SG1503/SG2503/SG3503
Rev 1.3a 10/04 Microsemi Inc. - Integrated Products
Copyright 1996 11861 Western Avenue ∞ ∞
∞ ∞
∞ Garden Grove, CA 92841
2(714) 898-8121 ∞∞
∞∞
∞ FAX: (714) 893-2570
ABSOLUTE MAXIMUM RATINGS (Note 1)
Input Voltage....................................................................... 40V
Storage Temperature Range .............................-65°C to 150°COperating Junction Temperature
Hermetic (T, Y - Package)............................................. 150°C
Plastic (M, DM - Package) ............................................ 150°C
Lead Temperature (Soldering, 10 Seconds) .................. 300°C
Note 1. Exceeding these ratings could cause damage to the device.
THERMAL DATA
Note A. Junction Temperature Calculation: TJ = TA + (PD x θJA).
Note B. The above numbers for θJC are maximums for the limiting
thermal resistance of the package in a standard mount-
ing configuration. The θJA numbers are meant to be
guidelines for the thermal performance of the device/pc-
board system. All of the above assume no ambient
airflow.
T Package:
Thermal Resistance-Junction to Case, θJC................... 15°C/W
Thermal Resistance-Junction to Ambient, θJA ............ 120°C/W
Y Package:
Thermal Resistance-Junction to Case, θJC.................. 50°C/W
Thermal Resistance-Junction to Ambient, θJA ........... 130°C/W
M Package:
Thermal Resistance-Junction to Case, θJC................... 60°C/W
Thermal Resistance-Junction to Ambient, θJA ............. 95°C/W
DM Package:
Thermal Resistance-Junction to Case, θJC.................. 55°C/W
Thermal Resistance-Junction to Ambient, θJA ........... 165°C/W
Input Voltage ..........................................................4.5V to 40V Operating Ambient Temperature Range
SG1503 ............................................................-55°C to 125°C
SG2503 ............................................................. -25°C to 85°C
SG3503 ................................................................ 0°C to 70°C
Note 2. Range over which the device is functional.
RECOMMENDED OPERATING CONDITIONS (Note 2)
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG1503 with -55°C ≤ TA ≤ 125°C, SG2503/SG3503
with 0°C ≤ TA ≤ 70°C, VIN = 15V, and IL = 0mA. Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal
to the ambient temperature.)
Units
SG3503
Min. Typ. Max.
Min. Typ. Max.
SG1503/2503
Test Conditions
2.485
4.7
4.5
15
2.515
40
40
3
5
5
8
20
5
2.0
30
2.500
1
3
3
4
5
1.5
20
76
100
250
V
V
V
mV
mV
mV
mV
mV
mV
mA
mA
dB
µV rms
µV/Khr
2.475
4.7
4.5
15
Parameter
Output Voltage
Input Voltage
Line Regulation
Load Regulation
Temperature Regulation
Quiescent Current
Short Circuit Current
Ripple Rejection
Output Noise
Voltage Stability
2.500
1
3
3
4
15
2.5
1.5
20
76
100
250
TA = 25°C
TA = 25°C
VIN = 5V to 15V
VIN = 15V to 40V
∆IL = 10mA
∆IL = 10mA, VIN = 30V
(SG1503 only)
(SG2503/3503 only)
VIN = 40V
TA = 25°C
f = 120Hz, TA = 25°C
BW = 10KHz, TA = 25°C
2.525
40
40
3
10
10
15
10
2.0
30
Pb-free / RoHS Peak Solder Reflow Temp (40 sec. max. exp.)........ 260°C (+0, -5)