Product Folder Order Now Support & Community Tools & Software Technical Documents DS90C124, DS90C241 SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 DS90C241 and DS90C124 5-MHz to 35-MHz DC-Balanced 24-Bit FPD-Link II Serializer and Deserializer 1 Features 2 Applications * * * * * 1 * * * * * * * * * * * * * * * * 5-MHz to 35-MHz Clock Embedded and DCBalancing 24:1 and 1:24 Data Transmissions User Defined Pre-Emphasis Driving Ability Through External Resistor on LVDS Outputs and Capable to Drive Up to 10-Meter Shielded Twisted-Pair Cable User-Selectable Clock Edge for Parallel Data on Both Transmitter and Receiver Internal DC Balancing Encode and Decode (Supports AC-Coupling Interface With No External Coding Required) Individual Power-Down Controls for Both Transmitter and Receiver Embedded Clock CDR (Clock and Data Recovery) on Receiver and No External Source of Reference Clock Required All Codes RDL (Random Data Lock) to Support Live-Pluggable Applications LOCK Output Flag to Ensure Data Integrity at Receiver Side Balanced TSETUP and THOLD Between RCLK and RDATA on Receiver Side PTO (Progressive Turnon) LVCMOS Outputs to Reduce EMI and Minimize SSO Effects All LVCMOS Inputs and Control Pins Have Internal Pulldown On-Chip Filters for PLLs on Transmitter and Receiver Temperature Range: -40C to 105C Greater Than 8-kV HBM ESD Tolerant Meets AEC-Q100 Compliance Power Supply Range: 3.3 V 10% 48-Pin TQFP Package Automotive Central Information Displays Automotive Instrument Cluster Displays Automotive Heads-Up Displays Remote Camera-Based Driver Assistance Systems 3 Description The DS90C241 and DS90C124 chipset translates a 24-bit parallel bus into a fully transparent data and control LVDS serial stream with embedded clock information. This single serial stream simplifies transferring a 24-bit bus over PCB traces or over cable by eliminating the skew problems between parallel data and clock paths. It saves system cost by narrowing data paths, which in turn reduces PCB layers, cable width, and connector size and pins. The DS90C241 and DS90C124 incorporate LVDS signaling on the high-speed I/O. LVDS provides a low-power and low-noise environment for reliably transferring data over a serial transmission path. By optimizing the serializer output edge rate for the operating frequency range, EMI is further reduced. In addition, the device features pre-emphasis to boost signals over longer distances using lossy cables. Internal DC balanced encoding and decoding supports AC-coupled interconnects. Device Information(1) PART NUMBER PACKAGE DS90C124 DS90C241 BODY SIZE (NOM) TQFP (48) 7.00 mm x 7.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Block Diagram PRE DEN VODSEL PLL RRFB RPWDNB Timing and Control RCLK CLK0 bit22 bit23 bit21 bit20 bit18 bit17 bit19 bit16 bit14 bit12 bit13 DCB DCA bit11 bit9 bit8 bit10 bit7 bit6 bit4 bit5 bit3 bit1 bit2 bit0 LOCK DESERIALIZER DS90C124 SERIALIZER DS90C241 CLK1 ROUT Clock Recovery bit15 TPWDNB 24 Timing and Control PLL TCLK Output Latch Serial to Parallel RIN- DOUT- DC Balance Decode RIN+ RT = 100: RT = 100: TRFB DOUT+ Parallel to Serial 24 DC Balance Encode DIN Input Latch REN Copyright (c) 2017, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. DS90C124, DS90C241 SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 7 8 1 1 1 2 3 7 Absolute Maximum Ratings ..................................... 7 ESD Ratings.............................................................. 7 Recommended Operating Conditions....................... 7 Thermal Information .................................................. 8 Electrical Characteristics........................................... 8 Timing Requirements - Serializer............................. 9 Switching Characteristics - Serializer..................... 10 Switching Characteristics - Deserializer................. 10 Typical Characteristics ............................................ 11 Parameter Measurement Information ................ 12 Detailed Description ............................................ 17 8.1 Overview ................................................................. 17 8.2 Functional Block Diagram ....................................... 17 8.3 Feature Description................................................. 17 8.4 Device Functional Modes........................................ 20 9 Applications and Implementation ...................... 22 9.1 Application Information............................................ 22 9.2 Typical Application ................................................. 22 10 Power Supply Recommendations ..................... 27 11 Layout................................................................... 28 11.1 Layout Guidelines ................................................. 28 11.2 Layout Example .................................................... 29 12 Device and Documentation Support ................. 32 12.1 12.2 12.3 12.4 12.5 12.6 12.7 Documentation Support ........................................ Related Links ........................................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 32 32 32 32 32 32 32 13 Mechanical, Packaging, and Orderable Information ........................................................... 33 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision L (April 2013) to Revision M Page * Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .................................................................................................. 1 * Deleted Lead temperature, soldering (260C maximum) from Absolute Maximum Ratings.................................................. 7 * Added Thermal Information table ........................................................................................................................................... 8 * Added Typical Characteristics (PCLK = 5 MHz and PCLK = 25 MHz plus pre-emphasis).................................................. 11 Changes from Revision K (April 2013) to Revision L * 2 Page Changed layout of National Semiconductor Data Sheet to TI format .................................................................................... 1 Submit Documentation Feedback Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 DS90C124, DS90C241 www.ti.com SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 5 Pin Configuration and Functions DIN[5] VDDT DIN[4] DIN[3] DIN[2] DIN[1] DIN[0] 30 29 28 27 26 25 DIN[6] 33 VSST DIN[7] 34 31 DIN[8] 35 32 DIN[9] 36 DS90C241 Serializer PFB Package 48-Pin TQFP Top View DIN[10] 37 24 VSS DIN[11] 38 23 PRE DIN[12] 39 22 VDDDR DIN[13] 40 21 VSSDR DIN[14] 41 20 DOUT+ VDDIT 42 19 DOUT- VSSIT 43 18 DEN DIN[15] 44 17 VSSPT0 DIN[16] 45 16 VDDPT0 DIN[17] 46 15 VSSPT1 DIN[18] 47 14 VDDPT1 DIN[19] 48 13 RESRVD 10 11 12 TCLK TRFB VODSEL 9 6 VSSL TPWDNB 5 DCAOFF 8 4 DIN[23] 7 3 DIN[22] VDDL 2 DIN[21] DCBOFF 1 DIN[20] DS90C241 48 PIN TQFP Pin Functions - DS90C241 Serializer PIN NAME NO. TYPE (1) DESCRIPTION LVCMOS PARALLEL INTERFACE PINS DIN[23:0] TCLK 4-1, 48-44, 41-32, 29-25 I LVCMOS, Transmitter parallel interface data input pins. Tie LOW if unused, do not float. 