LF80537GG0332M - Intel

Intel® Core™2 Duo Processors and

Intel® Core™2 Extreme Processors

for Platforms Based on Mobile Intel®

965 Express Chipset Family

Datasheet

January 2008

Document Number: 316745-005

2Datasheet

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Datasheet 3

Contents

1Introduction..............................................................................................................7

1.1 Terminology .......................................................................................................8

1.2 References .........................................................................................................9

2 Low Power Features ................................................................................................11

2.1 Clock Control and Low Power States ....................................................................11

2.1.1 Core Low Power State Descriptions...........................................................13

2.1.2 Package Low Power State Descriptions......................................................15

2.2 Enhanced Intel Speed S tep ® Te chnolog y ... .. .. ............. .. ............. .. ............. .. ..........18

2.2.1 Dynamic FSB Frequency Switching ...........................................................19

2.2.2 Intel® Dynamic Acceleration Technology...................................................19

2.3 Extended Low Power States................................................................................19

2.4 FSB Low Power Enhancements............................................................................20

2.5 VID-x ..............................................................................................................21

2.6 Processor Power Status Indicator (PSI-2) Signal....................................................21

3 Electrical Specifications...........................................................................................23

3.1 Power and Ground Pins ......................................................................................23

3.2 FSB Clock (BCLK[1:0]) and Processor Clocking......................................................23

3.3 Voltage Identification.........................................................................................23

3.4 Catastrophic Therm al Pro tec tion.............................. .. .. ............. .. ............. .. .. ........26

3.5 Reserved and Unused Pins..................................................................................26

3.6 FSB Frequency Select Signals (BSEL[2:0])............................................................27

3.7 FSB Signal Groups.............................................................................................27

3.8 CMOS Signals ...................................................................................................29

3.9 Maximum Ratings . .............................................................................................29

3.10 Processor DC Specifications ................................................................................30

4 Package Mechanical Specifications and Pin Information ..........................................41

4.1 Package Mechanical Specifications........ .. .. .. .........................................................41

4.2 Processor Pinout and Pin List ..............................................................................49

4.3 Alphabetical Signals Reference............................................................................69

5 Thermal Specifications and Design Considerations ..................................................77

5.1 Thermal Specifications.......................................................................................80

5.1.1 Thermal Diode.......................................................................................81

5.1.2 Thermal Diode Offset..............................................................................83

5.1.3 Intel® Thermal Monitor...........................................................................84

5.1.4 Digital Thermal Sensor............................................................................86

5.1.5 Out of Specification Detection .............. .. ............ .. ... ............ .. .. ... ............ ..87

5.1.6 PROCHOT# Signal Pin.............................................................................87

4Datasheet

Figures

1 Core Low Power States..............................................................................................12

2 Package Low Power States.........................................................................................13

3 Active VCC and ICC Loadline Intel Core 2 Duo Processors - Standard Voltage,

Low Voltage and Ultra Low Voltage and Intel Core 2 Extreme Processors |

(PSI# Not Asserted) .................................................................................................36

4 Deeper Sleep VCC and ICC Loadline Intel Core 2 Duo Processors -

Standard Voltage and Intel Core 2 Extreme Processors (PSI# Asserted)...........................37

5 Deeper Sleep VCC and ICC Load line Intel Core 2 Duo Processor -

Low Voltage and Ultra Low Voltage (PSI# Asserted)......................................................38

6 4-MB and Fused 2-MB Micro-FCPGA Processor Package Drawing (Sheet 1 of 2).................42

7 4-MB and Fused 2-MB Micro-FCPGA Processor Package Drawing (Sheet 2 of 2).................43

8 2-MB Micro-FCPGA Processor Package Drawing (Sheet 1 of 2) ........................................44

9 2-MB Micro-FCPGA Processor Package Drawing (Sheet 2 of 2) ........................................45

10 4-MB and Fused 2-MB Micro-FCBGA Processor Package Drawing (Sheet 1 of 2) ................. 46

11 4-MB and Fused 2-MB Micro-FCBGA Processor Package Drawing (Sheet 2 of 2) ................. 47

12 2-MB Micro-FCBGA Processor Package Drawing (Sheet 1 of 2)........................................48

13 2-MB Micro-FCBGA Processor Package Drawing (Sheet 2 of 2)........................................49

Tables

1 Coordination of Core Low Power States at the Package Level..........................................13

2 Voltage Identification Definition..................................................................................23

3 BSEL[2:0] Encodi ng for BCLK Freq uency............. .. ............. ............. ............ ............. ....27

4 FSB Pin Groups ........................................................................................................28

5 Processor Absolute Maximum Ratings..........................................................................29

6 Voltage and Current Specifications for the Intel Core 2 Duo Processors -

Standard Voltage......................................................................................................30

7 Voltage and Current Specifications for the Intel Core 2 Duo Processors -

Low Voltage................ ... .. ............ ............................................. ...............................32

8 Voltage and Current Specifications for the Intel Core 2 Duo -Ultra Low

Voltage Processors ...................................................................................................33

9 Voltage and Current Specifications for the Intel Core 2 Extreme Processors......................34

10 FSB Differential BCLK Specifications............................................................................38

11 AGTL+ Signal Group DC Specifications ........................................................................39

12 CMOS Signal Group DC Specifications..........................................................................40

13 Open Drain Signal Group DC Specifications ..................................................................40

14 The Coordinates of the Processor Pins as Viewed from the Top of the Package

(Sheet 1 of 2). .. .. .....................................................................................................50

15 The Coordinates of the Processor Pins as Viewed from the Top of the Package

(Sheet 2 of 2). .. .. .....................................................................................................51

16 Pin Listing by Pin Name.............................................................................................53

17 Pin Listing by Pin Number..........................................................................................60

18 Signal Description............. ..................... .. .. ...............................................................69

19 Power Specifications for the Intel Core 2 Duo Processor - Standard Voltage......................77

20 Power Specifications for the Intel Core 2 Duo Processor - Low Voltage................ .. ...........78

21 Power Specifications for the Intel Core 2 Duo Processor - Ultra Low Voltage .....................79

22 Power Specifications for the Intel Core 2 Extreme Processor...........................................80

23 Thermal Diode Interface............................................................................................81

24 Thermal Diode Parameters Using Diode Model..............................................................82

25 Thermal Diode Parameters Using Transistor Model ........................................................83

26 Thermal Diode ntrim and Diode Correction Toffset ........................................................84

Datasheet 5

Revision History

Document

Number Revision

Number Description Date

316745 -001 • Initial Release May 2007

316745 -002

• Updates

—Chapter 1 added Intel® Core™2 Duo processor - Ultra

Low Voltage information

—Chapter 3 added Table 8 with Intel Core 2 Duo processor -

Ultra Low Voltage U7600 and U7500 specifications

—Chapter 3 updated Figure 3 and 5 with Intel Core 2 D uo

processor - Ultra Low Voltage information

—Chapter 5 added Table 19 with Intel Core 2 Duo processor

-Ultra Low Voltage U7600 and U7500 specifications

June 2007

316745 -003

• Updates

—Chapter 1 added Intel® Core™2 Extreme processor

—Chapter 3 added Table 9 with Intel Core 2 Extreme

processor X7800 specifications

—Chapter 3 updated Figure 3 and 4 with Intel Core 2

Extreme processor information

— Chapter 5 added Table 20 with Intel Core 2 Extreme

processor X7800 specifications

— Corrected the pin diagram for 4-MB Micro-FCPGA and

2-MB Micro-FCPGA Processor Package Drawings

July 2007

316745 -004

• Updates

—Chapter 3 added Intel Core 2 Extreme processor X7900

and Low Voltage processor L7700 specifications

— Chapter 5 added Intel Core 2 Extreme processor X7900

and Low Voltage processor L7700 specifications

August 2007

316745 -005

• Updates

—Chapter 3 added Table 8 with Intel Core 2 Duo processor -

Ultr a Low Voltage U7700 specifications

—Chapter 5 added Table 21 with Intel Core 2 Duo processor

-Ultra Low Voltage U7700 specifications

January 2007

6Datasheet

Datasheet 7

Introduction

1 Introduction

The Intel® Core™2 Duo processor on 65-nm process technology is the next generation

high-performance, low-power processor based on the Intel® Core™ microarchitecture.

The Intel Core 2 Duo processor supports the Mobile Intel® 965 Express Chipset and

Intel® 82801HBM ICH8M Controller Hub Based Systems. This document contains

electrical, mechanical and thermal specifications for the following processors:

• Intel Core 2 Duo processor - Standard Voltage

• Intel Core 2 Duo processor - Low Voltage

• Intel Core 2 Duo processor - Ultra Low Voltage

• Intel Core 2 Extreme processor

Note: In this document, the Intel Core 2 Duo and Intel Core 2 Extreme processors are

referred to as the processor and Mobile Intel® 965 Express Chipset family is referred to

as the (G)MCH.

