ATXMEGA128A1-AUR - MICROCHIP TECHNOLOGY

Not recommended for new designs - Use XMEGA A1U series 8067O–AVR– 06 /20 13

Features

High-performance, low-power Atmel® AVR® XMEGA® 8/16-bit Microcontroller

Nonvolatile program and data memories

64K - 128KBytes of in-system self-programmable flash

4K - 8KBytes boot section

2 KBBytes EEPROM

4 KB - 8 KBBytes internal SRAM

External bus interface for up to 16Mbytes SRAM

External bus interface for up to 128Mbit SDRAM

Peripheral features

Four-channel DMA controller

Eight-channel event system

Eight 16-bit timer/counters

Four timer/counters with 4 output compare or input capture channels

Four timer/counters with 2 output compare or input capture channels

High resolution extension on all timer/counters

Advanced waveform extension (AWeX) on two timer/counters

Eight USARTs with IrDA support for one USART

Four two-wire interfaces with dual address match (I2C and SMBus compatible)

Four serial peripheral interfaces (SPIs)

AES and DES crypto engine

16-bit real time counter (RTC) with separate oscillator

Two sixteen channel, 12-bit, 2msps Analog to Digital Converters

Two two-channel, 12-bit, 1msps Digital to Analog Converters

Four Analog Comparators (ACs) with window compare function, and current sources

External interrupts on all general purpose I/O pins

Programmable watchdog timer with separate on-chip ultra low power oscillator

QTouch® library support

Capacitive touch buttons, sliders and wheels

Special microcontroller features

Power-on reset and programmable brown-out detection

Internal and external clock options with PLL and prescaler

Programmable multilevel interrupt controller

Five sleep modes

Programming and debug interfaces

JTAG (IEEE 1149.1 compliant) interface, including boundary scan

PDI (Program and Debug Interface)

I/O and packages

78 Programmable I/O pins

100 lead TQFP

100 ball BGA

100 ball VFBGA

Operating voltage

1.6 – 3.6V

Operating frequency

0 – 12MHz from 1.6V

0 – 32MHz from 2.7V

8/16-bit XMEGA A1 Microcontroller

ATxmega128A1 / ATxmega64A1

Preliminary

8067O–AVR–06/2013

Not recommended for new designs -

Use XMEGA A1U series

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

‘

1. Ordering Information

Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information.

2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green.

3. For packaging information, see “Packaging information” on page 70.

Typical Applications

Ordering Code Flash (B) E2SRAM Speed (MHz) Power Supply Package(1)(2)(3) Temp

ATxmega128A1-AU 128K + 8K 2 KB 8 KB

32 1.6 - 3.6V

100A

-40C - 85C

ATxmega128A1-AUR

ATxmega64A1-AU 64K + 4K 2 KB 4 KB

ATxmega64A1-AUR

ATxmega128A1-CU 128K + 8K 2 KB 8 KB

100C1

ATxmega128A1CUR

ATxmega64A1-CU 64K + 4K 2 KB 4 KB

ATxmega64A1-CUR

ATxmega128A1-C7U 128K + 8K 2 KB 8 KB

100C2

ATxmega128A1-C7UR

ATxmega64A1-C7U 64K + 4K 2 KB 4 KB

ATxmega64A1-C7UR

Package Type

100A 100-lead, 14 x 14 x 1.0mm, 0.5mm lead pitch, thin profile plastic quad flat package (TQFP)

100C1 100-ball, 9 x 9 x 1.2mm body, ball pitch 0.88mm, chip ball grid array (CBGA)

100C2 100-ball, 7 x 7 x 1.0mm body, ball pitch 0.65mm, very thin fine-pitch ball grid array (VFBGA)

Industrial control Climate control Low power battery applications

Factory automation RF and ZigBee®Power tools

Building control Sensor control HVAC

Board control Optical Utility metering

White goods Medical applications

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2. Pinout/Block Diagram

Figure 2-1. Block diagram and pinout

Notes: 1. For full detai ls on pinout and pin functions refer to “Pinout and Pin Functions” on page 55.

2. VCC/GND on pin 83/84 are swapped compared to other VCC/GND to allow easier routing of GND to 32kHz crystal.

INDEX CORNER

PA6

PA7

GND

AVCC

PB0

PB1

PB2

PB3

PB4

PB5

PB6

PB7

GND

VCC

PC0

PC1

PC2

PC3

PC4

PC5

PC6

PC7

GND

VCC

PD0

100

PD1

PD2

PD3

PD4

PD5

PD6

PD7

GND

VCC

PE0

PE1

PE2

PE3

PE4

PE5

PE6

PE7

GND

VCC

PF0

PF1

PF2

PF3

PF4

PF5

PK0

VCC

GND

PJ7

PJ6

PJ5

PJ4

PJ3

PJ2

PJ1

PJ0

VCC

GND

PH7

PH6

PH5

PH4

PH3

PH2

PH1

PH0

VCC

GND

PF7

PF6

PA5

PA4

PA3

PA2

PA1

PA0

AVCC

GND

PR1

PR0

RESET/PDI

PDI

PQ3

PQ2

PQ1

PQ0

GND

VCC

PK7

PK6

PK5

PK4

PK3

PK2

PK1

FLASH

RAM

E2PROM

DMA

Interrupt Controlle r

OCD

External Bus Interface

ADC A

ADC B

DAC B

DAC A

AC A0

AC A1

AC B0

AC B1

Port A

Port B

Event System ctrl

Port K

Port J

Port H

Port Q

Port R

Power

Contro l

Reset

Contro l

Watchdog

OSC/CLK

Contro l BOD POR

RTC

EVENT ROUTING NETWORK

DATA BU S

VREF

TEMP

Port C

CPU

T/C0:1

USART0:1

TWI

SPI

Port FPort EPort D

T/C0:1

USART0/1

TWI

SPI

T/C0:1

USART0:1

TWI

SPI

T/C0:1

USART0:1

TWI

SPI

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Figure 2-2. CBGA-pinout

Table 2-1. CBGA-pinout.

1 2 3 4 5 6 7 8 9 10

APK0 VCC GND PJ3 VCC GND PH1 GND VCC PF7

BPK3 PK2 PK1 PJ4 PH7 PH4 PH2 PH0 PF6 PF5

CVCC PK5 PK4 PJ5 PJ0 PH5 PH3 PF2 PF3 VCC

DGND PK6 PK7 PJ6 PJ1 PH6 PF0 PF1 PF4 GND

EPQ0 PQ1 PQ2 PJ7 PJ2 PE7 PE6 PE5 PE4 PE3

FPR1 PR0 RESET/

PDI PDI PQ3 PC2 PE2 PE1 PE0 VCC

GGND PA1 PA4 PB3 PB4 PC1 PC6 PD7 PD6 GND

HAVCC PA2 PA5 PB2 PB5 PC0 PC5 PD5 PD4 PD3

JPA0 PA3 PB0 PB1 PB6 PC3 PC4 PC7 PD2 PD1

KPA6 PA7 GND AVCC PB7 VCC GND VCC GND PD0

12345678910

10987654321

Top view Bottom view

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3. Overview

The Atmel AVR XMEGA is a family of low power, high performance, and peripheral rich 8/16-bit microcontrollers based

on the AVR enhanced RISC architecture. By executing instructions in a single clock cycle, the AVR XMEGA devices

achieve CPU throughput approaching one million instructions per second (MIPS) per megahertz, allowing the system

designer to optimize power consumption versus processing speed.

The Atmel AVR CPU combines a rich instruction set with 32 general purpose working registers. All 32 registers are

directly connected to the arithmetic logic unit (ALU), allowing two independent registers to be accessed in a single

instruction, executed in one clock cycle. The resulting architecture is more code efficient while achieving throughputs

many times faster than conventional single-accumulator or CISC based microcontrollers.

The AVR XMEGA A1 devices provide the following features: in-system programmable flash with read-while-write

capabilities; internal EEPROM and SRAM; four-channel DMA controller, eight-channel event system and programmable

multilevel interrupt controller, 78 general purpose I/O lines, 16-bit real-time counter (RTC); eight flexible, 16-bit

timer/counters with compare and PWM channels, eight USARTs; four two-wire serial interfaces (TWIs); four serial

peripheral interfaces (SPIs); AES and DES cryptographic engine; two 16-channel, 12-bit ADCs with programmable gain;

two 2-channel, 12-bit DACs; four Analog Comparators (ACs) with window mode; programmable watchdog timer with

separate internal oscillator; accurate internal oscillators with PLL and prescaler; and programmable brown-out detection.

The program and debug interface (PDI), a fast, two-pin interface for programming and debugging, is available. The

devices also have an IEEE std. 1149.1 compliant JTAG interface, and this can also be used for boundary scan, on-chip

debug and programming.

The XMEGA A1 devices have five software selectable power saving modes. The idle mode stops the CPU while allowing

the SRAM, DMA controller, event system, interrupt controller, and all peripherals to continue functioning. The power-

down mode saves the SRAM and register contents, but stops the oscillators, disabling all other functions until the next

TWI or pin-change interrupt, or reset. I n power-save mode, the asynchronous real-time counter continues to run, allowing

the application to maintain a timer base while the rest of the device is sleeping. In standby mode, the external crystal

oscillator keeps running while the rest of the device is sleeping. This allows very fast startup from the external crystal,

combined with low power consumption. In extended standby mode, both the main oscillator and the asynchronous timer

continue to run. To further reduce power consumption, the peripheral clock to each in dividual peripheral can optionally be

stopped in active mode and idle sleep mode.

Atmel offers a free QTouch library for embedding capacitive touch buttons, sliders and wheels functionality into AVR

microcontrollers.

The device are manufactured using Atmel high-density, nonvolatile memory technology. The program flash memo ry can

be reprogrammed in-system through the PDI or JTAG interfaces. A boot loader running in the device can use any

interface to download the application program to the flash memory. The bo ot loader software in the boot flash section will

continue to run while the application flash section is updated, providing true read-while-write operation. By combining an

8/16-bit RISC CPU with in-system, self-programmable flash, the AVR XMEGA is a powerful microcontroller family that

provides a highly flexible and cost effective solution for many embedded applications.

All Atmel AVR XMEGA devices are supported with a full suite of program and system development tools, including C

compilers, macro assemblers, program debugger/simulators, programmers, and evaluation kits.

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

3.1 Block Diagram

Figure 3-1. XMEGA A1 Block Diagram

VBAT

Power

Supervision

Battery Backup

Controller

Real Time

Counter

32.768 kHz

XOSC

Power

Supervision

POR/BOD &

RESET

PORT A (8)

PORT B (8)

EVENT ROUTING NETWORK

DMA

Controller

BUS

Matrix

SRAM

EBI

ADCA

DACA

ACA

DACB

ADCB

ACB

OCD

PORT K (8)

PORT J (8)

PORT H (8)

PDI

Watchdog

Timer

Watchdog

Oscillator

Interrupt

Controller

DATA BUS

Prog/Debug

Controller

PORT R (2)

Oscillator

Circuits/

Clock

Generation

Oscillator

Control

Real Time

Counter

Event System

Controller

JTAG

Sleep

Controller

DES

IRCOM

PORT G (8)

PORT L (8)

PORT Q (8)

PORT M (8)

PORT C (8)

TCC0:1

USARTC0:1

TWIC

SPIC

PORT D (8)

TCD0:1

USARTD0:1

TWID

SPID

TCF0:1

USARTF0:1

TWIF

SPIF

TCE0:1

USARTE0:1

TWIE

SPIE

PORT E (8) PORT F (8)

EVENT ROUTING NETWORK

AES

AREFA

AREFB

PORT N (8)

PORT P (8)

CPU

NVM Controller

MORPEEhsalF

DATA BUS

Int. Refs.

Tempref

Digital function

Analog function

Bus masters / Programming / Debug

Oscillator / Crystal / Clock

General Purpose I/O

EBI

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

4. Resources

A comprehensive set of development tools, application notes and datasheets are available for download on

http://www.atmel.com/avr.

4.1 Recommended reading

XMEGA A Manual

XMEGA A Application Notes

This device data sheet only contains part specific information and a short description of each peripheral and module. The

XMEGA A Manual describes the modules and peripherals in depth. The XMEGA A application notes contain example

code and show applied use of the modules and peripherals.

The XMEGA A Manual and Application Notes are available from http://www.atmel.com/avr.

5. Capacitive touch sensing

The Atmel QTouch library provides a simple to use solution to realize touch sensitive interfaces on most Atmel AVR

microcontrollers. The patented charge-transfer signal acquisition offers robust sensing and includes fully debounced

reporting of touch keys and includes Adjacent Key Suppression® (AKS®) technology for unambiguous detection of key

events. The QTouch library includes support for the QTouch and QMatrix acquisition methods.

Touch sensing can be added to any application by linking the appropriate Atmel QTouch library for the AVR

microcontroller. This is done by using a simple set of APIs to define the touch channels and sensors, and then calling the

touch sensing API’s to retrieve the channel information and determine the touch sensor states.

The QTouch library is FREE and downloadable from the Atmel website at the following location:

www.atmel.com/qtouchlibrary. For implementation details and other information, refer to the QTouch library user guide -

also available for download from the Atmel website.

6. Disclaimer

For devices that are not available yet, typical values contained in this datasheet are based on simulations and

characterization of other AVR XMEGA microcontrollers manufactured on the same process technology. Min. and Max

values will be available after the device is characterized.

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8067O–AVR–06/2013

7. AVR CPU

7.1 Features

8/16-bit high performance AVR RISC Architecture

138 instructions

Hardware multiplier

32x8-bit registers directly connected to the ALU

Stack in SRAM

Stack Pointer accessible in I/O memory space

Direct addressing of up to 16M Bytes of program and data memory

True 16/24-bit access to 16/24-bit I/O registers

Support for 8-, 16- and 32-bit Arithmetic

Configuration Change Protection of system critical features

7.2 Overview

All Atmel AVR XMEGA devices use the 8/16-bit AVR CPU. The main function of the CPU is to execute the code and

perform all calculations. The CPU is able to access memories, perform calculations, control peripherals, and execute the

program in the flash memory. Interrupt handling is described in a sepa rate section, refer to “Interrupts and Programmable

Multilevel Interrupt Controller” on page 29.

7.3 Architectural Overview

In order to maximize performance and parallelism, the AVR CPU uses a Harvard architecture with separate memories

and buses for program and data. Instructions in the program memo ry are executed with single-level pipelining . While one

instruction is being executed, the next instruction is pre-fetched from the program memory. This enables instructions to

be executed on every clock cycle. For details of all AVR instructions, refer to http://www.atmel.com/avr.

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

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Figure 7-1. Block diagram of the AVR CPU architecture.

The arithmetic logic unit (ALU) supports arithmetic and logic operations between registers or between a constant and a

register. Single-register operations can also be executed in the ALU. After an arithmetic operation, the status register is

updated to reflect information about the result of the operation.

The ALU is directly connected to the fast-access register file. The 32 x 8-bit general purpose working registers all have

single clock cycle access time allowing single-cycle arithmetic logic unit (ALU) operation between registers or between a

space addressing, enabling efficient address calculations.

The memory spaces are linear. The data memory space and the program memory space are two different memory

spaces.

The data memory space is divided into I/O registers, SRAM, and external RAM. In addition, the EEPROM can be

memory mapped in the data memory.

All I/O status and control registers reside in the lowest 4KB addresses of the data memory. This is referred to as the I/O

memory space. The lowest 64 addresses can be accessed directly, or as the data space locations from 0x00 to 0x3F.

The rest is the extended I/O memory space, ranging from 0x0040 to 0x0FFF. I/O registers here must be accessed as

data space locations using load (LD/LDS/LDD) and store (ST/STS/STD) instructions.

The SRAM holds data. Code execution from SRAM is not supported. It can easily be accessed through the five different

addressing modes supported in the AVR architecture. The first SRAM address is 0x2000.

Data addresses 0x1000 to 0x1FFF are reserved for memory mapping of EEPROM.

The program memory is divided in two sections, the application program section and the boot program section. Both

sections have dedicated lock bits for write and read/write protection. The SPM instruction that is used for self-

programming of the application flash memory must reside in the boot program section. The application section contains

an application table section with separate lock bits for write and read/write protection. The application table section can

be used for safe storing of nonvolatile data in the program memory.

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7.4 ALU - Arithmetic Logic Unit

The arithmetic logic unit (ALU) supports arithmetic and logic operations between registers or between a constant and a

purpose registers. In a single clock cycle, arithmetic operations between general purpose registers or between a register

and an immediate are executed and the result is stored in the register file. After an arithmetic or logic operation, the

status register is updated to reflect information about the result of the operation.

ALU operations are divided into three main categories – arithmetic, logical, and bit functions. Both 8- and 16-bit

arithmetic is supported, and the instruction set allows for efficient implementation of 32-bit aritmetic. The hardware

multiplier supports signed and unsigned multiplication and fractional format.

7.4.1 Hardware Multiplier

The multiplier is capable of multiplying two 8-bit numbers into a 16-bit result. The hardware multiplier supports different

variations of signed and unsigned integer and fractional numbers:

Multiplication of unsigned integers

Multiplication of signed integers

Multiplication of a signed integer with an unsigned integer

Multiplication of unsigned fractional numbers

Multiplication of signed fractional numbers

Multiplication of a signed fractional number with an unsigned one

A multiplication takes two CPU clock cycles.

7.5 Program Flow

After reset, the CPU starts to execute instructions from the lowest address in the flash program memory ‘0.’ The program

counter (PC) addresses the next instruction to be fetched.

Program flow is provided by conditional and unconditional jump and call instructions capable of addressing the whole

address space directly. Most AVR instructions use a 16-bit word format, while a limited number use a 32-bit format.

During interrupts and subroutine calls, the return address PC is stored on the stack. The stack is allocated in the general

data SRAM, and consequently the stack size is only limited by the total SRAM size and the usage of the SRAM. After

reset, the stack pointer (SP) points to the highest address in the internal SRAM. The SP is read/write accessible in the

I/O memory space, enabling easy implementation of multiple stacks or stack areas. The data SRAM can easily be

accessed through the five different addressing modes supported in the AVR CPU.

7.6 Status Register

The status register (SREG) contains information about the result of the most recently executed arithmetic or logic

instruction. This information can be used for altering program flow in order to perform conditional operations. Note that

the status register is updated after all ALU operations, as specified in the instruction set reference. This will in many

cases remove the need for using the dedicated compare instructions, resulting in faster and more compact code.

The status register is not automatically stored when entering an interrupt routine nor restored when returning from an

interrupt. This must be handled by software.

The status register is accessible in the I/O memory space.

7.6.1 Stack and Stack Pointer

The stack is used for storing return addresses after interrupts and subroutine calls. It can also be used for storing

temporary data. The stack pointer (SP) register always points to the top of the stack. It is implemented as two 8-bit

registers that are accessible in the I/O memory space. Data are pushed and popped from the stack using the PUSH and

POP instructions. The stack grows from a higher memory location to a lower memory location. This implies that pushing

data onto the stack decreases the SP, and popping data off the stack increases the SP. The SP is automatically loaded

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after reset, and the initial value is the highest address of the internal SRAM. If the SP is changed, it must be set to point

above address 0x2000, and it must be defined before any subroutine calls are executed or before interrupts are enabled.

During interrupts or subroutine calls, the return address is automatically pushed on the stack. The return address can be

two or three bytes, depending on program memory size of the device. For devices with 128KB or less of program

memory, the return address is two bytes, and hence the stack pointer is decremented/incremented by two. For devices

with more than 128KB of program memory, the return address is three bytes, and hence the SP is

decremented/incremented by three. The return address is popped off the stack when returning from interrupts using the

RETI instruction, and from subroutine calls using the RET instruction.

The SP is decremented by one when data are pushed on the stack with the PUSH instruction, and incremented by one

when data is popped off the stack using the POP instruction.

To prevent corruption when updating the stack pointer from software, a write to SPL will automatically disable interrupts

for up to four instructions or until the next I/O memory write.

After reset the stack pointer is initialized to the highest address of the SRAM. See Table 8-2 on page 15.

7.7 Register File

The register file consists of 32 x 8-bit general purpose working registers with single clock cycle access time. The register

file supports the following input/output schemes:

One 8-bit output operand and one 8-bit result input

Two 8-bit output operands and one 8-bit result input

Two 8-bit output operands and one 16-bit result input

One 16-bit output operand and one 16-bit result input

Six of the 32 registers can be used as three 16-bit address register pointers for data space addressing, enabling efficient

address calculations. One of these address pointers can also be used as an address pointer for lookup tables in flash

program memory.

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8. Memories

8.1 Features

Flash Program Memory

One linear address space

In-System Programmable

Self-Programming and Bootloader support

Application Section for application code

Application Table Section for application code or data storage

Boot Section for application code or bootloader code

Separate lock bits and protection for all sections

Built in fast CRC check of a selectable flash program memory section

Data Memory

One linear address space

Single cycle access from CPU

SRAM

EEPROM

Byte and page accessible

Optional memory mapping for direct load and store

I/O Memory

Configuration and Status registers for all peripherals and modules

16 bit-accessible General Purpose Register for global variables or flags

External Memory support

SRAM

SDRAM

Memory mapped external hardware

Bus arbitration

Safe and deterministic handling of CPU and DMA Con trol ler priority

Separate buses for SRAM, EEPROM, I/O Memory and External Memory access

Simultaneous bus access for CPU and DMA Controller

Production Signature Row Memory for factory programmed data

Device ID for each microcontroller device ty pe

Serial number for each device

Oscillator calibration bytes

ADC, DAC and temperature sensor calibration data

User Signature Row

One flash page in size

Can be read and written from software

Content is kept after chip erase

8.2 Overview

The Atmel AVR architecture has two main memory spaces, the program memory and the data memory. Executable code

can reside only in the program memory, while data can be stored in the program memory and the da ta memory. The data

memory includes the internal SRAM, and EEPROM for nonvolatile data storage. All memory spaces are linear and

require no memory bank switching. Nonvolatile memory (NVM) spaces can be locked for further write and read/write

operations. This prevents unrestricted access to the application software.

