American Opto Plus LED
C/A561SR-5 G/W
0.56’’ Single Digit Seven Segment Display
0.56inch (14.22 mm) height
Low power consumption
RoHS Compliance
Case mold type
Package Dimensions
Notes: 1. Label Notes: A: Part Number B: Date C: Bin Code
2. All dimensions are in millimeters (inches)
3. Tolerance is ± 0.25mm (0.01”) unless otherwise specified
Feb. 2005 Rev. 1.0
American Opto Plus LED
C/A561SR-5 G/W
0.56’’ Single Digit Seven Segment Display
0.56inch (14.22 mm) height
Low power consumption
RoHS Compliance
Case mold type
DEVICE SELECTION GUIDE
Part Number Chip Face / Segment
Material Emitted Color
C/A 561SR-5 G/W AlGaAs Super Red
Gray / White
ABSOLUTE MAXIMUM RATINGS (Ta=25°C)
Parameter Symbol Max Rating Unit
Power Dissipation per segment PAD 72 mW
Peak Current per segment
(1/10 Duty Cycle @1KHz ) IAF 100 mA
Continuous Forward Current per segment IPF 30 mA
Reverse Voltage VR 5.0 V
Operating Temperature Range TOPR -40~+85 °C
Storage Temperature Range TSTG -40~+85 °C
Solder temperature 1.6 mm from body for 3 seconds at 260°C
OPTICAL-ELECTRICAL CHARACTERISTICS
Parameter Symbol Test Condition Min Typ Max Unit
Ave. Luminous Intensity IV IF = 10mA 5000 18000 μcd
Forward Voltage/segment VF IF = 10mA 1.75 2.4 V
Reverse Current/segment IR VR = 5V 10 uA
Spectrum Line Half-Width Δλ IF = 10mA 20 nm
Dominant Wavelength λd IF = 10mA 645 nm
Peak Wavelength λp IF = 10mA 660 nm
American Opto Plus LED
C/A561SR-5 G/W
0.56’’ Single Digit Seven Segment Display
0.56inch (14.22 mm) height
Low power consumption
RoHS Compliance
Case mold type
TYPICAL ELECTRO-OPTICAL CHARACTERISTIC CURVES: SUPER RED (SR)
American Opto Plus LED
C/A561SR-5 G/W
0.56’’ Single Digit Seven Segment Display
0.56inch (14.22 mm) height
Low power consumption
RoHS Compliance
Case mold type
WAVE SOLDERING
American Opto Plus LED
C/A561SR-5 G/W
0.56’’ Single Digit Seven Segment Display
0.56inch (14.22 mm) height
Low power consumption
RoHS Compliance
Case mold type
LAMP HANDLING AND APPLICATION PRECAUTIONS
STORAGE
1. It is recommended to store the products in the following conditions:
a. Humidity: 60% RH Max
Temperature: 5°C ~ 40°C (41°F ~ 105°F)
b. Shelf life in sealed bag: 3 month < 40°C and 90% RH
FORMING
1. Any forming on lead pin must be done before solding, not during or after soldering
2. Avoid applying any stress to resin in order to prevent the epoxy fracture and break on
bonding wire.
3. While forming, please use a tie bar cut or equivalent ot hold or bend the pin.
4. 2mm from the base of resin is the minimum distance for the place bending the lead pin
5. Avoid bending the lead pin at the same point twice or more
SOLDERING
1. No stress can be applied to lead pins when they are heated, otherwise disconnection may
occur.
2. When an LED is mounted into a P.C. board, pitch spacing should be aligned carefully to
avoid causing any stress to the lead wires.
3. Mounting direction (electrode direction) of SMD LED and Display should be
perpendicular to direction of PCB curve
4. After soldering, don’t bend the PCB
CLEANING
1. Avoid using any unspecified chemical solvent to clean LED. For example,
Trichoroethylene, Chlorosen, Acetone, and Diflon S3MC.
2. Any cleaning method can only be taken under normal temperature in one minute or less if
it is required
3. Special attention should be taken when using any chemicals for claning because some
chemicals may damage the surface of epoxy.
