CMOS, 1.8 V to 5.5 V/±2.5 V, 3 Ω
Low Voltage 4-/8-Channel Multiplexers
Data Sheet
ADG708/ADG709
FEATURES
1.8 V to 5.5 V single supply
±2.5 V dual supply
3 Ω on resistance
0.75 Ω on resistance flatness
100 pA leakage currents
14 ns switching times
Single 8-to-1 multiplexer ADG708
Differential 4-to-1 multiplexer ADG709
16-lead TSSOP package
Low power consumption
TTL-/CMOS-compatible inputs
Qualified for automotive applications
APPLICATIONS
Data acquisition systems
Communication systems
Relay replacement
Audio and video switching
Battery-powered systems
GENERAL DESCRIPTION
The ADG708/ADG709 are low voltage, CMOS analog
multiplexers comprising eight single channels and four
differential channels, respectively. The ADG708 switches one of
eight inputs (S1 to S8) to a common output, D, as determined
by the 3-bit binary address lines A0, A1, and A2. The ADG709
switches one of four differential inputs to a common differential
output as determined by the 2-bit binary address lines A0 and
A1. An EN input on both devices is used to enable or disable
the device. When disabled, all channels are switched off.
Low power consumption and an operating supply range of
1.8 V to 5.5 V make the ADG708/ADG709 ideal for battery-
powered, portable instruments. All channels exhibit break-
before-make switching action preventing momentary shorting
when switching channels.
These switches are designed on an enhanced submicron process
that provides low power dissipation yet gives high switching
speed, very low on resistance, and leakage currents.
On resistance is in the region of a few ohms and is closely matched
between switches and very flat over the full signal range. These parts
can operate equally well as either multiplexers or demultiplexers
and have an input signal range that extends to the supplies.
FUNCTIONAL BLOCK DIAGRAMS
S1
S8
A0
D
A1 A2
ADG708
EN
1 OF 8
DECODER
00041-001
Figure 1.
S1A
A0
DA
S4A
S1B
S4B DB
EN
ADG709
1 OF 4
DECODER
A1
00041-002
Figure 2.
PRODUCT HIGHLIGHTS
1. Single-/dual-supply operation. The ADG708/ADG709 are
fully specified and guaranteed with 3 V and 5 V single-supply
and ±2.5 V dual-supply rails.
2. Low RON (3 Ω typical).
3. Low power consumption (<0.01 μW).
4. Guaranteed break-before-make switching action.
5. Small 16-lead TSSOP package.
The ADG708/ADG709 are available in a 16-lead TSSOP.
Rev. E Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2000–2014 Analog Devices, Inc. All rights reserved.
Technical Support www.analog.com
ADG708/ADG709 Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagrams ............................................................. 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Dual Supply ................................................................................... 7
Absolute Maximum Ratings ............................................................ 9
ESD Caution .................................................................................. 9
Pin Configurations and Function Descriptions ......................... 10
Truth Tables................................................................................. 11
Typical Performance Characteristics ........................................... 12
Test Circuits ..................................................................................... 15
Terminology .................................................................................... 18
Applications Information .............................................................. 19
Power Supply Sequencing ......................................................... 19
Outline Dimensions ....................................................................... 20
Ordering Guide .......................................................................... 20
Automotive Products ................................................................. 20
REVISION HISTORY
9/14−Rev. D to Rev. E
Changes to Ordering Guide .......................................................... 20
1/13−Rev. C to Rev. D
Changes to Ordering Guide .......................................................... 20
4/09−Rev. B to Rev. C
Changes to Table 1 ............................................................................ 3
Changes to Table 2 ............................................................................ 5
Changes to Table 3 ............................................................................ 7
Moved Truth Tables Section .......................................................... 11
Changes to Figure 7, Figure 8, and Figure 9................................ 12
Changes to Figure 13 and Figure 14 ............................................. 13
Moved Terminology Section ......................................................... 18
Changes to Ordering Guide .......................................................... 20
8/06−Rev. A to Rev. B
Updated Format .................................................................. Universal
Changes to Absolute Maximum Ratings Section .......................... 9
Added Table 7 and Table 8 ............................................................ 10
Updated Outline Dimensions ....................................................... 18
Changes to Ordering Guide .......................................................... 18
4/02—Rev. 0 to Rev. A
Edits to Features and Product Highlights ...................................... 1
Change to Specifications ............................................................. 2–4
Edits to Absolute Maximum Ratings Notes ................................... 5
Edits to TPCs 2, 5, 6–9, 11, and 15 ............................................. 7–9
Edits to Test Circuits 9 and 10 ...................................................... 11
Addition of Test Circuit 11 ............................................................ 11
10/00—Revision 0: Initial Version
Rev. E | Page 2 of 20
Data Sheet ADG708/ADG709
SPECIFICATIONS
VDD = 5 V ± 10%, VSS = 0 V, GND = 0 V, unless otherwise noted.