The following list provides some of the key features on this processor:

• Dual core processor for mobile with enhanced performance

• Intel architecture with Intel® Wide Dynamic Execution

• L1 Cache to Cache (C2C) transfer

• On-die, primary 32-KB instruction cache and 32-KB write-back data cache in each

core

• On-die, up to 4-MB second level shared cache with advanced transfer cache

architecture

• Streaming SIMD Extensions 2 (SSE2), Streaming SIMD Extensions 3 (SSE3) and

Supplemental Streaming SIMD Extensions 3 (SSSE3)

• 800-MHz Source-Synchronous Front Side Bus (FSB) for Intel Core 2 Extreme

processors, Intel Core 2 Duo standard and low voltage processors. 533-MHz FSB

for Intel Core 2 Duo ultra low voltage processors

• Advanced power management features including Enhanced Intel SpeedStep®

Technology and Dynamic FSB frequency switching.

• Intel Enhanced Deeper Sleep state with P_LVL5 I/O support

• Digital Thermal Sensor (DTS)

• I ntel® 64 Technology

• Enhanced Intel® Virtualization Technology

• Intel® Dynamic Acceleration Technology

• Enhanced Multi Threaded Thermal Management (EMTTM)

• P SI2 functionalit y

• Standard voltage processors are offered in Micro-FCPGA and Micro-FCBGA

packaging. Low voltage and Ultra low voltage processors are offered in Micro-

FCBGA packaging only. Intel Core 2 Extreme processors are offered in Micro-FCPGA

packaging only.

• E xecute Disable Bit support for enhanced security

Introduction

8 Datasheet

1.1 Terminology

Term Definition

A “#” symbol after a signal name refers to an active low signal, indicating a

signal is in the active state when driven to a low level. For example, when

RESET# is low, a reset has been requested. Conversely, when NMI is high,

a nonmaskable interrupt has occurred. In the case of signals whe r e the

name does not imply an active state but describes part of a binary

sequence (such as address or data), the “#” symbol implies th at the s ignal

is inverted. For example, D[3:0] = “HLHL” refers to a hex ‘A’, and D[3:0]#

= “LHLH” also refers to a hex “A” (H= High logic level, L= Low logic level).

XXXX means that the specification or value is yet to be determined.

Front Side Bus

(FSB) Refers to the interface between the processor and system core logic (also

known as the chipset components).

AGTL+ Advanced Gunning Transceiver Logic. Used to refer to Assisted GTL+

signaling technology on some Intel processors.

Storage

Conditions

Refers to a non-operational state. The processor may be installed in a

platform, in a tray, or loose. Processors may be sealed in packaging or

exposed to free air. Under these conditions, processor landings should not

be connected to any supply voltages, have any I/Os biased or receive any

clocks. Upon exposure to “free air” (i.e., unsealed packagin g or a device

removed from packaging material) the processor must be handled in

accordance with moisture sensitivity labeling (MSL) as indicated on the

packaging material.

Enhanced Intel

SpeedStep®

Technology Technology that provides power management capabilities to laptops.

Processor Core Processor core die with integrated L1 and L2 cache. All AC timing and

signal integrity specifications are at the pads of the processor core.

Intel® 64

Technology 64-bit memory extensions to the IA-32 architecture.

Intel®

Virtualization

Technology

Processor virtualization which when used in conjunction with Virtual

Machine Monitor software enables multiple, robust independent software

environments inside a single platform.

TDP Thermal Design Power

VCC The processor core power supply

VSS The processor ground

Datasheet 9

Introduction

1.2 References

Material and concepts available in the following documents may be beneficial when

reading this document.

NOTES:

1. Contact your local Intel representative for the latest revision of this document.

Document Document Number1,2

Intel® Core™ 2 Duo Processors For Intel® Centrino® Duo Processor

Technology Specification Update 314079

Mobile Intel® 965 Express Chipset Family Datasheet 316273

Mobile Intel® 965 Express Chipset Family Specification Update 316274

Intel® I/O Controller Hub 8 (ICH8)/ I/O Controller Hub 8M (ICH8M)

Datasheet

See http://

www.intel.com/design/

chipsets/datashts/

313056.htm

Intel® I/O Controller Hub 8 (ICH8)/ I/O Controller Hub 8M (ICH8M)

Specification Update

See http://

www.intel.com/design/

chipsets/specupdt/

313057.htm

Intel® 64 and IA-32 Architectures Software Developer’s Manual

See http://

www.intel.com/design/

pentium4/manuals/

index_new.htm

Intel® 64 and IA-32 Architectures Software Developer's Manuals

Documentation Change

See http://

developer.intel.com/

design/processor/

specupdt/252046.htm

Volume 1: Basic Architecture 253665

Volume 2A: Instruction Set Reference, A-M 253666

Volume 2B: Instruction Set Reference, N-Z 253667

Volume 3A: System Programming Guide 253668

Volume 3B: System Programming Guide 253669

Introduction

10 Datasheet

Datasheet 11

Low Power Features

2 Low Power Features

2.1 Clock Control and Low Power States

The processor supports low power states both at the individual core level and the

package level for optimal power management.

A core may independently enter the C1/AutoHALT, C1/MWAIT, C2, C3, and C4 low

power states. When both cores coincide in a common core low power state, the centr al

power management logic ensures that the entire processor enters the respective

package low power state by initiating a P_LVLx (P_LV L2, P_LVL3, P_LVL4, or P_LVL5)

I/O read to the chipset.

The processor implements two software interfaces for requesting low power states:

MWAIT instruction extensions with sub-state hints or P_LVLx reads to the ACPI P_BLK

converted to equivalent MWAIT C-state requests inside the processor and do not

directly result in I/O reads on the processor FSB. The P_L VLx I/O monitor address does

not need to be set up before using the P_LVLx I/O read interface. The sub-state hints

used for each P_LVLx read can be configured through the Model Specific Register

(MSR).

If a core encounters a chipset break event while STPCLK# is asserted, then it asserts

the PBE# output signal. Assertion of PBE# when STPCLK# is asserted indicates to

system logic that individual cores should return to the C0 state and the processor

should return to the Normal state.

Figure 1 shows the core low power states and Figure 2 shows the package low power

states. Table 1 maps the core low power states to the package low power states.

Low Power Features

12 Datasheet

Figure 1. Core Low Power States

C2†

Stop

Grant

Core state

break

P_LVL2 or

MWAIT(C2)

C3†

Core

state

break

P_LVL3 or

MWAIT(C3)

C1/

MWAIT Core state

break

MWAIT(C1)

C1/Auto

Halt

Halt break

HLT instruction

C4†‡

Core State

break

P_LVL4 or

P_LVL5ø or

MWAIT(C4)

STPCLK#

de-asserted

STPCLK#

asserted

STPCLK#

de-asserted

STPCLK#

asserted

STPCLK#

de-asserted

STPCLK#

asserted

halt break = A20M# transition, INIT#, INTR, NMI, PREQ#, RESET#, SMI#, or APIC interrupt

core state break = (halt break OR Monitor event) AND STPCLK# high (not asserted)

† — STPCLK# assertion and de-assertion have no effect if a core is in C2, C3, or C4.

‡ — Core C4 state supports the package level Intel Enhanced Deeper Sleep state.

Ø — P_LV L5 read is issued once the L2 cache is redu ce d to zero.

Datasheet 13

Low Power Features

NOTES:

1. AutoHALT or MWAIT/C1.

2.1.1 Core Low Po wer State Descript ions

2.1.1.1 Core C0 State

This is the normal operating state for cores in the processor.

2.1.1.2 Core C1/AutoHALT Powerdown State

C1/AutoHALT is a low power state entered when a core executes the HALT instruction.

The processor transitions to the C0 state upon occurren c e of SMI#, INIT#, LINT[1:0]

(NMI, INTR), or FSB interrupt messages. RESET# causes the processor to immediately

initialize itself.

Figure 2. P a ckage Low Power States

Table 1. Coordination of Core Low Power States at the Package Level

Package State Core1 State

Core0 State C0 C11C2 C3 C4

C0 Normal Normal Normal Normal Normal

C11Normal Normal Normal Normal Normal

C2 Normal Normal Stop-Grant Stop Grant Stop Grant

C3 Normal Normal Stop-Grant Deep Sleep Deep Sleep

C4 Normal Normal Stop-Grant Deep Sleep

Deeper Sleep

/ Intel®

Enhanced

Deeper Sleep

Stop

Grant

Snoop

Normal Stop

Grant Deep

Sleep

STP CLK# asserted

Snoop

serviced Snoop

occurs

Deeper

Sleep†

Sleep

SLP# asserted

SLP# deasserted

DPSLP# asserted

DP SLP# deasserted DP RS TP# deasserted

DPRSTP# asserted

STP C LK# deasserted

† — D eeper Sleep includes the Deeper Sleep state and Intel Enhanced Deeper Sleep state.

