© Semiconductor Components Industries, LLC, 2012
July, 2012 − Rev. 2
1Publication Order Number:
NLX2G08/D
NLX2G08
Dual 2-Input AND Gate
The NLX2G08 is an advanced high-speed dual 2-input CMOS
AND gate in ultra-small footprint.
The NLX2G08 input structures provide protection when voltages up
to 7.0 volts are applied, regardless of the supply voltage.
Features
•High Speed: tPD 2.5 ns (typical) at VCC = 5.0 V
•Designed for 1.65 V to 5.5 V VCC Operation
•Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
•24 mA Balanced Output Sink and Source Capability
•Balanced Propagation Delays
•Overvoltage Tolerant (OVT) Input Pins
•This is a Pb−Free Device
A1 1 VCC
B1
GND
2
3
8
7
6
45
Y2
Y1
B2
A2
Figure 1. Pinouts
A1
1
VCC
B1
GND
23
8
76
4
5
Y2
Y1 B2 A2
A2 Y2
&Y1
A1
B2
B1
IEEE/IEC
Figure 2. Logic Symbol
Inputs
FUNCTION TABLE
B
L
H
L
H
Output
Y
H
L
A
L
L
H
H
H
H
Y = AB
H = HIGH Logic Level
L = LOW Logic Level
PIN ASSIGNMENT
Pin
1
2
3
4
5
6
7
8
Function
(UQFN8)
Y1
B2
A2
GND
Y2
B1
A1
VCC
Function
(ULLGA)
A1
B1
Y2
GND
A2
B2
Y1
VCC
http://onsemi.com
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
ORDERING INFORMATION
MARKING
DIAGRAMS
XX = Specific Device Code
M = Date Code
G= Pb−Free Package
1
ULLGA8
1.45 x 1.0
CASE 613AA
1
ULLGA8
1.6 x 1.0
CASE 613AB
1
ULLGA8
1.95 x 1.0
CASE 613AC
XXM
G
XXM
G
XXM
G
UQFN8
MU SUFFIX
CASE 523AN
18
AD MG
G
1
(Note: Microdot may be in either location)
UDFN8
1.45 x 1.0
CASE 517BZ
UDFN8
1.6 x 1.0
CASE 517BY
UDFN8
1.95 x 1.0
CASE 517CA
X M
1
X M
1
X M
1
NLX2G08
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2
MAXIMUM RATINGS
Symbol Parameter Value Unit
VCC DC Supply Voltage *0.5 to +7.0 V
VIN DC Input Voltage *0.5 to +7.0 V
VOUT DC Output Voltage *0.5 to VCC + 0.5 V
IIK DC Input Diode Current VIN < GND *50 mA
IOK DC Output Diode Current VOUT < GND *50 mA
IODC Output Source/Sink Current $50 mA
ICC DC Supply Current per Supply Pin $100 mA
IGND DC Ground Current per Ground Pin $100 mA
TSTG Storage Temperature Range *65 to )150 °C
TLLead Temperature, 1 mm from Case for 10 Seconds TBD °C
TJJunction Temperature Under Bias TBD °C
qJA Thermal Resistance (Note 1) TBD °C/W
PDPower Dissipation in Still Air at 85°C TBD mW
MSL Moisture Sensitivity Level 1
FRFlammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
VESD ESD Withstand Voltage Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
TBD
TBD
N/A
V
ILatchup Latchup Performance Above VCC and Below GND at 125°C (Note 5) $500 mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
VCC Power DC Supply Voltage Operating
Data Retention Only
1.65
1.5
5.5
5.5
V
VIN Digital Input Voltage (Note 6) 0 5.5 V
VOUT Output Voltage 0 VCC V
TAOperating Free−Air Temperature −55 +125 °C
Dt/DVInput Transition Rise or Fall Rate VCC = 1.8 V $0.15 V
VCC = 2.5 V $0.2 V
VCC = 3.3 V $0.3 V
VCC = 5.0 V $0.5 V
0
0
0
0
20
20
10
5
ns/V
6. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level.
