2007-12-11
1
BAR64...
Silicon PIN Diode
High voltage current controlled RF resistor
for RF attenuator and switches
Frequency range above 1 MHz up to 6 GHz
Very low capacitance at zero volt reverse bias
at frequencies above 1 GHz (typ. 0.17 pF)
Low forward resistance (typ. 2.1 @ 10 mA)
Very low signal distortion
Pb-free (RoHS compliant) package1)
Qualified according AEC Q101
BAR64-02LRH
BAR64-02V
BAR64-03W
BAR64-05
BAR64-05W
BAR64-06
BAR64-06W
BAR64-07BAR64-04
BAR64-04W
!
,
,
,
!"
,
!
,
,
!
,
,
Type Package Configuration LS(nH) Marking
BAR64-02LRH
BAR64-02V
BAR64-03W
BAR64-04
BAR64-04W
BAR64-05
BAR64-05W
BAR64-06
BAR64-06W
BAR64-07
TSLP-2-7
SC79
SOD323
SOT23
SOT323
SOT23
SOT323
SOT23
SOT323
SOT143
single, leadless
single
single
series
series
common cathode
common cathode
common anode
common anode
parallel pair
0.4
0.6
1.8
1.8
1.4
1.8
1.4
1.8
1.4
2
O
O
2 blue
PPs
PPs
PRs
PRs
PSs
PSs
PTs
1Pb-containing package may be available upon special request
2007-12-11
2
BAR64...
Maximum Ratings at TA = 25°C, unless otherwise specified
Parameter Symbol Value Unit
Diode reverse voltage VR150 V
Forward current IF100 mA
Total power dissipation
BAR64-02LRH, TS 135 °C
BAR64-02V, TS 125 °C
BAR64-03W, BAR64-07, TS 25 °C
BAR64-04, -05, -06, TS 65 °C
BAR64-04W, -05W, -06W, TS 115 °C
Ptot
250
250
250
250
250
mW
Junction temperature Tj150 °C
Operating temperature range Top -55 ... 125
Storage temperature Tstg -55 ... 150
Thermal Resistance
Parameter Symbol Value Unit
Junction - soldering point1)
BAR64-02LRH
BAR64-02V, -04W, -05W, -06W
BAR64-03W
BAR64-04, -05, -06
BAR64-07
RthJS
60
140
370
340
290
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
DC Characteristics
Breakdown voltage
I(BR) = 5 µA
V(BR) 150 - - V
Forward voltage
IF = 50 mA
VF- - 1.1
1For calculation of RthJA please refer to Application Note Thermal Resistance
2007-12-11
3
BAR64...
Electrical Characteristics at T
A
= 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
AC Characteristics
Diode capacitance
VR = 20 V, f = 1 MHz
VR = 0 V, f = 100 MHz
VR = 0 V, f = 1...1.8 GHz, BAR64-02LRH
VR = 0 V, f = 1...1.8 GHz, all other
CT
-
-
-
-
0.23
0.3
0.13
0.17
0.35
-
-
-
pF
Reverse parallel resistance
VR = 0 V, f = 100 MHz
VR = 0 V, f = 1 GHz
VR = 0 V, f = 1.8 GHz
RP
-
-
-
10
4
3
-
-
-
k
Forward resistance
IF = 1 mA, f = 100 MHz
IF = 10 mA, f = 100 MHz
IF = 100 mA, f = 100 MHz
rf
-
-
-
12.5
2.1
0.85
20
2.8
1.35
Charge carrier life time
IF = 10 mA, IR = 6 mA, measured at IR = 3 mA,
RL = 100
τ rr - 1550 - ns
I-region width WI- 50 - µm
Insertion loss1)
IF = 3 mA, f = 1.8 GHz
IF = 5 mA, f = 1.8 GHz
IF = 10 mA, f = 1.8 GHz
IL
-
-
-
0.32
0.23
0.16
-
-
-
dB
Isolation1)
VR = 0 V, f = 0.9 GHz
VR = 0 V, f = 1.8 GHz
VR = 0 V, f = 2.45 GHz
VR = 0 V, f = 5.6 GHz
ISO
-
-
-
-
22
17
14.5
8.5
-
-
-
-
1BAR64-02LRH in series configuration, Z = 50
2007-12-11
4
BAR64...
