DS90C241IVS/NOPB - NATIONAL SEMICONDUCTOR

DEN

VODSEL

DIN

TRFB

REN

RRFB

RPWDNB

TCLK

TPWDNB

SERIALIZER ± DS90C241

PLL

Timing

and

Control

DOUT-

RT = 100:

RIN-

DESERIALIZER ± DS90C124

DOUT+ RIN+

PLL Timing

and

Control

24 ROUT

LOCK

RCLK

Clock

Recovery

Output Latch

Serial to Parallel

DC Balance Decode

Input Latch

Parallel to Serial

DC Balance Encode

CLK1

bit0

bit1

bit2

bit3

bit4

bit5

bit6

bit7

bit8

bit9

bit10

bit11

DCA

DCB

bit12

bit13

bit14

bit15

bit16

bit17

bit18

bit19

bit20

bit21

bit22

bit23

CLK0

PRE

Product

Folder

Order

Now

Technical

Documents

Tools &

Software

Support &

Community

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

DS90C124

DS90C241

SNLS209M –NOVEMBER 2005–REVISED JANUARY 2017

DS90C241 and DS90C124 5-MHz to 35-MHz DC-Balanced 24-Bit

FPD-Link II Serializer and Deserializer

1 Features

1• 5-MHz to 35-MHz Clock Embedded and DC-

Balancing 24:1 and 1:24 Data Transmissions

• User Defined Pre-Emphasis Driving Ability

Through External Resistor on LVDS Outputs and

Capable to Drive Up to 10-Meter Shielded

Twisted-Pair Cable

• User-Selectable Clock Edge for Parallel Data on

Both Transmitter and Receiver

• Internal DC Balancing Encode and Decode

(Supports AC-Coupling Interface With No External

Coding Required)

• Individual Power-Down Controls for Both

Transmitter and Receiver

• Embedded Clock CDR (Clock and Data Recovery)

on Receiver and No External Source of Reference

Clock Required

• All Codes RDL (Random Data Lock) to Support

Live-Pluggable Applications

• LOCK Output Flag to Ensure Data Integrity at

Receiver Side

• Balanced TSETUP and THOLD Between RCLK and

RDATA on Receiver Side

• PTO (Progressive Turnon) LVCMOS Outputs to

Reduce EMI and Minimize SSO Effects

• All LVCMOS Inputs and Control Pins Have

Internal Pulldown

• On-Chip Filters for PLLs on Transmitter and

Receiver

• Temperature Range: –40°C to 105°C

• Greater Than 8-kV HBM ESD Tolerant

• Meets AEC-Q100 Compliance

• Power Supply Range: 3.3 V ± 10%

• 48-Pin TQFP Package

2 Applications

• Automotive Central Information Displays

• Automotive Instrument Cluster Displays

• Automotive Heads-Up Displays

• Remote Camera-Based Driver Assistance

Systems

3 Description

The DS90C241 and DS90C124 chipset translates a

24-bit parallel bus into a fully transparent data and

control LVDS serial stream with embedded clock

information. This single serial stream simplifies

transferring a 24-bit bus over PCB traces or over

cable by eliminating the skew problems between

parallel data and clock paths. It saves system cost by

narrowing data paths, which in turn reduces PCB

layers, cable width, and connector size and pins.

The DS90C241 and DS90C124 incorporate LVDS

signaling on the high-speed I/O. LVDS provides a

low-power and low-noise environment for reliably

transferring data over a serial transmission path. By

optimizing the serializer output edge rate for the

operating frequency range, EMI is further reduced.

In addition, the device features pre-emphasis to boost

signals over longer distances using lossy cables.

Internal DC balanced encoding and decoding

supports AC-coupled interconnects.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

DS90C124

DS90C241 TQFP (48) 7.00 mm x 7.00 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Block Diagram

DS90C124

DS90C241

SNLS209M –NOVEMBER 2005–REVISED JANUARY 2017

www.ti.com

Product Folder Links: DS90C124 DS90C241

Table of Contents

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description............................................................. 1

4 Revision History..................................................... 2

5 Pin Configuration and Functions......................... 3

6 Specifications......................................................... 7

6.1 Absolute Maximum Ratings ..................................... 7

6.2 ESD Ratings.............................................................. 7

6.3 Recommended Operating Conditions....................... 7

6.4 Thermal Information.................................................. 8

6.5 Electrical Characteristics........................................... 8

6.6 Timing Requirements – Serializer............................. 9

6.7 Switching Characteristics – Serializer..................... 10

6.8 Switching Characteristics – Deserializer................. 10

6.9 Typical Characteristics............................................ 11

7 Parameter Measurement Information ................ 12

8 Detailed Description............................................ 17

8.1 Overview................................................................. 17

8.2 Functional Block Diagram....................................... 17

8.3 Feature Description................................................. 17

8.4 Device Functional Modes........................................ 20

9 Applications and Implementation ...................... 22

9.1 Application Information............................................ 22

9.2 Typical Application ................................................. 22

10 Power Supply Recommendations ..................... 27

11 Layout................................................................... 28

11.1 Layout Guidelines ................................................. 28

11.2 Layout Example .................................................... 29

12 Device and Documentation Support................. 32

12.1 Documentation Support ........................................ 32

12.2 Related Links ........................................................ 32

12.3 Receiving Notification of Documentation Updates 32

12.4 Community Resources.......................................... 32

12.5 Trademarks........................................................... 32

12.6 Electrostatic Discharge Caution............................ 32

12.7 Glossary................................................................ 32

13 Mechanical, Packaging, and Orderable

Information........................................................... 33

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision L (April 2013) to Revision M Page

• Added ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section.................................................................................................. 1

• Deleted Lead temperature, soldering (260°C maximum) from Absolute Maximum Ratings.................................................. 7

• Added Thermal Information table........................................................................................................................................... 8

• Added Typical Characteristics (PCLK = 5 MHz and PCLK = 25 MHz plus pre-emphasis).................................................. 11

Changes from Revision K (April 2013) to Revision L Page

• Changed layout of National Semiconductor Data Sheet to TI format .................................................................................... 1

48DIN[19]

47DIN[18]

46DIN[17]

45DIN[16]

44DIN[15]

VSSIT

VDDIT

41DIN[14]

40DIN[13]

39DIN[12]

38DIN[11]

37DIN[10]

RESRVD

VDDPT1

VSSPT1

VDDPT0

VSSPT0

DEN

DOUT-

DOUT+

VSSDR

VDDDR

PRE

VSS

12VODSEL

11TRFB

10TCLK

9TPWDNB

8DCBOFF

VDDL

VSSL

5DCAOFF

4DIN[23]

3DIN[22]

2DIN[21]

1DIN[20]

DIN[0]

DIN[1]

DIN[2]

DIN[3]

DIN[4]

VDDT

VSST

DIN[5]

DIN[6]

DIN[7]

DIN[8]

DIN[9]

DS90C241

48 PIN TQFP

DS90C124

DS90C241

www.ti.com

SNLS209M –NOVEMBER 2005–REVISED JANUARY 2017

Product Folder Links: DS90C124 DS90C241

(1) G = Ground, I = Input, O = Output, P = Power

5 Pin Configuration and Functions

DS90C241 Serializer PFB Package

48-Pin TQFP

Top View

Pin Functions – DS90C241 Serializer

PIN TYPE(1) DESCRIPTION

NAME NO.

LVCMOS PARALLEL INTERFACE PINS

DIN[23:0] 4-1, 48-44,

41-32, 29-25 I LVCMOS, Transmitter parallel interface data input pins. Tie LOW if unused, do not float.

TCLK 10 I LVCMOS, Transmitter parallel interface clock input pin. Strobe edge set by TRFB

configuration pin.

CONTROL AND CONFIGURATION PINS

DCAOFF 5 I LVCMOS, Reserved. This pin must be tied LOW.

DCBOFF 8 I LVCMOS, Reserved. This pin must be tied LOW.

DEN 18 I LVCMOS, Transmitter data enable.

DEN = H; LVDS driver outputs are enabled (ON).

DEN = L; LVDS driver outputs are disabled (OFF), Transmitter LVDS driver DOUT (±) outputs

are in TRI-STATE, PLL still operational and locked to TCLK.

PRE 23 I

LVCMOS, Pre-emphasis level select.

PRE = NC (No Connect); Pre-emphasis is disabled (OFF).

Pre-emphasis is active when input is tied to VSS through external resistor RPRE. Resistor

value determines pre-emphasis level. Recommended value RPRE ≥3 kΩ; Imax = [(1.2/R) ×

20], Rmin = 3 kΩ

RESRVD 13 I LVCMOS, Reserved. This pin must be tied LOW.

TPWDNB 9 I LVCMOS, Transmitter power down bar.

TPWDNB = H; Transmitter is enabled and ON

TPWDNB = L; Transmitter is in power down mode (Sleep), LVDS driver DOUT (±) outputs are

in TRI-STATE stand-by mode, PLL is shutdown to minimize power consumption.

