INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-CPC1001N-R06 1
CPC1001N
Optocoupler: Unidirectional Input,
Single-Transistor Output
Part # Description
CPC1001N 4-Pin SOP (100/Tube)
CPC1001NTR 4-Pin SOP Surface Mount (2000/Reel)
Parameter Rating Units
Breakdown Voltage BVCEO 30 V
Current Transfer Ratio (Min) 100 %
Saturation Voltage 0.3 V
Input Control Current 0.2 mA
Applications
Features
Description
Ordering Information
Pin Configuration
• Loop Detect
• Ringing Detect
• Sensor Circuitry
• Instrumentation
• Multiplexers
• Data Acquisition
• I/O Subsystems
• Industrial Control
• 100mA Continuous Load Rating
• 1500Vrms Input/Output Isolation
• Small 4-Pin SOP Package
• Tape & Reel Version Available
• Flammability Rating UL 94 V-0
CPC1001N is a unidirectional input optocoupler with
a single transistor output. Current transfer ratios
range from 100% to 800%.
1
23
4
+ Control
– Control
Load
Load
Approvals
• UL Recognized Component: File # E76270
• CSA Certified Component: Certificate # 1175739
• EN/IEC 60950-1 Certified Component:
Certificate available on our website
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R06
CPC1001N
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Absolute Maximum Ratings @ 25ºC
Parameter Ratings Units
Input Power Dissipation 1150 mW
Input Control Current
Peak (10ms)
5mA
1A
Reverse Input Voltage 5 V
Phototransistor 2150 mW
Isolation Voltage, Input to Output 1500 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 2.00 mW / ºC
Electrical Characteristics @ 25ºC
Characteristic Symbol Test Condition Typ Units
Turn-On Time ton IF=2mA, VCC=5V, RL=1K1s
Turn-Off Time toff 30
Switching Characteristics @ 25ºC
Parameters Conditions Symbol Min Typ Max Units
Output Characteristics
Phototransistor Blocking Voltage ICEO=10µA BVCEO 30 90 - VP
Phototransistor Output (Dark) Current IF=0mA, VCEO=5V ICEO - 9 500 nA
Saturation Voltage IF=1mA, IC=1mA VCE(sat) - - 0.3 V
Current Transfer Ratio IF=0.2mA, VCE=0.5V CTR 100 330 800 %
Output Capacitance VCEO=25V, f=1MHz COUT -6-pF
Input Characteristics
Input Control Current IC=0.2mA, VCE=0.5V IF- 0.1 0.2 mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.5 V
Input Reverse Current VR=5V IR- - 10 µA
Common Characteristics
Input to Output Capacitance - CI/O -3-pF
Switching Time Test Circuit VCC
VCE
RL
IF
Pulse Width=5ms
Duty Cycle=1%
IF
10%
90%
tON tOFF
VCE
INTEGRATED CIRCUITS DIVISION
CPC1001N
www.ixysic.com 3
R06
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifi cations, please contact our application department.
Refer to the Test Circuit
on the previous page
for these two graphs.
LED Forward Voltage (V)
1.1 1.2 1.3 1.4 1.5 1.6
LED Forward Current (mA)
0
10
20
30
40
50
LED Voltage vs. LED Current
LED Forward Voltage (V)
1.1 1.2 1.3 1.4 1.5 1.6
LED Forward Current (mA)
0.1
1
10
100
LED Voltage vs. LED Current
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
LED Forward Voltage vs. Temperature
IF=50mA
IF=5mA
IF=10mA
IF=20mA
IF=0.2mA
IF=1mA
IF=2mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Typical ICE (mA)
0.1
1
10
100
Typical ICE Current vs. Temperature
(VCE=0.5V)
IF=10mA
IF=5mA
IF=2mA
IF=1mA
IF=0.5mA
IF=0.2mA
IF=0.1mA
0.0 0.2 0.4 0.6 0.8 1.0 1.2
0
5
10
15
20
25
30
Typical Voltage vs. Current
Collector Voltage (V)
Collector Current (mA)
IF=0.2mA
IF=0.5mA
IF=1mA
IF=2mA
IF=5mA
IF=10mA
LED Forward Current (mA)
0.1 1 10
CTR (%)
100
150
200
250
300
350
Typical CTR vs. LED Forward Current
(VCE=0.5V)
55ºC
85ºC
25ºC
-40ºC
Load Resistance (k:)
0.1 1 10 100
Turn-On Time (Ps)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Turn-On Time vs. Load Resistance
(VCC=5V)
IF=5mA
IF=2mA
IF=1mA
Load Resistance (k:)
0.1 1 10 100
Turn-Off Time (Ps)
10
100
1000
Turn-Off Time vs. Load Resistance
(VCC=5V)
IF=5mA
IF=1mA
IF=2mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Saturation Voltage (V)
0.08
0.10
0.12
0.14
0.16
0.18
0.20
Typical Saturation Voltage
vs. Temperature
(IF=2mA, IC=1mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (VP)
88
89
90
91
92
93
94
95
96
Blocking Voltage vs. Temperature
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage Current (nA)
0
100
200
300
400
500
Collector Leakage Current
vs. Temperature
VCC=10V
VCC=5V
VCC=3V
PERFORMANCE DATA*
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
4R06
CPC1001N
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in
the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Classifi cation
CPC1001N MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device Classifi cation Temperature (Tc) Dwell Time (tp) Max Refl ow Cycles
CPC1001N 260ºC 30 seconds 3
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage
to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow
up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the
variability of the wash parameters used to clean the board, determination of the bake temperature and duration
necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning
or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the
device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
INTEGRATED CIRCUITS DIVISION
IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes
to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits'
Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but
not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property
or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice.
For additional information please visit our website at: www.ixysic.com
CPC1001N
Specification: DS-CPC1001N-R06
©Copyright 2018, IXYS Integrated Circuits
OptoMOS® is a registered trademark of IXYS Integrated Circuits
All rights reserved. Printed in USA.
6/4/2018
MECHANICAL DIMENSIONS
Dimensions
mm
(inches)
NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
User Direction o
f
Fee
d
User Direction of Feed
K0=2.70
(0.106)
K1=2.30
(0.091)
B0=4.70
(0.185)
W=12.00
(0.472)
P1=8.00
(0.315)
A0=6.50
(0.256)
CPC1001N
CPC1001NTR Tape & Reel
Recommended PCB Land Pattern
2.54
(0.10)
3.85
(0.152)
1.54
(0.061)
0.60
(0.024)
Dimensions
mm
(inches)
Pin 1
4.089 ± 0.025
(0.161 ± 0.001)
2.54 Typ
(0.100 Typ)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.025
(0.150 ± 0.001) 0.559 ± 0.127
(0.022 ± 0.005)
0.910 ± 0.025
(0.036 ± 0.001)
2.030± 0.025
(0.080± 0.001)
0.381 ± 0.025
(0.015 ± 0.001)
Package standoff:
0.064 ± 0.040
(0.0025 ± 0.0015)
0-0.1
(
0-0.004
)
0.481
(0.019)
0.203 ± 0.025
(0.008 ± 0.001)
Note:
1. Lead dimensions do not include plating: 1000 microinches max.
