NLX2G86MUTCG - ON Semiconductor

April, 2009 − Rev. 0

1Publication Order Number:

NLX2G86/D

NLX2G86

Dual 2-Input Exclusive-OR

Gate

The NLX2G86 is a high performance dual 2−input Exclusive−OR

Gate operating from a 1.65 V to 5.5 V supply.

Features

•Extremely High Speed: tPD 2.4 ns (typical) at VCC = 5.0 V

•Designed for 1.65 V to 5.5 V VCC Operation

•Over Voltage Tolerant Inputs and Outputs

•LVTTL Compatible − Interface Capability With 5.0 V TTL Logic

with VCC = 3.0 V

•LVCMOS Compatible

•24 mA Balanced Output Sink and Source Capability

•Near Zero Static Supply Current Substantially Reduces System

Power Requirements

•Replacement for NC7WZ86

•This is a Pb−Free Device

A2 Y2

Figure 1. Pinout (Top View) Figure 2. Logic Symbol

= 1 Y1

Input

FUNCTION TABLE

Output

Y = A + B

VCC

GND

Y1 B2 A2

PIN ASSIGNMENT

Function

GND

VCC

See detailed ordering and shipping information in the package

dimensions section on page 4 of this data sheet.

ORDERING INFORMATION

MARKING

DIAGRAM

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UQFN8

MU SUFFIX

CASE 523AN

AC= Device Code

M = Date Code*

G= Pb−Free Package

(Note: Microdot may be in either location)

AC MG

NLX2G86

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MAXIMUM RATINGS

Symbol Parameter Value Unit

VCC DC Supply Voltage *0.5 to )7.0 V

VIDC Input Voltage *0.5 to )7.0 V

VODC Output Voltage *0.5 to )7.0 V

IIK DC Input Diode Current VI < GND *50 mA

IOK DC Output Diode Current VO < GND *50 mA

IODC Output Sink Current $50 mA

ICC DC Supply Current per Supply Pin $100 mA

IGND DC Ground Current per Ground Pin $100 mA

TSTG Storage Temperature Range *65 to )150 _C

TLLead Temperature, 1 mm from Case for 10 Seconds 260 _C

TJJunction Temperature under Bias )150 _C

qJA Thermal Resistance (Note 1) TBD _C/W

PDPower Dissipation in Still Air at 85_CTBD mW

MSL Moisture Sensitivity Level 1

FRFlammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in

VESD ESD Withstand Voltage Human Body Model (Note 2)

Machine Model (Note 3)

Charged Device Model (Note 4)

> 2000

> 200

N/A

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace with no air flow.

2. Tested to EIA/JESD22−A114−A.

3. Tested to EIA/JESD22−A115−A.

4. Tested to JESD22−C101−A.

RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Max Unit

VCC Supply Voltage Operating

Data Retention Only

1.65

1.5

5.5

VIInput Voltage (Note 5) 0 5.5 V

VOOutput Voltage (HIGH or LOW State) 0 5.5 V

TAOperating Free−Air Temperature *40 )125 _C

Dt/DVInput Transition Rise or Fall Rate VCC = 1.8 V $0.15 V

VCC = 2.5 V $0.2 V

VCC = 3.0 V $0.3 V

VCC = 5.0 V $0.5 V

ns/V

5. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level.

NLX2G86

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DC ELECTRICAL CHARACTERISTICS

Symbol Parameter

VCC

(V)