Low Power Features

14 Datasheet

A System Management Interrupt (SMI) handler returns execution to either Normal

state or the AutoHALT Powerdown state. See the Intel® 64 and IA-32 Architectures

Software Developer’s Manual, Volume 3A/3B: System Programmer's Guide for more

information.

The system can generate a STPCLK# while the processor is in the AutoHALT

Powerdown state. When the system deasserts the STPCLK# interrupt, the processor

returns execution to the HALT state.

While in AutoHALT Powerdown state, the dual core processor processes bus snoops and

snoops from the other core. The processor enters a snoopable sub-state (not shown in

Figure 1) to process the snoop and then return to the AutoHALT Powerdown state.

2.1.1.3 Core C1/MWAIT Powerd own State

C1/MWAIT is a low power state entered when the processor core executes the

MWAIT(C1) instruction. Processor behavior in the MWAIT state is identical to the

AutoHALT state except that Monitor events can cause the processor core to return to

the C0 state. See the Intel® 64 and IA-32 Architectures Software Developer’s Manual,

Volume 2A: Instruction Set Reference, A-M and Volume 2B: Instruction Set Reference,

N-Z, for more information.

2.1.1.4 Core C2 State

Individual cores of the dual core processor can enter the C2 state by initiating a P_L VL2

I/O read to the P_BLK or an MWAIT(C2) instruction, but the processor does not issue a

Stop-Grant Acknowledge special bus cycle unless the STPCLK# pin is also asserted.

While in the C2 state, the dual core processor processes bus snoops and snoops from

the other core. The processor enters a snoopable sub-state (not shown in Figure 1) to

process the snoop and then return to the C2 state.

2.1.1.5 Core C3 State

Individual cores of the dual core processor can enter the C3 state by initiating a P_L VL3

I/O read to the P_BLK or an MWAIT(C3) instruction. Before entering C3, the processor

core flushes the contents of its L1 caches into the processor’s L2 cache. Except for the

caches, the processor core maintains all its architectural state in the C3 state. The

monitor remains armed if it is configured. All of the clocks in the processor core are

stopped in the C3 state.

Because the core’s caches are flushed the processor keeps the core in the C3 state

when the processor detects a snoop on the FSB or when the other core of the dual core

processor accesses cacheable memory. The processor core transitions to the C0 state

upon occurrence of a Monitor event, SMI#, INIT#, LINT[1:0] (NMI, INTR), or FSB

interrupt message. RESET# causes the processor to immediately initialize itself.

2.1.1.6 Core C4 State

Individual cores of the dual core processor can enter the C4 state by initiating a P_L VL4

I/O read to the P_BLK or an MWAIT(C4) instruction. The processor core beha vior in the

C4 state is nearly identical to the behavior in the C3 state. The only difference is that if

both processor cores are in C4, then the central power management logic requests that

the entire processor enter the Deeper Sleep package low power state (see

Section 2.1.2.6).

To enable the package level Intel Enhanced Deeper Sleep state, Dynamic Cache Sizing

and Intel Enhanced Deeper Sleep state fields must be configured in the software

programmable MSR. Refer to Section 2.1.2.6 for further details on Intel Enhanced

Deeper Sleep state.

Datasheet 15

Low Power Features

2.1.2 Package Low Power State Descriptions

2.1.2.1 Normal State

This is the normal operating state for the processor. The processor remains in the

Normal state when at least one of its cores is in the C0, C1/AutoHALT, or C1/MWAIT

state.

2.1.2.2 Stop-Grant State

When the STPCLK# pin is asserted by the chipset, each core of the dual core processor

enters the Stop-Grant state within 20-bus clocks after the response phase of the

processor-issued Stop-Grant Acknowledge special bus cycle. Processor cores that are

already in the C2, C3, or C4 state remain in their current low power state. When the

STPCLK# pin is deasserted, each core returns to its previous core low power state.

Since the AGTL+ signal pins receive power from the FSB, these pins should not be

driven (allowing the level to return to VCCP) for minimum power drawn by the

termination resistors in this state. In addition, all other input pins on the FSB should be

driven to the inactive state.

RESET# causes the processor to immediately initialize itself, but the processor stays in

Stop-Grant state. When RESET# is asserted by the system, the STPCLK#, SLP#,

DPSLP#, and DPRSTP# pins must be deasserted prior to RESET# deassertion. When

re-entering the Stop-Grant state from the Sleep state, STPCLK# should be deasserted

after the deassertion of SLP#.

While in Stop-Grant state, the processor services snoops and latch interrupts delivered

on the FSB. The processor latches SMI#, INIT# and LINT[1:0] interrupts and services

only one of each upon return to the Normal state.

The PBE# signal may be driven when the processor is in Stop-Grant state. PBE#

asserts if there is any pending interrupt or Monitor event latched within the processor.

Pending interrup ts that are blocked by the EFLAGS.IF bit being clear causes assertion

of PBE#. Assertion of PBE# indicates to system logic that the entire processor should

return to the Normal state.

A transition to the Stop-Grant Snoop state occurs when the processor detects a snoop

on the FSB (see Section 2.1.2.3). A transition to the Sleep state (see Section 2.1.2.4)

occurs with the assertion of the SLP# signal.

2.1.2.3 Stop-Grant Snoop State

The processor responds to snoop or interrupt transactions on the FSB while in Stop-

Grant state by entering the Stop-Grant Snoop state. The processor stays in this state

until the snoop on the FSB has been serviced (whether by the processor or another

agent on the FSB) or the interrupt has been latched. The processor returns to the Stop-

Grant state once the snoop has been serviced or the interrupt has been latched.

2.1.2.4 Sleep State

The Sleep state is a low power state in which the processor maintains its context,

maintains the phase-locked loop (PLL), and stops all internal clocks. The Sleep state is

entered through assertion of the SLP# signal while in the Stop-Grant state. The SLP#

pin should only be asserted when the processor is in the Stop-Grant state. SLP#

assertions while the processor is not in the Stop-Grant state is out of specification and

may result in unapproved operation.

Low Power Features

16 Datasheet

In the Sleep state, the processor is incapable of responding to snoop transactions or

latching interrupt signals. No transitions or assertions of signals (with the exception of

SLP#, DPSLP# or RESET#) are allowed on the FSB while the processor is in Sleep

state. Snoop events that occur while in Sleep state or during a transition into or out of

Sleep state causes unpredictable behavior. Any transition on an input signal before the

processor has returned to the Stop-Grant state results in unpredictable behavior.

If RESET# is driven active while the processor is in the Sleep state, and held active,

then the processor resets itself, ignoring the transition through Stop-Grant state. If

RESET# is driven active while the processor is in the Sleep state, the SLP# and

STPCLK# signals should be deasserted immediately after RESET# is asserted to ensure

the processor correctly executes the Reset sequence.

While in the Sleep state, the processor is capable of entering an even lower power

state, the Deep Sleep state, by asserting the DPSLP# pin (See Section 2.1.2.5). While

the processor is in the Sleep state, the SLP# pin must be deasserted if another

asynchronous FSB event needs to occur.

2.1.2.5 Deep Sleep State

The Deep Sl eep state is entere d through assertion of the DP SLP# pin while i n the Sleep

state. BCLK may be stopped during the Deep Sleep state for additional platform-level

power savings. BCLK stop/restart timings on appropriate chipset based platforms with

the CK505 clock chip are as follows:

• Deep Sleep entry: the system clock chip may stop/tristate BCLK within 2 BCLKs of

DPSLP# assertion. It is permissible to leave BCLK running during Deep Sleep.

• Deep Sleep exit: the system clock chip must drive BCLK to differential DC levels

within 2-3 ns of DPSLP# deassertion and start toggling BCLK within 10 BCLK

periods.

To re-enter the Sleep state, the DP SLP# pin must be deasserted. BCLK can be re-

started after DPSLP# deassertion as described above. A period of 15 microseconds (to

allow for PLL stabilization) must occur before the processor can be considered to be in

the Sleep state. Once in the Sleep state, the SLP # pin must be deasserted to re-enter

the Stop-Grant state.

While in Deep Sleep state, the processor is incapable of responding to snoop

transactions or latching interrupt signals. No transitions of signals are allowed on the

FSB while the processor is in Deep Sleep state. When the processor is in Deep Sleep

state, it does not respond to interrupts or snoop transactions. Any transition on an

input signal before the processor has returned to Stop-Grant state results in

unpredictable behavior.

