1. General description
The GreenChip II is the second generation of green Switched Mode Power Supply
(SMPS) controller ICs. Its high level of integration allows the design of a cost effective
power supply with a very low number of external components.
The TEA1530(A) (TEA1530T, TEA1530AT and TEA1530AP) can be used in fixed
frequency converter designs for low voltage, high current applications. At low power
(standby) levels, the system operates in cycle skipping mode which minimizes the
switching losses during standby.
The proprietary high voltage BCD800 process makes direct start-up possible from the
rectified universal mains voltage in an effective and green way. A second low voltage
BICMOS IC is used for accurate, high speed protection functions and control.
The TEA1530(A) enables highly efficient and reliable supplies to be designed easily.
2. Features
2.1 Distinctive features
nUniversal mains supply operation, 70 VAC to 276 VAC.
nHigh level of integration, resulting in a very low external component count.
nFixed frequency operation.
2.2 Green features
nCycle skipping mode at very low loads; input power < 300 mW at no-load operation for
a typical adapter application.
nOn-chip start-up current source.
2.3 Protection features
nSafe restart mode for system fault conditions.
nUndervoltage protection (foldback during overload).
nIC OverTemperature Protection (OTP) (latched).
nLow and adjustable OverCurrent Protection (OCP) trip level.
nSoft (re)start.
nMains voltage-dependent operation-enabling level.
nTEA1530AT and TEA1530AP: General purpose input for latched or safe restart
protection and timing, e.g. to be used for OverVoltage Protection (OVP), output short
circuit protection or system OTP.
TEA1530T/AT/AP
GreenChip II SMPS control IC
Rev. 01 — 30 June 2008 Product data sheet
TEA1530T_AT_AP_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 30 June 2008 2 of 21
NXP Semiconductors TEA1530T/AT/AP
GreenChip II SMPS control IC
nTEA1530T: General purpose input for latched protection and timing, e.g. to be used for
OVP, output short circuit protection or system OTP.
3. Applications
nPrinter & LCD adapters / chargers / supplies. The device can, however, also be used in
all applications that demand an efficient and cost-effective solution up to 65 W.
4. Ordering information
Table 1: Ordering information
Type number Package
Name Description Version
TEA1530T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
TEA1530AT SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
TEA1530AP DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1
TEA1530T_AT_AP_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 30 June 2008 3 of 21
NXP Semiconductors TEA1530T/AT/AP
GreenChip II SMPS control IC
5. Block diagram
(1) Switch S3 is not controlled in TEA1530T, it is fixed as drawn.
Fig 1. Block diagram
TEA1530(A)
LEB
0.5 V
GND
014aaa164
SUPPLY
MANAGEMENT START-UP
CURRENT SOURCE
Vm
S1
internal
supply UVLO start
OSCILLATOR
LOGIC
SLOPE
COMPENSATION
Isc/t
Ich
1
5.6 V
0.63 V
control
detect
300
5.6 V 3 V protect
detect OVER-
TEMPERATURE
PROTECTION
S
R
Q
Q
3
PROTECT
CTRL
VCC
GND
VCC < 4.5 V
S
R
Q
Q
UVLO
LOGIC
Osc_Rdy
Duty_Max
Istartup(soft)
8
HVS
DRIVER 7
DRIVER
6
SENSE
5
2.5 V
S3
soft
start
S2
blank
1
2
4
POWER-ON
RESET
Idch
TEA1530T_AT_AP_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 30 June 2008 4 of 21
NXP Semiconductors TEA1530T/AT/AP
GreenChip II SMPS control IC
6. Pinning information
6.1 Pinning
6.2 Pin description
7. Functional description
The TEA1530(A) is the controller of a compact flyback converter, with the IC situated at
the primary side. An auxiliary winding of the transformer powers the IC after start-up;
see Figure 3.
Fig 2. Pin configuration: TEA1530T, TEA1530AT (SOT96-1), TEA1530AP (SOT97-1)
TEA1530AT
VCC DRAIN
GND HVS
P
ROTECT DRIVER
CTRL SENSE
001aad470
1
2
3
4
6
5
8
7
Table 2: Pin description
Symbol Pin Description
VCC 1 supply voltage
GND 2 ground
PROTECT 3 protection and timing input
CTRL 4 control input
SENSE 5 programmable current sense input
DRIVER 6 MOSFET gate driver output
HVS 7 High voltage spacer
DRAIN 8 High voltage rectified mains input for start-up current
TEA1530T_AT_AP_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 30 June 2008 5 of 21
NXP Semiconductors TEA1530T/AT/AP
GreenChip II SMPS control IC
The TEA1530(A) can operate in multi modes; see Figure 4.