A separate memory section contains the fuse bytes. These are used for configuring important system functions, and can

only be written by an external programmer.

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The available memory size configurations are shown in “Ordering Information” on page 2. In addition each device has a

flash memory signature rows for calibration data, device identification, serial number etc.

8.3 In-System Programmable Flash Program Memory

he Atmel AVR XMEGA devices contain on-chip, in-system reprogrammable flash memory for program storage. The flash

memory can be accessed for read and write from an external programmer through the PDI or from application software

running in the device.

All AVR CPU instructions are 16 or 32 bits wide, and each flash location is 16 bits wide. The flash memory is organized

in two main sections, the application section and the boot loader section. The sizes of the different sections are fixed, but

device-dependent. These two sections have separate lock bits, and can have different levels of protection. The store

program memory (SPM) instruction, which is used to write to the flash from the application software, will only operate

when executed from the boot loader section.

The application section contains an application table section with separate lock settings. This enables safe storage of

nonvolatile data in the program memory.

Figure 8-1. Flash Program Memory (Hexadecimal address)

8.3.1 Application Section

The Application section is the section of the flash that is u sed for storin g the executable application code. The protectio n

level for the application section can be selected by the boot lock bits for this section. The application section can not store

any boot loader code since the SPM instruction cannot be executed from the application section.

8.3.2 Application Table Section

The application table section is a part of the application section of the flash memory that can be used for storing data.

The size is identical to the boot loader section. The protection level for the application table section can be selected by

the boot lock bits for this section. The possibilities for different protection levels on the application section and the

application table section enable safe parameter storage in the program memory. If this section is not used for data,

application code can reside here.

8.3.3 Boot Loader Section

While the application section is used for storing the application code, the boot loader software must be located in the boot

loader section because the SPM instruction can only initiate programming when executing from this section. The SPM

instruction can access the entire flash, including the boot loader section itself. The protection level for the boot loader

section can be selected by the boot loader lock bits. If this section is not used for boot loader software, application code

can be stored here.

Word Address

ATxega128A1 ATxmega64A1

Application Section (Bytes)

(128K/64K)

...

EFFF / 77FF

F000 / 7800 Application Table Section (Bytes)

(8K/4K)

FFFF / 7FFF

10000 / 8000 Boot Section (Bytes)

(8K/4K)

10FFF / 87FF

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8.3.4 Production Signature Row

The production signature row is a separate memory section for factory programmed data. It contains calibration data for

functions such as oscillators and analog modules. Some of the calibration values will be automatically loaded to the

corresponding module or peripheral unit during reset. Other values must be loaded from the signature row and written to

the corresponding peripheral registers from software. For details on calibration conditions, refer to “Electrical

Characteristics” on page 76.

The production signature row also contains an ID that identifies each microcontroller device type and a serial number for

each manufactured device. The serial number consists of the production lot number, wafer number, and wafer

coordinates for the device. The device ID for the available devices is shown in Table 8-1.

The production signature row cannot be written or erased, but it can be read from application software and external

programmers.

Table 8-1. Device ID bytes.

8.3.5 User Signature Row

The user signature row is a separate memory section that is fully accessible (read and write) from application software

and external programmers. It is one flash page in size, and is meant for static user parameter storage, such as calibration

data, custom serial number, identification numbers, random number seeds, etc. This section is not erased by chip erase

commands that erase the flash, and requires a dedicated erase command. This ensures parameter storage during

multiple program/erase operations and on-chip debug sessions.

8.4 Fuses and Lock bit s

The fuses are used to configure important system functions, and can only be written from an external programmer. The

application software can read the fuses. The fuses are used to configure reset sources such as brownout detector and

watchdog, startup configuration, JTAG enable, and JTAG user ID.

The lock bits are used to set protection levels for the different flash sections (that is, if read and/or write access should be

blocked). Lock bits can be written by external programmers and application software, but only to stricter protection levels.

Chip erase is the only way to erase the lock bits. To ensure that flash contents are protected even during chip erase, the

lock bits are erased after the rest of the flash memory has been erased.

An unprogrammed fuse or lock bit will have the value one, while a programmed fuse or lock bit will have the value zero.

Both fuses and lock bits are reprogrammable like the flash program memory.

8.5 Data Memory

The data memory contains the I/O memory, internal SRAM, optionally memory mapped EEPROM, and external memory

if available. The data memory is organized as one continuous memory section, see Figure 8-2 on page 15. To simplify

development, I/O Memory, EEPROM and SRAM will always have the same start addresses for all Atmel AVR XMEGA

devices. The address space for External Memory will always start at the end of Internal SRAM and end at address

0xFFFFFF.

Device Device ID bytes

Byte 2 Byte 1 Byte 0

ATxmega64A1 4E 96 1E

ATxmega128A1 4C 97 1E

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Figure 8-2. Data Memory Map (Hexadecimal address)

8.6 EEPROM

XMEGA AU devices have EEPROM for nonvolatile data storage. It is either addressable in a separate data space

(default) or memory mapped and accessed in normal data space. The EEPROM supports both byte and page access.

Memory mapped EEPROM allows highly efficient EEPROM reading and EEPROM buffer loading. When doing this,

EEPROM is accessible using load and store instructions. Memory mapped EEPROM will always start at hexadecimal

address 0x1000.

8.7 I/O Memory

The status and configuration registers for peripherals and modules, including the CPU, are addressable through I/O

memory locations. All I/O locations can be accessed by the load (LD/LDS/LDD) and store (ST/STS/STD) instructions,

which is used to transfer data between the 32 registers in the register file and the I/O memory. The IN and OUT

instructions can address I/O memory locations in the range 0x00 - 0x3F directly. In the address range 0x00 - 0x1F,

single- cycle instructions for manipulation and checking of individual bits are available.

The I/O memory address for all peripherals and modules in XMEGA A1U is shown in the “Peripheral Module Address

Map” on page 62.

8.7.1 General Purpose I/O Registers

The lowest 16 I/O memory addresses are reserved as general purpose I/O registers. These registers can be used for

storing global variables and flags, as they are directly bit-accessible using the SBI, CBI, SBIS, and SBIC instructions.

8.8 External Memory

Four ports can be used for external memory, supporting external SRAM, SDRAM, and memory mapped peripherals such

as LCD displays. Refer to “EBI – External Bus Interface” on page 47. The external memory address space will always

start at the end of internal SRAM.

8.9 Data Memory and Bus Arbitration

Since the data memory is organized as four separate sets of memories, the different bus masters (CPU, DMA controller

read and DMA controller write, etc.) can access different memory sections at the same time.

Byte Address ATxmega128A1 Byte Address ATxmega64A1

0I/O Registers

(4 KB)

0I/O Registers

(4 KB)

FFF FFF

1000 EEPROM

(2 KB)

1000 EEPROM

(2 KB)

17FF 17FF

RESERVED RESERVED

2000 Internal SRAM

(8 KB)

2000 Internal SRAM

(4 KB)

3FFF 2FFF

4000 External Memory

(0 to 16 MB)

3000 External Memory

(0 to 16 MB)

FFFFFF FFFFFF

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8.10 Memory Timing

Read and write access to the I/O memory takes one CPU clock cycle. A write to SRAM takes one cycle, and a read from

SRAM takes two cycles. For burst read (DMA), new data are available every cycle. EEPROM page load (write) takes one

cycle, and three cycles are required for read. For burst read, new data are available every second cycle. External

memory has multi-cycle read and write. The number of cycles depends on the type of memory and configuration of the

external bus interface. Refer to the instruction summary for more details on instructions and instruction timing.

8.11 Device ID and Revision

Each device has a three-byte device ID. This ID identifies Atmel as the manufacturer of the device and the device type. A

separate register contains the revision number of the device.

8.12 I/O Memory Protection

Some features in the device are regarded as critical for safety in some applications. Due to this, it is possible to lock the

I/O register related to the clock system, the event system, and the advanced waveform extensions. As long as the lock is

enabled, all related I/O registers are locked and they can not be written from the application software. The lock registers

themselves are protected by the configuration change protection mechanism.

8.13 JTAG Disable

It is possible to disable the JTAG interface from the application software. This will prevent all external JTAG access to the

device until the next device reset or until JTAG is enabled again from the application software. As long as JTAG is

disabled, the I/O pins required for JTAG can be used as normal I/O pins.

8.14 Flash and EEPROM Page Size

The flash program memory and EEPROM data memory are organized in pages. The pages are word accessible for the

flash and byte accessible for the EEPROM.

Table 8-2 shows the Flash Program Memory organization. Flash write and erase operations are performed on one page

at a time, while reading the Flash is done one byte at a time. For Flash access the Z-pointer (Z[m:n]) is used for

addressing. The most significant bits in the address (FPAGE) gives the page number and the least significant address

bits (FWORD) gives the word in the page.

Table 8-2. Number of words and Pages in the Flash .

Table 8-3 shows EEPROM memory organization for the Atmel AVR XMEGA A1U devices. EEPROM write and erase

operations can be performed one page or one byte at a time, while reading the EEPROM is done one byte at a time. For

EEPROM access the NVM Address Register (ADDR[m:n]) is used for addressing. The most significant bits in the

address (E2PAGE) give the page number and the least significant address bits (E2BYTE) give the byte in the page.

Device PC size Flash Page

Size FWORD FPAGE Application Boot

bits bytes words Size No of

pages Size No of

pages

ATxmega64A1 16 64K + 4K 128 Z[7:1] Z[16:8] 64K 256 4K 16

ATxmega128A1 17 128K+ 8K 256 Z[8:1] Z[17:9] 128K 256 8K 16

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Table 8-3. Number of Bytes and Pages in the EEPROM.

8.14.1 I/O Memory

All peripherals and modules are addressable through I/O memory locations in the data memory space. All I/O memory

locations can be accessed by the Load (LD/LDS/LDD) and Store (ST/STS/STD) instructions, transferring data between

the 32 general purpose registers in the CPU and the I/O Memory.

The IN and OUT instructions can address I/O memory locations in the range 0x00 - 0x3F directly.

I/O registers within the address range 0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. The

value of single bits can be checked by using the SBIS and SBIC instructions on these registers.

The I/O memory address for all peripherals and modules in XMEGA A1 is shown in the “Peripheral Module Address Map”

on page 62.

Device EEPROM Page Size E2BYTE E2PAGE No of pages

Size bytes

ATxmega64A1 2 KB 32 ADDR[4:0] ADDR[10:5] 64

ATxmega128A1 2 KB 32 ADDR[4:0 ADDR[10:5] 64

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9. DMAC - Direct Memory Access Controller

9.1 Features

Allows High-speed data transfer

From memory to peripheral

From memory to memory

From peripheral to memory

From peripheral to peripheral

4 Channels

From 1 byte and up to 16M bytes transfers in a single transaction

Multiple addressing modes for source and destination address

Increment

Decrement

Static

1, 2, 4, or 8 byte Burst Transfers

Programmable priority between channels

9.2 Overview

The four-channel direct memory access (DMA) controller can transfer data between memories and peripherals, and thus

offload these tasks from the CPU. It enables high data transfer rates with minimum CPU intervention, and frees up CPU

time. The four DMA channels enable up to four independent and parallel transfers.

The DMA controller can move data between SRAM and peripherals, between SRAM locations and directly between

peripheral registers. With access to all peripherals, the DMA controller can handle automatic transfer of data to/from

communication modules. The DMA controller can also read from memory mapped EEPROM.

Data transfers are done in continuous bursts of 1, 2, 4, or 8 bytes. They build block transfers of configurable size from 1

byte to 64KB. A repeat counter can be used to repeat each block transfer for single transactions up to 16MB. Source and

destination addressing can be static, incremental or decremental. Automatic reload of source and/or destination

addresses can be done after each burst or block transfer, or when a transaction is complete. Application software,

peripherals, and events can trigger DMA transfers.

The four DMA channels have individual configuration and control settings. This include source, destination, transfer

triggers, and transaction sizes. They have individual interrupt settings. Interrupt requests can be generated when a

transaction is complete or when the DMA controller detects an error on a DMA channel.

To allow for continuous transfers, two channels can be interlinked so that the second takes over the transfer when the

first is finished, and vice versa.

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10. Event System

10.1 Features

Inter-peripheral communication and signalling with minimum latency

CPU and DMA independent operation

8 Event Channels allows for up to 8 signals to be routed at the same time

Events can be generated by

Timer/Counters (TCxn)

Real Time Counter (RTC)

Analog to Digital Converters (ADCx)

Analog Comparators (ACx)

Ports (PORTx)

System Clock (ClkSYS)

Software (CPU)

Events can be used by

Timer/Counters (TCxn)

Analog to Digital Converters (ADCx)

Digital to Analog Converters (DACx)

Ports (PORTx)

DMA Controller (DMAC)

IR Communication Module (IRCOM)

The same event can be used by multiple peripherals for synchronized timing

Advanced Features

Manual Event Generation from software (CPU)

Quadrature Decoding

Digital Filtering

Functions in Active and Idle mode

10.2 Overview

The Event System is a set of features for inter-peripheral communication. It enables the possibility for a change of state

in one peripheral to automatically trigger actions in one or more peripherals. These changes in a peripheral that will

trigger actions in other peripherals are configurable by software. It is a simple, but powerful system as it allows for

autonomous control of peripherals without any use of interrupts, CPU or DMA resources.

The indication of a change in a peripheral is referred to as an event, and is usually the same as the interrupt conditions

for that peripheral. Events are passed between peripherals using a dedicated routing network called the Event Routing

Network. Figure 10-1 on page 20 shows a basic block diagram of the Event System with the Event Routing Network and

the peripherals to which it is connected. This highly flexible system can be used for simple routing of signals, pin

functions or for sequencing of events.

The maximum latency is two CPU clock cycles from when an event is generated in one peripheral, until the actions are

triggered in one or more other peripherals.

The Event System is functional in both Active and Idle modes.

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Figure 10-1. Event system block diagram.

he event routing network consists of eight software-configurable multiplexers that control how events are routed and

used. These are called event channels, and allow for up to eight parallel event routing configurations. The maximum

routing latency is two peripheral clock cycles. The event system works in both active mode and idle sleep mode.

DAC Timer /

Counters

ADC

Real Time

Counter

Port pins

CPU /

Software

DMA

Controller

IRCOM

Event Routing Network

Event

System

Controller

clkPER

Prescaler

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11. System Clock and Clock options

11.1 Features

Fast start-up time

Safe run-time clock switching

Internal Oscillators:

32 MHz run-time calibrated RC oscillator

2 MHz run-time calibrated RC oscillator

32.768 kHz calibrated RC oscillator

32 kHz Ultra Low Power (ULP) oscillator with 1 kHz ouput

External clock options

0.4 - 16 MHz Crystal Oscillator

32 kHz Crystal Oscillator

External clock

PLL with internal and external clock options with 1 to 31x multiplication

Clock Prescalers with 1x to 2048x division

Fast peripheral clock running at two and four times the CPU clock speed

Automatic Run-Time Calibration of internal oscillators

Crystal Oscillator failure detection

11.2 Overview

Atmel AVR XMEGA devices have a flexible clock system supporting a large number of clock sources. It incorporates

both accurate internal oscillators and external crystal oscillator and resonator support. A high-frequency phase locked

loop (PLL) and clock prescalers can be used to generate a wide range of clock frequencies. An oscillator failure monitor

can be enabled to issue a non-maskable interrupt and switch to the internal oscillator if the external oscillator or PLL fails.

When a reset occurs, all clock sources except the 32kHz ultra low power oscillator are disabled. After reset, the device

will always start up running from the 2MHz internal oscillator. During normal operation, the system clock source and

prescalers can be changed from software at any time.

Figure 11-1 on page 22 presents the principal clock system in the XMEGA A1U family devices. Not all of the clocks need

to be active at a given time. The clocks for the CPU and peripherals can be stopped using sleep modes and power

reduction registers as described in “Power Management and Sleep Modes” on page 24.

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Figure 11-1. The clock system, clock sources and clock distribution

11.3 Clock Options

The clock sources are divided in two main groups: internal oscillators and external clock sources. Most of the clock

sources can be directly enabled and disabled from software, while others are automatically enabled or disabled,

depending on peripheral settings. After reset, the device starts up running from the 2MHz internal oscillator. The other

clock sources and PLL are turned off by default.

The internal oscillators do not require any external comp onents to run. For details on characteristics and accuracy of the

internal oscillators, refer to the device datasheet.

11.3.1 32 kHz Ultra Low Power Internal Oscillator

This oscillator provides an approximate 32kHz clock. The 32kHz ultra low power (ULP) internal oscillator is a very low

power clock source, and it is not designed for high accuracy. The oscillator employs a built-in prescaler that provides a

1kHz output. The oscillator is automatically enabled/disabled when it is used as clock source for any part of the device.

This oscillator can be selected as the clock source for the RTC.

Real Time

Counter Peripherals RAM AVR CPU Non-Volatile

Memory

Watchdog

Timer

Brown-out

Detector

System Clock Prescalers

System Clock Multiplexer

(SCLKSEL)

PLLSRC

RTCSRC

DIV32

32 kHz

Int. ULP

32.768 kHz

Int. OSC

32.768 kHz

TOSC

2 MHz

Int. Osc

32 MHz

Int. Osc

0.4 – 16 MHz

XTAL

DIV32

DIV4

XOSCSEL

PLL

TOSC1

TOSC2

XTAL1

XTAL2

clkSYS

clkRTC

clkPER2

clkPER

clkCPU

clkPER4

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11.3.2 32.768 kHz Calibrated Internal Oscillator

This oscillator provides an approximate 32.768kHz clock. It is calibrated during production to provide a default frequency

close to its nominal frequency. The calibration register can also be written from software for run-time calibration of the

oscillator frequency. The oscillator employs a built-in prescaler, which provides both a 32.768kHz output and a 1.024kHz

output.

11.3.3 32.768 kHz Crystal Oscillator

A 32.768kHz crystal oscillator can be connected between the 1 and 2 pins and enables a dedicated low frequency

oscillator input circuit. A low power mode with reduced voltage swing on 2 is available. This oscillator can be used as a

clock source for the system clock and RTC.

11.3.4 0.4 - 16 MHz Crystal Oscillator

This oscillator can operate in four different modes optimized for different frequency ranges, all within 0.4 - 16MHz.

11.3.5 2 MHz Run-time Calibrated In te rn a l Osci llator

The 2MHz Run-time Calibrated Internal Oscillator is a high frequency oscillator. It is calibrated during production to

provide a default frequency which is close to its nominal frequency. The oscillator can use the 32kHz Calibrated Internal

Oscillator or the 32kHz Crystal Oscillator as a source for calibrating the frequency run-time to compensate for

temperature and voltage drift hereby optimizing the accuracy of the oscillator.

11.3.6 32 MHz Run-time Calibrated Internal Oscillator

The 32MHz Run-time Calibrated Internal Oscillator is a high frequency oscillator. It is calibrated during production to

provide a default frequency which is close to its nominal frequency. The oscillator can use the 32kHz Calibrated Internal

Oscillator or the 32kHz Crystal Oscillator as a source for calibrating the frequency run-time to compensate for

temperature and voltage drift hereby optimizing the accuracy of the oscillator.

11.3.7 External Clock input

The XTAL1 and XTAL2 pins can be used to drive an external oscillator, either a quartz crystal or a ceramic resonator.

XTAL1 can be used as input for an external clock signal. The 1 and 2 pins is dedicated to driving a 32.768kHz crystal

oscillator.

11.3.8 PLL with Multiplication factor 1 - 31x

The built-in phase locked loop (PLL) can be used to generate a high-frequency system clock. The PLL has a user-

selectable multiplication factor of from 1 to 31. In combination with the prescalers, this gives a wide range of output

frequencies from all clock sources.

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12. Power Management and Sleep Modes

12.1 Features

Power management for adjusting power consumption and functions

5 sleep modes

Idle

Power-down

Power-save

Standby

Extended standby

Power reduction register to disable clock and turn off unused peripherals in active and idle modes

12.2 Overview

Various sleep modes and clock gating are provided in order to tailor power consumption to application requirements.

This enables the Atmel AVR XMEGA microcontroller to stop unused modules to save power.

All sleep modes are available and can be entered from active mode. In active mode, the CPU is executing application

code. When the device enters sleep mode, program execution is stopped and interrupts or a reset is used to wake the

device again. The application code decides which sleep mode to enter and when. Interrupts from enabled peripherals

and all enabled reset sources can restore the microcontroller from sleep to active mode.

In addition, power reduction registers provide a method to stop the clock to individual peripherals from software. When

this is done, the current state of the peripheral is frozen, and there is no power consumption from that peripheral. This

reduces the power consumption in active mode and idle sleep modes and enables much more fine-tuned power

management than sleep modes alone.

12.3 Sleep Modes

Sleep modes are used to shut down modules and clock domains in the microcontroller in order to save power. XMEGA

microcontrollers have five different sleep modes tuned to match the typical functional stages during application

execution. A dedicated sleep instruction (SLEEP) is available to enter sleep mode. Interrupts are used to wake the

device from sleep, and the available interrupt wake-up sources are dependent on the configured sleep mode. When an

enabled interrupt occurs, the device will wake up and execute the interrupt service routine before continuing normal

program execution from the first instruction after the SLEEP instruction. If other, higher priority interrupts are pending

when the wake-up occurs, their interrupt service routines will be executed according to their priority before the interrupt

service routine for the wake-up interrupt is executed. After wake-up, the CPU is halted for four cycles before execution

starts.

