Freescale Semiconductor Data Sheet: Technical Data Document Number: K10P81M72SF1 Rev. 2, 4/2012 K10P81M72SF1 K10 Sub-Family Supports: MK10DX64VLK7, MK10DX128VLK7, MK10DX256VLK7, MK10DX64VMB7, MK10DX128VMB7, MK10DX256VMB7 Features * Operating Characteristics - Voltage range: 1.71 to 3.6 V - Flash write voltage range: 1.71 to 3.6 V - Temperature range (ambient): -40 to 105C * Clocks - 3 to 32 MHz crystal oscillator - 32 kHz crystal oscillator - Multi-purpose clock generator * System peripherals - 10 low-power modes to provide power optimization based on application requirements - 16-channel DMA controller, supporting up to 63 request sources - External watchdog monitor - Software watchdog - Low-leakage wakeup unit * Security and integrity modules - Hardware CRC module to support fast cyclic redundancy checks - 128-bit unique identification (ID) number per chip * Human-machine interface - Low-power hardware touch sensor interface (TSI) - General-purpose input/output * Analog modules - Two 16-bit SAR ADCs - Programmable gain amplifier (PGA) (up to x64) integrated into each ADC - 12-bit DAC - Three analog comparators (CMP) containing a 6-bit DAC and programmable reference input - Voltage reference * Timers - Programmable delay block - Eight-channel motor control/general purpose/PWM timer - Two 2-channel quadrature decoder/general purpose timers - Periodic interrupt timers - 16-bit low-power timer - Carrier modulator transmitter - Real-time clock * Communication interfaces - Controller Area Network (CAN) module - Two SPI modules - Two I2C modules - Four UART modules - I2S module Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. (c) 2012 Freescale Semiconductor, Inc. Table of Contents 1 Ordering parts...........................................................................3 5.4.2 Thermal attributes.................................................21 1.1 Determining valid orderable parts......................................3 6 Peripheral operating requirements and behaviors....................22 2 Part identification......................................................................3 6.1 Core modules....................................................................22 2.1 Description.........................................................................3 6.1.1 Debug trace timing specifications.........................22 2.2 Format...............................................................................3 6.1.2 JTAG electricals....................................................23 2.3 Fields.................................................................................3 6.2 System modules................................................................25 2.4 Example............................................................................4 6.3 Clock modules...................................................................25 3 Terminology and guidelines......................................................4 6.3.1 MCG specifications...............................................25 3.1 Definition: Operating requirement......................................4 6.3.2 Oscillator electrical specifications.........................28 3.2 Definition: Operating behavior...........................................5 6.3.3 32kHz Oscillator Electrical Characteristics............30 3.3 Definition: Attribute............................................................5 6.4 Memories and memory interfaces.....................................31 3.4 Definition: Rating...............................................................6 6.4.1 Flash electrical specifications................................31 3.5 Result of exceeding a rating..............................................6 6.4.2 EzPort Switching Specifications............................35 3.6 Relationship between ratings and operating 6.4.3 Flexbus Switching Specifications..........................36 requirements......................................................................6 6.5 Security and integrity modules..........................................39 3.7 Guidelines for ratings and operating requirements............7 6.6 Analog...............................................................................39 3.8 Definition: Typical value.....................................................7 6.6.1 ADC electrical specifications.................................39 3.9 Typical value conditions....................................................8 6.6.2 CMP and 6-bit DAC electrical specifications.........48 4 Ratings......................................................................................9 6.6.3 12-bit DAC electrical characteristics.....................50 4.1 Thermal handling ratings...................................................9 6.6.4 Voltage reference electrical specifications............53 4.2 Moisture handling ratings..................................................9 6.7 Timers................................................................................54 4.3 ESD handling ratings.........................................................9 6.8 Communication interfaces.................................................55 4.4 Voltage and current operating ratings...............................9 6.8.1 CAN switching specifications................................55 5 General.....................................................................................10 6.8.2 DSPI switching specifications (limited voltage 5.1 AC electrical characteristics..............................................10 5.2 Nonswitching electrical specifications...............................10 range)....................................................................55 6.8.3 DSPI switching specifications (full voltage range).56 5.2.1 Voltage and current operating requirements.........10 6.8.4 I2C switching specifications..................................58 5.2.2 LVD and POR operating requirements.................12 6.8.5 UART switching specifications..............................58 5.2.3 Voltage and current operating behaviors..............12 6.8.6 I2S/SAI Switching Specifications..........................58 5.2.4 Power mode transition operating behaviors..........13 5.2.5 Power consumption operating behaviors..............14 5.2.6 Designing with radiated emissions in mind...........18 7 Dimensions...............................................................................64 5.2.7 Capacitance attributes..........................................18 7.1 Obtaining package dimensions.........................................64 5.3 Switching specifications.....................................................19 8 Pinout........................................................................................64 6.9 Human-machine interfaces (HMI)......................................63 6.9.1 TSI electrical specifications...................................63 5.3.1 Device clock specifications...................................19 8.1 K10 Signal Multiplexing and Pin Assignments..................64 5.3.2 General switching specifications...........................19 8.2 K10 Pinouts.......................................................................69 5.4 Thermal specifications.......................................................20 9 Revision History........................................................................71 5.4.1 Thermal operating requirements...........................20 K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 2 Freescale Semiconductor, Inc. Ordering parts 1 Ordering parts 1.1 Determining valid orderable parts Valid orderable part numbers are provided on the web. To determine the orderable part numbers for this device, go to http://www.freescale.com and perform a part number search for the following device numbers: PK10 and MK10 . 2 Part identification 2.1 Description Part numbers for the chip have fields that identify the specific part. You can use the values of these fields to determine the specific part you have received. 2.2 Format Part numbers for this device have the following format: Q K## A M FFF R T PP CC N 2.3 Fields This table lists the possible values for each field in the part number (not all combinations are valid): Field Description Values Q Qualification status * M = Fully qualified, general market flow * P = Prequalification K## Kinetis family * K10 A Key attribute * D = Cortex-M4 w/ DSP * F = Cortex-M4 w/ DSP and FPU M Flash memory type * N = Program flash only * X = Program flash and FlexMemory Table continues on the next page... K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 3 Terminology and guidelines Field Description Values FFF Program flash memory size * * * * * * 32 = 32 KB 64 = 64 KB 128 = 128 KB 256 = 256 KB 512 = 512 KB 1M0 = 1 MB R Silicon revision * Z = Initial * (Blank) = Main * A = Revision after main T Temperature range (C) * V = -40 to 105 * C = -40 to 85 PP Package identifier * * * * * * * * * * * * * FM = 32 QFN (5 mm x 5 mm) FT = 48 QFN (7 mm x 7 mm) LF = 48 LQFP (7 mm x 7 mm) LH = 64 LQFP (10 mm x 10 mm) MP = 64 MAPBGA (5 mm x 5 mm) LK = 80 LQFP (12 mm x 12 mm) MB = 81 MAPBGA (8 mm x 8 mm) LL = 100 LQFP (14 mm x 14 mm) ML = 104 MAPBGA (8 mm x 8 mm) MC = 121 MAPBGA (8 mm x 8 mm) LQ = 144 LQFP (20 mm x 20 mm) MD = 144 MAPBGA (13 mm x 13 mm) MJ = 256 MAPBGA (17 mm x 17 mm) CC Maximum CPU frequency (MHz) * * * * * 5 = 50 MHz 7 = 72 MHz 10 = 100 MHz 12 = 120 MHz 15 = 150 MHz N Packaging type * R = Tape and reel * (Blank) = Trays 2.4 Example This is an example part number: MK10DN512ZVMD10 3 Terminology and guidelines K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 4 Freescale Semiconductor, Inc. Terminology and guidelines 3.1 Definition: Operating requirement An operating requirement is a specified value or range of values for a technical characteristic that you must guarantee during operation to avoid incorrect operation and possibly decreasing the useful life of the chip. 3.1.1 Example This is an example of an operating requirement, which you must meet for the accompanying operating behaviors to be guaranteed: Symbol VDD Description 1.0 V core supply voltage Min. 0.9 Max. 1.1 Unit V 3.2 Definition: Operating behavior An operating behavior is a specified value or range of values for a technical characteristic that are guaranteed during operation if you meet the operating requirements and any other specified conditions. 3.2.1 Example This is an example of an operating behavior, which is guaranteed if you meet the accompanying operating requirements: Symbol IWP Description Digital I/O weak pullup/ 10 pulldown current Min. Max. 130 Unit A 3.3 Definition: Attribute An attribute is a specified value or range of values for a technical characteristic that are guaranteed, regardless of whether you meet the operating requirements. K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 5 Terminology and guidelines 3.3.1 Example This is an example of an attribute: Symbol CIN_D Description Input capacitance: digital pins Min. -- Max. 7 Unit pF 3.4 Definition: Rating A rating is a minimum or maximum value of a technical characteristic that, if exceeded, may cause permanent chip failure: * Operating ratings apply during operation of the chip. * Handling ratings apply when the chip is not powered. 3.4.1 Example This is an example of an operating rating: Symbol VDD Description 1.0 V core supply voltage Min. -0.3 Max. 1.2 Unit V 3.5 Result of exceeding a rating Failures in time (ppm) 40 30 The likelihood of permanent chip failure increases rapidly as soon as a characteristic begins to exceed one of its operating ratings. 