AT93C66A-10PQ-2.7 - Atmel Corporation

Features

•Medium-voltage and Standard-voltage Operation

–5.0(V

CC = 4.5V to 5.5V)

– 2.7 (VCC = 2.7V to 5.5V)

•Extended Temperature Range –40°C to 125°C

•User-selectable Internal Organization

– 2K: 256 x 8 or 128 x 16

– 4K: 512 x 8 or 256 x 16

•Three-wire Serial Interface

•Sequential Read Operation

•2 MHz Clock Rate (5V)

•Self-timed Write Cycle (10 ms max)

•High Reliability

– Endurance: 1 Million Write Cycles

– Data Retention: 100 Years

•8-lead PDIP, 8-lead JEDEC SOIC, and 8-lead TSSOP Packages

Description

The AT93C56A/66A provides 2048/4096 bits of serial electrically-erasable program-

mable read-only memory (EEPROM). The EEPROM is organized as 128/256 words of

16 bits each when the ORG pin is connected to VCC and 256/512 words of 8 bits each

when it is tied to ground. The device is optimized for use in many automotive applica-

tions where low-power and low-voltage operations are essential. The AT93C56A/66A

is available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, and 8-lead TSSOP

packages.

The AT93C56A/66A is enabled through the Chip Select (CS) pin and accessed via a

three-wire serial interface consisting of Data Input (DI), Data Output (DO), and Shift

Clock (SK). Upon receiving a Read instruction at DI, the address is decoded and the

data is clocked out serially on the data output pin DO. The write cycle is completely

self-timed and no separate erase cycle is required before write. The write cycle is only

enabled when the part is in the Erase/Write Enable state. When CS is brought high

following the initiation of a write cycle, the DO pin outputs the Ready/Busy status of

the part.

The AT93C56A/66A is available in 2.7V to 5.5V versions.

Table 1. Pin Configuration

Pin Name Function

CS Chip Select

SK Serial Data Clock

DI Serial Data Input

DO Serial Data Output

GND Ground

VCC Power Supply

ORG Internal Organization

DC Don’t Connect

Three-wire

Serial

Extended

Temperature

EEPROMs

2K (256 x 8 or 128 x 16)

4K (512 x 8 or 256 x 16)

AT93C56A

AT93C66A

Preliminary

Rev. 5091A–SEEPR–10/04

VCC

ORG

GND

VCC

ORG

GND

8-lead PDIP

8-lead SOIC

VCC

ORG

GND

8-lead TSSOP

2AT93C56A/66A [Preliminary]

5091A–SEEPR–10/04

Figure 1. Block Diagram

Note: When the ORG pin is connected to VCC, the “x 16” organization is selected. When it is connected to ground, the “x 8” organiza-

tion is selected. If the ORG pin is left unconnected and the application does not load the input beyond the capability of the

internal 1 Meg ohm pullup, then the “x 16” organization is selected.

Absolute Maximum Ratings*

Operating Temperature......................................−55°C to +125°C*NOTICE: Stresses beyond those listed under “Absolute

Maximum Ratings” may cause permanent dam-

age to the device. This is a stress rating only and

functional operation of the device at these or any

other conditions beyond those indicated in the

operational sections of this specification is not

implied. Exposure to absolute maximum rating

conditions for extended periods may affect

device reliability

Storage Temperature .........................................−65°C to +150°C

Voltage on Any Pin

with Respect to Ground ........................................ −1.0V to +7.0V

Maximum Operating Voltage .......................................... 6.25V

DC Output Current........................................................ 5.0 mA

16384/32768 x 8

AT93C56A/66A [Preliminary]

5091A–SEEPR–10/04

Note: 1. This parameter is characterized and is not 100% tested.

Note: 1. VIL min and VIH max are reference only and are not tested.

Table 1. Pin Capacitance(1)

Applicable over recommended operating range from TA = 25°C, f = 1.0 MHz, VCC = +5.0V (unless otherwise noted)

Symbol Test Conditions Max Units Conditions

COUT Output Capacitance (DO) 5 pF VOUT = 0V

CIN Input Capacitance (CS, SK, DI) 5 pF VIN = 0V

Table 2. DC Characteristics

Applicable over recommended operating range from: TAE = −40°C to +125°C, VCC = +2.7V to +5.5V (unless otherwise

noted)

