C-13-2500/C-FDFB-SLC2
2.5Gbps Single Mode SFF LC Transceiver (IR1)
Features
• Duplex LC Single Mode Transceiver
• Small Form Factor Multi-sourced 2x5 Pin Package
• 1310nm, DFB Laser
• SONET /SDH STM-16 Compliant
• Single +3.3V Power Supply
• LVPECL/CML Differential level Inputs and Outputs
• LVTTL or LVPECL logic level signal-detect output choice
(C-13-2500-FDFB-SLC for LVPECL and C-13-2500C-FDFB-SLC for LVTTL)
• LVTTL disable input
• Temperature Range: 0 to 70º C
• Class 1 Laser International Safety Standard IEC 825 Compliant
• Complies with Bell Core TA-NWT-000983
General Operating
Symbol
Vcc
Icc
Icc'
Top
Tst
DR
Max
3.465
300
30
70
85
Unit
V
mA
mA
mVp-p
ºC
ºC
Mb/s
Min
3.135
100
0
-40
Typical
3.3
2488
Parameter
Supply Voltage
Total Current
Inrush Current
Power Supply Noise Rejectiona
Operating Temperature (case)
Storage Temperature
Data Rate OC48/STM-16
Transmitter Electrical
Symbol
Rin
Vin
Vin
Vfault
Vnormal
Vd
Ven
Max
120
800
1600
Vcc
0.8
Vcc
Vee+0.8
Unit
Ohm
mVp-p
mVp-p
V
V
V
V
Min
80
200
400
2
Vee
2
Vee
Typical
100
Parameter
Input Differential
PECL Single Ended data input swing
PECL Differential data input swing
TxFault_Fault
TxFault_Normal
TxDisable_Disable
TxDisable_Enable
Transmitter Specifications
Parameter
Optical Power
Average Launch power of off Tx
Extinction Ratio (dynamic)
Eye Mask
Optical Jitter generation
Optical Rise timeb
Optical Fall timeb
Mean Wavelength
Maximum RMS width (s)
Relative Intensity Noise
Symbol
Pop
Poff
ER
Jgen
tr
tf
λ
∆λ
RIN
Min
-5
8.2
1260
Typical
130
130
1310
Max
0
-30
0.002
1360
1
-120
Unit
dBm
dBm
dB
SONET/SDH compliant
UI
ps
ps
nm
nm
dB/Hz
b) 20%-80% values
a) 20Hz to 155MHz
C-13-2500/C-FDFB-SLC2
2.5Gbps Single Mode SFF LC Transceiver (IR1)
Receiver Specifications
Symbol
Rsens,low
Rsens,high
Pin,damage
λ
Max
-18
0
0
1600
-18
Unit
dBm
dBm
dBm
nm
dBm
dBm
dB
Min
1100
-28
1
Typical
-20
Parameter
Receive Power Lowd
Receive Power High
Damage Threshold for Receiver
Wavelength
LOS Assert
LOS De-assert
LOS hysteresis
Timing and Electrical
Symbol
t_on
t_off
t_init
t_fault
t_reset
t_loss_on
t_loss_off
f_serial_clock
VLOS fault
VLOS normal
Vh
Vl
Max
1
10
300
100
100
100
100
Vee+0.3
0.8
Vcc
Vee+0.3
Vcc
Vee+0.3
Unit
ms
µs
ms
µs
µs
µs
µs
KHz
V
V
V
V
V
V
Min
10
2
0
2
Vee
2
Vee
Typical
Parameter
Tx Disable Negate time
Tx Disable assert time
Time to initialize, including reset of TX fault
Tx fault Assert time
Tx Disable to reset
LOS Assert time
LOS De-assert time
Serial ID Clock Rate
RX_LOS Voltage (high)
RX_LOS Voltage (low)
LOS output voltage-Fault
LOS output voltage-Normal
MOD_DEF (0:2)-High
MOD_DEF (0:2)-Low
Electrical Output
Symbol
Vout
Vout
Tr
Tf
Max
500
1000
Unit
mVp-p
mVp-p
ps
ps
Min
250
500
Typical
130
130
Parameter
PECL Single ended data output swing
PECL Differential data output swing
Data output rise time
Data output fall time
d) at 10-10 BER, PRBS 223-1
C-13-2500/C-FDFB-SLC2
2.5Gbps Single Mode SFF LC Transceiver (IR1)
Outline Drawing
Recommended Circuit Schematics
v
Pin
1 RxGND Directly connect this pin to the receiver ground plane
2 RxVcc +3.3V dc power for the receiver section
3SD Active high on this indicates a received optical signal (LVTTL or LVPECL)
4
5 RD+ Receiver Data out (LVPECL/CML)
6 TxVcc +3.3V dc power for the transmitter section
7 TxGND Directly connect this pin to the transmitter ground plane
8 TxDIS Transmitter disable (LVTTL)
9 TD+ Transmitter Data In (LVPECL/CML)
10 TD- Transmitter Data In Bar (LVPECL/CML)
Symbol Notes
Pinout Definitions
RD- Receiver Data out Bar(LVPECL/CML)
Attaching Posts The attaching posts are at the case potential and may be connected
chassis ground. They are not isolated from circuit ground.