Diode capacitance CT = ƒ (VR)
f = Parameter
0 2 4 6 8 10 12 14 16 V20
VR
0.1
0.2
0.3
0.4
0.5
pF
0.7
CT
1 MHz
100 MHz
1 GHz
1.8 GHz
Reverse parallel resistance RP = ƒ(VR)
f = Parameter
0 5 10 15 20 25 30 V40
VR
-1
10
0
10
1
10
2
10
3
10
4
10
KOhm
Rp
100 MHz
1 GHz
1.8 GHz
Forward resistance rf = ƒ (IF)
f = 100MHz
10 -2 10 -1 10 0 10 1 10 2
mA
IF
-1
10
0
10
1
10
2
10
3
10
Ohm
RF
Forward current IF = ƒ (VF)
TA = Parameter
0 0.2 0.4 0.6 0.8 V1.2
VF
-6
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
A
IF
-40 °C
25 °C
85 °C
125 °C
2007-12-11
5
BAR64...
Intermodulation intercept point
IP3 = ƒ (IF); f = Parameter
10 -1 10 0 10 1
mA
IF
1
10
2
10
dBm
IP3
f=1800MHz
f=900MHz
Forward current IF = ƒ (TS)
BAR64-02LRH
0 30 60 90 120 °C 165
TS
0
10
20
30
40
50
60
70
80
90
100
mA
120
IF
Forward current IF = ƒ (TS)
BAR64-02V
0 15 30 45 60 75 90 105 120 °C 150
TS
0
10
20
30
40
50
60
70
80
90
100
mA
120
IF
Forward current IF = ƒ (TS)
BAR64-04, BAR64-05, BAR64-06
0 15 30 45 60 75 90 105 120 °C 150
TS
0
10
20
30
40
50
60
70
80
90
100
mA
120
IF
2007-12-11
6
BAR64...
Forward current IF = ƒ (TS)
BAR64-04W, BAR64-05W, BAR64-06W
0 15 30 45 60 75 90 105 120 °C 150
TS
0
10
20
30
40
50
60
70
80
90
100
mA
120
IF
Permissible Puls Load RthJS = ƒ (tp)
BAR64-02LRH
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
-1
10
0
10
1
10
2
10
K/W
RthJS
0.5
0.2
0.1
0.05
0.02
0.01
0.005
D = 0
Permissible Pulse Load
IFmax/ IFDC = ƒ (tp)
BAR64-02LRH
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
0
10
1
10
2
10
-
IFmax/IFDC
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
2007-12-11
7
BAR64...
Permissible Puls Load RthJS = ƒ (tp)
BAR64-02V
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
-1
10
0
10
1
10
2
10
3
10
K/W
RthJS
0.5
0.2
0.1
0.05
0.02
0.01
0.005
D = 0
Permissible Pulse Load
IFmax/ IFDC = ƒ (tp)
BAR64-02V
10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 10 1
s
tp
0
10
1
10
2
10
-
IFmax / IFDC
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
Permissible Puls Load RthJS = ƒ (tp)
BAR64-04, BAR64-05, BAR64-06
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tP
-1
10
0
10
1
10
2
10
3
10
K/W
RthJS
0.5
0.2
0.1
0.05
0.02
0.01
0.005
D = 0
Permissible Pulse Load
IFmax/ IFDC = ƒ (tp)
BAR64-04, BAR64-05, BAR64-06
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tP
0
10
1
10
2
10
-
IFmax/IFDC
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
2007-12-11
8
BAR64...
Permissible Puls Load RthJS = ƒ (tp)
BAR64-04W, BAR64-05W, BAR64-06W
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tP
-1
10
0
10
1
10
2
10
3
10
K/W
RthJS
0.5
0.2
0.1
0.05
0.02
0.01
0.005
D = 0
Permissible Pulse Load
IFmax/ IFDC = ƒ (tp)
BAR64-04W, BAR64-05W, BAR64-06W
10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 10 1
s
tP
0
10
1
10
2
10
-
IFmax/IFDC
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
Insertion loss IL = -|S21|2 = ƒ(f)
IF = Parameter
BAR64-02LRH in series configuration, Z = 50
01234GHz 6
f
-0.4
-0.35
-0.3
-0.25
-0.2
-0.15
-0.1
dB
0
|S21|2
3 mA
5 mA
10 mA
100 mA
Isolation ISO = -|S21|2 = ƒ(f)
VR = Parameter
BAR64-02LRH in series configuration, Z = 50
0.5 1.5 2.5 3.5 4.5 GHz 6.5
f
-30
-25
-20
-15
-10
dB
0
|S21|2
0 V
1 V
10 V
2007-12-11
9
BAR64...