Symbol Parameter Test Condition Min Typ Max Unit

VCC1 Supply Voltage 2.7 5.5 V

VCC2 Supply Voltage 4.5 5.5 V

ICC Supply Current VCC = 5.0V READ at 1.0 MHz 0.5 2.0 mA

WRITE at 1.0 MHz 0.5 2.0 mA

ISB1 Standby Current VCC = 2.7V CS = 0V 6.0 10.0 µA

ISB2 Standby Current VCC = 5.0V CS = 0V 17 30 µA

IIL Input Leakage VIN = 0V to VCC 0.1 3.0 µA

IOL Output Leakage VIN = 0V to VCC 0.1 3.0 µA

VIL1(1) Input Low Voltage 2.7V ≤ VCC ≤ 5.5V

−0.6 0.8 V

VIH1(1) Input High Voltage 2.0 VCC + 1

VOL1 Output Low Voltage 2.7V ≤ VCC ≤ 5.5V IOL = 2.1 mA 0.4 V

VOH1 Output High Voltage IOH = −0.4 mA 2.4 V

4AT93C56A/66A [Preliminary]

5091A–SEEPR–10/04

Note: 1. This parameter is characterized and is not 100% tested.

Table 3. AC Characteristics

Applicable over recommended operating range from TA = −40°C to + 125°C, VCC = As Specified, CL = 1 TTL Gate and

100 pF (unless otherwise noted).

Symbol Parameter Test Condition Min Typ Max Units

fSK SK Clock Frequency 4.5V ≤ VCC ≤ 5.5V

2.7V ≤ VCC ≤ 5.5V

1MHz

tSKH SK High Time 4.5V ≤ VCC ≤ 5.5V

2.7V ≤ VCC ≤ 5.5V

250

250 ns

tSKL SK Low Time 4.5V ≤ VCC ≤ 5.5V

2.7V ≤ VCC ≤ 5.5V

250

250 ns

tCS

Minimum CS

Low Time

4.5V ≤ VCC ≤ 5.5V

2.7V ≤ VCC ≤ 5.5V

250

250 ns

tCSS CS Setup Time Relative to SK 4.5V ≤ VCC ≤ 5.5V

2.7V ≤ VCC ≤ 5.5V

50 ns

tDIS DI Setup Time Relative to SK 4.5V ≤ VCC ≤ 5.5V

2.7V ≤ VCC ≤ 5.5V

100

100 ns

tCSH CS Hold Time Relative to SK 0 ns

tDIH DI Hold Time Relative to SK 4.5V ≤ VCC ≤ 5.5V

2.7V ≤ VCC ≤ 5.5V

100

100 ns

tPD1 Output Delay to “1” AC Test 4.5V ≤ VCC ≤ 5.5V

2.7V ≤ VCC ≤ 5.5V

250

500 ns

tPD0 Output Delay to “0” AC Test 4.5V ≤ VCC ≤ 5.5V

2.7V ≤ VCC ≤ 5.5V

250

500 ns

tSV CS to Status Valid AC Test 4.5V ≤ VCC ≤ 5.5V

2.7V ≤ VCC ≤ 5.5V

250

250 ns

tDF

CS to DO in High

Impedance

AC Test

CS = VIL

4.5V ≤ VCC ≤ 5.5V

2.7V ≤ VCC ≤ 5.5V

100

150 ns

tWP Write Cycle Time 2.7V ≤ VCC ≤ 5.5V 0.1 3 10 ms

Endurance(1) 5.0V, 25°C 1M Write Cycles

AT93C56A/66A [Preliminary]

5091A–SEEPR–10/04

Functional Description

The AT93C56A/66A is accessed via a simple and versatile three-wire serial communi-

cation interface. Device operation is controlled by seven instructions issued by the host

processor.

A valid instruction starts with a rising edge of CS

and consists of a start bit

(logic “1”) followed by the appropriate op code and the desired memory address

location.

Note: The X’s in the address field represent

don’t care

values and must be clocked.

READ (READ): The Read (READ) instruction contains the address code for the mem-

ory location to be read. After the instruction and address are decoded, data from the

selected memory location is available at the serial output pin DO. Output data changes

are synchronized with the rising edges of serial clock SK. It should be noted that a

dummy bit (logic “0”) precedes the 8- or 16-bit data output string. The AT93C56A/66A

supports sequential read operations. The device will automatically increment the inter-

nal address pointer and clock out the next memory location as long as Chip Select (CS)

is held high. In this case, the dummy bit (logic “0”) will not be clocked out between mem-

ory locations, thus allowing for a continuous stream of data to be read.

ERASE/WRITE ENABLE (EWEN): To assure data integrity, the part automatically goes

into the Erase/Write Disable (EWDS) state when power is first applied. An Erase/Write

Enable (EWEN) instruction must be executed first before any programming instructions

can be carried out. Please note that once in the EWEN state, programming remains

enabled until an EWDS instruction is executed or VCC power is removed from the part.

