- Patented Trench Schottky technology
- Excellent high temperature stability
- Low forward voltage
- Lower power loss/ high efficiency
- High forward surge capability
- Ideal for automated placement
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Packing code with suffix "G" means green compound (halogen-free)
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
SYMBOL UNIT
V
RRM
V
I
F(AV)
A
I
F
= 5A
I
F
= 10A
I
F
= 10A T
J
= 125°C
T
J
= 25°C μA
T
J
= 125°C mA
V
DC
V
R
θJL
°C/W
T
J
°C
T
STG
°C
Document Number: DS_D1411029 Version: E15
Note 1: Pulse Test with Pulse Width=300 μs, 1% Duty Cycle
10A, 60V Trench Schottky Rectifier
TSP10U60S
Taiwan Semiconductor
FEATURES
MECHANICAL DATA
Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
TO-277A (SMPC)
Case: TO-277A (SMPC)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25°C unless otherwise noted)
PARAMETER TSP10U60S
Polarity: Indicated by cathode band
Weight: 0.095g (approximately)
60
Maximum average forward rectified current 10
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load I
FSM
280
Maximum repetitive peak reverse voltage
-
A
-0.40 -
0.43 0.47
V
MAX
0.47
- 55 to +150
Maximum instantaneous reverse current
at rated reverse voltage I
R
- 300
- - 100
-
Storage temperature range - 55 to +150
Maximum DC reverse voltage 42
5Typical thermal resistance
80
Operating junction temperature range
0.54
Marking code 10U60
Maximum instantaneous forward voltage
(Note 1) T
J
= 25°C
MIN TYP
V
F
PART NO.
Note: Whole series with green compound
(T
A
=25
o
C unless otherwise noted)
Document Number: DS_D1411029 Version: E15
PACKING CODE
SUFFIX
PACKING
TSP10U60S S1G TSP10U60S S1 G Green compound
6,000/ 13" Plastic reel
PREFERRED
PART NO. PART NO. PACKING CODE
S1 GSMPC
S2 SMPC
1,500/ 7" Plastic reel
RATINGS AND CHARACTERISTICS CURVES
EXAMPLE
TSP10U60S
Taiwan Semiconductor
TSP10U60S
ORDERING INFORMATION
PACKING CODE PACKING CODE
SUFFIX
DESCRIPTION
PACKAGE
0.01
0.1
1
10
100
10 20 30 40 50 60 70 80 90 100
TJ=25oC
TJ=100oC
T
J
=125oC
100
1000
10000
0.1 1 10 100
f=1.0MHz
Vsig=50mVp-p
0.01
0.1
1
10
100
0 0.1 0.2 0.3 0.4 0.5 0.6
TJ=25oC
TJ=125oC
TJ=150oC
TJ=100oC
FIG. 2 TYPICAL FORWARD CHARACTERISTICS
0
5
10
15
20
0 25 50 75 100 125 150
WITH HEATSINK
30mm x 30mm 4 oz.
pad PCB
FIG.1 FORWARD CURRENT DERATING CURVE
AVERAGE FORWARD CURRENT (A)
INSTANTANEOUS FORWARD CURRENT (A)
CAPACITANCE (pF)
INSTANTANEOUS REVERSE CURRENT (mA)
FIG. 4 TYPICAL JUNCTION CAPACITANCE
FIG. 3 TYPICAL REVERSE CHARACTERISTICS
LEAD TEMPERATURE (oC) FORWARD VOLTAGE (V)
REVERSE VOLTAGE (V)PERCENT OF RATED PEAK REVERSE VOLTAGE.(%)
TJ=85oC
TJ=85oC
TJ=150oC
Document Number: DS_D1411029 Version: E15
TSP10U60S
Taiwan Semiconductor
0
30
60
90
120
150
180
210
240
270
300
1 10 100
PEAK FORWARD SURGE CURRENT (A)
FIG. 5 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
NUMBER OF CYCLES AT 60 Hz
8.3ms Single Half Sine Wave
Min Max Min Max
A 5.650 5.750 0.222 0.226
B 6.350 6.650 0.250 0.262
C 4.550 4.650 0.179 0.183
D 3.540 3.840 0.139 0.151
E 4.235 4.535 0.167 0.179
F 1.850 2.150 0.073 0.085
G 3.170 3.470 0.125 0.137
H 1.043 1.343 0.041 0.053
I 1.000 1.300 0.039 0.051
J 1.930 2.230 0.076 0.088
K 0.175 0.325 0.007 0.013
L 1.000 1.200 0.039 0.047
Symbol
A
B
C
D
E
F
P/N = Marking Code
YW = Date Code
F = Factory Code
Document Number: DS_D1411029 Version: E15
TSP10U60S
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
SUGG ESTED PAD LAYOUT
0.050
MARKING DIAGRAM
4.72
1.40
Unit (inch)
0.189
1.27
1.04
0.186
0.055
6.80 0.268
0.041
TO-277A (SMPC)
DIM. Unit (mm) Unit (inch)
Unit (mm)
4.80
CREAT BY ART
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1411029 Version: E15
TSP10U60S
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
