© Semiconductor Components Industries, LLC, 2009
April, 2009 − Rev. 18
1Publication Order Number:
MC34164/D
MC34164, MC33164,
NCV33164
Micropower Undervoltage
Sensing Circuits
The MC34164 series are undervoltage sensing circuits specifically
designed for use as reset controllers in portable microprocessor based
systems where extended battery life is required. These devices offer
the designer an economical solution for low voltage detection with a
single external resistor. The MC34164 series features a bandgap
reference, a comparator with precise thresholds and built−in hysteresis
to prevent erratic reset operation, an open collector reset output
capable of sinking in excess of 6.0 mA, and guaranteed operation
down to 1.0 V input with extremely low standby current. The MC
devices are packaged in 3−pin TO−92 (TO−226AA), micro size
TSOP−5, 8−pin SOIC−8 and Micro8™ surface mount packages. The
NCV device is packaged in SOIC−8.
Applications include direct monitoring of the 3.0 V or 5.0 V
MPU/logic power supply used in appliance, automotive, consumer,
and industrial equipment.
Features
•Temperature Compensated Reference
•Monitors 3.0 V (MC34164−3) or 5.0 V (MC34164−5) Power Supplies
•Precise Comparator Thresholds Guaranteed Over Temperature
•Comparator Hysteresis Prevents Erratic Reset
•Reset Output Capable of Sinking in Excess of 6.0 mA
•Internal Clamp Diode for Discharging Delay Capacitor
•Guaranteed Reset Operation With 1.0 V Input
•Extremely Low Standby Current: As Low as 9.0 A
•Economical TO−92 (TO−226AA), TSOP−5, SOIC−8 and Micro8
Surface Mount Packages
•NCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
•Pb−Free Packages are Available
Figure 1. Representative Block Diagram
1.2 Vref
Reset
GND
Input
=Sink Only
Positive True Logic
This device contains 28 active transistors.
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
ORDERING INFORMATION
SOIC−8
D SUFFIX
CASE 751
8
1
Micro8
DM SUFFIX
CASE 846A
8
1
See general marking information in the device marking
section on page 8 of this data sheet.
DEVICE MARKING INFORMATION
(Top View)
3
1N.C.
Ground
N.C.
N.C.
2
4
8
7
6
5N.C.
N.C.
Input
Reset
PIN CONNECTIONS
TO−92 (TO−226AA)
P SUFFIX
CASE 29
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TSOP−5
SN SUFFIX
CASE 483
Pin 1. Ground
2. Input
3. Reset
4. NC
5. NC
TSOP−5
Pin 1. Reset
2. Input
3. Ground
TO−92
1
5
123
12
BENT LEAD
TAPE & REEL
AMMO PACK
STRAIGHT LEAD
BULK PACK
3
MC34164, MC33164, NCV33164
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2
MAXIMUM RATINGS
Rating Symbol Value Unit
Power Input Supply Voltage Vin −1.0 to 12 V
Reset Output Voltage VO−1.0 to 12 V
Reset Output Sink Current ISink Internally
Limited
mA
Clamp Diode Forward Current, Reset to Input Pin (Note 1) IF 100 mA
Power Dissipation and Thermal Characteristics
P Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, Junction−to−Air
D Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, Junction−to−Air
DM Suffix, Plastic Package
Maximum Power Dissipation @ TA = 25°C
Thermal Resistance, Junction−to−Air
PD
RJA
PD
RJA
PD
RJA
700
178
700
178
520
240
mW
°C/W
mW
°C/W
mW
°C/W
Operating Junction Temperature TJ+150 °C
Operating Ambient Temperature Range
MC34164 Series
MC33164 Series, NCV33164
TA0 to +70
−40 to +125
°C
Storage Temperature Range Tstg −65 to +150 °C
Electrostatic Discharge Sensitivity (ESD)
Human Body Model (HBM)
Machine Model (MM)
ESD
4000
200
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
MC34164−3, MC33164−3 SERIES, NCV33164−3
ELECTRICAL CHARACTERISTICS (For typical values TA = 25°C, for min/max values TA is the operating ambient temperature
range that applies [Notes 2 & 3], unless otherwise noted.)
Characteristic Symbol Min Typ Max Unit
COMPARATOR
Threshold Voltage
High State Output (Vin Increasing)
Low State Output (Vin Decreasing)
Hysteresis (ISink = 100 A)
VIH
VIL
VH
2.55
2.55
0.03
2.71
2.65
0.06
2.80
2.80
−
V
RESET OUTPUT
Output Sink Saturation
(Vin = 2.4 V, ISink = 1.0 mA)
(Vin = 1.0 V, ISink = 0.25 mA)
VOL
−
−
0.14
0.1
0.4
0.3
V
Output Sink Current (Vin, Reset = 2.4 V) ISink 6.0 12 30 mA
Output Off−State Leakage
(Vin, Reset = 3.0 V)
(Vin, Reset = 10 V)
IR(leak)
−
−
0.02
0.02
0.5
1.0
A
Clamp Diode Forward Voltage, Reset to Input Pin (IF = 5.0 mA) VF0.6 0.9 1.2 V
TOTAL DEVICE
Operating Input Voltage Range Vin 1.0 to 10 − − V
Quiescent Input Current
Vin = 3.0 V
Vin = 6.0 V
Iin
−
−
9.0
24
15
40
A
1. Maximum package power dissipation limits must be observed.
2. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
3. Tlow = 0°C for MC34164 Thigh = +70°C for MC34164
=−40°C for MC33164, NCV33164 = +125°C for MC33164, NCV33164
MC34164, MC33164, NCV33164
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3
MC34164−5, MC33164−5 SERIES, NCV33164−5
ELECTRICAL CHARACTERISTICS (For typical values TA = 25°C, for min/max values TA is the operating ambient temperature
range that applies [Notes 5 & 6], unless otherwise noted.)
Characteristic Symbol Min Typ Max Unit
COMPARATOR
Threshold Voltage
High State Output (Vin Increasing)
Low State Output (Vin Decreasing)
Hysteresis (ISink = 100 A)
VIH
VIL
VH
4.15
4.15
0.02
4.33
4.27
0.09
4.45
4.45
−
V
RESET OUTPUT
Output Sink Saturation
(Vin = 4.0 V, ISink = 1.0 mA)
(Vin = 1.0 V, ISink = 0.25 mA)
VOL
−
−
0.14
0.1
0.4
0.3
V
Output Sink Current (Vin, Reset = 4.0 V) ISink 7.0 20 50 mA
Output Off−State Leakage
(Vin, Reset = 5.0 V)
(Vin, Reset = 10 V)
IR(leak)
−
−
0.02
0.02
0.5
2.0
A
Clamp Diode Forward Voltage, Reset to Input Pin (IF = 5.0 mA) VF0.6 0.9 1.2 V
TOTAL DEVICE
Operating Input Voltage Range Vin 1.0 to 10 − − V
Quiescent Input Current
Vin = 5.0 V
Vin = 10 V
Iin
−
−
12
32
20
50
A
4. Maximum package power dissipation limits must be observed.
5. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
6. Tlow = 0°C for MC34164 Thigh = +70°C for MC34164
=−40°C for MC33164, NCV33164 = +125°C for MC33164, NCV33164
7. NCV prefix is for automotive and other applications requiring site and change control.
0
Vin, INPUT VOLTAGE (V)
RL = 82 k to Vin
TA = 25°C
2.0 4.0 6.0 8.0 10
VO,
O
UTPUT V
O
LTA
G
E (V)
Figure 2. MC3X164−3 Reset Output
Voltage versus Input Voltage
0
Vin, INPUT VOLTAGE (V)
Figure 3. MC3X164−5 Reset Output
Voltage versus Input Voltage
RL = 82 k to Vin
TA = 25°C
2.0 4.0 6.0 8.0 10
VO, OUTPUT VOLTAGE (V)
10
8.0
6.0
4.0
2.0
0
10
8.0
6.0
4.0
2.0
0
MC34164, MC33164, NCV33164
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4
Iin, INPUT CURRENT ( A)
μ
Vin, THRESHOLD VOLTAGE (V)
VO, OUTPUT VOLTAGE (V)
Figure 4. MC3X164−3 Reset Output
Voltage versus Input Voltage
-50
TA, AMBIENT TEMPERATURE (°C)
-25 0 25 50 75 100 125
