TDA8944J-02 - Philips Semiconductors / NXP Semiconductors

TDA8944J

2 x 7 W stereo Bridge Tied Load (BTL) audio ampliﬁer

Rev. 02 — 14 February 2000 Product speciﬁcation

1. General description

The TDA8944J is a dual-channel audio power ampliﬁer with an output power of

2×7 W at an 8 Ω load and a 12 V supply. The circuit contains two Bridge Tied Load

(BTL) ampliﬁers with an all-NPN output stage and standby/mute logic. The TDA8944J

comes in a 17-pin DIL-bent-SIL (DBS) power package. The TDA8944J is

printed-circuit board (PCB) compatible with all other types in the TDA894x family.

One PCB footprint accommodates both the mono and the stereo products.

2. Features

■Few external components

■Fixed gain

■Standby and mute mode

■No on/off switching plops

■Low standby current

■High supply voltage ripple rejection

■Outputs short-circuit protected to ground, supply and across the load

■Thermally protected

■Printed-circuit board compatible.

3. Applications

■Mains fed applications (e.g. TV sound)

■PC audio

■Portable audio.

4. Quick reference data

Table 1: Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

VCC supply voltage 6 12 18 V

Iqquiescent supply current VCC =12V; R

L=∞- 2436mA

Istb standby supply current - - 10 µA

Philips Semiconductors TDA8944J

2 x 7 W stereo BTL audio ampliﬁer

Product speciﬁcation Rev. 02 — 14 February 2000 2 of 21

5. Ordering information

6. Block diagram

Pooutput power THD = 10%; RL=8Ω;

VCC =12V 67- W

THD total harmonic distortion Po= 1 W - 0.03 0.1 %

Gvvoltage gain 31 32 33 dB

SVRR supply voltage ripple

rejection 50 65 - dB

Table 1: Quick reference data

…continued

Symbol Parameter Conditions Min Typ Max Unit

Table 2: Ordering information

Type number Package

Name Description Version

TDA8944J DBS17P plastic DIL-bent-SIL power package;

17 leads (lead length 12 mm) SOT243-1

Fig 1. Block diagram.

dth

MBK933

STANDBY/

MUTE LOGIC SHORT CIRCUIT

AND

TEMPERATURE

PROTECTION

kΩ

12 17

VCC1

VCC

OUT2+

GND1

GND2

SVR

OUT2−

IN2−

IN2+

TDA8944J

VCC2

OUT1+

OUT1−

IN1−

IN1+

MODE

Philips Semiconductors TDA8944J

2 x 7 W stereo BTL audio ampliﬁer

Product speciﬁcation Rev. 02 — 14 February 2000 3 of 21

7. Pinning information

7.1 Pinning

7.2 Pin description

Fig 2. Pin conﬁguration.

handbook, halfpage

TDA8944J

MBK936

OUT1−

GND1

VCC1

OUT1+

n.c.

IN1+

n.c.

IN1−

IN2−

MODE

SVR

IN2+

n.c.

OUT2+

GND2

VCC2

OUT2−

Table 3: Pin description

Symbol Pin Description

OUT1−1 negative loudspeaker terminal 1

GND1 2 ground channel 1

VCC1 3 supply voltage channel 1

OUT1+4 positive loudspeaker terminal 1

n.c. 5 not connected

IN1+6 positive input 1

n.c. 7 not connected

IN1−8 negative input 1

IN2−9 negative input 2

MODE 10 mode selection input (standby, mute, operating)

SVR 11 half supply voltage decoupling (ripple rejection)

IN2+12 positive input 2

Philips Semiconductors TDA8944J

2 x 7 W stereo BTL audio ampliﬁer

Product speciﬁcation Rev. 02 — 14 February 2000 4 of 21

8. Functional description

The TDA8944J is a stereo BTL audio power ampliﬁer capable of delivering 2 ×7W

output power to an 8 Ω load at THD = 10%, using a 12 V power supply and an

external heatsink. The voltage gain is ﬁxed at 32 dB.

With the three-level MODE input the device can be switched from ‘standby’ to ‘mute’

and to ‘operating’ mode.

The TDA8944J outputs are protected by an internal thermal shutdown protection

mechanism and a short-circuit protection.

8.1 Input conﬁguration

The TDA8944J inputs can be driven symmetrical (ﬂoating) as well as asymmetrical.

