_______________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
MAX19993
Dual, SiGe, High-Linearity, 1200MHz to 1700MHz
Downconversion Mixer with LO Buffer/Switch
19-5307; Rev 0; 6/10
General Description
The MAX19993 dual-channel downconverter is designed
to provide 6.4dB of conversion gain, +27dBm input IP3,
15.4dBm 1dB input compression point, and a noise
figure of 9.8dB for 1200MHz to 1700MHz diversity
receiver applications. With an optimized LO frequency
range of 1000MHz to 1560MHz, this mixer is ideal
for low-side LO injection architectures. High-side LO
injection is supported by the MAX19993A, which is pin-
pin and functionally compatible with the MAX19993.
In addition to offering excellent linearity and noise
performance, the MAX19993 also yields a high level
of component integration. This device includes two
double-balanced passive mixer cores, two LO buffers, a
dual-input LO selectable switch, and a pair of differential
IF output amplifiers. Integrated on-chip baluns allow for
single-ended RF and LO inputs. The device requires a
nominal LO drive of 0dBm and a typical supply current of
337mA at VCC = +5.0V or 275mA at VCC = +3.3V.
The MAX19993 is pin compatible with the MAX9985/
MAX19985A/MAX9995/MAX19993A/MAX19994/
MAX19994A/MAX19995/MAX19995A series of 700MHz
to 2200MHz mixers and pin similar to the MAX19997A/
MAX19999 series of 1850MHz to 4000MHz mixers,
making this entire family of downconverters ideal for
applications where a common PCB layout is used across
multiple frequency bands.
The device is available in a 6mm x 6mm, 36-pin TQFN
package with an exposed pad. Electrical performance is
guaranteed over the extended temperature range, from
TC = -40NC to +85NC.
Applications
WCDMA/LTE Base Stations
Wireless Local Loop
Fixed Broadband Wireless Access
Private Mobile Radios
Military Systems
Features
S 1200MHz to 1700MHz RF Frequency Range
S 1000MHz to 1560MHz LO Frequency Range
S 50MHz to 500MHz IF Frequency Range
S 6.4dB Typical Conversion Gain
S 9.8dB Typical Noise Figure
S +27dBm Typical Input IP3
S 15.4dBm Typical Input 1dB Compression Point
S 72dBc Typical 2RF - 2LO Spurious Rejection at
PRF = -10dBm
S Dual Channels Ideal for Diversity Receiver
Applications
S 47dB Typical Channel-to-Channel Isolation
S Low -6dBm to +3dBm LO Drive
S Integrated LO Buffer
S Internal RF and LO Baluns for Single-Ended
Inputs
S Built-In SPDT LO Switch with 57dB LO-to-LO
Isolation and 50ns Switching Time
S Pin Compatible with the MAX9985/MAX19985A/
MAX9995/MAX19993A/MAX19994/MAX19994A/
MAX19995/MAX19995A Series of 700MHz to
2200MHz Mixers
S Pin Similar to the MAX19997A/MAX19999 Series
of 1850MHz to 4000MHz Mixers
S Single +5V or +3.3V Supply
S External Current-Setting Resistors Provide Option
for Operating Device in Reduced-Power/Reduced-
Performance Mode
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
T = Tape and reel.
Ordering Information
PART TEMP RANGE PIN-PACKAGE
MAX19993ETX+ -40NC to +85NC36 TQFN-EP*
MAX19993ETX+T -40NC to +85NC36 TQFN-EP*
MAX19993
Dual, SiGe, High-Linearity, 1200MHz to 1700MHz
Downconversion Mixer with LO Buffer/Switch
2
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
VCC to GND ..........................................................-0.3V to +5.5V
LO1, LO2 to GND .............................................................. Q0.3V
LOSEL to GND ......................................... -0.3V to (VCC + 0.3V)
RFMAIN, RFDIV, and LO_ Input Power ........................ +15dBm
RFMAIN, RFDIV Current (RF is DC shorted to GND
through a balun) .............................................................50mA
TAPMAIN, TAPDIV to GND .....................................-0.3V to +2V
Any Other Pins to GND ............................ -0.3V to (VCC + 0.3V)
Continuous Power Dissipation (Note 1) ..............................8.7W
BJA (Notes 2, 3) ........................................................... +38NC/W
BJC (Notes 1, 3) .............................................................7.4NC/W
Operating Temperature Range (Note 4) ... TC = -40NC to +85NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, VCC = 4.75V to 5.25V, no input AC signals. TC = -40NC to +85NC, R1 = R4 = 681I,
R2 = R5 = 1.82kI. Typical values are at VCC = 5.0V, TC = +25NC, unless otherwise noted. All parameters are production tested.)
ABSOLUTE MAXIMUM RATINGS
Note 1: Based on junction temperature TJ = TC + (BJC x VCC x ICC). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.
The junction temperature must not exceed +150NC.
Note 2: Junction temperature TJ = TA + (BJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150NC.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Note 4: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.
3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, VCC = 3.0V to 3.6V, no input AC signals. TC = -40NC to +85NC, R1 = R4 = 681I, R2 = R5 = 1.43kI.
Typical values are at VCC = 3.3V, TC = +25NC, unless otherwise noted. Parameters are guaranteed by design and not production
tested.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage VCC 4.75 5 5.25 V
Supply Current ICC Total supply current 337 400 mA
LOSEL Input High Voltage VIH 2 V
LOSEL Input Low Voltage VIL 0.8 V
LOSEL Input Current IIH and IIL -10 +10 FA
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage VCC 3.0 3.3 3.6 V
Supply Current ICC Total supply current (Note 5) 275 mA
LOSEL Input High Voltage VIH 2 V
LOSEL Input Low Voltage VIL 0.8 V
MAX19993
Dual, SiGe, High-Linearity, 1200MHz to 1700MHz
Downconversion Mixer with LO Buffer/Switch
3
RECOMMENDED AC OPERATING CONDITIONS
5.0V SUPPLY, LOW-SIDE INJECTION AC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit (see Table 1). R1 = R4 = 681I, R2 = R5 = 1.82kI, VCC = 4.75V to 5.25V, RF and LO ports are driven from
50I sources, PLO = -6dBm to +3dBm, PRF = -5dBm, fRF = 1200MHz to 1700MHz, fLO = 1060MHz to 1560MHz, fIF = 140MHz, fRF > fLO,
TC = -40NC to +85NC. Typical values are at VCC = +5.0V, PRF = -5dBm, PLO = 0dBm, fRF = 1450MHz, fLO = 1310MHz, fIF = 140MHz,
TC = +25NC. All parameters are guaranteed by design and characterization, unless otherwise noted.) (Note 7)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