DS90C124

DS90C241

SNLS209M –NOVEMBER 2005–REVISED JANUARY 2017

www.ti.com

Product Folder Links: DS90C124 DS90C241

Pin Functions – DS90C241 Serializer (continued)

PIN TYPE(1) DESCRIPTION

NAME NO.

TRFB 11 I LVCMOS, Transmitter clock edge select pin.

TRFB = H; Parallel interface data is strobed on the rising clock edge.

TRFB = L; Parallel interface data is strobed on the falling clock edge.

VODSEL 12 I

LVCMOS, VOD Level select

VODSEL = L; LVDS driver output is approximately ± 400 mV (RL= 100 Ω)

VODSEL = H; LVDS driver output is approximately ± 750 mV (RL= 100 Ω)

For normal applications, set this pin LOW. For long cable applications where a larger VOD is

required, set this pin HIGH.

LVDS SERIAL INTERFACE PINS

DOUT−19 O LVDS, Transmitter LVDS inverted (-) output

This output is intended to be loaded with a 100-Ωload to the DOUT- pin. The interconnect

must be AC-coupled to this pin with a 100-nF capacitor.

DOUT+ 20 O LVDS, Transmitter LVDS true (+) output.

This output is intended to be loaded with a 100-Ωload to the DOUT+ pin. The interconnect

must be AC-coupled to this pin with a 100-nF capacitor.

POWER OR GROUND PINS

VDDDR 22 P VDD, Analog voltage supply, LVDS output power

VDDIT 42 P VDD, Digital voltage supply, Tx input power

VDDL 7 P VDD, Digital voltage supply, Tx logic power

VDDPT0 16 P VDD, Analog voltage supply, VCO power

VDDPT1 14 P VDD, Analog voltage supply, PLL power

VDDT 30 P VDD, Digital voltage supply, Tx serializer power

VSS 24 G ESD ground

VSSDR 21 G Analog ground, LVDS output ground

VSSIT 43 G Digital ground, Tx input ground

VSSL 6 G Digital ground, Tx logic ground

VSSPT0 17 G Analog ground, VCO ground

VSSPT1 15 G Analog ground, PLL ground

VSST 31 G Digital ground, Tx serializer ground

48REN

VDDPR0

VSSPR0

VDDPR1

VSSPR1

43RRFB

42RIN-

41RIN+

VSSIR

VDDIR

VSSR1

VDDR1

ROUT[15]

ROUT[14]

ROUT[13]

ROUT[12]

LOCK

RCLK

VSSOR2

VDDOR2

ROUT[11]

ROUT[10]

ROUT[9]

ROUT[8]

12ROUT[16]

11ROUT[17]

10ROUT[18]

9ROUT[19]

VSSOR3

VDDOR3

6ROUT[20]

5ROUT[21]

4ROUT[22]

3ROUT[23]

2RESRVD

1RPWDNB

ROUT[7]

ROUT[6]

ROUT[5]

ROUT[4]

VSSOR1

VDDOR1

ROUT[3]

ROUT[2]

ROUT[1]

ROUT[0]

VSSR0

VDDR0

DS90C124

48 PIN TQFP

PTO GROUP 3

PTO GROUP 1

PTO GROUP 2

DS90C124

DS90C241

www.ti.com

SNLS209M –NOVEMBER 2005–REVISED JANUARY 2017

Product Folder Links: DS90C124 DS90C241

(1) G = Ground, I = Input, O = Output, P = Power

DS90C124 Deserializer PFB Package

48-Pin TQFP

Top View

Pin Functions – DS90C124 Deserializer

PIN TYPE(1) DESCRIPTION

NAME NO.

LVCMOS PARALLEL INTERFACE PINS

RCLK 18 O LVCMOS, Parallel interface clock output pin. Strobe edge set by RRFB configuration pin.

ROUT[7:0] 25-28, 31-34 O LVCMOS, Receiver LVCMOS level outputs – Group 1

ROUT[15:8] 13-16, 21-24 O LVCMOS, Receiver LVCMOS level outputs – Group 2

ROUT[23:16] 3-6, 9-12 O LVCMOS, Receiver LVCMOS level outputs – Group 3

CONTROL AND CONFIGURATION PINS

REN 48 I LVCMOS, Receiver data enable

REN = H; ROUT[23:0] and RCLK are enabled (ON).

REN = L; ROUT[23:0] and RCLK are disabled (OFF), receiver ROUT[23:0] and RCLK outputs

are in TRI-STATE, PLL still operational and locked to TCLK.

LOCK 17 O LVCMOS, LOCK indicates the status of the receiver PLL

LOCK = H; receiver PLL is locked

LOCK = L; receiver PLL is unlocked, ROUT[23:0] and RCLK are TRI-STATED

RESRVD 2 I LVCMOS, Reserved. This pin must be tied LOW.

RPWDNB 1 I LVCMOS, Receiver power down bar.

RPWDNB = H; Receiver is enabled and ON

RPWDNB = L; Receiver is in power down mode (Sleep), ROUT[23:0], RCLK, and LOCK are in

TRI-STATE standby mode, PLL is shutdown to minimize power consumption.

RRFB 43 I LVCMOS, Receiver clock edge select pin.

RRFB = H; ROUT LVCMOS outputs strobed on the rising clock edge.

RRFB = L; ROUT LVCMOS outputs strobed on the falling clock edge.

DS90C124

DS90C241

SNLS209M –NOVEMBER 2005–REVISED JANUARY 2017

www.ti.com

Product Folder Links: DS90C124 DS90C241

Pin Functions – DS90C124 Deserializer (continued)

PIN TYPE(1) DESCRIPTION

NAME NO.

LVDS SERIAL INTERFACE PINS

RIN−42 I Receiver LVDS Inverted (−) Input

This input is intended to be terminated with a 100-Ωload to the RIN- pin. The interconnect

must be AC-coupled to this pin with a 100-nF capacitor.

RIN+ 41 I Receiver LVDS True (+) input

This input is intended to be terminated with a 100-Ωload to the RIN+ pin. The interconnect

must be AC-coupled to this pin with a 100-nF capacitor.

POWER OR GROUND PINS

VDDIR 39 P VDD, Analog LVDS voltage supply, power

VDDOR1 30 P VDD, Digital voltage supply, LVCMOS output power

VDDOR2 20 P VDD, Digital voltage supply, LVCMOS output power

VDDOR3 7 P VDD, Digital voltage supply, LVCMOS output power

VDDPR0 47 P VDD, Analog voltage supply, PLL power

VDDPR1 45 P VDD, Analog voltage supply, PLL VCO power

VDDR0 36 P VDD, Digital voltage supply, Logic power

VDDR1 37 P VDD, Digital voltage supply, Logic power

VSSIR 40 G Analog LVDS ground

VSSOR1 29 G Digital ground, LVCMOS output ground

VSSOR2 19 G Digital ground, LVCMOS output ground

VSSOR3 8 G Digital ground, LVCMOS output ground

VSSPR0 46 G Analog ground, PLL ground

VSSPR1 44 G Analog ground, PLL VCO ground

VSSR0 35 G Digital ground, Logic ground

VSSR1 38 G Digital ground, Logic ground

DS90C124

DS90C241

www.ti.com

SNLS209M –NOVEMBER 2005–REVISED JANUARY 2017

Product Folder Links: DS90C124 DS90C241

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN MAX UNIT

VCC Supply voltage –0.3 4 V

LVCMOS/LVTTL input voltage –0.3 VCC + 0.3 V

LVCMOS/LVTTL output voltage –0.3 VCC + 0.3 V

LVDS receiver input voltage –0.3 3.9 V

LVDS driver output voltage –0.3 3.9 V

LVDS output short circuit duration 10 ms

TJJunction temperature 150 °C

Tstg Storage temperature –65 150 °C

(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.2 ESD Ratings VALUE UNIT

V(ESD) Electrostatic discharge

Human-body model (HBM), per AEC Q100-002(1) ±8000

Charged-device model (CDM), per AEC Q100-011 ±1250

RD= 330 Ω, CS= 150 pF

IEC, powered-up only contact

discharge (RIN0+, RIN0-, RIN1+, RIN1-)±8000

IEC, powered-up only air-gap

discharge (RIN0+, RIN0-, RIN1+, RIN1-)±15000

RD= 330 Ω, CS= 150 and 330 pF

ISO10605 contact discharge

(RIN0+, RIN0-, RIN1+, RIN1-)±8000

ISO10605 air-gap discharge

(RIN0+, RIN0-, RIN1+, RIN1-)±15000

RD= 2 kΩ, CS= 150 and 330 pF

ISO10605 contact discharge

(RIN0+, RIN0-, RIN1+, RIN1-)±8000

ISO10605 air-gap discharge

(RIN0+, RIN0-, RIN1+, RIN1-)±15000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT

VCC Supply voltage 3 3.3 3.6 V

Clock rate 5 35 MHz

Supply noise ±100 mVP-P

TAOperating free-air temperature −40 25 105 °C

DS90C124

DS90C241

SNLS209M –NOVEMBER 2005–REVISED JANUARY 2017

www.ti.com

Product Folder Links: DS90C124 DS90C241

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

DS90C241-Q1

DS90C124-Q1 UNIT

TFB (TQFP)

48 PINS

RθJA Junction-to-ambient thermal resistance 67.5 °C/W

RθJC(top) Junction-to-case (top) thermal resistance 15.1 °C/W

RθJB Junction-to-board thermal resistance 33.4 °C/W

ψJT Junction-to-top characterization parameter 0.4 °C/W

ψJB Junction-to-board characterization parameter 33 °C/W

(1) Specification is ensured by characterization and is not tested in production.

