HD74AC539
Dual 1-of-4 Decoder with 3-State Output
Description
The HD74AC539 contains two inpedendent decoders. Each accepts two Address (A0, A1) input signals and
decodes them to select one of four mutually exclusive outputs. A polarity control input (P) determines
whether the outputs are active HIGH (P = L) or active LOW (P = H). An active LOW input Enable (E) is
available for data demultiplexing; data is routed to the selected output in non-inverted form in the active
LOW mode or in inverted form in the active HIGH mode. A HIGH signal on the active LOW Output
Enable (OE) input forces the 3-state outputs to the high impedance state.
Feature
• Outputs Source/Sink 24 mA
HD74AC539
2
Pin Arrangement
1
2
3
4
5
6
7
8
9
10 11
12
13
14
15
16
17
18
19
20 VCC
O3b
A1b
A0b
Eb
Ea
O2b
O1b
O0b
Pb
OEb
A0a
A1a
O3a
O2a
GND
OEa
Pa
O0d
O1a
(Top view)
Logic Symbol
P
DECODER a
A0
O0O1O2O3
A1
E
OE
P
DECODER b
A0
O0O1O2O3
A1
E
OE
HD74AC539
3
Pin Names
A0a to A1a Side A Address Inputs
A0b to A1b Side B Address Inputs
Ea – EbEnable Inputs (Active LOW)
OEa, OEbOutput Enable Inputs (Active LOW)
Pa, PbPolarity Control Inputs
O0a to O3a Side A 3-State Outputs
O0b to O3b Side B 3-State Outputs
Truth Table
Inputs Outputs
Function OE E A1A0O0O1O2O3
High impedance H X X X ZZZZ
Disable L H X X On = P
Active HIGH output LLLLHLLL
(P = L) LLLHLHLL
LLHLLLHL
LLHHLLLH
Active LOW output LLLLLHHH
(P = H) LLLHHLHH
LLHLHHLH
LLHHHHHL
H : High Voltage Level
L : Low Voltage Level
X : Immaterial
Z : High Impedance
HD74AC539
4
Logic Diagram (one half shown)
A1
A0
O0O1O2O3
P
E
OE
Please note that this diagram is provided only for the understanding of logic operations and should not be
used to estimate propagation delays.
DC Characteristics (unless otherwise specified)
Item Symbol Max Unit Condition
Maximum quiescent supply current ICC 80 µAV
IN = VCC or ground, VCC = 5.5 V,
Ta = Worst case
Maximum quiescent supply current ICC 8.0 µAV
IN = VCC or ground, VCC = 5.5 V,
Ta = 25°C
HD74AC539
5
AC Characteristics: HD74AC539
Ta = +25°C
CL = 50 pF Ta = –40°C to +85°C
CL = 50 pF
Item Symbol VCC (V)*1Min Typ Max Min Max Unit
Propagation delay tPLH 3.3 1.0 — 15.0 1.0 18.0 ns
An to On5.0 1.0 — 10.0 1.0 12.0
Propagation delay tPHL 3.3 1.0 — 15.0 1.0 18.0 ns
An to On5.0 1.0 — 10.0 1.0 12.0
Propagation delay tPLH 3.3 1.0 — 14.5 1.0 16.5 ns
E to On5.0 1.0 — 9.5 1.0 11.0
Propagation delay tPHL 3.3 1.0 — 13.5 1.0 15.5 ns
E to On5.0 1.0 — 9.0 1.0 11.5
Propagation delay tPLH 3.3 1.0 — 16.0 1.0 19.0 ns
P to On5.0 1.0 — 11.5 1.0 12.5
Propagation delay tPHL 3.3 1.0 — 16.0 1.0 19.0 ns
P to On5.0 1.0 — 11.5 1.0 12.5
Propagation delay tZH 3.3 1.0 — 10.0 1.0 11.5 ns