20 10 0 Operating rating Measured characteristic K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 6 Freescale Semiconductor, Inc. Terminology and guidelines 3.6 Relationship between ratings and operating requirements e Op ing rat r ( ng ati in. t (m ) n. mi rat e Op ing ) t (m e ir qu re n me ing rat e Op ax .) e ir qu re n me ing rat e Op ng ati ax (m .) r Fatal range Degraded operating range Normal operating range Degraded operating range Fatal range Expected permanent failure - No permanent failure - Possible decreased life - Possible incorrect operation - No permanent failure - Correct operation - No permanent failure - Possible decreased life - Possible incorrect operation Expected permanent failure - Operating (power on) g lin nd Ha in rat n.) mi g( nd Ha g lin ing rat ax (m .) Fatal range Handling range Fatal range Expected permanent failure No permanent failure Expected permanent failure - Handling (power off) 3.7 Guidelines for ratings and operating requirements Follow these guidelines for ratings and operating requirements: * Never exceed any of the chip's ratings. * During normal operation, don't exceed any of the chip's operating requirements. * If you must exceed an operating requirement at times other than during normal operation (for example, during power sequencing), limit the duration as much as possible. 3.8 Definition: Typical value A typical value is a specified value for a technical characteristic that: * Lies within the range of values specified by the operating behavior * Given the typical manufacturing process, is representative of that characteristic during operation when you meet the typical-value conditions or other specified conditions Typical values are provided as design guidelines and are neither tested nor guaranteed. K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 7 Terminology and guidelines 3.8.1 Example 1 This is an example of an operating behavior that includes a typical value: Symbol Description IWP Digital I/O weak pullup/pulldown current Min. 10 Typ. 70 Max. 130 Unit A 3.8.2 Example 2 This is an example of a chart that shows typical values for various voltage and temperature conditions: 5000 4500 4000 TJ IDD_STOP (A) 3500 150 C 3000 105 C 2500 25 C 2000 -40 C 1500 1000 500 0 0.90 0.95 1.00 1.05 1.10 VDD (V) 3.9 Typical value conditions Typical values assume you meet the following conditions (or other conditions as specified): Symbol Description Value Unit TA Ambient temperature 25 C VDD 3.3 V supply voltage 3.3 V K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 8 Freescale Semiconductor, Inc. Ratings 4 Ratings 4.1 Thermal handling ratings Symbol Description Min. Max. Unit Notes TSTG Storage temperature -55 150 C 1 TSDR Solder temperature, lead-free -- 260 C 2 1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life. 2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 4.2 Moisture handling ratings Symbol MSL Description Moisture sensitivity level Min. Max. Unit Notes -- 3 -- 1 1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 4.3 ESD handling ratings Symbol Description Min. Max. Unit Notes VHBM Electrostatic discharge voltage, human body model -2000 +2000 V 1 VCDM Electrostatic discharge voltage, charged-device model -500 +500 V 2 Latch-up current at ambient temperature of 105C -100 +100 mA ILAT 1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM). 2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components. 4.4 Voltage and current operating ratings Symbol VDD Description Min. Max. Unit Digital supply voltage -0.3 3.8 V Table continues on the next page... K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 9 General Symbol IDD Description Digital supply current Min. Max. Unit -- 185 mA VDIO Digital input voltage (except RESET, EXTAL, and XTAL) -0.3 5.5 V VAIO Analog1, RESET, EXTAL, and XTAL input voltage -0.3 VDD + 0.3 V Maximum current single pin limit (applies to all port pins) -25 25 mA VDD - 0.3 VDD + 0.3 V -0.3 3.8 V ID VDDA Analog supply voltage VBAT RTC battery supply voltage 1. Analog pins are defined as pins that do not have an associated general purpose I/O port function. 5 General 5.1 AC electrical characteristics Unless otherwise specified, propagation delays are measured from the 50% to the 50% point, and rise and fall times are measured at the 20% and 80% points, as shown in the following figure. Figure 1. Input signal measurement reference All digital I/O switching characteristics assume: 1. output pins * have CL=30pF loads, * are configured for fast slew rate (PORTx_PCRn[SRE]=0), and * are configured for high drive strength (PORTx_PCRn[DSE]=1) 2. input pins * have their passive filter disabled (PORTx_PCRn[PFE]=0) 5.2 Nonswitching electrical specifications K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 10 Freescale Semiconductor, Inc. General 5.2.1 Voltage and current operating requirements Table 1. Voltage and current operating requirements Symbol Description Min. Max. Unit VDD Supply voltage 1.71 3.6 V VDDA Analog supply voltage 1.71 3.6 V VDD - VDDA VDD-to-VDDA differential voltage -0.1 0.1 V VSS - VSSA VSS-to-VSSA differential voltage -0.1 0.1 V 1.71 3.6 V * 2.7 V VDD 3.6 V 0.7 x VDD -- V * 1.7 V VDD 2.7 V 0.75 x VDD -- V * 2.7 V VDD 3.6 V -- 0.35 x VDD V * 1.7 V VDD 2.7 V -- 0.3 x VDD V 0.06 x VDD -- V -5 -- mA VBAT VIH VIL RTC battery supply voltage Input high voltage Input low voltage VHYS Input hysteresis IICDIO Digital pin negative DC injection current -- single pin * VIN < VSS-0.3V IICAIO IICcont 3 mA * VIN < VSS-0.3V (Negative current injection) -5 -- * VIN > VDD+0.3V (Positive current injection) -- +5 -25 -- -- +25 1.2 -- V VPOR_VBAT -- V Contiguous pin DC injection current --regional limit, includes sum of negative injection currents or sum of positive injection currents of 16 contiguous pins * Positive current injection VRFVBAT 1 Analog2, EXTAL, and XTAL pin DC injection current -- single pin * Negative current injection VRAM Notes VDD voltage required to retain RAM VBAT voltage required to retain the VBAT register file mA 1. All 5 V tolerant digital I/O pins are internally clamped to VSS through a ESD protection diode. There is no diode connection to VDD. If VIN greater than VDIO_MIN (=VSS-0.3V) is observed, then there is no need to provide current limiting resistors at the pads. If this limit cannot be observed then a current limiting resistor is required. The negative DC injection current limiting resistor is calculated as R=(VDIO_MIN-VIN)/|IIC|. 2. Analog pins are defined as pins that do not have an associated general purpose I/O port function. 3. All analog pins are internally clamped to VSS and VDD through ESD protection diodes. If VIN is greater than VAIO_MIN (=VSS-0.3V) and VIN is less than VAIO_MAX(=VDD+0.3V) is observed, then there is no need to provide current limiting resistors at the pads. If these limits cannot be observed then a current limiting resistor is required. The negative DC injection current limiting resistor is calculated as R=(VAIO_MIN-VIN)/|IIC|. The positive injection current limiting resistor is calcualted as R=(VIN-VAIO_MAX)/|IIC|. Select the larger of these two calculated resistances. K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 11 General 5.2.2 LVD and POR operating requirements Table 2. VDD supply LVD and POR operating requirements Symbol Description Min. Typ. Max. Unit VPOR Falling VDD POR detect voltage 0.8 1.1 1.5 V VLVDH Falling low-voltage detect threshold -- high range (LVDV=01) 2.48 2.56 2.64 V Low-voltage warning thresholds -- high range 1 VLVW1H * Level 1 falling (LVWV=00) 2.62 2.70 2.78 V VLVW2H * Level 2 falling (LVWV=01) 2.72 2.80 2.88 V VLVW3H * Level 3 falling (LVWV=10) 2.82 2.90 2.98 V VLVW4H * Level 4 falling (LVWV=11) 2.92 3.00 3.08 V -- 80 -- mV 1.54 1.60 1.66 V VHYSH Low-voltage inhibit reset/recover hysteresis -- high range VLVDL Falling low-voltage detect threshold -- low range (LVDV=00) Low-voltage warning thresholds -- low range 1 VLVW1L * Level 1 falling (LVWV=00) 1.74 1.80 1.86 V VLVW2L * Level 2 falling (LVWV=01) 1.84 1.90 1.96 V VLVW3L * Level 3 falling (LVWV=10) 1.94 2.00 2.06 V VLVW4L * Level 4 falling (LVWV=11) 2.04 2.10 2.16 V -- 60 -- mV VHYSL Low-voltage inhibit reset/recover hysteresis -- low range Notes VBG Bandgap voltage reference 0.97 1.00 1.03 V tLPO Internal low power oscillator period -- factory trimmed 900 1000 1100 s 1. Rising thresholds are falling threshold + hysteresis voltage Table 3. VBAT power operating requirements Symbol Description VPOR_VBAT Falling VBAT supply POR detect voltage Min. Typ. Max. Unit 0.8 1.1 1.5 V Notes K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 12 Freescale Semiconductor, Inc. General 5.2.3 Voltage and current operating behaviors Table 4. Voltage and current operating behaviors Symbol Min. Max. Unit * 2.7 V VDD 3.6 V, IOH = -9mA VDD - 0.5 -- V * 1.71 V VDD 2.7 V, IOH = -3mA VDD - 0.5 -- V * 2.7 V VDD 3.6 V, IOH = -2mA VDD - 0.5 -- V * 1.71 V VDD 2.7 V, IOH = -0.6mA VDD - 0.5 -- V -- 100 mA * 2.7 V VDD 3.6 V, IOL = 9mA -- 0.5 V * 1.71 V VDD 2.7 V, IOL = 3mA -- 0.5 V * 2.7 V VDD 3.6 V, IOL = 2mA -- 0.5 V * 1.71 V VDD 2.7 V, IOL = 0.6mA -- 0.5 V Output low current total for all ports -- 100 mA IIN Input leakage current (per pin) for full temperature range -- 1 A 1 IIN Input leakage current (per pin) at 25C -- 0.025 A 1 IOZ Hi-Z (off-state) leakage current (per pin) -- 1 A RPU Internal pullup resistors 20 50 k 2 RPD Internal pulldown resistors 20 50 k 3 VOH Description Notes Output high voltage -- high drive strength Output high voltage -- low drive strength IOHT Output high current total for all ports VOL Output low voltage -- high drive strength Output low voltage -- low drive strength IOLT 1. Measured at VDD=3.6V 2. Measured at VDD supply voltage = VDD min and Vinput = VSS 3. Measured at VDD supply voltage = VDD min and Vinput = VDD 5.2.4 Power mode transition operating behaviors All specifications except tPOR, and VLLSxRUN recovery times in the following table assume this clock configuration: * * * * CPU and system clocks = 72 MHz Bus clock = 36 MHz FlexBus clock = 36 MHz Flash clock = 24 MHz K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 13 General Table 5. Power mode transition operating behaviors Symbol tPOR Description After a POR event, amount of time from the point VDD reaches 1.71 V to execution of the first instruction across the operating temperature range of the chip. * VLLS1 RUN * VLLS2 RUN * VLLS3 RUN * LLS RUN * VLPS RUN * STOP RUN Min. Max. Unit Notes -- 300 s 1 -- 112 s -- 74 s -- 73 s -- 5.9 s -- 5.8 s -- 4.2 s 1. Normal boot (FTFL_OPT[LPBOOT]=1) 5.2.5 Power consumption operating behaviors Table 6. Power consumption operating behaviors Symbol IDDA IDD_RUN Description Analog supply current Typ. Max. Unit Notes -- -- See note mA 1 Run mode current -- all peripheral clocks disabled, code executing from flash * @ 1.8V * @ 3.0V IDD_RUN Min. 2 -- 21.5 25 mA -- 21.5 30 mA Run mode current -- all peripheral clocks enabled, code executing from flash * @ 1.8V 3, 4 -- 31 34 mA -- 31 34 mA -- 32 39 mA * @ 3.0V * @ 25C * @ 125C IDD_WAIT Wait mode high frequency current at 3.0 V -- all peripheral clocks disabled -- 12.5 -- mA 2 IDD_WAIT Wait mode reduced frequency current at 3.0 V -- all peripheral clocks disabled -- 7.2 -- mA 5 IDD_VLPR Very-low-power run mode current at 3.0 V -- all peripheral clocks disabled -- 0.996 -- mA 6 Table continues on the next page... K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 14 Freescale Semiconductor, Inc. General Table 6. Power consumption operating behaviors (continued) Symbol Description Min. Typ. Max. Unit Notes IDD_VLPR Very-low-power run mode current at 3.0 V -- all peripheral clocks enabled -- 1.46 -- mA 7 IDD_VLPW Very-low-power wait mode current at 3.0 V -- all peripheral clocks disabled -- 0.61 -- mA 8 IDD_STOP Stop mode current at 3.0 V * @ -40 to 25C -- 0.35 0.567 mA * @ 70C -- 0.384 0.793 mA * @ 105C -- 0.628 1.2 mA * @ -40 to 25C -- 5.9 32.7 A * @ 70C -- 26.1 59.8 A * @ 105C -- 98.1 188 A IDD_VLPS IDD_LLS IDD_VLLS3 IDD_VLLS2 IDD_VLLS1 IDD_VBAT Very-low-power stop mode current at 3.0 V Low leakage stop mode current at 3.0 V 9 * @ -40 to 25C -- 2.6 8.6 A * @ 70C -- 10.3 29.1 A * @ 105C -- 42.5 92.5 A Very low-leakage stop mode 3 current at 3.0 V 9 * @ -40 to 25C -- 1.9 5.8 A * @ 70C -- 6.9 12.1 A * @ 105C -- 28.1 41.9 A * @ -40 to 25C -- 1.59 5.5 A * @ 70C -- 4.3 9.5 A * @ 105C -- 17.5 34 A * @ -40 to 25C -- 1.47 5.4 A * @ 70C -- 2.97 8.1 A * @ 105C -- 12.41 32 A -- 0.19 0.22 A -- 0.49 0.64 A -- 2.2 3.2 A Very low-leakage stop mode 2 current at 3.0 V Very low-leakage stop mode 1 current at 3.0 V Average current with RTC and 32kHz disabled at 3.0 V * @ -40 to 25C * @ 70C * @ 105C Table continues on the next page... K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 15 General Table 6. Power consumption operating behaviors (continued) Symbol Description Min. IDD_VBAT Average current when CPU is not accessing RTC registers Typ. Max. Unit Notes 10 * @ 1.8V * @ -40 to 25C * @ 70C * @ 105C -- 0.57 0.67 A -- 0.90 1.2 A -- 2.4 3.5 A -- 0.67 0.94 A -- 1.0 1.4 A -- 2.7 3.9 A * @ 3.0V * @ -40 to 25C * @ 70C * @ 105C 1. The analog supply current is the sum of the active or disabled current for each of the analog modules on the device. See each module's specification for its supply current. 