Because of the fixed frequency mode, the internal oscillator determines the start of the
next converter stroke.
A cycle skipping mode is activated at very low power (standby) levels.
Fig 3. Typical configuration
Fig 4. Cycle skip and FF-CCM operation
1
2
3
4
VI
8
7
6
5
014aaa167
TEA1530(A)
CVCC
CVIN
014aaa166
fixed frequency
cycle
skip
P (W)
f
(kHz)
65
TEA1530T_AT_AP_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 30 June 2008 6 of 21
NXP Semiconductors TEA1530T/AT/AP
GreenChip II SMPS control IC
7.1 Start-up, mains enabling operation level and undervoltage lockout
Refer to Figure 8 and Figure 9. Initially, the IC is self supplying from the rectified mains
voltage via pin DRAIN. The supply capacitor CVCC (at pin 1) is charged by the internal
start-up current source to a level of about 4 V or higher, depending on the drain voltage.
Once the drain voltage exceeds the Vmains(oper)(en) (mains-dependent operation-enabling
level), the start-up current source will continue charging capacitor CVCC (switch S1 will be
opened), see Figure 1. The IC activates the power converter as soon as the voltage on
pin VCC passes the Vstartup level. At this moment the IC supply from the high voltage pin is
stopped (green function). The IC supply is taken over by the auxiliary winding of the
flyback converter.
The moment the voltage on pin VCC drops below Vth(UVLO) (undervoltage lockout), the IC
stops switching and performs a safe restart from the rectified mains voltage. In the safe
restart mode the driver output is disabled and the voltage on pin VCC is recharged via the
pin DRAIN.
7.2 Supply management
All (internal) reference voltages are derived from a temperature compensated, on-chip
band gap circuit.
7.3 Current control mode
Current control mode is used for its good line regulation behavior.
The primary current is sensed across an external resistor and compared with the internal
control voltage. The driver output is latched in the logic, preventing multiple switch-on.
The internal control voltage is inversely proportional to the voltage on the external
pin CTRL with an offset of 1.5 V. This means that a voltage range from 1 V to
approximately 1.5 V on pin CTRL will result in a pin SENSE voltage range from
0.52 V to 25 mV (a high external control voltage results in a low duty cycle).
7.4 Oscillator
The fixed frequency of the oscillator is set by an internal current source and capacitor.
Fig 5. The Vsense(max) voltage as a function of VCTRL
VCTRL (V)
1 V
(typ)
0.52 V
1.5 V
(typ)
coa016
Vsense(max) (V)
cycle
skip
active
25 mV
TEA1530T_AT_AP_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 30 June 2008 7 of 21
NXP Semiconductors TEA1530T/AT/AP
GreenChip II SMPS control IC
7.5 Cycle skipping
At very low power levels, a cycle skipping mode activates. An internal control voltage
(Vsense(max)) lower than 25 mV will inhibit switch-on of the external power MOSFET until
this voltage increases to a higher value; see Figure 5.
7.6 Continuous Conduction Mode (CCM)
The IC operates in Fixed Frequency Continuous Conduction Mode (FF CCM). Pin DRAIN
should be connected to the high voltage rectified mains VI; see Figure 8.
7.7 OverCurrent Protection (OCP)
The primary peak current in the transformer is measured accurately cycle-by-cycle using
the external sense resistor Rsense. The OCP circuit limits the voltage on pin SENSE to an
internal level equal to 1.5 V VCTRL (see also Section 7.3). The OCP detection is
suppressed during the leading edge blanking period, tleb to prevent false triggering caused
by the switch-on spikes.
7.8 Control pin protection
If pin CTRL becomes open-circuit or is disconnected, a fault condition is assumed and the
converter will stop switching immediately. Operation recommences when the fault
condition is removed.
7.9 Adjustable slope compensation
A slope compensation function has been added at pin CTRL; see Figure 6. The slope
compensation function prevents subharmonic oscillation in CCM at duty cycles over 50 %.
The CTRL voltage is modulated by sourcing a (non-constant) current out of pin CTRL and
by adding externally a series resistor Rslopecomp. This increases the CTRL voltage
proportionally with the on-time, which therefore limits the OCP level. A longer on-time
results in a higher CTRL voltage, this increase in CTRL voltage will decrease the on-time.
