CPC1727 Single-Pole, Normally Open ISOPLUSTM-264 DC Power Relay INTEGRATED CIRCUITS DIVISION Characteristics Parameter Description Rating Units 250 VP Blocking Voltage IXYS Integrated Circuits Division and IXYS have combined to bring OptoMOS(R) technology, reliability and compact size to a new family of high-power Solid State Relays. Load Current, TA=25C: With 5C/W Heat Sink 8.6 No Heat Sink 3.4 As part of this family, the CPC1727 single-pole normally open (1-Form-A) DC Solid State Power Relay employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. ADC On-Resistance (max) 0.09 RJC 0.3 C/W Features * * * * * * * * * * 8.6ADC Load Current with 5C/W Heat Sink Low 0.09 On-Resistance 250VP Blocking Voltage 2500Vrms Input/Output Isolation Low Thermal Resistance (0.3 C/W) Electrically Non-Conductive Thermal Pad for Heat Sink Applications Low Drive Power Requirements Arc-Free With No Snubbing Circuits No EMI/RFI Generation Machine Insertable, Wave Solderable Applications * * * * Industrial Controls / Motor Control Robotics Medical Equipment--Patient/Equipment Isolation Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Meters (Watt-Hour, Water, Gas) * Transportation Equipment * Aerospace/Defense Approvals The optically coupled outputs, that use patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance DC switching applications. The unique ISOPLUS-264 package pioneered by IXYS enables Solid State Relays to achieve the highest load current and power ratings. This package features a unique IXYS process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation, but also very low thermal resistance (0.3 C/W). Ordering Information Part Description CPC1727J ISOPLUS-264 Package (25 per tube) Switching Characteristics * UL 508 Certified Component: File E69938 * CSA Certified Component: Certificate 1172007 Form-A Pin Configuration IF 90% 1 2 + 3 - - 10% ILOAD 4 ton + toff e3 DS-CPC1727-R04 www.ixysic.com 1 CPC1727 INTEGRATED CIRCUITS DIVISION 1 Specifications 1.1 Absolute Maximum Ratings @ 25C Symbol Blocking Voltage Ratings Units 250 VP Reverse Input Voltage 5 V Input Control Current 100 mA 1 A 150 mW Peak (10ms) Input Power Dissipation Isolation Voltage, Input to Output 2500 Vrms Operational Temperature -40 to +85 C Storage Temperature -40 to +125 C Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. 1.2 Electrical Characteristics @ 25C Parameter Conditions Symbol Minimum Typical Maximum Units 30 AP Output Characteristics Load Current 1 Peak Continuous Continuous Continuous 2 On-Resistance Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Input/Output Characteristics Input-to-Output Capacitance t10ms No Heat Sink TC=25C IL TC=99C IL(99) IF=10mA, IL=1A RON - 0.0675 0.09 VL=250VP ILEAK - - 1 A ton - 5.5 20 toff - 0.125 5 VL=25V, f=1MHz Cout - 700 - pF IL=1A IF - - 10 mA IF=5mA IF 0.6 - - mA VF 0.9 1.2 1.4 V VR=5V IR - - 10 A - CI/O - 1 - pF IF=20mA, VL=10V - - 3.4 20 ADC 4.2 ms 1 Higher load currents possible with proper heat sinking. Measurement taken within 1 second of on-time. 3 For applications requiring high temperature operation (> 60C) a LED drive current of 20mA is recommended. 2 R04 www.ixysic.com 2 CPC1727 INTEGRATED CIRCUITS DIVISION 2 Thermal Characteristics Parameter Thermal Resistance (Junction to Case) Thermal Resistance (Junction to Ambient) Junction Temperature (Operating) Conditions Symbol Minimum Typical Maximum Units - RJC - - 0.3 C/W Free Air RJA - 33 - C/W - TJ -40 - 100 C 2.1 Thermal Management Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient thermal resistance of 12.5C/W. 2.2 Heat Sink Calculation Higher load currents are possible by using lower thermal resistance heat sink combinations. Heat Sink Rating RCA = (TJ - TA) IL(99)2 IL2 * PD(99) - RJC TJ = Junction Temperature (C), TJ 100C * TA = Ambient Temperature (C) IL(99) = Load Current with Case Temperature @ 99C (ADC) IL = Desired Operating Load Current (ADC), IL IL(MAX) RJC = Thermal Resistance, Junction to Case (C/W) = 0.3C/W RCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (C/W) PD(99) = Maximum power dissipation with case temperature held at 99C = 3.33W * Elevated junction temperature reduces semiconductor lifetime. 