2.1.2.6 Deeper Sleep State

The Deeper Sleep state is similar to the Deep Sleep state but further reduces core

voltage levels. One of the potential lower core voltage levels is achieved by entering the

base Deeper Sleep state. The De eper Sleep state is entered through assertion of the

DPRSTP# pin while in the Deep Sleep state. The other lower core voltage level, the

lowest possible in the processor, is achieved by entering the Intel Enhanced Deeper

Sleep state which is a sub-state of Deeper Sleep state. Intel Enhanced Deeper Sleep

state is entered through assertion of the DPRSTP# pin while in the Deep Sleep only

when the L2 cache has been completely shut down. Refer to Section 2.1.2.6.1 and

Section 2.1.2.6.2 for further details on reducing the L2 cache and entering Intel

Enhanced Deeper Sleep state.

In response to entering Deeper Sleep, the processor drives the VID code corresponding

to the Deeper Sleep core voltage on the VID[6:0] pins.

Datasheet 17

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Exit from Deeper Sleep or Intel Enhanced Deeper Sleep state is initiated by DPRSTP#

deassertion when either core requests a core st ate other than C4 or either core

requests a processor performance state other than the lowest operating point.

2.1.2.6.1 Intel Enhanced Deeper Sleep State

Intel Enhanced Deeper Sleep state is a sub-state of Deeper Sleep that extends power-

saving capabilities by allowing the processor to further reduce core voltage once the L2

cache has been reduced to zero ways and completely shut down. The following events

occur when the processor enters Intel Enhanced Deeper Sleep state:

• The last core entering C4 causes the package to issue a P_LVL4 IO Read.

• Every concurrent package C4 entry reduces the L2 Cache a certain number of

cache ways, after which another P_LVL4 IO Read is issued to the chipset. By

default, half the cache is flushed per concurrent C4 entry.

• Once the cache is flushed, P_LVL4 IO Reads continue to be issued.

• The processor drives the VID code corresponding to the Intel Enhanced Deeper

Sleep state core voltage on the VID[6:0] pins.

At this point, snoops to the L2 are still serviced, which reduces the amount of time the

processor can reside at the Intel Enhanced Deeper Sleep state core voltage.

To improve the Intel Enhanced Deeper Sleep state residency, the (G)MCH features

P_LVL5 IO R ead support. When enabled, the CPU issues a P_LV L5 IO read, once the L2

cache is flushed. The P_LVL5 IO read triggers a special chipset sequence to notify the

chipset to redirect all FSB traffic, except APIC messages, to memory instead of L2

cache. Therefore, the processor remains at the Intel Enhanced Deeper Sleep state core

voltage for a longer period of time.

2.1.2.6.2 Dynamic Cache Sizing

Dynamic Cache Sizing allows the processor to flush and disable a programmable

number of L2 cache ways upon each Deeper Sleep entry under the following

conditions:

• The second core is already in C4 and the Intel Enhanced Deeper Sleep state is

enabled (as specified in Section 2.1.1.6).

• The C0 timer, which tracks continuous residency in the Normal package state, has

not expired. This timer is cleared during the first entry into Deeper Sleep to allow

consecutive Deeper Sleep entries to shrink the L2 cache as needed.

• The FSB speed to processor core speed ratio is below the predefined L2 shrink

threshold.

If the FSB speed to processor core speed ratio is above the predefined L2 shrink

threshold, then L2 cache expansion is requested. If the ratio is zero, then the ratio is

not taken into account for Dynamic Cache Sizing decisions.

Upon STPCLK# deassertion, the first core exiting Intel Enhanced Deeper Sleep state

expands the L2 cache to two ways and invalidate previously disabled cache ways. If the

L2 cache reduction conditions stated above still exist when the last core returns to C4

and the package enters Intel Enhanced Deeper Sleep state, then the L2 is shrunk to

zero again. If a core requests a processor performance state resulting in a higher ratio

than the predefined L2 shrink threshold, the C0 timer expires, or the second core (not

the one currently entering the interrupt routine) requests the C1, C2, or C3 states,

then all of L2 expands upon the next interrupt event.

L2 cache shrink prevention may be enabled as needed on occasion through an

MWAIT(C4) sub-state field. If shrink prevention is enabled the processor does not enter

Intel Enhanced Deeper Sleep state because the L2 cache remains valid and in full size.

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18 Datasheet

2.2 Enhanced Intel SpeedStep® Technology

The processor features Enhanced Intel SpeedStep Technology. Following are the key

features of Enhanced Intel SpeedStep Technology:

• Multiple voltage and frequency operating points provide optimal performance at the

lowest power.

• Voltage and frequency selection is software-controlled by writing to processor

MSRs:

— If the target frequency is higher than the current frequency, Vcc is ramped up

in steps by placing new values on the VID pins, and the PLL then locks to the

new frequency.

— If the target frequency is lower than the cur rent frequency, the PLL locks to the

new frequency, and the VCC is changed through the VID pin mechanism.

— Software transitions are accepted at any time. If a previous transition is in

progress the new transition is deferred until the previous transition completes.

• The processor controls voltage ramp rates internally to ensure glitch-free

transitions.

• Low transition latency and large number of transitions possible per second:

— Processor core (including L2 cache) is unavailable for up to 10 ms during the

frequency transition.

— The bus protocol (BNR# mechanism) is used to block snooping.

• Improved Intel® Thermal Monitor mode:

— When the on-die thermal sensor indicates that the die temperature is too high,

the processor can automatically perform a transition to a lower frequency and

voltage specified in a software-programmable MSR.

— The processor waits for a fixed time period. If the die temperature is down to

acceptable levels, an up-transition to the previous frequency and voltage poin t

occurs.

— An interrupt is generated for the up and down Intel Thermal Monitor tr ansitions

enabling better system-level thermal management.

• Enhanced thermal management features:

— Digital Thermal Sensor and Out of Specification detection

— Intel Thermal Monitor 1 in addition to Intel Thermal Monitor 2 in case of

unsuccessful Intel Thermal Monitor 2 transition.

— Dual core thermal management synchronization.

Each core in the dual processor implements an independent MSR for controlling

Enhanced Intel SpeedStep Technology, but both cores must operate at the same

frequency and voltage. The processor has performance state coordination logic to

resolve frequency and voltage requests from the two cores into a single frequency and

voltage request for the package as a whole. If both cores request the same frequency

and voltage, then the processor transitions to the requested common frequency and

voltage. If the two cores have different frequency and voltage requests, then the

processor takes the highest of the two frequencies and voltages as the resolved

request, and transition to that frequency and voltage.

The processor also supports Dynamic FSB Frequency Switching and Intel® Dynamic

Acceleration Technology mode on select SKUS. The operating system can take

advantage of these features and requ est a lower operating point called SuperLFM (due

to Dynamic FSB Frequency Switching) and a higher operating point Intel Dynamic

Acceleration Te chnology mode.

Datasheet 19

Low Power Features

2.2.1 Dynamic FSB Frequency Switching

Dynamic FSB frequency switching effectively reduces the internal bus clock frequency

in half to further decrease the minimum processor operating frequency from the

Enhanced Intel SpeedStep Technology performance states and achieve the Super Low

Frequency Mode (SuperLFM). This feature is supported at FSB frequencies of 800-MHz

and does not entail a ch ange in the external bus signal (BCLK) frequency. Instead, both

the processor and (G)MCH internally lower their BCLK reference frequency to 50% of

the externally visible frequency. Both the processor and (G)MCH maintain a virtual

BCLK signal (“VBCLK”) that is aligned to the external BCLK but at half the frequency.

After a downward shift, it would appear externally as if the bus is running with a

100-MHz base clock in all aspects, except that the actual external BCLK remains at

200 MHz. The transition into SuperLFM, a “down-shift”, is done following a handshake

between the processor and (G)MCH. A similar handshake is used to indicate an “up-

shift”, a change back to normal operating mode.

2.2.2 Intel® Dynamic Acceleration Technology

The processor supports Intel Dynamic Acceleration Technology mode on select

platforms. The Intel Dynamic Acceleration Technology mode feature allows one core of

the processor to tempor arily operate at a high er frequency point when the other core is

inactive and the operating system requests increased performance. This higher

frequency is called the opportunistic frequency and the maximum rated operating

frequency is the guaranteed frequency.

Note: Intel Core 2 Extreme processors do not support Intel Dynamic Acceleration mode.

Intel Dynamic Acceleration Te chnology mode enabling requires:

• Exposure, via BIOS, of the opportunistic frequency as the highest ACPI P state.

• Enhanced Multi-Threaded Thermal Management (EMTTM).