ERASE (ERASE): The Erase (ERASE) instruction programs all bits in the specified

memory location to the logical “1” state. The self-timed erase cycle starts once the

Erase instruction and address are decoded. The DO pin outputs the Ready/Busy status

of the part if CS is brought high after being kept low for a minimum of 250 ns (tCS). A

logic “1” at pin DO indicates that the selected memory location has been erased, and the

part is ready for another instruction.

Table 4. Instruction Set for the AT93C56A and AT93C66A

Instruction SB

Code

Address Data

Commentsx 8 x 16 x 8 x 16

READ 1 10 A8 – A0A7 − A0

Reads data stored in memory, at

specified address

EWEN 1 00 11XXXXXXX 11XXXXXX Write enable must precede all

programming modes

ERASE 1 11 A8 − A0A7 − A0Erase memory location An − A0

WRITE 1 01 A8 − A0A7 − A0D7 − D0D15 − D0Writes memory location An − A0

ERAL 1 00 10XXXXXXX 10XXXXXX Erases all memory locations. Valid

only at VCC = 4.5V to 5.5V

WRAL 1 00 01XXXXXXX 01XXXXXX D7 − D0D15 − D0

Writes all memory locations. Valid

only at VCC = 5.0V ±10% and Disable

EWDS 1 00 00XXXXXXX 00XXXXXX Disables all programming instructions

6AT93C56A/66A [Preliminary]

5091A–SEEPR–10/04

WRITE (WRITE): The Write (WRITE) instruction contains the 8 or 16 bits of data to be

written into the specified memory location. The self-timed programming cycle, tWP, starts

after the last bit of data is received at serial data input pin DI. The DO pin outputs the

Ready/Busy status of the part if CS is brought high after being kept low for a minimum of

250 ns (tCS). A logic “0” at DO indicates that programming is still in progress. A logic “1”

indicates that the memory location at the specified address has been written with the

data pattern contained in the instruction and the part is ready for further instructions.

Ready/Busy status cannot be obtained if the CS is brought high after the end of the self-

timed programming cycle, tWP

ERASE ALL (ERAL): The Erase All (ERAL) instruction programs every bit in the mem-

ory array to the logic “1” state and is primarily used for testing purposes. The DO pin

outputs the ready/busy status of the part if CS is brought high after being kept low for a

minimum of 250 ns (tCS). The ERAL instruction is valid only at VCC = 5.0V ± 10%.

WRITE ALL (WRAL): The Write All (WRAL) instruction programs all memory locations

with the data patterns specified in the instruction. The DO pin outputs the Ready/Busy

status of the part if CS is brought high after being kept low for a minimum of 250 ns (tCS).

The WRAL instruction is valid only at VCC = 5.0V ± 10%.

ERASE/WRITE DISABLE (EWDS): To protect against accidental data disturb, the

Erase/Write Disable (EWDS) instruction disables all programming modes and should be

executed after all programming operations. The operation of the Read instruction is

independent of both the EWEN and EWDS instructions and can be executed at any

time.

Timing Diagrams

Figure 1. Synchronous Data Timing

Note: This is the minimum SK period.

Notes: 1. A8 is a

don’t care

value, but the extra clock is required.

2. A7 is a

don’t care

value, but the extra clock is required.

Table 5. Organization Key for Timing Diagrams

I/O

AT93C56A (2K) AT93C66A (4K)

x 8 x 16 x 8 x 16

ANA8(1) A7(2) A8A7

DND7D15 D7D15

HI-Z HI-Z

VALID IN

DIS

SCK

CSH

CSS

AT93C56A/66A [Preliminary]

5091A–SEEPR–10/04

Figure 2. READ Timing

Figure 3. EWEN Timing

Figure 4. EWDS Timing

Figure 5. WRITE Timing

High Impedance

11 ...

001

tCS

CS tCS

DI 1 0 000 ...

CS t

0A0D0

... ...