RF Frequency fRF (Note 6) 1200 1700 MHz
LO Frequency fLO (Note 6) 1000 1560 MHz
IF Frequency fIF
Using Mini-Circuits TC4-1W-17 4:1 trans-
former as defined in the Typical Application
Circuit, IF matching components affect the
IF frequency range (Note 6)
100 500
MHz
Using Mini-Circuits TC4-1W-7A 4:1 trans-
former as defined in the Typical Application
Circuit, IF matching components affect the
IF frequency range (Note 6)
50 250
LO Drive Level PLO (Note 6) -6 +3 dBm
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Conversion Gain (Note 5) GC
4.5 6.4 7.4
dBTC = +25NC 5.1 6.4 7.0
TC = +25NC, fRF = 1427MHz to 1463MHz 5.2 6.4 6.9
Conversion Gain Flatness DGCfRF = 1427MHz to 1463MHz Q0.03 dB
Gain Variation Over Temperature TCCG TC = -40NC to +85NC -0.009 dB/NC
Input Compression Point IP1dB fRF = 1450MHz (Notes 5, 8) 12.9 15.4 dBm
Input Third-Order Intercept Point IIP3
fRF1 - fRF2 = 1MHz, PRF = -5dBm per tone 24.0 27.0
dBm
fRF1 - fRF2 = 1MHz, PRF = -5dBm per tone,
fRF = 1427MHz to 1463MHz, TC = +25NC
(Note 5)
24.8 27.0
fRF1 - fRF2 = 1MHz, PRF = -5dBm per tone,
fRF = 1427MHz to 1463MHz (Note 5) 24.4 27.0
Input Third-Order Intercept Point
Variation Over Temperature TCIIP3 fRF1 - fRF2 = 1MHz, PRF = -5dBm per tone,
TC = -40NC to +85NCQ0.5 dBm
Noise Figure (Note 9) NFSSB
Single sideband, no blockers present 9.8 12.7
dB
fRF = 1427MHz to 1463MHz, TC = +25NC,
PLO = 0dBm, single sideband, no blockers
present
9.8 11.0
fRF = 1427MHz to 1463MHz, PLO = 0dBm,
single sideband, no blockers present 9.8 12.0
MAX19993
Dual, SiGe, High-Linearity, 1200MHz to 1700MHz
Downconversion Mixer with LO Buffer/Switch
4
5.0V SUPPLY, LOW-SIDE INJECTION AC ELECTRICAL CHARACTERISTICS (continued)
(Typical Application Circuit (see Table 1). R1 = R4 = 681I, R2 = R5 = 1.82kI, VCC = 4.75V to 5.25V, RF and LO ports are driven from
50I sources, PLO = -6dBm to +3dBm, PRF = -5dBm, fRF = 1200MHz to 1700MHz, fLO = 1060MHz to 1560MHz, fIF = 140MHz, fRF > fLO,
TC = -40NC to +85NC. Typical values are at VCC = +5.0V, PRF = -5dBm, PLO = 0dBm, fRF = 1450MHz, fLO = 1310MHz, fIF = 140MHz,
TC = +25NC. All parameters are guaranteed by design and characterization, unless otherwise noted.) (Note 7)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Noise Figure Temperature
Coefficient TCNF Single sideband, no blockers present,
TC = -40NC to +85NC0.016 dB/NC
Noise Figure with Blocker NFB
PBLOCKER = +8dBm, fRF = 1450MHz,
fLO = 1310MHz, fBLOCKER = 1550MHz,
PLO = 0dBm, VCC = 5.0V, TC = +25NC
(Notes 9, 10)
21.0 22.8 dB
2RF - 2LO Spur Rejection
(Note 9) 2x2
fRF = 1450MHz,
fLO = 1310MHz,
fSPUR = 1380MHz
PRF = -10dBm 58 72
dBc
PRF = -5dBm 53 67
fRF = 1450MHz,
fLO = 1310MHz,
fSPUR = 1380MHz,
PLO = 0dBm,
VCC = 5.0V,
TC = +25NC
PRF = -10dBm 61 72
dBc
PRF = -5dBm 56 67
3RF - 3LO Spur Rejection
(Note 9) 3x3
fRF = 1450MHz,
fLO = 1310MHz,
fSPUR = 1356.67MHz
PRF = -10dBm 77 93
dBc
PRF = -5dBm 67 83
fRF = 1450MHz,
fLO = 1310MHz,
fSPUR = 1356.67MHz,
PLO = 0dBm,
VCC = 5.0V,
TC = +25NC
PRF = -10dBm 82 93
dBc
PRF = -5dBm 72 83
RF Input Return Loss LO and IF terminated into matched
impedance, LO on 21 dB
LO Input Return Loss
LO port selected, RF and IF terminated into
matched impedance 24
dB
LO port unselected, RF and IF terminated
into matched impedance 27
IF Output Impedance ZIF Nominal differential impedance of the IF
outputs 200 I
IF Output Return Loss
RF terminated into 50I, LO driven by
50I source, IF transformed to 50I using
external components shown in the Typical
Application Circuit
15 dB
RF-to-IF Isolation (Note 5) 33 dB
LO Leakage at RF Port -38 dBm
2LO Leakage at RF Port -27 dBm
MAX19993
Dual, SiGe, High-Linearity, 1200MHz to 1700MHz
Downconversion Mixer with LO Buffer/Switch
5
5.0V SUPPLY, LOW-SIDE INJECTION AC ELECTRICAL CHARACTERISTICS (continued)
(Typical Application Circuit (see Table 1). R1 = R4 = 681I, R2 = R5 = 1.82kI, VCC = 4.75V to 5.25V, RF and LO ports are driven from
50I sources, PLO = -6dBm to +3dBm, PRF = -5dBm, fRF = 1200MHz to 1700MHz, fLO = 1060MHz to 1560MHz, fIF = 140MHz, fRF > fLO,
TC = -40NC to +85NC. Typical values are at VCC = +5.0V, PRF = -5dBm, PLO = 0dBm, fRF = 1450MHz, fLO = 1310MHz, fIF = 140MHz,
TC = +25NC. All parameters are guaranteed by design and characterization, unless otherwise noted.) (Note 7)
3.3V SUPPLY, LOW SIDE INJECTION AC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit (see Table 1). R1 = R4 = 681I, R2 = R5 = 1.43kI. Typical values are at VCC = 3.3V, PRF = -5dBm, PLO = 0dBm,
fRF = 1450MHz, fLO = 1310MHz, fIF = 140MHz, TC = +25NC, unless otherwise noted.) (Note 7)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
LO Leakage at IF Port (Note 5) -18 dBm
Channel Isolation (Note 5)
RFMAIN converted power measured at
IFDIV relative to IFMAIN, all unused ports
terminated to 50I
43 47
dB
RFDIV converted power measured at
IFMAIN relative to IFDIV, all unused ports
terminated to 50I
43 47
LO-to-LO Isolation PLO1 = +3dBm, PLO2 = +3dBm,
fLO1 = 1310MHz, fLO2 = 1311MHz (Note 5) 47 57 dB
LO Switching Time 50% of LOSEL to IF settled within 2 degrees 50 ns
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Conversion Gain GC(Note 5) 6.2 dB
Conversion Gain Flatness DGCfRF = 1427MHz to 1463MHz Q0.05 dB
Gain Variation Over Temperature TCCG TC = -40NC to +85NC-0.009 dB/NC
Input Compression Point IP1dB (Note 8) 12.8 dBm
Input Third-Order Intercept Point IIP3 fRF1 - fRF2 = 1MHz 24.4 dBm
Input Third-Order Intercept Point
Variation Over Temperature TCIIP3 fRF1 - fRF2 = 1MHz, PRF = -5dBm per tone,
TC = -40NC to +85NCQ0.8 dBm
Noise Figure NFSSB Single sideband, no blockers present 9.8 dB
Noise Figure Temperature
Coefficient TCNF Single sideband, no blockers present,
TC = -40NC to +85NC0.016 dB/NC
2RF - 2LO Spur Rejection 2 x 2 PRF = -10dBm 73 dBc
PRF = -5dBm 68
3RF - 3LO Spur Rejection 3 x 3 PRF = -10dBm 80 dBc
PRF = -5dBm 70
RF Input Return Loss LO and IF terminated into matched
impedance, LO on 21 dB
LO Input Return Loss
LO port selected, RF and IF terminated into
matched impedance 24
dB
LO port unselected, RF and IF terminated
into matched impedance 27
MAX19993
Dual, SiGe, High-Linearity, 1200MHz to 1700MHz
Downconversion Mixer with LO Buffer/Switch
6
Note 5: 100% production tested for functionality.