Table 1.
B Version C Version
Parameter +25°C
−40°C to
+85°C
−40°C to
+125°C +25°C
−40°C to
+85°C
−40°C to
+125°C Unit
Test Conditions/
Comments
ANALOG SWITCH
Analog Signal Range 0 V to
VDD
0 V to
VDD
0 V to
VDD
V
On Resistance (RON) 3 3 Ω typ VS = 0 V to VDD, IDS = 10 mA;
see Figure 20
4.5 5 7 4.5 5 7 Ω max
On Resistance Match
Between Channels (ΔRON)
0.4 0.4 Ω typ
0.8
1.5
0.8
1.5
Ω max
V
S
= 0 V to V
DD
, I
DS
= 10 mA
On Resistance Flatness
(RFL AT (ON))
0.75 0.75 Ω typ VS = 0 V to VDD, IDS = 10 mA
1.2 1.65 1.2 1.65 Ω max
LEAKAGE CURRENTS VDD = 5.5 V
Source Off Leakage, IS (Off ) ±0.01 ±0.01 nA typ VD = 4.5 V/1 V, VS = 1 V/4.5 V;
see Figure 21
±20 ±20 ±0.1 ±0.3 ±1 nA max
Drain Off Leakage, ID (Off ) ±0.01 ±0.01 nA typ VD = 4.5 V/1 V, VS = 1 V/4.5 V;
see Figure 22
±20 ±20 ±0.1 ±0.75 ±6 nA max
Channel On Leakage, ID, IS (On) ±0.01 ±0.01 nA typ VD = VS = 1 V or 4.5 V;
see Figure 23
±20 ±20 ±0.1 ±0.75 ±6 nA max
DIGITAL INPUTS
Input High Voltage, VINH 2.4 2.4 V min
Input Low Voltage, VINL 0.8 0.8 V max
Input Current
IINL or IINH 0.005 0.005 μA typ VIN = VINL or VINH
±0.1 ±0.1 μA max
Digital Input Capacitance, CIN 2 2 pF typ
DYNAMIC CHARACTERISTICS1
tTRANSITION 14 14 ns typ RL = 300 Ω, CL = 35 pF;
see Figure 24
25 25 25 25 ns max VS1 = 3 V/0 V, VS8 = 0 V/3 V
Break-Before-Make Time
Delay, tOPEN
8
ns typ
R
L
= 300 Ω, C
L
= 35 pF
1 1 1 1 ns min VS = 3 V; see Figure 25
tON (EN) 14 14 ns typ RL = 300 Ω, CL = 35 pF
25 25 25 25 ns max VS = 3 V; see Figure 26
tOFF (EN) 7 7 ns typ RL = 300 Ω, CL = 35 pF
12 12 12 12 ns max VS = 3 V; see Figure 26
Charge Injection ±3 ±3 pC typ VS = 2.5 V, RS = 0 Ω,
CL = 1 nF; See Figure 27
Off Isolation −60 −60 dB typ RL = 50 Ω, CL = 5 pF, f = 10 MHz
−80 −80 dB typ RL = 50 Ω, CL = 5 pF,
f = 1 MHz; see Figure 28
Rev. E | Page 3 of 20
ADG708/ADG709 Data Sheet
B Version C Version
Parameter +25°C
−40°C to
+85°C
−40°C to
+125°C +25°C
−40°C to
+85°C
−40°C to
+125°C Unit
Test Conditions/
Comments
Channel-to-Channel
Crosstalk
−60 −60 dB typ RL = 50 Ω, CL = 5 pF,
f = 10 MHz
−80 −80 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 29
−3 dB Bandwidth 55 55 MHz typ RL = 50 Ω, CL = 5 pF;
see Figure 30
C
S
(Off )
13
pF typ
f = 1 MHz
CD (Off )
ADG708 85 85 pF typ f = 1 MHz
ADG709 42 42 pF typ f = 1 MHz
CD, CS (On)
ADG708 96 96 pF typ f = 1 MHz
ADG709 48 48 pF typ f = 1 MHz
POWER REQUIREMENTS VDD = 5.5 V
IDD 0.001 0.001 μA typ Digital inputs = 0 V or 5.5 V
1.0 1.0 1.0 1.0 μA max
1 Guaranteed by design, not subject to production test.
Rev. E | Page 4 of 20
Data Sheet ADG708/ADG709
VDD = 3 V ± 10%, VSS = 0 V, GND = 0 V, unless otherwise noted.