Slope compensation can be adjusted by changing the value of Rslopecomp. Slope
compensation prevents modulation of the on-time (duty cycle) while operating in FF CCM.
A possible drawback of subharmonic oscillation can be output voltage ripple.
TEA1530T_AT_AP_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 30 June 2008 8 of 21
NXP Semiconductors TEA1530T/AT/AP
GreenChip II SMPS control IC
7.10 Minimum and maximum on-time
The minimum on-time of the SMPS is determined by the LEB time (typically 400 ns). The
IC limits the maximum on-time by limiting the driver duty cycle to 70 %. So the maximum
on-time is correlated to the oscillator time which results in an accurate limit of the
minimum input voltage of the flyback converter.
7.11 PROTECT and timing input
The PROTECT input (pin 3) is a multipurpose, high-impedance input, which can be used
to switch off the IC and create a relatively long timing function. As soon as the voltage on
this pin rises above 2.5 V, switching stops immediately. For the timing function, a current of
typically 50 µA flows out of pin PROTECT and charges an external capacitor until the
activation level of 2.5 V is reached. This current source is only activated when the
converter is not in regulation, which is detected by the voltage on pin CTRL
(VCTRL < 0.63 V). A (small) discharge current is also implemented to ensure that the
capacitor is not charged, for example, by spikes. An internal MOSFET switch is added to
discharge the external capacitor and ensures a defined start situation. For the
TEA1530AP and TEA1530AT the voltage on pin CTRL determines whether the IC enters
latched protection mode or safe restart protection mode:
When the voltage on pin CTRL is below 0.63 V, the IC is assumed to be out of
regulation (e.g. the control loop is open). In this case activating pin PROTECT
(VPROTECT > 2.5 V) will cause the converter to stop switching. Once VCC drops below
Vth(UVLO), capacitor CVCC will be recharged and the supply will restart. This cycle will
be repeated until the fault condition is removed (safe restart mode).
When the voltage on pin CTRL is above 0.63 V, the output is assumed to be in
regulation. In this case activating pin PROTECT (VPROTECT > 2.5 V), by external
means, will activate the latch protection of the IC. The voltage on pin VCC will cycle
between Vstartup and Vth(UVLO), but the IC will not start switching again until the latch
Fig 6. Slope compensation
014aaa255
CTRL 1
0.63 V
control
detect
5.6 V
4
RCTRL
Rslopecomp
Isc/t
TEA1530T_AT_AP_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 30 June 2008 9 of 21
NXP Semiconductors TEA1530T/AT/AP
GreenChip II SMPS control IC
protection is reset. The latch is reset as soon as VCC drops below 4.5 V (typical value)
(this only occurs when the mains has been disconnected). The internal
overtemperature protection will also trigger this latch; see also Figure 1.
For the TEA1530T the IC always enters the latched mode protection independent of the
voltage on pin CTRL.
A voltage higher than 3 V on pin PROTECT will always latch the IC. This is independent of
the state of the IC.
7.12 OverTemperature Protection (OTP)
The IC provides accurate OTP. The IC stops switching when the junction temperature
exceeds the thermal shutdown temperature. When VCC drops to Vth(UVLO), capacitor CVCC
is recharged to the Vstartup level, however, switching will not restart. Subsequently, VCC will
drop again to Vth(UVLO).
Operation only recommences when VCC drops below a level of about 4.5 V, typically when
the mains voltage is disconnected for a short period.
7.13 Soft start-up (pin SENSE)
To prevent transformer rattle at start-up or during hiccup, the transformer peak current is
slowly increased by the soft start function. This can be achieved by inserting a resistor
and a capacitor between pin SENSE (pin 5) and sense resistor Rsense. An internal current
source charges the capacitor to VSENSE =I
startup(soft) ×Rss (about 0.5 V maximum).
The start level and the time constant of the increasing primary current level can be
adjusted externally by changing the values of Rss and Css.
The charging current Istartup(soft) will flow as long as the voltage on pin SENSE is
below approximately 0.5 V. If the voltage on pin SENSE exceeds 0.5 V, the soft start
current source will start limiting current Istartup(soft).AtV
startup, the Istartup(soft) current source
is completely switched off, see Figure 7.
Since the soft start current Istartup(soft) is supplied from pin DRAIN, the Rss value will not
affect VCC current during start-up.
