ASMT-YTB0-0xxxx
PLCC-6 Surface Mount Tricolor LED
Data Sheet
CAUTION:LEDs are Class 1C ESD sensitive. Please observe appropriate precautions during
handling and processing. Please refer to Avago Application Note AN-1142 for additional details.
Description
This family of SMT LEDs packaged in the form of PLCC-
6 with separate heat path for each LED dice, enabling it
to be driven at higher current. This SMT LEDs have high
brightness and reliability performance and are designed
to work under a wide range of environmental conditions.
This high reliability feature makes them ideally suited to
be used under exterior and interior full color sign applica-
tion conditions.
To facilitate easy pick & place assembly, the LEDs are
packed in EIA-compliant tape and reel. Every reel will be
shipped in single intensity and color bin; except red color
to provide close uniformity.
These LEDs are compatible with reflow soldering process.
This super wide viewing angle at 115° together with the
built in reflector pushing up the intensity of the light out-
put makes these LED suitable to be used in the interior
electronics signs. The black top surface of the LED pro-
vides better contrast enhancement especially in the full
color sign application.
Features
• Industry Standard PLCC-6 package (Plastic Leaded Chip
Carrier) with individual addressable pin-out for higher
flexibility of driving configuration
• High reliability LED package with silicone encapsulation
• High brightness using AlInGaP and InGaN dice
technologies
• Wide viewing angle at 115°
• Compatible with reflow soldering process
• JEDEC MSL 2a
• Water-Resistant (IPX6*) per IEC 60529:2001
* The test is conducted on component level by mounting the
components on PCB with proper potting to protect the leads. It is
strongly recommended that customers perform necessary tests
on the components for their final application.
Applications
• Indoor and outdoor full color display
2
4.00±0.20
4.40±0.20
3.70±0.20
4.40±0.20
0.65 0.80
Red
Green
Blue
0.9±0.2
1.35
3.50±0.20
1
2
3
4
5
6
1
2
3
4
5
6
0.90±0.20 2.60±0.20
3.90
3.40
PIN 1
Table 1. Device Selection Guide
Part Number Color 1 Color 2 Color 3
ASMT-YTB0-0xxxx AlInGaP Red InGaN Green InGaN Blue
Part Number
Color 1 - Red Color 2 - Green Color 3 - Blue
Min. Iv @20mA Typ. Iv @20mA Min. Iv @ 20mA Typ. Iv @ 20mA Min. Iv @ 20mA Typ. Iv @ 20mA
Bin ID (mcd) (mcd) Bin ID (mcd) (mcd) Bin ID (mcd) (mcd)
ASMT-YTB0-0AA02 U1 450 648 V2 900 1243 S2 224 238
Notes:
1. The luminous intensity IV, is measured at the mechanical axis of the LED package. The actual peak of the spatial radiation pattern may not be
aligned with this axis.
2. Tolerance = ± 12 %
Notes:
1. All Dimensions are in millimeters
2. Tolerance = ±0.2 mm unless otherwise specified
3. Terminal Finish: Ag plating
4. Encapsulantion material: silicone resin
Lead Configuration
1 Cathode Blue
2 Cathode Green
3 Cathode Red
4 Anode Red
5 Anode Green
6 Anode Blue
Figure 1. Package drawing.
Package Dimensions
3
Part Numbering System
A S M T –Y T B 0– X1 X2 X3X4 X5
Packaging Option
Color Bin Selection
Intensity Bin Limit
Intensity Bin Selection
Device Specification Configuration
Table 2. Absolute Maximum Ratings (TA = 25°C)
Parameter Red Green & Blue Unit
DC forward current [1] 50 30 mA
Peak forward current [2] 100 100 mA
Power dissipation 120 117 mW
Reverse voltage 4V[3] V
Maximum junction temperature Tj max 125 °C
Operating temperature range - 40 to + 110[4] °C
Storage temperature range - 40 to + 110 °C
Note:
1. Derate linearly as shown in Figure 5a & 5b.
2 Duty Factor = 0.5%, Frequency = 500Hz
3. Driving the LED in reverse bias condition is suitable for short term only
4 Refer to Figure 5a and figure 5b for more information
Table 3. Optical Characteristics (TA = 25°C)
Color
Dominant
Wavelength,
λd (nm) [5]
Peak
Wavelength,
λp (nm)
Viewing
Angle
2θ½[6] (Degrees)
Luminous
Efficac
ηV[7] (lm/W)
Luminous
Efficiency
ηe (lm/W)
Total Flux / Luminous
Intensity [8]
ΦV / IV (lm/cd)
Min Typ. Max Typ. Typ. Typ. Typ. Typ.