6.5 Electrical Characteristics

over recommended operating supply and temperature ranges (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

LVCMOS AND LVTTL DC SPECIFICATIONS

VIH High-level voltage Tx: DIN[23:0], TCLK, TPWDNB, DEN, TRFB,

DCAOFF, DCBOFF, and VODSEL; and

Rx: RPWDNB, RRFB, and REN 2 VCC V

VIL Low-level input voltage Tx: DIN[23:0], TCLK, TPWDNB, DEN, TRFB,

DCAOFF, DCBOFF, and VODSEL; and

Rx: RPWDNB, RRFB, and REN GND 0.8 V

VCL Input clamp voltage ICL =−18 mA, Tx: DIN[23:0], TCLK, TPWDNB, DEN,

TRFB, DCAOFF, DCBOFF, and VODSEL; and

Rx: RPWDNB, RRFB, and REN(1) −0.8 −1.5 V

IIN Input current VIN = 0 V or 3.6 V

Tx: DIN[23:0], TCLK,

TPWDNB, DEN, TRFB,

DCAOFF, DCBOFF,

and VODSEL

−10 ±5 10 µA

Rx: RPWDNB, RRFB,

and REN −20 ±5 20

VOH High-level output voltage IOH =−4 mA, Rx: ROUT[23:0], RCLK, and LOCK 2.3 3 VCC V

VOL Low-level output voltage IOL = 4 mA, Rx: ROUT[23:0], RCLK, and LOCK GND 0.33 0.5 V

IOS Output short circuit current VOUT = 0 V, Rx: ROUT[23:0], RCLK, and LOCK(1) −40 −70 −110 mA

IOZ TRI-STATE output current RPWDNB, REN = 0 V, VOUT = 0 V or 2.4 V,

Rx: ROUT[23:0], RCLK, and LOCK −30 ±0.4 30 µA

LVDS DC SPECIFICATIONS

VTH Differential threshold high

voltage VCM = 1.2 V, Rx: RIN+ and RIN−50 mV

VTL Differential threshold low

voltage Rx: RIN+ and RIN−−50 mV

IIN Input current VIN = 2.4 V, VCC = 3.6 V or 0 V, Rx: RIN+ and RIN−±200 µA

VIN = 0 V, VCC = 3.6 V, Rx: RIN+ and RIN−±200

VOD Output differential voltage

(DOUT+) – (DOUT−)RL= 100 Ω, without pre-

emphasis, Tx: DOUT+ and

DOUT−(see Figure 12)

VODSEL = L 250 400 600 mV

VODSEL = H 450 750 1200

ΔVOD Output differential voltage

unbalance RL= 100 Ω, without pre-emphasis, Tx: DOUT+ and

DOUT−10 50 mV

VOS Offset voltage RL= 100 Ω, without pre-emphasis, Tx: DOUT+ and

DOUT−1 1.25 1.5 V

ΔVOS Offset voltage unbalance RL= 100 Ω, without pre-emphasis, Tx: DOUT+ and

DOUT−1 50 mV

DS90C124

DS90C241

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SNLS209M –NOVEMBER 2005–REVISED JANUARY 2017

Product Folder Links: DS90C124 DS90C241

Electrical Characteristics (continued)

over recommended operating supply and temperature ranges (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

IOS Output short circuit current

DOUT = 0 V, DIN = H,

TPWDNB, DEN = 2.4 V,

Tx: DOUT+ and DOUT−

VODSEL = L −2−8

DOUT = 0 V, DIN = H,

TPWDNB, DEN = 2.4 V,

Tx: DOUT+ and DOUT−

VODSEL = H −7−13

IOZ TRI-STATE output current TPWDNB, DEN = 0 V, DOUT = 0 V or 2.4 V,

Tx: DOUT+ and DOUT−

−15 ±1 15 µA

SERIALIZER OR DESERIALIZER SUPPLY CURRENT – DVDDx, PVDDx, AND AVDDx PINS (Digital, PLL, and Analog VDDs)

ICCT

Serializer (Tx) total supply

current (includes load current)

RL= 100 Ω, RPRE = OFF, VODSEL = H/L, f = 35 MHz,

and checker-board pattern (see Figure 3)40 65 mA

RL= 100 Ω, RPRE = 6 kΩ, VODSEL = H/L, f = 35 MHz,

and checker-board pattern (see Figure 3)45 70 mA

Serializer (Tx) total supply

current (includes load current)

f = 35 MHz, RL= 100 Ω, RPRE = OFF,

and VODSEL = H/L 40 65 mA

f = 35 MHz, RL= 100 Ω, RPRE = 6 kΩ, VODSEL = H/L,

and random pattern 45 70 mA

ICCTZ Serializer (Tx) supply current

power-down TPWDNB = 0 V (all other LVCMOS inputs = 0 V) 800 µA

ICCR

Deserializer (Rx) total supply

current (includes load current) CL= 8-pF LVCMOS output, f = 35 MHz, and checker-

board pattern (see Figure 4)85 mA

Deserializer (Rx) total supply

current (includes load current) CL= 8-pF LVCMOS output, f = 35 MHz, and random

pattern 80 mA

ICCRZ Deserializer (Rx) supply current

power-down RPWDNB = 0 V (all other LVCMOS inputs = 0 V,

RIN+/ RIN– = 0 V) 50 µA

(1) tJIT (at BER of 10e-9) specifies the allowable jitter on TCLK. tJIT not included in TxOUT_E_O parameter.

6.6 Timing Requirements – Serializer

over recommended operating supply and temperature ranges (unless otherwise noted)

MIN TYP MAX UNIT

tTCP Transmit clock period (see Figure 7) 28.6 T 200 ns

tTCIH Transmit clock high time 0.4T 0.5T 0.6T ns

tTCIL Transmit clock low time 0.4T 0.5T 0.6T ns

tCLKT TCLK input transition time (see Figure 6) 3 6 ns

tJIT TCLK input jitter(1) 33 ps (RMS)

DS90C124

DS90C241

SNLS209M –NOVEMBER 2005–REVISED JANUARY 2017

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Product Folder Links: DS90C124 DS90C241

(1) Specification is ensured by characterization and is not tested in production.

(2) When the serializer output is tri-stated, the deserializer loses PLL lock. Resynchronization must occur before data transfer.

(3) tJIT (at BER of 10e-9) specifies the allowable jitter on TCLK. tJIT not included in TxOUT_E_O parameter.

(4) TxOUT_E_O is affected by pre-emphasis value.

(5) UI – Unit Interval; equivalent to one ideal serialized data bit width. The UI scales with frequency.

6.7 Switching Characteristics – Serializer

over recommended operating supply and temperature ranges (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

tLLHT LVDS Low-to-High transition

time RL= 100 Ω, CL= 10 pF to GND, and

VODSEL = L (see Figure 5)0.6 ns

tLHLT LVDS High-to-Low transition

time RL= 100 Ω, CL= 10 pF to GND, and

VODSEL = L (see Figure 5)0.6 ns

tDIS DIN[23:0] setup to TCLK RL= 100 Ωand CL= 10 pF to GND(1) 5 ns

tDIH DIN[23:0] hold from TCLK RL= 100 Ωand CL= 10 pF to GND(1) 5 ns

tHZD DOUT± HIGH to TRI-STATE

delay RL= 100 Ωand CL= 10 pF to GND

(see Figure 8)(2) 15 ns

tLZD DOUT± LOW to TRI-STATE

delay RL= 100 Ωand CL= 10 pF to GND

(see Figure 8)(2) 15 ns

tZHD DOUT± TRI-STATE to HIGH

delay RL= 100 Ωand CL= 10 pF to GND

(see Figure 8)(2) 200 ns

tZLD DOUT± TRI-STATE to LOW

delay RL= 100 Ωand CL= 10 pF to GND

(see Figure 8)(2) 200 ns

tPLD Serializer PLL lock time RL= 100 Ω(see Figure 9) 10 ms

tSD Serializer delay

RL= 100 Ω, VODSEL = L, and TRFB = H

(see Figure 10)3.5T + 2.85 3.5T + 10 ns

RL= 100 Ω, VODSEL = L, and TRFB = L

(see Figure 10)3.5T + 2.85 3.5T + 10 ns

TxOUT_E_O TxOUT_Eye_Opening

(respect to ideal) 5 MHz to 35 MHz (see Figure 11)(1)(3)(4) 0.75 UI(5)

(1) Specification is ensured by characterization and is not tested in production.

6.8 Switching Characteristics – Deserializer

over recommended operating supply and temperature ranges (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

tRCP Receiver out clock period tRCP = tTCP and RCLK pin(1) 28.6 200 ns

tRDC RCLK duty cycle RCLK pin 45% 50% 55%

tCLH LVCMOS low-to-high

transition time CL= 8 pF (lumped load);

ROUT[23:0], LOCK, and RCLK

pins (see Figure 13)(1) 2.5 3.5 ns

tCHL LVCMOS high-to-low

transition time CL= 8 pF (lumped load);

ROUT[23:0], LOCK, and RCLK

pins (see Figure 13)(1) 2.5 3.5 ns

tROS ROUT[7:0] setup data to

RCLK (Group 1) ROUT[7:0] pins (see Figure 17) 0.4 × tRCP (29/56) × tRCP ns

tROH ROUT[7:0] hold data to

RCLK (Group 1) ROUT[7:0] pins (see Figure 17) 0.4 × tRCP (27/56) × tRCP ns

tROS ROUT[15:8] setup data

to RCLK (Group 2) ROUT[15:8] and LOCK pins

(see Figure 17)0.4 × tRCP 0.5 × tRCP ns

tROH ROUT[15:8] hold data to

RCLK (Group 2) ROUT[15:8] and LOCK pins

(see Figure 17)0.4 × tRCP 0.5 × tRCP ns

tROS ROUT[23:16] setup data

to RCLK (Group 3) ROUT[23:16] pins

(see Figure 17)0.4 × tRCP (27/56) × tRCP ns

tROH ROUT[23:16] hold data

to RCLK (Group 3) ROUT[23:16] pins

(see Figure 17)0.4 × tRCP (29/56) × tRCP ns

tHZR HIGH to TRI-STATE

delay ROUT[23:0], RCLK, and LOCK

pins (see Figure 15)3 10 ns

DS90C124

DS90C241

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Switching Characteristics – Deserializer (continued)

over recommended operating supply and temperature ranges (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

(2) The deserializer PLL lock time (tDRDL) may vary depending on input data patterns and the number of transitions within the pattern.

(3) RxIN_TOL is a measure of how much phase noise (jitter) the deserializer can tolerate in the incoming data stream before bit errors

occur. It is a measurement in reference with the ideal bit position. See AN-1217 How to Validate BLVDS SER/DES Signal Integrity

Using an Eye Mask (SNLA053) for details.

(4) UI – Unit Interval; equivalent to one ideal serialized data bit width. The UI scales with frequency.

tLZR LOW to TRI-STATE

delay ROUT[23:0], RCLK, and LOCK

pins 3 10 ns

tZHR TRI-STATE to HIGH

delay ROUT[23:0], RCLK, and LOCK

pins 3 10 ns

tZLR TRI-STATE to LOW

delay ROUT[23:0], RCLK, and LOCK

pins 3 10 ns

tDD Deserializer delay RCLK pin (see Figure 14) [4+(3/56)]T + 5.9 [4+(3/56)]T + 14 ns

tDRDL Deserializer PLL lock

time from power down See Figure 16(1)(2) 5 MHz 5 50 ms

35 MHz 5 50

RxIN_TOL_L Receiver input tolerance

(left) 5 MHz to 35 MHz

(see Figure 18)(1)(3) 0.25 UI(4)

RxIN_TOL_R Receiver input tolerance

(right) 5 MHz to 35 MHz

(see Figure 18)(1)(3) 0.25 UI(4)

6.9 Typical Characteristics

Figure 1 and Figure 2 are scope shots with PCLK = 5 MHz measured out of the DS90C241 DOUT± with pre-emphasis OFF

and pre-emphasis ON using a 1010... pattern on the DIN[23:0] inputs. The scope was triggered on the input PCLK.

Figure 1. DS90C241 DOUT± Eye Diagram at 5 MHz

Without Pre-Emphasis Figure 2. DS90C241 DOUT± Eye Diagram at 5 MHz

With Pre-Emphasis ON

Setup

VDD/2 Hold

tDIH

tDIS

TCLK

DIN [0:23]

tTCP

VDD/2

VDD/2 VDD/2VDD/2

VDD

80%

20%

80%

20%

tCLKT tCLKT

TCLK

VDD

80%

20%

80%

20% Vdiff = 0V

tLLHT tLHLT

Differential

Signal

Vdiff = (DOUT+) - (DOUT-)

100:

DOUT+

DOUT- 10 pF

10 pF

RCLK

ODD ROUT

EVEN ROUT

Signal PatternDevice Pin Name

TCLK

ODD DIN

EVEN DIN

Signal PatternDevice Pin Name

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7 Parameter Measurement Information

Figure 3. Serializer Input Checkerboard Pattern

Figure 4. Deserializer Output Checkerboard Pattern

Figure 5. Serializer LVDS Output Load and Transition Times

Figure 6. Serializer Input Clock Transition Times

Figure 7. Serializer Setup and Hold Times

2.0V 0.8V

TCLK

DOUT±

tHZD or

tLZD

tZHD or

tZLD

Output

Active

tPLD

PWDWN

TRI-STATE TRI-STATE

DEN

DOUT-

DOUT+ 5 pF 100:

Parasitic package and

Trace capcitance

200 mV DCA DCA DCA DCA $OOGDWD³0´V

CLK1

tZLD

tTCP

DCADCADCADCA

CLK1

tTCP

200 mV

DEN

(single-ended)

200 mV DCA DCA DCA DCA $OOGDWD³1´V

CLK0

tZHD

tTCP

DCADCA

DCA

CLK0

tTCP

200 mV

DOUT±

(differential)

VCC/2

DOUT±

(differential)

VCC/2

tHZD

DEN

(single-ended)

VCC/2

0V 0V

VCC/2

tLZD

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DS90C241

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Parameter Measurement Information (continued)

Figure 8. Serializer TRI-STATE Test Circuit and Delay

Figure 9. Serializer PLL Lock Time and TPWDNB TRI-STATE Delays

80%

20%

80%

20%

tCLH

Deserializer 8 pF

lumped

Single-ended

Signal

tCHL

PARALLEL-TO-SERIAL

DOUT+

DOUT-

DIN RL

TCLK

Ideal Center Position (tBIT/2)

tBIT (1UI)

TxOUT_E_O

Ideal Data Bit

End

Ideal Data Bit

Beginning

tBIT(1/2UI) tBIT(1/2UI)

23210

START

BIT

STOP

BIT

SYMBOL N

23210

START

BIT

STOP

BIT

SYMBOL N-1

23210

START

BIT

STOP

BIT

SYMBOL N-2

23210

START

BIT

STOP

BIT

SYMBOL N-3

23210

STOP

BIT

SYMBOL N-4

DOUT0-23

DCA, DCB

TCLK

tSD

DIN SYMBOL N+1SYMBOL N SYMBOL N+2 SYMBOL N+3

| |

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Parameter Measurement Information (continued)

Figure 10. Serializer Delay

Figure 11. Transmitter Output Eye Opening (TxOUT_E_O)

VOD = (DOUT+) – (DOUT -)

Differential output signal is shown as (DOUT+) – (DOUT -) with the device in data transfer mode.

Figure 12. Serializer VOD Diagram

Figure 13. Deserializer LVCMOS/LVTTL Output Load and Transition Times

RIN±

TRI-STATE

ROUT [0:23]

RCLK

TRI-STATE

LOCK

}v[šŒ

tHZR or tLZR

tDRDL

REN

PWDN

2.0V

0.8V

VOH

REN

VOL + 0.5V

VOL

ROUT [23:0]

VOL + 0.5V

tLZR

500:

VREF = VDD/2 for tZLR or tLZR,

VOH - 0.5V VOH + 0.5V

tZLR

tHZR tZHR

VDD/2 VDD/2

VOH

VOL

REN

VREF +

-VREF = 0V for tZHR or tHZR

CL = 8pF

23210

START

BIT

STOP

BIT

SYMBOL N+3

23210

START

BIT

STOP

BIT

SYMBOL N+2

23210

START

BIT

STOP

BIT

SYMBOL N+1

23210

START

BIT

STOP

BIT

SYMBOL N

RIN0-23

DCA, DCB

RCLK

tDD

ROUT0-23 SYMBOL N-1 SYMBOL NSYMBOL N-2SYMBOL N-3

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Parameter Measurement Information (continued)

Figure 14. Deserializer Delay

CLincludes instrumentation and fixture capacitance within 6 cm of ROUT[23:0].