The content of the register file, SRAM and registers are kept during sleep. If a reset occurs during sleep, the device will

reset, start up, and execute from the reset vector.

12.3.1 Idle Mode

In idle mode the CPU and nonvolatile memory are stopped (note that any ongoing programming will be completed), but

all peripherals, including the interrupt controller, event system and DMA controller are kept running. Any enabled

interrupt will wake the device.

12.3.2 Power-down Mode

In power-down mode, all clocks, including the real-time counter clock source, are stopped. This allows operation only of

asynchronous modules that do not require a running clock. The only interrupts that can wake up the MCU are the two-

wire interface address match interrupt and asynchronous port interrupts, e.g pin change.

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12.3.3 Power-save Mode

Power-save mode is identical to power down, with one exception. If the real-time counter (RTC) is enabled, it will keep

running during sleep, and the device can also wake up from either an RTC overflow or compare match interrupt.

12.3.4 Standby Mode

Standby mode is identical to power down, with the exception that the enabled system clock sources are kept running

while the CPU, peripheral, and RTC clocks are stopped. This reduces the wake-up time.

12.3.5 Extended Standby Mode

Extended standby mode is identical to power-save mode, with the exception that the enabled system clock sources are

kept running while the CPU and peripheral clocks are stopped. This reduces the wake-up time.

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13. System Control and Reset

13.1 Features

Multiple reset sources for safe operation and device reset

Power-On Reset

External Reset

Watchdog Reset

Brown-Out Reset

PDI reset

Software reset

Asynchronous reset

No running clock in the device is required for reset

Reset status register

13.2 Overview

The reset system issues a microcontroller reset and sets the device to its initial state. This is for situations where

operation should not start or continue, such as when the microcontroller operates below its power supply rating. If a reset

source goes active, the device enters and is kept in reset until all reset sources have released their reset. The I/O pins

are immediately tri-stated. The program counter is set to the reset vector location, and all I/O registers are set to their

initial values. The SRAM content is kept. However, if the device accesses the SRAM when a reset occurs, the content of

the accessed location can not be guaranteed.

After reset is released from all reset sources, the default oscillator is started and calibrated before the device starts

running from the reset vector address. By default, this is the lowest program memory address, 0, but it is possible to

move the reset vector to the lowest address in the boot section.

The reset functionality is asynchronous, and so no running system clock is required to reset the device. The software

reset feature makes it possible to issue a controlled system reset from the user software.

The reset status register has individual status flags for each reset source. It is cleared at power-on reset, and shows

which sources have issued a reset since the last power-on.

13.3 Reset Sequence

A reset request from any reset source will immediately reset the device and keep it in reset as long as the request is

active. When all reset requests are released, the device will go through three stages before the device starts running

again:

Reset counter delay

Oscillator startup

Oscillator calibration

If another reset requests occurs during this process, the reset sequence will start over again.

13.4 Reset Sources

13.4.1 Power-On Reset

TA power-on reset (POR) is generated by an on-chip detection circuit. The POR is activated when the VCC rises and

reaches the POR threshold voltage (VPOT), and this will start the reset sequence.

The POR is also activated to power down the device properly when the VCC falls and drops below the VPOT level.

The VPOT level is higher for falling VCC than for rising VCC. Consult the datasheet for POR characteristics data.

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13.4.2 Brownout Detection

The on-chip brownout detection (BOD) circuit monitors the VCC level during operation by comparing it to a fixed,

programmable level that is selected by the BODLEVEL fuses. If disabled, BOD is forced on at the lowest level during chip

erase and when the PDI is enabled.

13.4.3 External Reset

The external reset circuit is connected to the external RESET pin. The external reset will trigger when the RESET pin is

driven below the RESET pin threshold voltage, VRST, for longer than the minimum pulse period, tEXT. The reset will be

held as long as the pin is kept low. The RESET pin includes an internal pull-up resistor.

13.4.4 Watchdog Reset

The watchdog timer (WDT) is a system function for monitoring correct program operation. If the WDT is not reset from

the software within a programmable timeout period, a watchdog reset will be given. The watchdog reset is active for o ne

to two clock cycles of the 2MHz internal oscillator. For more details see “WDT - Watchdog Timer” on page 28.

13.4.5 Software reset

The software reset makes it possible to issue a system reset from software by writing to the software reset bit in the reset

control register.The reset will be issued within two CPU clock cycles after writing the bit. It is not possible to execute any

instruction from when a software reset is requested until it is issued.

13.4.6 Program and Debug Interface Reset

The program and debug interface reset contains a separate reset source that is used to reset the device during external

programming and debugging. This reset source is accessible only from external debuggers and programmers.

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13.5 WDT - Watchdog Timer

13.5.1 Features

Issues a device reset if the timer is not reset before its timeout period

Asynchronous operation from dedicated oscillator

1kHz output of the 32kHz ultra low power oscillator

11 selectable timeout periods, from 8ms to 8s

Two operation modes:

Normal mode

Window mode

Configuration lock to prevent unwanted changes

13.6 Overview

The watchdog timer (WDT) is a system function for monitoring correct program operation. It makes it possible to recover

from error situations such as runaway or deadlocked code. The WDT is a timer, configured to a predefined timeout

period, and is constantly running when enabled. If the WDT is not reset within the timeout period, it will issue a

microcontroller reset. The WDT is reset by executing the WDR (watchdog timer reset) instruction from the application

code.

The window mode makes it possible to define a time slot or window inside the total timeout period during which WDT

must be reset. If the WDT is reset outside this window, either too early or too late, a system reset will be issued.

Compared to the normal mode, this can also catch situations where a code error causes constant WDR execution.

The WDT will run in active mode and all sleep modes, if enabled. It is asynchronous, runs from a CPU-independent clock

source, and will continue to operate to issue a system reset even if the main clocks fail.

The configuration change protection mechanism ensures that the WDT settings cannot be changed by accident. For

increased safety, a fuse for locking the WDT settings is also available.

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14. Interrupts and Programmable Multilevel Interrupt Controller

14.1 Features

Short and predictable interrupt response time

Separate interrupt configuration and vector address for each interrupt

Programmable multilevel interrupt controller

Interrupt prioritizing according to level and vector address

Three selectable interrupt levels for all interrupts: low, medium and high

Selectable, round-robin priority scheme within low-level interrupts

Non-maskable interrupts for critical functions

Interrupt vectors optionally placed in the application section or the boot loader section

14.2 Overview

Interrupts signal a change of state in peripherals, and this can be used to alter program execution. Peripherals can have

one or more interrupts, and all are individually enabled and configured. When an interrupt is enabled and configured, it

will generate an interrupt request when the interrupt condition is present. The programmable multilevel interrupt

controller (PMIC) controls the handling and prioritizing of interrupt requests. When an interrupt request is acknowledged

by the PMIC, the program counter is set to point to the interrupt vector, and the interrupt handler can be executed.

All peripherals can select between three different priority levels for their interrupts: low, medium, and high. Interrupts are

prioritized according to their level and their interrupt vector address. Medium-level interrupts will interrupt low-level

interrupt handlers. High-level interrupts will interrupt both medium- and low-level interrupt handlers. Within each level, the

interrupt priority is decided from the interrupt vector address, where the lowest interrupt vector address has the highest

interrupt priority. Low-level interrupts have an optional round-robin scheduling scheme to ensure that all interrupts are

serviced within a certain amount of time.

Non-maskable interrupts (NMI) are also supported, and can be used for system critical functions.

14.3 Interrupt vectors

The interrupt vector is the sum of the peripheral’s base interrupt address and the offset address for specific interrupts in

each peripheral. The base addresses for the Atmel AVR XMEGA A1U devices are shown in Table 14-1. Offset

addresses for each interrupt available in the peripheral are described for each peripheral in the XMEGA AU manual. For

peripherals or modules that have only one interrupt, the interrupt vector is shown in Table 14-1. The program address is

the word address.

Table 14-1. Reset and Interrupt vectors

Program Address

(Base Address) Source Interrupt Description

0x000 RESET

0x002 OSCF_INT_vect Crystal Oscillator Failure Interrupt vector (NMI)

0x004 PORTC_INT_base Port C Interrupt base

0x008 PORTR_INT_base Port R Interrupt base

0x00C DMA_INT_base DMA Controller Interrupt base

0x014 RTC_INT_base Real Time Counter Interrupt base

0x018 TWIC_INT_base Two-Wire Interface on Port C Interrupt base

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0x01C TCC0_INT_base Timer/Counter 0 on port C Interrupt base

0x028 TCC1_INT_base Timer/Counter 1 on port C Interrupt base

0x030 SPIC_INT_vect SPI on port C Interru pt vector

0x032 USARTC0_INT_base USART 0 on port C Interrupt base

0x038 USARTC1_INT_base USART 1 on port C Interrupt base

0x03E AES_INT_vect AES Interrupt vector

0x040 NVM_INT_base Non-Volatile Memory Interrupt base

0x044 PORTB_INT_base Port B Interrupt base

0x048 ACB_INT_base Analog Comparator on Port B Interrupt base

0x04E ADCB_INT_base Analog to Digital Converter on Port B Interrupt base

0x056 PORTE_INT_base Port E Interrupt base

0x05A TWIE_INT_base Two-Wire Interface on Port E Interrupt base

0x05E TCE0_INT_base Timer/Counter 0 on port E Interrupt base

0x06A TCE1_INT_base Timer/Counter 1 on port E Interrupt base

0x072 SPIE_INT_vect SPI on port E Interrupt vector

0x074 USARTE0_INT_base USART 0 on port E Interrupt base

0x07A USARTE1_INT_base USART 1 on port E Interrupt base

0x080 PORTD_INT_base Port D Interrupt base

0x084 PORTA_INT_base Port A Interrupt base

0x088 ACA_INT_base Analog Comparator on Port A Interrupt base

0x08E ADCA_INT_base Analog to Digital Converter on Port A Interrupt base

0x096 TWID_INT_base Two-Wire Interface on Port D Interrupt base

0x09A TCD0_INT_base Timer/Counter 0 on po rt D Interrupt base

0x0A6 TCD1_INT_base Ti mer/Counter 1 on po rt D Interrupt base

0x0AE SPID_INT_vector SPI on port D Interrupt vector

0x0B0 USARTD0_INT_base USART 0 on port D Interrupt base

0x0B6 USARTD1_INT_base USART 1 on port D Interrupt base

0x0BC PORTQ_INT_base Port Q INT base

0x0C0 PORTH_INT_base Port H INT base

0x0C4 PORTJ_INT_base Port J INT base

0x0C8 PORTK_INT_base Port K INT base

0x0D0 PORTF_INT_base Port F INT base

0x0D4 TWIF_INT_base Two-Wire Interface on Port F INT base

Program Address

(Base Address) Source Interrupt Description

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0x0D8 TCF0_INT_base Timer/Counter 0 on port F Interrupt base

0x0E4 TCF1_INT_base Timer/Counter 1 on port F Interrupt base

0x0EC SPIF_INT_vector SPI ion port F Interrupt base

0x0EE USARTF0_INT_base USART 0 on port F Interrupt base

0x0F4 USARTF1_INT_base USART 1 on port F Interrupt base

Program Address

(Base Address) Source Interrupt Description

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8067O–AVR–06/2013

15. I/O Ports

15.1 Features

78 General purpose input and output pins with individual configuration

Output driver with configurable driver and pull settings:

Totem-pole

Wired-AND

Wired-OR

Bus-keeper

Inverted I/O

Input with synchronous and/or asynchronous sensing with interrupts and events

Sense both edges

Sense rising edges

Sense falling edges

Sense low level

Optional pull-up and pull-down resistor on input and Wired-OR/AND configurations

Optional slew rate control

Asynchronous pin change sensing that can wake the device from all sleep modes

Two port interrupts with pin masking per I/O port

Efficient and safe access to port pins

Hardware read-modify-write through dedicated toggle/clear/set registers

Configuration of multiple pins in a single operation

Mapping of port registers into bit-accessible I/O memory space

Peripheral clocks output on port pin

Real-time counter clock output to port pin

Event channels can be output on port pin

Remapping of digital peripheral pin functions

Selectable USART, SPI, and ti mer/counter input/output pin location s

15.2 Overview

One port consists of up to eight port pins: pin 0 to 7. Each port pin can be configured as input or output with configurable

driver and pull settings. They also implement synchronous and asynchronous input sensing with interrupts and events for

selectable pin change conditions. Asynchronous pin-change sensing means that a pin change can wake the device from

all sleep modes, included the modes where no clocks are running.

All functions are individual and configurable per pin, but several pins can be configured in a single operation. The pins

have hardware read-modify-write (RMW) functionality for safe and correct change of drive value and/or pull resistor

configuration. The direction of one port pin can be changed without unintentionally changing the direction of any other

pin.

The port pin configuration also controls input and output selection of other device functions. It is possible to have both the

peripheral clock and the real-time clock output to a port pin, and available for external use. The same applies to events

from the event system that can be used to synchronize and control external functions. Other digital peripherals, such as

USART, SPI, and timer/counters, can be remapped to selectable pin locations in order to optimize pin-out versus

application needs.

The notation of these ports are PORTA, PORTB, PORTC, PORTD, PORTE, PORTF, PORTH, PORTJ, PORTK, PORTQ

and PORTR.

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15.3 Output Driver

All port pins (Pn) have programmable output configuration. The port pins also have configurable slew rate limitation to

reduce electromagnetic emission.

15.3.1 Push-pull

Figure 15-1. I/O configuration - Totem-pole

15.3.2 Pull-down

Figure 15-2. I/O configuration - Totem-pole with pull-d own (on input)

15.3.3 Pull-up

Figure 15-3. I/O configuration - Totem-pole with pull-up (on inp ut)

INn

OUTn

DIRn

INn

OUTn

DIRn

INn

OUTn

DIRn

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15.3.4 Bus-keeper

The bus-keeper’s weak output produces the same logical level as the last output level. It acts as a pull-up if the last level

was ‘1’, and pull-down if the last level was ‘0’.

Figure 15-4. I/O config uration - Totem-pole with bus-keeper

15.3.5 Others

Figure 15-5. Output configura ti on - Wire d-O R with op tio na l pul l-d ow n

Figure 15-6. I/O configuration - Wired-AND with optional pull-up

INn

OUTn

DIRn

INn

OUTn

INn

OUTn

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15.4 Input sensing

Input sensing is synchronous or asynchronous depending on the enabled clock for the ports, and the configuration is

shown in Figure 15-7 on page 35.

Figure 15-7. Input sensing system overview

When a pin is configured with inverted I/O the pin value is inverted before the input sensing.

15.5 Port Interrupt

Each ports have two interrupts with seperate priority and interrupt vector. All pins on the port can be individually selected

as source for each of the interrupts. The interrupts are then triggered according to the input sense configuration for each

pin configured as source for the interrupt.

15.6 Alternate Port Functions

In addition to the input/output functions on all port pins, most pins have alternate functions. This means that other

modules or peripherals connected to the port can use the port pins for their functions, such as communication or pulse-

width modulation. “Pinout and Pin Functions” on page 55 shows which modules on peripherals that enables alternate

functions on a pin, and what alternate functions that is available on a pin.

IN VE R T E D I/O

Interrupt

Control IREQ

Event

Synchronizer

INn

EDGE

DETECT

Asynchronous sensing

Synchronous sensing

EDGE

DETECT

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16. T/C - 16-bit Timer/Counter

16.1 Features

Eight 16-bit Timer/Counters

Four Timer/Counters of type 0

Four Timer/Counters of type 1

Four Compare or Capture (CC) Channels in Timer/Counter 0

Two Compare or Capture (CC) Channels in Timer/Counter 1

Double Buffered Timer Period Setting

Double Buffered Compare or Capture Channels

Waveform Generation:

Single Slope Pulse Width Modulation

Dual Slope Pulse Width Modulation

Frequency Generation

Input Capture:

Input Capture with Noise Cancelling

Frequency capture

Pulse width capture

32-bit input capture

Event Counter with Direction Control

Timer Overflow and Timer Error Interrupts and Events

One Compare Match or Capture Interrupt and Event per CC Channel

Supports DMA Operation

Hi-Resolution Extension (Hi-Res)

Advanced Waveform Extension (AWEX)

16.2 Overview

Atmel AVR XMEGA devices have a set of eight flexible 16-bit timer/counters (TC). Their capabilities include accurate

program execution timing, frequency and waveform generation, and input capture with time and frequency measurement

of digital signals. Two timer/counters can be cascaded to create a 32-bit timer/counter with optional 32-bit capture.

A timer/counter consists of a base counter and a set of compare or capture (CC) channels. The base counter can be

used to count clock cycles or events. It has direction control and period setting that can be used for timing. The CC

channels can be used together with the base counter to do compare match control, frequency generation, and pulse

width waveform modulation, as well as various input capture operations. A timer/counter can be configured for either

capture or compare functions, but cannot perform both at the same time.

A timer/counter can be clocked and timed from the peripheral clock with optional prescaling or from the event system.

The event system can also be used for direction control and capture trigger or to synchronize operations.

There are two differences between timer/counter type 0 and type 1. Timer/counter 0 has four CC channels, and

timer/counter 1 has two CC channels. All information related to CC channels 3 and 4 is valid only for timer/counter 0.

Only Timer/Counter 0 has the split mode feature that split it into 2 8-bit Timer/Counters with four compare channels each.

Some timer/counters have extensions to enable more specialized waveform and frequency generation. The advanced

waveform extension (AWeX) is intended for motor control and other power control applications. It enables low- and high-

side output with dead-time insertion, as well as fault protection for disabling and shutting down external drivers. It can

also generate a synchronized bit pattern across the port pins.

The advanced waveform extension can be enabled to provide extra and more advanced features for the Timer/Counter.

This is only available for Timer/Counter 0. See “AWeX - Advanced Waveform Extension” on page 38 for more details.

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The high-resolution (hi-res) extension can be used to increase the waveform output resolution by four or eight times by

using an internal clock source running up to four times faster than the peripheral clock. See “Hi-Res - High Resolution

Extension” on page 39 for more details.

Figure 16-1. Overview of a Timer/Counter and closely related peripherals

PORTC, PORTD, PORTE and PORTF each has one Timer/Counter 0 and one Timer/Counter1. Notation of these

Timer/Counters are TCC0 (Time/Counter C0), TCC1, TCD0, TCD1, TCE0, TCE1, TCF0, and TCF1, respectively.

AWeX

Compare/Capture Channel D

Compare/Capture Channel C

Compare/Capture Channel B

Compare/Capture Channel A

Waveform

Generation

Buffer

Comparator

Hi-Res

Fault

Protection

Capture

Control

Base Counter

Counter Control Logic

Timer Period

Prescaler

DTI

Dead-Time

Insertion

Pattern

Generation

clkPER4

PORT

Event

System

clkPER

Timer/Counter

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17. AWeX - Advanced Waveform Extension

17.1 Features

Output with complementary output from each Capture channel

Four Dead Time Insertion (DTI) Units, one for each Capture channel

8-bit DTI Resolution

Separate High and Low Side Dead-Time Setting

Double Buffered Dead-Time

Event Controlled Fault Protection

Single Channel Multiple Output Operation (for BLDC motor control)

Double Buffered Pattern Generation

17.2 Overview

The advanced waveform extension (AWeX) provides extra functions to the timer/counter in waveform generation (WG)

modes. It is primarily intended for use with different types of motor control and other power control applications. It

enables low- and high side output with dead-time insertion and fault protection for disabling and shutting down external

drivers. It can also generate a synchronized bit pattern across the port pins.

Each of the waveform generator outputs from the Timer/Counter 0 are split into a complimentary pair of outputs when

any AWeX features are enabled. These output pairs go through a dead-time insertion (DTI) unit that generates the non-

inverted low side (LS) and inverted high side (HS) of the WG output with dead-time insertion between LS and HS

switching. The DTI output will override the normal port value according to the port override setting.

The pattern generation unit can be used to generate a synchronized bit pattern on the port it is connected to. In addition,

the WG output from compare channel A can be distributed to and override all the port pins. When the pattern generator

unit is enabled, the DTI unit is bypassed.

The fault protection unit is connected to the event system, enabling any event to trigger a fault condition that will disable

the AWeX output. The event system ensures predictable and instant fault reaction, and gives great flexibility in the

selection of fault triggers.

The AWeX is available for TCC0 and TCE0. The notation of these are AWEXC and AWEXE.

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18. Hi-Res - High Resolution Extension

18.1 Features

Increases Waveform Generator resolution by 2-bits (4x)

Supports Frequency, single- and dual-slope PWM operation

Supports the AWeX when this is enabled and used for the same Timer/Counter

18.2 Overview

TThe high-resolution (hi-res) extension can be used to increase the resolution of the waveform generation output from a

timer/counter by four or eight. It can be used for a timer/counter doing frequency, single-slope PWM, or dual-slope PWM

generation. It can also be used with the AWeX if this is used for the same timer/counter.

The hi-res extension uses the peripheral 4x clock (ClkPER4). The system clock prescalers must be configured so the

peripheral 4x clock frequency is four times higher than the peripheral and CPU clock frequency when the hi-res extension

is enabled.

There are four hi-res extensions that each can be enabled for each timer/counters pair on PORTC, PORTD, PORTE and

PORTF. The notation of these peripherals are HIRESC, HIRESD, HIRESE and HIRESF, respectively.

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19. RTC - 16-bit Real-Time Counter

19.1 Features

16-bit resolution

Selectable clock source

32.768kHz external crystal

External clock

32.768kHz internal oscillator

32kHz internal ULP oscillator

Programmable 10-bit clock prescaling

One compare register

One period register

Clear counter on period overflow

Optional interrupt/event on overflow and compare match

19.2 Overview

The 16-bit real-time counter (RTC) is a counter that typically runs continuously, including in low-power sleep modes, to

keep track of time. It can wake up the device from sleep modes and/or interrupt the device at regular intervals.

