MCP1401/02 Tiny 500 mA, High-Speed Power MOSFET Driver Features General Description * High Peak Output Current: 500 mA (typical) * Wide Input Supply Voltage Operating Range: - 4.5V to 18V * Low Shoot-Through/Cross-Conduction Current in Output Stage * High Capacitive Load Drive Capability: - 470 pF in 19 ns (typical) - 1000 pF in 34 ns (typical) * Short Delay Times: 35 ns (typical) * Matched Rise/Fall Times * Low Supply Current: - With Logic `1' Input - 0.85 mA (typical) - With Logic `0' Input - 0.1 mA (typical) * Latch-Up Protected: Will Withstand 500 mA Reverse Current * Logic Input will Withstand Negative Swing up to 5V * Space-saving 5-Lead SOT-23 Package The MCP1401/02 are high-speed MOSFET drivers capable of providing 500 mA of peak current. The inverting or non-inverting single channel output is directly controlled from either TTL or CMOS (3V to 18V). These devices also feature low shoot-through current, matched rise/fall times and propagation delays which make them ideal for high switching frequency applications. Applications * * * * Switch Mode Power Supplies Pulse Transformer Drive Line Drivers Motor and Solenoid Drive The MCP1401/02 devices operate from a single 4.5V to 18V power supply and can easily charge and discharge 470 pF gate capacitance in under 19 ns (typical). They provide low enough impedances in both the on and off states to ensure the MOSFET's intended state will not be affected, even by large transients. These devices are highly latch-up resistant under any conditions within their power and voltage ratings. They are not subject to damage when up to 5V of noise spiking (of either polarity) occurs on the ground pin. They can accept, without damage or logic upset, up to 500 mA of reverse current being forced back into their outputs. All terminals are fully protected against Electrostatic Discharge (ESD) up to 1 kV (HBM) and 300V (MM). Package Types SOT-23 MCP1401 MCP1402 GND 1 5 OUT OUT 4 GND GND VDD 2 IN 3 2007-2013 Microchip Technology Inc. DS20002052C-page 1 MCP1401/02 Functional Block Diagram Inverting VDD 850 A 300 mV Output Non-inverting Input Effective Input C = 25 pF (Each Input) 4.7V MCP1401 Inverting MCP1402 Non-inverting GND DS20002052C-page 2 2007-2013 Microchip Technology Inc. MCP1401/02 1.0 ELECTRICAL CHARACTERISTICS Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings Supply Voltage ..................................................... +20V Input Voltage .................... (VDD + 0.3V) to (GND - 5V) Input Current (VIN > VDD) ................................... 50 mA Package Power Dissipation (TA = 50oC) SOT-23-5 ........................................................ 0.39W DC CHARACTERISTICS (Note 2) Electrical Specifications: Unless otherwise indicated, TA = +25C, with 4.5V VDD 18V. Parameters Sym. Min. Typ. Max. Units Logic `1', High Input Voltage VIH 2.4 1.5 -- V Logic `0', Low Input Voltage VIL -- 1.3 0.8 V Input Current IIN -1 -- 1 A Input Voltage VIN -5 -- VDD + 0.3 V Conditions Input 0V VIN VDD Output High Output Voltage VOH VDD - 0.025 -- -- V DC Test Low Output Voltage VOL -- -- 0.025 V DC Test Output Resistance, High ROH -- 12 18 IOUT = 10 mA, VDD = 18V Output Resistance, Low ROL -- 10 16 IOUT = 10 mA, VDD = 18V Peak Output Current IPK -- 0.5 -- A VDD 18V (Note 2) Latch-Up Protection Withstand Reverse Current IREV -- > 0.5 -- A Duty cycle 2%, t 300 s Rise Time tR -- 19 25 ns Figure 4-1, Figure 4-2 CL = 470 pF Fall Time tF -- 15 20 ns Figure 4-1, Figure 4-2 CL = 470 pF Delay Time tD1 -- 35 40 ns Figure 4-1, Figure 4-2 Delay Time tD2 -- 35 40 ns Figure 4-1, Figure 4-2 VDD 4.5 -- 18.0 V IS -- 0.85 1.1 mA VIN = 3V IS -- 0.10 0.20 mA VIN = 0V Switching Time (Note 1) Power Supply Supply Voltage Power Supply Current Note 1: 2: Switching times ensured by design. Tested during characterization, not production tested. 