33
File Register Instructions............................................ 33
Fundamental Modes Supported .................. ....... .... .. .. 33
MAC Instru ctions .. ..................... ..................... ............ 34
MCU Instru ctions................................... ..................... 33
Move and Accumulator Instructions ............................ 34
Other Ins tructio n s....... ........................... ..................... 34
Instruction Set Overview................................................... 162
Instruction Set Summary .................................................. 159
Internal Clock Timing Examples....................................... 182
Inter n e t Ad d ress ................................ ........................... .... 228
Interrupt Controller
Register Map ... ............................ ..................... .......... 44
Interrupt Priority.................................................................. 40
Interrupt Sequence .............................................................43
Interrupt Stack Frame.................................................43

© 2007 Microchip Technology Inc. DS70135E-page 225
dsPIC30F4011/4012
M
Microc h i p  In ternet Web Site......................... .....................228
Modulo Addressing .............................................................34
Applicability.................................................................36
Operation Example.....................................................35
Start and End Address................................................35
W Addres s Reg ister Selection................. ...................35
Motor Control PWM Module. ...............................................91
Register Map..................... ..................... ...................101
MPLAB ASM30 Assembler, Linker, Librarian ...................168
MPLAB ICD 2 In-Circuit Debugger ...................................169
MPLAB ICE 2000 High-Perform ance 
Universal In-Circuit Emulator....................................169
MPLAB ICE 4000 High-Perform ance 
Universal In-Circuit Emulator....................................169
MPLAB Integrated Development 
Environ ment Software........................ .......................167
MPLAB PM3 Device Programmer ....................................169
MPLINK Object Linker/MPLIB Object Libraria n................168
O
Operating MIPS vs. Voltage..............................................171
Oscillator
Configurations...........................................................148
Fail-Safe Clock Monitor ....................................150
Fast RC (FRC)..................................................149
Init ial Cl o c k So u rce  Se l e ctio n ... ...... ...... ......... ...14 8
Low-Power RC (LPRC) .....................................149
LP .....................................................................149
Phase Locked Loop (PLL) ................. .. ......... .. ..149
Start- u p  Timer (OST)..................... ...................14 8
Operating Modes (Table)..........................................146
Oscillator Selection ...........................................................145
Output Compare Module.............................. .. .. .... ....... .. .... ..81
During CPU Idle Mode................................................83
During CPU Sleep Mode.............................................83
Interrupts.....................................................................83
Register Map..................... ..................... .....................84
P
Packaging .........................................................................213
Details.......................................................................215
Marking.....................................................................213
PICSTART Plus Development Programmer.....................170
Pinout Descriptions
dsPIC30F4011..............................................................9
dsPIC30F4012............................................................11
POR. See Power-on Reset.
Positio n  Mea surement Mode............. ........................... ......87
Power-Saving Modes........................................................155
Idle............................................................................156
Sleep.........................................................................155
Power-Saving Modes (Sleep and Idle) .............................145
Program Address Space.....................................................21
Construction................................................................22
Data Access From Program Memory 
Using Table Instructions.....................................23
Data Access From, Address Generation ....................22
Memory Map...............................................................21
Table Instructions
TBLRDH .............................................................23
TBLRDL..............................................................23
TBLWTH.............................................................23
TBLWTL..............................................................23
Program Counter................................................................ 14
Program Data Table Access  (lsw)... ..................... .............. 23
Program Data Table Access  (M SB )....... ..................... ........ 24
Program Space Visibility
Window into Program Space Operation ........... .. .. .... .. 25
Programmable Digital Noise Filters.................................... 87
Programm er’s Model .......................................................... 14
Diagram...................................................................... 15
Programming Operations...... ..................... ..................... .... 47
Algor ith m for Program Flas h.... ........................... ........ 47
Erasing a Row of Program Memory ........................... 47
Initiating the Programming Sequence ........................ 48
Loading Write Latches............. .. .. .... .. .. ..... .. .... .. .. .. .. .. .. 48
Protection Against Accidental Writes to OSCCON........... 150
PWM Duty Cycle Comparison Units................................... 96
Duty Cycle Register Buffers .............. ..................... .... 96
PWM Fault  Pin........ ..................... ........................... ............ 99
Enable Bits .. ............................................................... 99
Fault States ................................................................ 99
Input Modes................................................................ 99
Cycle-by-Cycle ................................................... 99
Latched............................................................... 99
PWM Operation  During CPU Idle Mode.. ............... .......... 100
PWM Operation During CPU Sleep Mode........................ 100
PWM Output and Polarity Control..................................... .. 99
Output Pin  Co n trol........................... ........................... 99
PWM Output  Override.................................... .................... 98
Complementary Output Mode .................................... 98
Synchronization.......................................................... 98
PWM Period .......................... ............................ .................. 94
PWM Special Event Trigger........................................ .... .. 100
Postscaler................................................................. 100
PWM Time Base............. ..................... ........................... .... 93
Continuous Up/Down Count Modes ......... .... .. .. .. .. .... .. 93
Double Update Mode................................ .. .. .... .. .. .. .... 94
Free-Running Mode .................................................... 93
Postscaler................................................................... 94
Prescaler .................................................................... 94
Single-Shot Mode....................................................... 93
PWM Update Lockout.............................. .... ......... .... .... .... 100
Q
QEI Module
Operation During CPU Sleep Mode ........................... 87
Timer Operation During CPU Sleep Mode ................. 87
Quadrature Encoder Interface (QEI)................................... 85
Interrupts .................................................................... 88
Logic........................................................................... 86
Operation During CPU Idle Mode............................... 88
Register Map.............. ............................ .................... 89
Tim e r Oper a ti o n  D u ri n g  CPU Id l e  Mo d e.. .. ...... ...... ..... 88
R
Reader Response............................................................. 229
Reset ........................................................................ 145, 151
BOR, Programmable........... ........................... .......... 153
Oscillato r Start-up Timer (OST)......... ......... ........ ...... 145
POR.......................................................................... 151
Long Crystal Start-up Time............................... 153
Operating Without FSCM and PWRT............... 153
Power-on Reset (POR)............................................. 145
Power-up Timer (PWRT).......................................... 145
Programmable Brown -out Reset (BOR)................... 145
Reset Sequence.......................................... ....... .... .... .. .... .. 41
Reset Sources........................... ........................... ...... 41