10 I LVCMOS, Transmitter parallel interface clock input pin. Strobe edge set by TRFB configuration pin. CONTROL AND CONFIGURATION PINS DCAOFF 5 I LVCMOS, Reserved. This pin must be tied LOW. DCBOFF 8 I LVCMOS, Reserved. This pin must be tied LOW. DEN 18 I LVCMOS, Transmitter data enable. DEN = H; LVDS driver outputs are enabled (ON). DEN = L; LVDS driver outputs are disabled (OFF), Transmitter LVDS driver DOUT () outputs are in TRI-STATE, PLL still operational and locked to TCLK. PRE 23 I LVCMOS, Pre-emphasis level select. PRE = NC (No Connect); Pre-emphasis is disabled (OFF). Pre-emphasis is active when input is tied to VSS through external resistor RPRE. Resistor value determines pre-emphasis level. Recommended value RPRE 3 k; Imax = [(1.2/R) x 20], Rmin = 3 k RESRVD 13 I LVCMOS, Reserved. This pin must be tied LOW. I LVCMOS, Transmitter power down bar. TPWDNB = H; Transmitter is enabled and ON TPWDNB = L; Transmitter is in power down mode (Sleep), LVDS driver DOUT () outputs are in TRI-STATE stand-by mode, PLL is shutdown to minimize power consumption. TPWDNB (1) 9 G = Ground, I = Input, O = Output, P = Power Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 Submit Documentation Feedback 3 DS90C124, DS90C241 SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 www.ti.com Pin Functions - DS90C241 Serializer (continued) PIN NAME NO. TRFB 11 VODSEL TYPE (1) 12 DESCRIPTION I LVCMOS, Transmitter clock edge select pin. TRFB = H; Parallel interface data is strobed on the rising clock edge. TRFB = L; Parallel interface data is strobed on the falling clock edge. I LVCMOS, VOD Level select VODSEL = L; LVDS driver output is approximately 400 mV (RL = 100 ) VODSEL = H; LVDS driver output is approximately 750 mV (RL = 100 ) For normal applications, set this pin LOW. For long cable applications where a larger VOD is required, set this pin HIGH. LVDS SERIAL INTERFACE PINS DOUT- 19 O LVDS, Transmitter LVDS inverted (-) output This output is intended to be loaded with a 100- load to the DOUT- pin. The interconnect must be AC-coupled to this pin with a 100-nF capacitor. DOUT+ 20 O LVDS, Transmitter LVDS true (+) output. This output is intended to be loaded with a 100- load to the DOUT+ pin. The interconnect must be AC-coupled to this pin with a 100-nF capacitor. POWER OR GROUND PINS VDDDR 22 P VDD, Analog voltage supply, LVDS output power VDDIT 42 P VDD, Digital voltage supply, Tx input power VDDL 7 P VDD, Digital voltage supply, Tx logic power VDDPT0 16 P VDD, Analog voltage supply, VCO power VDDPT1 14 P VDD, Analog voltage supply, PLL power VDDT 30 P VDD, Digital voltage supply, Tx serializer power VSS 24 G ESD ground VSSDR 21 G Analog ground, LVDS output ground VSSIT 43 G Digital ground, Tx input ground VSSL 6 G Digital ground, Tx logic ground VSSPT0 17 G Analog ground, VCO ground VSSPT1 15 G Analog ground, PLL ground VSST 31 G Digital ground, Tx serializer ground 4 Submit Documentation Feedback Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 DS90C124, DS90C241 www.ti.com SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 VSSOR1 ROUT[4] ROUT[5] ROUT[6] ROUT[7] 29 28 27 26 25 32 ROUT[3] ROUT[2] 33 VDDOR1 ROUT[1] 34 30 ROUT[0] 35 31 VDDR0 VSSR0 36 DS90C124 Deserializer PFB Package 48-Pin TQFP Top View PTO GROUP 1 37 24 ROUT[8] VSSR1 38 23 ROUT[9] VDDIR 39 22 ROUT[10] VSSIR 40 21 ROUT[11] RIN+ 41 20 VDDOR2 RIN- 42 19 VSSOR2 RRFB 43 18 RCLK VSSPR1 44 17 LOCK VDDPR1 45 16 ROUT[12] VSSPR0 46 15 ROUT[13] VDDPR0 47 14 ROUT[14] REN 48 13 ROUT[15] PTO GROUP 2 VDDR1 DS90C124 48 PIN TQFP 12 ROUT[16] 11 ROUT[17] 7 VDDOR3 10 6 ROUT[20] ROUT[18] 5 ROUT[21] 9 4 ROUT[22] 8 3 ROUT[23] VSSOR3 2 RESRVD ROUT[19] 1 RPWDNB PTO GROUP 3 Pin Functions - DS90C124 Deserializer PIN NAME NO. TYPE (1) DESCRIPTION LVCMOS PARALLEL INTERFACE PINS RCLK 18 O LVCMOS, Parallel interface clock output pin. Strobe edge set by RRFB configuration pin. ROUT[7:0] 25-28, 31-34 O LVCMOS, Receiver LVCMOS level outputs - Group 1 ROUT[15:8] 13-16, 21-24 O LVCMOS, Receiver LVCMOS level outputs - Group 2 ROUT[23:16] 3-6, 9-12 O LVCMOS, Receiver LVCMOS level outputs - Group 3 CONTROL AND CONFIGURATION PINS REN 48 I LVCMOS, Receiver data enable REN = H; ROUT[23:0] and RCLK are enabled (ON). REN = L; ROUT[23:0] and RCLK are disabled (OFF), receiver ROUT[23:0] and RCLK outputs are in TRI-STATE, PLL still operational and locked to TCLK. LOCK 17 O LVCMOS, LOCK indicates the status of the receiver PLL LOCK = H; receiver PLL is locked LOCK = L; receiver PLL is unlocked, ROUT[23:0] and RCLK are TRI-STATED RESRVD 2 I LVCMOS, Reserved. This pin must be tied LOW. RPWDNB 1 I LVCMOS, Receiver power down bar. RPWDNB = H; Receiver is enabled and ON RPWDNB = L; Receiver is in power down mode (Sleep), ROUT[23:0], RCLK, and LOCK are in TRI-STATE standby mode, PLL is shutdown to minimize power consumption. RRFB 43 I LVCMOS, Receiver clock edge select pin. RRFB = H; ROUT LVCMOS outputs strobed on the rising clock edge. RRFB = L; ROUT LVCMOS outputs strobed on the falling clock edge. (1) G = Ground, I = Input, O = Output, P = Power Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 Submit Documentation Feedback 5 DS90C124, DS90C241 SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 www.ti.com Pin Functions - DS90C124 Deserializer (continued) PIN NAME NO. TYPE (1) DESCRIPTION LVDS SERIAL INTERFACE PINS RIN- 42 I Receiver LVDS Inverted (-) Input This input is intended to be terminated with a 100- load to the RIN- pin. The interconnect must be AC-coupled to this pin with a 100-nF capacitor. RIN+ 41 I Receiver LVDS True (+) input This input is intended to be terminated with a 100- load to the RIN+ pin. The interconnect must be AC-coupled to this pin with a 100-nF capacitor. POWER OR GROUND PINS VDDIR 39 P VDD, Analog LVDS voltage supply, power VDDOR1 30 P VDD, Digital voltage supply, LVCMOS output power VDDOR2 20 P VDD, Digital voltage supply, LVCMOS output power VDDOR3 7 P VDD, Digital voltage supply, LVCMOS output power VDDPR0 47 P VDD, Analog voltage supply, PLL power VDDPR1 45 P VDD, Analog voltage supply, PLL VCO power VDDR0 36 P VDD, Digital voltage supply, Logic power VDDR1 37 P VDD, Digital voltage supply, Logic power VSSIR 40 G Analog LVDS ground VSSOR1 29 G Digital ground, LVCMOS output ground VSSOR2 19 G Digital ground, LVCMOS output ground VSSOR3 8 G Digital ground, LVCMOS output ground VSSPR0 46 G Analog ground, PLL ground VSSPR1 44 G Analog ground, PLL VCO ground VSSR0 35 G Digital ground, Logic ground VSSR1 38 G Digital ground, Logic ground 6 Submit Documentation Feedback Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 DS90C124, DS90C241 www.ti.com SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) VCC MIN MAX UNIT Supply voltage -0.3 4 V LVCMOS/LVTTL input voltage -0.3 VCC + 0.3 V LVCMOS/LVTTL output voltage -0.3 VCC + 0.3 V LVDS receiver input voltage -0.3 3.9 V LVDS driver output voltage -0.3 3.9 V LVDS output short circuit duration 10 ms TJ Junction temperature 150 C Tstg Storage temperature 150 C (1) -65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE Human-body model (HBM), per AEC Q100-002 (1) 8000 Charged-device model (CDM), per AEC Q100-011 RD = 330 , CS = 150 pF V(ESD) Electrostatic discharge RD = 330 , CS = 150 and 330 pF RD = 2 k, CS = 150 and 330 pF (1) UNIT 1250 IEC, powered-up only contact discharge (RIN0+, RIN0-, RIN1+, RIN1-) 8000 IEC, powered-up only air-gap discharge (RIN0+, RIN0-, RIN1+, RIN1-) 15000 ISO10605 contact discharge (RIN0+, RIN0-, RIN1+, RIN1-) 8000 ISO10605 air-gap discharge (RIN0+, RIN0-, RIN1+, RIN1-) 15000 ISO10605 contact discharge (RIN0+, RIN0-, RIN1+, RIN1-) 8000 ISO10605 air-gap discharge (RIN0+, RIN0-, RIN1+, RIN1-) 15000 V AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) VCC MIN NOM MAX Supply voltage 3 3.3 3.6 Clock rate 5 35 Supply noise TA -40 Operating free-air temperature Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 25 UNIT V MHz 100 mVP-P 105 C Submit Documentation Feedback 7 DS90C124, DS90C241 SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 www.ti.com 6.4 Thermal Information DS90C241-Q1 DS90C124-Q1 THERMAL METRIC (1) UNIT TFB (TQFP) 48 PINS RJA Junction-to-ambient thermal resistance 67.5 C/W RJC(top) Junction-to-case (top) thermal resistance 15.1 C/W RJB Junction-to-board thermal resistance 33.4 C/W JT Junction-to-top characterization parameter 0.4 C/W JB Junction-to-board characterization parameter 33 C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.5 Electrical Characteristics over recommended operating supply and temperature ranges (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT LVCMOS AND LVTTL DC SPECIFICATIONS VIH High-level voltage Tx: DIN[23:0], TCLK, TPWDNB, DEN, TRFB, DCAOFF, DCBOFF, and VODSEL; and Rx: RPWDNB, RRFB, and REN 2 VCC V VIL Low-level input voltage Tx: DIN[23:0], TCLK, TPWDNB, DEN, TRFB, DCAOFF, DCBOFF, and VODSEL; and Rx: RPWDNB, RRFB, and REN GND 0.8 V VCL Input clamp voltage ICL = -18 mA, Tx: DIN[23:0], TCLK, TPWDNB, DEN, TRFB, DCAOFF, DCBOFF, and VODSEL; and Rx: RPWDNB, RRFB, and REN (1) -0.8 -1.5 V 5 10 IIN Input current VIN = 0 V or 3.6 V Tx: DIN[23:0], TCLK, TPWDNB, DEN, TRFB, DCAOFF, DCBOFF, and VODSEL -10 Rx: RPWDNB, RRFB, and REN -20 VOH High-level output voltage IOH = -4 mA, Rx: ROUT[23:0], RCLK, and