2007-2013 Microchip Technology Inc. DS20002052C-page 3 MCP1401/02 DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE) Electrical Specifications: Unless otherwise indicated, operating temperature range with 4.5V VDD 18V. Parameters Sym. Min. Typ. Max. Units Logic `1', High Input Voltage VIH 2.4 Logic `0', Low Input Voltage VIL -- Input Current IIN -10 Input Voltage VIN -5 VOH VDD - 0.025 Low Output Voltage VOL Output Resistance, High ROH Output Resistance, Low Conditions -- -- V -- 0.8 V -- +10 A -- VDD + 0.3 V -- -- V DC TEST -- -- 0.025 V DC TEST -- 16 18 IOUT = 10 mA, VDD = 18V ROL -- 16 19 IOUT = 10 mA, VDD = 18V Rise Time tR -- 20 30 ns Figure 4-1, Figure 4-2 CL = 470 pF Fall Time tF -- 18 28 ns Figure 4-1, Figure 4-2 CL = 470 pF Delay Time tD1 -- 40 51 ns Figure 4-1, Figure 4-2 Delay Time tD2 -- 40 51 ns Figure 4-1, Figure 4-2 VDD 4.5 -- 18.0 V IS -- 0.90 1.10 mA VIN = 3V -- 0.11 0.20 mA VIN = 0V Input 0V VIN VDD Output High Output Voltage Switching Time (Note 1) Power Supply Supply Voltage Power Supply Current Note 1: 2: Switching times ensured by design. Tested during characterization, not production tested. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V VDD 18V. Parameters Sym. Min. Typ. Max. Units TA -40 -- +125 C Conditions Temperature Ranges Specified Temperature Range Maximum Junction Temperature TJ -- -- +150 C Storage Temperature Range TA -65 -- +150 C JA -- 220.7 -- C/W Package Thermal Resistances Thermal Resistance, 5L-SOT-23 DS20002052C-page 4 2007-2013 Microchip Technology Inc. MCP1401/02 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, TA = +25C with 4.5V VDD 18V. 350 350 3300 pF 250 200 150 1000 pF 100 3300 pF 300 Fall Time (ns) Rise TIme (ns) 300 470 pF 100 pF 50 250 200 150 100 pF 470 pF 100 1000 pF 50 0 0 4 6 8 10 12 14 16 18 4 6 8 Supply Voltage (V) FIGURE 2-1: Voltage. 10 12 14 FIGURE 2-4: Voltage. Rise Time vs. Supply Fall Time vs. Supply 250 12V 12V 200 Fall Time (ns) Rise Time (ns) 200 150 18V 100 50 150 18V 100 50 5V 0 100 1000 5V 0 100 10000 1000 Capacitive Load (pF) Time (ns) 10000 Capacitve Load (pF) Rise Time vs. Capacitive FIGURE 2-5: Load. Fall Time vs. Capacitive 44 CLOAD = 470 pF VDD = 12V tRISE 26 tFALL 22 18 14 10 Propagation Delay (ns) FIGURE 2-2: Load. 30 18 Supply Voltage (V) 250 34 16 VDD= 12V 43 tD1 42 41 40 39 tD2 38 37 36 -40 -25 -10 5 20 35 50 65 80 95 110 125 4 o FIGURE 2-3: Temperature. Rise and Fall Times vs. 2007-2013 Microchip Technology Inc. 5 6 7 8 9 10 Input Amplitude (V) Temperature ( C) FIGURE 2-6: Amplitude. Propagation Delay vs. Input DS20002052C-page 5 MCP1401/02 Note: Unless otherwise indicated, TA = +25C with 4.5V VDD 18V. 1.2 Quiescent Current (mA) Propagation Delay (ns) 80 70 tD1 60 50 tD2 40 VDD = 18V 1.0 Input = 1 0.8 0.6 0.4 0.2 Input = 0 0.0 30 4 6 8 10 12 14 16 -40 -25 -10 18 5 o Supply Voltage (V) FIGURE 2-7: Supply Voltage. Propagation Delay Time vs. FIGURE 2-10: Temperature. VDD = 12V 55 Input Threshold (V) Propagation Delay (ns) Temperature ( C) Quiescent Current vs. 2.2 60 tD1 50 45 tD2 40 35 30 2.1 VHI 2 1.9 1.8 1.7 VLO 1.6 1.5 -40 -25 -10 5 20 35 50 65 80 95 110 125 4 6 8 o FIGURE 2-8: Temperature. 10 12 14 Propagation Delay Time vs. FIGURE 2-11: Voltage. 