Red 618 621 628 629 115 200 40 2.60
Green 525 528 535 521 115 530 50 2.60
Blue 465 470 475 465 115 70 10 2.60
Notes:
5. The dominant wavelength is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
6. θ½ is the off axis angle where the luminous intensity is ½ the peak intensity
7. Radiant intensity, Ie in watts / steradian, may be calculated from the equation Ie = IV / ηV, where IV is the luminous intensity in candelas and ηV is
the luminous efficacy in lumens / watt.
8. ΦV is the total luminous flux output as measured with an integrating sphere at mono pulse condition.
4
Table 4. Electrical Characteristics (TA = 25°C)
Color
Forward Voltage,
VF (V) [1]
Reverse Voltage
VR @ 100µA
Reverse Voltage
VR @ 10µA
Min Typ. Max. Min. Min.
Red 1.80 2.10 2.40 4 -
Green 2.80 3.20 3.90 - 4
Blue 2.80 3.20 3.90 - 4
Note:
1. Tolerance ± 0.1V.
0.0
0.2
0.4
0.6
0.8
1.0
380 430 480 530 580 630 680 730 780
WAVELENGTH - nm
RELATIVE INTENSITY
AlInGaP RedInGaN Green
InGaN Blue
0
5
10
15
20
25
30
35
40
45
50
0 1 2 3 4
FORWARD VOLTAGE - V
FORWARD CURRENT – mA
AlInGaP
InGaN
0.00
0.50
1.00
1.50
2.00
2.50
3.00
0 10 20 30 40 50 60
DC FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZATION AT 20 mA)
InGaN
AlInGaP
Figure 2. Relative intensity vs. wavelength Figure 3. Forward current vs. forward voltage
Figure 4. Relative Intensity vs. forward current
5
-3
-2
-1
0
1
2
3
4
5
6
7
0 10 20 30 40 50
FORWARD CURRENT - mA
DOMINANT WAVELENGTH SHIFT
(NORMALIZED AT 20mA) - nm
Green
Blue Red
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREES
NORMALIZED INTENSIT Y
RED
GREEN
BLUE 0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREES
NORMALIZED INTENSIT Y
RED
GREEN
BLUE
0
10
20
30
40
50
60
0 20 40 60 80 100 120
AMBIENT TEMPERATURE (°C)
MAX. ALLOWABLE DC CURRENT (mA)
InGaN
0
10
20
30
40
50
60
0 20 40 60 80 100 120
AMBIENT TEMPERATURE (°C)
MAX. ALLOWABLE DC CURRENT (mA)
InGaN
AlInGaPAlInGaP
Figure 5a. Maximum forward current vs. ambient temperature.
Derated based on TJMAX = 125°C.(3 chips)
Figure 5b. Maximum forward current vs. ambient temperature.
Derated based on TJMAX = 125°C. (single chip)
Figure 6. Dominant wavelength shift (normalized at 20mA) Figure 7a. Component Axis for Radiation Patterns
Figure 7b. Radiation Pattern for X axis Figure 7c. Radiation Pattern for Y axis
6
Figure 8. Relative Intensity vs Junction Temperature
0.1
1
10
-50 -25 0 25 50 75 100 125
T
J
- JUNCTION TEMPERATURE - °C
NORMALIZED LUMINOUS INTENSITY
-0.40
-0.30
-0.20
-0.10
0.00
0.10
0.20
0.30
-50 -25 0 25 50 75 100 125
T
J
- JUNCTION TEMPERATURE - °C
FORWARD VOLTAGE SHIFT - V
RED
GREEN
BLUE
RED
GREEN
BLUE
Reflow
soldering
direction
4.20 1.60
2.60
1.10
4.20
0.40
1.60
1.10
4.20
4.20
3.15 0.80 0.65 3.15
+ve
+ve
+ve
8.40
-ve
-ve
-ve
0.80
SOLDER MASK
H
L
Dimension of LxH should be > 3.9mm x 3.4mm
Figure 9. Forward Voltage vs Junction Temperature
Figure 10. Recommended soldering land pattern.
Figure 11. Recommended pick and place nozzle tip
7
Figure 12. Recommended leaded reflow soldering profile
240°C MAX.
20 SEC. MAX.
3°C/SEC.