LOCK VOL Low-level output voltage IOL = 4 mA, Rx: ROUT[23:0], RCLK, and LOCK IOS IOZ Output short circuit current VOUT = 0 V, Rx: ROUT[23:0], RCLK, and LOCK TRI-STATE output current RPWDNB, REN = 0 V, VOUT = 0 V or 2.4 V, Rx: ROUT[23:0], RCLK, and LOCK (1) A 5 20 2.3 3 VCC V GND 0.33 0.5 V -40 -70 -110 mA -30 0.4 30 A 50 mV LVDS DC SPECIFICATIONS VTH Differential threshold high voltage VCM = 1.2 V, Rx: RIN+ and RIN- VTL Differential threshold low voltage Rx: RIN+ and RIN- IIN Input current VOD Output differential voltage (DOUT+) - (DOUT-) RL = 100 , without preemphasis, Tx: DOUT+ and DOUT- (see Figure 12) VOD Output differential voltage unbalance RL = 100 , without pre-emphasis, Tx: DOUT+ and DOUT- VOS Offset voltage RL = 100 , without pre-emphasis, Tx: DOUT+ and DOUT- VOS Offset voltage unbalance RL = 100 , without pre-emphasis, Tx: DOUT+ and DOUT- (1) 8 -50 mV VIN = 2.4 V, VCC = 3.6 V or 0 V, Rx: RIN+ and RIN- 200 VIN = 0 V, VCC = 3.6 V, Rx: RIN+ and RIN- 200 A VODSEL = L 250 400 600 VODSEL = H 450 750 1200 10 50 mV 1.25 1.5 V 1 50 mV 1 mV Specification is ensured by characterization and is not tested in production. Submit Documentation Feedback Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 DS90C124, DS90C241 www.ti.com SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 Electrical Characteristics (continued) over recommended operating supply and temperature ranges (unless otherwise noted) PARAMETER IOS Output short circuit current IOZ TRI-STATE output current TEST CONDITIONS MIN DOUT = 0 V, DIN = H, TPWDNB, DEN = 2.4 V, Tx: DOUT+ and DOUT- VODSEL = L DOUT = 0 V, DIN = H, TPWDNB, DEN = 2.4 V, Tx: DOUT+ and DOUT- VODSEL = H -7 TPWDNB, DEN = 0 V, DOUT = 0 V or 2.4 V, Tx: DOUT+ and DOUT- -15 TYP MAX -2 UNIT -8 mA -13 1 15 A SERIALIZER OR DESERIALIZER SUPPLY CURRENT - DVDDx, PVDDx, AND AVDDx PINS (Digital, PLL, and Analog VDDs) Serializer (Tx) total supply current (includes load current) ICCT Serializer (Tx) total supply current (includes load current) ICCTZ ICCR ICCRZ RL = 100 , RPRE = OFF, VODSEL = H/L, f = 35 MHz, and checker-board pattern (see Figure 3) 40 65 mA RL = 100 , RPRE = 6 k, VODSEL = H/L, f = 35 MHz, and checker-board pattern (see Figure 3) 45 70 mA f = 35 MHz, RL = 100 , RPRE = OFF, and VODSEL = H/L 40 65 mA f = 35 MHz, RL = 100 , RPRE = 6 k, VODSEL = H/L, and random pattern 45 70 mA 800 A Serializer (Tx) supply current power-down TPWDNB = 0 V (all other LVCMOS inputs = 0 V) Deserializer (Rx) total supply current (includes load current) CL = 8-pF LVCMOS output, f = 35 MHz, and checkerboard pattern (see Figure 4) 85 mA Deserializer (Rx) total supply current (includes load current) CL = 8-pF LVCMOS output, f = 35 MHz, and random pattern 80 mA Deserializer (Rx) supply current power-down RPWDNB = 0 V (all other LVCMOS inputs = 0 V, RIN+/ RIN- = 0 V) 50 A 6.6 Timing Requirements - Serializer over recommended operating supply and temperature ranges (unless otherwise noted) MIN TYP MAX UNIT tTCP Transmit clock period (see Figure 7) 28.6 T 200 ns tTCIH Transmit clock high time 0.4T 0.5T 0.6T ns tTCIL Transmit clock low time 0.4T 0.5T 0.6T ns tCLKT TCLK input transition time (see Figure 6) 3 6 ns tJIT TCLK input jitter (1) 33 ps (RMS) (1) tJIT (at BER of 10e-9) specifies the allowable jitter on TCLK. tJIT not included in TxOUT_E_O parameter. Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 Submit Documentation Feedback 9 DS90C124, DS90C241 SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 www.ti.com 6.7 Switching Characteristics - Serializer over recommended operating supply and temperature ranges (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tLLHT LVDS Low-to-High transition time RL = 100 , CL = 10 pF to GND, and VODSEL = L (see Figure 5) 0.6 ns tLHLT LVDS High-to-Low transition time RL = 100 , CL = 10 pF to GND, and VODSEL = L (see Figure 5) 0.6 ns tDIS DIN[23:0] setup to TCLK RL = 100 and CL = 10 pF to GND (1) 5 ns tDIH DIN[23:0] hold from TCLK RL = 100 and CL = 10 pF to GND (1) 5 ns tHZD DOUT HIGH to TRI-STATE delay RL = 100 and CL = 10 pF to GND (see Figure 8) (2) 15 ns tLZD DOUT LOW to TRI-STATE delay RL = 100 and CL = 10 pF to GND (see Figure 8) (2) 15 ns tZHD DOUT TRI-STATE to HIGH delay RL = 100 and CL = 10 pF to GND (see Figure 8) (2) 200 ns tZLD DOUT TRI-STATE to LOW delay RL = 100 and CL = 10 pF to GND (see Figure 8) (2) 200 ns tPLD Serializer PLL lock time RL = 100 (see Figure 9) 10 ms tSD Serializer delay TxOUT_E_O (1) (2) (3) (4) (5) TxOUT_Eye_Opening (respect to ideal) RL = 100 , VODSEL = L, and TRFB = H (see Figure 10) 3.5T + 2.85 3.5T + 10 ns RL = 100 , VODSEL = L, and TRFB = L (see Figure 10) 3.5T + 2.85 3.5T + 10 ns 5 MHz to 35 MHz (see Figure 11) (1) (3) (4) UI (5) 0.75 Specification is ensured by characterization and is not tested in production. When the serializer output is tri-stated, the deserializer loses PLL lock. Resynchronization must occur before data transfer. tJIT (at BER of 10e-9) specifies the allowable jitter on TCLK. tJIT not included in TxOUT_E_O parameter. TxOUT_E_O is affected by pre-emphasis value. UI - Unit Interval; equivalent to one ideal serialized data bit width. The UI scales with frequency. 6.8 Switching Characteristics - Deserializer over recommended operating supply and temperature ranges (unless otherwise noted) PARAMETER TEST CONDITIONS MIN tRCP Receiver out clock period tRCP = tTCP and RCLK pin (1) 28.6 tRDC RCLK duty cycle RCLK pin 45% tCLH LVCMOS low-to-high transition time tCHL TYP MAX UNIT 200 ns 50% 55% CL = 8 pF (lumped load); ROUT[23:0], LOCK, and RCLK pins (see Figure 13) (1) 2.5 3.5 ns LVCMOS high-to-low transition time CL = 8 pF (lumped load); ROUT[23:0], LOCK, and RCLK pins (see Figure 13) (1) 2.5 3.5 ns tROS ROUT[7:0] setup data to RCLK (Group 1) ROUT[7:0] pins (see Figure 17) 0.4 x tRCP (29/56) x tRCP ns tROH ROUT[7:0] hold data to RCLK (Group 1) ROUT[7:0] pins (see Figure 17) 0.4 x tRCP (27/56) x tRCP ns tROS ROUT[15:8] setup data to RCLK (Group 2) ROUT[15:8] and LOCK pins (see Figure 17) 0.4 x tRCP 0.5 x tRCP ns tROH ROUT[15:8] hold data to RCLK (Group 2) ROUT[15:8] and LOCK pins (see Figure 17) 0.4 x tRCP 0.5 x tRCP ns tROS ROUT[23:16] setup data to RCLK (Group 3) ROUT[23:16] pins (see Figure 17) 0.4 x tRCP (27/56) x tRCP ns tROH ROUT[23:16] hold data to RCLK (Group 3) ROUT[23:16] pins (see Figure 17) 0.4 x tRCP (29/56) x tRCP ns tHZR HIGH to TRI-STATE delay ROUT[23:0], RCLK, and LOCK pins (see Figure 15) (1) 10 3 10 ns Specification is ensured by characterization and is not tested in production. Submit Documentation Feedback Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 DS90C124, DS90C241 www.ti.com SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 Switching Characteristics - Deserializer (continued) over recommended operating supply and temperature ranges (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tLZR LOW to TRI-STATE delay ROUT[23:0], RCLK, and LOCK pins 3 10 ns tZHR TRI-STATE to HIGH delay ROUT[23:0], RCLK, and LOCK pins 3 10 ns tZLR TRI-STATE to LOW delay ROUT[23:0], RCLK, and LOCK pins 3 10 ns tDD Deserializer delay RCLK pin (see Figure 14) [4+(3/56)]T + 5.9 [4+(3/56)]T + 14 ns tDRDL Deserializer PLL lock time from power down See Figure 16 (1) (2) 5 MHz 5 50 35 MHz 5 50 RxIN_TOL_L Receiver input tolerance (left) 5 MHz to 35 MHz (see Figure 18) (1) (3) 0.25 UI (4) RxIN_TOL_R Receiver input tolerance (right) 5 MHz to 35 MHz (see Figure 18) (1) (3) 0.25 UI (4) (2) (3) (4) ms The deserializer PLL lock time (tDRDL) may vary depending on input data patterns and the number of transitions within the pattern. RxIN_TOL is a measure of how much phase noise (jitter) the deserializer can tolerate in the incoming data stream before bit errors occur. It is a measurement in reference with the ideal bit position. See AN-1217 How to Validate BLVDS SER/DES Signal Integrity Using an Eye Mask (SNLA053) for details. UI - Unit Interval; equivalent to one ideal serialized data bit width. The UI scales with frequency. 