BAS17,215 - NXP - Pdf.Support

DATA SH EET

Product data sheet

Supersedes data of 1999 May 31 2003 Mar 25

DISCRETE SEMICONDUCTORS

BAS17

Low-voltage stabistor

ook, halfpage

M3D088

2003 Mar 25 2

NXP Semiconductors Product data sheet

Low-voltage stabistor BAS17

FEATURES

•Low-voltage stabilization

•Forward voltage range: 580 to 960 mV

•Total power dissipation: max. 250 mW.

APPLICATIONS

•Low-voltage stabilization e.g.

– Bias stabilizer in class-B output stages

– Clipping

– Clamping

– Meter protectio n.

DESCRIPTION

Low-voltage st abilization diode in a small SOT23 plastic

package.

PINNING

PIN DESCRIPTION

1anode

2not connected

3cathode

Fig.1 Simplified outline (SOT23),

pin configuration an d symbol.

handbook, halfpage

3MAM185

n.c. 1

MARKING

Note

1. ∗ = p : Made in Hong Kong.

∗ = t : Made in Malaysia.

∗ = W : Made in China.

TYPE NUMBER MARKING CODE(1)

BAS17 ∗A9

LIMITING VALUES

In accordance with the A bsolute Maxi mum Rating System (IEC 60134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VRcontinuous revers e voltage −5 V

IFcontinuous forward current −200 mA

Ptot total power dissipation Tamb = 25 °C−250 mW

Tstg storage temperature −65 +150 °C

Tjjunction temperature −150 °C

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NXP Semiconductors Pr oduct data sheet

Low-voltage stabistor BAS17

ELECTRICAL CHARACTERISTIC S

Tj = 25 °C unless otherwise specified.

THERMAL CHARACTE RISTICS

Note

1. Device mounted o n a FR4 printed-circuit b oard.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VFforward voltage see Fig.2

IF = 0.1 mA 580 −660 mV

IF = 1 mA 665 −745 mV

IF = 5 mA 725 −805 mV

IF = 10 mA 750 −830 mV

IF = 100 mA 870 −960 mV

IRreverse current VR = 4 V −−5µA

rdif differential resistance IF = 0.5 mA −120 − Ω

IF = 2 mA −80 − Ω

SFtemperatur e coe fficient IF = 1 mA − −1.8 −mV/K

Cddiode capacitance VR = 0 V; f = 1 MHz −−140 pF

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth j-tp thermal resistance from junction to tie-point 330 K/W

Rth j-a thermal resistance from junction to ambient note 1 500 K/W

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NXP Semiconductors Pr oduct data sheet

Low-voltage stabistor BAS17

GRAPHICAL DATA

Tj = 25 °C.

(1) Minimum values.

(2) Maximum values.

Fig.2 Forward current as a function of forward

voltage.

handbook, halfpage

1.00.5

102

(1) (2)

10−1

MBG517

VF (V)

0.75

(mA)

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NXP Semiconductors Pr oduct data sheet

Low-voltage stabistor BAS17

PACKAGE OUTLINE

UNIT A1

max. bpcDE e1HELpQwv

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

97-02-28

99-09-13

IEC JEDEC EIAJ

mm 0.1 0.48

0.38 0.15

0.09 3.0

2.8 1.4

1.2 0.95

1.9 2.5

2.1 0.55

0.45 0.1

0.2

DIMENSIONS (mm are the original dimensions)

0.45

0.15

SOT23 TO-236AB

detail X

vMA

0 1 2 mm

scale

1.1

0.9

Plastic surface mounted package; 3 leads SOT2

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NXP Semiconductors Pr oduct data sheet

Low-voltage stabistor BAS17

DATA SHEET STATUS

Notes

1. Please consult the most recently issued document before initiating or completing a design.

2. The product s ta tus of device(s) described in this document may have changed since this docu ment was published

and may differ in case of multiple devices. The latest product status information is available on the Internet at

URL http://www.nxp.com.

DOCUMENT

STATUS(1) PRODUCT

STATUS(2) DEFINITION

Objective data sheet Development This document contains data from the objective specification for pro duct

development.

Preliminary data sheet Qualification This document contains data from the preliminary specification.

Product data sheet Production T his document contains the product specification.

DISCLAIMERS

General ⎯ Information in this document is believed to be

accurate and reliable . H ow ev er, NXP Semiconductors

does not give any representations or warranties,

expressed or implied, as to the accuracy or completeness

of such information and shall have no liability for the

consequenc es of use of such information.

Right to make changes ⎯ NXP Semiconductors

reserves the right to make changes to informa t ion

published in this doc ument, including without limitation

specifications and product descriptions, at any time and

without notice. This document supersedes and replaces all

information supplied prior to the publication hereof.

Suitability for use ⎯ NXP Semiconductors products are

not designed, au thorized or warran ted to be suitable for

use in medical, military, aircraft, space or life support

equipment, nor in applications where failure or malfunction

of an NXP Semiconductors product can reason ably be

expected to result in pe rs onal injury, death or severe

property or environmental damage. NXP Semiconductors

accepts no liability for inclusion and/or use of NXP

Semiconductors products in such equipment or

applications and therefor e s uc h inclusion and/or use is at

the customer’s own risk .

Applications ⎯ Applications that are described herein for

any of these products are for illustrative purposes only.

NXP Semiconductors makes no representation or

warranty that such applications will be suitable for the

specified use witho ut fu rth e r testing or modification.

Limiting values ⎯ Stress abov e on e or more limit ing

values (as defined in the Absolute Maximum Ratings

System of IEC 60134) may cause permanent damage to

the device. Limiting values a re s t ress ratings only and

operation of the device at these or an y other conditions

above those given in the Characteristics sections of this

document is not implied. Exposure to limiting values for

extended periods may affect device reliability.

Terms and conditions of sale ⎯ NXP Semiconductors

products are sold subject to the general terms and

conditions of commercial sale, as published at

http://www.nxp.com/profile/terms, including those

pertaining to warranty, intellectual property rights

infringement and limitation of liability, unless explicitly

otherwise agreed to in writing by NXP Semiconductors. In

case of any incons istency or conflict betwee n information

in this document an d such terms and conditio ns, the latter

will prevail.

No offer to sell or license ⎯ Nothing in this document

may be interpreted or construed as an offer to sell products

that is open for accept ance or the grant, conveyance or

implication of any license under any copyrights, patents or

other industr i al or inte llectual property rights.

Export control ⎯ This document as well as the item(s)

described herein may be subject to export control

regulations. Export might require a prior authorization from

national author ities.

Quick refer ence data ⎯ The Quick reference data is an

extract of th e product data given in the Limiting values and

Characteristics sections of this document, and as such is

not complete, exhaus tive or legally binding.

NXP Semiconductors

Contact information

For additional information p lease visit: http://www.nxp.com

For sales offices addresses send e-mail to: salesaddresses@nxp.com

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information pr e sent ed in this document does not fo rm p ar t o f an y q uot ation or co ntract, is believed to be accurate a nd reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other ind us trial or intellectual property rights.

Customer notification

This data sheet was changed to reflect the new company name NXP Semicon ductors. No change s were

made to the content, except for the legal definitions and disclaimer s.

Printed in The Netherlands 613514/03/pp7 Date of release: 2003 Mar 25 Document order number: 9397 750 10969