HIGH IMPEDANCE BUSY READY

8AT93C56A/66A [Preliminary]

5091A–SEEPR–10/04

Figure 6. WRAL Timing

Note: Valid only at VCC = 4.5V to 5.5V

Figure 7. ERASE Timing

Figure 8. ERAL Timing

Note: Valid only at VCC = 4.5V to 5.5V

HIGH IMPEDANCE BUSY

READY

1 0 0 1 ... D

... D00

1 1 ...1

DI A

N-1

N-2

CHECK

STATUS

STANDBY

READY

BUSY

HIGH IMPEDANCE HIGH IMPEDANCE

DI 1 1000

HIGH IMPEDANCE HIGH IMPEDANCE

READY

BUSY

CHECK

STATUS

STANDBY

AT93C56A/66A [Preliminary]

5091A–SEEPR–10/04

AT93C56A Ordering Information

Ordering Code Package Operation Range

AT93C56A-10PE-2.7

AT93C56A-10SE-2.7

8P3

8S1

Extended Temperature

(−40°C to 125°C)

AT93C56A-10PQ-2.7

AT93C56A-10SQ-2.7

AT93C56A-10TQ-2.7

8P3

8S1

8A2

Lead-free/Halogen-free/

Extended Temperature

(−40°C to 125°C)

Package Type

8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)

8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8A2 8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)

Options

−2.7 Low Voltage (2.7V to 5.5V)

10 AT93C56A/66A [Preliminary]

5091A–SEEPR–10/04

AT93C66A Ordering Information

Ordering Code Package Operation Range

AT93C66A-10PE-2.7

AT93C66A-10SE-2.7

8P3

8S1

Extended Temperature

(−40°C to 125°C)

AT93C66A-10PQ-2.7

AT93C66A-10SQ-2.7

AT93C66A-10TQ-2.7

8P3

8S1

8A2

Lead-free/Halogen-free/

Extended Temperature

(−40°C to 125°C)

Package Type

8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)

8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8A2 8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)

Options

−2.7 Low Voltage (2.7V to 5.5V)

AT93C56A/66A [Preliminary]

5091A–SEEPR–10/04

Packaging Information

8P3 – PDIP

2325 Orchard Parkway

San Jose, CA 95131

TITLE DRAWING NO.

REV.

8P3, 8-lead, 0.300" Wide Body, Plastic Dual

In-line Package (PDIP)

01/09/02

8P3B

Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA, for additional information.

2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.

3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.

4. E and eA measured with the leads constrained to be perpendicular to datum.

5. Pointed or rounded lead tips are preferred to ease insertion.

6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).

COMMON DIMENSIONS

(Unit of Measure = inches)

SYMBOL MIN NOM MAX NOTE

A2 A

4 PLCS

–

0.210 2

A2 0.115 0.130 0.195

b 0.014 0.018 0.022 5

b2 0.045 0.060 0.070 6

b3 0.030 0.039 0.045 6

c 0.008 0.010 0.014

D 0.355 0.365 0.400 3

D1 0.005

–

E 0.300 0.310 0.325 4

E1 0.240 0.250 0.280 3

e 0.100 BSC

eA 0.300 BSC 4

L 0.115 0.130 0.150 2

Top View

Side View

End View

12 AT93C56A/66A [Preliminary]

5091A–SEEPR–10/04

1150 E. Cheyenne Mtn. Blvd.

Colorado Springs, CO 80906

TITLE DRAWING NO.

REV.

Note:

10/7/03

8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing

Small Outline (JEDEC SOIC) 8S1 B

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL MIN NOM MAX NOTE

A1 0.10 – 0.25

These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.

A 1.35 – 1.75

b 0.31 – 0.51

C 0.17 – 0.25

D 4.80 – 5.00

E1 3.81 – 3.99

E 5.79 – 6.20

e 1.27 BSC

L 0.40 – 1.27

∅ 0° – 8°

∅

Top View

End View

Side View

8S1 – JEDEC SOIC

AT93C56A/66A [Preliminary]

5091A–SEEPR–10/04

2325 Orchard Parkway

San Jose, CA 95131

TITLE DRAWING NO.

REV.

5/30/02

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL MIN NOM MAX NOTE

D 2.90 3.00 3.10 2, 5

E 6.40 BSC

E1 4.30 4.40 4.50 3, 5

A – – 1.20

A2 0.80 1.00 1.05

b 0.19 – 0.30 4

e 0.65 BSC

L 0.45 0.60 0.75

L1 1.00 REF

8A2, 8-lead, 4.4 mm Body, Plastic

Thin Shrink Small Outline Package (TSSOP)

Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,

datums, etc.

2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed

0.15 mm (0.006 in) per side.

3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm

(0.010 in) per side.

4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the

b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between

protrusion and adjacent lead is 0.07 mm.

5. Dimension D and E1 to be determined at Datum Plane H.

8A2 B

Side View

End View

Top View

123

Pin 1 indicator

this corner

8A2 − TSSOP

Printed on recycled paper.

5091A–SEEPR–10/04

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