6.9 Typical Characteristics Figure 1 and Figure 2 are scope shots with PCLK = 5 MHz measured out of the DS90C241 DOUT with pre-emphasis OFF and pre-emphasis ON using a 1010... pattern on the DIN[23:0] inputs. The scope was triggered on the input PCLK. Figure 1. DS90C241 DOUT Eye Diagram at 5 MHz Without Pre-Emphasis Figure 2. DS90C241 DOUT Eye Diagram at 5 MHz With Pre-Emphasis ON Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 Submit Documentation Feedback 11 DS90C124, DS90C241 SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 www.ti.com 7 Parameter Measurement Information Device Pin Name Signal Pattern TCLK ODD DIN EVEN DIN Figure 3. Serializer Input Checkerboard Pattern Device Pin Name Signal Pattern RCLK ODD ROUT EVEN ROUT Figure 4. Deserializer Output Checkerboard Pattern DOUT+ 10 pF Differential Signal 100: 80% 80% 20% Vdiff = 0V 20% DOUT10 pF tLLHT tLHLT Vdiff = (DOUT+) - (DOUT-) Figure 5. Serializer LVDS Output Load and Transition Times 80% VDD 80% TCLK 20% 20% tCLKT 0V tCLKT Figure 6. Serializer Input Clock Transition Times tTCP TCLK VDD/2 tDIS VDD/2 VDD/2 tDIH VDD DIN [0:23] VDD/2 Setup Hold VDD/2 0V Figure 7. Serializer Setup and Hold Times 12 Submit Documentation Feedback Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 DS90C124, DS90C241 www.ti.com SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 Parameter Measurement Information (continued) Parasitic package and Trace capcitance DOUT+ 5 pF 100: DOUTDEN tLZD DEN VCC/2 (single-ended) 0V VCC/2 0V CLK1 CLK1 tTCP tTCP DOUT (differential) 200 mV DCA tZLD 200 mV DCA DCA DCA $OO GDWD 0V DCA DCA DCA DCA tHZD DEN VCC/2 (single-ended) 0V VCC/2 0V $OO GDWD 1V tZHD DCA 200 mV DCA DCA DCA DCA DCA DCA DCA 200 mV DOUT (differential) tTCP tTCP CLK0 CLK0 Figure 8. Serializer TRI-STATE Test Circuit and Delay PWDWN 2.0V 0.8V tHZD or tLZD TCLK tPLD DOUT TRI-STATE tZHD or tZLD Output Active TRI-STATE Figure 9. Serializer PLL Lock Time and TPWDNB TRI-STATE Delays Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 Submit Documentation Feedback 13 DS90C124, DS90C241 SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 www.ti.com DIN SYMBOL N SYMBOL N+1 SYMBOL N+2 | | Parameter Measurement Information (continued) SYMBOL N+3 | tSD TCLK 23 0 1 2 23 0 1 2 23 0 1 2 STOP START BIT BIT 23 0 STOP BIT SYMBOL N 1 2 | | 2 STOP START BIT BIT SYMBOL N-1 | | 1 | | 0 | | DOUT0-23 DCA, DCB STOP START BIT BIT SYMBOL N-2 | | STOP START BIT BIT SYMBOL N-3 SYMBOL N-4 23 Figure 10. Serializer Delay Ideal Data Bit End Ideal Data Bit Beginning TxOUT_E_O tBIT(1/2UI) tBIT(1/2UI) Ideal Center Position (tBIT/2) tBIT (1UI) 24 DIN PARALLEL-TO-SERIAL Figure 11. Transmitter Output Eye Opening (TxOUT_E_O) DOUT+ RL DOUT- TCLK VOD = (DOUT+) - (DOUT -) Differential output signal is shown as (DOUT+) - (DOUT -) with the device in data transfer mode. Figure 12. Serializer VOD Diagram Single-ended Signal Deserializer 8 pF lumped 80% 80% 20% 20% tCLH tCHL Figure 13. Deserializer LVCMOS/LVTTL Output Load and Transition Times 14 Submit Documentation Feedback Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 DS90C124, DS90C241 www.ti.com SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 Parameter Measurement Information (continued) 23 0 1 2 23 0 1 2 23 0 1 2 STOP BIT | | 2 STOP START BIT BIT SYMBOL N+3 | | 1 STOP START BIT BIT SYMBOL N+2 | | 0 STOP START BIT BIT SYMBOL N+1 SYMBOL N | | START BIT RIN0-23 DCA, DCB 23 tDD RCLK SYMBOL N-3 ROUT0-23 SYMBOL N-2 SYMBOL N-1 SYMBOL N Figure 14. Deserializer Delay 500: VREF CL = 8pF VREF = VDD/2 for tZLR or tLZR, + - VREF = 0V for tZHR or tHZR REN VOH VDD/2 REN VDD/2 VOL tLZR tZLR VOL + 0.5V VOL + 0.5V VOL tHZR ROUT [23:0] tZHR VOH VOH - 0.5V VOH + 0.5V CL includes instrumentation and fixture capacitance within 6 cm of ROUT[23:0]. Figure 15. Deserializer TRI-STATE Test Circuit and Timing 2.0V PWDN 0.8V | | tDRDL RIN LOCK TRI-STATE }v[ OE TRI-STATE tHZR or tLZR ROUT [0:23] TRI-STATE TRI-STATE RCLK TRI-STATE TRI-STATE REN Figure 16. Deserializer PLL Lock Times and RPWDNB TRI-STATE Delay Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 Submit Documentation Feedback 15 DS90C124, DS90C241 SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 www.ti.com Parameter Measurement Information (continued) tLOW RCLK tHIGH VDD/2 ROUT [7:0] VDD/2 VDD/2 tROS tROH (group 1) (group 1) Data Valid Before RCLK Data Valid After RCLK VDD/2 1/2 UI ROUT [15:8], LOCK 1/2 UI VDD/2 tROS tROH (group 2) (group 2) Data Valid Before RCLK Data Valid After RCLK VDD/2 1/2 UI ROUT [23:16] 1/2 UI VDD/2 tROS tROH (group 3) (group 3) Data Valid Before RCLK Data Valid After RCLK VDD/2 Figure 17. Deserializer Setup and Hold Times Ideal Data Bit Beginning Sampling Window RxIN_TOL -L Ideal Data Bit End RxIN_TOL -R Ideal Sampling Position tBIT ( ) 2 tBIT (1UI) RxIN_TOL_L is the ideal noise margin on the left of the figure with respect to ideal. RxIN_TOL_R is the ideal noise margin on the right of the figure with respect to ideal. Figure 18. Receiver Input Tolerance (RxIN_TOL) and Sampling Window 16 Submit Documentation Feedback Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 DS90C124, DS90C241 www.ti.com SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 8 Detailed Description 8.1 Overview The DS90C241 serializer and DS90C124 deserializer chipset is an easy-to-use transmitter and receiver pair that sends 24-bits of parallel LVCMOS data over a single serial LVDS link from 120 Mbps to 840 Mbps throughput. The DS90C241 transforms a 24-bit wide parallel LVCMOS data into a single high speed LVDS serial data stream with embedded clock, and scrambles or DC balances the data to enhance signal quality to support AC coupling. The DS90C124 receives the LVDS serial data stream and converts it back into a 24-bit wide parallel data and recovered clock. The 24-bit serializer or deserializer chipset is designed to transmit data up to 10 meters over shielded twisted pair (STP) at clock speeds from 5 MHz to 35 MHz. The deserializer can attain lock to a data stream without the use of a separate reference clock source. This greatly simplifies system complexity and overall cost. The deserializer synchronizes to the serializer regardless of data pattern, delivering true automatic plug and lock performance. It locks to the incoming serial stream without the requirement of special training patterns or sync characters. The deserializer recovers the clock and data by extracting the embedded clock information and validating data integrity from the incoming data stream and then deserializes the data. The deserializer monitors the incoming clock information, determines lock status, and asserts the LOCK output high when lock occurs. Each has a power down control to enable efficient operation in various applications. 8.2 Functional Block Diagram PRE DEN VODSEL PLL RRFB RPWDNB Timing and Control RCLK bit23 CLK0 bit22 bit21 bit20 bit18 bit19 bit17 bit16 bit14 bit12 bit13 DCB bit11 DCA bit9 bit10 bit8 bit7 bit6 bit5 bit4 bit3 bit1 bit2 bit0 LOCK DESERIALIZER DS90C124 SERIALIZER DS90C241 CLK1 ROUT Clock Recovery bit15 TPWDNB 24 Timing and Control PLL TCLK Output Latch RIN- DOUT- DC Balance Decode Serial to Parallel RIN+ RT = 100: RT = 100: TRFB DOUT+ Parallel to Serial 24 DC Balance Encode DIN Input Latch REN Copyright (c) 2017, Texas Instruments Incorporated 8.3 Feature Description 8.3.1 Initialization and Locking Mechanism Initialization of the DS90C241 and DS90C124 must be established before each device sends or receives data. Initialization refers to synchronizing the PLLS of the serializer and the deserializer together. After the serializers locks to the input clock source, the deserializer synchronizes to the serializers as the second and final initialization step. 1. When VCC is applied to both serializer or deserializer, the respective outputs are held in TRI-STATE and internal circuitry is disabled by on-chip power-on circuitry. When VCC reaches VCC OK (2.2 V) the PLL in serializer begins locking to a clock input. For the serializer, the local clock is the transmit clock, TCLK. The serializer outputs are held in TRI-STATE while the PLL locks to the TCLK. After locking to TCLK, the Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 Submit Documentation Feedback 17 DS90C124, DS90C241 SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 www.ti.com Feature Description (continued) serializer block is now ready to send data