PLA140
www.clare.com 5
R06
MECHANICAL DIMENSIONS
Dimensions
mm
(inches)
PCB Hole Pattern
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
0.254 ± 0.0127
(0.010 ± 0.0005)
9.144 ± 0.508
(0.360 ± 0.020)
7.239 TYP
(0.285 TYP)
7.620 ± 0.254
(0.300 ± 0.010)
3.302 ± 0.051
(0.130 ± 0.002) 4.064 TYP
(0.160 TYP)
0.457 ± 0.076
(0.018 ± 0.003)
8.382 ± 0.381
(0.330 ± 0.015) 2.54 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
1.651 ± 0.254
(0.065 ± 0.010)
RoHS
2002/95/EC e3
Pb
Manufacturing Information
All plastic encapsulated semiconductor packages are
susceptible to moisture ingression. Clare classified
all of its plastic encapsulated devices for moisture
sensitivity according to the latest version of the joint
industry standard, IPC/JEDEC J-STD-020 in force
at the time of product evaluation. We test all of our
products to the maximum conditions set forth in the
standard, and guarantee proper operation of our
devices when handled according to the limitations
and information in that standard as well as to any
limitations set forth in the information or standards
referenced below.
Failure to adhere to the warnings or limitations as
established by the listed specifications could result in
reduced product performance, reduction of operable
life, and/or reduction of overall reliability.
Moisture Sensitivity
This product is rated Moisture Sensitivity Level 1
(MSL 1), and should be handled according to the
requirements of the latest version of the joint industry
standard IPC/JEDEC J-STD-033.
ESD Sensitivity
This product is ESD Sensitive, and should be
handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature rating
of 250ºC for a maximum of 30 seconds. All other
guidelines of J-STD-020 must be observed.
Board Wash
Clare recommends the use of no-clean flux
formulations. However, board washing to remove flux
residue is acceptable. Since Clare employs the use of
silicone coating as an optical waveguide in many of its
optically isolated products, the use of a short drying
bake could be necessary if a wash is used after solder
reflow processes. Chlorine- or Fluorine-based solvents
or fluxes should not be used. Cleaning methods that
employ ultrasonic energy should not be used.