2. 72MHz core and system clock, 36MHz bus and FlexBus clock, and 24MHz flash clock. MCG configured for FEE mode. All peripheral clocks disabled. 3. 72MHz core and system clock, 36MHz bus and FlexBus clock, and 24MHz flash clock. MCG configured for FEE mode. All peripheral clocks enabled. 4. Max values are measured with CPU executing DSP instructions. 5. 25MHz core, system, bus, FlexBus and flash clock. MCG configured for FEI mode. 6. 4 MHz core and system clock, 4 MHz FlexBus and bus clock, and 1 MHz flash clock. MCG configured for BLPE mode. All peripheral clocks disabled. Code executing from flash. 7. 4 MHz core and system clock, 4 MHz FlexBus and bus clock, and 1 MHz flash clock. MCG configured for BLPE mode. All peripheral clocks enabled but peripherals are not in active operation. Code executing from flash. 8. 4 MHz core and system clock, 4 MHz FlexBus and bus clock, and 1 MHz flash clock. MCG configured for BLPE mode. All peripheral clocks disabled. 9. Data reflects devices with 128 KB of RAM. 10. Includes 32kHz oscillator current and RTC operation. 5.2.5.1 Diagram: Typical IDD_RUN operating behavior The following data was measured under these conditions: * MCG in FBE mode for 50 MHz and lower frequencies. MCG in FEE mode at greater than 50 MHz frequencies. * No GPIOs toggled * Code execution from flash with cache enabled * For the ALLOFF curve, all peripheral clocks are disabled except FTFL K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 16 Freescale Semiconductor, Inc. General Figure 2. Run mode supply current vs. core frequency K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 17 General Figure 3. VLPR mode supply current vs. core frequency 5.2.6 Designing with radiated emissions in mind To find application notes that provide guidance on designing your system to minimize interference from radiated emissions: 1. Go to http://www.freescale.com. 2. Perform a keyword search for "EMC design." 5.2.7 Capacitance attributes Table 7. Capacitance attributes Symbol CIN_A Description Input capacitance: analog pins Min. Max. Unit -- 7 pF Table continues on the next page... K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 18 Freescale Semiconductor, Inc. General Table 7. Capacitance attributes (continued) Symbol CIN_D Description Input capacitance: digital pins Min. Max. Unit -- 7 pF 5.3 Switching specifications 5.3.1 Device clock specifications Table 8. Device clock specifications Symbol Description Min. Max. Unit Notes Normal run mode fSYS System and core clock -- 72 MHz fBUS Bus clock -- 50 MHz FlexBus clock -- 50 MHz fFLASH Flash clock -- 25 MHz fLPTMR LPTMR clock -- 25 MHz FB_CLK VLPR mode1 fSYS System and core clock -- 4 MHz fBUS Bus clock -- 4 MHz FlexBus clock -- 4 MHz fFLASH Flash clock -- 1 MHz fERCLK External reference clock -- 16 MHz LPTMR clock -- 25 MHz LPTMR external reference clock -- 16 MHz -- 8 MHz FB_CLK fLPTMR_pin fLPTMR_ERCLK fFlexCAN_ERCLK FlexCAN external reference clock fI2S_MCLK I2S master clock -- 12.5 MHz fI2S_BCLK I2S bit clock -- 4 MHz 1. The frequency limitations in VLPR mode here override any frequency specification listed in the timing specification for any other module. 5.3.2 General switching specifications These general purpose specifications apply to all signals configured for GPIO, UART, CAN, CMT, and I2C signals. K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 19 General Table 9. General switching specifications Symbol Description Min. Max. Unit Notes GPIO pin interrupt pulse width (digital glitch filter disabled) -- Synchronous path 1.5 -- Bus clock cycles 1, 2 GPIO pin interrupt pulse width (digital glitch filter disabled, analog filter enabled) -- Asynchronous path 100 -- ns 3 GPIO pin interrupt pulse width (digital glitch filter disabled, analog filter disabled) -- Asynchronous path 16 -- ns 3 External reset pulse width (digital glitch filter disabled) 100 -- ns 3 2 -- Bus clock cycles Mode select (EZP_CS) hold time after reset deassertion Port rise and fall time (high drive strength) 4 * Slew disabled * 1.71 VDD 2.7V -- * 2.7 VDD 3.6V -- 12 ns ns 6 * Slew enabled * 1.71 VDD 2.7V -- * 2.7 VDD 3.6V -- ns 36 ns 24 Port rise and fall time (low drive strength) 5 * Slew disabled * 1.71 VDD 2.7V -- 12 ns * 2.7 VDD 3.6V -- 6 ns * 1.71 VDD 2.7V -- 36 ns * 2.7 VDD 3.6V -- 24 ns * Slew enabled 1. This is the minimum pulse width that is guaranteed to pass through the pin synchronization circuitry. Shorter pulses may or may not be recognized. In Stop, VLPS, LLS, and VLLSx modes, the synchronizer is bypassed so shorter pulses can be recognized in that case. 2. The greater synchronous and asynchronous timing must be met. 3. This is the minimum pulse width that is guaranteed to be recognized as a pin interrupt request in Stop, VLPS, LLS, and VLLSx modes. 4. 75pF load 5. 15pF load 5.4 Thermal specifications K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 20 Freescale Semiconductor, Inc. General 5.4.1 Thermal operating requirements Table 10. Thermal operating requirements Symbol Description Min. Max. Unit TJ Die junction temperature -40 125 C TA Ambient temperature -40 105 C 5.4.2 Thermal attributes Board type Symbol Description Single-layer (1s) RJA Four-layer (2s2p) 80 LQFP Unit Notes Thermal 74 resistance, junction to ambient (natural convection) 51 C/W 1, 2 RJA Thermal 42 resistance, junction to ambient (natural convection) 36 C/W 1, 3 Single-layer (1s) RJMA Thermal 62 resistance, junction to ambient (200 ft./ min. air speed) 41 C/W 1,3 Four-layer (2s2p) RJMA Thermal 38 resistance, junction to ambient (200 ft./ min. air speed) 30 C/W 1,3 -- RJB Thermal resistance, junction to board 23 20 C/W 4 -- RJC Thermal resistance, junction to case 19 10 C/W 5 -- JT Thermal 4 characterization parameter, junction to package top outside center (natural convection) 2 C/W 6 1. 81 MAPBGA Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 21 Peripheral operating requirements and behaviors 2. 3. 4. 5. 6. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions--Natural Convection (Still Air) with the single layer board horizontal. For the LQFP, the board meets the JESD51-3 specification. For the MAPBGA, the board meets the JESD51-9 specification. Determined according to JEDEC Standard JESD51-6, Integrated Circuits Thermal Test Method Environmental Conditions--Forced Convection (Moving Air) with the board horizontal. For the LQFP, the board meets the JESD51-7 specification. Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental Conditions--Junction-to-Board. Board temperature is measured on the top surface of the board near the package. Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate temperature used for the case temperature. The value includes the thermal resistance of the interface material between the top of the package and the cold plate. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions--Natural Convection (Still Air). 6 Peripheral operating requirements and behaviors 6.1 Core modules 6.1.1 Debug trace timing specifications Table 11. Debug trace operating behaviors Symbol Description Min. Max. Unit Tcyc Clock period Frequency dependent MHz Twl Low pulse width 2 -- ns Twh High pulse width 2 -- ns Tr Clock and data rise time -- 3 ns Tf Clock and data fall time -- 3 ns Ts Data setup 3 -- ns Th Data hold 2 -- ns Figure 4. TRACE_CLKOUT specifications K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 22 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors TRACE_CLKOUT Ts Th Ts Th TRACE_D[3:0] Figure 5. Trace data specifications 6.1.2 JTAG electricals Table 12. JTAG voltage range electricals Symbol J1 Description Min. Max. Unit Operating voltage 2.7 5.5 V TCLK frequency of operation MHz * JTAG -- 10 * CJTAG -- 5 J2 TCLK cycle period 1/J1 -- ns J3 TCLK clock pulse width * JTAG 100 -- ns * CJTAG 200 -- ns ns J4 TCLK rise and fall times J5 TMS input data setup time to TCLK rise * JTAG * CJTAG J6 TDI input data setup time to TCLK rise J7 TMS input data hold time after TCLK rise * JTAG * CJTAG J8 TDI input data hold time after TCLK rise J9 TCLK low to TMS data valid * JTAG * CJTAG -- 1 53 -- 112 -- 8 -- 3.4 -- 3.4 -- 3.4 -- -- 48 -- 85 ns ns ns ns ns ns J10 TCLK low to TDO data valid -- 48 ns J11 Output data hold/invalid time after clock edge1 -- 3 ns 1. They are common for JTAG and CJTAG. Input transition = 1 ns and Output load = 50pf K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 23 Peripheral operating requirements and behaviors J2 J3 J3 TCLK (input) J4 J4 Figure 6. Test clock input timing TCLK J5 Data inputs J6 Input data valid J7 Data outputs Output data valid J8 Data outputs J7 Data outputs Output data valid Figure 7. Boundary scan (JTAG) timing K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 24 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors TCLK J9 TDI/TMS J10 Input data valid J11 TDO Output data valid J12 TDO J11 TDO Output data valid Figure 8. Test Access Port timing TCLK J14 J13 TRST Figure 9. TRST timing 6.2 System modules There are no specifications necessary for the device's system modules. 6.3 Clock modules K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 25 Peripheral operating requirements and behaviors 6.3.1 MCG specifications Table 13. MCG specifications Symbol Description fints_ft Internal reference frequency (slow clock) -- factory trimmed at nominal VDD and 25 C fints_t Internal reference frequency (slow clock) -- user trimmed Min. Typ. Max. Unit -- 32.768 -- kHz 31.25 -- 39.0625 kHz Notes fdco_res_t Resolution of trimmed average DCO output frequency at fixed voltage and temperature -- using SCTRIM and SCFTRIM -- 0.3 0.6 %fdco 1 fdco_res_t Resolution of trimmed average DCO output frequency at fixed voltage and temperature -- using SCTRIM only -- 0.2 0.5 %fdco 1 fdco_t Total deviation of trimmed average DCO output frequency over voltage and temperature -- +0.5/-0.7 -- %fdco 1 fdco_t Total deviation of trimmed average DCO output frequency over fixed voltage and temperature range of 0-70C -- %fdco 1 fintf_ft Internal reference frequency (fast clock) -- factory trimmed at nominal VDD and 25C -- 4 -- MHz fintf_t Internal reference frequency (fast clock) -- user trimmed at nominal VDD and 25 C 3 -- 5 MHz floc_low Loss of external clock minimum frequency -- RANGE = 00 (3/5) x fints_t -- -- kHz floc_high Loss of external clock minimum frequency -- RANGE = 01, 10, or 11 (16/5) x fints_t -- -- kHz 31.25 -- 39.0625 kHz 20 20.97 25 MHz 40 41.94 50 MHz 60 62.91 75 MHz 80 83.89 100 MHz FLL ffll_ref fdco FLL reference frequency range DCO output frequency range Low range (DRS=00) 2, 3 640 x ffll_ref Mid range (DRS=01) 1280 x ffll_ref Mid-high range (DRS=10) 1920 x ffll_ref High range (DRS=11) 2560 x ffll_ref Table continues on the next page... K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 26 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 13. MCG specifications (continued) Symbol Description fdco_t_DMX3 DCO output frequency 2 Low range (DRS=00) Min. Typ. Max. Unit Notes -- 23.99 -- MHz 4, 5 -- 47.97 -- MHz -- 71.99 -- MHz -- 95.98 -- MHz -- 180 -- -- 150 -- -- -- 1 ms 48.0 -- 100 MHz -- 1060 -- A -- 600 -- A 2.0 -- 4.0 MHz 732 x ffll_ref Mid range (DRS=01) 1464 x ffll_ref Mid-high range (DRS=10) 2197 x ffll_ref High range (DRS=11) 2929 x ffll_ref Jcyc_fll FLL period jitter * fVCO = 48 MHz * fVCO = 98 MHz tfll_acquire FLL target frequency acquisition time ps 6 PLL fvco VCO operating frequency Ipll PLL operating current * PLL @ 96 MHz (fosc_hi_1 = 8 MHz, fpll_ref = 2 MHz, VDIV multiplier = 48) Ipll PLL operating current * PLL @ 48 MHz (fosc_hi_1 = 8 MHz, fpll_ref = 2 MHz, VDIV multiplier = 24) fpll_ref PLL reference frequency range Jcyc_pll PLL period jitter (RMS) Jacc_pll 7 7 8 * fvco = 48 MHz -- 120 -- ps * fvco = 100 MHz -- 50 -- ps PLL accumulated jitter over 1s (RMS) 8 * fvco = 48 MHz -- 1350 -- ps * fvco = 100 MHz -- 600 -- ps Dlock Lock entry frequency tolerance 1.49 -- 2.98 % Dunl Lock exit frequency tolerance 4.47 -- 5.97 % tpll_lock Lock detector detection time -- -- 150 x 10-6 + 1075(1/ fpll_ref) s 9 1. This parameter is measured with the internal reference (slow clock) being used as a reference to the FLL (FEI clock mode). 