• Intel Dynamic Acceleration Technology mode and EMTTM MSR configuration via

BIOS.

When in Intel Dynamic Acceleration Technology mode, it is possible for both cores to be

active under certain internal conditions. In such a scenario the processor may draw a

Instantaneous current (ICC_CORE_INST) for a short duration of tINST; however, the

average ICC current is lesser than or equal to ICCDES current specification. Please refer

to the Processor DC Specifications section for more details.

2.3 Extended Low Power States

Extended low power states (CxE) optimize for power by forcibly reducing the

performance state of the processor when it enters a package low power state. Instead

of directly transitioning into the package low power state, the extended package low

power state first reduces the performance state of the processor by performing an

Enhanced Intel SpeedStep Technology transition down to the lowest operating point.

Upon receiving a break event from the package low power state, control returns to the

software while an Enhanced Intel SpeedStep Technology transition up to the initial

operating poin t occurs. The advantage of this feature is that it significantly reduces

leakage while in low power states.

Note: Long-term reliability cannot be assured unless all the Extended Low Power states are

enabled.

Low Power Features

20 Datasheet

The processor implements two software interfaces for requesting extended package

low power states: MWAIT instruction extensions with sub-state hints and via BIOS by

configuring MSR bits to automatically promote package low power states to extended

package low power states.

Extended Stop-Grant and Extended Deeper Sleep must be enabled via the

BIOS for the processor to remain within specification. Any attempt to operate

the processor outside these operating limits may result in permanent damage to the

processor. As processor technology changes, enabling the extended low power states

becomes increasingly crucial when building computer systems. Maintaining the proper

BIOS configuration is key to reliable, long-term system operation. Not complying with

this guideline may affect the long-term reliability of the processor.

Enhance d I ntel SpeedStep Technology transitions are multistep processes that require

clocked control. These transitions cannot occur when the processor is in the Sleep or

Deep Sleep package low power states since processor clocks are not active in these

states. Extended Deeper Sleep state configuration lowers core voltage to the Deeper

Sleep level while in Deeper Sleep and, upon exit, automatically transitions to the lowest

operating voltage and frequency to reduce snoop service latency. The transition to the

lowest operating point or back to the original software requested point may not be

instantaneous. Furthermore, upon very frequent transitions between active and idle

states, the transitions may lag behind the idle state entry resulting in the processor

either executing for a longer time at the lowest operating point or running idle at a high

operating point. Observations and analyses show this behavior should not significantly

impact total power savings or performance score while providing power benefits in

most other cases.

2.4 FSB Low Power Enhancements

The processor incorporates FSB low power enhancements:

•Dynamic FSB Power Down

• BPRI# control for address and control input buffers

• Dynamic Bus Parking

• Dynamic On Die Termination disabling

•Low V

CCP (I/O termination voltage)

The processor incorporates the DPWR# signal that controls the data bus input buffers

on the processor. The DPWR# signal disables the buffers when not used and activates

them only when data bus activity occurs, resulting in significant power savings with no

performance impact. BPRI# control also allows the processor address and control input

buffers to be turned off when the BPRI# signal is inactive. Dynamic Bus P arking allows

a reciprocal power reduction in chipset address and control input buffers when the

processor deasserts its BR0# pin. The On Die Termination on the processor FSB buffers

is disabled when the signals are driven low, resulting in additional power savings. The

low I/O termination voltage is on a dedicated voltage plane, independent of the core

voltage, enabling low I/O switching power at all times.

2.5 VID-x

The processor implements the VID-x feature when in Intel Dynamic

Acceleration Technology mode. VID-x provides the ability for the processor to

request core voltage level reductions greater than one VID tick. The quantity of VID

ticks to be reduced depends on the specific performance state in which the processor is

running. This improved voltage regulator efficiency during periods of reduced power

Datasheet 21

Low Power Features

consumption allows for leakage current reduction, which results in platform power

savings and extended battery life. There is no platform-level change required to

support this feature as long as the VR vendor supports the VID-x feature.

2.6 Processor Power Status Indicator (PSI-2) Signal

The processor incorporates the PSI# signal that is asserted when the processor is in a

reduced power consumption state. PSI# can be used to improve intermediate and light

load efficiency of the voltage regulator, resulting in platform power savings and

extended battery life. The algorithm that the processor uses for determining when to

assert PSI# is different from the algorithm used in previous mobile processors. PSI-2

functionality improves overall voltage regulator efficiency over a wide power range

based on the C-state and P-state of the two cores. The combined C-state and P-state of

both cores are used to dynamically predict processor power. PSI-2 functionality is

expanded further to support three processor states:

• Both cores are in idle state

• Only one core is in active state

• Both cores are in active state

Low Power Features

22 Datasheet

Datasheet 23

Electrical Specifications

3 Electrical Specifications

3.1 Power and Ground Pins

For clean, on-chip power distribution, the processor has a large number of V CC (power)

and VSS (ground) inputs. All power pins must be connected to VCC power planes while

all VSS pins must be connected to system ground planes. Use of multiple power and

ground planes is recommended to reduce I*R drop. The processor VCC pin s must be

supplied the voltage determined by the VID (Voltage ID) pins.

3.2 FSB Clock (BCLK[1:0]) and Processor Clocking

BCLK[1:0] directly controls the FSB interface speed as well as the core frequency of the

processor. As in previous generation processors, the processor core frequency is a

multiple of the BCLK[1:0] frequency. The proce ssor uses a differential clocking

implementation.

3.3 Voltage Identification

The processor uses seven voltage identification pins,VID[6:0], to support automatic

selection of power supply voltages. The VID pins for processor are CMOS outputs

driven by the processor VID circuitry. Table 2 specifies the voltage level corresponding

to the state of VID[6:0]. A 1 refers to a high- voltage level and a 0 refers to low- voltage

level.

Table 2. Voltage Identification Definition (Sheet 1 of 4)

VID6 VID5 VID4 VID3 VID2 VID1 VID0 VCC (V)

0 0 0 0 0 0 0 1.5000

0 0 0 0 0 0 1 1.4875

0 0 0 0 0 1 0 1.4750

0 0 0 0 0 1 1 1.4625

0 0 0 0 1 0 0 1.4500

0 0 0 0 1 0 1 1.4375

0 0 0 0 1 1 0 1.4250

0 0 0 0 1 1 1 1.4125

0 0 0 1 0 0 0 1.4000

0 0 0 1 0 0 1 1.3875

0 0 0 1 0 1 0 1.3750

0 0 0 1 0 1 1 1.3625

0 0 0 1 1 0 0 1.3500

0 0 0 1 1 0 1 1.3375

0 0 0 1 1 1 0 1.3250

0 0 0 1 1 1 1 1.3125

0 0 1 0 0 0 0 1.3000

0 0 1 0 0 0 1 1.2875

0 0 1 0 0 1 0 1.2750

0 0 1 0 0 1 1 1.2625

0 0 1 0 1 0 0 1.2500

0 0 1 0 1 0 1 1.2375

Electrical Specifications

24 Datasheet

0 0 1 0 1 1 0 1.2250

0 0 1 0 1 1 1 1.2125

0 0 1 1 0 0 0 1.2000

0 0 1 1 0 0 1 1.1875

0 0 1 1 0 1 0 1.1750

0 0 1 1 0 1 1 1.1625

0 0 1 1 1 0 0 1.1500

0 0 1 1 1 0 1 1.1375

0 0 1 1 1 1 0 1.1250

0 0 1 1 1 1 1 1.1125

0 1 0 0 0 0 0 1.1000

0 1 0 0 0 0 1 1.0875

0 1 0 0 0 1 0 1.0750

0 1 0 0 0 1 1 1.0625

0 1 0 0 1 0 0 1.0500

0 1 0 0 1 0 1 1.0375

0 1 0 0 1 1 0 1.0250

0 1 0 0 1 1 1 1.0125

0 1 0 1 0 0 0 1.0000

0 1 0 1 0 0 1 0.9875

0 1 0 1 0 1 0 0.9750

0 1 0 1 0 1 1 0.9625

0 1 0 1 1 0 0 0.9500

0 1 0 1 1 0 1 0.9375

0 1 0 1 1 1 0 0.9250

0 1 0 1 1 1 1 0.9125

0 1 1 0 0 0 0 0.9000

0 1 1 0 0 0 1 0.8875

0 1 1 0 0 1 0 0.8750

0 1 1 0 0 1 1 0.8625

0 1 1 0 1 0 0 0.8500

0 1 1 0 1 0 1 0.8375

0 1 1 0 1 1 0 0.8250

0 1 1 0 1 1 1 0.8125

0 1 1 1 0 0 0 0.8000

0 1 1 1 0 0 1 0.7875

0 1 1 1 0 1 0 0.7750

0 1 1 1 0 1 1 0.7625

0 1 1 1 1 0 0 0.7500

0 1 1 1 1 0 1 0.7375

0 1 1 1 1 1 0 0.7250

0 1 1 1 1 1 1 0.7125

1 0 0 0 0 0 0 0.7000

1 0 0 0 0 0 1 0.6875

1 0 0 0 0 1 0 0.6750

1 0 0 0 0 1 1 0.6625

1 0 0 0 1 0 0 0.6500

Table 2. Voltage Identification Definition (Sheet 2 of 4)