18 Input Threshold vs. Supply 2.4 1.2 VDD = 12V 2.3 Input Threshold (V) 1.0 Input = 1 0.8 0.6 0.4 Input = 0 0.2 16 Supply Voltage (V) Temperature ( C) Quiescent Current (mA) 20 35 50 65 80 95 110 125 0.0 2.2 2.1 VHI 2 1.9 1.8 VLO 1.7 1.6 4 6 8 10 12 14 16 18 -40 -25 -10 Supply Voltage (V) FIGURE 2-9: Supply Voltage. Quiescent Current vs. 5 20 35 50 65 80 95 110 125 o Temperature ( C) FIGURE 2-12: Temperature. Input Threshold vs. Note: Unless otherwise indicated, TA = +25C with 4.5V VDD 18V. DS20002052C-page 6 2007-2013 Microchip Technology Inc. MCP1401/02 VDD = 18V 80 2 MHz 125 100 100 kHz 1 MHz 75 200 kHz 50 50 kHz 25 0 100 Supply Current (mA) Supply Current (mA) 150 70 VDD = 18V 6,800 pF 60 3,300 pF 50 100 pF 40 30 10 0 1000 10000 10 100 Capacitive Load (pF) FIGURE 2-13: Capacitive Load. 60 Supply Current vs. FIGURE 2-16: Frequency. 50 VDD = 12V 2 MHz 1 MHz 50 50 kHz 40 100 kHz 30 200 kHz 20 10 0 100 VDD = 12V 470 pF 30 100 pF 20 1,000 pF 10 10 10000 Supply Current vs. VDD = 6V FIGURE 2-17: Frequency. 25 2 MHz 25 100 kHz 1 MHz 20 50 kHz 200 kHz 10 5 0 100 1000 Supply Current vs. VDD = 6V 6,800 pF 20 3,300 pF 15 470 pF 100 pF 10 1,000 pF 5 0 1000 10000 10 Capacitive Load (pF) FIGURE 2-15: Capacitive Load. 100 Frequency (kHz) Supply Current (mA) Supply Current (mA) 6,800 pF 3,300 pF 0 1000 FIGURE 2-14: Capacitive Load. 15 Supply Current vs. 40 Capacitive Load (pF) 30 1000 Frequency (kHz) Supply Voltage (V) Supply Current (mA) 70 1,000 pF 470 pF 20 Supply Current vs. 2007-2013 Microchip Technology Inc. 100 1000 Frequency (kHz) FIGURE 2-18: Frequency. Supply Current vs. DS20002052C-page 7 MCP1401/02 Note: Unless otherwise indicated, TA = +25C with 4.5V VDD 18V. 60 VIN = 0V (MCP1401) VIN = 5V (MCP1402) ROUT-HI (m) 50 TJ = +125oC 40 30 20 TJ = +25oC 10 0 4 6 8 10 12 14 16 18 Supply Voltage (V) FIGURE 2-19: Output Resistance (Output High) vs. Supply Voltage. 50 VIN = 5V (MCP1401) VIN = 0V (MCP1402) 45 ROUT-LO (m) 40 TJ = +125oC 35 30 25 20 TJ = +25oC 15 10 5 4 6 8 10 12 14 16 18 Supply Voltage (V) FIGURE 2-20: Output Resistance (Output Low) vs. Supply Voltage. Crossover Energy (A*sec) 1E-7 1E-8 1E-9 1E-10 4 6 8 10 12 14 16 18 Supply Voltage (V) FIGURE 2-21: Supply Voltage. DS20002052C-page 8 Crossover Energy vs. 2007-2013 Microchip Technology Inc. MCP1401/02 3.0 PIN DESCRIPTIONS The description of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE(1) Pin No. MCP1401 MCP1402 1 GND GND 2 VDD VDD Supply Input 3 IN IN Control Input 4 GND GND Ground 5 OUT OUT Output Note 1: 3.1 Description Ground Duplicate pins must be connected for proper operation. Supply Input (VDD) 3.3 Ground (GND) VDD is the bias supply input for the MOSFET driver and has a voltage range of 4.5V to 18V. This input must be decoupled to ground with a local capacitor. This bypass capacitor provides a localized low-impedance path for the peak currents that are to be provided to the load. Ground is the device return pin. The ground pin should have a low-impedance connection to the bias supply source return. High peak currents will flow out the ground pin when the capacitive load is being discharged. 3.2 3.4 Control Input (IN) The MOSFET driver input is a high-impedance, TTL/ CMOS-compatible input. The input also has hysteresis between the high and low input levels, allowing them to be driven from slow rising and falling signals and to provide noise immunity. 2007-2013 Microchip Technology Inc. Output (OUT, OUT) The output is a CMOS push-pull output that is capable of sourcing and sinking 0.5A of peak current (VDD = 18V). The low output impedance ensures the gate of the external MOSFET will stay in the intended state even during large transients. This output also has a reverse current latch-up rating of 0.5A. DS20002052C-page 9 MCP1401/02 4.0 APPLICATION INFORMATION 4.1 General Information VDD = 18V 1 F MOSFET drivers are high-speed, high-current devices which are intended to source/sink high peak currents to charge/discharge the gate capacitance of external MOSFETs or IGBTs. In high-frequency switching power supplies, the PWM controller may not have the drive capability to directly drive the power MOSFET. A MOSFET driver like the MCP1401/02 family can be used to provide additional source/sink current capability. 