Note 6: Not production tested. Operation outside this range is possible, but with degraded performance of some parameters. See
the Typical Operating Characteristics section.
Note 7: All limits reflect losses of external components, including a 0.5dB loss at fIF = 140MHz due to the 4:1 transformer. Output
measurements were taken at IF outputs of the Typical Application Circuit.
Note 8: Maximum reliable continuous input power applied to the RF or IF port of this device is +12dBm from a 50I source.
Note 9: Not production tested.
Note 10: Measured with external LO source noise filtered so the noise floor is -174dBm/Hz. This specification reflects the effects
of all SNR degradations in the mixer, including the LO noise as defined in Application Note 2021: Specifications and
Measurement of Local Oscillator Noise in Integrated Circuit Base Station Mixers.
3.3V SUPPLY, LOW SIDE INJECTION AC ELECTRICAL CHARACTERISTICS (continued)
(Typical Application Circuit (see Table 1). R1 = R4 = 681I, R2 = R5 = 1.43kI. Typical values are at VCC = 3.3V, PRF = -5dBm, PLO = 0dBm,
fRF = 1450MHz, fLO = 1310MHz, fIF = 140MHz, TC = +25NC, unless otherwise noted.) (Note 7)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
IF Output Return Loss
RF terminated into 50I, LO driven by
50I source, IF transformed to 50I using
external components shown in the Typical
Application Circuit
15 dB
RF-to-IF Isolation 33 dB
LO Leakage at RF Port -45 dBm
2LO Leakage at RF Port -27 dBm
LO Leakage at IF Port -22 dBm
Channel Isolation
RFMAIN converted power measured at
IFDIV relative to IFMAIN, all unused ports
terminated to 50I
47
dB
RFDIV converted power measured at
IFMAIN relative to IFDIV, all unused ports
terminated to 50I
47
LO-to-LO Isolation PLO1 = +3dBm, PLO2 = +3dBm,
fLO1 = 1310MHz, fLO2 = 1311MHz 57 dB
LO Switching Time 50% of LOSEL to IF settled within
2 degrees 50 ns
MAX19993
Dual, SiGe, High-Linearity, 1200MHz to 1700MHz
Downconversion Mixer with LO Buffer/Switch
7
Typical Operating Characteristics
(Typical Application Circuit (see Table 1). VCC = 5.0V, fRF > fLO for a 140MHz IF, PRF = -5dBm, PLO = 0dBm, TC = +25°C, unless
otherwise noted.)
CONVERSION GAIN vs. RF FREQUENCY
MAX19993 toc01
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
1600150014001300
5
6
7
8
4
1200 1700
TC = -40°C
TC = +85°C
TC = +25°C
CONVERSION GAIN vs. RF FREQUENCY
MAX19993 toc02
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
1600150014001300
5
6
7
8
4
1200 1700
PLO = -6dBm, -3dBm, 0dBm, +3dBm
CONVERSION GAIN vs. RF FREQUENCY
MAX19993 toc03
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
1600150014001300
5
6
7
8
4
1200 1700
VCC = 4.75V, 5.0V, 5.25V
INPUT IP3 vs. RF FREQUENCY
MAX19993 toc04
RF FREQUENCY (MHz)
INPUT IP3 (dBm)
1600150014001300
26
27
28
25
1200 1700
PRF = -5dBm/TONE
TC = +85°C
TC = -40°C
TC = +25°C
INPUT IP3 vs. RF FREQUENCY
MAX19993 toc05
RF FREQUENCY (MHz)
INPUT IP3 (dBm)
1600150014001300
26
27
28
25
1200 1700
PRF = -5dBm/TONE
PLO = -3dBm
PLO = -6dBm
PLO = +3dBm
PLO = 0dBm
INPUT IP3 vs. RF FREQUENCY
MAX19993 toc06
RF FREQUENCY (MHz)
INPUT IP3 (dBm)
1600150014001300
26
27
28
25
1200 1700
PRF = -5dBm/TONE
VCC = 4.75V
VCC = 5.25V
VCC = 5.0V
NOISE FIGURE vs. RF FREQUENCY
MAX19993 toc07
RF FREQUENCY (MHz)
NOISE FIGURE (dB)
1600150014001300
8
9
10
11
12
13
7
1200 1700
TC = +25°C
TC = -40°C
TC = +85°C
NOISE FIGURE vs. RF FREQUENCY
MAX19993 toc08
RF FREQUENCY (MHz)
NOISE FIGURE (dB)
1600150014001300
8
9
10
11
12
13
7
1200 1700
PLO = -6dBm, -3dBm, 0dBm, +3dBm
NOISE FIGURE vs. RF FREQUENCY
MAX19993 toc09
RF FREQUENCY (MHz)
NOISE FIGURE (dB)
1600150014001300
8
9
10
11
12
13
7
1200 1700
VCC = 4.75V, 5.0V, 5.25V
MAX19993
Dual, SiGe, High-Linearity, 1200MHz to 1700MHz
Downconversion Mixer with LO Buffer/Switch
8
Typical Operating Characteristics (continued)
(Typical Application Circuit (see Table 1). VCC = 5.0V, fRF > fLO for a 140MHz IF, PRF = -5dBm, PLO = 0dBm, TC = +25°C, unless
otherwise noted.)
2RF - 2LO RESPONSE vs. RF FREQUENCY
MAX19993 toc10
RF FREQUENCY (MHz)
2RF - 2LO RESPONSE (dBc)
1600150014001300
60
70
80
50
1200 1700
PRF = -5dBm
TC = -40°C
TC = +85°C
TC = +25°C
2RF - 2LO RESPONSE vs. RF FREQUENCY
MAX19993 toc11
RF FREQUENCY (MHz)
2RF - 2LO RESPONSE (dBc)
1600150014001300
60
70
80
50
1200 1700
PRF = -5dBm
PLO = -3dBm
PLO = +3dBm
PLO = 0dBm
PLO = -6dBm
2RF - 2LO RESPONSE vs. RF FREQUENCY
MAX19993 toc12
RF FREQUENCY (MHz)
2RF - 2LO RESPONSE (dBc)
1600150014001300
60
70
80
50
1200 1700
PRF = -5dBm
VCC = 4.75V, 5.0V, 5.25V
3RF - 3LO RESPONSE vs. RF FREQUENCY
MAX19993 toc13
RF FREQUENCY (MHz)
3RF - 3LO RESPONSE (dBc)
1600150014001300
65
75
85
95
55
1200 1700
PRF = -5dBm
TC = -40°C
TC = +85°C
TC = +25°C
3RF - 3LO RESPONSE vs. RF FREQUENCY
MAX19993 toc14
RF FREQUENCY (MHz)
3RF - 3LO RESPONSE (dBc)
1600150014001300
65
75
85
95
55
1200 1700
PRF = -5dBm
PLO = -3dBm
PLO = +3dBm
PLO = 0dBm
PLO = -6dBm
3RF - 3LO RESPONSE vs. RF FREQUENCY
MAX19993 toc15
RF FREQUENCY (MHz)
3RF - 3LO RESPONSE (dBc)
1600150014001300
65
75
85
95
55
1200 1700
PRF = -5dBm
VCC = 4.75V
VCC = 5.0V
VCC = 5.25V
INPUT P1dB vs. RF FREQUENCY
MAX19993 toc16
RF FREQUENCY (MHz)
INPUT P1dB (dBm)
1600150014001300
14
15
16
17
13
1200 1700
TC = -40°C
TC = +85°C TC = +25°C
INPUT P1dB vs. RF FREQUENCY
MAX19993 toc17
RF FREQUENCY (MHz)
INPUT P1dB (dBm)
1600150014001300
14
15
16
17
13
1200 1700
PLO = -6dBm, -3dBm, 0dBm, +3dBm
INPUT P1dB vs. RF FREQUENCY
MAX19993 toc18
RF FREQUENCY (MHz)
INPUT P1dB (dBm)
1600150014001300
14
15
16
17
13
1200 1700
VCC = 4.75V
VCC = 5.25V
VCC = 5.0V
MAX19993
Dual, SiGe, High-Linearity, 1200MHz to 1700MHz
Downconversion Mixer with LO Buffer/Switch
9
Typical Operating Characteristics (continued)
(Typical Application Circuit (see Table 1). VCC = 5.0V, fRF > fLO for a 140MHz IF, PRF = -5dBm, PLO = 0dBm, TC = +25°C, unless
otherwise noted.)