I
DM Vsense max)( Istartup(soft) Rss
×()
Rsense
--------------------------------------------------------------------------------
=
τRss Css
×=
TEA1530T_AT_AP_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 30 June 2008 10 of 21
NXP Semiconductors TEA1530T/AT/AP
GreenChip II SMPS control IC
7.14 Driver
The driver circuit to the gate of the power MOSFET has a current sourcing capability of
typically 150 mA and a current sink capability of typically, 500 mA at VCC = 9.5 V. At
VCC = 15 V, the current sourcing capability is typically 250 mA and the current sink
capability typically 0.7 A. This permits fast turning on and off of the power MOSFET for
efficient operation.
A low driver source current has been chosen to limit the V/t at switch-on. This reduces
ElectroMagnetic Interference (EMI) and also limits the current spikes across Rsense.
8. Limiting values
Fig 7. Soft start-up
014aaa254
Css
Rss
SENSE
Rsense
Istartup(soft)
Vocp
start-up
6
0.5 V
Table 3: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured
with respect to ground (pin 2); positive currents flow into the chip; pin V
CC
may not be current driven.
The voltage ratings are valid provided other ratings are not violated; current ratings are valid
provided the maximum power rating is not violated.
Symbol Parameter Conditions Min Max Unit
Voltages
VCC supply voltage continuous 0.4 +20 V
VPROTECT voltage on pin PROTECT continuous 0.4 +5 V
VCTRL voltage on pin CTRL 0.4 +5 V
VSENSE voltage on pin SENSE current limited 0.4 - V
VDRAIN voltage on pin DRAIN 0.4 +650 V
Currents
ICTRL current on pin CTRL d < 10 % - 50 mA
ISENSE current on pin SENSE 1 +10 mA
IDRIVER current on pin DRIVER d < 10 % 0.8 +2 A
IDRAIN current on pin DRAIN - 5 mA
TEA1530T_AT_AP_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 30 June 2008 11 of 21
NXP Semiconductors TEA1530T/AT/AP
GreenChip II SMPS control IC
[1] Equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
[2] Equivalent to discharging a 200 pF capacitor through a 0.75 µH coil and a 10 resistor.
9. Thermal characteristics
10. Characteristics
General
Ptot total power dissipation Tamb <70°C
SO8 package - 0.5 W
DIP8 package - 0.75 W
Tstg storage temperature 55 +150 °C
Tjjunction temperature 20 +145 °C
ESD
VESD electrostatic discharge
voltage class 1
human body model
pins 1 to 6 [1] - 2000 V
pin 8 (DRAIN) [1] - 1500 V
machine model [2] - 200 V
Table 3: Limiting values
…continued
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured
with respect to ground (pin 2); positive currents flow into the chip; pin V
CC
may not be current driven.
The voltage ratings are valid provided other ratings are not violated; current ratings are valid
provided the maximum power rating is not violated.
Symbol Parameter Conditions Min Max Unit
Table 4. Thermal characteristics
Symbol Parameter Conditions Typ Unit
Rth(j-a) thermal resistance from junction to ambient. in free air, SO8 package. 150 K/W
in free air, DIP8 package 95 K/W
Table 5: Characteristics
T
amb
=25
°
C; V
CC
= 15 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into
the IC; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Start-up current source (pin DRAIN)
IDRAIN current on pin DRAIN VDRAIN > 100 V
VCC = 0 V 1.0 1.2 1.4 mA
with auxiliary supply - 100 300 µA
VBR breakdown voltage 650 - - V
Vmains(oper)(en) mains-dependent
operation-enabling voltage 60 - 100 V
Supply voltage management (pin VCC)
Vstartup start-up voltage 10.3 11 11.7 V
Vth(UVLO) undervoltage lockout threshold
voltage 8.1 8.7 9.3 V
TEA1530T_AT_AP_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 30 June 2008 12 of 21
NXP Semiconductors TEA1530T/AT/AP
GreenChip II SMPS control IC
Vhys hysteresis voltage Vstartup Vth(UVLO) 2.0 2.3 2.6 V
Ich(high) high charging current VDRAIN > 100 V; VCC <3V 1.2 10.8 mA
Ich(low) low charging current VDRAIN > 100 V;
3V<V
CC <V
th(UVLO)
1.2 0.75 0.45 mA
Irestart restart current VDRAIN > 100 V;
Vth(UVLO) <V
CC <V
startup
650 550 450 µA