In the asymmetrical mode one input pin is connected via a capacitor to the signal

ground which should be as close as possible to the SVR (electrolytic) capacitor

ground. Note that the DC level of the input pins is half of the supply voltage VCC, so

coupling capacitors for both pins are necessary.

The input cut-off frequency is:

(1)

For Ri=45kΩ and Ci= 220 nF:

(2)

As shown in Equation 1 and 2, large capacitor values for the inputs are not

necessary;so the switch-on delay during charging of the input capacitors, can be

minimized. This results in a good low frequency response and good switch-on

behaviour.

Remark: To prevent HF oscillations do not leave the inputs open, connect a capacitor

of at least 1.5 nF across the input pins close to the device.

n.c. 13 not connected

OUT2−14 negative loudspeaker terminal 2

GND2 15 ground channel 2

VCC2 16 supply voltage channel 2

OUT2+ 17 positive loudspeaker terminal 2

Table 3: Pin description

…continued

Symbol Pin Description

ficut off–() 1

iCi

×()–

-------------------------------

fi cut off–() 1

24510

×220×10 9–

×()–

-------------------------------------------------------------------16 Hz==

Philips Semiconductors TDA8944J

2 x 7 W stereo BTL audio ampliﬁer

Product speciﬁcation Rev. 02 — 14 February 2000 5 of 21

8.2 Power ampliﬁer

The power ampliﬁer is a Bridge Tied Load (BTL) ampliﬁer with an all-NPN output

stage, capable of delivering a peak output current of 2 A.

The BTL principle offers the following advantages:

•Lower peak value of the supply current

•The ripple frequency on the supply voltage is twice the signal frequency

•No expensive DC-blocking capacitor

•Good low frequency performance.

8.2.1 Output power measurement

The output power as a function of the supply voltage is measured on the output pins

at THD = 10%; see Figure 8. The maximum output power is limited by the maximum

supply voltage of 12 V and the maximum available output current: 2 A repetitive peak

current.

8.2.2 Headroom

Typical CD music requires at least 12 dB (factor 15.85) dynamic headroom –

compared to the average power output – for transferring the loudest parts without

distortion. At VCC =12V, R

L=8Ω and Po= 4 W at THD = 0.1% (see Figure 6), the

Average Listening Level (ALL) – music power – without any distortion yields:

Po(ALL) = 4 W/15.85 = 252 mW.

The power dissipation can be derived from Figure 11 on page 10 for 0 dB

respectively 12 dB headroom.

For the average listening level a power dissipation of 4 W can be used for a heatsink

calculation.

8.3 Mode selection

The TDA8944J has three functional modes, which can be selected by applying the

proper DC voltage to pin MODE. See Figure 4 and 5 for the respective DC levels,

which depend on the supply voltage level. The MODE pin can be driven by a 3-state

logic output stage: e.g. a microcontroller with additional components for DC-level

shifting.

Standby — In this mode the current consumption is very low and the outputs are

ﬂoating. The device is in standby mode when (VCC −0.5 V) < VMODE <V

CC, or when

the MODE pin is left ﬂoating (high impedance). The power consumption of the

TDA8944J will be reduced to <0.18 mW.

Table 4: Power rating as function of headroom

Headroom Power output (THD = 0.1%) Power dissipation (P)

0 dB Po=4W 8W

12 dB Po(ALL) = 252 mW 4 W

Philips Semiconductors TDA8944J

2 x 7 W stereo BTL audio ampliﬁer

Product speciﬁcation Rev. 02 — 14 February 2000 6 of 21

Mute — In this mode the ampliﬁer is DC-biased but not operational (no audio output);

the DC level of the input and output pins remain on half the supply voltage. This

allows the input coupling and Supply Voltage Ripple Rejection (SVRR) capacitors to

be charged to avoid pop-noise. The device is in mute mode when

3V<V

MODE <(V

CC −1.5 V).

Operating — In this mode the ampliﬁer is operating normally. The operating mode is

activated at VMODE < 0.5 V.

8.3.1 Switch-on and switch-off

To avoid audible plops during supply voltage switch-on or switch-off, the device is set

to standby mode before the supply voltage is applied (switch-on) or removed

(switch-off).

The switch-on and switch-off time can be inﬂuenced by an RC-circuit on the MODE

pin. Rapid on/off switching of the device or the MODE pin may cause ‘click- and

pop-noise’. This can be prevented by proper timing of the RC-circuit on the MODE

pin.