CHANNEL ISOLATION vs. RF FREQUENCY
MAX19993 toc19
RF FREQUENCY (MHz)
CHANNEL ISOLATION (dB)
1600150014001300
35
40
45
50
55
60
30
1200 1700
TC = -40°C, +25°C, +85°C
CHANNEL ISOLATION vs. RF FREQUENCY
MAX19993 toc20
RF FREQUENCY (MHz)
CHANNEL ISOLATION (dB)
1600150014001300
35
40
45
50
55
60
30
1200 1700
PLO = -6dBm, -3dBm, 0dBm, +3dBm
CHANNEL ISOLATION vs. RF FREQUENCY
MAX19993 toc21
RF FREQUENCY (MHz)
CHANNEL ISOLATION (dB)
1600150014001300
35
40
45
50
55
60
30
1200 1700
VCC = 4.75V, 5.0V, 5.25V
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
MAX19993 toc22
LO FREQUENCY (MHz)
LO LEAKAGE AT IF PORT (dBm)
1460136012601160
-30
-20
-10
0
-40
1060 1560
TC = -40°C
TC = +85°C
TC = +25°C
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
MAX19993 toc23
LO FREQUENCY (MHz)
LO LEAKAGE AT IF PORT (dBm)
1460136012601160
-30
-20
-10
0
-40
1060 1560
PLO = -3dBm
PLO = -6dBm
PLO = +3dBm
PLO = 0dBm
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
MAX19993 toc24
LO FREQUENCY (MHz)
LO LEAKAGE AT IF PORT (dBm)
1460136012601160
-30
-20
-10
0
-40
1060 1560
VCC = 4.75V
VCC = 5.25V
VCC = 5.0V
RF-TO-IF ISOLATION vs. RF FREQUENCY
MAX19993 toc25
RF FREQUENCY (MHz)
RF-TO-IF ISOLATION (dB)
1600150014001300
30
40
50
20
1200 1700
TC = -40°C
TC = +85°C
TC = +25°C
RF-TO-IF ISOLATION vs. RF FREQUENCY
MAX19993 toc26
RF FREQUENCY (MHz)
RF-TO-IF ISOLATION (dB)
1600150014001300
30
40
50
20
1200 1700
PLO = -6dBm, -3dBm, 0dBm, +3dBm
RF-TO-IF ISOLATION vs. RF FREQUENCY
MAX19993 toc27
RF FREQUENCY (MHz)
RF-TO-IF ISOLATION (dB)
1600150014001300
30
40
50
20
1200 1700
VCC = 4.75V, 5.0V, 5.25V
MAX19993
Dual, SiGe, High-Linearity, 1200MHz to 1700MHz
Downconversion Mixer with LO Buffer/Switch
10
Typical Operating Characteristics (continued)
(Typical Application Circuit (see Table 1). VCC = 5.0V, fRF > fLO for a 140MHz IF, PRF = -5dBm, PLO = 0dBm, TC = +25°C, unless
otherwise noted.)
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX19993 toc28
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT (dBm)
1490138012701160
-60
-50
-40
-30
-20
-70
1050 1600
TC = -40°C
TC = +85°C
TC = +25°C
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX19993 toc29
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT (dBm)
1490138012701160
-60
-50
-40
-30
-20
-70
1050 1600
PLO = -3dBm
PLO = -6dBm
PLO = +3dBm
PLO = 0dBm
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX19993 toc30
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT (dBm)
1490138012701160
-60
-50
-40
-30
-20
-70
1050 1600
VCC = 4.75V, 5.0V, 5.25V
2LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX19993 toc31
LO FREQUENCY (MHz)
2LO LEAKAGE AT RF PORT (dBm)
1490138012701160
-50
-40
-30
-20
-10
-60
1050 1600
TC = -40°C
TC = +85°C
TC = +25°C
2LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX19993 toc32
LO FREQUENCY (MHz)
2LO LEAKAGE AT RF PORT (dBm)
1490138012701160
-50
-40
-30
-20
-10
-60
1050 1600
PLO = -3dBm
PLO = -6dBm
PLO = +3dBm
PLO = 0dBm
2LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX19993 toc33
LO FREQUENCY (MHz)
2LO LEAKAGE AT RF PORT (dBm)
1490138012701160
-50
-40
-30
-20
-10
-60
1050 1600
VCC = 4.75V
VCC = 5.25V
VCC = 5.0V
LO SWITCH ISOLATION vs. LO FREQUENCY
MAX19993 toc34
LO FREQUENCY (MHz)
LO SWITCH ISOLATION (dB)
1490138018701160
50
60
70
40
1050 1600
TC = -40°C
TC = +85°C
TC = +25°C
LO SWITCH ISOLATION vs. LO FREQUENCY
MAX19993 toc35
LO FREQUENCY (MHz)
LO SWITCH ISOLATION (dB)
1490138018701160
50
60
70
40
1050 1600
PLO = -6dBm, -3dBm, 0dBm, +3dBm
LO SWITCH ISOLATION vs. LO FREQUENCY
MAX19993 toc36
LO FREQUENCY (MHz)
LO SWITCH ISOLATION (dB)
1490138018701160
50
60
70
40
1050 1600
VCC = 4.75V, 5.0V, 5.25V
MAX19993
Dual, SiGe, High-Linearity, 1200MHz to 1700MHz
Downconversion Mixer with LO Buffer/Switch
11
Typical Operating Characteristics (continued)
(Typical Application Circuit (see Table 1). VCC = 5.0V, fRF > fLO for a 140MHz IF, PRF = -5dBm, PLO = 0dBm, TC = +25°C, unless
otherwise noted.)