NLX2G08
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3
DC ELECTRICAL CHARACTERISTICS
Symbol Parameter Condition
VCC
(V)
TA = 255C TA 3 855C
TA = −555C to
+1255C
Unit
Min Typ Max Min Max Min Max
VIH High−Level Input
Voltage
1.65
2.3 to 5.5
0.75 x
VCC
0.7 x
VCC
0.75 x
VCC
0.7 x
VCC
0.75 x
VCC
0.7 x
VCC
V
VIL Low−Level Input
Voltage
1.65
2.3 to 5.5
0.25 x
VCC
0.3 x
VCC
0.25 x
VCC
0.3 x
VCC
0.25 x
VCC
0.3 x
VCC
V
VOH High−Level
Output Voltage
VIN = VIH or VIL,
IOH = −100 mA
1.65 to 5.5 VCC −
0.1
VCC VCC −
0.1
VCC −
0.1
V
VIN = VIH or VIL
IOH = −4 mA
IOH = −8 mA
IOH = −12 mA
IOH = −16 mA
IOH = −24 mA
IOH = −32 mA
1.65
2.3
2.7
3.0
3.0
4.5
1.29
1.9
2.2
2.4
2.3
3.8
1.5
2.1
2.4
2.7
2.5
4.0
1.29
1.9
2.2
2.4
2.3
3.8
1.29
1.9
2.2
2.4
2.3
3.8
VOL Low−Level
Output Voltage
VIN = VIH or VIL,
IOL = 100 mA
1.65 to 5.5 0.1 0.1 0.1 V
VIN = VIH or VIL
IOL = 4 mA
IOL = 8 mA
IOL = 12 mA
IOL = 16 mA
IOL = 24 mA
IOL = 32 mA
1.65
2.3
2.7
3.0
3.0
4.5
0.08
0.20
0.22
0.28
0.38
0.42
0.24
0.3
0.4
0.4
0.55
0.55
0.24
0.3
0.4
0.4
0.55
0.55
0.24
0.3
0.4
0.4
0.55
0.55
IIN Input Leakage
Current
0 ≤ VIN ≤ 5.5 V 0 to 5.5 $0.1 $1.0 $1.0 mA
IOFF Power−Off Input
Leakage Current
VIN = 5.5 V 0 1.0 10 10 mA
ICC Quiescent Supply
Current
0 ≤ VIN ≤ 5.5 V 5.5 1.0 10 10 mA
AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns
Symbol Parameter
VCC
(V) Test Condition
TA = 255C TA 3 855C
TA = −555C
to +1255C
Unit
Min Typ Max Min Max Min Max
tPLH
tPHL
Propagation Delay
Input A to Output
1.65 to 1.95 RL = 1 MW, CL = 15 pF 2.0 5.7 10.5 2.0 11.0 TBD TBD ns
2.3 to 2.7 RL = 1 MW, CL = 15 pF 1.2 3.5 5.8 2.0 6.2 TBD TBD
3.0 to 3.6 RL = 1 MW, CL = 15 pF 0.8 2.6 3.9 0.8 4.3 TBD TBD
RL = 500 W, CL = 50 pF 1.2 3.2 4.8 1.2 5.2 TBD TBD
4.5 to 5.5 RL = 1 MW, CL = 15 pF 0.5 1.9 3.1 0.5 3.3 TBD TBD
RL = 500 W, CL = 50 pF 0.8 2.5 3.7 0.8 4.0 TBD TBD
CIN Input Capacitance 5.5 VIN = 0 V or VCC 2.5 pF
CPD Power Dissipation
Capacitance (Note 7)
3.3
5.5
10 MHz, VIN = 0V or
VCC
9
11
pF
7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
NLX2G08
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4
Figure 3. Switching Waveform Figure 4. Test Circuit
RLCL
A 1−MHz square input wave is recommended for
propagation delay tests.
VCC
VCC
GND
50%
50% VCC
tPHL
tPLH
Y
A and B 50%
PROPAGATION DELAYS
tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
ORDERING INFORMATION
Device Package Shipping†
NLX2G08MUTCG UQFN8
(Pb−Free)
3000 / Tape & Reel
NLX2G08AMX1TCG ULLGA8, 1.95 x 1.0, 0.5P
(Pb−Free)
3000 / Tape & Reel
NLX2G08BMX1TCG ULLGA8, 1.6 x 1.0, 0.4P
(Pb−Free)
3000 / Tape & Reel
NLX2G08CMX1TCG ULLGA8, 1.45 x 1.0, 0.35P
(Pb−Free)
3000 / Tape & Reel
NLX2G08DMUTCG UDFN8, 1.95 x 1.0, 0.5P
(Pb−Free)
3000 / Tape & Reel
NLX2G08EMUTCG UDFN8, 1.6 x 1.0, 0.4P
(Pb−Free)
3000 / Tape & Reel
NLX2G08FMUTCG UDFN8, 1.45 x 1.0, 0.35P
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NLX2G08
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5
PACKAGE DIMENSIONS
UDFN8 1.6x1.0, 0.4P
CASE 517BY
ISSUE O
ÉÉÉ
ÉÉÉ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
RECOMMENDED
DIM MIN MAX
MILLIMETERS
A0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b0.15 0.25
D1.60 BSC
E1.00 BSC
e0.40 BSC
L0.25 0.35
L1 0.30 0.40
A B
E
D
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
A
A1
0.05 C
0.05 C
CSEATING
PLANE
SIDE VIEW
2X
2X
A3
BOTTOM VIEW
b
e
8X
L7X
L1
14
58
e/2
0.10 B
0.05
AC
CNOTE 3
M
MDIMENSIONS: MILLIMETERS
0.26
7X
0.49 8X
1.24
0.53
PITCH
0.40
1
PKG
OUTLINE
NLX2G08
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6
PACKAGE DIMENSIONS
UDFN8 1.45x1.0, 0.35P
CASE 517BZ
ISSUE O
ÉÉ
ÉÉ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
RECOMMENDED
DIM MIN MAX
MILLIMETERS
A0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b0.15 0.25