OE to On5.0 1.0 — 8.0 1.0 9.0
Propagation delay tZL 3.3 1.0 — 9.5 1.0 11.0 ns
OE to On5.0 1.0 — 7.5 1.0 8.5
Propagation delay tHZ 3.3 1.0 — 11.5 1.0 13.0 ns
OE to On5.0 1.0 — 9.5 1.0 10.5
Propagation delay tLZ 3.3 1.0 — 10.5 1.0 12.0 ns
OE to On5.0 1.0 — 8.5 1.0 9.5
Note: 1. Voltage Range 3.3 is 3.3 V ± 0.3 V
Voltage Range 5.0 is 5.0 V ± 0.5 V
Capacitance
Item Symbol Typ Unit Condition
Input capacitance CIN 4.5 pF VCC = 5.5 V
Power dissipation capacitance CPD 60 pF VCC = 5.0 V
Hitachi Code
JEDEC
EIAJ
Weight
(reference value)
DP-20N
—
Conforms
1.26 g
Unit: mm
0.51 Min
2.54 Min 5.08 Max
7.62
0.25+ 0.11
– 0.05
2.54 ± 0.25 0.48 ± 0.10
24.50
25.40 Max
0.89 1.30
6.30
7.00 Max
110
1120
0° – 15°
1.27 Max
Hitachi Code
JEDEC
EIAJ
Weight
(reference value)
FP-20DA
—
Conforms
0.31 g
Unit: mm
*Dimension including the plating thickness
Base material dimension
*0.42 ± 0.08
0.12
0.15
M
20
10
1
*0.22 ± 0.05
0.80 Max
11
12.6
5.5
2.20 Max
13 Max
0° – 8°
0.70 ± 0.20
+ 0.20
– 0.30
7.80
1.27
0.10 ± 0.10
1.15
0.40 ± 0.06
0.20 ± 0.04
Hitachi Code
JEDEC
EIAJ
Weight
(reference value)
FP-20DB
Conforms
—
0.52 g
Unit: mm
*Dimension including the plating thickness
Base material dimension
0.12
0.15
0° – 8°
M
20 11
0.20 ± 0.10
1
1.27
10
12.8
13.2 Max
7.50
2.65 Max
*0.27 ± 0.05
*0.42 ± 0.08
+ 0.57
– 0.30
0.70
+ 0.25
– 0.40
10.40
1.45
0.935 Max
0.40 ± 0.06
0.25 ± 0.04
Hitachi Code
JEDEC
EIAJ
Weight
(reference value)
TTP-20DA
—
—
0.07 g
Unit: mm
*Dimension including the plating thickness
Base material dimension
0.50 ± 0.10
0° – 8°
*0.17 ± 0.05
6.40 ± 0.20
0.10
1.10 Max
0.13 M
0.65
110
20 11
4.40
6.50
6.80 Max
*0.22+0.08
–0.07
0.07+0.03
–0.04
1.0
0.65 Max
0.20 ± 0.06
0.15 ± 0.04
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
Hitachi Asia Pte. Ltd.
16 Collyer Quay #20-00
Hitachi Tower
Singapore 049318
Tel: 535-2100
Fax: 535-1533
URL NorthAmerica : http:semiconductor.hitachi.com/
Europe : http://www.hitachi-eu.com/hel/ecg
Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm
Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan : http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Asia Ltd.
Taipei Branch Office
3F, Hung Kuo Building. No.167,
Tun-Hwa North Road, Taipei (105)
Tel: <886> (2) 2718-3666
Fax: <886> (2) 2718-8180
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Telex: 40815 HITEC HX
Hitachi Europe Ltd.
Electronic Components Group.
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 778322
Hitachi Europe GmbH
Electronic components Group
Dornacher Stra§e 3
D-85622 Feldkirchen, Munich
Germany
Tel: <49> (89) 9 9180-0
Fax: <49> (89) 9 29 30 00
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
For further information write to:
