INTEGRATED CIRCUITS DIVISION
DS-CPC1998-R05 www.ixysic.com 1
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Characteristics
Features
•Load Current up to 20Arms with 5°C/W Heat Sink
•800VP Blocking Voltage
•5mA Control Current
•Zero-Cross Switching
•Isolated, Low Thermal Impedance Ceramic Pad for
Heat Sink Applications
•2500Vrms Isolation, Input to Output
•DC Control, AC Output
•Optically Isolated
•TTL and CMOS Compatible
•Low EMI and RFI Generation
•High Noise Immunity
•Machine Insertable, Wave Solderable
Applications
•Programmable Control
•Process Control
•Power Control Panels
•Remote Switching
•Gas Pump Electronics
•Contactors
•Large Relays
•Solenoids
•Motors
•Heaters
Approvals
•UL 508 Recognized Component: File E69938
Description
CPC1998J is an AC Solid State Switch utilizing dual
power SCR outputs. This device also includes
zero-cross turn-on circuitry and is specified with an
800VP blocking voltage.
Tightly controlled zero-cross circuitry ensures low
noise switching of AC loads by minimizing the
generation of transients. The optically coupled input
and output circuits provide exceptional noise immunity
and 2500Vrms of isolation between the control and the
output. As a result, the CPC1998 is well suited for
industrial environments where electromagnetic
interference would disrupt the operation of plant facility
communications and control systems.
The unique i4-PAC package pioneered by IXYS allows
Solid State Relays to achieve the highest load current
and power ratings. This package features a unique
IXYS process in which the silicon chips are soft
soldered onto the Direct Copper Bond (DCB)
substrate instead of the traditional copper leadframe.
The DCB ceramic, the same substrate used in high
power modules, not only provides 2500Vrms isolation
but also very low junction-to-case thermal resistance
(0.35 °C/W).
Ordering Information
Pin Configuration
Parameter Rating Units
AC Operating Voltage 20-240 Vrms
Load Current
With 5°C/W Heat Sink 20 Arms
No Heat Sink 5
On-State Voltage Drop 1.1 VP (at IL=2AP)
Blocking Voltage 800 VP
Thermal Resistance,
Junction-to-Case, JC 0.35 °C/W
Part Description
CPC1998J i4-PAC Package (25 per tube)
2
1
– LED+ LEDAC Load
4
3
ZC
CPC1998
AC Power Switch
INTEGRATED CIRCUITS DIVISION
R05 www.ixysic.com 2
CPC1998
1 Specifications
1.1 Absolute Maximum Ratings @ 25°C
1 Derate linearly 1.33mW / °C.
2 Free air, no heat sink.
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
1.2 Electrical Characteristics @ 25°C
1 Tested at a peak value equivalent.
2 Zero-cross first half-cycle @ < 100Hz.
3 Snubber circuits may be required at low power factors.
4 For high-noise environments, or high-frequency operation (>60Hz), or for applications with a high inductive load, use IF 10mA.
Symbol Min Max Units
Blocking Voltage - 800 VP
Reverse Input Voltage - 5 V
Input Control Current - 50 mA
Peak (10ms) - 1 A
Input Power Dissipation 1-150
mW
Total Power Dissipation 2-3.5
W
I2t for Fusing
(1/2 Sine Wave, 60Hz) -200
A2s
Isolation Voltage, Input to Output - 2500 Vrms
ESD, Human Body Model - 8 kV
Operational Temperature - 40 +85 °C
Storage Temperature - 40 +125 °C
Parameter Conditions Symbol Minimum Typical Maximum Units
Output Characteristics
Load Current
Continuous No Heat Sink, VL=20-240Vrms IL0.1 - 5 Arms
Continuous TC=25°C 0.1 - 50
Maximum Surge Current 1/2 Sine Wave, 60Hz IP--150A
Off-State Leakage Current VL=800V ILEAK --100
AP
On-State Voltage Drop 1IL=2AP--0.851.1
VP
Off-State dV/dt IF=0mA dV/dt 1000 - - V/s
Switching Speeds
Tu r n - O n IF=5mA ton --0.5
cycles
Tu r n - O f f toff --0.5
Zero-Cross Turn-On Voltage 21st half-cycle --520
V
subsequent half-cycle ---5
Holding Current - IH-4450mA
Latching Current - IL-4875mA
Operating Frequency --20-500Hz
Load Power Factor for Guaranteed Turn-On 3f=60Hz PF 0.25 - - -
Input Characteristics
Input Control Current to Activate 4IL=1A Resistive, f=60Hz IF--5mA
Input Dropout Voltage - -0.8- -V
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR--10A
Input/Output Characteristics
Capacitance, Input-to-Output - CI/O --3pF
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CPC1998
2 Thermal Characteristics
2.1 Thermal Management
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface
material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient
thermal resistance of 12.5°C/W.