Table 2.
B Version C Version
Parameter +25°C
−40°C to
+85°C
−40°C to
+125°C +25°C
−40°C to
+85°C
−40°C to
+125°C Unit
Test Conditions/
Comments
ANALOG SWITCH
Analog Signal Range 0 V to
VDD
0 V to
VDD
V
On Resistance (RON) 8 8 Ω typ VS = 0 V to VDD, IDS = 10 mA;
see Figure 20
11
12
14
11
12
14
Ω max
On Resistance Match Between
Channels (ΔRON)
0.4 0.4 Ω typ VS = 0 V to VDD,
IDS = 10 mA
1.2 2 1.2 2 Ω max
LEAKAGE CURRENTS VDD = 3.3 V
Source Off Leakage, IS (Off) ±0.01 ±0.01 nA typ VS = 3 V/1 V, VD = 1 V/3 V;
see Figure 21
±20
±20
±0.1
±0.3
±1
nA max
Drain Off Leakage, I
D
(Off )
±0.01
±0.01
nA typ
V
S
= 3 V/1 V, V
D
= 1 V/3 V;
see Figure 22
±20 ±20 ±0.1 ±0.75 ±6 nA max
Channel On Leakage, ID, IS (On) ±0.01 ±0.01 nA typ VS = VD = 1 V or 3 V;
see Figure 23
±20 ±20 ±0.1 ±0.75 ±6 nA max
DIGITAL INPUTS
Input High Voltage, VINH 2.0 2.0 V min
Input Low Voltage, VINL 0.8 0.8 V max
Input Current
IINL or IINH 0.005 0.005 μA typ VIN = VINL or VINH
±0.1 ±0.1 μA max
Digital Input Capacitance, CIN 2 2 pF typ
DYNAMIC CHARACTERISTICS1
tTRANSITION 18 18 ns typ RL = 300 Ω, CL = 35 pF;
see Figure 24
30 30 30 30 ns max VS1 = 2 V/0 V, VS2 = 0 V/2 V
Break-Before-Make Time
Delay, tOPEN
8 8 ns typ RL = 300 Ω, CL = 35 pF
1 1 1 1 ns min VS = 2 V; see Figure 25
tON (EN) 18 18 ns typ RL = 300 Ω, CL = 35 pF
30 30 30 30 ns max VS = 2 V; see Figure 26
t
OFF
(EN)
8
8
ns typ
R
L
= 300 Ω, C
L
= 35 pF
15 15 15 15 ns max VS = 2 V; see Figure 26
Charge Injection ±3 ±3 pC typ VS = 1.5 V, RS = 0 Ω,
CL = 1 nF; see Figure 27
Off Isolation −60 −60 dB typ RL = 50 Ω, CL = 5 pF,
f = 10 MHz
−80
−80
dB typ
R
L
= 50 Ω, C
L
= 5 pF,
f = 1 MHz; see Figure 28
Channel-to-Channel Crosstalk −60 −60 dB typ RL = 50 Ω, CL = 5 pF,
f = 10 MHz
−80 −80 dB typ RL = 50 Ω, CL = 5 pF,
f = 1 MHz; see Figure 29
−3 dB Bandwidth 55 55 MHz typ RL = 50 Ω, CL = 5 pF;
see Figure 30
Rev. E | Page 5 of 20
ADG708/ADG709 Data Sheet
B Version C Version
Parameter +25°C
−40°C to
+85°C
−40°C to
+125°C +25°C
−40°C to
+85°C
−40°C to
+125°C Unit
Test Conditions/
Comments
CS (Off ) 13 13 pF typ f = 1 MHz
CD (Off )
ADG708 85 85 pF typ f = 1 MHz
ADG709 42 42 pF typ f = 1 MHz
CD, CS (On)
ADG708 96 96 pF typ f = 1 MHz
ADG709
48
48
pF typ
f = 1 MHz
POWER REQUIREMENTS VDD = 3.3 V
I
DD
0.001
0.001
μA typ
Digital inputs = 0 V or 3.3 V
1.0
1.0
1.0
1.0
μA max
1 Guaranteed by design, not subject to production test.
Rev. E | Page 6 of 20
Data Sheet ADG708/ADG709
DUAL SUPPLY
VDD = 2.5 V ± 10%, VSS = –2.5 V ± 10%, GND = 0 V, unless otherwise noted.
Table 3.