2. These typical values listed are with the slow internal reference clock (FEI) using factory trim and DMX32=0. 3. The resulting system clock frequencies should not exceed their maximum specified values. The DCO frequency deviation (fdco_t) over voltage and temperature should be considered. 4. These typical values listed are with the slow internal reference clock (FEI) using factory trim and DMX32=1. 5. The resulting clock frequency must not exceed the maximum specified clock frequency of the device. K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 27 Peripheral operating requirements and behaviors 6. This specification applies to any time the FLL reference source or reference divider is changed, trim value is changed, DMX32 bit is changed, DRS bits are changed, or changing from FLL disabled (BLPE, BLPI) to FLL enabled (FEI, FEE, FBE, FBI). If a crystal/resonator is being used as the reference, this specification assumes it is already running. 7. Excludes any oscillator currents that are also consuming power while PLL is in operation. 8. This specification was obtained using a Freescale developed PCB. PLL jitter is dependent on the noise characteristics of each PCB and results will vary. 9. This specification applies to any time the PLL VCO divider or reference divider is changed, or changing from PLL disabled (BLPE, BLPI) to PLL enabled (PBE, PEE). If a crystal/resonator is being used as the reference, this specification assumes it is already running. 6.3.2 Oscillator electrical specifications This section provides the electrical characteristics of the module. 6.3.2.1 Symbol VDD IDDOSC IDDOSC Oscillator DC electrical specifications Table 14. Oscillator DC electrical specifications Description Min. Typ. Max. Unit Supply voltage 1.71 -- 3.6 V Supply current -- low-power mode (HGO=0) Notes 1 * 32 kHz -- 500 -- nA * 4 MHz -- 200 -- A * 8 MHz (RANGE=01) -- 300 -- A * 16 MHz -- 950 -- A * 24 MHz -- 1.2 -- mA * 32 MHz -- 1.5 -- mA Supply current -- high gain mode (HGO=1) 1 * 32 kHz -- 25 -- A * 4 MHz -- 400 -- A * 8 MHz (RANGE=01) -- 500 -- A * 16 MHz -- 2.5 -- mA * 24 MHz -- 3 -- mA * 32 MHz -- 4 -- mA Cx EXTAL load capacitance -- -- -- 2, 3 Cy XTAL load capacitance -- -- -- 2, 3 Table continues on the next page... K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 28 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 14. Oscillator DC electrical specifications (continued) Symbol RF RS Description Min. Typ. Max. Unit Notes Feedback resistor -- low-frequency, low-power mode (HGO=0) -- -- -- M 2, 4 Feedback resistor -- low-frequency, high-gain mode (HGO=1) -- 10 -- M Feedback resistor -- high-frequency, low-power mode (HGO=0) -- -- -- M Feedback resistor -- high-frequency, high-gain mode (HGO=1) -- 1 -- M Series resistor -- low-frequency, low-power mode (HGO=0) -- -- -- k Series resistor -- low-frequency, high-gain mode (HGO=1) -- 200 -- k Series resistor -- high-frequency, low-power mode (HGO=0) -- -- -- k -- 0 -- k Peak-to-peak amplitude of oscillation (oscillator mode) -- low-frequency, low-power mode (HGO=0) -- 0.6 -- V Peak-to-peak amplitude of oscillation (oscillator mode) -- low-frequency, high-gain mode (HGO=1) -- VDD -- V Peak-to-peak amplitude of oscillation (oscillator mode) -- high-frequency, low-power mode (HGO=0) -- 0.6 -- V Peak-to-peak amplitude of oscillation (oscillator mode) -- high-frequency, high-gain mode (HGO=1) -- VDD -- V Series resistor -- high-frequency, high-gain mode (HGO=1) Vpp5 1. 2. 3. 4. 5. VDD=3.3 V, Temperature =25 C See crystal or resonator manufacturer's recommendation Cx,Cy can be provided by using either the integrated capacitors or by using external components. When low power mode is selected, RF is integrated and must not be attached externally. The EXTAL and XTAL pins should only be connected to required oscillator components and must not be connected to any other devices. 6.3.2.2 Symbol fosc_lo Oscillator frequency specifications Table 15. Oscillator frequency specifications Description Oscillator crystal or resonator frequency -- low frequency mode (MCG_C2[RANGE]=00) Min. Typ. Max. Unit 32 -- 40 kHz Notes Table continues on the next page... K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 29 Peripheral operating requirements and behaviors Table 15. Oscillator frequency specifications (continued) Symbol Description Min. Typ. Max. Unit fosc_hi_1 Oscillator crystal or resonator frequency -- high frequency mode (low range) (MCG_C2[RANGE]=01) 3 -- 8 MHz fosc_hi_2 Oscillator crystal or resonator frequency -- high frequency mode (high range) (MCG_C2[RANGE]=1x) 8 -- 32 MHz fec_extal Input clock frequency (external clock mode) -- -- 50 MHz tdc_extal Input clock duty cycle (external clock mode) 40 50 60 % Crystal startup time -- 32 kHz low-frequency, low-power mode (HGO=0) -- 750 -- ms Crystal startup time -- 32 kHz low-frequency, high-gain mode (HGO=1) -- 250 -- ms Crystal startup time -- 8 MHz high-frequency (MCG_C2[RANGE]=01), low-power mode (HGO=0) -- 0.6 -- ms Crystal startup time -- 8 MHz high-frequency (MCG_C2[RANGE]=01), high-gain mode (HGO=1) -- 1 -- ms tcst Notes 1, 2 3, 4 1. Other frequency limits may apply when external clock is being used as a reference for the FLL or PLL. 2. When transitioning from FBE to FEI mode, restrict the frequency of the input clock so that, when it is divided by FRDIV, it remains within the limits of the DCO input clock frequency. 3. Proper PC board layout procedures must be followed to achieve specifications. 4. Crystal startup time is defined as the time between the oscillator being enabled and the OSCINIT bit in the MCG_S register being set. 6.3.3 32kHz Oscillator Electrical Characteristics This section describes the module electrical characteristics. 6.3.3.1 Symbol 32kHz oscillator DC electrical specifications Table 16. 32kHz oscillator DC electrical specifications Description Min. Typ. Max. Unit Supply voltage 1.71 -- 3.6 V Internal feedback resistor -- 100 -- M Cpara Parasitical capacitance of EXTAL32 and XTAL32 -- 5 7 pF Vpp1 Peak-to-peak amplitude of oscillation -- 0.6 -- V VBAT RF 1. The EXTAL32 and XTAL32 pins should only be connected to required oscillator components and must not be connected to any other devices. K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 30 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 6.3.3.2 Symbol fosc_lo tstart 32kHz oscillator frequency specifications Table 17. 32kHz oscillator frequency specifications Description Min. Typ. Max. Unit Oscillator crystal -- 32.768 -- kHz Crystal start-up time -- 1000 -- ms Notes 1 1. Proper PC board layout procedures must be followed to achieve specifications. 6.4 Memories and memory interfaces 6.4.1 Flash electrical specifications This section describes the electrical characteristics of the flash memory module. 6.4.1.1 Flash timing specifications -- program and erase The following specifications represent the amount of time the internal charge pumps are active and do not include command overhead. Table 18. NVM program/erase timing specifications Symbol Description thvpgm4 thversscr thversblk32k Min. Typ. Max. Unit Longword Program high-voltage time -- 7.5 18 s Sector Erase high-voltage time -- 13 113 ms 1 Erase Block high-voltage time for 32 KB -- 52 452 ms 1 -- 104 904 ms 1 Notes thversblk256k Erase Block high-voltage time for 256 KB Notes 1. Maximum time based on expectations at cycling end-of-life. 6.4.1.2 Symbol Flash timing specifications -- commands Table 19. Flash command timing specifications Description Min. Typ. Max. Unit Read 1s Block execution time trd1blk32k * 32 KB data flash -- -- 0.5 ms trd1blk256k * 256 KB program flash -- -- 1.7 ms trd1sec1k Read 1s Section execution time (data flash sector) -- -- 60 s 1 trd1sec2k Read 1s Section execution time (program flash sector) -- -- 60 s 1 Table continues on the next page... K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 31 Peripheral operating requirements and behaviors Table 19. Flash command timing specifications (continued) Symbol Description Min. Typ. Max. Unit Notes tpgmchk Program Check execution time -- -- 45 s 1 trdrsrc Read Resource execution time -- -- 30 s 1 tpgm4 Program Longword execution time -- 65 145 s Erase Flash Block execution time 2 tersblk32k * 32 KB data flash -- 55 465 ms tersblk256k * 256 KB program flash -- 122 985 ms -- 14 114 ms tersscr Erase Flash Sector execution time 2 Program Section execution time tpgmsec512p * 512 B program flash -- 2.4 -- ms tpgmsec512d * 512 B data flash -- 4.7 -- ms tpgmsec1kp * 1 KB program flash -- 4.7 -- ms tpgmsec1kd * 1 KB data flash -- 9.3 -- ms trd1all Read 1s All Blocks execution time -- -- 1.8 ms trdonce Read Once execution time -- -- 25 s Program Once execution time -- 65 -- s tersall Erase All Blocks execution time -- 175 1500 ms 2 tvfykey Verify Backdoor Access Key execution time -- -- 30 s 1 tpgmonce 1 Swap Control execution time tswapx01 * control code 0x01 -- 200 -- s tswapx02 * control code 0x02 -- 70 150 s tswapx04 * control code 0x04 -- 70 150 s tswapx08 * control code 0x08 -- -- 30 s -- 70 -- ms Program Partition for EEPROM execution time tpgmpart32k * 32 KB FlexNVM Set FlexRAM Function execution time: tsetramff * Control Code 0xFF -- 50 -- s tsetram8k * 8 KB EEPROM backup -- 0.3 0.5 ms tsetram32k * 32 KB EEPROM backup -- 0.7 1.0 ms 260 s Byte-write to FlexRAM for EEPROM operation teewr8bers Byte-write to erased FlexRAM location execution time -- 175 3 Table continues on the next page... K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 32 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 19. Flash command timing specifications (continued) Symbol Description Min. Typ. Max. Unit Notes Byte-write to FlexRAM execution time: teewr8b8k * 8 KB EEPROM backup -- 340 1700 s teewr8b16k * 16 KB EEPROM backup -- 385 1800 s teewr8b32k * 32 KB EEPROM backup -- 475 2000 s Word-write to FlexRAM for EEPROM operation teewr16bers Word-write to erased FlexRAM location execution time -- 175 260 s Word-write to FlexRAM execution time: teewr16b8k * 8 KB EEPROM backup -- 340 1700 s teewr16b16k * 16 KB EEPROM backup -- 385 1800 s teewr16b32k * 32 KB EEPROM backup -- 475 2000 s Longword-write to FlexRAM for EEPROM operation teewr32bers Longword-write to erased FlexRAM location execution time -- 360 540 s Longword-write to FlexRAM execution time: teewr32b8k * 8 KB EEPROM backup -- 545 1950 s teewr32b16k * 16 KB EEPROM backup -- 630 2050 s teewr32b32k * 32 KB EEPROM backup -- 810 2250 s 1. Assumes 25MHz flash clock frequency. 2. Maximum times for erase parameters based on expectations at cycling end-of-life. 3. For byte-writes to an erased FlexRAM location, the aligned word containing the byte must be erased. 6.4.1.3 Flash current and power specfications Table 20. Flash current and power specfications Symbol Description IDD_PGM Worst case programming current in program flash 6.4.1.4 Symbol Typ. Unit 10 mA Reliability specifications Table 21. NVM reliability specifications Description Min. Typ.1 Max. Unit Notes Program Flash tnvmretp10k Data retention after up to 10 K cycles 5 50 -- years tnvmretp1k Data retention after up to 1 K cycles 20 100 -- years nnvmcycp Cycling endurance 10 K 50 K -- cycles 2 Table continues on the next page... K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 33 Peripheral operating requirements and behaviors Table 21. NVM reliability specifications (continued) Symbol Description Min. Typ.1 Max. Unit Notes Data Flash tnvmretd10k Data retention after up to 10 K cycles 5 50 -- years tnvmretd1k Data retention after up to 1 K cycles 20 100 -- years nnvmcycd Cycling endurance 10 K 50 K -- cycles 2 FlexRAM as EEPROM tnvmretee100 Data retention up to 100% of write endurance 5 50 -- years tnvmretee10 20 100 -- years Data retention up to 10% of write endurance Write endurance 3 nnvmwree16 * EEPROM backup to FlexRAM ratio = 16 35 K 175 K -- writes nnvmwree128 * EEPROM backup to FlexRAM ratio = 128 315 K 1.6 M -- writes nnvmwree512 * EEPROM backup to FlexRAM ratio = 512 1.27 M 6.4 M -- writes nnvmwree4k * EEPROM backup to FlexRAM ratio = 4096 10 M 50 M -- writes * EEPROM backup to FlexRAM ratio = 8192 20 M 100 M -- writes nnvmwree8k 1. Typical data retention values are based on measured response accelerated at high temperature and derated to a constant 25C use profile. Engineering Bulletin EB618 does not apply to this technology. Typical endurance defined in Engineering Bulletin EB619. 