Micro Chip Fuse
Micro Chip Fuse
Type:
ERB RD
ERB RE
ERB RG
●Small size
●Fast-acting and withstanding in-rush current characteristics
●RoHS compliant
UL248-14 : File No.E194052
c-UL C22.2 No.248-14 : File No.E194052
(1.0 mm×0.5 mm)
(1.6 mm×0.8 mm)
(3.2 mm×1.6 mm)
0.30±0.15 0.54±0.10
+0.15
-0.05
2.0A
ERBRD
0.30±0.20
Explanation of Part Numbers
Approved Safety Standards
Dimensions in mm (not to scale)
Product Code
Micro Chip Fuse
Structure
Rectangular
type
R
1R40
1.4A
3.15A
1.5A
Product shape
0402 inch size
1.25A
XPressed Carrier Taping
2 mm pitch, 10,000 pcs
L
W
VPunched Carrier Taping
4mm pitch, 5,000 pcs
1R50
5R00
Part No.
(inch size)
5.0A
0.375A
2R00
0.50A
E
G
0603 inch size
1206 inch size
Features
D
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
2020/3/1
Construction
a
Mass
(Weight)
(g/1000 pcs)
10
1.60±0.153.20±0.20
1.60±0.15 0.24±0.15
0.80
0.65±0.10
ERBRG
(1206)
ERBRD
(0402)
Packaging
Code
3.0A
2.5A
0.50 025±0.10
Part No.
0.315A
ERBRE
(0603)
2R50
0.63A
3R00
+0.10
-0.05
1.00±0.10
4.0A
2.2
0.7
0.39±0.10
Dimensions(mm)
T
b
0.15±0.10
Packaging Methods
0.55±0.20
0R25
0R31
0R37
0R50
0R63
0R75
1R00
1R25
0.25A
0.75A
3R15
1.0A
4R00
ERBRE
ERBRG
12 3 4 5 6 7 89 10
0
0
X
E
R
B
R
D
1
R
Protective Coating Electrode (Base)
Electrode
(Outer)
Fusing Element
Almina Substrate
W
a
L
T
b
Micro Chip Fuse
●0402 inch /1005 mm size : Type ERBRD
●0603 inch / 1608 mm size : Type ERBRE
●1206 inch / 3216 mm size : Type ERBRG
*The thin type is available about 1005 (0402 inch) size. Please contact us for details.
*Please contact us when another rated current is needed.
Fusing Current/
Fusing Time (at 25 ℃)
Marking Code
　　　　　　　　　　　　　　　　　　　　　　Rated Current ×100 % /4 hours min.
K
85
G
H
J
35
　　　　　　　　　　　　　　　　　　　　　　Rated Current ×300 % /0.2 seconds max.
51
5.0
P31
O
P
S
65
Internal R(mΩ)
at 25 ℃ max.
K
72
O
330 190
N S
32
35
-40 to +125
3.15
Rated Current(A)
2.0
2.5
3.0
4.0
ERBRG□R□□V
1R00
1R25
1R50
Part No.
2.0 2.5 3.0
40 33
4.01.5
Fusing Current/
Fusing Time (at 25 ℃)
Rated Voltage
(Open Circuit Voltage)
(V)DC
0.75
5.0
1R00
1R25
1R50
2R00
2R50
0R63
O
T
N
0.5
F
310
Part No.
Rated Current(A)
Marking Code
Internal R(mΩ)
at 25 ℃ max. 520700
Y
X
440
　　　　　　　　　　　　　　　　　　　　　　Rated Current ×200 % / 5 seconds max.
340 210 175 115560 45
0R75
1.25
1.5
0.5
N
F
0R50
1.0
Fusing Current/
Fusing Time (at 25 ℃)
Rated Voltage
(Open Circuit Voltage)
(V)DC
Interrupting Rating at
Rated Voltage(A)
Category Temp. Range(℃)
　　　　　　　　　　　　　　　　　　　　　　Rated Current ×100 % /4 hours min.
　　　　　　　　　　　　　　　　　　　　　　Rated Current ×200 % / 5 seconds max.
　　　　　　　　　　　　　　　　　　　　　　Rated Current ×300 % /0.2 seconds max.
32
50
Interrupting Rating at
Rated Voltage(A)
T
5R00
　　　　　　　　　　　　　　　　　　　　　　Rated Current ×300 % /0.2 seconds max.
2R00 2R501R00 1R25 1R40 1R50 3R15 4R003R000R50 0R75
　　　　　　　　　　　　　　　　　　　　　　Rated Current ×100 % /4 hours min.
　　　　　　　　　　　　　　　　　　　　　　Rated Current ×200 % / 5 seconds max.
125 82
P
S
H
J
K
ERBRD□R□□X
0R25
0.25
V
0.315
0R31
6
220
G
190
5R00
0.63
0R75
3R00
4R00
0.75
1.0
1.25
1.5
2.0
2.5
3.0
4.0
0R50
0R37
Internal R(mΩ)
at 25 ℃ max.