B Version C Version
Parameter +25°C
−40°C to
+85°C
−40°C to
+125°C +25°C
−40°C to
+85°C
−40°C to
+125°C Unit
Test Conditions/
Comments
ANALOG SWITCH
Analog Signal Range VSS to VDD VSS to VDD V
On Resistance (RON) 2.5 2.5 Ω typ VS = VSS to VDD, IDS = 10 mA;
see Figure 20
4.5 5 7 4.5 5 7 Ω max
On Resistance Match Between
Channels (ΔR
ON
)
0.4 0.4 Ω typ
0.8
1.5
0.8
1.5
Ω max
V
S
= V
SS
to V
DD
, I
DS
= 10 mA
On Resistance Flatness (RFL AT (ON)) 0.6 0.6 Ω typ VS = VSS to VDD, IDS = 10 mA
1.0 1.65 1.0 1.65 Ω max
LEAKAGE CURRENTS VDD = +2.75 V, VSS = −2.75 V
Source Off Leakage, IS (Off) ±0.01 ±0.01 nA typ VS = +2.25 V/−1.25 V,
VD = −1.25 V/+2.25 V;
see Figure 21
±20 ±20 ±0.1 ±0.3 ±1 nA max
Drain Off Leakage, ID (Off ) ±0.01 ±0.01 nA typ VS = +2.25 V/−1.25 V,
VD = −1.25 V/+2.25 V;
see Figure 22
±20 ±20 ±0.1 ±0.75 ±6 nA max
Channel On Leakage, ID, IS (On) ±0.01 ±0.01 nA typ VS = VD = +2.25 V/−1.25 V;
see Figure 23
±20
±20
±0.1
±0.75
±6
nA max
DIGITAL INPUTS
Input High Voltage, VINH 1.7 1.7 V min
Input Low Voltage, VINL 0.7 0.7 V max
Input Current
IINL or IINH 0.005 0.005 μA typ VIN = VINL or VINH
±0.1 ±0.1 μA max
Digital Input Capacitance, CIN 2 2 pF typ
DYNAMIC CHARACTERISTICS1
tTRANSITION 14 14 ns typ RL = 300 Ω, CL = 35 pF;
see Figure 24
25
25
25
25
ns max
V
S
= 1.5 V/0 V; see Figure 24
Break-Before-Make Time Delay,
tOPEN
8 8 ns typ RL = 300 Ω, CL = 35 pF
1 1 1 1 ns min VS = 1.5 V; see Figure 25
tON (EN) 14 14 ns typ RL = 300 Ω, CL = 35 pF
25 25 25 25 ns max VS = 1.5 V; see Figure 26
t
OFF
(EN)
8
8
ns typ
R
L
= 300 Ω, C
L
= 35 pF
15 15 15 15 ns max VS = 1.5 V; see Figure 26
Charge Injection ±3 ±3 pC typ VS = 0 V, RS = 0 Ω, CL = 1 nF;
see Figure 27
Off Isolation −60 −60 dB typ RL = 50 Ω, CL = 5 pF,
f = 10 MHz
−80 −80 dB typ RL = 50 Ω, CL = 5 pF,
f = 1 MHz; see Figure 28
Rev. E | Page 7 of 20
ADG708/ADG709 Data Sheet
B Version C Version
Parameter +25°C
−40°C to
+85°C
−40°C to
+125°C +25°C
−40°C to
+85°C
−40°C to
+125°C Unit
Test Conditions/
Comments
Channel-to-Channel Crosstalk −60 −60 dB typ RL = 50 Ω, CL = 5 pF,
f = 10 MHz
−80 −80 dB typ RL = 50 Ω, CL = 5 pF,
f = 1 MHz; see Figure 29
−3 dB Bandwidth 55 55 MHz typ RL = 50 Ω, CL = 5 pF;
see Figure 30
C
S
(Off )
13
13
pF typ
f = 1 MHz
CD (Off )
ADG708 85 85 pF typ f = 1 MHz
ADG709 42 42 pF typ f = 1 MHz
CD, CS (On)