Inputs to the C-1x-2500/C-Fx-SLCx series transmitters are AC coupled and internally terminated through 50 ohm to AC ground. These
transceivers can operate with LVPECL or CML logic levels. The input signal must have at least a 200 mV peak to peak (single ended) signal
swing. Output from the receiver section of the module is also AC coupled and is expected to drive into 50 ohm load. Different termination
strategies may be required depending on the particular Serializer/Deserializer chip set used. The C-1x-2500/C-Fx-SLCx series product family
are designed with AC coupled data inputs and outputs to provide the following a advantages:
Close positioning of SERDES with respect to transceiver; allow for shorter line lengths and at gigabit speeds reduces EMI.
Mininum number of external components.
Internal termination reduces the potential for unterminated stubs which would otherwise increase jitter and reduce
transmission margin.
Figure1&2illustrates the recommended transmit and receive data line terminations for SERDES with CML and LVPECL Inputs/outputs
respectively.
C-13-2500/C-FDFB-SLC2
2.5Gbps Single Mode SFF LC Transceiver (IR1)
BIAS
ER
TZ
AMP
AMP
POST
RD
-
RD
+
TD
-
TD +
Z=50!
Z=50!
Z=50!
Z=50!
See
Fig.4A
See
Fig. 3
Note 1
DRIVER
LASE
R
MITTE R
RX_GND
RX _D
RX_D
SD
Vcc_RX
Vcc_TX
TX_D
TX_D
TX_GND
TX_DIS
1
5
4
3
6
2
10
9
7
8TTL l ogic level
Serializer / De-Serializer
with CML lnputs/Outputs
BIAS
PIN
RECEIVER
TZ
AMP AMP
POST
RD -
RD +
TD -
TD +
Z=50!
Z=50!
Z=50!
Z=50!
See
Fig.4A
See
Fig. 3
DRIVER
LA SE R
RX_GND
RX _D
RX _D
SD
Vcc_RX
Vcc_TX
TX_D
TX _D
TX_ GND
TX_DI S
1
5
4
3
6
2
10
9
7
8
Note 1
TTL logic level
Ser ializer / De- S erializer
with LV P E C L lnpu ts/Outputs
TR AN SM ITT E R
Vc c = + 3.3V
13 0 13 0
Figure 1. Recommended TRANSMIT adn RECEIVE Data Termination for SERDES with CML I/Os
Note 1. Consult SERDES manufacurer's data sheet and application data for appropriate receiver iput biasing network.
Some deserializer inputs are internally termintated and may not need external termination resistors.
Figure 2. Recommended TRANSMIT and RECEIVE Data Terminations for SERDES with LV PECL I/Os.
Note 1. Consult SERDES manufacurer's data sheet and application data for appropriate receiver iput biasing
network. Some deserializer inputs are internally termintated and may not need external termination resistors.
C-13-2500/C-FDFB-SLC2
2.5Gbps Single Mode SFF LC Transceiver (IR1)
SIGNAL DETECT
LVPECL
or
LVTTL Logic
R: For LVTTL leve lR=100k or N.C
LVPECL level R= 510
Figure 3: Signal Detect
POWER COUPLING
Figure 4A: SuggestedPower Coupling-Electrical Schematic
Figure 4B: Suggested Power Coupling-Component Placement
VALUES:
C1,C2=1000pF,
C3, =0.1uF
C4, =10uF,
L1, L2 = Real impednc e of 50 to
100 O hms to 1000 MHz.
L1 C3 C4
C1 C2
Ac c
TOP VIEW
VALUES:
C1,C2=1000pF,
C3, =0.1uF
C4, =10uF,
L1, L2 = Rea l impedance of50to
100 Ohms to 1000MHz.
LEHEND:
CIRCUIT GRO UND PLANE CO NNECTION
CA SE GRO UND
!
!
Vcc PL ANE CONNECTION
NOTE :
1.) Com ponentsshownore plac ed
on the b ottom layer and are
viewed through the board .
C1 L2
C3 C4
L1 C2
The C-13-2500-F-SLC/C-13-2500C-F-SLC
transceivers are equipped with LVTTL / LVPECL
signal detect outputs. The standard LVTTL
output eliminates the need for a LVPECL to
LVTTL level shifter in most applications.
Asuggested layout for power and
ground connections is given in figure
4B below. Connections are made via
separate voltage and ground planes.
The mounting posts are at case ground
and should not be connected to circuit
ground. The mounting posts are at
case gound and should not be
connected to circuit ground. The ferrite
gead should provide a real impedance
of 50 to 100 ohms at 100 to
1000MHz. Bypass capacitors should
be placed as close to the 10-pin
connector as possible.
C-13-2500/C-FDFB-SLC2
2.5Gbps Single Mode SFF LC Transceiver (IR1)
Printed Circuit Board Layout Consideration
EMI and ESD Considerations
Laser Safety
Package Diagram
#.00%0.05
#7.78
#0.50
(0.413)
(0.039±0.002)
(0.700)
7.#2
(0.070)
(0.020)
#.78
0.50
(0.280)
3.8#
5.08
(0.150)
(0.200)
6.25
(0.246)
(0.520)
#3.20
(1.921)
#0.#6
(0.400)
&5.08
(0.
594
)
&&.36
(0.
447
)
6.97
3.95
(0.274)
(0.#55)&3.50
9.80
(0.53#)
(0.386)
2.&8
(0.086)
48.8+0
-0.2
+(.000)
-(0.008)
(0.535)
-(0.004)
+(
.000
)
+0
-0.&
&3.6
-(0.004)
+(
.000
)
(0.386)
-0.&
+0
9.8
(0.374)
9.50
Units in mm (inch)
Case with EMI Shielding Finger
A fiber-optic receiver employs a very high gain, wide bandwidth transimpedance amplifier. This ampifier detects and amplifies signals that are only tens
of nA in amplitude when the receiver is operating near its limit. Any unwanted signal current that couples into the receiver circuitry causes a decreasein
the receiver's senitivity and can also degrade the receiver's signal detect(SD) circuit. To minimize the coupling of unwanted noise into the receiver,
careful attention must be given to the printed circuit board. At a minimun, a double-sided printed circuit board (PCB) with a large component side
ground plane beneath the transceiver must be used. In applications that include many other high speed devices, a multi-layer PCB is highly
recommended. This permits the placement of power and ground on separate layers, which allows them to be isolated from the signal lines. Multilayer
construction also permits the routing of signal traces away from high level, high speed signal lines. To minimize the possibility of coupling noise into the
receiver section, high level, high speed signals such as transmitter inputs and clock lines should be routed as far away as possible from the recevier pins.
Noise that couples into the receiver through the power supply pins can also degrade performance. It is recommended that a pi filter in both the
transmitter and receiver be supplied.
