© Semiconductor Components Industries, LLC, 2003
August, 2018 − Rev. 9 1Publication Order Number:
SM05T1/D
SM05T1GSeries
ESD Protection Diode Array
Dual Common Anode
These dual monolithic silicon surge protection diodes are designed
for applications requiring transient overvoltage protection capability.
They are intended for u s e i n v olta ge a nd ESD s ensitive equipment s uch
as computers, printers, business machines, communication systems,
medical equipment and other applications. Their d ual junction common
anode design protects t wo s eparate l ines u sing only o ne p ackage. These
devices are ideal for situations where board space is at a premium.
Specification Features:
•SOT−23 Package Allows Either Two Separate Unidirectional
Configurations or a Single Bidirectional Configuration
•Working Peak Reverse Voltage Range − 5.0 V to 36 V
•Peak Power − 300 Watt (8/20 ms)
•Low Leakage − 1.0 mA
•Flammability Rating UL 94 V−0
•SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
•These are Pb−Free Devices
Mechanical Characteristics:
CASE: Void-Free, Transfer-Molded, Thermosetting Plastic Case
FINISH: Corrosion Resistant Finish, Easily Solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
Available in 8 mm Tape and Reel
Use the Device Number to Order the 7 Inch/3,000 Unit Reel
Replace the “T1” with “T3” in the Device Number to Order the
13 Inch/10,000 Unit Reel
www.onsemi.com
SOT−23
CASE 318
STYLE 12
13
2
PIN 1. CATHODE
2. CATHODE
3. ANODE
MARKING DIAGRAM
Device Package Shipping†
ORDERING INFORMATION
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer t o our Tape and Reel Packaging Specification
s
Brochure, BRD8011/D.
SM05T1G SOT−23
(Pb−Free) 3,000/Tape & Reel
SM12T1G SOT−23
(Pb−Free) 3,000/Tape & Reel
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
1
xxM MG
G
xxM = Device Code
xx = 05, 12, 15, 24, 36
M = Date Code*
G= Pb−Free Package
(Note: Microdot may be in either location)
SM15T1G SOT−23
(Pb−Free) 3,000/Tape & Reel
SM24T1G SOT−23
(Pb−Free) 3,000/Tape & Reel
SM36T1G SOT−23
(Pb−Free) 3,000/Tape & Reel
SZSM05T1G SOT−23
(Pb−Free) 3,000/Tape & Reel
SM05T1G Series
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2
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Power Dissipation @ 20 ms (Note 1) @ TL ≤ 25°CPpk 300 W
IEC 61000−4−2 (ESD)
Air
Contact ±15
±26
kV
IEC 61000−4−4 (EFT) 40 A
IEC 61000−4−5 (Lightning) 12 A
Total Power Dissipation on FR−5 Board (Note 2) @ TA = 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient
°PD°
RqJA
225
1.8
556
°mW°
mW/°C
°C/W
Total Power Dissipation on Alumina Substrate (Note 3) @ TA = 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient
°PD
RqJA
300
2.4
417
°mW
mW/°C
°C/W
Junction and Storage Temperature Range TJ, Tstg − 55 to +150 °C
Lead Solder Temperature − Maximum (10 Second Duration) TL260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be af fected.
1. Non−repetitive current pulse per Figure 3
2. FR−5 = 1.0 x 0.75 x 0.62 in.
3. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina
NOTE: Other voltages may be available upon request
ELECTRICAL CHARACTERISTICS
UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or 2 and 3)
Symbol Parameter
IPP Maximum Reverse Peak Pulse Current
VCClamping Voltage @ IPP
VRWM Working Peak Reverse Voltage
IRMaximum Reverse Leakage Current @ VRWM
VBR Breakdown Voltage @ IT
ITTest Current
QVBR Maximum Temperature Coefficient of VBR
IFForward Current
VFForward Voltage @ IF
ZZT Maximum Zener Impedance @ IZT
IZK Reverse Current
ZZK Maximum Zener Impedance @ IZK Uni−Directional
IPP
IF
V
I
IR
IT
VRWM
VCVBR VF
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Device* Device
Marking
VRWM IR @ VRWM
VBR, Breakdown Voltage IT
VC @
IPP =
1 Amp Max IPP
(Note 4)
Typical
Capacitance
(Volts) (pF)
(Volts) (mA) Min Max mA (Volts) (Amps) Pin 1 to 3
@ 0 Volts
SM05T1G 05M 5 10 6.2 7.3 1.0 9.8 17 225
SM12T1G 12M 12 1.0 13.3 15.75 1.0 19 12 95
SM15T1G 15M 15 1.0 16.7 19.6 1.0 24 10 100
SM24T1G 24M 24 1.0 26.7 31.35 1.0 43 5.0 60
SM36T1G 36M 36 1.0 40.0 46.95 1.0 60 4.0 45
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. 8/20 ms pulse waveform per Figure 3
*Include SZ-prefix devices where applicable.