-40 to +125
32 22 19125 94 85
2R00
3263
50
-40 to +125
Rated Voltage
(Open Circuit Voltage)
(V)DC
Interrupting Rating at
Rated Voltage(A)
Category Temp. Range(℃)
1.25 1.4Rated Current(A) 0.5
Ratings
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
2020/3/1
0.375
Part No. ERBRE□R□□V
70 53 42 37 24 19.5
J14Marking Code F G H
0.75 1.0
2R50
3R00
4R00
Category Temp. Range(℃)
Micro Chip Fuse
Resistance
Resistance to Soldering Heat
Rapid Change of Temperature
Damp Heat, Steady State
Load Life in Humidity
Endurance at 70 °C
0.5 to 0.6 1.4 to 1.6 0.4 to 0.6
0.7 to 0.9 2.0 to 2.2 0.8 to 1.0
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
2020/3/1
2.0 to 2.4 4.4 to 5.0 1.2 to 1.8
Part No.
(inch size)
Dimensions(mm)
A
B
C
ERBRD
(0402)
ERBRE
(0603)
ERBRG
(1206)
Fusing Characteristics (25 °C typical)
Perfomance
60 ℃, 90 % to 95 %RH, Load: 70 % rated current, 1000 h
70 ℃, Load: 70 % rated current, 1000 h
60 ℃, 90 % to 95 %RH, 1000 h (no load)
-40 ℃ (30 min.) / + 125 ℃ (30 min.), 5 cycles
260 ℃±5 ℃, 10 s
25 ℃
Test Conditions
Recommended Soldering Conditions
Test Item Performance Requirements
±10 %
●0402 inch / 1005 mm size
（Type ERBRD)
Fusing Current (A)
10
1
0.1
0.01
0.001
0.0001
110 100
0.1
0.25 A
Fusing Time（s）
0.315 A
0.375 A
0.5 A
0.63 A
0.75 A
1.0 A
1.25 A
1.5 A
2.0 A
2.5 A
3.0 A
4.0 A
5.0 A
＊Reference Only
10
1
0.01
0.001
0.0001
0.1
0.5 A
0.75 A
1.0 A
1.25 A
1.5 A
2.0 A
2.5 A
3.0 A
4.0 A
＊Reference Only
0.1 110 100
Fusing Current (A)
0.0001
0.5 A
0.75 A
1.0 A
1.25 A
1.4 A
2.0 A
2.5 A
3.0 A
4.0 A
5.0 A
＊Reference Only
1.5 A
3.15 A
0.1
1
10
100
Fusing Current (A)
10
1
0.01
0.001
0.1
C
B
A
●0603 inch / 1608 mm size
（Type ERBRE)
●1206 inch / 3216mm size
（Type ERBRG)
Fusing Time（s）
Fusing Time（s）
Micro Chip Fuse
●Standard Quantity
●Carrier Taping ( Unit : mm) ●Taping Reel ( Unit : mm)
Recommendations and precautions are described below
● Recommended soldering conditions for reflow
For soldering (Example : Sn/Pb)
For lead-free soldering (Example :Sn/Ag/Cu)
● Recommended soldering conditions for flow
《Repair with hand soldering》
● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less.
Solder each electrode for 3 seconds or less.
● Never touch this product with the tip of a soldering iron.
ERBRD
4.00 ±0.10
Packaging Methods (Taping)
Pitch (P1)
2 mm
4 mm
Part No.
Size (inch)
ERBRD
ERBRE
ERBRG
0402
0603
1206
Kind of Taping
Pressed Carrier Taping
Punched Carrier Taping
±0.10
±0.10
±0.20 3.50
±0.07
±0.07
±015
3.60
±020
8.00
1.90
2020/3/1
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Time
Temperature
Time
max. 260 ℃
Temperature
60 s to 120 s 150 ℃ to 180 ℃　　　　Preheating
　　　　Soldering
Temperature
140 ℃ to 160 ℃
245±5
℃
Main heating
Peak
60 s to 120 s
Above 230 ℃ 30 s to 40 s
Above 200 ℃ 30 s to 40 s
Part No. P1P2P0øD0T
ERBRG
ERBRE
2.00
1.10
±0.05
1.20
±0.10
ERBRD
1.50
0.67
0.78
0.84
1.75
±0.10
±0.07
ERBRG
ERBRE
Recommended Soldering Conditions
Quantity
10,000 pcs / reel
　5,000 pcs / reel
W1W2
øA
+1.0
　0 13.0 ±0.2
øN øCPart No. A B W F E Part No.
Preheating
+0.10
　0
±0.10
0.68
ERBRD
ERBRE
ERBRG
20 s to 30 s max. 260 ℃ max. 10 s
For soldering For lead-free soldering
max. 10 s
60 s to 120 s
Time
150 ℃ to 180 ℃
9.0 +1.0
　0 11.4 ±1.0 0
-1.5
180.0 60
・ Reflow soldering shall be performed a maximum of two times.