8.4 Supply Voltage Ripple Rejection (SVRR)

The SVRR is measured with an electrolytic capacitor of 10 µF on pin SVR at a

bandwidth of 10 Hz to 80 kHz. Figure 13 on page 11 illustrates the SVRR as function

of the frequency. A larger capacitor value on the SVR pin improves the ripple rejection

behaviour at the lower frequencies.

8.5 Built-in protection circuits

The TDA8944J contains two types of protection circuits, i.e. short-circuit and thermal

shutdown.

8.5.1 Short-circuit protection

Short-circuit to ground or supply line — This is detected by a so-called ‘missing

current’ detection circuit which measures the current in the positive supply line and

the current in the ground line. A difference between both currents larger than 0.4 A,

switches the power stage to standby mode (high impedance).

Short-circuit across the load — This is detected by an absolute-current

measurement. An absolute-current larger than 2 A, switches the power stage to

standby mode (high impedance).

8.5.2 Thermal shutdown protection

The junction temperature is measured by a temperature sensor; at a junction

temperature of approximately 150 °C this detection circuit switches the power stage

to standby mode (high impedance).

Philips Semiconductors TDA8944J

2 x 7 W stereo BTL audio ampliﬁer

Product speciﬁcation Rev. 02 — 14 February 2000 7 of 21

9. Limiting values

10. Thermal characteristics

11. Static characteristics

[1] With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal to the differential

output voltage offset (∆VOUT) divided by the load resistance (RL).

[2] The DC output voltage with respect to ground is approximately 0.5VCC.

[3] ∆VOUT =VOUT+ −VOUT−

Table 5: Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VCC supply voltage no signal −0.3 +25 V

operating −0.3 +18 V

VIinput voltage −0.3 VCC + 0.3 V

IORM repetitive peak output current - 2 A

Tstg storage temperature non-operating −55 +150 °C

Tamb operating ambient temperature −40 +85 °C

Ptot total power dissipation - 18 W

VCC(sc) supplyvoltagetoguarantee short-circuit

protection -15V

Table 6: Thermal characteristics

Symbol Parameter Conditions Value Unit

Rth(j-a) thermal resistance from junction to ambient in free air 40 K/W

Rth(j-mb) thermal resistance from junction to mounting base both channels driven 6.9 K/W

Table 7: Static characteristics

=12V; T

amb

=25

C; R

Ω

; V

MODE

=0V; V

= 0 V; measured in test circuit Figure 14; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

VCC supply voltage operating 6 12 18 V

Iqquiescent supply current RL=∞[1] - 2436mA

Istb standby supply current VMODE =V

CC --10µA

VODC output voltage [2] -6-V

∆VOUT [3] differential output voltage offset - - 200 mV

VMODE mode selection input voltage operating mode 0 - 0.5 V

mute mode 3 - VCC −1.5 V

standby mode VCC −0.5 - VCC V

IMODE mode selection input current 0 < VMODE <V

CC --20µA

Philips Semiconductors TDA8944J

2 x 7 W stereo BTL audio ampliﬁer

Product speciﬁcation Rev. 02 — 14 February 2000 8 of 21

12. Dynamic characteristics

[1] The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with a source impedance

Rs=0Ω at the input.

[2] Supply voltage ripple rejection is measured at the output, with a source impedance Rs=0Ω at the input. The ripple voltage is a sine

wave with a frequency fripple and an amplitude of 707 mV (RMS), which is applied to the positive supply rail.

[3] Output voltage in mute mode is measured with an input voltage of 1 V (RMS) in a bandwidth of 20 kHz, so including noise.

Fig 3. Quiescent current as function of supply

voltage. Fig 4. Quiescent current as function of mode voltage.

handbook, halfpage

00481216

VCC (V)

(mA)

MGL954

handbook, halfpage

00481216

VMODE (V)

(mA)

MGL955

VCC = 12 V

Table 8: Dynamic characteristics

=12V; T

amb

=25

C; R

Ω

; f = 1 kHz; V

MODE

= 0 V; measured in test circuit Figure 14; audio pass band

22 Hz to 22 kHz; unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

Pooutput power THD = 10% 6 7 - W

THD = 0.5% 4 5 - W

THD total harmonic distortion Po= 1 W - 0.03 0.1 %

Gvvoltage gain 31 32 33 dB

Zi(dif) differential input impedance 70 90 110 kΩ

Vn(o) noise output voltage [1] - 90 120 µV

SVRR supply voltage ripple rejection fripple = 1 kHz [2] 50 65 - dB

fripple = 100 Hz

to 20 kHz [2] -60-dB

Vo(mute) output voltage mute mode [3] --50µV

αcs channel separation Rs=0Ω50 75 - dB

Philips Semiconductors TDA8944J

2 x 7 W stereo BTL audio ampliﬁer

Product speciﬁcation Rev. 02 — 14 February 2000 9 of 21

Fig 5. Output voltage as function of mode voltage.