Package SC79
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch)
Reel ø330 mm = 10.000 Pieces/Reel
±0.1
1.6
0.3
1
2
marking
Cathode
0.8 ±0.1
10
˚
MAX.
±0.1
1.2
A
±0.05
10
˚
MAX.
0.13
A0.2
M
+0.05
-0.03
±0.04
0.55
±0.05
0.2
0.35
0.35
1.35
BAR63-02V
Type code
Cathode marking
Laser marking
2
0.66
0.93
0.4
1.33
1.96
8
0.2
Cathode
marking
4
Cathode
marking
Standard Reel with 2 mm Pitch
2005, June
Date code
2007-12-11
10
BAR64...
Date Code marking for discrete packages with
one digit (SCD80, SC79, SC75
1)
) CES-Code
1) New Marking Layout for SC75, implemented at October 2005.
.
Month 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014
01apAPapAPapAP
02bqBQbqBQbqBQ
03crCRcrCRcrCR
04dsDSdsDSdsDS
05et ETet ETet ET
06fuFUfuFUfuFU
07gvGVgvGVgvGV
08hxHXhxHXhxHX
09jyJYjyJYjyJY
10kzKZkzKZkzKZ
11l 2L4l 2L4 l 2L4
12n3N5n3N5n3N5
2007-12-11
11
BAR64...
Package SOD323
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
BAR63-03W
Type code
Cathode marking
Laser marking
0.80.8
0.6
1.7
marking
Cathode
±0.2
2.5
0.25
0.3
1
-0.05
M
A
+0.1
+0.2
2
1.25
-0.1
+0.05
-0.2
1.7
0.3
0.15
-0.06
+0.1
0
±0.05
+0.2
-0.1
A
0.9
+0.2
-0.1
±0.15
0.45
0.2
4
8
2.9
1
2
1.35
0.65
Cathode
marking
2007-12-11
12
BAR64...
Package SOT143
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
RF s
2005, June
Date code (YM)
BFP181
Type code
56
Pin 1
0.8 0.81.2
0.9 1.1 0.9
1.2
0.8 0.8
0.8-0.05
+0.1
1.9
1.7
±0.1
2.9
+0.1
-0.05
0.4
0.1 MAX.
12
34
0.25 MB
±0.1
1
10˚ MAX.
0.15 MIN.
0.2 A
M
2.4
±0.15
0.2
10˚ MAX.
A
1.3
±0.1
0...8˚
0.08...0.15
2.6
4
3.15
Pin 1
8
0.2
1.15
B
Manufacturer
2007-12-11
13
BAR64...
Package SOT23
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
EH
s
BCW66
Type code
Pin 1
0.8
0.9 0.91.3
0.8 1.2
0.25 MBC
1.9
-0.05
+0.1
0.4
±0.1
2.9
0.95
C
B
0...8˚
0.2 A
0.1 MAX.
10˚ MAX.
0.08...0.15
1.3
±0.1
10˚ MAX.
M
2.4
±0.15
±0.1
1
A
0.15 MIN.
1)
1) Lead width can be 0.6 max. in dambar area
12
3
3.15
4
2.65
2.13
0.9
8
0.2
1.15
Pin 1
Manufacturer
2005, June
Date code (YM)
2007-12-11
14
BAR64...
Package SOT323
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
1.25
±0.1
0.1 MAX.
2.1
±0.1
0.15
+0.1
-0.05
0.3
+0.1
±0.1
0.9
12
3A
±0.2
2
-0.05
0.650.65
M
3x 0.1
0.1 MIN.
0.1
M
0.2 A
0.2
4
2.15 1.1
8
2.3
Pin 1
Pin 1
2005, June
Date code (YM)
BCR108W
Type code
0.6
0.8
1.6
0.65 0.65
Manufacturer
2007-12-11
15
BAR64...
Package TSLP-2-7
1
2
±0.05
0.6
1
2
±0.05
0.65
±0.035
0.25 1)
1±0.05
0.05 MAX.
+0.01
0.39-0.03
1) Dimension applies to plated terminal
Cathode
marking
1)
±0.035
0.5
Bottom viewTop view
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
Reel ø330 mm = 50.000 Pieces/Reel (optional)
For board assembly information please refer to Infineon website "Packages"
0.45
0.275 0.275
0.375
0.925
Copper Solder mask Stencil apertures
0.35
1
0.6
0.35
0.3
0.76
4
1.16
0.5
Cathode
marking
8
BAR90-02LRH
Type code
Cathode marking
Laser marking
2007-12-11
16
BAR64...
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.