4.2 Input 0.1 F Ceramic Output CL = 470 pF MCP1402 MOSFET Driver Timing The ability of a MOSFET driver to transition from a fully off state to a fully on state is characterized by the driver's rise time (tR), fall time (tF), and propagation delays (tD1 and tD2). The MCP1401/02 family of drivers can typically charge and discharge a 470 pF load capacitance in 19 ns, along with a typical matched propagation delay of 35 ns. Figures 4-1 and 4-2 show the test circuit and timing waveform used to verify the MCP1401/02 timing. Input 0.1 F Ceramic 90% Input 18V tD1 tF tD2 tR 90% 90% Output 0V 10% FIGURE 4-1: Waveform. 0V 18V 10% tD1 90% Output tR tD2 10% 0V 90% tF 10% Non-Inverting Driver Timing Decoupling Capacitors Careful layout and decoupling capacitors are highly recommended when using MOSFET drivers. Large currents are required to charge and discharge capacitive loads quickly. For example, approximately 550 mA are needed to charge a 470 pF load with 18V in 15 ns. To operate the MOSFET driver over a wide frequency range with low supply impedance, it is recommended to place a ceramic and low ESR film capacitor in parallel between the driver VDD and GND. A 1.0 F low ESR film capacitor and a 0.1 F ceramic capacitor placed between pins 2 and 1 should be used. These capacitors should be placed close to the driver to minimize circuit board parasitics and provide a local source for the required current. MCP1401 0V 10% Input 4.3 Output CL = 470 pF +5V 90% FIGURE 4-2: Waveform. VDD = 18V 1 F +5V 10% Inverting Driver Timing 4.4 PCB Layout Considerations Proper Printed Circuit Board (PCB) layout is important in a high-current, fast switching circuit to provide proper device operation and robustness of design. PCB trace loop area and inductance should be minimized by the use of ground planes or trace under MOSFET gate drive signals, separate analog and power grounds, and local driver decoupling. Placing a ground plane beneath the MCP1401/02 will help as a radiated noise shield and it will provide some heat sinking for power dissipated within the device. DS20002052C-page 10 2007-2013 Microchip Technology Inc. MCP1401/02 4.5 Power Dissipation 4.5.2 The total internal power dissipation in a MOSFET driver is the summation of three separate power dissipation elements. EQUATION 4-1: P T = PL + P Q + P CC Where: PT = Total power dissipation PL = Load power dissipation PQ = Quiescent power dissipation PCC = Operating power dissipation 4.5.1 The power dissipation associated with the quiescent current draw depends upon the state of the input pin. The MCP1401/02 devices have a quiescent current draw of 0.85 mA (typical) when the input is high and of 0.1 mA (typical) when the input is low. The quiescent power dissipation is shown in Equation 4-3. EQUATION 4-3: P Q = I QH D + I QL 1 - D V DD Where: EQUATION 4-2: P L = f C T V DD 2 IQH = Quiescent current in the high state D = Duty cycle IQL = Quiescent current in the low state VDD = MOSFET driver supply voltage CAPACITIVE LOAD DISSIPATION The power dissipation caused by a capacitive load is a direct function of frequency, total capacitive load, and supply voltage. The power lost in the MOSFET driver for a complete charging and discharging cycle of a MOSFET is shown in Equation 4-2. QUIESCENT POWER DISSIPATION 4.5.3 OPERATING POWER DISSIPATION The