ADG708 96 96 pF typ f = 1 MHz
ADG709 48 48 pF typ f = 1 MHz
POWER REQUIREMENTS VDD = 2.75 V
IDD 0.001 0.001 μA typ Digital inputs = 0 V or 2.75 V
1.0 1.0 1.0 1.0 μA max
ISS 0.001 0.001 μA typ VSS = −2.75 V
1.0 1.0 1.0 1.0 μA max Digital inputs = 0 V or 2.75 V
1 Guaranteed by design not subject to production test.
Rev. E | Page 8 of 20
Data Sheet ADG708/ADG709
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter Rating
VDD to VSS 7 V
VDD to GND −0.3 V to +7 V
VSS to GND +0.3 V to −3.5 V
Analog Inputs1 VSS − 0.3 V to VDD + 0.3 V
or 30 mA, whichever
occurs first
Digital Inputs
1
−0.3 V to V
DD
+ 0.3 V or
30 mA, whichever
occurs first
Peak Current, S or D (Pulsed at 1 ms,
10% Duty Cycle Maximum)
100 mA
Continuous Current, S or D 30 mA
Operating Temperature
Industrial Temperature Range −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
TSSOP Package, Power Dissipation 432 mW
θJA Thermal Impedance 150.4°C/W
θJC Thermal Impedance 27.6°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
1 Overvoltages at A, EN, S, or D are clamped by internal codes. Current should
be limited to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating can be applied at any one time.
ESD CAUTION
Rev. E | Page 9 of 20
ADG708/ADG709 Data Sheet
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
A0
EN
S2
S3
S4
VSS
S1
D
A1
A2
S5
S6
S7
GND
VDD
S8
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
ADG708
TOP VIEW
(No t t o Scal e)
00041-003
Figure 3. ADG708 Pin Configuration
A0
EN
S2A
S3A
S4A
V
SS
S1A
DA
A1
GND
S2B
S3B
S4B
V
DD
S1B
DB
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
ADG709
TOP VIEW
(No t t o Scal e)
00041-004
Figure 4. ADG709 Pin Configuration
Table 5. ADG708 Pin Function Descriptions
Pin No. Mnemonic Description
1 A0 Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 7).
2 EN Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 7).
3 VSS Most Negative Power Supply Pin in Dual-Supply Applications. For single-supply applications, it should be tied to GND.
4
S1
Source Terminal. Can be an input or output.
5 S2 Source Terminal. Can be an input or output.
6 S3 Source Terminal. Can be an input or output.
7 S4 Source Terminal. Can be an input or output.
8 D Drain Terminal. Can be an input or output.
9 S8 Source Terminal. Can be an input or output.
10 S7 Source Terminal. Can be an input or output.
11 S6 Source Terminal. Can be an input or output.
12 S5 Source Terminal. Can be an input or output.
13 VDD Most Positive Power Supply Pin.
14 GND Ground (0 V) Reference.
15 A2 Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 7).
16 A1 Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 7).
Table 6. ADG709 Pin Function Descriptions
Pin No. Mnemonic Description
1 A0 Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 8).
2 EN Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 8).
3 VSS Most Negative Power Supply Pin in Dual-Supply Applications. For single-supply applications, it should be tied to GND.
4
S1A
Source Terminal. Can be an input or output.