2.2 Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
2.3 Thermal Performance Data
Parameter Conditions Symbol Rating Units
Thermal Resistance (Junction to Case) - JC 0.35 °C/W
Thermal Resistance (Junction to Ambient) Free Air JA 33 °C/W
Junction Temperature (Operating) - TJ-40 to +125 °C
θCA = - θJC
(TJ - TA)
PD
TJ = Junction Temperature (°C), TJ ≤ 125°C *
TA = Ambient Temperature (°C)
θJC = Thermal Resistance, Junction to Case (°C/W) = 0.35°C/W
θCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
PD = On-State Voltage (Vrms) • Load Current (Arms)
* Elevated junction temperature reduces semiconductor lifetime.
NOTE: The exposed surface of the DCB substrate is not to be soldered.
Heat Sink Rating
Load Current (Arms)
0 5 10 15 20 25 30 35 40
Output Power (W)
0
5
10
15
20
25
30
35
40
Output Power
vs. Load Current
Temperature (ºC)
0 25 50 75 100 125
Output Power (W)
0
5
10
15
20
25
30
35
40
Output Power
vs. Ambient Temperature
Heat Sink
1ºC/W
2ºC/W
5ºC/W
10ºC/W
15ºC/W
Free Air
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R05 www.ixysic.com 4
CPC1998
3 Performance Data @ 25°C (Unless Otherwise Noted)*
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not
indicated in the written specifications, please contact our application department.
LED Forward Voltage (V)
1.25 1.26 1.27 1.281.29 1.30
Device Count (N)
0
5
10
15
20
25
30
35
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
LED Forward Current (mA)
2.66 2.70 2.74 2.782.822.86 2.90
Device Count (N)
0
5
10
15
20
25
Typical IF for Switch Operation
with 1A Resistive Load
(N=50, VL=120VAC/60Hz)
Forward Voltage Drop (V)
0.856 0.859 0.862 0.865 0.8680.871 0.874
Device Count (N)
0
5
10
15
20
25
Forward Voltage Drop Distribution
(N=50, IF=5mA, IL=2A)
Zero-Cross Voltage (V)
6.2 6.4 6.6 6.87.0 7.2 7.4
Device Count (N)
0
5
10
15
20
Zero-Cross Voltage
(N=50, IF=5mA)
Blocking Voltage (VP)
874 876 878880882884886
Device Count (N)
0
5
10
15
20
Typical Blocking Voltage Distribution
(N=50)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage (V)
1.1
1.2
1.3
1.4
1.5
1.6
Typical LED Forward Voltage Drop
vs. Temperature
I
F
=50mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Current (mA)
2.5
3.0
3.5
4.0
4.5
LED Forward Current to Operate
vs. Temperature - Resistive Load
(I
L
=1A, f
L
=60Hz)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Current (mA)
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
LED Forward Current to Operate
vs. Temperature - Inductive Load
(IL=500mA, fL=60Hz, LL=400mH)
Load Frequency (Hz)
0 100 200 300 400 500 600
LED Forward Current (mA)
2.5
3.0
3.5
4.0
4.5
5.0
LED Current to Operate
vs. Load Frequency - Resistive Load
(VP=71V, RL=10Ω, IL=7A)
Load Frequency (Hz)
0 100 200 300 400 500 600
LED Forward Current (mA)
4.85
4.90
4.95
5.00
5.05
5.10
5.15
5.20
LED Current to Operate
vs. Load Frequency - Inductive Load
(VL=200V, ZL=400mH/220Ω)
Load Frequency (Hz)
0 100 200 300 400 500 600
LED Forward Current (mA)
5.10
5.12
5.14
5.16
5.18
5.20
LED Current to Operate
vs. Load Frequency- Inductive Load
(VL=200V, ZL=196mH/110Ω)
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CPC1998
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not
indicated in the written specifications, please contact our application department.