No bandpass ﬁlter applied.

Fig 6. Total harmonic distortion as function of output

power. Fig 7. Total harmonic distortion as function of

frequency.

handbook, full pagewidth

2016 VMODE (V)

MGL957

840

(V)

10−3

10−2

10−1

10−4

10−5

VCC = 12 V

handbook, halfpage

THD

(%)

10−2102

10110−1Po (W)

102

10−1

10−2

MGL952

VCC = 12 V

handbook, halfpage

THD

(%)

10 105

102103104f (Hz)

10−1

10−2

MGL953

Po = 0.1 W

1 W

Philips Semiconductors TDA8944J

2 x 7 W stereo BTL audio ampliﬁer

Product speciﬁcation Rev. 02 — 14 February 2000 10 of 21

THD = 10%.

Fig 8. Output power as function of supply voltage. Fig 9. Total power dissipation as function of supply

voltage.

VCC =12V.

Fig 10. Efﬁciency as function of output power. Fig 11. Power dissipation as function of output power.

handbook, halfpage

00481216

VCC (V)

(W)

MGL959

RL = 8 Ω

16 Ω

handbook, halfpage

00481216

VCC (V)

Ptot

(W)

MGL960

RL = 8 Ω

16 Ω

handbook, halfpage

100

002468

Po (W)

(%)

MGL962

RL = 16 Ω

8 Ω

handbook, halfpage

002468

Po (W)

(W)

MGL961

RL = 8 Ω

16 Ω

Philips Semiconductors TDA8944J

2 x 7 W stereo BTL audio ampliﬁer

Product speciﬁcation Rev. 02 — 14 February 2000 11 of 21

No bandpass ﬁlter applied.

Fig 12. Channel separation as function of frequency.

VCC = 12 V; Rs=0Ω; Vripple = 707 mV (peak-to-peak); no bandpass ﬁlter applied.

Curves A: inputs short-circuited

Curves B: inputs short-circuited and connected to ground (asymmetrical application)

Fig 13. Supply voltage ripple rejection as function of frequency.

handbook, halfpage

−20

−40

−60

−80

−100

10 102103104105

f (Hz)

αcs

(dB)

MGL958

handbook, full pagewidth

SVRR

(dB)

102103104105

10 f (Hz)

−20

−40

−60

−80

MGL956

CH2

ACH1

Philips Semiconductors TDA8944J

2 x 7 W stereo BTL audio ampliﬁer

Product speciﬁcation Rev. 02 — 14 February 2000 12 of 21

13. Internal circuitry

Table 9: Internal circuitry

Pin Symbol Equivalent circuit

6 and 8 IN1+ and IN1−

12 and 9 IN2+ and IN2−

1 and 4 OUT1−and OUT1+

14 and 17 OUT2−and OUT2+

10 MODE

11 SVR

1.5 kΩ1.5 kΩ

45 kΩ45 kΩ

VCC

MGL946

1 : 1 1 : 1

1/2 VCC

(SVR)

8, 9 6, 12

40 Ω

100 Ω

MGL947

1, 4, 14, 17

1/2 VCC

1 kΩ

10 kΩ

OFF

HIGH MUTE

HIGH

1 kΩ

VCC

MGL949

Standby

20 kΩ

VCC

MGL948

Philips Semiconductors TDA8944J

2 x 7 W stereo BTL audio ampliﬁer

Product speciﬁcation Rev. 02 — 14 February 2000 13 of 21

14. Application information

14.1 Printed-circuit board (PCB)

14.1.1 Layout and grounding

For a high system performance level certain grounding techniques are essential.

The input reference grounds have to be tied with their respective source grounds and

must have separate tracks from the power ground tracks; this will prevent the large

(output) signal currents from interfering with the small AC input signals.

The small-signal ground tracks should be physically located as far as possible from

the power ground tracks. Supply and output tracks should be as wide as possible for

delivering maximum output power.

