© Semiconductor Components Industries, LLC, 2007
October, 2019 Rev. 3
1Publication Order Number:
MB8S/D
MB1S-MB8S
Bridge Rectifiers, 0.5 A
Description
The MB family of bridge rectifiers is a 0.5 A rectifier family that
achieves high surge current absorption within a very small foot print.
Within its small 35 mm2 form factor, the MB family shines in its surge
capability. In order to absorb high surge currents, the design supports
a35A I
FSM rating and a 5.0 A2Sec I2T rating. Devices in the family
are also rated to breakdown voltages of up to 1000 V. These features
make the MB family ideal for small power supplies that need a little
extra surge capability.
For higher IFAV current ratings, lower profile packaging, or lower
VF values, explore the ON Semiconductor MDB family of bridge
rectifiers. For improved VF and efficiency values in the MB package
or even higher surge capability, ask about ON Semiconductor’s
pending MBxSV family.
Features
LowLeakage
Surge Overload Rating: 35 A peak
Ideal for Printed Circuit Board
UL Certified: UL #E258596
NRV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AECQ101
Qualified and PPAP Capable
This Device is PbFree and RoHS Compliant
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SOIC4 W
CASE 751EP
MARKING DIAGRAM
$Y = ON Semiconductor Logo
&Z = Assembly Plant Code
&3 = 3Digit Data Code (Year & Week)
MB*S = Specific Device Code
* = 1/2/4/6/8
See detailed ordering and shipping information on page 2 of
this data sheet.
ORDERING INFORMATION
+
$Y&Z&3
MB*S
MB1SMB8S
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2
ABSOLUTE MAXIMUM RATINGS
(Values are at TA = 25°C unless otherwise noted)
Symbol Parameter MB1S MB2S MB4S MB6S MB8S Unit
VRRM Maximum Repetitive Reverse Voltage 100 200 400 600 800 V
VRMS Maximum RMS Bridge Input Voltage 70 140 280 420 560 V
VRDC Reverse Voltage (Rated VR) 100 200 400 600 800 V
IF(AV) Average Rectified Forward Current at TA = 50°C0.5 A
IFSM NonRepetitive Peak Forward Surge Current:
8.3 ms Single HalfSineWave
35 A
TSTG Storage Temperature Range 55 to +150 °C
TJOperating Junction Temperature Range 55 to +150 _C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Symbol Parameter Value Unit
PDPower Dissipation 1.4 W
RθJA Thermal Resistance, Junction to Ambient, per Leg (Note 1) 85 °C/W
RθJL Thermal Resistance, Junction to Lead, per Leg (Note 1) 20 °C/W
1. Device mounted on PCB with 0.5 × 0.5 inch (13 × 13 mm) lead length.
ELECTRICAL CHARACTERISTICS (Values are at TA = 25°C unless otherwise noted)
Symbol Parameter Conditions Value Unit
VFForward Voltage, per Bridge IF = 0.5 A 1.0 V
IRReverse Current, per Leg at Rated VRTA = 25°C5.0 mA
TA = 125°C0.5 mA
I
2
t I
2
t Rating for Fusing t < 8.3 ms 5.0 A
2
s
CTTotal Capacitance, per Leg VR = 4.0 V, f = 1.0 MHz 13 pF
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
ORDERING INFORMATION
Part Number Top Mark Package Shipping
MB1S, NRVMB1S* MB1S SOIC4 W
(PbFree)
3,000 / Tape & Reel
MB2S, NRVMB2S* MB2S
MB4S, NRVMB4S* MB4S
MB6S, NRVMB6S* MB6S
MB8S, NRVMB8S* MB8S
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NRV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ101 Qualified and PPAP
Capable
MB1SMB8S
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3
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 1. Derating Curve for Output Rectified
Current
Figure 2. Typical Reverse Leakage Characteristics
Per Leg
Figure 3. Maximum NonRepetitive Peak Forward
Surge Current Per Leg
Figure 4. Typical Junction Capacitance Per Leg
Figure 5. Typical Forward Voltage Characteristics
Per Leg
0 20 40 60 80 100 120 140 160
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
Ambient Temperature (5C)
Average Forward Rectified
Current (A)
Aluminum Substrate
Glass
Epoxy
P.C.B
Resistive or Inductive Load
0
0.01
Percent of Rated Peak Reverse Voltage (%)
Instantaneous Reverse
Leakage Current (mA)
Tj = 25°C
20 40 60 80 100
0.1
1
10
100
Tj = 125°C
0.2
0.01
Instantaneous Forward Voltage (V)
Instantaneous Forward Current (A)
Tj = 25°C
0.1
1
10
Tj = 25°C
Pulse Width = 300 ms
1% Duty Cycles
0.4 0.6 0.8 1.0 1.2 1.4 1.6
0.1
0
Reverse Voltage (V)
Junction Capacitance (pF)
Tj = 25°C
f = 1 MHz
Vslg = 50 mVpp
1 10 100 200
5
10
15
20
25
30
1
0
Number of Cycles
F = 50 Hz
5
10
15
20
25
30
35
Peak Forward Surge Current (A)
F = 60 Hz
10 100
Tj = 40°C
Single Half SineWave
(JEDEC Method)
1 Cycle
SOIC4 W
CASE 751EP
ISSUE O
DATE 30 SEP 2016
0.10 C
0.13 C A B
0.13 C B A
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
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DOCUMENT NUMBER:
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Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
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