dsPIC30F4011/4012
DS70135E-page 226 © 2007 Microchip Technology Inc.
Revision History................................................................221
RTSP
Control Reg i sters ....... ..................... ............... .............46
NVMADR ............................................................46
NVMADRU..........................................................46
NVMCON............................................................46
NVMKEY.............................................................46
Operation ....................................................................46
S
Simple Capture Event Mode
Capture Bu ffer Operat io n................... .........................78
Capture Prescaler......................... ..............................78
Hall Sensor  Mode ......................... ............... ...............78
Timer2 and Timer3 Selection Mode................... .. .......78
Simple Output Compare Match Mode.................................82
Simple PWM Mode .............................................................82
Input Pin Fault Protection......................... .. .. .... .. ....... ..82
Period..........................................................................83
Single Pulse PWM Operation..............................................98
Softwa re Simulator (MP L AB SIM).......................... ...........168
Softwa re Stack Pointe r, Frame Pointer.................... ...........14
CALL Stack Frame......................................................29
SPI Module ...... ..................................................................103
Framed SPI Support .................................................103
Operating Function Description ................................103
Operation During CPU Idle Mode.............................105
Operation During CPU Sleep Mode..........................105
Register Map........................... ..................... .............106
SDO1 Disable . ..........................................................103
Slave Select Synchronization ...................................105
Word and Byte Communication.... ..................... .......103
STATUS Regi ster....... ..................... ..................... ...............14
Symbols Used in Opcode Descriptions.............................160
System Integration
Overview...................................................................145
Register Map........................... ........................... .......158
T
Thermal Operating Conditions..........................................172
Thermal Packaging Characteristics ..................................172
Timer1 Module
16-bit Asynchronous Counter Mode ...........................63
16-bit Synchronous Counter Mode .............................63
16-bit Timer Mode.......................................................63
Gate Operation ...........................................................64
Interrupt.......................................................................65
Operation During Sleep Mode ....................................64
Prescaler.....................................................................64
Real-Time Clock .........................................................65
RTC Interru p ts ........................... ..................... ....65
RTC Oscilla to r Operation........ ............... .............65
Register Map........................... ..................... ...............66
Timer2 and Timer3 Selection Mode...... ......... .... .. .... .... .......82
Timer2/3 Module
16-bit Timer Mode.......................................................67
32-bit Synchronous Counter Mode .............................67
32-bit Timer Mode.......................................................67
ADC Event Trigger......................................................70
Gate Operation ...........................................................70
Interrupt.......................................................................70
Operation During Sleep Mode ....................................70
Register Map........................... ..................... ...............71
Timer Prescaler...........................................................70
Timer4/5 Module................... .. .... .. ....... .... .. .. .... .. .. ....... .... .. .. 73
Register Map ... ............................ ..................... .......... 76
Timing Diagram
A/D Conversion
10-Bit High-Speed (CHPS = 01, SIMSAM = 0, 
ASAM = 1, SSRC = 111, 
SAMC = 00001)........................................ 210
I2C Bus Data (Slave Mode) ...................................... 204
Timing Diagrams
A/D Conversion
10-Bit High-Speed (CHPS = 01, SIMSAM = 0, 
ASAM = 0, SSRC = 000).......................... 209
Band Gap Start-up Time........................................... 186
CAN Bit........ ..................... ..................... ................... 128
CAN Module I/O................ .... .. ......... .. .. .... .. ....... .... .. .. 206
Center-Aligned PWM.................................................. 95
CLKO and I/O........................................................... 184
Dead-Time Timing...................................................... 97
Edge-Aligned PWM ................................. .. ......... .. .... .. 95
External Clock...........................................................179
I2C Bus Data (Master Mode) .................................... 202
I2C Bus Start/Stop Bits (Master Mode)..................... 202
I2C Bus Start/Stop Bits (Slave Mode)....................... 204
Input Capture............................................................ 190
Motor Control PWM.................................................. 193
Motor Control PWM Module Fault ............................ 193
Output Com p a re................... ............................ ........191
Output Com p a re/PWM ................ ........................... ..192
PWM Output...... ..................... ............................ ........ 83
QEI Module External Clock........................ ......... .. .... 189
QEI Module Index Pulse.......................... .. ......... .... .. 195
Reset, Watchdog Timer, Oscillator 
Start-up Timer and Power-up Timer.................185
SPI Master Mode (CKE = 0)..................................... 196
SPI Master Mode (CKE = 1)..................................... 197
SPI Slave Mode (CKE = 0)....................................... 198
SPI Slave Mode (CKE = 1)....................................... 200
Time-out Sequence on Power-up 
(MCLR No t Ti e d  to  V DD), Case 1 ..................... 152
Time-out Sequence on Power-up 
(MCLR No t Ti e d  to  V DD), Case 2 ..................... 152
Time-out Sequence on Power-up 
(MCLR Tied to VDD) ......................................... 152
Timerx External Clock............................................... 187
Timing Requirements
A/D Conversion
10-Bit High-Speed ...... .... ....... .... .... .. .... ......... .. .. 211
Band Gap Start-up Time........................................... 186
CAN Module I/O................ .... .. ......... .. .. .... .. ....... .... .. .. 206
CLKO and I/O........................................................... 184
External Clock...........................................................180
I2C Bus Data (Master Mode) .................................... 203
I2C Bus Data (Slave Mode) ...................................... 205
Input Capture............................................................ 190
Motor Control PWM.................................................. 193
Output Com p a re................... ............................ ........191
QEI Module External Clock........................ ......... .. .... 189
QEI Module Index Pulse.......................... .. ......... .... .. 195
Quadrature Decoder......................................... .... .... 194
Reset, Watchdog Timer, Oscillator 
Start-up Timer and Power-up Timer.................186
Simple Output Compare/PWM Mode ....................... 192