2. Cycling endurance represents number of program/erase cycles at -40C Tj 125C. 3. Write endurance represents the number of writes to each FlexRAM location at -40C Tj 125C influenced by the cycling endurance of the FlexNVM (same value as data flash) and the allocated EEPROM backup per subsystem. Minimum and typical values assume all byte-writes to FlexRAM. 6.4.1.5 Write endurance to FlexRAM for EEPROM When the FlexNVM partition code is not set to full data flash, the EEPROM data set size can be set to any of several non-zero values. The bytes not assigned to data flash via the FlexNVM partition code are used by the FTFL to obtain an effective endurance increase for the EEPROM data. The built-in EEPROM record management system raises the number of program/erase cycles that can be attained prior to device wear-out by cycling the EEPROM data through a larger EEPROM NVM storage space. While different partitions of the FlexNVM are available, the intention is that a single choice for the FlexNVM partition code and EEPROM data set size is used throughout the entire lifetime of a given application. The EEPROM endurance equation and graph shown below assume that only one configuration is ever used. Writes_subsystem = EEPROM - 2 x EEESPLIT x EEESIZE EEESPLIT x EEESIZE x Write_efficiency x nnvmcycd where K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 34 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors * Writes_subsystem -- minimum number of writes to each FlexRAM location for subsystem (each subsystem can have different endurance) * EEPROM -- allocated FlexNVM for each EEPROM subsystem based on DEPART; entered with Program Partition command * EEESPLIT -- FlexRAM split factor for subsystem; entered with the Program Partition command * EEESIZE -- allocated FlexRAM based on DEPART; entered with Program Partition command * Write_efficiency -- * 0.25 for 8-bit writes to FlexRAM * 0.50 for 16-bit or 32-bit writes to FlexRAM * nnvmcycd -- data flash cycling endurance Figure 10. EEPROM backup writes to FlexRAM K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 35 Peripheral operating requirements and behaviors 6.4.2 EzPort Switching Specifications Table 22. EzPort switching specifications Num Description Min. Max. Unit Operating voltage 1.71 3.6 V EP1 EZP_CK frequency of operation (all commands except READ) -- fSYS/2 MHz EP1a EZP_CK frequency of operation (READ command) -- fSYS/8 MHz EP2 EZP_CS negation to next EZP_CS assertion 2 x tEZP_CK -- ns EP3 EZP_CS input valid to EZP_CK high (setup) 5 -- ns EP4 EZP_CK high to EZP_CS input invalid (hold) 5 -- ns EP5 EZP_D input valid to EZP_CK high (setup) 2 -- ns EP6 EZP_CK high to EZP_D input invalid (hold) 5 -- ns EP7 EZP_CK low to EZP_Q output valid -- 16 ns EP8 EZP_CK low to EZP_Q output invalid (hold) 0 -- ns EP9 EZP_CS negation to EZP_Q tri-state -- 12 ns EZP_CK EP3 EP2 EP4 EZP_CS EP9 EP7 EP8 EZP_Q (output) EP5 EP6 EZP_D (input) Figure 11. EzPort Timing Diagram 6.4.3 Flexbus Switching Specifications All processor bus timings are synchronous; input setup/hold and output delay are given in respect to the rising edge of a reference clock, FB_CLK. The FB_CLK frequency may be the same as the internal system bus frequency or an integer divider of that frequency. K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 36 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors The following timing numbers indicate when data is latched or driven onto the external bus, relative to the Flexbus output clock (FB_CLK). All other timing relationships can be derived from these values. Table 23. Flexbus limited voltage range switching specifications Num Description Min. Max. Unit Notes Operating voltage 2.7 3.6 V Frequency of operation -- FB_CLK MHz FB1 Clock period 20 -- ns FB2 Address, data, and control output valid -- 11.5 ns 1 FB3 Address, data, and control output hold 0.5 -- ns 1 FB4 Data and FB_TA input setup 8.5 -- ns 2 FB5 Data and FB_TA input hold 0.5 -- ns 2 1. Specification is valid for all FB_AD[31:0], FB_BE/BWEn, FB_CSn, FB_OE, FB_R/W,FB_TBST, FB_TSIZ[1:0], FB_ALE, and FB_TS. 2. Specification is valid for all FB_AD[31:0] and FB_TA. Table 24. Flexbus full voltage range switching specifications Num Description Min. Max. Unit Operating voltage 1.71 3.6 V -- FB_CLK MHz 1/FB_CLK -- ns Frequency of operation Notes FB1 Clock period FB2 Address, data, and control output valid -- 13.5 ns 1 FB3 Address, data, and control output hold 0 -- ns 1 FB4 Data and FB_TA input setup 13.7 -- ns 2 FB5 Data and FB_TA input hold 0.5 -- ns 2 1. Specification is valid for all FB_AD[31:0], FB_BE/BWEn, FB_CSn, FB_OE, FB_R/W,FB_TBST, FB_TSIZ[1:0], FB_ALE, and FB_TS. 2. Specification is valid for all FB_AD[31:0] and FB_TA. K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 37 Peripheral operating requirements and behaviors FB1 FB_CLK FB3 FB5 FB_A[Y] Address FB4 FB2 FB_D[X] Address Data FB_RW FB_TS FB_ALE AA=1 FB_CSn AA=0 FB_OEn FB4 FB_BEn FB5 AA=1 FB_TA FB_TSIZ[1:0] AA=0 TSIZ Figure 12. FlexBus read timing diagram K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 38 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors FB1 FB_CLK FB2 FB3 FB_A[Y] FB_D[X] Address Address Data FB_RW FB_TS FB_ALE AA=1 FB_CSn AA=0 FB_OEn FB4 FB_BEn FB5 AA=1 FB_TA FB_TSIZ[1:0] AA=0 TSIZ Figure 13. FlexBus write timing diagram 6.5 Security and integrity modules There are no specifications necessary for the device's security and integrity modules. 6.6 Analog K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 39 Peripheral operating requirements and behaviors 6.6.1 ADC electrical specifications The 16-bit accuracy specifications listed in Table 25 and Table 26 are achievable on the differential pins ADCx_DP0, ADCx_DM0. The ADCx_DP2 and ADCx_DM2 ADC inputs are connected to the PGA outputs and are not direct device pins. Accuracy specifications for these pins are defined in Table 27 and Table 28. All other ADC channels meet the 13-bit differential/12-bit single-ended accuracy specifications. 6.6.1.1 16-bit ADC operating conditions Table 25. 16-bit ADC operating conditions Description Conditions Min. Typ.1 Max. Unit VDDA Supply voltage Absolute 1.71 -- 3.6 V VDDA Supply voltage Delta to VDD (VDDVDDA) -100 0 +100 mV 2 VSSA Ground voltage Delta to VSS (VSSVSSA) -100 0 +100 mV 2 VREFH ADC reference voltage high 1.13 VDDA VDDA V VREFL Reference voltage low VSSA VSSA VSSA V VADIN Input voltage VREFL -- VREFH V CADIN Input capacitance * 16 bit modes -- 8 10 pF * 8/10/12 bit modes -- 4 5 -- 2 5 Symbol RADIN RAS fADCK fADCK Input resistance Analog source resistance 13/12 bit modes ADC conversion clock frequency 13 bit modes ADC conversion clock frequency 16 bit modes fADCK < 4MHz Notes k 3 -- -- 5 k 4 1.0 -- 18.0 MHz 4 2.0 -- 12.0 MHz Table continues on the next page... K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 40 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 25. 16-bit ADC operating conditions (continued) Symbol Crate Description Conditions ADC conversion rate 13 bit modes Min. Typ.1 Max. Unit Notes 5 No ADC hardware averaging 20.000 -- 818.330 Ksps Continuous conversions enabled, subsequent conversion time Crate ADC conversion rate 16 bit modes 5 No ADC hardware averaging 37.037 -- 461.467 Ksps Continuous conversions enabled, subsequent conversion time 1. Typical values assume VDDA = 3.0 V, Temp = 25C, fADCK = 1.0 MHz unless otherwise stated. Typical values are for reference only and are not tested in production. 2. DC potential difference. 3. This resistance is external to MCU. The analog source resistance should be kept as low as possible in order to achieve the best results. The results in this datasheet were derived from a system which has <8 analog source resistance. The RAS/ CAS time constant should be kept to <1ns. 4. To use the maximum ADC conversion clock frequency, the ADHSC bit should be set and the ADLPC bit should be clear. 5. For guidelines and examples of conversion rate calculation, download the ADC calculator tool: http://cache.freescale.com/ files/soft_dev_tools/software/app_software/converters/ADC_CALCULATOR_CNV.zip?fpsp=1 SIMPLIFIED INPUT PIN EQUIVALENT CIRCUIT Pad leakage due to input protection Z AS R AS Z ADIN SIMPLIFIED CHANNEL SELECT CIRCUIT R ADIN ADC SAR ENGINE V ADIN C AS V AS R ADIN INPUT PIN INPUT PIN R ADIN R ADIN INPUT PIN C ADIN Figure 14. ADC input impedance equivalency diagram K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 41 Peripheral operating requirements and behaviors 6.6.1.2 16-bit ADC electrical characteristics Table 26. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) Symbol Description IDDA_ADC Supply current fADACK ADC asynchronous clock source Sample Time TUE DNL INL EFS Conditions1 Min. Typ.2 Max. Unit Notes 0.215 -- 1.7 mA 3 * ADLPC=1, ADHSC=0 1.2 2.4 3.9 MHz * ADLPC=1, ADHSC=1 3.0 4.0 7.3 MHz tADACK = 1/ fADACK * ADLPC=0, ADHSC=0 2.4 5.2 6.1 MHz * ADLPC=0, ADHSC=1 4.4 6.2 9.5 MHz LSB4 5 LSB4 5 LSB4 5 LSB4 VADIN = VDDA See Reference Manual chapter for sample times Total unadjusted error * 12 bit modes -- 4 6.8 * <12 bit modes -- 1.4 2.1 Differential nonlinearity * 12 bit modes -- 0.7 -1.1 to +1.9 * <12 bit modes -- 0.2 * 12 bit modes -- 1.0 * <12 bit modes -- 0.5 -0.7 to +0.5 * 12 bit modes -- -4 -5.4 * <12 bit modes -- -1.4 -1.8 Integral nonlinearity Full-scale error -0.3 to 0.5 -2.7 to +1.9 5 EQ ENOB Quantization error * 16 bit modes -- -1 to 0 -- * 13 bit modes -- -- 0.5 Effective number 16 bit differential mode of bits * Avg=32 * Avg=4 LSB4 6 12.8 14.5 -- bits 11.9 13.8 -- bits 12.2 13.9 -- bits 11.4 13.1 -- bits 16 bit single-ended mode * Avg=32 * Avg=4 SINAD THD Signal-to-noise plus distortion See ENOB Total harmonic distortion 16 bit differential mode 6.02 x ENOB + 1.76 * Avg=32 16 bit single-ended mode * Avg=32 dB 7 -- -94 -- dB -- -85 -- dB Table continues on the next page... K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 42 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 26. 16-bit ADC characteristics (VREFH = VDDA, VREFL = VSSA) (continued) Symbol SFDR Description Conditions1 Spurious free dynamic range 16 bit differential mode * Avg=32 16 bit single-ended mode * Avg=32 EIL Min. Typ.2 Max. Unit Notes 7 82 95 -- dB 78 90 -- dB Input leakage error IIn x RAS mV IIn = leakage current (refer to the MCU's voltage and current operating ratings) VTEMP25 Temp sensor slope -40C to 105C -- 1.715 -- mV/C Temp sensor voltage 25C -- 719 -- mV 1. All accuracy numbers assume the ADC is calibrated with VREFH = VDDA 2. Typical values assume VDDA = 3.0 V, Temp = 25C, fADCK = 2.0 MHz unless otherwise stated. Typical values are for reference only and are not tested in production. 3. The ADC supply current depends on the ADC conversion clock speed, conversion rate and the ADLPC bit (low power). For lowest power operation the ADLPC bit should be set, the HSC bit should be clear with 1MHz ADC conversion clock speed. 4. 1 LSB = (VREFH - VREFL)/2N 5. ADC conversion clock <16MHz, Max hardware averaging (AVGE = %1, AVGS = %11) 6. Input data is 100 Hz sine wave. ADC conversion clock <12MHz. 7. Input data is 1 kHz sine wave. ADC conversion clock <12MHz. K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 43 Peripheral operating requirements and behaviors Figure 15. Typical ENOB vs. ADC_CLK for 16-bit differential mode Figure 16. Typical ENOB vs. ADC_CLK for 16-bit single-ended mode K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 44 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 6.6.1.3 16-bit ADC with PGA operating conditions Table 27. 