Vin, THRESHOLD VOLTAGE (V)
Upper Threshold
High State Output
Lower Threshold
Low State Output
Figure 5. MC3X164−5 Reset Output
Voltage versus Input Voltage
4.22
Vin, INPUT VOLTAGE (V)
4.26 4.30 4.34 4.38
Figure 6. MC3X164−3 Comparator Threshold
Voltage versus Temperature
Figure 7. MC3X164−5 Comparator Threshold
Voltage versus Temperature
Figure 8. MC3X164−3 Input Current
versus Input Voltage
V
O,
OUTPUT
VOLTAGE
(V)
Figure 9. MC3X164−5 Input Current
versus Input Voltage
2.62
Vin, INPUT VOLTAGE (V)
RL = 82 k to Vin
TA = 25°C
2.66 2.70 2.74 2.78
-50
TA, AMBIENT TEMPERATURE (°C)
-25 0 25 50 75 100 125
Upper Threshold
High State Output
Lower Threshold
Low State Output
Vin, INPUT VOLTAGE (V)
2.0 4.0 6.0 8.0 10
TA = 0°C
TA = 70°C
Iin, INPUT CURRENT ( A)
μ
0
Vin, INPUT VOLTAGE (V)
2.0 4.0 6.0 8.0 10
RL = 82 k to Vin
TA = 25°C
4.36
4.32
4.28
4.24
4.20
5.0
4.0
3.0
2.0
1.0
0
5.0
4.0
3.0
2.0
1.0
0
2.76
2.72
2.68
2.64
2.60
50
40
30
20
10
00
50
40
30
20
10
0
TA = 25°C
TA = 0°C
TA = 70°C
TA = 25°C
MC34164, MC33164, NCV33164
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5
TA = 0°C
VOL, OUTPUT SATURATION (V)
0
ISink, SINK CURRENT (mA)
4.0 8.0 12 16 20
TA = 70°C
TA = 0°C
Vin, Reset = 4 V
Figure 10. MC3X164−3 Reset Output
Saturation versus Sink Current
Figure 11. MC3X164−5 Reset Output
Saturation versus Sink Current
Figure 12. Clamp Diode Forward Current
versus Voltage
VOL, OUTPUT SATURATION (V)
Figure 13. Reset Delay Time
(MC3X164−5 Shown)
0
VSink, SINK CURRENT (mA)
4.0 8.0 12 16
, FORWARD VOLTAGE (V)
0.4 0.8 1.2 1.6
IF, FORWARD CURRENT (mA)
20
TA = 25°C
Figure 14. Low Voltage Microprocessor Reset
Power
Supply
1.2 Vref
Microprocessor
Circuit
Input R
Reset
GND
Reset
CDLY
A time delayed reset can be accomplished with the addition of CDLY
. For systems with extremely fast power
supply rise times (<500 ns) it is recommended that the RCDLY time constant be greater than 5.0 s. Vth(MPU) is
the microprocessor reset input threshold.
tDLY = RCDLY In
1 −
Vth(MPU)
1
Vin
ǒǓ
TA = 25°C
TA = 0°C
TA = 70°C
TA = 25°C
Vin = 0 V
TA = 25°C
VF
Vin = 2.4 V
TA = 70°C
TA = 0°C
TA = 25°C
Reset
Vin
Vin = 5.0 V to 4.0 V
RL = 43 k
TA = 25°C
Reset
Vin
5.0V
4.0V
Ref
43k
90%
5.0 V
4.0 V
5.0 s/DIV
10
%
4.0
3.0
2.0
1.0
0
4.0
3.0
2.0
1.0
0
32
24
16
8.0
00
TA = 70°C
MC34164, MC33164, NCV33164
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6
Figure 15. Low Voltage Microprocessor Reset With Additional Hysteresis
(MC3X164−5 Shown)
Power
Supply
1.2 Vref
Microprocessor
Circuit
RL
GND
Reset
Comparator hysteresis can be increased with the addition of resistor RH. The hysteresis equation has been simplified and does not account for the change of input current
Iin as Vin crosses the comparator threshold (Figure 8). An increase of the lower threshold Vth(lower) will be observed due to Iin which is typically 10 A at 4.3 V. The
equations are accurate to ±10% with RH less than 1.0 k and RL between 4.3 k and 43 k.