RF PORT RETURN LOSS
vs. RF FREQUENCY
MAX19993 toc37
RF FREQUENCY (MHz)
RF PORT RETURN LOSS (dB)
1600150014001300
25
20
15
10
5
0
30
1200 1700
IF = 140MHz
PLO = -6dBm, -3dBm, 0dBm, +3dBm
IF PORT RETURN LOSS
vs. IF FREQUENCY
MAX19993 toc38
IF FREQUENCY (MHz)
IF PORT RETURN LOSS (dB)
410320230140
25
20
15
10
5
0
30
50 500
VCC = 4.75V, 5.0V, 5.25V
LO = 1560MHz
LO = 1060MHz
LO = 1310MHz
LO SELECTED PORT RETURN LOSS
vs. LO FREQUENCY
MAX19993 toc39
LO FREQUENCY (MHz)
LO SELECTED PORT RETURN LOSS (dB)
1800160014001200
30
20
10
0
40
1000 2000
PLO = -3dBm
PLO = -6dBm
PLO = +3dBm
PLO = 0dBm
LO UNSELECTED PORT RETURN LOSS
vs. LO FREQUENCY
MAX19993 toc40
LO FREQUENCY (MHz)
LO UNSELECTED PORT RETURN LOSS (dB)
1800160014001200
40
30
20
10
0
50
1000 2000
PLO = -6dBm, -3dBm, 0dBm, +3dBm
SUPPLY CURRENT vs. TEMPERATURE (TC)
MAX19993 toc41
TEMPERATURE (°C)
SUPPLY CURRENT (mA)
603510-15
320
330
340
350
360
370
310
-40 85
VCC = 4.75V
VCC = 5.25V VCC = 5.0V
MAX19993
Dual, SiGe, High-Linearity, 1200MHz to 1700MHz
Downconversion Mixer with LO Buffer/Switch
12
Typical Operating Characteristics (continued)
(Typical Application Circuit (see Table 1). VCC = 3.3V, fRF > fLO for a 140MHz IF, PRF = -5dBm, PLO = 0dBm, TC = +25°C, unless
otherwise noted.)
INPUT IP3 vs. RF FREQUENCY
MAX19993 toc46
RF FREQUENCY (MHz)
INPUT IP3 (dBm)
1600150014001300
22
23
24
25
26
27
21
1200 1700
VCC = 3.3V
PRF = -5dBm/TONE
PLO = +3dBm
PLO = -6dBm
PLO = -3dBm
PLO = 0dBm
INPUT IP3 vs. RF FREQUENCY
MAX19993 toc47
RF FREQUENCY (MHz)
INPUT IP3 (dBm)
1600150014001300
22
23
24
25
26
27
21
1200 1700
PRF = -5dBm/TONE
VCC = 3.0V
VCC = 3.6V
VCC = 3.3V
NOISE FIGURE vs. RF FREQUENCY
MAX19993 toc48
RF FREQUENCY (MHz)
NOISE FIGURE (dB)
1600150014001300
8
9
10
11
12
13
7
1200 1700
TC = -40°C
TC = +85°C
TC = +25°C
VCC = 3.3V
NOISE FIGURE vs. RF FREQUENCY
MAX19993 toc49
RF FREQUENCY (MHz)
NOISE FIGURE (dB)
1600150014001300
8
9
10
11
12
13
7
1200 1700
VCC = 3.3V
PLO = -6dBm, -3dBm, 0dBm, +3dBm
NOISE FIGURE vs. RF FREQUENCY
MAX19993 toc50
RF FREQUENCY (MHz)
NOISE FIGURE (dB)
1600150014001300
8
9
10
11
12
13
7
1200 1700
VCC = 3.0V, 3.3V, 3.6V
CONVERSION GAIN vs. RF FREQUENCY
MAX19993 toc42
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
1600150014001300
5
6
7
8
4
1200 1700
TC = -40°C
TC = +85°C TC = +25°C
VCC = 3.3V
CONVERSION GAIN vs. RF FREQUENCY
MAX19993 toc43
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
1600150014001300
5
6
7
8
4
1200 1700
VCC = 3.3V
PLO = -6dBm, -3dBm, 0dBm, +3dBm
CONVERSION GAIN vs. RF FREQUENCY
MAX19993 toc44
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
1600150014001300
5
6
7
8
4
1200 1700
VCC = 3.0V
VCC = 3.6V
VCC = 3.3V
INPUT IP3 vs. RF FREQUENCY
MAX19993 toc45
RF FREQUENCY (MHz)
INPUT IP3 (dBm)
1600150014001300
22
23
24
25
26
27
21
1200 1700
TC = -40°C
TC = +85°C
TC = +25°C
VCC = 3.3V
PRF = -5dBm/TONE
MAX19993
Dual, SiGe, High-Linearity, 1200MHz to 1700MHz
Downconversion Mixer with LO Buffer/Switch
13
Typical Operating Characteristics (continued)
(Typical Application Circuit (see Table 1). VCC = 3.3V, fRF > fLO for a 140MHz IF, PRF = -5dBm, PLO = 0dBm, TC +25°C, unless
otherwise noted.)
2RF - 2LO RESPONSE vs. RF FREQUENCY
MAX19993 toc51
RF FREQUENCY (MHz)
2RF - 2LO RESPONSE (dBc)
1600150014001300
60
70
80
50
1200 1700
TC = -40°C
TC = +85°C
TC = +25°C
VCC = 3.3V
PRF = -5dBm
2RF - 2LO RESPONSE vs. RF FREQUENCY
MAX19993 toc52
RF FREQUENCY (MHz)
2RF - 2LO RESPONSE (dBc)
1600150014001300
60
70
80
50
1200 1700
VCC = 3.3V
PRF = -5dBm
PLO = -3dBm
PLO = -6dBm
PLO = +3dBm
PLO = 0dBm
2RF - 2LO RESPONSE vs. RF FREQUENCY
MAX19993 toc53
RF FREQUENCY (MHz)
2RF - 2LO RESPONSE (dBc)
1600150014001300
60
70
80
50
1200 1700
PRF = -5dBm
VCC = 3.6V
VCC = 3.3V
VCC = 3.0V
3RF - 3LO RESPONSE vs. RF FREQUENCY
MAX19993 toc54
RF FREQUENCY (MHz)
3RF - 3LO RESPONSE (dBc)
1600150014001300
65
75
85
55
1200 1700
TC = +85°C
TC = -40°C
TC = +25°C
VCC = 3.3V
PRF = -5dBm
3RF - 3LO RESPONSE vs. RF FREQUENCY
MAX19993 toc55
RF FREQUENCY (MHz)
3RF - 3LO RESPONSE (dBc)
1600150014001300
65
75
85
55
1200 1700
VCC = 3.3V
PRF = -5dBm
PLO = -6dBm, -3dBm, 0dBm, +3dBm
3RF - 3LO RESPONSE vs. RF FREQUENCY
MAX19993 toc56
RF FREQUENCY (MHz)
3RF - 3LO RESPONSE (dBc)
1600150014001300
65
75
85
55
1200 1700
PRF = -5dBm
VCC = 3.6V
VCC = 3.3V
VCC = 3.0V
INPUT P1dB vs. RF FREQUENCY
MAX19993 toc57
RF FREQUENCY (MHz)
INPUT P1dB (dBm)
1600150014001300
11
12
13
14
15
10
1200 1700
TC = +85°C
TC = -40°C TC = +25°C
VCC = 3.3V
INPUT P1dB vs. RF FREQUENCY
MAX19993 toc58
RF FREQUENCY (MHz)
INPUT P1dB (dBm)
1600150014001300
11
12
13
14
15
10
1200 1700
VCC = 3.3V
PLO = -6dBm, -3dBm, 0dBm, +3dBm
INPUT P1dB vs. RF FREQUENCY
MAX19993 toc59
RF FREQUENCY (MHz)
INPUT P1dB (dBm)
1600150014001300
11
12
13
14
15
10
1200 1700
VCC = 3.0V
VCC = 3.6V
VCC = 3.3V
MAX19993
Dual, SiGe, High-Linearity, 1200MHz to 1700MHz
Downconversion Mixer with LO Buffer/Switch
14
Typical Operating Characteristics (continued)
(Typical Application Circuit (see Table 1). VCC = 3.3V, fRF > fLO for a 140MHz IF, PRF = -5dBm, PLO = 0dBm, TC +25°C, unless
otherwise noted.)