16-bit ADC with PGA operating conditions Description Conditions Min. Typ.1 Max. Unit VDDA Supply voltage Absolute 1.71 -- 3.6 V VREFPGA PGA ref voltage Symbol VADIN VCM RPGAD VREF_OU VREF_OU VREF_OU T T T V Notes 2, 3 Input voltage VSSA -- VDDA V Input Common Mode range VSSA -- VDDA V Gain = 1, 2, 4, 8 -- 128 -- k IN+ to IN-4 Gain = 16, 32 -- 64 -- Gain = 64 -- 32 -- Differential input impedance RAS Analog source resistance -- 100 -- 5 TS ADC sampling time 1.25 -- -- s 6 18.484 -- 450 Ksps 7 37.037 -- 250 Ksps 8 Crate ADC conversion rate 13 bit modes No ADC hardware averaging Continuous conversions enabled Peripheral clock = 50 MHz 16 bit modes No ADC hardware averaging Continuous conversions enabled Peripheral clock = 50 MHz 1. Typical values assume VDDA = 3.0 V, Temp = 25C, fADCK = 6 MHz unless otherwise stated. Typical values are for reference only and are not tested in production. 2. ADC must be configured to use the internal voltage reference (VREF_OUT) 3. PGA reference is internally connected to the VREF_OUT pin. If the user wishes to drive VREF_OUT with a voltage other than the output of the VREF module, the VREF module must be disabled. 4. For single ended configurations the input impedance of the driven input is RPGAD/2 5. The analog source resistance (RAS), external to MCU, should be kept as minimum as possible. Increased RAS causes drop in PGA gain without affecting other performances. This is not dependent on ADC clock frequency. 6. The minimum sampling time is dependent on input signal frequency and ADC mode of operation. A minimum of 1.25s time should be allowed for Fin=4 kHz at 16-bit differential mode. Recommended ADC setting is: ADLSMP=1, ADLSTS=2 at 8 MHz ADC clock. 7. ADC clock = 18 MHz, ADLSMP = 1, ADLST = 00, ADHSC = 1 8. ADC clock = 12 MHz, ADLSMP = 1, ADLST = 01, ADHSC = 1 K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 45 Peripheral operating requirements and behaviors 6.6.1.4 16-bit ADC with PGA characteristics with Chop enabled (ADC_PGA[PGACHPb] =0) Table 28. 16-bit ADC with PGA characteristics Symbol Description Conditions IDDA_PGA Supply current Low power (ADC_PGA[PGALPb]=0) IDC_PGA Input DC current G BW Gain4 Input signal bandwidth PSRR Power supply rejection ratio CMRR Common mode rejection ratio Min. Typ.1 Max. Unit Notes -- 420 644 A 2 A 3 Gain =1, VREFPGA=1.2V, VCM=0.5V -- 1.54 -- A Gain =64, VREFPGA=1.2V, VCM=0.1V -- 0.57 -- A * PGAG=0 0.95 1 1.05 * PGAG=1 1.9 2 2.1 * PGAG=2 3.8 4 4.2 * PGAG=3 7.6 8 8.4 * PGAG=4 15.2 16 16.6 * PGAG=5 30.0 31.6 33.2 * PGAG=6 58.8 63.3 67.8 -- -- 4 kHz -- -- 40 kHz -- -84 -- dB VDDA= 3V 100mV, fVDDA= 50Hz, 60Hz * Gain=1 -- -84 -- dB * Gain=64 -- -85 -- dB VCM= 500mVpp, fVCM= 50Hz, 100Hz * 16-bit modes * < 16-bit modes Gain=1 RAS < 100 VOFS Input offset voltage -- 0.2 -- mV Output offset = VOFS*(Gain+1) TGSW Gain switching settling time -- -- 10 s 5 dG/dT Gain drift over full temperature range * Gain=1 * Gain=64 -- 6 10 ppm/C -- 31 42 ppm/C Gain drift over supply voltage * Gain=1 * Gain=64 -- 0.07 0.21 %/V -- 0.14 0.31 %/V dG/dVDDA VDDA from 1.71 to 3.6V Table continues on the next page... K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 46 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Table 28. 16-bit ADC with PGA characteristics (continued) Symbol Description Conditions EIL Input leakage error All modes Min. Typ.1 Max. IIn x RAS Unit Notes mV IIn = leakage current (refer to the MCU's voltage and current operating ratings) VPP,DIFF SNR THD SFDR ENOB SINAD Maximum differential input signal swing V 6 16-bit differential mode, Average=32 where VX = VREFPGA x 0.583 Signal-to-noise ratio * Gain=1 80 90 -- dB * Gain=64 52 66 -- dB Total harmonic distortion * Gain=1 85 100 -- dB * Gain=64 49 95 -- dB Spurious free dynamic range * Gain=1 85 105 -- dB * Gain=64 53 88 -- dB Effective number of bits * Gain=1, Average=4 11.6 13.4 -- bits * Gain=64, Average=4 7.2 9.6 -- bits * Gain=1, Average=32 12.8 14.5 -- bits * Gain=2, Average=32 11.0 14.3 -- bits * Gain=4, Average=32 7.9 13.8 -- bits * Gain=8, Average=32 7.3 13.1 -- bits * Gain=16, Average=32 6.8 12.5 -- bits * Gain=32, Average=32 6.8 11.5 -- bits * Gain=64, Average=32 7.5 10.6 -- bits Signal-to-noise plus distortion ratio See ENOB 6.02 x ENOB + 1.76 16-bit differential mode, Average=32, fin=100Hz 16-bit differential mode, Average=32, fin=100Hz 16-bit differential mode,fin=100H z dB 1. Typical values assume VDDA =3.0V, Temp=25C, fADCK=6MHz unless otherwise stated. 2. This current is a PGA module adder, in addition to ADC conversion currents. 3. Between IN+ and IN-. The PGA draws a DC current from the input terminals. The magnitude of the DC current is a strong function of input common mode voltage (VCM) and the PGA gain. 4. Gain = 2PGAG 5. After changing the PGA gain setting, a minimum of 2 ADC+PGA conversions should be ignored. 6. Limit the input signal swing so that the PGA does not saturate during operation. Input signal swing is dependent on the PGA reference voltage and gain setting. K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 47 Peripheral operating requirements and behaviors 6.6.2 CMP and 6-bit DAC electrical specifications Table 29. Comparator and 6-bit DAC electrical specifications Symbol VDD Description Min. Typ. Max. Unit Supply voltage 1.71 -- 3.6 V IDDHS Supply current, High-speed mode (EN=1, PMODE=1) -- -- 200 A IDDLS Supply current, low-speed mode (EN=1, PMODE=0) -- -- 20 A VAIN Analog input voltage VSS - 0.3 -- VDD V VAIO Analog input offset voltage -- -- 20 mV * CR0[HYSTCTR] = 00 -- 5 -- mV * CR0[HYSTCTR] = 01 -- 10 -- mV * CR0[HYSTCTR] = 10 -- 20 -- mV * CR0[HYSTCTR] = 11 -- 30 -- mV VH Analog comparator hysteresis1 VCMPOh Output high VDD - 0.5 -- -- V VCMPOl Output low -- -- 0.5 V tDHS Propagation delay, high-speed mode (EN=1, PMODE=1) 20 50 200 ns tDLS Propagation delay, low-speed mode (EN=1, PMODE=0) 80 250 600 ns Analog comparator initialization delay2 -- -- 40 s 6-bit DAC current adder (enabled) -- 7 -- A IDAC6b INL 6-bit DAC integral non-linearity -0.5 -- 0.5 LSB3 DNL 6-bit DAC differential non-linearity -0.3 -- 0.3 LSB 1. Typical hysteresis is measured with input voltage range limited to 0.6 to VDD-0.6V. 2. Comparator initialization delay is defined as the time between software writes to change control inputs (Writes to DACEN, VRSEL, PSEL, MSEL, VOSEL) and the comparator output settling to a stable level. 3. 1 LSB = Vreference/64 K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 48 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 0.08 0.07 0.06 HYSTCTR Setting CM P Hystereris (V) 0.05 00 0.04 01 10 11 0.03 0.02 0.01 0 0.1 0.4 0.7 1 1.3 1.6 1.9 Vin level (V) 2.2 2.5 2.8 3.1 Figure 17. Typical hysteresis vs. Vin level (VDD=3.3V, PMODE=0) K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 49 Peripheral operating requirements and behaviors 0.18 0.16 0.14 CMP P Hystereris (V) 0.12 HYSTCTR Setting 0.1 00 01 0 08 0.08 10 11 0.06 0.04 0.02 0 0.1 0.4 0.7 1 1.3 1.6 Vin level (V) 1.9 2.2 2.5 2.8 3.1 Figure 18. Typical hysteresis vs. Vin level (VDD=3.3V, PMODE=1) 6.6.3 12-bit DAC electrical characteristics 6.6.3.1 Symbol 12-bit DAC operating requirements Table 30. 12-bit DAC operating requirements Desciption Min. Max. Unit VDDA Supply voltage 1.71 3.6 V VDACR Reference voltage 1.13 3.6 V TA Temperature -40 105 C CL Output load capacitance -- 100 pF IL Output load current -- 1 mA Notes 1 2 1. The DAC reference can be selected to be VDDA or the voltage output of the VREF module (VREF_OUT) 2. A small load capacitance (47 pF) can improve the bandwidth performance of the DAC K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 50 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 6.6.3.2 Symbol 12-bit DAC operating behaviors Table 31. 12-bit DAC operating behaviors Description IDDA_DACL Supply current -- low-power mode Min. Typ. Max. Unit -- -- 150 A -- -- 700 A Notes P IDDA_DAC Supply current -- high-speed mode HP tDACLP Full-scale settling time (0x080 to 0xF7F) -- low-power mode -- 100 200 s 1 tDACHP Full-scale settling time (0x080 to 0xF7F) -- high-power mode -- 15 30 s 1 tCCDACLP Code-to-code settling time (0xBF8 to 0xC08) -- low-power mode and high-speed mode -- 0.7 1 s 1 Vdacoutl DAC output voltage range low -- highspeed mode, no load, DAC set to 0x000 -- -- 100 mV Vdacouth DAC output voltage range high -- highspeed mode, no load, DAC set to 0xFFF VDACR -100 -- VDACR mV INL Integral non-linearity error -- high speed mode -- -- 8 LSB 2 DNL Differential non-linearity error -- VDACR > 2 V -- -- 1 LSB 3 DNL Differential non-linearity error -- VDACR = VREF_OUT -- -- 1 LSB 4 VOFFSET Offset error -- 0.4 0.8 %FSR 5 EG Gain error -- 0.1 0.6 %FSR 5 Power supply rejection ratio, VDDA > = 2.4 V 60 90 dB TCO Temperature coefficient offset voltage -- 3.7 -- V/C TGE Temperature coefficient gain error -- 0.000421 -- %FSR/C Rop Output resistance load = 3 k -- -- 250 SR Slew rate -80h F7Fh 80h PSRR 1. 2. 3. 4. 5. V/s * High power (SPHP) 1.2 1.7 -- * Low power (SPLP) 0.05 0.12 -- -- -- -80 CT Channel to channel cross talk BW 3dB bandwidth 6 dB kHz * High power (SPHP) 550 -- -- * Low power (SPLP) 40 -- -- Settling within 1 LSB The INL is measured for 0+100mV to VDACR-100 mV The DNL is measured for 0+100 mV to VDACR-100 mV The DNL is measured for 0+100mV to VDACR-100 mV with VDDA > 2.4V Calculated by a best fit curve from VSS+100 mV to VDACR-100 mV K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 51 Peripheral operating requirements and behaviors 6. VDDA = 3.0V, reference select set for VDDA (DACx_CO:DACRFS = 1), high power mode(DACx_C0:LPEN = 0), DAC set to 0x800, Temp range from -40C to 105C Figure 19. Typical INL error vs. digital code K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 52 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors Figure 20. Offset at half scale vs. temperature 6.6.4 Voltage reference electrical specifications Table 32. VREF full-range operating requirements Symbol Description Min. Max. Unit Supply voltage 1.71 3.6 V TA Temperature -40 105 C CL Output load capacitance VDDA 100 nF Notes 1, 2 1. CL must be connected to VREF_OUT if the VREF_OUT functionality is being used for either an internal or external reference. 2. The load capacitance should not exceed +/-25% of the nominal specified CL value over the operating temperature range of the device. K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 53 Peripheral operating requirements and behaviors Table 33. VREF full-range operating behaviors Symbol Description Min. Typ. Max. Unit Notes Vout Voltage reference output with factory trim at nominal VDDA and temperature=25C 1.1915 1.195 1.1977 V Vout Voltage reference output -- factory trim 1.1584 -- 1.2376 V Vout Voltage reference output -- user trim 1.193 -- 1.197 V Vstep Voltage reference trim step -- 0.5 -- mV Vtdrift Temperature drift (Vmax -Vmin across the full temperature range) -- -- 80 mV Ibg Bandgap only current -- -- 80 A 1 Ilp Low-power buffer current -- -- 360 uA 1 Ihp High-power buffer current -- -- 1 mA 1 V 1, 2 VLOAD Load regulation * current = 1.0 mA -- 200 -- Tstup Buffer startup time -- -- 20 s Vvdrift Voltage drift (Vmax - Vmin across the full voltage range) -- 2 -- mV 1 1. See the chip's Reference Manual for the appropriate settings of the VREF Status and Control register. 2. Load regulation voltage is the difference between the VREF_OUT voltage with no load vs. voltage with defined load Table 34. VREF limited-range operating requirements Symbol Description Min. Max. Unit TA Temperature 0 50 C Notes Table 35. VREF limited-range operating behaviors Symbol Vout Description Voltage reference output with factory trim Symbol Description Min Min. Max. Unit 1.173 1.225 V Max Unit VREFH Voltage reference output with factory trim 1.173 1.225 V VREFL Voltage reference output 0.38 0.42 V IBIASP_AFE_4A P-bias current output 3.5 4.5 A Notes Notes K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 54 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 6.7 Timers See General switching specifications. 