VH ≈
4.3 RH
RH
MC3X164-5
Iin Vin
Test Data
VH
(mV)
Vth
(mV)
RH
()
RL
(k)
60
103
123
160
155
199
280
262
306
357
421
530
0
1.0
1.0
1.0
2.2
2.2
2.2
4.7
4.7
4.7
4.7
4.7
0
100
100
100
220
220
220
470
470
470
470
470
43
10
6.8
4.3
10
6.8
4.3
10
8.2
6.8
5.6
4.3
RL
+ 0.06
Vth(lower) ≈10 RH x 10-6
where: RH ≤ 1.0 k
43 k ≥ RL ≥ 4.3 k
Figure 16. Voltage Monitor Figure 17. Solar Powered Battery Charger
Figure 18. MOSFET Low Voltage Gate Drive Protection Using the MC3X164−5
1.2 Vref
Input
270
Reset
GND
Power
Supply
1.2 Vref
Input
1.0 k
GND
1.2 Vref
Input
GND
Solar
Cells
RL
MTP3055EL
MC3X164-5
VCC
4.3V
Overheating of the logic level power MOSFET due to insufficient
gate voltage can be prevented with the above circuit. When the
input signal is below the 4.3 V threshold of the MC3X164-5, its
output grounds the gate of the L2 MOSFET.
Reset
Reset
MC34164, MC33164, NCV33164
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7
ORDERING INFORMATION
Device Package Shipping†
MC33164D−3G SOIC−8
(Pb−Free) 98 Units / Rail
MC33164D−3R2G SOIC−8
(Pb−Free)
2500 Units / Tape & Reel
NCV33164D−3R2* SOIC−8
NCV33164D−3R2G* SOIC−8
(Pb−Free)
MC33164DM−3R2 Micro8
4000 Units / Tape & Reel
MC33164DM−3R2G Micro8
(Pb−Free)
MC33164P−3G TO−92
(Pb−Free) 2000 Units / Box
MC33164P−3RAG TO−92
(Pb−Free) 2000 Units / Tape & Reel
MC33164P−3RPG TO−92
(Pb−Free) 2000 Units / Pack
MC33164D−5G SOIC−8
(Pb−Free) 98 Units / Rail
MC33164D−5R2 SOIC−8
2500 Units / Tape & Reel
MC33164D−5R2G SOIC−8
(Pb−Free)
NCV33164D−5R2G* SOIC−8
(Pb−Free)
MC33164DM−5R2G Micro8
(Pb−Free) 4000 Units / Tape & Reel
MC33164P−5G TO−92
(Pb−Free) 2000 Units / Box
MC33164P−5RAG TO−92
(Pb−Free) 2000 Units / Tape & Reel
MC33164P−5RPG TO−92
(Pb−Free) 2000 Units / Pack
MC34164D−3G SOIC−8
(Pb−Free) 98 Units / Rail
MC34164D−3R2G SOIC−8
(Pb−Free) 2500 Units / Tape & Reel
MC34164DM−3R2G Micro8
(Pb−Free) 4000 Units / Tape & Reel
MC34164P−3G TO−92
(Pb−Free) 2000 Units / Box
MC34164P−3RPG TO−92
(Pb−Free) 2000 Units / Pack
MC34164D−5G SOIC−8
(Pb−Free) 98 Units / Rail
MC34164D−5R2G SOIC−8
(Pb−Free) 2500 Units / Tape & Reel
MC34164DM−5R2G Micro8
(Pb−Free) 4000 Units / Tape & Reel
MC34164SN−5T1G TSOP−5
(Pb−Free) 3000 Units / Tape & Reel
MC34164P−5G TO−92
(Pb−Free) 2000 Units / Box
MC34164P−5RAG TO−92
(Pb−Free) 2000 Units / Tape & Reel
MC34164P−5RPG TO−92
(Pb−Free) 2000 Units / Pack
*NCV33164: Tlow = −40°C, Thigh = +125°C. Guaranteed by design. NCV prefix is for automotive and other applications requiring
site and change control.