VID6 VID5 VID4 VID3 VID2 VID1 VID0 VCC (V)

Datasheet 25

Electrical Specifications

1 0 0 0 1 0 1 0.6375

1 0 0 0 1 1 0 0.6250

1 0 0 0 1 1 1 0.6125

1 0 0 1 0 0 0 0.6000

1 0 0 1 0 0 1 0.5875

1 0 0 1 0 1 0 0.5750

1 0 0 1 0 1 1 0.5625

1 0 0 1 1 0 0 0.5500

1 0 0 1 1 0 1 0.5375

1 0 0 1 1 1 0 0.5250

1 0 0 1 1 1 1 0.5125

1 0 1 0 0 0 0 0.5000

1 0 1 0 0 0 1 0.4875

1 0 1 0 0 1 0 0.4750

1 0 1 0 0 1 1 0.4625

1 0 1 0 1 0 0 0.4500

1 0 1 0 1 0 1 0.4375

1 0 1 0 1 1 0 0.4250

1 0 1 0 1 1 1 0.4125

1 0 1 1 0 0 0 0.4000

1 0 1 1 0 0 1 0.3875

1 0 1 1 0 1 0 0.3750

1 0 1 1 0 1 1 0.3625

1 0 1 1 1 0 0 0.3500

1 0 1 1 1 0 1 0.3375

1 0 1 1 1 1 0 0.3250

1 0 1 1 1 1 1 0.3125

1 1 0 0 0 0 0 0.3000

1 1 0 0 0 0 1 0.2875

1 1 0 0 0 1 0 0.2750

1 1 0 0 0 1 1 0.2625

1 1 0 0 1 0 0 0.2500

1 1 0 0 1 0 1 0.2375

1 1 0 0 1 1 0 0.2250

1 1 0 0 1 1 1 0.2125

1 1 0 1 0 0 0 0.2000

1 1 0 1 0 0 1 0.1875

1 1 0 1 0 1 0 0.1750

1 1 0 1 0 1 1 0.1625

1 1 0 1 1 0 0 0.1500

1 1 0 1 1 0 1 0.1375

1 1 0 1 1 1 0 0.1250

1 1 0 1 1 1 1 0.1125

1 1 1 0 0 0 0 0.1000

1 1 1 0 0 0 1 0.0875

1 1 1 0 0 1 0 0.0750

1 1 1 0 0 1 1 0.0625

Table 2. Voltage Identification Definition (Sheet 3 of 4)

VID6 VID5 VID4 VID3 VID2 VID1 VID0 VCC (V)

Electrical Specifications

26 Datasheet

3.4 Catastrophic Thermal Protection

The processor supports the THERMTRIP# signal for catastrophic thermal protection. An

external thermal sensor should also be used to protect the processor and the system

against excessive temperatures. Even with the activation of THERMTRIP#, which halts

all processor internal clocks and activity, leakage current can be high enough that the

processor cannot be protected in all conditions without power removal to the processor.

If the external thermal sensor detects a catastrophic processor temperature of 125°C

(maximum), or if the THERMTRIP# signal is asserted, the VCC supply to the processor

must be turned off within 500 ms to prevent permanent silicon damage due to thermal

runaway of the processor. THERMTRIP# functionality is not guaranteed if the

PWRGOOD signal is not asserted.

3.5 Reserved and Unused Pins

All RESERVED (RSVD) pins must remain unconnected. Connection of these pins to VCC,

VSS, or to any other signal (including each other) may result in component malfunction

or incompatibility with future processors. See Section 4.2 for a pin listing of the

processor and the location of all RSVD pins.

For reliable operation, always connect unused inputs or bidirectional signals to an

appropriate signal level. Unused active low AGTL+ inputs may be left as no connects if

AGTL+ termination is provided on the processor silicon. Unused active high inputs

should be connected through a resistor to ground (VSS). Unused outputs can be left

unconnected.

The TEST1 and TEST2 pins must have a stuffing option of separate pull-down resistors

to VSS.

For the purpose of testability, route the TEST3 and TEST5 signals through a ground-

referenced Zo = 55-Ω trace that ends in a via that is near a GND via and is accessible

through an oscilloscope connection.

1 1 1 0 1 0 0 0.0500

1 1 1 0 1 0 1 0.0375

1 1 1 0 1 1 0 0.0250

1 1 1 0 1 1 1 0.0125

1 1 1 1 0 0 0 0.0000

1 1 1 1 0 0 1 0.0000

1 1 1 1 0 1 0 0.0000

1 1 1 1 0 1 1 0.0000

1 1 1 1 1 0 0 0.0000

1 1 1 1 1 0 1 0.0000

1 1 1 1 1 1 0 0.0000

1 1 1 1 1 1 1 0.0000

Table 2. Voltage Identification Definition (Sheet 4 of 4)

VID6 VID5 VID4 VID3 VID2 VID1 VID0 VCC (V)

Datasheet 27

Electrical Specifications

3.6 FSB Frequency Select Signals (BSEL[2:0])

The BSEL[2:0] signals are used to select the frequency of the processor input clock

(BCLK[1:0]). These signals should be connected to the clock chip and the appropriate

chipset on the platform. The BSEL encoding for BCLK[1:0] is shown in Table 3.

3.7 FSB Signal Groups

The FSB signals have been combined into groups by buffer type in the following

sections. AGTL+ input signals have differential input buffers, which use GTLREF as a

reference level. In this document, the term “AGTL+ Input” refers to the AGTL+ input

group as well as the AGTL+ I/O group when receiving. Similarly, “ AGTL+ Output” refers

to the AGTL+ output group as well as the AGTL+ I/O group when driving.

With the implementation of a source synchronous data bus, two sets of timing

parameters need to be specified. One set is for common clock signals, which are

dependent upon the rising edge of BCLK0 (ADS#, HIT#, HITM#, etc.) and the second

set is for the source synchronous signals, which are relative to their respective strobe

lines (data and address) as well as the rising edge of BCLK0. Asychronous signals are

still present (A20M#, IGNNE#, etc.) and can become active at any time during the

clock cycle. Table 4 identifies which signals are common clock, source synchronous,

and asynchronous.

Table 3. BSEL[2:0] Encoding for BCLK Frequency

BSEL[2] BSEL[1] BSEL[0] BCLK Frequency

L L L RESERVED

L L H 133 MHz

L H H RESERVED

L H L 200 MHz

H H L RESERVED

H H H RESERVED

H L H RESERVED

H L L RESERVED

Electrical Specifications

28 Datasheet

NOTES:

1. Refer to Chapter 4 for signal descriptions and termination requirements.

2. In processor systems wh ere there is no debug port implemented on the system board, these signals are

used to support a debug port interposer. In systems with the debug port implemented on the system

board, these signals are no connects.

3. BPM[2:1]# and PRDY# are AGTL+ output only signals.

4. PROCHOT# signal type is open drain output and CMOS input.

5. On die termination differs from other AGTL+ signals.

Table 4. FSB Pin Groups

Signal Group Type Signals1

AGTL+ Common Clock Input Synchronous

to BCLK[1:0] BPRI#, DEFER#, PREQ#5, RESET#, RS[2:0]#, TRDY#

AGTL+ Common Clock I/O Synchronous

to BCLK[1:0] ADS#, BNR#, BPM[3:0]#3, BR0#, DBSY#, DRDY#, HIT#,

HITM#, LOCK#, PRDY#3, DPWR#

AGTL+ Source Synchronous

I/O

Synchronous

to assoc.

strobe

AGTL+ Strobes Synchronous

to BCLK[1:0] ADSTB[1:0]#, DSTBP[3:0]#, DSTBN[3:0]#

CMOS Input Asynchronous A20M#, DPRSTP#, DPSLP#, IGNNE#, INIT#, LINT0/INTR,

LINT1/NMI, PWRGOOD, SMI#, SLP#, STPCLK#

Open Drain Output Asynchronous FERR#, IERR#, THERMTRIP#

Open Drain I/O Asynchronous PROCHOT#4

CMOS Output Asynchronous PSI#, VID[6:0], BSEL[2:0]