Figure 15. Deserializer TRI-STATE Test Circuit and Timing

Figure 16. Deserializer PLL Lock Times and RPWDNB TRI-STATE Delay

Ideal Sampling Position

tBIT

(1UI)

Sampling

Window Ideal Data Bit

End

Ideal Data Bit

Beginning

RxIN_TOL -L

tBIT

( )

RxIN_TOL -R

Data Valid

Before RCLK

Data Valid

After RCLK

ROUT [7:0]

Data Valid

Before RCLK

Data Valid

After RCLK

ROUT [15:8], LOCK

Data Valid

Before RCLK

Data Valid

After RCLK VDD/2

ROUT [23:16]

RCLK tLOW tHIGH

tROS tROH

(group 1) (group 1)

(group 2) (group 2)

1/2 UI 1/2 UI

tROS tROH

(group 3) (group 3)

1/2 UI 1/2 UI

VDD/2

VDD/2VDD/2

DS90C124

DS90C241

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Product Folder Links: DS90C124 DS90C241

Parameter Measurement Information (continued)

Figure 17. Deserializer Setup and Hold Times

RxIN_TOL_L is the ideal noise margin on the left of the figure with respect to ideal.

RxIN_TOL_R is the ideal noise margin on the right of the figure with respect to ideal.

Figure 18. Receiver Input Tolerance (RxIN_TOL) and Sampling Window

DEN

VODSEL

DIN

TRFB

REN

RRFB

RPWDNB

TCLK

TPWDNB

SERIALIZER ± DS90C241

PLL

Timing

and

Control

DOUT-

RT = 100:

RIN-

DESERIALIZER ± DS90C124

DOUT+ RIN+

PLL Timing

and

Control

24 ROUT

LOCK

RCLK

Clock

Recovery

Output Latch

Serial to Parallel

DC Balance Decode

Input Latch

Parallel to Serial

DC Balance Encode

CLK1

bit0

bit1

bit2

bit3

bit4

bit5

bit6

bit7

bit8

bit9

bit10

bit11

DCA

DCB

bit12

bit13

bit14

bit15

bit16

bit17

bit18

bit19

bit20

bit21

bit22

bit23

CLK0

PRE

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DS90C241

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8 Detailed Description

8.1 Overview

The DS90C241 serializer and DS90C124 deserializer chipset is an easy-to-use transmitter and receiver pair that

sends 24-bits of parallel LVCMOS data over a single serial LVDS link from 120 Mbps to 840 Mbps throughput.

The DS90C241 transforms a 24-bit wide parallel LVCMOS data into a single high speed LVDS serial data stream

with embedded clock, and scrambles or DC balances the data to enhance signal quality to support AC coupling.

The DS90C124 receives the LVDS serial data stream and converts it back into a 24-bit wide parallel data and

recovered clock. The 24-bit serializer or deserializer chipset is designed to transmit data up to 10 meters over

shielded twisted pair (STP) at clock speeds from 5 MHz to 35 MHz.

The deserializer can attain lock to a data stream without the use of a separate reference clock source. This

greatly simplifies system complexity and overall cost. The deserializer synchronizes to the serializer regardless of

data pattern, delivering true automatic plug and lock performance. It locks to the incoming serial stream without

the requirement of special training patterns or sync characters. The deserializer recovers the clock and data by

extracting the embedded clock information and validating data integrity from the incoming data stream and then

deserializes the data. The deserializer monitors the incoming clock information, determines lock status, and

asserts the LOCK output high when lock occurs. Each has a power down control to enable efficient operation in

various applications.

8.2 Functional Block Diagram

8.3 Feature Description

8.3.1 Initialization and Locking Mechanism

Initialization of the DS90C241 and DS90C124 must be established before each device sends or receives data.

Initialization refers to synchronizing the PLLS of the serializer and the deserializer together. After the serializers

locks to the input clock source, the deserializer synchronizes to the serializers as the second and final

initialization step.

1. When VCC is applied to both serializer or deserializer, the respective outputs are held in TRI-STATE and

internal circuitry is disabled by on-chip power-on circuitry. When VCC reaches VCC OK (2.2 V) the PLL in

serializer begins locking to a clock input. For the serializer, the local clock is the transmit clock, TCLK. The

serializer outputs are held in TRI-STATE while the PLL locks to the TCLK. After locking to TCLK, the

DS90C124

DS90C241

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Feature Description (continued)

serializer block is now ready to send data patterns. The deserializer output remains in TRI-STATE while its

PLL locks to the embedded clock information in serial data stream. Also, the deserializer LOCK output

remains low until its PLL locks to incoming data and sync-pattern on the RIN± pins.

2. The deserializer PLL acquires lock to a data stream without requiring the serializer to send special patterns.

The serializer that is generating the stream to the deserializer automatically sends random (non-repetitive)

data patterns during this step of the Initialization State. The deserializer locks onto the embedded clock

within the specified amount of time. An embedded clock and data recovery (CDR) circuit locks to the

incoming bit stream to recover the high-speed receive bit clock and re-time incoming data. The CDR circuit

expects a coded input bit stream. In order for the deserializer to lock to a random data stream from the

serializer, it performs a series of operations to identify the rising clock edge and validates data integrity, then

locks to it. Because this locking procedure is independent on the data pattern, total random locking duration

may vary. At the point when the CDR of the deserializer locks to the embedded clock, the LOCK pin goes

high and valid RCLK/data appears on the outputs. Note that the LOCK signal is synchronous to valid data

appearing on the outputs. The deserializer’s LOCK pin is a convenient way to ensure data integrity is

achieved on receiver side.

8.3.2 Data Transfer

After serializer lock is established, the inputs DIN0 to DIN23 may be used to input data to the serializer. Data is

clocked into the serializer by the TCLK input. The edge of TCLK used to strobe the data is selectable through the

TRFB pin. TRFB high selects the rising edge for clocking data and low selects the falling edge. The serializer

outputs (DOUT±) are intended to drive point-to-point connections as shown in Figure 19.

CLK1, CLK0, DCA, DCB are four overhead bits transmitted along the single LVDS serial data stream. The CLK1

bit is always high and the CLK0 bit is always low. The CLK1 and CLK0 bits function as the embedded clock bits

in the serial stream. DCB functions as the DC Balance control bit. It does not require any precoding of data on

transmit side. The DC Balance bit is used to minimize the short and long-term DC bias on the signal lines. This

bit operates by selectively sending the data either unmodified or inverted. The DCA bit is used to validate data

integrity in the embedded data stream. Both DCA and DCB coding schemes are integrated and automatically

performed within serializer and deserializer.

Serialized data and clock or control bits (24 +4 bits) are transmitted from the serial data output (DOUT±) at 28

times the TCLK frequency. For example, if TCLK is 35 MHz, the serial rate is 35 × 28 = 980 Mega bits per

second. Because only 24 bits are from input data, the serial payload rate is 24 times the TCLK frequency. For

example, if TCLK = 35 MHz, the payload data rate is 35 × 24 = 840 Mbps. TCLK is provided by the data source

and must be in the range of 5 MHz to 35 MHz nominal. The serializer outputs (DOUT±) can drive a point-to-point

connection. The outputs transmit data when the enable pin (DEN) is high, TPWDNB is high. The DEN pin may

be used to TRI-STATE the outputs when driven low.

When the deserializer channel attains lock to the input from a serializer, it drives its LOCK pin high and

synchronously delivers valid data and recovered clock on the output. The deserializer locks onto the embedded

clock, uses it to generate multiple internal data strobes, and then drives the recovered clock to the RCLK pin.

The recovered clock (RCLK output pin) is synchronous to the data on the ROUT[23:0] pins. While LOCK is high,

data on ROUT[23:0] is valid. Otherwise, ROUT[23:0] is invalid. The polarity of the RCLK edge is controlled by the

RRFB input. ROUT[23:0], LOCK, and RCLK outputs each drive a maximum of 8-pF load with 35-MHz clock.

REN controls TRI-STATE for ROUTn and the RCLK pin on the deserializer.

8.3.3 Resynchronization

If the deserializer loses lock, it automatically tries to re-establish lock. For example, if the embedded clock edge

is not detected one time in succession, the PLL loses lock and the LOCK pin is driven low. The deserializer then

enters the operating mode where it tries to lock to a random data stream. It looks for the embedded clock edge,

identifies it and then proceeds through the locking process. The logic state of the LOCK signal indicates whether

the data on ROUT is valid; when it is high, the data is valid. The system must monitor the LOCK pin to determine

whether data on the ROUT is valid.

100:

100 nF

100:

100 nF

DOUT-

DOUT+

RIN-

RIN+

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DS90C241

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Feature Description (continued)

8.3.4 Pre-Emphasis

The DS90C241 features a pre-emphasis function used to compensate for long or lossy transmission media.

Cable drive is enhanced with a user selectable pre-emphasis feature that provides additional output current

during transitions to counteract cable loading effects. The transmission distance is limited by the loss

characteristics and quality of the media. Pre-emphasis adds extra current during LVDS logic transition to reduce

the cable loading effects and increase driving distance. In addition, pre-emphasis helps provide faster transitions,

increased eye openings, and improved signal integrity. To enable the pre-emphasis function, the PRE pin

requires one external resistor (Rpre) to Vss to set the additional current level. Pre-emphasis strength is set

through an external resistor (Rpre) applied from min to max (floating to 3 kΩ) at the PRE pin. A lower input

resistor value on the PRE pin increases the magnitude of dynamic current during data transition. There is an

internal current source based on the following formula: PRE = (Rpre ≥3 kΩ); IMAX = [(1.2/Rpre) × 20]. The ability

of the DS90C241 to use the pre-emphasis feature extends the transmission distance up to 10 meters in most

cases.

