INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-LCA125-R09 1
LCA125
Single-Pole, Normally Open
OptoMOS® Relay
e3
Pb
Part # Description
LCA125 6-Pin DIP (50/Tube)
LCA125S 6-Pin Surface Mount (50/Tube)
LCA125STR 6-Pin Surface Mount (1,000/Reel)
Parameter Ratings Units
Blocking Voltage 300 VP
Load Current 170 mArms / mADC
On-Resistance (max) 16
Applications
Features
Description
Ordering Information
Pin Configuration
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook,
Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
• 3750Vrms Input/Output Isolation
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• High Reliability
• Arc-Free With No Snubbing Circuits
• FCC Compatible
• VDE Compatible
• No EMI/RFI Generation
• Small 6-Pin Package
• Machine Insertable, Wave Solderable
• Surface Mount Tape & Reel Version Available
Switching Characteristics of
Normally Open (Form A) Devices
Approvals
• UL Recognized Component: File # E76270
• CSA Certified Component: Certificate 1172007
• Certified to:
• EN60950-1: 2006
• EN60950-1: 2005
• TUV Certificate: B 09 07 49410 004
Form-A
IF
ILOAD
10%
90%
ton toff
1
3
2
4
5
6
+ Control
– Control
Do Not Use
Load
Do Not Use
Load
AC/DC Configuration
1
3
2
4
5
6
+ Control
– Control
Do Not Use
+ Load
– Load
DC Only Configuration
LCA125 is a 300V, 170mA, 16, normally open
(1-Form-A) solid state relay that uses optically coupled
MOSFET technology to provide 3750Vrms of input to
output isolation.
Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
Use the LCA125 to replace mechanical relays,
and gain the superior reliability associated with
semiconductor devices. Because they have no moving
parts, they offer faster, bounce-free switching in a more
compact surface mount or through hole package.