MMSD4148T1G, SMMSD4148T1G, MMSD4148T3G, SMMSD4148T3G Switching Diode http://onsemi.com Features SOD-123 Surface Mount Package High Breakdown Voltage Fast Speed Switching Time AEC-Q101 Qualified and PPAP Capable S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant* SOD-123 CASE 425 STYLE 1 1 CATHODE 2 ANODE MAXIMUM RATINGS Rating Symbol Value Unit Continuous Reverse Voltage VR 100 V Peak Forward Current IF 200 mA IFSM 1.0 2.0 A TJ, Tstg -55 to +150 C Characteristic Symbol Max Unit Total Device Dissipation FR-5 Board (Note 2) TA = 25C Derate above 25C PD 425 mW 3.4 mW/C 290 C/W Peak Forward Surge Current (Note 1) t < 1 sec t = 1 msec Operating and Storage Junction Temperature Range MARKING DIAGRAM 1 5I M G THERMAL CHARACTERISTICS Thermal Resistance Junction-to-Ambient RqJA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Typical Values 2. FR-5 = 1.0 oz Cu, 1.0 inz pad 5I M G G = Device Code = Date Code = Pb-Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Package Shipping MMSD4148T1G SOD-123 (Pb-Free) 3,000 / Tape & Reel SMMSD4148T1G SOD-123 (Pb-Free) 3,000 / Tape & Reel MMSD4148T3G SOD-123 (Pb-Free) 10,000 / Tape & Reel SMMSD4148T3G SOD-123 (Pb-Free) 10,000 / Tape & Reel Device For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2011 November, 2011 - Rev. 11 1 Publication Order Number: MMSD4148T1/D MMSD4148T1G, SMMSD4148T1G, MMSD4148T3G, SMMSD4148T3G ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Symbol Characteristic Min Max 100 - - - 25 5.0 - 1000 - 4.0 - 4.0 Unit OFF CHARACTERISTICS Reverse Breakdown Voltage (IBR = 100 mA) V(BR) Reverse Voltage Leakage Current (VR = 20 V) (VR = 75 V) IR Forward Voltage (IF = 10 mA) VF Diode Capacitance (VR = 0 V, f = 1.0 MHz) CD Reverse Recovery Time (IF = IR = 10 mA) (Figure 1) trr V nA mA mV pF ns 820 W +10 V 2k 100 mH 0.1 mF tr IF 0.1 mF tp t IF trr 10% t DUT 50 W OUTPUT PULSE GENERATOR 50 W INPUT SAMPLING OSCILLOSCOPE 90% IR VR INPUT SIGNAL 1. 2. 3. A 2.0 kW variable resistor adjusted for a Forward Current (IF) of 10 mA. Input pulse is adjusted so IR(peak) is equal to 10 mA. tp trr Figure 1. Recovery Time Equivalent Test Circuit http://onsemi.com 2 iR(REC) = 1 mA OUTPUT PULSE (IF = IR = 10 mA; measured at iR(REC) = 1 mA) MMSD4148T1G, SMMSD4148T1G, MMSD4148T3G, SMMSD4148T3G 100 10 I R, REVERSE CURRENT (A) 10 TA = 85C TA = -40C 1.0 TA = 25C TA = 125C 1.0 TA = 85C 0.1 TA = 55C 0.01 TA = 25C 0.1 0.2 0.4 0.6 0.8 1.0 0.001 1.2 10 0 20 30 VF, FORWARD VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 2. Forward Voltage Figure 3. Leakage Current 0.68 CD , DIODE CAPACITANCE (pF) IF, FORWARD CURRENT (mA) TA = 150C 0.64 0.60 0.56 0.52 0 2 4 6 VR, REVERSE VOLTAGE (VOLTS) Figure 4. Capacitance http://onsemi.com 3 8 40 50 MMSD4148T1G, SMMSD4148T1G, MMSD4148T3G, SMMSD4148T3G PACKAGE DIMENSIONS SOD-123 CASE 425-04 ISSUE G D AAAA AAAA AAAA A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. A1 1 HE DIM A A1 b c D E HE L q E 2 MILLIMETERS NOM MAX 1.17 1.35 0.05 0.10 0.61 0.71 --0.15 1.60 1.80 2.69 2.84 3.68 3.86 ------10 MIN 0.037 0.000 0.020 --0.055 0.100 0.140 0.010 0 INCHES NOM 0.046 0.002 0.024 --0.063 0.106 0.145 ----- MAX 0.053 0.004 0.028 0.006 0.071 0.112 0.152 --10 STYLE 1: PIN 1. CATHODE 2. ANODE q L b MIN 0.94 0.00 0.51 --1.40 2.54 3.56 0.25 0 C SOLDERING FOOTPRINT* EE EE EE 0.91 0.036 2.36 0.093 4.19 0.165 EE EE EE SCALE 10:1 1.22 0.048 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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