SM05T1G Series
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3
TYPICAL CHARACTERISTICS
0.1 10
10
Figure 1. Non−Repetitive Peak Pulse Power
versus Pulse Time
1tp, PULSE DURATION (ms)
100 1000
1
0.1
0.01
Figure 2. Steady State Power Derating Curve
PPP, PEAK PULSE POWER (kW)
0 25 50 75 100 125 150 175
300
250
200
150
100
50
0
TEMPERATURE (°C)
FR−5 BOARD
ALUMINA SUBSTRATE
PD, POWER DISSIPATION (mW)
100
Figure 3. 8/20 ms Pulse Waveform Figure 4. Typical Diode Capacitance (SM05)
01 524
250
130
90
BIAS VOLTAGE (VOLTS)
90
80
70
60
50
40
30
20
10
0020406080
t, TIME (ms)
tP
tr
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
HALF VALUE IRSM/2 @ 20 ms
% OF PEAK PULSE CURRENT
PEAK VALUE IRSM @ 8 ms
C, CAPACITANCE (pF)
210
170
Figure 5. Typical Diode Capacitance (SM12)
015812
100
90
40
30
20
10
0
BIAS VOLTAGE (VOLTS)
C, CAPACITANCE (pF)
80
70
60
50
3
SM05T1G Series
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4
TYPICAL COMMON ANODE APPLICATIONS
A quad junction common anode design in a SOT−23
package protects four separate lines using only one package.
This adds flexibility and creativity to PCB design especially
when board space is at a premium. Two simplified examples
of surge protection applications are illustrated below.
KEYBOARD
TERMINAL
PRINTER
ETC.
FUNCTIONAL
DECODER
I/O
A
SM05T1G
Series
GND
Computer Interface Protection
B
C
D
Microprocessor Protection
I/O
RAM ROM
CLOCK
CPU
CONTROL BUS
ADDRESS BUS
DATA BUS
GND
VGG
VDD
SM05T1
Series
SM05T1G
Series
SOT−23 (TO−236)
CASE 318−08
ISSUE AS
DATE 30 JAN 2018
SCALE 4:1
D
A1
3
12
1
XXXMG
G
XXX = Specific Device Code
M = Date Code
G= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
GENERIC
MARKING DIAGRAM*
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
SOLDERING FOOTPRINT
VIEW C
L
0.25
L1
e
EE
b
A
SEE VIEW C
DIM
A
MIN NOM MAX MIN
MILLIMETERS
0.89 1.00 1.11 0.035
INCHES
A1 0.01 0.06 0.10 0.000
b0.37 0.44 0.50 0.015
c0.08 0.14 0.20 0.003
D2.80 2.90 3.04 0.110
E1.20 1.30 1.40 0.047
e1.78 1.90 2.04 0.070
L0.30 0.43 0.55 0.012
0.039 0.044
0.002 0.004
0.017 0.020
0.006 0.008
0.114 0.120
0.051 0.055
0.075 0.080
0.017 0.022
NOM MAX
L1
H
STYLE 22:
PIN 1. RETURN
2. OUTPUT
3. INPUT
STYLE 6:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
STYLE 7:
PIN 1. EMITTER
2. BASE
3. COLLECTOR
STYLE 8:
PIN 1. ANODE
2. NO CONNECTION
3. CATHODE
STYLE 9:
PIN 1. ANODE
2. ANODE
3. CATHODE
STYLE 10:
PIN 1. DRAIN
2. SOURCE
3. GATE
STYLE 11:
PIN 1. ANODE
2. CATHODE
3. CATHODE−ANODE
STYLE 12:
PIN 1. CATHODE
2. CATHODE
3. ANODE
STYLE 13:
PIN 1. SOURCE
2. DRAIN
3. GATE
STYLE 14:
PIN 1. CATHODE
2. GATE
3. ANODE
STYLE 15:
PIN 1. GATE
2. CATHODE
3. ANODE
STYLE 16:
PIN 1. ANODE
2. CATHODE
3. CATHODE
STYLE 17:
PIN 1. NO CONNECTION
2. ANODE
3. CATHODE
STYLE 18:
PIN 1. NO CONNECTION
2. CATHODE
3. ANODE
STYLE 19:
PIN 1. CATHODE
2. ANODE
3. CATHODE−ANODE
STYLE 23:
PIN 1. ANODE
2. ANODE
3. CATHODE
STYLE 20:
PIN 1. CATHODE
2. ANODE
3. GATE
STYLE 21:
PIN 1. GATE
2. SOURCE
3. DRAIN
STYLE 1 THRU 5:
CANCELLED
STYLE 24:
PIN 1. GATE
2. DRAIN
3. SOURCE
STYLE 25:
PIN 1. ANODE
2. CATHODE
3. GATE
STYLE 26:
PIN 1. CATHODE
2. ANODE
3. NO CONNECTION
STYLE 27:
PIN 1. CATHODE
2. CATHODE
3. CATHODE
2.10 2.40 2.64 0.083 0.094 0.104
HE
0.35 0.54 0.69 0.014 0.021 0.027
c
0−−− 10 0 −−− 10
T°°°°
T
3X
TOP VIEW
SIDE VIEW
END VIEW
2.90
0.80
DIMENSIONS: MILLIMETERS
0.90
PITCH
3X
3X 0.95
RECOMMENDED
STYLE 28:
PIN 1. ANODE
2. ANODE
3. ANODE
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
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SOT−23 (TO−236)
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