TA = 255C*405C v TA v 855C

Unit Condition

Min Typ Max Min Max

VIH High−Level Input

Voltage

1.65 to 1.95

2.3 to 5.5

0.75 VCC

0.7 VCC

0.75 VCC

0.7 VCC

VIL Low−Level Input

Voltage

1.65 to 1.95

2.3 to 5.5

0.25 VCC

0.3 VCC

0.25 VCC

0.3 VCC

VOH High−Level Output

Voltage

VIN = VIH

1.65

1.8

2.3

3.0

4.5

1.55

1.7

2.2

2.9

4.4

1.65

1.8

2.3

3.0

4.5

1.55

1.7

2.2

2.9

4.4

VIOH = −100 mA

1.65

2.3

3.0

4.5

1.29

1.9

2.4

2.3

3.8

1.52

2.15

2.80

2.68

4.20

1.29

1.9

2.4

2.3

3.8

V IOH = −4 mA

IOH = −8 mA

IOH = −16 mA

IOH = −24 mA

IOH = −32 mA

VOL Low−Level Output

Voltage

VIN = VIL

1.65

1.8

2.3

3.0

4.5

0.0

0.1

VIOL = 100 mA

1.65

2.3

3.0

4.5

0.08

0.10

0.15

0.22

0.24

0.30

0.40

0.55

0.24

0.30

0.40

0.55

V IOL = 4 mA

IOL = 8 mA

IOL = 16 mA

IOL = 24 mA

IOL = 32 mA

IIN Input Leakage Current 0 to 5.5 $1.0 $1.0 mA0 V v VIN v 5.5 V

IOFF Power Off Leakage

Current

0.0 1.0 10 mAVIN or VOUT = 5.5 V

ICC Quiescent Supply

Current

1.65 to 5.5 1.0 10 mAVIN = 5.5 V, GND

AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns

VCC TA = 25_C*40_C v TA v 125_C

Symbol Parameter Condition (V) Min Typ Max Min Max Unit

tPLH

tPHL

Propagation Delay

(Figure 3 and 4)

RL = 1 MW, CL = 15 pF 1.8 $0.15 2.0 7.9 9.0 2.0 10.5 ns

RL = 1 MW, CL = 15 pF 2.5 $0.2 1.2 4.1 7.0 1.2 7.5

RL = 1 MW, CL = 15 pF 3.3 $0.3 0.8 3.0 4.8 0.8 5.2

RL = 500 W, CL = 50 pF 1.2 3.8 5.4 1.2 5.9

RL = 1 MW, CL = 15 pF 5.0 $0.5 0.5 2.2 3.5 0.5 3.8

RL = 500 W, CL = 50 pF 0.8 2.9 4.2 1.0 4.6

CAPACITIVE CHARACTERISTICS

Symbol Parameter Condition Typical Unit

CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC 2.5 pF

CPD Power Dissipation Capacitance

(Note 6)

10 MHz, VCC = 3.3 V, VI = 0 V or VCC 9 pF

10 MHz, VCC = 5.5 V, VI = 0 V or VCC 11

6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.

Average operating current can be obtained by the equation: ICC(OPR) = CPD  VCC  fin + ICC. CPD is used to determine the no−load dynamic

power consumption; PD = CPD  VCC2  fin + ICC  VCC.

NLX2G86

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Figure 3. Switching Waveform

INPUT

RLCL

A 1−MHz square input wave is recommended for

propagation delay tests.

Figure 4. Test Circuit

tf = 3 ns

VCC

GND

VOH

VOL

90%

50%

10%

50%

tPLH

tPHL

OUTPUT Y

INPUT

A and B

tf = 3 ns

90%

50%

10%

50%

OUTPUT

VCC or GND

DEVICE ORDERING INFORMATION

Device Order Number Package Type Tape and Reel Size†

NLX2G86MUTCG UQFN8

(Pb−Free)

3000 Units / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

NLX2G86

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PACKAGE DIMENSIONS

UQFN8

MU SUFFIX

CASE 523AN−01

ISSUE O

ÉÉÉ

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.30 mm FROM THE TERMINAL TIP.

BOTTOM VIEW

0.10 B

0.05

CNOTE 3

0.10 C

PIN ONE

REFERENCE

TOP VIEW

0.10 C

(A3)

0.05 C

CSEATING

PLANE

SIDE VIEW

DIM MIN MAX

MILLIMETERS

A0.45 0.60

A1 0.00 0.05

A3 0.13 REF

b0.15 0.25

D1.60 BSC

L1 −−− 0.15

E1.60 BSC

e0.50 BSC

L0.35 0.45

DETAIL A

ÇÇÇ

ÉÉÉ

DETAIL B

OPTIONAL

MOLD CMPD

EXPOSED Cu

CONSTRUCTION

OPTIONAL

CONSTRUCTION

DETAIL B

DETAIL A

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

PITCH

0.35

DIMENSIONS: MILLIMETERS

0.25

1.70

0.50

L3 0.25 0.35

(0.10) (0.15)

0.53

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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

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NLX2G86/D

PUBLICATION ORDERING INFORMATION

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USA/Canada

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Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5773−3850

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