patterns. The deserializer output remains in TRI-STATE while its PLL locks to the embedded clock information in serial data stream. Also, the deserializer LOCK output remains low until its PLL locks to incoming data and sync-pattern on the RIN pins. 2. The deserializer PLL acquires lock to a data stream without requiring the serializer to send special patterns. The serializer that is generating the stream to the deserializer automatically sends random (non-repetitive) data patterns during this step of the Initialization State. The deserializer locks onto the embedded clock within the specified amount of time. An embedded clock and data recovery (CDR) circuit locks to the incoming bit stream to recover the high-speed receive bit clock and re-time incoming data. The CDR circuit expects a coded input bit stream. In order for the deserializer to lock to a random data stream from the serializer, it performs a series of operations to identify the rising clock edge and validates data integrity, then locks to it. Because this locking procedure is independent on the data pattern, total random locking duration may vary. At the point when the CDR of the deserializer locks to the embedded clock, the LOCK pin goes high and valid RCLK/data appears on the outputs. Note that the LOCK signal is synchronous to valid data appearing on the outputs. The deserializer's LOCK pin is a convenient way to ensure data integrity is achieved on receiver side. 8.3.2 Data Transfer After serializer lock is established, the inputs DIN0 to DIN23 may be used to input data to the serializer. Data is clocked into the serializer by the TCLK input. The edge of TCLK used to strobe the data is selectable through the TRFB pin. TRFB high selects the rising edge for clocking data and low selects the falling edge. The serializer outputs (DOUT) are intended to drive point-to-point connections as shown in Figure 19. CLK1, CLK0, DCA, DCB are four overhead bits transmitted along the single LVDS serial data stream. The CLK1 bit is always high and the CLK0 bit is always low. The CLK1 and CLK0 bits function as the embedded clock bits in the serial stream. DCB functions as the DC Balance control bit. It does not require any precoding of data on transmit side. The DC Balance bit is used to minimize the short and long-term DC bias on the signal lines. This bit operates by selectively sending the data either unmodified or inverted. The DCA bit is used to validate data integrity in the embedded data stream. Both DCA and DCB coding schemes are integrated and automatically performed within serializer and deserializer. Serialized data and clock or control bits (24 +4 bits) are transmitted from the serial data output (DOUT) at 28 times the TCLK frequency. For example, if TCLK is 35 MHz, the serial rate is 35 x 28 = 980 Mega bits per second. Because only 24 bits are from input data, the serial payload rate is 24 times the TCLK frequency. For example, if TCLK = 35 MHz, the payload data rate is 35 x 24 = 840 Mbps. TCLK is provided by the data source and must be in the range of 5 MHz to 35 MHz nominal. The serializer outputs (DOUT) can drive a point-to-point connection. The outputs transmit data when the enable pin (DEN) is high, TPWDNB is high. The DEN pin may be used to TRI-STATE the outputs when driven low. When the deserializer channel attains lock to the input from a serializer, it drives its LOCK pin high and synchronously delivers valid data and recovered clock on the output. The deserializer locks onto the embedded clock, uses it to generate multiple internal data strobes, and then drives the recovered clock to the RCLK pin. The recovered clock (RCLK output pin) is synchronous to the data on the ROUT[23:0] pins. While LOCK is high, data on ROUT[23:0] is valid. Otherwise, ROUT[23:0] is invalid. The polarity of the RCLK edge is controlled by the RRFB input. ROUT[23:0], LOCK, and RCLK outputs each drive a maximum of 8-pF load with 35-MHz clock. REN controls TRI-STATE for ROUTn and the RCLK pin on the deserializer. 8.3.3 Resynchronization If the deserializer loses lock, it automatically tries to re-establish lock. For example, if the embedded clock edge is not detected one time in succession, the PLL loses lock and the LOCK pin is driven low. The deserializer then enters the operating mode where it tries to lock to a random data stream. It looks for the embedded clock edge, identifies it and then proceeds through the locking process. The logic state of the LOCK signal indicates whether the data on ROUT is valid; when it is high, the data is valid. The system must monitor the LOCK pin to determine whether data on the ROUT is valid. 18 Submit Documentation Feedback Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 DS90C124, DS90C241 www.ti.com SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 Feature Description (continued) 8.3.4 Pre-Emphasis The DS90C241 features a pre-emphasis function used to compensate for long or lossy transmission media. Cable drive is enhanced with a user selectable pre-emphasis feature that provides additional output current during transitions to counteract cable loading effects. The transmission distance is limited by the loss characteristics and quality of the media. Pre-emphasis adds extra current during LVDS logic transition to reduce the cable loading effects and increase driving distance. In addition, pre-emphasis helps provide faster transitions, increased eye openings, and improved signal integrity. To enable the pre-emphasis function, the PRE pin requires one external resistor (Rpre) to Vss to set the additional current level. Pre-emphasis strength is set through an external resistor (Rpre) applied from min to max (floating to 3 k) at the PRE pin. A lower input resistor value on the PRE pin increases the magnitude of dynamic current during data transition. There is an internal current source based on the following formula: PRE = (Rpre 3 k); IMAX = [(1.2/Rpre) x 20]. The ability of the DS90C241 to use the pre-emphasis feature extends the transmission distance up to 10 meters in most cases. The amount of pre-emphasis for a given media depends on the transmission distance of the application. In general, too much pre-emphasis can cause over or undershoot at the receiver input pins. This can result in excessive noise, crosstalk and increased power dissipation. For short cables or distances, pre-emphasis may not be required. Signal quality measurements are recommended to determine the proper amount of pre-emphasis for each application. 8.3.5 AC-Coupling and Termination The DS90C241 and DS90C124 supports AC-coupled interconnects through integrated DC balanced encoding/decoding scheme. To use AC coupled connection between the serializer and deserializer, insert external AC coupling capacitors in series in the LVDS signal path as illustrated in Figure 19. The deserializer input stage is designed for AC-coupling by providing a built-in AC bias network which sets the internal VCM to 1.2 V. With AC signal coupling, capacitors provide the AC-coupling path to the signal input. For the high-speed LVDS transmissions, the smallest available package must be used for the AC-coupling capacitor. This helps minimize degradation of signal quality due to package parasitics. The most common used capacitor value for the interface is 100-nF (0.1-F) capacitor. NPO class 1 or X7R class 2 type capacitors are recommended. 50-WVDC must be the minimum used for the best system-level ESD performance. The DS90C124 input stage is designed for AC-coupling by providing a built-in AC bias network which sets the internal VCM to 1.2 V. Therefore multiple termination options are possible. 8.3.5.1 Receiver Termination Options 8.3.5.1.1 Option 1 A single, 100- termination resistor is placed across the RIN pins (see Figure 19). This provides the signal termination at the receiver inputs. Other options may be used to increase noise tolerance. DOUT+ 100 nF RIN+ 100 nF 100: DOUT- 100: 100 nF RIN- 100 nF Figure 19. AC Coupled Application 8.3.5.1.1.1 Option 2 For additional EMI tolerance, two 50- resistors may be used in place of the single 100- resistor. A small capacitor is tied from the center point of the 50- resistors to ground (see Figure 20). This provides a highfrequency low impedance path for noise suppression. Value is not critical; 4.7 nF may be used with general applications. Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 Submit Documentation Feedback 19 DS90C124, DS90C241 SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 www.ti.com Feature Description (continued) 0.1 PF 0.1 PF RIN+ 50: DS90C241 DS90C124 100: 4.7 nF 50: RIN0.1 PF 0.1 PF Copyright (c) 2017, Texas Instruments Incorporated Figure 20. Receiver Termination Option 2 8.3.5.1.1.2 Option 3 For high noise environments an additional voltage divider network may be connected to the center point. This has the advantage of a providing a DC low-impedance path for noise suppression. Use resistor values in the range of 75 to 2 K for the pullup and pulldown. Ratio the resistor values to bias the center point at 1.2 V. For example (see Figure 21), VDD = 3.3 V, Rpullup = 1.3 k, Rpulldown = 750 ; or Rpullup = 130 , Rpulldown = 75 (strongest). The smaller values consume more bias current, but provide enhanced noise suppression. VDD 0.1 PF 0.1 PF RIN+ RPU DS90C241 50: DS90C124 100: RPD 4.7 nF 50: RIN- 0.1 PF 0.1 PF Copyright (c) 2017, Texas Instruments Incorporated Figure 21. Receiver Termination Option 3 8.4 Device Functional Modes Table 1 and Table 2 list the truth tables for the serializer and deserializer. Table 1. DS90C241 Serializer Truth Table TPWDNB (PIN 9) DEN (PIN 18) Tx PLL STATUS (INTERNAL) LVDS OUTPUTS (PINS 19 AND 20) L X X Hi Z H L X Hi Z H H Not locked Hi Z H H Locked Serialized data with embedded clock Table 2. DS90C124 Deserializer Truth Table 20 RPWDNB (PIN 1) REN (PIN 48) Rx PLL STATUS (INTERNAL) ROUTn AND RCLK (SEE PIN DIAGRAM) LOCK (PIN 17) L X X Hi Z Hi Z H L X Hi Z L = PLL unocked H = PLL locked H H Not locked Hi Z L Submit Documentation Feedback Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 DS90C124, DS90C241 www.ti.com SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 Table 2. DS90C124 Deserializer Truth Table (continued) RPWDNB (PIN 1) REN (PIN 48) Rx PLL STATUS (INTERNAL) ROUTn AND RCLK (SEE PIN DIAGRAM) LOCK (PIN 17) H H Locked Data and RCLK active H 8.4.1 Power Down The power-down state is a low power sleep mode that the serializer and deserializer may use to reduce power when no data is being transferred. The TPWDNB and RPWDNB are used to set each device into power down mode, which reduces supply current to the A range. The serializer enters power down when the TPWDNB pin is driven low. In power down, the PLL stops and the outputs go into TRI-STATE, disabling load current and reducing supply. To exit power down, TPWDNB must be driven high. When the serializer exits power down, its PLL must lock to TCLK before it is ready for the Initialization state. The system must then allow time for Initialization before data transfer can begin. The deserializer enters power down mode when RPWDNB is driven low. In power down mode, the PLL stops and the outputs enter TRI-STATE. To bring the deserializer block out of the power down state, the system drives RPWDNB high. Both the serializer and deserializer must reinitialize and relock before data can be transferred. The deserializer initializes and asserts LOCK high when it is locked to the input clock. 8.4.2 Tri-State For the serializer, TRI-STATE is entered when the DEN or TPWDNB pin is driven low. This does TRI-STATE both driver output pins (DOUT+ and DOUT-). When DEN is driven high, the serializer returns to the previous state as long as all other control pins remain static (TPWDNB, TRFB). When you drive the REN or RPWDNB pin low, the deserializer enters TRI-STATE. Consequently, the receiver output pins (ROUT0 to ROUT23) and RCLK enters TRI-STATE. The LOCK output remains active, reflecting the state of the PLL. The deserializer input pins are high impedance during receiver power down (RPWDNB low) and power-off (VCC = 0 V). 8.4.3 Progressive Turn-On (PTO) Deserializer ROUT[23:0] outputs are grouped into three groups of eight, with each group switching about 0.5-UI apart in phase to reduce EMI, simultaneous switching noise, and system ground bounce. Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 Submit Documentation Feedback 21 DS90C124, DS90C241 SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 www.ti.com 9 Applications and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information 9.1.1 Using the DS90C241 and DS90C124 The DS90C241/DS90C124 serializer or deserializer (SERDES) pair sends 24 bits of parallel LVCMOS data over a serial LVDS link up to 840 Mbps. Serialization of the input data is accomplished using an on-board PLL at the serializer which embeds clock with the data. The deserializer extracts the clock/control information from the incoming data stream and deserializes the data. The deserializer monitors the incoming clockl information to determine lock status and indicates lock by asserting the LOCK output high. 9.1.2 Display Application The DS90C241/DS90C124 chipset is intended for interface between a host (graphics processor) and a display. It supports an 18-bit color depth (RGB666) and up to 800 x 480 display formats. In a RGB666 configuration 18 color bits (R[5:0], G[5:0], B[5:0]), Pixel Clock (PCLK) and three control bits (VS, HS, and DE) along with three spare bits are supported across the serial link with PCLK rates from 5 MHz to 35 MHz. 9.2 Typical Application Figure 22 shows a typical application of the DS90C241 serializer (SER). The LVDS outputs use a 100- termination and 100-nF coupling capacitors to the line. Bypass capacitors are placed near the power supply pins. A system General Purpose Output (GPO) controls the TPWDNB pin. In this application the TRFB pin is tied High to latch data on the rising edge of the TCLK. The DEN signal is not used and is tied High also. In this application, the link is short; therefore, the VODSEL pin is tied Low for the standard LVDS swing. The pre-emphasis input uses a resistor to ground to set the amount of pre-emphasis desired by the application. Figure 23 shows a typical application of the DS90C124 deserializer (DES). The LVDS inputs use a 100- termination and 100-nF coupling capacitors to the line. Bypass capacitors are placed near the power supply pins. A system GPO controls the RPWDNB pin. In this application, the RRFB pin is tied high to strobe the data on the rising edge of the RCLK. The REN signal is not used and is tied high also. 22 Submit Documentation Feedback Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 DS90C124, DS90C241 www.ti.com SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 Typical Application (continued) DS90C241 (SER) VDDDR DIN0 DIN1 DIN2 DIN3 DIN4 DIN5 DIN6 DIN7 DIN8 DIN9 DIN10 DIN11 DIN12 DIN13 DIN14 DIN15 LVCMOS Parallel Interface DIN16 DIN17 DIN18 DIN19 DIN20 DIN21 DIN22 DIN23 3.3V TPWDNB = System GPO DEN = High (ON) TRFB = High (Rising edge) VODSEL = Low (400mV) PRE = Rpre RESRVD = Low DCAOFF = Low DCBOFF = Low DCAOFF DCBOFF VODSEL PRE RESRVD R2 C4 C2 C5 C3 C6 VDDIT VDDL VDDT DOUT+ C7 Serial LVDS Interface R1 DOUT- TPWDNB DEN TRFB C1 VDDPT0 VDDPT1 TCLK GPO 3.3V VSSDR VSSPT0 VSSPT1 VSST VSSL VSSIT VSS C8 C1 to C3 = 0.1 PF C4 to C6 = 0.01 PF C7 = 100 nF; 50WVDC, NPO or X7R C8 = 100 nF; 50WVDC, NPO or X7R R1 = 100: R2 = Open (OFF) or Rpre t 3 k: (ON) (cable specific) Copyright (c) 2017, Texas Instruments Incorporated Figure 22. DS90C241 Typical Application Connection Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 Submit Documentation Feedback 23 DS90C124, DS90C241 SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 www.ti.com Typical Application (continued) DS90C124 (DES) 3.3V VDDIR C5 VDDPR0 VDDPR1 C6 VDDOR1 VDDOR2 VDDOR3 C7 C8 RIN+ C3 C4 ROUT8 ROUT9 ROUT10 ROUT11 ROUT12 ROUT13 ROUT14 ROUT15 R1 RINC10 C2 ROUT0 ROUT1 ROUT2 ROUT3 ROUT4 ROUT5 ROUT6 ROUT7 C9 Serial LVDS Interface C1 VDDR0 VDDR1 C1 to C8 = 0.1 PF to 0.01 PF C9 = 100 nF; 50 WVDC, NPO or X7R C10 = 100 nF; 50 WVDC, NPO or X7R R1 = 100: GPO 3.3V 3.3V RPWDNB REN LVCMOS Parallel Interface ROUT16 ROUT17 ROUT18 ROUT19 ROUT20 ROUT21 ROUT22 ROUT23 RRFB RPWDNB = System GPO REN = High (ON) RRFB = High (Rising edge) RESRVD = Low RESRVD VSSIR VSSOR1 VSSOR2 VSSOR3 VSSPR0 VSSPR1 VSSR0 VSSR1 RCLK LOCK Copyright (c) 2017, Texas Instruments Incorporated Figure 23. DS90C124 Tyical Application Connection 9.2.1 Design Requirements For the typical design application, use the following as input parameters: The SER/DES supports only AC-coupled interconnects through an integrated DC-balanced decoding scheme. External AC coupling capacitors must be placed in series in the FPD-Link III signal path as illustrated in Figure 22 and Figure 23. 