3 www.ixysic.com R04 CPC1727 INTEGRATED CIRCUITS DIVISION 3 Performance Data Typical Turn-Off Time (N=50, IF=20mA, IL=1ADC, TA=25C) Typical Turn-On Time (N=50, IF=20mA, IL=1ADC, TA=25C) 25 Device Count (N) 25 20 15 10 5 15 10 5 4.50 20 15 10 5.25 6.00 6.75 0 7.50 0.095 0.105 0.115 0.125 0.135 0.145 0.0575 0.0600 0.0625 0.0650 0.0675 0.0700 Turn-On (ms) Turn-Off (ms) On-Resistance () Typical LED Forward Voltage Drop (N=50, IF=10mA, IL=1ADC, TA=25C) Typical Turn-On vs. LED Forward Current (IL=1ADC, TA=25C) Typical Turn-Off vs. LED Forward Current (IL=1ADC, TA=25C) 30 Turn-On (ms) 25 20 15 10 5 0 1.30 1.31 1.32 1.33 0.18 12 11 10 9 8 7 6 5 4 3 2 1 0 0.16 0.14 Turn-Off (ms) 35 0.12 0.10 0.08 0.06 0.04 0.02 0.00 0 1.34 5 10 15 20 25 30 35 40 45 0 50 5 10 15 20 25 30 35 40 LED Forward Current (mA) LED Forward Current (mA) Typical LED Forward Voltage Drop vs. Temperature Typical Turn-On vs. Temperature (IL=1ADC) Typical Turn-Off vs. Temperature (IL=1ADC) 14 1.8 1.4 I F =50mA I F =20mA I F =10mA 1.2 Turn-On (ms) 1.6 1.0 0.16 I F = 10mA 12 10 I F = 20mA 8 6 4 2 -20 0 20 40 60 80 100 -20 0 0 20 40 60 Temperature (C) 0.06 20 40 60 80 100 IF = 10mA -40 -20 80 100 0 20 40 60 80 100 Temperature (C) Maximum Load Current vs. Temperature with Heatsink 20 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 1C/W Load Current (ADC) Load Current (A) -20 IF = 20mA 0.08 Typical Load Current vs. Load Voltage (IF=10mA, TA=25C) Typical IF for Switch Operation vs. Temperature (IL=1ADC) -40 0.10 Temperature (C) Temperature (C) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0.12 0.02 -40 120 0.14 0.04 0 0.8 50 45 LED Forward Voltage (V) -40 LED Current (mA) 25 5 3.75 Device Count (N) 30 20 0 0 LED Forward Voltage Drop (V) 35 Turn-Off (ms) Device Count (N) 30 Device Count (N) 35 Typical On-Resistance Distribution (N=50, IF=10mA, IL=1ADC, TA=25C) 15 10 5C/W 10C/W 5 Free Air 0 0 0.05 0.10 0.15 0.20 0.25 0.30 0 Load Voltage (V) 20 40 60 Temperature (C) 80 100 Unless otherwise specified, all performance data was acquired without the use of a heat sink. The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R04 www.ixysic.com 4 CPC1727 INTEGRATED CIRCUITS DIVISION Typical On-Resistance vs. Temperature (IF=10mA, IL=1ADC) Blocking Voltage vs. Temperature Blocking Voltage (VP) On-Resistance () 0.16 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0 -40 -20 0 20 40 60 80 290 0.7 285 0.6 280 0.5 275 270 265 260 100 0.4 0.3 0.2 0.1 255 250 -40 Temperature (C) Leakage (A) 0.18 Typical Leakage vs. Temperature Measured Across Pins 1&2 (VL=250VP) 0 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 Temperature (C) Temperature (C) Load Current (A) Energy Rating Curve Free Air, No Heatsink 33 30 27 24 21 18 15 12 9 6 3 0 10s 100s 1ms 10ms 100ms Time 1s 10s 100s Unless otherwise specified, all performance data was acquired without the use of a heat sink. The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 5 www.ixysic.com R04 CPC1727 INTEGRATED CIRCUITS DIVISION 4 Manufacturing Information 4.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1727J MSL 1 4.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 4.3 Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1727J 245C for 30 seconds 4.4 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake may be necessary if a wash is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. e3 R04 www.ixysic.com 6 CPC1727 INTEGRATED CIRCUITS DIVISION 4.5 Mechanical Dimensions 5.029 0.127 (0.198 0.005) 1.181 0.076 (0.047 0.003) 19.914 0.254 (0.784 0.010) 1.930 0.381 (0.076 0.015) 26.162 0.254 (1.030 0.010) 20.396 0.508 (0.803 0.020) 20.600 0.254 (0.811 0.010) 2.362 0.381 (0.093 0.015) DIMENSIONS mm (inches) 3.810 0.254 (0.150 0.010) 15.240 0.508 (0.600 0.020) 17.221 0.254 (0.678 0.010) 0.635 0.076 (0.025 0.003) 2.794 0.127 (0.110 0.005) 1.270 TYP (0.050 TYP) NOTE: Back-side heat sink meets 2500Vrms isolation to the pins. For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division's Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1727-R04 (c)Copyright 2012, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/17/2012 7 www.ixysic.com R04