The reference clock is typically the 1.024kHz output from a high-accuracy crystal of 32.768kHz, and this is the

configuration most optimized for low power consumption. The faster 32.768kHz output can be selected if the RTC needs

a resolution higher than 1ms. The RTC can also be clocked from an external clock signal, the 32.768kHz internal

oscillator or the 32kHz internal ULP oscillator.

The RTC includes a 10-bit programmable prescaler that can scale down the reference clock before it reaches the

counter. A wide range of resolutions and time-out periods can be configured. With a 32.768kHz clock source, the

maximum resolution is 30.5µs, and time-out periods can range up to 2000 seconds. With a resolution of 1s, the

maximum timeout period is more than18 hours (65536 seconds). The RTC can give a compare interrupt and/or event

when the counter equals the compare register value, and an overflow interrupt and/or event when it equals the period

Figure 19-1. Real Time Counter overview

32.768kHz Crystal Osc

32.768kHz Int. Osc

TOSC1

TOSC2

External Clock

DIV32

32kHz int ULP (DIV32)

RTCSRC

10-bit

prescaler

clkRTC

CNT

PER

COMP

”match”/

Compare

TOP/

Overflow

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20. TWI - Two-Wire Interface

20.1 Features

Four identical two-wire interface peripherals

Bidirectional two-wire communication interface

Phillips I2C compatible

System Management Bus (SMBus) compatible

Bus master and slave operation supported

Slave operation

Single bus master operation

Bus master in multi-master bus environment

Multi-master arbitration

Flexible slave address match functions

7-bit and general call address recognition in hard ware

10-bit addressing supported

Address mask register for dual address match or address range masking

Optional software address recogni tion for unlimited number of addresses

Slave can operate in all sleep modes, including power-down

Slave address match can wake device from all sleep modes, including power-down

100kHz and 400kHz bus frequency support

Slew-rate limited output drivers

Input filter for bus noise and spike suppression

Support arbitration between start repeated start and data bit (SMBus)

Slave arbitration allows support for address resolve protocol (ARP) (SMBus)

20.2 Overview

The two-wire interface (TWI) is a bidirectional, two-wire communication interface. It is I2C and System Management Bu s

(SMBus) compatible. The only external hardware needed to implement the bus is one pull-up resistor on each bus line.

A device connected to the bus must act as a master or a slave. The master initiates a data transaction by addressing a

slave on the bus and telling whether it wants to transmit or receive data. One bus can have many slaves and one or

several masters that can take control of the bus. An arbitration process handles priority if more than one master tries to

transmit data at the same time. Mechanisms for resolving bus contention are inherent in the protocol.

The TWI module supports master and slave functionality. The master and slave functionality are separated from each

other, and can be enabled and configured separately. The master module supports multi-master bus operation and

arbitration. It contains the baud rate generator. Both 100kHz and 400kHz bus frequency is supported. Quick command

and smart mode can be enabled to auto-trigger operations and reduce software complexity.

The slave module implements 7-bit address match and general address call recognition in hardware. 10-bit addressing is

also supported. A dedicated address mask register can act as a second address match register or as a register for

address range masking. The slave continues to operate in all sleep modes, including power-down mode. This enables

the slave to wake up the device from all sleep modes on TWI address match. It is possible to disable the address

matching to let this be handled in software instead.

The TWI module will detect START and STOP conditions, bus collisions, and bus errors. Arbitration lost, errors, collision,

and clock hold on the bus are also detected and indicated in separate status flags available in both master and slave

modes.

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It is possible to disable the TWI drivers in the device, and enable a four-wire digital interface for connecting to an external

TWI bus driver. This can be used for applications where the device operates from a different VCC voltage than used by

the TWI bus.

PORTC, PORTD, PORTE, and PORTF each has one TWI. Notation of these peripherals are TWIC, TWID, TWIE, and

TWIF.

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21. SPI - Serial Peripheral Interface

21.1 Features

Four identical SPI peripherals

Full-duplex, three-wire synchronous data transfer

Master or slave operation

Lsb first or msb first data transfer

Eight programmable bit rates

Interrupt flag at the end of transmission

Write collision flag to indicate data collision

Wake up from idle sleep mode

Double speed master mode

21.2 Overview

The Serial Peripheral Interface (SPI) is a high-speed synchronous data transfer interface using three or four pins. It

allows fast communication between an Atmel AVR XMEGA device and peripheral devices or between several

microcontrollers. The SPI supports full-duplex communication.

A device connected to the bus must act as a master or slave. The master initiates and controls all data transactions.

PORTC, PORTD, PORTE, and PORTF each has one SPI. Notation of these peripherals are SPIC, SPID, SPIE, and

SPIF.

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22. USART

22.1 Features

Eight identical USART peripherals

Full-duplex operation

Asynchronous or synchronous operation

Synchronous clock rates up to 1/2 of the device clock frequency

Asynchronous clock rates up to 1/8 of the device clock frequency

Supports serial frames with 5, 6, 7, 8, or 9 data bits and 1 or 2 stop bits

Fractional baud rate generator

Can generate desired baud rate from any system clock frequency

No need for external oscillator with certain frequencies

Built-in error detection and correction schemes

Odd or even parity generation and parity check

Data overrun and framing error detection

Noise filtering includes false start bit detection and digital low-pass filter

Separate interrupts for

Transmit complete

Transmit data register empty

Receive complete

Multiprocessor communication mode

Addressing scheme to address a specific devices on a multidevice bus

Enable unaddressed devices to automatically ignore all frames

Master SPI mode

Double buffered operation

Operation up to 1/2 of the peripheral clock freque ncy

IRCOM module for IrDA compliant pulse modulation/demodulation

22.2 Overview

The universal synchronous and asynchronous serial receiver and transmitter (USART) is a fast and flexible serial

communication module. The USART supports full-duplex communication and asynchronous and synchronous operation.

The USART can be configured to operate in SPI master mode and used for SPI communication.

Communication is frame based, and the frame format can be customized to support a wide range of standards. The

USART is buffered in both directions, enabling continued data transmission without any delay between frames. Separate

interrupts for receive and transmit complete enable fully interrupt driven communication. Frame error and buffer overflow

are detected in hardware and indicated with separate status flags. Even or odd parity generation and parity check can

also be enabled.

The clock generator includes a fractional baud rate generator that is able to generate a wide range of USART baud ra tes

from any system clock frequencies. This removes the need to use an external crystal oscillator with a specific frequency

to achieve a required baud rate. It also supports external clock input in synchronous slave operation.

When the USART is set in master SPI mode, all USART-specific logic is disabled, leaving the transmit and receive

buffers, shift registers, and baud rate generator enabled. Pin control and interrupt generation are identical in both modes.

The registers are used in both modes, but their functionality differs for some control settings.

An IRCOM module can be enabled for one USART to support IrDA 1.4 physical compliant pulse modulation and

demodulation for baud rates up to 115.2Kbps.

PORTC, PORTD, PORTE, and PORTF each has two USARTs. Notation of these peripherals are USARTC0, USARTC1,

USARTD0, USARTD1, USARTE0, USARTE1, USARTF0 and USARTF1.

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

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23. IRCOM - IR Communication Module

23.1 Features

Pulse modulation/demodulation for infrared communication

IrDA compatible for baud rates up to 115.2Kbps

Selectable pulse modulation scheme

3/16 of the baud rate period

Fixed pulse period, 8-bit pro grammable

Pulse modula ti on di sa bl e d

Built-in filtering

Can be connected to and used by any USART

23.2 Overview

Atmel AVR XMEGA devices contain an infrared communication module (IRCOM) that is IrDA compatible for baud rates

up to 115.2Kbps. It can be connected to any USART to enable infrared pulse encoding/decoding for that USART.

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

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24. AES and DES Crypto Engine

24.1 Features

Data Encryption Standard (DES) CPU instruction

Advanced Encryption Standard (AES) crypto module

DES Instruction

Encryption and decryption

DES supported

Encryption/decryption in 16 CPU clock cycles per 8-byte block

AES crypto module

Encryption and decryption

Supports 128-bit keys

Supports XOR data load mode to the state memory

Encryption/decryption in 375 clock cycles per 16-byte block

24.2 Overview

The Advanced Encryption Standard (AES) and Data Encryption Standard (DES) are two commonly used standards for

cryptography. These are supported through an AES peripheral module and a DES CPU instruction, and the

communication interfaces and the CPU can use these for fast, encrypted communication and secure data storage.

DES is supported by an instruction in the AVR CPU. The 8-byte key and 8-byte data blocks must be loaded into the

The AES crypto module encrypts and decrypts 128-bit data blocks with the use of a 128-bit key. The key and data must

be loaded into the key and state memory in the module before encryption/decryption is started. It takes 375 peripheral

clock cycles before the encryption/decryption is done. The encrypted/encrypted data can then be read out, and an

optional interrupt can be generated. The AES crypto module also has DMA support with transfer triggers when

encryption/decryption is done and optional auto-start of encryption/decryption when the state memory is fully loaded.

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

25. EBI – External Bus Interface

25.1 Features

Supports SRAM up to:

512KB using 3-port EBI configuration

16MB using 3-port EBI configuration

Supports SDRAM up to:

128Mb using 3-port EBI configuration

Four software configurable chip selects

Software configurable wait state insertion

Can run from the 2x peripheral clock frequency for fast access

25.2 Overview

The External Bus Interface (EBI) is used to connect external peripherals and memory for access through the data

memory space. When the EBI is enabled, data address space outside the internal SRAM becomes available using

dedicated EBI pins.

The EBI can interface external SRAM, SDRAM, and peripherals, such as LCD displays and other memory mapped

devices.

The address space for the external memory is selectable from 256 bytes (8-bit) up to 16MB (24-bit). Various multiplexing

modes for address and data lines can be selected for optimal use of pins when more or fewer pins are available for the

EBI. The complete memory will be mapped into one linear data address space continuing from the end of the internal

SRAM.

The EBI has four chip selects, each with separate configuration. Each can be configured for SRAM, SRAM low pin count

(LPC), or SDRAM.

The EBI is clocked from the fast, 2x peripheral clock, running up to two times faster than the CPU.

Four-bit and eight-bit SDRAM are supported, and SDRAM configurations, such as CAS latency and refresh rate, are

configurable in software.

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

26. ADC - 12-bit Analog to Digital Converter

26.1 Features

Two ADCs with 12-bit resolution

2Msps sample rate for each ADC

Signed and unsigned conversions

4 result registers with individual input channel control for each ADC

8 single ended inputs for each ADC

8x4 differential inputs for each ADC

4 internal inputs:

 Integrated Temperature Sensor

 DAC Output

 VCC voltage divided by 10

 Bandgap voltage

Software selectable gain of 2, 4, 8, 16, 32 or 64

Software selectable resolution of 8- or 12-bit.

Internal or External Reference selection

Event triggered conversion for accurate timing

DMA transfer of conversion results

Interrupt/Event on compare result

26.2 Overview

XMEGA A1 devices have two Analog to Digital Converters (ADC), see Figure 26-1 on page 49. The two ADC modules

can be operated simultaneously, individually or synchronized.

The ADC converts analog voltages to digital values. The ADC has 12-bit resolution and is capable of converting up to 2

million samples per second. The input selection is flexible, and both single-ended and differential measurements can be

done. For differential measurements an optional gain stage is available to increase the dynamic range. In addition

several internal signal inputs are available. The ADC can provide both signed and unsigned results.

This is a pipeline ADC. A pipeline ADC consists of several consecutive stages, where each stage convert one part of the

result. The pipeline design enables high sample rate at low clock speeds, and remove limitations on samples speed

versus propagation delay. This also means that a new analog voltage can be sampled and a new ADC measurement

started while other ADC measurements are ongoing.

ADC measurements can either be started by application software or an incoming event from another peripheral in the

device. Four different result registers with individual input selection (MUX selection) are provided to make it easier for the

application to keep track of the data. Each result register and MUX selection pair is referred to as an ADC Channel. It is

possible to use DMA to move ADC results directly to memory or peripherals when conversions are done.

Both internal and external analog reference voltages can be used. An accurate internal 1.0V reference is available.

An integrated temperature sensor is available and the output from this can be measured with the ADC. The output from

the DAC, VCC/10 and the Bandgap voltage can also be measured by the ADC.

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

Figure 26-1. ADC overview

Each ADC has four MUX selection registers with a corresponding result register. This means that four channels can be

sampled within 1.5 µs without any intervention by the application other than starting the conversion. The results will be

available in the result registers.

The ADC may be configured for 8- or 12-bit result, reducing the minimum conversion time (propagation delay) from 3.5

µs for 12-bit to 2.5 µs for 8-bit result.

ADC conversion results are provided left- or right adjusted with optional ‘1’ or ‘0’ padding. This eases calculation when

the result is represented as a signed integer (signed 16-bit number).

PORTA and PORTB each has one ADC. Notation of these peripherals are ADCA and ADCB, respectively.

CH1 Result

CH0 Result

CH2 Result

Compare

>Threshold

(Int Req)

Internal 1.00V

Internal VCC/1.6V

AREFA

AREFB

VINP

VINN

Internal

signals

Internal

signals

CH3 Result

ADC0

ADC7

ADC4

ADC7

ADC0

ADC3

•

Int. signals

Reference

Voltage

1x - 64x

•

ADC0

ADC7

•

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

27. DAC - 12-bit Digital to Analog Converter

27.1 Features

12-bit resolution

Two independent, continuous-drive output channels

Up to one million samples per second conversion rate

Built-in calibration that removes:

Offset error

Gain error

Multiple conversion trigger sources

On new available data

Events from the event system

High drive capabilities and support for

Resistive loads

Capacitive loads

Combined resistive and capacitive loads

Internal and external reference options

DAC output available as input to analog comparator and ADC

Low-power mode, with reduced drive strength

Optional DMA transfer of data

27.2 Overview

The XMEGA A1 devices features two 12-bit, 1 Msps DACs with built-in offset and gain calibration, see Figure 27-1 on

page 50.

A DAC converts a digital value into an analog signal. The DAC may use an internal 1.0 voltage as the upper limit for

conversion, but it is also possible to use the supply voltage or any applied voltage in-between. The external reference

input is shared with the ADC reference input.

Figure 27-1. DAC overview

CH1DATA

CH0DATA

Trigger

Internal 1.00V

AREFA

AREFB

AVCC

DAC CTRL

DAC CH0

REFSEL

Enable

ADC

DAC

DAC CH1

Output

Control and Driver

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

Each DAC has one continuous output with high drive capabilities for both resistive and capacitive loads. It is also

possible to split the continuous time channel into two Sample and Hold (S/H) channels, each with separate data

conversion registers.

A DAC conversion may be started from the application software by writing the data conversion registers. The DAC can

also be configured to do conversions triggered by the Event System to have regular timing, independent of the

application software. DMA may be used for transferring data from memory locations to DAC data registers.

The DAC has a built-in calibration system to reduce offset and gain error when loading with a calibration value from

software.

PORTA and PORTB each has one DAC. Notation of these peripherals are DACA and DACB. respectively.

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

28. AC - Analog Comparator

28.1 Features

Four Analog Comparators

Selectable propagation delay versus current consumption

Selectable hysteresis

No

Small

Large

Analog comparator output available on pin

Flexible input selection

All pins on the port

Output from the DAC

Bandgap reference voltage

A 64-level programmable voltage scaler of the internal VCC voltage

Interrupt and event generation on:

Rising edge

Falling edge

Toggle

Window function interrupt and event generation on:

Signal above window

Signal inside window

Signal below window

Constant current source with configurable output pin selection

28.2 Overview

The analog comparator (AC) compares the voltage levels on two inputs and gives a digital output based on this

comparison. The analog comparator may be configured to generate interrupt requests and/or events upon several

different combinations of input change.

Two important properties of the analog comparator’s dynamic behavior are: hysteresis and propagation delay. Both of

these parameters may be adjusted in order to achieve the optimal operation for each application.

The input selection includes analog port pins, several internal signals, and a 64-level programmable voltage scaler. The

analog comparator output state can also be output on a pin for use by external devices.

A constant current source can be enabled and output on a selectable pin. This can be used to replace, for example,

external resistors used to charge capacitors in capacitive touch sensing applications.

The analog comparators are always grouped in pairs on each port. These are called analog comparator 0 (AC0) and

analog comparator 1 (AC1). They have identical behavior, but separate control registers. Used as pair, they can be set in

window mode to compare a signal to a voltage range instead of a voltage level.

PORTA and PORTB each has one AC pair. Notations are ACA and ACB, respectively.

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

Figure 28-1 . Analog co m parator overvi ew

The window function is realized by connecting the external inputs of the two analog comparators in a pair as shown in

Figure 28-2.

Figure 28-2. Analog compa r ato r wind ow function

ACnMUXCTRL ACnCTRL

Interrupt

Mode

Enable

Hysteresis

AC1OUT

WINCTRL

Interrupt

Sensititivity

Control

Window

Function

Events

Interrupts

AC0OUT

Pin Input

Voltage

Scaler

DAC

Bandgap

AC0

AC1

Input signal

Upper limit of window

Lower limit of window

Interrupt

sensitivity

control

Interrupts

Events

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

29. Programming and Debugging

29.1 Features

Programming

External programming through PDI or JTAG interfaces

Minimal protocol overhead for fast operation

Built-in error detection and handling for reliable operation

Boot loader support for programming through any communication interface

Debugging

Nonintrusive, real-time, on-chip debug system

No software or hardware resources required from device except pin connection

Program flow control

Go, Stop, Reset, Step Into, Step Over, Step Out, Run-to-Cursor

Unlimited number of user program breakpoints

Unlimited number of user data breakpoints, break on:

Data location read, write, or both read and write

Data location content equal or not equal to a value

Data location content is greater or smaller than a value

Data location content is within or outside a range

No limitation on device clock frequency

Program and Debug Interface (PDI)

Two-pin interface for external programming and debugging

Uses the Reset pin and a dedicated pin

No I/O pins required during programming or debugging

JTAG interface

Four-pin, IEEE Std. 114 9.1 compliant interface for programming and debugging

Boundary scan capabilities according to IEEE Std. 1149.1 (JTAG)

29.2 Overview

The Program and Debug Interface (PDI) is an Atmel proprietary interface for external programming and on-chip

debugging of a device.

The PDI supports fast programming of nonvolatile memory (NVM) spaces; flash, EEPOM, fuses, lock bits, and the user

signature row.

Debug is supported through an on-chip debug system that offers nonintrusive, real-time debug. It does not require any

software or hardware resources except for the device pin connection. Using the Atmel tool chain, it offers complete

program flow control and support for an unlimited number of program and complex data breakpoints. Application debug

can be done from a C or other high-level language source code level, as well as from an assembler and disassembler

level.

Programming and debugging can be done through two physical interfaces. The primary one is the PDI physical layer,

which is available on all devices. This is a two-pin interface that uses the Reset pin for the clock input (PDI_CLK) and one

other dedicated pin for data input and output (PDI_DATA). A JTAG interface is also available on most devices, and this

can be used for programming and debugging through the four-pin JTAG interface. The JTAG interface is IEEE Std.

1149.1 compliant, and supports boundary scan. Any external programmer or on-chip debugger/emulator can be directly

connected to either of these interfaces. Unless otherwise stated, all references to the PDI assume access through the

PDI physical layer.

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

30. Pinout and Pin Functions

The pinout of XMEGA A1 is shown in “Pinout/Block Diagram” on page 3. In addition to general I/O functionality, each pin

may have several functions. This will depend on which peripheral is enabled and connected to the actual pin. Only one of

the alternate pin functions can be used at time.

30.1 Alternate Pin Function Description

The tables below shows the notation for all pin functions available and describes its function.

30.1.1 Operation/Power Supply

30.1.2 Port Interrupt functions

30.1.3 Analog functions

30.1.4 EBI functions

VCC Digital supply voltage

AVCC Analog supply voltage

GND Ground

SYNC Port pin with full synchrono us and limited asynchronous interrupt function

ASYNC Port pin with full synchronous and full asynch ronous interrupt function

ACn Analog Comparator input pin n

AC0OUT Analog Comparator 0 Output

ADCn Analog to Digital Converter input pin n

DACn Digital to Analog Converter output pin n

AREF Analog Reference input pin

An Address line n

Dn Data line n

CSn Chip Select n

ALEn Address Latch Enable pin n (SRAM)

RE Read Enable (SRAM)

WE External Data Memory Write (SRAM /SDRAM)

BAn Bank Address (SDRAM)

CAS Column Access Strobe (SDRAM)

CKE SDRAM Clock Enable (SDRAM)

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

30.1.5 Timer/Counter and AWEX functions

30.1.6 Communication functions

30.1.7 Oscillators, Clock and Event

CLK SDRAM Clock (SDRAM)

DQM Data Mask Signal/Output Enable (SDRAM)

RAS Row Access Strobe (SDRAM)

2P 2 Port Interface

3P 3 Port Interface

OCnx Output Compare Chan nel x for Timer/Counter n

OCnx Inverted Output Compare Channel x for Timer/Counter n

OCnxLS Output Compare Channel x Low Side for Timer/Counter n

OCnxHS Output Compare Channel x High Side for Timer/Counter n

SCL Serial Clock for TWI

SDA Serial Data for TWI

SCLIN Serial Clock In for TWI when external driver interface is enabled

SCLOUT Serial Clock Out for TWI when external driver interface is enabled

SDAIN Serial Data In for TWI when external driver interface is enabled

SDAOUT Serial Data Out for TWI when external driver interface is enabled

XCKn Transfer Clock for USART n

RXDn Receiver Data for USART n

TXDn Transmitter Data for USART n

SS Slave Select for SPI

MOSI Master Out Slave In for SPI

MISO Master In Slave Out for SPI

SCK Serial Clock for SPI

nTimer Oscillator pin n

XTALn Input/Output for inverting Oscillator pin n

CLKOUT Peripheral Clock Output

EVOUT Event Channel 0 Output

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

30.1.8 Debug/System functions

RESET Reset pin

PDI_CLK Program and Debug Interface Clock pin

PDI_DATA Program and Debug Interface Data pin

TCK JTAG Test Clock

TDI JTAG Test Data In

TDO JTAG Test Data Out

TMS JTAG Test Mode Select

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

30.2 Alternate Pin Functions

The tables below show the primary/default function for each pin on a port in the first column, the pin number in the

second column, and then all alternate pin functions in the remaining columns. The head row shows what peripheral that

enable and use the alternate pin functions.