24 Submit Documentation Feedback Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 DS90C124, DS90C241 www.ti.com SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 Typical Application (continued) 9.2.2 Detailed Design Procedure Circuit board layout and stack-up for the LVDS serializer and deserializer devices must be designed to provide low-noise power to the device. Good layout practice also separates high frequency or high-level inputs and outputs to minimize unwanted stray noise, feedback and interference. Power system performance may be greatly improved by using thin dielectrics (2 to 4 mil) for power and ground sandwiches. This arrangement uses the plane capacitance for the PCB power system and has low-inductance, which has proven effectiveness especially at high frequencies, and makes the value and placement of external bypass capacitors less critical. External bypass capacitors must include both RF ceramic and tantalum electrolytic types. RF capacitors may use values in the range of 0.01 F to 10 F. Tantalum capacitors may be in the 2.2-F to 10-F range. The voltage rating of the tantalum capacitors must be at least 5 times the power supply voltage being used. MLCC surface mount capacitors are recommended due to their smaller parasitic properties. When using multiple capacitors per supply pin, place the smaller value closer to the pin. A large bulk capacitor is recommended at the point of power entry. This is typically in the 50 F to 100 F range and smooth low frequency switching noise. TI recommends connecting power and ground pins directly to the power and ground planes with bypass capacitors connected to the plane with through on both ends of the capacitor. Connecting power or ground pins to an external bypass capacitor will increase the inductance of the path. A small body size X7R chip capacitor, such as 0603 or 0805, is recommended for external bypass. A small body sized capacitor has less inductance. The user must pay attention to the resonance frequency of these external bypass capacitors, usually in the range from 20 MHz to 30 MHz. To provide effective bypassing, multiple capacitors are often used to achieve low impedance between the supply rails over the frequency of interest. At high frequency, it is also a common practice to use two vias from power and ground pins to the planes, reducing the impedance at high frequency. Use at least a four layer board with a power and ground plane. Place LVCMOS signals away from the LVDS lines to prevent coupling from the LVCMOS lines to the LVDS lines. Closely coupled differential lines of 100 are typically recommended for LVDS interconnect. The closely coupled lines help to ensure that coupled noise will appear as common mode and thus is rejected by the receivers. The tightly coupled lines will also radiate less. 9.2.2.1 Noise Margin The deserializer noise margin is the amount of input jitter (phase noise) that the deserializer can tolerate and still reliably recover data. Various environmental and systematic factors include: * Serializer: TCLK jitter, VCC noise (noise bandwidth and out-of-band noise) * Media: ISI, VCM noise * Deserializer: VCC noise For a graphical representation of noise margin, see Figure 18. 9.2.2.2 Transmission Media The serializer and deserializer can be used in point-to-point configuration, through a PCB trace, or through twisted pair cable. In a point-to-point configuration, the transmission media requires termination at both ends of the transmitter and receiver pair. Interconnect for LVDS typically has a differential impedance of 100 . Use cables and connectors that have matched differential impedance to minimize impedance discontinuities. In most applications that involve cables, the transmission distance is determined on data rates involved, acceptable bit error rate and transmission medium. The resulting signal quality at the receiving end of the transmission media may be assessed by monitoring the differential eye opening of the serial data stream. The Receiver Input Tolerance in Switching Characteristics - Deserializer and the Differential Threshold Voltage specifications in Electrical Characteristics define the acceptable data eye opening. A differential probe must be used to measure across the termination resistor at the DS90C124 inputs. Figure 24 illustrates the eye opening and relationship to the receiver input tolerance and differential threshold voltage specifications. Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 Submit Documentation Feedback 25 DS90C124, DS90C241 SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 www.ti.com Typical Application (continued) Ideal Data Bit Beginning RxIN_TOL -L Minimum Eye Width * VTH - VTL Ideal Data Bit End RxIN_TOL -R tBIT (1UI) Figure 24. Receiver Input Eye Opening 9.2.2.3 Live Link Insertion The serializer and deserializer devices support live pluggable applications. The automatic receiver lock to random data plug and go hot insertion capability allows the DS90C124 to attain lock to the active data stream during a live insertion event. 9.2.3 Application Curves Figure 25, Figure 26, and Figure 27 are scope shots with PCLK = 25 MHz into the DS90C241 with a 1010... pattern on the DIN[23:0] inputs. The scope was triggered on the input PCLK. Figure 25. Input PCLK = 25 MHz and Associated DOUT Serial Stream Figure 26. Input PCLK = 25 MHz and Associated DOUT Serial Stream With Pre-Emphasis Figure 27. Input PCLK = 25 MHz and Associated DOUT Serial Stream With VODSEL = H 26 Submit Documentation Feedback Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 DS90C124, DS90C241 www.ti.com SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 Typical Application (continued) Figure 28, Figure 29, and Figure 30 are scope shots with PCLK = 33 MHz into the DS90C241 with a 1010... pattern on the DIN[23:0] inputs. The scope was triggered on the input PCLK. Figure 28. Input PCLK = 33 MHz and Associated DOUT Serial Stream Figure 29. Input PCLK = 33 MHz and Associated DOUT Serial Stream With Pre-Emphasis PCLK DOUT+/w/ VOD=H (differential) Figure 30. Input PCLK = 33 MHz and Associated DOUT Serial Stream With VODSEL = H 10 Power Supply Recommendations An all CMOS design of the serializer and deserializer makes them inherently low power devices. Additionally, the constant current source nature of the LVDS outputs minimize the slope of the speed versus ICC curve of CMOS designs. Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 Submit Documentation Feedback 27 DS90C124, DS90C241 SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 www.ti.com 11 Layout 11.1 Layout Guidelines Circuit board layout and stack-up for the LVDS SERDES devices must be designed to provide low-noise power feed to the device. Good layout practice also separates high frequency or high-level inputs and outputs to minimize unwanted stray noise pickup, feedback and interference. Power system performance may be greatly improved by using thin dielectrics (2 to 4 mils) for power and ground sandwiches. This arrangement provides plane capacitance for the PCB power system with low-inductance parasitics, which has proven especially effective at high frequencies, and makes the value and placement of external bypass capacitors less critical. External bypass capacitors must include both RF ceramic and tantalum electrolytic types. RF capacitors may use values in the range of 0.01 F to 0.1 F. Tantalum capacitors may be in the 2.2-F to 10-F range. Voltage rating of the tantalum capacitors must be at least 5 times the power supply voltage being used. Surface mount capacitors are recommended due to their smaller parasitics. When using multiple capacitors per