5 S2A Source Terminal. Can be an input or output.
6 S3A Source Terminal. Can be an input or output.
7 S4A Source Terminal. Can be an input or output.
8 DA Drain Terminal. Can be an input or output.
9 DB Drain Terminal. Can be an input or output.
10 S4B Source Terminal. Can be an input or output.
11 S3B Source Terminal. Can be an input or output.
12 S2B Source Terminal. Can be an input or output.
13 S1B Source Terminal. Can be an input or output.
14 VDD Most Positive Power Supply Pin.
15 GND Ground (0 V) Reference.
16 A1 Digital Input. Controls the configuration of the switch, as shown in the truth table (see Table 8).
Rev. E | Page 10 of 20
Data Sheet ADG708/ADG709
TRUTH TABLES
Table 7. ADG708 Truth Table
A2 A1 A0 EN Switch Condition
X
1
X
1
X
1
0
None
0 0 0 1 1
0 0 1 1 2
0 1 0 1 3
0 1 1 1 4
1 0 0 1 5
1 0 1 1 6
1 1 0 1 7
1 1 1 1 8
1 X = Don’t care.
Table 8. ADG709 Truth Table
A1 A0 EN On Switch Pair
X1 X1 0 None
0 0 1 1
0
1
1
2
1 0 1 3
1 1 1 4
1 X = Don’t care.
Rev. E | Page 11 of 20
ADG708/ADG709 Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
V
D
OR V
S
– DRAIN O R S OURCE V OL TAG E ( V )
8T
A
= 25°C
V
SS
= 0V
7
6
5
4
3
2
1
0
ON RES ISTANCE ( Ω)
V
DD
= 2.7V
V
DD
= 3.3V
V
DD
= 4.5V
V
DD
= 5.5V
0 1 2 34 5
00041-005
Figure 5. On Resistance as a Function of VD (VS) for Single Supply
8
–3.0
7
6
5
4
3
2
0–2.5 –2.0 –1.5 –1.0 –0.5 1.0 1.5 2.0 2.5 3.00.5
0
1VDD = + 2.75V
VSS = –2.75V
ON RES ISTANCE ( Ω)
VD OR VS – DRAIN OR SOURCE V OL TAG E ( V )
TA = 25°C
VDD = + 2.25V
VSS = –2.25V
00041-006
Figure 6. On Resistance as a Function of VD (VS) for Dual Supply
0 1 2 3 4 5
7
6
5
4
3
2
1
0
+85°C
+25°C
+125°C
–40°C
VDD = 5V
VSS = 0V
8
ON RES ISTANCE ( Ω)
VD OR VS – DRAIN OR SOURCE V OL TAG E ( V )
00041-007
Figure 7. On Resistance as a Function of VD (VS) for Different Temperatures,
Single Supply
+85°C
–40°C
VDD = 3V
VSS = 0V
7
6
5
4
3
2
1
0
8
00.5 1.0 1.5 2.0 3.02.5
VD OR VS – DRAIN OR SOURCE V OL TAG E ( V )
+25°C
+125°C
00041-008
ON RES ISTANCE ( Ω)
Figure 8. On Resistance as a Function of VD (VS) for Different Temperatures,
Single Supply
ON RES ISTANCE ( Ω)
5
4
3
2
1
0
V
DD
= +2. 5V
V
SS
= –2.5V
+85°C
–40°C
+125°C
6
–2.5 –2.0 –1.5 –1.0 00.5 1.0 1.5 2.0–0.5 –2.5
V
D
OR V
S
– DRAIN O R S OURCE V OL TAG E ( V )
00041-009
+25°C
Figure 9. On Resistance as a Function of VD (VS) for Different Temperatures,
Dual Supply
0 1 2 3 4 5
V
S
, (V
D
= V
DD
– V
S
) (V)
0.12
CURRENT (nA)
0.08
0.04
0
–0.04
–0.08
–0.12
I
D
(O N)
I
S
(OFF)
I
D
(OFF)
V
DD
= 5V
V
SS
= 0V
T
A
= 25°C
00041-010
Figure 10. Leakage Currents as a Function of VD (VS)
Rev. E | Page 12 of 20
Data Sheet ADG708/ADG709
V
D
, (V
S
= V
DD
– V
D
) (V)
00.5
0.12
CURRENT (nA)
1.0 1.5 2.0 3.0
0.08
0.04
0
–0.04
–0.08
–0.12 2.5
V
DD
= 3V
V
SS
= 0V
T
A
= 25°C
I
S
(OFF)
I
D
(O N)
I
D
(OFF)
00041-011
Figure 11. Leakage Currents as a Function of VD (VS)
–3.0
0.12
CURRENT (nA)
0.08
0.04
0
–0.04
–0.08
–0.12 –2.5 –2.0 –1.5 –1.0 00.5 1.0 1.5 2.0 2.5