6.8 Communication interfaces 6.8.1 CAN switching specifications See General switching specifications. 6.8.2 DSPI switching specifications (limited voltage range) The DMA Serial Peripheral Interface (DSPI) provides a synchronous serial bus with master and slave operations. Many of the transfer attributes are programmable. The tables below provide DSPI timing characteristics for classic SPI timing modes. Refer to the DSPI chapter of the Reference Manual for information on the modified transfer formats used for communicating with slower peripheral devices. Table 37. Master mode DSPI timing (limited voltage range) Num Description Min. Max. Unit Operating voltage 2.7 3.6 V Frequency of operation -- 25 MHz 2 x tBUS -- ns Notes DS1 DSPI_SCK output cycle time DS2 DSPI_SCK output high/low time (tSCK/2) - 2 (tSCK/2) + 2 ns DS3 DSPI_PCSn valid to DSPI_SCK delay (tBUS x 2) - 2 -- ns 1 DS4 DSPI_SCK to DSPI_PCSn invalid delay (tBUS x 2) - 2 -- ns 2 DS5 DSPI_SCK to DSPI_SOUT valid -- 8.5 ns DS6 DSPI_SCK to DSPI_SOUT invalid -2 -- ns DS7 DSPI_SIN to DSPI_SCK input setup 15 -- ns DS8 DSPI_SCK to DSPI_SIN input hold 0 -- ns 1. The delay is programmable in SPIx_CTARn[PSSCK] and SPIx_CTARn[CSSCK]. 2. The delay is programmable in SPIx_CTARn[PASC] and SPIx_CTARn[ASC]. K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 55 Peripheral operating requirements and behaviors DSPI_PCSn DS3 DS1 DS2 DS4 DSPI_SCK DS8 DS7 (CPOL=0) DSPI_SIN Data First data Last data DS5 DSPI_SOUT DS6 First data Data Last data Figure 21. DSPI classic SPI timing -- master mode Table 38. Slave mode DSPI timing (limited voltage range) Num Description Operating voltage Min. Max. Unit 2.7 3.6 V 12.5 MHz 4 x tBUS -- ns (tSCK/2) - 2 (tSCK/2) + 2 ns Frequency of operation DS9 DSPI_SCK input cycle time DS10 DSPI_SCK input high/low time DS11 DSPI_SCK to DSPI_SOUT valid -- 10 ns DS12 DSPI_SCK to DSPI_SOUT invalid 0 -- ns DS13 DSPI_SIN to DSPI_SCK input setup 2 -- ns DS14 DSPI_SCK to DSPI_SIN input hold 7 -- ns DS15 DSPI_SS active to DSPI_SOUT driven -- 14 ns DS16 DSPI_SS inactive to DSPI_SOUT not driven -- 14 ns DSPI_SS DS10 DS9 DSPI_SCK (CPOL=0) DS15 DSPI_SOUT First data DS13 DSPI_SIN DS12 DS16 DS11 Data Last data DS14 First data Data Last data Figure 22. DSPI classic SPI timing -- slave mode K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 56 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 6.8.3 DSPI switching specifications (full voltage range) The DMA Serial Peripheral Interface (DSPI) provides a synchronous serial bus with master and slave operations. Many of the transfer attributes are programmable. The tables below provides DSPI timing characteristics for classic SPI timing modes. Refer to the DSPI chapter of the Reference Manual for information on the modified transfer formats used for communicating with slower peripheral devices. Table 39. Master mode DSPI timing (full voltage range) Num Description Operating voltage Frequency of operation Min. Max. Unit Notes 1.71 3.6 V 1 -- 12.5 MHz 4 x tBUS -- ns DS1 DSPI_SCK output cycle time DS2 DSPI_SCK output high/low time (tSCK/2) - 4 (tSCK/2) + 4 ns DS3 DSPI_PCSn valid to DSPI_SCK delay (tBUS x 2) - 4 -- ns 2 DS4 DSPI_SCK to DSPI_PCSn invalid delay (tBUS x 2) - 4 -- ns 3 DS5 DSPI_SCK to DSPI_SOUT valid -- 10 ns DS6 DSPI_SCK to DSPI_SOUT invalid -4.5 -- ns DS7 DSPI_SIN to DSPI_SCK input setup 20.5 -- ns DS8 DSPI_SCK to DSPI_SIN input hold 0 -- ns 1. The DSPI module can operate across the entire operating voltage for the processor, but to run across the full voltage range the maximum frequency of operation is reduced. 2. The delay is programmable in SPIx_CTARn[PSSCK] and SPIx_CTARn[CSSCK]. 3. The delay is programmable in SPIx_CTARn[PASC] and SPIx_CTARn[ASC]. DSPI_PCSn DS3 DS1 DS2 DS4 DSPI_SCK DS7 (CPOL=0) DSPI_SIN DS8 Data First data Last data DS5 DSPI_SOUT First data DS6 Data Last data Figure 23. DSPI classic SPI timing -- master mode K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 57 Peripheral operating requirements and behaviors Table 40. Slave mode DSPI timing (full voltage range) Num Description Operating voltage Frequency of operation Min. Max. Unit 1.71 3.6 V -- 6.25 MHz 8 x tBUS -- ns (tSCK/2) - 4 (tSCK/2) + 4 ns DS9 DSPI_SCK input cycle time DS10 DSPI_SCK input high/low time DS11 DSPI_SCK to DSPI_SOUT valid -- 20 ns DS12 DSPI_SCK to DSPI_SOUT invalid 0 -- ns DS13 DSPI_SIN to DSPI_SCK input setup 2 -- ns DS14 DSPI_SCK to DSPI_SIN input hold 7 -- ns DS15 DSPI_SS active to DSPI_SOUT driven -- 19 ns DS16 DSPI_SS inactive to DSPI_SOUT not driven -- 19 ns DSPI_SS DS10 DS9 DSPI_SCK (CPOL=0) DS15 DSPI_SOUT First data DS13 DSPI_SIN DS12 DS16 DS11 Data Last data DS14 First data Data Last data Figure 24. DSPI classic SPI timing -- slave mode 6.8.4 I2C switching specifications See General switching specifications. 6.8.5 UART switching specifications See General switching specifications. K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 58 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors 6.8.6 I2S/SAI Switching Specifications This section provides the AC timing for the I2S/SAI module in master mode (clocks are driven) and slave mode (clocks are input). All timing is given for noninverted serial clock polarity (TCR2[BCP] is 0, RCR2[BCP] is 0) and a noninverted frame sync (TCR4[FSP] is 0, RCR4[FSP] is 0). If the polarity of the clock and/or the frame sync have been inverted, all the timing remains valid by inverting the bit clock signal (BCLK) and/or the frame sync (FS) signal shown in the following figures. 6.8.6.1 Normal Run, Wait and Stop mode performance over the full operating voltage range This section provides the operating performance over the full operating voltage for the device in Normal Run, Wait and Stop modes. Table 41. I2S/SAI master mode timing in Normal Run, Wait and Stop modes (full voltage range) Num. Characteristic Min. Max. Unit Operating voltage 1.71 3.6 V S1 I2S_MCLK cycle time 40 -- ns S2 I2S_MCLK pulse width high/low 45% 55% MCLK period S3 I2S_TX_BCLK/I2S_RX_BCLK cycle time (output) 80 -- ns S4 I2S_TX_BCLK/I2S_RX_BCLK pulse width high/low 45% 55% BCLK period S5 I2S_TX_BCLK/I2S_RX_BCLK to I2S_TX_FS/ I2S_RX_FS output valid -- 15 ns S6 I2S_TX_BCLK/I2S_RX_BCLK to I2S_TX_FS/ I2S_RX_FS output invalid -1.0 -- ns S7 I2S_TX_BCLK to I2S_TXD valid -- 15 ns S8 I2S_TX_BCLK to I2S_TXD invalid 0 -- ns S9 I2S_RXD/I2S_RX_FS input setup before I2S_RX_BCLK 20.5 -- ns S10 I2S_RXD/I2S_RX_FS input hold after I2S_RX_BCLK 0 -- ns K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 59 Peripheral operating requirements and behaviors S1 S2 S2 I2S_MCLK (output) S3 I2S_TX_BCLK/ I2S_RX_BCLK (output) S4 S4 S6 S5 I2S_TX_FS/ I2S_RX_FS (output) S10 S9 I2S_TX_FS/ I2S_RX_FS (input) S7 S8 S7 S8 I2S_TXD S9 S10 I2S_RXD Figure 25. I2S/SAI timing -- master modes Table 42. I2S/SAI slave mode timing in Normal Run, Wait and Stop modes (full voltage range) Num. Characteristic Min. Max. Unit Operating voltage 1.71 3.6 V S11 I2S_TX_BCLK/I2S_RX_BCLK cycle time (input) 80 -- ns S12 I2S_TX_BCLK/I2S_RX_BCLK pulse width high/low (input) 45% 55% MCLK period S13 I2S_TX_FS/I2S_RX_FS input setup before I2S_TX_BCLK/I2S_RX_BCLK 5.8 -- ns S14 I2S_TX_FS/I2S_RX_FS input hold after I2S_TX_BCLK/I2S_RX_BCLK 2 -- ns S15 I2S_TX_BCLK to I2S_TXD/I2S_TX_FS output valid -- 20.6 ns S16 I2S_TX_BCLK to I2S_TXD/I2S_TX_FS output invalid 0 -- ns S17 I2S_RXD setup before I2S_RX_BCLK 5.8 -- ns S18 I2S_RXD hold after I2S_RX_BCLK 2 -- ns S19 I2S_TX_FS input assertion to I2S_TXD output valid1 -- 25 ns 1. Applies to first bit in each frame and only if the TCR4[FSE] bit is clear K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 60 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors S11 S12 I2S_TX_BCLK/ I2S_RX_BCLK (input) S12 S15 S16 I2S_TX_FS/ I2S_RX_FS (output) S13 I2S_TX_FS/ I2S_RX_FS (input) S19 S14 S15 S16 S15 S16 I2S_TXD S17 S18 I2S_RXD Figure 26. I2S/SAI timing -- slave modes 6.8.6.2 VLPR, VLPW, and VLPS mode performance over the full operating voltage range This section provides the operating performance over the full operating voltage for the device in VLPR, VLPW, and VLPS modes. Table 43. I2S/SAI master mode timing in VLPR, VLPW, and VLPS modes (full voltage range) Num. Characteristic Min. Max. Unit Operating voltage 1.71 3.6 V S1 I2S_MCLK cycle time 62.5 -- ns S2 I2S_MCLK pulse width high/low 45% 55% MCLK period S3 I2S_TX_BCLK/I2S_RX_BCLK cycle time (output) 250 -- ns S4 I2S_TX_BCLK/I2S_RX_BCLK pulse width high/low 45% 55% BCLK period S5 I2S_TX_BCLK/I2S_RX_BCLK to I2S_TX_FS/ I2S_RX_FS output valid -- 45 ns S6 I2S_TX_BCLK/I2S_RX_BCLK to I2S_TX_FS/ I2S_RX_FS output invalid 0 -- ns S7 I2S_TX_BCLK to I2S_TXD valid -- 45 ns S8 I2S_TX_BCLK to I2S_TXD invalid 0 -- ns S9 I2S_RXD/I2S_RX_FS input setup before I2S_RX_BCLK 53 -- ns S10 I2S_RXD/I2S_RX_FS input hold after I2S_RX_BCLK 0 -- ns K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 61 Peripheral operating requirements and behaviors S1 S2 S2 I2S_MCLK (output) S3 I2S_TX_BCLK/ I2S_RX_BCLK (output) S4 S4 S6 S5 I2S_TX_FS/ I2S_RX_FS (output) S10 S9 I2S_TX_FS/ I2S_RX_FS (input) S7 S8 S7 S8 I2S_TXD S9 S10 I2S_RXD Figure 27. I2S/SAI timing -- master modes Table 44. I2S/SAI slave mode timing in VLPR, VLPW, and VLPS modes (full voltage range) Num. Characteristic Min. Max. Unit Operating voltage 1.71 3.6 V S11 I2S_TX_BCLK/I2S_RX_BCLK cycle time (input) 250 -- ns S12 I2S_TX_BCLK/I2S_RX_BCLK pulse width high/low (input) 45% 55% MCLK period S13 I2S_TX_FS/I2S_RX_FS input setup before I2S_TX_BCLK/I2S_RX_BCLK 30 -- ns S14 I2S_TX_FS/I2S_RX_FS input hold after I2S_TX_BCLK/I2S_RX_BCLK 7.6 -- ns S15 I2S_TX_BCLK to I2S_TXD/I2S_TX_FS output valid -- 67 ns S16 I2S_TX_BCLK to I2S_TXD/I2S_TX_FS output invalid 0 -- ns S17 I2S_RXD setup before I2S_RX_BCLK 30 -- ns S18 I2S_RXD hold after I2S_RX_BCLK 6.5 -- ns S19 I2S_TX_FS input assertion to I2S_TXD output valid1 -- 72 ns 1. Applies to first bit in each frame and only if the TCR4[FSE] bit is clear K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 62 Freescale Semiconductor, Inc. Peripheral operating requirements and behaviors S11 S12 I2S_TX_BCLK/ I2S_RX_BCLK (input) S12 S15 S16 I2S_TX_FS/ I2S_RX_FS (output) S13 I2S_TX_FS/ I2S_RX_FS (input) S19 S14 S15 S16 S15 S16 I2S_TXD S17 S18 I2S_RXD Figure 28. I2S/SAI timing -- slave modes 6.9 Human-machine interfaces (HMI) 6.9.1 TSI electrical specifications Table 45. TSI electrical specifications Symbol Description Min. Typ. Max. Unit VDDTSI Operating voltage 1.71 -- 3.6 V Target electrode capacitance range 1 20 500 pF 1 fREFmax Reference oscillator frequency -- 8 15 MHz 2, 3 fELEmax Electrode oscillator frequency -- 1 1.8 MHz 2, 4 Internal reference capacitor -- 1 -- pF Oscillator delta voltage -- 500 -- mV 2, 5 -- 2 3 A 2, 6 -- 36 50 -- 2 3 A 2, 7 -- 36 50 CELE CREF VDELTA IREF IELE Reference oscillator current source base current * 2 A setting (REFCHRG = 0) * 32 A setting (REFCHRG = 15) Electrode oscillator current source base current * 2 A setting (EXTCHRG = 0) * 32 A setting (EXTCHRG = 15) Notes Pres5 Electrode capacitance measurement precision -- 8.3333 38400 fF/count 8 Pres20 Electrode capacitance measurement precision -- 8.3333 38400 fF/count 9 Pres100 Electrode capacitance measurement precision -- 8.3333 38400 fF/count 10 MaxSens Maximum sensitivity 0.003 12.5 -- fF/count 11 -- -- 16 bits Res Resolution Table continues on the next page... K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 63 Dimensions Table 45. TSI electrical specifications (continued) Symbol Description TCon20 ITSI_RUN ITSI_LP Min. Typ. Max. Unit Notes Response time @ 20 pF 8 15 25 s 12 Current added in run mode -- 55 -- A Low power mode current adder -- 1.3 2.5 A 13 1. The TSI module is functional with capacitance values outside this range. However, optimal performance is not guaranteed. 2. Fixed external capacitance of 20 pF. 3. REFCHRG = 2, EXTCHRG=0. 4. REFCHRG = 0, EXTCHRG = 10. 5. VDD = 3.0 V. 6. The programmable current source value is generated by multiplying the SCANC[REFCHRG] value and the base current. 7. The programmable current source value is generated by multiplying the SCANC[EXTCHRG] value and the base current. 8. Measured with a 5 pF electrode, reference oscillator frequency of 10 MHz, PS = 128, NSCN = 8; Iext = 16. 