Table 30-1. Port A - Alternate functions.

Table 30-2. Port B - Alternate functions.

Table 30-3. Port C - Alternate functions.

PORT A PIN # INTERRUPT ADCA

POS ADCA

NEG ADCA

GAINPOS ADCA

GAINNEG ACA

POS ACA

NEG ACA

OUT DACA REFA

GND 93

AVCC 94

PA0 95 SYNC ADC0 ADC0 ADC0 AC0 AC0 AREF

PA1 96 SYNC ADC1 ADC1 ADC1 AC1 AC1

PA2 97 SYNC/ASYNC ADC2 ADC2 ADC2 AC2 DAC0

PA3 98 SYNC ADC3 ADC3 ADC3 AC3 AC3 DAC1

PA4 99 SYNC ADC4 ADC4 ADC4 AC4

PA5 100 SYNC ADC5 ADC5 ADC5 AC5 AC5

PA6 1SYNC ADC6 ADC6 ADC6 AC6

PA7 2SYNC ADC7 ADC7 ADC7 AC7 AC0OUT

PORT B PIN # INTERRUPT ADCB

POS ADCB

NEG ADCB

GAINPOS ADCB

GAINNEG ACB

POS ACB

NEG ACB

OUT DACB REFB JTAG

GND 3

AVCC 4

PB0 5SYNC ADC0 ADC0 ADC0 AC0 AC0 AREF

PB1 6SYNC ADC1 ADC1 ADC1 AC1 AC1

PB2 7SYNC/ASYNC ADC2 ADC2 ADC2 AC2 DAC0

PB3 8SYNC ADC3 ADC3 ADC3 AC3 AC3 DAC1

PB4 9SYNC ADC4 ADC4 ADC4 AC4 TMS

PB5 10 SYNC ADC5 ADC5 ADC5 AC5 AC5 TDI

PB6 11 SYNC ADC6 ADC6 ADC6 AC6 TCK

PB7 12 SYNC ADC7 ADC7 ADC7 AC7 AC0OUT TDO

PORT C PIN # INTERRUPT TCC0 AWEXC TCC1 USARTC0 USARTC1 SPIC TWIC CLOCKOUT EVENTOUT

GND 13

VCC 14

PC0 15 SYNC OC0A OC0ALS SDA

PC1 16 SYNC OC0B OC0AHS XCK0 SCL

PC2 17 SYNC/ASYNC OC0C OC0BLS RXD0

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

Table 30-4. Port D - Alternate functions.

Table 30-5. Port E - Alternate functions.

Table 30-6. Port F - Alternate functio n s.

PC3 18 SYNC OC0D OC0BHS TXD0

PC4 19 SYNC OC0CLS OC1A SS

PC5 20 SYNC OC0CHS OC1B XCK1 MOSI

PC6 21 SYNC OC0DLS RXD1 MISO

PC7 22 SYNC OC0DHS TXD1 SCK CLKOUT EVOUT

PORT D PIN # INTERRUPT TCD0 TCD1 USARTD0 USARTD1 SPID TWID CLOCKOUT EVENTOUT

GND 23

VCC 24

PD0 25 SYNC OC0A SDA

PD1 26 SYNC OC0B XCK0 SCL

PD2 27 SYNC/ASYNC OC0C RXD0

PD3 28 SYNC OC0D TXD0

PD4 29 SYNC OC1A SS

PD5 30 SYNC OC1B XCK1 MOSI

PD6 31 SYNC RXD1 MISO

PD7 32 SYNC TXD1 SCK CLKOUT EVOUT

PORT E PIN # INTERRUPT TCE0 AWEXE TCE1 USARTE0 USARTE1 SPIE TWIE CLOCKOUT EVENTOUT

GND 33

VCC 34

PE0 35 SYNC OC0A OC0ALS SDA

PE1 36 SYNC OC0B OC0AHS XCK0 SCL

PE2 37 SYNC/ASYNC OC0C OC0BLS RXD0

PE3 38 SYNC OC0D OC0BHS TXD0

PE4 39 SYNC OC0CLS OC1A SS

PE5 40 SYNC OC0CHS OC1B XCK1 MOSI

PE6 41 SYNC OC0DLS RXD1 MISO

PE7 42 SYNC OC0DHS TXD1 SCK CLKOUT EVOUT

PORT F PIN # INTERRUPT TCF0 TCF1 USARTF0 USARTF1 SPIF TWIF

GND 43

VCC 44

PF0 45 SYNC OC0A SDA

PORT C PIN # INTERRUPT TCC0 AWEXC TCC1 USARTC0 USARTC1 SPIC TWIC CLOCKOUT EVENTOUT

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

Table 30-7. Port H - Alternate functions.

Table 30-8. Port J - Alternate functions.

PF1 46 SYNC OC0B XCK0 SCL

PF2 47 SYNC/ASYNC OC0C RXD0

PF3 48 SYNC OC0D TXD0

PF4 49 SYNC OC1A SS

PF5 50 SYNC OC1B XCK1 MOSI

PF6 51 SYNC RXD1 MISO

PF7 52 SYNC TXD1 SCK

PORT H PIN # INTERRUPT SDRAM 3P SRAM ALE1 3P SRAM ALE12 3P LPC ALE1 3P LPC ALE1 2P LPC ALE12 2P

GND 53

VCC 54

PH0 55 SYNC WE WE WE WE WE WE

PH1 56 SYNC CAS RE RE RE RE RE

PH2 57 SYNC/ASYNC RAS ALE1 ALE1 ALE1 ALE1 ALE1

PH3 58 SYNC DQM ALE2 ALE2

PH4 59 SYNC BA0 CS0/A16 CS0 CS0/A16 CS0 CS0/A16

PH5 60 SYNC BA1 CS1/A17 CS1 CS1/A17 CS1 CS1/A17

PH6 61 SYNC CKE CS2/A18 CS2 CS2/A18 CS2 CS2/A18

PH7 62 SYNC CLK CS3/A19 CS3 CS3/A19 CS3 CS3/A19

PORT J PIN # INTERRUPT SDRAM 3P SRAM ALE1 3P SRAM ALE12 3P LPC ALE1 3P LPC ALE1 2P LPC ALE12 2P

GND 63

VCC 64

PJ0 65 SYNC D0 D0 D0 D0/A0 D0/A0 D0/A0/A8

PJ1 66 SYNC D1 D1 D1 D1/A1 D1/A1 D1/A1/A9

PJ2 67 SYNC/ASYNC D2 D2 D2 D2/A2 D2/A2 D2/A2/A10

PJ3 68 SYNC D3 D3 D3 D3/A3 D3/A3 D3/A3/A11

PJ4 69 SYNC A8 D4 D4 D4/A4 D4/A4 D4/A4/A12

PJ5 70 SYNC A9 D5 D5 D5/A5 D5/A5 D5/A5/A13

PJ6 71 SYNC A10 D6 D6 D6/A6 D6/A6 D6/A6/A14

PJ7 72 SYNC A11 D7 D7 D7/A7 D7/A7 D7/A7/A15

PORT F PIN # INTERRUPT TCF0 TCF1 USARTF0 USARTF1 SPIF TWIF

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

Table 30-9. Port K - Alterna te functions.

Table 30-10. Port Q - Alternate functions.

Table 30-11. Port R - Alternate functions.

PORT K PIN # INTERRUPT SDRAM 3P SRAM ALE1 3P SRAM ALE12 3P LPC ALE1 3P LPC ALE1 2P LPC ALE12 2P

GND 73

VCC 74

PK0 75 SYNC A0 A0/A8 A0/A8/A16 A8

PK1 76 SYNC A1 A1/A9 A1/A9/A17 A9

PK2 77 SYNC/ASYNC A2 A2/A10 A2/A10/A18 A10

PK3 78 SYNC A3 A3/A11 A3/A11/A19 A11

PK4 79 SYNC A4 A4/A12 A4/A12/A20 A12

PK5 80 SYNC A5 A5/A13 A5/A13/A21 A13

PK6 81 SYNC A6 A6/A14 A6/A14/A22 A14

PK7 82 SYNC A7 A7/A15 A7/A15/A23 A15

PORT Q PIN # INTERRUPT

VCC 83

GND 84

PQ0 85 SYNC TOSC1 (Input)

PQ1 86 SYNC TOSC2 (Output)

PQ2 87 SYNC/ASYNC

PQ3 88 SYNC

PORT R PIN # INTERRUPT PDI XTAL

PDI 89 PDI_DATA

RESET 90 PDI_CLOCK

PRO 91 SYNC XTAL2

PR1 92 SYNC XTAL1

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

31. Peripheral Module Address Map

The address maps show the base address for each peripheral and module in XMEGA A1. For complete register

description and summary for each peripheral module, refer to the XMEGA A Manual.

Table 31-1. Peripheral Module Address Map

Base Address Name Description

0x0000 GPIO General Purpose IO Registers

0x0010 VPORT0 Virtual Port 0

0x0014 VPORT1 Virtual Port 1

0x0018 VPORT2 Virtual Port 2

0x001C VPORT3 Virtual Port 3

0x0030 CPU CPU

0x0040 CLK Clock Control

0x0048 SLEEP Sleep Controller

0x0050 OSC Oscillator Control

0x0060 DFLLRC32M DFLL for the 32 MHz Internal RC Oscillator

0x0068 DFLLRC2M DFLL for the 2 MHz RC Oscillator

0x0070 PR Power Reduction

0x0078 RST Reset Controller

0x0080 WDT Watch-Dog Timer

0x0090 MCU MCU Control

0x00A0 PMIC Programmable Multilevel Interrupt Controller

0x00B0 PORTCFG Port Configuration

0x00C0 AES AES Module

0x0100 DMA DMA Controller

0x0180 EVSYS Event System

0x01C0 NVM Non Volatile Memory (NVM) Controller

0x0200 ADCA Analog to Digital Converter on port A

0x0240 ADCB Analog to Digital Converter on port B

0x0300 DACA Digital to Analog Converter on port A

0x0320 DACB Digital to Analog Converter on port B

0x0380 ACA Analo g Comparator pair on port A

0x0390 ACB Analo g Comparator pair on port B

0x0400 RTC Real Time Counter

0x0440 EBI External Bus Interface

0x0480 TWIC Two Wire Interface on port C

0x0490 TWID Two Wire Interface on port D

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

0x04A0 TWIE Two Wire Interface on port E

0x04B0 TWIF Two Wire Interface on port F

0x0600 PORTA Port A

0x0620 PORTB Port B

0x0640 PORTC Port C

0x0660 PORTD Port D

0x0680 PORTE Port E

0x06A0 PORTF Port F

0x06E0 PORTH Port H

0x0700 PORTJ Port J

0x0720 PORTK Port K

0x07C0 PORTQ Por t Q

0x07E0 PORTR Port R

0x0800 TCC0 Timer/Counter 0 on port C

0x0840 TCC1 Timer/Counter 1 on port C

0x0880 AWEXC Advanced Waveform Extension on port C

0x0890 HIRESC High Resolution Extension on port C

0x08A0 USARTC0 USART 0 on port C

0x08B0 USARTC1 USART 1 on port C

0x08C0 SPIC Se rial Peripheral Interface on port C

0x08F8 IRCOM Infrared Communication Module

0x0900 TCD0 Timer/Counter 0 on port D

0x0940 TCD1 Timer/Counter 1 on port D

0x0990 HIRESD High Resolution Extension on port D

0x09A0 USARTD0 USART 0 on port D

0x09B0 USARTD1 USART 1 on port D

0x09C0 SPID Se rial Peripheral Interface on port D

0x0A00 TCE0 Timer/Counter 0 on port E

0x0A40 TCE1 Timer/Counter 1 on port E

0x0A80 AWEXE Advanced W aveform Extension on port E

0x0A90 HIRESE High Resolution Extension on port E

0x0AA0 USARTE0 USART 0 on port E

0x0AB0 USARTE1 USART 1 on port E

0x0AC0 SPIE Serial Peripheral Interface on port E

0x0B00 TCF0 Timer/Counter 0 on port F

Base Address Name Description

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

0x0B40 TCF1 Timer/Counter 1 on port F

0x0B90 HIRESF High Resolution Extension on port F

0x0BA0 USARTF0 USART 0 on port F

0x0BB0 USARTF1 USART 1 on port F

0x0BC0 SPIF Serial Peripheral Interface on port F

Base Address Name Description

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

32. Instruction Set Summary

Mnemonics Operands Description Operation Flags #Clocks

Arithmetic and Logic Instructions

ADD Rd, Rr Add without Carry Rd Rd + Rr Z,C,N,V,S,H 1

ADC Rd, Rr Add with Carry Rd Rd + Rr + C Z,C,N,V,S,H 1

ADIW Rd, K Add Immediate to Word Rd Rd + 1:Rd + K Z,C,N,V,S 2

SUB Rd, Rr Subtract without Carry Rd Rd - Rr Z,C,N,V,S,H 1

SUBI Rd, K Sub tract Immediate Rd Rd - K Z,C,N,V,S,H 1

SBC Rd, Rr Subtract with Carry Rd Rd - Rr - C Z,C,N,V,S,H 1

SBCI Rd, K Subtract Immediate with Carry Rd Rd - K - C Z,C,N,V,S,H 1

SBIW Rd, K Subtract Immediate from Word Rd + 1:Rd Rd + 1:Rd - K Z,C,N,V,S 2

AND Rd, Rr Logical AND Rd Rd  Rr Z,N,V,S 1

ANDI Rd, K Logical AND with Immediate Rd Rd  K Z,N,V,S 1

OR Rd, Rr Logical OR Rd Rd v Rr Z,N,V,S 1

ORI Rd, K Logical OR with Immediate Rd Rd v K Z,N,V,S 1

EOR Rd, Rr Exclusive OR Rd Rd  Rr Z,N,V,S 1

COM Rd One’s Complement Rd $FF - Rd Z,C,N,V,S 1

NEG Rd Two’s Complement Rd $00 - Rd Z,C,N,V,S,H 1

SBR Rd,K Set Bit(s) in Register Rd Rd v K Z,N,V,S 1

CBR Rd,K Clear Bit(s) in Register Rd Rd  ($FFh - K) Z,N,V,S 1

INC Rd Increment Rd Rd + 1 Z,N,V,S 1

DEC Rd Decrement Rd Rd - 1 Z,N,V,S 1

TST Rd Test for Zero or Minus Rd Rd  Rd Z,N,V,S 1

CLR Rd Clear Register Rd Rd  Rd Z,N,V,S 1

SER Rd Set Register Rd $FF None 1

MUL Rd,Rr Multiply Unsigned R1:R0 Rd x Rr (U U) Z,C 2

MULS Rd,Rr Multiply Signed R1:R0 Rd x Rr (SS) Z,C 2

MULSU Rd,Rr Multiply Signed with Unsigned R1:R0 Rd x Rr (SU) Z,C 2

FMUL Rd,Rr Fractional Multiply Unsigned R1:R0 Rd x Rr< < 1 (U U) Z,C 2

FMULS Rd,Rr Fractional Multiply Signed R1:R0 Rd x Rr<< 1 (SS) Z,C 2

FMULSU Rd,Rr Fractional Multiply Signed with Unsigned R1:R0 Rd x Rr< < 1 (SU) Z,C 2

DES KData Encryption if (H = 0) then R15:R0

else if (H = 1) then R15:R0 



Encrypt(R15:R0, K)

Decrypt(R15:R0, K) 1/2

Branch Instructions

RJMP kRelative Jump PC PC + k + 1 None 2

IJMP Indirect Jump to (Z) PC(15:0)

PC(21:16) 



0None 2

EIJMP Extended Indirect Jump to (Z) PC(15:0)

PC(21:16) 



EIND None 2

JMP kJump PC kNone 3

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

RCALL kRelative Call Subroutine PC PC + k + 1 None 2 / 3(1)

ICALL Indirect Call to (Z) PC(15:0)

PC(21:16) 



0None 2 / 3(1)

EICALL Extended Indirect Call to (Z) PC(15:0)

PC(21:16) 



EIND None 3(1)

CALL kcall Subroutine PC kNone 3 / 4(1)

RET Subrou tine Return PC STACK None 4 / 5(1)

RETI Interrupt Return PC STACK I4 / 5(1)

CPSE Rd,Rr Compare, Skip if Equal if (Rd = Rr) PC PC + 2 or 3 None 1 / 2 / 3

CP Rd,Rr Compare Rd - Rr Z,C,N,V,S,H 1

CPC Rd,Rr Compare with Car ry Rd - Rr - C Z,C,N,V,S,H 1

CPI Rd,K Compare with Immediate Rd - K Z,C,N,V,S,H 1

SBRC Rr, b Skip if Bit in Register Cleared if (Rr(b) = 0) PC PC + 2 or 3 None 1 / 2 / 3

SBRS Rr, b Skip if Bit in Register Set if (Rr(b) = 1) PC PC + 2 or 3 None 1 / 2 / 3

SBIC A, b Skip if Bit in I/O Register Cleared if (I/O(A,b) = 0) PC PC + 2 or 3 None 2 / 3 / 4

SBIS A, b Skip if Bit in I/O Register Set If (I/O(A,b) =1) PC PC + 2 or 3 None 2 / 3 / 4

BRBS s, k Branch if Status Flag Set if (SREG(s) = 1) then PC PC + k + 1 None 1 / 2

BRBC s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PC PC + k + 1 None 1 / 2

BREQ k Branch if Equal if (Z = 1) then PC PC + k + 1 None 1 / 2

BRNE k Branch if Not Equal if (Z = 0) then PC PC + k + 1 None 1 / 2

BRCS k Branch if Carr y Set if (C = 1) then PC PC + k + 1 None 1 / 2

BRCC k Branch if Carr y Cleared if (C = 0) then PC PC + k + 1 None 1 / 2

BRSH k Branch if Same or Higher if (C = 0) then PC PC + k + 1 None 1 / 2

BRLO k Branch if Lower if (C = 1) then PC PC + k + 1 None 1 / 2

BRMI k Branch if Minus if (N = 1) then PC PC + k + 1 None 1 / 2

BRPL k Branch if Plus if (N = 0) then PC PC + k + 1 None 1 / 2

BRGE k Branch if Greater or Equal, Signed if (N  V= 0) then PC PC + k + 1 None 1 / 2

BRLT k Branch if Less Than, Signed if (N  V= 1) then PC PC + k + 1 None 1 / 2

BRHS k Branch if Half Carry Flag Set if (H = 1) then PC PC + k + 1 None 1 / 2

BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC PC + k + 1 None 1 / 2

BRTS k Branch if T Flag Set if (T = 1) then PC PC + k + 1 None 1 / 2

BRTC k Branch if T Flag Cleared if (T = 0) then PC PC + k + 1 None 1 / 2

BRVS k Branch if Overflow Flag is Set if (V = 1) then PC PC + k + 1 None 1 / 2

BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC PC + k + 1 None 1 / 2

BRIE k Branch if Interrupt Enabled if (I = 1) then PC PC + k + 1 None 1 / 2

BRID k Branch if Interrupt Disabled if (I = 0) then PC PC + k + 1 None 1 / 2

Data Transfer Instructions

MOV Rd, Rr Copy Register Rd Rr None 1

MOVW Rd, Rr Copy Register Pair Rd+1:Rd Rr+1:Rr None 1

Mnemonics Operands Description Operation Flags #Clocks

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

LDI Rd, K Load Immediate Rd KNone 1

LDS Rd, k Load Direct fr om data space Rd (k) None 2(1)(2)

LD Rd, X Load Indirect Rd (X) None 1(1)(2)

LD Rd, X+ Load Indirect and Post-Increment Rd

X



(X)

X + 1 None 1(1)(2)

LD Rd, -X Load Indirect and Pre-Decrement X  X - 1,

Rd  (X) 



X - 1

(X) None 2(1)(2)

LD Rd, Y Load Indirect Rd  (Y) (Y) None 1(1)(2)

LD Rd, Y+ Load Indirect and Post-Increment Rd

Y



(Y)

Y + 1 None 1(1)(2)

LD Rd, -Y Load Indirect and Pre-Decrement Y

Rd 



Y - 1

(Y) None 2(1)(2)

LDD Rd, Y+q Load Indirect with Displacement Rd (Y + q) None 2(1)(2)

LD Rd, Z Load Indirect Rd (Z) None 1(1)(2)

LD Rd, Z+ Load Indirect and Post-Increment Rd

Z



(Z),

Z+1 None 1(1)(2)

LD Rd, -Z Load Indirect and Pre-Decrement Z

Rd 



Z - 1,

(Z) None 2(1)(2)

LDD Rd, Z+q Load Indirect with Displacement Rd (Z + q) None 2(1)(2)

STS k, Rr Store Direct to Data Space (k) Rd None 2(1)

ST X, Rr Store Indirect (X) Rr None 1(1)

ST X+, Rr Store Indirect and Post-Increment (X)