Fig 14. Application diagram.

ull pagewidth

316

OUT1−

−

−−

−

8 Ω

45 kΩ

Symmetrical

input

45 kΩ

8 Ω

OUT1+

IN1−

IN1+

OUT2−

OUT2+

GND

MGL950

IN2−

IN2+

MODE

SVR

220 nF

152

+VCC

1000 µF

100 nF

20 kΩ

µF

−

−−

−

45 kΩ

VCC

signal

GND

TDA8944J

signal

GND

SHORT CIRCUIT

AND

TEMPERATURE

PROTECTION

STANDBY/

MUTE LOGIC

MICROCONTROLLER

Standby

MODE

Mute

C1 C2

1/2 VCC

220 nF

1.5

Asymmetrical

input

220 nF

1/2 VCC 1/2 VCC

1/2 VCC

Philips Semiconductors TDA8944J

2 x 7 W stereo BTL audio ampliﬁer

Product speciﬁcation Rev. 02 — 14 February 2000 14 of 21

14.1.2 Power supply decoupling

Proper supply bypassing is critical for low-noise performance and high supply voltage

ripple rejection. The respective capacitor locations should be as close as possible to

the device and grounded to the power ground. Proper power supply decoupling also

prevents oscillations.

For suppressing higher frequency transients (spikes) on the supply line a capacitor

with low ESR – typical 100 nF – has to be placed as close as possible to the device.

For suppressing lower frequency noise and ripple signals, a large electrolytic

capacitor – e.g. 1000 µF or greater – must be placed close to the device.

The bypass capacitor on the SVR pin reduces the noise and ripple on the midrail

voltage. For good THD and noise performance a low ESR capacitor is recommended.

Fig 15. Printed-circuit board layout (single-sided); components view.

dth

MGL951

MUTE

220 nF

100 nF

1.5 nF

1000 µF

10 µF

220 nF

+−

IN2−

IN2+

IN1−

IN1+

OUT1−

OUT1+

OUT2−

OUT2+

VCC

GND

54 mm

56 mm

Philips Semiconductors TDA8944J

2 x 7 W stereo BTL audio ampliﬁer

Product speciﬁcation Rev. 02 — 14 February 2000 15 of 21

14.2 Thermal behaviour and heatsink calculation

The measured maximum thermal resistance of the IC package, Rth(j-mb) is 6.9 K/W.

A calculation for the heatsink can be made, with the following parameters:

Tamb(max) =50°C

VCC = 12 V and RL=8Ω

Tj(max) = 150 °C.

Rth(tot) is the total thermal resistance between the junction and the ambient

including the heatsink. In the heatsink calculations the value of Rth(mb-h) is ignored.

At VCC = 12 V and RL=8Ω the measured worstcase sine-wave dissipation is 8 W;

see Figure 11. For Tj(max) = 150 °C the temperature raise - caused by the power

dissipation - is: 150 – 50 = 100 °C.

P×Rth(tot) = 100 °C

Rth(tot) = 100/8 = 12.5 K/W

Rth(h-a) =R

th(tot) –R

th(j-mb) = 12.5 – 6.9 = 5.6 K/W.

The calculation above is for an application at worstcase (stereo) sine-wave output

signals. In practice music signals will be applied, which decreases the maximum

power dissipation to approximately half of the sine-wave power dissipation (see

Section 8.2.2). This allows for the use of a smaller heatsink:

P×Rth(tot) = 100 °C

Rth(tot) = 100/4 = 25 K/W

Rth(h-a) =R

th(tot) –R

th(j-mb) = 25 – 6.9 = 18.1 K/W.

To increase the lifetime of the IC, Tj(max) should be reduced to 125 °C. This requires a

heatsink of approximately 12 K/W for music signals.

15. Test information

15.1 Quality information

The

General Quality Speciﬁcation for Integrated Circuits, SNW-FQ-611D

applicable.

15.2 Test conditions

Tamb =25°C; VCC = 12 V; f = 1 kHz; RL=8Ω; audio pass band 22 Hz to 22 kHz;

unless otherwise speciﬁed.

Remark: In the graphs as function of frequency no bandpass ﬁlter was applied; see

Figure 7,12 and 13.

Philips Semiconductors TDA8944J

2 x 7 W stereo BTL audio ampliﬁer

Product speciﬁcation Rev. 02 — 14 February 2000 16 of 21

16. Package outline

Fig 16. DBS17P package outline.