・ Please contact us for additional information when used in
conditions other than those specified.
・ Please measure the temperature of the terminals and study
every kind of solder and printed circuit board for solderability
before actual use.
2.00
60 s to 120 s
Time
140 ℃ to 160 ℃
Temperature
235 ± 5 ℃max. 10 s
±0.10
2.00
±0.10
Preheating
Main heating
Peak
±0.05 4.00
Pressed
Carrier
T
P2
P0
T
A
P1
P1
(2ｍｍ pitch)
F
W
E
B
Punched
Carrier
Peak
Preheating
Heating
Time
Temperature
øC
W1
øN
øA
W2
øD0
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Fuses
Safety Precautions (Common precautions for Fuses)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject to
change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products under the actual conditions for use.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as
damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment,
electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention
equipment.
✽ Systems equipped with a protection circuit and a protection device.
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single
fault.
✽ Systems equipped with an arresting the spread of fire or preventing glitch.
(1) Precautions for use
• These products are designed and manufactured for general and standard use in general elec tron ic equipment.
(e.g. AV equipment, home electric appliances, office equipment, information and communication equipment)
For applications in which special quality and reliability are required, or if the failure or malfunction of the
products may directly jeopardize life or cause threat of personal injury (such as for aircraft and aerospace
equipment, traffic and transport equipment, combustion equipment, medical equipment, accident prevention
and anti-theft devices, and safety equipment), please be sure to consult with our sales representative in
advance and to exchange product specifications which conform to such applications.
• These products are not intended for use in the following special conditions. Before using the products, carefully
check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent.
2. In direct sunlight, outdoors, or in dust.
3. In salty air or air with a high concentration of corrosive gas, such as Cl2，H2S，NH3，SO2，or NOX .
4. Electric Static Discharge (ESD) Environment.
These components are sensitive to static electricity and can be damaged under static shock (ESD).
　　 Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic and Radioactive Environment.
Avoid any environment where strong electromagnetic waves and radiation exist.
6. In an environment where these products cause dew condensation.
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials.
• These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range
due to the effects of neighboring heat-generating components. Do not mount or place heat-generating
components or inflammables, such as vinyl-coated wires, near these products.
• Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the
performance or reliability of the products.
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the
performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to
leave water residues. Otherwise, the insulation performance may be deteriorated.
• Do not apply flux to these products after soldering. The activity of flux may be a cause of failures in these
products.
• Refer to the recommended soldering conditions and set the soldering condition. High peak temperature or
long heating time may impair the performance or the reliability of these products.
• Recommended soldering condition is for the guideline for ensuring the basic characteristics of the products,
not for the stable soldering conditions. Conditions for proper soldering should be set up according to individual
conditions.
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Fuses
• Do not reuse any products after removal from mounting boards.
• Do not drop these products. If these products are dropped, do not use them. Such products may have
received mechanical or electrical damage.
• If any doubt or concern to the safety on these products arise, make sure to inform us immediately and
conduct technical examinations at your side.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of
arrival at your company, provided that they remain packed as they were when delivered and stored at
a temperature of 5 °C to 35 °C and a relative humidity of 45 % to 85 %.
The performance of Thermal Cutoffs is guaranteed for a year after our delivery, provided that they are stored
at a temperature of -10 °C to +40 °C and a relative humidity of 30 % to 75 %.
Even within the above guarantee periods, do not store these products in the following conditions.
Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging
materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2，H2S，NH3，SO2，or NOX .
2. In direct sunlight.
(3) Precaution specific to this product
1. Set the rated current so that the current passing through the Micro Chip Fuses (hereafter called the fuses)
under normal conditions is within 70% of the rated current.
2. Do not continuously pass a current exceeding the rated current through the fuses.
3. If a pulse exceeding the rated current is applied, such as a rush current or surge current at power-on,
take care not to cause unwanted fusing. Calculate the I2t value of the pulse and check the tolerance to
the number of pulses according to the I2t-t characteristic curve before deciding to use the fuses.
Before checking the tolerance, consult our sales staff in advance.
4. The fuses are designed to be blown out by a current that is double or greater than the rated current.
Ensure that the abnormal current generated when a circuit abnormality occurs in your product is at least
double or greater than the rated current of the fuses. In addition, ensure that the abnormal current of
your product does not exceed the maximum interrupting current of the fuses.
5. The fuses are designed to be used on the secondary side of a power supply. Do not use them on the
primary side.
6. Ensure that the voltage applied to the fuses are within their rated voltage.
7. The fusing characteristics of the fuses are affected by the ambient temperature. Before use, mount the
fuses on your products and carefully check and evaluate their category temperature range.
＜Package markings＞
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
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