X



Rr,

X + 1 None 1(1)

ST -X, Rr S tor e Indirect and Pre-Dec rement X

(X) 



X - 1,

Rr None 2(1)

ST Y, Rr Store Indirect (Y) Rr None 1(1)

ST Y+, Rr Store Indirect and Post-Increment (Y)

Y



Rr,

Y + 1 None 1(1)

ST -Y, Rr Store Indirect and Pre-Decrement Y

(Y) 



Y - 1,

Rr None 2(1)

STD Y+q, Rr Store Indirect with Displacement (Y + q) Rr None 2(1)

ST Z, Rr Store Indirect (Z) Rr None 1(1)

ST Z+, Rr S tor e Indirect and Post-Increment (Z)

Z



Z + 1 None 1(1)

ST -Z, Rr Store Indirect and Pre-Decrement ZZ - 1 None 2(1)

STD Z+q,Rr Store Indirect with Displacement (Z + q) Rr None 2(1)

LPM Load Program Memory R0 (Z) None 3

LPM Rd, Z Load Program Memory Rd (Z) None 3

LPM Rd, Z+ Load Program Memory and Post-Increment Rd

Z



(Z),

Z + 1 None 3

ELPM Extended Load Program Memory R0 (RAMPZ:Z) None 3

ELPM Rd, Z Extended Load Program Memory Rd (RAMPZ:Z) None 3

ELPM Rd, Z+ Extended Load Program Memory and Post-

Increment Rd

Z



(RAMPZ:Z),

Z + 1 None 3

SPM Store Program Memory (RAMPZ:Z) R1:R0 None -

Mnemonics Operands Description Operation Flags #Clocks

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

SPM Z+ S tor e Program Memory and Post-Incr ement

by 2 (RAMPZ:Z)

Z



R1:R0,

Z + 2 None -

IN Rd, A In From I/O Location Rd I/O(A) None 1

OUT A, Rr Out To I/O Location I/O(A) Rr None 1

PUSH Rr Push Register on Stack STACK Rr None 1(1)

POP Rd Pop Register from Stack Rd STACK None 2(1)

Bit and Bit-test Instructions

LSL Rd Logical Shift Left Rd(n+1)

Rd(0)



Rd(n),

Rd(7)

Z,C,N,V,H 1

LSR Rd Logical Shift Right Rd(n)

Rd(7)



Rd(n+1),

Rd(0)

Z,C,N,V 1

ROL Rd Rotate Left Through Carry Rd(0)

Rd(n+1)



Rd(n),

Rd(7)

Z,C,N,V,H 1

ROR Rd Rotate Right Through Carry Rd(7)

Rd(n)



Rd(n+1),

Rd(0)

Z,C,N,V 1

ASR Rd Arithmetic Shift Right Rd(n) Rd(n+1), n=0..6 Z,C,N,V 1

SWAP Rd Swap Nibbles Rd(3..0) Rd(7..4) None 1

BSET sFlag Set SREG(s) 1SREG(s) 1

BCLR sFlag Clear SREG(s) 0SREG(s) 1

SBI A, b Set Bit in I/O Register I/O(A, b) 1None 1

CBI A, b Clear Bit in I/O Register I/O(A, b) 0None 1

BST Rr, b Bit Store from Register to T TRr(b) T 1

BLD Rd, b Bit load from T to Register Rd(b) TNone 1

SEC Set Carry C1 C 1

CLC Clear Carry C0 C 1

SEN Set Negative Flag N1 N 1

CLN Clear Negative Flag N0 N 1

SEZ Set Zero Flag Z1 Z 1

CLZ Clear Zero Flag Z0 Z 1

SEI Global Interrupt Enable I1 I 1

CLI Global Interrupt Disable I0 I 1

SES Set Signed Test Flag S1 S 1

CLS Clear Signed Test Flag S0 S 1

SEV Set Two’s Complement Overflow V1 V 1

CLV Clear Two’s Complement Overflow V0 V 1

SET Set T in SREG T1 T 1

CLT Clear T in SREG T0 T 1

SEH Set Half Carry Flag in SREG H1 H 1

CLH Clear Half Carry Flag in SREG H0 H 1

Mnemonics Operands Description Operation Flags #Clocks

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

Notes: 1. Cycle times for Data memory accesses assume internal memory accesses, and are not valid for accesses via the external RAM interface.

2. One extra cycle must be added when accessing Internal SRAM.

MCU Control Instructions

BREAK Break (See specific descr. for BREAK) None 1

NOP No Operation None 1

SLEEP Sleep (see specific descr. for Sleep) None 1

WDR Watchdog Reset (see specific descr. for WDR) None 1

Mnemonics Operands Description Operation Flags #Clocks

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

33. Packaging information

33.1 100A

2325 Orchard Parkway

San Jose, CA 95131

TITLE DRAWING NO.

REV.

100A, 100-lead, 14 x 14 mm Body Size, 1.0 mm Body Thickness,

0.5 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) D

100A

2010-10-20

PIN 1 IDENTIFIER

0°~7°

PIN 1

A1 A2 A

eE1 E

A – – 1.20

A1 0.05 – 0.15

A2 0.95 1.00 1.05

D 15.75 16.00 16.25

D1 13.90 14.00 14.10 Note 2

E 15.75 16.00 16.25

E1 13.90 14.00 14.10 Note 2

B 0.17 – 0.27

C 0.09 – 0.20

L 0.45 – 0.75

e 0.50 TYP

Notes:

1. This package conforms to JEDEC reference MS-026, Variation AED.

2. Dimensions D1 and E1 do not include mold protrusion. Allowable

protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum

plastic body size dimensions including mold mismatch.

3. Lead coplanarity is 0.08 mm maximum.

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL MIN NOM MAX NOTE

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

33.2 100C1

2325 Orchard Parkway

San Jose, CA 95131

TITLE DRAWING NO.

REV.

100C1, 100-ball, 9 x 9 x 1.2 mm Body, Ball Pitch 0.80 mm

Chip Array BGA Package (CBGA)

100C1

5/25/06

TOP VIEW

SIDE VIEW

BOTTOM VIEW

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL MIN NOM MAX NOTE

A 1.10 – 1.20

A1 0.30 0.35 0.40

D 8.90 9.00 9.10

E 8.90 9.00 9.10

D1 7.10 7.20 7.30

E1 7.10 7.20 7.30

Øb 0.35 0.40 0.45

e 0.80 TYP

Marked A1 Identifier

678

0.90 TYP

A1 Corner

0.12 Z

Øb

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

33.3 100C2

TITLE DRAWING NO. GPC REV.

Package Drawing Contact:

packagedrawings@atmel.com 100C2CIF A

100C2, 100-ball (10 x 10 Array), 0.65 mm Pitch,

7.0 x 7.0 x 1.0 mm, Very Thin, Fine-Pitch

Ball Grid Array Package (VFBGA)

12/23/08

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL MIN NOM MAX NOTE

A – – 1.00

A1 0.20 – –

A2 0.65 – –

D 6.90 7.00 7.10

D1 5.85 BSC

E 6.90 7.00 7.10

E1 5.85 BSC

b 0.30 0.35 0.40

e 0.65 BSC

TOP VIEW

SIDE VIEW

A1 BALL ID

12 3 4 5 6 7 8 9 10

0.10

100 - Ø0.35 ± 0.05

A1 BALL CORNER

BOTTOM VIEW

b e

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

34. Electrical Characteristics

34.1 Absolute Maximum Ratings*

34.2 DC Characteristics

Table 34-1. Current consumption.

Operating Temperature . . . . . . . . . . .-55C to +125C*NOTICE: Stresses beyond those listed under “Absolute

Maximum Rati ngs” may cause permanent dam-

age to the device. This is a stress rating only

and functional operati on of the device at these

or other condi ti on s be yo n d th ose indicated in

the operational sections of this specification is

not implied. Exposure to absolute maximum rat-

ing conditions for extended periods may affect

device reliability.

Storage Temperature . . . . . . . . . . . . .-65C to +150°C

Voltage on any Pin with respect to Ground-0.5V to VCC+0.5V

Maximum Operating Voltage . . . . . . . . . . . . . . . . 3.6V

DC Current per I/O Pin. . . . . . . . . . . . . . . . . . 20.0 mA

DC Current VCC and GND Pins. . . . . . . . . . 200.0 mA

Symbol Parameter Condition Min Typ Max Units

ICC

Active mode(1)

1 MHz, Ext. Clk VCC = 1.8V 365

µA

VCC = 3.0V 790

2 MHz, Ext. Clk VCC = 1.8V 690 800

VCC = 3.0V 1400 1600

32 MHz, Ext. Clk VCC = 3.0V 18.35 20 mA

Idle mode(1)

1 MHz, Ext. Clk VCC = 1.8V 135

µA

VCC = 3.0V 255

2 MHz, Ext. Clk VCC = 1.8V 270 380

VCC = 3.0V 510 650

32 MHz, Ext. Clk VCC = 3.0V 8.15 9.2 mA

Power-down mode

All Functions Disabled VCC = 3.0V 0.1

µA

All Functions Disabled, T = 85°C VCC = 3.0V 2 5

ULP, WDT, Sampled BOD VCC = 1.8V 0.5

VCC = 3.0V 0.6

ULP, WDT, Sampled BOD, T=85°C VCC = 3.0V 310

Power-save mode RTC 1 kHz from Low Power 32 kHz VCC = 1.8V 0.52

µAVCC = 3.0V 0.55

RTC from Low Power 32 kHz VCC = 3.0V 1.16

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

Note: 1. All Power Reduction Registers set. Typical numbers measured at T = 25°C if nothing else is specified.

2. with no prescaling

Module current consumption(2)

ICC

RC32M 395

µA

RC32M w/DFLL Internal 32.768 kHz oscillator as DFLL source TBD

RC2M 120

RC2M w/DFLL Internal 32.768 kHz oscillator as DFLL source 155

RC32K 30

PLL Multiplication factor = 10x 195

Watchdog normal mode TBD

BOD Continuous mode 120

BOD Sampled mode 1

Internal 1.00 V ref 85

Temperature reference 80

RTC with int. 32 kHz RC as

source No prescaling 30

RTC with ULP as source No prescaling 1

ADC 250 kS/s - Int. 1V Ref 3.6

mADAC Normal Mode 1000 kS/s, Single channel, Int. 1V Ref 1.8

DAC Low-Power Mode 1000 KS/s, Single channel, Int. 1V Ref 1

AC High-speed 220

µA

AC Low-power 110

USART Rx and Tx enabled, 9600 BAUD 7.5

DMA 180

Timer/Counter Prescaler DIV1 18

AES 195

Flash/EEPROM

Programming Vcc = 2V 20 mA

Vcc = 3V 30

Symbol Parameter Condition Min Typ Max Units

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

34.3 Speed

Table 34-2. Operating voltage and frequency.

The maximum CPU clock frequency of the XMEGA A1 devices is depending on VCC. As shown in Figure 34-1 on page

75 the Frequency vs. VCC curve is linear between 1.8V < VCC <2.7V.

Figure 34-1. Maximum Frequency vs. Vcc

Symbol Parameter Condition Min Typ Max Units

ClkCPU CPU clock frequency

VCC = 1.6V 012

MHz

VCC = 1.8V 012

VCC = 2.7V 032

VCC = 3.6V 032

1.8

MHz

2.7 3.6

1.6

Safe Operating Area

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

34.4 Flash and EEPROM Memory Characteristics

Table 34-3. Endurance and data retention.

Table 34-4. Programming time.

Notes: 1. Programming is timed from the internal 2 MHz oscillator.

2. EEPROM is not erased if the EESAVE fuse is programmed.

34.5 ADC Characteristics

Table 34-5. ADC characteristics

Symbol Parameter Condition Min Typ Max Units

Flash

Write/Erase cycles 25°C 10K Cycle

85°C 10K

Data retention 25°C 100 Year

55°C 25

EEPROM

Write/Erase cycles 25°C 80K Cycle

85°C 30K

Data retention 25°C 100 Year

55°C 25

Symbol Parameter Condition Min Typ(1) Max Units

Chip Erase Flash, EEPROM(2) and SRAM Erase 40

Flash

Page Erase 4

Page Write 6

Page WriteAutomatic Page Erase and Write 12

EEPROM

Page Erase 4

Page Write 6

Page Write Automatic Page Erase and Write 12

Symbol Parameter Condition Min Typ Max Units

RES Resolution Programmable: 8/12 812 12 Bits

INL Integral Non-Linearity 500 kS/s -5 <±1 5LSB

DNL Differential Non-Linearity 500 kS/s < ±0.75 LSB

Gain Error ±10 mV

Offset Error ±2 mV

ADCclk ADC Clock frequency Max is 1/4 of

Peripheral Clock VCC2.0V 2000 kHz

VCC<2.0V 500

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

Table 34-6. ADC gain stage characteristics.

Conversion rate VCC2.0V 2000 ksps

VCC<2.0V 500

Conversion time

(propagation delay) (RES+2)/2+GAIN

RES = 8 or 12, GAIN = 0 or 1 5 7 8 ADCclk

cycles

Sampling Time 1/2 ADCclk cycle 0.25 µS

Conversion range 0VREF V

AVCC Analog Supply Voltage Vcc-0.3 Vcc+0.3 V

VREF Reference voltage 1.0 Vcc-0.6 V

Input bandwidth VCC2.0V 2000 kHz

VCC<2.0V 500

INT1V Internal 1.00V reference 1.00 V

INTVCC Internal VCC/1.6 VCC/1.6 V

SCALEDVCC Scaled internal VCC/10 input VCC/10 V

RAREF Reference input resistance >10 M

Start-up time 12 24 ADCclk

cycles

Internal input sampling speed Temp. sensor, VCC/10, Bandgap 100 ksps

Symbol Parameter Condition Min Typ Max Units

Gain error 1 to 64 gain < ±1 %

Offset error < ±1 mV

Vrms Noise level at input 64x gain VREF = Int. 1V 0.12 mV

VREF = Ext. 2V 0.06

Clock rate Same as ADC 1000 kHz

Symbol Parameter Condition Min Typ Max Units

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

34.6 DAC Characteristics

Table 34-7. DAC characteristics.

34.7 Analog Comparator Characteristics

Table 34-8. Analog Comp arator characteristics.

34.8 Bandgap Characteristics

Table 34-9. Bandgap voltage characteristics.

Symbol Parameter Condition Min Typ Max Units

INL Integral Non-Linearity VCC = 1.6-3.6V VREF = Ext. ref 5LSB

DNL Differential Non-Linearity VCC = 1.6-3.6V VREF = Ext. ref 0.6 <±1 LSB

VREF= AVCC 0.6

Fclk Conversion rate 1000 ksps

AREF External reference voltage 1.1 AVCC-0.6 V

Reference input impedance >10 M

Max output voltage Rload=100kAVCC*0.98 V

Min output voltage Rload=100k0.01 V

Symbol Parameter Condition Min Typ Max Units

Voff Input Offset Voltage VCC = 1.6 - 3.6V <±5 mV

Ilk Input Leakage Current VCC = 1.6 - 3.6V < 1000 pA

Vhys1 Hysteresis, No VCC = 1.6 - 3.6V 0mV

Vhys2 Hysteresis, Small VCC = 1.6 - 3.6V mode = HS 25 mV

Vhys3 Hysteresis, Large VCC = 1.6 - 3.6V mode = HS 50 mV

tdelay Propagation delay

VCC = 3.0V, T= 85°C mode = HS 100

nsVCC = 1.6 - 3.6V mode = HS 70

VCC = 1.6 - 3.6V mode = LP 140

Symbol Parameter Condition Min Typ Max Units

Bandgap startup time As reference for ADC or DAC 1 Clk_PER + 2.5µs µs

Bandgap voltage 1.1 V

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

34.9 Brownout Detection Characteristics

Table 34-10. Brownout Detection characteristics.

Note: 1. BOD is calibrated to BOD level 0 at 85°C, and BOD level 0 is the default level.

34.10 PA D Characteristics

Table 34-11. PAD charac teristics.

ADC/DAC ref T= 85°C, After calibration 0.99 1.01 V

Variation over voltage and temperature VCC = 1.6 - 3.6V, T = -40C to 85C±5 %

Symbol Parameter Condition Min Typ Max Units

BOD level 0 falling Vcc 1.6

BOD level 1 falling Vcc 1.9

BOD level 2 falling Vcc 2.1

BOD level 3 falling Vcc 2.4

BOD level 4 falling Vcc 2.6

BOD level 5 falling Vcc 2.9

BOD level 6 falling Vcc 3.2

BOD level 7 falling Vcc 3.4

Hysteresis BOD level 0-5 2 %

Symbol Parameter Condition Min Typ Max Units

VIH Input High Vol tage VCC = 2.4 - 3.6V 0.7*VCC VCC+0.5 V

VCC = 1.6 - 2.4V 0.8*VCC VCC+0.5

VIL Input Low Voltage VCC = 2.4 - 3.6V -0.5 0.3*VCC V

VCC = 1.6 - 2.4V -0.5 0.2*VCC

VOL Output Low Voltage GPIO

IOL = 15 mA, VCC = 3.3V 0.45 0.76

VIOL = 10 mA, VCC = 3.0V 0.3 0.64

IOL= 5 mA, VCC = 1.8V 0.2 0.46

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

34.11 POR Characteristics

Table 34-12. Power-on Reset characteristics.

34.12 Reset Characteristics

Table 34-13. Reset characteristics.

34.13 Oscillator Characteristics

Table 34-14. Internal 32.768kHz oscillator characteristics.

VOH Output High Voltage GPIO

IOH = -8 mA, VCC = 3.3V 2.6 3

VIOH = -6 mA, VCC = 3.0V 2.1 2.2

IOH = -2 mA, VCC = 1.8V 1.4 1.6

IIL Input Leakage Current I/O pin <0.001 1µA

IIH Input Leakage Current I/O pin <0.001 1µA

RPI/O pin Pull/Buss keeper Resistor 20 k

RRST Reset pin Pull-up Resistor 20 k

Input hysteresis 0.5 V

Symbol Parameter Condition Min Typ Max Units

VPOT- POR threshold voltage falling Vcc 1 V

VPOT+ POR threshold voltage rising Vcc 1.4 V

Symbol Parameter Condition Min Typ Max Units

Minimum reset pulse width 90 ns

Reset threshold voltage VCC = 2.7 - 3.6V 0.45*VCC V

VCC = 1.6 - 2.7V 0.42*VCC

Symbol Parameter Condition Min Typ Max Units

Accuracy T = 85C, VCC = 3V,

After production calibration -0.5 0.5 %

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8067O–AVR–06/2013

Table 34-15. Internal 2MHz oscillator characteristics.

Table 34-16. Internal 32MHz oscillator characteristics.

Table 34-17. Internal 32kHz, ULP oscillator characteristics.

Table 34-18. Maximum load capacitance (CL) and ESR recommendation fo r 32.768kHz crystal.

Table 34-19. Device wake-up time from sleep.

Notes: 1. Non-prescaled System Clock source.

2. Time from pin change on external interrupt pin to first available clock cycle. Additional interrupt response ti me is minimum 5 system clock source cycles.

Symbol Parameter Condition Min Typ Max Units

Accuracy T = 85C, VCC = 3V,

After production calibration -1.5 1.5 %

DFLL Calibration step size T = 25C, VCC = 3V 0.175 %

Symbol Parameter Condition Min Typ Max Units

Accuracy T = 85C, VCC = 3V,

After production calibration -1.5 1.5 %

DFLL Calibration stepsize T = 25C, VCC = 3V 0.2 %

Symbol Parameter Condition Min Typ Max Units

Output frequency 32 kHz ULP OSC T = 85C, VCC = 3.0V 26 kHz

Crystal CL [pF] Max ESR [k]

6.5 60

935

Symbol Parameter Condition(1) Min Typ(2) Max Units

Idle Sleep, Standby and Extended

Standby sleep mo de

Int. 32.768 kHz RC 130

µS

Int. 2 MHz RC 2

Ext. 2 MHz Clock 2

Int. 32 MHz RC 0.17

Power-save and Power-down

Sleep mode

Int. 32.768 kHz RC 320

Int. 2 MHz RC 10.3

Ext. 2 MHz Clock 4.5

Int. 32 MHz RC 5.8

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

35. Typical Characteristics

35.1 Active Supply Current

Figure 35-1. Active Supply Current vs. Frequency

fSYS = 1 - 32 MHz, T = 25°C

Figure 35-2. Active Supply Current vs. VCC

fSYS = 1.0 MHz

3.3V

3.0V

2.7V

0 4 8 12 16 20 24 28 32

Frequency [MHz]

[mA]

1.8V

2.2V

85°C

25°C

-40°C

200

400

600

800

1000

1200

1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6

Vcc [V]

[uA]

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8067O–AVR–06/2013

35.2 Idle Supply Current

Figure 35-3. Idle Supply Current vs. Frequency

fSYS = 1 - 32 MHz, T = 25°C

Figure 35-4. Active Supply Current vs. VCC

fSYS = 1.0 MHz

3.3V

3.0V

2.7V

0 4 8 12 16 20 24 28 32

Frequency [MHz]

Icc [mA]

1.8V

2.2V

85°C

25°C

-40°C

100

150

200

250

300

350

400

1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6

[V]

[uA]

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

35.3 Power-down Supply Current

Figure 35-5. Power-down Supply Current vs. Temperature

35.4 Power-save Supply Current

Figure 35-6. Power-save Supply Current vs. Temperature

Sampled BOD, WDT, RTC from ULP enabled

3.3V

3.0V

2.7V

2.2V

1.8V

0.5

1.5

2.5

-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90

Temperature [°C]

[uA]

3.3V

2.7V

2.2V

1.8V

0.5

1.5

2.5

3.5

-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90

Temperature [°C]

[uA]

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

35.5 Pin Pull-up

Figure 35-7. I/O Reset Pull-up Resistor Current vs. Reset Pin Voltage

VCC = 1.8V

Figure 35-8. I/O Reset Pull-up Resistor Current vs. Reset Pin Voltage

VCC = 3.0V

85 °C 25 °C

-40 °C

100

0 0.2 0.4 0.6 0.8 1 1.2 1.4

reset

[V]

reset

[uA]

85 °C

25 °C

-40 °C

100

120

140

160

180

0 0.5 1 1.5 2 2.5

vreset [V]

Ireset [uA]

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8067O–AVR–06/2013

Figure 35-9. I/O Reset Pull-up Resistor Current vs. Reset Pin Voltage

VCC = 3.3V

35.6 Pin Thresholds and Hysteresis

Figure 35-10.I/O Pin Input Threshold Voltage vs. VCC

VIH - I/O Pin Read as “1”

85 °C

25 °C

-40 °C

100

120

140

160

180

00.511.522.53

reset

[V]

reset

[uA]

85 °C

25 °C

-40 °C

0.5

1.5

2.5

1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6

[V]

threshold

[V]

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

Figure 35-11.I/O Pin Inpu t Threshold Voltage vs. VCC

VIL - I/O Pin Read as “0”

Figure 35-12.I/O Pin Input Hysteresis vs. V CC.