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

SOT243-1

0 5 10 mm

scale

117

non-concave

97-12-16

99-12-17

DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1

view B: mounting base side

UNIT A e1

A2bpcD

(1) E(1) Z(1)

deDhLL

mm 17.0

15.5 4.6

4.4 0.75

0.60 0.48

0.38 24.0

23.6 20.0

19.6 10 2.54

0.8

12.2

11.8 1.27

5.08 2.4

1.6

62.00

1.45

2.1

1.8

3.4

3.1 4.3

12.4

11.0

0.4

0.03

Philips Semiconductors TDA8944J

2 x 7 W stereo BTL audio ampliﬁer

Product speciﬁcation Rev. 02 — 14 February 2000 17 of 21

17. Soldering

17.1 Introduction to soldering through-hole mount packages

This text gives a brief insight to wave, dip and manual soldering. A more in-depth

account of soldering ICs can be found in our

Data Handbook IC26; Integrated Circuit

Packages

(document order number 9398 652 90011).

Wave soldering is the preferred method for mounting of through-hole mount IC

packages on a printed-circuit board.

17.2 Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is 260 °C; solder at this

temperature must not be in contact with the joints for more than 5 seconds. The total

contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the

plastic body must not exceed the speciﬁed maximum storage temperature (Tstg(max)).

If the printed-circuit board has been pre-heated, forced cooling may be necessary

immediately after soldering to keep the temperature within the permissible limit.

17.3 Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the

seating plane or not more than 2 mm above it. If the temperature of the soldering iron

bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit

temperature is between 300 and 400 °C, contact may be up to 5 seconds.

17.4 Package related soldering information

[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the

printed-circuit board.

Table 10: Suitability of through-hole mount IC packages for dipping and wave soldering

methods

Package Soldering method

Dipping Wave

DBS, DIP, HDIP, SDIP, SIL suitable suitable[1]

Philips Semiconductors TDA8944J
2 x 7 W stereo BTL audio ampliﬁer
Product speciﬁcation Rev. 02 — 14 February 2000 18 of 21
9397 750 06861 © Philips Electronics N.V. 2000. All rights reserved.
18. Revision history
Table 11: Revision history
Rev Date CPCN Description
02 000214 - Product speciﬁcation; second version; supersedes initial version TDA8944J-01 of
14 April 1999 (9397 750 04881). Modiﬁcations:
•Table 1 on page 1: SVRR; Typ value 65 dB → added
•Figure 1 on page 2: Block diagram; pin numbers changed OUT2−→ 14 and OUT2+ → 17
•Figure 2 on page 3: Pin conﬁguration; pin numbers changed OUT2−→14 and OUT2+ →17
•Section 8 “Functional description”:
–Section 8.1 “Input conﬁguration” on page 4 → added.
–Section 8.2 “Power ampliﬁer” on page 5: ........, capable of delivering a peak output
current of 1.5 A → changed to 2 A.
–Section 8.2.1 “Output power measurement” on page 5 → added
–Section 8.2.2 “Headroom” on page 5 → added
•Section 8.3 “Mode selection”:
–Standby mode: VMODE >(V
CC −0.5 V) →changed to (VCC −0.5 V) < VMODE <V
CC; The
power consumption of the TDA8944J will be reduced to <0.18 mW → added.
–Mute mode: the DC level of the input and output pins remain on half the supply
voltage →added;
–2.5 V < VMODE <(V
CC −1.5 V) → changed to 3 V < VMODE <(V
CC −1.5 V)
–Section 8.3.1 “Switch-on and switch-off” on page 6
•Section 8.4 “Supply Voltage Ripple Rejection (SVRR)” on page 6 → added
•Section 8.5 “Built-in protection circuits” on page 6 → added
•Table 5 on page 7:
–Ptot value added 18 V
–VCC(sc) value added 15 V
•Table 6 on page 7:
–Rth(j-a) value added 40 K/W
–Rth(j-c) value 10 →changed to 6.9 K/W; condition ‘in free air’ →changed to ‘both channels
driven’
•Table 7 on page 7: VMODE  - mute mode - value Min 2.5 → changed to 3 V
•Table 8 on page 8:
–SVRR; Typ values 65 and 60 dB → added
–αcs; Typ value 75 dB → added
•Figure 3 to 13: ﬁgures added
•Section 13 “Internal circuitry” on page 12:→ added
•Figure 14: ﬁgure adjusted
•Section 14.1 “Printed-circuit board (PCB)” on page 13:→ added
•Figure 15: ﬁgure added
•Section 14.2 “Thermal behaviour and heatsink calculation” on page 15:→ added
•Section 15.2 “Test conditions” on page 15:→ added
01 990414 - Preliminary speciﬁcation; initial version.