supply pin, place the smaller value closer to the pin. A large bulk capacitor is recommend at the point of power entry. This is typically in the 50-F to 100-F range and smooth low frequency switching noise. TI recommends connecting power and ground pins directly to the power and ground planes with bypass capacitors connected to the plane with via on both ends of the capacitor. Connecting power or ground pins to an external bypass capacitor increases the inductance of the path. A small body size X7R chip capacitor, such as 0603, is recommended for external bypass. Its small body size reduces the parasitic inductance of the capacitor. The user must pay attention to the resonance frequency of these external bypass capacitors, usually in the range of 20 MHz to 30 MHz range. To provide effective bypassing, multiple capacitors are often used to achieve low impedance between the supply rails over the frequency of interest. At high frequency, it is also a common practice to use two vias from power and ground pins to the planes, reducing the impedance at high frequency. Some devices provide separate power and ground pins for different portions of the circuit. This is done to isolate switching noise effects between different sections of the circuit. Separate planes on the PCB are typically not required. Pin Configuration and Functions typically provide guidance on which circuit blocks are connected to which power pin pairs. In some cases, an external filter many be used to provide clean power to sensitive circuits such as PLLs. Use at least a four layer board with a power and ground plane. Place LVCMOS (LVTTL) signals away from the LVDS lines to prevent coupling from the LVCMOS lines to the LVDS lines. Closely-coupled differential lines of 100 are typically recommended for LVDS interconnect. The closely coupled lines help to ensure that coupled noise appears as common-mode and thus is rejected by the receivers. The tightly coupled lines also radiate less. Termination of the LVDS interconnect is required. For point-to-point applications, termination must be placed at both ends of the devices. Nominal value is 100 to match the line's differential impedance. Place the resistor as close to the transmitter DOUT outputs and receiver RIN inputs as possible to minimize the resulting stub between the termination resistor and device. 11.1.1 LVDS Interconnect Guidelines See AN-1108 Channel-Link PCB and Interconnect Design-In Guidelines (SNLA008) and AN-905 Transmission Line RAPIDESIGNER(c) Operation and Applications Guide (SNLA035) for full details. * Use 100- coupled differential pairs * Use the S/2S/3S rule in spacings - S = space between the pair - 2S = space between pairs - 3S = space to LVCMOS/LVTTL signal * Minimize the number of vias * Use differential connectors when operating above 500-Mbps line speed * Maintain balance of the traces * Minimize skew within the pair * Terminate as close to the TX outputs and RX inputs as possible Additional general guidance can be found in the LVDS Owner's Manual available in PDF format from the TI web site at: www.ti.com/lvds. 28 Submit Documentation Feedback Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 DS90C124, DS90C241 www.ti.com SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 11.2 Layout Example Figure 31 shows the input LVCMOS traces and output high-speed, 100- differential traces from the DS90C241 EVM. Figure 31. DS90C241 Layout Example from DS90C241 EVM Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 Submit Documentation Feedback 29 DS90C124, DS90C241 SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 www.ti.com Layout Example (continued) Figure 32 shows the input high-speed, 100- differential traces and the output LVCMOS traces and from the DS90C124 EVM. Figure 32. DS90C124 Layout Example from DS90C124 EVM 30 Submit Documentation Feedback Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 DS90C124, DS90C241 www.ti.com SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 Layout Example (continued) Figure 33 shows the power decoupling from the DS90C241 EVM. Figure 33. DS90C241 Example Layout of Power Decoupling from EVM Figure 34 shows the power decoupling from the DS90C124 EVM. Figure 34. DS90C124 Example Layout of Power Decoupling from EVM Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 Submit Documentation Feedback 31 DS90C124, DS90C241 SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 www.ti.com 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation For related documentation see the following: * AN-1217 How to Validate BLVDS SER/DES Signal Integrity Using an Eye Mask (SNLA053) * AN-1108 Channel-Link PCB and Interconnect Design-In Guidelines (SNLA008) * AN-905 Transmission Line RAPIDESIGNER(c) Operation and Applications Guide (SNLA035) 12.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 3. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY DS90C124 Click here Click here Click here Click here Click here DS90C241 Click here Click here Click here Click here Click here 12.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.5 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.6 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.7 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 32 Submit Documentation Feedback Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 DS90C124, DS90C241 www.ti.com SNLS209M - NOVEMBER 2005 - REVISED JANUARY 2017 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright (c) 2005-2017, Texas Instruments Incorporated Product Folder Links: DS90C124 DS90C241 Submit Documentation Feedback 33 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) DS90C124IVS/NOPB ACTIVE TQFP PFB 48 250 RoHS & Green SN Level-3-260C-168 HR -40 to 105 DS90C124 IVS DS90C124IVSX/NOPB ACTIVE TQFP PFB 48 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 105 DS90C124 IVS DS90C124QVS/NOPB ACTIVE TQFP PFB 48 250 RoHS & Green SN Level-3-260C-168 HR -40 to 105 DS90C124 QVS DS90C124QVSX/NOPB ACTIVE TQFP PFB 48 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 105 DS90C124 QVS DS90C241IVS/NOPB ACTIVE TQFP PFB 48 250 RoHS & Green SN Level-3-260C-168 HR -40 to 105 DS90C241 IVS DS90C241IVSX/NOPB ACTIVE TQFP PFB 48 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 105 DS90C241 IVS DS90C241QVS/NOPB ACTIVE TQFP PFB 48 250 RoHS & Green SN Level-3-260C-168 HR -40 to 105 DS90C241 QVS DS90C241QVSX/NOPB ACTIVE TQFP PFB 48 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 105 DS90C241 QVS (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF DS90C124, DS90C124-Q1, DS90C241, DS90C241-Q1 : * Catalog: DS90C124, DS90C241 * Automotive: DS90C124-Q1, DS90C241-Q1 NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-Aug-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DS90C124IVSX/NOPB TQFP PFB 48 1000 330.0 16.4 9.3 9.3 2.2 12.0 16.0 Q2 DS90C124QVSX/NOPB TQFP PFB 48 1000 330.0 16.4 9.3 9.3 2.2 12.0 16.0 Q2 DS90C241IVSX/NOPB TQFP PFB 48 1000 330.0 16.4 9.3 9.3 2.2 12.0 16.0 Q2 DS90C241QVSX/NOPB TQFP PFB 48 1000 330.0 16.4 9.3 9.3 2.2 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Aug-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS90C124IVSX/NOPB TQFP PFB 48 1000 367.0 367.0 38.0 DS90C124QVSX/NOPB TQFP PFB 48 1000 367.0 367.0 38.0 DS90C241IVSX/NOPB TQFP PFB 48 1000 367.0 367.0 38.0 DS90C241QVSX/NOPB TQFP PFB 48 1000 367.0 367.0 38.0 Pack Materials-Page 2 MECHANICAL DATA MTQF019A - JANUARY 1995 - REVISED JANUARY 1998 PFB (S-PQFP-G48) PLASTIC QUAD FLATPACK 0,27 0,17 0,50 36 0,08 M 25 37 24 48 13 0,13 NOM 1 12 5,50 TYP 7,20 SQ 6,80 9,20 SQ 8,80 Gage Plane 0,25 0,05 MIN 0- 7 1,05 0,95 Seating Plane 0,75 0,45 0,08 1,20 MAX 4073176 / B 10/96 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Falls within JEDEC MS-026 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES "AS IS" AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI's products are provided subject to TI's Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI's provision of these resources does not expand or otherwise alter TI's applicable warranties or warranty disclaimers for TI products. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2020, Texas Instruments Incorporated