MAX.
120 SEC. MAX.
TIME
TEMPERATURE
183°C
100-150°C
-6°C/SEC.
MAX.
60-150 SEC.
3°C/SEC. MAX. 217 °C
200 °C
60 - 120 SEC.
6 °C/SEC. MAX.
3 °C/SEC. MAX.
3 °C/SEC. MAX.
150 °C
255 - 260 °C
100 SEC. MAX.
10 to 30 SEC.
TIME
TEMPERATURE
8.00 ± 0.10
4.00 ± 0.10
1.75 ± 0.10
2.00 ± 0.05 Ø1.50 +0.10
Ø1.50 +0.25
0.32 ± 0.02
3.83 ± 0.10
4.85 ± 0.10
12.00 +0.30
-0.10
5.50 ± 0.05
Figure 13. Recommended Pb-free reflow soldering profile.
Note:
For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED
Indicator Components
Figure 14. Carrier Tape Dimension
8
Ø3.50±0.50
2.50±0.50
Label Area
2.30 2.30
330.0
Ø330.0+1.0
Ø99.5+1.0
Figure 15. Reel Dimension
Pin 1
Printed Label
Figure 16. Reeling Orientation
9
Intensity Bin Limits
Bin ID Min (mcd) Max (mcd)
S2 224.0 285.0
T1 285.0 355.0
T2 355.0 450.0
U1 450.0 560.0
U2 560.0 715.0
V1 715.0 900.0
V2 900.0 1125.0
W1 1125.0 1400.0
W2 1400.0 1800.0
X1 1800.0 2240.0
Tolerance of each bin limit ± 12%
Color Bin Limits
Red Min (nm) Max (nm)
Full distribution 618.0 628.0
Green Min (nm) Max (nm)
C 525.0 530.0
D 530.0 535.0
Blue Min (nm) Max (nm)
B 465.0 470.0
C 470.0 475.0
Tolerance of each bin limit is ± 1 nm
Intensity Bin Select (X2, X3)
Individual reel will contain parts from 1 half bin only
X2
Min Iv Bin (Minimum Intensity Bin)
Red Green Blue
0 0 0 0
A U1 V2 S2
X3
Number of Half bin from X2
Red Green Blue
0 0 0 0
A 4 4 4
Note: 0 represents no maximum bin limit
Color Bin Select (X4)
Individual Reel will contain part from 1 full bin only
X4
Color Bin Combinations
Red Green Blue
0 Full
distribution
C & D B & C
10
Packaging Option (X5)
Option Test Current Package Type Reel Size
2 20mA Top mount 13 inch
Note: Each reel contains 1000pcs LED
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0.80
0.90
0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80
X-COORDINATE
Y - COORDINATE
C
D
B
C
Red
Green
Blue
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved.
AV02-1095EN - September 11, 2009
Handling Precaution
The encapsulation material of the product is made of sili-
cone for better reliability of the product. As silicone is a
soft material, please do not press on the silicone or poke
a sharp object onto the silicone. These might damage the
product and cause premature failure. During assembly of
handling, the unit should be held on the body only. Please
refer to Avago Application Note AN 5288 for detail infor-
mation.
Moisture Sensitivity
This product is qualified as Moisture Sensitive Level 2a per
Jedec J-STD-020. Precautions when handling this moisture
sensitive product is important to ensure the reliability of
the product. Do refer to Avago Application Note AN5305
Handling of Moisture Sensitive Surface Mount Devices for
details.
A. Storage before use
• Unopen moisture barrier bag (MBB) can be stored at
<40°C/90%RH for 12 months. If the actual shelf life has
exceeded 12 months and the HIC indicates that baking
is not required, then it is safe to reflow the LEDs per the
original MSL rating.
• It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
B. Control after opening the MBB
• The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
• The LEDs must be kept at <30°C / 60%RH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 672 hours.
C. Control for unfinished reel
• For any unuse LEDs, they need to be stored in sealed
MBB with desiccant or desiccator at <5%RH.
D. Control of assembled boards
• If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB need to
be stored in sealed MBB with desiccant or desiccator
at <5%RH to ensure no LEDs have exceeded their floor
life of 672 hours
E. Baking is required if:
• “10%” or “15%” HIC indicator turns pink
• The LEDs are exposed to condition of >30°C / 60% RH
at any time.
• The Led floor life exceeded 672hrs.
Recommended baking condition: 60±5°C for 20hrs.