Philips Semiconductors TDA8944J

2 x 7 W stereo BTL audio ampliﬁer

Product speciﬁcation Rev. 02 — 14 February 2000 19 of 21

19. Data sheet status

[1] Please consult the most recently issued data sheet before initiating or completing a design.

20. Deﬁnitions

Short-form speciﬁcation — The data in a short-form speciﬁcation is

extracted from a full data sheet with the same type number and title. For

detailed information see the relevant data sheet or data handbook.

Limiting values deﬁnition — Limiting values given are in accordance with

the Absolute Maximum Rating System (IEC 60134). Stress above one or

more of the limiting values may cause permanent damage to the device.

These are stress ratings only and operation of the device at these or at any

other conditions above those given in the Characteristics sections of the

speciﬁcation is not implied. Exposure to limiting values for extended periods

may affect device reliability.

Application information — Applications that are described herein for any

of these products are for illustrative purposes only. Philips Semiconductors

make no representation or warranty that such applications will be suitable for

the speciﬁed use without further testing or modiﬁcation.

21. Disclaimers

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips Semiconductors

customers using or selling these products for use in such applications do so

at their own risk and agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to

make changes, without notice, in the products, including circuits, standard

cells, and/or software, described or contained herein in order to improve

design and/or performance. Philips Semiconductors assumes no

responsibility or liability for the use of any of these products, conveys no

licence or title under any patent, copyright, or mask work right to these

products, and makes no representations or warranties that these products

are free from patent, copyright, or mask work right infringement, unless

otherwise speciﬁed.

Datasheet status Product status Deﬁnition[1]

Objective speciﬁcation Development This data sheet contains the design target or goal speciﬁcations for product development. Speciﬁcation may

change in any manner without notice.

Preliminary speciﬁcation Qualiﬁcation This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips

Semiconductors reserves the right to make changes at any time without notice in order to improve design and

supply the best possible product.

Product speciﬁcation Production This data sheet contains ﬁnal speciﬁcations. Philips Semiconductors reserves the right to make changes at any

time without notice in order to improve design and supply the best possible product.

Philips Semiconductors TDA8944J

2 x 7 W stereo BTL audio ampliﬁer

Product speciﬁcation Rev. 02 — 14 February 2000 20 of 21

Philips Semiconductors - a worldwide company

Argentina: see South America

Australia: Tel. +61 2 9704 8141, Fax. +61 2 9704 8139

Austria: Tel. +43 160 101, Fax. +43 160 101 1210

Belarus: Tel. +375 17 220 0733, Fax. +375 17 220 0773

Belgium: see The Netherlands

Brazil: see South America

Bulgaria: Tel. +359 268 9211, Fax. +359 268 9102

Canada: Tel. +1 800 234 7381

China/Hong Kong: Tel. +852 2 319 7888, Fax. +852 2 319 7700

Colombia: see South America

Czech Republic: see Austria

Denmark: Tel. +45 3 288 2636, Fax. +45 3 157 0044

Finland: Tel. +358 961 5800, Fax. +358 96 158 0920

France: Tel. +33 14 099 6161, Fax. +33 14 099 6427

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Hungary: see Austria

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Indonesia: see Singapore

Ireland: Tel. +353 17 64 0000, Fax. +353 17 64 0200

Israel: Tel. +972 36 45 0444, Fax. +972 36 49 1007

Italy: Tel. +39 039 203 6838, Fax +39 039 203 6800

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Korea: Tel. +82 27 09 1412, Fax. +82 27 09 1415

Malaysia: Tel. +60 37 50 5214, Fax. +60 37 57 4880

Mexico: Tel. +9-5 800 234 7381

Middle East: see Italy

Netherlands: Tel. +31 40 278 2785, Fax. +31 40 278 8399

New Zealand: Tel. +64 98 49 4160, Fax. +64 98 49 7811

Norway: Tel. +47 22 74 8000, Fax. +47 22 74 8341

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Poland: Tel. +48 22 5710 000, Fax. +48 22 5710 001