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
MAX19993 toc64
LO FREQUENCY (MHz)
LO LEAKAGE AT IF PORT (dBm)
1460136012601160
-30
-20
-10
-40
1060 1560
VCC = 3.3V
PLO = -6dBm, -3dBm, 0dBm, +3dBm
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
MAX19993 toc65
LO FREQUENCY (MHz)
LO LEAKAGE AT IF PORT (dBm)
1460136012601160
-30
-20
-10
-40
1060 1560
VCC = 3.0V
VCC = 3.6V
VCC = 3.3V
RF-TO-IF ISOLATION vs. RF FREQUENCY
MAX19993 toc66
RF FREQUENCY (MHz)
RF-TO-IF ISOLATION (dB)
1600150014001300
30
40
50
20
1200 1700
TC = +85°C
TC = -40°C TC = +25°C
VCC = 3.3V
RF-TO-IF ISOLATION vs. RF FREQUENCY
MAX19993 toc67
RF FREQUENCY (MHz)
RF-TO-IF ISOLATION (dB)
1600150014001300
30
40
50
20
1200 1700
VCC = 3.3V
PLO = -6dBm, -3dBm, 0dBm, +3dBm
RF-TO-IF ISOLATION vs. RF FREQUENCY
MAX19993 toc68
RF FREQUENCY (MHz)
RF-TO-IF ISOLATION (dB)
1600150014001300
30
40
50
20
1200 1700
VCC = 3.0V, 3.3V, 3.6V
CHANNEL ISOLATION vs. RF FREQUENCY
MAX19993 toc61
RF FREQUENCY (MHz)
CHANNEL ISOLATION (dB)
1600150014001300
45
50
55
40
1200 1700
VCC = 3.3V
PLO = -6dBm, -3dBm, 0dBm, +3dBm
CHANNEL ISOLATION vs. RF FREQUENCY
MAX19993 toc62
RF FREQUENCY (MHz)
CHANNEL ISOLATION (dB)
1600150014001300
45
50
55
40
1200 1700
VCC = 3.0V, 3.3V, 3.6V
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
MAX19993 toc63
LO FREQUENCY (MHz)
LO LEAKAGE AT IF PORT (dBm)
1460136012601160
-30
-20
-10
-40
1060 1560
TC = +85°C
TC = -40°C
TC = +25°C
VCC = 3.3V
CHANNEL ISOLATION vs. RF FREQUENCY
MAX19993 toc60
RF FREQUENCY (MHz)
CHANNEL ISOLATION (dB)
1600150014001300
45
50
55
40
1200 1700
TC = -40°C
TC = +25°C
TC = +85°C
VCC = 3.3V
MAX19993
Dual, SiGe, High-Linearity, 1200MHz to 1700MHz
Downconversion Mixer with LO Buffer/Switch
15
Typical Operating Characteristics (continued)
(Typical Application Circuit (see Table 1). VCC = 3.3V, fRF > fLO for a 140MHz IF, PRF = -5dBm, PLO = 0dBm, TC +25°C, unless
otherwise noted.)
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX19993 toc70
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT (dBm)
1490138012701160
-60
-50
-40
-30
-20
-70
1050 1600
VCC = 3.3V
PLO = -3dBm
PLO = -6dBm
PLO = +3dBm
PLO = 0dBm
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX19993 toc71
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT (dBm)
1490138012701160
-60
-50
-40
-30
-20
-70
1050 1600
VCC = 3.0V
VCC = 3.6V
VCC = 3.3V
2LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX19993 toc72
LO FREQUENCY (MHz)
2LO LEAKAGE AT RF PORT (dBm)
1490138012701160
-50
-40
-30
-20
-10
-60
1050 1600
VCC = 3.3V
TC = +85°C
TC = -40°C
TC = +25°C
2LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX19993 toc73
LO FREQUENCY (MHz)
2LO LEAKAGE AT RF PORT (dBm)
1490138012701160
-50
-40
-30
-20
-10
-60
1050 1600
VCC = 3.3V
PLO = -3dBm
PLO = -6dBm
PLO = +3dBm
PLO = 0dBm
2LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX19993 toc74
LO FREQUENCY (MHz)
2LO LEAKAGE AT RF PORT (dBm)
1490138012701160
-50
-40
-30
-20
-10
-60
1050 1600
VCC = 3.0V
VCC = 3.6V
VCC = 3.3V
LO SWITCH ISOLATION vs. LO FREQUENCY
MAX19993 toc75
LO FREQUENCY (MHz)
LO SWITCH ISOLATION (dB)
1490138012701160
50
60
70
40
1050 1600
VCC = 3.3V
TC = +85°C
TC = -40°C
TC = +25°C
LO SWITCH ISOLATION vs. LO FREQUENCY
MAX19993 toc76
LO FREQUENCY (MHz)
LO SWITCH ISOLATION (dB)
1490138012701160
50
60
70
40
1050 1600
VCC = 3.3V
PLO = -6dBm, -3dBm, 0dBm, +3dBm
LO SWITCH ISOLATION vs. LO FREQUENCY
MAX19993 toc77
LO FREQUENCY (MHz)
LO SWITCH ISOLATION (dB)
1490138012701160
50
60
70
40
1050 1600
VCC = 3.0V, 3.3V, 3.6V
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX19993 toc69
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT (dBm)
1490138012701160
-60
-50
-40
-30
-20
-70
1050 1600
VCC = 3.3V
TC = +85°C
TC = -40°C
TC = +25°C
MAX19993
Dual, SiGe, High-Linearity, 1200MHz to 1700MHz
Downconversion Mixer with LO Buffer/Switch
16
Typical Operating Characteristics (continued)
(Typical Application Circuit (see Table 1). VCC = 3.3V, fRF > fLO for a 140MHz IF, PRF = -5dBm, PLO = 0dBm, TC +25°C, unless
otherwise noted.)
LO UNSELECTED PORT RETURN LOSS
vs. LO FREQUENCY
MAX19993 toc81
LO FREQUENCY (MHz)
LO UNSELECTED PORT RETURN LOSS (dB)
1800160014001200
40
30
20
10
0
50
1000 2000
VCC = 3.3V
PLO = -6dBm, -3dBm, 0dBm, +3dBm
SUPPLY CURRENT vs. TEMPERATURE (TC)
MAX19993 toc82
TEMPERATURE (°C)
SUPPLY CURRENT (mA)
603510-15
250
260
270
280
290
300
310
240
-40 85
VCC = 3.0V
VCC = 3.6V
VCC = 3.3V
RF PORT RETURN LOSS
vs. RF FREQUENCY
MAX19993 toc78
RF FREQUENCY (MHz)
RF PORT RETURN LOSS (dB)
1600150014001300
25
20
15
10
5
0
30
1200 1700
PLO = -6dBm, -3dBm, 0dBm, +3dBm
VCC = 3.3V
IF = 140MHz
IF PORT RETURN LOSS
vs. IF FREQUENCY
MAX19993 toc79
IF FREQUENCY (MHz)
IF PORT RETURN LOSS (dB)
410320230140
15
10
5
0
20
50 500
VCC = 3.0V, 3.3V, 3.6V
LO = 1560MHz
LO = 1310MHz
LO = 1060MHz
LO SELECTED PORT RETURN LOSS
vs. LO FREQUENCY
MAX19993 toc80
LO FREQUENCY (MHz)
LO SELECTED PORT RETURN LOSS (dB)
1800160014001200
30
20
10
0
40
1000 2000
VCC = 3.3V
PLO = -6dBm, -3dBm, 0dBm, +3dBm
MAX19993
Dual, SiGe, High-Linearity, 1200MHz to 1700MHz
Downconversion Mixer with LO Buffer/Switch
17
Pin Configuration
EXPOSED PAD
EXPOSED PAD ON THE BOTTOM OF THE PACKAGE
1 2 3 4 5
6 7 8 9
10
11
12
13
14
15
16
17
18
VCC
IFD_SET
GND
IFD+
IFD-
IND_EXTD
VCC
LO_ADJ_D
N.C.
