1. Product profile
1.1 General description
Dual high-speed switching diode, encapsulated in a very small SOT323 (SC-70)
Surface-Mounted Device (SMD) plastic package.
1.2 Features and benefits
1.3 Applications
High-speed switching
General-purpose switching
1.4 Quick reference data
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Single diode loaded.
[3] Double diode loaded.
[4] When switched from IF= 10 mA to IR=10mA; R
L= 100 ; measured at IR=1mA.
1PS300
Dual high-speed switching diode
Rev. 5 — 5 March 2012 Product data sheet
SOT323
High switching speed: trr 4ns Low capacitance: Cd2pF
Repetitive peak reverse voltage:
VRRM 85 V
Repetitive peak forw ar d cu rr en t:
IFRM 500 mA
Reverse voltage: VR80 V Very small SMD plastic package
AEC-Q101 qualified
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
Per diode
IFforward current [1]
[2] --200mA
[3] --170mA
IRreverse current VR=80V - - 0.5 A
VRreverse voltage - - 80 V
trr reverse recovery time [4] --4ns
1PS300 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 5 — 5 March 2012 2 of 11
NXP Semiconductors 1PS300
Dual high-speed switching diode
2. Pinning information
3. Ordering information
4. Marking
[1] * = placeholder for manufacturing site code
5. Limiting values
Table 2. Pinning
Pin Description Simplified outline Graphic symbol
1 cathode (diode 1)
2 cathode (diode 2)
3 common anode
12
3
006aab099
12
3
Tabl e 3. Ordering i nfo rmation
Type number Package
Name Description Version
1PS300 SC-70 plastic surface-mounted package; 3 leads SOT323
Table 4. Marking codes
Type number Marking code[1]
1PS300 A*3
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per diode
VRRM repetitive peak reverse
voltage -85V
VRreverse voltage - 80 V
IFforward current [1]
[2] -200mA
[3] -170mA
IFRM repetitive peak forward
current tp0.5 s;
0.25 -500mA
IFSM non-repetitive peak forward
current square wave [4]
tp=1s-4A
tp=1s - 0.5 A
1PS300 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 5 — 5 March 2012 3 of 11
NXP Semiconductors 1PS300
Dual high-speed switching diode
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Single diode loaded.
[3] Double diode loaded.
[4] Tj=25C before surge.
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
7. Characteristics
[1] When switched from IF= 10 mA to IR=10mA; R
L= 100 ; measured at IR=1mA.
[2] When switched from IF=10mA; t
r=20ns.
Per device
Ptot total power dissipation Tamb 25 C[1] -300mW
Tjjunction temperature - 150 C
Tamb ambient temperature 55 +150 C
Tstg storage temperature 65 +150 C
Table 5. Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Per device
Rth(j-a) thermal resistance from
junction to ambient in free air [1] - - 415 K/W
Rth(j-sp) thermal resistance from
junction to solder poi nt - - 200 K/W
Table 7. Characteristics
Tamb =25
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per diode
VFforward voltage IF= 1 mA - 610 - mV
IF= 10 mA - 740 - mV
IF=50mA --1.0V
IF=100mA --1.2V
IRreverse current VR=25V --30nA
VR=80V --0.5A
VR=25V; T
j=150C --30A
VR=80V; T
j=150C - - 100 A
Cddiode capacitance f = 1 MHz; VR=0V --2pF
trr reverse recovery time [1] --4ns
VFR forward recovery voltage [2] --1.75V
1PS300 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 5 — 5 March 2012 4 of 11
NXP Semiconductors 1PS300
Dual high-speed switching diode
(1) Tj= 150 C; typical values
(2) Tj=25C; typical values
(3) Tj=25C; maximum values
(1) VR= 80 V; maximum values
(2) VR= 80 V; typical values
(3) VR= 25 V; typical values
Fig 1. Forward current as a function of forward
voltage Fig 2. Reverse current as a functio n o f junction
temperature
f=1MHz; T
amb =25C FR4 PCB, standard footprint
(1) single diode loaded
(2) double diode loaded
Fig 3. Diod e capacitance as a function of reverse
voltage; typical values Fig 4. Forward current as a function of ambient
temperature; derating curves
VF (V)
0.0 2.01.50.5 1.0
006aac851
100
200
300
IF
(mA)
0
(1) (2) (3)
mbg380
102
10
200
0 100 Tj (°C)
IR
(μA)
1
10−2
10−1
(1) (2) (3)
025
VR (V)
2.5
0
0.5
mbh191
1.0
1.5
2.0
5
Cd
(pF)
10 15 20
mbg443
0 100 200
300
200
0
100
Tamb (°C)
IF
(mA)
(1)
(2)
1PS300 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 5 — 5 March 2012 5 of 11
NXP Semiconductors 1PS300
Dual high-speed switching diode
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
(1) IR=1mA
Input signal: reverse pulse rise time tr= 0.6 ns; reverse voltage pulse duration tp= 100 ns; duty cycle =0.05
Oscilloscope: rise time tr=0.35ns
Fig 5. Reverse recovery time test circuit and waveforms
Input signal: forward pulse rise time tr= 20 ns; forward current pulse duration tp100 ns; duty cycle 0.005
Fig 6. F orward recovery voltage test circuit and waveforms
trr
(1)
+ IFt
output signal
trtpt
10 %
90 %
VR
input signal
V = VR + IF × RS
RS = 50
Ω
IF
D.U.T.