The amount of pre-emphasis for a given media depends on the transmission distance of the application. In

general, too much pre-emphasis can cause over or undershoot at the receiver input pins. This can result in

excessive noise, crosstalk and increased power dissipation. For short cables or distances, pre-emphasis may not

be required. Signal quality measurements are recommended to determine the proper amount of pre-emphasis for

each application.

8.3.5 AC-Coupling and Termination

The DS90C241 and DS90C124 supports AC-coupled interconnects through integrated DC balanced

encoding/decoding scheme. To use AC coupled connection between the serializer and deserializer, insert

external AC coupling capacitors in series in the LVDS signal path as illustrated in Figure 19. The deserializer

input stage is designed for AC-coupling by providing a built-in AC bias network which sets the internal VCM to

1.2 V. With AC signal coupling, capacitors provide the AC-coupling path to the signal input.

For the high-speed LVDS transmissions, the smallest available package must be used for the AC-coupling

capacitor. This helps minimize degradation of signal quality due to package parasitics. The most common used

capacitor value for the interface is 100-nF (0.1-µF) capacitor. NPO class 1 or X7R class 2 type capacitors are

recommended. 50-WVDC must be the minimum used for the best system-level ESD performance.

The DS90C124 input stage is designed for AC-coupling by providing a built-in AC bias network which sets the

internal VCM to 1.2 V. Therefore multiple termination options are possible.

8.3.5.1 Receiver Termination Options

8.3.5.1.1 Option 1

A single, 100-Ωtermination resistor is placed across the RIN± pins (see Figure 19). This provides the signal

termination at the receiver inputs. Other options may be used to increase noise tolerance.

Figure 19. AC Coupled Application

8.3.5.1.1.1 Option 2

For additional EMI tolerance, two 50-Ωresistors may be used in place of the single 100-Ωresistor. A small

capacitor is tied from the center point of the 50-Ωresistors to ground (see Figure 20). This provides a high-

frequency low impedance path for noise suppression. Value is not critical; 4.7 nF may be used with general

applications.

0.1 PF

50:

4.7 nF DS90C124

100:

0.1 PF

DS90C241

RPU

VDD

RPD

RIN+

RIN-

RIN+

RIN-

0.1 PF

50:

4.7 nF DS90C124

100:

0.1 PF

DS90C241

DS90C124

DS90C241

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Product Folder Links: DS90C124 DS90C241

Feature Description (continued)

Figure 20. Receiver Termination Option 2

8.3.5.1.1.2 Option 3

For high noise environments an additional voltage divider network may be connected to the center point. This

has the advantage of a providing a DC low-impedance path for noise suppression. Use resistor values in the

range of 75 Ωto 2 KΩfor the pullup and pulldown. Ratio the resistor values to bias the center point at 1.2 V. For

example (see Figure 21), VDD = 3.3 V, Rpullup = 1.3 kΩ, Rpulldown = 750 Ω; or Rpullup = 130 Ω, Rpulldown =

75 Ω(strongest). The smaller values consume more bias current, but provide enhanced noise suppression.

Figure 21. Receiver Termination Option 3

8.4 Device Functional Modes

Table 1 and Table 2 list the truth tables for the serializer and deserializer.

Table 1. DS90C241 Serializer Truth Table

TPWDNB

(PIN 9) DEN

(PIN 18) Tx PLL STATUS

(INTERNAL) LVDS OUTPUTS

(PINS 19 AND 20)

L X X Hi Z

H L X Hi Z

H H Not locked Hi Z

H H Locked Serialized data with embedded clock

Table 2. DS90C124 Deserializer Truth Table

RPWDNB

(PIN 1) REN

(PIN 48) Rx PLL STATUS

(INTERNAL) ROUTn AND RCLK

(SEE PIN DIAGRAM) LOCK

(PIN 17)

L X X Hi Z Hi Z

H L X Hi Z L = PLL unocked

H = PLL locked

H H Not locked Hi Z L

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Table 2. DS90C124 Deserializer Truth Table (continued)

RPWDNB

(PIN 1) REN

(PIN 48) Rx PLL STATUS

(INTERNAL) ROUTn AND RCLK

(SEE PIN DIAGRAM) LOCK

(PIN 17)

H H Locked Data and RCLK active H

8.4.1 Power Down

The power-down state is a low power sleep mode that the serializer and deserializer may use to reduce power

when no data is being transferred. The TPWDNB and RPWDNB are used to set each device into power down

mode, which reduces supply current to the µA range. The serializer enters power down when the TPWDNB pin is

driven low. In power down, the PLL stops and the outputs go into TRI-STATE, disabling load current and

reducing supply. To exit power down, TPWDNB must be driven high. When the serializer exits power down, its

PLL must lock to TCLK before it is ready for the Initialization state. The system must then allow time for

Initialization before data transfer can begin. The deserializer enters power down mode when RPWDNB is driven

low. In power down mode, the PLL stops and the outputs enter TRI-STATE. To bring the deserializer block out of

the power down state, the system drives RPWDNB high.

Both the serializer and deserializer must reinitialize and relock before data can be transferred. The deserializer

initializes and asserts LOCK high when it is locked to the input clock.

8.4.2 Tri-State

For the serializer, TRI-STATE is entered when the DEN or TPWDNB pin is driven low. This does TRI-STATE

both driver output pins (DOUT+ and DOUT−). When DEN is driven high, the serializer returns to the previous

state as long as all other control pins remain static (TPWDNB, TRFB).

When you drive the REN or RPWDNB pin low, the deserializer enters TRI-STATE. Consequently, the receiver

output pins (ROUT0 to ROUT23) and RCLK enters TRI-STATE. The LOCK output remains active, reflecting the

state of the PLL. The deserializer input pins are high impedance during receiver power down (RPWDNB low) and

power-off (VCC = 0 V).

8.4.3 Progressive Turn–On (PTO)

Deserializer ROUT[23:0] outputs are grouped into three groups of eight, with each group switching about 0.5-UI

apart in phase to reduce EMI, simultaneous switching noise, and system ground bounce.

DS90C124

DS90C241

SNLS209M –NOVEMBER 2005–REVISED JANUARY 2017

www.ti.com

Product Folder Links: DS90C124 DS90C241

9 Applications and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

9.1 Application Information

9.1.1 Using the DS90C241 and DS90C124

The DS90C241/DS90C124 serializer or deserializer (SERDES) pair sends 24 bits of parallel LVCMOS data over

a serial LVDS link up to 840 Mbps. Serialization of the input data is accomplished using an on-board PLL at the

serializer which embeds clock with the data. The deserializer extracts the clock/control information from the

incoming data stream and deserializes the data. The deserializer monitors the incoming clockl information to

determine lock status and indicates lock by asserting the LOCK output high.

9.1.2 Display Application

The DS90C241/DS90C124 chipset is intended for interface between a host (graphics processor) and a display. It

supports an 18-bit color depth (RGB666) and up to 800 × 480 display formats. In a RGB666 configuration 18

color bits (R[5:0], G[5:0], B[5:0]), Pixel Clock (PCLK) and three control bits (VS, HS, and DE) along with three

spare bits are supported across the serial link with PCLK rates from 5 MHz to 35 MHz.

9.2 Typical Application

Figure 22 shows a typical application of the DS90C241 serializer (SER). The LVDS outputs use a 100-Ω

termination and 100-nF coupling capacitors to the line. Bypass capacitors are placed near the power supply pins.

A system General Purpose Output (GPO) controls the TPWDNB pin. In this application the TRFB pin is tied High

to latch data on the rising edge of the TCLK. The DEN signal is not used and is tied High also. In this application,

the link is short; therefore, the VODSEL pin is tied Low for the standard LVDS swing. The pre-emphasis input

uses a resistor to ground to set the amount of pre-emphasis desired by the application.

Figure 23 shows a typical application of the DS90C124 deserializer (DES). The LVDS inputs use a 100-Ω

termination and 100-nF coupling capacitors to the line. Bypass capacitors are placed near the power supply pins.

A system GPO controls the RPWDNB pin. In this application, the RRFB pin is tied high to strobe the data on the

rising edge of the RCLK. The REN signal is not used and is tied high also.

