Detailed Description
The MAX2659 is an LNA designed for GPS L1, GALILEO,
and GLONASS applications. The device features a
power-shutdown control mode to eliminate the need for
an external supply switch. The device achieves a 20.5dB
gain and an ultra-low-noise figure of 0.8dB. The MAX2659
consumes approximately 4.1mA while providing a IP1dB
of -12dBm and an IIP3 of -5dBm.
Input and Output Matching
The MAX2659 requires an off-chip input matching. Only a
6.8nH inductor in series with a DC-blocking capacitor is need-
ed to form the input matching circuit. The Typical Application
Circuit diagram shows the recommended input-matching
network. These values are optimized for the best simultane-
ous gain, noise figure, and return loss performance. Table 1
lists typical device S11 values. The MAX2659 integrates an
on-chip output matching to 50Ω at the output, eliminating the
need for external matching components.
Shutdown
The MAX2659 includes a shutdown feature to turn off the
entire chip. Apply a logic high to SHDN pin to place the
part in the active mode and a logic low to place the part in
the shutdown mode.
Applications Information
A properly designed PC board (PCB) is essential to any
RF microwave circuit. Use controlled-impedance lines on
all high-frequency inputs and outputs. Bypass VCC with
decoupling capacitors located close to the device. For long
VCC lines, it may be necessary to add decoupling capaci-
tors. Locate these additional capacitors further away from
the device package. Proper grounding of the GND pins is
essential. If the PCB uses a topside RF ground, connect it
directly to the GND pins. For a board where the ground is
not on the component layer, connect the GND pins to the
board with multiple vias close to the package.
Table 1. Typical S11 Values
MAX2659 GPS/GNSS Low-Noise Amplier
www.maximintegrated.com Maxim Integrated
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5
Pin Description
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
Chip Information
PROCESS: SiGe BiCMOS
PIN NAME FUNCTION
1, 2 GND Ground. Connect to the PCB ground plane.
3RFIN RF Input. Requires a DC-blocking capacitor and external matching components.
4 VCC Supply Voltage. Bypass to ground with a 33nF capacitor as close as possible to the IC.
5SHDN Shutdown Input. A logic-low disables the device.
6RFOUT RF Output. RFOUT is internally matched to 50Ω and incorporates an internal DC-blocking capacitor.
FREQUENCY (MHz) REAL S11 IMAGINARY S11
1000 -0.58 -j0.52
1100 -0.68 -j0.356
1200 -0.74 -j0.16
1300 -0.74 j0.036
1400 -0.676 j0.22
1500 -0.56 j0.36
1575 -0.47 j0.415
1600 -0.44 j0.43
1700 -0.36 j0.467
1800 -0.3 j0.51
1900 -0.228 j0.567
2000 -0.14 j0.622
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
6 μDFN L611+2 21-0147 90-0084