85 °C

25 °C

-40 °C

0.2

0.4

0.6

0.8

1.2

1.4

1.6

1.8

1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6

cc [V]

Vthreshold [V]

85 °C

25 °C

-40 °C

0.2

0.4

0.6

0.8

1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6

Vcc [V]

threshold

[V]

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

Figure 35-13.Reset Input Threshold Voltag e vs. VCC

VIH - I/O Pin Read as “1”

Figure 35-14.Reset Input Threshold Voltag e vs. VCC

VIL - I/O Pin Read as “0”

85 °C

25 °C

-40 °C

0.2

0.4

0.6

0.8

1.2

1.4

1.6

1.8

1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6

[V]

threshold

[V]

85 °C

25 °C

-40 °C

0.2

0.4

0.6

0.8

1.2

1.4

1.6

1.8

1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6

[V]

threshold

[V]

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

35.7 Bod Thresholds

Figure 35-15.BOD Thresholds vs. Temperature

BOD Level = 1.6V

Figure 35-16.BOD Thresholds vs. Temperature

BOD Level = 2.9V

Rising Vcc

Falling Vcc

1.602

1.608

1.614

1.62

1.626

1.632

1.638

-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90

Temperature [°C]

BOT

[V]

Rising Vcc

Falling Vcc

2.905

2.92

2.935

2.95

2.965

2.98

2.995

3.01

-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90

Temperature [°C]

BOT

[V]

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

35.8 Bandgap

Figure 35-17.Internal 1.00V Refer ence vs. Temperature.

35.9 Analog Comparator

Figure 35-18.Analog Comparator Hysteresis vs. VCC

High-speed, Small hysteresis

3.0V

1.8V

0.999

0.9995

1.0005

1.001

1.0015

1.002

1.0025

1.003

1.0035

1.004

-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90

Temperature [°C]

REF

[V]

25°C

1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6

[V]

Hysteresis [mV]

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8067O–AVR–06/2013

Figure 35-19.Analog Comparator Hysteresis vs. VCC, High-speed

Large hysteresis

Figure 35-20.Analog Comparator Propagation Delay vs. VCC

High-speed

25°C

1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6

Vcc [V]

Hysteresis [mV]

25°C

100

120

1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6

[V]

Propagation Delay [ns]

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8067O–AVR–06/2013

35.10 Oscillators and Wake-up Time

Figure 35-21.Internal 32.768 kHz Oscillator Frequency vs. Temperature

1.024 kHz output

Figure 35-22.Ultra Low-Power (ULP) Oscillator Frequency vs. Temperature

1 kHz output

3.0 V

1.8 V

0.99

0.995

1.005

1.01

1.015

1.02

1.025

1.03

-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90

T [°C]

f [kHz]

3.0 V

1.8 V

0.87

0.88

0.89

0.9

0.91

0.92

0.93

-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90

T [°C]

f1kHz output [kHz]

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

Figure 35-23.Internal 2 MHz Oscillator CalA Calibration Step Size

T = -40 to 85



C, VCC = 3V

Figure 35-24.Internal 2 MHz Oscillator CalB Calibration Step Size

T = -40 to 85



C, VCC = 3V

0.001

0.002

0.003

0.004

0.005

0.006

020406080100120140

CALA [LSB]

Step size: f [MHz]

0.005

0.01

0.015

0.02

0.025

0.03

0.035

0.04

0 10203040506070

CALB [LSB]

Step size: f [MHz]

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8067O–AVR–06/2013

Figure 35-25.Internal 32 MHz Oscillator CalA Calibration Step Size

T = -40 to 85



C, VCC = 3V

Figure 35-26.Internal 32 MHz Oscillator CalB Calibration Step Size

T = -40 to 85



C, VCC = 3V

0.01

0.02

0.03

0.04

0.05

0.06

0.07

0.08

0.09

0 20 40 60 80 100 120 140

CALA

Step size: f [MHz]

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0 10203040506070

CALB

Step size: f [MHz]

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

35.11 PDI Speed

Figure 35-27.PDI Speed vs. VCC

25 °C

1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6

VCC [V]

fMAX [MHz]

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

36. Errata

36.1 ATxmega64A1and ATxmega128A1 rev. H

Bandgap voltage input for the ACs can not be changed when used for both ACs simultaneously

VCC voltage scaler for AC is non-linear

The ADC has up to ±2 LSB inaccuracy

ADC gain stage output range is limited to 2.4 V

Sampling speed limited to 500 ksps for supply voltage below 2.0V

ADC Event on compare match non-functional

Bandgap measurement with the ADC is non-functional when VCC is below 2.7V

Accuracy lost on first three samples after switching input to ADC gain stage

The input difference between two succeeding ADC samples is limited by VREF

Increased noise when using internal 1.0V reference at low temperature

Configuration of PGM and CWCM not as described in XMEGA A Manual

PWM is not restarted properly after a fault in cycle-by-cycle mode

BOD will be enabled at any reset

BODACT fuse location is not correct

Sampled BOD in Active mode will cause noise when bandgap is used as reference

DAC has up to ±10 LSB noise in Sampled Mode

DAC is nonlinear and inaccurate when reference is above 2.4V or VCC - 0.6V

DAC refresh may be blocked in S/H mode

Conversion lost on DAC channel B in event triggered mode

Both DFLLs and both oscillators have to be enabled for one to work

Access error when multiple bus masters are accessing SDRAM

EEPROM page buffer always written when NVM DATA0 is written

Pending full asynchronous pin change interrupts will not wake the device

Pin configuration does not affect Analog Comparator Output

Low level interrupt triggered when pin input is disabled

JTAG enable does not override Analog Comparator B output

NMI Flag for Crystal Oscillator Failure automatically cleared

Flash Power Reduction Mode can not be enabled when entering sleep

Some NVM Commands are non-functional

Crystal start-up time required after power-save even if crystal is source for RTC

Setting PRHIRES bit makes PWM output unavailable

Accessing EBI address space with PREBI set will lock Bus Master

RTC Counter value not correctly read after sleep

Pending asynchronous RTC-interrupts will not wake up device

TWI, the minimum I2C SCL low time could be violated in Master Read mode

TWI address-mask feature is non-functional

TWI, a general address call will match independent of the R/W-bit value

TWI Transmit collision flag not cleared on repeated start

Clearing TWI Stop Interrupt Flag may lock the bus

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8067O–AVR–06/2013

TWI START condition at bus timeout will cause transaction to be dropped

TWI Data Interrupt Flag erroneously read as set

WDR instruction inside closed window will not issue reset

1. Bandgap voltage input for the ACs cannot be changed when used for both ACs simultaneously

If the Bandgap voltage is selected as input for one Analog Comparator (AC) and then selected/deselected as input

for another AC, the first comparator will be affected for up to 1 µs and could potentially give a wrong comparison

result.

Problem fix/Workaround

If the Bandgap is required for both ACs simultaneously, configure the input selection for both ACs before enabling

any of them.

2. VCC voltage scaler for AC is non-linear

The 6-bit VCC voltage scaler in the Analog Comparators is non-linear.

Figure 36-1. Analog Compara tor Voltage Scaler vs. Scalefac

T = 25°C

Problem fix/Workaround

Use external voltage input for the analog comparator if accurate voltage levels are needed

3. The ADC has up to ±2 LSB inaccuracy

The ADC will have up to ±2 LSB ina ccuracy, visible as a saw-tooth pattern on the input voltage/ output value trans-

fer function of the ADC. The inaccuracy increases with increasing voltage reference reaching ±2 LSB with 3V

reference.

3.3 V

2.7 V

1.8 V

0.5

1.5

2.5

3.5

0 5 10 15 20 25 30 35 40 45 50 55 60 65

SCALEFAC

VSCALE [V]

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8067O–AVR–06/2013

Problem fix/Workaround

None, the actual ADC resolution will be reduced with up to ±2 LSB.

4. ADC gain stage output range is limited to 2.4 V

The amplified output of the ADC gain stage will never go above 2.4 V, hence the differential input will only give cor-

rect output when below 2.4 V/gain. For the available gain settings, this gives a differential input range of:

Problem fix/Workaround

Keep the amplified voltage output from the ADC gain stage below 2.4 V in order to get a correct result, or keep

ADC voltage reference below 2.4 V.

5. Sampling speed limited to 500 ksps for supply voltage below 2.0V

The sampling frequency is limited to 500 ksps for supply voltage below 2.0V. At higher sampling rate the INL error

will be several hundred LSB.

Problem fix/Workaround

None.

6. ADC Event on compare match non-functional

ADC signalling event will be given at every conversion complete even if Interrupt mode (INTMODE) is set to

BELOW or ABOVE.

Problem fix/Workaround

Enable and use interrupt on compare match when using the compare function.

7. Bandgap measurement with the ADC is non-functional when VCC is below 2.7V

The ADC can not be used to do bandgap measurements when VCC is below 2.7V.

Problem fix/Workaround

– 1x gain: 2.4 V

– 2x gain: 1.2 V

– 4x gain: 0.6 V

– 8x gain: 300 mV

– 16x gain: 150 mV

– 32x gain: 75 mV

– 64x gain: 38 mV

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8067O–AVR–06/2013

None.

8. Accuracy lost on first three samples after switching input to ADC gain stage

Due to memory effect in the ADC gain stage, the first three samples after changing input channel must be disre-

garded to achieve 12-bit accuracy.

Problem fix/Workaround

Run three ADC conversions and discard these results after changing input channels to ADC gain stage.

9. The input difference between two succeeding ADC samples is limited by VREF

If the difference in input between two samples changes more than the size of the reference, the ADC will not be

able to convert the data correctly. Two conversions will be required before the conversion is correct.

Problem fix/Workaround

Discard the first conversion if input is changed more than VREF, or ensure that the input never changes more then

VREF.

10. Increased noise when using internal 1.0V reference at low temperature

When operating at below 0C and using internal 1.0V reference the RMS noise will be up 4 LSB, Peak-to-peak

noise up to 25 LSB.

Problem fix/Workaround

Use averaging to remove noise.

11. Configuration of PGM and CWCM not as described in XMEGA A Manual

Enabling Common Waveform Channel Mode will enable Pattern generation mode (PGM), but not Common Wave-

form Channel Mode.

Enabling Pattern Generation Mode (PGM) and not Common Waveform Channel Mode (CWCM) will enable both

Pattern Generation Mode and Common Waveform Channel Mode.

Problem fix/Workaround

12 PWM is not restarted pro perly after a fault in cycle-by-cycle mode

When the AWeX fault restore mode is set to cycle -by-cycle, the waveform output will not return to normal operation

at first update after fault condition is no longer present.

PGM CWCM Description

0 0 PGM and CWCM disabled

0 1 PGM enabled

1 0 PGM and CWCM enabled

1 1 PGM enabled

100

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8067O–AVR–06/2013

Problem fix/Workaround

Do a write to any AWeX I/O register to re-enable the output.

13. BOD will be enabled after any reset

If any reset source goes active, the BOD will be enabled and keep the device in reset if the VCC voltage is below

the programmed BOD level. During Power-On Reset, reset will not be released until VCC is above the pro-

grammed BOD level even if the BOD is disabled.

Problem fix/Workaround

Do not set the BOD level higher than VCC even if the BOD is not used.

14. BODACT fuse location is not correct

The fuses for enabling BOD in active mode (BODACT) are located at FUSEBYTE2, bit 2 and 3 and not in FUSE-

BYTE 5 as described in the XMEGA A Manual.

Problem fix/Workaround

Access the fuses in FUSEBYTE2.

15. Sampled BOD in Active mode will cause noise when bandgap is used as reference

Using the BOD in sampled mode when the device is running in Active or Idle mode will add noise on the bandgap

reference for ADC, DAC and Analog Comparator.

Problem fix/Workaround

If the bandgap is used as reference for either the ADC, DAC or Analog Comparator, the BOD must not be set in

sampled mode.

16. DAC has up to ±10 LSB noise in Sampled Mode

The DAC has noise of up to ±10 LSB in Sampled Mode for entire operation range.

Problem fix/Workaround

Use the DAC in continuous mode.

17. DAC is nonlinear and inaccurate when reference is above 2.4V or VCC - 0.6V

Using the DAC with a reference voltage above 2.4V or VCC - 0.6V will give inaccurate output when converting

codes that give below 0.75V output:

±10 LSB for continuous mode

±200 LSB for Sample and Hold mode

Problem fix/Workaround

None.

101

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8067O–AVR–06/2013

18. DAC has up to ±10 LSB noise in Sampled Mode

If the DAC is running in Sample and Hold (S/H) mode and conversion for one channel is done at maximum rate

(i.e. the DAC is always busy doing conversion for this channel), this will block refresh signals to the second chan-

nel.

Problem fix/Workaround

When using the DAC in S/H mode, ensure that none of the channels is running at maximum conversion rate, or

ensure that the conversion rate of both channels is high enough to not require refresh.

19. Conversion lost on DAC channel B in event triggered mode

If during dual channel operation channel 1 is set in auto trigged conversion mode, channel 1 conversions are occa-

sionally lost. This means that not all data-values written to the Channel 1 data register are converted.

Problem fix/Workaround

Keep the DAC conversion interval in the range 000-001 (1 and 3 CLK), and limit the Peripheral clock frequency so

the conversion internal never is shorter than 1.5 µs.

20. Both DFLLs and both oscillators have to be enabled for one to work

In order to use the automatic runtime calibration for the 2 MHz or the 32 MHz internal oscillators, the DFLL for both

oscillators and both oscillators have to be enabled for one to work.

Problem fix/Workaround

Enable both DFLLs and both oscillators when using automatic runtime calibration for either of the internal

oscillators.

21. Access error when multiple bus masters are accessing SDRAM

If one bus master (CPU and DMA channels) is using the EBI to access an SDRAM in burst mode and another bus

master is accessing the same row number in a different BANK of the SDRAM in the cycle directly after the burst

access is complete, the access for the second bus master will fail.

Problem fix/Workaround

Do not put stack pointer in SDRAM and use DMA Controller in 1 byte burst mode if CPU and DMA Controller are

required to access SDRAM at the same time.

22. EEPROM page buffer always written when NVM DATA0 is written

If the EEPROM is memory mapped, writing to NVM DATA0 will corrupt data in the EEPROM page buffer.

Problem fix/Workaround

Before writing to NVM DATA0, for example when doing software CRC or flash page buffer write, check if EEPROM

page buffer active loading flag (EELOAD) is set. Do not write NVM DATA0 when EELOAD is set.

23. Pending full asynchronous pin change interrupts will not wake the device

102

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Any full asynchronous pin-change Interrupt from pin 2, on any port, that is pending when the sleep instruction is

executed, will be ignored until the device is woken from another source or the source triggers again. This applies

when entering all sleep modes where the System Clock is stopped.

Problem fix/Workaround

None.

24. Pin configuration does not affect Analog Comparator Output

The Output/Pull and inverted pin configuration does not affect the Analog Comparator output function.

Problem fix/Workaround

None for Output/Pull configuration.

For inverted I/O, configure the Analog Comparator to give an inverted result (i.e. connect positive input to the neg-

ative AC input and vice versa), or use and external inverter to change polarity of Analog Comparator output.

25. Low level interrupt triggered when pin input is disabled

If a pin input is disabled, but pin is configured to trigger on low level, interrupt request will be sent.

Problem fix/Workaround

Ensure that Interrupt mask for the disabled pin is cleared.

26. JTAG enable does not override Analog Comparator B output

When JTAG is enabled this will not override the Analog Comparator B (ACB) output, AC0OUT on pin 7 if this is

enabled.

Problem fix/Workaround

Use Analog Comparator output for ACA when JTAG is used, or use the PDI as debug interface.

27. NMI Flag for Crystal Oscillator Failure automatically cleared

NMI flag for Crystal Oscillator Failure (XOSCFDIF) will be automatically cleared when executing the NMI interrupt

handler.

Problem fix/Workaround

This device revision has only one NMI interrupt source, so checking the interrupt source in software is not

required.

28. Flash Power Reduction Mode can not be enabled when entering sleep

If Flash Power Reduction Mode is enabled when entering Power-save or Extended Standby sleep mode, the

device will only wake up on every fourth wake-up request. If Flash Power Reduction Mode is enabled when enter-

ing Idle sleep mode, the wake-up time will vary with up to 16 CPU clock cycles.

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Problem fix/Workaround

Disable Flash Power Reduction mode before entering sleep mode.

29. Some NVM Commands are non-functional

The following NVM commands are non-functional:

Problem fix/Workaround

None for Flash Range CRC

Use separate programming commands for accessing application and boot section.

30. Crystal start-up time required after power-save even if crystal is source for RTC

Even if 32.768 kHz crystal is used for RTC during sleep, the clock from the crystal will not be rea dy for the system

before the specified start-up time. See "XOSCSEL[3:0]: Crystal Oscillator Selection" in XMEGA A Manual. If BOD

is used in active mode, the BOD will be on during this period (0.5s).

Problem fix/Workaround

If faster start-up is required, go to sleep with internal oscillator as system clock.

31. Setting PRHIRES bit makes PWM output unavailable

Setting the HIRES Power Reduction (PR) bit for PORTx will make any Frequency or PWM output for the corre-

sponding Timer/Counters (TCx0 and TCx1) unavailable on the pin even if the Hi-Res is not used.

Problem fix/Workaround

Do not write the HIRES PR bit on PORTx when frequency or PWM output from TCx0/1 is used.

– 0x2B Erase Flash Page

– 0x2E Write Flash Page

– 0x2F Erase & Write Fl a sh Pa ge

– 0x3A Flash Range CRC

– 0x22 E rase Application Section Page

– 0x24 Write Application Section Page

– 0x25 E rase & Write Application Section Page

– 0x2A Erase Boot Loade r Section Page

– 0x2C Write Boot Loader Section Page

– 0x2D Erase & Write Boot Loader Section Page

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32. Accessing EBI address space with PREBI set will lock Bus Master

If EBI Power Reduction Bit is set while EBI is enabled, accessing external memory could result in bus hang-up,

blocking all further access to all data memory.

Problem fix/Workaround

Ensure that EBI is disabled before setting EBI Power Reduction bit.

33. RTC Counter value not correctly read after sleep

If the RTC is set to wake up the device on RTC Overflow and bit 0 of RTC CNT is identical to bit 0 of RTC PER as

the device is entering sleep, the value in the RTC count register can not be read correctly within the first prescaled

RTC clock cycle after wakeup. The value read will be the same as the value in the register when entering sleep.

The same applies if RTC Compare Match is used as wake-up source.

Problem fix/Workaround

Wait at least one prescaled RTC clock cycle before reading the RTC CNT value.

34. Pending asynchronous RTC-interrupts will not wake up device

Asynchronous Interrupts from the Real-Time-Counter that is pending when the sleep instruction is executed, will

be ignored until the device is woken from another source or the source triggers again.

Problem fix/Workaround

None.

35. TWI, the minimum I2C SCL low time could be violated in Master Read mode

If the TWI is in Master Read mode and issues a Repeated Start on the bus, this will immediately release the SCL

line even if one complete SCL low period has not passed. This means that the minimum SCL low time in the I2C

specification could be violated.

Problem fix/Workaround

If this is a problem in the application, ensure in software that the Repeated Start is never issued before one SCL

low time has passed.

36. TWI address-mask feature is non-funct ional

The address-mask feature is non-functional, so the TWI can not perform hardware address match on more than

one address.

Problem fix/Workaround

If the TWI must respond to multiple addresses, enable Promiscuous Mode for the TWI to respond to all address

and implement the address-mask function in software.

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37. TWI, a general address call will match independent of the R/W-bit value

When the TWI is in Slave mode and a general address call is issued on the bus, the TWI Slave will get an address

match regardless of the received R/W bit.

Problem fix/Workaround

Use software to check the R/W-bit on general call address match.

38. TWI Transmit collision flag not cleared on repeated start

The TWI transmit collision flag should be automatically cleared on start and repeated start, but is only cleared on

start.

Problem fix/Workaround

Clear the flag in software after address interrupt.

39. Clearing TWI Stop Interrupt Flag may lock the bus

If software clears the STOP Interrupt Flag (APIF) on the same Peripheral Clock cycle as the hardware sets this

flag due to a new address received, CLKHOLD is not cleared and the SCL line is not released. This will lock the

bus.

Problem fix/Workaround

Check if the bus state is IDLE. If this is the case, it is safe to clear APIF. If the bus state is not IDLE, wait for the

SCL pin to be low before clearing APIF.