DIN0

DIN1

DIN2

DIN3

DIN4

DIN5

DIN6

DIN7

DIN8

DIN9

DIN10

DIN11

DIN12

DIN13

DIN14

DIN15

DIN16

DIN17

DIN18

DIN19

DIN20

DIN21

DIN22

DIN23

TCLK

TPWDNB

DEN

TRFB

DCAOFF

VODSEL

PRE

RESRVD

DOUT+

DOUT-

VDDT

VSSDR

VDDL

VSSPT0

VSSPT1

VSST

VSSL

VSSIT

VDDPT1

VDDPT0

VDDIT

VDDDR

TPWDNB = System GPO

DEN = High (ON)

TRFB = High (Rising edge)

VODSEL = Low (400mV)

PRE = Rpre

RESRVD = Low

DCAOFF = Low

DCBOFF = Low

GPO 3.3V

3.3V

DS90C241 (SER)

C1 C4

C2 C5

C3 C6

C1 to C3 = 0.1 PF

C4 to C6 = 0.01 PF

C7 = 100 nF; 50WVDC, NPO or X7R

C8 = 100 nF; 50WVDC, NPO or X7R

R1 = 100:

R2 = Open (OFF) or Rpre t3 k: (ON) (cable specific)

LVCMOS

Parallel

Interface

Serial

LVDS

Interface

DCBOFF

VSS

DS90C124

DS90C241

www.ti.com

SNLS209M –NOVEMBER 2005–REVISED JANUARY 2017

Product Folder Links: DS90C124 DS90C241

Typical Application (continued)

Figure 22. DS90C241 Typical Application Connection

ROUT0

ROUT1

ROUT2

ROUT3

ROUT4

ROUT5

ROUT6

ROUT7

ROUT8

ROUT9

ROUT10

ROUT11

ROUT12

ROUT13

ROUT14

ROUT15

ROUT16

ROUT17

ROUT18

ROUT19

ROUT20

ROUT21

ROUT22

ROUT23

RCLK

RPWDNB

REN

RRFB

RESRVD

RIN+

RIN-

VDDOR2

VDDOR3 VDDR1

VDDR0

VDDPR1

VDDPR0

RPWDNB = System GPO

REN = High (ON)

RRFB = High (Rising edge)

RESRVD = Low

GPO

3.3V

DS90C124 (DES)

C1 C2

C3 C4

C10

C5 C6

VDDIR

VDDOR1

VSSPR0

VSSPR1

VSSR0

VSSR1

VSSIR

VSSOR1

VSSOR2

VSSOR3

LOCK

C8C7

3.3V

C1 to C8 = 0.1 PF to 0.01 PF

C9 = 100 nF; 50 WVDC, NPO or X7R

C10 = 100 nF; 50 WVDC, NPO or X7R

R1 = 100:

Serial

LVDS

Interface

LVCMOS

Parallel

Interface

DS90C124

DS90C241

SNLS209M –NOVEMBER 2005–REVISED JANUARY 2017

www.ti.com

Product Folder Links: DS90C124 DS90C241

Typical Application (continued)

Figure 23. DS90C124 Tyical Application Connection

9.2.1 Design Requirements

For the typical design application, use the following as input parameters:

The SER/DES supports only AC-coupled interconnects through an integrated DC-balanced decoding scheme.

External AC coupling capacitors must be placed in series in the FPD-Link III signal path as illustrated in

Figure 22 and Figure 23.

DS90C124

DS90C241

www.ti.com

SNLS209M –NOVEMBER 2005–REVISED JANUARY 2017

Product Folder Links: DS90C124 DS90C241

Typical Application (continued)

9.2.2 Detailed Design Procedure

Circuit board layout and stack-up for the LVDS serializer and deserializer devices must be designed to provide

low-noise power to the device. Good layout practice also separates high frequency or high-level inputs and

outputs to minimize unwanted stray noise, feedback and interference. Power system performance may be greatly

improved by using thin dielectrics (2 to 4 mil) for power and ground sandwiches. This arrangement uses the

plane capacitance for the PCB power system and has low-inductance, which has proven effectiveness especially

at high frequencies, and makes the value and placement of external bypass capacitors less critical. External

bypass capacitors must include both RF ceramic and tantalum electrolytic types. RF capacitors may use values

in the range of 0.01 µF to 10 µF. Tantalum capacitors may be in the 2.2-µF to 10-µF range. The voltage rating of

the tantalum capacitors must be at least 5 times the power supply voltage being used.

MLCC surface mount capacitors are recommended due to their smaller parasitic properties. When using multiple

capacitors per supply pin, place the smaller value closer to the pin. A large bulk capacitor is recommended at the

point of power entry. This is typically in the 50 µF to 100 µF range and smooth low frequency switching noise. TI

recommends connecting power and ground pins directly to the power and ground planes with bypass capacitors

connected to the plane with through on both ends of the capacitor. Connecting power or ground pins to an

external bypass capacitor will increase the inductance of the path. A small body size X7R chip capacitor, such as

0603 or 0805, is recommended for external bypass. A small body sized capacitor has less inductance. The user

must pay attention to the resonance frequency of these external bypass capacitors, usually in the range from 20

MHz to 30 MHz. To provide effective bypassing, multiple capacitors are often used to achieve low impedance

between the supply rails over the frequency of interest. At high frequency, it is also a common practice to use

two vias from power and ground pins to the planes, reducing the impedance at high frequency. Use at least a

four layer board with a power and ground plane. Place LVCMOS signals away from the LVDS lines to prevent

coupling from the LVCMOS lines to the LVDS lines. Closely coupled differential lines of 100 Ωare typically

recommended for LVDS interconnect. The closely coupled lines help to ensure that coupled noise will appear as

common mode and thus is rejected by the receivers. The tightly coupled lines will also radiate less.

9.2.2.1 Noise Margin

The deserializer noise margin is the amount of input jitter (phase noise) that the deserializer can tolerate and still

reliably recover data. Various environmental and systematic factors include:

• Serializer: TCLK jitter, VCC noise (noise bandwidth and out-of-band noise)

• Media: ISI, VCM noise

• Deserializer: VCC noise

For a graphical representation of noise margin, see Figure 18.

9.2.2.2 Transmission Media

The serializer and deserializer can be used in point-to-point configuration, through a PCB trace, or through

twisted pair cable. In a point-to-point configuration, the transmission media requires termination at both ends of

the transmitter and receiver pair. Interconnect for LVDS typically has a differential impedance of 100 Ω. Use

cables and connectors that have matched differential impedance to minimize impedance discontinuities. In most

applications that involve cables, the transmission distance is determined on data rates involved, acceptable bit

error rate and transmission medium.

The resulting signal quality at the receiving end of the transmission media may be assessed by monitoring the

differential eye opening of the serial data stream. The Receiver Input Tolerance in Switching Characteristics –

Deserializer and the Differential Threshold Voltage specifications in Electrical Characteristics define the

acceptable data eye opening. A differential probe must be used to measure across the termination resistor at the

DS90C124 inputs. Figure 24 illustrates the eye opening and relationship to the receiver input tolerance and

differential threshold voltage specifications.

tBIT

(1UI)

Minimum Eye

Width Ideal Data Bit

End

Ideal Data Bit

Beginning

RxIN_TOL -L RxIN_TOL -R

•VTH - VTL

DS90C124

DS90C241

SNLS209M –NOVEMBER 2005–REVISED JANUARY 2017

www.ti.com

Product Folder Links: DS90C124 DS90C241

Typical Application (continued)

Figure 24. Receiver Input Eye Opening

9.2.2.3 Live Link Insertion

The serializer and deserializer devices support live pluggable applications. The automatic receiver lock to

random data plug and go hot insertion capability allows the DS90C124 to attain lock to the active data stream

during a live insertion event.

9.2.3 Application Curves

Figure 25,Figure 26, and Figure 27 are scope shots with PCLK = 25 MHz into the DS90C241 with a 1010...

pattern on the DIN[23:0] inputs. The scope was triggered on the input PCLK.

Figure 25. Input PCLK = 25 MHz and Associated DOUT

Serial Stream Figure 26. Input PCLK = 25 MHz and Associated DOUT

Serial Stream With Pre-Emphasis

Figure 27. Input PCLK = 25 MHz and Associated DOUT Serial Stream With VODSEL = H

PCLK

DOUT+/-

w/ VOD=H

(differential)

DS90C124

DS90C241

www.ti.com

SNLS209M –NOVEMBER 2005–REVISED JANUARY 2017

Product Folder Links: DS90C124 DS90C241

Typical Application (continued)

Figure 28,Figure 29, and Figure 30 are scope shots with PCLK = 33 MHz into the DS90C241 with a 1010...

pattern on the DIN[23:0] inputs. The scope was triggered on the input PCLK.

Figure 28. Input PCLK = 33 MHz and Associated DOUT

Serial Stream Figure 29. Input PCLK = 33 MHz and Associated DOUT

Serial Stream With Pre-Emphasis

Figure 30. Input PCLK = 33 MHz and Associated DOUT Serial Stream With VODSEL = H

10 Power Supply Recommendations

An all CMOS design of the serializer and deserializer makes them inherently low power devices. Additionally, the

constant current source nature of the LVDS outputs minimize the slope of the speed versus ICC curve of CMOS

designs.