192021222324252627
LO2
GND
GND
GND
LOSEL
GND
VCC
GND
LO1
RFMAIN
TAPMAIN
GND
VCC
GND
VCC
GND
TAPDIV
RFDIV
28
29
30
31
32
33
34
35
36
N.C.
LO_ADJ_M
VCC
IND_EXTM
IFM-
IFM+
GND
IFM_SET
VCC
TQFN
(6mm × 6mm)
TOP VIEW
MAX19993
+
MAX19993
Dual, SiGe, High-Linearity, 1200MHz to 1700MHz
Downconversion Mixer with LO Buffer/Switch
18
Pin Description
PIN NAME FUNCTION
1 RFMAIN Main Channel RF Input. Internally matched to 50I. Requires an input DC-blocking capacitor.
2 TAPMAIN Main Channel Balun Center Tap. Bypass to GND with 39pF and 0.033FF capacitors as close as
possible to the pin with the smaller value capacitor closer to the part.
3, 5, 7, 12,
20, 22, 24,
25, 26, 34
GND Ground
4, 6, 10, 16,
21, 30, 36 VCC Power Supply. Bypass to GND with capacitors as close as possible to the pin, as shown in the
Typical Application Circuit.
8 TAPDIV Diversity Channel Balun Center Tap. Bypass to GND with 39pF and 0.033FF capacitors as close as
possible to the pin with the smaller value capacitor closer to the part.
9 RFDIV Diversity Channel RF Input. Internally matched to 50I. Requires an input DC-blocking capacitor.
11 IFD_SET IF Diversity Amplifier Bias Control. Connect a resistor from this pin to ground to set the bias current
for the diversity IF amplifier. See the Typical Application Circuit.
13, 14 IFD+, IFD- Diversity Mixer Differential IF Output +/-. Connect pullup inductors from each of these pins to VCC.
See the Typical Application Circuit.
15 IND_EXTD Diversity External Inductor Connection. Connect to ground through a 0I resistor (0603) as close as
possible to the pin. For improved RF-to-IF and LO-to-IF isolation, contact the factory for details.
17 LO_ADJ_D LO Diversity Amplifier Bias Control. Connect a resistor from this pin to ground to set the bias current
for the diversity LO amplifier. See the Typical Application Circuit.
18, 28 N.C. No Connection. Not internally connected.
19 LO1 Local Oscillator 1 Input. This input is internally matched to 50I. Requires an input DC-blocking
capacitor.
23 LOSEL Local Oscillator Select. Set this pin to high to select LO1. Set to low to select LO2.
27 LO2 Local Oscillator 2 Input. This input is internally matched to 50I. Requires an input DC-blocking
capacitor.
29 LO_ADJ_M LO Main Amplifier Bias Control. Connect a resistor from this pin to ground to set the bias current for
the main LO amplifier. See the Typical Application Circuit.
31 IND_EXTM Main External Inductor Connection. Connect to ground through a 0I resistor (0603) as close as
possible to the pin. For improved RF-to-IF and LO-to-IF isolation, contact the factory for details.
32, 33 IFM-, IFM+ Main Mixer Differential IF Output -/+. Connect pullup inductors from each of these pins to VCC. See
the Typical Application Circuit.
35 IFM_SET IF Main Amplifier Bias Control. Connect a resistor from this pin to ground to set the bias current for
the main IF amplifier. See the Typical Application Circuit.
— EP
Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses mul-
tiple ground vias to provide heat transfer out of the device into the PCB ground planes. These mul-
tiple ground vias are also required to achieve the noted RF performance.
MAX19993
Dual, SiGe, High-Linearity, 1200MHz to 1700MHz
Downconversion Mixer with LO Buffer/Switch
19
Detailed Description
The MAX19993 is a dual-channel downconverter
designed to provide up to 6.4dB of conversion gain,
+27dBm input IP3, 15.4dBm 1dB input compression
point, and a noise figure of 9.8dB.
In addition to its high-linearity performance, the device
achieves a high level of component integration. It inte-
grates two double-balanced mixers for two-channel
downconversion. Both the main and diversity channels
include a balun and matching circuitry to allow 50I
single-ended interfaces to the RF ports and the two LO
ports. An integrated single-pole/double-throw (SPDT)
switch provides 50ns switching time between the two LO
inputs with 57dB of LO-to-LO isolation and -38dBm of
LO leakage at the RF port. Furthermore, the integrated
LO buffers provide a high drive level to each mixer core,
reducing the LO drive required at the device’s inputs
to a range of -6dBm to +3dBm. The IF ports for both
channels incorporate differential outputs for downcon-
version, which is ideal for providing enhanced 2RF - 2LO
performance.
The device is specified to operate over an RF input range
of 1200MHz to 1700MHz, an LO range of 1000MHz to
1560MHz, and an IF range of 50MHz to 500MHz. The
external IF components set the lower frequency range. See
the Typical Operating Characteristics section for details.
Operation beyond these ranges is possible; see the
Typical Operating Characteristics section for additional
information. Although this device is optimized for low-
side LO injection applications, it can operate in high-
side LO injection modes as well. However, perfor-
mance degrades as fLO continues to increase. Contact
the factory for a variant with increased high-side LO
performance.
RF Port and Balun
The RF input ports of both the main and diversity
channels are internally matched to 50I, requiring no
external matching components. A DC-blocking capacitor
is required as the input is internally DC shorted to ground
through the on-chip balun. The RF port input return
loss is typically better than 19dB over the 1400MHz to
1700MHz RF frequency range.
LO Inputs, Buffer, and Balun
The device is optimized for a 1000MHz to 1560MHz
LO frequency range. As an added feature, the device
includes an internal LO SPDT switch for use in frequency-
hopping applications. The switch selects one of the two
single-ended LO ports, allowing the external oscillator
to settle on a particular frequency before it is switched
in. LO switching time is typically 50ns, which is more
than adequate for typical GSM applications. If frequency
hopping is not employed, simply set the switch to
either of the LO inputs. The switch is controlled by a
digital input (LOSEL), where logic-high selects LO1
and logic-low selects LO2. LO1 and LO2 inputs are
internally matched to 50I, requiring only 39pF
DC-blocking capacitors.
If LOSEL is connected directly to a logic source, then
voltage MUST be applied to VCC before digital logic
is applied to LOSEL to avoid damaging the part.
Alternatively, a 1kI resistor can be placed in series at
the LOSEL to limit the input current in applications where
LOSEL is applied before VCC.
The main and diversity channels incorporate a two-stage
LO buffer that allows for a wide-input power range for
the LO drive. The on-chip low-loss baluns, along with LO
buffers, drive the double-balanced mixers. All interfacing
and matching components from the LO inputs to the IF
outputs are integrated on-chip.