OIC transceivers offer a metalized plastic case and a special chassis grounding clip. As shown in the drawing, this clip connects the module case to
chassis grounding clip then installs flush through the panel cutout. The grounding clip in this way brushes the edge of the cutout in order to make a
proper contact. The use of a grounding clip also provides increased electrostatic protection and helps reduce radiated emissions from the module or the
host circuit board through the chassis faceplate. The attaching posts are at case potential and may be connected to chassis ground. They should not be
connected to circuit ground. Plastic optical subassemblies are used to further reduce the possibility of radiated emissions by eliminating the metalfrom
the transmitter and receiver diode housings, which extend into connector space. By proficing a non-metal receptacle for the optical cable ferrule, the
gigabit speed RF electrical signal is isolated from the connector area thus preventing radiated energy leakage from these surfaces to the outside of the
panel.
This single mode transceiver is a Class 1 laser product. It complies with IEC 825 and FDA 21 DFR 1040.10 and 1040.11. The transceiver must be
operated within the specified temperature and voltage limits. The optical ports of the module shall determinate with an optical connector or with a dust
plug.
C-13-2500/C-FDFB-SLC2
2.5Gbps Single Mode SFF LC Transceiver (IR1)
Recommended Board layout Hole Pattern
Recommended Panel mounting
1.THIS FIGURE DESCRIBE THE RE COMMAND CIRCUI T BOARD LAYOUT FOR THE SFF TRANSCEIVE R.
2.THE HATCHED AREAS ARE KE EP-OUT AREAS RESERVED FOR HOUS ING STANDOFF. NO METAL
TRACES OR GROUND CONNE CTION IN KEEP-OUT AREAS.
3.THE MOUNTING STUDS SHOULD BE SOLDERED TO CHASSIS GROUND FOR MECHANICAL INTEGRI TY.
DIMENSION IN MILLIMETER (INCHES)
N
OTES:
vvvvvvvvvvv
DIMENSION IN MILLIMETER (INCHES)
C-13-2500/C-FDFB-SLC2
2.5Gbps Single Mode SFF LC Transceiver (IR1)
LUMNDS235-1023
20550 Nordhoff St. • Chatsworth, CA 91311 • tel: 818.773.9044 • fax: 818.576.9486 • LUMINENT.COM
Handling Precautions: This device is susceptible to damage as a result of electrostatic discharge (ESD). A static free environment is highly recommended.
Follow guidelines according to proper ESD procedures.
Laser Safety: Radiation emitted by laser devices can be dangerous to human eyes. Avoid eye exposure to direct or indirect radiation.
IMPORTANT NOTICE!
All information contained in this document is subject to change without notice, at Luminent’s sole and absolute discretion. Luminent warrants performance of
its products to current specifications only in accordance with the company’s standard one-year warranty; however, specifications designated as “preliminary”
are given to describe components only, and Luminent expressly disclaims any and all warranties for said products, including express, implied, and statutory
warranties, warranties of merchantability, fitness for a particular purpose, and non-infringement of proprietary rights. Please refer to the company’s Terms and
Conditions of Sale for further warranty information.
Luminent assumes no liability for applications assistance, customer product design, software performance, or infringement of patents, services, or intellectual
property described herein. No license, either express or implied, is granted under any patent right, copyright, or intellectual property right, and Luminent makes
no representations or warranties that the product(s) described herein are free from patent, copyright, or intellectual property rights. Products described in this
document are NOT intended for use in implantation or other life support applications where malfunction may result in injury or death to persons. Luminent
customers using or selling products for use in such applications do so at their own risk and agree to fully defend and indemnify Luminent for any damages
resulting from such use or sale.
THE INFORMATION CONTAINED IN THIS DOCUMENT IS PROVIDED ON AN “AS IS” BASIS. Customer agrees that Luminent is not liable for any actual,
consequential, exemplary, or other damages arising directly or indirectly from any use of the information contained in this document. Customer must contact
Luminent to obtain the latest version of this publication to verify, before placing any order, that the information contained herein is current.
© Luminent, Inc. 2002
All rights reserved
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