DS90C124

DS90C241

SNLS209M –NOVEMBER 2005–REVISED JANUARY 2017

www.ti.com

Product Folder Links: DS90C124 DS90C241

11 Layout

11.1 Layout Guidelines

Circuit board layout and stack-up for the LVDS SERDES devices must be designed to provide low-noise power

feed to the device. Good layout practice also separates high frequency or high-level inputs and outputs to

minimize unwanted stray noise pickup, feedback and interference. Power system performance may be greatly

improved by using thin dielectrics (2 to 4 mils) for power and ground sandwiches. This arrangement provides

plane capacitance for the PCB power system with low-inductance parasitics, which has proven especially

effective at high frequencies, and makes the value and placement of external bypass capacitors less critical.

External bypass capacitors must include both RF ceramic and tantalum electrolytic types. RF capacitors may use

values in the range of 0.01 µF to 0.1 µF. Tantalum capacitors may be in the 2.2-µF to 10-µF range. Voltage

rating of the tantalum capacitors must be at least 5 times the power supply voltage being used.

Surface mount capacitors are recommended due to their smaller parasitics. When using multiple capacitors per

supply pin, place the smaller value closer to the pin. A large bulk capacitor is recommend at the point of power

entry. This is typically in the 50-µF to 100-µF range and smooth low frequency switching noise. TI recommends

connecting power and ground pins directly to the power and ground planes with bypass capacitors connected to

the plane with via on both ends of the capacitor. Connecting power or ground pins to an external bypass

capacitor increases the inductance of the path.

A small body size X7R chip capacitor, such as 0603, is recommended for external bypass. Its small body size

reduces the parasitic inductance of the capacitor. The user must pay attention to the resonance frequency of

these external bypass capacitors, usually in the range of 20 MHz to 30 MHz range. To provide effective

bypassing, multiple capacitors are often used to achieve low impedance between the supply rails over the

frequency of interest. At high frequency, it is also a common practice to use two vias from power and ground pins

to the planes, reducing the impedance at high frequency.

Some devices provide separate power and ground pins for different portions of the circuit. This is done to isolate

switching noise effects between different sections of the circuit. Separate planes on the PCB are typically not

required. Pin Configuration and Functions typically provide guidance on which circuit blocks are connected to

which power pin pairs. In some cases, an external filter many be used to provide clean power to sensitive circuits

such as PLLs.

Use at least a four layer board with a power and ground plane. Place LVCMOS (LVTTL) signals away from the

LVDS lines to prevent coupling from the LVCMOS lines to the LVDS lines. Closely-coupled differential lines of

100 Ωare typically recommended for LVDS interconnect. The closely coupled lines help to ensure that coupled

noise appears as common-mode and thus is rejected by the receivers. The tightly coupled lines also radiate less.

Termination of the LVDS interconnect is required. For point-to-point applications, termination must be placed at

both ends of the devices. Nominal value is 100 Ωto match the line’s differential impedance. Place the resistor as

close to the transmitter DOUT± outputs and receiver RIN± inputs as possible to minimize the resulting stub

between the termination resistor and device.

11.1.1 LVDS Interconnect Guidelines

See AN-1108 Channel-Link PCB and Interconnect Design-In Guidelines (SNLA008) and AN-905 Transmission

• Use 100-Ωcoupled differential pairs

• Use the S/2S/3S rule in spacings

– S = space between the pair

– 2S = space between pairs

– 3S = space to LVCMOS/LVTTL signal

• Minimize the number of vias

• Use differential connectors when operating above 500-Mbps line speed

• Maintain balance of the traces

• Minimize skew within the pair

• Terminate as close to the TX outputs and RX inputs as possible

Additional general guidance can be found in the LVDS Owner’s Manual available in PDF format from the TI web

site at: www.ti.com/lvds.

DS90C124

DS90C241

www.ti.com

SNLS209M –NOVEMBER 2005–REVISED JANUARY 2017

Product Folder Links: DS90C124 DS90C241

11.2 Layout Example

Figure 31 shows the input LVCMOS traces and output high-speed, 100-Ωdifferential traces from the DS90C241

EVM.

Figure 31. DS90C241 Layout Example from DS90C241 EVM

DS90C124

DS90C241

SNLS209M –NOVEMBER 2005–REVISED JANUARY 2017

www.ti.com

Product Folder Links: DS90C124 DS90C241

Layout Example (continued)

Figure 32 shows the input high-speed, 100-Ωdifferential traces and the output LVCMOS traces and from the

DS90C124 EVM.

Figure 32. DS90C124 Layout Example from DS90C124 EVM

DS90C124

DS90C241

www.ti.com

SNLS209M –NOVEMBER 2005–REVISED JANUARY 2017

Product Folder Links: DS90C124 DS90C241

Layout Example (continued)

Figure 33 shows the power decoupling from the DS90C241 EVM.

Figure 33. DS90C241 Example Layout of Power Decoupling from EVM

Figure 34 shows the power decoupling from the DS90C124 EVM.

Figure 34. DS90C124 Example Layout of Power Decoupling from EVM

DS90C124

DS90C241

SNLS209M –NOVEMBER 2005–REVISED JANUARY 2017

www.ti.com

Product Folder Links: DS90C124 DS90C241

12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related Documentation

For related documentation see the following:

•AN-1217 How to Validate BLVDS SER/DES Signal Integrity Using an Eye Mask (SNLA053)

•AN-1108 Channel-Link PCB and Interconnect Design-In Guidelines (SNLA008)

12.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community

resources, tools and software, and quick access to sample or buy.

Table 3. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL

DOCUMENTS TOOLS &

SOFTWARE SUPPORT &

COMMUNITY

DS90C124 Click here Click here Click here Click here Click here

DS90C241 Click here Click here Click here Click here Click here

12.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

12.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

12.5 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.6 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

12.7 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

DS90C124

DS90C241

www.ti.com

SNLS209M –NOVEMBER 2005–REVISED JANUARY 2017

Product Folder Links: DS90C124 DS90C241

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

DS90C124IVS/NOPB ACTIVE TQFP PFB 48 250 RoHS & Green SN Level-3-260C-168 HR -40 to 105 DS90C124

IVS

DS90C124IVSX/NOPB ACTIVE TQFP PFB 48 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 105 DS90C124

IVS

DS90C124QVS/NOPB ACTIVE TQFP PFB 48 250 RoHS & Green SN Level-3-260C-168 HR -40 to 105 DS90C124

QVS

DS90C124QVSX/NOPB ACTIVE TQFP PFB 48 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 105 DS90C124

QVS

DS90C241IVS/NOPB ACTIVE TQFP PFB 48 250 RoHS & Green SN Level-3-260C-168 HR -40 to 105 DS90C241

IVS

DS90C241IVSX/NOPB ACTIVE TQFP PFB 48 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 105 DS90C241

IVS

DS90C241QVS/NOPB ACTIVE TQFP PFB 48 250 RoHS & Green SN Level-3-260C-168 HR -40 to 105 DS90C241

QVS

DS90C241QVSX/NOPB ACTIVE TQFP PFB 48 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 105 DS90C241

QVS

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

Addendum-Page 2

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF DS90C124, DS90C124-Q1, DS90C241, DS90C241-Q1 :

•Catalog: DS90C124, DS90C241

•Automotive: DS90C124-Q1, DS90C241-Q1

NOTE: Qualified Version Definitions:

•Catalog - TI's standard catalog product

•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

DS90C124IVSX/NOPB TQFP PFB 48 1000 330.0 16.4 9.3 9.3 2.2 12.0 16.0 Q2

DS90C124QVSX/NOPB TQFP PFB 48 1000 330.0 16.4 9.3 9.3 2.2 12.0 16.0 Q2

DS90C241IVSX/NOPB TQFP PFB 48 1000 330.0 16.4 9.3 9.3 2.2 12.0 16.0 Q2

DS90C241QVSX/NOPB TQFP PFB 48 1000 330.0 16.4 9.3 9.3 2.2 12.0 16.0 Q2

PACKAGE MATERIALS INFORMATION

www.ti.com 19-Aug-2015

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

DS90C124IVSX/NOPB TQFP PFB 48 1000 367.0 367.0 38.0

DS90C124QVSX/NOPB TQFP PFB 48 1000 367.0 367.0 38.0

DS90C241IVSX/NOPB TQFP PFB 48 1000 367.0 367.0 38.0

DS90C241QVSX/NOPB TQFP PFB 48 1000 367.0 367.0 38.0

PACKAGE MATERIALS INFORMATION

www.ti.com 19-Aug-2015

Pack Materials-Page 2

MECHANICAL DATA

MTQF019A – JANUARY 1995 – REVISED JANUARY 1998

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PFB (S-PQFP-G48) PLASTIC QUAD FLATPACK

4073176/B 10/96

Gage Plane

0,13 NOM

0,25

0,45

0,75

Seating Plane

0,05 MIN

0,17

0,27

7,20

6,80

5,50 TYP

8,80

9,20

1,05

0,95

1,20 MAX 0,08

0,50 M

0,08

0°–7°

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Falls within JEDEC MS-026

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