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MC34164, MC33164, NCV33164
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8
SOIC−8
D SUFFIX
CASE 751
SRC = Device Code
x = Device Number 3 or 4
y = Suffix Number 3 or 5
A = Assembly Location
L = Wafer Lot
Y = Year
W, WW = Work Week
G= Pb−Free
PIN CONNECTIONS AND MARKING DIAGRAMS
Micro8
MC33164DM
CASE 846A
MIy0
AYWG
G
1
8
Micro8
MC34164DM
CASE 846A
MCy0
AYWG
G
1
8
TO−92
MC3x164P−yRA
MC3x164P−yRP
MC3x164P−y
CASE 29
MC3x1
64P−y
YWW
123
TSOP−5
SN SUFFIX
CASE 483
3x164
ALYWy
G
1
8
1
5
SRCAYWG
G
MC34164, MC33164, NCV33164
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9
PACKAGE DIMENSIONS
TO−92 (TO−226AA)
P SUFFIX
CASE 29−11
ISSUE AM
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
R
A
P
J
L
B
K
G
H
SECTION X−X
C
V
D
N
N
XX
SEATING
PLANE DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.175 0.205 4.45 5.20
B0.170 0.210 4.32 5.33
C0.125 0.165 3.18 4.19
D0.016 0.021 0.407 0.533
G0.045 0.055 1.15 1.39
H0.095 0.105 2.42 2.66
J0.015 0.020 0.39 0.50
K0.500 --- 12.70 ---
L0.250 --- 6.35 ---
N0.080 0.105 2.04 2.66
P--- 0.100 --- 2.54
R0.115 --- 2.93 ---
V0.135 --- 3.43 ---
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR OF PACKAGE BEYOND
DIMENSION R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P
AND BEYOND DIMENSION K MINIMUM.
RA
P
J
B
K
G
SECTION X−X
C
V
D
N
XX
SEATING
PLANE DIM MIN MAX
MILLIMETERS
A4.45 5.20
B4.32 5.33
C3.18 4.19
D0.40 0.54
G2.40 2.80
J0.39 0.50
K12.70 ---
N2.04 2.66
P1.50 4.00
R2.93 ---
V3.43 ---
1
T
STRAIGHT LEAD
BULK PACK
BENT LEAD
TAPE & REEL
AMMO PACK
MC34164, MC33164, NCV33164
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10
PACKAGE DIMENSIONS
TSOP−5
SN SUFFIX
CASE 483−02
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM MIN MAX
MILLIMETERS
A3.00 BSC
B1.50 BSC
C0.90 1.10
D0.25 0.50
G0.95 BSC
H0.01 0.10
J0.10 0.26
K0.20 0.60
L1.25 1.55
M0 10
S2.50 3.00
123
54 S
A
G
L
B
D
H
C
J
__
0.7
0.028
1.0
0.039
ǒmm
inchesǓ
SCALE 10:1
0.95
0.037
2.4
0.094
1.9
0.074
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.20
5X
CAB
T0.10
2X
2X T0.20
NOTE 5
T
SEATING
PLANE
0.05
K
M
DETAIL Z
DETAIL Z
MC34164, MC33164, NCV33164
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11
PACKAGE DIMENSIONS
SOIC−8
D SUFFIX
CASE 751−07
ISSUE AJ
SEATING
PLANE
1
4
58
N
J
X 45 _
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
BS
D
H
C
0.10 (0.004)
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B3.80 4.00 0.150 0.157
C1.35 1.75 0.053 0.069
D0.33 0.51 0.013 0.020
G1.27 BSC 0.050 BSC
H0.10 0.25 0.004 0.010
J0.19 0.25 0.007 0.010
K0.40 1.27 0.016 0.050
M0 8 0 8
N0.25 0.50 0.010 0.020
S5.80 6.20 0.228 0.244
−X−
−Y−
G
M
Y
M
0.25 (0.010)
−Z−
Y
M
0.25 (0.010) ZSXS
M
____
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
ǒmm
inchesǓ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
MC34164, MC33164, NCV33164
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12
PACKAGE DIMENSIONS
Micro8
DM SUFFIX
CASE 846A−02
ISSUE H
S
B
M
0.08 (0.003) A S
T
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.
b
e
PIN 1 ID
8 PL
0.038 (0.0015)
−T−
SEATING
PLANE
A
A1 cL
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
8X 8X
6X ǒmm
inchesǓ
SCALE 8:1
1.04
0.041
0.38
0.015
5.28
0.208
4.24
0.167
3.20
0.126
0.65
0.0256
DIM
A
MIN NOM MAX MIN
MILLIMETERS
−− −− 1.10 −−
INCHES
A1 0.05 0.08 0.15 0.002
b0.25 0.33 0.40 0.010
c0.13 0.18 0.23 0.005
D2.90 3.00 3.10 0.114
E2.90 3.00 3.10 0.114
e0.65 BSC
L0.40 0.55 0.70 0.016
−− 0.043
0.003 0.006
0.013 0.016
0.007 0.009
0.118 0.122
0.118 0.122
0.026 BSC
0.021 0.028
NOM MAX
4.75 4.90 5.05 0.187 0.193 0.199
HE
HE
DD
E
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MC34164/D
Micro8 is a trademark of International Rectifier.
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