High-Linearity Mixer
The core of the device’s dual-channel downconverter
consists of two double-balanced, high-performance
passive mixers. Exceptional linearity is provided by
the large LO swing from the on-chip LO buffers. When
combined with the integrated IF amplifiers, the cascaded
IIP3, 2RF - 2LO rejection, and noise-figure performance
are typically +27dBm, 72dBc, and 9.8dB, respectively.
Differential IF
The device has a 50MHz to 500MHz IF frequency range,
where the low-end frequency depends on the frequency
response of the external IF components. Note that these
differential ports are ideal for providing enhanced IIP2
performance. Single-ended IF applications require a
4:1 (impedance ratio) balun to transform the 200I
differential IF impedance to a 50I single-ended system.
After the balun, the return loss is typically 15dB. The user
can use a differential IF amplifier on the mixer IF ports,
but a DC block is required on both IFD+/IFD- and IFM+/
IFM- ports to keep external DC from entering the IF ports
of the mixer.
MAX19993
Dual, SiGe, High-Linearity, 1200MHz to 1700MHz
Downconversion Mixer with LO Buffer/Switch
20
Applications Information
Input and Output Matching
The RF and LO inputs are internally matched to 50I.
No matching components are required. The RF port
input return loss is typically better than 19dB over the
1400MHz to 1700MHz RF frequency range and return
loss at the LO ports are typically better than 15dB over
the entire LO range. RF and LO inputs require only
DC-blocking capacitors for interfacing.
The IF output impedance is 200I (differential). For
evaluation, an external low-loss 4:1 (impedance ratio)
balun transforms this impedance to a 50I single-ended
output. See the Typical Application Circuit.
Reduced-Power Mode
Each channel of the device has two pins (LO_ADJ_D/
LO_ADJ_M, IFD_SET/IFM_SET) that allow external
resistors to set the internal bias currents. Nominal values
for these resistors are given in Table 1. Larger value
resistors can be used to reduce power dissipation at the
expense of some performance loss. If Q1% resistors are
not readily available, substitute with Q5% resistors.
Significant reductions in power consumption can also
be realized by operating the mixer with an optional 3.3V
supply voltage. Doing so reduces the overall power
consumption by approximately 46%. See the 3.3V Supply
DC Electrical Characteristics table and the relevant 3.3V
curves in the Typical Operating Characteristics section.
IND_EXT_ Inductors
The default application circuit calls for connecting
IND_EXT_ (pins 15 and 31) to ground through a 0I
resistor (0603) as close as possible to the pin. For
improved RF-to-IF and LO-to-IF isolation, contact the
factory for details.
Layout Considerations
A properly designed PCB is an essential part of any
RF/microwave circuit. Keep RF signal lines as short as
possible to reduce losses, radiation, and inductance.
The load impedance presented to the mixer must be
such that any capacitance from both IF- and IF+ to
ground does not exceed several picofarads. For the best
performance, route the ground pin traces directly to the
exposed pad under the package. The PCB exposed pad
MUST be connected to the ground plane of the PCB. It is
suggested that multiple vias be used to connect this pad
to the lower-level ground planes. This method provides a
good RF/thermal-conduction path for the device. Solder
the exposed pad on the bottom of the device package
to the PCB. The MAX19993 evaluation kit can be used
as a reference for board layout. Gerber files are available
upon request at www.maxim-ic.com.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass each VCC pin and
TAPMAIN/TAPDIV with the capacitors shown in the
Typical Application Circuit. See Table 1 for component
values. Place the TAPMAIN/TAPDIV bypass capacitors
to ground within 100 mils of the pin.
Exposed Pad RF/Thermal Considerations
The exposed pad (EP) of the MAX19993’s 36-pin TQFN-
EP package provides a low thermal-resistance path to
the die. It is important that the PCB on which the device
is mounted be designed to conduct heat from the EP. In
addition, provide the EP with a low-inductance path to
electrical ground. The EP MUST be soldered to a ground
plane on the PCB, either directly or through an array of
plated via holes.
MAX19993
Dual, SiGe, High-Linearity, 1200MHz to 1700MHz
Downconversion Mixer with LO Buffer/Switch
21
Table 1. Component Values
Typical Application Circuit
VCC
IFD_SET
GND
IFD+
IFD-
IND_EXTD
VCC
LO_ADJ_D
N.C.
LO2
GND
GND
GND
LOSEL
GND
VCC
GND
LO1
RFMAIN
TAPMAIN
GND
VCC
GND
VCC
GND
TAPDIV
RFDIV
N.C.
LO_ADJ_M
VCC
IND_EXTM
IFM-
IFM+
GND
IFM_SET
VCC
VCC
VCC
VCC
VCC
VCC
L7 L8
C2
C3 C4 C5 C6
C9
C18
T24:1
4:1T1
R4
R1
L4L5L2L1
L6
L3
C12 C10C11
C21 C20C19
C13
C17
C14C16
C15
R6
R3
R5
R2
C7
C8
RF MAIN INPUT RF DIV INPUT
IF DIV OUTPUT
IF MAIN OUTPUT
LO1LO2 LO SELECT
C1
VCC
EXPOSED PAD
+
1 2 3 4 5
6 7 8 9
10
11
12
13
14
15
16
17
18
192021222324252627
28
29
30
31
32
33
34
35
36
MAX19993
VCC
VCC VCC
DESIGNATION QTY DESCRIPTION COMPONENT SUPPLIER
C1, C2, C7, C8,
C14, C16 6 39pF microwave capacitors (0402) Murata Electronics North America, Inc.
C3, C6 2 0.033FF microwave capacitors (0603) Murata Electronics North America, Inc.
C4, C5 2 0402, not used —
C9, C13, C15,
C17, C18 50.01FF microwave capacitors (0402) Murata Electronics North America, Inc.
MAX19993
Dual, SiGe, High-Linearity, 1200MHz to 1700MHz
Downconversion Mixer with LO Buffer/Switch
22
Chip Information
PROCESS: SiGe BiCMOS
Package Information
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
36 Thin QFN-EP T3666+2 21-0141 90-0049
Table 1. Component Values (continued)
DESIGNATION QTY DESCRIPTION COMPONENT SUPPLIER
C10, C11, C12,
C19, C20, C21 6 150pF microwave capacitors (0603) Murata Electronics North America, Inc.
L1, L2, L4, L5 4 330nH wire-wound high-Q inductors (0805) Coilcraft, Inc.
L3, L6 2 0I resistors (0603). For improved RF-to-IF and
LO-to-IF isolation, contact factory for details. Digi-Key Corp.
L7, L8 2 Additional tuning elements (0402, not used) —
R1, R4 2
681I ±1% resistors (0402). Used for VCC = 5.0V
applications. Larger values can be used to reduce
power at the expense of some performance loss. Digi-Key Corp.
681I ±1% resistors (0402). Used for VCC = 3.3V
applications.
R2, R5 2
1.82kI ±1% resistors (0402). Used for VCC = 5.0V
applications. Larger values can be used to reduce
power at the expense of some performance loss. Digi-Key Corp.
1.43kI ±1% resistors (0402). Used for VCC = 3.3V
applications.
R3, R6 2 0I resistors (1206) Digi-Key Corp.
T1, T2 2 4:1 transformers (200:50) TC4-1W-7A Mini-Circuits
U1 1 MAX19993 IC (36 TQFN-EP) Maxim Integrated Products, Inc.
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied.
Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 23
© 2010 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.
MAX19993
Dual, SiGe, High-Linearity, 1200MHz to 1700MHz
Downconversion Mixer with LO Buffer/Switch
Revision History
REVISION
NUMBER
REVISION
DATE DESCRIPTION PAGES
CHANGED
0 6/10 Initial release —