© 2007 Microchip Technology Inc. DS70135E-page 227
dsPIC30F4011/4012
SPI Master Mode (CKE = 0) .....................................196
SPI Master Mode (CKE = 1) .....................................197
SPI Slave Mode (CKE = 0).......................................199
SPI Slave Mode (CKE = 1).......................................201
Timer1 External Clock...............................................187
Timer2 and Timer4 External Clock ......................... ..188
Timer3 and Timer5 External Clock ......................... ..188
Timing Specifications
PLL Clock ..................................................................181
PLL Jitter...................................................................181
Trap Vec to rs ....................... ................................. ...............42
Traps...................................................................................41
Hard and Soft..............................................................42
Trap Sources ............................... ........................... ....41
U
UART
Address Detect Mode ...............................................119
Alternate I/O..............................................................117
Auto-Baud Support ............................................... ....120
Baud Rate Generator................................................119
Disabling...................................................................117
Enabling and Setting Up ... .. .. ....... .. .. .. .... .. .. .. ....... .. .. ..117
Loopback Mode ................................... .... .. ....... .... .. ..119
Module Overview......................................................115
Operation During CPU Sleep and Idle Modes..........120
Receiving Data..........................................................118
In 8-b i t o r  9 -b i t D a ta Mo d e.. ...... ...... ...... ..... .......118
Interrupt ............................................................118
Receive Buffer (UxRCB)...................................118
Reception  Er ror Handling............. .............. ...............118
Framing Error (FERR) ......................................119
Idle Status.........................................................119
Parity Error (PERR)..........................................119
Receive Break ..................................................119
Receive Buffe r Overrun Erro r ( OERR Bit) ........118
Setting Up Data, Parity and Stop Bit 
Selections......................................................... 117
Transmitting Data..................................................... 117
Break................................................................ 118
In 8-bit Da ta  Mod e............... ..................... ........ 117
In 9-bit Da ta  Mod e............... ..................... ........ 117
Interrupt............................................................ 118
Transmit Buffer (UxTXB).................................. 117
UART1 Register Map ............................................... 121
UART2 Register Map ............................................... 121
Unit ID Locations.............................................................. 145
Universal Asynchronous Receiver 
Transmitter Module (UART) ..................................... 115
W
Wake-up from Sleep......................................................... 145
Wake-up from Sleep and Idle............................................. 43
Watchdog Timer (WDT)..................... .. .... .... ....... .. .... 145, 155
Enabling and Disabling............................................. 155
Operation.................................................................. 155
WWW Addres s..................... ............................ ................ 228
WWW, On-Line Support....................................................... 6