ICC(oper) operating supply current no load on pin DRIVER 1.1 1.3 1.5 mA
Pulse width modulator
ton(min) minimum on-time - tleb -ns
ton(max) maximum on-time 20 25 30 µs
δmax maximum duty cycle 67 70 73 %
Oscillator
fosc oscillator frequency VCTRL <1V 506375kHz
Duty cycle control (pin CTRL)
Vmin(δmax) minimum voltage (maximum
duty cycle) - 1.0 - V
Vmax(δmin) maximum voltage (minimum
duty cycle) - 1.5 - V
Isc/t slope compensation current 1.2 10.8 µA/µs
VCTRL(detect) detection voltage on pin CTRL 0.56 0.63 0.70 V
Protection and timing input (pin PROTECT)
Vtrip trip voltage [1] 2.37 2.5 2.63 V
Vtrip(latch) latch trip voltage 2.85 3 3.15 V
VVCC(latch)(reset) latch reset voltage on pin VCC VCC(latch) < 2.3 V - 4.5 - V
Ich charge current VCTRL < 0.63 V 57 50 43 µA
Idch discharge current - 100 - nA
Overcurrent and winding short circuit protection (pin SENSE)
Vsense(max) maximum sense voltage V/t = 0.1 V/µs 0.48 0.52 0.56 V
tPD propagation delay V/t = 0.5 V/µs - 140 185 ns
tleb leading edge blanking time 330 400 470 ns
Istartup(soft) soft startup current VI<0.5V 456075µA
Driver (pin DRIVER)
Isource source current VCC = 9.5 V; VDRIVER =2V - 150 88 mA
Isink sink current VCC = 9.5 V
VDRIVER = 2 V - 250 - mA
VDRIVER = 9.5 V 300 500 - mA
Vo(max) maximum output voltage VCC > 12 V - 11.5 12 V
Table 5: Characteristics
…continued
T
amb
=25
°
C; V
CC
= 15 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into
the IC; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
TEA1530T_AT_AP_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 30 June 2008 13 of 21
NXP Semiconductors TEA1530T/AT/AP
GreenChip II SMPS control IC
[1] TEA1530AT and TEA1530AP: safe restart; TEA1530T: latch.
[2] Valid for VCC >2V.
Temperature protection
Tpl(max) maximum protection level
temperature 130 140 150 °C
Tpl(hys) protection level hysteresis
temperature [2] -8-°C
Table 5: Characteristics
…continued
T
amb
=25
°
C; V
CC
= 15 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into
the IC; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
TEA1530T_AT_AP_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 30 June 2008 14 of 21
NXP Semiconductors TEA1530T/AT/AP
GreenChip II SMPS control IC
11. Application information
A converter with the TEA1530(A) consists of an input filter, a transformer with a third
winding (auxiliary), and an output stage with a feedback circuit.
Capacitor CVCC buffers the IC supply voltage, which is powered via the internal current
source, that is connected to the rectified mains, during start-up and via the auxiliary
winding during operation.
A sense resistor Rsense converts the primary current into a voltage at pin SENSE. The
value of Rsense defines the maximum primary peak current.
Figure 8 shows a typical CCM flyback configuration. Pin PROTECT is used in this
example for external overtemperature protection and open loop or output short circuit
protection.
(1) Pin PROTECT is used in this example for external OTP and open loop or output short circuit
protection. Slope compensation is determined by the value of Rslopecomp.
Fig 8. Flyback configuration using CCM
U
1
2
3
4
VCC
Vmains
VI
RCTRL Rsense
GND
PROTECT
CTRL
DRAIN
DRIVER
SENSE
8
7
6
5
Rslopecomp
HVS
Rss
Css
014aaa165
TEA1530(A)
TEA1530T_AT_AP_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 30 June 2008 15 of 21
NXP Semiconductors TEA1530T/AT/AP
GreenChip II SMPS control IC
Fig 9. Typical waveforms 1
014aaa168
VDRIVER
VPROTECT
start-up
sequence normal
operation OVP
TEA1530AT normal
operation output
short-circuit
TEA1530AT
VCC
Vstartup
VO
VDRAIN
VI
VI
Vth(UVLO)
2.5 V
TEA1530T_AT_AP_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 30 June 2008 16 of 21
NXP Semiconductors TEA1530T/AT/AP
GreenChip II SMPS control IC
(1) When VPROTECT is forced above 3 V, the protection is always latched. So the IC is not started at
Vstartup unless the VCC voltage drops below the VVCC(latch)(reset) level. This is the same action used
for external OTP compensation described in Section 7.12.