CMOS Input Synchronous

to TCK TCK, TDI, TMS, TRST#

Open Drain Output Synchronous

to TCK TDO

FSB Clock Clock BCLK[1:0]

Power/Other COMP[ 3:0], DBR#2, GTLREF, RSVD, TEST2, TEST1, THERMDA,

THERMDC, VCC, VCCA, VCCP, VCC_SENSE, VSS, VSS_SENSE

Signals Associated Strobe

REQ[4:0]#,

A[16:3]# ADSTB[0]#

A[35:17]# ADSTB[1]#

D[15:0]#,

DINV0# DSTBP0#,

DSTBN0#

D[31:16]#,

DINV1# DSTBP1#,

DSTBN1#

D[47:32]#,

DINV2# DSTBP2#,

DSTBN2#

D[63:48]#,

DINV3# DSTBP3#,

DSTBN3#

Datasheet 29

Electrical Specifications

3.8 CMOS Signals

CMOS input signals are shown in Table 4. Legacy output FERR#, IERR# and other non-

AGTL+ signals (THERMTRIP# and PROCHOT#) utilize Open Drain output buffers. These

signals do not have setup or hold time specifications in relation to BCLK[1:0]. However,

all of the CMOS signals are required to be asserted for more than four BCLKs in order

for the processor to recognize them. See Section 3.10 for the DC specifications for the

CMOS signal groups.

3.9 Maximum Ratings

Table 5 specifies absolute maximum and minimum ratings. If the processor stays within

functional operation limits, functionality and long-term reliability can be expected.

Caution: At conditions outside functional operation condition limits, but within absolute

maximum and minimum ratings, neither functionality nor long term reliability can be

expected. At conditions exceeding absolute maximum and minimum ratings, neither

functionality nor long term reliability can be expected.

Caution: Precautions should always be taken to avoid high static voltages or electric fields.

NOTES:

1. For functional operation, all processor electrical, signal quality, mechanical and thermal

specifications must be satisfied.

2. Storage temperature is applicable to storage conditions only. In this scenario, the

processor must not receive a clock, and no lands can be connected to a voltage bias.

Storage within these limits does not affect the long term reliability of the device. For

functional operation, please refer to the processor case temperature specificati o ns.

3. This rating applies to the processor and does not include any tray or packaging.

4. Failure to adhere to this specification can affect the long term reliability of the processor.

Table 5. Processor Absolute Maximum Ratings

Symbol Parameter Min Max Unit Notes1

TSTORAGE Processor storage

temperature -40 85 °C 2, 3, 4

VCC Any processor supply voltage

with respect to VSS -0.3 1.55 V

VinAGTL+ AGTL+ buffer DC input

voltage with re spect to VSS -0.1 1.55 V

VinAsynch_CMOS CMOS buffer DC input

voltage with re spect to VSS -0.1 1.55 V

Electrical Specifications

30 Datasheet

3.10 Processor DC Specificatio ns

The processor DC specifications in this section are defined at the processor

core (pads) unless noted otherwise. See Table 4 for the pin signal definitions and

signal pin assignments.

Table 6 through Table 8 list the DC specifications for the processor and are valid only

while meeting specifications for junction temperature, clock frequency, and input

voltages. The Highest Frequency Mode (HFM) and Super Low Frequency Mode

(SuperLFM) refer to the highest and lowest core operating frequencies supported on

the processor. Active mode load line specifications apply in all states except in the Deep

Sleep and Deeper Sleep states. VCC,BOOT is the default voltage driven by the voltage

regulator at power up in order to set the VID values. Unless specified otherwise, all

specifications for the processor are at Tjunction = 100°C. Care should be taken to read

all notes associated with each parameter.

Table 6. Voltage and Current Specifications for the Intel Core 2 Duo Processors -

Standard Voltage (Sheet 1 of 2)

Symbol Parameter Min Typ Max Unit Notes

VCCDAM VCC in Intel® Dynamic Acceleration

Tech nology Mode 1.0375 1.3500 V 1, 2

VCCHFM VCC at High Frequency Mode (HFM) 1.0375 1.3000 V 1, 2

VCCLFM VCC at Low Frequency Mode (LFM) 0.8500 1.0500 V 1, 2, 8

VCCSLFM VCC at Super Low Frequency Mode (SuperLFM) 0.7500 0.9500 V 1, 2

VCC,BOOT Default VCC Voltage for Initial Power Up 1.20 V 2

VCCP AGTL+ Termination Voltage 1.00 1.05 1.10 V

VCCA PLL Supply Voltage 1.425 1.5 1.575 V

VCCDPRSLP VCC at Deeper Sleep 0.6000 0.8000 V 1, 2

VCCDC4 VCC at Intel® Enhanced Deeper Sl eep Voltage 0.5500 0.7500 V 1, 2, 8

ICCDES Standard V oltage Processor ICC Recommended

Design Target 44 A 6

ICC

Standard Voltage ICC for the Processor

Processor

Number Core Frequency/Voltage

T7800

T7700

T7500

T7300

T7250

T7100

2.6 GHz & VCCHFM

2.4 GHz & VCCHFM

2.2 GHz & VCCHFM

2.0 GHz & VCCHFM

1.8 GHz & VCCHFM

1.2 GHz & VCCLFM

0.8 GHz & VCCSLFM

30.1

25.5

3, 4, 5, 12, 13

3, 4, 5, 12, 14

IAH,

ISGNT

ICC Auto-Halt & Stop-Grant

HFM

SuperLFM 27.9

17.0 A 3, 4, 12

ISLP

ICC Sleep

HFM

SuperLFM 27.4

16.8 A 3, 4, 12

Datasheet 31

Electrical Specifications

NOTES:

1. Each processor is programmed with a maximum valid voltage identification value (VID), which is set at

manufacturing and cannot be altered. Individual maximum VID values are calibrated during manufacturing

in such a way that two processors at the same frequency may hav e different settin gs within the VID range.

Note that this differs from the VID employed by the processor during a power management event (Intel

Thermal Monitor 2, Enhanced Intel SpeedStep Tech nology, or Extended Halt State).

2. The voltage specifications are assumed to be measured across VCC_SENSE and VSS_SENSE pins at socket with

a 100-MHz bandwidth oscilloscope, 1.5-pF maximum probe capacitance, and 1-mΩ minimum impedance.

The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from

the system is not couple d in the scope probe.

3. Specified at 100°C Tj .

4. Specified at the nominal VCC.

5. 800-MHz FSB supported

6. Instantaneou s current ICC_CORE_INST of 55 A has to be sustained for short time (tINST) of 10 µs. Average

current is le ss than maximum spe cified ICCDES. VR OCP threshold should be high enough to support current

levels described herein.

7. Measured at the bulk capacitors on the motherboard.

8. The maximum delta between Intel Enhanced Deeper Sleep and LFM on the processor is lesser than or

equal to 350 mV.

9. Based on simu lations and averaged over the duration of any change in current. Specified by design/

characterization at nominal VCC. Not 100% tested.

10. This is a power-up peak current specification, which is applicable when VCCP is high and VCC_CORE is low .

11. This is a steady-state ICC curr ent specification, which is applica b le when both VCCP and VCC_CORE are high.

12. Processor ICC requirements in Intel Dynamic Acceleration Technology mode is lesser than ICC in HFM.

13. 4-M L2 cache.

14. 2-M L2 cache.

IDSLP

ICC Deep Sleep

HFM

SuperLFM 25.0

16.0 A3, 4, 12

IDPRSLP ICC Deeper Sleep 11.5 A 3, 4

IDC4 ICC Intel Enhanced Deeper Sleep 9.4 A 3, 4

dICC/DT VCC Power Supply Current Slew Rate at

Processor Package Pin 600 A/µs 7, 9

ICCA ICC for VCCA Supply 130 mA

ICCP ICC for VCCP Supply before VCC Stable

ICC for VCCP Supply after VCC Stable 4.5

2.5 A

A10

Table 6. Voltage and Current Specifications for the Intel Core 2 Duo Processors -

Standard Voltage (Sheet 2 of 2)

Symbol Parameter Min Typ Max Unit Notes

Electrical Specifications

32 Datasheet

NOTES:

1. Each processor is programmed with a maximum valid voltage identificat ion value (VID), which is set at

manufacturing and cannot be altered. Individual maximum VID va lues are calibrated during manufacturing

such that two processors at the same frequency may have different settings within the VID range. Note

that this differs from the VID employed by the processor during a power management event (Intel Thermal

Monitor 2, Enhanced Intel SpeedStep Technology, or Enhanced Halt State).