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Zero-Cross Voltage (V)
6.0
6.2
6.4
6.6
6.8
7.0
7.2
7.4
Zero-Cross Voltage vs. Temperature
(I
F
=5mA, R
L
=120Ω)
Voltage (V)
-1.5 -1.0 -0.5 0.0 0.5 1.0 1.5
Current (A)
-15
-10
-5
0
5
10
15
Output Voltage vs. Output Current
(IF=5mA)
T
A
=-40ºC
T
A
=25ºC
T
A
=85ºC
Temperature (ºC)
-40 -20 0 20 40 60 80 100
V
ON
(V)
0.70
0.75
0.80
0.85
0.90
0.95
1.00
1.05
1.10
VON vs. Temperature
I
L
=3A
I
L
=2A
I
L
=1A
I
L
=10A
I
L
=5A
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Holding Current (mA)
20
30
40
50
60
70
80
Holding Current vs. Temperature
(R
L
=1.9Ω)
Temperature (ºC)
0 1020304050607080 90 100
Thermal Resistance (ºC/W)
0
5
10
15
20
25
30
Total Heat Sinking Required
vs. Temperature
IL=5Arms
IL=7.5Arms
IL=10Arms
IL=15Arms
IL=20Arms
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Breakdown Voltage (V)
800
850
900
950
1000
Breakdown Voltage vs. Temperature
(I
F
=0mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage current (μA)
0.001
0.01
0.1
1
10
100
Leakage Current vs. Temperature
Measured Across Pins 1&2
V
L
=800V
V
L
=600V
V
L
=400V
Time
100μs 1ms 10ms 100ms 1s 10s
Current (A)
Maximum Surge Current
Non-Repetitive, Free Air
1
10
100
1000
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CPC1998
4 Manufacturing Information
4.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
4.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
4.3 Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
NOTE: The exposed surface of the DCB substrate is not to be soldered.
4.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake may be necessary if a wash
is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Device Moisture Sensitivity Level (MSL) Rating
CPC1998J MSL 1
Device Maximum Temperature x Time
CPC1998J 245°C for 30 seconds
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CPC1998
4.5 Mechanical Dimensions
DCB Substrate
1.270 TYP
(0.050 TYP)
NOTE: Metallized external surface of DCB substrate maintains 2500Vrms
isolation to device internal structure and all external pins.
20.879 ± 0.254
(0.822 ± 0.010)
20.396 ± 0.508
(0.803 ± 0.020)
15.240 ± 0.508
(0.600 ± 0.020)
3.810 ± 0.254
(0.150 ± 0.010)
2.362 ± 0.381
(0.093 ± 0.015)
19.914 ± 0.254
(0.784 ± 0.010)
5.029 ± 0.127
(0.198 ± 0.005) 1.181 ± 0.076
(0.047 ± 0.003)
15.317 ± 0.254
(0.603 ± 0.010)
1.930 ± 0.381
(0.076 ± 0.015)
17.221 ± 0.254
(0.678 ± 0.010)
DIMENSIONS
mm
(inches)
0.635 ± 0.076
(0.025 ± 0.003)
2.794 ± 0.127
(0.110 ± 0.005)
NOTE: Not to be soldered
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1998-R05
©Copyright 2015, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
3/9/2015