(2) External OTP for TEA1530(A); OVP and output short circuit for TEA1530T.
Fig 10. Typical waveforms 2
014aaa256
VDRIVER
VPROTECT(1)
start-up
sequence normal
operation
VCC
Vstartup
VO
VDRAIN
VI
VI
Vth(UVLO)
2.5 V
protection
active(2)
TEA1530T_AT_AP_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 30 June 2008 17 of 21
NXP Semiconductors TEA1530T/AT/AP
GreenChip II SMPS control IC
12. Package outline
Fig 11. Package outline SOT96-1 (SO8)
UNIT A
max. A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 5.0
4.8 4.0
3.8 1.27 6.2
5.8 1.05 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.10.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
1.0
0.4
SOT96-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
4
5
pin 1 index
1
8
y
076E03 MS-012
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.20
0.19 0.16
0.15 0.05 0.244
0.228 0.028
0.024 0.028
0.012
0.010.010.041 0.004
0.039
0.016
0 2.5 5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
99-12-27
03-02-18
TEA1530T_AT_AP_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 30 June 2008 18 of 21
NXP Semiconductors TEA1530T/AT/AP
GreenChip II SMPS control IC
Fig 12. Package outline SOT97-1 (DIP8)
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
SOT97-1 99-12-27
03-02-13
UNIT A
max. 12 b1(1) (1) (1)
b2cD E e M Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min. A
max. bmax.
w
ME
e1
1.73
1.14 0.53
0.38 0.36
0.23 9.8
9.2 6.48
6.20 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 1.154.2 0.51 3.2
inches 0.068
0.045 0.021
0.015 0.014
0.009
1.07
0.89
0.042
0.035 0.39
0.36 0.26
0.24 0.14
0.12 0.010.1 0.3 0.32
0.31 0.39
0.33 0.0450.17 0.02 0.13
b2
050G01 MO-001 SC-504-8
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
8
1
5
4
b
E
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
pin 1 index
DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1
TEA1530T_AT_AP_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 30 June 2008 19 of 21
NXP Semiconductors TEA1530T/AT/AP
GreenChip II SMPS control IC
13. Revision history
Table 6. Revision history
Document ID Release date Data sheet status Change notice Supersedes
TEA1530T_AT_AP_1 20080630 Product data sheet - -
TEA1530T_AT_AP_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 30 June 2008 20 of 21
NXP Semiconductors TEA1530T/AT/AP
GreenChip II SMPS control IC
14. Legal information
14.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
14.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
GreenChip — is a trademark of NXP B.V.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors TEA1530T/AT/AP
GreenChip II SMPS control IC
© NXP B.V. 2008. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 30 June 2008
Document identifier: TEA1530T_AT_AP_1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
16. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2.1 Distinctive features . . . . . . . . . . . . . . . . . . . . . . 1
2.2 Green features . . . . . . . . . . . . . . . . . . . . . . . . . 1
2.3 Protection features . . . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
7 Functional description . . . . . . . . . . . . . . . . . . . 4
7.1 Start-up, mains enabling operation level and
undervoltage lockout. . . . . . . . . . . . . . . . . . . . . 6
7.2 Supply management. . . . . . . . . . . . . . . . . . . . . 6
7.3 Current control mode . . . . . . . . . . . . . . . . . . . . 6
7.4 Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
7.5 Cycle skipping. . . . . . . . . . . . . . . . . . . . . . . . . . 7
7.6 Continuous Conduction Mode (CCM). . . . . . . . 7
7.7 OverCurrent Protection (OCP) . . . . . . . . . . . . . 7
7.8 Control pin protection . . . . . . . . . . . . . . . . . . . . 7
7.9 Adjustable slope compensation . . . . . . . . . . . . 7
7.10 Minimum and maximum on-time. . . . . . . . . . . . 8
7.11 PROTECT and timing input . . . . . . . . . . . . . . . 8
7.12 OverTemperature Protection (OTP) . . . . . . . . . 9
7.13 Soft start-up (pin SENSE). . . . . . . . . . . . . . . . . 9
7.14 Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 10
9 Thermal characteristics. . . . . . . . . . . . . . . . . . 11
10 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 11
11 Application information. . . . . . . . . . . . . . . . . . 14
12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17
13 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19
14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 20
14.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20
14.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
14.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 20
14.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20
15 Contact information. . . . . . . . . . . . . . . . . . . . . 20
16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21