I
S
(OFF) I
D
(OFF)
–0.5 3.0
V
S
, (V
D
= V
DD
– V
S
) (V)
I
D
(ON), V
S
= V
D
V
DD
= +2. 5V
V
SS
= –2.5V
T
A
= 25°C
00041-012
Figure 12. Leakage Currents as a Function of VD (VS)
00041-013
0
020 40 60 80 100 120
CURRENT (nA)
TEMPERAT URE ( °C)
0.05
0.10
0.15
0.20
0.25
0.30
0.35 V
DD
= +5V
V
SS
= 0V
AND
V
DD
= +2. 5V
V
SS
= –2.5V
I
D
(OFF) I
S
(OFF)
I
D
(O N)
Figure 13. Leakage Currents as a Function of Temperature
00041-014
0
020 40 60 80 100 120
CURRENT (nA)
TEMPERAT URE ( °C)
0.05
0.10
0.15
0.20
0.25
0.30
0.35 V
DD
= +3V
I
D
(OFF)
I
S
(OFF)
I
D
(O N)
Figure 14. Leakage Currents as a Function of Temperature
FREQUENCY ( Hz )
10m
10
CURRENT (A)
1m
100µ
10µ
1µ
100n
10n
1n 10M1M10k 100k1k100
T
A
= 25° C
V
DD
= +3V
V
DD
= +5V
V
DD
= +2. 5V
V
SS
= –2.5V
00041-015
Figure 15. Supply Current vs. Input Switching Frequency
FREQUENCY ( Hz )
0
ATTENUAT IO N ( dB)
–20
–40
–60
–80
–100
–120
30k 100M10M100k 1M
V
DD
= 5V
T
A
= 25° C
00041-016
Figure 16. Off Isolation vs. Frequency
Rev. E | Page 13 of 20
ADG708/ADG709 Data Sheet
FREQUENCY ( Hz )
0
30k
ATTENUAT IO N ( dB)
–20
–40
–60
–80
–100
–120 100M10M100k 1M
VDD = 5V
TA = 25° C
00041-017
Figure 17. Crosstalk vs. Frequency
100M10M100k 1M
FREQUENCY ( Hz )
0
30k
ATTENUAT IO N ( dB)
–5
–10
–15
–20
VDD = 5V
TA = 25° C
00041-018
Figure 18. On Response vs. Frequency
VOLTAGE (V)
–3
20
Q
INJ
(p C)
–1 12 5
T
A
= 25° C
10
0
–10
–20
–40 3
–30
40
–2
V
DD
= +2. 5V
V
SS
= –2.5V
V
DD
= +3V
V
SS
= 0V
V
DD
= +5V
V
SS
= 0V
00041-019
Figure 19. Charge Injection vs. Source Voltage
Rev. E | Page 14 of 20
Data Sheet ADG708/ADG709
TEST CIRCUITS
R
ON
= V1/ I
DS
V
S
V1
I
DS
D
S
00041-020
Figure 20. On Resistance
A
0.8V
D
I
S
(OFF) S1
S2
S8 EN
GND
V
S
V
D
V
SS
V
DD
V
SS
V
DD
00041-021
Figure 21. IS (OFF)
V
S
A
0.8V
DI
D
(OFF)
V
SS
V
DD
V
SS
V
DD
S1
S2
S8 EN
GND
V
D
00041-022
Figure 22. ID (OFF)
VS
VSS
VDD
A
2.4V
DID(ON)
S1
S8
EN
GND
VD
VSS
VDD
00041-023
Figure 23. ID (ON)
V
SS
V
DD
V
SS
V
DD
V
S8
3V
50%
t
TRANSITION
90%
90%
ADDRESS
DRIVE (V
IN
)50%
0V
V
S1
V
OUT
t
TRANSITION
A2
D
*SIM IL AR CONNECTI ON F OR ADG 709.
A1
A0
EN GND
ADG708*
S1
S8
S2 TO S7
V
IN
2.4V
50Ω
VS1
VS8
RL
300Ω
CL
35pF
VOUT
00041-024
Figure 24. Switching Time of Multiplexer, tTRANSITION
tOPEN
3V
80% 80%
ADDRESS
DRIVE (VIN)
0V
VOUT
A2
D
*SIM IL AR CONNECTI ON F OR ADG 709.
A1
A0
EN GND
ADG708*
S1
S8
S2 TO S7
VIN
2.4V
50Ω
VDD
VDD VSS
VSS
VS
RL
300Ω
CL
35pF
VOUT
00041-025
Figure 25. Break-Before-Make Delay, tOPEN
Rev. E | Page 15 of 20
ADG708/ADG709 Data Sheet
OUTPUT
3V
50%
ENABLE
DRIVE (V
IN
)50%
0V
V
O
t
ON
(EN)
0V
0.9V
O
0.9V
O
t
OFF
(EN)
A2
D
*SIM IL AR CONNECTI ON F OR ADG 709.
A1
A0
EN GND
ADG708*
S1
S2 TO S8
V
IN
35pF
V
DD
V
SS
V
DD
V
SS
V
S
300Ω
R
L
C
L
V
OUT
50Ω
00041-026
Figure 26. Enable Delay, tON (EN), tOFF (EN)
LOGIC INPUT
(VIN)
3V
0V
VOUT
QINJ = CL×ΔVOUT
A2
VOUT
VDD
D
A1
A0
EN
GND
ADG708*
CL
1nF
VDD
S
VIN
RS
VSS
VSS
VS
*SIM IL AR CONNECTI ON F OR ADG 709.