Table 7. Voltage and Current Specifications for the Intel Core 2 Duo Processors - Low

Voltage

Symbol Parameter Min Typ Max Unit Notes

VCCDAM VCC in Intel® Dynamic Acceleration Technology

Mode 0.9000 1.3000 V 1, 2

VCCHFM VCC at High Frequency Mode (HFM) 0.9000 1.2000 V 1, 2

VCCLFM VCC at Low Frequency Mode (LFM) 0.9000 1.0500 V 1, 2, 13

VCCSLFM VCC at Super Low Frequency Mode (SuperLFM) 0.7500 0.9500 V 1, 2

VCC,BOOT Default VCC Voltage for Initial Power Up 1.20 V 2

VCCP AGTL+ Termination Voltage 1.00 1.05 1.10 V

VCCA PLL Supply Voltage 1.425 1.5 1.575 V

VCCDPRSLP VCC at Deeper Sleep 0.6000 0.8000 V 1, 2

VCCDC4 VCC at Intel® Enhanced Deeper Sleep Voltage 0.5500 0.7000 V 1, 2, 13

ICCDES Low V oltage Processor ICC Recommended Design

Target 23 A 6

ICC

Low Voltage ICC for the Processor

Processor

Number Core Frequency/Voltage

L7700

L7500

L7300

1.8 GHz & VCCHFM

1.6 GHz & VCCHFM

1.4 GHz & VCCHFM

1.2 GHz & VCCLFM

0.8 GHz & VCCSLFM

14.2

A3, 4, 5,

8, 12

IAH,

ISGNT

ICC Auto-Halt & Stop-Grant

HFM

SuperLFM 11.7

8.3 A3, 4, 12

ISLP

ICC Sleep

HFM

SuperLFM 11.4

8.1 A3, 4, 12

IDSLP

ICC Deep Sleep

HFM

SuperLFM 10.0

7.3 A3, 4, 12

IDPRSLP ICC Deeper Sleep 6.3 A 3, 4

IDC4 ICC Intel Enhanced Deeper Sleep 4.7 A 3, 4

dICC/DT VCC P ower Supply Current Slew Rate at Processor

Package Pin 600 A/µs 7, 9

ICCA ICC for VCCA Supply 130 mA

ICCP ICC for VCCP Supply before VCC Stable

ICC for VCCP Supply after VCC Stable 4.5

2.5 A

A10

Datasheet 33

Electrical Specifications

2. The voltage specifications are assumed to be measured across VCC_SENSE and VSS_SENSE pins at socket with

a 100-MHz bandwidth oscilloscope, 1.5-pF maximum probe capacitance, and 1-mΩ minimum impedance.

The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from

the system is not couple d in the scope probe.

3. Specified at 100°C Tj .

4. Specified at the nominal VCC.

5. 800-MHz FSB supported.

6. Instantaneou s current ICC_CORE_INST of 30 A has to be sustained for short time (tINST) of 10 µs. Average

current is le ss than maximum spe cified ICCDES. VR OCP threshold should be high enough to support current

levels described herein.

7. Measured at the bulk capacitors on the motherboard.

8. 4-M L2 cache.

9. Based on simu lations and averaged over the duration of any change in current. Specified by design/

characterization at nominal VCC. Not 100% tested.

10. This is a power-up peak current specification, which is applicable when VCCP is high and VCC_CORE is low.

11. This is a steady-state ICC curr ent specification, which is applica b le when both VCCP and VCC_CORE are high.

12. Processor ICC requirements in Intel Dynamic Acceleration Technology mode is lesser than Icc in HFM.

13. The maximum delta between Intel Enhanced Deeper Sleep and LFM on the processor is lesser than or

equal to 350 mV.

Table 8. Voltage and Current Specifications for the Intel Core 2 Duo -Ultra Low Voltage

Processors (Sheet 1 of 2)

Symbol Parameter Min Typ Max Unit Notes

VCCDAM VCC in Intel® Dynamic Acceleration Mode 0.8000 1.2000 V 1, 2

VCCHFM VCC at High Frequency Mode (HFM) 0.8000 0.9750 V 1, 2

VCCLFM VCC at Low Frequency Mode (LFM) 0.7500 0.9500 V 1, 2, 13

VCC,BOOT Default VCC Voltage for Initial Power Up 1.20 V 2

VCCP AGTL+ Termination Voltage 1.00 1.05 1.10 V

VCCA PLL Supply Voltage 1.425 1.5 1.575 V

VCCDPRSLP VCC at Deeper Sleep 0.6000 0.8000 V 1, 2

VCCDC4 VCC at Intel® Enhanced Deeper Sleep voltage 0.5500 0.7500 V 1, 2, 13

ICCDES Ultra Low Voltage Processor ICC Recommended

Design Target 17 A 6

ICC

Ultra Low Voltage ICC for the Processor

Processor

Number Core Frequency/Voltage

U7700

U7600

U7500

1.33 GHz & VCCHFM

1.20 GHz & VCCHFM

1.06 GHz & VCCHFM

0.80 GHz & VCCLFM

13.8

A3, 4, 5,

8, 12,

IAH,

ISGNT

ICC Auto-Halt & Stop-Grant

HFM

LFM 7.4

6.5 A 3, 4, 12

ISLP

ICC Sleep

HFM

LFM 7.2

6.3 A 3, 4, 12

IDSLP

ICC Deep Sleep

HFM

LFM 6.2

5.7 A 3, 4, 12

IDPRSLP ICC Deeper Sleep 4.9 A 3, 4

Electrical Specifications

34 Datasheet

NOTES:

1. Each processor is programmed with a maximum valid voltage identificat ion value (VID), which is set at

manufacturing and cannot be altered. Individual maximum VID va lues are calibrated during manufacturing

such that two processors at the same frequency may have different settings within the VID range. Note

that this differs from the VID employed by the processor during a power management event (Intel Thermal

Monitor 2, Enhanced Intel SpeedStep Technology, or Enhanced Halt State).

2. The voltage specifications are assumed to be measured across VCC_SENSE and VSS_SENSE pins at socket with

a 100-MHz bandwidth oscilloscope, 1.5-pF maximum probe capacitance, and 1 -mΩ minimum impedance.

The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from

the system is not coupled in the scope probe.

3. Specified at 100°C Tj.

4. Specified at the nominal VCC.

5. 533-MHz FSB supported.

6. Instantaneous current ICC_CORE_INST of 21 A has to be sustained for short time (tINST) of 10 µs. Average

current is less than maximum specified ICCDES. VR OCP threshold should be high enough to support current

levels described herein.

7. Measured at the bulk capacitors on the motherboard.

8. 2-M L2 cache.

9. Based on simulati ons and averaged over the duration of any change in current. Specified by design/

characterization at nominal VCC. Not 100% tested.

10. This is a power-up peak current specification, which is applicable when VCCP is high and VCC_CORE is low.

11. This is a steady-state ICC current specification, whi ch is applicable when both VCCP and VCC_CORE are high.

12. Processor ICC requirements in Intel Dynamic Acceleration Techno logy mode is lesser than ICC in HFM.

13. The maximum delta betw een Intel Enhanced Deeper Sleep and LFM on the processor is lesser than or

equal to 350 mV.

14. Dynamic FSB Frequency Switching no t supported.

IDC4 ICC Intel Enhanced Deeper Sleep 4.0 A 3, 4

dICC/DT VCC Power Supply Current Slew Rate at Processor

Package Pin 600 A/µs 7, 9

ICCA ICC for VCCA Supply 130 mA

ICCP ICC for VCCP Supply before VCC Stable

ICC for VCCP Supply after VCC Stable 4.5

2.5 A

A10

Table 9. Voltage and Current Specifications for the Intel Core 2 Extreme Processors

(Sheet 1 of 2)

Symbol Parameter Min Typ Max Unit Notes

VCCHFM VCC at High Frequency Mode (HFM) 1.1000 1.3750 V 1, 2

VCCLFM VCC at Low Frequency Mode (LFM) 1.0000 1.1000 V 1, 2, 7

VCCSLFM VCC at Super Low Frequency Mode (SuperLFM) 0.9000 1.1000 V 1, 2

VCC,BOOT Default VCC Voltage for Initial Power Up 1.20 V 2

VCCP AGTL+ Termination Voltage 1.00 1.05 1.10 V

VCCA PLL Supply Voltage 1.425 1.5 1.575 V

VCCDPRSLP VCC at Deeper Sleep 0.7000 0.9000 V 1, 2

VCCDC4 VCC at Intel® Enhanced Deeper Sleep Voltage 0.6500 0.8500 V 1, 2, 7

ICCDES Extreme Processor ICC Recommended Design

Target 55 A

Table 8. Voltage and Current Specifications for the Intel Core 2 Duo -Ultra Low Voltage

Processors (Sheet 2 of 2)

Symbol Parameter Min Typ Max Unit Notes

Datasheet 35