Ri = 50
Ω
SAMPLING
OSCILLOSCOPE
mga881
t
r
t
t
p
10 %
90 %
I
input signal
R
S
= 50 Ω
I
R
i
= 50 Ω
OSCILLOSCOPE
1 kΩ450 Ω
D.U.T.
mga882
VFR
t
output signal
V
1PS300 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 5 — 5 March 2012 6 of 11
NXP Semiconductors 1PS300
Dual high-speed switching diode
9. Package outline
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
Fig 7. Package outline SOT323 (SC-70)
04-11-04Dimensions in mm
0.45
0.15
1.1
0.8
2.2
1.8
2.2
2.0 1.35
1.15
1.3
0.4
0.3 0.25
0.10
12
3
Table 8. Packing methods
The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
3000 10000
1PS300 SOT323 4 mm pitch, 8 mm tape and reel -115 -135
1PS300 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 5 — 5 March 2012 7 of 11
NXP Semiconductors 1PS300
Dual high-speed switching diode
11. Soldering
Fig 8. Reflow soldering footprint SOT323 (SC-70)
Fig 9. Wave soldering footprint SOT323 (SC-70)
solder lands
solder resist
occupied area
solder paste
sot323_fr
2.65
2.35 0.6
(3×)
0.5
(3×)
0.55
(3×)
1.325
1.85
1.3
3
2
1
Dimensions in mm
sot323_fw
3.65 2.1
1.425
(3×)
4.6
09
(2×)
2.575
1.8
solder lands
solder resist
occupied area
preferred transport
direction during soldering
Dimensions in mm
1PS300 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 5 — 5 March 2012 8 of 11
NXP Semiconductors 1PS300
Dual high-speed switching diode
12. Revision history
Table 9. Revision history
Document ID Release date Data sheet status Change notice Supersedes
1PS300 v.5 20120305 Product data sheet - 1PS300 v.4
Modifications: •The format of this document has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•Legal texts have been adapted to the new company name where appropriate.
•Section 1.1 “General description”: amended
•Table 1 “Quick reference data”: added
•Section 4 “Marking”: updated
•Section 8 “Test in f ormation”: added
•Figure 7: superseded by minimized package outline drawing
•Section 10 “Packing information”: added
•Section 11 “Soldering”: added
•Section 13 “Legal information”: updated
1PS300 v.4 19990526 Product data sheet - 1PS300 v.3
1PS300 v.3 19961004 Product specification - 1PS300 v.2
1PS300 v.2 19960903 Product specification - 1PS300 v.1
1PS300 v.1 19960403 Product specification - -
1PS300 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 5 — 5 March 2012 9 of 11
NXP Semiconductors 1PS300
Dual high-speed switching diode
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or comple teness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conf lict with the short data sheet, the
full data sheet shall pre vail.
Product specificat ion — The information and data provided in a Product
data sheet shall define the specification of the product as agr eed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Se miconductors takes no
responsibility for the content in this document if provided by an inf ormation
source outside of NXP Semiconductors.
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punitive, special or consequ ential damages (including - wit hout limitatio n - lost
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Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconduct ors’ aggregate and cumulat ive liability toward s
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semicondu ctors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
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authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors pro duct can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconducto rs products in such equipment or
applications and ther efore such inclu sion and/or use is at the cu stomer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with t heir
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessa ry
testing for th e customer’s applications and pro ducts using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
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applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing i n this document may be interpreted or
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conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property right s.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data fro m the objective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specification.
1PS300 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 5 — 5 March 2012 10 of 11
NXP Semiconductors 1PS300
Dual high-speed switching diode
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors 1PS300
Dual high-speed switching diode
© NXP B.V. 2012. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of rele ase: 5 March 2 012
Document identif ie r: 1PS300
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 5
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 5
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
10 Packing information . . . . . . . . . . . . . . . . . . . . . 6
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
14 Contact information. . . . . . . . . . . . . . . . . . . . . 10
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