dsPIC30F4011/4012

NOTES:

dsPIC30F4011/4012

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dsPIC30F4011/4012

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DS70135EdsPIC30F4011/4012

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dsPIC30F4011/4012

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dsPIC30F6010AT-30I/PF-000

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dsPIC30F6010AT-30I/PF = 30 MIPS, Industrial temp., TQFP package, Rev. A

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Architecture

Flash

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Temperature

Device ID

Package

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Memory Size in Bytes

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2 = 7K to 12K

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12/08/06

© 2007 Microchip Technology Inc. DS70135E-page 1
dsPIC30F4011/4012
0 Device Overview .......................................................................................................................................................................... 7
0 CPU Architecture Overview........................................................................................................................................................ 13
0 Memory O rganization. ................................................................................................................................................................ 21
0 Address Generato r Units............................................................................................................................................................ 33
0 Interrupts.................................................................................................................................................................................... 39
0 Flash Pro g ram Memory............................ ............................ ........................... ........................................................................... 45
0 Data EEPR OM Mem o ry........ ..................... ..................... ............................ ........................... .................................................... 51
0 I/O Ports........... ............................ ........................... .................................. ................................................................................. 57
0 Timer1 Module ........................................................................................................................................................................... 63
0 Timer2/3 Module ................... ....... .. .. .. .. .... .. ..... .... .. .. .. .. .... ..... .. .. .... .. .. .. .. ....... .. .. .. .... .. .. ..... ............................................................ 67
0 Timer4/5 Module  ........................... .. .. .. .... .. ..... .. .... .. .. .. .. ....... .. .. .. .... .. .. .. ....... .. .. .. .. .... .. ..... ............................................................ 73
0 Input Capture Module............................. .... ..... .... .. .. .... .. .. ....... .. .... .. .. .... ..... .... .. .. .... .. .. ....... .......................................................... 77
0 Output Compa re Module........................ ..................... ..................... ............................ .............................................................. 81
0 Quadrature Encoder Interface (QEI ) Module ............................................................................................................................. 85
0 Mot or Control PWM Module....................................................................................................................................................... 91
0 SP I Module............................................................................................................................................................................... 103
0 I2 C™  Module ........................................................................................................................................................................... 107
0 U nivers al Asynchr onous Receiver  Transmi tter (UART) Module .............................................................................................. 115
0 CAN Module............................................................................................................................................................................. 123
0 10-bit, High-Speed 
Analog-to-Digital Converter (ADC) Module133
0 System Inte g r a tion .... ..................... ..................... ..................... ........................... ..................................................................... 145
0 Instruction Set Summary.......................................................................................................................................................... 159
0 Development Support............................................................................................................................................................... 167
0 Electrical Characteristics.......................................................................................................................................................... 171
0 Packagin g  In fo rmation.............................. ............................ ..................... ............................................................................... 213
The Micro chip Web Site...... ........................... ........................... .................................. ....................................................................... 229
Customer Change Notification Service............................................................................... ............................................................... 229
Customer Support............................................................... .... ............. ...... ............. ...... .... ................................................................. 229
Reader Response.............................................................................................................................................................................. 230
Product Identification System ............................................................................................................................................................ 231

dsPIC30F4011/4012