MAX1709 4A, Low-Noise, High-Frequency,
Step-Up DC-DC Converter
Maxim Integrated | 12www.maximintegrated.com
Approximate equations for the MAX1709 internal loss
terms are as follows. Values in {} are example values for
a 3.3V input, 4V output, 4A design:
PD(MAX1709) = PSW + PTRAN + PCAP {1.35W}
where:
PSW = (1 - D’) x ISW2x RSW {1.08W}
PTRAN = (VOUT + VD) x ISW x
tSW x f / 3 {0.18W}
PCAP = (CDIO + CDSW + CGSW) x
(VOUT + VD)2f {0.09W}
where:
D’ = duty factor of the n-channel switch =
VIN / (VOUT + VD) {0.6}
(Note: D’ = 1 means the switch is always off)
ISW, the approximate peak switch current =
IOUT / (D’ x eff), {8.23A}
(with eff. estimated at 81%)
RSW = Internal n-channel switch
resistance {0.04W)
(estimate for elevated die temperature)
VD= forward voltage of the external
rectifier {0.5V}
tSW = the transition time of the
n-channel switch {20ns}
f = the switching rate of the MAX1709 {600kHz}
CDIO = rectifier capacitance {1nF}
CDSW = internal n-channel drain
capacitance {2.5nF}
CGSW = internal n-channel gate
capacitance {1.5nF}
Applications Information
Using a Momentary On/Off Switch
A momentary pushbutton switch can be used to turn
the MAX1709 on and off. As shown in Figure 5, when
ONA is pulled low and ONB is pulled high, the part is
off. When the momentary switch is pressed, ONB is
pulled low and the regulator turns on. The switch
should be on long enough for the microcontroller to exit
reset. The controller issues a logic high to ONA, which
guarantees that the part will stay on regardless of the
subsequent switch state. To turn the regulator off, press
the switch long enough for the controller to read the
switch status and pull ONA low. When the switch is
released, ONB pulls high and the regulator turns off.
Layout Considerations
The MAX1709ESE and MAX1709EUI+ both utilize PC
board area for heatsinking. Package dissipation ratings
in the
Absolute Maximum Ratings
section assume 1in2
of 1oz copper.
The MAX1709EUI+ has superior power-dissipating ability
due to an exposed metal pad on the underside of the
package. The thermal resistance from the die to the
exposed pad is a very low 1.2°C/W. The MAX1709ESE’s
ability to dissipate power will especially depend on the
PC board design. Typical thermal resistance for 1in2of
copper is 34°C/W. For tighter layouts, 0.5in2typically
exhibits 40°C/W. Adding multiple vias under the
MAX1709EUI+ to conduct heat to the bottom of the board
will also help dissipate power.
Due to high inductor current levels and fast switching
waveforms, proper PC board layout is essential. Protect
sensitive analog grounds by using a star ground con-
figuration. Connect PGND, the input bypass capacitor
ground lead, and the output filter capacitor ground lead
to a single point (star ground configuration). In addition,
minimize trace lengths to reduce stray capacitance and
trace resistance, especially from the LX pins to the
catch diode (D1) and output capacitors (C6 and C7) to
PGND pins. If an external resistor-divider is used to set
the output voltage (Figure 4), the trace from FB to the
resistors must be extremely short and must be shielded
from switching signals, such as CLK or LX. Refer to a
layout example in the MAX1709EVKIT data sheet.
Package Information
For the latest package outline information and land patterns (foot-
prints), go to www.maximintegrated.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but the
drawing pertains to the package regardless of RoHS status.