FP2207R1-R230-R - EATON

Technical Data 10673 Effective June 2018

Supersedes May 2017

FP2207R

High frequency, high current power inductors

Product features

• High current carrying capacity

• Low core loss

• Magnetically shielded

• 22.5 mm x 8.2 mm footprint surface mount-

package in a 7.25 mm height

• Moisture Sensitivity Level: 1

• Ferrite core material

Applications

• Multi-phase and Vcore regulators

• Voltage Regulator Modules (VRMs) and high-

power density VRMs

• Server and desktop

• Central processing unit (CPU)

• Graphics processing unit (GPU)

• Application specific integrated circuit (ASIC)

• Data networking and storage systems

• Graphics cards and battery power systems

• Point-of-Load modules (POL)

Environmental data

• Storage temperature range (Component):

-55 °C to +125 °C

• Operating temperature range: -55 °C to +125 °C

(ambient plus self-temperature rise)

• Solder reflow temperature:

J-STD-020 (latest revision) compliant

• Halogen free, lead free, RoHS compliant

HALOGEN

FREE

Technical Data 10673

Effective June 2018

FP2207R

High frequency, high current power inductors

www.eaton.com/electronics

Product Specifications

Part Number8

OCL1

(nH) ±10%

FLL2 (nH)

minimum

Irms

(A)

Isat14

(A)

Isat25

(A)

Isat36

(A)

DCR (mΩ)

±15% @ +20 °C K-factor7

R1 Version

FP2207R1-R230-R 230 196 50 70 77 72 0.47 182.5

1. Open Circuit Inductance (OCL) Test Parameters: 1.0 MHz, 0.1 Vrms, 0.0 Adc, +25 °C

2. Full Load Inductance (FLL) Test Parameters: 1.0 MHz, 0.1 Vrms, Isat1, +25 °C

3. Irms : DC current for an approximate temperature rise of 40 °C without core loss. Derating is

necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat

generating components will affect the temperature rise. It is recommended that the temperature of the

part not exceed +125 °C under worst case operating conditions verified in the end application.

4. Isat1: Peak current for approximately 5% rolloff @ +25 °C

5. Isat2: Peak current for approximately 20% rolloff @ +100 °C

6. Isat3: Peak current for approximately 20% rolloff @ +125 °C

7. K-factor: Used to determine Bp-p for core loss (see graph).

Bp-p = K * L * ΔI * 10-3 Bp-p: (Gauss), K: (K-factor from table),

L: (Inductance in nH), ΔI (Peak to peak ripple current in Amps).

8. Part Number Definition: FP2207Rx-Rxxx-R

FP2207R= Product code and size

x= Version indicator

Rxxx= Inductance value in μH, R= decimal point

-R suffix = RoHS compliant

Note: Hipot: 250 Vdc minimum for 2 seconds, 0.1 mA

conductor to uncoated core (test points c to d)

Dimensions (mm)

Part marking: FP2207Rx (x = Version indicator), Rxxx = Inductance value in uH, R= decimal point), xxxx=Lot code

Tolerances are ±0.15 unless stated otherwise

Pad layout tolerances are ±0.1 unless stated otherwise

Soldering surfaces to be coplanar within 0.1 millimeters

DCR measured from point “a” to point “b”

Hipot measured from point “c” to point “d”

Secure Inductor to PCB using Circuit Bond LV (or equivalent) adhesive for mechanical stability to meet Vibration, Mechanical shock and shear

force requirements.

Do not route traces or vias underneath the inductor

typ

Technical Data 10673

Effective June 2018

FP2207R

High frequency, high current power inductors

www.eaton.com/electronics

Packaging information (mm)

Supplied in tape and reel packaging , 500 parts per 13” diameter reel

Temperature rise vs. total loss

0.00.2 0.40.6 0.81.0 1.21.4 1.61.8 2.0

Temperature Rise (°C)

Total Loss (W)

FP2207R1

Technical Data 10673

Effective June 2018

FP2207R

High frequency, high current power inductors

www.eaton.com/electronics

Core loss vs. Bp-p

Inductance characteristics

0.001

0.01

0.1

000010001001

Core Loss (W)

Bp-p (Gauss)

FP2207R1

1.5 MHz

1 MHz

2 MHz

700 kHz

100

150

200

250

300

020406080100 120

Inductance (nH)

Idc (A)

FP2207R1-R230-R

-40 °C

+25 °C

+100 °C

+125 °C

Eaton

Electronics Division

1000 Eaton Boulevard

Cleveland, OH 44122

United States

www.eaton.com/electronics

Printed in USA

Publication No. 10673 EE-PCN18018

June 2018

Eaton is a registered trademark.

All other trademarks are property

of their respective owners.

Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written

approval of an ofﬁcer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used

in accordance with instructions for use provided in the labeling, can be reasonably expected to result in signiﬁcant injury to the user.

Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also

reserves the right to change or update, without notice, any technical information contained in this bulletin.

Technical Data 10673

Effective June 2018

FP2207R

High frequency, high current power inductors

Temperature

TC -5°C

Time 25°C to Peak Time

°C

Tsmin

Tsmax

Preheat

Max. Ramp Up Rate = 3°C/s

Max. Ramp Down Rate = 6°C/s

Solder reflow profile

Reference JDEC J-STD-020

Profile Feature Standard SnPb Solder Lead (Pb) Free Solder

Preheat and Soak • Temperature min. (Tsmin)100 °C 150 °C

• Temperature max. (Tsmax)150 °C 200 °C

• Time (Tsmin to Tsmax) (ts)60-120 Seconds 60-120 Seconds

Average ramp up rate Tsmax to Tp3 °C/ Second Max. 3 °C/ Second Max.

Liquidous temperature (Tl)

Time at liquidous (tL)

183 °C

60-150 Seconds

217 °C

60-150 Seconds

Peak package body temperature (TP)* Table 1 Table 2

Time (tp)** within 5 °C of the specified classification temperature (Tc)20 Seconds** 30 Seconds**

Average ramp-down rate (Tp to Tsmax)6 °C/ Second Max. 6 °C/ Second Max.

Time 25 °C to Peak Temperature 6 Minutes Max. 8 Minutes Max.

* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.

Table 1 - Standard SnPb Solder (Tc)

Package

Thickness

Volume

mm3

<350

Volume

mm3

≥350

<2.5mm) 235 °C 220 °C

≥2.5mm 220 °C 220 °C

Table 2 - Lead (Pb) Free Solder (Tc)

Package

Thickness

Volume

mm3

<350

Volume

mm3

350 - 2000

Volume

mm3

>2000

<1.6mm 260 °C 260 °C 260 °C

1.6 – 2.5mm 260 °C 250 °C 245 °C

>2.5mm 250 °C 245 °C 245 °C