CMS04 TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type CMS04 Switching Mode Power Supply Applications Portable Equipment Battery Applications * * * * Unit: mm Forward voltage: VFM = 0.37 V (max) Average forward current: IF (AV) = 5.0 A Repetitive peak reverse voltage: VRRM = 30 V Suitable for compact assembly due to small surface-mount package "M-FLATTM" (Toshiba package name) Absolute Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit Repetitive peak reverse voltage VRRM 30 V Average forward current IF (AV) Peak one cycle surge forward current (non-repetitive) 5.0 (Note 1) A IFSM 70 (50 Hz) A Junction temperature Tj -40~125 C Storage temperature Tstg -40~150 C JEDEC JEITA TOSHIBA Note 1: T = 36C: Rectangular waveform ( = 180), VR = 15 V 3-4E1A Weight: 0.023 g (typ.) Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Electrical Characteristics (Ta = 25C) Characteristics Peak forward voltage Repetitive peak reverse current Junction capacitance Thermal resistance Symbol Test Condition Min Typ. Max VFM (1) IFM = 1 A 0.27 VFM (2) IFM = 3 A 0.31 VFM (3) IFM = 5 A 0.35 0.37 IRRM (1) VRRM = 5 V 0.31 IRRM (2) VRRM = 30 V 3.3 8.0 Cj Rth (j-a) VR = 10 V, f = 1.0 MHz 330 Device mounted on a ceramic board (soldering land: 2 mm x 2 mm) 60 Device mounted on a glass-epoxy board (soldering land: 6 mm x 6 mm) 135 16 Rth (j-) 1 Unit V mA pF C/W 2006-11-13 CMS04 Marking Abbreviation Code Part No. S4 CMS04 Standard Soldering Pad 2.1 Unit: mm 1.4 3.0 1.4 Handling Precaution Schottky barrier diodes have reverse current characteristic compared to the other diodes. There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage. This device is VF-IRRM trade-off type, lower VF higher IRRM; therefore, thermal runaway might occur when voltage is applied. Please take forward and reverse loss into consideration during design. The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded during operation, even for an instant. The following are the general derating methods that we recommend when you design a circuit with a device. VRRM: Use this rating with reference to the above. VRRM has a temperature coefficient of 0.1%/C. Take this temperature coefficient into account designing a device at low temperature. IF(AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF(AV) and Tj be below 100C. When using this device, take the margin into consideration by using an allowable Tamax-IF(AV) curve. IFSM: This rating specifies the non-repetitive peak current. This is only applied for an abnormal operation, which seldom occurs during the lifespan of the device. Tj: Derate this rating when using a device in order to ensure high reliability. We recommend that the device be used at a Tj of below 100C. Thermal resistance between junction and ambient fluctuates depending on the device's mounting condition. When using a device, please design a circuit board and a soldering land size to match the appropriate thermal resistance value. Please refer to the Rectifiers databook for further information. 2 2006-11-13 CMS04 iF - vF PF (AV) - IF (AV) 100 2.4 Average forward power dissipation PF (AV) (W) 10 125C 75C 1 = 60 1.2 Rectangular waveform 0.8 0 360 0.4 Conduction angle: 0.2 0.4 0.6 0.8 1.0 Instantaneous forward voltage vF 1.2 1.4 (V) 0 360 IF (AV) Conduction angle: VR = 5 V 270 180 60 40 120 20 = 60 1 2 3 4 5 Average forward current 6 3.0 4.0 5.0 6.0 7.0 8.0 IF (AV) (A) T max - IF (AV) DC 80 2.0 140 Rectangular waveform 100 1.0 Average forward current 120 0 0.0 0.0 0.0 Ta max - IF (AV) Device mounted on a ceramic board (board size: 50 mm x 50 mm) 140 Maximum allowable ambinent temperature Ta max (C) 120 1.6 Tj = 25C 0.1 0.0 Maximum allowable lead temperature T max (C) Instantaneous forward current iF (A) DC 180 1.8 7 120 100 80 60 IF (AV) (A) 270 180 Rectangular waveform 120 40 20 0 0.0 8 DC = 60 0 360 IF (AV) Conduction angle: VR = 5 V 1 2 3 4 Average forward current 5 6 7 8 IF (AV) (A) T max - IF (AV) Maximum allowable lead temperature T max (C) 140 120 DC 100 270 80 60 Rectangular waveform 180 40 = 120 20 0 0.0 1 2 3 0 360 IF (AV) Conduction angle: VR = 15 V 4 Average forward current 5 6 7 8 IF (AV) (A) 3 2006-11-13 CMS04 Cj -VR Surge forward current (non-repetitive) (typ.) 1000 100 IFSM (A) Ta = 25C 500 Peak surge forward current Junction capacitance Cj (pF) f = 1 MHz 300 100 1 3 5 10 Reverse voltage 30 VR 50 60 40 20 3 5 (V) 10 30 50 100 Number of cycles IR - Tj PR (AV) - VR (typ.) (typ.) 28 Pulse test 100 Average reverse power dissipation PR (AV) (W) 20 V 15 V VR = 30 V 10 V 5V VR = 3 V 10 1 Rectangular waveform 24 0 DC 360 300 20 VR 16 240 Conduction angle: Tj = 125C 12 180 8 120 4 60 0.1 0 0 20 40 60 80 100 Junction temperature Tj 120 140 160 0 10 (C) Reverse voltage 30 20 VR (V) rth (j-a) - t Transient thermal impedance rth (j-a) (C/W) (mA) Ta = 25C 80 0 1 100 1000 Reverse current IR f = 50 MHz 500 Device mounted on a glass-epoxy board Soldering land: 2.1 mm x 1.4 mm 100 Device mounted on a glass-epoxy board Soldering land: 6.0 mm x 6.0 mm 10 Device mounted on a ceramic board Soldering land: 2.0 mm x 2.0 mm 1 0.5 0.001 0.01 0.1 1 10 100 1000 Time (s) 4 2006-11-13 CMS04 RESTRICTIONS ON PRODUCT USE * Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. 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Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. * Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 5 2006-11-13