ΔVOUT
00041-027
Figure 27. Charge Injection
V
S
V
OUT
50Ω
NETWORK
ANALYZER
R
L
50Ω
GND
S
D
V
S
OFF ISOLATION = 20 log V
OUT
0.1µF
V
DD
A2
A1
A0
EN
2.4V
0.1µF
V
SS
V
DD
V
SS
50Ω
00041-028
Figure 28. Off Isolation
*SIM IL AR CONNECTI ON F OR ADG 709. VOUT
VS
A2
D
A1
A0
EN
GND
ADG708*
S1
S2
S8
2.4V
NETWORK
ANALYZER
NETWORK
ANALYZER
R
L
50Ω
V
OUT
0.1µF 0.1µF
V
DD
V
SS
V
DD
V
SS
50Ω
V
S
50Ω
00041-029
CHANNEL-TO-CHANNEL CROSSTAL K = 20 lo g
Figure 29. Channel-to-Channel Crosstalk
Rev. E | Page 16 of 20
Data Sheet ADG708/ADG709
0.1µF 0.1µF
VS
VOUT
50Ω
NETWORK
ANALYZER
RL
50Ω
GND
S
D
VOUT WITH SWITCH
VOUT WITHOUT SWITCH
INSERTION LOSS = 20 log
VDD
A2
A1
A0
EN
2.4V
VSS
VDD VSS
00041-030
Figure 30. Bandwidth
Rev. E | Page 17 of 20
ADG708/ADG709 Data Sheet
TERMINOLOGY
VDD
Most positive power supply potential.
VSS
Most negative power supply in a dual-supply application. In
single-supply applications, tie VSS to ground at the device.
GND
Ground (0 V) reference.
S
Source terminal. Can be an input or output.
D
Drain terminal. Can be an input or output.
Ax
Logic control input.
EN
Active high enable.
RON
Ohmic resistance between D and S.
RFLAT (ON)
Flatness is defined as the difference between the maximum and
minimum value of on resistance as measured over the specified
analog signal range.
IS (Off)
Source leakage current with the switch off.
ID (Off)
Drain leakage current with the switch off.
ID, IS (On)
Channel leakage current with the switch on.
VD (VS)
Analog voltage on Terminal D and Terminal S.
CS (Off)
Off switch source capacitance. Measured with reference to ground.
CD (Off)
Off switch drain capacitance. Measured with reference to ground.
CD, CS (On)
On switch capacitance. Measured with reference to ground.
CIN
Digital input capacitance.
tTRANSITION
Delay time measured between the 50% and 90% points of the
digital inputs and the switch on condition when switching from
one address state to another.
tON (EN)
Delay time between the 50% and 90% points of the EN digital
input and the switch on condition.
tOFF (EN)
Delay time between the 50% and 90% points of the EN digital
input and the switch off condition.
tOPEN
Off time measured between the 80% points of both switches
when switching from one address state to another.
Off Isolation
A measure of unwanted signal coupling through an off switch.
Crosstalk
A measure of unwanted signal that is coupled through from one
channel to another as a result of parasitic capacitance.
Charge
A measure of the glitch impulse transferred from injection of
the digital input to the analog output during switching.
Bandwidth
The frequency at which the output is attenuated by 3 dB.
On Response
The frequency response of the on switch.
On Loss
The loss due to the on resistance of the switch.
VINL
Maximum input voltage for Logic 0.
VINH
Minimum input voltage for Logic 1.
IINL (IINH)
Input current of the digital input.
IDD
Positive supply current.
ISS
Negative supply current.
Rev. E | Page 18 of 20
Data Sheet ADG708/ADG709
APPLICATIONS INFORMATION
POWER SUPPLY SEQUENCING
When using CMOS devices, take care to ensure correct power
supply sequencing. Incorrect power supply sequencing can
result in the device being subjected to stresses beyond the
maximum ratings listed in Figure 4.
Always apply digital and analog inputs after power supplies and
ground. For single-supply operation, tie VSS to GND as close to
the device as possible.
Rev. E | Page 19 of 20
ADG708/ADG709 Data Sheet
OUTLINE DIMENSIONS
16 9
81
PIN 1
SEATING
PLANE
8°
0°
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX 0.20
0.09 0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COM PLI ANT T O JEDE C S TANDARDS M O-153- AB
Figure 31. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ORDERING GUIDE
Model1, 2 Temperature Range Package Description Package Option
ADG708BRU −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG708BRU-REEL −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG708BRU-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG708BRUZ −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG708BRUZ-REEL −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG708BRUZ-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG708CRU −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG708CRUZ −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG708CRUZ-REEL −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG708CRUZ-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADW54008-0REEL7 −40°C to +105°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG709BRU −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG709BRU-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG709BRUZ −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG709BRUZ-REEL −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG709BRUZ-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG709CRUZ −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG709CRUZ-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
1 Z = RoHS Compliant Part.
2 W = Qualified for Automotive Applications.
AUTOMOTIVE PRODUCTS
The ADW54008 models are available with controlled manufacturing to support the quality and reliability requirements of automotive
applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers
should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in
automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to
obtain the specific Automotive Reliability reports for these models.
©2000–2014 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D00041-0-9/14(E)
Rev. E | Page 20 of 20