Portugal: see Spain

Romania: see Italy

Russia: Tel. +7 095 755 6918, Fax. +7 095 755 6919

Singapore: Tel. +65 350 2538, Fax. +65 251 6500

Slovakia: see Austria

Slovenia: see Italy

South Africa: Tel. +27 11 471 5401, Fax. +27 11 471 5398

South America: Tel. +55 11 821 2333, Fax. +55 11 829 1849

Spain: Tel. +34 33 01 6312, Fax. +34 33 01 4107

Sweden: Tel. +46 86 32 2000, Fax. +46 86 32 2745

Switzerland: Tel. +41 14 88 2686, Fax. +41 14 81 7730

Taiwan: Tel. +886 22 134 2865, Fax. +886 22 134 2874

Thailand: Tel. +66 27 45 4090, Fax. +66 23 98 0793

Turkey: Tel. +90 216 522 1500, Fax. +90 216 522 1813

Ukraine: Tel. +380 44 264 2776, Fax. +380 44 268 0461

United Kingdom: Tel. +44 208 730 5000, Fax. +44 208 754 8421

United States: Tel. +1 800 234 7381

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: Tel. +381 11 3341 299, Fax. +381 11 3342 553

For all other countries apply to: Philips Semiconductors,

International Marketing & Sales Communications,

Building BE, P.O. Box 218, 5600 MD EINDHOVEN,

The Netherlands, Fax. +31 40 272 4825

Internet: http://www.semiconductors.philips.com

(SCA69)

© Philips Electronics N.V. 2000. Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 14 February 2000 Document order number: 9397 750 06861
Contents
Philips Semiconductors TDA8944J
x 7 W stereo BTL audio ampliﬁer
General description. . . . . . . . . . . . . . . . . . . . . .  1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .  1
Quick reference data . . . . . . . . . . . . . . . . . . . . .  1
Ordering information. . . . . . . . . . . . . . . . . . . . .  2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . .  2
Pinning information. . . . . . . . . . . . . . . . . . . . . .  3
1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  3
2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . .  3
Functional description  . . . . . . . . . . . . . . . . . . .  4
1 Input configuration . . . . . . . . . . . . . . . . . . . . . .  4
2 Power amplifier. . . . . . . . . . . . . . . . . . . . . . . . .  5
2.1 Output power measurement. . . . . . . . . . . . . . .  5
2.2 Headroom. . . . . . . . . . . . . . . . . . . . . . . . . . . . .  5
3 Mode selection . . . . . . . . . . . . . . . . . . . . . . . . .  5
3.1 Switch-on and switch-off. . . . . . . . . . . . . . . . . .  6
4 Supply Voltage Ripple Rejection (SVRR). . . . .  6
5 Built-in protection circuits . . . . . . . . . . . . . . . . .  6
5.1 Short-circuit protection . . . . . . . . . . . . . . . . . . .  6
5.2 Thermal shutdown protection . . . . . . . . . . . . . .  6
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .  7
Thermal characteristics. . . . . . . . . . . . . . . . . . .  7
Static characteristics. . . . . . . . . . . . . . . . . . . . .  7
Dynamic characteristics . . . . . . . . . . . . . . . . . .  8
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . .  12
Application information. . . . . . . . . . . . . . . . . .  13
1 Printed-circuit board (PCB). . . . . . . . . . . . . . .  13
1.1 Layout and grounding. . . . . . . . . . . . . . . . . . .  13
1.2 Power supply decoupling . . . . . . . . . . . . . . . .  14
2 Thermal behaviour and heatsink calculation  .  15
Test information. . . . . . . . . . . . . . . . . . . . . . . .  15
1 Quality information . . . . . . . . . . . . . . . . . . . . .  15
2 Test conditions . . . . . . . . . . . . . . . . . . . . . . . .  15
Package outline . . . . . . . . . . . . . . . . . . . . . . . .  16
Soldering  . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  17
1 Introduction to soldering through-hole mount
 packages . . . . . . . . . . . . . . . . . . . . . . . . . . . .  17
2 Soldering by dipping or by solder wave . . . . .  17
3 Manual soldering  . . . . . . . . . . . . . . . . . . . . . .  17
4 Package related soldering information . . . . . .  17
Revision history. . . . . . . . . . . . . . . . . . . . . . . .  18
Data sheet status. . . . . . . . . . . . . . . . . . . . . . .  19
Definitions  . . . . . . . . . . . . . . . . . . . . . . . . . . . .  19
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .  19