D1.45 BSC
E1.00 BSC
e0.35 BSC
L0.25 0.35
L1 0.30 0.40
A B
E
D
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
A
A1
0.05 C
0.05 C
CSEATING
PLANE
SIDE VIEW
2X
2X
A3
BOTTOM VIEW
b
e
8X
L7X
L1
14
58
e/2
DIMENSIONS: MILLIMETERS
0.22
7X
0.48 8X
1.18
0.53
PITCH
0.35
1
PKG
OUTLINE
0.10 B
0.05
AC
CNOTE 3
M
M
NLX2G08
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7
PACKAGE DIMENSIONS
UDFN8 1.95x1.0, 0.5P
CASE 517CA
ISSUE O
ÉÉÉ
ÉÉÉ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
RECOMMENDED
DIM MIN MAX
MILLIMETERS
A0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b0.15 0.25
D1.95 BSC
E1.00 BSC
e0.50 BSC
L0.25 0.35
L1 0.30 0.40
A B
E
D
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
A
A1
0.05 C
0.05 C
CSEATING
PLANE
SIDE VIEW
2X
2X
A3
BOTTOM VIEW
b
e
8X
L7X
L1
14
58
e/2
DIMENSIONS: MILLIMETERS
0.30
7X
0.49 8X
1.24
0.54
PITCH
0.50
1
PKG
OUTLINE
0.10 B
0.05
AC
CNOTE 3
M
M
NLX2G08
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8
PACKAGE DIMENSIONS
UQFN8
MU SUFFIX
CASE 523AN
ISSUE O
ÉÉÉ
ÉÉÉ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
A
B
E
D
BOTTOM VIEW
b
e
8X
0.10 B
0.05
AC
CNOTE 3
2X
0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.10 C
A
A1
(A3)
0.05 C
0.05 C
CSEATING
PLANE
SIDE VIEW
L
8X
1
35
8
DIM MIN MAX
MILLIMETERS
A0.45 0.60
A1 0.00 0.05
A3 0.13 REF
b0.15 0.25
D1.60 BSC
L1 −−− 0.15
E1.60 BSC
e0.50 BSC
L0.35 0.45
L1
DETAIL A
ÇÇÇ
ÇÇÇ
ÉÉÉ
ÉÉÉ
A1
A3
DETAIL B
OPTIONAL
MOLD CMPD
EXPOSED Cu
b
CONSTRUCTION
OPTIONAL
CONSTRUCTION
DETAIL B
DETAIL A
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
PITCH
0.35
7X
DIMENSIONS: MILLIMETERS
1
7
L3
0.25
1.70
1.70
0.50
L3 0.25 0.35
L3
(0.10) (0.15)
8X
0.53
8X
0.53
8X
NLX2G08
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9
PACKAGE DIMENSIONS
ULLGA8 1.45x1.0, 0.35P
CASE 613AA
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
ÉÉÉ
ÉÉÉ
ÉÉÉ
A
B
E
D
BOTTOM VIEW
b
e
8X
0.10 B
0.05
AC
C
L7X
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
8X
A
A1
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
L1
14
58
DIM MIN MAX
MILLIMETERS
A−−− 0.40
A1 0.00 0.05
b0.15 0.25
D1.45 BSC
E1.00 BSC
e0.35 BSC
L0.25 0.35
L1 0.30 0.40
e/2
NOTE 4
SOLDERMASK DEFINED*
DIMENSIONS: MILLIMETERS
0.22
7X
0.48 8X
1.18
0.53
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.35
1
MOUNTING FOOTPRINT
PKG
OUTLINE
NLX2G08
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10
PACKAGE DIMENSIONS
ULLGA8 1.6x1.0, 0.4P
CASE 613AB
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
ÉÉÉ
ÉÉÉ
ÉÉÉ
A
B
E
D
BOTTOM VIEW
b
e
8X
0.10 B
0.05
AC
C
L7X
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
8X
A
A1
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
L1
14
58
DIM MIN MAX
MILLIMETERS
A−−− 0.40
A1 0.00 0.05
b0.15 0.25
D1.60 BSC
E1.00 BSC
e0.40 BSC
L0.25 0.35
L1 0.30 0.40
e/2
NOTE 4
SOLDERMASK DEFINED*
DIMENSIONS: MILLIMETERS
0.26
7X
0.49 8X
1.24
0.53
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.40
1
MOUNTING FOOTPRINT
PKG
OUTLINE
NLX2G08
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11
PACKAGE DIMENSIONS
ULLGA8 1.95x1.0, 0.5P
CASE 613AC
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
A
B
E
D
BOTTOM VIEW
b
e
8X
0.10 B
0.05
AC
C
L7X
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
8X
A
A1
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
L1
14
58
DIM MIN MAX
MILLIMETERS
A−−− 0.40
A1 0.00 0.05
b0.15 0.25
D1.95 BSC
E1.00 BSC
e0.50 BSC
L0.25 0.35
L1 0.30 0.40
e/2
NOTE 4
SOLDERMASK DEFINED*
DIMENSIONS: MILLIMETERS
0.30
7X
0.49 8X
1.24
0.53
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.50
1
MOUNTING FOOTPRINT
PKG
OUTLINE
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NLX2G08/D
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