operating power dissipation occurs each time the MOSFET driver output transitions because, for a very short period of time, both MOSFETs in the output stage are on simultaneously. This cross-conduction current leads to a power dissipation described in Equation 4-4. Where: f = Switching frequency CT = Total load capacitance VDD = MOSFET driver supply voltage EQUATION 4-4: P CC = CC f V DD Where: CC 2007-2013 Microchip Technology Inc. = Cross-conduction constant (A * sec) f = Switching frequency VDD = MOSFET driver supply voltage DS20002052C-page 11 MCP1401/02 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 5-Lead SOT-23 Example Standard Markings for SOT-23 Part Number MCP1401T-E/OT MCP1402T-E/OT Legend: XX...X Y YY WW NNN e3 * Note: DS20002052C-page 12 Code GYNN GZNN GYNN Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2007-2013 Microchip Technology Inc. MCP1401/02 /HDG3ODVWLF6PDOO2XWOLQH7UDQVLVWRU 27 >627@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ b N E E1 3 2 1 e e1 D A2 A c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icrochip Technology Inc. DS20002052C-page 13 MCP1401/02 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20002052C-page 14 2007-2013 Microchip Technology Inc. MCP1401/02 APPENDIX A: REVISION HISTORY Revision C (September 2013) The following is the list of modifications: 1. 2. 3. Updated values for Electrostatic Discharge (ESD) protection in the Section "General Description". Updated package drawings in Section 5.0 "Packaging Information". Updated ROH and ROL numbers in the "DC Characteristics (Over Operating Temperature Range)" table. Revision B (December 2007) The following is the list of modifications: 1. 2. Updated the low supply current values. Updated Section 5.1 "Package Marking Information". Revision A (June 2007) * Original Release of this Document. 2007-2013 Microchip Technology Inc. DS20002052C-page 15 MCP1401/02 NOTES: DS20002052C-page 16 2007-2013 Microchip Technology Inc. MCP1401/02 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X X Device Tape & Reel Range XX Temperature Package Range Device: MCP1401: 500 mA MOSFET Driver, Inverting MCP1402: 500 mA MOSFET Driver, Non-Inverting Tape and Reel: T = Tape and Reel Temperature Range: E Package: * OT = Plastic Thin Small Outline Transistor (OT), 5-Lead = Examples: a) MCP1401T-E/OT: 500 mA Inverting MOSFET Driver, 5LD SOT-23 package. a) MCP1402T-E/OT 500 mA Non-Inverting MOSFET Driver, 5LD SOT-23 package. -40C to +125C * All package offerings are Pb Free (Lead Free) DS20002052C-page 17 2007-2013 Microchip Technology Inc. MCP1401/02 NOTES: DS20002052C-page 18 2007-2013 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. 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Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2007-2013, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-62077-467-0 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2007-2013 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS20002052C-page 19 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 China - Hangzhou Tel: 86-571-2819-3187 Fax: 86-571-2819-3189 China - Hong Kong SAR Tel: 852-2943-5100 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 India - Pune Tel: 91-20-3019-1500 Japan - Osaka Tel: 81-6-6152-7160 Fax: 81-6-6152-9310 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Japan - Tokyo Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 Taiwan - Kaohsiung Tel: 886-7-213-7828 Fax: 886-7-330-9305 Taiwan - Taipei Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 DS20002052C-page 20 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 08/20/13 2007-2013 Microchip Technology Inc.