Code:

/* Only clear the interrupt flag if within a "safe zone". */

while ( /* Bus not IDLE: */

((COMMS_TWI.MASTER.STATUS & TWI_MASTER_BUSSTATE_gm) !=

TWI_MASTER_BUSSTATE_IDLE_gc)) &&

/* SCL not held by slave: */

!(COMMS_TWI.SLAVE.STATUS & TWI_SLAVE_CLKHOLD_bm)

)

{

/* Ensure that the SCL line is low */

if ( !(COMMS_PORT.IN & PIN1_bm) )

break;

}

/* Check for an pending address match interrupt */

if ( !(COMMS_TWI.SLAVE.STATUS & TWI_SLAVE_CLKHOLD_bm) )

{

/* Safely clear interrupt flag */

COMMS_TWI.SLAVE.STATUS |= (uint8_t)TWI_SLAVE_APIF_bm;

}

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40. TWI START condition at bus timeout will cause transaction to be dropped

If Bus Timeout is enabled and a timeout occurs on the same Peripheral Clock cycle as a START is detected, the

transaction will be dropped.

Problem fix/Workaround

None.

41. TWI Data Interrupt Flag erroneously read as set

When issuing the TWI slave response command CMD=0b11, it takes 1 Peripheral Clock cycle to clear the data

interrupt flag (DIF). A read of DIF directly after issuing the command will show the DIF still set.

Problem fix/Workaround

Add one NOP instruction before checking DIF.

42. WDR instruction inside closed window will not issue reset

When a WDR instruction is execute within one ULP clock cycle after updating the window control register, the

counter can be cleared without giving a system reset.

Problem fix/Workaround

Wait at least one ULP clock cycle before executing a WDR instruction.

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36.2 ATxmega64A1 and ATxmega128A1 rev. G

Bootloader Section in Flash is non-functional

Bandgap voltage input for the ACs cannot be changed when used for both ACs simultaneously

DAC is nonlinear and inaccurate when reference is above 2.4V

ADC gain stage output range is limited to 2.4 V

The ADC has up to ±2 LSB inaccuracy

TWI, a general address call will match independent of the R/W-bit value

TWI, the minimum I2C SCL low time could be violated in Master Read mode

Setting HIRES PR bit makes PWM output unavailable

EEPROM erase and write does not work with all System Clock sources

BOD will be enabled after any reset

Propagation delay analog Comparator increasing to 2 ms at -40C

Sampled BOD in Active mode will cause noise when bandgap is used as reference

Default setting for SDRAM refresh period too low

Flash Power Reduction Mode can not be enabled when entering sleep mode

Enabling Analog Comparator B output will cause JTAG failure

JTAG enable does not override Analog Comparator B output

Bandgap measurement with the ADC is non-functional when VCC is below 2.7V

DAC refresh may be blocked in S/H mode

Inverted I/O enable does not affect Analog Comparator Output

Both DFLLs and both oscillators has to be enabled for one to work

1. Bootloader Se ction in Flash is non-functional

The Bootloader Section is non-functional, and bootloader or application code cannot reside in this part of the

Flash.

Problem fix/Workaround

None, do not use the Bootloader Section.

2. Bandgap voltage input for the ACs cannot be changed when used for both ACs simultaneously

If the Bandgap voltage is selected as input for one Analog Comparator (AC) and then selected/deselected as input

for the another AC, the first comparator will be affected for up to 1 us and could potentially give a wrong compari-

son result.

Problem fix/Workaround

If the Bandgap is required for both ACs simultaneously, configure the input selection for both ACs before enabling

any of them.

3. DAC is nonlinear and inaccurate when referen c e is above 2.4V

Using the DAC with a reference voltage above 2.4V give inaccurate output when converting codes that give below

0.75V output:

±20 LSB for continuous mode

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±200 LSB for Sample and Hold mode

Problem fix/Workaround

None, avoid using a voltage reference above 2.4V.

4. ADC gain stage output range is limited to 2.4 V

The amplified output of the ADC gain stage will never go above 2.4 V, hence the differential input will only give cor-

rect output when below 2.4 V/gain. For the available gain settings, this gives a differential input range of:

Problem fix/Workaround

Keep the amplified voltage output from the ADC gain stage below 2.4 V in order to get a correct result, or keep

ADC voltage reference below 2.4 V.

5. The ADC has up to ±2 LSB inaccuracy

The ADC will have up to ±2 LSB ina ccuracy, visible as a saw-tooth pattern on the input voltage/ output value trans-

fer function of the ADC. The inaccuracy increases with increasing voltage reference reaching ±2 LSB with 3V

reference.

Problem fix/Workaround

None, the actual ADC resolution will be reduced with up to ±2 LSB.

6. TWI, a general address call will match independent of the R/W- bit value

When the TWI is in Slave mode and a general address call is issued on the bus, the TWI Slave will get an address

match regardless of the R/W-bit (ADDR[0] bit) value in the Slave Address Register.

Problem fix/Workaround

Use software to check the R/W-bit on general call address match.

– 1x gain: 2.4 V

– 2x gain: 1.2 V

– 4x gain: 0.6 V

– 8x gain: 300 mV

– 16x gain: 150 mV

– 32x gain: 75 mV

– 64x gain: 38 mV

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7. TWI, the minimum I2C SCL low time could be violated in Master Read mode

When the TWI is in Master Read mode and issuing a Repeated Start on the bus, this will immediately release the

SCL line even if one complete SCL low period has not passed. This means that the minimum SCL low time in the

I2C specification could be violated.

Problem fix/Workaround

If this causes a potential problem in the application, software must ensure that the Repeated Start is never issued

before one SCL low time has passed.

8. Setting HIRES PR bit makes PWM output unavailable

Setting the HIRES Power Reduction (PR) bit for PORTx will make any Frequency or PWM output for the corre-

sponding Timer/Counters (TCx0 and TCx1) unavailable on the pin.

Problem fix/Workaround

Do not write the HIRES PR bit on PORTx when frequency or PWM output from TCx0/1 is used.

9. EEPROM erase and write does not work with all System Clock sources

When doing EEPROM erase or Write operations with other clock sources than the 2 MHz RCOSC, Flash will be

read wrongly for one or two clock cycles at the end of the EEPROM operation.

Problem fix/Workaround

Alt 1: Use the internal 2 MHz RCOSC when doing erase or write operations on EEPROM.

Alt 2: Ensure to be in sleep mode while completing erase or write on EEPROM. After starting erase or write opera-

tions on EEPROM, other interrupts should be disabled and the device put to sleep.

10. BOD will be enabled after any reset

If any reset source goes active, the BOD will be enabled and keep the device in reset if the VCC voltage is below

the programmed BOD level. During Power-On Reset, reset will not be released until VCC is above the pro-

grammed BOD level even if the BOD is disabled.

Problem fix/Workaround

Do not set the BOD level higher than VCC even if the BOD is not used.

11. Propagation delay analog Comparator increasing to 2 ms at -40 °C

When the analog comparator is used at temperatures reaching down to -40 °C, the propagation delay will increase

to ~2 ms.

Problem fix/Workaround

None

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12. Sampled BOD in Active mode will cause noise when bandgap is used as reference

Using the BOD in sampled mode when the device is running in Active or Idle mode will add noise on the bandgap

reference for ADC and DAC.

Problem fix/Workaround

If the bandgap is used as reference for either the ADC or the DAC, the BOD must not be set in sampled mode.

13. Default setting for SDRAM refresh period too low

If the SDRAM refresh period is set to a value less then 0x20, the SDRAM content may be corrupted when access-

ing through On-Chip Debug sessions.

Problem fix/Workaround

The SDRAM refresh period (REFRESHH/L) should not be set to a value less then 0x20.

14. Flash Power Reduction Mode can not be enabled when entering sleep mode

If Flash Power Reduction Mode is enabled when entering Power-save or Extended Standby sleep mode, the

device will only wake up on every fourth wake-up request.

If Flash Power Reduction Mode is enabled when entering Idle sleep mode, the wake-up time will vary with up to 16

CPU clock cycles.

Problem fix/Workaround

Disable Flash Power Reduction mode before entering sleep mode.

15. JTAG enable does not override Analog Comparator B output

When JTAG is enabled this will not override the Anlog Comparator B (ACB)ouput, AC0OUT on pin 7 if this is

enabled.

Problem fix/Workaround

AC0OUT for ACB should not be enabled when JTAG is used. Use only analog comparator output for ACA when

JTAG is used, or use the PDI as debug interface.

16. Bandgap measurement with the ADC is non-functional when VCC is below 2.7V

The ADC cannot be used to do bandgap measurements when VCC is below 2.7V.

Problem fix/Workaround

If internal voltages must be measured when VCC is below 2.7V, measure the internal 1.00V reference instead of

the bandgap.

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17. DAC refresh may be blocked in S/H mode

If the DAC is running in Sample and Hold (S/H) mode and conversion for one channel is done at maximum rate

(i.e. the DAC is always busy doing conversion for this channel), this will block refresh signals to the second chan-

nel.

Problem fix/Workarund

When using the DAC in S/H mode, ensure that none of the channels is running at maximum conversion rate, or

ensure that the conversion rate of both channels is high enough to not require refresh.

18. Inverted I/O enable does not affect Analog Comparator Output

The inverted I/O pin function does not affect the Analog Comparator output function.

Problem fix/Workarund

Configure the analog comparator setup to give a inverted result (i.e. connect positive input to the negative AC input

and vice versa), or use and externel inverter to change polarity of Analog Comparator Output.

19. Both DFLLs and both oscillators has to be enabled for one to work

In order to use the automatic runtime calibration for the 2 MHz or the 32 MHz internal oscilla-tors, the DFLL for

both oscillators and both oscillators has to be enabled for one to work.

Problem fix/Workarund

Enabled both DFLLs and oscillators when using automatic runtime calibration for one of the internal oscillators.

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37. Datasheet Revision History

Please note that the referring page numbers in this section are referred to this document. The referring revision in this

section are referring to the document revision.

37.1 8067O – 06/2013

37.2 8067N – 03/2013

37.3 8067M – 09/2010

37.4 8067L – 08/2010

1. Not recommended for new designs - Use XMEGA A1U series.

1. Removed all references to ATxmega192A1, ATxmega256A1 and ATxmega384A1 .

2. Updated module description. Based on the XMEGA A1U device datasheet.

3. Updated analog comparator (AC) overview, Figure 28-1 on page 53.

4. Updated “ADC Characteristics” on page 76.

5Updated page erase time in “Flash and EEPROM Memory Characteristics” on page 76.

6Updated Output low voltage conditions from IOH to IOL in “PAD Characteristics” on page 79.

7. Removed TBDs from:

“DC Characteristics” on page 73.

“DAC Characteristics” on page 78.

“Bandgap Characteristics” on page 78.

8. Updated “Errata” on page 96 to be va lid for both ATxmega64A1 and ATxmega128A1.

9. Removed Boundary Scan Order table.

1. Updated Errata “ATxmega64A1and ATxmega128A1 rev. H” on page 96

1. Removed Footnote 3 of Figure 2-1 on page 3

2. Updated “Features” on page 32. Event Chann el 0 output on port pin 7

3. Updated “DC Characteristics” on page 73, by adding ICC for Flash/EEPROM Programming.

4. Added AVCC in “ADC Characteristics” on page 76.

5. Updated Start up time in “ADC Characteristics” on page 76.

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37.5 8067K – 02/2010

37.6 8067J – 02/2010

37.7 8067I – 04/2009

37.8 8067H – 04/2009

6. Updated “DAC Characteristics” on page 78. Removed DC output impedance.

7. Fixed typo in “Packag ing information” section.

8. Fixed typo in “Errata” section.

1. Added “PDI Speed vs. VCC” on page 95.

1. Removed JTAG Reset from the datasheet.

2. Updated “Timer/Counter and AWEX functions” on page 56.

3. Updated “Alternate Pin Functions” on page 58.

3. Updated all “Electrical Characteristics” on page 73.

4. Updated “PAD Characteristics” on pa ge 79.

5. Changed Internal Oscillator Speed to “Oscillators and Wake-up Time” on page 92.

6. Updated “Errata” on page 96

1. Updated “Ordering Information” on page 2.

2. Updated “PAD Characteristics” on pa ge 79.

1. Editorial updates.

2. Updated “Overview” on page 54.

3. Updated Table 29-9 on pa ge 54.

4. Updated “Peripheral Module Address Map” on page 62. IRCOM has address ma p: 0x08F8.

5. Updated “Electrical Characteristics” on page 73.

6. Updated “PAD Characteristics” on pa ge 79.

7. Updated “Typical Characteristics” on page 82.

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37.9 8067G – 11/2008

37.10 8067F – 09/2008

37.11 8067E – 08/2008

37.12 8067D – 07/2008

1. Updated “Block Diagram” on page 6.

2. Updated feature list in “Memories” on page 12.

3. Updated “Programming and Debugging” on page 54.

4. Updated “Peripheral Module Address Map” on page 62. IRCOM has address 0x8F0.

5. Added “Electrical Characteristics” on page 73.

6. Added “Typical Characte ristics” on page 82.

7. Added “ATxmega64A1and ATxmega128A1 rev. H” on page 96.

8. Updated “ATxmega64A1 and ATxmega128A1 rev. G” on page 107.

1. Updated “Features” on page 1

2. Updated “Ordering Information” on page 2

3. Updated Figure 7-1 on page 11 and Figu re 7-2 on page 11.

4. Updated Table 7-2 on pag e 15 .

5. Updated “Features” on page 48 and “Overview” on page 48.

6. Removed “Interrupt Vector Summary” section from datasheet.

1. Changed Figure 2-1’s title to “Block diagram and pinout” on page 3.

2. Updated Figure 2-2 on page 4.

3. Updated Table 29-2 on pa ge 51 and Table 29-3 on page 52.

1. Updated “Ordering Information” on page 2.

2. Updated “Peripheral Module Address Map” on page 62.

3. Inserted “Interrupt Vector Summary” on page 56.

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37.13 8067C – 06/2008

37.14 8067B – 05/2008

37.15 8067A – 02/2008

1. Updated the Front page and “Features” on page 1.

2. Updated the “DC Cha r acteristics” on page 73.

3. Updated Figure 3-1 on page 6.

4. Added “Flash and EEPROM Page Size” on page 15.

5. Updated Table 33-6 on pa ge 72 with new data: Gain Error, Offset Error and Signal -to-Noise

Ratio (SNR).

6. Updated Errata “ATxmega64A1 an d ATxmega128A1 rev. G” on page 107.

1. Updated “Pinout/Block Diagram” on page 3 and “Pinout and Pin Functions” on page 55.

2. Added XMEGA A1 Block Diagram, Figure 3-1 on page 6.

3. Updated “Overview” on page 5 included the XMEGA A1 explanation text on page 6.

4. Updated AVR CPU “Features” on page 8.

5. Updated Event System block diagram, Figure 10-1 on page 20.

6. Updated “Interrupts and Programmable Multilevel In terrupt Controller” on page 29.

7. Updated “AC - Analog Comparator” on page 52.

8. Updated “Alternate Pin Function Description” on page 55.

9. Updated “Alternate Pin Functions” on page 58.

10. Updated “Typical Characteristics” on page 82.

11. Updated “Ordering Information” on page 2.

12. Updated “Overview” on page 5.

13. Updated Figure 6-1 on page 8.

14. Inserted a new Figure 16-1 on page 37.

15. Updated Speed grades in “Speed” on page 75.

16. Added a new A Txmega384A1 device in “Features” on page 1, updated “Ordering Information” on

page 2 and “Memories” on pa ge 12.

17. Replaced the Figure 3-1 on page 6 by a new XMEGA A1 detailed block diagram.

18. Inserted Errata “ATxmega64A1 and ATxmega128A1 rev. G” on page 107 .

1. Initial revision.

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Table of Contents

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

2. Pinout/Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

3. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3.1 Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

4. Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

4.1 Recommended reading. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

5. Capacitive touch sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

6. Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

7. AVR CPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

7.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

7.2 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

7.3 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

7.4 ALU - Arithmetic Logic Unit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

7.5 Program Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

7.6 Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

7.7 Register File . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

8. Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

8.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

8.2 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

8.3 In-System Programmable Flash Program Memory. . . . . . . . . . . . . . . . . . . . . 13

8.4 Fuses and Lock bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

8.5 Data Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

8.6 EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

8.7 I/O Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

8.8 External Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

8.9 Data Memory and Bus Arbitration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

8.10 Memory Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

8.11 Device ID and Revision. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

8.12 I/O Memory Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

8.13 JTAG Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

8.14 Flash and EEPROM Page Size . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

9. DMAC - Direct Memory Access Controller . . . . . . . . . . . . . . . . . . . . 18

9.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

9.2 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

10. Event System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

10.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

10.2 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

11. System Clock and Clock options . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

11.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

11.2 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

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11.3 Clock Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

12. Power Management and Sleep Modes . . . . . . . . . . . . . . . . . . . . . . 24

12.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

12.2 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

12.3 Sleep Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

13. System Control and Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

13.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

13.2 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

13.3 Reset Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

13.4 Reset Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

13.5 WDT - Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

13.6 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

14. Interrupts and Programmable Multilevel Interrupt Controller . . . . . . 29

14.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

14.2 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

14.3 Interrupt vectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

15. I/O Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

15.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

15.2 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

15.3 Output Driver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

15.4 Input sensing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

15.5 Port Interrupt. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

15.6 Alternate Port Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

16. T/C - 16-bit Timer/Counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

16.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

16.2 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

17. AWeX - Advanced Waveform Extension . . . . . . . . . . . . . . . . . . . . . 38

17.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

17.2 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

18. Hi-Res - High Resolution Extension . . . . . . . . . . . . . . . . . . . . . . . . . 39

18.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

18.2 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

19. RTC - 16-bit Real-Time Counter . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

19.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

19.2 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

20. TWI - Two-Wire Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

20.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

20.2 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

21. SPI - Serial Peripheral Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

21.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

21.2 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

22. USART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

22.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

22.2 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

23. IRCOM - IR Communication Module . . . . . . . . . . . . . . . . . . . . . . . . 45

23.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

23.2 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

24. AES and DES Crypto Engine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

24.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

24.2 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

25. EBI – External Bus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

25.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

25.2 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

26. ADC - 12-bit Analog to Digital Converter . . . . . . . . . . . . . . . . . . . . . 48

26.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

26.2 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

27. DAC - 12-bit Digital to Analog Converter . . . . . . . . . . . . . . . . . . . . . 50

27.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

27.2 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

28. AC - Analog Comparator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

28.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

28.2 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

29. Programming and Debugging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

29.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

29.2 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

30. Pinout and Pin Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

30.1 Alternate Pin Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

30.2 Alternate Pin Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

31. Peripheral Module Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

32. Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

33. Packaging information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

33.1 100A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

33.2 100C1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

33.3 100C2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

34. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

34.1 Absolute Maximum Ratings*. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

34.2 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73

34.3 Speed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

34.4 Flash and EEPROM Memory Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 76

34.5 ADC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

34.6 DAC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

34.7 Analog Comparator Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

34.8 Bandgap Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

34.9 Brownout Detection Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

34.10 PAD Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

34.11 POR Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

34.12 Reset Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

34.13 Oscillator Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

35. Typical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82

35.1 Active Supply Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82

35.2 Idle Supply Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

35.3 Power-down Supply Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

35.4 Power-save Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

35.5 Pin Pull-up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85

35.6 Pin Thresholds and Hysteresis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

35.7 Bod Thresholds. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

35.8 Bandgap . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

35.9 Analog Comparator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

35.10 Oscillators and Wake-up Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92

35.11 PDI Speed. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

36. Errata . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96

36.1 ATxmega64A1and ATxmega128A1 rev. H. . . . . . . . . . . . . . . . . . . . . . . . . . . 96

36.2 ATxmega64A1 and ATxmega128A1 rev. G . . . . . . . . . . . . . . . . . . . . . . . . . 107

37. Datasheet Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112

37.1 8067O – 06/2013 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112

37.2 8067N – 03/2013 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112

37.3 8067M – 09/2010 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112

37.4 8067L – 08/2010. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112

37.5 8067K – 02/2010. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

37.6 8067J – 02/2010. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

37.7 8067I – 04/2009 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

37.8 8067H – 04/2009 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

37.9 8067G – 11/2008 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114

37.10 8067F – 09/2008. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114

37.11 8067E – 08/2008. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114

37.12 8067D – 07/2008 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114

37.13 8067C – 06/2008 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

37.14 8067B – 05/2008. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

37.15 8067A – 02/2008. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

[Not recommended for new designs - Use XMEGA A1U series] XMEGA A1 [DATASHEET]

8067O–AVR–06/2013

Atmel Corporation

1600 Technology Drive

San Jose, CA 95110

USA

Tel: (+1) (408) 441-0311

Fax: (+1) (408) 487-2600

www.atmel.com

Atmel Asia Limited

Unit 01-5 & 16, 19F

BEA Tower, Millennium City 5

418 Kwun Tong Ro a

Kwun Tong , Ko w lo on

HONG KONG

Tel: (+852) 2245-6100

Fax: (+852) 2722-1369

Atmel Munich GmbH

Business Campus

Parkring 4

D-85748 Garching b. Munich

GERMANY

Tel: (+49) 89-319 70 -0

Fax: (+49) 89-3194621

Atmel Japan G.K.

16F Shin-Osaki Kangyo Bldg

1-6-4 Osaki, Shinagawa-ku

Tokyo 141-0032

JAPAN

Tel: (+81) (3) 6417-0300

Fax: (+81) (3) 6417-03 70

Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, t o any intellec tual property right is g ranted by th is

document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN THE ATMEL TERMS AND CONDITIONS OF SALES LOCATED ON THE ATMEL WEBSITE, ATMEL ASSUMES

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