9. Measured with a 20 pF electrode, reference oscillator frequency of 10 MHz, PS = 128, NSCN = 2; Iext = 16. 10. Measured with a 20 pF electrode, reference oscillator frequency of 10 MHz, PS = 16, NSCN = 3; Iext = 16. 11. Sensitivity defines the minimum capacitance change when a single count from the TSI module changes, it is equal to (Cref * Iext)/( Iref * PS * NSCN). Sensitivity depends on the configuration used. The typical value listed is based on the following configuration: Iext = 6 A (EXTCHRG = 2), PS = 128, NSCN = 2, Iref = 16 A (REFCHRG = 7), Cref = 1.0 pF. The minimum sensitivity describes the smallest possible capacitance that can be measured by a single count (this is the best sensitivity but is described as a minimum because it's the smallest number). The minimum sensitivity parameter is based on the following configuration: Iext = 2 A (EXTCHRG = 0), PS = 128, NSCN = 32, Iref = 32 A (REFCHRG = 15). 12. Time to do one complete measurement of the electrode. Sensitivity resolution of 0.0133 pF, PS = 0, NSCN = 0, 1 electrode, EXTCHRG = 7. 13. REFCHRG=0, EXTCHRG=4, PS=7, NSCN=0F, LPSCNITV=F, LPO is selected (1 kHz), and fixed external capacitance of 20 pF. Data is captured with an average of 7 periods window. 7 Dimensions 7.1 Obtaining package dimensions Package dimensions are provided in package drawings. To find a package drawing, go to http://www.freescale.com and perform a keyword search for the drawing's document number: If you want the drawing for this package Then use this document number 80-pin LQFP 98ASS23174W 81-pin MAPBGA 98ASA00344D 8 Pinout K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 64 Freescale Semiconductor, Inc. Pinout 8.1 K10 Signal Multiplexing and Pin Assignments The following table shows the signals available on each pin and the locations of these pins on the devices supported by this document. The Port Control Module is responsible for selecting which ALT functionality is available on each pin. 81 80 MAP LQFP BGA Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7 E4 1 PTE0 ADC1_SE4a ADC1_SE4a PTE0 SPI1_PCS1 UART1_TX I2C1_SDA RTC_CLKOUT E3 2 PTE1/ LLWU_P0 ADC1_SE5a ADC1_SE5a PTE1/ LLWU_P0 SPI1_SOUT UART1_RX I2C1_SCL SPI1_SIN E2 3 PTE2/ LLWU_P1 ADC1_SE6a ADC1_SE6a PTE2/ LLWU_P1 SPI1_SCK UART1_CTS_ b F4 4 PTE3 ADC1_SE7a ADC1_SE7a PTE3 SPI1_SIN UART1_RTS_ b E7 -- VDD VDD VDD F7 -- VSS VSS VSS H7 5 PTE4/ LLWU_P2 DISABLED PTE4/ LLWU_P2 SPI1_PCS0 UART3_TX G4 6 PTE5 DISABLED PTE5 SPI1_PCS2 UART3_RX E6 7 VDD VDD VDD G7 8 VSS VSS VSS F1 9 PTE16 ADC0_SE4a ADC0_SE4a PTE16 SPI0_PCS0 UART2_TX FTM_CLKIN0 FTM0_FLT3 F2 10 PTE17 ADC0_SE5a ADC0_SE5a PTE17 SPI0_SCK UART2_RX FTM_CLKIN1 LPTMR0_ ALT3 G1 11 PTE18 ADC0_SE6a ADC0_SE6a PTE18 SPI0_SOUT UART2_CTS_ I2C0_SDA b G2 12 PTE19 ADC0_SE7a ADC0_SE7a PTE19 SPI0_SIN UART2_RTS_ I2C0_SCL b L6 -- VSS VSS VSS K1 13 PGA0_DP/ ADC0_DP0/ ADC1_DP3 PGA0_DP/ ADC0_DP0/ ADC1_DP3 PGA0_DP/ ADC0_DP0/ ADC1_DP3 K2 14 PGA0_DM/ ADC0_DM0/ ADC1_DM3 PGA0_DM/ ADC0_DM0/ ADC1_DM3 PGA0_DM/ ADC0_DM0/ ADC1_DM3 L1 15 PGA1_DP/ ADC1_DP0/ ADC0_DP3 PGA1_DP/ ADC1_DP0/ ADC0_DP3 PGA1_DP/ ADC1_DP0/ ADC0_DP3 L2 16 PGA1_DM/ ADC1_DM0/ ADC0_DM3 PGA1_DM/ ADC1_DM0/ ADC0_DM3 PGA1_DM/ ADC1_DM0/ ADC0_DM3 F5 17 VDDA VDDA VDDA G5 18 VREFH VREFH VREFH G6 19 VREFL VREFL VREFL F6 20 VSSA VSSA VSSA EzPort SPI1_SOUT K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 65 Pinout 81 80 MAP LQFP BGA Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7 EzPort L3 21 VREF_OUT/ CMP1_IN5/ CMP0_IN5/ ADC1_SE18 VREF_OUT/ CMP1_IN5/ CMP0_IN5/ ADC1_SE18 VREF_OUT/ CMP1_IN5/ CMP0_IN5/ ADC1_SE18 K5 22 DAC0_OUT/ CMP1_IN3/ ADC0_SE23 DAC0_OUT/ CMP1_IN3/ ADC0_SE23 DAC0_OUT/ CMP1_IN3/ ADC0_SE23 L7 -- RTC_ WAKEUP_B RTC_ WAKEUP_B RTC_ WAKEUP_B L4 23 XTAL32 XTAL32 XTAL32 L5 24 EXTAL32 EXTAL32 EXTAL32 K6 25 VBAT VBAT VBAT J6 26 PTA0 JTAG_TCLK/ SWD_CLK/ EZP_CLK TSI0_CH1 PTA0 UART0_CTS_ FTM0_CH5 b/ UART0_COL_ b JTAG_TCLK/ SWD_CLK EZP_CLK H8 27 PTA1 JTAG_TDI/ EZP_DI TSI0_CH2 PTA1 UART0_RX FTM0_CH6 JTAG_TDI EZP_DI J7 28 PTA2 JTAG_TDO/ TSI0_CH3 TRACE_SWO/ EZP_DO PTA2 UART0_TX FTM0_CH7 JTAG_TDO/ EZP_DO TRACE_SWO H9 29 PTA3 JTAG_TMS/ SWD_DIO TSI0_CH4 PTA3 UART0_RTS_ FTM0_CH0 b J8 30 PTA4/ LLWU_P3 NMI_b/ EZP_CS_b TSI0_CH5 PTA4/ LLWU_P3 FTM0_CH1 K7 31 PTA5 DISABLED PTA5 FTM0_CH2 E5 -- VDD VDD VDD G3 -- VSS VSS VSS K8 32 PTA12 CMP2_IN0 CMP2_IN0 PTA12 CAN0_TX L8 33 PTA13/ LLWU_P4 CMP2_IN1 CMP2_IN1 PTA13/ LLWU_P4 K9 34 PTA14 DISABLED L9 35 PTA15 J10 36 H10 JTAG_TMS/ SWD_DIO NMI_b CMP2_OUT I2S0_TX_ BCLK JTAG_TRST_ b FTM1_CH0 I2S0_TXD0 FTM1_QD_ PHA CAN0_RX FTM1_CH1 I2S0_TX_FS FTM1_QD_ PHB PTA14 SPI0_PCS0 UART0_TX I2S0_RX_ BCLK I2S0_TXD1 DISABLED PTA15 SPI0_SCK UART0_RX I2S0_RXD0 PTA16 DISABLED PTA16 SPI0_SOUT UART0_CTS_ b/ UART0_COL_ b I2S0_RX_FS 37 PTA17 ADC1_SE17 ADC1_SE17 PTA17 SPI0_SIN UART0_RTS_ b I2S0_MCLK L10 38 VDD VDD VDD K10 39 VSS VSS VSS L11 40 PTA18 EXTAL0 EXTAL0 PTA18 FTM0_FLT2 FTM_CLKIN0 K11 41 PTA19 XTAL0 XTAL0 PTA19 FTM1_FLT0 FTM_CLKIN1 EZP_CS_b I2S0_RXD1 LPTMR0_ ALT1 K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 66 Freescale Semiconductor, Inc. Pinout 81 80 MAP LQFP BGA Pin Name Default ALT0 ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 J11 42 RESET_b RESET_b RESET_b G11 43 PTB0/ LLWU_P5 ADC0_SE8/ ADC1_SE8/ TSI0_CH0 ADC0_SE8/ ADC1_SE8/ TSI0_CH0 PTB0/ LLWU_P5 I2C0_SCL FTM1_CH0 FTM1_QD_ PHA G10 44 PTB1 ADC0_SE9/ ADC1_SE9/ TSI0_CH6 ADC0_SE9/ ADC1_SE9/ TSI0_CH6 PTB1 I2C0_SDA FTM1_CH1 FTM1_QD_ PHB G9 45 PTB2 ADC0_SE12/ TSI0_CH7 ADC0_SE12/ TSI0_CH7 PTB2 I2C0_SCL UART0_RTS_ b FTM0_FLT3 G8 46 PTB3 ADC0_SE13/ TSI0_CH8 ADC0_SE13/ TSI0_CH8 PTB3 I2C0_SDA UART0_CTS_ b/ UART0_COL_ b FTM0_FLT0 D10 47 PTB10 ADC1_SE14 ADC1_SE14 PTB10 SPI1_PCS0 UART3_RX FB_AD19 FTM0_FLT1 C10 48 PTB11 ADC1_SE15 ADC1_SE15 PTB11 SPI1_SCK UART3_TX FB_AD18 FTM0_FLT2 -- 49 VSS VSS VSS -- 50 VDD VDD VDD B10 51 PTB16 TSI0_CH9 TSI0_CH9 PTB16 SPI1_SOUT UART0_RX FB_AD17 EWM_IN E9 52 PTB17 TSI0_CH10 TSI0_CH10 PTB17 SPI1_SIN UART0_TX FB_AD16 EWM_OUT_b D9 53 PTB18 TSI0_CH11 TSI0_CH11 PTB18 CAN0_TX FTM2_CH0 I2S0_TX_ BCLK FB_AD15 FTM2_QD_ PHA C9 54 PTB19 TSI0_CH12 TSI0_CH12 PTB19 CAN0_RX FTM2_CH1 I2S0_TX_FS FB_OE_b FTM2_QD_ PHB B9 55 PTC0 ADC0_SE14/ TSI0_CH13 ADC0_SE14/ TSI0_CH13 PTC0 SPI0_PCS4 PDB0_EXTRG FB_AD14 I2S0_TXD1 D8 56 PTC1/ LLWU_P6 ADC0_SE15/ TSI0_CH14 ADC0_SE15/ TSI0_CH14 PTC1/ LLWU_P6 SPI0_PCS3 UART1_RTS_ FTM0_CH0 b FB_AD13 I2S0_TXD0 C8 57 PTC2 ADC0_SE4b/ CMP1_IN0/ TSI0_CH15 ADC0_SE4b/ CMP1_IN0/ TSI0_CH15 PTC2 SPI0_PCS2 UART1_CTS_ FTM0_CH1 b FB_AD12 I2S0_TX_FS B8 58 PTC3/ LLWU_P7 CMP1_IN1 CMP1_IN1 PTC3/ LLWU_P7 SPI0_PCS1 UART1_RX FTM0_CH2 CLKOUT I2S0_TX_ BCLK -- 59 VSS VSS VSS -- 60 VDD VDD VDD A8 61 PTC4/ LLWU_P8 DISABLED PTC4/ LLWU_P8 SPI0_PCS0 UART1_TX FTM0_CH3 FB_AD11 CMP1_OUT D7 62 PTC5/ LLWU_P9 DISABLED PTC5/ LLWU_P9 SPI0_SCK LPTMR0_ ALT2 I2S0_RXD0 FB_AD10 CMP0_OUT C7 63 PTC6/ LLWU_P10 CMP0_IN0 CMP0_IN0 PTC6/ LLWU_P10 SPI0_SOUT PDB0_EXTRG I2S0_RX_ BCLK FB_AD9 I2S0_MCLK B7 64 PTC7 CMP0_IN1 CMP0_IN1 PTC7 SPI0_SIN A7 65 PTC8 ADC1_SE4b/ CMP0_IN2 ADC1_SE4b/ CMP0_IN2 D6 66 PTC9 ADC1_SE5b/ CMP0_IN3 C6 67 PTC10 ADC1_SE6b I2S0_RX_FS FB_AD8 PTC8 I2S0_MCLK FB_AD7 ADC1_SE5b/ CMP0_IN3 PTC9 I2S0_RX_ BCLK FB_AD6 ADC1_SE6b PTC10 I2S0_RX_FS FB_AD5 I2C1_SCL ALT7 EzPort FTM2_FLT0 K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 67 Pinout 81 80 MAP LQFP BGA Pin Name Default ALT0 ALT1 ALT2 PTC11/ LLWU_P11 I2C1_SDA ALT3 ALT4 ALT6 C5 68 PTC11/ LLWU_P11 ADC1_SE7b ADC1_SE7b -- 69 VSS VSS VSS -- 70 VDD VDD VDD D5 71 PTC16 DISABLED PTC16 UART3_RX FB_CS5_b/ FB_TSIZ1/ FB_BE23_16_ BLS15_8_b C4 72 PTC17 DISABLED PTC17 UART3_TX FB_CS4_b/ FB_TSIZ0/ FB_BE31_24_ BLS7_0_b D4 73 PTD0/ LLWU_P12 DISABLED PTD0/ LLWU_P12 SPI0_PCS0 UART2_RTS_ b FB_ALE/ FB_CS1_b/ FB_TS_b D3 74 PTD1 ADC0_SE5b PTD1 SPI0_SCK UART2_CTS_ b FB_CS0_b C3 75 PTD2/ LLWU_P13 DISABLED PTD2/ LLWU_P13 SPI0_SOUT UART2_RX FB_AD4 B3 76 PTD3 DISABLED PTD3 SPI0_SIN UART2_TX FB_AD3 A3 77 PTD4/ LLWU_P14 DISABLED PTD4/ LLWU_P14 SPI0_PCS1 UART0_RTS_ FTM0_CH4 b FB_AD2 EWM_IN A2 78 PTD5 ADC0_SE6b ADC0_SE6b PTD5 SPI0_PCS2 UART0_CTS_ FTM0_CH5 b/ UART0_COL_ b FB_AD1 EWM_OUT_b B2 79 PTD6/ LLWU_P15 ADC0_SE7b ADC0_SE7b PTD6/ LLWU_P15 SPI0_PCS3 UART0_RX FTM0_CH6 FB_AD0 FTM0_FLT0 A1 80 PTD7 DISABLED PTD7 CMT_IRO UART0_TX FTM0_CH7 A11 -- NC NC NC B11 -- NC NC NC C11 -- NC NC NC K3 -- NC NC NC H4 -- NC NC NC F3 -- NC NC NC H1 -- NC NC NC H2 -- NC NC NC J1 -- NC NC NC J2 -- NC NC NC J3 -- NC NC NC H3 -- NC NC NC K4 -- NC NC NC H5 -- NC NC NC J5 -- NC NC NC H6 -- NC NC NC ADC0_SE5b I2S0_RXD1 ALT5 ALT7 EzPort FB_RW_b FTM0_FLT1 K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 68 Freescale Semiconductor, Inc. Pinout 81 80 MAP LQFP BGA Pin Name Default ALT0 J9 -- NC NC NC J4 -- NC NC NC H11 -- NC NC NC F11 -- NC NC NC E11 -- NC NC NC D11 -- NC NC NC E10 -- NC NC NC F10 -- NC NC NC F9 -- NC NC NC F8 -- NC NC NC E8 -- NC NC NC B6 -- NC NC NC A6 -- NC NC NC A5 -- NC NC NC B5 -- NC NC NC B4 -- NC NC NC A4 -- NC NC NC A10 -- NC NC NC A9 -- NC NC NC B1 -- NC NC NC C2 -- NC NC NC C1 -- NC NC NC D2 -- NC NC NC D1 -- NC NC NC E1 -- NC NC NC ALT1 ALT2 ALT3 ALT4 ALT5 ALT6 ALT7 EzPort 8.2 K10 Pinouts The below figure shows the pinout diagram for the devices supported by this document. Many signals may be multiplexed onto a single pin. To determine what signals can be used on which pin, see the previous section. K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 69 PTD7 PTD6/LLWU_P15 PTD5 PTD4/LLWU_P14 PTD3 PTD2/LLWU_P13 PTD1 PTD0/LLWU_P12 PTC17 PTC16 VDD VSS PTC11/LLWU_P11 PTC10 PTC9 PTC8 PTC7 PTC6/LLWU_P10 PTC5/LLWU_P9 PTC4/LLWU_P8 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 Pinout PTE18 11 50 VDD PTE19 12 49 VSS PGA0_DP/ADC0_DP0/ADC1_DP3 13 48 PTB11 PGA0_DM/ADC0_DM0/ADC1_DM3 14 47 PTB10 PGA1_DP/ADC1_DP0/ADC0_DP3 15 46 PTB3 PGA1_DM/ADC1_DM0/ADC0_DM3 16 45 PTB2 VDDA 17 44 PTB1 VREFH 18 43 PTB0/LLWU_P5 VREFL 19 42 RESET_b VSSA 20 41 PTA19 40 PTB16 PTA18 51 39 10 VSS PTE17 38 PTB17 VDD 52 37 9 PTA17 PTE16 36 PTB18 PTA16 53 35 8 PTA15 VSS 34 PTB19 PTA14 54 33 7 PTA13/LLWU_P4 VDD 32 PTC0 PTA12 55 31 6 PTA5 PTE5 30 PTC1/LLWU_P6 PTA4/LLWU_P3 56 29 5 PTA3 PTE4/LLWU_P2 28 PTC2 PTA2 57 27 4 PTA1 PTE3 PTA0 PTC3/LLWU_P7 26 58 25 3 VBAT PTE2/LLWU_P1 24 VSS EXTAL32 59 23 2 XTAL32 PTE1/LLWU_P0 22 VDD DAC0_OUT/CMP1_IN3/ADC0_SE23 60 21 1 VREF_OUT/CMP1_IN5/CMP0_IN5/ADC1_SE18 PTE0 Figure 29. K10 80 LQFP Pinout Diagram K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 70 Freescale Semiconductor, Inc. Revision History 1 2 3 4 5 6 7 8 9 10 11 A PTD7 PTD5 PTD4/ LLWU_P14 NC NC NC PTC8 PTC4/ LLWU_P8 NC NC NC A B NC PTD6/ LLWU_P15 PTD3 NC NC NC PTC7 PTC3/ LLWU_P7 PTC0 PTB16 NC B C NC NC PTD2/ LLWU_P13 PTC17 PTC11/ LLWU_P11 PTC10 PTC6/ LLWU_P10 PTC2 PTB19 PTB11 NC C D NC NC PTD1 PTD0/ LLWU_P12 PTC16 PTC9 PTC5/ LLWU_P9 PTC1/ LLWU_P6 PTB18 PTB10 NC D E NC PTE2/ LLWU_P1 PTE1/ LLWU_P0 PTE0 VDD VDD VDD NC PTB17 NC NC E F PTE16 PTE17 NC PTE3 VDDA VSSA VSS NC NC NC NC F G PTE18 PTE19 VSS PTE5 VREFH VREFL VSS PTB3 PTB2 PTB1 PTB0/ LLWU_P5 G H NC NC NC NC NC NC PTE4/ LLWU_P2 PTA1 PTA3 PTA17 NC H J NC NC NC NC NC PTA0 PTA2 PTA4/ LLWU_P3 NC PTA16 RESET_b J NC NC DAC0_OUT/ CMP1_IN3/ ADC0_SE23 VBAT PTA5 PTA12 PTA14 VSS PTA19 K XTAL32 EXTAL32 VSS PTA15 VDD PTA18 L 4 5 6 9 10 11 K PGA0_DP/ PGA0_DM/ ADC0_DP0/ ADC0_DM0/ ADC1_DP3 ADC1_DM3 L VREF_OUT/ PGA1_DP/ PGA1_DM/ CMP1_IN5/ ADC1_DP0/ ADC1_DM0/ CMP0_IN5/ ADC0_DP3 ADC0_DM3 ADC1_SE18 1 2 3 RTC_ PTA13/ WAKEUP_B LLWU_P4 7 8 Figure 30. K10 81 MAPBGA Pinout Diagram 9 Revision History The following table provides a revision history for this document. Table 46. Revision History Rev. No. Date 1 3/2012 Substantial Changes Initial public release Table continues on the next page... K10 Sub-Family Data Sheet, Rev. 2, 4/2012. Freescale Semiconductor, Inc. 71 Revision History Table 46. Revision History (continued) Rev. No. Date 2 4/2012 Substantial Changes * * * * * * Replaced TBDs throughout. Updated "Power consumption operating behaviors" table. Updated "ADC electrical specifications" section. Updated "VREF full-range operating behaviors" table. Updated "I2S/SAI Switching Specifications" section. Updated "TSI electrical specifications" table. K10 Sub-Family Data Sheet, Rev. 2, 4/2012. 72 Freescale Semiconductor, Inc. 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